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TW201233548A - Matte finish polyimide films and methods relating thereto - Google Patents

Matte finish polyimide films and methods relating thereto Download PDF

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Publication number
TW201233548A
TW201233548A TW100105149A TW100105149A TW201233548A TW 201233548 A TW201233548 A TW 201233548A TW 100105149 A TW100105149 A TW 100105149A TW 100105149 A TW100105149 A TW 100105149A TW 201233548 A TW201233548 A TW 201233548A
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Taiwan
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base film
film
weight percent
dianhydride
polyimine
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TW100105149A
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Chinese (zh)
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TWI432321B (en
Inventor
Thomas Edward Carney
Jeffrey Michael Bartolin
Meredith L Dunbar
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Du Pont
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Priority claimed from PCT/US2011/024745 external-priority patent/WO2012011970A1/en
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Publication of TWI432321B publication Critical patent/TWI432321B/en

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Abstract

The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.

Description

201233548 六、發明說明: 【發明所屬之技術領域】 本發明係關於消光表面處理之基膜(matte finish base films),其可用於覆蓋(cover丨ay)之應用並且具有優異的介 電與光學性質。更特定的是,本發明之該消光表面處理基 膜包含一相對低濃度的顏料與消光劑於一聚醯亞胺膜中, 該聚醯亞胺膜係藉由化學(相對於熱程序)轉化程序而經醯 亞胺化。 【先前技術】 概括而言,覆蓋(coverlayS)已知用於作為保護電子材料 之阻隔膜,例如用於保護撓性印刷電路板、電子零件、積 體電路封裝的導線架及類似者。然而,人們對於更加薄化 且成本更低之覆蓋仍有需求,而且不但需要具有可接受之 電氣性質(例如介電強度),而且還需具有可接受的結構與 光學性質’以對於受該覆蓋所保護的電子零件提供安全防 護’避免不必要的目視檢查與破壞。 【發明内容】 本發明係關於一基膜。該基膜係包含一經化學轉化之聚 醢亞胺’其量為該基膜之71至96重量百分比。該經化學轉 化之聚醯亞胺係衍生自:i.至少50莫耳百分比之芳族二 酐’此係基於該聚醯亞胺之總二酐含量,以及u至少5〇莫 耳百分比之芳族二胺,此係基於該聚醯亞胺之總二胺含 量。該基膜進一步包含:一低傳導度碳黑’其存在量為該 基膜之2至9重量百分比;以及一消光劑,其: 154225.doc201233548 VI. Description of the Invention: [Technical Field] The present invention relates to matte finish base films which can be used for cover and have excellent dielectric and optical properties. . More specifically, the matte surface treatment base film of the present invention comprises a relatively low concentration of a pigment and a matting agent in a polyimine film which is converted by chemical (relative to thermal procedures). The procedure is imidized by hydrazine. [Prior Art] In summary, coverlays are known as barrier films for protecting electronic materials, such as lead frames for protecting flexible printed circuit boards, electronic parts, integrated circuit packages, and the like. However, there is still a need for a thinner and less costly coverage, and not only requires acceptable electrical properties (e.g., dielectric strength), but also acceptable structural and optical properties to provide for coverage. Protected electronic parts provide safety protection 'avoid unnecessary visual inspection and damage. SUMMARY OF THE INVENTION The present invention is directed to a base film. The base film comprises a chemically converted polyimine in an amount of from 71 to 96% by weight of the base film. The chemically converted polyimide is derived from: i. at least 50 mole percent of aromatic dianhydride' based on the total dianhydride content of the polyimine, and at least 5 mole percent of the aromatic Group diamines, based on the total diamine content of the polyimine. The base film further comprises: a low conductivity carbon black 'which is present in an amount of from 2 to 9 weight percent of the base film; and a matting agent: 154225.doc

