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TW201307588A - Highly bendable cu-co-si alloy wire - Google Patents

Highly bendable cu-co-si alloy wire Download PDF

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TW201307588A
TW201307588A TW101114307A TW101114307A TW201307588A TW 201307588 A TW201307588 A TW 201307588A TW 101114307 A TW101114307 A TW 101114307A TW 101114307 A TW101114307 A TW 101114307A TW 201307588 A TW201307588 A TW 201307588A
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inclusions
surface layer
alloy wire
bending
intensity ratio
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TWI457451B (en
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Masayuki Nagano
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Jx Nippon Mining & Metals Corp
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    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper

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Abstract

The present invention relates to a Cu-Co-Si alloy wire demonstrating improved bendability during notching while maintaining strength and electroconductivity. This highly bendable Cu-Co-Si alloy wire contains 0.5-3.0 wt% of Co, 0.1-1.0 wt% of Si, and copper and inevitable impurities constituting the balance. Even in the surface layer and the central region, the maximum value of the X-ray random intensity ratio on the {200} pole figure is 3.0-15.0 in a range where the angle (a) around an axis perpendicular to the axis of rotation of a diffraction goniometer specified by the Schulz method is 0-10 DEG . A cross section that is parallel both to the rolling direction and to the plate-thickness direction preferably has 20-200 inclusions/mm2, each of the inclusions having a particle diameter of 1-2 [mu]m. The alloy wire optionally contains a total of 0.005-2.5 wt% of one or more elements from Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, Ni, and Ag.

Description

彎曲加工性優異之Cu-Co-Si系合金條 Cu-Co-Si alloy strip with excellent bending workability

本發明係關於一種適合作為連接器、端子、繼電器、開關等材料之Cu-Co-Si系合金條。 The present invention relates to a Cu-Co-Si alloy strip suitable as a material for connectors, terminals, relays, switches, and the like.

近年來,伴隨電子機器之小型化,電氣.電子零件之小型化正在發展。而且,對用於該等零件之銅合金要求良好之強度、導電率。 In recent years, with the miniaturization of electronic machines, electrical. The miniaturization of electronic components is developing. Moreover, good strength and electrical conductivity are required for copper alloys used in such parts.

於車用端子中,亦伴隨小型化,而對使用之銅合金要求良好之強度、導電率。進而,關於車用母端子,多於加壓彎曲加工前對彎曲內面實施稱為凹痕(notching)加工之切口加工。其係為了提高加壓彎曲加工後之形狀精度而進行之加工。伴隨製品小型化,為進一步提高端子之形狀精度,存在凹痕加工變深之傾向。因此,對用於車用母端子之銅合金,除要求良好之強度、導電率以外,亦要求良好之彎曲加工性。 In the automotive terminal, it is also miniaturized, and requires good strength and electrical conductivity for the copper alloy used. Further, the female terminal for the vehicle is subjected to a notch process called a notching process on the curved inner surface before the press bending process. This is processed in order to improve the shape accuracy after the press bending process. Along with the miniaturization of the product, in order to further improve the shape accuracy of the terminal, there is a tendency that the dent process becomes deep. Therefore, in addition to good strength and electrical conductivity, a copper alloy used for a female terminal for a vehicle is required to have good bending workability.

依該要求,使用具有高強度及導電率之卡遜合金等析出強化型銅合金來代替先前之磷青銅或黃銅等固溶強化型銅合金,且此需求日趨增加。在卡遜合金中,Cu-Co-Si系合金為兼具相對較高之強度與高導電率之合金系,其強化機制係藉由於Cu基質(matrix)中析出Co-Si系金屬間化合物粒子而使強度及導電率提高。 According to this requirement, a precipitation-strengthened copper alloy such as a Carson alloy having high strength and electrical conductivity is used in place of the solid solution-strengthened copper alloy such as phosphor bronze or brass, and this demand is increasing. Among the Carson alloys, Cu-Co-Si alloys are alloy systems with relatively high strength and high electrical conductivity. The strengthening mechanism is due to the precipitation of Co-Si intermetallic compound particles in the matrix of Cu. The strength and electrical conductivity are improved.

一般而言,強度與彎曲加工性為相反之性質,即使於Cu-Co-Si系合金中亦期待維持高強度同時改善彎曲加工 性。 In general, strength and bending workability are opposite, and it is expected to maintain high strength and improve bending processing even in Cu-Co-Si alloys. Sex.

卡遜合金之一種即Cu-Ni-Si系合金之彎曲加工性之改善方法,有如專利文獻1~3中記載之控制結晶方位之方法。專利文獻1,藉由使EBSP分析測定結果之{001}<100>面積比率為50%以上來改善彎曲加工性;專利文獻2,藉由使EBSP分析測定結果之{001}<100>面積比率為50%以上且不具有層狀邊界,來改善彎曲加工性;專利文獻3,藉由使EBSP分析之測定結果之{110}<112>面積比率為20%以下、使{121}<111>面積比率為20%以下、使{001}<100>之面積比率設為5~60%而改善彎曲加工性。 A method for improving the bending workability of a Cu-Ni-Si alloy which is one of the Carson alloys is a method for controlling the crystal orientation described in Patent Documents 1 to 3. Patent Document 1 improves bending workability by making the {001}<100> area ratio of the EBSP analysis measurement result 50% or more; Patent Document 2, the {001}<100> area ratio by EBSP analysis measurement result 50% or more and no lamellar boundary to improve bending workability; Patent Document 3, by making the {110}<112> area ratio of the measurement result of EBSP analysis to be 20% or less, and making {121}<111> The area ratio is 20% or less, and the area ratio of {001}<100> is set to 5 to 60% to improve the bending workability.

