TW201245373A - Adhesive and adhering material using the same, using method thereof and use of condensation resin - Google Patents

Abstract

An adhesive includes a condensed resin with structure units obtained by polycondensing polymerizable monomers including a monomer (A) with at least two carboxyl groups and a monomer (B) with at least two amino groups, and the adhesive satisfies (3) and at least one of (1) and (2) in the following: (1) at least one selected from the group consisting of the monomer (A), an acid anhydride of the monomer (A) and the monomer (B) is liquid at 25 DEG C; (2) the condensed resin has polyoxyalkanediyl groups; (3) the condensed resin has cyclohexane rings.

Description

201245373 VI. Description of the Invention: [Technical Field] The present invention relates to an adhesive which maintains adhesion in a high-temperature environment, an adhesive material using the same, and a method of using the same. [Prior Art] Previously, an acrylic adhesive was often used as an adhesive. Further, as a heat-resistant adhesive, for example, (10) a coating agent is described. "'''''''''''''''''''''''''''''' 2〇0°C or more) The adhesiveness cannot be maintained, and floating or peeling occurs. The outer layer of the (f) adhesive has the following problems: it is expensive, and it is attached with a sputum (for example, a plastic material such as a poly-S film or a polyimide film) [Inventive content] The purpose of maintaining the purpose is to provide a kind of The adhesive agent which can be used in a high-temperature environment and the method of using the same. The method of the present invention provides a two-part (10) material and a user thereof. The known structural unit, the above polymerizable property The adhesive containing 2:: is related to the following adhesives, the adhesive will be red: the condensed system of the second county 具有 has "the condensed monomer of the merging monomer comprises a single having at least 2 several 4, 201245373 / pif base And (3) at least one of the following (1) and (2) and the following (3). ^1) is selected from the above single At least one of the group consisting of the acid anhydride of the body (a), the monomer (A) and the monomer (B) is liquid at 25 ° C. (2) The condensed resin has a polyoxyalkylene diyl group. (3) The condensed resin has a cyclohexane ring. According to the above-mentioned adhesive, in the high-temperature environment (for example, 200 (above:)), the high-adhesion property is maintained, and the occurrence of floating or peeling can be sufficiently suppressed. Further, the above-mentioned adhesive exhibits high adhesion to the adherend of a plastic material or the like. Further, the adhesive further maintains high adhesion after being peeled off from the adherend, so that adhesion and peeling of the adherend can be repeated. The adhesive preferably satisfies the above two (1) and (7) adhesions. In addition, such an adhesive such as J is easily attached to the adherend by pressing at 0C to 5 (rc). The above adhesive, preferably the condensed resin is selected from the group i = tree; Osmium imine resin and polyamide resin

Preferably, the upper hybrid resin is a polyacrylic acid resin, and the condensed resin t70 has the above-mentioned polyoxygenated second base. That is, it is preferred that the (2) t hydrooxane-based group is contained in the above structural unit. In the above-mentioned structural unit, the structure derived from the early precursor (B) has the above polyoxyalkylene dibasic group. #, Preferably, the polyoxygen ship diyl group in the above (2) is contained in the structure of the above monomer (B). In the above adhesive, it is preferred that the polymerizable monomer is in an amount of 2 5 m〇i% to i〇m〇i%, relative to the total amount of the above single and upper = monomer (B), and has a monomer. (6)), the monomer (5)) has a ketone group and at least 2 amine groups. In other respects, there is an adhesive for polyurethane, a polyimine resin, and a condensation resin in an imine tree, and the above condensation resin has a cyclohexane ring and a polycondensation. Oxyalkylene diyl. In the alkane ring: earth, the above-mentioned condensed resin may further contain a diamine unit having a cyclohexazone = and a polyoxymethane. In the fragrant product 3::, the condensed resin may further have a divalent aromatic scent 1 ' or a dichroic unit having a divalent material. 1 right = the hybrid shot of the present invention, the above condensed pure fat may also be more 1,4 - scalydiyl, or may contain a diamine having a fluorene oxime group: 3 viscous:: medium' is preferably the above The content of the condensed resin is 50%. The adhesive may be an adhesive containing the above condensation system. This adhesive is used as: a heat-resistant adhesive. _ is more excellent, so it is more suitable for the above adhesive, for example, as a heat-resistant adhesive, and the heat-sensitive adhesive 6 201245373 423S7pif is attached to the adherend and heated to 2 〇 (rc and above from the adherend) Peeling, that is, the above-mentioned adhesive can also be suitably used in a process having a step of exposing to a temperature higher than 2 〇〇. #. Another aspect of the present invention relates to the following condensed resin as an adhesive. The condensed resin has a structural unit for condensation polymerization of a polymerizable monomer, and the polymerizable monomer includes a monomer (A) having at least two carboxyl groups and a monomer having at least two amine groups (B). And the at least one of the following (!) and (2) and the following (3): j 1) is selected from the group consisting of the above-mentioned monomer (Α), the above-mentioned monomer (Α) acid anhydride, and At least one of the groups consisting of the above monomers (Β) is in the form of 25 < 3 (: liquid). (2) The condensed oxime resin has a polyoxymethane base. (3) The condensed resin has a ring Hexane ring. Another aspect of the invention is related to the following condensed resin In the use of the adhesive, the condensed resin has a polymerization unit and a structural unit, and the polymerizable monomer includes a monomer (A) having a slow group and a single condensed resin having at least two amine groups, which satisfies the following At least one of (1) and (7) and (3) below. At least one selected from the group consisting of the above monomer (A), the acid needle of the above monomer (4), and the above-mentioned precursor (B) is liquid at 25 °C. (2) The condensed resin has a polyoxyalkylene diyl group. (3) The condensed resin has a cyclohexane ring. 201245373 Another aspect of the present invention relates to the use of an condensed resin selected from the group consisting of a polyamide resin, a polyamide amide resin, and a polyimide resin. In the group, it has a cyclohexane ring and a polyoxyalkylene diyl group. Another aspect of the invention relates to the use of a condensed resin for the manufacture of an adhesive, the hybrid resin being selected from the group consisting of a polyamine resin, a polyamide resin, and a polyimide resin. In the group, it has a cyclohexane ring and a polyoxyalkylene diyl group. Further, the present invention provides an adhesive comprising a support and an adhesive layer containing the adhesive disposed on the support. In addition, the present invention provides a method of using an adhesive comprising the steps of: attaching, attaching a second object to the first adherend via an adhesive layer containing the adhesive; heating step = layer The temperature _ means C« on the condition, the feeding and the first broken adhesive body are heated; and the peeling step, from the t-heating step _ above the first - 鄕 _ on the secret layer and the above-mentioned brother - is adhered body. Preferably, in the method of using the above-mentioned dispensing agent, the attaching step: the body-attached body and the second viscous body α 丨 α 上述 上述 上述 ^ ^ ^ ^ ^ ^ ^ ^ In the method of using the agent from the above-mentioned first-adhered body, the method of using the agent is preferably in the method of using the adhesive in the peeling step and the second adherend. The above-mentioned adhesive layer from the peeling step 8 201245373 仏)/pif is reused in the above-mentioned attaching step. In addition, the present invention provides a method of using an adhesive, comprising the steps of: attaching the adhesive to the adherend, wherein the adhesive layer is disposed on a side close to the adhered body; The adhesive body is heated under the condition that the temperature of the adhesive material reaches 20 CTC or more; and the peeling step, the adhesive material is peeled off from the adherend which has passed through the heating step. Preferably, in the method of using the adhesive, the adhesive is applied to the adherend at 0C to 5G/C. In the method of using the above-mentioned adhesive material, it is preferred to carry out the above-mentioned peeling, and it is 〇C~5. . . The adhesive material is peeled off from the above-mentioned adherend. The above-mentioned adhesive material peeled off in the above-mentioned step can be reused in the above-mentioned attaching step. [Effect of the Invention] According to the present invention, it is possible to provide a novelty which is also achievable in a high temperature environment. Adhesives and methods of use thereof. In addition, the roots of the private-supplied-used--adhesive materials and their methods of making money. X' can be [implemented] with the appropriate implementation of the adhesive and adhesive of the present invention Form (Adhesive) The adhesive of the present embodiment contains a condensed resin, and the structural unit obtained by condensation polymerization of the monomer contains the monomer (4) having at least two counties and having an amine of at least 9 201245373 I Ui. The monomer (B) of the present embodiment satisfies at least one of the following (1) and (2) and the following (3). (1) The monomer (A) and the monomer are selected. At least one of the group consisting of the acid anhydride of (A) and the monomer (B) is at 25. (The liquid is in the lower form. (2) The condensed resin has a polyoxyalkylene diyl group. (3) The above condensed oxime resin Having a cyclohexane ring. According to such an adhesive, even if it is maintained at, for example, 2 〇〇 ° C or more In the high-temperature environment, the high adhesion is maintained, and the occurrence of floating or peeling can be sufficiently suppressed. Further, the condensed resin is not necessarily required to be obtained by condensation polymerization of the polymerizable monomer, as long as it has the above-mentioned polymerizable single The structural unit formed by polymerization may be used. It is not necessary to test the condensed resin in the above two sentences. (IV) Monomer (a liquid material in the bottom of the crypts) - as long as the above condensation ♦, the resin has the following The structural unit may be formed by a monomer which is liquid-containing under the pit (or the acid needle is poured into the liquid (4)) and is formed by the fusion reaction. (4) The above structural unit in the shrinkage/τίΓ resin may be - The structure of the monomer =it _ combined with the single core of the monomer (4) monomer (4), at least - the liquid is 25t at 25t, and the formed group can form the above The monomer (4) and the monomer (8) of the structural unit can be confirmed by the method of 2〇l245Si=. That is, the compound having at least 2 brittle groups and the 5 substances having the hydrazine hydrolysis can be used as the monomer respectively. (4) and monomer (B). > 2 amine groups (Α Γ) such as ^ (M) The table of the peach is referred to as a monomer condensation machine represented by the following formula polymerization monomer and the following formula (8). The weight of the component I is earlier. Further, in the formula, R1 and r2 Indicates that the divalent has [Chemical 1]