S 201233548 a_存在量為該基膜之1.6至10重量百分比、 b.具有中值粒徑為1.3至10微米,以及 c·具有密度為2至4.5 g/cc。 在一實施例中’該基膜具有:L厚度為8至152微米; 11.60度光澤值(6〇 degree gi〇ss vaiue)為 2至 35 ; iii.光學密 度為大於或等於2 ;以及iv.介電強度為大於1400 V/mil。本 發明亦關於覆蓋膜’其包含該基膜並結合一黏著層。 本發明亦關於一基膜,其包括: Α· 一經化學轉化之聚醯亞胺,其量為該基膜之40至90 重量百分比’該經化學轉化之聚酿亞胺係衍生自: a. 以該聚酿亞胺之二酐總量計算,至少5〇莫耳百 分比之芳香族二酐,以及 b. 以該聚醯亞胺之二胺總量計算,至少5〇莫耳百 分比之芳香族二胺; Β· 一填料,除碳黑及顏料之外,其量為該基膜的1〇至 60重I百分比;且其中該基膜的厚度是從8至152微 米。 【實施方式】 定義 如本文中所用者,術語「包含」 —/、力」义凡 何/、匕’欠型均旨在涵蓋非排他性的包括。例如,當—方 法私序、物件或設傷包含一元件清單時,並不 限於該些清軍上之异# 疋僅偈 70件’而是可包括其他非明示列出 件或該等方法、經庆 勺疋 私序、物件或設備所固有的元件◎再者, J54225.doc 201233548 除非另行說明,㈣「或」係指涵括性的或而非排他性的 或。例如,以下任何一種情況均滿足條件A或B : A為真 (或存在)且B為偽(或不存在)、A為偽(或不存在)且B為真 (或存在)以及A與B皆為真(或存在)。 又’使用「-」或「一個」來猫述本發明的元件和組 件。這樣做僅僅是為了方便,並且對本發明提供一般性的 意義。除非很明顯地另指他意,這種描述應被理解為包括 一個或至少一個,並且該單數也同時包括複數。 本文中所用的「二針」係意指包括其前驅物或衍生物, 其在技術上可非為二酐但與二胺反應以形成聚醯胺酸 (polyamic acid)’此酸可接著經轉化為聚醯亞胺。 本文中所料「二胺」係意指包括其前驅物或衍生物, 其在技術上可非為二胺但與二酐反應以形成聚醯胺酸,此 酸可接著經轉化為聚醯亞胺。 本文中所用的「聚醯胺酸」係意指包括任何聚醯亞胺前 驅物材料,其衍生自二酐與二胺單體或其官能性等效物的 組合,並且能夠經由化學轉化程序而轉化為聚醯亞胺。 本文中所用的「預聚合物」係意指稱相對低分子量之聚 醯胺酸溶液,該溶液係使用在化學計量為過量的二胺來製 備,以得到黏度為約50-100泊(Poise)的溶液。 本文中所用的「化學轉化」或「經化學轉化」代表使用 催化劑(加速劑)或脫水劑(或兩者皆用)來轉化該聚醯胺酸 為聚醢亞胺,並且係意指包括經部分化學轉化之聚醯亞 胺’而後其在高溫乾燥至固體程度為大於98〇/〇。 154225.doc 201233548 本文中所用的「轉化化學品」或「醯亞胺化化學品」代 表能夠將聚醯胺酸轉化成聚醯亞胺的催化劑(加速劑)及/或 能夠將聚醯胺酸轉化成聚醯亞胺的脫水劑。 本文中的「完成溶液(Finishing s〇luti〇n)」代表於極性 非質子性溶劑中的二酐,其係加入預聚合物溶液中以增加 分子置與黏度。所用之二酐通常與用於製造該預聚合物之 二酐相同(或者使用多於一種時,可為該相同二酐中之其 一)。 々當指定含量、濃度、或其他數值或參數為-範圍、較佳 範圍、或上較佳值與下較佳值之列舉時,應將其理解為特 定揭露由任何範m較録與任何錢下限或較佳值 之任何配對所形成之所有範圍,無論該些範圍是否分別揭 路。右本文中敘述-數值範圍,除非另有說明,該範圍音 欲包括該範圍之端點與其内之所有整數與分數。本發明: 範轉並u欲限定^義—範料所_之特定值。 在描述一些聚合物時’應理解申請人有時係以用於製造 該些聚合物之單體,或用於製造該些聚合物之單體旦: 指稱該些聚合物。雖然此— 里朿 聚合物之較命名,或可不包括料料該最終 —語,但是任何=等:定產物―― 為該聚合物係由該些單 :二::提及應解讀 暗示。 除非内文中另有指明或 明,並非用以限制本發明二管=性質’除非特別說 用類似或等效於本文所 154225.doc 201233548 述的方法或材料來實施或測試本發明,然本文所敘者為適 當的方法及材料。 基膜 本發明之基膜包含經填充之聚醯亞胺基質,其中該聚醯 亞胺係由化學轉化程序所創造。化學轉化程序之一個優點 (相較於單獨的熱轉化程序而言)為達到足夠低光澤之必要 的消光劑量,相較於若使用熱轉化程序者,係至少低於其 之10、20、30、40或50百分比。普遍接受之60度光澤值 為: <10 平光(flat) 〇 /肖光㈣站切)、絲光(satin)、半光(semi-gloss)(使用各種術語) >7〇 光澤(glossy) 〇 在某些貫施例中,該基膜具有60度光澤值為介於且選擇 性地包括任何下列兩者:2、3、4、5、1 〇、15、2〇、25、 30與35。在某些實施例中,該基膜具有6〇度光澤值為2至 35。在某些實施例中,該基膜具有6〇度光澤值為⑺至”。 該60度光澤值係使用Micro_TRI_G1〇ss光澤計測得。使用較 少量的消光劑(藉助於該化學轉化而能製成)有其優點,因 為此:i·降低整體成本;ii.簡化消光劑分散至該聚醯胺酸 (或其他聚醯亞胺前驅物材料)的程序;以及iu使所生成之 基膜具有較佳機械性質(例如較低之脆度)。化學轉化程序 之另一個優點(相較於單獨的熱轉化程序而言)為該經化學 轉化之基膜的介電強度較高。在某些實施例中,該基膜之 154225.doc 201233548 介電強度係大於 1400 V/mil (55 V/micron)。 在某些實施例中,該經化學轉化之聚醯亞胺係藉由將聚 醯胺酸溶液與一能夠將聚醯胺酸轉化成聚醯亞胺的催化劑 或脫水劑混合的步驟所製成。在另一實施例中,該經化學 轉化之聚醯亞胺係藉由將聚醯胺酸溶液與一能夠將聚醯胺 酸轉化成聚醯亞胺的催化劑或脫水劑混合的步驟所製成。 在化學轉化程序中,該聚醯胺酸溶液係浸潰於或混合於轉 化(縫亞胺化(imidization))化學品。在一實施例中,該轉化 化學品為三級胺催化劑(加速劑)與酐脫水材料。在一實施 例中’該酐脫水材料為乙酐,其常在相對於該聚醯胺酸中 之醯胺酸(amide acid)基團以莫耳過量使用,每當量聚醯胺 酸通常為約1.2至2.4莫耳。在一實施例中,係使用相當量 之三級胺催化劑。 作為該酐脫水材料之乙酐的替代物包括:丨·其他脂族 酐’例如丙酸酐、丁酸酐、戊酸酐與其混合物;π.芳族單 羧酸之酐;iii_脂族酐與芳族酐之混合物;iv碳二亞胺 (carbodimides);以及V.脂族烯酮(烯酮可視為極度脫水之 酸所衍生之羧酸酐)。 