[專利文獻1]日本特開2006-283059號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-283059

[專利文獻2]日本特開2006-152392號公報 [Patent Document 2] Japanese Laid-Open Patent Publication No. 2006-152392

[專利文獻3]日本特開2011-017072號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2011-017072

然而,在該等方法,若於凹痕加工後進行彎曲加工則於彎曲部會產生裂痕(crack),尤其是若凹痕加工之切口深度較長則會產生較大之裂痕,而在該等方法彎曲加工性之改善會不足。 However, in these methods, if the bending process is performed after the dent processing, cracks may occur in the bent portion, and in particular, if the kerf depth of the dent processing is long, a large crack is generated, and such a crack occurs. The improvement in bending workability is insufficient.

因此,本發明之目的在於確保強度、導電率且改善Cu-Co-Si系合金之彎曲加工性,尤其是改善實施有凹痕加工之情形時之彎曲加工性。 Accordingly, an object of the present invention is to improve the strength and electrical conductivity and to improve the bending workability of a Cu-Co-Si alloy, and in particular to improve the bending workability in the case of performing a dent process.

本發明人對Cu-Co-Si系銅合金之結晶方位與彎曲加工性之關係進行努力研究,結果發現:藉由於表層及中央部之任一者中,均對{200}極圖上包含{001}<100>方位區域 之X射線隨機強度比之極大值進行控制而改善彎曲加工性,尤其是改善凹痕加工後之彎曲加工性。 The present inventors conducted an effort to study the relationship between the crystal orientation of the Cu-Co-Si-based copper alloy and the bending workability, and as a result, it was found that the {200} pole figure is included in either of the surface layer and the central portion. 001}<100> azimuth area The X-ray random intensity is controlled to be greater than the maximum value to improve the bending workability, and in particular to improve the bending workability after the dent processing.

進而發現:為控制表層及中央部兩者之X射線隨機強度比,有效果的是於熱壓延後以特定速度進行冷卻而使特定量之粒徑1~2 μm之夾雜物存在,及調整熱壓延後之冷壓延之應變速度。 Further, it has been found that in order to control the X-ray random intensity ratio between the surface layer and the central portion, it is effective to cool at a specific speed after hot rolling to cause inclusions of a specific amount of particles having a particle diameter of 1 to 2 μm, and to adjust The strain rate of cold rolling after hot rolling.

即,本發明係關於下述發明。 That is, the present invention relates to the following invention.

(1)一種彎曲加工性優異之Cu-Co-Si系合金條,其含有0.5~3.0質量%之Co與0.1~1.0質量%之Si,剩餘部分由銅及不可避免之雜質構成,且於表層及中央部之任一者中,在{200}極圖上,與舒爾次(Schultz)法規定之繞射用測角儀之旋轉軸垂直的軸旋轉角度α為0~10°之範圍之X射線隨機強度比的極大值均為3.0~15.0。 (1) A Cu-Co-Si-based alloy strip excellent in bending workability, which contains 0.5 to 3.0% by mass of Co and 0.1 to 1.0% by mass of Si, and the balance is composed of copper and unavoidable impurities, and is on the surface layer. In any of the central parts, on the {200} pole figure, the axis rotation angle α perpendicular to the rotation axis of the diffraction goniometer specified by the Schultz method is in the range of 0 to 10°. The maximum value of the random intensity ratio of X-rays is 3.0~15.0.

(2)如(1)之Cu-Co-Si系合金條,其中,平行於壓延方向且平行於板厚方向之剖面之粒徑1~2 μm之夾雜物個數為20~200個/mm2(2) The Cu-Co-Si alloy strip according to (1), wherein the number of inclusions having a particle diameter of 1 to 2 μm parallel to the rolling direction and parallel to the thickness direction is 20 to 200/mm 2 .

(3)如(1)或(2)之Cu-Co-Si系合金條,含有以總量計為0.005~2.5質量%之Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Ni及Ag中的1種以上。 (3) The Cu-Co-Si alloy strip according to (1) or (2), containing 0.005 to 2.5% by mass of total of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P One or more of Mn, Ni, and Ag.

可獲得一種即便於加壓彎曲加工前對彎曲內面實施凹痕加工亦不會產生裂痕、彎曲加工性優異之Cu-Co-Si系銅合金。 It is possible to obtain a Cu-Co-Si-based copper alloy which is excellent in bending workability even if it is subjected to dent processing on the curved inner surface before the press bending process.

(1)Co、Si濃度 (1) Co, Si concentration

Co及Si係藉由進行時效處理而作為Co-Si系之金屬間化合物析出。該化合物使強度提高,且藉由析出而使固溶於Cu基質中之Co及Si減少,因此導電率提高。然而,若Co濃度未達0.5質量%(以下記作%)及/或Si濃度未達0.1%則無法獲得想要之強度,相反,若Co濃度超過3.0%及/或Si濃度超過1.0%則熱加工性會劣化。 Co and Si are precipitated as a Co-Si-based intermetallic compound by aging treatment. This compound increases the strength, and Co and Si dissolved in the Cu matrix are reduced by precipitation, so that the electrical conductivity is improved. However, if the Co concentration is less than 0.5% by mass (hereinafter referred to as %) and/or the Si concentration is less than 0.1%, the desired strength cannot be obtained. Conversely, if the Co concentration exceeds 3.0% and/or the Si concentration exceeds 1.0%, Hot workability is degraded.

