TW201246431A - Substrate carrier - Google Patents

Abstract

The invention relates to a substrate carrier for transporting and for mounting substrates during coating in plasma chambers. The substrate carrier consists of a material that is dimensionally stable up to 800 DEG C, and has longitudinal struts and transverse struts which surround a plurality of openings into which substrates are inserted and held along the edges of the longitudinal and transverse struts. The substrates are supported on the underside at the edges such that a plasma wraparound is reduced. The undersides and/or the top sides of one or more of the transverse struts have a shaping that supports a gas and plasma flow transversely with respect to the transport direction of the substrate.

Description

201246431 VI. Description of the Invention: [Technical Field] The present invention relates to a configuration of a cross struts of a substrate carrier, which is configured to guide plasma and gas over the surface of the wafer by means of corresponding styling Particularly good ability. Terminology: Substrate The carrier and the crystal body, the substrate and the wafer are used in the following to make a soil. [Prior Art] The substrate carrier is especially used in semiconductor production and solar electric oil production. The substrate is used to hold the Crystal® or substrate during the crystallization process and processing. The process especially refers to the cladding process and 侃Ijjl# that the wafer is often subjected to at higher temperatures and pressures (deviation from atmospheric pressure). Since the silk plate carrier also holds the substrate while being finely treated, the substrate carrier is also subjected to these processing conditions. The process is either for one side of the planar wafer or for both sides. Therefore, it is necessary to design the holding scheme of the wafer in the substrate carrier so that the county board carrier covers as little surface area as possible. In addition, the processing read of the wafer side should affect the second as little as possible. Wafer side. This is especially problematic in the (iv) daughter process, which is due to the scaly ion volume recording the granule-edge flow, and also to the back Φ partially-lifting layer. This phenomenon is called "Umgreifen" and is not desirable in most cases. Another goal is to have the process applied as evenly as possible across the entire wafer, and on the substrate + circle. , 201264231 The substrate carrier contemplated herein has a planar, frame-like configuration in which the wafer is held in the thumb opening. The opening of the peach is preferably rectangular, however, the opening σ of the grid may also be rhombic, circular, elliptical or rectangular or square with chamfered or rounded corners. Here, the shape of the grid opening corresponds to the wafer to be conveyed in a miscellaneous t dimension. The wafer is held in the grid opening by a soil-wound edge, a small hook, a pin or the like, and the wafer is placed flat on these structures. A corresponding configuration is described, for example, in 2020 2(8)9 〇Qi 817', in which a grid-like configuration has a widened cover for improved stability as an outer frame. The wafer carrier is made of a material that is stable up to 800 C, preferably made of metal (should, steel, tantalum, titanium), or made of ceramic or carbon fiber reinforced carbon (CFc_Carb (10). By forming a substrate carrier, etc. :; = surface 'so it should be obtained undisturbed on the surface. In US 2005/0061665 A1, the following = and the 2 circular carrier also provides the position for multiple wafers. The wafer carries _ /, the basic frame And one or two auxiliary frames. The Weishen ST is carried out in the opening of the basic frame by means of the auxiliary frame; and the pressing of the wafer against the basic frame (four) is good. The carrier should be especially suitable for the secret Weigong#. This = made of electrically conductive material, and the auxiliary frame and clip are == connected, making the electro-mineral process feasible. However, the frame is not suitable for the secret plasma, because it is not 4 201246431, flat conduction Table © will make the (10) sub-body split unevenly. In the plasma for wafers according to the prior art, 'with a plate-like regular strip (four) speed 敬 ς processing equipment' and with the shouting plasma Body plus r. Here, ^ ion body The upper and/or lower material is fed onto the wafer, and the excess plasma or the Rim read direction is sucked away. Thus, a complex __ daughter flow appears above the surface of the lion. The task is to have a positive effect on the plasma flow over the surface of the base body. According to the invention, this task is achieved by the construction of the substrate carrier according to the claim 。. The financial formula is shown in the related dependent claims. The substrate carrier according to the invention for transporting and holding the substrate during coating in a plasma chamber is made of a material up to 80 (rc is still dimensionally stable and has The longitudinal strut and the cross strut. The longitudinal strut and the transverse strut are arranged in a grid-like manner in a plurality of openings into which the substrate is placed and held along the edges of the longitudinal strut and the cross strut. In particular, the substrate is so arranged on its underside at the edge that the plasma entrapment is reduced as much as possible. The bottom side and/or the upper side of the cross-struts of the substrate carrier have the following shape, which supports lateral Gas in the direction of transport of the substrate Flow and plasma flow. Here, the longitudinal struts and cross struts at the edges of the substrate carrier are wider than the longitudinal and transverse slabs that are not at the edges of the substrate carrier. The substrate carrier is substantially vertical ( The transverse selection of the substrate carrier in the transport direction 201246431 is referred to as the width of the strip oriented parallel to the transport direction. The longitudinal strip is generally the body flow is subjected to the strip flow and the gas is thus different from the vertical strip. Type == 明'(四)条i II, particularly preferably at least the length of the transverse bar; the extension / ° extends upwards. The groove and / or the splicing portion in its distribution direction: the division ^ upper 姊 bottom side support = at least one groove on the side = yellow: =, the groove and the changeover are exchanged between the other preferred embodiments; only the upper side; a further preferred embodiment is not = the upper side of the struts The transverse struts which have at least one arch-on-substrate carrier on the bottom side can advantageously be designed differently such that, for example, some of the cross struts have recesses on the upper side and have on the bottom side The bulge 'and the other cross struts have curved portions on both sides. Corresponding variants are preferred. By the configuration according to the invention of the slap strip, the gas ship and the like on the surface of the substrate are affected. Achieved 201246431 = easy to reach in the lateral direction transverse to two: = The substrate carrier according to the invention is preferably made of a material that is still dimensionally stable. The big “shi” is what it is. Here, it is particularly suitable for steel, aluminum, titanium, _ or carbon fiber reinforced carbon (CFC). The parts can be made from unexpected materials.

