201249269 六、發明說明： 【發明所屬之技術領域】 本發明係關於配線板，其具備用以連接於被連接基板 之被連接端子列之連接端子列。 【先前技術】 以往’在將基板之連接端子列連接於其他基板之連接 端子列時，係透過連接器連接兩方之連接端子列。然而， 伴隨電子機器之小型化’縮小兩方之連接端子列之連接部 分之空間之要求變高。因此，已提出了一種如日本特開平 10—41599號公報所示，不使用連接器連接兩方之連接端子 列之方法。 根據日本特開平1 〇 一 41 599號公報之技術，於連接於 配線板之連接端子列之被連接基板之被連接端子列周圍形 成絕緣層’於該絕緣層形成對應被連接端子列之槽。藉由 將配線板之連接端子列嵌入於此槽，定出配線板之連接端 子列與被連接基板之被連接端子列之位置。 【發明内容】 曰本特開平10— 41599號公報之技術能適用於將從基 板端面突出之連接端子列連接於被連接基板之被連接端子 列之情形。然而’該技術無法適用於連接設於基板表面之 連接端子列彼此之情形。 又’在連接設於基板表面之連接端子列彼此之情形， 201249269 由於使連接端子列彼此對向’作業者僅能目視確認連接端 子列之背面。是以，由於作業者無法目視確認連接端子列， 因此難以定出連接端子列彼此之位置。 本發明有鑒於上述實情’其目的在於提供能容易地定 出連接端子列對被連接基板之被連接端子列之位置之配線 板。 以下，記載用以達成上述目的之手段及其作用效果。 (1)根據本發明之一實施態樣，係一種配線板，具備配 線板基板、以及形成於前述配線板基板之一面上且構成為 連接於被連接基板之被連接端子列之連接端子列，其特徵 在於：前述配線板’進一步具備用以對前述被連接基板之 被連接端子列定出前述配線板之連接端子列之位置之標 記’則述標記設於以前述連接端子列之特定部分為基準設 定之前述配線板上之特定位置，前述配線板構成為能目視 確認該標記與前述被連接基板之一部分。 此情形下’由於能目視確認標記與被連接基板之特定 位置，因此能使配線板之標記與被連接基板之特定位置一 致。是以，在被連接基板之被連接端子列與特定位置之位 置關係’與配線板之連接端子列與標記之位置關係相同 時，藉由使配線板之標記與被連接基板之特定位置一致， 即能將連接端子列對被連接端子列定位成既定之配置。 又，由於能目視確認配線板之標記與被連接基板之特定位 置，因此即使在無法目視確認配線板之連接端子列及被連 接基板之被連接端子列時，亦能將連接端子列對被連接端 201249269 子列定位。 (2)根據本發明之另一 耳苑J樣，其亦可為：前述 端子列具備複數個連 i ^連接 鳊子，則述標記係前述複數個連接 端子中之至少一個遠桩栌工+ ‘ 部分。 運接^子或前述至少—個連接端子之- 此情形下，由於將連接端 * 邵分作為定位用標 6己，因此無需藉由印刷或雷射 和你0匕寺來將新的標記形成於 配線板。因此，由於能省略形成標記之步驟，目此能使配 線板之製造步驟簡略。又，由於無需確保形成標記之空間， 因此能縮小配線板。 (3)根據本發明之另一實施態樣，其亦可為：前述配線 板”備具有延伸至w述連接端子列之複數配線之本體部、 、及，、有⑴述連接端子列之連接部；前述配線板基板具備 夾著前述配線且構成前述本體部之2片第丨子基板、以及 支撐前述連接端子列之背面且構成前述連接部之第2子基 板，前述第2子基板構成為能透過該第2子基板透視前述 被連接基板。 此情形下，由於第2子基板為透明，因此能作為用以 定位連接端子之標記使用。由於能以發揮標記功能之連接 端子為基準目視確認被連接基板之被連接端子，因此藉由 使連接端子與被連接基板之被連接端子一致，即能將配線 板之連接端子列對被連接基板之被連接端子列定位。 (4)根據本發明之另一實施態樣’其亦可為：前述配線 板基板構成為能透過該配線板基板透視前述被連接基板。 201249269 此情形下，由於配線板之基板為透明，因此能以標記 為基準來參照且能目視嫁認被連接基板之特定位置。藉 此，能使配線板之該標記與被連接基板之特定位置一致， 將配線板之連接端子列對被連接基板之被連接端子列定 位。 (5) 根據本發明之另一實施態樣’其亦可為：前述標記 係貝通月I』述配線板基板之貫通孔。 此情形下，由於標記為貫通孔，因此能透過此貫通孔 目視確S忍被連接基板之特定位置。藉此，能使配線板之該 標S己與被連接基板之特定位置一致’將配線板之連接端子 列對被連接基板之被連接端子列定位。 (6) 根據本發明之另一實施態樣，其亦可為：前述標記 係設於前述配線板基板之端部之缺口。 此情形下’由於標記為缺口，因此能透過此缺口目視 確認被連接基板之特定位置。藉此’能使配線板之該標記 與被連接基板之特定位置一致，將配線板之連接端子列對 被連接基板之被連接端子列定位。 (7) 根據本發明之另一實施態樣，其亦可為：前述標記 構成為定出該標記與前述被連接基板之特定位置之位置差 之容許範圍。 此情形下’能目視確認配線板之標記與被連接基板之 位置差是否在容許範圍内。藉此，能容易地判定配線板之 連接端子列與被連接基板之被連接端子列是否為既定之位 置關係。 201249269 此外’當將連接端子作為標記時，雖該連接端子與被 連接基板之被連接端子最好為相同程度之大小，但亦可係 -中方略大於另-方。在連接端子較被連接端子小之情 形下，能在將該連接端子配置於被連接基板之被連接端子 亡時目視確認對齊範圍。相反地，在該連接端子較被連接 鈿子大之凊形下，在將該連接端子配置於被連接基板之被 連接端子上日夺，只I被連#基板之被連接料全部被隱 藏，即可判定配線板與被連接基板之位置差在容許範圍内。 (8) 根據本發明之另一實施態樣，其亦可為：前述連接 端子列具備：複數個連接端子；導電連接層，配置於前述 各連接端子之上面且由包含導電粒子之導電性樹脂形成以 及絕緣層，配置於前述連接端子中之至少一對之間且使連 接端子彼此絕緣；前述絕緣層由絕緣接著劑形成。 此情形下’在連接配線板之連接端子列與被連接基板 之被連接端子列時，絕緣層係與被連接基板之被連接端子 列接著。亦即’配線板之連接端子列與被連接基板之被連 接端子列透過導電連接層而電氣連接，且配線板與被連接 基板藉由絕緣接著劑而連接。因此，與不藉由絕緣接著劑 連接配線板與被連接基板者相較，能增大配線板與被連接 基板之連接部分之強度。 (9) 根據本發明之另一實施態樣，其亦可為：前述配線 板具備：設於具有前述連接端子列之連接部且補強該連接 部之補強板；於前述補強板設有前述標記。 此情形下，藉由補強板補強連接端子列。又，由於於 201249269 此補強板形成有標t，因此能提高標記對連接端子列之基 準位置之位置精度。 ⑽根據本發明之另一實施態樣，其亦可為：前述補強 板於對應前述連接端子狀位置具備加熱用孔。 此情形下，由於補強板具備加熱用孔，因此在加軌連 接端子列時不經由補強板即能加熱設有連接端子列之部 /7因此肖-又有連接端子列之部分被補強板覆蓋者相較， 能將連接端子列更快速地加熱至既定溫度。 (二1)根據本發明之另一實施態樣，其亦可為：前述標記 於以前述連接端子列之特定部分為基準言史定之不同位置設 有2個。 此情形T，能藉由I 2㈣標記一致於分別對應之被連 接基板之特定位置，使配線板之連接端子列之端子排列方 向與被連接基板之被連接端子列之端子排列方向一致來將 兩者定位。 【實施方式】 參照圖1〜圖5說明將本發明之配線板具體化之一實施 形態》 如圖1及圖2所示’配線板1包含本體部1〇與設於本 體部之前端部之連接部20。連接部2〇與被連接基板4〇 之被連接部5 0連接。 本體部10具備藉由導電材料形成之配線圖案12、夾著 配線圖案12之配線板基板11、塗布於配線板基板n及配 201249269 線圖案12間而接著配線板基板11及配線圖案12之接著劑 層1 3。配線圖案12顯示排列有複數支導體者。 配線板基板11為透明。具體而言，配線板基板丨丨透明 至能透視被連接基板40之程度。又，形成接著劑層13之接 著劑在硬化時為透明。具體而言，接著劑在硬化時為透明至 能透視被連接基板40之程度。亦即，由於具備透明之配線板 基板11及透明之接著劑層13，因此配線板丨為透明，進而 配線板1具有在從一面側觀看時能透視配置於另一面側者之 構造。 作為配線板基才反U，例如可舉出厚纟12”之聚對苯 一甲3文乙一酯之絕緣性樹脂片。接著劑層13係將聚酯系接 著Μ以3 0 β m之厚度塗布於配線板基板i 1上而形成。作為 配線圖案12可舉出例如厚度35 之銅落線。 連接邛20包含基礎部2〇A、配置於基礎部2〇八上面之 連接端子22、形成於各連接端子22上面之導電連接層 配置於相鄰之連接端子22之間之絕，緣層24、以及補強該連 接部20之補強板26。基礎部2〇a包含藉由延伸本體部 m線板基板11而形成之部分與藉由延伸本體部Π)之接 著劑層1 3而形成之八 > & 作為配線方向d。：後，連接端子22之長度方向 參。與配線方向YA正交且沿著配線 之方向作為端子排列方向XA來參照。 連接端子22藉由延伸 乂 22排列成彼此平行且等:：：圖案12而… I，構成連接端子列21。相鄰之 子22之令心線間隔DA為―或…. 201249269 鄰之連接端子22側端間之距離 為 0.2mm 或 0.15 〜0.3mm。又 於配線板基板1 1上之接著劑層 埋入於接著劑層1 3。 (以下稱為「端子間距離」) ’各連接端子22配置於積層 13上。連接端子22之下部 導電連接層23形成於各連接端子22之上面。導電連 接層23例如由熱可塑性之銀糊以15 ”之厚度形成。作為 銀糊’最好使用包含平均粒徑〇.5〜一之鱗片狀銀粉末 與金屬塗布有有機物之平均粒徑―下之球狀銀粉末之 銀糊。藉由使銀糊含有平均粒徑2〇nm以下之球狀銀粉末， 能使導電連接層23之表面成為平滑。藉由平滑之表面，能 增大導電連接層23之表面部分與被連接基板4()之被連接 食而子52之接觸面積。 絕緣層24配置於接著劑層13上。絕緣層以之上面高 度係以配線板基板丨丨之上面為基準面25設於較導電連接 層23上面之位置高之位置。絕緣層24與導電連接層23之 段差HA較被連接基板4〇之被連接端子52之高度大。又， 彼此相鄰之絕緣層24彼此之端面距離WA與被連接基板4〇 之被連接端子52之寬度方向長度相同或較相同長度大。 作為形成絕緣層24之絕緣接著劑，可舉出例如聚酯系 熱炼接著劑》絕緣層24之熔融溫度例如最好係l2(rc〜1 5〇 C。當絕緣層24之熔融溫度較12〇<t低時，有配線板i與 被連接基板40之接著強度降低之虞。當絕緣層24之熔融 溫度較1 50°C大時’有配線板基板丨丨變形或配線板基板i j 與接著劑層13之接著力降低之虞。 201249269 接端=?6配置於連接部2。之背面、亦即與形成有連 板26配詈於面對向之面。補強板％為透明，進而將補強 26，二：連接部2 〇時係能透視連接部2。。作為補強板 ^例如聚對苯二甲酸乙二自旨基板、聚醯亞胺基板 ，26具有較絕緣接㈣之㈣溫度高之耐熱 溫度。 ，亦可如圖12所示’配線板！不具備本體部而僅 ”備連接:P 2〇。於配線板基板"上以既定間隔配置配線圖 '、 冑由接著劑I 13加以接著。此情形下，配線圓案 1思2僅由連接端子22構成。與圖1所示之形態同樣地，絕緣 S 24配置於接著劑層13上，導電連接層23形成於連接端 子2上面。亦可於配線板基板11下面（與配置配線圖案12 之面相反之面)上配置議反26，或亦可不配置。此情形 下’配線板1如圖12所示，能連接於發揮被連接端子作用 之複數導線452突出之扁平電纜44〇。 又，如圖2所示，於與連接端子列2丨對應之補強板％ 之位置形成有加熱用孔3〇。加熱用孔30為大致四角形。加 •、用孔3〇之上緣3 1及下緣32沿著與連接端子22之長度 方向正父之方向延伸。加熱用孔30之左緣33配置於較連 J 2 1左側，沿配線方向γ a延伸。加熱用孔3 〇之右 彖3 4配置於較連接端子列2 1右側，沿配線方向γ A延伸。 於連接部20之右端與左端設有第1標記27與第2 ^ °己28。第1標記27及第2標記28係在將配線板i之連 接而子列2 1連接於被連接基板4 〇之被連接端子列5 1時作 201249269 為用以將連接端子22與被連接端子列5丨之位置整合之基 準使用。第1標記27及第2標記28係藉由雷射標記器^ 喷墨印字、沖壓印字、沖壓標記成形等來設置。 以下，圖3中配置於最右方之連接端子22之右側端緣 與配線板1之前端緣之交點作為用以規定第丨標記27位置 之原點（基準位置）KA來參照。又，通過此原點ka且沿端 子排列方向ΧΑ延伸之軸線作為X軸來參照，通過原點κα 且沿配線方向ΥΑ延伸之軸線作為γ軸來參照。配置於最 右方之連接端子22作為基準端子22Κ來參照。 第1標記27，設於圖2中較連接端子列2丨中配置於最 右方之連接端子22更右方之部分、且具有補強板26之部 刀第1 3己27為十字形。第1標記27之中心點配置於 座標（XI，Υ1)。 第2標記28，設於圖2中較連接端子列21中配置於最 左方之連接端子22更左方之部分、且具有補強板26之部 分。第2標記28為十字形。第2標記28之中心點配置於 座標（Χ2, Υ1)。 參照圖3說明連接配線板1之被連接基板4 〇。 被連接基板40包含由玻璃環氧樹脂製造之底板4 1、配 置於底板41之一面之被連接部50。 被連接部5 0具有由複數個被連接端子5 2構成之被連 接端子列5 1。相鄰之被連接端子52之間隔與相鄰之連接端 子22之間隔相同。以下，被連接端子52之長度方向作為 配線方向ΥΒ來參照。又，與配線方向υβ正交且沿著底板 3 12 201249269 4 1之面之方向作為端子排列方向XB來參照β 』；連接20之右端與左端設有第3標記與第 ::連二3標記5 3及第4標記5 4係在連接被連接基板:〇 ;4子列51與配線板！之連接端子列21時作為用 以使被連接端子列51與連接端子22之位置整合之基準使 用0 圖3中，連接於基準端子22K之被連接端子（以下稱為 「基準被連接端子52Κ」）右上之頂點作為用以規定第3標 記53之位置之原點（基準位置）ΚΒ來參照。又，通過此原點 ΚΒ且沿端子排列方向χΒ延伸之轴線作為X轴來參照，通 過原點ΚΒ丨沿配線方肖ΥΒ延伸之轴線作$ γ車由來參照。 第3標記53 ’設於圖3中較被連接端子列5丨中配置於 最右方之被連接端子52更右方。第3標記53為十字形。 第3標記53之中心點配置於座標（χι，γι)。 第4標記54 ’設於圖3中較被連接端子列51中配置於 最左方之被連接端子52更左方。第4標記54為十字形。 第4標記54之中心點配置於座標（Χ2, γι)。 參照圖3及圖4說明配線板1與被連接基板4〇之定位 方法。 首先，使具有被連接端子52之被連接基板40之面朝 向上方，被連接基板40固定於基台61。被連接基板40係 以在配線板1與被連接基板40連接後亦能容易地從基台61 卸除之狀態固定。例如藉由黏著帶暫時固定基台6 1與被連 接基板40。或者亦能將鐵等強磁性體作為基台61使用磁石 13 201249269 將被連接基板40固定於基台61。 其次，使具有連接端子22之配線板！之面朝向下方， 定出配線板1對被連接基板4 0之位置。具體而古，首先最 合配線板1之連接部20與被連接基板4〇之被連接部5〇 = 其次，使第1標記2 7之中心與第3標記5 3之中心—致， 且使第2標記28之中心與第4標記54之中心一致定出 配線板1對被連接基板40之位置。定位作業最好係使用顯 微鏡以第1標記2 7之中心與第3標記5 3之中心之位置差、 以及第2標記28之中心與第4標記54之中心之位置差成 為既定範圍（以下稱為「容許範圍」）内之方式進行。例如， 在私子間距離DB為〇.2mm時’位置差之容許範圍設定為+ 0.05mm 〇 第1標記27及第2標記28設於以基準端子22κ之特 定位置為原點ΚΑ之既定座標之位置。第3標記53及第4 標5己54設於以基準被連接端子52Κ之特定位置為原點ΚΒ 之既定座標之位置。又，第1標記27之座標與第3標記53 之座標相同，第2標記28之座標與第4標記54之座標相 同。藉由此種關係，配線板1之連接端子列2丨與被連接基 板40之被連接端子列5 1彼此精確地被定位。 在配線板1與被連接基板40已叠合時，連接端子22 之導電連接層23與對應該連接端子22之被連接端子列5 i 彼此接觸，且絕緣層24嵌入被連接端子52之間。 參照圖5說明配線板1與被連接基板4〇之接著方法。 在定出配線板1與被連接基板40之位置後，將加熱機201249269 VI. [Technical Field] The present invention relates to a wiring board including a connection terminal row for connecting to a connected terminal row of a substrate to be connected. [Prior Art] Conventionally, when the connection terminal row of the substrate is connected to the connection terminal row of another substrate, the connection terminal arrays of both sides are connected through the connector. However, with the miniaturization of electronic equipment, the demand for reducing the space of the connection portions of the connection terminals of the two sides becomes high. For this reason, a method of connecting the connection terminal columns of both sides without using a connector has been proposed as disclosed in Japanese Laid-Open Patent Publication No. Hei 10-41599. According to the technique of Japanese Laid-Open Patent Publication No. Hei No. 41-599, an insulating layer is formed around the terminal to be connected row of the substrate to be connected to the connection terminal row of the wiring board, and a groove corresponding to the terminal row to be connected is formed in the insulating layer. The position of the connection terminal row of the wiring board and the connected terminal row of the connected substrate is determined by embedding the connection terminal row of the wiring board in this slot. The technique of Japanese Laid-Open Patent Publication No. Hei 10-41599 can be applied to a case where a connection terminal row protruding from an end surface of a substrate is connected to a terminal block to be connected of a substrate to be connected. However, this technique cannot be applied to the case where the connection terminal columns provided on the surface of the substrate are connected to each other. Further, in the case where the connection terminal arrays provided on the surface of the substrate are connected to each other, 201249269, the operator can only visually confirm the back side of the connection terminal row by causing the connection terminal rows to face each other. Therefore, since the operator cannot visually confirm the connection terminal array, it is difficult to determine the positions of the connection terminal columns. The present invention has been made in view of the above circumstances. It is an object of the invention to provide a wiring board which can easily define a position at which a terminal row is connected to a connected terminal row of a substrate to be connected. Hereinafter, means for achieving the above object and effects thereof will be described. (1) A wiring board comprising: a wiring board substrate; and a connection terminal row formed on one surface of the wiring board substrate and connected to a connected terminal row of the connected substrate, according to an embodiment of the present invention, The wiring board ′ further includes a mark “the position at which the connection terminal row of the wiring board is arranged for the connected terminal of the connected substrate. The reference mark is provided in a specific portion of the connection terminal row. The wiring board is configured to