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TW201306312A - Illuminating device - Google Patents

Illuminating device Download PDF

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Publication number
TW201306312A
TW201306312A TW100126302A TW100126302A TW201306312A TW 201306312 A TW201306312 A TW 201306312A TW 100126302 A TW100126302 A TW 100126302A TW 100126302 A TW100126302 A TW 100126302A TW 201306312 A TW201306312 A TW 201306312A
Authority
TW
Taiwan
Prior art keywords
light
lead frame
illuminating device
grasping
emitting element
Prior art date
Application number
TW100126302A
Other languages
Chinese (zh)
Inventor
蔡培崧
田運宜
林子樸
周彥志
Original Assignee
隆達電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 隆達電子股份有限公司 filed Critical 隆達電子股份有限公司
Priority to TW100126302A priority Critical patent/TW201306312A/en
Priority to CN2011103367875A priority patent/CN102903822A/en
Publication of TW201306312A publication Critical patent/TW201306312A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/50—
    • H10W72/5522—
    • H10W72/5524—
    • H10W74/00—

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  • Led Device Packages (AREA)

Abstract

A light emitting device, includes a light emitting element; a first electrode, electrically coupled with a first terminal of the light emitting element, wherein the light emitting element is mounted on the first electrode; a second electrode, electrically coupled with a second terminal of the light emitting element; at least a first holder wire formed on the first electrode; at least a second holder wire formed on the second electrode; and a molding resin cap attached to the first and the second electrode, and cover the light emitting device and the first and the second holder wire.

Description

發光裝置Illuminating device

本發明係有關於發光裝置，特別是關於發光二極體元件的封裝結構。The present invention relates to a light-emitting device, and more particularly to a package structure for a light-emitting diode element.

發光二極體(Light Emitting Device,LED)相較於傳統光源，具有高效率、壽命長、結構堅固且高開關速度等優勢，且可以廣泛應用於顯示器及各種照明設備，因此發展發光二極體光源為近年來的主流趨勢。典型的發光二極體晶片具有透明的封裝罩，覆蓋於發光二極體晶片以及基板上方，以保護發光二極體晶片以及其打線(bonding wire)不受外力或水氣的破壞。然而，封裝罩與基板之間常因為熱作用或接合不良而產生剝離(peeling)現象，使得封裝罩的保護作用喪失，對於元件的可靠度影響甚劇。Compared with traditional light sources, Light Emitting Device (LED) has the advantages of high efficiency, long life, strong structure and high switching speed, and can be widely used in displays and various lighting devices, so the development of light-emitting diodes Light sources are the mainstream trend in recent years. A typical LED wafer has a transparent encapsulation covering the LED substrate and the substrate to protect the LED wafer and its bonding wire from external forces or moisture. However, the peeling phenomenon often occurs between the encapsulating cover and the substrate due to thermal action or poor bonding, so that the protective effect of the encapsulating cover is lost, which has a great influence on the reliability of the component.

因此，本發明提出一種發光裝置，包括發光元件；第一導線架，承載發光二極體晶片，與發光元件之第一端構成電性連接；第二導線架，與發光元件之第二端構成電性連接；至少第一抓取結構，形成於第一導線架上；至少一第二抓取結構，形成於第二導線架上；以及一封裝罩，與第一及第二導線架接合，且包覆發光元件及第一與第二抓取結構。Therefore, the present invention provides a light-emitting device comprising a light-emitting element; a first lead frame carrying a light-emitting diode wafer electrically connected to a first end of the light-emitting element; and a second lead frame forming a second end of the light-emitting element Electrically connecting; at least a first grasping structure formed on the first lead frame; at least one second grasping structure formed on the second lead frame; and a package cover engaged with the first and second lead frames And covering the light emitting element and the first and second grasping structures.

以下實施例揭露一種發光裝置以及其形成方法。為求簡明，僅於以下實施例及圖式中描述一個發光裝置100，惟於實際製程中，可同時形成複數個發光裝置100。首先如第1圖所示，將一第一導線架20a與一第二導線架20b設置於一基板10之上。接著將一發光元件30安置於第一導線架20a之上。The following embodiments disclose a light emitting device and a method of forming the same. For the sake of brevity, only one illuminating device 100 is described in the following embodiments and drawings, but in the actual process, a plurality of illuminating devices 100 can be simultaneously formed. First, as shown in FIG. 1, a first lead frame 20a and a second lead frame 20b are disposed on a substrate 10. A light-emitting element 30 is then placed over the first leadframe 20a.

