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TW201308529A - Multi-layered array-type LED light engine - Google Patents

Multi-layered array-type LED light engine Download PDF

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TW201308529A
TW201308529A TW100127434A TW100127434A TW201308529A TW 201308529 A TW201308529 A TW 201308529A TW 100127434 A TW100127434 A TW 100127434A TW 100127434 A TW100127434 A TW 100127434A TW 201308529 A TW201308529 A TW 201308529A
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light
package
optical
emitting diode
layer
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TW100127434A
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Chinese (zh)
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TWI441288B (en
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zhong-fu Hu
Yong-Fu Wu
kui-jiang Liu
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Gem Weltronics Twn Corp
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Abstract

A multi-layered array-type LED light engine at least comprises a substrate, a package body, two lead-frame pairs, an LED grain, and an optical lens set, wherein the circular periphery of the substrate is wrapped up through the package body, and the wrapping range needs to cover the upper and lower peripheral parts of the periphery, so that the package body and the substrate are formed into an absolutely sealed structure body. The present invention can dispose a fluorescent layer between an optical gel layer and a silicone protection layer in the optical chamber of the package body, so as to form another moisture-proof mechanism to prevent the fluorescent layer from being moistened and deterioration, wherein the optical gel layer has a refractive coefficient with a predetermined range, so as to enhance the probability of photon to be emitted out of the optical chamber, thereby achieving a multi-layered array-type LED light engine capable of enhancing the light-emitting efficiency and completely preventing the optical element from being moistened.

Description

多層式陣列型發光二極體光引擎Multilayer array type light emitting diode light engine

一種多層式陣列型發光二極體光引擎,尤其是涉及一種可提升發光效率、完全避免光學元件受潮的多層式陣列型發光二極體光引擎。A multi-layer array type light-emitting diode light engine, in particular, relates to a multi-layer array type light-emitting diode light engine which can improve luminous efficiency and completely avoid moisture of optical components.

按,LED的發光原理是利用半導體固有特性,它不同於以往的白熾燈管的放電、發熱發光原理,而是將電流順向流入半導體的PN接面時便會發出光線,所以LED被稱為冷光源(cold light)。由於LED系具有高耐久性、壽命長、輕巧、耗電量低且不含水銀等有害物質等之優點,故可廣泛應用於照明設備產業中,且其通常以LED陣列封裝方式應用在電子看板、交通號誌等商業領域。According to the principle of LED illumination, it is different from the inherent characteristics of semiconductors. It is different from the principle of discharge and heat emission of incandescent lamps. Instead, it will emit light when flowing current into the PN junction of the semiconductor, so the LED is called Cold light. LEDs are widely used in the lighting industry because of their high durability, long life, light weight, low power consumption, and no harmful substances such as mercury. They are usually applied to electronic boards in LED array packages. Business areas such as traffic signs.

習知技術的多層式陣列型發光二極體之封裝方法,首先製備一基板,並使兩導線架定位於該基板之導線架容置槽中,接著射出成型一封裝模塊以將該基板與兩導線架包埋固定,接著將該等發光二極體晶粒配置於該基板之出光區表面上,再使該等發光二極體晶粒與該兩導線架形成一電性迴路,在該發光二極體上依序形成絕緣保護層及螢光層,最後直接射出透鏡罩在封裝模塊上,其中該等發光二極體能用陣列排列的方式配置於該基板上,又本發明係以層疊式方式之封裝方法製成多層式陣列型發光二極體。The packaging method of the multi-layer array type light-emitting diode of the prior art is to first prepare a substrate, and position the two lead frames in the lead frame receiving groove of the substrate, and then project a package module to form the substrate with two The lead frame is embedded and fixed, and then the light-emitting diode crystal grains are disposed on the surface of the light-emitting area of the substrate, and the light-emitting diode crystal grains and the two lead frames form an electrical circuit. An insulating protective layer and a phosphor layer are sequentially formed on the diode, and finally the lens cover is directly emitted on the package module, wherein the light emitting diodes can be arranged on the substrate by array arrangement, and the present invention is laminated. The packaging method of the method is to form a multilayer array type light emitting diode.