If

Ri

(1-1) [Chemical 2]

Ii〇2c-Rl-C〇2H (Al ) [Chemical Formula 3] H2N-R2-NH2 (Bl) Here, the structural unit represented by the formula Q]) satisfies the monomer represented by = 上述 in the above monomer and The structure represented by the formula (Β·υ is liquid at 25 c. Further, for example, the structural unit represented by the following ^( U) can be referred to as a single one represented by the following formula (A-2) of 201245373 And a structural unit obtained by condensation polymerization of a monomer represented by the above formula (Β-l). Further, in the formula, R3 represents a trivalent organic group. [Chemical 4] 0 Η

-r3 N-r2-nY Ο (1-2) [Chemical 5] ΗΟ- Ο Ο i-〇ΗV0H Ο (Α-2) Here, in order for the structural unit represented by the formula (1-2) to satisfy the above ( 1), as long as at least one selected from the group consisting of a monomer represented by the formula (Α-2), a monomer represented by the formula (Β-1), and a group consisting of an acid anhydride represented by the following formula (Α-2〇) One can be liquid at 25 ° C. [Chemistry 6] Ο HO-J-

(A-2·) 12 201245373 4ZJ5/pif Further, for example, the structural unit represented by the following formula (1-3) can be referred to as a monomer represented by the following formula (A-3) and the above formula (B- 1) A structural unit obtained by condensation polymerization of a monomer represented. Further, in the formula, R4 represents a tetravalent organic group. [化η

Here, in order to satisfy the above (1) of the structural unit represented by the formula (1-3), it is selected from the monomer represented by the formula (Α-3), the monomer represented by the formula (Β-1), and the lower side. At least one of the groups consisting of the acid anhydride represented by the above formula (Α-3') may be liquid at 25 °C. [Chem. 9] 13 201245373

