TW201306316A - The method for sealing the flip chip light emitting diode chip on board (FCCOB) light engine - Google Patents

Abstract

This invention is about a use of Flip Chip Light Emitting Diode (FCLED) constructed of the surface light source chip-on-board LED light Engine (FCCOB) of the structure and its manufacturing method. Hinges on the surface of circuit board layout, and circuit layout in line with the plural electrode contact, and then flip-chip LEDs by use of electrical materials and then connected to the electrode contacts. Material to be solidified and then to apron around the circuit board of the FCLED the external, then surrounded on the apron within the deployment of the fluorescent powder gel, in a particular way of return to punctuate gel coating method, the FCLED of visible surface and the FCLED between adjacent side of the circuit board surface covered with fluorescent powder gel. After vacuum deaerating and baking process, the formation of the optical light engine modules. This expression allows the formation of each FCLED between adjacent side, the light emitted by the side of light formed by an extension of areas, so that the fluorescent powder coating colloidal been excited, arising from extended of the surface light. Such structures and manufacturing methods to improve luminous efficiency can improve the light projection angle, lighting levels, and light uniformity effect.

Description

Packaging method of flip chip type light emitting diode surface light source optical engine

The invention relates to a method for packaging a flip-chip light-emitting diode surface light source optical engine, in particular to a chip on board (COB) constructed by using a Flip Chip Light Emitting Diode (FCLED) flip-chip light-emitting diode. The structure of the optical engine Light Engine light-emitting module (FCCOB) and the manufacturing method thereof, so that the light extending region formed by the light emitted from the side between adjacent sides of each flip-chip light-emitting diode enables coating The phosphor powder is excited and produces an extensible surface source. A packaging method for improving luminous efficiency, increasing the projection angle of illumination, improving illumination brightness, and uniform illumination efficiency.

Light-emitting diodes (LEDs) are light-emitting components with power saving, small size, and high reliability. In particular, white light-emitting diodes have been widely used in indoor and outdoor lighting, backlights for liquid crystal panels, and the like. . How the light-emitting diode uniformly and efficiently produces the high brightness required for illumination and the luminous efficiency of the surface light source formed by a large area has been the focus of continuous research and development in the packaging industry. The luminous efficiency of the light-emitting diode itself is related to the quantum efficiency and the temperature effect. However, if only the luminous efficiency of the light-emitting diode is increased, the illumination effect of the surface light source required to achieve illumination is slightly insufficient. The luminous efficiency of the light-emitting diodes is increased in the packaging process of the latter stage, for example, the light-emitting diodes are arranged in a reflective cup-like structure, or arranged in a matrix form or the like. Although the effect of increasing the brightness can be achieved, for the surface light source required for illumination, the form is liable to cause problems such as glare, glare, ghosting, poor heat dissipation, and light decay. Therefore, in view of the above problems and shortcomings, the inventors collected relevant information, evaluated and considered them through multiple parties, and designed the flip-chip LED surface light source optical engine with years of research and development experience accumulated in this industry. The invention of the packaging method of FCCOB Light Engine to solve the above problems and problems.

The main object of the present invention is to provide a packaged method for a flip-chip light-emitting diode surface light source optical engine, which is a structure and a manufacturing method of a surface light source optical engine light-emitting module constructed by using a flip-chip light-emitting diode. An optical extension region formed by the light emitted from the side surface between adjacent side faces of each of the flip-chip light-emitting diodes is excited by the applied phosphor powder colloid to generate an extensible surface light source. In order to improve luminous efficiency, increase the projection angle of illumination, improve illumination brightness and uniform illumination

The above-described encapsulation method is to expand the light-emitting area by using the pattern of the phosphor powder coating, and to improve the luminous efficiency. The circuit layout is formed on the circuit board according to an appropriate separation distance, and an electrode contact is arranged on the circuit layout, so that the light-emitting diode is electrically connected to the electrode contact, and then the rubber ring is fixed on the circuit. The specific position of the circuit board is used to apply the fluorescent powder colloid to the light-emitting range formed by the apron by the loop dispensing method, so that the visible light-emitting surfaces of the light-emitting diodes in the light-emitting range and the adjacent light-emitting diodes are adjacent to each other. The surface of the circuit board between the positions is coated with a phosphor powder colloid.

In the foregoing packaging method, in order to ensure that the fluorescent powder can be completely covered and the covered bubbles are removed, vacuum defoaming is performed in the process to remove all the gas in the gap; then baking is performed to make the fluorescent The powder colloid is formed on the light emitting surface of the light emitting diode and the surface of the circuit board between adjacent positions of the light emitting diodes. The coating method of the phosphor powder colloid is a surface light source capable of forming an extensible side light of the light emitting diode, thereby improving the luminous efficiency of the light emitting diode, and the light emitting module can also generate the whole surface. The effect of uniform illumination.

