201247089 六、發明說明： 【發明所屬之技術領域】 本提案係關於一種冷卻系統，特別是一種設置於資料中心的冷 卻系統。 【先前技術】 近年來’雲端計算(cloudcomputing)堪稱電腦產業中最熱門的 話題。雲端計算所需要的機房架構，除了傳統式的固定建物型式 之外最^見的便疋祆櫃型的機房(⑺拉血过data center)結構。貨 櫃機房之所时成為產業注目的焦點，主要在於可以有效降低機 房建置的成本，同時亦可整櫃輸出作1111七^3〇11^〇11)，以提供全球 各地之機房配置需求。此外，貨櫃型資料中心由於内含的祠·服器 密度咼，因此對於提高土地的使用效率也很大的幫助 。不過也正 由於内含_服||密度高，㈣機朗的發齡及發熱密度也相 對提高’因此貨櫃機房力整體散熱冷卻系、統，便成為整個雲端硬 體架構中’不可或缺的一環。另外，在全球化的節能減碳的訴求 下^櫃機房的電源使用效率0〇wer usage e任ectiveness，卩证)性 此開始被南度要求，PUE值愈低，代表機房的能源使用效率愈好。 其中’ PUE=(機房總用電量)/(資訊科技設備總用電量）。 早期的資料中心機房的PUE值幾乎都在2.0以上，近幾年機 房的PUE值大対降低至16左右。不過絲貨櫃式顧的顺 性能將至少被要求在1.5以下，因此如何降低PUE值，已是大部 份貨櫃機房設計者所努力要達成的目標。因此，ρυΈ值的高低， 也將成為曰後業者選購貨櫃型機房的重要指標之一。 201247089 目則知櫃機房的冷部系統多是利用冰水機(咖㈣產生低溫的 ‘流體，使低溫流體經由管路帶人貨櫃機房内，然後結合熱交換器 ，機房内高溫线㈤冷卻錢溫。並且_低城絲冷卻僵 器内的所有發熱70件。換句話說’此種冷卻純完全依賴冰水機 運作所產生的低㈣IL體，以針對貨櫃内部所有發熱源進行冷卻散 .熱。因此，冰水機的冷卻效率高低，將主導整個冷卻系統的201247089 VI. Description of the invention: [Technical field to which the invention pertains] This proposal relates to a cooling system, and more particularly to a cooling system installed in a data center. [Prior Art] In recent years, cloud computing has become the hottest topic in the computer industry. The computer room structure required for cloud computing, in addition to the traditional fixed building type, is the most convenient structure of the magazine room ((7) pulling the data center). The container room has become the focus of industry attention, mainly because it can effectively reduce the cost of the construction of the machine room, and can also be exported to the whole cabinet for 1111 7^3〇11^〇11) to provide the configuration requirements of the equipment room around the world. In addition, the container-type data center is also very helpful for improving the efficiency of land use due to the density of the contained container. However, due to the high density of the embedded _ clothing||, (4) the age of the lang and the heat density are relatively improved. Therefore, the overall cooling and cooling system of the container machine room becomes an indispensable part of the entire cloud hardware architecture. A ring. In addition, under the globalization of energy-saving and carbon-reduction requirements, the power efficiency of the cabinet room is 0 〇wer usage e ectiveness, the 性 ) ) 性 性 性 性 性 南 南 南 南 南 南 南 南 南 南 南 南 南 南 南 , 南 南 南 南 南 南 南 南 南 南 南 南it is good. Where 'PUE=(total power consumption of the equipment room) / (total power consumption of IT equipment). The PUE values of the early data center equipment rooms were almost all above 2.0. In recent years, the PUE value of the equipment room has been reduced to around 16. However, the smoothness of the silk container type will be required to be at least 1.5 or less. Therefore, how to reduce the PUE value is the goal that most container cabinet designers strive to achieve. Therefore, the level of ρυΈ will also become one of the important indicators for the purchase of container-type equipment rooms. 201247089 The cold system of the cabinet room is mostly the use of ice water machine (Caf (four) to generate low temperature 'fluid, so that the low temperature fluid is brought into the container room through the pipeline, and then combined with the heat exchanger, the high temperature line in the machine room (5) cooling money And _ low-city cooling all 70 heat in the cold pack. In other words, 'this cooling purely depends entirely on the low (four) IL body produced by the operation of the ice water machine, to cool all the heat sources inside the container. Therefore, the cooling efficiency of the ice water machine will dominate the entire cooling system.
