TW201247676A - Method for producing dianthra [2,3-b:2',3'-f] thieno [3,2-b] thiophen and application thereof - Google Patents
Method for producing dianthra [2,3-b:2',3'-f] thieno [3,2-b] thiophen and application thereof Download PDFInfo
- Publication number
- TW201247676A TW201247676A TW101106272A TW101106272A TW201247676A TW 201247676 A TW201247676 A TW 201247676A TW 101106272 A TW101106272 A TW 101106272A TW 101106272 A TW101106272 A TW 101106272A TW 201247676 A TW201247676 A TW 201247676A
- Authority
- TW
- Taiwan
- Prior art keywords
- organic
- layer
- thiophene
- thieno
- compound
- Prior art date
Links
- VJYJJHQEVLEOFL-UHFFFAOYSA-N thieno[3,2-b]thiophene Chemical compound S1C=CC2=C1C=CS2 VJYJJHQEVLEOFL-UHFFFAOYSA-N 0.000 title claims description 42
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 150000003606 tin compounds Chemical class 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 165
- 239000004065 semiconductor Substances 0.000 claims description 117
- 239000000463 material Substances 0.000 claims description 114
- 150000001875 compounds Chemical class 0.000 claims description 85
- 239000010408 film Substances 0.000 claims description 83
- 238000006243 chemical reaction Methods 0.000 claims description 63
- 239000000758 substrate Substances 0.000 claims description 60
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 claims description 47
- 229930004069 diterpene Natural products 0.000 claims description 46
- 150000004141 diterpene derivatives Chemical class 0.000 claims description 46
- 239000010409 thin film Substances 0.000 claims description 42
- 238000000576 coating method Methods 0.000 claims description 27
- 229930192474 thiophene Natural products 0.000 claims description 25
- 239000000126 substance Substances 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000001704 evaporation Methods 0.000 claims description 8
- QMMFVYPAHWMCMS-UHFFFAOYSA-N Dimethyl sulfide Chemical compound CSC QMMFVYPAHWMCMS-UHFFFAOYSA-N 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 125000001424 substituent group Chemical group 0.000 claims description 3
- GKTQKQTXHNUFSP-UHFFFAOYSA-N thieno[3,4-c]pyrrole-4,6-dione Chemical compound S1C=C2C(=O)NC(=O)C2=C1 GKTQKQTXHNUFSP-UHFFFAOYSA-N 0.000 claims 1
- 150000001454 anthracenes Chemical class 0.000 abstract description 7
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 abstract description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 2
- 238000007363 ring formation reaction Methods 0.000 abstract description 2
- 229910052717 sulfur Inorganic materials 0.000 abstract description 2
- 239000011593 sulfur Substances 0.000 abstract description 2
- DNGRSVWAENAWJR-UHFFFAOYSA-N dianthra[2,3-b:2',3'-f]thieno[3,2-b]thiophene Chemical compound C1=CC=C2C=C(C=C3C(C=4SC=5C(C=4S3)=CC3=CC4=CC=CC=C4C=C3C=5)=C3)C3=CC2=C1 DNGRSVWAENAWJR-UHFFFAOYSA-N 0.000 abstract 1
- 230000011987 methylation Effects 0.000 abstract 1
- 238000007069 methylation reaction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 192
- -1 trifluorofluorohexyl Chemical group 0.000 description 35
- 239000000203 mixture Substances 0.000 description 29
- 230000015572 biosynthetic process Effects 0.000 description 25
- 230000006870 function Effects 0.000 description 23
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 21
- 210000004027 cell Anatomy 0.000 description 20
- 239000002019 doping agent Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 230000005525 hole transport Effects 0.000 description 17
- 239000012212 insulator Substances 0.000 description 17
- 238000010438 heat treatment Methods 0.000 description 16
- 238000007639 printing Methods 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000002184 metal Substances 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- 238000007740 vapor deposition Methods 0.000 description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 13
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 12
- 238000001459 lithography Methods 0.000 description 12
- 239000011241 protective layer Substances 0.000 description 12
- 238000003786 synthesis reaction Methods 0.000 description 12
- 239000003153 chemical reaction reagent Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 11
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 230000005669 field effect Effects 0.000 description 10
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 101150041968 CDC13 gene Proteins 0.000 description 9
- 229910000420 cerium oxide Inorganic materials 0.000 description 9
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000002585 base Substances 0.000 description 8
- WQOXQRCZOLPYPM-UHFFFAOYSA-N dimethyl disulfide Chemical group CSSC WQOXQRCZOLPYPM-UHFFFAOYSA-N 0.000 description 8
- 239000007789 gas Substances 0.000 description 8
- 238000004528 spin coating Methods 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 7
- 238000005481 NMR spectroscopy Methods 0.000 description 7
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 229910052744 lithium Inorganic materials 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- 229910052708 sodium Inorganic materials 0.000 description 7
- 239000011734 sodium Substances 0.000 description 7
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 6
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 125000000217 alkyl group Chemical group 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 6
- 229910052791 calcium Inorganic materials 0.000 description 6
- 239000011575 calcium Substances 0.000 description 6
- 238000004512 die casting Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 238000000813 microcontact printing Methods 0.000 description 6
- FGSWVUVISMIKSR-PLNGDYQASA-N n'-hydroxy-n,n-dimethylethanimidamide Chemical compound CN(C)C(\C)=N/O FGSWVUVISMIKSR-PLNGDYQASA-N 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 229910052700 potassium Inorganic materials 0.000 description 6
- 239000011591 potassium Substances 0.000 description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical group [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 5
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 5
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 5
- 238000007611 bar coating method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000002451 electron ionisation mass spectrometry Methods 0.000 description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 5
- 238000007641 inkjet printing Methods 0.000 description 5
- 238000007644 letterpress printing Methods 0.000 description 5
- 239000004417 polycarbonate Substances 0.000 description 5
- 229920000515 polycarbonate Polymers 0.000 description 5
- 238000010248 power generation Methods 0.000 description 5
- 238000000746 purification Methods 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 238000009835 boiling Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 238000007646 gravure printing Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 239000011777 magnesium Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 150000004866 oxadiazoles Chemical class 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 4
- 229920002098 polyfluorene Polymers 0.000 description 4
- 229920000123 polythiophene Polymers 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000010025 steaming Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N Pd(PPh3)4 Substances [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- DGEZNRSVGBDHLK-UHFFFAOYSA-N [1,10]phenanthroline Chemical compound C1=CN=C2C3=NC=CC=C3C=CC2=C1 DGEZNRSVGBDHLK-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 229910052783 alkali metal Inorganic materials 0.000 description 3
- 150000001340 alkali metals Chemical class 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 3
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 3
- 150000008425 anthrones Chemical class 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000010549 co-Evaporation Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- DMEGYFMYUHOHGS-UHFFFAOYSA-N cycloheptane Chemical compound C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 238000003618 dip coating Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005566 electron beam evaporation Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 3
- 238000004949 mass spectrometry Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 150000007978 oxazole derivatives Chemical class 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- UQPUONNXJVWHRM-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 UQPUONNXJVWHRM-UHFFFAOYSA-N 0.000 description 3
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 3
- 150000002987 phenanthrenes Chemical class 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 229920000767 polyaniline Polymers 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 150000004033 porphyrin derivatives Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 229910052707 ruthenium Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000003980 solgel method Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- YEMJHNYABQHWHL-UHFFFAOYSA-N tributyl(ethynyl)stannane Chemical group CCCC[Sn](CCCC)(CCCC)C#C YEMJHNYABQHWHL-UHFFFAOYSA-N 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- CINOYIQWMMQTGN-UHFFFAOYSA-N 1,1,1-trichlorononadecane Chemical compound C(CCCCCCCCCCCCCCCCC)C(Cl)(Cl)Cl CINOYIQWMMQTGN-UHFFFAOYSA-N 0.000 description 2
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- ATWLRNODAYAMQS-UHFFFAOYSA-N 1,1-dibromopropane Chemical compound CCC(Br)Br ATWLRNODAYAMQS-UHFFFAOYSA-N 0.000 description 2
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 2
- KNKRKFALVUDBJE-UHFFFAOYSA-N 1,2-dichloropropane Chemical compound CC(Cl)CCl KNKRKFALVUDBJE-UHFFFAOYSA-N 0.000 description 2
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical class C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 2
- JDIIGWSSTNUWGK-UHFFFAOYSA-N 1h-imidazol-3-ium;chloride Chemical compound [Cl-].[NH2+]1C=CN=C1 JDIIGWSSTNUWGK-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- IHXWECHPYNPJRR-UHFFFAOYSA-N 3-hydroxycyclobut-2-en-1-one Chemical class OC1=CC(=O)C1 IHXWECHPYNPJRR-UHFFFAOYSA-N 0.000 description 2
- JGSIAOZAXBWRFO-UHFFFAOYSA-N 3-methylsulfanyl-1-phenyl-4,5-dihydrobenzo[g]indazole Chemical compound C1CC2=CC=CC=C2C2=C1C(SC)=NN2C1=CC=CC=C1 JGSIAOZAXBWRFO-UHFFFAOYSA-N 0.000 description 2
- IBLUVZHBUVLHSL-UHFFFAOYSA-N 3-methylsulfanyl-1H-indol-2-ol Chemical compound CSC1=C(NC2=CC=CC=C12)O IBLUVZHBUVLHSL-UHFFFAOYSA-N 0.000 description 2
- CMSGUKVDXXTJDQ-UHFFFAOYSA-N 4-(2-naphthalen-1-ylethylamino)-4-oxobutanoic acid Chemical compound C1=CC=C2C(CCNC(=O)CCC(=O)O)=CC=CC2=C1 CMSGUKVDXXTJDQ-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 2
- 239000002841 Lewis acid Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 101100030361 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pph-3 gene Proteins 0.000 description 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229920000265 Polyparaphenylene Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical class N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N SnO2 Inorganic materials O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 150000001342 alkaline earth metals Chemical class 0.000 description 2
- 239000003849 aromatic solvent Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- ILAHWRKJUDSMFH-UHFFFAOYSA-N boron tribromide Chemical compound BrB(Br)Br ILAHWRKJUDSMFH-UHFFFAOYSA-N 0.000 description 2
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 2
- DIKBFYAXUHHXCS-UHFFFAOYSA-N bromoform Chemical compound BrC(Br)Br DIKBFYAXUHHXCS-UHFFFAOYSA-N 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000004440 column chromatography Methods 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 150000004696 coordination complex Chemical class 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 235000019439 ethyl acetate Nutrition 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910003472 fullerene Inorganic materials 0.000 description 2
- 150000002391 heterocyclic compounds Chemical class 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical class C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 2
- 150000002790 naphthalenes Chemical class 0.000 description 2
- KFBKRCXOTTUAFS-UHFFFAOYSA-N nickel;triphenylphosphane Chemical compound [Ni].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 KFBKRCXOTTUAFS-UHFFFAOYSA-N 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 150000002923 oximes Chemical class 0.000 description 2
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920000128 polypyrrole Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 150000003216 pyrazines Chemical class 0.000 description 2
- 150000003219 pyrazolines Chemical class 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 150000003252 quinoxalines Chemical class 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000007670 refining Methods 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- HPALAKNZSZLMCH-UHFFFAOYSA-M sodium;chloride;hydrate Chemical class O.[Na+].[Cl-] HPALAKNZSZLMCH-UHFFFAOYSA-M 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- DLYUQMMRRRQYAE-UHFFFAOYSA-N tetraphosphorus decaoxide Chemical compound O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WJKHJLXJJJATHN-UHFFFAOYSA-N triflic anhydride Chemical compound FC(F)(F)S(=O)(=O)OS(=O)(=O)C(F)(F)F WJKHJLXJJJATHN-UHFFFAOYSA-N 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- GNLJBJNONOOOQC-UHFFFAOYSA-N $l^{3}-carbane;magnesium Chemical compound [Mg]C GNLJBJNONOOOQC-UHFFFAOYSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- GETTZEONDQJALK-UHFFFAOYSA-N (trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=CC=C1 GETTZEONDQJALK-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- SEQRDAAUNCRFIT-UHFFFAOYSA-N 1,1-dichlorobutane Chemical compound CCCC(Cl)Cl SEQRDAAUNCRFIT-UHFFFAOYSA-N 0.000 description 1
- KDTWXGUXWNBYGS-UHFFFAOYSA-N 1,2,3,3,4,4-hexamethyl-5H-diazepine Chemical compound CC1(C(N(N(C=CC1)C)C)(C)C)C KDTWXGUXWNBYGS-UHFFFAOYSA-N 0.000 description 1
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- QFMZQPDHXULLKC-UHFFFAOYSA-N 1,2-bis(diphenylphosphino)ethane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 QFMZQPDHXULLKC-UHFFFAOYSA-N 0.000 description 1
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical group NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- LVEYOSJUKRVCCF-UHFFFAOYSA-N 1,3-Bis(diphenylphosphino)propane Substances C=1C=CC=CC=1P(C=1C=CC=CC=1)CCCP(C=1C=CC=CC=1)C1=CC=CC=C1 LVEYOSJUKRVCCF-UHFFFAOYSA-N 0.000 description 1
- AVJBQMXODCVJCJ-UHFFFAOYSA-M 1,3-bis[2,6-di(propan-2-yl)phenyl]imidazol-1-ium;chloride Chemical compound [Cl-].CC(C)C1=CC=CC(C(C)C)=C1N1C=[N+](C=2C(=CC=CC=2C(C)C)C(C)C)C=C1 AVJBQMXODCVJCJ-UHFFFAOYSA-M 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- 150000004057 1,4-benzoquinones Chemical class 0.000 description 1
- KTIJMQNTKJSZJB-UHFFFAOYSA-N 1-(1h-indol-2-yl)-9h-carbazole Chemical compound C12=CC=CC=C2NC2=C1C=CC=C2C1=CC2=CC=CC=C2N1 KTIJMQNTKJSZJB-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- MPPPKRYCTPRNTB-UHFFFAOYSA-N 1-bromobutane Chemical compound CCCCBr MPPPKRYCTPRNTB-UHFFFAOYSA-N 0.000 description 1
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- XHZMLDOBAFNUKC-UHFFFAOYSA-N 1-diphenylphosphanylethyl(diphenyl)phosphane;nickel Chemical compound [Ni].C=1C=CC=CC=1P(C=1C=CC=CC=1)C(C)P(C=1C=CC=CC=1)C1=CC=CC=C1 XHZMLDOBAFNUKC-UHFFFAOYSA-N 0.000 description 1
- PMGGFTVJVZZSFU-UHFFFAOYSA-L 1-methyl-1-[[2-[2-[4-[(1-methylpyrrolidin-1-ium-1-yl)methyl]-1,3-dioxolan-2-yl]ethyl]-1,3-dioxolan-4-yl]methyl]pyrrolidin-1-ium;diiodide Chemical compound [I-].[I-].C1OC(CCC2OC(C[N+]3(C)CCCC3)CO2)OC1C[N+]1(C)CCCC1 PMGGFTVJVZZSFU-UHFFFAOYSA-L 0.000 description 1
- HFZLSTDPRQSZCQ-UHFFFAOYSA-N 1-pyrrolidin-3-ylpyrrolidine Chemical compound C1CCCN1C1CNCC1 HFZLSTDPRQSZCQ-UHFFFAOYSA-N 0.000 description 1
- 238000005160 1H NMR spectroscopy Methods 0.000 description 1
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 1
- URFRJUCWQUIDHW-UHFFFAOYSA-N 2-(1H-inden-1-yl)-1,3-oxazole Chemical compound C1(C=CC2=CC=CC=C12)C=1OC=CN1 URFRJUCWQUIDHW-UHFFFAOYSA-N 0.000 description 1
- SCVJRXQHFJXZFZ-KVQBGUIXSA-N 2-amino-9-[(2r,4s,5r)-4-hydroxy-5-(hydroxymethyl)oxolan-2-yl]-3h-purine-6-thione Chemical compound C1=2NC(N)=NC(=S)C=2N=CN1[C@H]1C[C@H](O)[C@@H](CO)O1 SCVJRXQHFJXZFZ-KVQBGUIXSA-N 0.000 description 1
- NUKUJFJFYCCENW-UHFFFAOYSA-N 2-bromo-3-methylsulfanyl-1H-indole Chemical compound C1=CC=C2C(SC)=C(Br)NC2=C1 NUKUJFJFYCCENW-UHFFFAOYSA-N 0.000 description 1
- XTDKZSUYCXHXJM-UHFFFAOYSA-N 2-methoxyoxane Chemical compound COC1CCCCO1 XTDKZSUYCXHXJM-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- FBWSRAOCSJQZJA-UHFFFAOYSA-N 4-iminonaphthalen-1-one Chemical class C1=CC=C2C(=N)C=CC(=O)C2=C1 FBWSRAOCSJQZJA-UHFFFAOYSA-N 0.000 description 1
- DIVZFUBWFAOMCW-UHFFFAOYSA-N 4-n-(3-methylphenyl)-1-n,1-n-bis[4-(n-(3-methylphenyl)anilino)phenyl]-4-n-phenylbenzene-1,4-diamine Chemical compound CC1=CC=CC(N(C=2C=CC=CC=2)C=2C=CC(=CC=2)N(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C=C(C)C=CC=2)=C1 DIVZFUBWFAOMCW-UHFFFAOYSA-N 0.000 description 1
- 125000004199 4-trifluoromethylphenyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1*)C(F)(F)F 0.000 description 1
- 150000000648 7,7',9,9'-tetra-cis-lycopenes Chemical class 0.000 description 1
- CFNMUZCFSDMZPQ-GHXNOFRVSA-N 7-[(z)-3-methyl-4-(4-methyl-5-oxo-2h-furan-2-yl)but-2-enoxy]chromen-2-one Chemical compound C=1C=C2C=CC(=O)OC2=CC=1OC/C=C(/C)CC1OC(=O)C(C)=C1 CFNMUZCFSDMZPQ-GHXNOFRVSA-N 0.000 description 1
- GHBQLFWTMLRYKN-UHFFFAOYSA-N 9-prop-2-enylcarbazole Chemical compound C1=CC=C2N(CC=C)C3=CC=CC=C3C2=C1 GHBQLFWTMLRYKN-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920003026 Acene Polymers 0.000 description 1
- 241000208140 Acer Species 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 244000291564 Allium cepa Species 0.000 description 1
- 235000002732 Allium cepa var. cepa Nutrition 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910017049 AsF5 Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910015845 BBr3 Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- 241000284156 Clerodendrum quadriloculare Species 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- KWHWFTSHDPJOTG-UHFFFAOYSA-N Deazaflavin Chemical class C1=CC=C2C=C(C(=O)NC(=O)N3)C3=NC2=C1 KWHWFTSHDPJOTG-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- JGFBQFKZKSSODQ-UHFFFAOYSA-N Isothiocyanatocyclopropane Chemical compound S=C=NC1CC1 JGFBQFKZKSSODQ-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- IJHNSHDBIRRJRN-UHFFFAOYSA-N N,N-dimethyl-3-phenyl-3-(2-pyridinyl)-1-propanamine Chemical class C=1C=CC=NC=1C(CCN(C)C)C1=CC=CC=C1 IJHNSHDBIRRJRN-UHFFFAOYSA-N 0.000 description 1
- NFJGVKXEAUZSDV-UHFFFAOYSA-N NN.C(C)(=O)N(C)C Chemical compound NN.C(C)(=O)N(C)C NFJGVKXEAUZSDV-UHFFFAOYSA-N 0.000 description 1
- 229930192627 Naphthoquinone Natural products 0.000 description 1
- 229910021585 Nickel(II) bromide Inorganic materials 0.000 description 1
- ZCQWOFVYLHDMMC-UHFFFAOYSA-N Oxazole Chemical compound C1=COC=N1 ZCQWOFVYLHDMMC-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910021174 PF5 Inorganic materials 0.000 description 1
- 241001494479 Pecora Species 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GCTFWCDSFPMHHS-UHFFFAOYSA-M Tributyltin chloride Chemical compound CCCC[Sn](Cl)(CCCC)CCCC GCTFWCDSFPMHHS-UHFFFAOYSA-M 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- MMARIUHDPUWBAF-UHFFFAOYSA-N [(E)-2-stannylethenyl]stannane Chemical compound [SnH3]\C=C\[SnH3] MMARIUHDPUWBAF-UHFFFAOYSA-N 0.000 description 1
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical compound C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 description 1
- GIXORGPEOVMYKH-UHFFFAOYSA-N [Ni].C1(=CC=CC=C1)P(C1=CC=CC=C1)C(C)(C)P(C1=CC=CC=C1)C1=CC=CC=C1 Chemical compound [Ni].C1(=CC=CC=C1)P(C1=CC=CC=C1)C(C)(C)P(C1=CC=CC=C1)C1=CC=CC=C1 GIXORGPEOVMYKH-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- CMBZEFASPGWDEN-UHFFFAOYSA-N argon;hydrate Chemical compound O.[Ar] CMBZEFASPGWDEN-UHFFFAOYSA-N 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- YBGKQGSCGDNZIB-UHFFFAOYSA-N arsenic pentafluoride Chemical compound F[As](F)(F)(F)F YBGKQGSCGDNZIB-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- QPNTVQDJTQUQFX-UHFFFAOYSA-N benzo[b][1,10]phenanthroline Chemical compound C1=CN=C2C3=NC4=CC=CC=C4C=C3C=CC2=C1 QPNTVQDJTQUQFX-UHFFFAOYSA-N 0.000 description 1
- WJVDOECOMYEGMP-UHFFFAOYSA-N bis[2,3-di(propan-2-yl)phenyl]phosphane Chemical compound CC(C)C1=C(C(=CC=C1)PC2=CC=CC(=C2C(C)C)C(C)C)C(C)C WJVDOECOMYEGMP-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000012267 brine Substances 0.000 description 1
- BRTFVKHPEHKBQF-UHFFFAOYSA-N bromocyclopentane Chemical compound BrC1CCCC1 BRTFVKHPEHKBQF-UHFFFAOYSA-N 0.000 description 1
- 229950005228 bromoform Drugs 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- XZKRXPZXQLARHH-UHFFFAOYSA-N buta-1,3-dienylbenzene Chemical class C=CC=CC1=CC=CC=C1 XZKRXPZXQLARHH-UHFFFAOYSA-N 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LUZSPGQEISANPO-UHFFFAOYSA-N butyltin Chemical compound CCCC[Sn] LUZSPGQEISANPO-UHFFFAOYSA-N 0.000 description 1