(2)其他添加元素 (2) Other added elements

Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Ni及Ag之添加有助於強度上升。進而,Zn對於Sn鍍敷之耐熱剝離性之提高有效,Mg對於應力緩和特性之提高有效,Zr、Cr、Mn對於熱加工性之提高有效。若Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Ni及Ag之濃度以總量計未達0.005%則無法獲得上述改良效果,相反,若超過2.5%則導電率顯著降低而無法用作電氣.電子零件材料。 The addition of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, Ni, and Ag contributes to an increase in strength. Further, Zn is effective for improving the heat-resistant peelability of Sn plating, and Mg is effective for improving stress relaxation characteristics, and Zr, Cr, and Mn are effective for improving hot workability. If the concentrations of Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn, Ni, and Ag are less than 0.005% by total, the above-mentioned improvement effect cannot be obtained. Conversely, if it exceeds 2.5%, the conductivity is obtained. Significantly reduced and cannot be used as electrical. Electronic parts materials.

(3)X射線隨機強度比 (3) X-ray random intensity ratio

將{200}極圖上包含{001}<100>方位區域之X射線隨機強度比之極大值增大對改善彎曲加工性、尤其是凹痕加工後之彎曲加工性有效。進而,於表層及中央部之任一者中一起將上述X射線隨機強度比增大,對凹痕加工後之彎曲加工性之改善有效。於本說明書中,所謂「表層」係表示自合金條之正反表面起向板厚中心方向為1/6深度之部分,所謂「中央部」係表示表層以外之部分。再者,在{200}極圖上,{001}<100>方位若以與舒爾次法規定之繞射用測角儀之旋轉軸垂直的軸旋轉角度α、及平行於該旋轉軸之 軸旋轉角度β表示,則對應於α=0~10°、β=0~360°。 Increasing the X-ray random intensity ratio maximal value of the {001}<100> azimuth region on the {200} pole figure is effective for improving the bending workability, especially the bending workability after the dent processing. Further, the X-ray random intensity ratio is increased together with the surface layer and the central portion, and is effective for improving the bending workability after the dent processing. In the present specification, the term "surface layer" means a portion having a depth of 1/6 from the front and back surfaces of the alloy strip to the center of the sheet thickness, and the "central portion" indicates a portion other than the surface layer. Furthermore, on the {200} pole figure, the {001}<100> orientation is an axis rotation angle α perpendicular to the rotation axis of the diffraction goniometer specified by the Shure method, and parallel to the rotation axis. The axis rotation angle β corresponds to α=0~10° and β=0~360°.

本發明於表層及中央部中,以X射線繞射儀(X-ray diffractometer)(RIGAKU公司製造之RINT2500)進行測定,發現若在{200}極圖上α為0~10°之範圍(參照圖1)之X射線隨機強度比之極大值為3.0以上,則彎曲加工性會良好。於表層及/或中央部中,若極大值未達3.0,則彎曲加工性會劣化。另一方面,極大值現際上難以超過15.0。因此,將極大值之上限設為15.0。較佳為於表層及中央部之任一者的極大值均為5.0以上。 The present invention is measured in an X-ray diffractometer (RINT 2500 manufactured by RIGAKU Co., Ltd.) in the surface layer and the center portion, and it is found that α is in the range of 0 to 10° on the {200} pole figure (refer to When the maximum value of the X-ray random intensity ratio of Fig. 1) is 3.0 or more, the bending workability is good. In the surface layer and/or the center portion, if the maximum value is less than 3.0, the bending workability is deteriorated. On the other hand, the maximum value is currently difficult to exceed 15.0. Therefore, the upper limit of the maximum value is set to 15.0. Preferably, the maximum value of any of the surface layer and the central portion is 5.0 or more.

藉由調整{001}<100>方位之X射線隨機強度而達成優異之耐彎曲斷裂性之原因雖尚不明確,但認為由於與其他方位相比,{001}<100>方位係較為抑制塑性變形時之剪切帶之導入的方位,故而於彎曲加工時難以產生斷裂。然而,並不由上述理論限制本發明。上述α及β之範圍係考慮X射線強度比之波峰位置會因加工、熱處理條件及測定誤差等而變動來決定。 The reason for achieving excellent bending fracture resistance by adjusting the random intensity of X-rays in the {001}<100> orientation is not clear, but it is considered that the {001}<100> orientation system is more resistant to plasticity than other orientations. The orientation of the introduction of the shear band at the time of deformation is difficult to cause breakage during bending. However, the invention is not limited by the above theory. The range of α and β described above is determined by considering the peak position of the X-ray intensity ratio due to processing, heat treatment conditions, measurement errors, and the like.

藉由端子製造步驟中通常進行之凹痕加工而產生之切口深度可深至板厚之中央部為止。即便僅提高板厚表層之上述X射線隨機強度比之極大值,亦會於凹痕加工時在板厚中央部產生微裂(micro crack),且其因凹痕加工後之彎曲加工而傳播至表層產生裂痕。因此,於表層及中央部之任一者中均增大上述X射線隨機強度比之極大值以調整結晶方位,對彎曲加工性之改善有效。 The depth of the slit generated by the dent processing which is usually performed in the terminal manufacturing step can be deep to the center portion of the thickness. Even if only the maximum value of the X-ray random intensity ratio of the surface layer of the thickness is increased, a micro crack is generated in the central portion of the thickness during the dent processing, and it is propagated to the bending process after the dent processing. The surface layer is cracked. Therefore, the maximum value of the X-ray random intensity ratio is increased in either of the surface layer and the central portion to adjust the crystal orientation, which is effective for improving the bending workability.