PUE 性能，而往往此冷卻系、統的最佳pu£性能約只能達到13左右。 另外，習知冷卻系統還有使職電較低的冷卻水塔進行整個 機櫃的散熱。_冷卻树的冷料叙最佳puE性能約可達到 =2左右’不過讀冷㈣統僅_於環境溫度較低的高緯度區 = 的低緯度地區，將使得此冷卻系統之散熱效· 【發日I内容】相術嶋w機的問題。 馨於以上的問題，本提案在於提供一種 習用冷卻系統運用於機房岐成機房的咖_高、 限於高緯度區域設置之問題。 乂及機房文 的至π:=心之冷卻系統，對至少-機櫃内 第資射心之冷卻祕包含—機房、 第m第二散熱模組。其中，機 第-散熱模組包含-第一熱交換器、—第二教、機房内。 環管路及-幫浦。第-熱交換器設置於财循 置於舰器上，第一循環管路連接第_ ^、父換器設 器。幫浦連接苐-猶環管路，第:及苐二熱交換 第盾衣g路内具有一第-冷卻液， 201247089 幫浦驅動第一冷卻液於窜 熱模組包含-第三熱二韻:路内以單相狀態流動。第二散 熱交換器設置祕^ —知器及—第二循環管路。第三 ,、 内，並吸收機房内之熱能。冷卻器設置於機 房外H辭料 m置於機 第二冷卻液至第：心帛〜、讀器及冷卻器，冷卻器提供-…一…又換器，以對第三熱交換器降溫。 鮒上述實轭例之資料中心之冷卻系統，係 =:'增—散熱模組來進行散熱，使第-散： 用A卻-二㈠排㈣部分熱能。並且，第-散熱模組並非利 用冷^體兩相變化的狀態來進行吸、放熱動作’因此不需要設 置，缩财讀而增加額外的功率雜。因此第—散熱模組除了 可/刀擔第-散熱模組之冷卻器的消耗功率外，更可降低資料中心 的整體PUE值。 有關本提案的特徵、實作與功效，紐合圖式作最佳實施例 詳細說明如下。 【實施方式】 ,睛參照「第1圖」，「第1圖」係為根據本提案-實施例之 冷卻系統的結構平面示意圖。 本實施例之冷卻系統10係用於貨櫃型的資料中心(Date Center) ’冷卻系統10包含一機房(Container)500、一第一散熱模組 1〇〇及一第二散熱模組2〇〇。機房500即為用於貨櫃型資料中心的 扣櫃體。機房5〇〇内設置有至少一機櫃(Rack)600，機櫃600内設 置有多台伺服器(Server)700，冷卻系統1〇係用以對伺服器7〇〇所 產生的熱能進行散熱。 201247089 . 請繼續參照「第1圖」，第一散熱模組100包含一第一熱交 .換器m二熱交換ϋ 130、-第-循環管路12()以及一幫浦 140。其中’第-熱父換if 13G係可職於伺服器 β的發熱源 上’發熱源可以疋主機板上的晶片，如中央處理器。第二熱交換 器130 S以吸收伺服器700内的發熱源所產生的熱能。第一熱交 換器no設置於機房500夕卜，且第一熱交換器11〇藉由第一循環 料no而與第二熱交換器130相連接。第一熱交換器ιι〇可以 疋八有政熱‘，，、日片之結構的金屬體。此外，一風扇U2可設置於第 熱交換器110旁’且風扇112運轉所產生的風流路徑通過第一 …、又換益110。第-熱父換器110透過風扇112所產生的強制對流 而將熱能移除。 、第循裒g路120内具有一第一冷卻液，第一冷卻液可以是 V煤液L水或;|電液。幫浦14G係連接第—循環管路1如，幫浦 2驅使第-冷卻液於第—循環管路m _單相狀態進行循環 一策步來％ ’第—冷峡可保躲液體離態下而於第 孰处二:路12G㈣環流動。此外，第二熱交換器13。所吸收的 二冷卻液於第—循環管路12G内的流動而傳遞至第 …又、益110 ’以使第一熱交換H 110藉由自缺對流或是風戶 …，，制對流秘熱能移除。 …、h風扇 過程务冷卻_—循環管路12G _的循環 並非利^ 細嫩频狀㈣即令散熱模組1〇〇 冷部液的早相狀態進行熱能的傳遞。如此一來，第一 201247089 散熱模組100可不需設置壓縮機’因此可減少其消耗功率，進而 降低資料中心的PUE值。 此外，本實施例之第二散熱模組200包含一第三熱交換器 210、一第二循環管路220以及一冷卻器230。機房500内更具有 一隔板510，隔板510具有一氣流口 511。隔板510位於機房500 内，隔板510可以是機房500内的天花板。隔板510可連接機櫃 600的上緣’且隔板510與機櫃600將機房500内分隔成一第一氣 流道520及一第二氣流道530 ’且第一氣流道520及第二氣流道 530可分別位於機櫃600的相對兩侧。第三熱交換器21〇係嵌設於 氣流口 511並貫穿隔板510，使得氣流能夠經由第三熱交換器21〇 而由隔板510之一側穿越過至隔板510的另一侧，第三熱交換器 210用以吸收機櫃6〇〇内之第二氣流道530中的熱空氣之熱能。 需注意的是，第三熱交換器210嵌設於氣流口 511的特徵非 用以限疋本&案。舉例來說，第三熱交換器只需鄰近於氣流 ° 511處’且能達到吸收第二氣流道53〇中的熱空氣之熱能的功 、e本實施例之冷卻器230係設置於機房外，冷卻器23〇可 ^但不舰於冰水機’且冷卻器23()藉由第二循縣路⑽連 三哉21〇。冷卻器23_提供低溫的第二冷卻液至第 =、、父換心0’使低溫的第二冷卻液對第三熱交換器加進行降 的-:Γ機更可具有多個風扇132設置於機櫃6。。内 機櫃_内的伺服請所產生的部分熱能可藉由風扇 201247089 132運轉所產生的強制對流而排出至第二氣流道53〇 。並且，第二 • 氣流道530上更可以設置有一風扇532,風扇532將風扇132運轉 所排出之熱空氣繼續引導吹送至第三熱交換器別進行熱交換。 當熱空氣通過第三敝換n21G後，其温賴降躺成為冷空氣。 冷空氣進入第-氣流道52〇，並再流入麵^⑻内繼續對伺服器 700進行散熱。 * .* 更進一步來說’本實施例之冷卻祕K)储由第-散熱模組 100及第二散熱模組200來對伺服器700進行散熱。其中，第一散 熱模組100係藉由第二熱交換器1；3〇接觸於词服器7〇〇的發熱源 來進行熱交換，意即第二熱交換器m利用熱傳導的方式精散 熱’並利用第一熱交換器110將第二熱交換器13〇所吸收的熱能 排出機房外。第二散熱模組2〇〇則是利用機房500魄扇132 及風扇532所產生的強制對流’使機櫃_所排出的熱空氣經由 第二熱交換⑨21G進行吸熱後而成為冷空氣。冷空氣再經由第一 氣流道520流入機櫃6〇〇，以進行再一次的散熱動作。換句話說， 機櫃600 _舰器700所產生之熱能，係經由第二散熱模組勘 作功製冷吸收，也可以經由第一散熱模組刚移除至外界環境。 由於習知技術僅使用第二散熱模組職房綱内=散 • 熱，因此將造成冷卻11 230 t要花費較大的運轉功率。本實施^ " 之冷卻系統10係額外增設-組第-散熱模組1〇〇，以幫助散熱， 並且分擔冷部器230的工作量。且第—散熱模組綱因不使用壓 縮機’因此其所耗費的功率較低，故運用本實施例之冷卻系統^ 的資料中心之PUE可較習用單以冷卻$ 23〇提供散熱效果的資料 9 201247089 中心之PUE來的低。 請參照「第2圖」’ 「第2圖」係為根據本提案另一實施例 之冷卻系統的結構平面示意圖。由於本實施例與「第1圖」實施 例之結構相似，因此針對相似之處便不再詳細描述。 本實施例之冷卻系統10，更包含一第三散熱模組3〇〇。第三 散熱模組300包含一第四熱交換器310、一第五熱交換器320以及 連接第四熱交換器310及第五熱交換器320的一第三循環管路 330。第四熱交換器310及第五熱交換器320可以是具有散熱縛片 之結構的金屬體。第五熱交換器32〇設置於機房5〇〇内之第二氣 流道530 ’且位於風扇532的風流路徑上，第五熱交換器32〇用以 吸收第二氣流道530的熱空氣之熱能，以對熱空氣降溫。第四熱 交換器310則設置於機房5〇〇外，用以排除第五熱交換器32〇所 吸收之熱能。第三循環管路33〇可以是熱管或是具有流體於其内 部循環的管路’其_具錢環流動的-第三冷卻液。第五熱交 換器320係將吸收到的熱能經由第三循環管路33〇内的第三冷卻 液傳遞至第四熱交換器31〇，第四熱交換器⑽可設置於一風扇 312的風流路徑上，以將熱能藉由強制對流而排除。 在本實細例中，熱空氣係先經由第三散熱模、组3〇〇進行降溫， 因此使得流經第三熱交換器21〇的熱空氣溫度較低，藉此可減軒 冷卻器230的工作量。 工 請接著參照「第3圖」，「第3圖」係為根據本提案另一實 ，例之冷卻系統的結構平面示顏。