TW201247056A - Wiring method for surface of solid structure, intermediate structure for obtaining solid structure having surface provided with wiring, and solid structure having surface provided with wiring - Google Patents

Abstract

The invention is directed to providing a wiring method for the surface of a solid structure, an intermediate structure for obtaining a solid structure having a surface provided with wiring, and a solid structure having a surface provided with wiring, wherein a laser can irradiate along only one direction with the arranged position or direction of a laser irradiation device or a stage being unchanged, whereby a circuit pattern is well formed in the solid structure. In the invention, a convex body 13a is formed on the surface of an insulated substrate 11 by using an insulated resin 13. A resin film 14 is formed on the surface of the convex body 13a and the surface of the insulated substrate 11. A circuit pattern 15 having a depth greater than that of the resin film 14 is formed by performing a laser processing from the outer surface side. A plating catalyst 16 is coated on the surface of the circuit pattern 15 and the surface of the resin film 14. The resin film 14 is removed, and an electroless plating film 17 is only formed on the residual portion of the plating catalyst 16. In the step (B) of forming a convex body, a convex body 13a, having an inclined plane 13b inclining relatively to the surface of the insulated substrate 11, is formed. In the step (D) of forming a circuit pattern, a laser irradiates toward the surface of the insulated substrate 11 along a vertical direction.

Description

201247056 VI. Description of the Invention: [Technical Field of the Invention] [0001] Wiring method, for obtaining a watch, and a three-dimensional wiring having a surface