Please refer to the first figure and the second figure at the same time, which is a top view and a side view of the phosphor powder colloid coating of the light-emitting module according to the preferred embodiment of the present invention. As shown in the figure, the light-emitting module of the present invention comprises a circuit board 1, a light-emitting diode 2, a rubber ring 3 and a phosphor powder colloid 4, wherein the circuit board 1 is arranged on one side surface as a circuit layout. And an electrode contact is arranged on the circuit layout, the electrode contact is a positive contact 11 and a negative contact 12 including at least a pair of configurations, and the circuit board 1 can be a single-sided or double-sided circuit The light-emitting diode 2 is a rectangular crystal having six faces, and the crystal is a flip-chip type, and the light-emitting diode 2 has a P-electrode and an N-electrode on one surface. The light-emitting diode 2 is electrically connected to the pair of circuit board 1 through the flip-chip method through the P-pole electrode and the N-pole electrode; when the light-emitting diode 2 is electrically connected to the circuit board 1 , the five visible light-emitting surfaces are formed; the rubber ring 3 is made of an opaque material, which is located on the surface of the circuit board 1 and surrounds the periphery of the light-emitting diode 2 on the surface of the circuit board 1 The surface of the circuit board 1 is formed by a fixed range surrounded by the rubber ring 3; the phosphor powder colloid 4 is applied to the circuit by a loop dispensing method. 1 in a fixed range surrounded by the upper rubber ring 3, and the phosphor powder colloid 4 can cover the surface of the printed circuit board 2 in a fixed range and the surface of the circuit board between the adjacent positions of the light-emitting diodes 2, the fluorescent light The powder colloid 4 is prepared by uniformly mixing the fluorescent powder and the rubber material in a certain proportion, and the rubber material may be an adhesive or colloidal material having a light transmissive or semi-transparent effect such as epoxy resin or silicone rubber; the phosphor powder colloid 4 In order to be applied to a fixed range enclosed by the apron 3, the coating method is numerous. The present invention utilizes Circle Dispensing as a description of the preferred embodiment.

Please refer to the third figure, which is a diagram of the dispensing embodiment of the present invention. As shown in the figure, when the loop dispensing method is used, the glue dispenser 5 is first used, and the dispenser 5 has a glue injection head 51, and the phosphor powder 4 is injected into the circuit through the injection head 51. The five visible light-emitting surfaces of the light-emitting diode 2 in the range of the upper ring of the plate 1 and the surface of the circuit board 1 between the light-emitting diodes 2. The width of the loop is set according to the desired circular shape of the circle, so that it forms a colloid with a circular arc, and the surface thereof forms a circular surface with a mirror effect due to contact with air. When the colloid is applied to the LED 2, the light can be diverged according to the arc angle; when the first colloidal loop is completed, the injection head 51 returns to the injection start point for the second injection. At this time, the surface of the first gelatinized gel has been formed. After the second injection, the two colloids are horizontally dispersed due to the nature of the glue. Then, the vacuum defoaming and baking process can be performed again, and the phosphor powder 4 can be effectively formed on the surface of the circuit board 1 between the five visible light-emitting surfaces of the light-emitting diode 2 and the light-emitting diodes 2.

The baking process described above is such that the phosphor powder colloid 4 covering the respective light-emitting surfaces of the light-emitting diode 2 can be quickly melted and uniformly adhered to the upper apron 3 of the circuit board 1 by heating in a baking oven. Each visible light-emitting surface of the light-emitting diode 2 and the surface of the circuit board 1 between the light-emitting diodes 2.

Please refer to the first figure, which is a top view of the flip-chip light-emitting diode surface light source optical engine of the present invention, which can be clearly seen from the figure, according to the principle of light refraction - Snell's law (Snell, s Law), when When the phosphor powder 4 is formed on each visible light-emitting surface of the light-emitting diode 2 on the circuit board 1, the lateral light of each of the light-emitting diodes 2 excites the fluorescent powder to form white light, and the two light-emitting diodes are The distance between the sides of the light-emitting diodes 2 is small, and the surface of the circuit board 1 between the light-emitting diodes 2 is also coated with a phosphor powder colloid 4, each of which has a light-emitting diode. The lateral light source of the body 2 will generate extensible light due to the medium of the same refractive index (that is, the phosphor powder colloid 4), and an extensible surface light source will be generated between the light-emitting diodes 2, and the circuit board Each of the LEDs 2 on the 1 will generate a light source outside the circuit board 1 instead of forming a point light source, which can solve the problem that the lateral light of the conventional LED 2 is easily formed by entering the medium of different refractive index. The problem of reflection or total reflection, and the occurrence of light loss, so as to enhance the hair Light efficiency.