visually confirm the mark and one of the connected substrates at a specific position on the wiring board set by the reference. In this case, since the specific position of the mark and the substrate to be connected can be visually confirmed, the mark of the wiring board can be made to coincide with the specific position of the substrate to be connected. When the positional relationship between the connected terminal row of the connected substrate and the specific position is the same as the positional relationship between the connection terminal row of the wiring board and the mark, the mark of the wiring board is aligned with the specific position of the connected substrate. That is, the connection terminal array can be positioned in a predetermined configuration for the connected terminal column. Further, since the mark of the wiring board and the specific position of the substrate to be connected can be visually confirmed, the connection terminal can be connected in series even when the connection terminal row of the wiring board and the connected terminal row of the connection substrate cannot be visually confirmed. End 201249269 Subcolumn positioning. (2) According to another embodiment of the present invention, the terminal column may have a plurality of connection terminals, and the mark is at least one of the plurality of connection terminals. ' section. Transport the ^ or the aforementioned at least one of the connection terminals - in this case, since the connection end * is used as the positioning target 6, there is no need to form new marks by printing or laser and your temple. On the wiring board. Therefore, since the step of forming the mark can be omitted, the manufacturing steps of the wiring board can be simplified. Moreover, since it is not necessary to ensure the space in which the mark is formed, the wiring board can be reduced. (3) According to another aspect of the present invention, the wiring board may have a main body portion extending to a plurality of wirings of the connection terminal row, and (1) a connection terminal row connection The wiring board substrate includes two second sub-substrates that form the main body portion with the wiring interposed therebetween, and a second sub-substrate that supports the connection portion on the back surface of the connection terminal row, and the second sub-substrate is configured as The second sub-substrate can be seen through the second sub-substrate. In this case, since the second sub-substrate is transparent, it can be used as a mark for positioning the connection terminal. It can be visually confirmed based on the connection terminal that functions as a mark. Since the connected terminal is connected to the terminal, the connection terminal of the wiring board can be positioned to the connected terminal row of the connected substrate by matching the connection terminal to the connected terminal of the connected substrate. (4) According to the present invention In another embodiment, the wiring board substrate may be configured such that the connected board can be seen through the wiring board substrate. 201249269 In this case, Since the substrate of the wiring board is transparent, the specific position of the connected substrate can be visually referred to with reference to the mark. Thereby, the mark of the wiring board can be aligned with the specific position of the connected substrate, and the wiring board can be aligned. The connection terminal array is positioned to the connected terminal row of the connected substrate. (5) According to another embodiment of the present invention, the reference mark may be a through hole of the wiring board substrate. In this case, since the mark is a through hole, it is possible to visually confirm the specific position of the substrate to be connected through the through hole. Thereby, the target of the wiring board can be aligned with the specific position of the connected substrate. The connection terminal array is positioned to the connected terminal row of the connected substrate. (6) According to another aspect of the present invention, the mark may be provided at a notch of an end portion of the wiring board substrate. Since the mark is a notch, it is possible to visually confirm the specific position of the substrate to be connected through the gap. This enables the mark of the wiring board to coincide with the specific position of the substrate to be connected. The connecting terminal row of the board is positioned to the connected terminal row of the connected substrate. (7) According to another embodiment of the present invention, the marking may be configured to define the marking and the specific position of the connected substrate. In this case, it is possible to visually check whether the position difference between the mark of the wiring board and the substrate to be connected is within the allowable range. Therefore, it is possible to easily determine the connection terminal row of the wiring board and the connected substrate. Whether the connection terminal column has a predetermined positional relationship. 201249269 In addition, when the connection terminal is used as a mark, although the connection terminal and the connected terminal of the connected substrate are preferably the same size, the system may be slightly larger than the other. - When the connection terminal is smaller than the connection terminal, the alignment range can be visually confirmed when the connection terminal is placed on the connected terminal of the connected substrate. Conversely, the connection terminal is more connected to the connection terminal. In the case of the connection, the connection terminal is placed on the connected terminal of the connected substrate, and only the connected materials of the I substrate are hidden. It can be determined that the position difference between the wiring board and the connected substrate is within an allowable range. (8) According to another aspect of the present invention, the connection terminal array may include: a plurality of connection terminals; and a conductive connection layer disposed on the connection terminals and made of a conductive resin containing conductive particles The formation and the insulating layer are disposed between at least one of the pair of connection terminals and insulated from each other; the insulating layer is formed of an insulating adhesive. In this case, when the connection terminal row of the wiring board and the connected terminal row of the substrate to be connected are connected, the insulating layer is connected to the connected terminal row of the connected substrate. That is, the connection terminal row of the wiring board and the connected terminal row of the connected substrate are electrically connected through the conductive connection layer, and the wiring board and the connected substrate are connected by an insulating adhesive. Therefore, the strength of the connection portion between the wiring board and the substrate to be connected can be increased as compared with the case where the wiring board is not connected to the substrate to be connected by the insulating adhesive. According to another aspect of the present invention, the wiring board may include: a reinforcing plate provided on a connection portion having the connection terminal row and reinforcing the connection portion; and the reinforcing plate provided with the mark . In this case, the terminal block is reinforced by the reinforcing plate. Moreover, since the reinforcing plate is formed with the mark t at 201249269, the positional accuracy of the mark to the reference position of the connection terminal row can be improved. (10) According to another aspect of the present invention, the reinforcing plate may be provided with a heating hole at a position corresponding to the connection terminal. In this case, since the reinforcing plate is provided with a heating hole, when the terminal block is connected, the portion where the connection terminal row is provided can be heated without passing through the reinforcing plate, and thus the portion having the connection terminal row is covered by the reinforcing plate. In comparison, the connection terminal array can be heated to a predetermined temperature more quickly. (2) According to another embodiment of the present invention, the reference numeral may be provided at two different positions defined by a specific portion of the connection terminal array. In this case, the I 2 (four) mark can be aligned with the specific position of the corresponding connected substrate, and the terminal arrangement direction of the connection terminal row of the wiring board can be aligned with the terminal arrangement direction of the connected terminal row of the connected substrate. Positioning. [Embodiment] An embodiment in which a wiring board according to the present invention is embodied will be described with reference to Figs. 1 to 5. As shown in Figs. 1 and 2, the wiring board 1 includes a main body portion 1 and a front end portion provided on the main body portion. Connection portion 20. The connecting portion 2 is connected to the connected portion 50 of the connected substrate 4A. The main body portion 10 includes a wiring pattern 12 formed of a conductive material, a wiring board substrate 11 sandwiching the wiring pattern 12, and is applied between the wiring board substrate n and the 201249269 line pattern 12, and then the wiring board substrate 11 and the wiring pattern 12 are followed. Agent layer 13. The wiring pattern 12 shows those in which a plurality of conductors are arranged. The wiring board substrate 11 is transparent. Specifically, the wiring board substrate 丨丨 is transparent to the extent that the substrate 40 can be seen through. Further, the adhesive forming the adhesive layer 13 is transparent when it is cured. Specifically, the adhesive is transparent to the extent that it can be seen through the substrate 40 when it is cured. In other words, since the wiring board 11 and