The present invention relates to an intermediate structure structure in which a three-dimensional structure having wiring is provided on a surface of a three-dimensional structure. D [Prior Art] [0002] In recent years, with the increase in density of circuits in the electrical and electronic fields, wiring width, thinning, and narrowing of wiring intervals are progressing. Thinner, the narrower the wiring _, the more likely to cause short circuit or migration between adjacent wiring. [0003] In the meantime, Patent Document 1 describes the following circuit manufacturing method. First, a resin H is formed on the surface of the ruthenium G-edge substrate, and a circuit pattern is formed from the outside of the resin film or the hole. Secondly, the electroplating, the edge of the electric wire Φ and the ship's filaments are turned over. Standing times, tree mulch. Next, electroplating is performed on the circuit pattern by the insulating substrate of the peeled resin film. According to this technology, it is possible to use laser processing to convert the greenness to the outline of the circuit, and to [0004] ^ and to specialize in the literature 2 towel' as a technique for forming wiring on the surface of a three-dimensional structure such as a semiconductor package. It is revealed that the wiring and the groove having a depth greater than or equal to the thickness of the resin film are formed by the outer surface side of the insulating resin and the outer surface of the insulating resin. The _man' 5 electromineral catalyst or its precursor covers the surface of the wiring trench. Transfer it to remove it. Secondly, only after removing the resin film, the electro-mineral catalyst I is used to drive the red shaft of the red electric medium before the electroless electricity 201247056 coating. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2010-80946 (Paragraph 〇〇 1 [Patent Document 2] earning a publicly exclusive 2_〇87336) Falling 0126~013 12, FIG. 15 to 19) W. U.S. U.S. Patent Application [0006] The façade fabric of the invention described in Patent Document 2 is formed by the crystallization of the semiconductor substrate in the insulating substrate. The convex body on the surface of the insulating substrate and the side surface perpendicular to the surface of the insulating substrate. When forming a wiring trench on the upper surface of the convex body or the surface of the insulating substrate, a vehicle is projected from the outer surface side in a direction perpendicular to the upper surface of the convex body or the surface of the insulating substrate: thereby The wiring trench is formed by a good impact on the upper surface of the convex body or the surface of the insulating substrate. [0007] However, when the wiring trench is formed on the side surface of the convex body, in order to make the laser beam convexly good to the side surface of the convex body, it is necessary to change the arrangement position or direction of the laser irradiation device, or to place the platform of the three-dimensional structure_work piece. Configure the location or direction. Such an operation takes time and leads to a decrease in productivity. It is expected that such a defect will be possible and that the cost of production will be increased when the laser irradiation device or platform is modified. [0008] The present invention has been made in an effort to provide a wiring structure for a surface of a three-dimensional structure, an intermediate structure for obtaining a three-dimensional structure having a wiring on the surface thereof, and a three-dimensional structure having wiring on the surface thereof. When the wiring is formed on the surface of the three-dimensional structure of the convex body, the position or direction of the misalignment or the arrangement of the stage can be changed, and the radiation can be irradiated only in one direction to form a good circuit pattern on the convex body. [0009] 201247056 That is, the present invention is a step of forming a convex body on the surface of the three-dimensional structure, in order to delay the 丄&quot;, comprising: a resin film forming step, and 2, forming a convex shape from an insulating resin Body; circuit pattern forming step, # by the body from the outer surface of the surface of the substrate to form a tree moon film; plating catalyst coating step 'Lean and sapphire; face (four) · precursor package (four) road pattern table = film The removal step, go; and the residual of the catalyst = = no job, the step of electroplating by its fine ,, "has a tilted surface relative to the surface of the insulating substrate. In the circuit _ formation step, the edge of her edge is vertical Illuminating Ray [0010] JL is another intermediate structure of the present invention, comprising: 'turning to obtain a three-dimensional insulating substrate having wiring on the surface; and the convex body' borrowing from the surface of the insulating substrate The convex body has an inclined surface which is inclined with respect to the surface of the substrate, and the surface of the substrate is inclined to the surface of the three-dimensional structure. Square insulating resin layer forming step, containing a convex body Resin layer; %,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Appearance_Laser processing to form a deep circuit pattern; the main shape and depth of the grooves and / or holes, forming a 201247056 surface and covering steps, so that the electro-mineral catalyst or its precursor coated circuit pattern table resin film removal step , removing the resin film; and the catalyst == no? = medium or the plating surface formed by the precursor ====^_ on the insulating substrate. In the electrical shutdown _ age, Cheng Yuan New surface straight Directional irradiation of lightning [0012] Creating system - finely obtaining a three-dimensional insulating substrate having wiring on the surface; and an insulating resin layer comprising a convex body formed on the surface of the insulating substrate by an insulating resin An inclined surface that is inclined with respect to the surface of the insulating substrate. The method is g-shaped and its secret is simple—(4) depending on the wiring of the surface (4) surface ====== convex body; difficult thickness 'in the desired shape and depth ^ Face and chest, feeding the 峨 (4) road pattern table resin film removal step, In addition to the resin film; and the catalyst is not the medium or the electric ore formed by the precursor, and in the convex "forming step, the convex body having the inclined surface of the surface of the private wire is inclined to 201247056, toward the insulating substrate The surface is irradiated with a lightning in the vertical direction to form a step of the circuit pattern, and the convex surface of the convex body is irradiated to the surface of the mirror surface to illuminate the surface of the lightning surface in the vertical direction to illuminate the laser. The energy of the laser toward the early time parallel to the insulating substrate table [〇〇14] increases. Method, ^Invention of the other - Recording system - the wiring of the surface of the three-dimensional structure is the edge of the bar edge and the formation of the lipid layer, in the insulating resin layer containing the convex body; hunting on the surface of the substrate Forming a resin from the insulating resin to form a resin film on the surface; the thickness is in the shape of the hole = the surface and the step of the tree, the step of removing the resin film by removing the resin film from the circuit pattern of the electric or medium or the precursor =====Electric clock insulation forming step formed by the shaft knitting, forming an insulating layer comprising a convex body having an inclined surface inclined to the surface of the insulating coffin, then the edge substrate = circuit pattern forming step When the surface of the insulating substrate & the surface is irradiated toward the inclined surface of the convex body in the vertical direction, the laser is irradiated per unit time as compared with the surface of the insulating substrate. The energy increases. Soil The above-mentioned it is a three-dimensional structure in which wiring is provided on the surface, and is obtained by the wiring method of the surface of the body. The embossed body is provided with an inclined surface, and has a three-dimensional arrangement or direction of the convex body, and only the material (four) ^• The position of the financial platform is only the direction & the shot (four) shot 'by taking the convex shape good land 201247056 pattern. [0017] According to the present invention, the inclined surface is provided on the convex body, and the oblique surface of the convex body is irradiated to the surface of the surface of the insulating substrate to irradiate the laser, and each of the single shots is irradiated to the surface of the surface parallel to the surface of the insulating substrate. It can be directly increased 'by this, when the wiring is formed on the stand with the convex body, and the configuration of the k-object is ©, the laser can be irradiated (four) or the configuration position of the platform, and the laser is irradiated only in one direction. The circuit pattern is formed well in the convex body. [Embodiment] [0019] In the semiconductor package, in order to avoid gold wire offset when encapsulating the resin, the wiring for connecting the semiconductor chip connection terminal and the insulator is formed instead of the wire bonding. The surface of the insulating substrate, Ί 'Japanese-like semiconductors {the surface will be difficult to form a direct formation, an invention' is covered with a semiconductor resin with an insulating resin, and the insulating tree = = body surface forming wiring (International Publication W02Gl()/()87336 Bulletin). 