在一貫施例中,該三級胺催化劑為。比咬與3 _甲基石比咬 (beta-picoline),並且其用量通常類似於酐脫水材料之莫耳 數。可使用更低或更咼的量,此係取決於所欲之轉化率與 所用之催化劑。亦可使用具有與該„比咬約略相同之活性的 三級胺以及貝他曱《比啶。這些三級胺包括2_曱基吡咬 (alpha picoline) ; 3,4-二甲吡啶;3,5_二曱吡啶;4_甲基吼 154225.doc 201233548 啶;4-異丙基吼啶;N,N_:甲基苄基胺;異喹啉;4苄基 吡啶、N,N-二曱基十二胺、三乙基胺與類似者。用於醯亞 胺化之其他不同催化劑在該項技術領域中為習知技術,例 如咪《坐’並且可根據本發明而使用。 該轉化化學品通常在約室溫或高於室溫進行反應,以將 聚醯胺酸轉化為聚醯亞胺。在一實施例中,該化學轉化係 發生在溫度1 5 C至12〇t,並且該反應在較高溫度為非常 快速而在較低溫度為相對較慢。 在一實施例中,該經化學處理之聚醯胺酸溶液可鏵型或 擠型至經加熱之轉化表面或基板上》在一實施例中,該經 化學處理之聚醯胺酸溶液可鑄型於帶或鼓上。該溶劑可由 該溶液中蒸發出來,並且該聚醯胺酸可局部經化學轉化為 聚醯亞胺。所生成之溶液而後成為聚醯胺酸_聚醯亞胺膠 體之型態。或者,該聚醢胺酸溶液可擠型至轉化化學品之 浴中,該轉化化學品浴係由酐組分(脫水劑)、三級胺組分 (催化劑)或上述兩者所組成,具有或不具有稀釋溶劑。在 上述任一情況、係形成膠膜,並且醢胺酸基團成為醯亞胺 基團之轉化百分比是取決於接觸時間與溫度,但通常為約 完成10至75百分比。為了固化至固體程度大於98%,該膠 膜通书必須在咼溫(由約2〇〇°C ’最高達約550°C )乾燥,如 此會使该醯亞胺化趨於完全完成。在某些實施例中,較佳 為同時使用脫水劑與催化劑,以利於膠膜之形成並達到所 欲之轉化率。 儘管該膠膜具有高溶劑含量,但其仍傾向於能夠自我支 154225.docS 201233548 a_ is present in an amount of from 1.6 to 10% by weight of the base film, b. has a median diameter of from 1.3 to 10 μm, and c· has a density of from 2 to 4.5 g/cc. In one embodiment, the base film has: L thickness of 8 to 152 microns; 11.60 degree gloss value (6°degree gi〇ss vaiue) of 2 to 35; iii. Optical density of 2 or more; and iv. The dielectric strength is greater than 1400 V/mil. The present invention also relates to a cover film which comprises the base film and incorporates an adhesive layer. The invention also relates to a base film comprising: 一· a chemically converted polyimine in an amount of from 40 to 90% by weight of the base film. The chemically converted poly nitrite is derived from: a. Calculating an aromatic dianhydride of at least 5 mole percent, based on the total amount of the dianhydride of the brewed imine, and b. an aromatic of at least 5 mole percent based on the total amount of the diamine of the polyimine Diamine; Β· A filler, in addition to carbon black and pigment, is present in an amount of from 1 to 60 weight percent of the base film; and wherein the base film has a thickness of from 8 to 152 microns. [Embodiment] Definitions As used herein, the term "comprising" - /, force" is intended to cover non-exclusive inclusions. For example, when the method private order, object, or injury contains a list of components, it is not limited to the difference of the number of the squadrons, but may include other non-express list or methods. Elements that are inherent to the order, object, or equipment. □ J54225.doc 201233548 Unless otherwise stated, (4) “or” means a stipulated or non-exclusive OR. For example, any of the following cases satisfies condition A or B: A is true (or exists) and B is pseudo (or non-existent), A is pseudo (or non-existent) and B is true (or exists) and A and B All are true (or exist). Also, "-" or "one" is used to describe the elements and components of the present invention. This is done for convenience only and provides a general meaning to the invention. This description should be understood to include one or at least one, and the singular also includes the plural. As used herein, "two-needle" is meant to include a precursor or derivative thereof which is technically not a dianhydride but reacts with a diamine to form a polyamic acid which can be subsequently converted. It is a polyimine. As used herein, "diamine" is