the transparent adhesive layer 13 are provided, the wiring board 丨 is transparent, and the wiring board 1 has a structure in which it can be seen through the other side when viewed from one side. As the wiring board base, the U is, for example, an insulating resin sheet of poly(p-xylylene) having a thickness of 12". The adhesive layer 13 is made of a polyester system and has a thickness of 30 μm. It is formed by being applied to the wiring board substrate i 1. The wiring pattern 12 is, for example, a copper drop having a thickness of 35. The connection port 20 includes a base portion 2A and a connection terminal 22 disposed on the top portion of the base portion 2, and is formed. The conductive connection layer on each of the connection terminals 22 is disposed between the adjacent connection terminals 22, the edge layer 24, and the reinforcing plate 26 for reinforcing the connection portion 20. The base portion 2A includes the body portion m by extending The portion formed by the wiring board substrate 11 and the adhesive layer 13 formed by extending the body portion 作为) are referred to as the wiring direction d. Thereafter, the length direction of the connection terminal 22 is referred to. The direction orthogonal to the wiring is referred to as the terminal arrangement direction XA. The connection terminals 22 are arranged in parallel with each other by the extension 乂22 and the like::: pattern 12 and I constitute the connection terminal column 21. The adjacent sub-section 22 Let the heartline interval DA be "or...." 201249269 The distance between the side ends of the 22 is 0.2 mm or 0.15 to 0.3 mm. The adhesive layer on the wiring board substrate 1 is embedded in the adhesive layer 13 (hereinafter referred to as "inter-terminal distance"). 22 is disposed on the laminate 13. The lower portion of the connection terminal 22 is formed on the upper surface of each of the connection terminals 22. The conductive connecting layer 23 is formed, for example, by a thermoplastic silver paste having a thickness of 15". As the silver paste, it is preferable to use a scaly silver powder having an average particle diameter of 55 to 1 and an average particle diameter of the metal coated with the organic substance. Silver paste of spherical silver powder. By making the silver paste contain spherical silver powder having an average particle diameter of 2 〇 nm or less, the surface of the conductive connecting layer 23 can be made smooth. By smoothing the surface, the conductive connection can be increased. The surface portion of the layer 23 is in contact with the connected substrate 4 (). The insulating layer 24 is disposed on the adhesive layer 13. The upper surface of the insulating layer is the upper surface of the wiring board substrate. The reference surface 25 is disposed at a position higher than the position above the conductive connection layer 23. The step HA of the insulating layer 24 and the conductive connection layer 23 is larger than the height of the connected terminal 52 of the connection substrate 4, and is insulated from each other. The end surface distance WA between the layers 24 is equal to or longer than the length in the width direction of the connected terminal 52 of the connected substrate 4A. As the insulating adhesive forming the insulating layer 24, for example, a polyester-based heat-curing adhesive can be cited. 》Insulation 2 The melting temperature of 4 is preferably, for example, l2 (rc 〜1 5 〇 C. When the melting temperature of the insulating layer 24 is lower than 12 〇 < t, the subsequent strength of the wiring board i and the connected substrate 40 is lowered. When the melting temperature of the insulating layer 24 is larger than 150 ° C, the wiring board substrate 丨丨 is deformed or the adhesion between the wiring board substrate ij and the adhesive layer 13 is lowered. 201249269 The terminal = ? 6 is disposed in the connecting portion 2. The back surface, that is, the surface of the connecting plate 26 is formed to face the facing surface. The reinforcing plate % is transparent, and the reinforcing portion 26, and the second connecting portion 2 can be seen through the connecting portion 2. As a reinforcing plate ^ For example, the polyethylene terephthalate substrate and the polyimide substrate have a heat-resistant temperature higher than the temperature of the insulation (4). Alternatively, as shown in FIG. 12, the wiring board does not have the body portion but only "Preparation connection: P 2 〇. The wiring pattern is placed at a predetermined interval on the wiring board substrate", and 胄 is followed by the adhesive I 13. In this case, the wiring circle 1 is only composed of the connection terminal 22. In the same manner as shown in FIG. 1, the insulating S 24 is disposed on the adhesive layer 13, and the conductive connecting layer 23 is formed on The upper surface of the connection terminal 2 may be disposed on the lower surface of the wiring board substrate 11 (the surface opposite to the surface on which the wiring pattern 12 is disposed), or may not be disposed. In this case, the wiring board 1 can be as shown in FIG. The flat cable 44A that protrudes from the plurality of wires 452 that function as the connection terminals is connected. Further, as shown in Fig. 2, a heating hole 3 is formed at a position of the reinforcing plate % corresponding to the connection terminal row 2A. The hole 30 has a substantially square shape, and the upper edge 3 1 and the lower edge 32 of the hole 3 延伸 extend in the direction perpendicular to the longitudinal direction of the connection terminal 22. The left edge 33 of the heating hole 30 is disposed in the parallel J. 2 1 left, extending along the wiring direction γ a. The right side of the heating hole 3 彖3 4 is disposed on the right side of the connection terminal row 2 1 and extends in the wiring direction γ A . The first mark 27 and the second ^28 are provided at the right end and the left end of the connecting portion 20. The first mark 27 and the second mark 28 are used as 201249269 when the wiring board i is connected and the sub-array 2 1 is connected to the connected terminal row 5 1 of the connected substrate 4 为 for connecting the connection terminal 22 and the connected terminal. The benchmark for column integration is used. The first mark 27 and the second mark 28 are provided by laser marking, inkjet printing, stamping, stamping, or the like. Hereinafter, the intersection of the right end edge of the connection terminal 22 disposed at the rightmost side in Fig. 3 and the front edge of the wiring board 1 is referred to as the origin (reference position) KA for defining the position of the second mark 27. Further, the axis which is extended by the origin k in the direction in which the terminals are arranged is referred to as the X-axis, and the axis which extends through the origin κα and extends in the wiring direction 作为 is referred to as the γ-axis. The connection terminal 22 disposed at the rightmost side is referred to as the reference terminal 22A. The first mark 27 is provided in a portion on the right side of the connection terminal 22 disposed on the rightmost side of the connection terminal row 2A in Fig. 2, and the first blade 27 having the reinforcing plate 26 has a cross shape. The center point of the first mark 27 is arranged at coordinates (XI, Υ 1). The second mark 28 is provided in a portion of the connection terminal row 21 which is disposed to the left of the leftmost connection terminal 22 in Fig. 2, and has a portion of the reinforcing plate 26. The second mark 28 is a cross. The center point of the second mark 28 is placed at coordinates (Χ2, Υ1). The connected substrate 4A to which the wiring board 1 is connected will be described with reference to FIG. The substrate to be joined 40 includes a bottom plate 41 made of glass epoxy resin, and a connected portion 50 disposed on one surface of the bottom plate 41. The connected portion 50 has a connected terminal row 51 composed of a plurality of connected terminals 52. The spacing between adjacent connected terminals 52 is the same as the spacing between adjacent connecting terminals 22. Hereinafter, the longitudinal direction of the connected terminal 52 is referred to as the wiring direction ΥΒ. Further, the direction orthogonal to the wiring direction υβ and the direction along the surface of the bottom plate 3 12 201249269 4 1 is referred to as β in the terminal arrangement direction XB; the right end and the left end of the connection 20 are provided with the third mark and the ::: 2 mark 5 3 and 4th mark 5 4 are connected to the connected substrate: 〇; 4 sub-column 51 and wiring board! When the terminal array 21 is connected, the reference terminal 0 is used as a reference for integrating the positions of the connected terminal row 51 and the connection terminal 22, and the connected terminal (hereinafter referred to as "reference connected terminal 52" is connected to the reference terminal 22K. The vertex of the upper right is referred to as the origin (reference position) 用以 for specifying the position of the third mark 53. Further, the axis extending through the origin direction and extending in the terminal arrangement direction is referred to as the X-axis, and is referred to by the origin ΚΒ丨 along the axis extending along the wiring side. The third mark 53' is provided on the right side of the connected terminal 52 disposed on the rightmost side of the connected terminal row 5A in Fig. 3 . The third mark 53 has a cross shape. The center point of the third mark 53 is placed at coordinates (χι, γι). The fourth mark 54' is provided on the left side of the connected terminal 52 disposed on the leftmost side of the connected terminal row 51 in Fig. 3 . The fourth mark 54 is a cross. The center point of the fourth mark 54 is arranged at coordinates (Χ2, γι). A method of positioning the wiring board 1 and the connected substrate 4A will be described with reference to Figs. 3 and 4 . First, the surface of the substrate 40 to be connected having the