'When the line groove is n, the age of the material is added and the circuit pattern containing the matching groove is selected'. The precision can be obtained by subdividing the high-density column such as 'the upper surface of the convex body across the side surface or even the surface of the insulating substrate. When the circuit pattern is formed, if the laser is made from the top of the convex body = the upper surface of the upper body and the surface of the insulating substrate, it is good for two; however, the laser cannot effectively impact the side of the convex body, and the method is good. The ground is formed, and the wiring is broken on the side of the convex body. /,良良 [0021] The present invention is completed by the following: an inclined surface that impacts the side of the convex body, thereby making it possible to change the position or direction of the laser irradiation device or the mounting device Ug 9 201247056 The shot is only perpendicular to the plane so that the circuit pattern can be formed on the side of the convex body. The inventors of the present invention also pay attention to the following: when the surface of the surface of the base material of the tilting side is irradiated with a laser against the non-vertical surface of the surface of the insulating substrate, the straw is not changed. The laser irradiation device is either placed with a workpiece or a direction such that the laser is formed well only along the side perpendicular to the insulating substrate on the side of the convex body. The machine, the, the shot and the movement, the surface is the inclined surface, this non-section. Here is a summary of this part of the 2nd Chen Chen, divided into a favored _ _ _ Longben (four) implementation. [Description of Steps] <First and Third Configuration Modes> The first and third embodiments of the present invention will be described with reference to Fig. 1 '. In the figure, Fu! Lu 10 three-dimensional structure 'symbol 1GA, intermediate structure' "connection terminal, symbol 13 insulation resin, symbol 13a 15 Figure of the inclined surface, symbol 14 resin film, symbol symbol (four) electricity In the wiring method according to the first and third embodiments, first, as shown in Fig. 4 (4), 201247056 is prepared for the insulating substrate 11 The 遴 主 主 女装 女装 女装 女装 女装 女装 女装 女装 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 it it it it it it it it it it it it it it it it it it it it it it it it 0027] Further, the illustration shows that the connection terminal Ua and the surface of the body wafer 12 (not protruding from the surface) are formed on the insulating substrate u or the semiconductor 5 or the sub-lla, 12a. The lla can also be a circuit-it surface (protruding from the surface). The connection terminal [0028] = the shape of the chip, the stacking wafer is not particularly limited. For example, the stacked wafer can be mounted on the insulating substrate with the adhesive layer interposed therebetween. = η. The semiconductor wafers 12 in the wafer are the most ancient and two layers of each other. The conductor wafer 12=the layer method is also a mosquito. For example, the electronic component can be covered with the insulating resin 13 by sandwiching the adhesive [0029] (4), and the surface of the J substrate 11 is made of an insulating resin. 13 forming the convex body 13 The convex body 13a of the inclined surface 13b of the edge of the base material U is inclined (the body [0030] = soil!! i convex body forming step] may also be coated with the insulating resin 13 in advance. In the case of the insulating member 11, the insulating member 11a (the convex body 13a having the inclined surface 13b inclined with respect to the surface of the insulating substrate 11) may be used on the surface of the insulating member 11. [0031] 'Illustration^' Although the inclined surface 13b of the convex body 13a is continuous j, but V follows the ladder-shaped stack 4", as shown by the _ line, the inclined surface is divided into a plurality of ladders. [0032] In the stage, the intermediate structure 1A can be obtained. The intermediate structure 1〇A is used in 11 201247056 to obtain an intermediate structure in which the three-dimensional structure ι is provided on the surface. The intermediate product 10A includes: an insulating substrate 11, And the convex body 13a' is formed of an insulating resin on the surface of the insulating substrate 11. Further, the convex body 13a has a surface opposite to the insulating substrate u. [0033] Next, as shown in Fig. 1(C), a resin film 14 is formed on the surface of the convex body 13a and the surface of the insulating base material 11 on which the projection 13a is not formed (resin film forming step). At this stage, the intermediate structure 10B can be obtained. The intermediate structure of the intermediate structure is used to obtain the three-dimensional structure 1B having the wiring 17 on the surface, and the intermediate structure 10B includes: ° f insulating substrate 11; convex shape The body 13a' is formed on the surface of the insulating substrate 11 by an insulating resin, and is formed on the surface of the large Da surface and the insulating substrate. * &lt; Further, 13b, the convex body 13a has an inclined surface inclined with respect to the surface of the insulating substrate [0035], as shown in Fig. 1(D), by forming a depth exceeding the resin film by the resin film The thickness of 14 is: face shot plus case b. At this time, the laser is perpendicular to the surface of the insulating substrate n. The laser is directed in a direction parallel to the surface of the insulating substrate 丨i; a laser is emitted. Case formation step). Further, when the circuit diagram of the inclined state of the convex body 13a is insulated in the case of the surface (10) parallel to the surface of the insulating substrate 11, when the laser is irradiated with respect to the upper surface of the 3a, the surface and the convex body are applied per unit. Form circuit pattern forming step). The field is increased. (3rd real [0036] 12 201247056 The wiring pattern of the circuit pattern 15 is formed on the upper surface of the convex body 13a, the convex body i3a = the inclined surface (side surface) 13b, and the surface of the insulating substrate η is continuously formed. One end reaches the connection terminal 11a of the insulating substrate ^. The via hole of the electrical connection case extends from the wiring groove to the connection terminal 12a of the semiconductor wafer 12. [0037] Next, as shown in FIG. 1(E), the plating is performed. The catalyst 16 or its precursor coats the surface of the circuit diagram and the surface of the resin film 14 (electro-metal catalyst coating step). The lipid film step =. _ shows that the film 14 is dissolved or punctured by the thin film (tree [0039] As shown in Fig. KG), by electroless electrowinning, an electroless plating film formation step is formed only in a portion where the electrocaloric catalyst formed by the electric iron contact is left. Thereby, in the stereo 1G in which the wiring 17 is provided on the surface, the convex H and the wiring 17 are encapsulated by the encapsulating resin 18 to form a semiconductor package. [0040] A plan view of an example of the three-dimensional structure 10 obtained by the wire bonding method of the wire 1 and the third embodiment. In the figure, the upper surface of the convex body is 13d. As shown in the figure, the wiring 17 to 7 are formed by the inclined surface 13b of the convex body 13a and the upper surface i3d of the convex body. The surface, the line 17...17 on the inclined surface i3b of the convex body 13a is also insulated from the material u, / * has a shape (four) on the table (four) is tender, the surface of the material 11 or convex [0041] 1 inch inch &lt; 2 and 4th embodiment> Referring to Fig. 3, the connection terminals of the first and fourth embodiments of the present invention, the symbol 1GA, the hall intermediate structure, the symbol, and the 11a insulating substrate, will be described. , symbol 12, connection terminal of two halves, symbol 13 is insulating resin: "= convex body" 遽 13b convex body inclined surface, symbol W is insulating tree layer, 13 201247056 symbol 14 resin Film, symbol 15 series circuit pattern, symbol a 17-series plating film (wiring), symbol 18-series. 糸 plating catalyst, [0042], according to the wiring method of the second and fourth modes, first prepare The electronic component is mounted on the insulating substrate 11, and the plurality of semiconductor wafers 12 are stacked in a stack of 3 (A) (the stacking is a stack of 1C, an LSI, a VLSI, an LED chip, etc.): a wafer 12, For example, the system 113 is exposed on the surface of the structure in the semiconductor "12 wire 胄 2 connection terminal. There is a connection to the connection. These connection terminals are, [0043] again, For example, although the surface of the connection terminal 11a, 12 body wafer 12 (not protruding from the surface), the core substrate 11 or the semiconducting layer is formed on the insulating base terminal m, or may be the surface of the circuit (projecting from the surface). [0044] Method. Iirij===Defining the stacked wafer to the insulating substrate u The mounting wafer in the mounting wafer is mounted on the insulating substrate 11. The stacking layer stacking method is also determined. The insulating substrate 11 may be, for example, an exothermic metal [0046] Sub-Ua is provided in the insulating resin 13 described below. The material 11 is thereby not covered with the insulating resin 13 And the insulating substrate is called an insulating hang, and the surface of the j substrate 11 is formed by the insulating resin 13 to form a convex π surface inclined 曰 曰 U U U 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 U U The insulating resin layer 13c of the convex body 13a (insulating tree [0047] is a step of forming a layer of the edge of the tree, and may be attached to the insulating substrate 11 by an insulating member 13 previously covered with an insulating member 13 201247056. This also forms the convex body 13a with the insulating resin 13 on the surface of the insulating substrate η ( There is a convex body 13a) which is inclined with respect to the surface of the insulating substrate 1 with respect to the surface inclined surface 13b. [0048] Further, in the illustrated example, the inclined surface 13b of the convex body 13a is continuous, but can follow the ladder-shaped stacked wafer. As shown by the chain line, the 'inclined surface is divided into a plurality of ladders. At this stage, the intermediate structure 1GA is obtained. The intermediate structure is obtained in the intermediate structure of the three-dimensional structure in which the wiring 17 is provided on the surface. The product 10A includes: an insulating substrate 11 interposed therebetween; and an insulating resin layer 13c, which is included in the surface of the insulating substrate u to form a convex body 13a. Shaped and nb. [0050] The convex body 11⁄4 has an inclined surface of the slanting edge of the smear. Next, as shown in FIG. 3(C), the insulating resin layer i3 #lip film forming step is performed. The paste layer (5) Table (4) is formed into the resin film 14 (at this stage, the intermediate structure 1 可获得 can be obtained. The intermediate structure 10 Β includes: an insulating substrate 11; and a three-dimensional structure for obtaining the wiring 17 on the surface 忉:: J p., 诰舨 诰舨 ηη 厶 厶 厶 〜 〜 〜 〜 〜 〜 〜 〜 〜 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中14' is on the surface of the insulating resin layer 13c, and the convex body 13a has a beveled surface. Next, as shown in Fig. 3(D), the laser is applied from the outer surface side of the resin film 14 to form a depth. Exceeding the thickness of the resin film 14, the sacred sand y groove and the hole, thereby forming a channel pattern Ϊ5 including the convex shape of the convex body 13a. At this time, the electricity is formed perpendicular to the insulating substrate. (Laser). The laser is laser-parallel to the insulating substrate. The laser is irradiated with the material in the insulating substrate. The illuminating ray is a step of forming a pattern of fB radiance per unit time. The wiring pattern of the circuit pattern is formed on the upper surface of the convex body 13a continuously along the surface of the lipid layer i3e. The connection pattern of the circuit pattern ^ i 11 - [0054] as shown in FIG. 3(E), the plating catalyst 