另一方面,專利文獻1~3均為測定表面之結晶方位而 進行控制者,並未對中央部之結晶方位進行控制(專利文獻1~3之各請求項1)。因此,利用凹痕加工後之彎曲加工於板厚中央部會產生微裂,而使彎曲加工性劣化。 On the other hand, Patent Documents 1 to 3 measure the crystal orientation of the surface. The controller does not control the crystal orientation of the center portion (requests 1 of Patent Documents 1 to 3). Therefore, the bending process after the dent processing is performed at the center portion of the thickness of the sheet to cause microcracking, and the bending workability is deteriorated.

(4)夾雜物 (4) inclusions

於本發明中,所謂「夾雜物」係指如下之概念:包含於鑄造時之凝固過程產生之一般為粗大之結晶物以及由熔解時之熔液內之反應而產生之氧化物、硫化物等,進而包含鑄造時之凝固過程以後、即凝固後之冷卻過程、熱壓延後、於固溶化處理後之冷卻過程及時效處理時在固相之基質中由析出反應而產生之析出物,即,包含藉由本銅合金之SEM觀察而於基質中觀察到之粒子(所謂第二相粒子)。 In the present invention, the term "inclusion" means a concept including a generally coarse crystal formed by a solidification process at the time of casting and an oxide, a sulfide, or the like which is produced by a reaction in a melt at the time of melting. And further comprising a precipitate formed by a precipitation reaction in a solid phase matrix after a solidification process at the time of casting, that is, a cooling process after solidification, a hot rolling, and a cooling process after the solution treatment. Contains particles observed in the matrix by SEM observation of the copper alloy (so-called second phase particles).

「夾雜物之粒徑」係指藉由SEM觀察下測定之包含該夾雜物之最小圓之直徑。所謂「夾雜物之個數」係指在平行於材料之壓延方向且平行於板厚方向之剖面中,於蝕刻後藉由SEM觀察,在複數個部位實際計數與母相不同成分之粒子的每單位平方mm內之平均個數。 The "particle diameter of inclusions" means the diameter of the smallest circle including the inclusions measured by SEM observation. The term "the number of inclusions" means a particle which is different from the parent phase in a plurality of portions in a cross section parallel to the rolling direction of the material and parallel to the thickness direction of the material, and observed by SEM after etching. The average number of squares in mm.

如上述,本發明之夾雜物亦包含在熱壓延後之步驟形成之粒子,但主要有助於本發明所要之作用的是於熱壓延後存在之特定尺寸的夾雜物。 As described above, the inclusions of the present invention also contain particles formed in the step after hot rolling, but mainly contribute to the desired function of the present invention by inclusions of a specific size which are present after hot rolling.

具體而言,若於熱壓延後之壓延平行剖面中粒徑1~2 μm之夾雜物存在20~200個/mm2,則表層及中央部兩者之上述X射線隨機強度比之極大值為3.0以上。若處於20~200個/mm2之範圍外,則上述X射線強度比之極大值未達3.0,而彎曲加工性會劣化。 Specifically, if the inclusions having a particle diameter of 1 to 2 μm in the calender parallel cross section after hot rolling are present in the range of 20 to 200/mm 2 , the X-ray random intensity ratio of the surface layer and the central portion is maximal. It is 3.0 or more. If it is outside the range of 20 to 200 / mm 2 , the maximum value of the X-ray intensity ratio is less than 3.0, and the bending workability is deteriorated.

再者,熱壓延後粒徑超過1 μm之夾雜物個數係與經過包含冷壓延、固溶化處理、時效處理之Cu-Co-Si系合金之製造步驟所得之最終製品中個數大致相同。 Further, the number of inclusions having a particle diameter of more than 1 μm after hot rolling is substantially the same as the number of final products obtained by a manufacturing step of a Cu-Co-Si alloy including cold rolling, solution treatment, and aging treatment. .

詳細而言,若在熱壓延後,對粒徑1~2 μm之夾雜物於板厚方向均勻分佈之材料進行冷壓延,則加工應變會集中於夾雜物之周邊,因此應變會於板厚方向均勻分佈。若對該材料進行固溶化處理,則因{001}<100>方位之晶粒於板厚方向均勻地再結晶,故可獲得上述範圍內之X射線強度比。 Specifically, if the material having a uniform particle diameter of 1 to 2 μm is uniformly rolled in the thickness direction after hot rolling, the processing strain will concentrate on the periphery of the inclusion, so the strain will be in the thickness of the plate. The direction is evenly distributed. When the material is subjected to a solution treatment, the crystal grains of the {001}<100> orientation are uniformly recrystallized in the thickness direction, so that the X-ray intensity ratio within the above range can be obtained.

然而,先前認為其彎曲加工性裂化之原因為:若析出強化型銅合金於熱壓延後存在粒徑1~2 μm之粗大夾雜物,則有在其後之固溶化處理步驟微細第二相粒子無法充分析出而無法達成目標之強化效果之虞,且於彎曲加工時會成為斷裂之起點。因此,在析出強化型銅合金之製造步驟,以於熱壓延後儘量不產生夾雜物之方式於熱壓延中充分加熱,並於熱壓延後藉由水冷進行急冷(例如專利文獻1「0026」、專利文獻2「0062」、專利文獻3「0030」)。 However, the reason for the bending process cracking is considered to be that if the precipitated reinforced copper alloy has coarse inclusions having a particle diameter of 1 to 2 μm after hot rolling, there is a fine second phase in the subsequent solution treatment step. The particles cannot be analyzed and cannot achieve the target's strengthening effect, and will become the starting point of the fracture during bending. Therefore, in the production step of the precipitation-strengthened copper alloy, it is sufficiently heated in the hot rolling so as not to cause inclusions after hot rolling, and is rapidly cooled by water cooling after hot rolling (for example, Patent Document 1) 0026", Patent Document 2 "0062", Patent Document 3 "0030").