- PWLNAUNEAKQYLH-UHFFFAOYSA-N butyric acid octyl ester Natural products CCCCCCCCOC(=O)CCC PWLNAUNEAKQYLH-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 150000001716 carbazoles Chemical class 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 210000003850 cellular structure Anatomy 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- NDTCXABJQNJPCF-UHFFFAOYSA-N chlorocyclopentane Chemical compound ClC1CCCC1 NDTCXABJQNJPCF-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920000547 conjugated polymer Polymers 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- AMFOXYRZVYMNIR-UHFFFAOYSA-N ctk0i0750 Chemical compound C12CC(C3)CC(C45)C1CC1C4CC4CC1C2C53C4 AMFOXYRZVYMNIR-UHFFFAOYSA-N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 239000012024 dehydrating agents Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- FJBFPHVGVWTDIP-UHFFFAOYSA-N dibromomethane Chemical compound BrCBr FJBFPHVGVWTDIP-UHFFFAOYSA-N 0.000 description 1
- YNHIGQDRGKUECZ-UHFFFAOYSA-N dichloropalladium;triphenylphosphanium Chemical compound Cl[Pd]Cl.C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 YNHIGQDRGKUECZ-UHFFFAOYSA-N 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229940043279 diisopropylamine Drugs 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229940093499 ethyl acetate Drugs 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 150000002220 fluorenes Chemical class 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 229910052747 lanthanoid Inorganic materials 0.000 description 1
- 150000002602 lanthanoids Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- DLEDOFVPSDKWEF-UHFFFAOYSA-N lithium butane Chemical compound [Li+].CCC[CH2-] DLEDOFVPSDKWEF-UHFFFAOYSA-N 0.000 description 1
- UBJFKNSINUCEAL-UHFFFAOYSA-N lithium;2-methylpropane Chemical compound [Li+].C[C-](C)C UBJFKNSINUCEAL-UHFFFAOYSA-N 0.000 description 1
- LBAIJNRSTQHDMR-UHFFFAOYSA-N magnesium phthalocyanine Chemical compound [Mg].C12=CC=CC=C2C(N=C2NC(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2N1 LBAIJNRSTQHDMR-UHFFFAOYSA-N 0.000 description 1
- QUXHCILOWRXCEO-UHFFFAOYSA-M magnesium;butane;chloride Chemical compound [Mg+2].[Cl-].CCC[CH2-] QUXHCILOWRXCEO-UHFFFAOYSA-M 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- DVSDBMFJEQPWNO-UHFFFAOYSA-N methyllithium Chemical compound C[Li] DVSDBMFJEQPWNO-UHFFFAOYSA-N 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- UNFUYWDGSFDHCW-UHFFFAOYSA-N monochlorocyclohexane Chemical compound ClC1CCCCC1 UNFUYWDGSFDHCW-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- HVOYZOQVDYHUPF-UHFFFAOYSA-N n,n',n'-trimethylethane-1,2-diamine Chemical compound CNCCN(C)C HVOYZOQVDYHUPF-UHFFFAOYSA-N 0.000 description 1
- OXKUGIFNIUUKAW-UHFFFAOYSA-N n,n-dimethylformamide;hydrazine Chemical compound NN.CN(C)C=O OXKUGIFNIUUKAW-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- UUIQMZJEGPQKFD-UHFFFAOYSA-N n-butyric acid methyl ester Natural products CCCC(=O)OC UUIQMZJEGPQKFD-UHFFFAOYSA-N 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 150000002791 naphthoquinones Chemical class 0.000 description 1
- BMGNSKKZFQMGDH-FDGPNNRMSA-L nickel(2+);(z)-4-oxopent-2-en-2-olate Chemical compound [Ni+2].C\C([O-])=C\C(C)=O.C\C([O-])=C\C(C)=O BMGNSKKZFQMGDH-FDGPNNRMSA-L 0.000 description 1
- MNSHGRXIICSKRQ-UHFFFAOYSA-L nickel(2+);3-oxobutanoate Chemical compound [Ni+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O MNSHGRXIICSKRQ-UHFFFAOYSA-L 0.000 description 1
- CMMVZHRMGVPOKK-UHFFFAOYSA-N nickel;2-pyridin-2-ylpyridine Chemical compound [Ni].N1=CC=CC=C1C1=CC=CC=N1 CMMVZHRMGVPOKK-UHFFFAOYSA-N 0.000 description 1
- UYLRKRLDQUXYKB-UHFFFAOYSA-N nickel;triphenylphosphane Chemical compound [Ni].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 UYLRKRLDQUXYKB-UHFFFAOYSA-N 0.000 description 1
- VOFUROIFQGPCGE-UHFFFAOYSA-N nile red Chemical compound C1=CC=C2C3=NC4=CC=C(N(CC)CC)C=C4OC3=CC(=O)C2=C1 VOFUROIFQGPCGE-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 150000004893 oxazines Chemical class 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 238000007649 pad printing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002964 pentacenes Chemical class 0.000 description 1
- BNIXVQGCZULYKV-UHFFFAOYSA-N pentachloroethane Chemical compound ClC(Cl)C(Cl)(Cl)Cl BNIXVQGCZULYKV-UHFFFAOYSA-N 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 125000005005 perfluorohexyl group Chemical group FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)* 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NHKJPPKXDNZFBJ-UHFFFAOYSA-N phenyllithium Chemical compound [Li]C1=CC=CC=C1 NHKJPPKXDNZFBJ-UHFFFAOYSA-N 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- OBCUTHMOOONNBS-UHFFFAOYSA-N phosphorus pentafluoride Chemical compound FP(F)(F)(F)F OBCUTHMOOONNBS-UHFFFAOYSA-N 0.000 description 1
- 230000001443 photoexcitation Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003227 poly(N-vinyl carbazole) Polymers 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920005596 polymer binder Polymers 0.000 description 1
- 239000002491 polymer binding agent Substances 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 150000004032 porphyrins Chemical class 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- HUAZGNHGCJGYNP-UHFFFAOYSA-N propyl butyrate Chemical compound CCCOC(=O)CCC HUAZGNHGCJGYNP-UHFFFAOYSA-N 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000006862 quantum yield reaction Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 210000003296 saliva Anatomy 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229940042055 systemic antimycotics triazole derivative Drugs 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000013076 target substance Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 150000003518 tetracenes Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000004867 thiadiazoles Chemical class 0.000 description 1
- 150000007979 thiazole derivatives Chemical class 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003577 thiophenes Chemical class 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- VNKOWRBFAJTPLS-UHFFFAOYSA-N tributyl-[(z)-2-tributylstannylethenyl]stannane Chemical group CCCC[Sn](CCCC)(CCCC)\C=C\[Sn](CCCC)(CCCC)CCCC VNKOWRBFAJTPLS-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 125000006617 triphenylamine group Chemical class 0.000 description 1
- BWHDROKFUHTORW-UHFFFAOYSA-N tritert-butylphosphane Chemical compound CC(C)(C)P(C(C)(C)C)C(C)(C)C BWHDROKFUHTORW-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- DNYWZCXLKNTFFI-UHFFFAOYSA-N uranium Chemical compound [U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U] DNYWZCXLKNTFFI-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D495/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having sulfur atoms as the only ring hetero atoms
- C07D495/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having sulfur atoms as the only ring hetero atoms in which the condensed system contains two hetero rings
- C07D495/04—Ortho-condensed systems
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/481—Insulated gate field-effect transistors [IGFETs] characterised by the gate conductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/657—Polycyclic condensed heteroaromatic hydrocarbons
- H10K85/6576—Polycyclic condensed heteroaromatic hydrocarbons comprising only sulfur in the heteroaromatic polycondensed ring system, e.g. benzothiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Thin Film Transistor (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- Photovoltaic Devices (AREA)
- Semiconductor Lasers (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
201247676 六、發明說明: 【發明所屬之技術領域】 本發明係關於二惠[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩 的嶄新製造方法。此外,本發明係關於應用該化合物之有 機電子裝置。 【先前技術】 近年來,對於有機電子裝置之注目乃逐年提高。該特 徵可列舉出能夠採用可撓式構造,可大面積化,並且在裝 置製造程序中可採用便宜且闻速之印刷方法者。代表'性的 裝置可列舉出有機光電轉換元件、有機EL元件、有機電 晶體元件等。有機光電轉換元件,係作爲有機薄膜太陽能 電池、光感測器、影像感測器來進行硏究開發。此外,有 機EL元件,係被廣泛應用在行動電話的顯示器至τν等 ,有機電晶體兀件則作爲可擦性顯不器或便宜的1C來進 行硏究開發》 此等有機電子裝置的開發中,構成該裝置之材料的開 發乃極爲重要。因此,在各領域中已探討爲數眾多的材料 ,但仍未具有充分的性能,目前亦積極地進行對各種裝置 爲有用之材料的開發。藉由使用有機材料,可在不需進行 高溫下的處理之低溫程序中製造,而使得能夠採用之基@ 材料的範圍擴大。其結果可逐漸實現具可撓性、輕量且γ 易損壞之裝置的製作。此外,各裝置的製作步驟中,有時 亦可採用溶解有半導體材料之溶液的塗佈、依據噴墨等m -5- 201247676 進行之印刷等手法,而存在著能夠以低成本來製造大面積 裝置之可能性。再者’有機半導體材料用的化合物有許多 種類可選擇’而令人期待可活用該特性並發現到至目前爲 止所不存在之功能。 將有機化合物用作爲半導體材料之例子,至目前爲止 已探討許多內容’例如,爲人所知者有將應用並五苯、噻 吩或此等之低聚物或聚合物者用作爲具有電洞輸送特性之 材料(參考專利文獻】及專利文獻2)。並五苯爲5個苯 環直線狀地縮合之並苯系的芳香族烴,將此用作爲半導體 材料之場效電晶體’係顯示出可與目前已達實用化之非晶 矽匹敵之電荷的遷移率(載子遷移率)。然而,使用並五 苯之場效電晶體,會因環境引起劣化,穩定性仍存在著問 題。此外’使用噻吩系化合物時,亦存在同樣的問題,目 前均仍無法視爲實用性高之材料。近年來,在大氣中穩定 ,且顯示出高載子遷移率之二萘[2,3-b: 2’,3,-f]噻吩并 [3,2-b]噻吩(DNTT )等已被開發出,並逐漸受到囑目( 參考專利文獻3及非專利文獻1 )。 然而’對於此等化合物,亦存在著來自市場的強烈要 求’亦即’當應用在有機EL等之顯示器用途時,必須具 有更高的載子遷移率,此外,當應用在太陽能電池或光感 測器等之用途時,必須具有可吸收特定的波長等之具特徵 性的光電轉換能。進一步就耐久性之觀點來看,亦要求開 發出高品質及高性能之有機半導體材料。關於將二萘[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩(DNTT)的π系予以延伸之 201247676 化合物,於專利文獻3 并[3,2-b]噻吩(DATT ) 製法,爲了將該化合物 ,惟該製造方法仍稱不上是工業 應用在產業上,必須確立一種可應 用在工業上之該化合物的製造方法。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開200 1 -94 1 07號公幸艮 [專利文獻2]日本特開平6-177380號公報 [專利文獻3] W02008/050726公報 [專利文獻4]日本特開2008-10541號公報 [專利文獻5] KR2008100982公報 [專利文獻6] W02010/098372公報 [專利文獻7]日本特開2009-196975號公報 [專利文獻8] W02009/009790公報 [專利文獻9]日本特開2010-258214號公報 [非專利文獻] [非專利文獻 1] J. Am. Chem. Soc·,Vol. 129,2224-2225 ( 2007 ) 【發明內容】 (發明所欲解決之課題) 本發明之目的在於提供一種具有顯示出優異的載子遷 移率之作爲實用半導體的特性之二蒽[2,3-b: 2’,3’-f]噻吩 201247676 并[3,2-b]噻吩的嶄新製造方法,以及具有藉由該化合物所 形成之半導體層之有機電子裝置。 (用以解決課題之手段) 本發明者們係爲了解決上述課題而進行精心探討,結 果成功地開發出一種可簡便且有效率地合成二蒽[2,3-b : 2’,3’-^噻吩并[3,2-15]噻吩之嶄新製造方法。此外,並發現 到該化合物具有顯示出優異的載子遷移率之作爲實用半導 體的特性。藉此可提供由該化合物所構成之半導體材料, 以及具有藉由該化合物所形成之半導體層之有機電子裝置 ,因而完成本發明。 亦即’本發明是一種方法,爲製造二蒽[2,3-b: 2,,3,· f]噻吩并[3,2-b]噻吩之方法,其特徵係包含: 使式(1 )表示之化合物與二甲基硫醚反應而得到式 (2)表示之化合物之步驟, 使式(2)表示之化合物與式(3)表示之錫化合物反 應而得到式(4 )表示之化合物之步驟,以及 使式(4 )表示之化合物環化而得到二蒽[2,3_b : 2 ’,3 ’ - f ]噻吩并[3,2 - b ]噻吩之步驟; 【化1】201247676 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a novel process for producing bis-[2,3-b: 2',3'-f]thieno[3,2-b]thiophene. Furthermore, the present invention relates to an organic electronic device to which the compound is applied. [Prior Art] In recent years, attention to organic electronic devices has been increasing year by year. This feature can be exemplified by a flexible structure, a large area, and an inexpensive and fast printing method in the device manufacturing process. The organic photoelectric conversion element, the organic EL element, the organic transistor element, and the like are exemplified as the device. The organic photoelectric conversion element is developed as an organic thin film solar cell, a photo sensor, and an image sensor. In addition, the organic EL device is widely used in the display of mobile phones to τν, etc., and the organic transistor device is developed as an erasable device or a cheap 1C. The development of the materials that make up the device is extremely important. Therefore, a large number of materials have been explored in various fields, but sufficient performance has not yet been achieved, and development of materials useful for various devices has been actively carried out. By using an organic material, it can be fabricated in a low temperature process that does not require high temperature processing, and the range of materials that can be used is expanded. As a result, the production of a device that is flexible, lightweight, and susceptible to gamma can be gradually realized. Further, in the production steps of the respective devices, it is also possible to use a coating method in which a semiconductor material is dissolved, a printing method based on inkjet, etc., m-5-201247676, and the like, and it is possible to manufacture a large area at a low cost. The possibility of the device. Further, 'the compound for organic semiconductor materials has many types to choose from' and it is expected that the characteristics can be utilized and found to have a function that has not existed until now. The use of organic compounds as examples of semiconductor materials has been discussed so far. For example, it is known to use pentacene, thiophene or oligomers or polymers thereof as having a hole transport. Material of characteristics (refer to patent document) and patent document 2). Pentacene is an acene-based aromatic hydrocarbon in which five benzene rings are linearly condensed, and the field effect transistor which is used as a semiconductor material exhibits a charge comparable to that of a practical amorphous ruthenium. Mobility (carrier mobility). However, the use of a field-effect transistor of pentacene causes deterioration due to the environment, and stability still has problems. Further, when the thiophene-based compound is used, the same problem also exists, and it is still not considered to be a material having high practicality. In recent years, dinaphthyl [2,3-b: 2',3,-f]thieno[3,2-b]thiophene (DNTT), which is stable in the atmosphere and exhibits high carrier mobility, has been It has been developed and is attracting attention (see Patent Document 3 and Non-Patent Document 1). However, 'there is also a strong demand from these markets for these compounds', that is, when applied to display applications such as organic EL, it is necessary to have higher carrier mobility, and when applied to solar cells or light perception. When it is used for a detector or the like, it must have characteristic photoelectric conversion energy that can absorb a specific wavelength or the like. Further, in terms of durability, it is also required to develop high-quality and high-performance organic semiconductor materials. A compound of 201247676 which extends π of dinaphthyl [2,3-b: 2',3'-f]thieno[3,2-b]thiophene (DNTT), and is disclosed in Patent Document 3 [3, 2 -b] The thiophene (DATT) method, in order to use the compound, but the manufacturing method is still not industrially applicable, and it is necessary to establish a manufacturing method of the compound which can be applied industrially. [Prior Art Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A No. Hei-6-177780 (Patent Document 3) Japanese Patent Publication No. 2008-10541 [Patent Document 5] KR2008100982 publication [Patent Document 6] WO02010/098372 publication [Patent Document 7] JP-A-2009-196975 (Patent Document 8) WO02009/009790 publication [ [Patent Document 9] Japanese Laid-Open Patent Publication No. 2010-258214 [Non-Patent Document] [Non-Patent Document 1] J. Am. Chem. Soc., Vol. 129, 2224-2225 (2007) [Summary of the Invention] Solution to Problem) An object of the present invention is to provide a bismuth [2,3-b: 2',3'-f]thiophene 201247676 having a characteristic of a practical semiconductor which exhibits excellent carrier mobility and [3, 2-b] a novel method of producing thiophene, and an organic electronic device having a semiconductor layer formed by the compound. (Means for Solving the Problem) The present inventors have carefully studied to solve the above problems, and have succeeded in developing a simple and efficient synthesis of diterpene [2,3-b : 2', 3'- ^New method for the production of thieno[3,2-15]thiophene. Further, it has been found that the compound has characteristics as a practical semiconductor which exhibits excellent carrier mobility. Thereby, a semiconductor material composed of the compound and an organic electronic device having a semiconductor layer formed by the compound can be provided, and thus the present invention has been completed. That is, the present invention is a method for producing diterpene [2,3-b: 2,3,·f]thieno[3,2-b]thiophene, which is characterized by comprising: a step of reacting a compound represented by the formula (2) with a dimethyl sulfide to obtain a compound represented by the formula (2), and reacting the compound represented by the formula (2) with a tin compound represented by the formula (3) to obtain a compound represented by the formula (4) And a step of cyclizing the compound represented by the formula (4) to obtain diterpene [2,3_b : 2 ',3 ' - f ]thieno[3,2 - b ]thiophene;
【化2】 ⑴ 201247676 【化3】[Chemical 2] (1) 201247676 [Chemical 3]
【化4】【化4】
(式中,R1、R2表示取代基,Me表示甲基)。 [2] —種有機半導體材料,其係含有藉由Π]之方法所 得之二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩》 [3] 一種半導體裝置製作用油墨,其係含有藉由Π]之 方法所得之二蒽[2,3_b: 2’,3’-f]噻吩并[3,2-b]噻吩。 [4] 一種有機半導體薄膜,其係含有藉由[1]項之方法 所得之二蒽[2,3-b ·· 2’,3’-f]噻吩并[3,2-b]噻吩。 [5] —種有機電子裝置’其係具有[4]之有機半導體薄 膜層。 [6] 如[5]之有機電子裝置’其係光電轉換元件、有機 EL元件、有機半導體雷射兀件、液晶顯示元件或薄膜電 晶體元件。 [7] 如[5]之有機電子裝置’其係太陽能電池。 [8 ]如[5 ]之有機電子裝置,其係光感測器。 [9] 一種如[5]之有機電子裝置的製造方法,其係包含 :將由藉由[1]之方法所得之二蒽[2,3_b: 2,,3,_f]噻吩并 -9- 201247676 [3,2-b]噻吩所構成之半導體層形成於基板上之步驟。 [10] 如[9]之有機電子裝置的製造方法,其中半導體 層是藉由蒸鍍法所形成。 [11] 如[9]之有機電子裝置的製造方法,其係藉由塗 佈[3]之半導體裝置製作用油墨來形成半導體層。 發明之效果: 本發明之製造方法,可高選擇地製造出二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩的中間物,而成爲可良率佳地製 得二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩之工業上爲有用 之製造方法。此外,當將藉由該製法所製造之二蒽[2,3-b :2’,3’_f]唾吩并[3,2-b]噻吩使用在有機電子裝置時,可提 供一種與先前有機半導體材料相比顯示出更優異的性能之 有機電子裝置。 【實施方式】 以下詳細說明本發明。本發明係關於二蒽[2,3-b : 2,3 ’ - f]噻吩并[3,2 - b ]噻吩的製造方法。此外,係關於使用 一蒽[2,3-b: 2’,3’- f]噻吩并[3,2-b]噻吩作爲半導體材料, 形成半導體層而得之有機電子裝置。 以下3羊細說明二蒽[2,3-6:2’,3,-〇噻吩并[3,2-15]噻吩 的製造方法。根據本發明之製造方法,能夠非常有效率地 製造出該化合物。本發明之反應式如下所述。以下依序說 明反應式(1 ) 、( 2 ) 、( 3 )。 -10- 201247676 【化5】(wherein R1 and R2 represent a substituent, and Me represents a methyl group). [2] An organic semiconductor material containing diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene obtained by the method of Π] [3] An ink for producing a semiconductor device, which comprises diterpene [2,3_b: 2',3'-f]thieno[3,2-b]thiophene obtained by the method of Π]. [4] An organic semiconductor thin film comprising diterpene [2,3-b ·· 2',3'-f]thieno[3,2-b]thiophene obtained by the method of [1]. [5] An organic electronic device which has the organic semiconductor thin film layer of [4]. [6] The organic electronic device of [5] is a photoelectric conversion element, an organic EL element, an organic semiconductor laser element, a liquid crystal display element or a thin film transistor element. [7] The organic electronic device as in [5] is a solar cell. [8] An organic electronic device such as [5], which is a light sensor. [9] A method for producing an organic electronic device according to [5], which comprises: a diterpene [2,3_b: 2,,3,_f] thiophene-9-201247676 which is obtained by the method of [1] A step of forming a semiconductor layer composed of [3,2-b]thiophene on a substrate. [10] The method of producing an organic electronic device according to [9], wherein the semiconductor layer is formed by an evaporation method. [11] The method of producing an organic electronic device according to [9], wherein the semiconductor layer is formed by coating the ink for semiconductor device production of [3]. Advantageous Effects of Invention: In the production method of the present invention, an intermediate of dioxonium [2,3-b: 2',3'-f]thieno[3,2-b]thiophene can be produced with high selectivity, and becomes Good industrial yield is a useful manufacturing process for diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene. Further, when diterpene [2,3-b:2',3'-f]pyrano[3,2-b]thiophene produced by the process is used in an organic electronic device, one can be provided with An organic electronic device exhibiting superior performance compared to an organic semiconductor material. [Embodiment] Hereinafter, the present invention will be described in detail. The present invention relates to a process for producing diterpene [2,3-b: 2,3 '-f]thieno[3,2 - b ]thiophene. Further, it relates to an organic electronic device obtained by forming a semiconductor layer using a fluorene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene as a semiconductor material. The following 3 sheep detail the production method of diterpene [2,3-6:2',3,-deutero[3,2-15]thiophene. According to the production method of the present invention, the compound can be produced very efficiently. The reaction formula of the present invention is as follows. The reaction formulas (1), (2), and (3) are explained in the following order. -10- 201247676 【化5】
首先說明二蒽[2,3-b: 2’,3’-f]噻吩并 造中,作爲反應式(1)的起始物質之化会 作爲起始物質之化合物(1 )中,R1 基、三氟甲基、全氟己基、4-三氟甲基苯 經氟原子所取代之芳基的五氟苯基、三氟 氟己基S02基、4-三氟甲基苯基S02基、 原子所取代之芳基的五氟苯基S02基。較 出甲基、三氟甲基S02基。此等化合物 從市售品中取得。 接著詳細說明反應式(1 )。該反應 特徵在於:使用二甲基二硫醚(Me2S2 ) 2位的位置上與氧鍵結之作爲起始物質之/ 位進行SMe化者。爲了開發該反應,本發 以進行因3位的氫脫離所形成之金屬化之 、鹼土類金屬試藥)、反應溶劑、反應溫 -11 - 反應式⑴ 反應式(2) 反應式(3) [3,2-b]噻吩的製 Γ 物(1 )。 較佳可列舉出甲 基、全部氫原子 甲基S02基、全 全部氫原子經氟 :佳的R1可列舉 (1 ),較多均可 爲靜新反應,其 ,高選擇地對在 ί七合物(1 )的3 明者們係探討用 鹼(鹼金屬試藥 度、及操作步驟 201247676 ’而發現到使用二甲基二硫醚高選擇地對化合物(1)的3 位進行SMe化之製造方法。 【化6】First, the diterpene [2,3-b: 2',3'-f] thiophene is described. As the starting material of the reaction formula (1), the compound (1), the R1 group, will be used as the starting material. , pentafluorophenyl, trifluorofluorohexyl S02-based, 4-trifluoromethylphenyl S02-based, atom of aryl group substituted with a fluorine atom, trifluoromethyl, perfluorohexyl, 4-trifluoromethylbenzene The pentafluorophenyl S02 group of the substituted aryl group. More methyl, trifluoromethyl S02 groups. These compounds are obtained from commercial products. Next, the reaction formula (1) will be described in detail. The reaction is characterized in that SME is carried out using the position of the dimethyl disulfide (Me2S2) at the 2-position and the oxygen-bonded starting material. In order to develop this reaction, the present invention is a metallized, alkaline earth metal reagent formed by detachment of hydrogen at the 3-position, a reaction solvent, and a reaction temperature of 11 - reaction formula (1) reaction formula (2) reaction formula (3) [3,2-b] thiophene oxime (1). Preferably, a methyl group, a methyl group of all hydrogen atoms, a group of S02 groups, and all hydrogen atoms are fluorinated: preferably, R1 is exemplified by (1), and many of them may be a static reaction, which is highly selective. The three compounds of the compound (1) were investigated for the SME of the compound (1) at a high selectivity by using a base (alkali metal reagent degree, and operation step 201247676') with high selectivity to dimethyl disulfide. Manufacturing method.
