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TW201242073A - Flexible light emitting semiconductor device having thin dielectric substrate - Google Patents

Flexible light emitting semiconductor device having thin dielectric substrate Download PDF

Info

Publication number
TW201242073A
TW201242073A TW101105366A TW101105366A TW201242073A TW 201242073 A TW201242073 A TW 201242073A TW 101105366 A TW101105366 A TW 101105366A TW 101105366 A TW101105366 A TW 101105366A TW 201242073 A TW201242073 A TW 201242073A
Authority
TW
Taiwan
Prior art keywords
layer
conductive
thickness
dielectric
dielectric layer
Prior art date
Application number
TW101105366A
Other languages
English (en)
Chinese (zh)
Inventor
Ravi Palaniswamy
Arokiaraj Jesudoss
Andrew John Ouderkirk
Justine Anne Mooney
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201242073A publication Critical patent/TW201242073A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/884—
    • H10W90/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
TW101105366A 2011-02-18 2012-02-17 Flexible light emitting semiconductor device having thin dielectric substrate TW201242073A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201161444337P 2011-02-18 2011-02-18

Publications (1)

Publication Number Publication Date
TW201242073A true TW201242073A (en) 2012-10-16

Family

ID=45768296

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101105366A TW201242073A (en) 2011-02-18 2012-02-17 Flexible light emitting semiconductor device having thin dielectric substrate

Country Status (2)

Country Link
TW (1) TW201242073A (fr)
WO (1) WO2012112310A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9674938B2 (en) 2010-11-03 2017-06-06 3M Innovative Properties Company Flexible LED device for thermal management
KR20130143061A (ko) 2010-11-03 2013-12-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 와이어 본드 프리 다이를 사용한 가요성 led 디바이스
KR20130132828A (ko) 2010-11-03 2013-12-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 중합체 에칭제 및 그의 사용 방법
WO2012112873A2 (fr) 2011-02-18 2012-08-23 3M Innovative Properties Company Dispositif électroluminescent souple à semi-conducteurs
WO2013025402A2 (fr) 2011-08-17 2013-02-21 3M Innovative Properties Company Dispositif semi-conducteur électroluminescent flexible en deux parties
WO2013078180A1 (fr) 2011-11-23 2013-05-30 3M Innovative Properties Company Dispositif à semi-conducteur électroluminescent souple présentant une structure tridimensionnelle
US20150294793A1 (en) * 2012-11-21 2015-10-15 3M Innovative Properties Company Multilayer film including first and second dielectric layers
CN104937685A (zh) * 2012-11-21 2015-09-23 3M创新有限公司 包括第一介电层和第二介电层的多层膜
US8882310B2 (en) * 2012-12-10 2014-11-11 Microsoft Corporation Laser die light source module with low inductance
EP2991460B1 (fr) 2014-08-29 2018-11-21 Nokia Technologies OY Appareil et procédés associés pour appareils électroniques déformables

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
US7273987B2 (en) * 2002-03-21 2007-09-25 General Electric Company Flexible interconnect structures for electrical devices and light sources incorporating the same
US20070120089A1 (en) 2005-11-28 2007-05-31 3M Innovative Properties Company Polymer etchant and method of using same
US7806560B2 (en) * 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
KR100956888B1 (ko) * 2008-01-24 2010-05-11 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법

Also Published As

Publication number Publication date
WO2012112310A1 (fr) 2012-08-23

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