In a preferred embodiment, the substrate carrier is made of CFc. The substrate carrier is manufactured by a lamination method in which different prepreg layers are placed one on top of the other, and then the stone is annealed by heat. Advantageously, the prepregs that are placed one on top of the other have been configured such that the cross struts achieve the desired shape. This can preferably be done by placing one or more inner cores between the prepreg layers. Preferably, the shaped milling (formf side en) CFC or graphite is used as the inner core material. However, the inner core material does not have to be the same as the material of the semi-cured sheet. It is important that the inner core is up to 8 inches. ^The material is still shaped to be stable' preferably from up to 800. (: is still made of a shape-stable broken fiber. Another preferred manufacturing method is designed such that the prepreg is placed in a mold having a bulge in the mold, so that the prepreg has a groove after carbonization. Another preference The embodiment is provided with a substrate carrier that is shaped and milled from a piece of CFC. Other methods for fabricating a substrate carrier are known from the prior art. In a preferred embodiment, one inner core constitutes a plurality of bends 201246431 arches. The meanders on the upper and bottom sides of the cross struts can be constructed, for example, by an inner core having a circular or sinuous cross-section inside the cross-waist. The holding of the substrate in the substrate carrier is known The method is carried out. Preferably, the substrate is held on the edge of the job at the _ strip and the yoke. This also advantageously mitigates plasma entrapment. (iv) leaving an untreated area at the edge of the substrate Therefore, another preferred embodiment of the holding is provided such that hooks are arranged on the longitudinal struts and (four) strips which support the substrate approximately in a point shape on the bottom side of the substrate. An untreated area on the side. Another solution utilizes pins in the longitudinal struts and cross struts to support the substrate. Furthermore, the longitudinal struts and cross struts are configured such that they avoid sharp angles Or a right-angled edge. Advantageously, the longitudinal struts and the transverse struts are chamfered such that the edges are inclined up to the surface of the substrate without abrupt changes in height. To minimize plasma entrapment, The ring-shaped slit between the longitudinal struts and the cross struts and the backsheet, which is required for automation (loading and unloading of the substrate carrier), is advantageously configured to be as narrow as possible. [Embodiment] FIG. Schematic diagram of a substrate carrier 1 according to the invention. The opening 2 for accommodating the wafer is surrounded by a longitudinal strut 3 and a cross strut 4. In the opening 2, the wafer is supported by a pin 21. On the substrate carrier The longitudinal struts 31 and the transverse struts 41 at the edges are more widely implemented than those of the longitudinal struts and cross struts 3, 4 which are inside the face of the substrate carrier 。. It is shown that two 201246431 42 i substrate carriers are cut: Laibu 仏. The rotating party (four) explains the war 4 how to walk through the processing area _. 2 shows that the middle substrate 4 has (four) a substrate carrier according to the invention which extends over the transverse support. The recessed V disk has a rounded recess in the entire length of the transverse strip 4 of the transverse strip 4. 3 shows the (four) timing mode of the cross strut 4. Fig. 44 constitutes the strip 4 of the ^. The curved 42 passes through the inside of the inner core 22:::_4, and the edge of the wafer 5 is traversed 4 It has two edge ridges for supporting the tread edge T to the wrap door f. The ribs are ionic, and the influence of the slanting material on the octagonal Libu brilliance is affected. The solution has two flat cores 4: 槿: the starting portion 42, the bulging portion 42 passes through two separate inners: +. Figure 5 does not show an embodiment in which the cross-section is rounded by two = cores 44 The four wings of the (four) coffee. : 44 has a circular cross section here. According to the embodiment of Fig. 6, there is a bulging portion 42 with two parallel triangular grooved poles distributed on the bottom side. Figure 7 shows a traverse strip 4 having a bulge 42 on the bottom side 3. The swollen portion on the bottom side is formed by passing the bend _ 44. According to the embodiment of Fig. 8, a transverse strip 4 of one bend = 42 is provided on the upper and bottom sides of the transverse strip 4. Here, the bent portion is formed by two core cores. 201246431 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows a schematic diagram of a substrate carrier 1 according to the present invention. Figure 2 shows a substrate carrier according to the invention. Figures 3 to 8 show different embodiments of the cross struts 4. [Description of main component symbols] 1 Wafer carrier (substrate carrier) 2 Opening 21 for accommodating a wafer (substrate) Pin 22 for supporting a wafer Wraparound edge for supporting a wafer 3 Vertical struts 31 Longitudinal strut 4 at the edge of the substrate carrier. Cross strut 41 at the edge of the substrate carrier. The cross braces 42 on the cross brace without the interruptions on the cross brace. The curved portion 43 of the interruption portion has a groove 43 in the cross struts, a groove 43b having a rounded cross section in the cross struts, and a groove 44 having a triangular cross section in the cross struts. 5 wafer