反應式(1) 反應中所使用之驗,較佳可使用鹼金屬試藥之鋰試藥 、鈉試藥、鉀試藥;鹼土類金屬試藥之鎂試藥、鈣試藥。 具體而言’可使用甲基鋰、正丁基鋰、三級丁基鋰、苯基 鋰、氣化甲基鎂、氯化丁基鎂等。特佳爲使用穩定且強力 的鹼之丁基鋰。 鹼的用量’相對於lmol的化合物(1)而言,較佳爲 0.5mol以上lOmo丨以下。將化合物(1 )添加於鹼之反應 溶液中’更可在上述用量的範圍內添加鹼。藉由如此兩階 段地添加鹼,有時可平順地進行化合物(丨)之3位氫原 子的脫離。 此外’本實施形態之化合物的製造方法中,以鋰試藥 的穗定化等爲目的’亦可與鹼金屬試藥一同添加驗性化合 物(添加劑)。鹼性化合物可列舉出N, N, N'-三甲基乙二 胺、二甲基胺、二異丙基胺、嗎啉等。 反應時’較佳係在氮氣取代下、乾燥氮氣流下進行。 使上述化合物(1 )與鹼反應時之反應溫度,較佳位 於-100°C〜30°C的範圍,尤佳爲-30°C〜10t » 反應時’溶劑可使用任意者’較佳爲醚系溶劑、脂肪 族系溶劑、或芳香族系溶劑。此外,此等溶劑較佳係使用 -12- 201247676 使水分乾燥後之溶劑。 反應所使用之醚系溶劑,可列舉出四氫呋喃(THF ) 、二乙醚、二甲氧乙烷、二噁烷等。脂肪族系溶劑可列舉 出正戊烷、正己烷、正庚烷等,芳香族系溶劑可列舉出甲 苯、二甲苯等。 反應所使用之二甲基二硫醚的用量,相對於lmol的 化合物(1)而言,較佳爲〇.5mol以上lOmol以下。 當精製上述所得之化合物(2)時,精製方法並無特 別限定,可因應化合物的物性來使用一般所知的精製方法 。具體而言,可藉由再結晶、管柱層析法等來精製。 接著說明反應式(2)中與化合物(2)反應之化合物 【化7】In the reaction formula (1), it is preferable to use an alkali metal reagent lithium reagent, a sodium reagent, a potassium reagent, an alkaline earth metal reagent magnesium reagent, and a calcium reagent. Specifically, methyllithium, n-butyllithium, tertiary butyllithium, phenyllithium, vaporized methylmagnesium, butylmagnesium chloride or the like can be used. It is particularly preferred to use a stable and strong base butyl lithium. The amount of the base used is preferably 0.5 mol or more and 10 mol% or less based on 1 mol of the compound (1). The compound (1) is added to the reaction solution of the base, and a base may be added in the range of the above amount. By adding the base in such a two-stage manner, the detachment of the hydrogen atom at the 3-position of the compound (丨) can be carried out smoothly. Further, in the method for producing a compound of the present embodiment, it is also possible to add an inspectable compound (additive) together with an alkali metal reagent for the purpose of performing spike determination of a lithium reagent. The basic compound may, for example, be N, N, N'-trimethylethylenediamine, dimethylamine, diisopropylamine or morpholine. The reaction is preferably carried out under a nitrogen purge and under a stream of dry nitrogen. The reaction temperature at the time of reacting the above compound (1) with a base is preferably in the range of -100 ° C to 30 ° C, particularly preferably -30 ° C to 10 t · When the reaction is carried out, 'any solvent can be used' is preferably An ether solvent, an aliphatic solvent, or an aromatic solvent. Further, it is preferred to use a solvent such that -12-201247676 is used to dry the water. Examples of the ether solvent used in the reaction include tetrahydrofuran (THF), diethyl ether, dimethoxyethane, and dioxane. Examples of the aliphatic solvent include n-pentane, n-hexane, and n-heptane. Examples of the aromatic solvent include toluene and xylene. The amount of the dimethyl disulfide to be used in the reaction is preferably 〇5 mol or more and 10 mol or less based on 1 mol of the compound (1). When the compound (2) obtained above is purified, the purification method is not particularly limited, and a generally known purification method can be used depending on the physical properties of the compound. Specifically, it can be purified by recrystallization, column chromatography, or the like. Next, a compound which reacts with the compound (2) in the reaction formula (2) will be described.
作爲錫化合物之式(3 )中,R2表示烷基。烷基可列 舉出直鏈或分枝鏈的烷基,該碳數爲1〜8,較佳爲1〜4, 尤佳爲4。在此,直鏈烷基的具體例,可列舉出甲基、乙 基、正丙基、正丁基、正戊基、正己基等。分枝烷基的具 體例,可列舉出異丙基、異丁基、三級丁基、異戊基、異 己基等之C3-C6的飽和分枝烷基。較佳爲容易取得之正丁 基。 -13- 201247676 以下係顯示由式(3 )表示之錫化合物的具體例,但 本發明並不限於此等。 【化8】In the formula (3) as a tin compound, R2 represents an alkyl group. The alkyl group may be a linear or branched alkyl group having a carbon number of from 1 to 8, preferably from 1 to 4, particularly preferably 4. Here, specific examples of the linear alkyl group include a methyl group, an ethyl group, a n-propyl group, a n-butyl group, a n-pentyl group, and a n-hexyl group. Specific examples of the branched alkyl group include a C3-C6 saturated branched alkyl group such as an isopropyl group, an isobutyl group, a tertiary butyl group, an isopentyl group or an isohexyl group. Preferably, the n-butyl group is easily obtained. -13-201247676 The following shows a specific example of the tin compound represented by the formula (3), but the present invention is not limited thereto. 【化8】
【第1表】 化合物號碼 R2 (3)-01 Me (3)-02 Et (3)-03 n-Pr (3)-04 r-Pr (3)-05 n-Bu (3)-06 hBu (3)-07 t-Bu 藉由反應式(2)所生成之化合物(化合物(4)), 爲反式-1,2-雙(3-甲基硫蒽-2-基)乙烯。 專利文獻3及非專利文獻1所記載之先前的反應中, 用以合成化合物(4)之原料之醛體的合成非常不易進行 ’但本發明之反應式(2)的反應爲嶄新反應,其特徵在 於:於3位具有MeS基之2分子的化合物(2),在2位 的氧原子之脫離的同時,亦與化合物(3 )反應,而能夠 闻選擇地製造化合物(4)。一般而言,反應式(2)的反 應係採用P d系化合物作爲催化劑,但p d容易受到硫化物 的侵襲’有時會立即失去活性。因此,本發明者們係探討 如上述般有效地使化合物(2 )的氧脫離,以及與化合物 (3 )反應之催化劑、反應溶劑、反應溫度、及操作步驟 ’而發現到能夠從2分子的化合物(2)高選擇且高良率 -14- 201247676 地得到化合物(4 )之製造方法。 在此’化合物(2 )的R1,在進行反應式(2 )的反應 時,可因應必要轉換爲最適取代基來使用。 進行反應式(2)的反應時之化合物(2)與化合物( 3 )之混合比,相對於1 mol的化合物(3 )而言,化合物 (2)較佳爲1.8mol以上2.5mol以下。尤佳爲1.95mol以 上2.10mol以下,更佳爲i_95mol以上2.05mol以下。 反應所使用之催化劑,只要是Pd或Ni系催化劑均可 使用,只要至少1種催化劑,含有選自由三-三級丁基膦 '三金剛烷膦、1,3-雙(2,4,6-三甲基苯基)氯化咪唑鹽、 1,3-雙(2,6 -二異丙基苯基)氯化咪唑鹽、13-二金剛烷氯 化咪唑鹽、或此等之混合物;金屬P d、P d / C (含水或非 含水)、二氯化雙(三苯基膦)鈀(Pd(PPh3)2Cl2 )、乙 酸鈀(Π) (Pd(OAc)2)、四(三苯基膦)鈀(pd(pph3)4 )、四(三苯基膦)鎳(Ni(PPh3)4)、鎳(II)乙醯丙酮 酸Ni(acac)2、二氯化(2,2'-雙吡啶)鎳、二溴化雙(三苯 基膦)鎳(Ni(PPh3)2Br2 )、二氯化雙(二苯基膦)丙烷 鎳(Ni((dppp)Cl2 )、二氯化雙(二苯基膦)乙烷鎳( Ni((dppe)Ch、或此等之混合物所組成之群組之具有配位 基的鎳及鈀催化劑之至少1種化合物即可。較佳的催化劑 ,可列舉出Pd/ C (含水或非含水)、Pd(PPh3)2Cl2、 Pd(PPh3)4,尤佳可列舉出 Pd(PPh3)2Cl2、Pd(PPh3)4。 催化劑的用量,相對於1 mol的化合物(2 )而言,較 佳爲O.OOlmol以上0.5mol以下。可再添加有化合物(2) -15- 201247676 與化合物(3 )與催化劑之反應溶液中,在上述用量的範 圍內進一步添加催化劑。如此,藉由將催化劑分爲2階段 以上添加,有時可抑制因催化劑的失去活性所導致之反應 率的降低。 使化合物(2)與化合物(3)反應時之反應溫度,通 常在-10°C〜200°C中進行。尤佳爲4〇°C〜180°C,更佳爲80 〇C 〜1 5 0 t:。 反應時,較佳係在氮氣取代下或氬氣取代下等之非活 性氣體環境下,或是乾燥氮氣流下等來進行。 反應時,可使用溶劑或不使用。只要是一般有機合成 中所使用者均可使用。例如可列舉出氯苯、鄰二氯苯、溴 苯、硝基苯、甲苯、二甲苯等之芳香族化合物,或是正己 烷、正庚烷、正戊烷等之飽和脂肪族烴;環己烷、環庚烷 、環戊烷等之脂環型烴;溴化正丙基、氯化正丁基、溴化 正丁基、二氯甲烷、二溴甲烷、二氯丙烷、二溴丙烷、二 氯乙烷 '二溴乙烷、二氯丙烷、二溴丙烷、二氯丁烷、三 氯甲烷、三溴甲烷、四氯化碳、四溴化碳、三氯乙烷、四 氯乙烷、五氯乙烷等之飽和脂肪族鹵化烴;氯環己烷、氯 環戊烷、溴環戊烷等之鹵化環狀烴;乙酸乙酯、乙酸丙酯 、乙酸丁酯、丙酸甲酯、丙酸乙酯、丙酸丙酯、丙酸丁酯 、丁酸甲酯、丁酸乙酯、丁酸丙酯、丁酸丁酯等之酯;丙 酮、丁酮、甲基異丁酮等之酮。此等溶劑可單獨使用或混 合2種以上使用。 此外’使用沸點1 〇〇 °c以上之高沸點溶劑的至少1種 -16- 201247676 作爲反應溶劑時,可大幅提升反應速度或增加反應的選擇 性,故較佳。 沸點1 0 0 °C以上的高沸點溶劑,較佳爲醯胺類(N_甲 基-2-吡咯啶酮(以下略稱爲NMP) 、Ν,Ν-二甲基甲醯胺 (以下略稱爲DMF ) 、Ν,Ν-二甲基乙醯胺(以下略稱爲 DMAc);二醇類(乙二醇、丙二醇、聚乙二醇):及亞 颯類(二甲基亞颯(以下略稱爲DMSO)),尤佳爲N -甲 基-2-吡咯啶酮、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺 〇 精製所得之化合物(4 )時,精製方法並無特別限定 ’可因應化合物(4)的物性來使用一般所知的精製方法 。具體而言,可藉由再結晶、管柱層析法等來精製。 然後’藉由反應式(3 )的反應,從化合物(4 )中衍 生出下列二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩。 【化9】[Table 1] Compound No. R2 (3)-01 Me (3)-02 Et (3)-03 n-Pr (3)-04 r-Pr (3)-05 n-Bu (3)-06 hBu (3)-07 t-Bu The compound (compound (4)) produced by the reaction formula (2) is trans-1,2-bis(3-methylthioindol-2-yl)ethylene. In the prior reaction described in Patent Document 3 and Non-Patent Document 1, the synthesis of the aldehyde compound for synthesizing the raw material of the compound (4) is very difficult to carry out. However, the reaction of the reaction formula (2) of the present invention is a novel reaction. The compound (2) having two molecules having a MeS group at the 3-position is reacted with the compound (3) at the same time as the oxygen atom at the 2-position, and the compound (4) can be selectively produced. In general, the reaction of the reaction formula (2) employs a P d compound as a catalyst, but p d is easily attacked by sulfides, and sometimes it loses its activity immediately. Therefore, the inventors of the present invention have found that the oxygen of the compound (2) can be effectively removed as described above, and the catalyst, the reaction solvent, the reaction temperature, and the operation step of reacting with the compound (3) can be found to be capable of The compound (2) is highly selected and has a high yield of 14 to 201247676 to obtain a method for producing the compound (4). Here, R1 of the compound (2) can be used in the reaction of the reaction formula (2), if necessary, to be converted into an optimum substituent. The mixing ratio of the compound (2) to the compound (3) in the reaction of the reaction formula (2) is preferably 1.8 mol or more and 2.5 mol or less based on 1 mol of the compound (3). It is particularly preferably 1.95 mol or more and 2.10 mol or less, more preferably i_95 mol or more and 2.05 mol or less. The catalyst to be used in the reaction may be any Pd or Ni-based catalyst, and may contain at least one catalyst selected from the group consisting of tri-tertiary butylphosphine 'triamantane phosphine and 1,3-double (2, 4, 6). a trimethylphenyl)imidazolium chloride salt, a 1,3-bis(2,6-diisopropylphenyl)imidazolium chloride salt, a 13-diadamantane chloride imidazolium salt, or a mixture thereof; Metal P d, P d / C (aqueous or non-aqueous), bis(triphenylphosphine)palladium dichloride (Pd(PPh3)2Cl2), palladium acetate (Pd(OAc)2), tetra (three) Phenylphosphine)palladium (pd(pph3)4), tetrakis(triphenylphosphine)nickel (Ni(PPh3)4), nickel(II) acetoacetate Ni(acac)2, dichlorination (2,2 '-bipyridine) nickel, bis(triphenylphosphine)nickel dibromide (Ni(PPh3)2Br2), bis(diphenylphosphino)propane nickel (Ni((dppp)Cl2), dichlorination A bis(diphenylphosphino) ethane nickel (Ni((dppe)Ch) or at least one compound of a nickel and palladium catalyst having a ligand composed of a mixture of such a mixture. Preferred catalyst For example, Pd/C (aqueous or non-aqueous), Pd(PPh3)2Cl2, Pd(PPh3)4 can be cited, and it is particularly preferable to cite Pd(PPh3)2Cl2, Pd(PPh3)4. The amount of the catalyst is preferably from 0.01 mol to 0.5 mol per mol of the compound (2). Further compound (2) -15- may be added. 201247676 In the reaction solution of the compound (3) and the catalyst, a catalyst is further added within the above-mentioned amount. Thus, by adding the catalyst to two or more stages, the reaction rate due to the loss of activity of the catalyst may be suppressed. The reaction temperature at the time of reacting the compound (2) with the compound (3) is usually carried out at -10 ° C to 200 ° C. More preferably 4 ° C to 180 ° C, more preferably 80 〇 C ~1 50 t: When the reaction is carried out, it is preferably carried out under an inert gas atmosphere such as nitrogen substitution or argon substitution, or under a dry nitrogen stream, etc. In the reaction, a solvent may be used or not used. It can be used by a user in general organic synthesis, and examples thereof include aromatic compounds such as chlorobenzene, o-dichlorobenzene, bromobenzene, nitrobenzene, toluene, and xylene, or n-hexane and n-heptane. Saturated aliphatic hydrocarbon such as n-pentane; cyclohexane, cycloheptane An alicyclic hydrocarbon such as cyclopentane; n-propyl bromide, n-butyl chloride, n-butyl bromide, dichloromethane, dibromomethane, dichloropropane, dibromopropane, dichloroethane Ethyl bromide, dichloropropane, dibromopropane, dichlorobutane, chloroform, tribromomethane, carbon tetrachloride, carbon tetrabromide, trichloroethane, tetrachloroethane, pentachloroethane, etc. a saturated aliphatic halogenated hydrocarbon; a halogenated cyclic hydrocarbon such as chlorocyclohexane, chlorocyclopentane or bromocyclopentane; ethyl acetate, propyl acetate, butyl acetate, methyl propionate, ethyl propionate, and C An ester of propyl acrylate, butyl propionate, methyl butyrate, ethyl butyrate, propyl butyrate, butyl butyrate or the like; a ketone of acetone, methyl ethyl ketone or methyl isobutyl ketone. These solvents may be used singly or in combination of two or more. Further, when at least one of -16 to 201247676, which uses a high boiling point solvent having a boiling point of 1 〇〇 ° C or more, is used as a reaction solvent, the reaction rate can be greatly increased or the selectivity of the reaction can be increased, which is preferable. A high boiling point solvent having a boiling point of 100 ° C or higher is preferably a guanamine (N-methyl-2-pyrrolidone (hereinafter abbreviated as NMP), hydrazine, hydrazine-dimethylformamide (hereinafter abbreviated) Known as DMF), hydrazine, hydrazine-dimethylacetamide (hereinafter abbreviated as DMAc); glycols (ethylene glycol, propylene glycol, polyethylene glycol): and fluorenes (dimethyl hydrazine ( Hereinafter, abbreviated as DMSO)), particularly preferably N-methyl-2-pyrrolidone, N,N-dimethylformamide, and N,N-dimethylacetamide oxime (4) In the case of the purification method, it is not particularly limited to use a general-known purification method depending on the physical properties of the compound (4). Specifically, it can be purified by recrystallization, column chromatography, or the like. In the reaction of the reaction formula (3), the following diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene is derived from the compound (4).
本發明之薄膜,是指由本發明之二蒽[2,3-b : 2’,3’-f] 噻吩并[3,2-b]噻吩或含有其之組成物所形成之薄膜。薄膜 的膜厚’因該用途而有所不同,通常爲O.lnm〜100//m, 絞佳爲 尤佳爲 lnm~20//m。 本發明之薄膜的形成方法,一般可列舉出真空程序之 -17- 201247676 電阻加熱蒸鍍法、電子束蒸鏟法、濺鍍法、分子層合法等 ’或是溶液程序之旋轉塗佈法、液滴塗佈法、浸泡塗佈法 噴霧法、快乾印刷、樹脂凸版印刷等之凸版印刷法、平 版印刷法、乾式平版印刷法、墊印刷法、石版印刷法等之 平版印刷法、凹版印刷法等之凹版印刷法、絲網版印刷法 、轉印版印刷法、微影印刷法等之孔版印刷法、噴墨印刷 法、微接觸印刷法等’或是組合複數種此等手法之方法。 通常’較佳爲真空程序之電阻加熱蒸鍍法或是溶液程序之 旋轉塗佈法、浸泡塗佈法、噴墨法、網版印刷法、凸版印 刷法等。此外,各有機電子裝置中所需之製膜方法亦有所 不同’將在各裝置的項目中說明。 本發明之有機電子裝置,爲含有前述二蒽[2,3-b : 2’,3’_幻噻吩并[3,2-1)]唾吩作爲電子裝置用途的電子材料者 。有機電子裝置,例如可列舉出薄膜電晶體和有機EL元 件、液晶顯示元件、光電轉換元件、有機半導體雷射元件 等。接著詳細說明此等元件。 首先詳細說明薄膜電晶體。 薄膜電晶體,接觸於半導體具有2個電極(源極電極 及汲極電極),並藉由施加於稱爲閘極電極之另一個電極 之電壓,來控制該電極間所流通之電流。 一般而言,薄膜電晶體元件,較多是採用以絕緣膜使 鬧極電極絕緣之構造(Metal-Insulator-Semiconductor ; MIS構造)。使用金屬氧化膜作爲絕緣膜者,稱爲MOS 構造。其他亦有經由肯特基能障來形成閘極電極之構造, -18- 201247676 亦即MES構造,但在使用有機半導體材料之薄膜電晶體 中’較多是採用MIS構造。 以下係使用圖面來更詳細說明本發明之有機系的薄膜 電晶體,但本發明並不限於此等構造。 第1圖係顯示本發明之薄膜電晶體(元件)的數個型 態例。各例中,1表示源極電極,2表示半導體層,3表示 汲極電極,4表示絕緣體層,5表示閘極電極,6表示基板 。各層和電極的配置,可因應元件的用途來適當地選擇。 A〜D,由於電流在與基板並行之方向上流通,故稱爲橫型 電晶體。A稱爲底接觸構造,B稱爲頂接觸構造。此外, C係在半導體上設置源極及汲極電極、絕緣體層,然後於 其上方形成閘極電極,而稱爲底閘極構造。D係稱爲頂及 底接觸型電晶體之構造。E爲具有縱形構造之電晶體,亦 即爲靜電感應電晶體(SIT :靜電感應電晶體)之示意圖 。該SIT,由於電流的流動呈平面狀地擴散,故可一次使 大量的載子遷移。此外,由於源極電極與汲極電極縱向地 配置,故可縮小電極間距離而使反應達到高速。因此,可 較佳地適用在進行伴隨著大電流之高速的開關等用途。第 1圖中的E,雖未記載基板,但通常在第1圖中的E之由 1及3表示之源極電極及汲極電極的外側,設置有基板^ 接著說明各型態例中的各構成要素。 基板6,必須在不會使形成於其上之各層剝離下可予 以保持。例如可使用樹脂板或薄膜、紙、玻璃、石英、陶 瓷等之絕緣性材料;在金屬或合金等導電性基板上藉由塗 -19- 201247676 佈等而形成絕緣層者;由樹脂與無機材料等之各種組合所 構成之材料等。可使用之樹脂薄膜,例如可列舉出聚對苯 二甲酸乙二酯、聚萘二甲酸乙二酯、聚醚颯、聚醯胺、聚 醯亞胺、聚碳酸酯、纖維素三乙酸酯、聚醚醯亞胺等。使 用樹脂薄膜或紙時,可使元件具有可撓性,變得柔軟且達 輕量化’而提升實用性。基板的厚度通常爲1 # m〜l〇mm ,較佳爲 5/zm~5mme 源極電極1、汲極電極3、閘極電極5係使用具有導 電性之材料。例如可使用鉑、金、銀、鋁、鉻、鎢、鉬、 鎳、鈷、銅、鐵、鉛、錫、鈦 '銦、鈀、鉬、鎂、鈣、鋇 、鋰、鉀、鈉等之金屬及含有此等之合金;In〇2、Zn〇2、 Sn〇2、ITO等之導電性氧化物;聚苯胺、聚吡咯、聚噻吩 、聚乙炔、聚對伸苯、伸乙烯、聚二乙炔等之導電性高分 子化合物;矽、鍺、硼化鎵等之半導體;碳黑、富勒烯、 碳奈米管、石墨等之碳材料等。此外,亦可對導電性高分 子化合物或半導體進行慘雜。此時的摻雜劑,例如可列舉 出鹽酸、硫酸等之無機酸:磺酸等之具有酸性官能基之有 機酸;PFS、AsFs、FeCl3等之路易斯酸;碘等之鹵素原子 :鋰、鈉、鉀等之金屬原子等。硼、磷、砷等,亦多使用 作爲矽等之無機半導體用摻雜劑。 此外’亦可採用使碳黑或金屬粒子等分散於上述摻雜 劑之導電性複合材料^ 此外’源極與汲極電極間的距離(通道長度)爲決定 元件特性之重要的因素。該通道長度,通常爲O.UOOym -20- 201247676 ,較佳爲O.5~100ym。通道長度愈短,雖可增加可擷取 之電流量,但反而會產生漏電流等,所以適當的通道長度 乃爲必要。源極與汲極電極間的寬度(通道寬度),通常 爲10〜10000"m,較佳爲100〜5000νιη。此外,該通道寬 度,藉由將電極的構造構成爲梳型構造等,可形成更長的 通道寬度,可因應必要的電流量或元件的構造等,來設爲 適當的長度。 接著說明源極及汲極電極的各構造(形式)。源極及 汲極電極的構造可互爲相同或不同。電極的長度可與前述 通道寬度相同。電極的寬度並無特別規定,爲了在使電特 性達到穩定化之範圍內縮小元件的面積,較佳爲較短者。 電極的寬度通常爲0.1〜1000//m,較佳爲0.5〜100/zm。電 極的厚度通常爲0.1〜lOOOnm,較佳爲l~5 00nm,尤佳爲 5〜200nm。各電極1、3及5係連結有配線,配線亦可藉由 與電極相同材料來製作。 絕緣體層4係使用具有絕緣性之材料。例如可使用聚 對二甲苯、聚丙烯酸酯、聚甲基丙烯酸甲酯、聚苯乙烯、 聚乙烯酚、聚醯胺、聚醯亞胺、聚碳酸酯、聚酯、聚乙烯 醇、聚乙酸乙烯酯、聚胺基甲酸酯、聚楓、環氧樹脂、酚 樹脂、氟系樹脂等之聚合物及組合此等之共聚物;二氧化 矽、氧化鋁、氧化鈦、氧化钽等之金屬氧化物;SrTi03、 BaTi〇3等之強介電性金屬氧化物;氮化矽、氮化鋁等之氮 化物;硫化物;氟化物等之衍生物;或是使此等電介質的 粒子分散之聚合物等。絕緣體層4的膜厚,因材料而有所 -21 - 201247676 不同通常爲 0.1nm~100//m,較佳爲 0.5nm~50/im,尤佳 爲 1 nm〜1 0 /z m。 半導體層2的材料,係使用本發明之二蒽[2,3-b : 2’,3’4]噻吩并[3,2-13]噻吩或含有其之組成物。可使用前述 方法,將此材料形成爲薄膜作爲半導體層2。此時,較佳 係將單一的二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩用作爲 有機半導體材料,但爲了改善薄膜電晶體的特性或賦予其 他特性’可因應必要混合其他有機半導體材料或各種添加 劑。此等可列舉出在蒸鍍程序中與其他有機半導體材料或 摻雜劑共蒸鍍之情形,或是與在溶液程序中所使用之溶劑 、分散劑、界面活性劑、平坦劑、表面張力調整劑等混合 而構成組成物之情形爲例。此外,半導體層2可由複數層 所構成。 上述添加劑,當以有機半導體材料的總量爲1時,通 常在0.01〜1〇重量%,較佳爲0_05〜5重量%,尤佳爲0.1〜3 重量%之範圍內添加。當使用前述半導體組成物作爲有機 半導體材料時,並不限於此。 此外,半導體層雖可由複數層所構成,但尤佳是單層 構造。半導體層2的膜厚,在不失去必要功能之範圍內愈 薄愈佳β在第1圖所示之A、B及D所示之橫型薄膜電晶 體中,當膜厚較厚時,漏電流會增加,所以在既定値以上 的膜厚時,元件的特性不與膜厚相依。用以顯現出必要功 能之半導體層的膜厚,通常爲lnm-10/zm,較佳爲5nm〜5 "m,尤佳爲l〇nm〜3/zm。 -22- 201247676 本發明之薄膜電晶體中,例如在基板層與絕緣膜層或 絕緣膜層與半導體層之間、或是在元件的外面,可因應必 要而設置其他層。例如,在有機半導體層上直接或夾介其 他層而形成保護層時,可降低溼氣等之外部氣體的影響, 此外,亦具有可提高元件的導通/關閉比等之使電特性達 到穩定化之優點。 保護層的材料並無特別限定,較佳例如可使用由環氧 樹脂、聚甲基丙烯酸甲酯等之丙烯酸樹脂、聚胺基甲酸酯 、聚醯亞胺、聚乙烯醇、氟樹脂、聚烯烴等之各種樹脂所 構成之膜:由氧化矽、氧化鋁、氮化矽等之無機氧化膜、 及氮化膜等之電介質所構成之膜等,尤佳爲氧或水分的穿 透率或吸水率小之樹脂(聚合物)。亦可使用近年來開發 作爲有機EL顯示器用之保護材料。保護層的膜厚,可因 應該目的來選擇任意膜厚,通常爲l〇〇nm〜1mm。 此外,藉由在層合有有機半導體層之基板或絕緣體層 上等預先進行表面處理,可提升作爲薄膜電晶體元件的特 性。例如,藉由調整基板表面的親水性/疏水性的程度, 可改良成膜於其上之膜的膜質。尤其是有機半導體材料的 待性,會受到分子的配向等之膜的狀態之影響而大幅變化 。因此,藉由對基板等進行表面處理,可控制基板等與之 後成膜的有機半導體層之界面部分的分子配向,此外可減 少基板或絕緣體層上之捕集部位,藉此可改良載子遷移率 等特性。 所謂捕集部位,是指存在於未處理基板之例如羥基般 -23- 201247676 的官能基,當存在此般官能基時,電子會被該官能基所拉 近,結果導致載子遷移率的降低。因此,減少捕集部位者 ,較多情況下對於載子遷移率等之特性改良者爲有效。 用於上述特性改良之基板處理,例如可列舉出依據六 甲基二矽氮烷、環己烯、辛基三氯矽烷、十八烷基三氯矽 烷等所進行之疏水化處理;依據鹽酸或硫酸、乙酸等所進 行之酸處理;依據氫氧化鈉、氫氧化鉀、氫氧化鈣、氨水 等所進行之鹼處理:臭氧處理:氟化處理;氧化氬等之電 漿處理;Langmuir-Blodgett膜的形成處理;其他絕緣體或 半導體之薄膜的形成處理;機械處理;電暈放電等之電處 理:此外,應用纖維等之磨刷處理等。 此等型態中,設置例如基板層與絕緣膜層或絕緣膜層 與有機半導體層等各層之方法,例如可適當地採用真空蒸 鍍法、濺鍍法、塗佈法、印刷法、溶膠凝膠法等。 接著以第1圖的型態例A所示之底接觸型薄膜電晶體 爲例’根據第2圖,來說明本發明之薄膜電晶體元件的製 造方法。該製造方法,亦可同樣地適用於前述其他型態的 薄膜電晶體等。 (薄膜電晶體的基板及基板處理) 本發明之薄膜電晶體,係在基板6上設置必要的各種 層和電極而製造出(參照第2圖(1 ))。基板可使用上 述所說明者。亦可對該基板上進行前述表面處理等。基板 6的厚度,在不妨礙必要功能之範圍內愈薄愈佳。雖因材 -24- 201247676 料而有所不同,但通常爲lem〜10mm,較佳爲5/zm 。此外,可因應必要使基板具備有電極的功能。 (關於閘極電極的形成) 於基板6上形成閘極電極5(參照第2圖(2)) 極材料可使用上述所說明者。使電極膜成膜之方法, 用各種方法,例如可採用真空蒸鍍法、濺鍍法、塗佈 熱轉印法、印刷法、溶膠凝膠法等。成膜時或成膜後 佳係因應必要進行圖型形成以成爲期望的形狀。圖型 的方法亦可使用各種方法,例如可列舉出組合光阻的 形成與蝕刻之微影技術等。此外,亦可應用噴墨印刷 版印刷、平版印刷、凸版印刷法等印刷法,微接觸印 等之可撓性微影技術之手法,以及組合複數種此等手 手法,來進行圖型形成。閘極電極5的膜厚,雖因材 有所不同,但通常爲O.lnm〜10/zm,較佳爲0.5nm~ ,尤佳爲lnm〜3 /zm。此外,當兼具閘極電極與基板 可較上述膜厚更大。 (關於絕緣體層的形成) 於閘極電極5上形成絕緣體層4 (參照第2圖(: 。絕緣體材料可使用上述所說明者等。形成絕緣體層 ,可使用各種方法,例如可列舉出旋轉塗佈法、噴霧 法、浸泡塗佈法、壓鑄法、棒塗佈法、刮刀塗佈法等 佈法,網版印刷、平版印刷、噴墨等印刷法,真空蒸 〜5mm 。電 可使 法、 ,較 形成 圖型 、網 刷法 法之 料而 S β m 時, )) 4時 塗佈 之塗 鍍法 -25- 201247676 、分子束磊晶成長法、離子集束法、離子蒸鍍法、濺鍍法 、大氣壓電漿法、CVD法等之乾式程序法等。其他亦可採 用溶膠凝膠法,或是如鋁上的氧皮鋁膜或矽上的二氧化矽 般,於金屬上形成氧化物膜之方法等。在絕緣體層與半導 體層所接觸之部分上,於兩層的界面上,爲了使構成半導 體之分子,例如本發明之二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩的分子良好地配向,可對絕緣體層進行既定的表面 處理。表面處理的手法,可採用與基板的表面處理爲相同 者。絕緣體層4的膜厚,在不損及該功能之範圍內愈薄愈 佳。通常爲 0.1nm~100//m,較佳爲 0.5nm〜50/zm,尤佳 爲 5nm~10//m。 (源極電極及汲極電極的形成) 源極電極1及汲極電極3的形成方法等,可依據閘極 電極5之情形來形成(參照第2圖(4 ))。此外,爲了 降低與有機半導體層之接觸電阻,可使用各種添加劑等。 (關於有機半導體層的形成) 有機半導體材料,如上述所說明般,係使用本發明之 二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩或其組成物。使有 機半導體層成膜時,可使用各種方法。可大致區分爲濺鍍 法、CVD法、分子束磊晶成長法、真空蒸鍍法等之真空程 序中的形成方法;以及浸泡塗佈法、壓鑄塗佈法、輥塗佈 法、棒塗佈法、旋轉塗佈法等之塗佈法;噴墨法、網版印 -26- 201247676 刷法、平版印刷法、微接觸印刷法等之溶液程序的形成方 法。 將本發明之二蒽[2,3-b : 2’,3,-f]噻吩并[3,2-b]噻吩用 作爲半導體材料來形成成爲半導體層之有機薄膜時,較佳 是將藉由真空程序所成膜之有機薄膜形成作爲半導體層之 方法’更佳爲真空蒸鑛法。亦可依據溶液程序來進行成膜 ,亦可採用成本低之印刷方法。 接著說明藉由真空程序使有機半導體材料成膜而得有 機半導體層之方法。較佳係採用:在坩堝或金屬皿中,於 真空下加熱前述有機半導體材料,使蒸發後的有機半導體 材料附著(蒸鍍)於基板(絕緣體層、源極電極及汲極電 極的暴露部)之方法,亦即真空蒸鍍法。此時,真空度通 常爲l.OxlOdpa以下,較佳爲l.〇xi〇-3pa以下。此外,有 時因蒸鍍時的基板溫度之不同,會使有機半導體膜及薄膜 電晶體的特性產生變化,較佳需細心地選擇基板溫度。蒸 鍵時的基板溫度,通常爲0〜20(TC,較佳爲10〜15(TC,尤 佳爲 15~120°C,更佳爲 25~100°C。 此外,蒸鏟速度通常爲 0.001〜10nm /秒,較佳爲 〇·〇1〜lnm /秒》由有機半導體材料所形成之有機半導體層 的膜厚’通常爲lnm~10/zm,較佳爲5nm〜5//m,尤佳爲 lOnm〜3 // m 〇 亦可採用使加速後的氬等之離子與材料靶材碰撞,將 材料原子撞擊出而附著於基板之濺鍍法,來取代將用以形 成有機半導體層之有機半導體材料加熱使其蒸發而附著於 -27- 201247676 基板之蒸鍍方法。 接著說明藉由溶液程序來成膜而得到有機半導體層之 方法。可採用:將本發明之二蒽[2,3-b : 2’,3,-f]噻吩并 [3,2-b]噻吩溶解或分散於溶劑等,並因應必要加入其他低 分子化合物或高分子化合物、摻雜劑、分散劑、界面活性 劑、平坦劑、表面張力調整劑等添加劑而構成組成物,將 該組成物調製作爲半導體裝置製作用油墨,並塗佈於基板 (絕緣體層、源極電極及汲極電極的暴露部)。塗佈的方 法,可採用壓鑄法、旋轉塗佈法、浸泡塗佈法、刮刀塗佈 法、線棒塗佈法、噴霧塗佈法等之塗佈法,噴墨印刷、網 版印刷、平版印刷、凸版印刷等印刷法,微接觸印刷法等 之可撓性微影技術之手法等,以及組合複數種此等手法之 手法。 再者,與塗佈方法類似之方法,亦可採用:將上述油 墨滴在水面上所製作之有機半導體層的單分子膜移至基板 而層合之Langmuir-Blodgett法,或是藉由兩片基板夾持 液晶或溶融狀態的材料,並以毛細現象將其導入於基板間 之方法等。製膜時之基板或組成物的溫度等之環境亦爲重 要,由於電晶體的特性有時因基板或組成物的溫度而產生 •變化,故需細心地選擇基板或組成物的溫度。蒸鍍時的基 板溫度,通常爲〇〜200°c ’較佳爲10〜120°C,尤佳爲15〜100 t。尤其與所使用之組成物中的溶劑等大幅地相依’故需 特別注意。 藉由該方法所製作之有機半導體層的膜厚’在不損及 -28- 201247676 該功能之範圍內愈薄愈佳。膜厚較厚時,會有漏 之疑慮。有機半導體層的膜厚,通常爲lnm〜10;/ 爲 5nm~5vm,尤佳爲 10nm〜3/zm。 如此形成之有機半導體層(參照第2圖(5 藉由後續處理來進一步改善該特性。例如,就考 熱處理可緩和成膜時所產生之膜中的應變,減少 並控制膜中的排列配置及配向等之理由來看,可 半導體特性的提升和穩定。於本發明之薄膜電晶 時,進行該熱處理者,對於提升特性乃爲有效。 是在形成有機半導體層後,藉由加熱基板來進行 的處理溫度並無特別限制,通常爲室溫〜1 5 0 °C 40~120°C,更佳爲45~100°C。此時之熱處理時 別限制^通常爲1分鐘~24小時,較佳爲2分鐘-此時之氣體環境,可在大氣中,亦可在氮氣或氬 活性氣體環境下。 此外,其他有機半導體層的後續處理方法, 與氧或氫等之氧化性或還原性氣體或是氧化性或 體等進行處理,而引發由氧化或還原所導致之特 此做法較多是例如以膜中之載體密度的增加或減 而應用。 