connection terminal 52 is placed upward, and the connection substrate 40 is fixed to the base 61. The connected substrate 40 is fixed in a state where it can be easily removed from the base 61 after the wiring board 1 is connected to the connected substrate 40. The base 61 and the to-be-joined substrate 40 are temporarily fixed by, for example, an adhesive tape. Alternatively, a ferromagnetic material such as iron may be used as the base 61. The magnet 61 is used to fix the connected substrate 40 to the base 61. Next, make the wiring board with the connection terminal 22! The surface faces downward, and the position of the wiring board 1 to the connected substrate 40 is fixed. Specifically, first, the connection portion 20 of the wiring board 1 and the connected portion 5 of the connected substrate 4 are finally connected. Next, the center of the first mark 27 and the center of the third mark 53 are made, and The center of the second mark 28 coincides with the center of the fourth mark 54 to define the position of the wiring board 1 to the substrate 40 to be connected. Preferably, the positioning operation is performed by using a microscope such that the difference between the center of the first mark 27 and the center of the third mark 53 and the position of the center of the second mark 28 and the center of the fourth mark 54 are within a predetermined range (hereinafter referred to as a predetermined range). This is done in the "permissible range". For example, when the inter-private distance DB is 〇.2 mm, the allowable range of the position difference is set to +0.05 mm. The first mark 27 and the second mark 28 are set to the predetermined coordinates at the specific position of the reference terminal 22κ. The location. The third mark 53 and the fourth mark 5 are provided at positions where the specific position of the reference connected terminal 52 is the original coordinate of the origin ΚΒ. Further, the coordinates of the first mark 27 are the same as the coordinates of the third mark 53, and the coordinates of the second mark 28 are the same as those of the fourth mark 54. With this relationship, the connection terminal array 2 of the wiring board 1 and the connected terminal arrays 5 1 of the connected substrate 40 are accurately positioned with each other. When the wiring board 1 and the connected substrate 40 are overlapped, the conductive connection layer 23 of the connection terminal 22 and the connected terminal array 5 i corresponding to the connection terminal 22 are in contact with each other, and the insulating layer 24 is fitted between the connection terminals 52. A method of attaching the wiring board 1 and the connected substrate 4A will be described with reference to FIG. After setting the position of the wiring board 1 and the substrate 40 to be connected, the heating machine
14 S 201249269 70之加熱部71壓抵於對應補強板26之加熱用孔之部 分，以加熱配線板1之連接端子列21。此時，藉由絕緣層 24之一部分熔融，而接著配線板i之絕緣層24與被連接端 子5 2間之部分。 根據本實施形態’發揮以下效果。 U )本實施形態中，係於以基準端子22K之特定位置（原 點ΚΑ)為基準設定之特定座標設有第i標記27。第i標記 27用以定出配線板！之連接端子列21對被連接基板之 被連接端子列5 1之位置。設於被連接基板4〇之特定位置 之第3標記53，能透過配線板基板丨丨與第1標記27 一起 目視確認。 根據此構成，由於能將第1標記作為基準來參照，且 忐透過配線板基板1丨目視確認被連接基板40之第3標記 53，因此能將配線板丨與被連接基板4〇配置成配線板i之 第1標記27與被連接基板4〇之第3標記53之位置一致。 又此構成’第3標記5 3對被連接基板4 0之被連接 端子列5 1之位置關係與第1標記27對配線板1之連接端 子列21之位置關係相同。因此’藉由使配線板1之第1標 s己27與被連接基板4〇之第3標記53之位置一致，即能以 既定配置定出連接端子列2 1對被連接端子列5 1之位置。 又’由於能目視確認配線板1之第1標記27與被連接 基板40之第3標記53，因此即使係無法目視確認配線板i 之連接端子列21及被連接基板40之被連接端子列5 1之情 形’亦能定出連接端子列2 1對被連接端子列5 1之位置。 15 201249269 (2) 本貫施形態中，配線板基板11為透明，而能透視第 1標27與被連接基板40。根據此構成，能透過配線板】 之基板11以s玄第1標記為基準目視確認被連接基板4 〇之第 3標記53。藉此，能使配線板丨之第丨標記27與被連接基 板40之第3標記53之位置一致，定出配線板丨之連接端 子列2 1對被連接端子列5 1之位置。 (3) 本實施形態中’於構成連接端子列2 1之各連接端子 22之上面設有由包含銀粉末之銀糊形成之導電連接層23。 又，於連接端子22之間設有使連接端子22彼此絕緣之絕 緣層24。絕緣層24由熱熔接著劑形成。 根據此構成，在連接配線板丨之連接端子列21與被連 接基板40之被連接端子列51時，絕緣層24係與被連接基 板40之被連接端子列5丨之被連接端子52間之部分接著。 亦即，配線板1之連接端子列21與被連接基板4〇之被連 接端子列51透過導電連接層23而電氣連接。且配線板i 與被連接基板40藉由熱熔接著劑而接著。藉由以熱熔接著 劑接著配線板i與被連接基板4〇,能增大配線板Y與被連 接基板4 0之連接部之強度。 (4) 本實施形態中，於具有連接端子列21之連接部μ 設有補強連接部20之補強板26…於連接部2〇設有第 1標記27。 根據此構成，藉由補強板26補強連接端子列2 1。又， 由於於此補強板26設有第！標記27,因此能提高第【標記 27對連接端子列之基準位置（原點KA)之位置精度。 201249269 (5) 本實施形態中’於對應連接端子列2 1之補強板26 之部分設有加熱用孔3 0。根據此構成，在加熱連接端子列 2 1時不經由補強板26即能加熱具有連接端子列2 1之部 分。因此’與具有連接端子列21之部分被補強板26覆蓋 之情形相較，能將連接端子列2 1更快速地加熱至既定溫度。 (6) 本實施形態中，第丨標記27與第2標記28以連接 端子列21之特定部分為基準設定設於不同之位置。根據此 構成，能藉由使第1標記27 —致於被連接基板4〇之第3 才示s己5 3 ’且使第2標記2 8 —致於被連接基板4 0之第4標 記54，而能以配線板丨之連接端子列2丨之端子排列方向 X A與被連接端子列5丨之端子排列方向χΒ —致之方式定出 連接端子列2 1與被連接端子列5 1之位置。 <第1變形例> 參照圖6說明配線板1對被連接基板4〇之定位構造之 變形例。 第1變形例之配線板1與上述實施形態之構成在下述 點中相異。亦即，上述實施形態中，係以第i標記27之中 〜與第3標記53之中心一致、第2標記28之中心與第4 標記54之中心一致之方式，定出配線板1與被連接基板40 之位置。相對於此，第丨變形例中，第丨標記127具有第3 標記153進入内側之形狀。第2標記及第4標記之關係與 第1標記127及第3標記153之關係相同。以下，說明第i 變形例中自上述實施形態之構成之詳細變更。對與上述實 施形態共通之部分賦予相同之符號，省略其說明。 17 201249269 第1標記127，形成於圖6中較連接端子列2ι右端 連接端子22更右方之部分、且具有補強板％之部分。=之 標記1 2 7係具有既定内徑之環狀。 1 另一方面，第3標記153係圓形，該圓形之直徑較第 標記127之内徑小。例如，第i標記127之内徑與第3 / 記153之直徑之差設定為〇 lmm。亦即，當於第工標記m 内存在第3標記153時，第！標記127之中心與第3標& 153之中心之位置差在土〇.〇5mm以内。 在定出配線板1之連接端子列21與被連接基板4〇之 被連接端子列51之位置時，係以第3標記丨5 3進入第且枳 記127内側之方式定出配線板！與被連接基板4〇之位置「 藉此，能容易地目視確認第1標記127與第3標記153之 位置差是否在容許範圍内。 根據第1變形例，除了上述（1)〜（6)之效果以外，尚能 發揮以下之作用效果。 (7)第1變形例中，第1標記127構成為定出配線板1 之第1標記127與被連接基板40之第3標記153之位置差 之容許範圍。根據此構成，能目視確認配線板1之第1標 記127與被連接基板40之第3標記153之位置差是否在容 許範圍内。藉此，能容易地判定配線板1之連接端子列2】 與被連接基板40之被連接端子列51是否具有既定之位置 關係。 <第2變形例> 參照圖7說明配線板1對被連接基板40之定位構造之The heating portion 71 of 14 S 201249269 70 is pressed against the portion of the heating hole corresponding to the reinforcing plate 26 to heat the connection terminal row 21 of the wiring board 1. At this time, a portion of the insulating layer 24 of the wiring board i and the portion to which the terminal 52 is connected are partially melted by one of the insulating layers 24. According to this embodiment, the following effects are exhibited. U) In the present embodiment, the i-th mark 27 is provided on a specific coordinate set based on the specific position (original point ΚΑ) of the reference terminal 22K. The i-th mark 27 is used to fix the wiring board! The connection terminal array 21 is positioned to the connected terminal row 5 1 of the substrate to be connected. The third mark 53 provided at a specific position of the substrate 4 to be connected can be visually confirmed by the wiring board substrate 丨丨 together with the first mark 27. According to this configuration, the first mark can be referred to as a reference, and the third mark 53 of the connected substrate 40 can be visually confirmed through the wiring board substrate 1. Therefore, the wiring board 丨 and the connected substrate 4 can be arranged as wiring. The first mark 27 of the board i coincides with the position of the third mark 53 of the connected substrate 4A. Further, the positional relationship between the third mark 53 and the connected terminal row 5 1 of the connected substrate 40 is the same as the positional relationship between the first mark 27 and the connecting terminal 21 of the wiring board 1. Therefore, by aligning the position of the first mark 27 of the wiring board 1 with the third mark 53 of the substrate 4 to be connected, the connection terminal row 2 1 can be set to the connected terminal row 5 1 in a predetermined arrangement. position. In addition, since the first mark 27 of the wiring board 1 and the third mark 53 of the connected board 40 can be visually confirmed, the connection terminal line 21 of the wiring board i and the connected terminal line 5 of the connected board 40 cannot be visually recognized. In the case of 1 ', the position of the connection terminal column 2 1 to the connected terminal column 5 1 can also be determined. 15 201249269 (2) In the present embodiment, the wiring board substrate 11 is transparent, and the first standard 27 and the connected substrate 40 can be seen through. According to this configuration, the substrate 11 of the wiring board can visually confirm the third mark 53 of the connected substrate 4 based on the first mark of the smect. Thereby, the position of the second mark 53 of the connection board 40 can be made coincident with the position of the third mark 53 of the connection board 40, and the position of the connection terminal 2 of the wiring board 对 to the terminal row 5 to be connected can be determined. (3) In the present embodiment, the conductive connecting layer 23 made of a silver paste containing silver powder is provided on the upper surface of each of the connection terminals 22 constituting the connection terminal row 2 1 . Further, an insulating layer 24 for insulating the connection terminals 22 from each other is provided between the connection terminals 22. The insulating layer 24 is formed of a hot melt adhesive. According to this configuration, when the connection terminal row 21 of the wiring board 与 and the terminal row 51 of the connected substrate 40 are connected, the insulating layer 24 is interposed between the connected terminal 52 of the connected terminal row 5 of the connected substrate 40. Partially followed. That is, the connection terminal row 21 of the wiring board 1 and the connected terminal row 51 of the connected substrate 4 are electrically connected to each other through the conductive connection layer 23. And the wiring board i and the to-be-connected substrate 40 are followed by a hot-melt adhesive. The strength of the connection portion between the wiring board Y and the to-be-connected substrate 40 can be increased by the heat-dissipating agent following the wiring board i and the substrate 4 to be connected. (4) In the present embodiment, the reinforcing plate 26 having the reinforcing connecting portion 20 is provided in the connecting portion μ having the connection terminal row 21, and the first mark 27 is provided on the connecting portion 2 . According to this configuration, the connection terminal array 21 is reinforced by the reinforcing plate 26. Moreover, since the reinforcing plate 26 is provided with the first! Marking 27, it is possible to improve the positional accuracy of the reference position (original point KA) of the [mark 27] connection terminal row. 201249269 (5) In the present embodiment, the