然而習知技術的缺點在於無法長期使用於水、濕氣含量高的環境,以及如深海、太空或軍事等險惡的環境,其係因為封裝完成後的各層結構並非確實地密封接合,當然無法要求其整體的氣密性,因此溼氣或水氣容易滲入於封裝結構內部,導致發光元件及光學單元劣化甚至損毀,因此無法使用於潮濕的環境下,連帶影響整體的結構強度,且反光罩必須分開製作再進行裝設,導致封裝效率低落,因此必須對此加以改良,並提供一種完全阻絕水氣進入、並堅固耐用及長期維持光學元件效能的一種發光二極體的封裝結構。However, the shortcomings of the prior art are that it cannot be used for a long time in an environment with high water and moisture content, and a sinister environment such as deep sea, space or military, because the layers of the package after the completion of the package are not surely sealed and joined, of course, cannot be required. The overall airtightness, so moisture or moisture easily penetrates into the inside of the package structure, resulting in deterioration or even damage of the light-emitting element and the optical unit, so that it cannot be used in a humid environment, and the overall structural strength is affected, and the reflector must be Separate fabrication and assembly results in low package efficiency, which must be improved and provide a package structure for a light-emitting diode that completely blocks moisture ingress, is robust, and maintains optical component performance over time.

本發明之主要目的在於提供一種多層式陣列型發光二極體光引擎,其提供一種絕對密封及多層的防潮結構的結構體,藉以防止螢光層及光學元件受潮變質。The main object of the present invention is to provide a multi-layer array type light emitting diode light engine, which provides an absolute sealed and multi-layer moisture-proof structure structure, thereby preventing the phosphor layer and the optical element from being deteriorated by moisture.

為達上述目的,本發明的具體技述手段包含有一基板,該基板具有一表面及一出光部,該表面並設置有一槽縫,該槽縫係環繞該出光部而設置,且該基板並具有一環周緣,該等封裝孔係分佈設置在該基板之該環周緣之周邊處;一封裝體,該封裝體將該基板之該環周緣及位於該環周緣之周邊上下處完全包覆起來,該封裝體亦將該等封裝孔及該槽縫一併包覆,該封裝體並圍構出有一光學腔室,該光學腔室具有對應於該出光部的一出光口,該光學腔室具有一內壁面,該封裝體具有一頂面,該內壁面與該出光部之表面相對具有一交角關係,該內壁面之頂緣係向外延設有一封合面,該封合面與該封裝體的該頂面之間具有一段面差;兩導線架,該兩導線架係包埋於該封裝體之中並與該基板相距有一間隔,每一個導線架並具有兩端部,該兩導線架之該兩端部係外露於該封裝體之外;複數個發光二極體晶粒,該等發光二極體晶粒係位於該出光部之表面上,該等發光二極體晶粒與該兩導線架藉構成一電性連接;一晶粒保護層,該晶粒保護層位於該等發光二極體晶粒之上;一光學膠層,該光學膠層位於該晶粒保護層之上;一螢光層,該螢光層位於該光學膠層之上;一矽膠保護層,該矽膠保護層位於該螢光層之上;以及一光學透鏡組,該光學透鏡組係用以與該出光口相貼合密封。In order to achieve the above object, the specific technical means of the present invention comprises a substrate having a surface and a light exiting portion, the surface is provided with a slot, the slot is disposed around the light exiting portion, and the substrate has a circumference of the ring, the package holes are disposed at a periphery of the circumference of the ring of the substrate; and a package body completely covering the circumference of the substrate and the periphery of the circumference of the ring, The package body also covers the package holes and the slot, the package body and surrounding an optical cavity, the optical cavity has a light exit port corresponding to the light exit portion, the optical cavity has a light chamber The inner wall surface has a top surface, and the inner wall surface has an angle relationship with respect to a surface of the light exit portion, and a top surface of the inner wall surface is provided with a joint surface, the sealing surface and the package body Between the top surfaces, there is a surface difference; two lead frames are embedded in the package and spaced apart from the substrate, and each lead frame has two ends, and the two lead frames The ends are outside Outside the package; a plurality of light-emitting diode crystal grains, the light-emitting diode crystal grains are located on a surface of the light-emitting portion, and the light-emitting diode crystal grains and the two lead frames constitute an electric a crystalline protective layer, the die protection layer is located above the light emitting diode die; an optical adhesive layer, the optical adhesive layer is located above the die protective layer; a fluorescent layer, the The phosphor layer is disposed on the optical adhesive layer; a silicone protective layer on the fluorescent layer; and an optical lens assembly for sealingly sealing the optical opening.