第一導線架20a與第二導線架20b可以沖壓(stamping)、電鍍(electroplating)或是沈積方式形成。於安裝發光元件30之前，可選擇性的於第一導線架20a與一第二導線架20b表面塗上一層銀膠或錫膏，以增加發光元件30與第一導線架20a之間的接合度，並可降低後續封裝製程中第一導線架20a與一第二導線架20b與導線40a、40b之間的接觸電阻值。於一較佳實施例中，發光元件30為一發光二極體元件。The first lead frame 20a and the second lead frame 20b may be formed by stamping, electroplating or deposition. Optionally, a layer of silver paste or solder paste is applied to the surface of the first lead frame 20a and the second lead frame 20b before the mounting of the light emitting element 30 to increase the bonding degree between the light emitting element 30 and the first lead frame 20a. And reducing the contact resistance between the first lead frame 20a and the second lead frame 20b and the wires 40a, 40b in the subsequent packaging process. In a preferred embodiment, the light-emitting element 30 is a light-emitting diode element.

接著如第2A圖所示，分別於第一導線架20a以及第二導線架20b上形成導線40a、40b以及複數個抓取結構50a、50b。其中導線40a的一端與第一導線架20a接合以形成電性連結，另一端則與發光元件30的一端子電性連結；導線40b的一端與第一導線架20b接合以形成電性連結，另一端則與發光元件30的另一端子電性連結。抓取結構50a的兩端皆與第一導線架20a接合，抓取結構50b的兩端則皆與第一導線架20b接合。第2B圖為第2A圖中實施例的平面示意圖。Next, as shown in FIG. 2A, wires 40a, 40b and a plurality of gripping structures 50a, 50b are formed on the first lead frame 20a and the second lead frame 20b, respectively. One end of the wire 40a is joined to the first lead frame 20a to form an electrical connection, and the other end is electrically connected to one terminal of the light-emitting element 30; one end of the wire 40b is joined to the first lead frame 20b to form an electrical connection, and One end is electrically connected to the other terminal of the light-emitting element 30. Both ends of the grasping structure 50a are engaged with the first lead frame 20a, and both ends of the grasping structure 50b are engaged with the first lead frame 20b. Figure 2B is a plan view of the embodiment of Figure 2A.

導線40a、40b以及抓取結構50a、50b皆可以打線機(wire bonder)形成，可以使用金、銅、鋁等材料構成。於部份實施例中，抓取結構50a、50b可為線狀，帶狀(ribbon)，或片狀(slice)。於部份實施例中，抓取結構50a、50b的外觀可呈現圓弧型或具有彎曲角度。應注意的是，於發光元件操作時，由於抓取結構50a的兩端皆與第一導線架20a接合，而抓取結構50b的兩端則皆與第二導線架20b接合，因此抓取結構50a與50b之兩端皆為等電位，並未有任何電流通過其上。The wires 40a, 40b and the grasping structures 50a, 50b may be formed by a wire bonder, and may be made of a material such as gold, copper or aluminum. In some embodiments, the grasping structures 50a, 50b can be linear, ribbon, or a slice. In some embodiments, the appearance of the gripping structures 50a, 50b may assume a circular arc shape or have a curved angle. It should be noted that, when the light-emitting element is operated, since both ends of the grasping structure 50a are engaged with the first lead frame 20a, both ends of the grasping structure 50b are engaged with the second lead frame 20b, so the grasping structure Both ends 50a and 50b are equipotential, and no current flows through them.

接著形成一封裝罩60於基板10之上，覆蓋發光元件30、第一導線架20a與第二導線架20b、導線40a、40b，以及抓取結構50a、50b。其中抓取結構50a、50b與封裝罩60接合，以形成發光裝置100，如第3A圖所示。第3B圖為第3A圖中實施例的平面示意圖。A package cover 60 is then formed over the substrate 10 to cover the light-emitting elements 30, the first leadframe 20a and the second leadframe 20b, the wires 40a, 40b, and the gripping structures 50a, 50b. The gripping structures 50a, 50b are joined to the encapsulation cover 60 to form the illumination device 100, as shown in FIG. 3A. Figure 3B is a plan view of the embodiment of Figure 3A.