此外,在稱爲摻雜之手法中,可藉由將微量 子團、分子、高分子添加於有機半導體層來改變 體層的特性。例如可摻雜氧、氫、鹽酸、硫酸、 酸;PF5、AsF5、FeCl3等之路易斯酸;碘等之鹵 電流增大 :m,較佳 )),可 量到藉由 針孔等, 達到有機 體的製作 該熱處理 。熱處理 ,較佳爲 間並無特 -3小時。 氣等之非 亦可藉由 還原性液 性變化。 少爲目的 元素、原 有機半導 磺酸等之 素原子; -29- 201247676 鈉、鉀等之金屬原子;各種有機半導體材料等。此可藉由 使此等之氣體接觸於有機半導體層、浸潰於溶液、或是進 行電化學摻雜處理來達成。此等之摻雜,可不在有機半導 體層的製作後,而是在有機半導體化合物的合成時添加, 或是在使用有機半導體元件製作用油墨來製作有機半導體 層之程序中,添加於該油墨,或是在形成薄膜之步驟階段 等來添加。此外,亦可將摻雜材料添加於在蒸鍍時用以形 成有機半導體層之材料中以進行共蒸鍍,或是在製作有機 半導體層時混合於周圍的氣體環境中(在使摻雜材料存在 之環境下製作有機半導體層),再者,亦可在真空中使離 子加速並與膜碰撞而摻雜。 此等摻雜之效果,可列舉出因載體密度的增加或減少 所產生之電傳導率的變化、載子的極性變化(P型、N型 )、費米能階的變化等。此般摻雜,尤其在使用矽等的無 機系材料之半導體元件中經常被應用。 (關於保護層) 在有機半導體層上形成保護層7時,乃具有可將外部 氣體的影響抑制在最低程度,並且使有機薄膜電晶體的電 特性達到穩定之優點(參照第2圖(6))。保護層的材 料可使用前述所說明者。保護層7的膜厚,可因應該目的 來採用任意膜厚,通常爲l〇〇nm〜1mm。 使保護層成膜時,可採用各種方法,當保護層由樹脂 所構成時,例如可列舉出塗佈樹脂溶液後使其乾燥而形成 -30- 201247676 樹脂膜之方法;塗佈或蒸鍍樹脂單體後進行聚合之方法等 。成膜厚可進行交聯處理。 當保護層由無機物所構成時,例如可使用濺鍍法、蒸 鏟法等之真空程序中的形成方法,或是溶膠凝膠等之溶液 程序中的形成方法。 本發明之薄膜電晶體中,除了在有機半導體層上之外 ,在各層之間,亦可因應必要來設置保護層。此等層有時 有益於薄膜電晶體之電特性的穩定。 根據本發明,由於將二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩用作爲有機半導體材料,所以可在相對低溫的程序 下製造出。因此,在暴露於高溫之條件下所無法使用之塑 膠板、塑膠薄膜等之可撓性材質,亦可用作爲基板。其結 果可製造出輕量且柔軟性佳之不易損壞的元件,而能夠應 用作爲顯示器之主動矩陣的開關元件等。 本發明之薄膜電晶體,亦可應用作爲記憶體電路元件 、訊號驅動器電路元件、訊號處理電路元件等之數位元件 或類比元件。此外,藉由組合此等,可製作出1C卡或1C 標籤。再者,本發明之薄膜電晶體,可藉由化學物質等之 外部刺激而引起該特性的改變,故亦可應用作爲FET感測 器。 接著詳細說明本發明之有機EL元件。 有機EL元件爲固體,其可應用在自發光型的大面積 彩色顯示或照明等用途而受到矚目,並以開發出許多種。 該構成,爲人所知者有:在由陰極與陽極所構成之對向電 -31 - 201247676 極之間,具有發光層及電荷輸送層2層之構造者; 合於對向電極之間之電子輸送層、發光層及電洞輸 層之構造者:及具有3層以上的層者等,此外,發 爲單層者等。 在此,電洞輸送層係具有:從陽極注入電洞並 輸送至發光層以容易進行電洞往發光層的注入之功 及阻擋電子之功能。此外,電子輸送層係具有:從 入電子並將電子輸送至發光層以容易進行電子往發 注入之功能,以及阻擋電洞之功能。此外,在發光 由於分別注入之電子與電洞的重新結合而產生激發 該激發光子在放射及失去活性之過程中所放射的能 偵測作爲發光。以下係說明本發明之有機EL元件 型態。 本發明之有機EL元件,爲在陽極與陰極之電 成有1層或複數層有機薄膜,並藉由電能而發光之: 本發明之有機EL元件中所使用之陽極,爲具 洞注入於電洞注入層、電洞輸送層、發光層之功能 。一般而言,功函數爲4.5eV以上之金屬氧化物或 合金、導電性材料等較爲適合。具體而言雖無特別 但可列舉出氧化錫(NESA )、氧化銦、氧化銦錫( 、氧化銦鋅(丨ZO )等之導電性金屬氧化物;金、 、鉻、鋁、鐵、鈷、鎳、鎢等之金屬;碘化銅、硫 之無機導電性物質;聚噻吩、聚吡咯、聚苯胺等之 聚合物或碳。此等當中,較佳係使用ITO或NESA< 具有層 送層3 光層可 將電洞 能,以 陰極注 光層的 層中, 光子, 量,被 的較佳 極間形 元件。 有將電 的電極 金屬、 限定, ITO ) 銀、鉑 化銅等 導電性 -32- 201247676 陽極,可因應必要使用複數種材料 所構成。陽極的電阻,只要可供給對元 分的電流者即可,並無特別限定,就元 點來看,較佳爲低電阻。例如,薄片電 以下之ITO基板具有作爲元件電極之功 Ω/□之基板,故較佳爲使用低電阻者 合電阻値來任意選擇,通常在 5 10〜3 00nm之間使用。ITO等之膜形成 鍍法、電子束法、濺鍍法、化學反應法 本發明之有機EL元件中所使用之 子注入於電子注入層、電子輸送層、發 。一般而言,功函數較小(大致爲4eV 金較爲適合。具體而言可列舉出鈾、金 、鋅 '鋁、銦、鉻、鋰、鈉、鉀、鈣、 定。爲了提升電子注入效率以提升元件 鈉、鉀、鈣、鎂。 合金,可使用含有此等低功函數金 的合金,或是層合此等之構造的電極等 ’亦可使用氟化鋰般之無機鹽。此外, 而是往陰極側取光時,亦可構成爲可低 。膜形成方法,可列舉出蒸鍍法、電子 學反應法、塗佈法等,但不限定於此。 可供給對元件的發光而言爲充分的電流 限定,就元件的消耗電力之觀點來看, ,且可由2層以上 件的發光而言爲充 件的消耗電力之觀 阻値爲3 00 Ω / □ 能,但亦可供給數 。ITO的厚度可配 -500nm,較佳在 方法,可列舉出蒸 、塗佈法等。 陰極,爲具有將電 光層之功能的電極 以下)之金屬或合 、銀、銅、鐵、錫 鎂等,但無特別限 性,較佳爲鋰、 屬之鋁或銀等金屬 。層合構造的電極 當並非在陽極側, 溫製膜之透明電極 束法、濺鍍法、化 陰極的電阻,只要 者即可,並無特別 較佳爲低電阻,較 -33- 201247676 佳爲數1〇〇~數Ω/□。膜厚通常在5〜500nm,較佳在 的範圍內使用。 再者’爲了進行封合、保護,亦可藉由氧化 矽' 氧化矽、氮氧化矽、氧化鍺等之氧化物、氮 此等之混合物、聚乙烯醇、氯乙烯、烴系高分子 分子等來保護陰極,並與氧化鋇、五氧化磷、氧 脫水劑一同封合。 此外,爲了取光,一般而言,較佳係在元件 長區域中具有充分透明性之基板上製作電極。透 列舉出玻璃基板或聚合物基板。玻璃基板可使用 、無鹼玻璃、石英等,只要具有可保持機械及熱 分的厚度即可,較佳爲0.5mm以上的厚度。關於 質,以從玻璃熔出之離子較少者較佳,較佳爲無 此般玻璃,市售品有Si02等之施以阻障塗膜之 ’亦可使用此。此外,以玻璃以外的聚合物所形 ,可列舉出聚碳酸酯、聚丙烯、聚醚颯、聚對苯 二酯、丙烯酸基板等。 本發明之有機EL元件所具有之有機薄膜, 與陰極之電極間形成有1層或複數層。藉由使本 蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩含有於該有 可得到藉由電能而發光之元件。 本發明中之形成有機薄膜之1層或複數層的 如電洞輸送層 '電子輸送層、電洞輸送性發光層 送性發光層、電洞阻障層、電子阻障層、電洞注 1 0~3 OOnm 鈦、氮化 化物、或 、氟系高 化鈣等之 的發光波 明基板可 鈉鈣玻璃 強度之充 玻璃的材 鹼玻璃。 鈉鈣玻璃 成之基板 二甲酸乙 係在陽極 發明之二 機薄膜, 「層」, '電子輸 入層、電 -34- 201247676 子注入層、發光層或下列構成例9)所示’係意味著兼具 此等層所具有的功能之單一層。本發明中之形成有機薄膜 之層的構成,可列舉出下列構成例1 )〜9 ) ’可爲任一項 構成。 構成例 1) 電洞輸送層/電子輸送性發光層。 2) 電洞輸送層/發光層/電子輸送層。 3) 電洞輸送性發光層/電子輸送層。 4) 電洞輸送層/發光層/電洞阻止層。 5) 電洞輸送層/發光層/電洞阻止層/電子輸送層 〇 6) 電洞輸送性發光層/電洞阻止層/電子輸送層。 7) 前述1)至6)的各組合中,於電洞輸送層或電洞 輸送性發光層之前進一步賦予一層電洞注入層之構成。 8) 前述1)至7)的各組合中,於電子輸送層或電子 輸送性發光層之前進一步賦予一層電子注入層之構成。 9 )分別混合前述1 )至8)的組合中所使用之材料, 而僅具有一層含有該混合後的材料之構成。 前述9),一般可爲藉由被稱爲雙載子性發光材料之 材料所形成之單一層;或是僅設置一層含有發光材料與電 洞輸送材料或電子輸送材料之層者。一般而言,藉由構成 爲多層構造,可有效率地輸送電荷,亦即電洞及/或電子 ’使此等電荷重新結合。此外,由於可抑制電荷的淬滅等 -35- 201247676 ’所以可防止元件穩定性的降低而提升發光效率。 電洞注入層及輸送層,可單獨層合電洞輸送材料,或 層合兩種以上之該材料的混合物而形成。電洞輸送材料, 較佳可使用Ν,Ν·-二苯基·Ν,Ν·-二(3-甲基苯基)-4,4,-二 苯基-1,1'-二胺、Ν,Ν,-二萘基-Ν,Ν,-二苯基-4,4,-二苯基-1,厂-二胺等之三苯基胺類;雙(Ν_烯丙基咔唑)或雙(Ν_ 烷基咔唑)類;以吡唑啉衍生物、芪系化合物、腙系化合 物、三唑衍生物、噁二唑衍生物或卟啉衍生物爲代表之雜 環化合物;聚合物系中,於側鏈具有前述單體之聚碳酸酯 或苯乙烯衍生物、聚乙烯味唑、聚矽烷等。只要是可形成 元件製作所需之薄膜’且可從電極中注入電洞並輸送電洞 之物質即可’並無特別限定。用以提升電洞注入性而設置 在電洞輸送層與陽極之間之電洞注入層,可列舉出酞菁衍 生物、m-MTDATA等之星爆型胺類,高分子系中,有由 PEDOT等之聚噻吩 '聚乙稀咔唑衍生物等所製作者。 電子輸送材料,必須在賦予電場之電極間,可有效率 地從負極輸送電子。電子輸送材料,較佳爲電子注入效率 高’並可有效率地輸送所注入之電子。因此,係要求電子 親和力大且電子遷移率大,穩定性佳,並且於製造時及使 用時不易產生成爲捕集之雜質之物質。滿足此般條件之物 質’可列舉出以三(8 -喹啉)鋁錯合物爲代表之喹啉衍生 物金屬錯合物、卓酚酮金屬錯合物、茈衍生物、芘酮衍生 物、萘二甲醯亞胺衍生物、萘二甲酸衍生物、噁唑衍生物 、噁二唑衍生物、噻唑衍生物、噻二唑衍生物、三唑衍生 -36- 201247676 物、雙苯乙烯衍生物、吡嗪衍生物、菲羅林衍生物、苯並 噁唑衍生物'喹喔啉衍生物等,但不特別限定於此。此等 電子輸送材料,可單獨使用,或與不同電子輸送材料層合 或混合使用。用以提升電子注入性而設置在電子輸送層與 陰極之間之電子注入層,可列舉出鉋'鋰、緦等之金屬或 氟化鋰等。 電洞阻止層,係藉由單獨使用電洞阻止性物質,或是 層合或混合兩種以上的該物質來形成。電洞阻止性物質, 較佳爲紅菲羅林、2,9-二甲基-4,7-二苯基-l,l〇 -菲羅林等 之菲羅林衍生物、矽雜環戊二烯衍生物、喹啉衍生物金屬 錯合物、噁二唑衍生物、噁唑衍生物等。電洞阻止性物質 ’只要可阻止電洞從陰極側往元件外部流出而使發光效率 降低之化合物即可,並無特別限定。 發光層,意味著可發光之有機薄膜,例如爲具有強發 光性之電洞輸送層、電子輸送層或雙載子輸送層。發光層 只要是藉由發光材料(主體材料、摻雜劑材料等)所形成 即可,此可爲主體材料與摻雜劑材料之混合物,或是單獨 爲主體材料中的任一種。主體材料與摻雜劑材料可分別爲 一種’或是複數種材料之組合。摻雜劑材料,可包含於主 體材料的全體或是部分地包含。摻雜劑材料可被層合或分 散’可爲其中的任一種。發光層,例如可列舉出前述電洞 輸送層或電子輸送層。發光層所使用之材料,可列舉出昨 唑衍生物 '蒽衍生物、萘衍生物 '菲衍生物、苯基丁二稀 衍生物、苯乙烯基衍生物、苑衍生物、菲衍生物、唾啉衍 -37- 201247676 生物、並四苯衍生物、茈衍生物、喹吖啶酮衍生物、香豆 素衍生物、卟啉衍生物或磷光性金屬錯合物(Ir錯合物、 Pt錯合物、Eu錯合物等)等。 此等之薄膜的形成方法,一般可列舉出真空程序之電 阻加熱蒸鍍法、電子束蒸鍍法、濺鍍法、分子層合法等, 或是溶液程序之壓鑄法、旋轉塗佈法、浸泡塗佈法、刮刀 塗佈法、線棒塗佈法、噴霧塗佈法等之塗佈法,或是噴墨 印刷、網版印刷、平版印刷、凸版印刷等之印刷法,微接 觸印刷法等之可燒式微影技術之手法等,或是組合複數種 此等手法之方法。各層的厚度,因各物質的電阻値和電荷 遷移率有所不同而無法限定,但可選自0.5〜5 0 0Onm之間 。較佳爲l~1 000nm,尤佳爲5〜500nm。 本發明之有機EL元件所具有之有機薄膜中,藉由使 本發明之二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩,含有於 在陽極與陰極之電極間所存在之發光層、電洞輸送層、電 子輸送層等之薄膜的1層或複數層中,可得到即使是低電 能亦可有效率地發光之元件。 本發明之有機EL元件,可藉由在陽極與陰極之電極 間’形成1層或複數層之本發明之二蒽[2,3-b: 2’,3’-f]噻 吩并[3,2-b]噻吩而得。尤其是,使用本發明之二蒽[2,3-b :2’,3’-f]噻吩并[3,2-b]噻吩之部位雖無限制,但可較佳地 應用作爲電洞輸送層或發光層,或是與摻雜劑材料組合之 主體材料。 本發明之有機EL元件中,本發明之二蒽[2,3-b: 2’,3’- -38- 201247676 f]噻吩并[3,2-b]噻吩可較佳地使用作爲電洞輸送層或發光 層。例如可與前述電子輸送材料或電洞輸送材料、發光材 料等組合使用或混合使用。較佳可列舉出以三(8-喹啉) 鋁錯合物爲代表之喹啉衍生物金屬錯合物、卓酚酮金屬錯 合物、茈衍生物、芘酮衍生物、萘二甲醯亞胺衍生物、萘 二甲酸衍生物、雙苯乙烯衍生物、吡嗪衍生物、菲羅林衍 生物 '苯並噁唑衍生物、喹喔啉衍生物、三苯基胺類、雙 (N-烯丙基咔唑)或雙(N-烷基昨唑)類、以吡唑啉衍生 物、底系化合物、腙系化合物、噁二唑衍生物爲代表之雜 環化合物等,但無特別限定。此等可單獨使用,或與不同 材料層合或混合使用。 將本發明之二蒽[2,3-b : 2,,3,-f]噻吩并[3,2-b]噻吩用 作爲與摻雜劑材料組合之主體材料時之摻雜劑材料的具體 例’可使用雙(二異丙基苯基)茈四羧酸醯亞胺等之茈衍 生物、芘酮衍生物、4-(二氰亞甲基)-2 -甲基·6-(對二 甲基胺基苯乙烯基)-4Η-哌喃(DCM )或該類似物、酞菁 鎂、氯酞菁鋁等之金屬酞菁衍生物、玫瑰紅化合物、脫氮 黃素衍生物、香豆素衍生物、噁嗪化合物、方酸菁化合物 、紫葱酮化合物、尼羅紅、5 -氰基吡咯亞甲- BF4錯合物等 之卩比略甲川衍生物,此外,可使用以乙醯丙酮或苯甲醯丙 酮與菲羅林等作爲配位基之Eu錯合物或^錯合物、RU錯 合物、Pi錯合物、〇s錯合物等之卟啉、鄰位金屬金屬錯 合物等作爲磷光材料,但並不限定於此等。此外,當混合 2種慘雜劑材料時,亦可使用紅螢烯般之輔助摻雜劑,使 -39- 201247676 來自主體色素的能量有效率地移動,而得到色純度經提升 後之發光。不論何種情形,爲了得到高亮度特性,較佳係 摻雜螢光量子產率高者。 所使用之摻雜劑材料的量過多時,會引起濃度消光現 象,故通常相對於主體材料而言爲30質量%以下使用。較 佳爲20質量%以下,更佳爲10質量%以下。發光層中將 摻雜劑材料摻雜於主體材料之方法,可藉由與主體材料之 共蒸鍍來形成,亦可預先與主體材料混合並同時蒸鍍。此 外,亦可以三明治狀夾持於主體材料來使用。此時,亦可 與主體材料層合作爲一層或兩層以上的摻雜劑層。 此等摻雜劑層,可單獨形成各層或是混合此等來使用 。此外,可將摻雜劑材料溶解或分散於作爲高分子黏結劑 之聚氯乙烯、聚碳酸酯、聚苯乙烯、聚苯乙烯磺酸、聚( N-乙烯咔唑)、聚(甲基)丙烯酸甲酯、聚(甲基)丙烯 酸丁酯、聚酯、聚颯、聚伸苯醚、聚丁二烯、烴樹脂、酮 樹脂、苯氧樹脂、聚颯、聚醯胺、乙基纖維素、乙酸乙烯 酯、ABS樹脂、聚胺基甲酸酯樹脂等之溶劑可溶性樹脂, 或是酚樹脂、二甲苯樹脂、石油樹脂、脲樹脂、三聚氰胺 樹脂、不飽和聚酯樹脂、醇酸樹脂、環氧樹脂、聚矽氧垸 樹脂等之硬化性樹脂來使用。 本發明之有機EL元件中所使用之薄膜的形成方法, 可使用本發明之二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩或 組成物,並採用一般之真空程序之電阻加熱蒸鍍法、電子 束蒸鍍法' 濺鍍法、分子層合法,或是溶液程序之壓鑄法 -40- 201247676 、旋轉塗佈法、浸泡塗佈法、刮刀塗佈法、線棒塗佈法、 噴霧塗佈法等之塗佈法,或是噴墨印刷、網版印刷、平版 印刷、凸版印刷等之印刷法,微接觸印刷法等之可撓式微 影技術之手法等,或是組合複數種此等手法之方法來進行 〇 電阻加熱蒸鍍法、電子束蒸鍍法、濺鍍法、分子層合 法,或是溶解或分散於溶劑或樹脂來塗佈之方法(旋轉塗 佈法、壓鑄法、浸泡塗佈法),LB法、噴墨法等並無特 別限定。通常就特性方面來看較佳爲電阻加熱蒸鍍。各層 的厚度,係因應發光物質的電阻値來設定,故而無法限定 ,但可選自0.5〜500Onm之間。較佳爲1〜100Onm,尤佳爲 5~5 OOnm ° 本發明之有機EL元件,可較佳地使用作爲平面顯示 器。此外,亦可用做爲平面背光,此時可使用發出有色光 者或是發出白色光者的任一種。背光,主要以提升不會自 發光之顯示裝置的觀看性爲目的而使用,可使用在液晶顯 示裝置、手錶、音訊機器、汽車儀表板、顯示板、標誌等 。尤其是液晶顯示裝置,當中尤以個人電腦用途之先前的 背光,由於以螢光燈和導光板所組成,所以難以薄型化, 使用本發明之發光元件之背光,具有薄型且輕量之特徵, 故可消除上述問題點。同樣的,對於照明亦極爲有用。 使用本發明之二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩 時,可得到發光效率高且壽命長之有機EL顯示裝置。此 外,藉由組合本發明之薄膜電晶體元件,能夠低成本地供 -41 - 201247676 給電特性上可高精度地控制施加電壓的導通關閉現象之有 機EL顯示裝置。 (關於光電轉換元件) 藉由應用本發明之二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b] 噻吩的有機半導體特性,可令人期待能夠應用作爲具可撓 性、低成本且製法簡便之光電轉換元件。當中,有機太陽 能電池元件,由於如色素增感太陽能電池般未使用電解液 ,故具有在柔軟性和壽命的提升上較爲有利之特長,以往 ,採用組合有導電性聚合物和富勒烯等之有機薄膜半導體 之太陽能電池的開發乃爲主流,但仍存在發電轉換效率之 問題。 —般而言,有機太陽能電池元件的構成,與矽系太陽 能電池相同,係以陰極與陽極夾持進行發電之層,並在各 電極上接受吸收了光所產生之電洞與電子,而發揮太陽能 電池的功能。該發電層,是由P型施體材料與N型受體材 料以及緩衝層等之其他材料所構成,將使用有機材料作爲 該材料者稱爲有機太陽能電池。 該構造可列舉出肯特基接面、異質接面、塊材異質接 面、奈米構造接面、混成型等,藉由使各材料有效率地吸 收入射光,產生電荷,並將所產生的電荷(電洞與電子) 予以分離、輸送及收集,而發揮太陽能電池的功能。接著 說明本發明之太陽能電池元件中的構成要素。 本發明之太陽能電池元件中的陽極與陰極’係與先前 -42- 201247676 所說明之有機EL元件相同。由於需有效率地取光,所以 較佳係構成爲在發電層的吸收波長區域中具有透明性之電 極。此外’爲了具有良好的太陽能電池特性,薄片電阻較 佳爲20Ω/ □以下。 本發明之太陽能電池元件中的發電層,係由形成至少 含有本發明之二蒽[2,3-b : 2,,3,-f]噻吩并[3,2-b]噻吩的有 機薄膜之1層或複數層所形成。雖可採用先前所示之構造 ’但基本上是由P型施體材料與N型受體材料以及緩衝層 所構成。 P型施體材料’基本上可列舉出與有機EL元件的項 目中所說明之電洞注入及電洞輸送層同樣地可輸送電洞之 化合物’或是聚對伸苯乙烯衍生物、聚噻吩衍生物 '聚芴 衍生物、聚苯胺衍生物等之7Γ共軛型聚合物,或是咔唑或 其他於雜環側鏈上所具有之聚合物。低分子化合物,可列 舉出並五苯衍生物、紅螢烯衍生物、卟啉衍生物、酞菁衍 生物、飽藍衍生物、喹吖啶酮衍生物、部花青素衍生物、 花青素衍生物、方酸菁衍生物、苯醌衍生物等。 N型受體材料,基本上可列舉出與有機el元件的項 目中所說明之電子輸送層同樣地可輸送電子之化合物,或 是骨架中具有吡啶及該衍生物之低聚物或聚合物、骨架中 具有喹啉及該衍生物之低聚物或聚合物、具有苯並菲羅林 類及該衍生物之聚合物、氰基聚伸苯乙嫌衍生物(CN_ PPV等)等之高分子材料’或是氟化酞菁衍生物、菲衍生 物、萘衍生物、2,9-二甲基-4,7 -二苯基_ι,10_菲羅林衍生 -43- 201247676 物、C60或C70、PCBM等之富勒烯衍生物等之低分子材 料。 較佳可有效率地吸收各種光並產生電荷,所使用之材 料的吸光係數愈高者愈佳。 本發明之二蒽[2,3-b: 2’,3’-f]唾吩并[3,2-b]噻吩,特 佳可使用作爲P型施體材料。本發明之有機太陽能電池的 發電層用之薄膜的形成方法,可與先前有機EL元件的項 目中所說明之方法相同。薄膜的膜厚等,因太陽能電池的 構成而有所不同’但爲了充分地吸收光以及防止短路,愈 厚者愈佳,但由於輸送所產生的電荷之距離愈短愈佳,所 以較適當爲較薄者。一般而言,發電層較適合爲10〜5 000 (關於光感測器、影像感測器) 藉由應用本發明之二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b] 噻吩的物性及半導體特性,可令人期待能夠應用作爲光感 測器或影像感測器。裝置,可列舉出作爲固體攝像元件之 影像感測器,或是具有將動畫或靜畫等之影像訊號轉換爲 數位訊號之功能之電荷耦合元件(CCD )等,並且亦可期 待應用作爲更便宜,且可活用大面積化加工性、有機物固 有的可撓功能性等之各種感測器。 (關於有機半導體雷射元件) 由於本發明之二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩 -44- 201247676 爲具有有機半導體特性之化合物,故可令人期待能夠應用 作爲有機半導體雷射元件。亦即,只要可將共振器構造組 裝於含有本發明之二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩 之有機半導體元件,有效率地注入載子並充分地提高激發 狀態的密度,則可令人期待能夠使光增幅而產生雷射振盪 。以往,係有人提出僅觀測出依據光激發所進行之雷射振 盪者,乃難以進行對依據電激發所進行之雷射振盪而言爲 必要之將高密度的載子注入於有機半導體元件以產生高密 度的激發狀態者,但藉由使用含有本發明之二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩之有機半導體元件,乃令人期待 引起高效率的發光(場發光)之可能性。 [實施例] 以下係列舉出實施例來更詳細地說明本發明,但本發 明並不限於此等實施例。實施例中,「%」在未特別指定 時,表示「質量%」。此外,反應溫度在未特別指定時, 係記載爲反應系統內的內溫。 實施例中所得之各種化合物,可因應必要,藉由進行 mp (熔點)、NMR(1H,13C) 、IR (紅外線吸收光譜) MS (質譜分析光譜)、元素分析等的各種測定來決定該 結構式。測定機器如下所述。 mp :柳本微量熔點測定裝置MP-S3 NMR : JEOL Lambda 400 spectrometer IR :島津傅立葉轉換紅外線分光光度儀IR Prestige- -45 - 201247676 2400 CHN型元素分析儀 MS 光譜:Shimadzu QP-5 0 5 0A 元素分析:Parkin Elmer 2400 二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩的合成 (〇 3-甲基硫-2_甲氧蒽的合成 【化1 0】The film of the present invention means a film formed from the diterpene [2,3-b : 2', 3'-f] thieno[3,2-b]thiophene of the present invention or a composition containing the same. The film thickness of the film varies depending on the application, and is usually from 0.1 nm to 100/m, and the twist is preferably from 1 nm to 20/m. The method for forming the film of the present invention generally includes a vacuum program -17-201247676 resistance heating vapor deposition method, electron beam steaming method, sputtering method, molecular layering method, etc. or a spin coating method of a solution program, Lithographic printing method, gravure printing method, gravure printing method, dry lithography method, pad printing method, lithographic printing method, etc., lithography, gravure printing, etc., such as droplet coating method, immersion coating method, quick-drying printing, resin relief printing, etc. A method such as a gravure printing method, a screen printing method, a transfer printing method, a lithographic printing method, a stencil printing method, an inkjet printing method, a microcontact printing method, or the like, or a method of combining a plurality of such methods . Usually, it is preferably a resistance heating vapor deposition method of a vacuum program or a spin coating method of a solution program, a dip coating method, an ink jet method, a screen printing method, a letterpress printing method, or the like. In addition, the film forming methods required in the respective organic electronic devices are also different, and will be described in the items of the respective devices. The organic electronic device of the present invention is an electronic material containing the above-described diterpene [2,3-b:2',3'-phantomino[3,2-1)] peptidene as an electronic device. Examples of the organic electronic device include a thin film transistor and an organic EL element, a liquid crystal display element, a photoelectric conversion element, and an organic semiconductor laser element. These components will be described in detail below. First, the thin film transistor will be described in detail. The thin film transistor has two electrodes (a source electrode and a drain electrode) in contact with the semiconductor, and controls a current flowing between the electrodes by a voltage applied to the other electrode called a gate electrode. In general, a thin film transistor element is often constructed by insulating an electrode with an insulating film (Metal-Insulator-Semiconductor; MIS structure). A metal oxide film is used as an insulating film and is called a MOS structure. Others have a structure in which a gate electrode is formed by a Kentke barrier, and -18-201247676 is also a MES structure. However, in a thin film transistor using an organic semiconductor material, the MIS structure is mostly used. Hereinafter, the organic thin film transistor of the present invention will be described in more detail using the drawings, but the present invention is not limited to these configurations. Fig. 1 shows several types of examples of the thin film transistor (element) of the present invention. In each of the examples, 1 denotes a source electrode, 2 denotes a semiconductor layer, 3 denotes a drain electrode, 4 denotes an insulator layer, 5 denotes a gate electrode, and 6 denotes a substrate. The configuration of each layer and electrode can be appropriately selected depending on the use of the component. A to D, because the current flows in the direction parallel to the substrate, it is called a lateral transistor. A is called a bottom contact structure, and B is called a top contact structure. Further, the C system is provided with a source electrode and a drain electrode and an insulator layer on the semiconductor, and then a gate electrode is formed thereon, which is called a bottom gate structure. D is called the structure of the top and bottom contact type transistors. E is a transistor having a vertical structure, that is, a schematic diagram of an electrostatic induction transistor (SIT: electrostatic induction transistor). In this SIT, since the current flows in a planar manner, a large number of carriers can be transferred at a time. Further, since the source electrode and the drain electrode are arranged longitudinally, the distance between the electrodes can be reduced to achieve a high speed of the reaction. Therefore, it can be suitably applied to applications such as switching at a high speed accompanied by a large current. In the case of E in the first drawing, the substrate is not described. However, the substrate is usually provided on the outer side of the source electrode and the drain electrode indicated by 1 and 3 in the first drawing, and the substrate is described. Each component. The substrate 6 must be held without peeling off the layers formed thereon. For example, an insulating material such as a resin plate or a film, paper, glass, quartz, or ceramics; an insulating layer formed on a conductive substrate such as a metal or an alloy by coating -19-201247676 or the like; and a resin and an inorganic material may be used; Materials such as various combinations. The resin film which can be used, for example, polyethylene terephthalate, polyethylene naphthalate, polyether oxime, polyamine, polyimide, polycarbonate, cellulose triacetate , polyether phthalimide and the like. When a resin film or paper is used, the element can be made flexible, soft and lightweight, and the practicality can be improved. The thickness of the substrate is usually 1 #m to l〇mm, preferably 5/zm to 5 mme. The source electrode 1, the drain electrode 3, and the gate electrode 5 are made of a conductive material. For example, platinum, gold, silver, aluminum, chromium, tungsten, molybdenum, nickel, cobalt, copper, iron, lead, tin, titanium 'indium, palladium, molybdenum, magnesium, calcium, barium, lithium, potassium, sodium, etc. may be used. Metals and alloys containing the same; conductive oxides of In〇2, Zn〇2, Sn〇2, ITO, etc.; polyaniline, polypyrrole, polythiophene, polyacetylene, polyparaphenylene, ethylene, poly A conductive polymer compound such as acetylene; a semiconductor such as ruthenium, osmium or gallium arsenide; a carbon material such as carbon black, fullerene, carbon nanotube or graphite. In addition, conductive high molecular compounds or semiconductors can be cumbersome. Examples of the dopant in this case include inorganic acids such as hydrochloric acid and sulfuric acid; organic acids having an acidic functional group such as sulfonic acid; Lewis acids such as PFS, AsFs, and FeCl3; and halogen atoms such as iodine: lithium and sodium. a metal atom such as potassium. Boron, phosphorus, arsenic, etc. are also widely used as dopants for inorganic semiconductors such as ruthenium. Further, a conductive composite material in which carbon black or metal particles or the like is dispersed in the above dopant may be used. Further, the distance (channel length) between the source and the drain electrode is an important factor for determining the characteristics of the device. The length of the channel is usually O.UOOym -20-201247676, preferably O.5~100ym. The shorter the channel length, the more the amount of current that can be drawn, but the leakage current, etc., so the proper channel length is necessary. The width (channel width) between the source and the drain electrode is usually 10 to 10000 " m, preferably 100 to 5000 νηη. Further, the width of the channel can be formed into a comb structure by forming the structure of the electrode, etc., and a longer channel width can be formed, and can be set to an appropriate length in accordance with the amount of current necessary or the structure of the element. Next, the respective configurations (forms) of the source and the drain electrodes will be described. The source and drain electrodes may be identical or different in configuration. The length of the electrode can be the same as the width of the aforementioned channel. The width of the electrode is not particularly limited, and it is preferably shorter in order to reduce the area of the element within a range in which the electrical characteristics are stabilized. The width of the electrode is usually from 0.1 to 1000 / / m, preferably from 0.5 to 100 / zm. The thickness of the electrode is usually from 0.1 to 100 nm, preferably from 1 to 500 nm, and more preferably from 5 to 200 nm. Wiring is connected to each of the electrodes 1, 3, and 5, and the wiring can be produced by using the same material as the electrode. The insulator layer 4 is made of an insulating material. For example, parylene, polyacrylate, polymethyl methacrylate, polystyrene, polyvinyl phenol, polyamide, polyimide, polycarbonate, polyester, polyvinyl alcohol, polyvinyl acetate can be used. a polymer of an ester, a polyurethane, a poly maple, an epoxy resin, a phenol resin, a fluorine resin, or the like, and a copolymer of the same; metal oxidation of cerium oxide, aluminum oxide, titanium oxide, cerium oxide, or the like a strong dielectric metal oxide such as SrTi03 or BaTi〇3; a nitride such as tantalum nitride or aluminum nitride; a sulfide; a derivative such as fluoride; or a polymerization which disperses particles of such a dielectric. Things and so on. The film thickness of the insulator layer 4 varies depending on the material -21 - 201247676 is usually 0.1 nm to 100 / / m, preferably 0.5 nm to 50 / im, and more preferably 1 nm to 1 0 / z m. As the material of the semiconductor layer 2, the diterpene [2,3-b: 2', 3'4] thieno[3,2-13] thiophene of the present invention or a composition containing the same is used. This material