heating hole 30 is provided in a portion corresponding to the reinforcing plate 26 of the connection terminal row 2 1 . According to this configuration, when the connection terminal row 2 1 is heated, the portion having the connection terminal row 2 1 can be heated without passing through the reinforcing plate 26. Therefore, the connection terminal array 2 1 can be heated to a predetermined temperature more quickly than when the portion having the connection terminal row 21 is covered by the reinforcing plate 26. (6) In the present embodiment, the second mark 27 and the second mark 28 are set at different positions with respect to a specific portion of the connection terminal line 21. According to this configuration, the first mark 27 can be made to be the third of the connected substrate 4, and the second mark can be made to be the fourth mark 54 of the connected substrate 40. The position of the connection terminal row 2 1 and the connected terminal column 5 1 can be determined in such a manner that the terminal arrangement direction XA of the connection terminal row 2 of the wiring board 与 and the terminal arrangement direction of the connection terminal row 5 χΒ are aligned. . <First Modification> A modification of the positioning structure of the wiring board 1 to the connected substrate 4A will be described with reference to Fig. 6 . The wiring board 1 of the first modification differs from the configuration of the above embodiment in the following points. In other words, in the above-described embodiment, the wiring board 1 and the wiring board 1 are defined such that the center of the i-th mark 27 coincides with the center of the third mark 53, and the center of the second mark 28 coincides with the center of the fourth mark 54. The position of the substrate 40 is connected. On the other hand, in the second modification, the second mark 127 has a shape in which the third mark 153 enters the inside. The relationship between the second mark and the fourth mark is the same as the relationship between the first mark 127 and the third mark 153. Hereinafter, detailed changes from the configuration of the above embodiment in the i-th modification will be described. The same components as those in the above embodiment are denoted by the same reference numerals, and their description will be omitted. 17 201249269 The first mark 127 is formed in a portion closer to the right side of the connection terminal 22 than the right end of the connection terminal row 2i in Fig. 6, and has a portion of the reinforcing plate %. = mark 1 2 7 is a ring having a predetermined inner diameter. On the other hand, the third mark 153 is circular, and the diameter of the circle is smaller than the inner diameter of the first mark 127. For example, the difference between the inner diameter of the i-th mark 127 and the diameter of the third/note 153 is set to 〇 lmm. That is, when the third mark 153 is present in the mark m, the first! The difference between the center of the mark 127 and the center of the third mark & 153 is within 5 mm of the soil. When the position of the connection terminal row 21 of the wiring board 1 and the terminal array 51 to be connected to the connection board 4 is fixed, the wiring board is fixed so that the third mark 丨5 3 enters the inside of the first and lower marks 127! With respect to the position of the substrate 4 to be connected, it is possible to easily visually check whether or not the position difference between the first mark 127 and the third mark 153 is within an allowable range. According to the first modification, the above (1) to (6) are excluded. In addition to the effects, the following effects can be obtained. (7) In the first modification, the first mark 127 is configured to define a position difference between the first mark 127 of the wiring board 1 and the third mark 153 of the connected substrate 40. According to this configuration, it is possible to visually check whether or not the positional difference between the first mark 127 of the wiring board 1 and the third mark 153 of the connected substrate 40 is within an allowable range. Thereby, the connection of the wiring board 1 can be easily determined. The terminal row 2] has a predetermined positional relationship with the connected terminal row 51 of the connected substrate 40. <Second Modification> Referring to Fig. 7, the positioning structure of the wiring board 1 to the connected substrate 40 will be described with reference to Fig. 7 .
18 201249269 變形例。 第2變形例之配線板1與上述實施形態之構成在下述 點中相異。亦即，上述實施形態中，係以第1標記27之中 心與第3標記53之中心一致、且第2標記28之中心與第4 標記54之中心一致之方式，定出配線板1與被連接基板4〇 之位置。相對於此，第2變形例中，第1標記227具有第3 標記2 5 3進入内側之形狀。第2標記及第4標記之關係與 第1標記2 27及第3標記2 5 3之關係相同。以下，說明第2 變形例中自上述實施形態之構成之詳細變更。對與上述實 施形態共通之部分賦予相同之符號，省略其說明。 配線板1之第1標記227，形成於圖7中較連接端子列 2 1右端之連接端子22更右方之部分、且具有補強板26之 部分。第1標記227係具有既定既定徑之貫通孔。 另一方面，第3標記2 5 3係圓形，該圓形之直徑較第i 標記227之直徑小。例如，第1標記227之直徑與第3標 s己253之直徑之差設定為〇.imm。亦即，當於第1標記Μ? 内存在第3標記253時，第1標記227之中心與第3標記 253之中心之位置差在士0.05mm以内。 在定出配線板1之連接端子列21與被連接基板4〇之 被連接端子列5 1之位置時，與第丨變形例同樣地，係以第 3標記253進入第1標記227内側之方式定出配線板i與被 連接基板40之位置。藉此，能容易地目視確認第i標記'a? 與第3標§己253之位置差是否在容許範圍内。 根據第2變形例，第i標記227形成為貫通孔。因此， 19 201249269 配線板基板11及接著劑層1 3無需為透明。是以，配線板基 板11及接著劑層13能以有色材料製造。 根據第2變形例，除了上述（1)〜（7)之效果以外，尚能 發揮以下之作用效果。 (8)第1變形例中’第1標記227形成為貫通配線板基 板11之貫通孔。根據此構成，能透過貫通孔目視確認被連 接基板4 0之第3標§己2 5 3。藉此’能使配線板1之第1標 a己227與被連接基板40之第3標記253之位置一致，定出 配線板1之連接端子列21對被連接基板4〇之被連接端子 列5 1之位置。 <第3變形例> 參照圖8說明配線板1對被連接基板4〇之定位構造之 變形例。 第3變形例之配線板丨與第2變形例之構成在下述點 中相異。亦即，第2變形例中，帛"票記227形成為貫通 孔。=對於此，帛3變形例中，帛i標記327形成為缺口。 第2 ‘ n己及第4標記之關係與第！標記3 2 7及第3標記3 3 之關係相同。以下，說明第3變形例中自上述實施形態之 鼻成之4細變更。對與上述實施形態共通之部分賦予相同 之符號，省略其說明。 —立配線板i之第i標記327，藉由切除連接部2〇右端之 ▲ P刀而形成。第1標記327之形狀為矩形。作為第1標 °己327之缺口係藉由沖壓模具形成。 另—方面’第3標記353為矩形，較第】標記327小。18 201249269 Modifications. The wiring board 1 of the second modification differs from the configuration of the above embodiment in the following points. In other words, in the above-described embodiment, the center of the first mark 27 coincides with the center of the third mark 53, and the center of the second mark 28 coincides with the center of the fourth mark 54 to define the wiring board 1 and the quilt. The position of the substrate 4 is connected. On the other hand, in the second modification, the first mark 227 has a shape in which the third mark 253 enters the inside. The relationship between the second mark and the fourth mark is the same as the relationship between the first mark 2 27 and the third mark 2 5 3 . Hereinafter, a detailed modification of the configuration of the above embodiment in the second modification will be described. The same components as those in the above embodiment are denoted by the same reference numerals, and their description will be omitted. The first mark 227 of the wiring board 1 is formed on the right side of the connection terminal 22 at the right end of the connection terminal row 2 1 in Fig. 7, and has a portion of the reinforcing plate 26. The first mark 227 is a through hole having a predetermined diameter. On the other hand, the third mark 2 5 3 is circular, and the diameter of the circle is smaller than the diameter of the i-th mark 227. For example, the difference between the diameter of the first mark 227 and the diameter of the third mark 253 is set to 〇.imm. That is, when the third mark 253 is present in the first mark ?, the difference between the center of the first mark 227 and the center of the third mark 253 is within 0.05 mm. When the position of the connection terminal row 21 of the wiring board 1 and the terminal row 5 1 to be connected to the connection board 4 is fixed, the third mark 253 enters the inside of the first mark 227 as in the third modification. The position of the wiring board i and the substrate 40 to be connected is determined. Thereby, it can be easily visually confirmed whether or not the position difference between the i-th mark 'a? and the third mark 253 has been within the allowable range. According to the second modification, the i-th mark 227 is formed as a through hole. Therefore, 19 201249269, the wiring board substrate 11 and the adhesive layer 13 need not be transparent. Therefore, the wiring board substrate 11 and the adhesive layer 13 can be made of a colored material. According to the second modification, in addition to the effects (1) to (7) described above, the following effects can be exhibited. (8) In the first modification, the first mark 227 is formed as a through hole penetrating the wiring board substrate 11. According to this configuration, the third standard 2 5 3 of the connected substrate 40 can be visually confirmed through the through hole. Thereby, the position of the first mark 227 of the wiring board 1 and the third mark 253 of the substrate 40 to be connected can be made uniform, and the connected terminal row of the connection terminal row 21 of the wiring board 1 to the connected substrate 4 can be fixed. 5 1 location. <Third Modification> A modification of the positioning structure of the wiring board 1 to the connected substrate 4A will be described with reference to Fig. 8 . The wiring board of the third modification and the configuration of the second modification differ in the following points. That is, in the second modification, the 帛" ticket 227 is formed as a through hole. = For this, in the 帛3 modification, the 帛i mark 327 is formed as a notch. The relationship between the 2nd ‘n own and the 4th mark and the first! The relationship between the mark 3 2 7 and the third mark 3 3 is the same. Hereinafter, in the third modification, the fine change from the nose of the above embodiment will be described. The same components as those of the above-described embodiments are denoted by the same reference numerals, and their description will be omitted. — The i-th mark 327 of the vertical wiring board i is formed by cutting the ▲ P blade at the right end of the connecting portion 2 . The shape of the first mark 327 is a rectangle. The notch as the first standard 327 is formed by a press die. The other aspect 'the third mark 353 is a rectangle, which is smaller than the first mark 327.