封裝罩60可以插入塑模(insert molding)方式形成，經由填充注膠於一模具內，並經適量的加熱加壓以將膠材硬化。膠材呈流體狀時會與抓取結構50a、50b緊密貼附，膠材經硬化後形成封裝罩60，抓取結構50a、50b便具有額外的固定封裝罩60之功效。封裝罩60的材料可為矽氧樹脂(silicone resin)或環氧樹脂(epoxy resin)。The encapsulating cover 60 can be formed by insert molding, and is filled in a mold via a filling glue, and is subjected to an appropriate amount of heat and pressure to harden the rubber material. When the glue material is in fluid form, it will be closely attached to the grasping structures 50a, 50b, and the glue material is hardened to form the package cover 60. The grasping structures 50a, 50b have the additional function of fixing the package cover 60. The material of the encapsulation cover 60 may be a silicone resin or an epoxy resin.

於部份實施例中，封裝罩60包括鏡面部份60a以及基層部份(base layer)60b，其中鏡面部份60a位於發光元件30的正上方，而基層部份60b則位於發光元件30的周圍。一較佳實施例中，抓取結構50a、50b係與基層部份60b貼合，如第3A圖及第3B圖所示。惟本發明之範疇不侷限於此。於部份其他實施例中，如第4圖之發光裝置200，可以於打線形成後，以點膠製程於塑膠帶線晶片載體(plastic leaded chip carrier)70上形成封裝罩80。其中抓取結構50a、50b與封裝罩80接合，具有額外的固定封裝罩80之功效。In some embodiments, the encapsulation cover 60 includes a mirror portion 60a and a base layer 60b, wherein the mirror portion 60a is located directly above the light emitting element 30, and the base portion 60b is located around the light emitting element 30. . In a preferred embodiment, the gripping structures 50a, 50b are attached to the base portion 60b as shown in Figures 3A and 3B. However, the scope of the invention is not limited thereto. In some other embodiments, as in the light-emitting device 200 of FIG. 4, the package cover 80 may be formed on the plastic leaded chip carrier 70 by a dispensing process after the wire is formed. Wherein the gripping structures 50a, 50b are engaged with the encapsulation cover 80, with the additional effect of securing the encapsulation cover 80.

本發明提供一種發光裝置，藉由抓取結構，強化封裝罩與裝置基板及部件之間的接合力，進而提昇發光裝置的可靠度及平均壽命，無須增加額外的製程。The present invention provides a light-emitting device that enhances the bonding force between the package cover and the substrate and components of the device by grasping the structure, thereby improving the reliability and the average life of the light-emitting device without adding an additional process.

10．．．基板10. . . Substrate

20a、20b．．．導線架20a, 20b. . . Lead frame

30．．．發光元件30. . . Light-emitting element

40a、40b．．．導線40a, 40b. . . wire

50a、50b．．．抓取結構50a, 50b. . . Grab structure

60．．．封裝罩60. . . Encapsulation cover

60a．．．鏡面部份60a. . . Mirror part

60b．．．基層部份60b. . . Base part

70．．．塑膠帶線晶片載體70. . . Plastic strip wafer carrier

80．．．封裝罩80. . . Encapsulation cover

100．．．發光裝置100. . . Illuminating device

200．．．發光裝置200. . . Illuminating device

第1圖為根據一實施例，發光裝置製造過程的剖面示意圖；1 is a schematic cross-sectional view showing a manufacturing process of a light emitting device according to an embodiment;

第2A圖為根據一實施例，發光裝置製造過程的剖面示意圖；2A is a schematic cross-sectional view showing a manufacturing process of a light emitting device according to an embodiment;

第2B圖為第2A圖中發光裝置製造過程的平面示意圖；2B is a plan view showing the manufacturing process of the light-emitting device in FIG. 2A;

第3A圖為根據一實施例，發光裝置製造過程的剖面示意圖；3A is a schematic cross-sectional view showing a manufacturing process of a light emitting device according to an embodiment;

第3B圖為第3A圖中發光裝置製造過程的平面示意圖；3B is a plan view showing the manufacturing process of the light-emitting device in FIG. 3A;

第4圖為根據一實施例，發光裝置製造過程的剖面示意圖。4 is a schematic cross-sectional view showing a manufacturing process of a light emitting device according to an embodiment.