meant to include a precursor or derivative thereof which is technically not a diamine but which is reacted with a dianhydride to form a poly-proline which can then be converted to a polyruthenium. amine. As used herein, "polylysine" is meant to include any polyamidiamine precursor material derived from a combination of a dianhydride and a diamine monomer or a functional equivalent thereof, and capable of undergoing a chemical conversion procedure. Converted to polyimine. As used herein, "prepolymer" is intended to mean a relatively low molecular weight polyamic acid solution prepared using a stoichiometric excess of diamine to give a viscosity of from about 50 to about 100 poise. Solution. As used herein, "chemical conversion" or "chemical conversion" means the use of a catalyst (accelerator) or a dehydrating agent (or both) to convert the polyamic acid to a polyimine, and is meant to include Part of the chemically converted polyimine' is then dried at elevated temperatures to a degree of solidity greater than 98 Å/〇. 154225.doc 201233548 As used herein, "transformation chemical" or "deuterated chemical" means a catalyst (accelerator) capable of converting polyplycine to polyimine and/or capable of polylysine A dehydrating agent that is converted to a polyimine. As used herein, "Finishing s〇luti〇n" means a dianhydride in a polar aprotic solvent which is added to the prepolymer solution to increase molecular weight and viscosity. The dianhydride used is usually the same as the dianhydride used to make the prepolymer (or one of the same dianhydrides may be used when more than one is used). When a specified content, concentration, or other value or parameter is recited as a range, a preferred range, or an upper preferred value and a lower preferred value, it should be construed as a specific disclosure by any All ranges formed by any pairing of lower or preferred values, whether or not the ranges are separately disclosed. The scope of the present invention is to be understood as being limited to the singular range of the range and the integers and fractions thereof. The present invention: Fan Zhuan and u want to define the specific value of the meaning of the formula. In describing some polymers, it is understood that the applicant sometimes uses the monomers used to make the polymers, or the monomers used to make the polymers: Refer to the polymers. Although this is the name of the polymer, or may not include the final term of the material, any = etc.: the product - the polymer is from the list: two:: mention should be interpreted. Unless otherwise indicated or indicated in the text, it is not intended to limit the present invention to the nature of the invention, unless otherwise specifically described or equivalent to the method or material described in the 154 225. doc 201233548. The speaker is the appropriate method and material. Base Film The base film of the present invention comprises a filled polyimine matrix, wherein the polyimine is created by a chemical conversion procedure. One advantage of the chemical conversion procedure (compared to the separate thermal conversion procedure) is that the amount of matting required to achieve a sufficiently low gloss is at least 