S 201249269 例如，第1標記327之沿著端子排 』万向XA之長片斑笛〇 私記353之沿著端子排列方向χΒ之又、 ▽ ^ 14®^ 長度之差為O.lmm。 又，第1標記327之沿著配線方向 之長度與第3標印 353之沿著配線方向ΥΒ之長度之 、° 左馬0.1mm。亦即，春於 第1標記327内存在第3標記如時，第i標記327之中 心（對角線之交點）與第3標記353之中心之位置差在土 0.05mm 以内。 在定出配線板i之連接端子列21與被連接基板4〇之 被連接端子列51之位置時，與第【變形例同樣地，係以第 3標記353進入第i標記327内側之方式定出配線板i與被 連接基板40之位置。囍此，能交且从n 1精此此谷易地目視確認第1標記327 與第3標記353之位置差是否在容許範圍内。 根據第3變形例，第i標記327形成為缺口。因此， 配線板基板11及接著劑層13無需為透明。是以，配線板基 板11及接著劑層13能以有色材料製造。 根據第3變形例，除了上述（1)〜（7)之效果以外，尚能 發揮以下之作用效果。 (9)第3變形例中’第1標記327形成為設於配線板基 板11端部之缺口。根據此構成，能透過缺口目視確認被連 接基板40之第3標記3W。藉此，能使配線板1之第1標 記327與被連接基板4〇之第3標記353之位置一致，定出 配線板1之連接端子列2 1對被連接基板4〇之被連接端子 列5 1之位置。 <第4變形例> 21 201249269 參照圖9說明配線板1對被連接基板4 〇之定位構造之 變形例。 圖3所示之實施形態之配線板1，係於連接部形成 有第1標記27及第2標記28。相對於此，圖9所示之第4 變形例’兩個連接端子22係作為第1標記及第2標記使用。 此情形下，作為與第1標記一致之第3標記、亦即被連接 基板40之被連接部5〇上之標記，係使用連接於第丨標記 用之連接端子22之被連接端子52。同樣地，作為與第2標 。己致之第4標記、亦即被連接基板4〇之被連接部5〇側 之標記，係使用連接於第2標記用之連接端子22之被連接 端子52。以下，說明第4變形例中自上述實施形態之構成 之詳細變更。對與上述實施形態共通之部分賦予相同之符 號’省略其說明。 本體部1 0具備藉由導電材料形成之配線圖案1 2、炎著 配線圖案12之第1子基板111、塗布於第1子基板111及 配線圖案12間而接著第1子基板丨丨丨及配線圖案12之接 者劑層112、以及支禮連接端子列之第2子基板12()。配線 圖案12係與最初所舉之實施形態相同者，例如藉由厚度h 以m之鋼猪線形成。 一作為第1子基板in，例如可舉出厚度12"mi聚對苯 二甲酸乙二酯之絕緣性樹脂片。上述最初所舉之實施形態 中，雖係使用透明之配線板基板丨〖，但本變形例中亦能使 用不透明之基板作為第1子基板U1。 接著劑層112係將聚酯系接著劑以20〜1〇〇以m之厚度S 201249269 For example, the first mark 327 along the terminal block 』the X-ray of the X-ray of the long-range Snapper 私 353 along the terminal arrangement direction 、, ▽ ^ 14® ^ the difference between the length is O.lmm. Further, the length of the first mark 327 along the wiring direction and the length of the third mark 353 along the wiring direction 、 are 0.1 mm. That is, in the spring, when the third mark is present in the first mark 327, the position difference between the center of the i-th mark 327 (the intersection of the diagonal lines) and the center of the third mark 353 is within 0.05 mm of the soil. When the position of the connection terminal line 21 of the wiring board i and the connected terminal line 51 of the connected board 4 is fixed, the third mark 353 is placed inside the i-th mark 327 as in the modification. The position of the wiring board i and the substrate 40 to be connected is taken out. In this case, it is possible to visually check whether the difference in position between the first mark 327 and the third mark 353 is within the allowable range from n 1 . According to the third modification, the i-th mark 327 is formed as a notch. Therefore, the wiring board substrate 11 and the adhesive layer 13 need not be transparent. Therefore, the wiring board substrate 11 and the adhesive layer 13 can be made of a colored material. According to the third modification, in addition to the effects (1) to (7) described above, the following effects can be exhibited. (9) In the third modification, the first mark 327 is formed as a notch provided at the end of the wiring board substrate 11. According to this configuration, the third mark 3W of the connected substrate 40 can be visually confirmed through the notch. Thereby, the position of the first mark 327 of the wiring board 1 and the third mark 353 of the connected board 4 can be aligned, and the connected terminal row of the connection terminal row 2 1 of the wiring board 1 to the connected board 4 can be fixed. 5 1 location. <Fourth Modification> 21 201249269 A modification of the positioning structure of the wiring board 1 to the connected substrate 4A will be described with reference to Fig. 9 . In the wiring board 1 of the embodiment shown in Fig. 3, the first mark 27 and the second mark 28 are formed in the connecting portion. On the other hand, in the fourth modification shown in Fig. 9, the two connection terminals 22 are used as the first mark and the second mark. In this case, as the third mark corresponding to the first mark, that is, the mark on the connected portion 5 of the connection substrate 40, the connected terminal 52 connected to the connection terminal 22 for the second mark is used. Similarly, as the second standard. The fourth mark, that is, the mark on the side of the connected portion 5 of the connection substrate 4A, is the connected terminal 52 connected to the connection terminal 22 for the second mark. Hereinafter, a detailed modification of the configuration of the above embodiment in the fourth modification will be described. The same components as those of the above-described embodiments are denoted by the same reference numerals, and the description thereof will be omitted. The main body portion 10 includes a wiring pattern 1 formed of a conductive material, a first sub-substrate 111 of the inflammatory wiring pattern 12, and is applied between the first sub-substrate 111 and the wiring pattern 12, and then the first sub-substrate and The connector layer 112 of the wiring pattern 12 and the second sub-substrate 12 () of the connection terminal row. The wiring pattern 12 is the same as the first embodiment, and is formed, for example, by a steel pig wire having a thickness h of m. As the first sub-substrate in, for example, an insulating resin sheet having a thickness of 12 "mi polyethylene terephthalate is exemplified. In the first embodiment described above, a transparent wiring board substrate is used, but in the present modification, an opaque substrate can be used as the first sub-substrate U1. The adhesive layer 112 is a polyester adhesive having a thickness of 20 to 1 〇〇.
S 22 201249269 塗布於配線板基板u上 * 所舉之實rr能+ 也成。接者劑層⑴在上述最初 所舉之霄％形態中，雖在 ,1〆 叹叶會透明，但本第4變形例 中’可係硬化時會透明，亦可係不透明。 力第I子基板ill係覆蓋配線圖案12之延伸方向之端 =構成連接部2。之部分以外之部分。第2子基板12。 直接貼附於連接部2 〇。 第、2子基請具備具有剛性之第2子基板本體. 接著於連接端子2 2之接著劑声1 2 ：>。— * 考肖』a 122接者劑層122塗布於 第2子基板本體121之一面。垃芏為丨班 〈 面。接者劑層122為透明且即使 加熱亦維持透明之狀錐。笛？工苴 心狀心第2子基板本體121亦為透明， 由具有50〜15(^m之厚度之聚對苯二甲酸乙二醋之絕緣性 樹脂片形成。 第2子基板120透過接著劑層122接著於連接端子列 21。第2子基板120發揮抑制連接端子^之變形之補強板 功能。第i子基板⑴相當^上述實施形態之配線板基板 11。第2子基板12〇相當於上述實施形態之補強板％。 第2子基板120之形狀並不限定。第4變形例中，連 接端子22之前端與第2子基板12〇之端緣係一致。亦可取 代此方式，以第2子基板12〇之端緣位於連接端子22前端 之延伸線上之方式形成第2子基板12〇。 連接部20與最初實施形態之連接部2〇之構造相同。 亦即，於連接端子22上面形成有導電連接層23。於相鄰之 連接端子22之間形成有絕緣層24。 配線板1之連接端子列2 1與被連接基板40之被連接 23 201249269 端子列5 1之位置如下述方式定出。 連接端子列21兩端之連接端子22分別作為第}標記 及第2標記使用。確認第！標記即連接端子22與㈣^基 板40之一端之被連接端子52(第2標記），使該連接端子a 與被連接端子52之位置一致，且確認第2標記即連接端子 22與被連接基板40之另一端之被連接端子52(第4標記）， 使該連接端子22與被連接端子52之位置—致。此時，亦 可從配線板1向被連接基板4〇照射光以明確地看到被連接 基板40之被連接端子列5 j。 又，在使連接端子22與被連接端子52之位置一致時， 亦可如下述般使連接端子22之端緣作為基準。關於此定 位’參照圖3說明。圖3所示之配線板j雖與本第*變形 例之配線板1相異，但連接端子22之排列構造與第4變形 例之配線板1之連接端子22之排列構造相同。因此，關於 使連接端子22與被連接端子52之位置一致時之定位之說 明係使用圖3。 將連接鳊子列2 1與被連接端子列5丨之位置整合成第^ 標記之連接端子22之端緣22A(參照圖3)至第3標記之被連 接端子52之端緣52 a(參照圖3)之距離與第2標記之連接端 子22之端緣22B至第4標記之被連接端子52之端緣52B 之距離相等。亦可取代此m此情形下，使用連接端 子22之角部取代連接端子22之端緣作為對齊用之標記。 參照圖10及圖11說明上述配線板丨之製造方法。 如圖10所示，藉由使複數支銅箔線並行排列，形成配S 22 201249269 Applied on the wiring board substrate u * The real rr can be +. In the first embodiment of the splicer layer (1), the singular leaf is transparent, but in the fourth modification, it may be transparent or opaque. The force first sub-substrate ill covers the end of the extension pattern of the wiring pattern 12 = constitutes the connection portion 2. Part of the part. The second sub-substrate 12. Attach directly to the connection 2 〇. The second and second sub-bases are provided with a rigid second sub-substrate body. Next, the adhesive sound of the connection terminal 2 2 is 1 2 :>. —* The test piece a 122 connector layer 122 is applied to one surface of the second sub-substrate body 121. It’s a slap in the face. The adapter layer 122 is transparent and maintains a transparent cone even when heated. flute? The second sub-substrate body 121 is also transparent, and is formed of an insulating resin sheet having a polyethylene terephthalate having a thickness of 50 to 15 mm. The second sub-substrate 120 is transmitted through the adhesive layer. 122 is connected to the terminal array 21. The second sub-substrate 120 functions as a reinforcing plate for suppressing deformation of the connection terminal. The i-th sub-board (1) corresponds to the wiring board substrate 11 of the above-described embodiment. The second sub-substrate 12 〇 corresponds to the above. The shape of the second reinforcing substrate is not limited. In the fourth modified example, the front end of the connecting terminal 22 and the end edge of the second sub-substrate 12 are identical to each other. The second sub-substrate 12A is formed so that the end edge of the sub-substrate 12 is located on the extension line of the front end of the connection terminal 22. The connection portion 20 has the same structure as the connection portion 2 of the first embodiment. That is, above the connection terminal 22. An electrically conductive connection layer 23 is formed. An insulating layer 24 is formed between the adjacent connection terminals 22. The connection terminal row 2 1 of the wiring board 1 and the connected substrate 40 are connected 23 201249269 The position of the terminal row 5 1 is as follows Set the connection terminal column 21 The connection terminals 22 are used as the first mark and the second mark, respectively, and the connection mark 22 and the connected terminal 52 (second mark) at one end of the substrate 40 are confirmed, and the connection terminal a and the connected terminal are connected. The positions of 52 are the same, and the second terminal, that is, the connection terminal 22 and the connected terminal 52 (fourth mark) at the other end of the connected substrate 40 are confirmed, and the position of the connection terminal 22 and the connected terminal 52 is made uniform. It is also possible to illuminate the connected substrate 4 from the wiring board 1 to clearly see the connected terminal row 5 j of the connected substrate 40. Further, when the position of the connection terminal 22 and the connected terminal 52 are aligned, The end edge of the connection terminal 22 can be used as a reference. The positioning is described with reference to Fig. 3. The wiring board j shown in Fig. 3 is different from the wiring board 1 of the first modification, but the connection terminal 22 is The arrangement structure is the same as that of the connection terminal 22 of the wiring board 1 of the fourth modification. Therefore, the description of the positioning when the connection terminal 22 and the connected terminal 52 are aligned with each other is as shown in Fig. 3. 2 1 and the connected terminal column 5 The position is integrated into the end edge 22A of the connection terminal 22 of the first mark (refer to FIG. 3) to the end edge 52a of the connected terminal 52 of the third mark (refer to FIG. 3) and the end of the connection terminal 22 of the second mark. The distance from the edge 22B to the end edge 52B of the fourth terminal of the connected terminal 52 is equal. Alternatively, in this case, the corner of the connection terminal 22 may be used instead of the end edge of the connection terminal 22 as a mark for alignment. 10 and Fig. 11 illustrate a method of manufacturing the wiring board 。. As shown in Fig. 10, a plurality of copper foil lines are arranged in parallel to form a distribution.