10．．．基板10. . . Substrate

20a、20b．．．導線架20a, 20b. . . Lead frame

30．．．發光元件30. . . Light-emitting element

40a、40b．．．導線40a, 40b. . . wire

50a、50b．．．抓取結構50a, 50b. . . Grab structure

60．．．封裝罩60. . . Encapsulation cover

60a．．．鏡面部份60a. . . Mirror part

60b．．．基層部份60b. . . Base part

100．．．發光裝置100. . . Illuminating device

Claims (10)

一種發光裝置，包括：一發光元件；一第一導線架，承載該發光元件，與該發光元件之一第一端構成電性連接；一第二導線架，與該發光元件之一第二端構成電性連接；至少一第一抓取結構，形成於該第一導線架上；至少一第二抓取結構，形成於該第二導線架上；以及一封裝罩，與該第一及第二導線架接合，且包覆該發光元件及該第一與該第二抓取結構。A light-emitting device comprising: a light-emitting element; a first lead frame carrying the light-emitting element, electrically connected to a first end of the light-emitting element; a second lead frame, and a second end of the light-emitting element Forming an electrical connection; at least one first grasping structure is formed on the first lead frame; at least one second grasping structure is formed on the second lead frame; and a package cover, and the first and the first The two lead frames are joined and enclose the light emitting element and the first and second grasping structures. 如申請專利範圍第1項所述之發光裝置，其中該封裝罩具有一透鏡，且設置於該發光元件之上方。The illuminating device of claim 1, wherein the encapsulating cover has a lens and is disposed above the illuminating element. 如申請專利範圍第1項所述之發光裝置，其中該第一與該第二抓取結構為線狀、帶狀或片狀金屬。The illuminating device of claim 1, wherein the first and second grasping structures are linear, strip or sheet metal. 如申請專利範圍第1項所述之發光裝置，其中該第一抓取結構之兩端均接合至該第一導線架；該第二抓取結構之兩端均接合至該第二導線架。The illuminating device of claim 1, wherein both ends of the first grasping structure are joined to the first lead frame; both ends of the second grasping structure are joined to the second lead frame. 如申請專利範圍第1項所述之發光裝置，其中該第一與該第二抓取結構係彎折成為圓弧形或多邊形。The illuminating device of claim 1, wherein the first and second grasping structures are bent into a circular arc shape or a polygonal shape. 如申請專利範圍第1項所述之發光裝置，其中該第一與該第二抓取結構係藉由打線機而成型於該第一及該第二導線架上。The illuminating device of claim 1, wherein the first and second grasping structures are formed on the first and second lead frames by a wire bonding machine. 如申請專利範圍第1項所述之發光裝置，其中該第一與該第二抓取結構均無電流通過。The illuminating device of claim 1, wherein no current is passed through the first and second grasping structures. 如申請專利範圍第1項所述之發光裝置，其中該第一抓取結構之兩端無電位差；該第二抓取結構之兩端無電位差。The illuminating device of claim 1, wherein there is no potential difference between the two ends of the first grasping structure; and there is no potential difference between the two ends of the second grasping structure. 如申請專利範圍第1項所述之發光裝置，其中該封裝罩之材質為矽氧樹脂(silicone resin)或環氧樹脂(epoxy resin)。The illuminating device of claim 1, wherein the encapsulating cover is made of a silicone resin or an epoxy resin. 如申請專利範圍第1項所述之發光裝置，其中該發光元件為發光二極體晶片。The illuminating device of claim 1, wherein the illuminating element is a light emitting diode chip.
TW100126302A 2011-07-26 2011-07-26 Illuminating device TW201306312A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100126302A TW201306312A (en) 2011-07-26 2011-07-26 Illuminating device
CN2011103367875A CN102903822A (en) 2011-07-26 2011-10-31 light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100126302A TW201306312A (en) 2011-07-26 2011-07-26 Illuminating device

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CN116207208A (en) * 2023-02-17 2023-06-02 深圳市聚飞光电股份有限公司 Chip package and manufacturing method thereof

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JP2000022044A (en) * 1998-07-02 2000-01-21 Mitsubishi Electric Corp Semiconductor device and manufacturing method thereof
JP4101468B2 (en) * 2001-04-09 2008-06-18 豊田合成株式会社 Method for manufacturing light emitting device
JP5233170B2 (en) * 2007-05-31 2013-07-10 日亜化学工業株式会社 LIGHT EMITTING DEVICE, RESIN MOLDED BODY FORMING LIGHT EMITTING DEVICE, AND METHOD FOR PRODUCING THEM
CN201204212Y (en) * 2008-05-30 2009-03-04 深圳市瑞丰光电子有限公司 A kind of LED packaging structure
US20100237378A1 (en) * 2009-03-19 2010-09-23 Tzu-Han Lin Light emitting diode package structure and fabrication thereof
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