(A-3') The monomer (A) includes a monomer having two carboxyl groups (a monomer represented by the formula (A-i)) and a monomer having three carboxyl groups (a monomer represented by the formula (a_2)) A monomer having four slow groups (a monomer represented by the formula (a-3)) and the like. Examples of the monomer having two carboxyl groups include oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, sebacic acid, sebacic acid, and 1,9-decane. Alkanedicarboxylic acid such as dicarboxylic acid, dodecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, octadecanedioic acid; phthalic acid, terephthalic acid, isophthalic acid , 1,4-naphthalene dicarboxylic acid, 1> 5-naphthalenedicarboxylic acid, 26 naphthalene dicarboxylic acid, indole-5,6-dicarboxylic acid, pyridine-2,3-dicarboxylic acid, pyridine-2, 6_dicarboxylic acid, 1H-imidazole-4,5-dicarboxylic acid, 1H·pyrrole 2,4-dicarboxylic acid, furan-2,5-dicarboxylic acid, thiophene-2,5-dicarboxylic acid, etc. Aromatic dicarboxylic acid, hydrazine, cyclohexanedicarboxylic acid, LA·cyclohexanedicarboxylic acid, 4-mercaptohexahydrophthalic acid, 3-methylhexahydrophthalic acid, 3-B a dicarboxylic acid having a cyclohexane skeleton such as hexahydrophthalic acid, 4-ethylhexahydrophthalic acid or fluorenylnorbornane-2,3-dicarboxylic acid; 3_mercapto-1 , 2,3,6-tetrahydrophthalic acid, 4-methyl", ^, tetrahydrophthalic acid, methyl-3,6-endinohydrinyl hydrogen phthalic acid, etc. a dilute skeleton of dicarboxylic acid, etc. The Ri in the formula (1-1) includes an alkanediyl group, a divalent alicyclic group, a divalent aromatic ring group, etc., and the earth 201245373 42357pif alkanediyl group is preferably a helmet of the nitrate, and the number is i~2. The hydrocarbon hydrocarbon number of J_~3: is preferably carbon-like, and is preferably a straight-chain t-dione group which may be a straight bond or a branch A. Examples of the carcass include: Methyl, Ethyl Ethyl, Propylene Ethylene, Bismuth i: Octaldiyl, hexanediyl, heptanediyl, octanedi=丄10-(tetra), dodecanediyl, ten-ring The carbon number of the fine saturated or unsaturated carbon day long group is preferably from 3 to 20, more preferably from 4 to 12. Further, the 'divalent alicyclic group preferably has a cyclohexane ring. 5 ^二丝环己烧烧],2·二基,降冰二基媒4侧-1,2-cyclohexan-1,2-diyl, etc., a group, 4_methyl-3,6 - The internal fluorenyl-4- number is ==3⁄4. Preferably, the carbon divalent aromatic ring group is substituted with a aryl group: 〜5. The aromatic ring group is preferably a carbon number-based ring structure. The divalent alicyclic group having a divalent number of 6 to 10, and the valence #香环基' is more preferably a carbon divalent aromatic ring group such as a fluorenyl group 1-5, 6- Base, bite _2 3 bis 'di-diyl, naphthalene diyl, biphenyl di C diyl, m "ratio w · ' two: storm, ° ratio, 6-diyl, 1H" rice bran, Furan-2,5-diyl, thiophene-2,5-15 201245373 dibasic. Further, the benzenediyl group may be a benzenediyl group or a 13 phenyldiylfluorenyl group. Further, examples of the naphthalene diyl group include a naphthalene diyl 1,3-naphthalene diyl group, a 14-na na, a naphthalene diyl group, a 17 naphthalene diyl group, and an 18 naphthalene diyl group, and examples thereof include biphenyl-4,4,- Second base. , #—基专. Further, a monomer having a biphenyl group having three carboxyl groups, for example, may be listed as a tribasic acid or a cyclic aromatic ring. The R3 in the formula (10) may be a trivalent alicyclic group or a trivalent aromatic triyl (3) alicyclic group. Jiawei is a better one for the ring hexagram ^ Like three ^ Xiang ring fine lung benzene triyl, naphthalene triyl preferably benzene with 4 lining monomers such as _ -1,2,3,4_ four Acid, 1 2 S # ,, | u夂丰1,2,4,5·naphthalene tetrawei, = ί ' 2'3'6'7•naphthoic acid, -iA95i〇.ra^Si > ' » Acid, 2,2,,3,3,-biphenyltetrazoic acid, 2 3 22 bis (biphenyl ton +. _ ', phenylene carboxylic acid, 3 3, 4 4 · benzophenone 4 Acid, 2,3,2,,3,·2: grade 夂W,4· 曱_tetracarboxylic acid, 3,3',4,4,-biphenyl fluorene tetracarboxy fluorene tetrahydrobenzene shout, double (3 , bis-benzene _, ', ^, bis-p-phenylene) bismuth di-diphenyl) 曱 、, double four test, ^f34 4 4 4'-carboxyl base) ethane, 2,2- bis ( , Benji Ma, 2, 2, 3:: phenyl phenyl) propane, 201245373 4,4H4, f-isopropylidene diphenoxy;) bis (o-phthalic acid), benzene Bis (trimellitic phthalate), bis(3,4-dicarboxyphenyl)dimethyl decane, double (3 , 4_ dicarboxyphenyl)methylphenylnonane, bis(3,4-dicarboxyphenyl)diphenyl anthracene, 1,3_bis(3,4-disulfophenyl)-1,1 , 3,3_tetradecyl oxalate, i,4_bis(3,4-dicarboxyphenyldimethylmethyl)benzene, 2,2-bis(3,4-dicarboxyphenyl) Hexafluoropropane, 2,2-bis(4-(3,4-dicarboxyphenoxy)phenyl)hexafluoropropane, 4,4'-bis(3,4-dicarboxyphenoxy)diphenyl sulfide Ether, 2,3,5,6-pyridinetetracarboxylic acid, pyrrolidine-2,3,4,5-tetracarboxylic acid, pyrazine-2,3,5,6-tetracarboxylic acid, thiophene-2,3 ,4,5-tetracarboxylic acid, tetrahydrofuran-2,3,4,5-tetracarboxylic acid, ethyltetracarboxylic acid, 1,2,3,4-butadiene, u,2,2•B Burning four linings, ^ doing C-burning four rebel acid, U, 6, 6_ already burning four training, u, 4, 5_ ring hexane burning four enemy acid, = burning four new, like heart ring diced burning ^ ten hydrogen Naphthalene ^ from four 8 · one 曱 base cut, 5, 6, 7 • hexahydro naphthalene > reading acid, cyclopentane _1, 2, 3, 4 _ ^, 丨 + + 环丁院-7- Alkene-2,3,5,6·four«, double (external material "" two ^ 〖called octanoic acid, double ring [2·2·2] 辛烧·2,3,5,6·四缓[2.2·η Wei Ji Ershi Oxygen (tetra)-diyl) bis (bicyclic aromatic compound or conversion: = 10 'more Preferably, it is 2 to 6. The carbon number of the alkane tetra, propane·1,1,2,3_tetrayl, butanexanyl group is higher than that of the Weiliang 9 group, for example, ethidium, 1, 2, 2: 4^17 201245373 -1,2,3,4-tetrayl, hexyl-1,1,6,6-tetrayl, ethylidene. The tetravalent alicyclic group is preferably a group having a carbon number of 4 to 50, more preferably a group having a carbon number of 6 to 30. Further, the tetravalent alicyclic group preferably has a cyclohexane ring. Examples of the tetravalent alicyclic group include a group in which four hydrogen atoms are removed from the following compounds: cyclohexane, cyclopentane, cyclobutane, bicyclohexane, decahydronaphthalene, bicyclo [2, 2, 2] Octane, bicyclo[2,2,1]heptane, dimercaptohexahydronaphthalene, bicyclo[2,2,2]oct-7-ene, 5,5,-(1,1,3,3,5 , 5-hexamethylenetrioxane-1,5-diyl)bis(bicyclo[2.2.1]heptane) or bis(bicyclo[2,21]heptane)sulfone. Examples of the tetravalent aromatic ring group include a group in which four hydrogen atoms are removed from the following compounds: benzene, naphthalene, biphenyl, dibenzophenone, biphenyl, dipyridyl, trifluorononylbenzene , diphenyl oxime, diphenyl, ethene, 2'2-diphenylpropane, 2,2-bis(4-phenoxyphenyl)propane, bis-formic acid benzene, diphenyldifluorene Kewei, Tris-methyl-Wei, Tetraphenyl-J-alkylphenyl sulfonium 3,3-tetradecyl-dioxaxophone, bis(diphenyldiphenyl, 2,2-diphenylhexafluoropropane, 2, 2_ bis (4_ phenoxy phenoxy), fluoropropane or diphenyl sulfide. The base may, for example, be freely determined, scale, ° phenophene, ° ratio slightly bite or tetra; remove 4 hydrogen atoms from the oxime The base of the product. Formic acid needle, 3-ethyl odor dicarboxylic acid needle, 4-methyl hexahydro phthalate, "Ergent dimethyl hexahydrate, 4 - ethyl hexahydrophthalic acid 丄〆 ,: tetrahydrophthalic tetrahydrophthalic acid _ Ζ 4Τ^, 2,3,6- formic acid needle, 5,5,-external