201244560 六、發明說明： 【發明所屬之技術領域】 本發明係有關用於裝配電子元件之配線板及其製造方 法。 【先前技術】 隨著電子機器的小型化、多功能化，機器中裝配的電 子元件也不斷朝小型化、高度積體化邁進。 欲將分別裝配於配線板（基板）兩面的電子元件以電 性連接的情況下’當裝配的電子元件種類相異時，每個電 子元件所需的電極之配置不同，表面配線亦必須因應電極 之配置。 然而’爲了避免表面配線之間產生短路或電子訊號干 擾’必須在表面配線之間保留一定的間隔，這會使得配線 板表面上表面配線的佔據面積增加，導致電子元件的配置 更加受限。此外，若表面配線過長，可能引起訊號延遲， 或高頻特性劣化等問題。 又，其他將分別裝配於配線板兩面的電子元件以電性 連接的方式，習知有令配線板其中一面之端子間距較另--面之端子間距來得寬，而在玻璃等材質之基材上以雷射等 工具設置斜向的微細孔，並在微細孔內塡充導電性物質， 而形成斜向貫穿配線之貫穿配線基板（中介板， interposer)(如專利文獻1 )。 然而該方法須以雷射等工具在基材上設置微細孔，故 -5- 201244560 形成貫穿配線較爲困難。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2006 — 3033 60號公報 【發明內容】 本發明之目的係在於提供一種配線板及其製造方法， 使得裝配於配線板兩面的電子元件之間，可容易地形成貫 穿配線以進行電性連接。 [用以解決課題之手段] 本發明其中一種形態爲一種配線板，具備絕緣層；及 貫穿配線，係由金屬線構成，具有第1端部與第2端部， 前述第1端部之端面高度與前述絕緣層之上面高度大略一 致，前述第2端部之端面高度與前述絕緣層之下面高度大 略一致。 本發明另一種形態爲一種配線板，具備絕緣層；及貫 穿配線，係由金屬線構成，具有第1端部與第2端部，前 述第1端部之端面高度與前述絕緣層之上面高度大略一致 ，前述第2端部之端面與前述絕緣層之側面大略位於同一 平面上。 本發明另一種形態爲一種配線板之製造方法，包含於 支持基板之上面形成曲線狀金屬線之製程，該金屬線之兩 • 6 - 201244560 端與前述支持基板相接；及於前述支持基板之上 緣層之製程，該絕緣層覆蓋前述金屬線的至少一 除去前述金屬線的一部分以裁斷前述金屬線而形 穿配線之製程，該貫穿配線具有第1端部與第2 中該第1端部之端面高度與前述絕緣層之上面高 致，該第2端部與前述支持基板之上面相接；及 支持基板之製程。 本發明另一種形態爲一種配線板之製造方法 支持基板之上面形成曲線狀金屬線之製程，該金 端與前述支持基板相接；及於前述支持基板之上 緣層之製程，該絕緣層覆蓋前述金屬線的至少一 除去前述金屬線的一部分以形成貫穿配線之製程 金屬線之最上部分露出，以前述露出之最上部分 穿配線之第1端部，以前述兩端作爲該貫穿配線 第3端部；及除去前述支持基板之製程。 本發明另一種形態爲一種配線板之製造方法 支持基板之上面形成金屬線之製程，該金屬線具 支持基板之上面相接之第1端部，且該金屬線與 基板之上面朝不同方向延伸；及於前述支持基板 成絕緣層之製程，該絕緣層覆蓋前述金屬線的至 :及除去前述金屬線的一部分以形成貫穿配線之 貫穿配線具有之第2端部的端面高度，與前述絕 面高度大略一致；及除去前述支持基板之製程。 面形成絕 部分；及 成一對貫 端部，其 度大略一 除去前述 ，包含於 屬線之兩 面形成絕 部分；及 ，使前述 作爲該貫 之第2及 ，包含於 有與前述 前述支持 之上面形 少一部分 製程，該 緣層之上 201244560 【實施方式】 接下來’參照圖面說明本發明之實施形態。 記載中’遇同一或類似之部分，予以標記同一或 號。但需留意的是，圖面皆屬模型，其厚度和平 關係' 各層的厚度比例等與實物有所不同。故， 度或尺寸應參酌以下說明後加以判斷。又，圖面 於相互尺寸關係或比例上，同樣包含相異之部分 再者’以下所示之實施形態，係用以例示具 發明技術思想之裝置或方法，本發明之技術思想 述構成元件之材質、形狀、構造、配置等所限定 之技術思想，在申請專利範圍內，皆可增加各種 (配線板之構造） 本發明實施形態之配線板如圖1所示，具備 :及貫穿配線1 1 a〜1 6 a、1 1 b〜1 6 b，係由金屬 具有第1端部（上端）與第2端部（下端），其 部之端面高度與絕緣層1上面高度大略一致，第 端面高度與絕緣層1下面高度大略一致；及上 2a〜21，與貫穿配線 11a〜16a，lib〜16b之上 及下面側焊墊3a〜31，與貫穿配線11a〜16a， 之下端連接。 本發明實施形態中，所謂「金屬線」係指由 屬絲或柱狀凸塊（stud bump)等，在絕緣層1包覆 前即預先作成線狀之金屬構件。 以下圖面 類似之符 面尺寸之 具體之厚 彼此之間 〇 體呈現本 並非由下 。本發明 變更。 絕緣層1 線構成， 中第1端 2端部之 面側焊墊 端連接； 1 1 b 〜1 6 b 焊線、金 其周圍之 -8 - 201244560 絕緣層1 ’例如可具有5 0 μ m〜1 m m左右之厚度。絕 緣層1之材料’可使用環氧系樹脂或無機材料等，凡爲絕 緣性材料即可，並未特別限定。 貫穿配線 11a〜16a’ lib〜16b，例如可具有20μιη〜 1 0 0 μηι左右之線徑。貫穿配線！丨a〜丨6 3，！丨b〜丨6 b ,例 如可使用金（Au )或銅（Cu )等材料所製成之焊線。 貫穿配線1 1 a〜1 6 a，係於絕緣層1之厚度方向平行 延伸。另一方面’貫穿配線1 1 b〜1 6 b，係相對於絕緣層1 之厚度方向斜向延伸。像這樣令貫穿配線1 1 b〜1 6b斜向 延伸，無需多層配線板，以單層配線板亦可連接電子元件 。貫穿配線1 1 b〜1 6b之下端間隔可以愈朝向外緣愈寬， 而貫穿配線lib〜16b之下端亦可以等間隔配置。假設爲 球型陣列（ball-grid array)的情形下，一般而言其格狀位置 爲等間隔，此時貫穿配線1 1 b〜1 6b之下端以等間隔配置 ，即可有效率地裝配。 成對之貫穿配線1 1 a，1 1 b，是由一根焊線裁斷而形 成。如圖2所示，貫穿配線1 1 a具有連接下面側焊墊3 a 之第1接合部111、及第1接合部111上方之球狀部Π2 、及球狀部1 1 2上方之第1配線部1 1 3。第1接合部1 1 1 、球狀部1 1 2及第1配線部1 1 3係一體成形。另一方面， 貫穿配線1 1 b具有連接下面側焊墊3b之第2接合部1 1 4 、及第2接合部1 14上方之第2配線部1 1 5。第2接合部 1 1 4及第2配線部1 1 5係一體成形。 圖1所示之成對貫穿配線1 2a、1 2b ’成對貫穿配線 -9- 201244560 13a、13b ’成對貫穿配線14a、14b，成對貫穿配線15a、 1 5 b及成對貫穿配線1 6 a、1 6 b，分別與成對貫穿配線1 1 a 、1 1 b相同’是由一根焊線裁斷而形成。 圖3所示者’爲配置於絕緣層1 x內之複數貫穿配線 1 1 X其布局之一例。貫穿配線1 1 X之上端以等間隔配置。 貫穿配線1 1 X之下端配置，係愈朝向外緣間隔愈寬。 圖1所示之上面側焊墊2 a〜2丨及下面側焊墊3 a〜3 1 之材料，可使用銅（Cu)等。上面側焊墊2a〜21及下面 側焊墊3a〜31之剖面積，各自相較於貫穿配線1 ia〜16a ’lib〜16b上端及下端之剖面積來得大。於圖1所示之 配線板上面及下面裝配電子元件時，可透過上面側焊墊 2a〜21及下面側焊墊3a〜31，將端子位置相異之電子元件 電性連接。上面側焊墊2 a〜2 1之間距例如可爲5 0 μηι左右 ，下面側焊墊3a〜31之間距例如可爲150 μιη左右。上面 側焊墊2a〜21及下面側焊墊3a〜31之間距，可以視絕緣 層1厚度與貫穿配線11a〜16a、lib〜16b之布局而適當 調整。 本發明實施形態之配線板，可應用於如圖4所示之電 子裝置。該電子裝置具備配線板10、及配線板10之上面 以覆晶封裝法（flip chip)所裝配之電子元件20、及配線板 1 〇之下面以覆晶封裝法所裝配之電子元件3 0。 電子元件20例如可爲1C晶片，其具有基體21、及 複數之電極22，該複數之電極22係配置於基體2 1之下 面，且與配線板1 〇之上面側焊墊2a〜21之間透過複數之 -10- 201244560 凸塊71而分別連接。電子元件20之複數之電極22、及 配線板1 〇之上面側焊墊2 a〜21表面的一部分，係分別由 防焊漆73，74所覆蓋。而電子元件20之複數之電極22 、及配線板1 〇之上面側焊墊2 a〜21所露出的一部分，係 分別與複數之凸塊71連接。電子元件20與配線板1〇之 間，以底部塡充膠75密封。 電子元件30例如可爲主機板，其具有基體31、及複 數之電極32，該複數之電極32係配置於基體31之上面 ，且與配線板10之下面側焊墊3a〜31之間透過複數之凸 塊7 2而分別連接。配線板1 〇之下面側焊墊3 a〜3 1、及電 子元件30之複數之電極32表面的一部分，係分別由防焊 漆7 6 ’ 7 7所覆蓋。而配線板1 〇之下面側焊墊3 a〜3 1、 及電子元件3 0之複數之電極3 2所露出的一部分，係分別 與複數之凸塊72連接。電子元件30與配線板10之間， 以底部塡充膠78密封。 電子元件20之電極22與電子元件30之電極32，其 配置位置、間隔有所相異。又，圖4中雖以電子元件2 〇 、3 0之間介有一個單層配線板1 〇之電子裝置進行說明， 但因應電子元件之電極配置位置、間隔，亦可使電子元件 之間層積有複數層配線板。 如上所述’依據本發明實施形態之配線板1 0，電極 22、32對於高密度且以相異布局配置之電子元件20、30 ’無需採用多層配線構造，即可讓裝配於配線板1 0兩面 之電子元件20、30的電極22、32彼此自由連接。 -11 - 201244560 再者，因使用了以焊線構成之貫穿配線π a〜1 6a、 1 1 b〜1 6b，相較於以雷射等工具形成微細孔後，再以電鍍 或印刷等方式於微細孔內塡充導電性物質而成的貫穿配線 ，其不會有氣泡跑入而可確實導通，可提升連接之可靠性 (配線板之製造方法） 接下來利用圖5〜圖1 1，說明本發明實施形態之配線 板之製造方法其中一例。又，以下所示之製造方法僅爲一 例，並非特別限定者。本發明實施形態之配線板可以各種 製造方法來製造。 (―)如圖5所示，先準備好板狀之支持基板4，其 爲不鏽鋼等材料之金屬板或矽基板等，具有剛性，厚度爲 5 Ομηι〜1mm左右。本發明實施形態中，使用1mm厚之不 鏽鋼板。支持基板4之材料，凡是能在後續製程中進行打 線即可，並未特別限定。此外，亦可於支持基板4之上面 ，事先以濺鍍等方式堆積出銅（Cu)、金（Au)或鎳（ Ni )等金屬層。 (二）接著如圖6所示，以超音波熱壓著等方式進行 打線，將曲線狀之銅（Cu )或金（Au )等所構成之焊線 1 1〜16，形成爲例如線徑20μιη左右、最小焊墊間距 5 Ομιη左右，且其兩端與支持基板4上相接。本發明實施 形態中，所謂「曲線狀」包含環狀之圓滑曲線，亦包含複 數之直線部分所撓曲成的形狀》舉例來說，形成焊線11 -12- 201244560 時如圖7所示，首先以未圖示之瓷嘴（capillary)形成金球 ’再在支持基板4上以瓷嘴按壓金球，形成與支持基板4 接合之第1接合部111及球狀部112。接下來移動瓷嘴， 形成環狀之第1配線部113及第2配線部115。再在支持 基板4上以瓷嘴按壓，形成與支持基板4接合之第2接合 部1 1 4。其後裁斷金線，結束一個製程循環。圖8所示者 ，爲支持基板4x上形成有複數之焊線lly其布局之一例 。複數之焊線1 1 y形成時，以長度相對愈長者會通過上層 〇 (三） 如圖9所示，於支持基板4之上面，例如用厚 度ΙΟΟμηι左右之半硬化狀態環氧系樹脂膜，在100〇c下疊 層以覆蓋焊線1 1〜1 6全體，並在1 80 °C下加熱30分鐘使 其硬化，形成絕緣層1。形成絕緣層1之其他方法，有將 聚醯亞胺清漆等予以印刷之手法、以溶膠凝膠法形成玻璃 層之方法、將陶瓷基板用之半硬化狀態的綠帶（green sheet)予以疊層並於1 000°C左右燒結之方法等。絕緣層1 之材料’亦可爲無機材料，凡是絕緣性材料即可，並未特 別限定。 (四） 如圖1 0所示，將焊線1 1〜i 6之上部及絕緣層 1之上部以硏磨等方式削磨至規定厚度，將焊線丨丨〜j 6 各自裁斷成兩截。如此一來，便形成貫穿配線1 1 a〜！ 6 a 、lib〜16b’其上端之端面高度與絕緣層I上面高度大略 —致。貫穿配線11a〜16a’係於絕緣層1之厚度方向平 行延伸。貫穿配線1 1 b〜1 6b ’係相對於絕緣層1之厚度 -13- 201244560 方向斜向延伸。貫穿配線1 1 b〜1 6b之下端間隔 向外緣愈寬，而下端亦可以等間隔配置。 (五）如圖1 1所示，除去支持基板4。如 貫穿配線11a〜16a、lib〜16b之下端便會露出 圖1所不，以銅（Cu)電錢等方式，於貫穿配 16a、1 lb〜16b之表面上，分別形成上面側焊墊 下面側焊墊3 a〜31，配線板即完成。又，也可視 面側焊墊2 a〜2 1及下面側焊墊3 a〜3 1之上面或 少一面，施以鎳（Ni)電鍍或金（Au)電鍍等 圖4所示，可在配線板1 0兩面以覆晶封裝法來 元件20、30，製造出電子裝置。 