10, 20, 30 lower than if the thermal conversion procedure is used. , 40 or 50 percent. The generally accepted 60-degree gloss value is: <10 flat (〇) 肖/ 肖光(四)站切), mercin (satin), semi-gloss (using various terms) >7〇 gloss (glossy) In some embodiments, the base film has a 60 degree gloss value between and optionally including any of the following: 2, 3, 4, 5, 1 〇, 15, 2 〇, 25, 30 and 35. In certain embodiments, the base film has a 6-degree gloss value of 2 to 35. In certain embodiments, the base film has a 6-degree gloss value of (7) to ". The 60-degree gloss value is measured using a Micro_TRI_G1 〇ss gloss meter. A smaller amount of matting agent is used (by means of the chemical conversion Made) has its advantages because it: i. reduces the overall cost; ii. simplifies the process of dispersing the matting agent to the poly-proline (or other polyimide precursor material); and iu makes the base film formed Has better mechanical properties (eg, lower brittleness). Another advantage of the chemical conversion procedure (compared to the separate thermal conversion procedure) is that the chemically converted base film has a higher dielectric strength. In some embodiments, the base film has a dielectric strength of 154225.doc 201233548 of greater than 1400 V/mil (55 V/micron). In certain embodiments, the chemically converted polyimine is polymerized The proline solution is prepared by a step of mixing a catalyst or a dehydrating agent capable of converting polyproline to polyimine. In another embodiment, the chemically converted polyimine is by Poly-proline solution and one capable of converting poly-proline into poly The step of mixing the amine catalyst or dehydrating agent. In the chemical conversion procedure, the polyamic acid solution is impregnated or mixed with a conversion (imidization) chemical. In one embodiment The conversion chemistry is a tertiary amine catalyst (accelerator) and an anhydride dehydration material. In one embodiment, the anhydride dehydration material is acetic anhydride, which is often in the amide relative to the poly phthalic acid. The acid) group is used in molar excess, typically from about 1.2 to 2.4 moles per equivalent of polyamic acid. In one embodiment, a comparable amount of tertiary amine catalyst is used. Acetic anhydride as the anhydride dehydration material Alternatives include: 丨·other aliphatic anhydrides such as propionic anhydride, butyric anhydride, valeric anhydride and mixtures thereof; π. aromatic monocarboxylic acid anhydrides; iii_ mixture of aliphatic anhydrides and aromatic anhydrides; iv carbodiimides (carbodimides); and V. aliphatic ketene (the ketene can be regarded as a carboxylic anhydride derived from an extremely dehydrated acid). In a consistent application, the tertiary amine catalyst is a bite than a 3 _methyl stone bite. (beta-picoline), and its amount is usually similar to the anhydride dehydration material The amount of lower or higher enthalpy may be used depending on the desired conversion rate and the catalyst used. It is also possible to use a tertiary amine having a slightly the same activity as the singular bite and a beta pyridine. . These tertiary amines include 2_mercaptoline; 3,4-dimethylpyridine; 3,5-dipyridinium; 