can be formed as a thin film as the semiconductor layer 2 by the aforementioned method. In this case, a single diterpene [2,3-b : 2',3'-f]thieno[3,2-b]thiophene is preferably used as the organic semiconductor material, but in order to improve the characteristics of the thin film transistor Or impart other characteristics 'may mix other organic semiconductor materials or various additives as necessary. These may include the case of co-evaporation with other organic semiconductor materials or dopants in the evaporation process, or the solvent, dispersant, surfactant, leveling agent, surface tension adjustment used in the solution procedure. A case where a composition or the like is mixed to form a composition is exemplified. Further, the semiconductor layer 2 may be composed of a plurality of layers. The above additive is usually added in an amount of 0.01 to 1% by weight, preferably 0 to 5 to 5% by weight, particularly preferably 0.1 to 3% by weight, based on the total amount of the organic semiconductor material. When the aforementioned semiconductor composition is used as the organic semiconductor material, it is not limited thereto. Further, although the semiconductor layer may be composed of a plurality of layers, it is particularly preferably a single layer structure. The film thickness of the semiconductor layer 2 is thinner in the range where the necessary function is not lost. β is a thin film transistor shown in A, B, and D shown in Fig. 1 when the film thickness is thick. The current increases, so the characteristics of the element do not depend on the film thickness when the film thickness is greater than or equal to the predetermined thickness. The film thickness of the semiconductor layer for exhibiting the necessary function is usually from 1 nm to 10/zm, preferably from 5 nm to 5 " m, and more preferably from 10 nm to 3/zm. -22- 201247676 In the thin film transistor of the present invention, for example, between the substrate layer and the insulating film layer or between the insulating film layer and the semiconductor layer, or on the outside of the element, other layers may be provided as necessary. For example, when a protective layer is formed by directly or interposing another layer on the organic semiconductor layer, the influence of external gas such as moisture can be reduced, and the electrical characteristics can be stabilized by improving the on/off ratio of the element and the like. The advantages. The material of the protective layer is not particularly limited, and for example, an acrylic resin such as an epoxy resin or polymethyl methacrylate, a polyurethane, a polyimide, a polyvinyl alcohol, a fluororesin, or a poly A film composed of various resins such as olefin: a film composed of an inorganic oxide film such as cerium oxide, aluminum oxide or tantalum nitride, or a dielectric such as a nitride film, etc., preferably having a transmittance of oxygen or moisture or A resin (polymer) having a small water absorption rate. It can also be used in recent years as a protective material for organic EL displays. The film thickness of the protective layer can be selected according to the purpose, and is usually from 10 nm to 1 mm. Further, by performing surface treatment in advance on a substrate or an insulator layer on which an organic semiconductor layer is laminated, the characteristics as a thin film transistor element can be improved. For example, by adjusting the degree of hydrophilicity/hydrophobicity of the surface of the substrate, the film quality of the film formed thereon can be improved. In particular, the acceptability of an organic semiconductor material greatly changes depending on the state of the film such as the alignment of the molecules. Therefore, by surface-treating the substrate or the like, it is possible to control the molecular alignment of the interface portion of the substrate or the like with the organic semiconductor layer to be subsequently formed, and to reduce the trapping portion on the substrate or the insulator layer, thereby improving carrier migration. Rate and other characteristics. The trapping site refers to a functional group such as a hydroxyl group -23-201247676 present on an untreated substrate. When such a functional group is present, electrons are pulled close by the functional group, resulting in a decrease in carrier mobility. . Therefore, those who have reduced the collection site are often effective in improving the characteristics of the carrier mobility and the like. The substrate treatment for improving the above characteristics may, for example, be a hydrophobization treatment according to hexamethyldiazepine, cyclohexene, octyltrichlorodecane or octadecyltrichloromethane; Acid treatment by sulfuric acid, acetic acid, etc.; alkali treatment according to sodium hydroxide, potassium hydroxide, calcium hydroxide, ammonia water, etc.: ozone treatment: fluorination treatment; plasma treatment of argon oxide, etc.; Langmuir-Blodgett membrane Formation treatment of other insulators or thin films of semiconductors; mechanical treatment; electrical treatment of corona discharge, etc.: in addition, brushing treatment using fibers or the like. In such a form, for example, a method of providing a substrate layer, an insulating film layer, or an insulating film layer and an organic semiconductor layer, for example, a vacuum deposition method, a sputtering method, a coating method, a printing method, or a sol-gel method can be suitably employed. Glue method, etc. Next, a bottom contact type thin film transistor shown in the type A of Fig. 1 will be described as an example. A method of manufacturing the thin film transistor element of the present invention will be described based on Fig. 2 . This production method can be similarly applied to the above-described other types of thin film transistors and the like. (Substrate and Substrate Treatment of Thin Film Transistor) The thin film transistor of the present invention is produced by providing various layers and electrodes necessary for the substrate 6 (see Fig. 2 (1)). The substrate can be used as described above. The surface treatment or the like may be performed on the substrate. The thickness of the substrate 6 is preferably as thin as possible within a range that does not hinder the necessary functions. Although it varies depending on the material -24- 201247676, it is usually lem~10mm, preferably 5/zm. Further, the substrate can be provided with an electrode function as necessary. (Formation of Gate Electrode) The gate electrode 5 is formed on the substrate 6 (see Fig. 2 (2)). The electrode material can be used as described above. The method of forming the electrode film into a film may be, for example, a vacuum deposition method, a sputtering method, a coating thermal transfer method, a printing method, a sol-gel method or the like by various methods. When forming a film or after film formation, it is necessary to form a pattern to form a desired shape. Various methods can be used for the pattern method, and examples thereof include a lithography technique for forming and etching a combined photoresist. Further, it is also possible to apply a printing method such as inkjet printing, lithography, and letterpress printing, a technique of flexible lithography such as microcontact printing, and a combination of a plurality of such techniques to form a pattern. The film thickness of the gate electrode 5 is usually from 0.1 nm to 10/zm, preferably from 0.5 nm to 1, and particularly preferably from 1 nm to 3 /zm, although it varies depending on the material. In addition, when both the gate electrode and the substrate are combined, the film thickness can be made larger. (Formation of Insulator Layer) The insulator layer 4 is formed on the gate electrode 5 (see Fig. 2 (: The insulator material can be used as described above. The insulator layer can be formed, and various methods can be used, and for example, spin coating can be used. Cloth method, spray method, dip coating method, die casting method, bar coating method, knife coating method, etc., screen printing, lithography, inkjet, etc., vacuum evaporation ~ 5mm. Compared with the formation of pattern and net brush method and S β m, )) coating method of coating at 25° - 201247676, molecular beam epitaxy growth method, ion clustering method, ion evaporation method, splashing Dry procedural methods such as plating, atmospheric piezoelectric slurry, and CVD. Other methods such as a sol-gel method or an oxide film formed on a metal such as an aluminum oxide film on aluminum or cerium oxide on a crucible may be employed. In the portion where the insulator layer and the semiconductor layer are in contact, at the interface between the two layers, in order to make a molecule constituting the semiconductor, for example, the diterpene [2,3-b: 2', 3'-f] thieno[ The molecules of 3,2-b]thiophenes are well aligned, and the insulator layer can be subjected to a predetermined surface treatment. The surface treatment method can be the same as the surface treatment of the substrate. The film thickness of the insulator layer 4 is preferably as thin as possible within a range that does not impair the function. It is usually 0.1 nm to 100/m, preferably 0.5 nm to 50/zm, and more preferably 5 nm to 10/m. (Formation of Source Electrode and Diode Electrode) The method of forming the source electrode 1 and the drain electrode 3 can be formed in accordance with the case of the gate electrode 5 (see Fig. 2 (4)). Further, in order to lower the contact resistance with the organic semiconductor layer, various additives and the like can be used. (Formation of Organic Semiconductor Layer) The organic semiconductor material, as described above, uses the diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene of the present invention. Or its constituents. When the organic semiconductor layer is formed into a film, various methods can be used. The method can be roughly classified into a vacuum program such as a sputtering method, a CVD method, a molecular beam epitaxial growth method, or a vacuum evaporation method; and a immersion coating method, a die casting coating method, a roll coating method, and a bar coating method. A coating method such as a method, a spin coating method, or the like; a method of forming a solution program such as a brush method, a lithography method, or a microcontact printing method by an inkjet method or a screen printing method -26-201247676. When the diterpene [2,3-b : 2',3,-f]thieno[3,2-b]thiophene of the present invention is used as a semiconductor material to form an organic thin film which becomes a semiconductor layer, it is preferred to borrow The method of forming an organic thin film formed by a vacuum process as a semiconductor layer is more preferably a vacuum distillation method. It is also possible to form a film according to a solution procedure, or a low-cost printing method. Next, a method of forming an organic semiconductor material by a vacuum process to form an organic semiconductor layer will be described. Preferably, the organic semiconductor material is heated under vacuum in a crucible or a metal dish, and the evaporated organic semiconductor material is attached (vapor-deposited) to the substrate (the exposed portion of the insulator layer, the source electrode, and the drain electrode). The method is vacuum evaporation. In this case, the degree of vacuum is usually 1.0 or less, preferably less than or equal to 〇xi〇-3pa. Further, sometimes the characteristics of the organic semiconductor film and the thin film transistor are changed by the difference in substrate temperature during vapor deposition, and it is preferable to carefully select the substrate temperature. The substrate temperature at the time of steaming is usually 0 to 20 (TC, preferably 10 to 15 (TC, particularly preferably 15 to 120 ° C, more preferably 25 to 100 ° C. In addition, the speed of the steamer is usually 0.001 〜10 nm / sec, preferably 〇·〇1 to lnm / sec. The film thickness of the organic semiconductor layer formed of the organic semiconductor material is usually from 1 nm to 10/zm, preferably from 5 nm to 5/m. Preferably, lOnm~3/m 〇 can also be used to form an organic semiconductor layer by causing the accelerated argon ions to collide with the material target, and the material atoms are struck and adhered to the substrate. The organic semiconductor material is heated and evaporated to adhere to the vapor deposition method of the substrate -27-201247676. Next, a method of forming an organic semiconductor layer by a solution process will be described. The second embodiment of the present invention can be used. -b : 2',3,-f]thieno[3,2-b]thiophene is dissolved or dispersed in a solvent, etc., and other low molecular compounds or polymer compounds, dopants, dispersants, and interfacial activities are added as necessary. Additives such as a agent, a flat agent, and a surface tension adjuster constitute a composition, and the composition is prepared as a composition The ink for the conductor device is applied to the substrate (the exposed portion of the insulator layer, the source electrode, and the drain electrode). The coating method may be a die casting method, a spin coating method, a dip coating method, or a knife coating method. Coating methods such as a method, a bar coating method, a spray coating method, a printing method such as inkjet printing, screen printing, lithography, and letterpress printing, and a method of flexible lithography such as a microcontact printing method. And a method of combining a plurality of such methods. Further, similarly to the coating method, the monomolecular film of the organic semiconductor layer prepared by dropping the ink on the water surface may be moved to the substrate to be laminated. The Langmuir-Blodgett method is a method in which a liquid crystal or a molten material is sandwiched between two substrates, and is introduced into the substrate by capillary phenomenon, etc. The temperature of the substrate or the composition at the time of film formation is also Importantly, since the characteristics of the transistor sometimes vary depending on the temperature of the substrate or the composition, it is necessary to carefully select the temperature of the substrate or the composition. The substrate temperature during vapor deposition is usually 〇~200°c'. It is preferably from 10 to 120 ° C, more preferably from 15 to 100 t. In particular, it is largely dependent on the solvent and the like in the composition to be used. Therefore, special care is required. The film thickness of the organic semiconductor layer produced by this method is Do not damage -28- 201247676 The thinner the better the range of this function. If the film thickness is thick, there will be doubts about leakage. The film thickness of the organic semiconductor layer is usually lnm~10; / 5nm~5vm, especially good It is 10 nm to 3/zm. The organic semiconductor layer thus formed (refer to Fig. 2 (5) to further improve the characteristics by subsequent treatment. For example, the heat treatment can alleviate the strain in the film which is formed when the film is formed, and reduces From the standpoint of controlling the arrangement and alignment of the film, etc., the semiconductor characteristics can be improved and stabilized. In the case of the film electroforming of the present invention, the heat treatment is effective for improving the characteristics. The treatment temperature by heating the substrate after forming the organic semiconductor layer is not particularly limited, and is usually room temperature to 150 ° C 40 to 120 ° C, more preferably 45 to 100 ° C. The heat treatment at this time is usually limited to 1 minute to 24 hours, preferably 2 minutes - at this time, the gas atmosphere may be in the atmosphere or in a nitrogen or argon active gas atmosphere. In addition, the subsequent treatment of other organic semiconductor layers is treated with an oxidizing or reducing gas such as oxygen or hydrogen, or an oxidizing or a bulk, etc., and the initiation of oxidation or reduction is particularly the case, for example, by a film. The increase or decrease in the density of the carrier is applied. Further, in a method called doping, the characteristics of the bulk layer can be changed by adding a trace amount of a group, a molecule, or a polymer to the organic semiconductor layer. For example, it can be doped with oxygen, hydrogen, hydrochloric acid, sulfuric acid, acid; Lewis acid such as PF5, AsF5, FeCl3, etc.; halogen current of iodine or the like is increased: m, preferably)), and can reach the organism by pinhole or the like The heat treatment was made. The heat treatment is preferably not particularly -3 hours. The gas can also be changed by reducing liquidity. A small atomic element, a primary atom such as an organic semi-conductive sulfonic acid; -29- 201247676 A metal atom such as sodium or potassium; various organic semiconductor materials. This can be achieved by contacting the gases with the organic semiconductor layer, by dipping into the solution, or by electrochemical doping. Such doping may be added to the ink after the preparation of the organic semiconductor layer, or during the synthesis of the organic semiconductor compound, or in the process of producing an organic semiconductor layer using an ink for producing an organic semiconductor device. It is added at the step of forming a film or the like. In addition, a doping material may be added to a material for forming an organic semiconductor layer during vapor deposition for co-evaporation, or may be mixed in a surrounding gas environment when an organic semiconductor layer is formed (in a doping material) The organic semiconductor layer is formed in the presence of the substrate, and further, the ions may be accelerated in a vacuum and doped with the film. The effect of such doping may be a change in electrical conductivity due to an increase or decrease in carrier density, a change in polarity of a carrier (P-type, N-type), a change in Fermi level, and the like. Such doping is often applied, particularly in semiconductor devices using an inorganic material such as germanium. (Regarding the protective layer) When the protective layer 7 is formed on the organic semiconductor layer, it has the advantage of suppressing the influence of the external gas to a minimum and stabilizing the electrical characteristics of the organic thin film transistor (refer to Fig. 2 (6) ). The material of the protective layer can be as described above. The film thickness of the protective layer 7 can be any film thickness depending on the purpose, and is usually from 10 nm to 1 mm. When the protective layer is formed into a film, various methods may be employed. When the protective layer is composed of a resin, for example, a method of applying a resin solution and drying it to form a -30-201247676 resin film; coating or vapor-depositing a resin may be mentioned. A method in which a monomer is subjected to polymerization, and the like. The film formation thickness can be cross-linked. When the protective layer is composed of an inorganic material, for example, a formation method in a vacuum program such as a sputtering method or a steaming method, or a formation method in a solution program such as a sol gel can be used. In the thin film transistor of the present invention, in addition to the organic semiconductor layer, a protective layer may be provided between the layers as necessary. These layers are sometimes beneficial for the stabilization of the electrical properties of the thin film transistor. According to the present invention, since diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene is used as an organic semiconductor material, it can be produced under a relatively low temperature process. Therefore, a flexible material such as a plastic sheet or a plastic film which cannot be used