S 24 201249269 線圖案12。於此等配線圖案丨2之一面接著第^片材2⑽， 繼而，從另一面接著第2片材200而整合於此第i片材2〇〇。 第1片材200藉由與第i子基板lu相同材料之母材片 構成。於此母材片之一面塗布有藉由被加熱而形成接著劑 層11 2之接著劑。 第1片材200係沿一方向較長之片材，具備沿延伸方 向具有既定長度之矩形窗201。沿著延伸方向之窗2〇1之長 度係連接部20之長度之約2倍。窗201之寬度較連接端子 列21之寬度大。沿第i片材2〇〇之延伸方向相鄰之窗 彼此之距離與配線板丨之長度一致。亦即，窗2〇ι形成於 對應連接端子列21之部分。又，在將片材2〇〇貼附於配線 圖案12時，兩個片材之窗201大致一致，連接部2〇不被 覆蓋。 如圖10及圖11(a)所示，沿第1切斷線CA、第2切斷 線CB及第3切斷線CC切斷片材。藉此切出配線板丨。其 次，如圖11 (b)所示，於配線板1之兩端部接著第2子基板 120。第2子基板120之一部分與片材2〇〇(亦即第i子基板 1 11)重疊。 其次，準備用以於連接部20上形成導電連接層23及 絕緣層24之轉印片材130。 如圖11 (c)所示，轉印片材1 30係於剝離片材i 3 1上交 互塗布對應導電連接層23之導電材料133與對應絕緣層24 之絕緣材料132而形成。 於剝離片材1 3 1表面形成有例如石夕層。其係為了防止 25 201249269 在將導電材料133及絕緣#料 該剝離片材1 3 1時於剝離片材 緣材料1 3 2。 1 3 2貼附於連接部2 〇後剝離 131附著導電材料133及絕 導電材料133 <列士。由熱可塑性之銀糊形成 藉由網板印刷於剝離片和 連接端子2 2之區域塗布銀糊 之硬化而形成導電材料133。 絕緣材料1 3 2例如由聚 板印刷於剝離片材13 1之既 2 2間之區域塗布熱溶接著劑 方式形成轉印片材130。 卜1 3 1之既定區域、亦即對應 ’在其後藉由使之乾燥進而使 酉曰系熱溶接著劑形成。藉由網 定區域、亦即相鄰之連接端子 ’使熱溶接著劑乾燥。以上述 如圖U⑷所示，轉印片材130貝占附於配線板】之連接 部20,且藉由壓板等將導電材料133按壓於連接端子Η， 將絕緣材料132按壓於第2子基板120。導電材料133及絕 緣材料132在被壓板按壓於第2子基板12〇時，係以12〇 C加熱此後’除去剝離片材丨3丨。藉由以上步驟形 成配線板1。 圖1 0及圖11中，片材被切分成配線板丨後，接著第2 子基板120，並轉印導電材料133與絕緣材料132。亦可取 代此方式，在於對應連接部2〇之部分接著第2子基板12〇 後，再切斷片材。又，亦可於對應連接部2〇之部分接著第 2子基板120，進而對第2子基板12〇轉印導電材料丨33與 絕緣材料1 3 2後，再切斷片材。 根據第4變形例，除了上述⑴〜（6)之效果以外，尚能S 24 201249269 Line pattern 12. One of the wiring patterns 丨2 is next to the second sheet 2 (10), and then the second sheet 200 is joined to the ith sheet 2 from the other surface. The first sheet 200 is composed of a base material sheet of the same material as the i-th sub-substrate lu. An adhesive for forming the adhesive layer 11 2 by heating is applied to one side of the base material sheet. The first sheet 200 is a sheet which is long in one direction and has a rectangular window 201 having a predetermined length in the extending direction. The length of the window 2〇1 along the extending direction is about twice the length of the connecting portion 20. The width of the window 201 is larger than the width of the connection terminal column 21. The windows adjacent to each other along the extending direction of the i-th sheet 2 are aligned with the length of the wiring board 。. That is, the window 2 is formed in a portion corresponding to the connection terminal column 21. Further, when the sheet 2 is attached to the wiring pattern 12, the windows 201 of the two sheets are substantially identical, and the connecting portion 2 is not covered. As shown in Fig. 10 and Fig. 11(a), the sheet is cut along the first cutting line CA, the second cutting line CB, and the third cutting line CC. Thereby, the wiring board 切 is cut out. Next, as shown in Fig. 11 (b), the second sub-substrate 120 is attached to both end portions of the wiring board 1. One portion of the second sub-substrate 120 overlaps the sheet 2 (i.e., the i-th sub-substrate 11). Next, a transfer sheet 130 for forming the conductive connecting layer 23 and the insulating layer 24 on the connecting portion 20 is prepared. As shown in Fig. 11 (c), the transfer sheet 1 30 is formed by coating the conductive material 133 of the corresponding conductive connecting layer 23 and the insulating material 132 of the corresponding insulating layer 24 on the release sheet i 3 1 . For example, a layer of sap is formed on the surface of the release sheet 1 31. This is to prevent the sheet edge material 1 3 2 from being peeled off when the conductive material 133 and the insulating material are peeled off the sheet 1 3 1 from 201204269. 1 3 2 is attached to the connecting portion 2, and then peeled off. 131 Adhesive material 133 and conductive material 133 < The conductive material 133 is formed by coating a silver paste of a thermoplastic sheet by a screen printing on a region where the release sheet and the connection terminal 2 2 are coated with a silver paste. The insulating material 133 forms a transfer sheet 130 by, for example, applying a hot-melt adhesive agent to a region between the two of the release sheets 13 1 by a slab. The predetermined region of Bu 1 3 1 , i.e., corresponding to ' is thereafter dried by drying to form a lanthanide hot-melt adhesive. The hot melt adhesive is dried by a networked region, i.e., adjacent connection terminals. As shown in Fig. U (4), the transfer sheet 130 is attached to the connection portion 20 of the wiring board, and the conductive material 133 is pressed against the connection terminal 藉 by a press plate or the like, and the insulating material 132 is pressed against the second sub-substrate. 120. When the conductive material 133 and the insulating material 132 are pressed against the second sub-substrate 12 by the press plate, the conductive material 133 and the insulating material 132 are heated by 12 〇 C to remove the release sheet 丨 3 。. The wiring board 1 is formed by the above steps. In FIGS. 10 and 11, the sheet is cut into the wiring board, and then the second sub-substrate 120 is transferred, and the conductive material 133 and the insulating material 132 are transferred. Alternatively, the film may be cut after the portion corresponding to the connecting portion 2 is next to the second sub-substrate 12?. Further, the second sub-substrate 120 may be attached to the portion corresponding to the connection portion 2, and the conductive material 丨33 and the insulating material 134 may be transferred to the second sub-substrate 12, and then the sheet may be cut. According to the fourth modification, in addition to the effects (1) to (6) described above,
S 26 201249269 發揮以下之效果。 ⑽第4變形例巾，由於定线接端子列21對被連接 基板40之位置，因此連接端子22作為第丨標記及第2標 記使用。藉此’可將作為第丨標記之連接端子22作為基準 來參照’ X能目視確認作為被連接&板4〇之帛3標記之被 連接端子52。又，能目視確認作為第2標記之連接端子22 與作為被連接基板40之第4標記之被連接端子52〇藉此， 月b使連接端子22與被連接基板4〇之被連接端子52之位置 一致，定出配線板1之連接端子列2l對被連接基板4〇之 被連接端子列5 1之位置。 (其他實施形態） 本發明之實施態樣不限於上述實施形態及變形例所示 之態樣。例如，本發明之實施態樣亦能如以下所示變更並 實施。又，以下之各變形例，不僅適用於上述各實施例， 亦能將不同變形例彼此組合來實施。 •上述實施形態中，雖為了對被連接基板4〇定位而於 配線板1設有兩個標記，但亦可設有一個標記。此情形下， 係使配線板1相對被連接基板40旋轉，以使連接端子列2 i 之端子排列方向XA與被連接端子列5丨之端子排列方向χΒ 一致’且使配線板1之第i標記27及被連接基板4〇之第3 標記5 3之位置一致。 •上述實施形態中，雖使用一層之補強板26，但亦能 使用兩層以上之補強板26。此情形下，亦可將加熱用孔3〇 形成為貫通兩層。又，亦可僅於外側之一層形成加熱用孔 27 201249269 .上述實施形態中，雖配線板1之補強板26具備加熱 用孔30，但亦可不具備加熱用孔3〇。此情形下，係透過補 強板2 6加熱連接部2 〇。 •上述實施形態中，雖配線板丨之補強板26包圍連接 部20外周，但補強板26不限定於此形態。例如，補強板 26亦可僅覆蓋配線板i之前端部。又，補強板26亦可覆蓋 配線板1之前端部及兩端部。 •上述實施形態中’雖於補強板26形成有第1標記27 及第2標記28，但標記27, 28亦能形成於具有補強板26 之部分以外之部分。 •上述貫施形態中，雖配線板丨之背面具被補強板26， 但亦可不具備補強板26。 •上述實施形態中，雖絕緣層24以兩層形成，但絕緣 層24之構造不限定於此。例如，絕緣層24亦能以一層形 成又，絕緣層2 4亦能以三層以上形成。又，雖導電連接 層23以一層形成，但亦能以兩層以上形成。 •上述實施形態中，雖導電連接層23由銀糊形成，但 亦可取代此方式，由異向性樹脂形成。此情形下，在塗布 異向性樹脂後之步驟中’異向性樹脂係被壓縮而形成導電 連接層23。 •上述實施形態中’形成有較導電連接層23上面之位 置尚之絕緣層24。作為此種形成絕緣層24之方法，有藉由 網板印刷使絕緣層24成為兩層之方法、在將絕緣層“與 28 201249269 導電連接層23形成為相同高度後壓縮導電連接層23之方 法等。 ♦上述實施形態中，導電連接層23之上面與絕緣層24 之上面亦可為大致相同高度。 *上述實施形態中’導電連接層23之上面亦可較絕緣 層24之上面高。 •上述實施形態中’導電連接層23與絕緣層24亦可 取代轉印而直接印刷。 •上述實施形態中’絕緣層24形成於各連接端子22 之間。亦能取代此方式，僅於連接端子列2 1中一方端之連 接端子22外側與另一方端之連接端子22外側形成絕緣層 24又’亦可於各連接端子22之間之任一個或兩個以上形 成絕緣層2 4。 上述第4變形例_，如圖9所示，於連接端子列21 之一面直接貼附有第2子基板1 2 〇。亦能取代此方式，至少 一方之第1子基板111為透明’且該透明之第1子基板m 延伸至連接部20，並於此第1子基板丨〖丨貼附第2子基板 120。第1子基板in及第2子基板12〇，具有在貼合第1子 基板111及第2子基板120時能透視被連接基板4〇程度之透 明性。亦即，藉由此種構造’由於貼合第1子基板1丨丨及第 2子基板120而成之合板為透明，因此與第4變形例同樣 地’能使連接端子22與被連接基板4〇之被連接端子52之 位置一致’定出配線板1之連接端子列2!對被連接基板4〇 之被連接端子列5 1之位置。 29 201249269 【圖式簡單說明】 圖1係針對本發明之實施形態之配線板顯示連接部一 部分之立體圖。 圖2係顯示本發明之實施形態之配線板背面之俯視圖。 圖3係顯示本發明之實施形態之配線板與被連接基板 之連接方法之示意圖。 圖4係顯示定出本發明之實施形態之配線板與被連接 基板之位置之樣子之俯視圖。 圖5係顯示本發明之實施形態之配線板與被連接基板 之接著方法之示意圖。 圖6係針對本發明之實施形態之第1變形例顯示定出 此配線板與被連接基板之位置之樣子之俯視圖。 圖7係針對本發明之實施形態之第2變形例顯示定出 此配線板與被連接基板之位置之樣子之俯視圖。 圖8係針對本發明之實施形態之第3變形例顯示定出 此配線板與被連接基板之位置之樣子之俯視圖。 圖9係針對本發明之實施形態之第4變形例顯示連接 部一部分之立體圖。 圖1 0係針對第4變形例之配線板顯示處於製造過程之 製品之圖。 圖11係針對第4變形例之配線板顯示處於製造過程之 製品之圖。 圖12係顯示本發明之實施形態之一變形例之立體圖。