H-indolyl-1,2,3,6-tetrahydroortylene Bis(2,3,3,5,5-hexamethylene trioxosulfonate) II 201245373 42J5/pif (bicyclo[2.2.1]glybdeno-exo-2,3-diacid) dianhydride Etc. Here's the above formula (Μ) order The Ri is, for example, 4-alkylcyclohexane-1,2-diyl, 3-alkylcyclohexanone-1,2-diyl, 3-carboyl-4-cyclohexan-1,2-di Base, 4-alkyl-4-cycloheximide, i.sub.2,diyl, 4-mercapto-3,6-endomethyl-4-cyclohexene-1,2-diyl (preferably 4- 4-ylcyclohexanone_ι,2-diyl, 3-methylcyclohexan-1,2-diyl, 3-mercapto-4-cyclohexene-1,2-diyl, 4 -methyl-4-cyclohexene-1,2-diyl, 4-mercapto-3,6-endomethyl-4-cyclohexene-1,2-diyl), in the present embodiment The adhesive satisfies the above (丨). Further, R4 in the above formula (1-3) is, for example, 5,5,-exo-(1,1,3,3,5,5-hexamethyl-sanistite_ When the 1,5-diyl) bis(bicyclo[2 2 heptyl-exo-2 3 -diyl] group, the adhesive of the present embodiment satisfies the above-mentioned other monomer (B) preferably has two amine groups. Monomer, such a monomer, for example, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenyloxy)phenyl] Sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, bis[4_(4-amino) Phenoxy)phenyl]methane, 4,4,-bis(4-aminobenzene Biphenyl, bis[4_(4-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]-, hydrazine} bis(4-aminophenoxy) Benzene, 1,4-bis(4-aminophenoxy)benzene, 2,2,-dimethylbiphenyl-4,4'-diamine, 2,2,_bis(trifluoromethyl) Biphenyl _4,4,-diamine, 2,6,2,6,tetramenebiphenyl-4,4,-diamine, 5,5,_dimethyl-2,2,_sulfonate Mercapto-biphenyl '_4,4,-diamine bis(4,4'-diamino)diphenyl ether, (4,4,diamino)diphenylsulfone, monoamino)diphenyl Anthrone, (3,3'-diamino)benzophenone, (44, diamine), (4,4·diamino) diphenyl scale, (3,3,·2) Conversion of aromatic diamine; ethylenediamine, propylenediamine and other amines, polyepoxyethylene 201245373 - monoamine, polyoxypropylene, a private polyoxygenated diamine '1,3-cyclohexene Diamine, 1,4- privately burned January female, (4,4 - January female base) * a zh zh 己 曱 曱 、, isophor g diamine, 1,4-diaminopropyl pipe Aliphatic diamines such as [3,4-bis(1-aminoheptyl)-6-hexyl ice (1-octenyl)]cyclohexene, bisaminodecylnorbornane; polydidecyl A halogenated alkanediamine such as a dioxane diamine. That is, R2 in the formula (1-1), the formula (1-2), and the formula (1-3) may, for example, be an alkanediyl group, a polyoxyalkylenediyl group, a divalent alicyclic group, a divalent aromatic ring group, or two. A valent heterocyclic group, a polyoxyalkylene diyl group or the like. The burnt-smoke base of R is preferably a calcined diyl group having a carbon number of 1 to 30, more preferably an alkanediyl group having a carbon number of 1 to 20. The alkanediyl group may be linear or branched, and is preferably linear. The alkanediyl group of R2 may, for example, be an anthracenyl group, an ethylidene group, a propanediyl group, a butanediyl group, a pentanediyl group, a hexanediyl group, a heptanediyl group, an octanediyldecanediyl group or a decane. Dikilc, undecanediyl, dodecanediyl, tridecanediyl, hexadecanediyl and the like. The divalent alicyclic group of R2 is preferably an alicyclic group having a carbon number of 3 to 1 Å, more preferably an alicyclic group of 4 to y. Further, the digamma ring group preferably has a cyclohexane ring. The divalent alicyclic group of R may, for example, be a cyclohexane-based diyl group, a pyrenylcyclohexane-1,4-diyl group, a di-cyclohexan-m-diyl group, a norbornene-based diyl group, a calcining group m2, 3-a. Base-hexyl methanediyl, dicyclohexylpropanediyl, iso-yl, bis-indenylcyclohexyl, bis-indenyl norbornyl. The divalent alicyclic group of 2' R2 is preferably an alkyl group having a carbon number of 1 to 10, more preferably an alkyl group having a carbon number of 丨5. The divalent aromatic ring group of R may, for example, be a stupid diyl group (1,2 phenyldiyl group, 20 201245373. l, 3- = 1, 1, 1,4-phenylenediyl), naphthalenediyl (1) naphthalenediyl i 3 naphthalenediyl, diH 5 ·naphthalenediyl, 1,6-naphthalenediyl, i,7-naphthalenediyl, dinacoyl 12,6-naphthalenediyl, 2,7-naphthalenediyl, etc., 4 , 4, biphenyl 1-2, 4,4'-(2,2'-diphenylpropane)diyl, 3,3,-(2,2,-diyl, 4,4' benzophenone Bismuth) dibasic, 3,3,-(diphenyl milling) di-glycine, 3 diphenyl hexafluoropropanone diyl, 3,3,-(3,3-diphenyl hexafluoro, Yuanyi soil, 4,4'-(diphenylether)diyl, 3,3,-(diphenyl ether) bis, 4,4, phenylene _)diyl, 3 3, phenylphenyl hydrazine Dibasic, 4,4._(2,2,dimethylbiphenyl)diyl, 44丨丨λ* 44, 4,4_(2,2-bis(trimethylmethyl)biphenyl)diyl , 4,4-(2)6,2,6-tetramethylbiphenyl)diyl. As the -valent group, the ring group may, for example, be a (1,4-dipropyl*methyl)diyl group. Examples of the poly-banking base of R include polydiindenyl-based Wei-steaming and the like. In the case of some monomers (Β) in the soil δ hai, the monomer which is liquid under the pit can be exemplified by: = amine = = Weisi base material, called amine, guanamine W ^ Xin County)] ring-roasted, epoxy-fired Dioxo^^northene system, silk diamine, polyepoxydiamine, lithography (1-1), formula (丨_2) and formula (丨_3) 2 (1, 4 base j / R is the second example: the form of the adhesive satisfies the above (1). · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · Here, the polygas can be exemplified by the private base. 21 201245373 - 丨 ,, ^ / Λ argon, where η represents an integer of 2 or more, and R5 represents an alkanediyl group. R5 may be the same or different from each other. [10] ~fR5~°t (2) The alkanediyl group of R5 may be linear or branched. The alkanediyl group of R5 preferably has a carbon number of 2 to 4. The alkanediyl group is more preferably an alkanediyl group having a carbon number of 2 to 3. The alkanediyl group of R5 may, for example, be an ethyl group, an anthracene, a 2 propanediyl group, a 1,3-propanediyl group or a 1,4-. Butanediyl, etc. The n in the formula (2) is preferably 2 to 7 Å, more preferably 6 to 33. _ Polyoxyalkylene diyl Preferred are groups derived from the following compounds: polyepoxy, polyglycol, polyepoxybutene, polytetramethylene oxide, polyoxyethylene propylene oxide copolymer, poly Polyethylene oxide polytetramethylene glycol copolymer, polypropylene glycol polytetramethylene glycol copolymer, polyethylene glycol polypropylene = alcohol polytetramethylene glycol copolymer, etc. The method of introducing the polyoxyl hydrocarbon diyl group into the condensed resin is not particularly limited, and examples thereof include the following: f« guanamine resin, A condensed resin such as a polyamidene tree or a ruthenium resin is modified to introduce the above polyoxyalkylene diyl group. Further, the 'condensed oxime resin is preferred as the above-mentioned base material. The above-mentioned polyoxycholinyl group is present in the structural towel derived from the monomer in the above structural unit. That is, it is preferred that at least one of the monomer 22 201245373 42357 pif pH and the body / B) has the above polyoxyalkylene diyl group, and more preferably at least one of the carcass (B) has the above polyweidiyl diyl group. . More preferably, the condensed resin has a structure derived from the monomer (8) in the above structural unit and has a polyoxyalkylene diyl group. That is, the condensed resin preferably has a structural unit obtained by condensation polymerization of a polymerizable precursor containing a monomer (b-1) having a polyoxyndene group and at least two amine groups. The monomer (b-fluorene) may, for example, be a polyepoxydiamine, and may be suitably used, for example:

Polypropylene oxide such as JEFFAMINE D-230 (HUNTSMAN, trade name), JEFFAMINE D-400 (HUNTSMAN, trade name), JEFFAMINE D 2_ (HUNTSMAN 'brand name), JEFFAMINE D 4()〇〇 (HUNTSMAN' trade name) Diamine; jeffamine ED-600 (HUNTSMAN, trade name), JEFAMINE ED_9〇〇 (HUNTSMAN 'trade name) and other copolymers of polypropylene oxide and polyethylene oxide diamine; JEFFAMINE EDR-148 (HUNTSMAN ' trade name ), JEFFAMINE EDR-176 (HUNTSMAN, trade name) and other polyethylene oxide diamine; JEFFAMINE T-403 (HUNTSMAN, trade name), JEFFAMINE T-3000 (HUNTSMAN, trade name) and JEFFAMINE T-5000 (HUNTSMAN, Trade name) and other triamines. These compounds may be used singly or in combination of two or more. The content of the monomer (b-Ι) in the polymerizable monomer is preferably 〇.5 m〇l% to 20 m〇l%, relative to the total amount of the monomer (A) and the monomer (B). Preferably, it is 1 mol% to 10 mol%, and further preferably 2 mol% to 8 mol%. According to the condensed system 23 201245373 resin having a structural unit obtained by subjecting such a polymerizable monomer to condensation polymerization, an adhesive which is more excellent in adhesion to the shaft is obtained. The condensed resin has a cyclohexane ring β which is reduced in water absorption by the condensing ring, and the adhesive force changes in the environment of the inhibitor. The condensed resin is difficult to be a fresh scented towel, and is preferably the above (3) 6/^ class. (A) human M·衣己烧H3 is to contain a monomer (A) and an early (B) binder, in other words, preferably the polymerizable monomer comprises a ring In the case of ===, the condensed resin is preferably a structure of the upper (4) or the monomer (B) derived from the structural ring of the monomer (8), more preferably the body (A) and At least a ring in the monomer (8). That is, it is preferable that it is preferably a monomer which is light and has a ring of a monomer (8), and a monomer which has a cyclohexane ring and a ring which has a cyclohexane ring. (a_l)"), for example, may be exemplified by a compound (A) which is sometimes referred to as "a monomeric divalent alicyclic group, a compound of the formula (R3 is a trivalent alicyclic group having a cyclohexane ring, and 4 (A). $\ is a compound having a tetravalent alicyclic group having a cyclohexane ring. 11 is a monomer having a cyclohexane ring, and the monomer (a-fluorene) and y, acid, and μ-cyclohexane are listed. I3·cyclohexene bis-hydrogen phthalic acid, 3·ethylhexahydroortho-benzene, hydrazine: phthalic acid, 3-mercapto hexacarboxylic acid, methyl norbornene _2, 3_ = acid, 4_Ethylhexahydro-o-stupled 1 A4,5-cyclohexene-burning tetra-Wei, !'2 3^=, cyclohexene-1,2,4-tricarboxylic acid, pyrrolic acid, decahydronaphthalene Acid, 1,2,3,4-cyclobutane, 4,8-dimethyl-1,2,3,5,6,7- 24 201245373. hexahydronaphthalene-1,2,5,6- Tetracarboxylic acid, cyclopentane, tetracarboxylic acid, " ^ appearance four, double core _ [2.2.2] xin · 'ene 2, 3, 5, 6 - four test, double (outer ring [U1 ]Geng appearance-2,3-two _, u,4,5_ read double ϋ [2.2.2] Xin Xuan_2,3,5,6_tetraacid, etc. The ring-burning monomer (8) (hereinafter sometimes referred to as (b-2)") may, for example, be a formula (Β) 2 divalent alicyclic amide compound. For the specific example of the monomer (b-2), there are two examples of the monomer (b-2), such as hexylamine, cyclohexanediamine, (4,4'diamino)dicyclohexylmethane, and isophora. Eramine diamine, [3,4-bis(1-aminoheptyl)-6-hexyl)]cyclohexene, bisaminodecylnorbornane, etc. relative to monomer (A) and monomer ( The total amount of B), the content of the monomer having a cyclohexene in the polymerizable monomer is preferably G5 mQi% to 4% by weight, more preferably i mol% to 20%, and further preferably 4%. ~i6 dish. According to (4) the structural mono-condensation resin obtained by the condensation polymerization of the Wei-combination monomer, the water absorption rate can be further suppressed, and the adhesion change under high temperature environment can be further suppressed. - Liquid state at 225 ° C Or the monomer (A) whose precursor is liquid at 25 ° C (a), and the monomer (8) which is liquid at 25 ° C is set to 2 (b·3), relative to the monomer (A) And the total amount of the monomer (8), the total content of the two monopolys and the monomer (f)) is preferably 15 mol% to 60 m〇1%, more preferably 2% by weight%%%%%, Further preferably, it is 25 mol% to 45 mol%. As a suitable combination of the polymerizable monomers, a monomer is preferred. Package 201245373 A compound containing R1 of formula 3 (A-1) as a divalent aromatic ring group, a compound of formula (A-2) which is a mussel ring, and a ring of formula (A-3) are tetravalent. At least one of the aromatic ring-based compounds, and the monomer (B) contains the monomer (W), the monomer (b-2), and the monomer (b_3). A suitable combination of the monomers of the present invention is also preferably a compound containing a divalent aromatic ring group, a compound of the formula (Α-2) wherein R3 is a triyl group, and a formula of the formula (Α3). It is at least one of the five species of the tetravalent aromatic ring group and the monomer (4)), (1) 1) and the monomer (5)). The early polymerization === can be obtained by the acid or monomer of the monomer (4) and the monomer (B). Further, it is also possible to use a monomer (4), a single monomer, or a polymerizable monomer, which may contain a divalent atmosphere, a total amount of a single monomer, and a monomer (4) or more of a polymerizable monomer sheet, and further preferably has a higher yield. It is 3〇m〇i% or more, more preferably 5〇m〇i% of 70m〇1% or more. Further, the amount of the monomer (A) and the monomer J may be 100 mol%. The method of the polymerization is not particularly limited. For example, the following compounds can be dissolved in a solvent at the reaction temperature. ~ 曰 曰 'For the period of 1 hour ~ 5 hours or so to carry out the retraction & polymerization used by you over the time you ...... _ 201245373. hzjj /pif N'N-monomethyl acetamide, Aachen Phosphate, diterpenoid, and the like. Among them, from the viewpoint of solubility of the resin, the N-fluorenylpyrrole side is preferred. Further, in the condensation polymerization, an accelerator such as a catalyst may be used in order to promote the condensation reaction. The acceleration_additional amount is equivalent to 1 〇 mol of the polymerizable monomer and the mosquito is G"_equal to ~5 GmQl equivalent. Examples of the accelerator include inorganic salts such as lithium chloride, calcium carbonate, and thiocyanate (Calcium rhodanate), tertiary amines such as diethylamine, and tetramethylammonium, vaporized tetramethylammonium, desertified tetraethylammonium, and bromine. A quaternary ammonium salt such as tetra-n-butylammonium may be used. The condensed resin may be further modified to form a lysate by a polymerization obtained by condensation polymerization, and examples thereof include: _ modified polydecylamine, oxy-oxygen Burning modified amine, 11 oxygen-fired modified polyimine, epoxy modified polyamine, polyamic acid from a modified polyamine, female hydrocarbon modified polyimine, Shixi oxygen burning modified Polyimine, epoxy modified polyimine, polycarbonate modified polyimine, alkane modified polyimine, olefin modified polyamidoximine, alkoxydecane modified Polyamidamine, alkane modified polyamidoximine, epoxy modified polyamidoximine, epoxy modified polyamidoximine, polycarbonate modified polyamidoxime Imine, etc. The condensed oxime resin of the present embodiment may be, for example, a polyamine resin having a cyclohexane ring and a polyoxyalkylene diyl group, a polyamidimide resin or a polyimide resin. The condensed resin satisfies at least the above (2) and (3). The condensed resin may further contain a diamine unit having a polyoxyalkylene diyl group and a diamine unit having a cyclohexane ring. That is, a polyoxyalkylene diyl group. And the cyclohexane ring may be contained in the diamine unit of the condensed resin, respectively. & The diamine unit having a polyoxyalkylene diyl group may, for example, be a polyepoxy compound 2 27 201245373 = derived from the above polyepoxy Monomer unit, 1,4-cyclohexanediamine unit, yak; ... hexamidine diamine, isophor copper diamine unit, [^ bis (^ ^ ^ 环 基 基 基 单 辛 辛 烯基 烯基 烯基)] cyclohexene unit, bisaminomethyl norbornyl group _5 servant-; ί, ?ί; = may also have a divalent aromatic ring group, may also contain a ί: unit. By condensation resin A compound having a divalent group's capable of inhibiting the adhesion of a homogenate to a high-temperature environment, wherein R1 of a divalent unit having a divalent aromatic ring group is a divalent aromatic ring group. Formula (Α-1) Condensation m village The material of the stupid base is as the base of the fresh tree, and is selected from the group consisting of the o-phthalic acid mono-isophthalic acid unit and the sub-dibenzoic acid unit. - The condensed resin benzodiazepine can be used to change the adhesive force in a high temperature environment. In addition, the condensed resin may have a M-methyl group or may have a The diamine unit of 4-piperazinediyl. According to the diamine unit, the adhesion of the adhesive to a high temperature environment can be further suppressed. Examples of the diamine unit having a 1,4-piperazinediyl group include hydrazine. 4• bis(ωaminoalkyl)piperazine is monovalent. In the 1,4-bis(ω-aminoalkyl)piperazine unit, the amino group of the amino group is preferably 1 to 10, more preferably Preferably, the ratio is 2 to 4. _ 28 201245373 Fine 1 ί Γ Γ 胺 ) ) ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- 3- C: The ratio of the content of Cl of the diamine unit of the molar == ring is 0.1 to 40, more preferably 0.5 to 8. Monomer · " Purpose? From the monomer (A) _ structural unit can be called =: 结构 derived from the monomer (8) structural unit can be called monomer (8) unit = called monomer-containing (A) unit and The monomer has a ring of diamine units in a single to 40 mol. /, dispute 1) The total amount of the benchmark, preferably ❻.1. More preferably, it is 1 m 〇 1% to 20 mol%, and further preferably 4 1 〇 / type of condensed resin, which can further inhibit the water absorption rate γ and suppress the change of adhesion in the enthalpy environment. The total amount of the unit having the polyoxyalkylene (4) unit and the monomer (8) in the condensed resin is: ten =; too 01% to 20 m〇1%, more preferably 1 mol% to 10 m0%, and further Coffee 1%. According to this stipulation, an adhesive which is more excellent in adhesion to the adherend can be obtained.旦 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , More preferably, it is 1% to 5〇, and preferably 40 mol% to 50 mol%. The content of the diamine unit having a M ♦ Qindiyl group in the condensed resin is 2012. The amount of the monomer (A) unit and the monomer (B) unit is preferably 15 mol% to 60 mol%, based on the total amount of the monomer (A) unit and the monomer (B) unit. More preferably, it is 20 mol% to 50 m〇1%, and further preferably 25 mol% to 45 mol%. The weight average molecular weight of the condensed resin is preferably from 2 Å to 100,000, more preferably from 30,000 to 60,000. In the present specification, the weight average molecular weight means a polystyrene-equivalent weight average molecular weight measured by a gel permeation chromatography (GPC) method. The content of the condensed resin in the adhesive of the present embodiment is preferably 5 G% by mass or more, and more preferably 7 (% by mass) based on the total amount of the adhesive. When the content of the condensed resin is in the above-described range, the south heat resistance can be sufficiently maintained and a higher adhesiveness can be obtained. Further, the content of the condensed resin may be 96% by volume or less, or may be 9% by volume or less. In addition, the adhesive of the present embodiment may be an adhesive containing a condensed resin (that is, the content of the t-type resin is (10)% by mass). However, the amount of the condensed resin may be appropriately set according to the use. Out of scope. _In addition, the content of δ in the high-temperature environment is good, and the content of the solid-state contact agent is preferably 5% by mass or less, more preferably 2% by mass or less, and further preferably 2% by mass or less. It does not contain a thermosetting resin. In the adhesive of the present embodiment, in order to improve the adhesion, it is also possible to add rosin resin, (four) resin, and fragrant beans to the invention. The day of the month, the hope of "the moon", the stupid resin, the aliphatic petroleum resin, the aromatic, the oil tree I (four) 芳钱丝合油, etc. tackifier 201245373 4ZJD/pif, etc. (How to use the adhesive) This implementation The adhesive of the form can maintain adhesiveness even in a high temperature environment, and therefore can be used for the purpose of including the following steps (1) to (3). (〇 Attachment step, on the first adherend, via the adhesive Adhesive layer is attached to the second adherend. (2) Heating step, heating the first adherend and the second adherend under the condition that the temperature of the adhesive layer reaches 2 〇 ((α) (3) a peeling step, from the first adhering system of the heating step to the adhesive layer and the second adherend. In the attaching step, for example, an adhesive layer may be formed on one side of the first adherend, The side of the adhesive layer opposite to the first adherend is matched with two, the adherend, and the first adherend and the second adherend are pressed against each other, and the hook is attached to the first-adhesive_ The second adherend. In addition, an adhesive layer may be formed on one side of the second adherend. The first adherend and the second adherend are pressed against each other on the opposite side, whereby the second adherend is attached to the adhered body. : A solvent adhesive and a glycol ether solvent which are excellent in a solvent adhesive are prepared, and the solvent is represented by an ethylene glycol, a triethylene glycol or a propylene solvent, for example, ethylene glycol, 31 201245373 Glycol, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, diethylene glycol monoterpene ether, triethylene glycol monoterpene ether, propylene glycol monoterpene ether, 3_decyloxydecyl-1- Butanol, ethylene glycol monoterpene ether acetate, Propyleneglycol monomethyl ether acetate (PMA), dihexanediol monobutyl acetate, and diethylene glycol monoethylglycidyl acetate Ester. In addition to fleeing, you can also use N-decylpyrrolidone, N-ethylpyrrolidone, N-mercaptosuccinimide, N,N'-dimercaptoacetamide and dimethyl These solvents may be used singly or in combination of two or more.