依據本發明實施形態之配線板之製造方法， 的方式使焊線11〜16形成貫穿配線iia〜16a、 ，相較於以雷射等工具形成微細孔後，再以電鍍 方式於微細孔內塡充導電性物質而成的貫穿配線 較低，且可容易地形成貫穿配線1 la〜16a、1 lb- 再者，以雷射等工具形成微細孔後，再以電 等方式於微細孔內塡充導電性物質之方法，可能 導電性物質時有氣泡跑入；但若依據本發明實施 線板之製造方法，因利用預先形成之焊線11〜 確實導通，並形成連接可靠性較高的貫穿配線 、lib 〜16b 〇 又’本發明在絕緣層1形成之前，即預先 11〜16，故形成貫穿配線11a〜16a、lib〜16b 可以愈朝 此一來， 。其後如 線 1 1 a〜 2a〜21及 需要於上 下面的至 。此外如 裝配電子 是以打線 1 1 b〜1 6b 或印刷等 ，其成本 “ 1 6 b 〇 鍍或印刷 會於塡充 形態之配 1 6，故可 1 1 a 〜1 6 a 开多成焊線 時*可品 -14- 201244560 質均一地得到所需之線徑及形狀。 (第1變形例） 以下以配線板之製造方法的另一例，說明本發明實施 形態之第1變形例。 本發明實施形態第1變形例之配線板之製造方法，是 在圖6所示形成焊線11〜16之製程後，再如圖12所示， 於支持基板4之上面，令絕緣層1形成爲規定之厚度，使 得焊線1 1〜1 6之上部露出；上述之處與本發明實施形態 之配線板之製造方法相異。 其後’將焊線1 1〜1 6以硏磨等方式削磨至與絕緣層 1上面同高。如此一來，便可得到與圖1 0相同之構造 其後之製程與本發明實施形態之製程實質相同，故省略重 複說明。 依據本發明實施形態之第1變形例，相較於本發明實 施形態之配線板之製造方法，其可省略削磨部分絕緣層1 之製程’可容易地形成貫穿配線1 1 a〜1 6 a、1 1 b〜1 6 b .> 又’絕緣層1形成爲規定高度且不需削磨，故可節省絕緣 層1之材料。 (第2變形例） 本發明實施形態第2變形例之配線板，如圖1 3所示 ’具備曲線狀之貫穿配線1 1、1 4，其具有第1端部（上 端）與第2及第3端部（下端），其中第1端部之端面高 -15- 201244560 度與絕緣層1上面高度大略一致，第2及第3端部之端面 高度與絕緣層1下面高度大略一致，且從上端開始分岐彼 此朝不同方向延伸；上述之處與本發明實施形態之配線板 相異》 貫穿配線1 1、14之上端，係呈橢圓形狀。絕緣層1 之上面’配置有與貫穿配線11、14連接之上面側焊墊2m 、2n。其餘構成與本發明實施形態之配線板實質相同，故 省略重複說明。 本發明實施形態第2變形例之配線板，遇電子元件之 間有分岐配線的情形’無需採用多層配線構造，即可予以 分岐配線，這一點可發揮功效。 本發明實施形態第2變形例之配線板之製造方法，是 如圖1 4所示，令絕緣層1形成爲規定之厚度，使得焊線 1 1、1 4之最上部露出後，再以硏磨等方式將焊線丨丨〜j 6 之上部削磨至與絕緣層1同高即可。又或者是，亦可形成 絕緣層1覆蓋焊線1 1〜1 6全體後，將絕緣層1的—部分 及焊線11〜16的一部分予以除去，直到焊線11、14不會 裁斷成兩截的高度爲止。 (第3變形例） 本發明實施形態第3變形例之配線板，如圖1 5所示 ’貫穿配線1 3 b、1 6 b端部之端面，與絕緣層1之側面大 略在同一平面上；上述之處與本發明實施形態之配線板相 異。絕緣層1的側面上’配置有與貫穿配線丨3b、1 6b端 -16- 201244560 部連接之側面側焊墊3m、3η。 本發明實施形態第3變形例之配線板之製造方法，是 將圖1 0所示之支持基板4如圖1 1所示般除去後，再以研; 磨等方式削磨絕緣層1及貫穿配線11a〜16a、ilb〜i6b 外緣的一部分，使貫穿配線1 3b、1 6b從絕緣層1之側面 露出。其後以電鍍等方式，形成與貫穿配線1 3 b、1 6b連 接之側面側焊墊3 m、3 η即可。 (第4變形例） 本發明實施形態之第4變形例，係不使用打線，而以 柱狀凸塊法作爲配線板之製造方法的一例。 本發明實施形態第4變形例之配線板之製造方法，是 如圖5所示準備好支持基板4後，再如圖16所示，以柱 狀凸塊法在支持基板4上形成具有突起41a〜411之柱狀 凸塊42a〜421。利用突起41a〜411及柱狀凸塊42a〜421 ’相對於支持基板4之上面，構成朝不同方向延伸之金屬 線。 接著如圖17所示，於支持基板4之上面，形成規定 高度之絕緣層1 ’以覆蓋突起41a〜411的一部分。其後如 圖18所示’以硏磨等方式，將突起41a〜41丨的—部分削 磨至與絕緣層1之上面同高。又或者是不採用圖17及圖 18之手續，而是形成絕緣層1覆蓋突起4ia〜411全體後 ’再將突起41a〜411的一部分及絕緣層1的一部分予以 除去亦可。 -17- 201244560 依據本發明實施形態第4變形例之配線板之製造方法 ，即使不使用打線而採用柱狀凸塊法的情形下，同樣可容 易地製造配線板。此時，相較於裁斷一根金屬線來形成一 對貫穿配線之情形，其可形成奇數根之貫穿配線，且可個 別配置貫穿配線，使得配置的靈活度更大。 (第5變形例） 本發明實施形態之第5變形例，係不使用打線，而使 用預先製作好之金屬線作爲配線板之製造方法的一例。 本發明實施形態第5變形例之配線板之製造方法，是 如圖5所示準備好支持基板4後，再如圖19所示，在支 持基板4上以蝕刻等方式形成貫穿孔51a〜511。 如圖20所示，將預先製作好的金（Au)、銅（Cu ) 或鋁（A1 )等金屬線61〜66撓曲並插入貫穿孔51a〜511 內固定後，再如圖21所示，於支持基板4之上面形成絕 緣層1，使金屬線6 1〜6 6的一部分露出。 其後以硏磨等方式，將金屬線6 1〜66的一部分削磨 至與絕緣層1之上面同高；或是亦可形成絕緣層1覆蓋金 屬線6 1〜66全體後，將金屬線6 1〜66的一部分及絕緣層 1的一部分除去亦可。其後除去支持基板4，同時以硏磨 等方式，削磨絕緣層1之下面所突出之金屬線61〜66的 一部分。 依據本發明實施形態第5變形例之配線板之製造方法 ，即使不使用打線而使用預先製作好的金屬線6 1〜66， -18- 201244560 同樣可容易地製造配線板。 (其他實施形態） 本發明雖以上述實施形態所記載，然不應以所揭示之 部分論述及圖面來限定本發明。所屬技術領域者，當然可 從該揭示中採用各種替代之實施形態、實施例及運用技術 0 已論述之實施形態說明中，係以超音波熱壓著方式進 行打線，但亦可使用熱壓著方式或超音波方式等進行打線 。若採超音波方式，例如可使用鋁線，於室溫下進行接合 0 本發明實施形態之配線板，係爲中介板之一例，於絕 緣層1之厚度方向具有斜向延伸之貫穿配線lib〜16b， 其下端朝向外緣之寬度變寬；但，僅具有平行於絕緣層1 厚度方向之貫穿配線之配線板同樣可適用。 此外，上面說明了於絕緣層1之厚度方向平行延伸之 貫穿配線11a〜16a、及相對於絕緣層1之厚度方向斜向 延伸之貫穿配線lib〜16b:但，透過調整焊線之布局， 僅具有相對於絕緣層1厚度方向斜向延伸之貫穿配線之配 線板同樣可適用。例如圖22所示，如同貫穿配線1 1 b〜 1 6b，貫穿配線1 1 a〜1 6a亦相對於絕緣層1之厚度方向斜 向延伸者亦可。圖2 2所示之配線板’可如圖2 3所示’預 先將焊線1 1〜1 6會形成圖22貫穿配線1 1 a〜1 6a的部分 ，予以斜向形成，即可製得。 -19- 201244560 由上可知，本發明當然包含本說明書中未記載之各種 實施形態等。是故，本發明之技術範圔，僅受到上述說明 而得出之妥適申請專利範圍中之發明限縮事項所限制。 【圖式簡單說明】 [圖1 ]本發明實施形態之配線板其中一例的剖面圖。 [圖2]本發明實施形態之配線板予以部分放大後之剖 面圖。 [圖3]本發明實施形態之配線板，其貫穿配線布局其 中一例之立體圖。 [圖4]本發明實施形態之配線板，裝配電子元{牛彳轰之 電子裝置其中一例之剖面圖。 [圖5 ]本發明實施形態之配線板之製造方法，說明# 中一例之製程剖面圖。 [圖6]本發明實施形態之配線板之製造方法，&，續0 5說明其中一例之製程剖面圖。 [圖7]本發明實施形態之配線板之製造方法，_說日月# 中一例之剖面圖* [圖8]本發明實施形態之配線板之製造方法，_ % # 焊線布局其中一例之上視圖〃 [圖9]本發明實施形態之配線板之製造方法，、沿_ ffl 6說明其中一例之製程剖面圖。 [圖1 0]本發明實施形態之配線板之製造方法，沿續H 9說明其中一例之製程剖面圖。 -20- 201244560 [圖1 1 ]本發明實施形態之配線板之製造方法，沿續陶 1 〇說明其中一例之製程剖面圖。 [圖1 2]本發明實施形態之第1變形例，其配線板之製 造方法其中一例之製程剖面圖。 [圖13]本發明實施形態之第2變形例，其配線板其中 一例之剖面圖。 [圖14]本發明實施形態之第2變形例，其配線板之製 造方法其中一例之製程剖面圖。 [圖1 5]本發明實施形態之第3變形例，其配線板其中 一例之剖面圖。 [圖1 6]本發明實施形態之第4變形例，其配線板之製 造方法其中一例之製程剖面圖。 [圖1 7]本發明實施形態之第4變形例，沿續圖1 6說 明配線板之製造方法其中一例之製程剖面圖。 [圖1 8]本發明實施形態之第4變形例，沿續圖1 7說 明配線板之製造方法其中一例之製程剖面圖。 [圖19]本發明實施形態之第5變形例，其配線板之製 造方法其中一例之製程剖面圖。 [圖20]本發明實施形態之第5變形例，沿續圖19說 明配線板之製造方法其中一例之製程剖面圖。 [圖2 1 ]本發明實施形態之第5變形例，沿續圖2〇說 明配線板之製造方法其中一例之製程剖面圖。 [圖22]本發明其他實施形態，其配線板其中一例之剖 面圖。 -21 - 201244560 [圖23]本發明其他實施形態，說明其配線板之製造方 法其中一例之製程剖面圖。 【主要元件符號說明】 1 :絕緣層 2a〜21 :上面側焊墊 3 a〜3 1 :下面側焊墊 4、4x :支持基板 1 〇 :配線板 1 1 〜1 6、1 1 X、1 1 y :焊線 11a〜16a、lib〜16b:貫穿配線 20、 30 :電子元件 21、 3 1 :基體 22、 32 :電極 4 1 a〜4 11 :突起 42a〜421:柱狀凸塊 5 1 a〜5 11 :貫穿孔 6 1〜6 6 :金屬線 71、 72 :凸塊 73、 74、 76、 77:防焊漆 75、78 :底部塡充膠 1 1 1 :第1接合部 1 1 2 :球狀部 1 1 3 :第1配線部 -22- 201244560 1 1 4 :第2接合部 1 1 5 :第2配線部 -23-201244560 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a wiring board for assembling electronic components and a method of manufacturing the same. [Prior Art] With the miniaturization and multi-function of electronic equipment, the electronic components assembled in the machine are also moving toward miniaturization and high integration. In the case where the electronic components respectively mounted on the both sides of the wiring board (substrate) are electrically connected, 'when the types of electronic components to be assembled are different, the arrangement of the electrodes required for each electronic component is different, and the surface wiring must also correspond to the electrodes. Configuration. However, in order to avoid a short circuit or an electronic signal interference between the surface wirings, it is necessary to reserve a certain interval between the surface wirings, which causes an increase in the occupation area of the surface wiring on the surface of the wiring board, resulting in a more limited configuration of the electronic components. In addition, if the surface wiring is too long, there may be problems such as signal delay or deterioration of high frequency characteristics. In addition, other electronic components respectively mounted on both sides of the wiring board are electrically connected, and it is known that the terminal pitch of one side of the wiring board is wider than that of the other surface, and the substrate is made of glass or the like. The oblique micropores are provided by a tool such as a laser, and a conductive material is filled in the micropores to form a through wiring substrate (interposer) obliquely penetrating the wiring (for example, Patent Document 1). However, in this method, micropores are required to be placed on the substrate by means of a laser or the like, so that it is difficult to form the through wiring of -5 - 201244560. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. 2006-3033 60. SUMMARY OF THE INVENTION An object of the present invention is to provide a wiring board and a method of manufacturing the same, such that electrons mounted on both sides of a wiring board Throughout the components, through wirings can be easily formed for electrical connection. [Means for Solving the Problems] One aspect of the present invention provides a wiring board including an insulating layer, and a through wiring, which is formed of a metal wire and has a first end portion and a second end portion, and an end surface of the first end portion The height is substantially the same as the height of the upper surface of the insulating layer, and the height of the end surface of the second end portion substantially coincides with the height of the lower surface of the insulating layer. Another aspect of the present invention provides a wiring board including an insulating layer, and a through wiring including a metal wire, and having a first end portion and a second end portion, and an end surface height of the first end portion and an upper surface height of the insulating layer Generally, the end faces of the second end portions are located on the same plane as the side faces of the insulating layer. Another aspect of the present invention provides a method of manufacturing a wiring board, comprising: forming a curved metal line on a support substrate, wherein two ends of the metal line are connected to the support substrate; and the support substrate is In the process of the upper edge layer, the insulating layer covers at least one of the metal wires to remove a portion of the metal wires to cut the metal wires to form a wiring, and the through wiring has a first end portion and a second end portion The height of the end face of the portion is higher than the upper surface of the insulating layer, the second end portion is in contact with the upper surface of the support substrate; and the process of supporting the substrate. Another aspect of the present invention is a method for manufacturing a wiring board, which supports a process of forming a curved metal line on a substrate, the gold end is in contact with the support substrate, and the insulating layer is covered by the process of the upper edge layer of the support substrate. At least one of the metal wires is removed to form an uppermost portion of the process metal wire forming the through wiring, and the first end portion of the exposed uppermost portion is routed through the first end portion, and the both ends are used as the third end of the through wiring. And the process of removing the aforementioned supporting substrate. Another aspect of the present invention provides a method for manufacturing a wiring board, which supports a process of forming a metal line on a substrate, wherein the metal wire supports a first end portion of the substrate that is in contact with the upper surface thereof, and the metal wire and the upper surface of the substrate extend in different directions. And the process of forming the insulating layer on the support substrate, the insulating layer covering the metal wire to: and removing a portion of the metal wire to form an end surface height of the second end portion of the through wiring having the through wiring, and the above-mentioned surface The height is roughly the same; and the process of removing the aforementioned supporting substrate is performed. Forming a permanent portion; and forming a pair of end portions, the degree of which is substantially removed, and includes a portion formed on both sides of the genus line; and the second portion is included in the upper surface of the support A part of the process, the edge layer is 201244560. [Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings. In the case of the same or similar parts, the same or the number is marked. However, it should be noted that the drawings are all models, and the thickness and the relationship of the thickness of each layer are different from the actual ones. Therefore, the degree or size should be judged after considering the following instructions. Moreover, the drawings have the same dimensions and proportions, and also include the different parts. The embodiments shown below are used to exemplify the device or method having the technical idea of the present invention. The technical idea defined by the material, the shape, the structure, the configuration, and the like can be variously added to the patent application (the structure of the wiring board). As shown in FIG. 1, the wiring board of the embodiment of the present invention includes: and the through wiring 1 1 a to 1 6 a, 1 1 b to 1 6 b, the metal has a first end (upper end) and a second end (lower end), and the height of the end face of the portion is substantially the same as the