S 26 201249269 The following effects are achieved. (10) In the fourth modified example, since the position of the fixed terminal block 21 to the substrate 40 is connected, the connection terminal 22 is used as the second mark and the second mark. By this, it is possible to visually confirm the connected terminal 52 which is the 帛3 mark of the connected & panel 4 by referring to the connection terminal 22 as the second mark. Moreover, the connection terminal 22 as the second mark and the connected terminal 52 as the fourth mark of the connected substrate 40 can be visually confirmed, whereby the connection terminal 22 and the connected terminal 52 of the connected substrate 4 are connected by the month b. The positions are the same, and the position of the connection terminal row 2 1 of the wiring board 1 to the connected terminal row 5 1 of the substrate 4 to be connected is fixed. (Other Embodiments) The embodiment of the present invention is not limited to the embodiment shown in the above embodiments and modifications. For example, the embodiment of the present invention can be modified and implemented as shown below. Further, the following modifications are applicable not only to the above-described respective embodiments but also to different modifications. In the above embodiment, two marks are provided on the wiring board 1 in order to position the substrate to be connected 4, but one mark may be provided. In this case, the wiring board 1 is rotated relative to the connected substrate 40 so that the terminal arrangement direction XA of the connection terminal array 2 i coincides with the terminal arrangement direction χΒ of the connected terminal array 5 ' 'and the ith of the wiring board 1 is made The position of the mark 27 and the third mark 5 3 of the connected substrate 4A coincides. In the above embodiment, a reinforcing plate 26 of one layer is used, but two or more reinforcing plates 26 can be used. In this case, the heating hole 3〇 may be formed to penetrate the two layers. Further, the heating hole 27 may be formed only in one of the outer layers. In the above embodiment, the reinforcing plate 26 of the wiring board 1 is provided with the heating hole 30, but the heating hole 3 may not be provided. In this case, the connecting portion 2 is heated by the reinforcing plate 26. In the above embodiment, the reinforcing plate 26 of the wiring board surrounds the outer periphery of the connecting portion 20, but the reinforcing plate 26 is not limited to this configuration. For example, the reinforcing plate 26 may cover only the front end of the wiring board i. Further, the reinforcing plate 26 may cover the front end portion and both end portions of the wiring board 1. In the above embodiment, the first mark 27 and the second mark 28 are formed on the reinforcing plate 26, but the marks 27 and 28 may be formed in portions other than the portion having the reinforcing plate 26. In the above-described embodiment, the reinforcing plate 26 is provided on the back surface of the wiring board, but the reinforcing plate 26 may not be provided. In the above embodiment, the insulating layer 24 is formed of two layers, but the structure of the insulating layer 24 is not limited thereto. For example, the insulating layer 24 can also be formed in one layer, and the insulating layer 24 can also be formed in three or more layers. Further, although the conductive connecting layer 23 is formed of one layer, it may be formed of two or more layers. In the above embodiment, the conductive connecting layer 23 is formed of a silver paste, but may be formed of an anisotropic resin instead of this. In this case, the anisotropic resin is compressed in the step after the application of the anisotropic resin to form the conductive connecting layer 23. In the above embodiment, the insulating layer 24 is formed on the upper surface of the conductive connecting layer 23. As a method of forming the insulating layer 24, there is a method in which the insulating layer 24 is formed into two layers by screen printing, and the insulating layer "is formed at the same height as the 28 201249269 conductive connecting layer 23, and the conductive connecting layer 23 is compressed. ♦ In the above embodiment, the upper surface of the conductive connecting layer 23 and the upper surface of the insulating layer 24 may have substantially the same height. * In the above embodiment, the upper surface of the conductive connecting layer 23 may be higher than the upper surface of the insulating layer 24. In the above embodiment, the conductive connecting layer 23 and the insulating layer 24 may be directly printed instead of the transfer. In the above embodiment, the 'insulating layer 24 is formed between the respective connection terminals 22. Alternatively, only the connection terminal may be used. An insulating layer 24 may be formed on the outer side of the connection terminal 22 at one end of the column 2 and the other end of the connection terminal 22 in the other end, and the insulating layer 24 may be formed in either or both of the connection terminals 22. 4 Modification_ As shown in FIG. 9, the second sub-substrate 1 2 is directly attached to one surface of the connection terminal array 21. Alternatively, at least one of the first sub-substrates 111 may be transparent and transparent. The first sub-substrate m extends to the connection portion 20, and the second sub-substrate 120 is attached to the first sub-substrate 。. The first sub-substrate in and the second sub-substrate 12 〇 have the first sub-substrate bonded thereto. In the case of the 111th and the second sub-substrate 120, the transparency of the substrate to be connected can be seen to be transparent. That is, the plywood formed by bonding the first sub-substrate 1 and the second sub-substrate 120 is In the same manner as in the fourth modification, the position of the connection terminal 22 and the connected terminal 52 of the connected substrate 4 can be set to match the position of the connection terminal 2 of the wiring board 1 Fig. 1 is a perspective view showing a part of a wiring board display connection portion according to an embodiment of the present invention. Fig. 2 is a plan view showing a rear surface of a wiring board according to an embodiment of the present invention. Fig. 3 is a schematic view showing a method of connecting a wiring board and a substrate to be connected according to an embodiment of the present invention. Fig. 4 is a plan view showing a position of a wiring board and a substrate to be connected according to an embodiment of the present invention. Show the embodiment of the present invention FIG. 6 is a plan view showing a state in which the position of the wiring board and the substrate to be connected is fixed in the first modification of the embodiment of the present invention. FIG. The second modification of the embodiment of the present invention is a plan view showing the position of the wiring board and the connected substrate. Fig. 8 shows the wiring board and the connected board in the third modification of the embodiment of the present invention. Fig. 9 is a perspective view showing a part of a connecting portion in a fourth modification of the embodiment of the present invention. Fig. 10 is a view showing a product in a manufacturing process in a wiring board according to a fourth modification. Fig. 11 is a view showing the article in the manufacturing process for the wiring board of the fourth modification. Fig. 12 is a perspective view showing a modification of the embodiment of the present invention.
30 201249269 【主要元件符號說明】 1 配線板 10 本體部 11 配線板基板 12 配線圖案 13 接著劑層 20 連接部 20A 基礎部 21 連接端子列 22 連接端子 22A, 22B 端緣 22K 基準端子 23 導電連接層 24 絕緣層 25 基準面 26 補強板 27 第1標記 28 第2標記 30 加熱用孔 3 1 上緣 32 下緣 33 左緣 34 右緣 31 201249269 40 被連接基板 41 底板 50 被連接部 5 1 被連接端子列 52 被連接端子 52A, 52B 端緣 52K 基準被連接端子 53 第3標記 54 第4標記 61 基台 70 加熱機 71 加熱部 111 第1子基板 112 接著劑層 120 第2子基板 121 第2子基板本體 122 接著劑層 127 第1標記 130 轉印片材 131 剝離片材 132 絕緣材料 133 導電材料 153 第3標記 200 第1片材 32 201249269 201 窗 227 第 1 標 記 253 第 3 標 記 327 第 1 標 記 353 第 3 標 記 440 扁 平 電 纜 452 導 線30 201249269 [Description of main components] 1 Wiring board 10 Main body part 11 Wiring board base 12 Wiring pattern 13 Subsequent layer 20 Connecting part 20A Base part 21 Connection terminal row 22 Connection terminal 22A, 22B End edge 22K Reference terminal 23 Conductive connection layer 24 Insulation layer 25 Reference surface 26 Reinforcement plate 27 First mark 28 Second mark 30 Heating hole 3 1 Upper edge 32 Lower edge 33 Left edge 34 Right edge 31 201249269 40 Connected substrate 41 Base plate 50 is connected by connection part 5 1 Terminal row 52 connection terminal 52A, 52B end edge 52K reference connection terminal 53 third mark 54 fourth mark 61 base 70 heating machine 71 heating part 111 first sub-substrate 112 subsequent agent layer 120 second sub-substrate 121 second Sub-substrate body 122 Substrate layer 127 First mark 130 Transfer sheet 131 Release sheet 132 Insulation material 133 Conductive material 153 Third mark 200 First sheet 32 201249269 201 Window 227 First mark 253 Third mark 327 First Mark 353 3rd mark 440 flat cable 452 wire