其中光學膠層並具有特定範圍的折射系數,藉以提升光子射出光學腔室的機率。The optical adhesive layer has a specific range of refractive index to enhance the probability of photons exiting the optical chamber.

以下配合圖式及元件符號對本發明之實施方式做更詳細的說明,俾使熟習該項技藝者在研讀本說明書後能據以實施。The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

參閱第一圖,本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之立體剖視圖。本發明係有關一種多層式陣列型發光二極體光引擎,其可完全杜絕濕氣進入多層式陣列型發光二極體光引擎之內部,防止內部之重要元件受潮而劣化。多層式陣列型發光二極體光引擎係至少包含有一基板1、一封裝體3、兩導線架對5、複數個發光二極體晶粒5及一光學透鏡組20。Referring to the first figure, a perspective cross-sectional view of a multilayer array type light emitting diode light engine of the present invention which can eliminate moisture. The invention relates to a multi-layer array type light-emitting diode light engine, which can completely prevent moisture from entering the interior of the multi-layer array type light-emitting diode light engine, and prevent internal important components from being deteriorated by moisture. The multi-layer array type LED light engine includes at least one substrate 1, a package 3, two lead frame pairs 5, a plurality of LED dipoles 5, and an optical lens group 20.

該基板1具有一表面11、一出光部13及複數個封裝孔15,該出光部13係位於該表面11之中心部份,該表面11並設置有至少一圈槽縫111,該至少一圈槽縫111係環繞該出光部13而設置,該至少一圈槽縫111的形狀可以如本實施例所示的環形,也可以是其他適當形態,且該基板1並具有一環周緣113,該等封裝孔115係分佈設置在該基板1之該環周緣113之周邊處。The substrate 1 has a surface 11 , a light exiting portion 13 and a plurality of package holes 15 . The light exiting portion 13 is located at a central portion of the surface 11 , and the surface 11 is provided with at least one slot slit 111 , the at least one turn The slit 111 is disposed around the light exit portion 13. The shape of the at least one slit slot 111 may be a ring shape as shown in this embodiment, or may be other suitable forms, and the substrate 1 has a ring circumference 113. The package holes 115 are distributed at the periphery of the ring periphery 113 of the substrate 1.

其中該至少一圈槽縫111的斷面形狀可以設置成V型、凹型、U型或其他適當形狀,且較佳地更可在該至少一圈槽縫111的內緣形成有一勾部111a,如第二圖所示,該勾部111a可以朝該至少一圈槽縫111內的任一方向形成。The cross-sectional shape of the at least one slot 111 may be V-shaped, concave, U-shaped or other suitable shape, and preferably, a hook portion 111a is formed on the inner edge of the at least one slot 111. As shown in the second figure, the hook portion 111a can be formed in any direction within the at least one slit slot 111.