height of the upper surface of the insulating layer 1, and the end face The height is substantially the same as the height of the lower surface of the insulating layer 1; and the upper 2a to 21, and the upper and lower side pads 3a to 31b of the through wirings 11a to 16a, lib to 16b are connected to the lower ends of the through wirings 11a to 16a. In the embodiment of the present invention, the term "metal wire" refers to a metal member which is previously formed in a line shape before being wrapped by the insulating layer 1 by a filament or a columnar bump. The following figures are similar to the specific thickness of the surface dimensions. The present invention is modified. The insulating layer is composed of a wire, and the surface-side pad end of the first end 2 is connected; 1 1 b 〜1 6 b The wire, the gold around it -8 - 201244560 The insulating layer 1 ' can have, for example, 50 μm A thickness of ~1 mm or so. The material of the insulating layer 1 may be an epoxy resin or an inorganic material, and is not particularly limited as long as it is an insulating material. The through wirings 11a to 16a' lib to 16b may have, for example, a wire diameter of about 20 μm to 1 0 0 μηι. Through the wiring!丨a~丨6 3,!丨b~丨6 b , for example, a wire made of a material such as gold (Au) or copper (Cu). The through wirings 1 1 a to 1 6 a extend in parallel in the thickness direction of the insulating layer 1. On the other hand, the through wirings 1 1 b to 1 6 b extend obliquely with respect to the thickness direction of the insulating layer 1. Thus, the through wirings 1 1 b to 16b are obliquely extended, and the multilayer wiring board is not required, and the electronic component can be connected to the single wiring board. The lower end of the through wirings 1 1 b to 1 6b may be wider toward the outer edge, and the lower ends of the through wirings lib to 16b may be arranged at equal intervals. In the case of a ball-grid array, in general, the grid-like positions are equally spaced, and at this time, the lower ends of the wirings 1 1 b to 16b are arranged at equal intervals, so that assembly can be performed efficiently. The paired through wires 1 1 a, 1 1 b are formed by cutting a wire. As shown in FIG. 2, the through wiring 1 1 a has a first joint portion 111 that connects the lower side pad 3 a , a spherical portion 上方 2 above the first joint portion 111 , and a first portion above the spherical portion 1 1 2 . Wiring part 1 1 3 . The first joint portion 1 1 1 , the spherical portion 1 1 2, and the first wiring portion 1 1 3 are integrally formed. On the other hand, the through wiring 1 1 b has the second bonding portion 1 1 4 that connects the lower side pad 3b and the second wiring portion 1 15 that is above the second bonding portion 1 14 . The second joint portion 1 1 4 and the second wiring portion 1 1 5 are integrally formed. The pair of through wirings 1 2a and 1 2b' shown in FIG. 1 are paired through wirings -9-201244560 13a, 13b', the pair of through wirings 14a and 14b, the pair of through wirings 15a and 15b, and the pair of through wirings 1 6 a and 1 6 b are formed by cutting a pair of through wires 1 1 a and 1 1 b respectively. The figure shown in Fig. 3 is an example of the layout of the plurality of through wirings 1 1 X disposed in the insulating layer 1 x . The upper ends of the wirings 1 1 X are arranged at equal intervals. Through the lower end of the wiring 1 1 X, the wider the gap is toward the outer edge. As the material of the upper side pads 2a to 2b and the lower side pads 3a to 31 shown in Fig. 1, copper (Cu) or the like can be used. The cross-sectional areas of the upper side pads 2a to 21 and the lower side pads 3a to 31 are larger than the cross-sectional areas of the upper and lower ends of the through wirings 1 ia to 16a ' lib to 16b. When electronic components are mounted on the upper and lower sides of the wiring board shown in Fig. 1, the electronic components having different terminal positions can be electrically connected through the upper side pads 2a to 21 and the lower side pads 3a to 31. The distance between the upper side pads 2a to 21 may be, for example, about 50 μm, and the distance between the lower side pads 3a to 31 may be, for example, about 150 μm. The distance between the upper side pads 2a to 21 and the lower side pads 3a to 31 can be appropriately adjusted depending on the thickness of the insulating layer 1 and the layout of the through wirings 11a to 16a and lib to 16b. The wiring board according to the embodiment of the present invention can be applied to an electronic device as shown in Fig. 4. The electronic device includes the wiring board 10 and the electronic component 20 mounted on the upper surface of the wiring board 10 by a flip chip method, and the electronic component 30 mounted on the lower surface of the wiring board 1 by a flip chip method. The electronic component 20 can be, for example, a 1C wafer having a substrate 21 and a plurality of electrodes 22 disposed between the substrate 2 1 and between the upper pads 2a 21 of the wiring board 1 They are connected by a plurality of -10- 201244560 bumps 71. The plurality of electrodes 22 of the electronic component 20 and a part of the surface of the upper pads 2a to 21 of the wiring board 1 are covered by the solder resists 73, 74, respectively. The plurality of electrodes 22 of the electronic component 20 and a portion of the upper pads 2a to 21 of the wiring board 1 are exposed to the plurality of bumps 71, respectively. The electronic component 20 and the wiring board 1 are sealed by a bottom adhesive 75. The electronic component 