由於本實施例與「第1圖」 貫施例之結構相似，因此針對相似之處便不再詳細描述。」 201247089 本實施例之冷卻系統ίο，更包含一散熱器4〇〇，散熱器4〇〇 • 可以疋但不侷限於熱管及散熱鰭片等。散熱器400係設置於機房 5〇〇的壁體上，且散熱器400的相對兩端分別位於機房5〇〇内的第 二氣流道530與機房500外。散熱器4〇〇位於第二氣流道53〇的 一端吸收機房500 _熱能，並將熱能傳導至賴器4⑻位於機 房500外的一端，並藉由熱對流以將熱能排除至機房$㈨外。由 於本實施例之冷卻系統1〇藉由增設散熱器働以將第二氣流道 530的部分熱能排除，因此使得流經第三熱交換器21〇的熱空氣= 度較低’藉此可減輕冷卻器230的工作量。 請接著參照「第4圖」，「第4圖」係為根據本提案另一實 施例之冷卻系統的結構平面示意圖。由於本實施例與「第^圖」 實施例之結構相似，因此針對相似之處便不再詳細描述。 本實施例之第二散熱模組200更包含一第六熱交換器24〇，第 六熱交換器240可以是具有散熱轉片之結構的金屬體。第六熱交 換器240設置於财5〇〇外，且位於一風扇淡賴流路徑上， 縣242用以對第六熱交換器進行散熱。第六熱交換器240 . 藉由第一循環管路22〇而與第三熱交換器21〇及冷卻器挪相連 接。冷卻器23〇触低溫的第二冷卻液，並使第二冷卻液依序流 經第讀交換H21()及第六熱交換器，再使第二冷卻液經由第 /、熱父換益240流回冷卻器230。 八中第一熱乂換态210吸收機房5〇〇内的熱能，並藉由第 二冷卻液將熱能傳遞至第六熱交換器施，第六熱交換器擔可排 除第二冷卻㈣的部分熱能。更進—步來說，第六散換器240 201247089 可排除部分第三熱交換器210所吸收的熱量，使得冷卻器挪的 工作量得以降低。藉此，也可降低運縣冷卻系統1G之資料中心 的PUE值。 明接著參照「第5圖」，「第5圖」係為根據本提案另一實 施例之冷卻系統的結構平面示意圖。由於本實施例盘「第*圖」 貫施例之結構相似，因此針對相似之處便不再詳細描述。 本實施例之第二散熱模組2〇〇更包含一切換間門跡切換閥 Π 250設朗二循環管㈣，錄於第六熱交換⑽、第三 及冷卻器230之間。切換間門，用以切換第二冷 /…第—魏管路220内的循環狀態。舉例來說，第二散熱 增設一幫浦’而使切換閥門25〇可控制第二冷卻流體 ^ .....................之間循環。再另一種 也樣下，切換閥門250可控制第二冷卻流體只 之間循環。或者，切換閥門25。可控制第二忒 Γ第六熱交換器240、第三熱交換器加與冷卻器230三者間 交互循環。 =進-步來說’當外界環境的溫度較低時，切換闊門25〇可 =第二冷卻流體只於第六熱交換器與第三熱交換器21〇之 =。鱗㈣纖㈣崎峨_導至第 =’使外界低溫空氣直接對第六熱交換器進― 不*倚賴冷卻器230。可降低資料中心的pUE值。 體環境的溫度較高時’切換闕門250可控制第二冷卻流 體與第，、熱交換器第三熱交換請與冷卻器23G三者間交 201247089 230同時排除第三熱交換 互循環，使第六熱交換器240與冷卻器 • 器210所吸收之熱能。 根據上财_^射心的轉純 覆於伺服器之發熱源上第—散執模 ^曰j ,1 …、模、、且來進仃散熱，使第一散埶模 、，且可为擔移除錬輯出的部分熱能。並且，第—散賴 ...姻冷卻_兩婦化陳態來妨吸、放_作，因此不需要 設置壓縮解賴而增加渺卜的辨雜。因此第 了可分擔第二《池之冷邮㈣耗辨外，更亀資料; 心的整體PUE值。 〃胃 严此外’還可藉由增設散熱器或是第三散熱模組以用外界冷空 氣進行熱交換的鶴，來幫助排除機相的熱能。或者，本實施 例之冷㈣統可於第二散熱额上增設熱交換器，时擔冷卻器 的工作量。因此，上叙手段皆低冷卻H的功量，以減少 冷心〉肖耗的功率。是以這樣的冷卻系統，可降低資料中心的整 體PUE值’以達未來需求之期望。 雖然本提案以前述之較佳實施_露如上，然其並非用以限 疋本提案’任何熟習相像技藝者，在不脫離本提案之精神和範圍 内，當可作些許之更動與潤飾，因此本提案之專利保護範圍須視 本說明書所附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖係為根據本提案一實施例之冷卻系統的結構平面示意 圖。 第2圖係為根據本提案另一實施例之冷卻系統的結構平面示 13 201247089 意圖。 第3圖係為根據本提案另一實施例之冷卻系統的結構平面示 意圖。 第4圖係為根據本提案另一實施例之冷卻系統的結構平面示 意圖。 第5圖 意圖。 係為根據本提案另一實施例之冷卻系統的結構平面示 【主要元件符號說明】 10 冷卻系統 100 第一散熱模組 110 第一熱交換器 112 風扇 120 第一循環管路 130 第二熱交換器 132 風扇 140 幫浦 200 第一散熱模組 210 第三熱交換器 220 第二循環管路 230 冷卻器 240 第六熱交換器 242 風扇 250 切換閥門 14 201247089 300 • 310 312 320 330 ' 400 500 510 511 520 530 532 600 700 第三散熱模組 第四熱交換器 風扇 第五熱交換器 第三循環管路 散熱器 機房 隔板 氣流口 第一氣流道 第二氣流道 風扇 機櫃 伺服器 15PUE performance, and often the best performance of this cooling system, system can only reach about 13 or so. In addition, the conventional cooling system also has a cooling tower that has a lower power supply for heat dissipation throughout the cabinet. _ Cooling tree cold material, the best puE performance can reach about 2 or so 'but the reading cold (four) system only _ in the low latitude area with low ambient temperature = low latitude area, will make the cooling system heat dissipation effect The content of the day I] the problem of the machine. In addition to the above problems, the proposal is to provide a problem that the conventional cooling system is applied to the machine room and is limited to the high latitude area setting.乂 机 机 = = = = = = = = = = = = 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心 心The first heat dissipation module includes a first heat exchanger, a second teaching, and a machine room. Ring pipe and - pump. The first heat exchanger is disposed on the vessel, and the first circulation pipeline is connected to the first _ ^, the parent converter. The pump is connected to the 苐-Jushua pipeline, the first: and the second heat exchange shield Shield g road has a first-coolant, 201247089 pump drives the first coolant in the heat module contains - the third heat two rhyme : The road flows in a single-phase state. The second heat exchanger is provided with a secret and a second circulation line. Third, inside, and absorb the heat energy in the machine room. The cooler is placed outside the machine room. The re-distribution m is placed in the second coolant to the first: the hearth ~, the reader and the cooler, the cooler provides - ... a ... again to cool the third heat exchanger.