上述專利文獻1~3均未著眼於熱壓延步驟之條件,僅藉由控制壓延之加工度或固溶化處理條件而調節壓延表面之結晶方位。然而,在熱壓延後之冷壓延,若不控制應變速度則於表層與中央部產生之加工應變會不同,因此導致表層與中央部之結晶方位不同。又,通常在固溶化處理,表層與中央部接收之熱量並不相同,且於熱量之影響較少之中央部無法達成目標之結晶方位。因此,在該等專利文 獻之製造方法,無法控制中央部之結晶方位,包含{001}<100>方位區域之X射線隨機強度比之極大值於中央部未增加。 None of the above Patent Documents 1 to 3 pay attention to the conditions of the hot rolling step, and the crystal orientation of the calendering surface is adjusted only by controlling the degree of processing of the calendering or the solution treatment conditions. However, in the cold rolling after hot rolling, if the strain rate is not controlled, the processing strain generated in the surface layer and the center portion will be different, and thus the crystal orientation of the surface layer and the center portion will be different. Further, in the solid solution treatment, the heat received by the surface layer and the central portion is not the same, and the central portion where the influence of heat is less is unable to achieve the target crystal orientation. Therefore, in these patents According to the manufacturing method, the crystal orientation of the central portion cannot be controlled, and the maximum value of the X-ray random intensity ratio including the {001}<100> azimuth region is not increased at the central portion.

(5)製造步驟 (5) Manufacturing steps

本發明之製造步驟,首先使用大氣熔解爐,於木炭被覆下熔解電解銅、Co、Si等原料,獲得所期望之組成熔液。繼而,將該熔液鑄造成錠(ingot)。其後,進行熱壓延,並進行冷壓延、固溶化處理(在700~1000℃ 10~300秒)、時效處理(在400~600℃ 2~20小時)、及最終冷壓延(加工度5~40%)。亦可於最終冷壓延後進行弛力退火。弛力退火通常於Ar等惰性氣體環境中在250~600℃進行5~300秒。進而,亦可於固溶化處理與時效處理之間進行冷壓延以使其高強度化。又,亦可於固溶化處理後依序進行最終冷壓延、時效處理,亦可替換該等步驟之順序。若為Cu-Co-Si系合金之製造步驟中採用且於上述例示之通常之固溶化處理、時效處理及最終冷壓延之條件範圍內,則經過下述條件之熱壓延及其後之冷壓延之材料在固溶化處理於表層及中央部均會使目標方位之晶粒再結晶,且於時效處理及最終冷壓延後結晶方位之結構本質上亦不會有變化。 In the manufacturing process of the present invention, first, an atmospheric melting furnace is used, and a raw material such as electrolytic copper, Co, or Si is melted under charcoal coating to obtain a desired composition melt. The melt is then cast into an ingot. Thereafter, hot rolling is performed, and cold rolling, solution treatment (10 to 300 seconds at 700 to 1000 ° C), aging treatment (2 to 20 hours at 400 to 600 ° C), and final cold rolling (processing degree 5) are performed. ~40%). Relaxation annealing can also be performed after the final cold rolling. The relaxation annealing is usually carried out at 250 to 600 ° C for 5 to 300 seconds in an inert gas atmosphere such as Ar. Further, it is also possible to carry out cold rolling between the solution treatment treatment and the aging treatment to increase the strength. Further, the final cold rolling and aging treatment may be sequentially performed after the solution treatment, and the order of the steps may be replaced. If it is used in the manufacturing step of the Cu-Co-Si alloy and is within the conditions of the usual solution treatment, aging treatment and final cold rolling as exemplified above, the hot rolling and the subsequent cooling are carried out under the following conditions. The calendered material recrystallizes the grain of the target orientation in the surface layer and the central portion after solution treatment, and the structure of the crystal orientation after aging treatment and final cold rolling does not change substantially.

以下,對本發明之合金條之製造方法中重要步驟之製造條件進行詳述。 Hereinafter, the production conditions of important steps in the method for producing an alloy strip of the present invention will be described in detail.

(A)熱壓延 (A) Hot rolling

將鑄錠在800~1,000℃下加熱1~20小時並均質化退 火後,進行壓延。壓延後,使材料溫度從600℃降低至300℃期間之冷卻速度較佳為10~100℃/分鐘、更佳為20~80℃/分鐘。若冷卻速度處於上述範圍外,則粒徑1~2 μm之夾雜物會易處於20~200個/mm2之範圍外。即,若冷卻速度快,則粒徑1~2 μm之夾雜物會未達20個/mm2,在下一冷壓延步驟會無法於板厚方向產生均勻應變,若冷卻速度慢則粒徑1~2 μm之夾雜物會超過200個/mm2,同樣在下一冷壓延步驟會無法於板厚方向產生均勻應變,而使彎曲性下降。 The ingot is heated at 800 to 1,000 ° C for 1 to 20 hours and homogenized and annealed, followed by rolling. After the calendering, the cooling rate during the temperature reduction of the material from 600 ° C to 300 ° C is preferably from 10 to 100 ° C / min, more preferably from 20 to 80 ° C / min. If the cooling rate is outside the above range, the inclusions having a particle diameter of 1 to 2 μm may be outside the range of 20 to 200/mm 2 . That is, if the cooling rate is fast, the inclusions having a particle diameter of 1 to 2 μm may be less than 20/mm 2 , and in the next cold rolling step, uniform strain may not be generated in the thickness direction, and if the cooling rate is slow, the particle diameter is 1~ The inclusions of 2 μm will exceed 200/mm 2 , and in the next cold rolling step, uniform strain will not occur in the thickness direction, and the bending property will be lowered.