30 can be, for example, a motherboard having a base 31 and a plurality of electrodes 32 disposed on the base 31 and penetrating the lower pads 3a to 31 of the wiring board 10 The bumps 7 2 are connected separately. The lower surface pads 3a to 3 of the wiring board 1 and a part of the surface of the plurality of electrodes 32 of the electronic component 30 are covered by the solder resist 7 6 ' 7 7 , respectively. A part of the lower side pads 3a to 3 1 of the wiring board 1 and the plurality of electrodes 3 2 of the electronic component 30 are respectively connected to the plurality of bumps 72. Between the electronic component 30 and the wiring board 10, the bottom adhesive 78 is sealed. The electrode 22 of the electronic component 20 and the electrode 32 of the electronic component 30 are arranged at different positions and intervals. In addition, in FIG. 4, an electronic device in which a single-layer wiring board 1 is interposed between the electronic components 2 and 30 is described. However, depending on the position and interval of the electrodes of the electronic components, the layers between the electronic components may be used. A plurality of wiring boards are stacked. As described above, in the wiring board 10 according to the embodiment of the present invention, the electrodes 22 and 32 can be assembled to the wiring board 10 without using a multilayer wiring structure for the electronic components 20, 30' which are arranged at a high density and in a different layout. The electrodes 22, 32 of the electronic components 20, 30 on both sides are freely connected to each other. -11 - 201244560 Further, since the through wirings π a to 1 6a and 1 1 b to 1 6b formed by the bonding wires are used, the micropores are formed by tools such as lasers, and then electroplating or printing is performed. The through wiring which is filled with a conductive material in the fine pores can be surely turned on without the escape of air bubbles, and the reliability of the connection can be improved (manufacturing method of the wiring board). Next, using FIG. 5 to FIG. An example of a method of manufacturing a wiring board according to an embodiment of the present invention will be described. Further, the manufacturing method shown below is merely an example and is not particularly limited. The wiring board according to the embodiment of the present invention can be manufactured by various manufacturing methods. (―) As shown in Fig. 5, the plate-shaped support substrate 4 is prepared, which is a metal plate or a ruthenium substrate of a material such as stainless steel, and has rigidity and a thickness of about 5 Ομηι to 1 mm. In the embodiment of the present invention, a stainless steel plate having a thickness of 1 mm is used. The material of the support substrate 4 is not particularly limited as long as it can be wired in a subsequent process. Further, a metal layer such as copper (Cu), gold (Au) or nickel (Ni) may be deposited on the upper surface of the support substrate 4 by sputtering or the like. (2) Next, as shown in FIG. 6, the wire is formed by ultrasonic pressing or the like, and the bonding wires 1 1 to 16 made of curved copper (Cu) or gold (Au) are formed into, for example, wire diameter. It is about 20 μm, and the minimum pad pitch is about 5 Ομιη, and its both ends are connected to the support substrate 4. In the embodiment of the present invention, the "curved shape" includes a circular smooth curve and a shape in which a plurality of straight portions are bent. For example, when the bonding wire 11-12-201244560 is formed, as shown in Fig. 7, First, a gold ball is formed by a porcelain cap (not shown). Then, a gold ball is pressed by a porcelain nozzle on the support substrate 4, and the first joint portion 111 and the spherical portion 112 joined to the support substrate 4 are formed. Next, the porcelain nozzle is moved to form a ring-shaped first wiring portion 113 and a second wiring portion 115. Further, the support substrate 4 is pressed by a porcelain nozzle to form a second joint portion 1 1 4 joined to the support substrate 4. The gold line is then cut and a process cycle is ended. As shown in Fig. 8, an example of a layout in which a plurality of bonding wires lly are formed on the supporting substrate 4x is shown. When a plurality of bonding wires 1 1 y are formed, the longer the length is, the upper layer 〇 (3) is as shown in Fig. 9. On the upper surface of the supporting substrate 4, for example, a semi-hardened epoxy resin film having a thickness of about ημηι is used. The laminate was laminated at 100 〇c to cover the entire bonding wires 1 1 to 16 and was cured by heating at 180 ° C for 30 minutes to form an insulating layer 1. Other methods of forming the insulating layer 1 include a method of printing a polyimide varnish or the like, a method of forming a glass layer by a sol-gel method, and a green sheet of a semi-hardened state for a ceramic substrate. And the method of sintering at about 1 000 ° C, etc. The material ' of the insulating layer 1 may also be an inorganic material, and any insulating material is not particularly limited. (4) As shown in Fig. 10, the upper portion of the bonding wires 1 1 to i 6 and the upper portion of the insulating layer 1 are ground to a predetermined thickness by honing or the like, and the bonding wires 丨丨 to j 6 are each cut into two pieces. . In this way, the through wiring 1 1 a~! 