冷却 The cooling system of the data center of the above yoke example is: = 'Add - heat dissipation module to dissipate heat, make the first dispersion: use A but - two (one) row (four) part of the heat energy. Further, the first heat dissipating module does not use the state of the two-phase change of the cold body to perform the suction and heat release operations. Therefore, it is not necessary to set it, and the additional power is added by the reduced reading. Therefore, the first heat dissipation module can reduce the overall PUE value of the data center in addition to the power consumption of the cooler of the heat dissipation module. For the characteristics, implementation and efficacy of this proposal, the best example of the collocation diagram is as follows. [Embodiment] The term "Fig. 1" and "Fig. 1" are schematic plan views showing the structure of a cooling system according to the present invention. The cooling system 10 of the present embodiment is used for a container type data center (Date Center). The cooling system 10 includes a container 500, a first heat dissipation module 1 and a second heat dissipation module 2 . The machine room 500 is the buckle body for the container type data center. At least one cabinet (Rack) 600 is disposed in the machine room 5, and a plurality of servers (Server) 700 are disposed in the cabinet 600, and the cooling system 1 is configured to dissipate heat generated by the server 7〇〇. 201247089. Please continue to refer to "FIG. 1", the first heat dissipation module 100 includes a first heat exchange converter m two heat exchange ports 130, a first-cycle line 12 () and a pump 140. Among them, the 'first-hot father's if 13G system can work on the heat source of the server β'. The heat source can be used to chip the chip on the motherboard, such as a central processing unit. The second heat exchanger 130S absorbs thermal energy generated by a heat source within the servo 700. The first heat exchanger no is disposed in the machine room 500, and the first heat exchanger 11 is connected to the second heat exchanger 130 by the first circulating material no. The first heat exchanger ιι〇 can be used to smash the metal body of the structure of the government. In addition, a fan U2 can be disposed beside the first heat exchanger 110 and the wind flow path generated by the operation of the fan 112 passes through the first ... and the benefit 110. The first-hot parent converter 110 removes thermal energy by forced convection generated by the fan 112. The first cooling liquid 120 has a first cooling liquid, and the first cooling liquid may be V coal liquid L water or electro-hydraulic liquid. The pump 14G system is connected to the first-cycle pipeline 1. For example, the pump 2 drives the first coolant to the first-cycle state of the first-circulating pipeline m _ single phase to circulate one step to % 'the cold gorge to avoid liquid separation Next, at the second place: the road 12G (four) ring flow. Further, the second heat exchanger 13 is provided. The