16 or its precursor is coated on the surface of the circuit 15 and the surface of the resin film 14 (electric clock catalyst) [0055] The lipid film t^r (F) solution 'borrowed __ 14 dissolved_ tenderly removed (tree [0056] secondly] as shown in Figure 3 (G), by electroless plating, only by electroplating The electroless plating film (wiring) 17 is formed in the portion where the plating catalyst is formed by the contact 16 or its precursor (the plating film forming step). Thereby, the three-dimensional structure 10 having the wiring 17 on the surface is obtained. In the case of 10, the insulating resin layer 13c including the convex body 13a and the wiring π are encapsulated by the encapsulating resin 18 to form a semiconductor package. [0057] &lt;&lt;Other structures of the convex body&gt; Referring to Figs. 4 and 5, Fig. 6 is a view showing another structure of the convex body 13a. Fig. 4(a) to Fig. 4(D) correspond to the first and third embodiments (B) the step of forming the convex body forming step 16 201247056 Implementing the resin layer i3c) As shown, it is equivalent to the 2nd and 4thth! And in the third stage, the phase of Fig. 6 is in the stage of the end of the forming process of the 19-series wafer inductor or capacitor. In the figure, the symbol plate (the stacked chip in Fig. 6), the connection terminal of the multi-layer circuit base, and the respective circuit blocks in the circuit base 6 are rewiring. The connection wiring of the connection terminal and the wiring is formed by stacking the wafers in [0058] in Fig. 6. The respective halves = the insulating resin 13 is covered. Therefore, the stacked wafer does not have the surface of 11, that is, the surface of the stacked wafer, and the edge of the substrate 11 is inclined. Inclined surface. Also formed ί; = Γ.) Although there is no inclined surface 'but the convex shape is covered (4) [0059] Relative to this 'as shown in Fig. 4 (a), each of the fat guiding edge substrate U The surface is inclined so that the sides of the stack 2 are inclined with respect to the surface of the surface. That is, the stack may follow the ladder-shaped stacked wafers for the wei edge substrate η [ooiot^13a 5 ^ body..._face], and the convex bodies are shown by a plurality of lines. The inclined surface 13b of the shape a is divided into a ladder shape [0061] and as shown in Fig. 4 (8), the convex body 13a is also ======== not limited thereto, and may be a + conductor chip electronic component) Although the side is 17 201247056 and so on. In the shape a, the insulating resin 13 may also be covered with a pin or a bump [0062] and as shown in FIG. 4(C), the convex body i3a may also be a member of the prism 19 by using a crystal of only a salty sulphide + $ + Ϊ ίίΪ It is mounted on the insulating substrate U to insulate the surface of the substrate with an insulating tree, but the convex body 13a is formed to be formed and the surface of the substrate is inclined, and the convex body covered with the convex body _ ::=. Further, in the case of the convex body, the insulating resin u is [0063] shaped. ΐ/, as f 4 (D) * ′ 凸 ❿ 绝缘 绝缘 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ i t 彡 彡 靖 _ ig surface matching [0064] or components such as punching materials other than electronic components. The plurality of ridges may be formed by coating the 20 f grease 13 mounted on the insulating base material 11. The multilayer circuit board is formed by electrically connecting the three-dimensional structure w2Ga via the connection wiring to form a wiring structure (in more detail, the inclined surface of the convex body 13a) is used as the insulating substrate 11 for the η, ϋ The connection terminal 11a. The wiring 17 is connected to the external wiring of the multilayer circuit substrate 2G by Ϊίϊί f. Here, instead of the ===2" substrate 2, the circuit board 2 of the lowermost layer is not formed with the wiring 17\ side circuit board 2G. In the side surface of the convex body 13a [0065] The following wiring is recorded inside the convex body For example, the connection terminal 20a of each of the multi-layer circuit boards 20 is connected to the end of the 201247056 network wiring 20b. The convex body 13a is formed, and the connection wiring 2〇b is horizontally extended by 1 'connection. The other end face of the wire 20b is inclined to the convex body 13a. The circuit pattern=the step towel' forms a wiring groove, and sequentially passes through the other end of the connecting wire 20b extending from the circuit substrate to be connected. The 'protruding body 13a' shown by M can also be formed by covering the sheet resin 13 mounted on the insulating base material 11. The respective wafers constituting the stacked wafer 20 are re-wired and electrically connected to each other to form a three-dimensional structure w. The wiring 17 of the inclined surface 13b) of the shape 13a. The wiring 17 is further connected to the terminal 11a. The wiring 17 is used to connect the stacked wiring to the external wiring (which can replace the through-hole (Tsv)). The body 13a has a shape that is inclined with respect to the surface of the insulating substrate 11. Lions, etc., but also according to the situation, do not have parallel to the surface of the insulating substrate 11 or ® cone material. ·^ can also be a hemispherical shape, etc. The above convex S body only has 1 in the object 10 There may also be two upper-capacity 'each convex body 13a can be in the former furnace; the same structure s in the soil 曰 s can also be different structures (mixed). ° [0069] &lt; convex body Specifications of each part > γ-ray laser focus position, symbol z z (four) m-ray laser irradiation device, symbol focus position rotation), symbol θ · clear to insulation; surface to laser tilt angle. Also, reference surface resin &amp; Insulating Resin of the inclined surface of the 2-shaped body 红3 of the Hongqi County New ' continuation of the lower layer [0070] 19 201247056 rim base ====== (4) The inclination angle is at the upper limit of _ the surface of the insulating substrate 11 The ratio is 10. to 83. The lower limit is f A. The upper limit is 75. The upper limit is 60. The upper limit is 60. The upper limit is in the shirt. The following is extremely desirable. a &amp; recording, z pure keratinization. However, depending on the situation (for example, according to the angle of the 隅 系 ^ ^ 去 去 去 或 或 或 或 or curved face = or curved. For example, do not need to be the original [0072] this embodiment In addition, the size of the three-dimensional structure 1G and the convex body 可 can be changed depending on the various uses and the like. For example, the length of the three-dimensional structure 1 or the width J (approximately a) is about 1 mm to several tens of cm, convex. The length of the base of the shape 13a or (symbol b) is about 1 〇哗 to several tens of cm 'the height of the convex body ( (symbol c) is about = to several mm. [0073] In the present embodiment, the laser irradiation device X There is no particular limitation. For example, a carbon dioxide gas laser, a pseudo-molecular laser, a uv_YAG laser, or the like can be used. Shape: The width of the wiring trench of the circuit pattern 15 is, for example, about 2 〇 μηι, and a high-density circuit pattern can be formed according to the situation. [0074] In the present embodiment, the laser irradiation various parameters may be various types of the insulating resin 13 or the material type of the insulating substrate I and the inclined angle of the inclined surface 13b of the convex body 13a. For example, the frequency of laser B should be about 10~100Hz. It is preferably about 40~70Hz. It is quite ideal for about 50~70Hz. It is more ideal for about 60~70Hz. The moving speed of laser L (moving speed in the direction parallel to the surface of the insulating substrate ^: processing speed) is preferably about 100~2〇〇111111/sec, more preferably about «20 201247056 120~150mm/sec, about 12〇~14 〇mm/second nowcw seconds is extremely ideal. Laser L loses '0.3-0.5W „J , 〇.35^〇.5W ^^ 〇41; 〇15〇; §, only ίίί. However, the setting of the frequency or speed of the laser processing machine or the setting of the wheel is of course [0075]. In the fourth embodiment, the surface of the inclined surface (10) f of the convex body and the upper surface (10) of the convex body are irradiated with lightning. The energy of the shot l two two single p field L is increased. This energy increase can be achieved by combining the speed of the laser beam L (cry speed) and the ejection of L = above. j. The author or the two [0076] In the a (four) state, the laser focus position y is set between the positions near the base 13d near the base of the convex body 13. Alternatively, the position of the mine position γ may be set between the position of the base of the convex body 13 and the position of the upper surface 13d. That is, the height between the heights (c) of the buttons 13 is between the lengths of the inclined faces. At this time, the ancient 疋 laser focus position γ is lower than the base of the convex body 13, and can also be set at the upper surface 13d of the i if f body 13. In the present embodiment, the distance from the reference surface #二η focus t to γ is referred to as a focus deviation m. The focus deviation m can be changed according to the convexity: various degrees C and the like. The focus deviation m is, for example, about several μηη to _, and is one of representative values, for example, 〇 35 mm or the like. &lt;Operation and Effect of the Present Embodiment&gt; In the first embodiment, the (B) convex body forming step, the (C) forming step, the (D) circuit pattern forming step, and the (D) circuit pattern forming step are included. (8) Electroplating catalyst coating step, ) Resin film removing step and (G) plating film forming step on the surface of the solid structure 10 21 201247056 Body forming step, forming insulation with respect to the insulating pair = F; convex body 13a 'In (9) circuit pattern forming step, appearance 'direction of the shot ^f laser L. Thereby, from the resin film 14 training, the 'shot laser L can effectively impact the tilting direction of the convex body 13a. The position or direction of the X-ray table of the device is irradiated, so that the laser is insulated for the material A. The U surface is irradiated only in the vertical direction, and at the same time, the laser L phase is shaped as 'if, and the surface is moved in parallel, whereby not only the insulating substrate 11, but also the inclined surface 13b can form the circuit pattern 15 well (refer to the figure). 2) The step of forming the GS circuit pattern, when the laser beam L is irradiated to the convex body 13a, the energy of the L-ray is increased per unit when compared with the two-shot L parallel to the surface of the insulating substrate 11. . Therefore, the position or direction of the platform can be omitted, so that the laser L is irradiated only in the vertical direction with respect to the surface of the material ▲, and at the same time, the laser L is rotated relative to the insulation, and the wire is cut into the heart. ❿ [QQ8 (^ surface 13t>) The circuit pattern 15 can also be formed well (see Fig. 2).