under conditions of exposure to high temperatures can be used as the substrate. As a result, it is possible to manufacture a lightweight and flexible component which is not easily damaged, and can be applied as a switching element of an active matrix of a display or the like. The thin film transistor of the present invention can also be applied as a digital component or analog component such as a memory circuit component, a signal driver circuit component, a signal processing circuit component, or the like. In addition, by combining these, a 1C card or a 1C tag can be created. Further, the thin film transistor of the present invention can be applied as a FET sensor by causing a change in the characteristics by external stimulation of a chemical substance or the like. Next, the organic EL device of the present invention will be described in detail. The organic EL element is a solid, and it can be used for applications such as self-luminous type large-area color display or illumination, and has been developed in many ways. This configuration is known to have a structure of a layer of a light-emitting layer and a charge transport layer between opposite electrodes of the cathode and the anode, and a structure between the counter electrodes. The structure of the electron transport layer, the light-emitting layer, and the hole transport layer: and a layer having three or more layers, and the like, and a single layer or the like. Here, the hole transport layer has a function of injecting a hole from the anode and transporting it to the light-emitting layer to facilitate the injection of the hole into the light-emitting layer and the function of blocking electrons. Further, the electron transport layer has a function of transferring electrons from the electrons and transporting the electrons to the light-emitting layer to facilitate electron injection, and a function of blocking the holes. In addition, the luminescence is detected by the recombination of the separately injected electrons and the holes, and the radiation emitted by the excitation photons during the process of radiation and loss of activity is detected as luminescence. The type of the organic EL device of the present invention will be described below. The organic EL device of the present invention has one or a plurality of organic thin films electrically formed on the anode and the cathode, and emits light by electric energy: the anode used in the organic EL device of the present invention is injected into the hole with holes. The function of the hole injection layer, the hole transport layer, and the light-emitting layer. In general, a metal oxide or alloy having a work function of 4.5 eV or more, a conductive material, or the like is suitable. Specifically, it is not particularly preferable, but a conductive metal oxide such as tin oxide (NESA), indium oxide, indium tin oxide (indium zinc oxide) or the like; gold, chromium, aluminum, iron, cobalt, or the like; a metal such as nickel or tungsten; an inorganic conductive material of copper iodide or sulfur; a polymer or carbon of polythiophene, polypyrrole, polyaniline, etc. Among these, ITO or NESA is preferably used. < Having a layer of the layer 3 The layer of light can be used to make the hole, in the layer of the cathode layer, the photon, the amount of the preferred interpole element. Electrode metal, limited, ITO) silver, platinum-plated copper, etc. Conductivity -32- 201247676 Anode, which can be used as many materials as necessary. The electric resistance of the anode is not particularly limited as long as it can supply a current to the element, and is preferably low in resistance. For example, since the ITO substrate below the sheet electrode has a substrate Ω/□ as the element electrode, it is preferably arbitrarily selected using a low-resistance resistor 値, and is usually used between 5 10 and 300 nm. Film formation by ITO or the like, plating method, electron beam method, sputtering method, and chemical reaction method. The electrode used in the organic EL device of the present invention is implanted in an electron injecting layer, an electron transporting layer, and a film. In general, the work function is small (approximately 4eV gold is more suitable. Specifically, uranium, gold, zinc 'aluminum, indium, chromium, lithium, sodium, potassium, calcium, and calcium are listed. In order to improve the efficiency of electron injection. In order to improve the element, sodium, potassium, calcium, and magnesium, an alloy containing such a low work function gold, or an electrode having a structure in which such a structure is laminated may be used. In the case of taking light from the cathode side, the film formation method may be low. The film formation method may be, for example, a vapor deposition method, an electron reaction method, or a coating method, but is not limited thereto. It is said that the current is limited, and from the viewpoint of the power consumption of the element, the power consumption of the charging of the two or more layers can be 300 Ω / □, but it can also be supplied. The thickness of the ITO may be -500 nm, preferably in the method, and may be, for example, steaming, coating, etc. The cathode is a metal or a combination of silver, copper, iron, and tin having an electro-optical layer function. Magnesium, etc., but without special limitation, preferably lithium, aluminum Silver and other metals. The electrode of the laminated structure is not on the anode side, the transparent electrode beam method of the warm film, the sputtering method, and the resistance of the cathode, as long as it is not particularly preferable as a low resistance, which is better than -33-201247676. The number is 1 〇〇 to several Ω / □. The film thickness is usually from 5 to 500 nm, preferably within the range. In addition, 'for the sealing and protection, it is also possible to use oxides such as cerium oxide, cerium oxide, cerium oxide, cerium oxide, nitrogen, etc., polyvinyl alcohol, vinyl chloride, hydrocarbon polymer molecules, etc. The cathode is protected and sealed together with cerium oxide, phosphorus pentoxide, and an oxygen dehydrating agent. Further, in order to take light, in general, it is preferable to form an electrode on a substrate having sufficient transparency in a long region of the element. A glass substrate or a polymer substrate is exemplified. The glass substrate can be used, an alkali-free glass, quartz or the like, and it is preferably a thickness of 0.5 mm or more as long as it has a thickness capable of maintaining mechanical and thermal separation. Regarding the quality, it is preferable that the amount of ions to be melted from the glass is small, and it is preferable that the glass is not used. The commercially available product may be used as a barrier coating film of SiO 2 or the like. Further, examples of the polymer other than glass include polycarbonate, polypropylene, polyether oxime, polyparaphenylene ester, and acrylic substrate. The organic thin film of the organic EL device of the present invention has one or a plurality of layers formed between the electrodes of the cathode. By having the fluorene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene contained therein, an element which emits light by electric energy can be obtained. In the present invention, one or more layers of an organic thin film, such as a hole transport layer, an electron transport layer, a hole transport light-emitting layer, a light-emitting layer, a hole barrier layer, an electron barrier layer, and a hole injection 1 0~3 OOnm Luminescent substrate with titanium, nitride, or fluorine-based calcium, etc. Glass-based alkali glass with a soda-lime glass strength. The substrate made of soda-lime glass is made of the second film of the invention of the anode, the "layer", the 'electronic input layer, the electric-34-201247676 sub-injection layer, the luminescent layer or the following composition example 9) A single layer that combines the functions of these layers. In the constitution of the layer forming the organic thin film in the present invention, the following constitution examples 1) to 9) can be used. Configuration Example 1) Hole transport layer/electron transport light-emitting layer. 2) Hole transport layer / luminescent layer / electron transport layer. 3) Hole transporting luminescent layer/electron transport layer. 4) Hole transport layer / luminescent layer / hole blocking layer. 5) Hole transport layer/light-emitting layer/hole stop layer/electron transport layer 〇 6) Hole transporting light-emitting layer/hole stop layer/electron transport layer. 7) In each of the combinations of the above 1) to 6), a hole injection layer is further provided before the hole transport layer or the hole transporting light-emitting layer. 8) In each of the combinations of the above 1) to 7), a layer of an electron injecting layer is further provided before the electron transporting layer or the electron transporting light emitting layer. 9) The materials used in the combination of the above 1) to 8) are separately mixed, and only one layer contains the composition of the mixed material. The above 9) may generally be a single layer formed by a material called a bi-carrier luminescent material; or a layer containing only a luminescent material and a hole transporting material or an electron transporting material. In general, by constructing a multilayer structure, it is possible to efficiently transport charges, i.e., holes and/or electrons, to recombine these charges. Further, since the quenching of the electric charge or the like -35 - 201247676 ' can be suppressed, the decrease in the stability of the element can be prevented and the luminous efficiency can be improved. The hole injection layer and the transport layer may be formed by laminating the hole transporting material alone or by laminating a mixture of two or more of the materials. As the hole transporting material, yttrium, ytterbium-diphenyl fluorene, bis-(3-methylphenyl)-4,4,-diphenyl-1,1'-diamine, Ν,Ν,-dinaphthyl-anthracene, anthracene,-diphenyl-4,4,-diphenyl-1, triphenylamines such as diamines; bis(indolyl carbazole) Or a bis(indenyl oxazole) type; a heterocyclic compound represented by a pyrazoline derivative, an anthraquinone compound, an anthraquinone compound, a triazole derivative, an oxadiazole derivative or a porphyrin derivative; In the system, a polycarbonate or a styrene derivative of the above monomer, a polyvinyl oxazole, a polydecane or the like is provided in the side chain. It is not particularly limited as long as it is a material which can form a film required for the production of a device and can inject a hole from the electrode and transport the hole. The hole injection layer which is provided between the hole transport layer and the anode for improving the hole injectability, and examples thereof include a phthalocyanine derivative, a starburst type amine such as m-MTDATA, and a polymer system. Produced by PEDOT and other polythiophene 'polyethylene carbazole derivatives. The electron transporting material must efficiently transport electrons from the negative electrode between the electrodes that impart electric fields. The electron transporting material, preferably having a high electron injection efficiency, can efficiently transport the injected electrons. Therefore, it is required to have a large electron affinity, a large electron mobility, a good stability, and it is difficult to produce a substance which is a trapping impurity at the time of manufacture and use. The substance satisfying such a condition can be exemplified by a quinoline derivative metal complex represented by a tris(8-quinoline)aluminum complex, a phenol ketone metal complex, an anthracene derivative, an anthrone derivative. , naphthoquinone imine derivatives, naphthalene dicarboxylic acid derivatives, oxazole derivatives, oxadiazole derivatives, thiazole derivatives, thiadiazole derivatives, triazole derivatives -36-201247676, bisstyrene derivatives The compound, the pyrazine derivative, the phenolin derivative, the benzoxazole derivative 'quinoxaline derivative, and the like are not particularly limited thereto. These electron transport materials can be used alone or in combination or in combination with different electron transport materials. The electron injecting layer provided between the electron transporting layer and the cathode for enhancing the electron injecting property may be a metal such as lithium or tantalum or lithium fluoride. The hole blocking layer is formed by using a hole blocking substance alone or by laminating or mixing two or more kinds of the substance. a hole-blocking substance, preferably phenanthroline, 2,9-dimethyl-4,7-diphenyl-l, l-phenanthroline, etc. a diene derivative, a quinoline derivative metal complex, an oxadiazole derivative, an oxazole derivative, or the like. The hole blocking substance ' is not particularly limited as long as it can prevent the hole from flowing from the cathode side to the outside of the element and lowering the luminous efficiency. The light-emitting layer means an organic film which can emit light, for example, a hole transporting layer having a strong light-emitting property, an electron transporting layer or a double-carrier transporting layer. The light-emitting layer may be formed of a light-emitting material (host material, dopant material, etc.), which may be a mixture of the host material and the dopant material, or may be any of the host materials alone. The host material and the dopant material may each be a 'or a combination of a plurality of materials. The dopant material may be included in whole or in part of the host material. The dopant material may be laminated or dispersed' may be any of them. The light-emitting layer may, for example, be the above-mentioned hole transport layer or electron transport layer. The material used for the light-emitting layer may, for example, be a oxazole derivative, an anthracene derivative, a naphthalene derivative, a phenanthrene derivative, a phenylbutadiene derivative, a styryl derivative, a court derivative, a phenanthrene derivative, or a saliva.廖衍-37- 201247676 Biological, tetracene derivative, anthracene derivative, quinacridone derivative, coumarin derivative, porphyrin derivative or phosphorescent metal complex (Ir complex, Pt error Compound, Eu complex, etc.). The method for forming such a film generally includes a resistance heating vapor deposition method, an electron beam evaporation method, a sputtering method, a molecular layer method, or the like, or a die casting method, a spin coating method, or a soaking of a solution program. Coating method such as coating method, doctor blade coating method, wire bar coating method, spray coating method, or printing method such as inkjet printing, screen printing, lithography, letterpress printing, microcontact printing method, etc. The method of flammable lithography, or a combination of a plurality of such methods. The thickness of each layer cannot be limited depending on the resistance 値 and charge mobility of each substance, but may be selected from 0.5 to 50,000 nm. It is preferably from 1 to 1 000 nm, particularly preferably from 5 to 500 nm. In the organic thin film of the organic EL device of the present invention, the diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene of the present invention is contained in In one or a plurality of layers of a thin film such as a light-emitting layer, a hole transport layer, and an electron transport layer which are present between the electrodes of the anode and the cathode, an element which can efficiently emit light even with low electric energy can be obtained. In the organic EL device of the present invention, the diterpene [2,3-b: 2',3'-f]thiophene [3, of the present invention can be formed by forming one layer or a plurality of layers between the electrodes of the anode and the cathode. 2-b] thiophene. In particular, the site of the diterpene [2,3-b:2',3'-f]thieno[3,2-b]thiophene of the present invention is not limited, but can be preferably used as a hole transport. a layer or luminescent layer, or a host material in combination with a dopant material. In the organic EL device of the present invention, the diterpene [2,3-b: 2',3'--38-201247676 f]thieno[3,2-b]thiophene of the present invention can be preferably used as a hole Transport layer or luminescent layer. For example, it may be used in combination or in combination with the aforementioned electron transporting material or hole transporting material, luminescent material or the like. Preferably, a quinoline derivative metal complex represented by tris(8-quinoline)aluminum complex, a phenol ketone metal complex, an anthracene derivative, an anthrone derivative, naphthoquinone is exemplified. Imine derivative, naphthalene dicarboxylic acid derivative, bisstyrene derivative, pyrazine derivative, pheniramine derivative 'benzoxazole derivative, quinoxaline derivative, triphenylamine, double (N - allyl carbazole) or bis (N-alkyl azole), a heterocyclic compound represented by a pyrazoline derivative, a bottom compound, an anthraquinone compound, or an oxadiazole derivative, but no particular limited. These may be used alone or in combination or in combination with different materials. The specificity of the dopant material when the diterpene [2,3-b : 2,3,-f]thieno[3,2-b]thiophene of the present invention is used as a host material in combination with a dopant material For example, an anthracene derivative such as bis(diisopropylphenyl)phosphonium tetracarboxylate, an anthrone derivative, 4-(dicyanomethylene)-2-methyl·6-(pair can be used. Dimethylaminostyryl)-4Η-pyran (DCM) or a metal phthalocyanine derivative of the analog, magnesium phthalocyanine, aluminum chlorophthalocyanine, etc., rosin compound, deazaflavin derivative, fragrant Bean derivatives, oxazine compounds, squaraine compounds, lycopene compounds, Nile red, 5-cyanopyrrole-BF4 complexes, etc. Porphyrin or ortho-metal, such as Eu complex or phenanthroline or phenanthroline as a ligand, such as Eu complex or complex, RU complex, Pi complex, 〇s complex, etc. A metal complex or the like is used as the phosphorescent material, but is not limited thereto. In addition, when mixing two kinds of dopant materials, it is also possible to use a red fluorene-like auxiliary dopant to efficiently move the energy from the host pigment of -39-201247676 to obtain an improved color purity. In any case, in order to obtain high luminance characteristics, it is preferred that the doped fluorescence quantum yield is high. When the amount of the dopant material to be used is too large, concentration dimming is caused, and therefore it is usually used in an amount of 30% by mass or less based on the host material. It is preferably 20% by mass or less, more preferably 10% by mass or less. The method of doping the dopant material into the host material in the light-emitting layer may be formed by co-evaporation with the host material, or may be previously mixed with the host material and simultaneously vapor-deposited. In addition, it can also be sandwiched and used in the body material. At this time, it is also possible to cooperate with the host material layer as one or two or more dopant layers. These dopant layers may be formed separately or mixed. In addition, the dopant material may be dissolved or dispersed in polyvinyl chloride, polycarbonate, polystyrene, polystyrenesulfonic acid, poly(N-vinylcarbazole), poly(methyl) as a polymer binder. Methyl acrylate, polybutyl (meth) acrylate, polyester, polyfluorene, polyphenylene oxide, polybutadiene, hydrocarbon resin, ketone resin, phenoxy resin, polyfluorene, polyamine, ethyl cellulose a solvent-soluble resin such as vinyl acetate, ABS resin, or urethane resin, or a phenol resin, a xylene resin, a petroleum resin, a urea resin, a melamine resin, an unsaturated polyester resin, an alkyd