(B)熱壓延後之冷壓延 (B) Cold rolling after hot rolling

熱壓延後之冷壓延之應變速度較佳為1×10-6~1×10-4/s、更佳為5×10-6~8.0×10-5/s。本發明之「應變速度」被特定為壓延速度/輥接觸弧長。若應變速度未達1×10-6/s,則所得材料之X射線強度比之極大值於表層為3.0以上,但於中央部未達3.0。相反,若超過1×10-4/s則所得材料之X射線強度比之極大值於中央部為3.0以上,但於表層未達3.0,故而不佳。 The strain rate of the cold calendering after hot rolling is preferably from 1 × 10 -6 to 1 × 10 -4 /s, more preferably from 5 × 10 -6 to 8.0 × 10 -5 / s. The "strain rate" of the present invention is specified as the calendering speed / roll contact arc length. When the strain rate is less than 1 × 10 -6 /s, the X-ray intensity ratio of the obtained material is 3.0 or more in the surface layer, but is less than 3.0 in the center portion. On the other hand, when it exceeds 1 × 10 -4 /s, the maximum value of the X-ray intensity ratio of the obtained material is 3.0 or more in the center portion, but it is not preferable because the surface layer is less than 3.0.

[實施例] [Examples]

以下表示本發明之實施例及比較例,但該等實施例係為了更好理解本發明及其優點而提供者,並非故意對發明進行限定。 The embodiments of the present invention and the comparative examples are shown below, but the examples are provided to better understand the present invention and its advantages, and are not intended to limit the invention.

利用高頻熔解爐於氬氣環境下,在內徑110 mm、深度230 mm之氧化鋁或氧化鎂製坩堝中熔解電解銅2.50 Kg。按照表1之組成添加銅以外之元素,將熔液溫度調整為1300 ℃後,使用鑄模(材質:鑄鐵)將熔液鑄造成30×60×120 mm之錠,且利用以下之步驟製作銅合金條。 The electrolytic copper was melted by 2.50 Kg in a high-frequency melting furnace under an argon atmosphere with an inner diameter of 110 mm and a depth of 230 mm of alumina or magnesia. Add elements other than copper according to the composition of Table 1, and adjust the melt temperature to 1300. After °C, the molten metal was cast into a 30×60×120 mm ingot using a mold (material: cast iron), and a copper alloy strip was produced by the following procedure.

(步驟1)在950℃加熱3小時後,熱壓延至厚度10 mm,並使材料溫度如表1記載般變化自600℃向300℃降低之冷卻速度。 (Step 1) After heating at 950 ° C for 3 hours, the film was hot rolled to a thickness of 10 mm, and the material temperature was changed from 600 ° C to 300 ° C as shown in Table 1.

(步驟2)利用研磨機(grinder)將熱壓延後之板表面之氧化銹皮研磨、除去。 (Step 2) The rust scale on the surface of the hot rolled sheet is ground and removed by a grinder.

(步驟3)以表1記載之應變速度冷壓延至板厚0.180 mm為止。應變速度係由壓延速度/輥接觸弧長而決定。 (Step 3) Cold rolling to a plate thickness of 0.180 mm at the strain rate shown in Table 1. The strain rate is determined by the calendering speed/roller contact arc length.

(步驟4)在1000℃、大氣中加熱10秒,並在水中急冷作為固溶化處理。 (Step 4) Heating at 1000 ° C for 10 seconds in the air, and quenching in water as a solution treatment.

(步驟5)使用電爐在550℃、Ar環境中以加熱5小時,作為時效處理。 (Step 5) Heating was carried out for 5 hours at 550 ° C in an Ar atmosphere using an electric furnace as an aging treatment.

(步驟6)進行最終冷壓延至板厚0.15 mm為止。 (Step 6) Final cold rolling is performed until the sheet thickness is 0.15 mm.

(步驟7)作為弛力退火,在400℃、Ar環境中加熱10秒。 (Step 7) As a relaxation annealing, it was heated at 400 ° C in an Ar atmosphere for 10 seconds.

對如此製作之試樣,進行以下各特性之評價。 The samples thus prepared were evaluated for the following characteristics.

(1)夾雜物 (1) inclusions

熱壓延後之試樣,藉由蝕刻(水-NH3(40 vol%)-H2O2(0.6 vol%))使平行於壓延方向且平行於板厚方向之剖面組織露出,使用FE-SEM(日本FEI公司製造之XL30SFEG)以750倍之倍率觀察1 mm2視野之2次電子像。其後,使用圖像分析裝置分別求出觀察視野中夾雜物之粒徑及個數。進而,亦測定最終步驟後製品之夾雜物,確認到熱壓 延後粒徑1~2 μm之夾雜物個數於最終步驟後並未有較大變化。 After hot rolling, the cross-sectional structure parallel to the rolling direction and parallel to the thickness direction was exposed by etching (water-NH 3 (40 vol%)-H 2 O 2 (0.6 vol%)), and FE was used. - SEM (XL30SFEG manufactured by FEI Corporation, Japan) observed a secondary image of 1 mm 2 field of view at a magnification of 750 times. Thereafter, the particle diameter and the number of inclusions in the observation field of view were respectively determined using an image analyzer. Further, the inclusions of the product after the final step were also measured, and it was confirmed that the number of inclusions having a particle diameter of 1 to 2 μm after hot rolling did not largely change after the final step.