I

When the surface of the Ui edge substrate 11 is irradiated with the laser beam L in the vertical direction, the laser surface L is in parallel with the surface of the surface of the insulating substrate 11, but the tilting impact on the inclination of the convex body 13a is obliquely impacted. . As a result, the reflection of the convex body 13a in the convex H^ is increased, and the portion having a high energy distribution is reduced. Therefore, the trench or hole of the circuit pattern 15 formed by the Hi% tends to be small (the width or depth of the trench or the hole is thinned or lightened [0081]. The groove or hole of the IH15 is reduced] circuit In the pattern 15, the electric clock catalyst 16 ^ is reduced, and the electroplating catalyst 16 is used as the core to grow and the electroless electroless film is formed, so that it becomes difficult to form. As a result, the inclined surface of the convex body m is easy to be formed. If the wiring or the hole of the circuit pattern 15 is reduced, the capacity of the groove will be reduced, so that the growth of the electroless (electrical) surface 17 will easily overflow from the groove or the hole. As a result, it is easy to cause a short circuit or migration. 22 201247056 [0082] In the face of such a loss, the energy of the laser L is increased on the inclined surface 13b of the convex body 13a, and the body of the emperor is early. Therefore, the energy lost by the reflection of the laser L can be supplemented with J. The octagonal fruit, the groove or the hole of the circuit pattern 15 formed on the inclined surface 13b, tends to be suppressed, and can be suppressed. Line or flap or migration ', ' [0083] The intermediate structures 10A, 10B of the first and third embodiments include: an insulating base The material 11 and the convex body 13a' are formed of an insulating resin 13 on the surface of the insulating substrate. The 'convex body 13a has an inclined surface 1 inclined with respect to the surface of the insulating substrate u. The object or the brain towel can change the position or direction of the laser irradiation device or the flat opening, so that the laser beam is irradiated along the vertical f direction with respect to the surface of the insulating substrate u, and at the same time, the laser beam is opposite to the edge and the edge. The surface of the material U is moved by the flat lamp. Thus, not only the insulating substrate u but also the circuit pattern 15 is formed well on the inclined surface of the convex body 13a. Therefore, the intermediate structure is tender and the surface is suitable for δ. The surface of the first and third embodiments is further provided on the surface of the insulating body 11a and the resin substrate 14 which is formed in a removable manner. Therefore, the electric film 15 is formed on the surface of the convex body 13a and the surface of the insulating substrate u over the resin film 14, and after the electric shovel catalyst ι6 is coated, the resin film 14 is removed, whereby the electric key can be touched. The portion remaining in the circuit pattern 15 'forms an electroless electrolytic film (wiring) 17. This intermediate structure is due to j 10B is more suitable as an intermediate structure in which the three-dimensional structure 10 having wiring is provided on the surface. [0085] The second and fourth embodiments shown in FIG. 3 include a step (B) of forming an insulating resin layer. (C) resin film forming step, (d) electric 4 pattern forming step, but) electroplating contact, cladding _, (: ρ) _ station step ((}) electric ship to read the stereo 10 surface wiring In the method, in the (Β) insulating resin layer forming step, the edge 23 201247056 edge resin layer 13c including the convex body 13a having the inclined surface 13b inclined with respect to the surface of the insulating substrate 11 is formed, and the (D) circuit pattern is formed. The cow &amp; directs the laser L·. Thereby, from the tree, the surface of the insulating substrate 11 is irradiated with the inclined surface of the vertical effective impact convex body 13a, and the position or direction of the laser is irradiated, and the position of the laser can be changed without changing the laser irradiation. The device illuminates 'in the vertical direction' and at the same time causes the lightning: relative == material η surface to move only, thereby not only in the insulating resin layer 13c but also in the surface of the substrate 11 which is exactly parallel to the surface of the substrate 11 in the convex body 丨 3 The tilting surface "two is in the surface pattern 15 of the insulating substrate 11. The beveled surface 13b can also form a circuit well [0086] Change the laser irradiation device X or the platform of the platform #大口 this, can not be insulated 11 #秘%千置置或方向'Welve Wei L relative to the ίίίΛ direction and At the same time, the laser beam L is moved in parallel with respect to the surface of the insulating substrate 11, whereby the inclination of the convex body 13a is good not only in the insulating resin layer but also in the portion of the surface of the surface of the insulating substrate 11. The circuit pattern 15 is formed. That is, the slope of the inclined surface is compensated by the energy lost by the laser. The circuit pattern formed on the inclined surface 13b is spliced. [The tendency of ϊί small can be suppressed, and the problem of _ line or scale or migration can be suppressed. The intermediate structure 〇Α, 1〇Β according to the second embodiment includes: an insulating base material 11; and an insulating resin layer 13c, which is provided on the surface of the insulating base material U to insulate the convex body 13a. Further, the intermediate structures ι and 10B of the fourth embodiment include: an insulating base material 11; and an insulating resin layer 13c' which is provided on the surface of the insulating base material η to insulate the convex body 13a. 9 [0088] Further, in either of them, the convex body 13a has an inclined surface 13b with respect to the insulating base material 24 201247056. Therefore, in the intermediate structures 1 () A, 10B, the position or direction of the illuminating device X or the platform is such that the surface of the laser L-phase is only irradiated in the vertical direction, and at the same time The laser beam L is moved in parallel with respect to the parallel two (four)', thereby not only the portion having the surface of the surface of the insulating resin layer 13c, but also the circuit pattern 15 on the inclined surface of the convex body. Therefore, the intermediate structures 10A and _[00^9] are intermediate structures for obtaining the three-dimensional structure 10 of the surface-setting peach line. The intermediate structure 10B of the 13c ^ 2 and 4 embodiments further includes a resin film 14 which is formed in a removable manner on the surface of the insulating resin layer. Therefore, the circuit pattern 15 is formed across the surface of the resin film kUt lipid layer 13c, and the plating contact is known as the octopus film 14', whereby the plating catalyst can remain only in the portion of the circuit pattern 15 (electrolytic film). . Therefore, the intermediate structure excitation is more suitable for [ooiof to obtain the inter-sheet structure of the surface structure 1G of the surface-setting peach line. In the fourth embodiment of the lightning striker, the insulating resin layer 13e is formed not only on the electronic component (stacked wafer) but also on the portion of the insulating base material 11 on which the jr member is not mounted. Further, a circuit _15 is formed on the surface of the grease layer 13e to form the wiring 17. Therefore, it can be prevented from =. 17 Contacting the connection terminal Ua of the insulating substrate u, and expanding the wiring 17 to rewind [0091] In the present embodiment, the convex body 13a is at least one of the following: The insulating resin 13 is formed in a convex shape (Fig. 4(D)) An electronic component (the electronic component having an inclined surface inclined with respect to the surface of the insulating substrate 11) to be mounted on the insulating substrate η is made of an insulating resin 13 4 (A), FIG. 4 (B)); The figure will be mounted on the electronic component of the insulating button 11 (the electrical reading material has an inclined surface inclined on the surface of the phase insulating substrate 11) to insulate the resin 13 ', 1 (B), Fig., and Fig. 10 (10). This can be based on whether the side of the three-dimensional structure 10 is the same as that of the sleek circuit board 25 201247056, and the inclination of the surface of the insulating substrate 11 is inclined. In the actual state of the coated electronic component, the electronic component is at least one of the following: a semiconductor wafer (Fig. 4(B)); a plurality of semiconductor wafers (10) 1 (8), Fig. 3 (Β), Fig. 4 (Α )); and = chip inductors or capacitors and other circuit-mounted components (Fig. 4 (Q).) and other 1 and = such as semiconductor sealing circuit [0094] As shown in Fig. 1 (B), Fig. 3 (B), and Fig. 4 (A), the stacked wafer towel, the surface wiring of the 1D stereoscopic structure 1G, saves space and wiring freedom. Increased and reliable: see the enlargement of the Japanese film, more segmentation, etc. Layer [0095] In the present embodiment, the inclination of the inclined surface 13b of the convex body l3a = 11 surface angle is 0. When 'relative The surface of the insulating substrate u is: the nightmare is such that the inclination angle θ of the inclined surface 13b of the convex body 13a is such a range ^ ^ H13a the length or degree of the base portion (8) is not too large and does not change the position of the laser irradiation ^ ί ί Or the direction, the laser L is irradiated with respect to the insulating substrate U j in the vertical direction, and at the same time, the laser L is rotated relative to the insulating substrate u, whereby the circuit pattern 15 can be sufficiently satisfied with the inclined surface 13b. Further, in the third and fourth embodiments, the moving speed (machining speed) of the laser beam L is increased, and/or the amount of output LM of the laser beam L is increased, so that it is simple and 26 201247056 In the third and fourth embodiments, the inclination of the inclined surface 13b of the convex body 13a is as follows: : t unit, shot l The energy is increased even more, so even if it is tilted:

Also a, it is also possible to easily and surely compensate for the energy lost by the reflection of the laser beam L on the inclined surface 13b. [0098] π soil Axle, the convex body 13a of the plurality of face-to-face and the ship's z are required to be obtuse. Therefore, (in the resin film forming step, by, for example, coating a solution or stacking a thin and soft resin film, it is possible to use a convex body fat; 14. That is, if the angle of the convex body 13a is an acute angle, It is difficult for the shovel cloth to be unevenly coated and it is difficult to form a film 14 on the surface of the yttrium. When a thin and soft resin film is stacked, the film may be broken and it is difficult to form a good ridge on the corner 'Z surface. The wire coating step and the (G) electric ray forming step, the unnecessary electric medium 16 has a month b 〇 corner 隅 portion Z and forms an electric clock film to become a circuit formation failure (circuit short circuit ^ cause 1 in the De-angching or surface-forming, the corner portion Z of the convex body 13a is bluntly formed in the corner portion Z resin solution, or the resin film is good. [0099] In this embodiment, the three-dimensional structure 1 is on the surface. The wiring 17 is provided, and the wiring method shown in FIG. 3 is obtained by the drawing. Therefore, the inclined surface of the convex body (5) can be well formed, and the wiring is well formed by the I5'* disconnection. In the third and second aspects, 'other than this', the problem of short circuit or migration can be suppressed (see Fig. 2). t, in the (D) circuit pattern forming step, grooves and holes having a depth exceeding the thickness of the resin film 14 are formed. Therefore, the circuit pattern 15 penetrates the surface of the three-dimensional structure 1 , and the wiring 17 is partially or entirely embedded in the three-dimensional structure 1 As a result, the /If wiring is used to suppress the misalignment of the three-dimensional structure 10, and the wiring 17 is prevented from falling off or deviating. [0101] In the present embodiment, the laser focus position is set in the (D) circuit pattern forming step. Y is located between the position near the base of the convex body 13a and the position near the upper surface i3d. That is, it is substantially set between the lengths of the inclined faces 13b of the convex body 13a. Generally, it is preferable to maintain the lightning force during the working hours of the laser beam. The focus position γ of the shot L is set to be constant. However, in the present embodiment, the object to be processed has high absorption of laser light in a wavelength region of 100 nm to 4 nm.