6 a , lib ~ 16b' The height of the end face of the upper end is slightly larger than the height of the upper surface of the insulating layer I. The through wirings 11a to 16a' extend in parallel in the thickness direction of the insulating layer 1. The through wirings 1 1 b to 1 6b ' extend obliquely with respect to the thickness -13 - 201244560 of the insulating layer 1. The lower end of the through wiring 1 1 b~1 6b is spaced wider toward the outer edge, and the lower end can be equally spaced. (5) As shown in Fig. 11, the support substrate 4 is removed. If the lower ends of the wirings 11a to 16a and lib~16b are exposed, the upper side of the upper side pads are formed on the surface of the through-distribution 16a and 1 lb to 16b by means of copper (Cu) electricity or the like. The side pads 3 a to 31, the wiring board is completed. Further, as shown in FIG. 4, such as nickel (Ni) plating or gold (Au) plating, the upper side or the lower side of the surface side pads 2 a to 2 1 and the lower side pads 3 a to 3 1 may be applied. On both sides of the wiring board 10, the components 20 and 30 were formed by flip chip packaging, and an electronic device was manufactured. According to the method of manufacturing a wiring board according to the embodiment of the present invention, the bonding wires 11 to 16 are formed to penetrate the wirings iia to 16a, and the micropores are formed by a tool such as a laser, and then electroplated into the micropores. The through wiring for charging a conductive material is low, and the through wirings 1 la to 16a and 1 lb can be easily formed. Further, micropores are formed by a tool such as a laser, and then electrically or the like is formed in the micropores. In the method of charging a conductive material, there may be a bubble in the conductive material; however, according to the method for manufacturing a wire board according to the present invention, the pre-formed bonding wire 11 to be surely turned on, and a connection reliability is high. Wiring, lib 〜 16b 〇 In addition, the present invention is formed before the formation of the insulating layer 1, that is, 11 to 16, so that the through wirings 11a to 16a and lib to 16b can be formed one by one. Thereafter, as line 1 1 a~ 2a~21 and need to go up to below. In addition, if the assembly electronics is to wire 1 1 b~1 6b or print, the cost is “1 6 b 〇 plating or printing will be in the form of charging, so that it can be welded in 1 1 a to 1 6 a. In the case of the wire, the wire diameter and the shape are obtained in a uniform manner. (First Modification) Hereinafter, a first modification of the embodiment of the present invention will be described with another example of the method of manufacturing the wiring board. In the method of manufacturing the wiring board according to the first modification of the present invention, after the process of forming the bonding wires 11 to 16 shown in FIG. 6, the insulating layer 1 is formed on the upper surface of the supporting substrate 4 as shown in FIG. The predetermined thickness is such that the upper portions of the bonding wires 1 1 to 16 are exposed; the above is different from the method for manufacturing the wiring board according to the embodiment of the present invention. Thereafter, the bonding wires 1 1 to 16 are cut by honing or the like. Grinding to the same height as the upper surface of the insulating layer 1. Thus, the same structure as that of FIG. 10 can be obtained, and the process subsequent to the embodiment of the present invention is substantially the same as the process of the embodiment of the present invention, and the repeated description is omitted. 1 Modification, Manufacturing of Wiring Board Compared to Embodiment of the Present Invention The method of omitting the process of grinding a portion of the insulating layer 1 can easily form the through wirings 1 1 a to 1 6 a, 1 1 b to 1 6 b . Further, the insulating layer 1 is formed to a prescribed height and is not required The material of the insulating layer 1 can be saved by the grinding. (Second Modification) The wiring board according to the second modification of the embodiment of the present invention has a curved through wiring 1 1 and 1 4 as shown in FIG. The first end portion (upper end) and the second end portion and the third end portion (lower end), wherein the end surface of the first end portion is -15-201244560 degrees higher than the height of the upper surface of the insulating layer 1, and the second and third end portions are The height of the end face is substantially the same as the height of the lower surface of the insulating layer 1, and the branches are extended from the upper end in different directions. The above-mentioned points are different from the wiring board of the embodiment of the present invention. The upper ends of the wirings 1 and 14 are elliptical. The upper side pads 2m and 2n which are connected to the through wirings 11 and 14 are disposed on the upper surface of the insulating layer 1. The rest of the configuration is substantially the same as that of the wiring board according to the embodiment of the present invention, and the description thereof will not be repeated. Wiring board, there are branching wiring between electronic components In the case of the wiring board which is a second modification of the embodiment of the present invention, the insulating layer 1 is formed as shown in FIG. The thickness is such that the uppermost portion of the bonding wires 1 1 and 14 is exposed, and then the upper portion of the bonding wires 丨丨 to j 6 is ground to the same height as the insulating layer 1 by honing or the like. After the insulating layer 1 is formed to cover the entire bonding wires 1 1 to 16 , a portion of the insulating layer 1 and a part of the bonding wires 11 to 16 are removed