The adhesive layer in the attaching step may be an adhesive layer provided on the one side of the first adherend or the second adherend by drying and drying the adhesive varnish, or may be borrowed The adhesive layer formed on the one surface of the first adherend or the second adherend is bonded to one surface of the first adherend or the second adherend, and is disposed on the one surface. In the attaching step, for example, the first adherend and the second adherend may be attached at 〇t:~5 (rc). In the heating step, the first-adhered body and the second adherend are attached. The heating method and the purpose of heating are not particularly limited, and the adhesive layer is exposed to a temperature of 20 ° C or higher due to heating, usually, if the heat is low (for example, an acrylic adhesive) When such an addition step is performed, the adhesiveness cannot be maintained and floating or peeling occurs. However, the adhesive layer having the adhesive of the present embodiment maintains the adhesion even after passing through the heating well 3, so that it can be sufficiently suppressed. The occurrence of floating or peeling.... In the heating step, the heated first adherend-adhesive body may be formed into a shape. The point containing the material of the present embodiment is ^ 32 201245373. HZJJ Since the /pif layer is excellent in followability, even when the first adherend and the body are deformed by the forming process, it is possible to sufficiently produce the separation of the #3f. An adherent body peels off the adhesive layer and the first, Adhesive body. Here, the adhesive layer and the second adherend may be formed into a body and peeled off from the adherend, or may be separately peeled off from the first adherend. In the peeling step, for example, it may be rubbed. (: 〜5 (r2) The adhesive layer peeled off from the _th body and the second adherend. The adhesive layer peeled off in the peeling step maintains the adhesiveness even after the above heating step, and can be reused in the attaching step. The first to-be-attached body and the second adherend are not particularly limited, and examples thereof include an adherend containing at least one organic material selected from the group consisting of polyester, polyimine, polyamine, polyether oxime, Polyphenylene sulfide, polyether ketone, poly- __, triethyl hydrazine cellulose, polyether phthalimide, polyethylene naphthalate, polypropylene, acrylic, polystyrene, polycarbonate, etc. A support containing an inorganic material may also be used. For example, a support containing at least one inorganic material selected from the group consisting of aluminum, magnesium, titanium, chromium, manganese, iron, nickel, rhodium, tin, glass, copper may be used. , 矽 wafer and alloy. The first adherend and the second viscous The material may also be made of a material having heat resistance at a temperature of 200 ° C or more, and examples thereof include a polyamide resin such as nylon 6, nylon 66, and nylon 46; polyethylene terephthalate and polyethylene naphthalene; Polyethylene resin such as ethylene glycol diester, polytrimethylene terephthalate, triammonium polyphthalate, butylene dibutyl terephthalate, butylene dibutyl phthalate; polypropylene, poly Polyolefin resin such as ethylene; acrylic resin, polyimide tree 33 201245373 grease, polyarylate resin or a mixed resin of these resins; aluminum, magnesium, titanium, chromium, manganese, iron, nickel, zinc, tin or glass , copper, germanium wafers. Among these materials, polyester resin, polyamide resin, polyolefin resin, polyimide resin, acrylic resin, aluminum, magnesium, titanium, chromium, manganese, iron, Nickel, zinc, tin, glass, copper, and tantalum wafers are shown to exhibit high heat resistance. According to the above-described method of use, for example, the first adherend having low rigidity can be reliably fixed to the second adherend during high-temperature processing, and the first adherend is not damaged or deformed after being processed and peeled off. (Adhesive material) Fig. 1 is a schematic cross-sectional view showing a preferred embodiment of the adhesive of the present invention. The adhesive i shown in Fig. 1 is provided with a support 1A and an adhesive layer 14 containing an adhesive provided on the support 10. The support is not particularly limited', and a support containing at least one organic material selected from the group consisting of polyester, polyimine, polyamine, polyacrylic acid, polythioether, polymorph, poly Sodium ether ketone, triethyl hydrazine cellulose, polydecyl imine, polyethylene naphthalate, polypropylene, acrylic acid, polystyrene, polycarbonate, etc. Further, a support body containing an inorganic material may be used. For example, a support body containing at least one type of inorganic material selected from the following materials may be used. Ming, magnesium, titanium, chromium, lanthanum, iron, nickel, zinc, tin Glass, copper, tantalum wafers and alloys. The adhesive can be produced, for example, by applying an adhesive varnish containing an adhesive and a solvent to the support and drying it. This kind of use of the lining method is more suitable for bribery flatness. The solvent used in the adhesive varnish can be exemplified by the same solvent as described above. 34 201245373 In addition, the adhesive material can also be produced by coating the varnish (4) on the film and drying it, and attaching the formed layer to the support by the 成=adhesive layer The thickness of the transfer adhesive layer is preferably (U μιη~(10) 卿, more preferably [师他,曲曲帅. The thickness of the adhesive layer can be adhered by the adhesion varnish/ink or adhesive varnish in the above adhesive varnish) The coating amount is appropriately adjusted. ' (How to use the adhesive material) The adhesive of the last embodiment can maintain the adhesiveness even in a high temperature environment, and therefore can be used for the purpose of including the following steps (1) to (1). (1) Attachment step, Adhesive material is attached to the adhered body so that the adhesive layer is disposed on the side of the adhesive. (7) The heating step is performed until the temperature of the adhesive material is fine. Under the above c, the adherend is heated. (3) _Step, after the heating step (4), the adhesive body peels off the adhesive material. The "attachment" can be pressed by the adhesive layer of the adhesive material and the adhered body 2, and the adhesive material is _ Body. In the attached step ^, it can be used at any temperature. The adherend and the second adherend are attached, for example, from the viewpoint of proper nucleus and work efficiency, preferably 〇C~5〇. Attached under the arm. In the heating step, the pair is adhered. The body is heated while the adhesive 5 is exposed to 200. (: At the above temperature, pass f, if the heat-resistant adhesive (such as an acrylic adhesive) is subjected to such a heating step, then no 35 201245373 'The production or peeling occurs. However, according to the material of the present embodiment, even if the adhesion is performed by such a heating step, it can be filled to suppress the occurrence of eccentricity or peeling. The work can also be heated. The adhesive is formed by the shaft body, and the adhesive layer is excellent in follow-up property, and it is also more suitable for suppressing the occurrence of floating or peeling when the adhered body is deformed by shaping and curing. In the peeling step, the adhesive material is peeled off from the adherend. In the peeling step t', the adhesive material can be peeled off from the adherend under the machine. The adhesive material peeled off in the step maintains the stickiness even after the above heating step. Can be reused The attached body in the financial method can be exemplified by the same adherend to the first adherend and the first adherend. According to the above-described method of use, for example, a low-rigidity adherend can be applied to the adhesive. The substrate is fixed to the support, and is not peeled or deformed by the adhesive body w after the processing. The preferred embodiment of the present invention has been described above, but the invention is not limited to the above embodiment. For example, an aspect of the present invention relates to the use of a condensation resin having a structural unit obtained by condensation polymerization of a polymerizable monomer, and the above-mentioned polymerizable