absorbed two coolants are transferred to the first circulation line 12G and transferred to the first and second sides to make the first heat exchange H 110 convective heat or convection ... Remove. ..., h fan process cooling _ - cycle 12G _ cycle is not good ^ fine frequency (four) that the heat module 1 〇〇 cold liquid early phase state for thermal energy transfer. In this way, the first 201247089 heat dissipation module 100 can eliminate the need to install a compressor, thus reducing its power consumption, thereby reducing the PUE value of the data center. In addition, the second heat dissipation module 200 of the embodiment includes a third heat exchanger 210, a second circulation line 220, and a cooler 230. The machine room 500 further has a partition 510 having an air flow port 511. The partition 510 is located in the machine room 500, and the partition 510 may be a ceiling in the machine room 500. The partition 510 can be connected to the upper edge of the cabinet 600 and the partition 510 and the cabinet 600 divide the interior of the machine room 500 into a first air passage 520 and a second air passage 530 ′, and the first air passage 520 and the second air passage 530 can be They are located on opposite sides of the cabinet 600, respectively. The third heat exchanger 21 is embedded in the air flow port 511 and penetrates the partition plate 510 so that the air flow can pass through one side of the partition plate 510 to the other side of the partition plate 510 via the third heat exchanger 21〇. The third heat exchanger 210 is configured to absorb the thermal energy of the hot air in the second airflow path 530 in the cabinet 6〇〇. It should be noted that the feature of the third heat exchanger 210 embedded in the airflow port 511 is not limited to the present & For example, the third heat exchanger only needs to be adjacent to the airflow 511' and can achieve the work of absorbing the thermal energy of the hot air in the second airflow path 53A. The cooler 230 of the embodiment is disposed outside the machine room. The cooler 23 can be used but not in the ice water machine' and the cooler 23 () is connected to the second road through the second county road (10). The cooler 23_ provides a second cooling liquid at a low temperature to the first, and the parenting center 0' causes the second cooling liquid at a low temperature to be lowered to the third heat exchanger-: the rake machine may have a plurality of fans 132 In the cabinet 6. . Part of the heat generated by the servo in the inner cabinet_ can be discharged to the second air passage 53 by forced convection generated by the operation of the fan 201247089 132. Further, the second air flow path 530 may further be provided with a fan 532. The fan 532 continues to guide the hot air discharged from the operation of the fan 132 to the third heat exchanger for heat exchange. When the hot air is changed to the n21G through the third cymbal, the temperature is lowered to become cold air. The cold air enters the first air flow path 52〇 and flows into the surface (8) to continue to dissipate the servo 700. Further, the cooling module K of the present embodiment stores the heat dissipation from the server 700 by the first heat dissipation module 100 and the second heat dissipation module 200. The first heat dissipation module 100 performs heat exchange by contacting the heat source of the second heat exchanger 1; 3〇 with the word processor 7〇〇, that is, the second heat exchanger m is cooled by heat