參閱第三圖,本發明之基板與封裝體之封裝成形之側視圖。該封裝體3將該基板1之該環周緣113及位於該環周緣113之周邊上下處完全包覆起來,該封裝體3亦一併包覆該等封裝孔15及該槽縫11,該封裝體3並圍構出有一光學腔室31,該光學腔室31具有一出光口311其對應於該出光部13,該光學腔室31具有一內壁面313,該封裝體3具有一頂面33,該內壁面313與該出光部13之表面相對具有一交角關係,亦即若該出光部13之表面呈現一水平面,該內壁面313則設置成一斜面,以利將光線反射至多層式陣列型發光二極體光引擎之外,該內壁面313之頂緣係向外延設有一封合面35,該封合面35與該封裝體3的該頂面33之間具有一段面差,其中該內壁面313之上可配置一反光罩4。Referring to the third figure, a side view of the package forming of the substrate and the package of the present invention. The package body 3 completely covers the ring periphery 113 of the substrate 1 and the periphery of the ring periphery 113. The package 3 also covers the package holes 15 and the slot 11 together. The optical cavity 31 has an optical opening 31 311 corresponding to the light exiting portion 13 . The optical cavity 31 has an inner wall surface 313 , and the package body 3 has a top surface 33 . The inner wall surface 313 has an angle relationship with the surface of the light exiting portion 13, that is, if the surface of the light exiting portion 13 presents a horizontal plane, the inner wall surface 313 is disposed as a slope to facilitate reflection of light to the multilayer array type. In addition to the light-emitting diode light engine, the top edge of the inner wall surface 313 is provided with a mating surface 35, and the sealing surface 35 has a surface difference with the top surface 33 of the package body 3, wherein A reflector 4 can be disposed above the inner wall surface 313.

該兩導線架5係包埋於該封裝體3之中並與該基板1相距有一間隔,每一個導線架5並具有兩端部,該兩導線架5之該兩端部須外露於該封裝體3之外。The two lead frames 5 are embedded in the package 3 and spaced apart from the substrate 1. Each lead frame 5 has two ends, and the two ends of the two lead frames 5 are exposed to the package. Outside of body 3.

參閱第四圖,本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之剖面示意圖。該等發光二極體晶粒6係位於該出光部13之表面上,因此當該等發光二極體晶粒6產生光線時,發出的光線可藉由該反光罩4而反射至多層式陣列型發光二極體光引擎之外,有效提升發光亮度及發光效率,該等發光二極體晶粒6較佳地配置型態係為陣列型的排列方式,其中該等發光二極體晶粒6之間相打線接合(wire donding)並與該兩導線架5之一端部構成電性連接以形成一電路,而該兩導線架5之另一端部則連接至電源。Referring to the fourth figure, a schematic cross-sectional view of a multilayer array type light emitting diode light engine of the present invention which can eliminate moisture is shown. The light emitting diodes 6 are located on the surface of the light exiting portion 13, so that when the light emitting diodes 6 generate light, the emitted light can be reflected by the reflector 4 to the multilayer array. In addition to the light-emitting diode light engine, the light-emitting luminance and the light-emitting efficiency are effectively improved, and the light-emitting diode crystal grains 6 are preferably arranged in an array type arrangement, wherein the light-emitting diode crystal grains are arranged. 6 is wire-bonded and electrically connected to one end of the two lead frames 5 to form a circuit, and the other end of the two lead frames 5 is connected to a power source.

該等發光二極體晶粒6之上並形成有一晶粒保護層7,該晶粒保護層7係包覆保護該等發光二極體晶粒6,該晶粒保護層7之上並依序形成有一光學膠層8、一螢光層9及一矽膠保護層10,其中該螢光層9介於該光學膠層8及該矽膠保護層10之間,其中該光學膠層8之反射係數係至少大於1.5。A die-protective layer 7 is formed on the light-emitting diodes 6 and the die-protective layer 7 is coated to protect the light-emitting diodes 6 and the die-protective layer 7 Forming an optical adhesive layer 8, a phosphor layer 9 and a silicone protective layer 10, wherein the phosphor layer 9 is interposed between the optical adhesive layer 8 and the silicone protective layer 10, wherein the optical adhesive layer 8 is reflected The coefficient is at least greater than 1.5.

該光學透鏡組20係用以與該出光口311接合密封,以防止水氣侵入,其中該光學透鏡組20可以是由一上光學透鏡210、一間隔環220及一下光學透鏡230構成,該間隔環220用以配置於該上光學透鏡210及該下光學透鏡230,可透過將該間隔環220配置於該封合面35之上並與該封合面35相貼合密封,其中該上光學透鏡210可以是一平板透鏡、一凹透鏡、一曲面鏡,或者如第五圖所示為一凸透鏡。The optical lens unit 20 is configured to be sealed with the light exit opening 311 to prevent moisture from entering. The optical lens unit 20 may be composed of an upper optical lens 210, a spacer ring 220 and a lower optical lens 230. The ring 220 is disposed on the upper optical lens 210 and the lower optical lens 230, and the spacer ring 220 is disposed on the sealing surface 35 and is sealingly sealed with the sealing surface 35. The lens 210 may be a flat lens, a concave lens, a curved mirror, or a convex lens as shown in the fifth figure.