until the bonding wires 11 and 14 are not cut into two heights. (Third Modification) The wiring board according to the third modification of the embodiment of the present invention has an end surface of the end portions of the through wirings 1 3 b and 16 6 as shown in Fig. 15 and is substantially flush with the side surface of the insulating layer 1 The above is different from the wiring board of the embodiment of the present invention. Side surface pads 3m, 3n connected to the ends of the wiring layers 3b, 16b, -16 - 201244560, are disposed on the side surface of the insulating layer 1. In the method of manufacturing the wiring board according to the third modification of the embodiment of the present invention, the support substrate 4 shown in FIG. 10 is removed as shown in FIG. 11, and then the insulating layer 1 is ground by grinding or the like. A part of the outer edges of the wirings 11a to 16a and ilb to i6b exposes the through wirings 13b and 16b from the side surface of the insulating layer 1. Thereafter, the side surface side pads 3 m and 3 n connected to the through wirings 1 3 b and 16 b may be formed by plating or the like. (Fourth Modification) In the fourth modification of the embodiment of the present invention, the columnar bump method is not used as the wiring board, and the columnar bump method is used as an example of the method of manufacturing the wiring board. In the method of manufacturing the wiring board according to the fourth modification of the embodiment of the present invention, after the support substrate 4 is prepared as shown in FIG. 5, as shown in FIG. 16, the protrusion 41a is formed on the support substrate 4 by the stud bump method. Columnar bumps 42a to 421 of 411. The metal wires extending in different directions are formed by the projections 41a to 411 and the columnar bumps 42a to 421' with respect to the upper surface of the support substrate 4. Next, as shown in Fig. 17, an insulating layer 1' having a predetermined height is formed on the upper surface of the supporting substrate 4 to cover a part of the projections 41a to 411. Thereafter, as shown in Fig. 18, the portions of the projections 41a to 41b are ground to the same height as the upper surface of the insulating layer 1 by honing or the like. Alternatively, instead of using the procedures of Figs. 17 and 18, the insulating layer 1 may be formed to cover the entire projections 4ia to 411, and a part of the projections 41a to 411 and a part of the insulating layer 1 may be removed. In the method of manufacturing a wiring board according to a fourth modification of the embodiment of the present invention, the wiring board can be easily manufactured even when the columnar bump method is used without using a wire. At this time, compared with the case where a pair of through wires are cut to form a pair of through wires, it is possible to form an odd number of through wires, and the through wires can be individually arranged, so that the flexibility of the arrangement is greater. (Fifth Modification) A fifth modification of the embodiment of the present invention is an example of a method of manufacturing a wiring board by using a wire which is prepared in advance without using a wire. In the method of manufacturing the wiring board according to the fifth modification of the embodiment of the present invention, after the support substrate 4 is prepared as shown in FIG. 5, as shown in FIG. 19, the through holes 51a to 511 are formed on the support substrate 4 by etching or the like. . As shown in FIG. 20, the metal wires 61 to 66 such as gold (Au), copper (Cu), or aluminum (A1) prepared in advance are flexed and inserted into the through holes 51a to 511, and then as shown in FIG. The insulating layer 1 is formed on the upper surface of the support substrate 4, and a part of the metal lines 6 1 to 6 6 is exposed. Thereafter, a part of the metal wires 6 1 to 66 is ground to the same height as the upper surface of the insulating layer 1 by honing or the like; or the insulating layer 1 may be formed to cover the entire metal wires 6 1 to 66, and then the metal wires are formed. A part of 6 1 to 66 and a part of the insulating layer 1 may be removed. Thereafter, the support substrate 4 is removed, and at the same time, a part of the metal wires 61 to 66 protruding under the insulating layer 1 is ground by honing or the like. According to the method of manufacturing a wiring board according to the fifth modification of the embodiment of the present invention, the wiring board can be easily manufactured by using the pre-made metal wires 6 1 to 66, -18 to 201244560 without using the wire bonding. (Other Embodiments) The present invention has been described in the above embodiments, and the present invention should not be limited by the description and the drawings. It will be apparent to those skilled in the art that various alternative embodiments, embodiments, and operational techniques have been used in the disclosure. In the description of the embodiments discussed above, the ultrasonic welding is performed by ultrasonic compression, but it is also possible to use hot pressing. Wire the line in the way or in the ultrasonic mode. In the case of the ultrasonic method, for example, an aluminum wire can be used and the bonding is performed at room temperature. The wiring board according to the embodiment of the present invention is an example of an interposer, and has a diagonally extending through wiring lib~ in the thickness direction of the insulating layer 1. 