monomer comprising the above-mentioned single two (A) And the above-mentioned monomer (8), and the condensed resin satisfies at least one of the above (2) and (3). Further, another aspect of the present invention relates to the following condensed resin 36 201245373 j /pif In the use of the XI-based adhesive, the condensed resin has a structural unit obtained by simply combining the polymerizability, and the polymerizable monomer includes the above-mentioned monomer (A) and the monomer (B). And said resin satisfies the above condensation) and (2) and at least one of the above (3). Further, another aspect of the present invention relates to the use of a condensed resin which is selected from the group consisting of polyamidamine resin and polyimine resin. The group consisting of has a cyclohexane ring and a polyoxyalkylene diyl group. Further, another aspect of the present invention relates to a condensed resin for use in the manufacture of an adhesive selected from the group consisting of polyamidamide resins, polyamidoximine resins, and polyfluorene resins. The group consisting of an amine resin has a cyclohexane ring and a polyoxyalkylene diyl group. EXAMPLES Hereinafter, the present invention will be more specifically illustrated by the examples, but the present invention is not limited to the examples. (Example 1) In a separable flask equipped with a scrambler, a reflux condenser, a thermometer, and a nitrogen introduction tube, 43.75 parts (mole ratio) of two gasified m-xylylene carbonate were cooled under ice bath cooling. Gasification of 6 25 parts (mole ratio), polypropylene oxide diamine (JEFFAMINE (registered trademark) D-2000, manufactured by HUNTSMAN) 5 parts (mole ratio), bis (4-amino group) Cyclohexyl) stilbene 2·5 parts (mole ratio) and 1,4 bis (3-aminopropyl) butyl azine 42 5 parts (mole ratio) containing 110 parts of triethylamine (Morbi ratio) Condensation polymerization in S1·decylpyrrolidone as an acid neutralizer. After the reaction is completed, in the reaction mixture 37 201245373 X. Three times the amount of water is added, and the insoluble components are separated and dried to obtain Polyamide resin - Then, using an applicator, the obtained adhesive varnish was applied to a polyimide film having a thickness of 25 μm and a width of 20 cm so that the thickness of the dried adhesive layer was 20 The mixture was heated under uot for 5 minutes, and then heated at 150 ° C for 30 minutes to obtain an adhesive. (Example 2) In the condensation polymerization, respectively Changed to bis(4-aminocyclohexyl)decane 5 parts (mole ratio) and 1,4-bis(3-aminopropyl)pyrazine 4 parts (mole ratio), in addition to In the same manner as in Example 1, a polyamide resin, an adhesive varnish, and an adhesive were produced. (Example 3) In the condensation polymerization, it was changed to bis(4-aminocyclohexyl)decane (mole ratio) and 1 respectively. A polyamine resin, an adhesive varnish, and an adhesive were produced in the same manner as in Example 1 except that 35 parts of (4) bis(3-aminopropyl)-neptiazine (mole ratio) was used. (Example 4) Condensation In the polymerization, it was changed to bis(4-aminocyclohexyl)decane 5 parts (mole ratio) and 1,4-bis(3-aminopropyl) limazine 35 parts (mole ratio), norbornene A polyamine resin, an adhesive varnish, and an adhesive were produced in the same manner as in Example 1 except that 5 parts of an alkylenediamine (NBDA, manufactured by Mitsui Chemicals, Inc.) was used. (Comparative Example 1) A stirrer and a reflux condenser were provided. Thermometer, nitrogen inlet tube 38 201245373. In a separable flask, under cooling in an ice bath, make 23.3 parts (mole ratio) of di-m-phlophenyl phthalate and 6.25 parts of di-gaso-p-benzoquinone ( Mobibi), polypropylene oxide diamine (JEFFAMINE (registered trademark) D-2000, manufactured by HUNTSMAN) 5 parts (mole ratio) and ι,4·bis(3-aminopropyl)piperazine 45 parts (Morbi) is a condensation polymerization in N-decylpyrrolidone containing 11 parts by weight of triethylamine (mole ratio) as an acid neutralizing agent. After the reaction, 3 times the amount of water is added to the reaction mixture. The insoluble component was separated and dried to obtain a polyamine resin. (Comparative Example 2) In a separable flask equipped with a stirrer, a reflux condenser, a thermometer, and a nitrogen introduction tube, the mixture was cooled in an ice bath to make two Gasification of benzodiazepine 43,75 parts (mole ratio), two gasified p-benzoquinone 6.25 parts (mole ratio), polypropylene oxide diamine (JEFFAMINE (registered trademark) D_2〇〇〇, 5 parts (mole ratio) and bis(4-aminocyclohexyl)decane 45 parts (mole ratio) of triethylamine containing 11 parts (mole ratio) as an acid neutralizer Condensation polymerization in N-decylpyrrolidone. After the completion of the reaction, three times the amount of water was added to the reaction mixture, and the insoluble components were separated and dried to obtain a polyamide resin. Knife The weight average molecular weights of the respective guanamine resins obtained in Examples 1 to 4 and Comparative Examples 1 and 2 were determined by the following methods. In addition, the use of each of the adhesive materials obtained in the two examples 1 to 3 and the comparative example 4 was evaluated for adhesion, lion residue, and heat resistance. Further: Price moisture absorption. The results are shown in Table 1. (Evaluation of Adhesion) 39 201245373 The adhesive was placed on a 10 cmxlO cm glass plate with a thickness of 70 μm, at a temperature of 17 ° C to 25 ° C, in a laminator with a roll pressure of 3 MPa. The speed was passed at 0.8 m/min for attaching. The end of the polyimide film to which the adhesive material was attached was slightly peeled off and held, using a Rheometer RE3305R (manufactured by Yamagata) tensile tester at a temperature of 90 degrees and a tensile speed of 300 mm/min. The minimum force (N/cm) required to peel the polyimide film at a width of 10 mm was measured. (Evaluation of peeling residue) The weight of the adhesive material was measured, and the weight of the adhesive layer of the pre-measured polyimine film was subtracted from the weight of the adhesive layer of the adhesive material, and the adhesion was evaluated. In the same manner, the adhesion of the adhesive to the glass plate and the peeling of the adhesive are performed. The weight of the peeled adhesive was measured, and the weight of the previously measured polyimide film was subtracted, whereby the weight of the adhesive layer of the adhesive after peeling was calculated. In this case, the case where the ratio of the weight of the adhesive layer after peeling to the weight of the adhesive layer before attachment is 90% or more is regarded as "Α", and the case where it is less than 90% is regarded as "Β", and the peeling residual is evaluated. . (Evaluation of heat resistance) The adhesion of the adhesive to the glass plate was carried out in the same manner as the evaluation of the adhesion. The glass plate to which the adhesive material was attached was heated in a clean oven at 200 ° C for 1 hour. The visual inspection confirmed the presence or absence of peeling of the adhesive material from the glass plate. The case where no peeling was observed was regarded as "A". The case where peeling was observed was regarded as "B", and the heat resistance was evaluated. (Evaluation of hygroscopicity) The amount of each of the polyamines obtained in Examples 1 to 4 and Comparative Example 1 and Comparative Example 2 was about 1 〇 mg, and the thermal differential-thermal re-synchronization measurement was used to determine the setting of 201245373. / pit TAPS3000S (manufactured by Bruker AXS Co., Ltd.) The amount of thermal weight loss was measured at a temperature elevation rate of 10 ° C / min. The water absorption rate is calculated based on the amount of thermal weight loss between 50 ° C and 10 ° C. [Table 1] Water absorption (%) Weight average molecular weight adhesion (N/cm) Peel residual heat resistance Example 1 2.04 46000 0.48 AA Example 2 1.77 44000 0.22 AA Example 3 1.73 45000 0.20 AA Example 4 1.80 43000 0.22 AA Comparative Example 1 2.64 52500 0.70 AA Comparative Example 2 1.00 35000 Unattached at room temperature - [Brief Description of the Drawings] Fig. 1 is a schematic cross-sectional view showing a preferred embodiment of the adhesive of the present invention. [Main component symbol description] 1 : Adhesive 10 : Support 14 : Adhesive layer