The loop dispensing method of the above-mentioned flip-chip light-emitting diode surface light source optical engine of the present invention has at least the following advantages when used:

1. The present invention is a circuit board having a circuit board 1 having a circuit connection for electrically connecting the LEDs 2, and electrically connecting the LEDs 2 to the circuit board 1 and using the apron 3 Formed on the outer side of the light-emitting die on the surface of the circuit board, and then the phosphor powder colloid 4 is formed on the visible light-emitting surface of the light-emitting diode 2 by the loop dispensing method, and the surface of the circuit board 1 between the light-emitting diodes 2 , that is, a one-side light source optical engine is formed; the phosphor powder colloid is coated in such a manner that the lateral light of each of the light-emitting diodes 2 is overlapped to form an extensible surface light source, thereby achieving the improved light-emitting diode 2 The luminous efficiency and the illumination module can also produce the effect of full-surface illumination.

2. The present invention is a method for directly electrically connecting the circuit board 1 by using the light-emitting diode 2, and does not need to perform a procedure of filling a transparent apron such as an epoxy resin after the phosphor powder coating and baking process. After the phosphor powder colloid 4 coating and baking process, the light-emitting module can be completed, thereby reducing the thermal accumulation of the light-emitting diode 2 caused by the double-layer epoxy resin, thereby effectively improving the service life of the light-emitting module, and It also does not reduce the luminous efficiency of the luminescent crystal grains due to the yellowing caused by the epoxy resin. On the other hand, it can also effectively simplify the manufacturing process and material cost.

In summary, the package method of the flip-chip light-emitting diode surface light source optical engine of the present invention can improve the luminous efficiency of the light-emitting diode, and the light-emitting module can also produce the whole-surface light-emitting effect. For a practical design, in line with the application requirements of the invention patent, 提出 apply in accordance with the law, and hope that the trial committee will grant the case as soon as possible to protect the inventor's hard work in research and development.

1. . . Circuit board

11. . . Positive contact

12. . . Negative contact

2. . . Light-emitting diode

3. . . Apron

4. . . Fluorescent powder colloid

5. . . Dispenser

51. . . Injection head

The first figure is a top view of a phosphor powder colloid coating of a preferred embodiment of the present invention.

The second figure is a side view of a phosphor powder colloid coating of a preferred embodiment of the present invention.

The third figure is a diagram of an embodiment of the dispensing of the present invention.

11. . . Positive contact

12. . . Negative contact

2. . . Light-emitting diode

3. . . Apron

Claims (6)

A package method for a flip-chip light-emitting diode surface light source optical engine, comprising: setting a circuit layout on one side surface of the circuit board, and providing electrode contacts on the circuit layout, the electrode contacts including at least a pair The positive pole contact and the negative pole contact are arranged; the light emitting diodes are connected to the positive and negative contact points of the pair of circuit boards to form five visible light emitting surfaces; the light emitting around the surface of the circuit board The periphery of the diode is formed to form a fixed range surrounded by the apron; the phosphor powder is applied to a fixed range surrounded by the apron on the circuit board, so that the phosphor powder colloid can cover the light within the fixed range. The polar body and the surface of the circuit board between the adjacent positions of the light-emitting diodes form an extensible surface light source after the lateral light of each of the light-emitting diodes is overlapped, thereby improving the luminous efficiency of the light-emitting diode. And the light-emitting module can also produce the effect of full-surface illumination. The method for packaging a flip-chip light-emitting diode surface light source optical engine according to claim 1, wherein the phosphor powder adhesive system is injected into the circuit board through the glue injection head by a dispenser having a glue injection head The five visible light-emitting surfaces of the light-emitting diode in the range of the upper apron and the surface of the circuit board between the light-emitting diodes. The method for packaging a flip-chip light-emitting diode surface light source optical engine according to claim 1, wherein the circuit board can be a single-sided or double-sided circuit. The method for packaging a flip-chip light-emitting diode surface light source optical engine according to claim 1, wherein the light-emitting diode system is a rectangular shape having six sides and is a flip-chip crystal. The method for packaging a flip-chip light-emitting diode surface light source optical engine according to claim 1, wherein the phosphor powder system is prepared by uniformly mixing the phosphor powder and the rubber material in a certain ratio. The method for packaging a flip-chip light-emitting diode surface light source optical engine according to claim 5, wherein the adhesive material is an adhesive colloid having a light transmissive or semi-transparent effect such as epoxy resin or silicone rubber. material.