resin, or a ring. A curable resin such as an oxygen resin or a polyfluorene oxide resin is used. The method for forming a film used in the organic EL device of the present invention may be a diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene or a composition of the present invention. And adopting the general vacuum program of resistance heating evaporation method, electron beam evaporation method 'sputtering method, molecular layering method, or solution programming die casting method-40-201247676, spin coating method, immersion coating method, Coating method such as blade coating method, wire bar coating method, spray coating method, or printing method such as inkjet printing, screen printing, lithography, letterpress printing, etc., micro-contact printing method, etc. The technique of the shadow technique, or a combination of a plurality of such methods to carry out the 〇 resistance heating evaporation method, the electron beam evaporation method, the sputtering method, the molecular layering method, or the dissolution or dispersion in a solvent or a resin to coat The method of the cloth (the spin coating method, the die casting method, the immersion coating method), the LB method, the inkjet method, and the like are not particularly limited. Generally, resistance heating vapor deposition is preferred in terms of characteristics. The thickness of each layer is set in accordance with the electric resistance 値 of the luminescent material, and therefore it is not limited, but may be selected from 0.5 to 500 nm. It is preferably 1 to 100 nm, and more preferably 5 to 5 OO nm. The organic EL device of the present invention can be preferably used as a flat display. In addition, it can also be used as a flat backlight, in which case any one that emits colored light or emits white light can be used. The backlight is mainly used for the purpose of improving the visibility of a display device that does not emit light, and can be used in a liquid crystal display device, a watch, an audio device, a car dashboard, a display panel, a logo, and the like. In particular, a liquid crystal display device, in which a conventional backlight for personal computer use is composed of a fluorescent lamp and a light guide plate, is difficult to be thinned, and the backlight of the light-emitting element of the present invention is characterized by being thin and lightweight. Therefore, the above problems can be eliminated. The same is very useful for lighting. When the diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene of the present invention is used, an organic EL display device having high luminous efficiency and long life can be obtained. Further, by combining the thin film transistor of the present invention, it is possible to inexpensively supply an organic EL display device in which the on-off phenomenon of the applied voltage can be controlled with high precision in the electric characteristics of the -41 - 201247676. (Regarding Photoelectric Conversion Element) By applying the organic semiconductor characteristics of the diterpene [2,3-b : 2',3'-f]thieno[3,2-b]thiophene of the present invention, it is expected to be applicable. It is a photoelectric conversion element that is flexible, low-cost, and easy to manufacture. In the organic solar cell element, since the electrolyte is not used as the dye-sensitized solar cell, it is advantageous in terms of improvement in flexibility and life, and conventionally, a combination of a conductive polymer and fullerene is used. The development of solar cells for organic thin film semiconductors is mainstream, but there is still a problem of power conversion efficiency. In general, the structure of an organic solar cell element is the same as that of a lanthanide solar cell, and is a layer in which a cathode and an anode are sandwiched to generate electricity, and a hole and an electron generated by absorbing light are received on each electrode. The function of solar cells. The power generation layer is composed of a P-type donor material, an N-type acceptor material, and other materials such as a buffer layer, and an organic material is referred to as an organic solar battery. The structure includes a Kent base joint, a heterojunction joint, a bulk heterojunction, a nanostructure joint, a hybrid molding, etc., and each of the materials efficiently absorbs the incident light to generate a charge, and the resulting The charge (holes and electrons) is separated, transported, and collected to function as a solar cell. Next, the constituent elements in the solar battery element of the present invention will be described. The anode and cathode ' in the solar cell element of the present invention are the same as the organic EL element described in the aforementioned -42-201247676. Since it is necessary to efficiently take light, it is preferably constituted as an electrode having transparency in the absorption wavelength region of the power generation layer. Further, in order to have good solar cell characteristics, the sheet resistance is preferably 20 Ω / □ or less. The power generation layer in the solar cell element of the present invention is formed by forming an organic film containing at least the diterpene [2,3-b: 2,3,-f]thieno[3,2-b]thiophene of the present invention. One layer or a plurality of layers are formed. Although the configuration shown previously can be employed, it is basically composed of a P-type donor material and an N-type acceptor material and a buffer layer. The P-type donor material 'is basically a compound which can transport a hole like the hole injection and hole transport layer described in the item of the organic EL element, or a poly-p-stene derivative, polythiophene. A 7-conjugated polymer of a derivative such as a polyfluorene derivative or a polyaniline derivative, or a carbazole or other polymer having a side chain of a heterocyclic ring. Examples of the low molecular compound include a pentacene derivative, a erythrene derivative, a porphyrin derivative, a phthalocyanine derivative, a saturated blue derivative, a quinacridone derivative, a merocyanin derivative, and a cyanine. a derivative, a squaraine derivative, a benzoquinone derivative, and the like. The N-type acceptor material is basically a compound capable of transporting electrons in the same manner as the electron transport layer described in the item of the organic EL element, or an oligomer or a polymer having pyridine and the derivative in the skeleton, a polymer having quinoline and an oligomer or polymer of the derivative, a polymer having benzophenanthroline and the derivative, a cyano-polyphenylene derivative (CN_PVV, etc.) Material 'either a fluorinated phthalocyanine derivative, a phenanthrene derivative, a naphthalene derivative, 2,9-dimethyl-4,7-diphenyl-I, 10-phenrolene derivative-43-201247676, C60 Or a low molecular material such as a fullerene derivative such as C70 or PCBM. It is preferable to efficiently absorb various kinds of light and generate electric charges, and the higher the absorption coefficient of the materials used, the better. The diterpene [2,3-b: 2',3'-f]pyrano[3,2-b]thiophene of the present invention is particularly preferably used as a P-type donor material. The method for forming a film for a power generation layer of the organic solar cell of the present invention can be the same as that described in the prior art of an organic EL device. The film thickness of the film or the like varies depending on the configuration of the solar cell. However, in order to sufficiently absorb light and prevent short-circuiting, the thicker is better, but the shorter the distance of the charge generated by the transport, the better. Thinner. In general, the power generation layer is preferably 10 to 5000 (for photosensors, image sensors) by applying the diterpene [2,3-b: 2',3'-f]thiophene of the present invention. [3,2-b] The physical properties and semiconductor properties of thiophene are expected to be applicable as photosensors or image sensors. The device may be an image sensor as a solid-state image sensor or a charge-coupled device (CCD) having a function of converting an image signal such as an animation or a still image into a digital signal, and may also be expected to be used as a cheaper device. Further, various sensors such as a large-area processing property and a flexible function inherent to an organic substance can be utilized. (About Organic Semiconductor Laser Element) Since the diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene-44-201247676 of the present invention is a compound having organic semiconductor characteristics Therefore, it can be expected to be applied as an organic semiconductor laser element. That is, as long as the resonator structure can be assembled to the organic semiconductor element containing the diterpene [2,3-b : 2',3'-f]thieno[3,2-b]thiophene of the present invention, efficiently By injecting a carrier and sufficiently increasing the density of the excited state, it is expected that the laser can be amplified to generate laser oscillation. In the past, it has been proposed to observe only laser oscillations based on photoexcitation, and it is difficult to perform high-density carriers injected into an organic semiconductor element to be necessary for laser oscillation by electrical excitation. High-density excitation state, but by using an organic semiconductor element containing the diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene of the present invention The possibility of causing high-efficiency luminescence (field luminescence) is expected. [Examples] The present invention will be described in more detail in the following examples, but the present invention is not limited to the examples. In the embodiment, "%" indicates "% by mass" unless otherwise specified. Further, when the reaction temperature is not specifically specified, it is described as the internal temperature in the reaction system. The various compounds obtained in the examples can be determined by various measurements such as mp (melting point), NMR (1H, 13C), IR (infrared absorption spectrum) MS (mass spectrometry), elemental analysis, etc., as necessary. formula. The measuring machine is as follows. Mp : Liuben micro melting point measuring device MP-S3 NMR : JEOL Lambda 400 spectrometer IR : Shimadzu Fourier transform infrared spectrophotometer IR Prestige- -45 - 201247676 2400 CHN elemental analyzer MS Spectrum: Shimadzu QP-5 0 5 0A Elemental analysis :Synthesis of Parkin Elmer 2400 Diterpene [2,3-b : 2',3'-f]thieno[3,2-b]thiophene (Synthesis of 〇3-Methylsulfate-2_methoxyoxindole 1 0]
在 〇C 下將 1.67M 的正- BuLi(86ml,144mmol)己院 溶液’加入於作爲化合物(1 )之2-甲氧蒽(I5.0g, 72mmol)的THF( 520ml)溶液中。在室溫下攪拌1小時 後,在〇°C下加入二甲基二硫醚(13ml,150mmol)並在 室溫下攪拌7小時。將混合物投入於水(100ml ),以蒸 發器將THF濃縮,並過濾所析出之結晶。過濾後以水( 100ml )洗淨,再以甲醇(100ml )洗淨,而得到成爲白色 結晶之化合物(2)的3-甲基硫-2-甲氧蒽(18.3g,定量) 〇 mp 176.5-177.5 °C : 'H NMR ( 400MHz » CDC13 ) δ 2.58(s,3H) ,4.03(s,3H) ,7_16(s’lH) ,7.39( ddd,J= 8.2,4.9 * 1.9Hz ’ 1H) ’ 7.42 ( ddd,J= 8.2 ’ 4.9,1.9Hz,1H > 1H ) 7.93 ( d 7.55 ( s - 1H ) ,7.92 ( d,J = 9.5Hz 9.5Hz,1 H ) ,8·22 ( s,1H ) ,8.24 -46 - 201247676 (s > 1Η ) ; 13C NMR ( 125MHz > CDC13) δ 14.7 > 56.2 »A 1.67 M solution of n-BuLi (86 ml, 144 mmol) in THF was added to a solution of 2-methoxyoxane (15.0 g, 72 mmol) in THF (520 ml) as Compound (1). After stirring at room temperature for 1 hour, dimethyl disulfide (13 ml, 150 mmol) was added at EtOAc and stirred at room temperature for 7 hr. The mixture was poured into water (100 ml), and the THF was concentrated by an evaporator, and the crystals precipitated were filtered. After filtration, it was washed with water (100 ml), and then washed with methanol (100 ml) to give 3-methylthio-2-methoxyindole (18.3 g, quantitative) as white crystal compound (2) 〇mp 176.5 -177.5 °C : 'H NMR ( 400MHz » CDC13 ) δ 2.58(s,3H) , 4.03(s,3H) ,7_16(s'lH) ,7.39( ddd,J= 8.2,4.9 * 1.9Hz ' 1H) ' 7.42 ( ddd, J = 8.2 ' 4.9, 1.9 Hz, 1H > 1H ) 7.93 ( d 7.55 ( s - 1H ) , 7.92 ( d, J = 9.5 Hz 9.5 Hz, 1 H ) , 8 · 22 ( s, 1H) , 8.24 -46 - 201247676 (s > 1Η ) ; 13C NMR ( 125MHz > CDC13) δ 14.7 > 56.2 »
128.4 > 128.9 > 131.0 ' 131.0 ' 131.7 > 131.8 > 154.6 ; EIMS ( 70eV ) m / z = 2 5 4 ( M+ ) 。Anal Calcd for C16H14OS: C,75·55; H,5.55%。Found: C,75.26; H, 5.33%。 (Π) 2 -羥基-3-甲基硫蒽的合成 【化1 1】128.4 > 128.9 > 131.0 ' 131.0 ' 131.7 > 131.8 >154.6; EIMS ( 70eV ) m / z = 2 5 4 ( M+ ) . Anal Calcd for C16H14OS: C, 75·55; H, 5.55%. Found: C, 75.26; H, 5.33%. (Π) Synthesis of 2-hydroxy-3-methylthioindole [Chemical 1 1]
在-78。(3 下將 BBr3 (ca. 2M,50ml’ lOOmmol)二氯甲 烷溶液,滴入於3 -甲基硫-2-甲氧蒽(14.5g,57mmol)的 二氯甲烷(2 0 0 m 1 )溶液中。在室溫下攪拌5小時後’在 〇 °C下加入冰(約5 0 g )。以二氯甲烷(2 0 0 m 1 X 3 )萃取出 混合物,以飽和食鹽水(l〇〇mix3 )洗淨’並以MgS04乾 燥而濃縮,而得到成爲白色結晶之2 -經基-3-甲基硫蒽( 13.7g,定量)。 mp 1 75.6〜1 76.5 °C ; NMR ( 400MHz,CDC13 ) 5 2.49 ( s > 3H ) ,6.54(s,lH) > 7.3 1 ( s > 1H ) ,7.39( d d d,J = 1 0.7,6.6,1.4 Hz,1 H ) ,7.41 ( s,1H) > 7.43 (ddd,J = 1 0.7,6.6,1.4Hz,1 H ) ,7 _ 9 1 ( d,J = 8 · 8 H z ,1H) - 7.93 ( d > J = 8.8Hz > 1H ) ,8.14(s,lH), 3.22 ( s * 1H ) ,8.30 ( s,1H) ; 13C NMR ( 100MHz - -47- 201247676 CDC13 ) <5 19.8 > 107.8 > 124.2 > 125.0 > 1 26.2 - 1 26.2 - 126.8,128.0,128.5,128.6,130.8,132.8,133.0, 1 33.8,15 1 .7 ; IR ( KBr ) v 35 1 0cm·1 ( OH ) ; EIMS ( 7 0 e V ) m/z= 240 ( M+) 0 A n a 1 C a 1 c d fo r C i 5 Η 12 0 S : C, 74.66 ; H > 4.72%。Found: C > 74.70 ; H,4.84%。 (III) 3-(甲基硫)蒽-2-基三氟甲烷磺酸酯的合成 【化1 2】At -78. (3) BBr3 (ca. 2M, 50 ml '100 mmol) in dichloromethane was added dropwise to 3-methylthio-2-methoxyindole (14.5 g, 57 mmol) in dichloromethane (2 0 0 m 1 ) In the solution, after stirring for 5 hours at room temperature, add ice (about 50 g) at 〇 ° C. Extract the mixture with dichloromethane (200 m 1 X 3 ) to saturate saline (l〇 〇mix3) was washed and concentrated with MgS04 to give a white crystal of 2-bromo-3-methylthioindole (13.7 g, quantitative). mp 1 75.6~1 76.5 ° C; NMR (400 MHz, CDC13) 5 2.49 ( s > 3H ) , 6.54 (s, lH) > 7.3 1 ( s > 1H ) , 7.39 ( ddd , J = 1 0.7, 6.6, 1.4 Hz, 1 H ) , 7.41 ( s, 1H) > 7.43 (ddd, J = 1 0.7, 6.6, 1.4 Hz, 1 H ) , 7 _ 9 1 ( d, J = 8 · 8 H z , 1H) - 7.93 ( d > J = 8.8 Hz > ; 1H ) , 8.14 (s, lH), 3.22 ( s * 1H ) , 8.30 ( s, 1H) ; 13C NMR ( 100MHz - -47 - 201247676 CDC13 ) <5 19.8 > 107.8 > 124.2 > 125.0 > ; 1 26.2 - 1 26.2 - 126.8, 128.0, 128.5, 128.6, 130.8, 132.8, 133.0, 1 33.8, 15 1 .7 ; IR ( KBr ) v 35 1 0cm· 1 ( OH ) ; EIMS ( 7 0 e V ) m/z = 240 ( M+ ) 0 A na 1 C a 1 cd fo r C i 5 Η 12 0 S : C, 74.66 ; H > 4.72%. Found: C >74.70; H, 4.84%. (III) Synthesis of 3-(methylthio)indol-2-yltrifluoromethanesulfonate [Chemical 1 2]
在0°C下將三氟甲烷磺酸酐(l〇.〇ml,54.6mmol)二 氯甲烷溶液,加入於2-羥基-3-甲基硫蒽(lO.lg,42mmol )與三乙胺(16_0ffll,115mmol)的二氯甲烷(400ml)溶 液中。在室溫下搅拌4 2小時並以水(5 0 m 1 )稀釋後,加 入稀鹽酸(4M,100ml)。以二氯甲烷(i〇〇mlx3)萃取 出此,然後與藉由3次萃取所得之有機層一同以飽和食鹽 水(100mlx3 )洗淨’並以MgS04乾燥而濃縮,而得到成 爲黃色固體之3-(甲基硫)蒽-2-基三氟甲烷磺酸酯( 1 5.5g,定量)。 mp 105.5-106.0 °C : 'H NMR ( 400MHz - CDC13) δ 2.63 (s,3H) ’ 7.50( ddd,J=9.6,6.3,1 . 8Hz > 1H )A solution of trifluoromethanesulfonic anhydride (10 ml, 54.6 mmol) in dichloromethane was added at 0 ° C to 2-hydroxy-3-methylthioindole (10 g, 42 mmol) and triethylamine ( 16_0ffll, 115 mmol) in dichloromethane (400 mL). After stirring for 4 hours at room temperature and diluting with water (50 m 1 ), dilute hydrochloric acid (4M, 100 ml) was added. This was extracted with dichloromethane (i 〇〇 ml x 3 ), and then washed with saturated brine (100 ml×3 ) together with the organic layer obtained by the three extractions, and concentrated by drying with MgS04 to give a yellow solid. -(Methylthio)indole-2-yltrifluoromethanesulfonate (15.5 g, quantitative). Mp 105.5-106.0 °C : 'H NMR (400MHz - CDC13) δ 2.63 (s,3H) ' 7.50 ( ddd, J=9.6, 6.3, 1. 8Hz > 1H )
,7.51 (ddd,J=9.6,6.3,l.8Hz,1H ) > 7.78 ( s > 1H ),7.88(s,lH) > 7.97 ( dd - J = 5.5 > 2.0Hz - 1 H ), 7.98 ( dd > J = 5.5 > 2.0Hz - 1 H ) ,8.34(s,1H ) ,8.38 -48 - 201247676 (s ’ 1H) : 13c NMR ( 125MHz,CDC13 ) δ 15.8 · 119.0 ,(q,J=319Hz) ,119.5,125.4,126.2,126.4,126.8 ,127.1,1 2 8.4 ( x 2 ) - 1 29.0 - 1 3 0.6 > 131.0 > 132.0 ' 132.9,145.3 ; IR ( KBr) u 1 429 1 207cm_1 ( -O-SO2-); EIMS ( 70eV ) m / z = 3 72 ( M+ ) 。Anal Calcd for (:16^30山:C,51.61 ; H,2.98%。Found: C,51.57 ;H,2.67%。 (IV)三丁基甲錫烷基乙炔的合成 【化1 3】, 7.51 (ddd, J=9.6, 6.3, l.8 Hz, 1H) > 7.78 ( s > 1H ), 7.88 (s, lH) > 7.97 ( dd - J = 5.5 > 2.0 Hz - 1 H ) , 7.98 ( dd > J = 5.5 > 2.0 Hz - 1 H ) , 8.34 (s, 1H ) , 8.38 -48 - 201247676 (s ' 1H) : 13c NMR ( 125MHz, CDC13 ) δ 15.8 · 119.0 , (q , J=319Hz), 119.5, 125.4, 126.2, 126.4, 126.8, 127.1, 1 2 8.4 ( x 2 ) - 1 29.0 - 1 3 0.6 > 131.0 > 132.0 ' 132.9, 145.3 ; IR ( KBr ) u 1 429 1 207cm_1 ( -O-SO2-); EIMS ( 70eV ) m / z = 3 72 ( M+ ). Anal Calcd for (:16^30: C, 51.61; H, 2.98%. Found: C, 51.57; H, 2.67%. (IV) Synthesis of tributylstannyl acetylene [Chemical 1 3]
NaC^-H -► Bu3Sn-^H 於氮氣環境中,在〇°C下將氯化三丁基錫(8.6ml, 32mmol)加入於18w%Na乙炔的甲苯與礦物油的分散油( 10ml,8_5g,32mmol)之 THF(60ml)溶液中。在室溫下 攪拌1 7小時後,以己烷萃取出混合物並以食鹽水洗淨。 混合有機層並以MgS04乾燥後濃縮。進行減壓蒸餾( 85〜120°C,約0.7mmHg) ’而得到成爲無色油狀物質之三 丁基甲錫烷基乙炔(3.6g,34%) » 1H NMR ( 400MHz - CDC13 ) <5 0.91 ( t , 9H,J = 8.0Hz ) ,1.02 ( t * 8H ' J — 8.0Hz) > 1.35 ( sextet,6H’ T = 8.0Hz) ,1.58 ( quintet ’ 6H ’ J = 8.0Hz) ,2.20 ( s * 1H) (V) 1,2-雙(三丁基甲錫烷基)乙烯(化合物(3) -〇5) -49- 201247676 的合成 【化1 4】NaC^-H -► Bu3Sn-^H Tributyltin chloride (8.6ml, 32mmol) was added to 18w% Na acetylene in toluene and mineral oil dispersion oil (10ml, 8_5g, under 氮气°C). 32 mmol) in THF (60 ml). After stirring at room temperature for 17 hours, the mixture was extracted with hexane and washed with brine. The organic layers were combined and dried over MgS04 and concentrated. Distillation under reduced pressure (85 to 120 ° C, about 0.7 mmHg) to give tributylstannyl acetylene (3.6 g, 34%) as a colorless oily material. <1H NMR (400 MHz - CDC13) <5 0.91 ( t , 9H, J = 8.0Hz ) , 1.02 ( t * 8H ' J — 8.0Hz ) > 1.35 ( sextet , 6H' T = 8.0Hz ) , 1.58 ( quintet ' 6H ' J = 8.0Hz ) , 2.20 ( s * 1H) (V) 1,2-bis(tributylstannyl)ethylene (compound (3) -〇5) -49- 201247676 Synthesis [Chemical 1 4]
Bu3Sn^H -^ BU3Sf1s^SnBu3 (3)-05 於氮氣環境中,將偶氮雙異丁腈(l〇〇mg, )加入於三丁基甲錫烷基乙炔(1.6g,5 mmol ) 丁基錫(1.3ml,5mmol)之甲苯(20ml)溶液中 下攪拌該混合物1 7小時,在9 0 °C下加熱攪拌, 2〇ml )後進行濃縮。以己烷萃取出該混合物並以 淨萃取液,而得到成爲無色油狀物質之1,2-雙( 錫烷基)乙烯(化合物(3)-05) (3.0g,90%) 1H NMR ( 400MHz ’ CDC13 ) <5 0.8 6-0.9 1 ( .1 5 H ) ,1.31 (sextet,6H,J = 8.0Hz) ,1.50 ,6H,J= 8.0Hz ),6.88 ( s,2H ) (VI)反式-1,2-雙(3-甲基硫葱·2-基)乙院的合 【化15】 0 · 6 0 mm ο 1 與氫化三 。在室溫 加入水( 食鹽水洗 三丁基甲 〇 multiplet (quintet 成Bu3Sn^H -^ BU3Sf1s^SnBu3 (3)-05 Add azobisisobutyronitrile (l〇〇mg, ) to tributylstannyl acetylene (1.6g, 5mmol) butyltin (1.3) under nitrogen atmosphere The mixture was stirred under a solution of ml (5 ml) in toluene (20 ml) for 1 hour, heated and stirred at 90 ° C, and then concentrated. The mixture was extracted with hexane and purified to give 1,2-bis(stannyl)ethene (compound (3)-05) (3.0 g, 90%) as a colorless oily material. 400MHz ' CDC13 ) <5 0.8 6-0.9 1 ( .1 5 H ) , 1.31 (sextet, 6H, J = 8.0Hz), 1.50 , 6H, J = 8.0Hz ), 6.88 ( s, 2H ) (VI) Trans-1,2-bis(3-methylsodium sulphate 2-yl) yoke compound [Chemical 15] 0 · 6 0 mm ο 1 with hydrogenation III. Add water at room temperature (salt washing with tributylmethyl hydrazine multiplet (quintet into
於氮氣環境中’將Pd(PPh3)4 ( i.2g ’ K 加入於3-(甲基硫)葱-2_基三氟甲院 H.2g,30觀。"與!,2·雙(三丁基甲錫院基) 合物(3) -05) ( ’ 15.〇_〇丨)的 DMF ( 1 液中,並在1〇〇。(;下於暗處加熱17小時。冷卻並In a nitrogen atmosphere, 'Pd(PPh3)4 (i.2g 'K was added to 3-(methylsulfate) onion-2_based trifluoromethane H.2g, 30. "and!,2·double (tributyltinyl) compound (3) -05) ( ' 15.〇_〇丨) of DMF (in 1 liquid, and at 1 〇〇. (; under the dark for 17 hours. Cool and
Ommol » 磺酸酯( 乙烯(化 1 Oml )溶 以水稀釋 -50- 201247676 ’過濾所析出之結晶,以水(l〇〇ml ) '乙醇(5〇ml )洗 淨’而得成爲黃色固體之化合物(4)的反式-1,2-雙(3-甲基硫蒽-2-基)乙烷(3.9g,55%)。Ommol » sulfonate (ethylene (1 ml) dissolved in water -50 - 201247676 'The crystals precipitated are filtered and washed with water (l〇〇ml ) 'ethanol (5 〇ml) to give a yellow solid The trans-1,2-bis(3-methylthioindol-2-yl)ethane of the compound (4) (3.9 g, 55%).