conduction. And using the first heat exchanger 110 to discharge the heat energy absorbed by the second heat exchanger 13〇 out of the machine room. The second heat dissipation module 2 uses the forced convection generated by the fan fan 132 and the fan 532 of the machine room 500 to cause the hot air discharged from the cabinet to absorb heat through the second heat exchange unit 921G to become cold air. The cold air then flows into the cabinet 6 through the first air flow path 520 to perform another heat dissipation operation. In other words, the thermal energy generated by the cabinet 600_the ship 700 is absorbed by the second heat dissipation module, and may also be removed to the external environment via the first heat dissipation module. Since the prior art only uses the second heat-dissipation module in the office building, it will cause a large operating power to cool 11 230 tons. The cooling system 10 of the present embodiment additionally adds a group-heat dissipation module 1〇〇 to help dissipate heat and share the workload of the cold box 230. And the first-heat-dissipation module does not use the compressor', so the power it consumes is low. Therefore, the PUE of the data center using the cooling system of the embodiment can be used to cool the data by providing a cooling effect of $23. 9 201247089 The PUE of the center is low. Please refer to "Fig. 2" and "Fig. 2" for a schematic plan view of a cooling system according to another embodiment of the present proposal. Since this embodiment is similar in structure to the embodiment of the "Fig. 1", the details will not be described in detail. The cooling system 10 of the embodiment further includes a third heat dissipation module 3〇〇. The third heat dissipation module 300 includes a fourth heat exchanger 310, a fifth heat exchanger 320, and a third circulation line 330 connecting the fourth heat exchanger 310 and the fifth heat exchanger 320. The fourth heat exchanger 310 and the fifth heat exchanger 320 may be metal bodies having a structure of heat dissipation tabs. The fifth heat exchanger 32 is disposed in the second air flow path 530 ′ in the machine room 5 且 and is located in the air flow path of the fan 532 , and the fifth heat exchanger 32 is configured to absorb the heat energy of the hot air of the second air flow path 530 . To cool the hot air. The fourth heat exchanger 310 is disposed outside the machine room 5 to exclude the heat energy absorbed by the fifth heat exchanger 32. The third circulation line 33〇 may be a heat pipe or a pipe having a fluid circulating therein, which has a money-flowing third coolant. The fifth heat exchanger 320 transmits the absorbed thermal energy to the fourth heat exchanger 31 through the third coolant in the third circulation line 33, and the fourth heat exchanger (10) can be disposed in the wind flow of the fan 312. On the path, heat is excluded by forced convection. In the present embodiment, the hot air is first cooled by the third heat dissipation mold and the group 3〇〇, so that the temperature of the hot air flowing through the third heat exchanger 21〇 is lower, thereby reducing the sleek cooler 230. The amount of work. Please refer to "3rd figure", and "3rd figure" is the structural plane of the cooling system according to another example of this proposal. Since the present embodiment is similar in structure to the first embodiment, the details will not be described in detail. 