The rate of the resin (insulating resin 13), or the depth of the focus of the laser L is sufficient, so even if the laser L, the focus position Y is deviated sufficiently to perform laser processing. Here, the setting of the lightning is substantially between the lengths of the inclined surfaces of the convex body 俾, and the entire length of the inclined surface 13b of the 俾 circuit convex body 13a is well formed. The laser focus position Y can be sighed below the base of the convex body 13a, and the body 13a is on the surface of the table 13 (1), and is also the same as the convex shape [0102] [Description of the material] (insulation base) The material coffin 11 can be used without particular limitation, such as for use in an ampoule semi-conductive = column inorganic substrate. As a specific example of the organic substrate, a lipoxy resin, a propylene glycol resin, a polycarbonate tree = Well resin, double-polymerized whistle 1, _ resin, benzene type tree ί want = example ί can be used, the circuit board is made up of: double Α type epoxy tree month: 雔Ί 雔Ί limit, specific For example, the following aralkyl ring-lips, benzenes, oxime resins, double-aged S-type epoxy resins, and various oxygen-based resins, bicyclic fluorene-type epoxy trees, _ shrinkage The epoxide of the condensate of glycerol i, the oxygen of the trimeric isocyanate or the squamous degeneration, etc., and the flame retardancy, ί = "I can combine the day and contain _. When the resin is used to form the insulating base material 11 with such a resin, in order to harden the resin, a hard 28 201247056 amine is used. For example, a dicyanodic acid cyanide resin or the like is used. A sulphur-based benzophenic acid hardener, [0105] as a discretionary hardener, which can be combined with a mountain, a flame retardant, an aromatic form, a type, etc.; Use &amp;^=species alone = use the tree to form electricity! The case forms her laser processing grease, etc.. Concretely, the absorption rate (uv absorption rate) is excellent. [0107] For example, polyimine Resin or the like. The insulating substrate 11 may also contain a filler = _ silk, _ 峨. The age contains a dew point, and the concavity and convexity of the filler 11 and the new film 17 [0108] = a material constituting the inorganic fine particles, Specifically, for example, it can be cited as: -tu/Lt (Al203), magnesium oxide (Mg〇), nitrided butterfly (four), nitrided (Α1Ν), ^; crushed (ι〇2), barium titanate High dielectric constant such as (BaTi〇3) and titanium oxide (Ti〇2) filled with magnetic filler such as hard magnetic material; magnesium hydroxide (Mg(〇H)2), aluminum hydroxide (A1(〇H)2), Inorganic resistance such as trioxide (Sb2〇3), ===Sb205), strontium salt, zinc borate, phosphating hexate, zinc stannate, etc.: stone (Mg3(Si4O10)(〇H)2), barium sulfate (pas) 〇 4), obstructive mother (cac〇3), banquet mother, etc. These inorganic fine particles may be used singly or in combination of two or more. 29 201247056 The inconsistency of the island's innocent particles, such as thermal conductivity, dielectric constant, flame retardancy, particle size distribution, and humanity, so that when the desired function is selectively exerted, the material can be appropriately reduced and reduced. It is pure. 〇.〇=== is not particularly limited, but is preferably, for example, (10) 1 is called 1010 μm, and the dispersibility is improved in the rim substrate 11, and the inorganic fine particles may be cyclized. Further, in order to improve the dispersibility of the inorganic fine particles in the insulating base material 11, the second embodiment also contains a Shi Xiyuan coupling agent. The Shi Xi siu coupling agent is not particularly limited. With class i萁: two? For example, the following decane coupling agents, etc.: epoxy decane, decyl decane window, ti/burning, ethyl ruthenium sulphate, styrene based sulphur, sulphur-based propylene, sulphide Classes, titanates, etc. These decane couplings may be used giLt alone or in combination of two or more. Further, the dispersibility of the fine particles in the insulating substrate 11 and the insulating substrate 11 are burned. "Hi is not particularly limited as a dispersing agent. Specifically, for example, a class I, a silk polyetheramine, and a high A dispersing agent such as a molecule may be used alone or in combination of two or more kinds. The organic fine particles used as a filler may be exemplified by rubber particles [0114]. Specifically, a sheet, a crucible, a crucible, a crucible, a three-dimensional shape molded body, etc. The thickness of the insulating base material η is also particularly limited. For example, a sheet, a film, a prepreg, and the like - "Special = ' Ideally, I want to __ put in, win, and make ^it, etc., which will become the material of the insulating substrate, and the molded body formed into a three-dimensional shape, etc., may also be 201247056. The prepreg is punched out, and the second is donated to the child to harden it, thereby forming a three-dimensional shape, m or the like, or heating to add [0116] (insulating resin) organic and structural system to steam the shirt, It is also possible to make the insulating material of the multi-layered inorganic material or mix or use the insulating tree to replace it (4) (5) It can also be used in silk condition, without making machine materials, etc. Shi Xi (Sl〇2) is specially used for the first time, such as Tao Jing, etc. [0117] (resin film) As the material used to form the resin crucible 14, the mouth or swelling is removed. Tree 4V ===With film=, the degree of swelling is high, and the resin is peeled off by swelling. The planting is 'or for the established liquid L^Jl 18] iv丄丄yj or the tree should be like the liquid swelling degree of the given liquid is 5〇 % or more, the specific resin of the resin is, for example, 500% or more of the swellable resin. As such: it is adjusted to a desired degree: gelatin, (tetra) acid copolymer, etc.: === [0120] (Electroplating Catalyst) Electrolysis is a catalyst that is previously applied to the portion of the electroless shovel film 17 to form a helmet forging film. As the plating catalyst 16, as long as it is ^ 31 201247056, it is used as a catalyst for electroless plating. The user can use the electric medium 16 instead of the electric medium. Instead, the coating can be made to t ° and _, = _ medium 16 _, for example, the metal [0121], 16 coating method can be mentioned (four) For example, after treating with the acid solution of _~3 acid Π ΐ ΐ acid tPd_Sn, the solution treated with acid solution is ίίΐ as follows. First, it will be in (9) circuit == The shaft of the shaft _15 surface is oily and soaked with a hot metal such as a surfactant.) Secondly, the soft etch treatment is carried out with a sodium-sulfur sulphate soft button engraving agent. In addition, the acid solution such as the solution = ^ solution is pickled. Secondly, the dipping, the main ΐ ΐ water solute is the domain of the job, after the gasification residual adsorption, the immersion 3 and S palladium pH 1~3 acid (four) η Acidic contact such as colloid, metal colloidal towel "provides pd and Sn to agglomerate and rhyme. In addition, it causes redox reaction between adsorbed stannous and stannous chloride = i + Pdcl2 - SnCl4 + P (U). In this way, the metal palladium of the electrocatalyst catalyst 16 is precipitated (pf a and 'as the acid catalyst metal colloid dissolved in the night'), and the conventional acidic pd_Sn Qin, catalyst solution, etc. can be used to make the __media Jinlin liquid Such a process is, for example, systematically sold by Rohm and Haas Electronic Materials Co., Ltd. (electroless plating) ' As a method for electroplating of (G) electroplating lions, it can be used as a catalyst. 16 coated electric clock object is immersed in the electroless plating bath. The plating film 17 is only analyzed in the portion coated with the plating catalyst 16 [0124] 丨 is used for the electroless metal, for example Copper (Cu), nickel (10), and Lu (A1), etc. Among them, the electric clock film containing Cu as a main component is excellent in conductivity, and is preferable because it contains Ni. The adhesiveness of the solder is excellent. The thickness of the coating film 17 is not particularly limited. Specifically, for example, it is preferably 〇im, preferably about 1 to 5 μm. [0126] This issue of the Japanese secret - the type of the three-dimensional structure of the table Φ wiring Fang Hong contains β, on the surface of the insulating substrate by The edge resin forms a convex body; ϋΞΐίϊϊ, a resin film is formed on the surface of the convex body and the surface of the insulating substrate; the thickness of the surface is in a desired shape and depth _ and _ = surface and 'the plating contact or its fine _ circuit pattern a resin film removing step, removing the resin film; and a shrinking step, forming an electroless plating film only on the plating catalyst or a residual portion of the electric clock catalyst formed by the precursor;

[0127] constituting the intermediate insulating substrate of the __ ̄ county self-contained _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Inclined surface. ^In order to obtain a three-dimensional structure having a wiring on the surface, the surface of the convex (four) wire and the surface of the lining substrate (4) can be removed, and the surface of the base of the U can be removed, so that the surface of the material is inclined to the circuit pattern. In the forming step, the film is irradiated 33 in the vertical direction toward the surface of the insulating substrate. [0129] The present invention is a wiring method for a surface of a three-dimensional structure, comprising: an insulating resin layer forming step, an insulating resin layer containing a convex body on an insulating substrate surface by an insulating tree; 氐u resin 臈 formation a step of forming a resin film on the surface of the insulating resin layer; the circuit pattern forming step 'by performing laser processing from the outer surface, depending on the thickness, the impurity and the deep red groove view/or hole, forming the surface and frequency, so that __ Or a material-coated circuit pattern sheet resin 臈 removal step to remove the resin film;