mp > 3 00 °C ; 'H NMR ( 400MHz,CDC13 ) δ 2.66 ( s ,6H ) ’ 7.44 ( dd . J= 5.0,4.4Hz,4H ) ,7.75 ( s,2H )’ 7.78 ( s ’ 2H) ,7.97 ( d,J = 9.6Hz,2H ) ,7.98 ( d ,J=9.6Hz,2H) ,8.27(s,2H) > 8.30 ( s - 2H ), 8.44 ( s ’ 2H) ; 13C NMR ( 100MHz > CDC13) <5 16.8 > 124.2,124.9,125.7,125.7,126.0,126.8,126.9, 128.5,128.6,129.2,130.6,132.0,132.8,136.5, 147.3;IR(KBr)1485,1426,1024,957,862,741cnT 1 ; EIMS ( 70eV) m / z = 472 ( M+) o Anal Calcd for C32H24S2: C,81.31 ; H,5.12%。Found: C,81.21 ; H, 4.90% » (VII)二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩的合成 【化1 6】Mp > 3 00 ° C ; 'H NMR ( 400 MHz , CDC 13 ) δ 2.66 ( s , 6H ) ' 7.44 ( dd . J = 5.0, 4.4 Hz, 4H ) , 7.75 ( s, 2H ) ' 7.78 ( s ' 2H ), 7.97 ( d, J = 9.6 Hz, 2H ) , 7.98 ( d , J = 9.6 Hz, 2H) , 8.27 (s, 2H) > 8.30 ( s - 2H ), 8.44 ( s ' 2H) ; 13C NMR (100MHz > CDC13) <5 16.8 > 124.2, 124.9, 125.7, 125.7, 126.0, 126.8, 126.9, 128.5, 128.6, 129.2, 130.6, 132.0, 132.8, 136.5, 147.3; IR (KBr) 1485, 1426, 1024,957,862,741cnT 1 ; EIMS ( 70eV) m / z = 472 ( M+) o Anal Calcd for C32H24S2: C,81.31 ; H, 5.12%. Found: C,81.21 ; H, 4.90% » (VII) Synthesis of diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene [Chem. 1 6]
將硏磨成粉末狀之碘(59g,232 mmol)與反式-1,2-雙(3-甲基硫蒽-2-基)乙烷(3.8g,8.0mmol)加入於乙 酸(250ml ),進行1 1小時的加熱回流。以蒸餾來去除過 剩的乙酸,加入飽和NaHS03 7JC溶液(200ml )並攪拌1 小時。進行過濾並以水(l〇〇ml )、丙酮(l〇〇ml )、二氯 -51 - 201247676 甲烷(100ml )洗淨結晶,而得成爲深紅色固體之二 [2,3-b: 2’,3’-f]噻吩并[3,2,b]噻吩(DATT) (3.8g,定 )。進行昇華精製(約400°C,l(T2Pa以下,氮氣回流 )’從氯苯中進行再結晶而得到以產率計爲5 0%的二 [2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩。 m p. > 3 Ο 0 °C ; EIMS (70eV) m/z= 440 (Μ+) 。Anal CalcdThe iodine (59 g, 232 mmol) pulverized into powder form and trans-1,2-bis(3-methylthioindol-2-yl)ethane (3.8 g, 8.0 mmol) were added to acetic acid (250 ml). , heating and refluxing for 1 hour. Excess acetic acid was removed by distillation, and saturated NaHS03 7JC solution (200 ml) was added and stirred for 1 hour. Filtration and washing with water (l〇〇ml), acetone (l〇〇ml), dichloro-51 - 201247676 methane (100 ml) to obtain a dark red solid [2,3-b: 2 ',3'-f]thieno[3,2,b]thiophene (DATT) (3.8 g, fixed). Sublimation purification (about 400 ° C, l (less than T2Pa, nitrogen reflux)' is recrystallized from chlorobenzene to obtain bis[2,3-b: 2',3'- in terms of yield of 50%. f] thieno[3,2-b]thiophene m p. > 3 Ο 0 °C ; EIMS (70eV) m/z = 440 (Μ+) . Anal Calcd
C30H16S2 : C,81.78 : H,3.66%。Found : c,81 38 ; H 3.52%。Amax= 550-570nm(薄膜時)。 比較例1 按照專利文獻3,依循下列反應式(4 )來進行二 [2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩的合成。 反應式(4-1)中,目的化合物之3-(甲基硫)葱 甲酸,是以產率80 %作爲與在1位導入有甲基硫基之異 物的混合物而得。從依據質子N MR所進行之鑑定φ, 得知其係目的物(3位)與副產物(1位)爲4 : 1的比 之混合物。使用該混合物來進行反應式(4-2 )所示之 合反應,可得到以約50%的純度(依據質子NMR所進 之鑑定)含有目的物的反式-1,2-雙(3-甲基硫恵-2-基) 垸之粗製品。最後藉由反應式(4-3)所示之環化反應 得到含有二蒽[2,3-b : 2’,3’-f]噻吩并[3,2-b]噻吩之粗製 。藉由重複對此進行昇華精製及再結晶,可得目的化合 ’但與本申請案的製造方法相比,中間物雜質極多,不 蒽 量 下 蒽 for 蒽 2- 構 可 率 偶 行 乙 , 品 物 僅 •52- 201247676 最終總產率大幅劣化’用以去除此等雜質之精製步驟亦極 爲繁瑣。 【化1 7】C30H16S2: C, 81.78: H, 3.66%. Found : c,81 38 ; H 3.52%. Amax = 550-570 nm (when film is used). Comparative Example 1 According to Patent Document 3, the synthesis of bis [2,3-b: 2',3'-f]thieno[3,2-b]thiophene was carried out in accordance with the following reaction formula (4). In the reaction formula (4-1), the 3-(methylthio) onion formic acid of the objective compound is obtained by a mixture of 80% in a yield and a foreign substance having a methylthio group introduced at the 1-position. From the identification of φ by the proton N MR, a mixture of the target (position 3) and the by-product (position 1) of 4:1 was obtained. By using the mixture to carry out the reaction shown in the reaction formula (4-2), trans-1,2-bis(3-) containing a target substance can be obtained with a purity of about 50% (identified by proton NMR). A crude product of methylthioindole-2-yl). Finally, a crude reaction containing diindole [2,3-b: 2',3'-f]thieno[3,2-b]thiophene is obtained by a cyclization reaction represented by the reaction formula (4-3). By repeating the sublimation refining and recrystallization, the desired combination can be obtained. However, compared with the manufacturing method of the present application, the intermediate impurities are extremely large, and the amount of 蒽 for 蒽2- constitutive rate is evenly calculated. The product only • 52- 201247676 The final total yield is greatly degraded 'The refining step to remove these impurities is also extremely cumbersome. [化1 7]
如上述般’藉由本發明’可簡便且有效地合成二蒽 [2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩。 接著詳細說明具有由二蒽[2,3-b : 2’,3’- f]噻吩并[3,2-b]噻吩所構成之半導體層之場效電晶體。 實施例2 (頂接觸型場效電晶體) 將進行十八烷基三氯矽烷處理後之附有300nm的 Si02熱氧化膜之η摻雜矽晶圓(面電阻0.02 Ω . cm以下 )設置在真空蒸鍍裝置內’進行排氣直到裝置內的真空度 成爲3.0x1 0_3 Pa以下。藉由電阻加熱蒸鍍法,在基板溫度 約1 0 0 t的條件下,以2 5 n m的厚度將實施例1中所得之 二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩蒸鍍於該電極,而 形成半導體層(2)。接著將電極製作用遮罩安裝於該基 板,設置在真空蒸鍍裝置內’進行排氣直到裝置內的真空 度成爲l.Ox l〇_4Pa以下,並藉由電阻加熱蒸鍍法’以 -53- 201247676 4Onm的厚度來蒸鍍金的電極,亦即源極電極(1)及汲極 電極(3 ),而得到TC (頂接觸型)之本發明之場效電晶 體。 本實施例之場效電晶體中,附有熱氧化膜之η摻雜矽 晶圓中的熱氧化膜具有絕緣層(4 )的功能,η摻雜矽晶圓 兼具有基板(6 )及閘極電極(5 )的功能。 將所得之場效電晶體設置在探針機內,使用半導體參 數分析儀41 55C ( Agilent公司製)來測定半導體特性。半 導體特性,係在10V〜-100V中以20V階段來掃描閘極電 壓,在10V〜-100V中掃描汲極電壓,並測定汲極電流-汲 極電壓。其結果係觀測到電流飽和,並從所得之電壓電流 曲線中,得知本元件爲p型半導體,載子遷移率爲2.5〜3.0 c m2 / V s。 接著詳細說明具有由二蒽[2,3-b : 2’,3’-f]噻吩并[3,2· b]噻吩所構成之半導體層之有機太陽能電池元件。 實施例3 於元件製作前,對使1T0透明導電膜沉積1 15nm之 玻璃基板(東京三容真空股份有限公司製,20 Ω/ □以下 )進行UV-臭氧洗淨。將該玻璃基板設置在真空蒸鍍裝置 內,進行排氣直到裝置內的真空度成爲3.0xl(T3Pa以下。 藉由電阻加熱蒸鍍法,以40nm的厚度將實施例1中所得 之二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩蒸鍍於該電極, 而形成半導體層。接著以40nm的厚度蒸鍍C60,以1 〇nm -54- 201247676 的厚度蒸鍍2,9-二甲基-4,7-二苯基-1,10-菲羅林。然後夾 介遮罩以lOOnm的厚度蒸鍍鋁而形成陰極,藉此製作出 φ 2mm的圓形有機太陽能電池元件。使用AM 1.5的太陽 光模擬系統,以l〇〇mW/ cm來測定光電轉換效率。而得 到開放電壓爲0.42V,短路電流爲5.04mA/ cm2,塡滿因 數爲0.56,轉換效率爲1.19 %之有機太陽能電池。第4圖 係顯示本實施例之有機太陽能電池元件之j_V特性圖。 如以上所述般,可製作出有機場效電晶體及有機薄膜 太陽能電池元件並確認其實用性。藉由本發明所簡便且有 效地製得之二蒽[2,3-b: 2’,3’-f]噻吩并[3,2-b]噻吩,由於 具有優異的特性値,故可說是對於作爲有機場效電晶體、 有機發光二極體、有機發光電晶體、有機太陽能電池、有 機雷射、有機光感測器等之各種有機電子裝置用材料極爲 有用之化合物。 【圖式簡單說明】 第1圖係顯示本發明之場效電晶體的一項形態之槪略 圖。 第2圖爲用以製造本發明之場效電晶體的一項形態( 底接觸型薄膜電晶體)之步驟的槪略圖。 第3圖係顯示有機EL的一項形態之槪略圖》 第4圖爲實施例3之有機太陽能電池元件之:T-V特性 圖。 -55- 201247676 【主要元件符號說明】 第1圖中對相同名稱者賦予相同符號。 1 :源極電極 2 :半導體層 3 :汲極電極 4 :絕緣體層 5 :閘極電極 6 :基板 · 7 =保護層 -56-As described above, the diterpene [2,3-b: 2',3'-f]thieno[3,2-b]thiophene can be synthesized simply and efficiently by the present invention. Next, a field effect transistor having a semiconductor layer composed of diterpene [2,3-b : 2',3'-f]thieno[3,2-b]thiophene will be described in detail. Example 2 (top contact type field effect transistor) An n-doped germanium wafer (face resistance of 0.02 Ω·cm or less) with a 300 nm SiO 2 thermal oxide film treated with octadecyltrichloromethane was placed in The inside of the vacuum vapor deposition apparatus is 'exhausted until the degree of vacuum in the apparatus becomes 3.0 x 1 0_3 Pa or less. The diterpene [2,3-b: 2', 3'-f] obtained in Example 1 was obtained by a resistance heating evaporation method at a substrate temperature of about 100 t at a thickness of 25 nm. Thio[3,2-b]thiophene is evaporated on the electrode to form a semiconductor layer (2). Next, the electrode fabrication mask is mounted on the substrate, and is disposed in the vacuum vapor deposition apparatus to perform the evacuation until the degree of vacuum in the apparatus becomes 1.Ox l〇_4 Pa or less, and by the resistance heating evaporation method. 53- 201247676 The thickness of 4 Onm is used to vapor-deposit the gold electrode, that is, the source electrode (1) and the drain electrode (3), to obtain the field effect transistor of the present invention of TC (top contact type). In the field effect transistor of the present embodiment, the thermal oxide film in the n-doped germanium wafer with the thermal oxide film has the function of the insulating layer (4), and the n-doped germanium wafer also has the substrate (6) and The function of the gate electrode (5). The obtained field effect transistor was placed in a probe machine, and semiconductor characteristics were measured using a semiconductor parameter analyzer 41 55C (manufactured by Agilent Co., Ltd.). The semiconductor characteristic is that the gate voltage is scanned in a 20V phase from 10V to -100V, the drain voltage is scanned in 10V to -100V, and the drain current-thortion voltage is measured. As a result, current saturation was observed, and from the obtained voltage-current curve, it was found that the device was a p-type semiconductor, and the carrier mobility was 2.5 to 3.0 c m 2 /V s . Next, an organic solar cell element having a semiconductor layer composed of diterpene [2,3-b : 2',3'-f]thieno[3,2·b]thiophene will be described in detail. (Example 3) A glass substrate (manufactured by Tokyo Sanken Vacuum Co., Ltd., 20 Ω/□ or less) in which a 1T0 transparent conductive film was deposited by a 1T0 transparent conductive film was subjected to UV-ozone cleaning. The glass substrate was placed in a vacuum vapor deposition apparatus, and evacuated until the degree of vacuum in the apparatus was 3.0 x 1 (T3 Pa or less. The enthalpy obtained in Example 1 was obtained by a resistance heating vapor deposition method at a thickness of 40 nm [ 2,3-b: 2',3'-f]thieno[3,2-b]thiophene is evaporated on the electrode to form a semiconductor layer, and then C60 is deposited at a thickness of 40 nm to 1 〇nm -54 - 2,9-Dimethyl-4,7-diphenyl-1,10-phenanthroline was evaporated to a thickness of 201247676. Then, a mask was deposited by vapor deposition of aluminum at a thickness of 100 nm to form a cathode. φ 2mm round organic solar cell component. Using the AM 1.5 solar simulation system, the photoelectric conversion efficiency was measured at l〇〇mW/cm, and the open voltage was 0.42V, and the short-circuit current was 5.04mA/cm2. An organic solar cell having a factor of 0.56 and a conversion efficiency of 1.19 %. Fig. 4 is a diagram showing the j_V characteristic of the organic solar cell element of the present embodiment. As described above, an airport effect transistor and an organic thin film solar energy can be produced. The battery element is confirmed for its practicability. The second and the second are produced by the present invention [2,3- b: 2',3'-f]thieno[3,2-b]thiophene, because of its excellent properties, can be said to be used as an organic field effect transistor, organic light-emitting diode, organic light-emitting transistor A compound which is extremely useful for materials for various organic electronic devices such as organic solar cells, organic lasers, organic photosensors, etc. [Simplified description of the drawings] Fig. 1 shows a form of the field effect transistor of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 2 is a schematic diagram showing the steps of a form (bottom contact type thin film transistor) for fabricating the field effect transistor of the present invention. Fig. 3 is a schematic diagram showing a form of organic EL. Fig. 4 is a TV characteristic diagram of the organic solar cell element of Example 3. -55-201247676 [Description of main component symbols] The same reference numerals are given to the same names in Fig. 1. 1 : source electrode 2: semiconductor layer 3 : Bipolar electrode 4: Insulator layer 5: Gate electrode 6: Substrate · 7 = Protective layer - 56-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011039404 | 2011-02-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201247676A true TW201247676A (en) | 2012-12-01 |
Family
ID=46720992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101106272A TW201247676A (en) | 2011-02-25 | 2012-02-24 | Method for producing dianthra [2,3-b:2',3'-f] thieno [3,2-b] thiophen and application thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2012115218A1 (en) |
| TW (1) | TW201247676A (en) |
| WO (1) | WO2012115218A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI602798B (en) * | 2012-12-12 | 2017-10-21 | Daicel Corp | Composition for the production of organic transistors, and use of the solvent or solvent composition for the production of organic transistors |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11539190B2 (en) | 2016-09-02 | 2022-12-27 | Kyushu University, National University Corporation | Continuous-wave organic thin-film distributed feedback laser and electrically driven organic semiconductor laser diode |
| KR102402133B1 (en) * | 2016-09-02 | 2022-05-26 | 고쿠리쓰다이가쿠호진 규슈다이가쿠 | Continuous-wave organic thin-film distributed feedback laser and electrically driven organic semiconductor laser diode |
| TWI871971B (en) | 2017-02-07 | 2025-02-01 | 國立大學法人九州大學 | Current-injection organic semiconductor laser diode, method for producing same and program |
| JP7325731B2 (en) | 2018-08-23 | 2023-08-15 | 国立大学法人九州大学 | organic electroluminescence element |
| JP7512917B2 (en) * | 2021-01-29 | 2024-07-09 | コニカミノルタ株式会社 | Organic electroluminescence element, its manufacturing method, and lighting device, display device, and printed object equipped with the same |
| WO2023189381A1 (en) * | 2022-03-30 | 2023-10-05 | ソニーグループ株式会社 | Light-emitting element and electronic device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009009790A1 (en) * | 2007-07-12 | 2009-01-15 | President And Fellows Of Harvard College | Air-stable, high hole mobility thieno-thiophene derivatives |
| JP2011003852A (en) * | 2009-06-22 | 2011-01-06 | Asahi Kasei Corp | Organic semiconductor thin film with sheet-like crystal of condensed polycyclic aromatic compound containing sulfur atom laminated on substrate, and method of manufacturing the same |
-
2012
- 2012-02-24 TW TW101106272A patent/TW201247676A/en unknown
- 2012-02-24 JP JP2012539130A patent/JPWO2012115218A1/en active Pending
- 2012-02-24 WO PCT/JP2012/054528 patent/WO2012115218A1/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI602798B (en) * | 2012-12-12 | 2017-10-21 | Daicel Corp | Composition for the production of organic transistors, and use of the solvent or solvent composition for the production of organic transistors |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2012115218A1 (en) | 2014-07-07 |
| WO2012115218A1 (en) | 2012-08-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI588150B (en) | Heterocyclic compounds and their utilization | |
| JP5622585B2 (en) | Novel heterocyclic compounds and their use | |
| Li et al. | Stable solution-processed high-mobility substituted pentacene semiconductors | |
| KR101790854B1 (en) | Deuterated compounds for luminescent applications | |
| TWI549327B (en) | Organic field effect transistor and organic semiconductor material | |
| JP2014507401A (en) | Triazine derivatives for electronics applications | |
| JP2013509406A (en) | Deuterium compounds for electronic applications | |
| TWI773664B (en) | Aromatic amine derivatives and their utilization | |
| JP5837611B2 (en) | Electroactive materials and devices manufactured using such materials | |
| TW201247676A (en) | Method for producing dianthra [2,3-b:2',3'-f] thieno [3,2-b] thiophen and application thereof | |
| JP2009242339A (en) | Aromatic fused ring compound, organic semiconductor material containing the same, organic semiconductor device and manufacturing methods thereof | |
| JP2022169503A (en) | charge transport varnish | |
| JP5344441B2 (en) | NOVEL COMPOUND, PROCESS FOR PRODUCING THE SAME, ORGANIC SEMICONDUCTOR MATERIAL AND ORGANIC SEMICONDUCTOR DEVICE | |
| JP6425646B2 (en) | Novel condensed polycyclic aromatic compound and use thereof | |
| WO2013031468A1 (en) | Heterocyclic compound and use thereof | |
| JP2018046219A (en) | Compound containing amino group or alkylamino group with aromatic hydrocarbon or heteroaromatic ring skeleton and organic thin film device using the same | |
| JP6592863B2 (en) | Organic compounds and their uses | |
| JP6572473B2 (en) | Organic compounds and their uses | |
| WO2012165612A1 (en) | Organic semiconductor material, and organic electronics device | |
| TWI844726B (en) | Condensed polycyclic aromatic compound | |
| CN109942548A (en) | Quinoline-substituted diphenylpyrimidine compound and its organic electroluminescent device | |
| TW201529580A (en) | Novel condensed polycyclic aromatic compounds and uses thereof | |
| CN105210207A (en) | Charge-transporting varnish |