201247089 The cooling system of this embodiment further includes a heat sink 4〇〇, a heat sink 4〇〇 • can be used for, but not limited to, a heat pipe and a heat sink fin. The heat sink 400 is disposed on the wall of the machine room 5, and the opposite ends of the heat sink 400 are respectively located outside the second air channel 530 in the machine room 5 and outside the machine room 500. The radiator 4 is located at one end of the second air passage 53A to absorb the heat of the equipment room 500, and conducts heat energy to one end of the air conditioner 4 (8) outside the equipment room 500, and is thermally convected to exclude heat energy to the outside of the equipment room (9). Since the cooling system 1 of the present embodiment removes part of the thermal energy of the second air flow path 530 by adding a heat sink ,, the hot air flowing through the third heat exchanger 21 = is lower. The amount of work of the cooler 230. Please refer to Fig. 4, and Fig. 4 is a schematic plan view showing the structure of the cooling system according to another embodiment of the present proposal. Since this embodiment is similar in structure to the embodiment of the "FIG. 2", the detailed description will not be repeated. The second heat dissipation module 200 of the embodiment further includes a sixth heat exchanger 24, and the sixth heat exchanger 240 may be a metal body having a structure of a heat dissipation fin. The sixth heat exchanger 240 is disposed outside the financial field and is located on a fan-drain path, and the county 242 is configured to dissipate heat from the sixth heat exchanger. The sixth heat exchanger 240 is connected to the third heat exchanger 21A and the cooler by the first circulation line 22〇. The cooler 23 touches the second cooling liquid at a low temperature, and causes the second cooling liquid to sequentially flow through the first reading exchange H21 () and the sixth heat exchanger, and then the second cooling liquid is exchanged via the /, hot parent 240 Flow back to cooler 230. The first hot enthalpy 210 of the eighth middle absorbs the heat energy in the 5 机 of the machine room, and transfers the heat energy to the sixth heat exchanger by the second coolant, and the sixth heat exchanger can exclude the part of the second cooling (4) Thermal energy. Further, the sixth distributor 240 201247089 can exclude the heat absorbed by the portion of the third heat exchanger 210, so that the workload of the cooler is reduced. In this way, the PUE value of the data center of Yunxian Cooling System 1G can also be reduced. Referring next to "figure 5", "figure 5" is a schematic plan view of a cooling system according to another embodiment of the present proposal. Since the structure of the "Fig. 3" embodiment of the present embodiment is similar, the details will not be described in detail. The second heat dissipation module 2 of the embodiment further includes a switching door switch valve Π 250, and a second circulation pipe (4) is disposed between the sixth heat exchange (10), the third and the cooler 230. The switching door is used to switch the circulation state in the second cold/...first-wei pipeline 220. For example, the second heat dissipation adds a pump' to allow the switching valve 25 to control the circulation between the second cooling fluids. Still another, the switching valve 250 controls the circulation of the second cooling fluid only between. Alternatively, the valve 25 is switched. The second 热交换器 Γ sixth heat exchanger 240, the third heat exchanger plus the cooler 230 can be controlled