參閱第六圖,本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之第三實施例示意圖,參閱第七圖,本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之第四實施例示意圖。其中如第六圖及第七圖所示,該兩導線架5也可封裝於對應於該矽膠保護層10內的該封裝體3之中,當該等發光二極體晶粒6因發光所產生的熱能傳導至該兩導線架5時,即使其內部萬一產生的熱氣或濕氣,亦不會對該螢光層9造成影響而劣化變質。Referring to FIG. 6 , a schematic diagram of a third embodiment of a multi-layer array type LED light engine capable of eliminating moisture according to the present invention, and referring to FIG. 7 , the multi-layer array type LED of the present invention can eliminate moisture. A schematic diagram of a fourth embodiment of a body light engine. As shown in FIG. 6 and FIG. 7 , the two lead frames 5 can also be packaged in the package 3 corresponding to the silicone protective layer 10 when the light emitting diodes 6 are illuminated by light. When the generated heat energy is transmitted to the two lead frames 5, even if the heat or moisture generated in the interior thereof is not affected by the phosphor layer 9, the deterioration is deteriorated.

其中如第七圖所示,該光學透鏡組20亦可使用一單一光學透鏡240。要注意的是,該晶粒保護層7、該光學膠層8、該螢光層9及該矽膠保護層10之間的相互配置厚度比例係視實際需要而定,在此僅是說明用的實例而已,並非用以限制本發明的範圍。As shown in the seventh figure, the optical lens group 20 can also use a single optical lens 240. It should be noted that the mutual arrangement thickness ratio between the die protection layer 7, the optical adhesive layer 8, the phosphor layer 9, and the silicone protective layer 10 is determined according to actual needs, and is merely illustrative. The examples are not intended to limit the scope of the invention.

承上所述,本發明透過封裝體3將該基板1之環周緣113起來,尤其包覆範圍包含環周緣113之上下周邊部分,如此致使該封裝體3與該基板1形成一種絕對密封的結構,且由於該等封裝孔15及該槽縫11之設立,得以讓封裝體3可非常緊密地與該基板1固定成形。As described above, the present invention penetrates the peripheral edge 113 of the substrate 1 through the package 3, and particularly covers the lower peripheral portion of the peripheral edge 113 of the ring, thus causing the package 3 and the substrate 1 to form an absolutely sealed structure. And because the package holes 15 and the slots 11 are established, the package 3 can be fixedly formed with the substrate 1 very tightly.

再者,本發明更在光學腔室31之中,透過將該螢光層9設置於該光學膠層8及該矽膠保護層10之間,因此提供更多一道的防潮機制藉以防止該螢光層9受潮變質,值得注意的是,該光學膠層8係具有係至少大於1.5的反射係數,更有利於增加提升光線反射效率,本發明之多重密封結構可達成防止其內部重要光學元件受潮失效的目的,同時也提升發光效率及亮度。Furthermore, the present invention further provides the phosphor layer 9 between the optical adhesive layer 8 and the silicone protective layer 10 in the optical chamber 31, thereby providing a more moisture-proof mechanism to prevent the fluorescent light. The layer 9 is deteriorated by moisture. It is worth noting that the optical adhesive layer 8 has a reflection coefficient of at least greater than 1.5, which is more advantageous for increasing the reflection efficiency of the light. The multiple sealing structure of the present invention can prevent the internal optical components from being damaged by moisture. The purpose is also to improve luminous efficiency and brightness.

以上所述者僅為用以解釋本發明之較佳實施例,並非企圖據以對本發明做任何形式上之限制,是以,凡有在相同之發明精神下所作有關本發明之任何修飾或變更,皆仍應包括在本發明意圖保護之範疇。The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.