The ship is turned into a non-electrolytic plating film formed only by the wheel catalyst or by the front part of the plating catalyst formed by the recording; X is the purpose of forming the slanting inclination of the surface of the insulating substrate The insulating resin layer of the convex surface of the surface is irradiated with the surface of the edge of the gold in the vertical direction. [0130] The structure is t-turned to obtain an intermediate insulating substrate having a matching lining material on the surface; and the θ layer of the ridge body of the ridge is included in the surface of the swarf material by the insulating tree body. 0131^ The convex body has an inclined surface with a tilted surface of the substrate. In addition, there is a description of the structure of the material, and the object can also be used to cut the red resin film on the surface of the layer. The three-dimensional structure for the surface to be provided with wiring is suitable for the 34 201247056 convex 绫 S edge resin is convexly formed; and/or the material surface is inclined to the insulating substrate, with or without Subtracted from the insulating base of the electronic components of the parasitic mosquito to form the marrow. The inside of the furnace is provided with an interconnected structure in which the three-dimensional structure of the wiring is provided. The electrons are: the middle of the three-dimensional structure of the stack, and/or the three-dimensional structure of the crystal inclined surface. In the structure, the convex material of the convex material is reduced to the insulating base [0135]. The convex method of the sacred fabric, = the other aspect of the invention is the wiring of the surface of the three-dimensional structure = ί 2 ί$Ξ ' ί Insulation substrate surface is formed by insulating resin to form a convex body; Circuit _ Axis step, wrong from the outer surface side to enter the thickness, in the desired shape __^= face and Qing, feed 峨 pure na pattern table The step of removing the resin film from the tree decimating film; and removing the resin film from the step of removing the net; and forming the electroless electric surface only by the residual impurities of the static catalyst formed by the Wei or the precursor; The surface of the fine object is inclined to the circuit diagram _ into the turn of her county material sheet in the vertical direction to illuminate the thunder 35 201247056, and the surface of the convex surface is irradiated with the surface of the convex surface to illuminate the laser, so that the insulation per unit time Substrate table [0137] =: contains · · Insulating resin layer containing convex body; , ' soil surface by insulating resin SSS is formed in the package; == into a resin film; the film thickness is in the form of a green-shaped s surface and a tree-coated film 4' to make a plating contact or a resin film removal step thereof. Removing the resin film; and forming a step of forming the plating surface of the catalyst medium or the precursor formed by the precursor, forming an insulating resin layer including a convex body having an inclined surface inclined to the surface of the insulating surface, The substrate is shot, and the case is formed. When the laser is irradiated in the vertical direction toward the surface of the insulating substrate, the energy of the clearing of each unit is squeaky, and the surface of the insulating tree is etched. The insulating substrate 'is formed with or without an electronic member with respect to the insulating substrate [0139] '1 slope. In the wiring method opposite to the body wafer, the electronic component should be a single-half-conducting circuit, such as a semiconductor wafer, and/or a wafer, or a capacitor [0140] 36 201247056 The wiring method of the surface of the pair of steric structures is The energy of the laser per unit time increases. Hunting by the laser frequency between the turns, [0141] 可 The speed of the wiring method of the surface of the pair of stereoscopic structures is increased by __wei. L-Imprint Movement [0142] The method of wiring the surface of the pair of three-dimensional structures is to increase the energy per unit time_laser. Laser transmission [0143] In the wiring method of the surface of the pair of three-dimensional structures, the focus position is set near the base portion [0145] the body configuration - the above-mentioned opposite [0146] shot === pattern. Ride to 'only along the direction—to form a circuit in the convex body [0147] The laser i is inclined to the convex body, and the inclined surface toward the convex body is located parallel to the insulation. When the surface of the surface of the substrate is irradiated with a laser, the energy per shot is increased, whereby the wiring is formed in the vertical direction with the convex body (4) 'the position or side of the configuration where the lightning state is not changed or the platform is not changed [ 0148] The laser is irradiated in the /〇 direction to form a circuit pattern well in the convex body. 37 201247056 The following is a more specific summary of the invention. It is not limited or transferred due to the following implementation. EMBODIMENT OF THE INVENTION [Embodiment] [Examples] In Fig. 7, respectively, (a) is 1 mm, and (9) is the inclination angle θ of the contact inclined surface 13b of 45. (Test No. υ, 75. (Try) $ J = 4), %. (Test No. 5). ^Creation' Degree 20, the groove. The laser is irradiated from the convex body 13a above the vertical S surface. At the same time, it moves along the table iiir parallel to the insulating substrate 11. Further, the groove formed on the inclined surface i3b is observed by a microscope, and the laser is applied to the surface. The results are shown in Table 1. Further, the embodiment is described. Laser processing (1), using U^YAG laser MODEL530. % &lt; 丄a岣泉[0150] (evaluation basis) x: There is more than one point at the complete disconnection. △ No disconnection, but inclined surface The width of the 13b groove is less than 15μηη. 18μιη〇··There is no wire breakage, the width of the groove of the inclined surface 13b is above ι5μιη, not full, ◎.The wire is not broken, and the width of the groove of the inclined surface 13b is 18μπι Above, 20μηη or less. [0151] [Table 1] 38 201247056

As is clear from the results of Table 1, the surface of the side material 11 of the convex body 1Sa is inclined without being perpendicular, and it is possible to change the thunder &amp; The position or direction of the irradiation device or the platform is irradiated only in one direction, and when the evaluation result f is used, the result is more excellent when the evaluation result f is arbitrarily and the degree is ^^^^ (test number 1, 2). (Example 2) Inclination iii is more than 7' (a) is lnun' (b) is (c) is 6'' ==13b, and the degree of inclination Θ is 45. The middle structure says that the test film is unsatisfactory). Further, for each sample, a UV-YAG laser (wavelength 355 (4) was used, and the surface of the insulating substrate 11 was traversed from the convex body 13a or the upper surface 13d of the convex body 13a in a laser irradiation condition. Two grooves having a width of 20 μm are formed at intervals. The laser is irradiated from above the convex body 13a in a direction perpendicular to the surface of the insulating substrate 11, and simultaneously moves in a direction parallel to the surface of the insulating substrate u, and is formed by using a microscope. The groove of the inclined surface 13b was evaluated on the following basis. The results are shown in Tables 2 to 4. [0154] 39 201247056 (Evaluation Criteria) Χ: There is one or more points at the complete disconnection. However, the width of the groove of the inclined surface 13b is less than 15 mm. 18μιη 〇·The line is not broken. The width of the groove of the inclined surface 13b is 15 μm or more, less than the following [0155] ◎•The line is not broken. The width of the 13b groove is above 18μπι, 2〇 tons---- Test number tilt angle (.) ------ 6 7 8 9 10 45 Focus deviation (mm) 0.35 -- Frequency (Hz) 30 40 50 60 70 Output (W) 0.3 — Processing speed (nun/sec) 150 _ Complex ---- 1 rating results ΓΠ1 Vi X Δ square ◎ ◎ [Table 3]

Test No.----____ Tilt angle (.) Focus deviation (_) Frequency (Hz) Round-off (W) 40 201247056 Processing speed (mm/sec) 120 130 140 150 160 Repeat number 1 Evaluation result ◎ ◎ 0 Δ X [[Table 4] Test No. 16 17 18 19 20 Tilt angle (.) 45 Focus deviation (mm) 0.35 Frequency (Hz) 60 Output (W) 0.25 0.3 0.35 0.4 0.5 Processing speed (mm/sec) 150 Repeating number 1 Evaluation result X Δ 〇 ◎ ◎ [0158] As shown by the results of Table 2, the higher the laser frequency, the more the position or direction of the laser irradiation device or the platform can be changed, and the laser is irradiated only in one direction. Thereby, the groove was formed favorably on the inclined surface 13b of the convex body 13a (test Nos. 7 to 10). In particular, when the frequency was 50 Hz or more, the result was excellent (test No. 8 to 1 〇), and the frequency was 60 Hz. The above results are more excellent (test No. 9, 1〇). [0159] As shown by the results of Table 3, the slower the laser processing speed, the more the position or direction of the laser irradiation device or the platform can be changed. , irradiating the laser only in one direction, thereby forming the body 13a The inclined surface 13b is well formed with a groove (test No. 1W4). Particularly, when the processing speed is 140 mm/sec or less, the result is quite excellent (test No. 11 13), and the processing accuracy is 130 mm/sec or less, and the result is more excellent (testing) No. 41 201247056 11 &gt; 12) 〇[0160] Device side:, high, the more you can change the laser irradiation poem 1 position or direction 'only the direction of the laser, so that the cam is well formed at 13b (Test No. 17~2〇). In particular, 4] 4W is quite excellent when it is used on the technique J (test No. 18~2〇), and the output is more excellent when it is above =;] (test No. 19, 2〇). The plural is shown in Figure 7, (4) is lmm '(b) is (10), and (8) is 6_,