4-methyloxime 154225.doc 201233548 pyridine; 4-isopropyl acridine N, N_: methylbenzylamine; isoquinoline; 4 benzylpyridine, N,N-didecyldodecylamine, triethylamine and the like. Other different catalysts for the ruthenium imidization are well known in the art, such as the "sitting' and can be used in accordance with the present invention. The conversion chemistry is typically carried out at about room temperature or above to convert the polyproline to the polyimine. In one embodiment, the chemical conversion occurs at a temperature of 15 C to 12 Torr, and the reaction is very fast at higher temperatures and relatively slow at lower temperatures. In one embodiment, the chemically treated polyamic acid solution can be sputum-type or extruded onto a heated conversion surface or substrate. In one embodiment, the chemically-treated polyamic acid solution can be cast. Type on the belt or drum. The solvent can be evaporated from the solution and the polyamic acid can be locally chemically converted to polyimine. The resulting solution is then in the form of a polylysine-polyimine colloid. Alternatively, the polyamic acid solution can be extruded into a bath of a conversion chemical consisting of an anhydride component (dehydrating agent), a tertiary amine component (catalyst), or both. Or no dilution solvent. In either case, the film is formed and the percentage of conversion of the guanamine group to the quinone group is dependent on the contact time and temperature, but is typically about 10 to 75 percent complete. In order to cure to a solids level of greater than 98%, the film must be dried at a temperature of from about 2 °C to up to about 550 °C, thus tending to complete the hydrazine imidization. In certain embodiments, it is preferred to use both a dehydrating agent and a catalyst to facilitate the formation of the film and achieve the desired conversion. Although the film has a high solvent content, it still tends to be able to self-support 154225.doc

S 201233548 撐(seif-supp〇rting)。通常接著乾燥該膠膜以去除水、殘留 溶劑與剩餘轉化化學品,並且在此程序中該聚醯胺酸係基 本上完全轉化為聚醯亞胺(即大於98%醯亞胺化)。該乾燥 可在相對溫和之條件下進行,而無須在此時使聚醯胺 全轉化為聚醯亞胺,或者該乾燥與轉化可使用較高之溫度 而同時進行。 因為該膠體含有許多須在乾燥與轉化步驟中去除的液 體,該膠體在乾燥時通常須加以限制以避免不期望的收 縮。在連續製造時’該基膜可在其邊緣予以固持,例如在 拉幅框(福er frame)中、使用拉幅夹或拉幅針以進行限 制。 可使用短時間的高溫來乾燥該基膜並且誘發進_步的酿 亞胺化,以在相同步驟中將該膠膜轉化為聚醯亞胺基膜。 在一實施例中,該基膜係加熱至溫度為2〇〇它至55〇它。一 般來說’與厚膜比較,薄膜需要較少的加熱與時間。 在該等乾燥與轉化(由聚醯胺酸轉化為聚醯亞胺)期間, 該基膜可加以限制以避免過度收縮,並且實際上可將其拉 伸至高達其初始尺寸的150百分比。製備膜時,可以長度 方向或寬度方向或兩者拉伸。若有需要,可調整限制程度 以容許有限度的收縮。 本發明之經化學轉化基膜的另一優點為兩側皆為消光, 即使其係鑄型於光滑表面上亦然。若該基膜之兩側皆為消 光,可在該基膜之任一側施用任何額外之層。有別於上述 情況’當同樣填充有聚醯亞胺前驅物之膜係僅經熱轉化, 154225.doc 201233548 該鑄型側傾向為光澤而該向空氣 並鑄型於光滑表面上時 側傾向為消光。 又-優點為經化學轉化之基膜具有較高介電強度,此係 相較於僅經熱轉化之基膜。典型地,該介電強度隨著消光 劑量的增加而減少所以在僅使用熱程序者中其雖然可 藉由增加消光劑量而達成低的60度光澤值(僅向空氣側), 但是其介電強度亦減少。 在一實施例中,該聚醯胺酸係由下列程序而製成,藉由 /合解,力略同莫耳數量之二酐與二胺於溶劑中,並且在經調 控之溫度條件攪拌所生成之溶液,直到該二酐與該二胺之 聚合完成。典型地,使單體之一者(通常為二胺)稍微過量 用以初始控制分子量與黏度,而後可經由額外少量的不足 單體而使分子量與黏度增加。適用於本發明之聚醯亞胺的 二酐實例包括芳族二酐、脂族二酐與其混合物。在一實施 例中’該芳族二酐係選自由下列所組成之群組: 焦蜜石酸二酐; 3,3,4,4 -聯苯四竣酸二肝(tetracarb〇Xy】ic dianhydride); 3,3',4,4'-二苯基嗣四叛酸二酐; 4,4 -氧基一狄酸奸(oxydiphthalic anhydride); 3,3 ,4,4 一本基礙四叛酸二針; 2,2-雙(3,4-二叛基苯基)六氟丙烧(2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane); 雙酚A二酐;以及 其混合物與衍生物。 