to alternately cycle. = Step-by-step] When the temperature of the external environment is low, switching the wide door 25 〇 = the second cooling fluid is only in the sixth heat exchanger and the third heat exchanger 21 =. Scale (four) fiber (four) rugged _ lead to the first = ' so that the outside low temperature air directly into the sixth heat exchanger - not * depends on the cooler 230. The pUE value of the data center can be reduced. When the temperature of the body environment is high, the 'switching trick 250 can control the second cooling fluid and the third, and the third heat exchange of the heat exchanger, and the cooler 23G, the intersection of the 201247089 230 and the third heat exchange mutual cycle. The heat energy absorbed by the sixth heat exchanger 240 and the cooler 210. According to the transfer of the _ _ ^ 射 纯 纯 纯 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服 伺服Part of the heat energy removed from the 錬. And, the first - scatter ... marriage cooling _ two women's attitudes to suck, put _, so do not need to set the compression solution to increase the confusion. Therefore, the second can share the second "pool of cold mail (four) consumption, more information; the overall PUE value of the heart. The stomach can be used to eliminate the heat of the machine phase by adding a radiator or a third heat-dissipating module to the heat exchange with the outside cold air. Alternatively, the cold (4) system of the present embodiment can add a heat exchanger to the second heat dissipation amount, and the workload of the cooler is required. Therefore, the above-mentioned means are all low-cooling H's power to reduce the power of the cold heart. With such a cooling system, the overall PUE value of the data center can be lowered to meet the expectations of future demand. Although this proposal is based on the above-mentioned preferred implementation _ as above, it is not intended to limit the proposal to any of the familiar artists, and may make some changes and refinements without departing from the spirit and scope of this proposal. The scope of patent protection of this proposal shall be subject to the definition of the scope of the patent application attached to this specification. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view schematically showing the structure of a cooling system according to an embodiment of the present proposal. Figure 2 is a schematic diagram showing the structure of a cooling system according to another embodiment of the present proposal. Figure 3 is a schematic plan view of a cooling system in accordance with another embodiment of the present proposal. Figure 4 is a schematic plan view of a cooling system in accordance with another embodiment of the present proposal. Figure 5 Intent. The structure of the cooling system according to another embodiment of the present proposal is shown in [Following the main component symbol description] 10 Cooling system 100 First heat dissipation module 110 First heat exchanger 112 Fan 120 First circulation line 130 Second heat exchange 132 a fan 140 pump 200 first heat dissipation module 210 third heat exchanger 220 second circulation line 230 cooler 240 sixth heat exchanger 242 fan 250 switching valve 14 201247089 300 • 310 312 320 330 ' 400 500 510 511 520 530 532 600 700 third heat dissipation module fourth heat exchanger fan fifth heat exchanger third circulation line radiator room partition air flow port first air passage second air passage fan cabinet server 15