(2)X射線隨機強度比之極大值 (2) X-ray random intensity ratio maximum value

藉由X射線繞射儀(RIGAKU股份有限公司製造,RINT2500),使用Co管(Co X-ray tube),以管電壓為30 kV、管電流為100 mA進行各試樣之{200}極點測定,並製作{200}極圖。測定上述範圍(α=0~10°、β=0~360°)之X射線強度,算出其與同樣方式測得之作為標準試樣之銅粉末(關東化學股份有限製造,商品名為銅(粉末)2N5)之X射線強度之比,並求出其極大值。表層之X射線隨機強度比之極大值係測定壓延面,中央部之X射線隨機強度比之極大值係測定由三氯化鐵溶液之噴霧蝕刻(spray etching)而使板厚中央部(板厚深度之1/2)露出之面。再者,係於磷酸67%+硫酸10%+水之溶液對壓延面表面,以15 V60秒之條件以電解研磨使組織露出再水洗乾燥後,進行壓延面之測定。 The {200} pole measurement of each sample was carried out by a X-ray diffractometer (RINT2500, manufactured by RIGAKU Co., Ltd.) using a Co tube (Co X-ray tube) at a tube voltage of 30 kV and a tube current of 100 mA. And make a {200} pole figure. The X-ray intensity of the above range (α = 0 to 10 °, β = 0 to 360 °) was measured, and the copper powder as a standard sample measured in the same manner was calculated (Kantong Chemical Co., Ltd., trade name: copper ( The ratio of the X-ray intensity of the powder) 2N5) and the maximum value thereof. The X-ray random intensity ratio of the surface layer is the maximum value of the calendered surface, and the X-ray random intensity ratio at the central portion is measured by the spray etching of the ferric chloride solution to make the central portion of the plate thickness (plate thickness). 1/2 of the depth) exposed. Further, a solution of phosphoric acid 67% + sulfuric acid 10% + water was applied to the surface of the calendered surface by electrolytic polishing at 15 V for 60 seconds to expose the structure to water and then dried, and then the calendered surface was measured.

(3)0.2%耐力及導電率 (3) 0.2% endurance and electrical conductivity

0.2%耐力係使用拉伸試驗機依照JIS Z 2241而測出。本發明所謂之良好強度係指0.2%耐力為500 MPa~950 MPa、較佳為600~950 MPa之範圍內。 0.2% of the endurance was measured in accordance with JIS Z 2241 using a tensile tester. The so-called good strength of the present invention means that the 0.2% proof stress is in the range of 500 MPa to 950 MPa, preferably 600 to 950 MPa.

導電率係依照JIS H 0505而測出。本發明所謂之良好導電率係指50%IACS以上、較佳為60%IACS以上。 The conductivity was measured in accordance with JIS H 0505. The term "good conductivity" as used in the present invention means 50% IACS or more, preferably 60% IACS or more.

(4)彎曲性 (4) Flexibility

彎曲性之評價,實施深度為25、50、75 μm之凹痕加 工(參照圖2A)後,依照JIS H 3130,進行彎曲半徑為0 mm、於GoodWay方向進行90°W彎曲加工(參照圖2B)。再者,在圖2A中被附予凹痕之試樣,在圖2B中上下翻轉進行彎曲加工。利用機械研磨及拋光研磨將經彎曲加工之部分的平行於壓延方向且平行於板厚方向之剖面(參照圖2C)精加工為鏡面,以光學顯微鏡(倍率50倍)觀察斷裂之有無。將光學顯微鏡觀察下未確認到斷裂之情形評價為○,將確認到斷裂之情形評價為×。 Evaluation of the bending property, the implementation of the depth of 25, 50, 75 μm dent plus After the work (see FIG. 2A), the bending radius was 0 mm and the 90°W bending process was performed in the GoodWay direction in accordance with JIS H 3130 (see FIG. 2B). Further, the sample to which the indentation is attached in Fig. 2A is turned upside down in Fig. 2B to perform bending processing. The section of the bent portion parallel to the rolling direction and parallel to the sheet thickness direction (see FIG. 2C) was finished into a mirror surface by mechanical polishing and polishing, and the presence or absence of cracking was observed with an optical microscope (magnification: 50 times). The case where the fracture was not confirmed under the observation of the optical microscope was evaluated as ○, and the case where the fracture was confirmed was evaluated as ×.

本發明所謂「彎曲加工性優異」係指於對板厚0.15 mm之試樣進行上述評價時,即便進行深度50 μm之凹痕加工亦未確認到斷裂。 In the present invention, "excellent bending workability" means that when the above evaluation is performed on a sample having a thickness of 0.15 mm, no breakage was observed even when the dent was processed at a depth of 50 μm.

將實施例示於表1。發明例1~17為規定範圍內,即便於深度50 μm之凹痕加工後實施彎曲加工亦未確認到斷裂,顯示出良好之彎曲加工性。其中,發明例2、3、6~8、11、12及14確保優異之強度、導電率,且即便於試樣厚度一半之深度75 μm的凹痕加工後實施彎曲加工,亦未確認到斷裂。 The examples are shown in Table 1. Inventive Examples 1 to 17 were within a predetermined range, and even if the bending process was performed after the dent processing with a depth of 50 μm, no fracture was observed, and good bending workability was exhibited. Among them, Invention Examples 2, 3, 6 to 8, 11, 12, and 14 ensure excellent strength and electrical conductivity, and no fracture was observed even after bending processing was performed after dent processing having a depth of 75 μm at half the thickness of the sample.

比較例1因Co及Si濃度均低,故0.2%耐力低。比較例2因Co及Si濃度均高,故於熱壓延時產生斷裂。比較例3因Co、Si以外之添加元素濃度高,故導電率較低,不適合作為電氣.電子零件材料。 In Comparative Example 1, since the concentrations of Co and Si were both low, the 0.2% proof stress was low. In Comparative Example 2, since the concentrations of Co and Si were both high, fracture occurred at the time of hot pressing. In Comparative Example 3, since the concentration of the added element other than Co and Si is high, the conductivity is low and it is not suitable as an electric. Electronic parts materials.