1...基板1. . . Substrate

11...表面11. . . surface

13...出光部13. . . Light exit

15...封裝孔15. . . Package hole

111...槽縫111. . . Slot

111a...勾部111a. . . Hook

113...環周緣113. . . Ring circumference

3...封裝體3. . . Package

31...光學腔室31. . . Optical chamber

33...頂面33. . . Top surface

35...封合面35. . . Sealing surface

313...內壁面313. . . Inner wall

4...反光罩4. . . Reflector

5...導線架5. . . Lead frame

6...發光二極體晶粒6. . . Light-emitting diode grain

7...晶粒保護層7. . . Grain protection layer

8...光學膠層8. . . Optical adhesive layer

9...螢光層9. . . Fluorescent layer

10...矽膠保護層10. . . Silicone protective layer

20...光學透鏡組20. . . Optical lens unit

210...上光學透鏡210. . . Upper optical lens

220...間隔環220. . . Spacer ring

230...下光學透鏡230. . . Lower optical lens

240...光學透鏡240. . . optical lens

第一圖為顯示本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之立體剖視圖。The first figure is a perspective cross-sectional view showing a multilayer array type light emitting diode light engine of the present invention which can eliminate moisture.

第二圖為顯示本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之第一實施例示意圖。The second figure is a schematic view showing a first embodiment of the multi-layer array type light-emitting diode light engine of the present invention which can eliminate moisture.

第三圖為顯示本發明之基板與封裝體之封裝成形之側視圖。The third figure is a side view showing the package forming of the substrate and the package of the present invention.

第四圖為顯示本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之剖面示意圖。The fourth figure is a schematic cross-sectional view showing a multi-layer array type light-emitting diode light engine of the present invention which can eliminate moisture.

第五圖為顯示本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之第二實施例示意圖。The fifth figure is a schematic view showing a second embodiment of the multi-layer array type light-emitting diode light engine of the present invention which can prevent moisture.

第六圖為顯示本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之第三實施例示意圖。Fig. 6 is a view showing a third embodiment of the multi-layer array type light-emitting diode light engine of the present invention which can eliminate moisture.

第七圖為顯示本發明之可杜絕濕氣之多層式陣列型發光二極體光引擎之第四實施例示意圖。The seventh figure is a schematic view showing a fourth embodiment of the multi-layer array type light-emitting diode light engine of the present invention which can eliminate moisture.

1...基板1. . . Substrate

11...表面11. . . surface

13...出光部13. . . Light exit

15...封裝孔15. . . Package hole

111...槽縫111. . . Slot

113...環周緣113. . . Ring circumference

3...封裝體3. . . Package

33...頂面33. . . Top surface

35...封合面35. . . Sealing surface

313...內壁面313. . . Inner wall

4...反光罩4. . . Reflector

5...導線架5. . . Lead frame

6...發光二極體晶粒6. . . Light-emitting diode grain

20...光學透鏡組20. . . Optical lens unit

210...上光學透鏡210. . . Upper optical lens

220...間隔環220. . . Spacer ring

230...下光學透鏡230. . . Lower optical lens

Claims (6)