Claims (1)

201245373 VII. Patent application scope: h An adhesive comprising a condensed resin having a structural unit obtained by condensation polymerization of a polymerizable monomer, wherein the polymerizable monomer comprises a monomer having at least two carboxyl groups ( A) and a monomer (B) having at least two amine groups, and the above-mentioned adhesive satisfies at least one of the following (1) and (2) and does not describe (3): (1) is selected from the above monomers (A) And at least one of the group consisting of the acid anhydride of the monomer (A) and the monomer (B) is liquid at 253⁄4; * (2) the condensed resin has a polyoxyalkylene diyl group; The condensed resin has a cyclohexane ring. 2. The adhesive according to claim 2, which satisfies both (1) and (2) above. 3. The adhesive according to claim 2, wherein the condensed resin contains a group selected from the group consisting of polyamidimide resins, polyimine resins, and polyamide resins. At least one of them. 4. The Thai remedy according to any one of the items of the present invention, wherein the condensed resin is a polyamine resin. The correct one of items 1 to 3 The above-mentioned structure of the oxyhydrocarbonate is derived from the above-mentioned polycondensate 42 201245373. The structure has the above-mentioned polyoxyalkylene diyl group. 荖 ^申 May patent scope of any of items 1 to 5 The above-mentioned monomer (A) and the total amount of the above monomer (8) are as described above. The ratio of the monomer (A) and the monomer (8) is two. The ratio of the monomer Ή mol% to 8 contains a monomer " Ι) having a polyoxyalkylene diyl group and at least two amine groups. (4) Lr County agent 'containing a smectite resin selected from the group consisting of poly-contact, polyamidamine's fat and poly-pyrene. The condensed resin has a cyclohexane ring and a polyoxyalkylene diyl group. The adhesive according to claim 7, wherein the condensed fat contains a diamine unit having a cyclohexan filament, and A diamine unit having a polyoxyl-smoke-based group. 10. The adhesive according to claim 7 or 8, wherein the above-mentioned condensed resin has more The adhesive of the above-mentioned '5-line tree, for example, contains a di-retensive acid unit having a divalent aromatic ring group. ―12. The adhesive according to any one of item 10, wherein the condensed resin further has an anthracene, 4 • piperazine diyl group. ^ u. The adhesive according to claim 11 of the patent application, i The condensed resin contains a diamine unit having a 1,4-piperazinediyl group. The adhesive according to any one of the above-mentioned items of the present invention, which is used as a heat-resistant adhesive. The heat-resistant adhesive is adhered to the adherend and is peeled off from the adherend after being heated to 200 ° C or higher. ^ As claimed in any of items i to 13 of the patent scope 2012 2012373 adhesive The adhesive of any one of the above-mentioned condensed resin is an adhesive containing the above-mentioned condensed resin. Π. The use of a condensed resin as an adhesive, the condensed resin having a structural unit obtained by condensation polymerization of a polymer body, wherein the polymerizable monomer comprises a monomer (A) having at least 2 tilting groups and a monomer (B) having at least 2 amine groups, and the condensation system satisfies the following (1) And at least one of (2) and the following (3): (1) is at least one selected from the group consisting of the monomer (A), the acid needle of the monomer (A), and the transition of the early body (B). (2) The condensed resin has a polyoxyalkylene diyl group; (3) the condensed resin has a cyclohexane ring. 18. The use of a condensed resin for producing an adhesive, The condensed resin has a structural unit obtained by condensation-polymerizing a polymerizable monomer, and the polymerizable monomer includes at least two secret monomers (a) and a monomer (8) having at least two amine groups, and the condensation system The resin satisfies at least the following (1) and (2) and the following (1): (1), free of the above-mentioned monomer (A), the acid liver of the above monomer (A), and the above-mentioned monomer (B) Less - the seed is liquid under the pit; (7) the above condensed resin has a oxyhydrocarbonate dibasic; (3) the above condensation system Alicyclic having a cyclohexane ring. 19. Use of a condensed resin as an adhesive, the condensation system 201245373. The resin is selected from the group consisting of polyfluorene resins, two people, a ship imine resin, and a polyaniline polyoxyalkylene diyl group. . & is a tree-shaped, and has a ring-burning ring and a resin which is selected from the group consisting of an adhesive made of yttrium, a dimerized amide amine-imide resin and a poly-ring ring in a group consisting of the imide resin And polyoxymethane two bases. a group & resin, and having a containment material on a ring-fired product, which has a support body, and a method of providing the following in the support patents No. 1 to No. 16 - Item 4 (4), which includes the following Step · The range "" to "2" is adhered to the adhesive layer via the adhesive layer containing the adhesive as described in the second application of the patent application; The heat of the above-mentioned adhesive layer reaches a temperature of 2 〇〇ΐ or more; and the 3 adherends and the second adherend are stripped from the above-mentioned first adherend body through the heating step away from the adhesive layer And the second adherend as described above. 23) The use of the adhesive phase as described in claim 22 of the patent application, in the attaching step, the first adherend is 〇°C~50Ϊ: Attached to the second adherend described above. Ji& M 22 23 method for the use of the mold, wherein in the above peeling step, under the condition of 0 < t 〜 5 〇 <> c from 45 201245373 The adhesive layer and the second adherend described above, as in the 22nd to 24th claims of the patent application The method of use 'which is peeled off in the above-mentioned peeling step: The adhesive layer is reused in the above-mentioned attaching step. 26. The method of using the adhesive material, comprising the following steps: attaching step, attaching to the adhered body Attached as a patent application, the adhesive material is in which the adhesive layer is disposed on the side close to the adhered bottle; the heating step is performed on the temperature of the adhesive material to 2 ) (): The adhesive body is heated; and the above-mentioned adherend is peeled off from the above-mentioned adhesive step by the above-mentioned heating step, and the use method of the adhesive material according to claim 26, wherein In the above-mentioned attaching step, the above-mentioned adhesive material is attached to the above-mentioned adherend in 〇cc~5 (rc). 28. The use method of the adhesive material according to claim 26 or 27, wherein In the above-mentioned peeling step, the adhesive material is peeled off from the above-mentioned adherend, and the adhesive material is used according to any one of the above-mentioned items, wherein the adhesive material is used according to any one of claims 26 to 28, wherein Will The above-mentioned adhesive material peeled off in the above peeling step is reused in the above-mentioned attaching step.