The second singer, the slanting degree θ is 7G. The sample of the intermediate structure (resin film) was the same as Test Nos. 6 to 20, and the laser irradiation conditions indicated by UY-YAG iH:! were used to straddle the surface of the insulating substrate 11 from the convex shape. The inclined surface l3b is evenly spaced apart from the upper surface i3d of the convex body 13a. The laser is perpendicular to the upper surface of the convex body i3a and is parallel to the surface of the insulating substrate 11. The microscopic observation was made on the basis of the evaluation of the reference. The results are shown in Table 5. The results are shown in Table 5. [0162] [Table 5] Test No. 21 22 23 24 -----~ 25 Tilt angle (.) 70 ----- J ---— Focus deviation (mm) 0.35 ~ Frequency (Hz) ---—^ 60 Output (W) 0.3 Processing speed (mm/sec) 100 110 120 130 140 Repeat number — 1 Evaluation result ◎ ◎ 0 Δ X ----- 42 201247056 [0163] As is apparent from comparing the results of Table 3 with the results of Table 5, the inclination angle of the inclined surface 13b of the convex body i3a is increased, and the more The energy per unit time of the laser is increased (by making the laser processing slower), even if the tilt angle is increased from 45 to 70°, Grooves can be formed well on the inclined surface 13b of the convex body 13a (test Nos. 21 to 24). [0164] This application is filed on Nov. 5, 2010. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The above-described embodiments can be easily modified and/or modified by those skilled in the art. Therefore, those skilled in the art can change the scope of the claims or the modified forms as described in the claims. The change of position or the state of the new (four) shall be transferred to the scope of the right to be included in the claim. (Industrial use) [0166] The gas and electronic field caps are widely used in the technology of circuit formation. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1(G) is a cross-sectional view showing the steps of the wiring method according to the first and third embodiments of the present invention. Obtained, surface s A plan view of one example of a three-dimensional structure having wiring. 43 1 4 2 Fig. 4(A) to Fig. 4(D) are sectional views showing various structures of a convex body. 201247056 Fig. 5 is a view showing a convex body Fig. 6 is a cross-sectional view showing still another structure of the convex body. Fig. 7 is a cross-sectional view showing the specifications of each part of the convex body. [Description of main component symbols] a. .. length or width of the three-dimensional structure b. . . the length or width of the base of the convex body c. .. the convexity of the convex body L... laser (laser) Beam) m... focus deviates from X. .. laser irradiation device Y. . . laser focus position Z. . . angle 0 0... tilt angle 10 .. stereoscopic structures 10A, 10B... Intermediate structure 11. Insulation substrate (circuit board) 11a... Insulation substrate connection terminal 12: Semiconductor wafer 12a... Semiconductor wafer connection terminal 13. Insulation resin 13a...convex The body 13b...the inclined surface 13c of the convex body...the insulating resin layer 13d...the upper surface of the convex body 14.. resin film 15.. circuit pattern 16.. plating catalyst 17.. Wiring (electroless plating film) 18. Packaging resin 44 201247056 19... Circuit mounting component 20... Multi-layer circuit substrate (stacked wafer) 20a... Connection terminal 20b of circuit board. Rewiring) 45

Claims (1)

201247056 VII. Patent application scope: 1. A method for wiring the surface of a three-dimensional structure, comprising: a step of forming a convex body, which is decorated by an insulating resin in an insulating circuit diagram step by step from the outer surface side to perform laser protection The transfer of the money is compared to the position and depth of the groove and/or the hole, and the surface and the Ι Ι 步骤 step 'make the electric side medium or its precursor coated circuit pattern table moon 曰 film removal step' to remove the resin film; Catalyst ======= material (four) Wei Shiqing into the electric shovel. In the circuit_forming step, the lightning is irradiated in a vertical direction toward the surface of the insulating substrate: 2. an intermediate structure 'to obtain a three-dimensional structure having wiring on the surface, an insulating substrate; and a convex body' The surface of the substrate is formed by a grease; the shape has a surface relative to the insulating substrate 3. As in the second item of the patent application, the surface and the surface of the wire are more included in the convex body. The wiring method of the surface of the body structure includes: a step of forming an insulating resin layer, and a layer of a perishable layer containing the convex body; a substrate for forming a resin film by the resin, in the insulating tree _ Degree exceeds the thickness of the resin film, and is processed to form a deep circuit pattern; 7 爿 and / / wood grooves and / or holes, forming 46 201247056 plating catalyst coating steps, so that Resin film surface; or, scraper coating circuit pattern table resin film removing step 'Removal of resin 貘. Plating film forming step, forming an electroless dielectric or forming only a precursor thereof only at a residual portion of the thunder catalyst Electric record and the insulating tree Layer is formed of an inclined surface of the step ^ convex surface is tilted with respect to the insulating material forming step in the circuit pattern shot. The surface of the moon, and the edge of the base material is irradiated with lightning in the vertical direction: 5. The intermediate structure is used to obtain a three-dimensional structure with wiring on the surface, and the insulating substrate is wrapped; and the shape, the edge of the tree The layer 'containing a convex body formed of an insulating resin on the surface of the insulating substrate has a beveled surface with respect to the fine wire material 6 as in the fifth item of the patent application. The surface of the resin layer is designed with the purpose of the wire axis. , ^ ^ contained in the insulation = the middle structure of the second paragraph of the patent scope, the convex body is formed in the following manner: /, A is formed by the shape of the insulating tree is convex; and / or the edge resin will be installed An insulating member is coated with or without an electronic member inclined to the inclined surface of the surface of the material, and the intermediate structure of the shape f is relative to the range of the single-i7 derivative=1 The electronic component is a beveled surface, and the intermediate structure of the second item of the second page of the page 2 is in which the surface angle of the surface substrate of the inclined substrate of the convex body is 〇°, relative to the insulation ^ The viscous body 47 201247056 u. The three-dimensional structure in which the surface of the seed is provided with a wiring is obtained by the wiring method of the surface of the three-dimensional structure as in the application of Patent No. 1 or 4. 12. A method for wiring a surface of a three-dimensional structure, comprising: forming a body, and forming a body on the surface of the insulating body and the surface by a tree member. In the step of forming a resin on the surface of the convex body and the surface of the insulating substrate电; electric_case formation step 'by laser processing from the outer surface side, forming a thickness of the lining, showing the surface of the light surface or the hole, forming the surface and === (four), making Wei Lin or its surface pure «The road pattern table resin film removing step, removing the resin film; and the electric charge forming step formed by the plated coffee composition, forming a step opposite to the surface of the insulating substrate, the circuit pattern forming step, facing the surface of the insulating substrate: When the laser beam is irradiated toward the inclined surface of the convex body, the energy of the f-ejection between the 141 and the ff is increased as compared with the surface of the surface of the material. The wiring method of the surface of the stereostructure &amp; the insulating resin layer forming step, the insulating layer of the insulating layer containing the convex body; the rim base (4) surface hunting resin film formed by the resin _, in the insulating tree Circuit pattern forming step, #树月曰膜, degree exceeds the thickness of the tree, and the desired laser is applied to form a deep circuit pattern; J / wood and grooves and / or holes, forming a surface a resin film removing step of the catalyst or its precursor covering the circuit pattern, removing the resin ruthenium; and the plating film forming step 'forming only the electroless electricity in the residual portion of the total protective catalyst of the lightning protection or by the driving device thereof Forming the electric ore 48 201247056 and in the insulating resin layer forming step, the insulating tree t, 3 forming the convex body of the surface inclined surface has a step of forming the circuit pattern with respect to the insulating substrate, and is irradiated toward the surface of the insulating substrate When the laser is irradiated toward the inclined surface of the convex body, the laser is irradiated to the surface of the known and the lightning-emitting surface, and the wiring of the surface of the substrate (4) is insulated every unit time. The resin is formed into a convex shape And / or method: the application of the body wafer, and / or chip inductors or capacitors, etc., the multiplicity of the side of the circuit - the method, the I2 slave belly lining wire, the wiring frequency of the laser, so that each unit of time The energy of the laser is big. In the law, in the middle of the scorpion, the amount of the matching line on the surface of the three-dimensional structure is increased; ^ the speed of the axis of the laser, so that the energy per unit time _ laser, ϊί 12 reading miscellaneous silk The wiring is large, and the towel is used by the &amp; to the laser, so that the energy of the laser per unit time is increased by the method of the patented Fancai 12 on the surface of the three-dimensional structure. It is difficult to form a wiring convex shape on the surface of the three-dimensional structure, and the focus position of the laser is set between the position where the base of the convex body is moved and the position close to the upper surface. 2i. A three-dimensional structure having a wiring provided on the surface, which is obtained by the wiring method of the surface of the three-dimensional structure according to the items 12 to 20. , 49