16b, the lower end thereof is widened toward the outer edge; however, a wiring board having only the through wiring parallel to the thickness direction of the insulating layer 1 is also applicable. Further, the above-described through wirings 11a to 16a extending in the thickness direction of the insulating layer 1 and the through wirings lib to 16b extending obliquely with respect to the thickness direction of the insulating layer 1 have been described. However, by adjusting the layout of the bonding wires, only A wiring board having a through wiring extending obliquely with respect to the thickness direction of the insulating layer 1 is also applicable. For example, as shown in Fig. 22, the through wirings 1 1 a to 16a may extend obliquely with respect to the thickness direction of the insulating layer 1 as in the through wirings 1 1 b to 16 b. The wiring board shown in FIG. 2 can be formed by forming the portions of the wirings 1 1 a to 16a of FIG. 22 in advance by forming the bonding wires 1 1 to 16 6 as shown in FIG. . -19- 201244560 As apparent from the above, the present invention naturally includes various embodiments and the like which are not described in the present specification. Therefore, the technical scope of the present invention is limited only by the limitations of the invention in the scope of the Applicable Patent Application. BRIEF DESCRIPTION OF THE DRAWINGS [FIG. 1] A cross-sectional view showing an example of a wiring board according to an embodiment of the present invention. Fig. 2 is a partially enlarged cross-sectional view showing a wiring board according to an embodiment of the present invention. Fig. 3 is a perspective view showing an example of a wiring board according to an embodiment of the present invention. Fig. 4 is a cross-sectional view showing an example of an electronic device in which an electronic component {牛彳轰" is mounted on a wiring board according to an embodiment of the present invention. Fig. 5 is a cross-sectional view showing a process of manufacturing a wiring board according to an embodiment of the present invention. Fig. 6 is a cross-sectional view showing a process of manufacturing a wiring board according to an embodiment of the present invention, and hereinafter. Fig. 7 is a cross-sectional view showing an example of a wiring board according to an embodiment of the present invention, and Fig. 8 is a view showing a method of manufacturing a wiring board according to an embodiment of the present invention, and _% # [FIG. 9] A method of manufacturing a wiring board according to an embodiment of the present invention, and a process sectional view of an example thereof will be described along _ffl 6. [Fig. 10] A method of manufacturing a wiring board according to an embodiment of the present invention, and a process sectional view of an example thereof will be described hereinafter. -20- 201244560 [Fig. 1 1] A method of manufacturing a wiring board according to an embodiment of the present invention, and a cross-sectional view showing an example of the process will be described. Fig. 1 is a cross-sectional view showing an example of a method of manufacturing a wiring board according to a first modification of the embodiment of the present invention. Fig. 13 is a cross-sectional view showing an example of a wiring board according to a second modification of the embodiment of the present invention. Fig. 14 is a cross-sectional view showing an example of a method of manufacturing a wiring board according to a second modification of the embodiment of the present invention. Fig. 15 is a cross-sectional view showing an example of a wiring board according to a third modification of the embodiment of the present invention. Fig. 16 is a cross-sectional view showing an example of a method of manufacturing a wiring board according to a fourth modification of the embodiment of the present invention. Fig. 17 is a cross-sectional view showing an example of a method of manufacturing a wiring board according to a fourth modification of the embodiment of the present invention. Fig. 18 is a cross-sectional view showing an example of a method of manufacturing a wiring board according to a fourth modification of the embodiment of the present invention. Fig. 19 is a cross-sectional view showing an example of a method of manufacturing a wiring board according to a fifth modification of the embodiment of the present invention. Fig. 20 is a cross-sectional view showing an example of a method of manufacturing a wiring board according to a fifth modification of the embodiment of the present invention. Fig. 21 is a cross-sectional view showing an example of a method of manufacturing a wiring board according to a fifth modification of the embodiment of the present invention. Fig. 22 is a cross-sectional view showing an example of a wiring board according to another embodiment of the present invention. [21] Fig. 23 is a cross-sectional view showing a process of an example of a method of manufacturing a wiring board according to another embodiment of the present invention. [Main component symbol description] 1 : Insulation layers 2a to 21: upper side pads 3 a to 3 1 : lower side pads 4, 4x : support substrate 1 〇: wiring boards 1 1 to 1 6 , 1 1 X, 1 1 y : bonding wires 11a to 16a, lib to 16b: through wirings 20, 30: electronic components 21, 3 1 : base 22, 32: electrodes 4 1 a to 4 11 : projections 42a to 421: columnar bumps 5 1 a to 5 11 : through holes 6 1 to 6 6 : metal wires 71 , 72 : bumps 73 , 74 , 76 , 77 : solder resist paint 75 , 78 : bottom 塡 glue 1 1 1 : first joint portion 1 1 2 : Spherical portion 1 1 3 : First wiring portion -22- 201244560 1 1 4 : Second joint portion 1 1 5 : Second wiring portion -23-