比較例4為因熱壓延之冷卻速度慢故而夾雜物之個數多之例。X射線隨機強度比之極大值於表層及中央部均未達3.0,而使彎曲加工性較差。相反,比較例5及6為於熱壓 延後進行水冷之先前技術例。因冷卻速度快,故夾雜物之個數少,無法獲得因夾雜物均勻分佈而使加工應變均勻分散之效果,即便冷壓延之應變速度為適當之範圍內,X射線隨機強度比之極大值不管於表層及中央部均未達3.0,而使彎曲加工性差。 Comparative Example 4 is an example in which the number of inclusions is large due to the slow cooling rate of hot rolling. The maximum value of the X-ray random intensity ratio is less than 3.0 in the surface layer and the central portion, and the bending workability is poor. In contrast, Comparative Examples 5 and 6 are for hot pressing A prior art example in which water cooling is postponed. Since the cooling rate is fast, the number of inclusions is small, and the effect of uniform dispersion of the processing strain due to uniform distribution of inclusions cannot be obtained. Even if the strain rate of cold rolling is within an appropriate range, the random intensity of X-rays is greater than the maximum value. It is less than 3.0 in the surface layer and the center portion, and the bending workability is poor.

比較例7及8為熱壓延後之冷壓延之應變速度快之例。雖中央部之X射線隨機強度比之極大值為3.0以上,但表層部未達3.0,即便沖口加工深度為25 μm(板厚之1/6),彎曲加工性亦差。相反,比較例9及10為熱壓延後之冷壓延之應變速度慢之例。雖表層部之X射線隨機強度比之極大值為3.0以上,但中央部未達3.0,雖於凹痕加工深度為25 μm時未產生斷裂,但於50 μm(板厚之1/3)以上時產生斷裂,其彎曲加工性差。 Comparative Examples 7 and 8 are examples in which the strain rate of cold rolling after hot rolling is fast. Although the maximum X-ray intensity ratio at the center is 3.0 or more, the surface portion is less than 3.0, and the bending workability is inferior even if the punching depth is 25 μm (1/6 of the thickness). On the contrary, Comparative Examples 9 and 10 are examples in which the strain rate of cold rolling after hot rolling is slow. Although the X-ray random intensity ratio of the surface layer is greater than 3.0, the central portion is less than 3.0. Although the fracture depth is 25 μm, no fracture occurs, but it is 50 μm (1/3 of the thickness). When a fracture occurs, the bending workability is poor.

2‧‧‧試樣 2‧‧‧sample

3‧‧‧凹痕加工深度 3‧‧‧Deep processing depth

21‧‧‧壓延方向 21‧‧‧Rolling direction

22‧‧‧板厚方向 22‧‧‧ plate thickness direction

23‧‧‧彎曲加工性之觀察面 23‧‧‧Bending processing observation surface

圖1係以灰色部分(中央之圓內)表示與舒爾次法規定繞射用測角儀之旋轉軸垂直的軸旋轉角度α為0~10°之範圍的{200}極圖。 Fig. 1 is a {200} pole figure showing a range in which the axis rotation angle α perpendicular to the rotation axis of the diffraction goniometer specified by the Shure method is 0 to 10° in the gray portion (in the center circle).

圖2A係凹痕加工步驟之示意圖。圖中之箭頭表示壓力方向。 Figure 2A is a schematic illustration of the dent processing step. The arrows in the figure indicate the direction of pressure.

圖2B係90°W彎曲加工步驟之示意圖。 Figure 2B is a schematic illustration of a 90° W bending process step.

圖2C係表示彎曲加工後之觀察面之說明示意圖。 Fig. 2C is a schematic view showing the observation surface after the bending process.

Claims (3)

一種彎曲加工性優異之Cu-Co-Si系合金條,含有0.5~3.0質量%之Co與0.1~1.0質量%之Si,剩餘部分由銅及不可避免之雜質構成,且於表層及中央部之任一者中,在{200}極圖上,與舒爾次法規定之繞射用測角儀之旋轉軸垂直的軸旋轉角度α為0~10°之範圍之X射線隨機強度比的極大值均為3.0~15.0。 A Cu-Co-Si alloy strip excellent in bending workability, containing 0.5 to 3.0% by mass of Co and 0.1 to 1.0% by mass of Si, and the balance being composed of copper and unavoidable impurities, and being in the surface layer and the central portion. In either case, on the {200} pole figure, the X-ray random intensity ratio is extremely large in the range of 0 to 10° from the axis of rotation α of the angle of rotation of the goniometer specified by the Shure method. The values are all from 3.0 to 15.0. 如申請專利範圍第1項之Cu-Co-Si系合金條,其中,平行於壓延方向且平行於板厚方向之剖面之粒徑1~2 μm之夾雜物個數為20~200個/mm2For example, in the Cu-Co-Si alloy strip according to item 1 of the patent application, wherein the number of inclusions having a particle diameter of 1 to 2 μm parallel to the rolling direction and parallel to the thickness direction is 20 to 200/mm. 2 . 如申請專利範圍第1或2項之Cu-Co-Si系合金條,含有以總量計為0.005~2.5質量%之Sn、Zn、Mg、Fe、Ti、Zr、Cr、Al、P、Mn、Ni及Ag中的1種以上。 The Cu-Co-Si alloy strip according to claim 1 or 2 contains Sn, Zn, Mg, Fe, Ti, Zr, Cr, Al, P, Mn in a total amount of 0.005 to 2.5% by mass. One or more of Ni and Ag.
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