一種可杜絕濕氣之多層式陣列型發光二極體光引擎,係包含有:一基板,該基板具有一表面及一出光部,該表面並設置有至少一圈槽縫,該至少一圈槽縫係環繞該出光部而設置,且該基板並具有一環周緣,該等封裝孔係分佈設置在該基板之該環周緣之周邊處;一封裝體,該封裝體將該基板之該環周緣及位於該環周緣之周邊上下處完全包覆起來,該封裝體亦將該等封裝孔及該槽縫一併包覆,該封裝體並圍構出有一光學腔室,該光學腔室具有對應於該出光部的一出光口,該光學腔室具有一內壁面,該封裝體具有一頂面,該內壁面與該出光部之表面相對具有一交角關係,該內壁面之頂緣係向外延設有一封合面,該封合面與該封裝體的該頂面之間具有一段面差;兩導線架,該兩導線架係包埋於該封裝體之中並與該基板相距有一間隔,每一個導線架並具有兩端部,該兩導線架之該兩端部係外露於該封裝體之外;複數個發光二極體晶粒,該等發光二極體晶粒係位於該出光部之表面上,該等發光二極體晶粒與該兩導線架藉構成一電性連接;一晶粒保護層,該晶粒保護層位於該等發光二極體晶粒之上;一光學膠層,該光學膠層位於該晶粒保護層之上;一螢光層,該螢光層位於該光學膠層之上;一矽膠保護層,該矽膠保護層位於該螢光層之上;以及一光學透鏡組,該光學透鏡組係用以與該出光口相貼合密封。A multilayer array type light emitting diode light engine capable of eliminating moisture, comprising: a substrate having a surface and a light exiting portion, wherein the surface is provided with at least one groove slot, the at least one groove The slit is disposed around the light exiting portion, and the substrate has a ring circumference, and the package holes are distributed around the periphery of the ring of the substrate; a package body, the package body surrounds the ring of the substrate and The package is completely covered at the periphery of the circumference of the ring, and the package also covers the package holes and the slot. The package body and an optical chamber is defined. The optical chamber has a corresponding An optical port of the light exiting portion, the optical cavity has an inner wall surface, and the package body has a top surface, the inner wall surface has an angle of intersection with the surface of the light exiting portion, and the top edge of the inner wall surface is outwardly disposed a sealing surface having a surface difference from the top surface of the package; two lead frames embedded in the package and spaced apart from the substrate, each having a spacing a lead frame with two The two ends of the two lead frames are exposed outside the package; a plurality of light-emitting diode crystal grains are disposed on the surface of the light-emitting portion, and the light-emitting diodes The polar body die and the two lead frames form an electrical connection; a die protection layer, the die protection layer is located above the light emitting diode die; an optical adhesive layer, the optical adhesive layer is located Above the die protection layer; a phosphor layer on the optical adhesive layer; a silicone protective layer on the phosphor layer; and an optical lens group, the optical lens The group is used for sealing and sealing with the light exit port. 依據申請專利範圍第1項所述之可杜絕濕氣之多層式陣列型發光二極體光引擎,其中該內壁面之上可配置一反光罩。The multilayer array type light emitting diode light engine according to claim 1, wherein a reflector can be disposed on the inner wall surface. 依據申請專利範圍第1項所述之可杜絕濕氣之多層式陣列型發光二極體光引擎,其中該光學膠層的折射係數係至少不小於1.5。The multilayer array type light emitting diode light engine according to claim 1, wherein the optical adhesive layer has a refractive index of at least not less than 1.5. 依據申請專利範圍第1項所述之可杜絕濕氣之多層式陣列型發光二極體光引擎,其中該光學透鏡組可以是由一上光學透鏡、一間隔環及一下光學透鏡構成,該間隔環用以配置於該上光學透鏡及該下光學透鏡,可透過將該間隔環配置於該封合面之上並與該封合面相貼合密封。The multi-layer array type light emitting diode light engine according to claim 1, wherein the optical lens group is composed of an upper optical lens, a spacer ring and a lower optical lens. The ring is disposed on the upper optical lens and the lower optical lens, and the spacer ring is disposed on the sealing surface and sealed to the sealing surface. 依據申請專利範圍第1項所述之可杜絕濕氣之多層式陣列型發光二極體光引擎,其中該至少一圈槽縫的斷面形狀可以設置成V型、凹型或U型之至少其中。The multilayer array type light emitting diode light engine according to claim 1, wherein the cross-sectional shape of the at least one groove slot can be set to at least a V shape, a concave shape or a U shape. . 依據申請專利範圍第1項所述之可杜絕濕氣之多層式陣列型發光二極體光引擎,其中該至少一圈槽縫的內緣形成有一勾部。The multilayer array type light emitting diode light engine according to claim 1, wherein the inner edge of the at least one slit is formed with a hook portion.
TW100127434A 2011-08-02 2011-08-02 Multi-layered array-type LED light engine TW201308529A (en)

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