B substrate carrier transport direction

Claims (1)

201246431 VII. The scope of the patent application scope is based on (4) sub-foaming to carry out the coating and holding of the substrate, wherein the substrate carrier is still stable in shape until _〇c and has a plurality of openings. The longitudinal strut and the cross strut, the substrate is extracted by the turtle and along the edges of the longitudinal strut and the (four) strip: the crucible is characterized in that the substrate is on the bottom side at the edge The bottom side and/or the upper side of one of the two strips has a shape that supports gas flow and plasma flow transverse to the transport direction of the substrate. . 2. The substrate according to claim 2, characterized in that the substrate is disposed directly at the edge of the substrate and parallel to the (four) strips disposed between the Wei and the (four) strips. The struts and cross struts are wider. 3 Yugen ^ please patent scope 丨 or 2 esaki's substrate NZ, which is special to seven, not directly on the silk slab _ edge of the horizontal miscellaneous on the upper / / bottom side has at least - generous The groove which is the longest stretched to be distributed, 仏 according to the feature of the substrate described in item i or 2 of the full-time, in the non-direct surface of the substrate, the inclined strip disposed on the upper side and the bottom side has at least - A piece of chess that is distributed along the longest length of the cross-section, please delete 3 and 4 as described - the substrate carrier, which is not directly in the county __ Wei Mi (4) cross struts > some in Yokohama The upper side has a material portion and the 201246431 on the bottom side of the money stay has a groove, or conversely, the bottom side has a raised portion which is distributed. Having a groove on the upper side of the cross struts and extending the longest stretch along the cross struts in the yoke and the bulging portion, characterized in that the substrate is described in item 6, characterized in that The material is made of a material that is stable in shape, preferably from a carbon fiber. According to the seventh aspect of the present invention, the material of the inner core until the shape is stable is forming milling. of. The substrate carrier' according to any one of the preceding claims, wherein the substrate is supported in a manner that wraps around all edges and mitigates the plasma entrapment. 10. The substrate carrier according to any of the preceding claims, wherein the wire plate is supported on the wire by means of age/or hook, and the plasma is surrounded by the substrate The spacing between the longitudinal strut or the cross strut is minimized and mitigated. 12