154225.doc 12S 201233548 support (seif-supp〇rting). The film is typically dried to remove water, residual solvent and residual conversion chemicals, and in this procedure the polyamine acid is substantially completely converted to polyimine (i.e., greater than 98% quinone imidization). The drying can be carried out under relatively mild conditions without the need to completely convert the polyamidamine to polyimine at this point, or the drying and conversion can be carried out simultaneously using a higher temperature. Because the colloid contains a number of liquids that must be removed during the drying and conversion steps, the colloids typically must be limited during drying to avoid undesired shrinkage. The base film can be held at its edges during continuous manufacture, for example in a tent frame, using a tenter clip or a tenter pin to limit it. The base film can be dried using a short time of high temperature and the imidization of the film can be induced to convert the film into a polyimide film in the same step. In one embodiment, the base film is heated to a temperature of from 2 Torr to 55 Torr. In general, films require less heating and time than thick films. During such drying and conversion (conversion from polyglycolic acid to polyimine), the base film can be limited to avoid excessive shrinkage and can actually be stretched up to 150 percent of its original size. When the film is prepared, it may be stretched in the length direction or the width direction or both. If necessary, adjust the limit to allow for limited shrinkage. Another advantage of the chemically-transformed base film of the present invention is that both sides are matt, even if it is cast on a smooth surface. If both sides of the base film are matted, any additional layers can be applied to either side of the base film. Different from the above situation, when the film system which is also filled with the polyimide precursor is only thermally converted, 154225.doc 201233548, the side of the mold tends to be luster, and when the air is cast on a smooth surface, the side tends to be extinction. Again - the advantage is that the chemically converted base film has a higher dielectric strength than the base film which is only thermally converted. Typically, the dielectric strength decreases with increasing matting dose so that in a person using only thermal procedures, although a low 60 degree gloss value (only to the air side) can be achieved by increasing the matting dose, the dielectric is dielectric The intensity is also reduced. In one embodiment, the polyamic acid is prepared by the following procedure, with a molar amount of dianhydride and diamine in a solvent, and stirred under controlled temperature conditions. The resulting solution is until the polymerization of the dianhydride and the diamine is complete. Typically, one of the monomers (usually a diamine) is used in a slight excess to initially control molecular weight and viscosity, and then the molecular weight and viscosity can be increased via an additional small amount of insufficient monomer. Examples of the dianhydride suitable for the polyimine of the present invention include aromatic dianhydrides, aliphatic dianhydrides, and mixtures thereof. In one embodiment, the aromatic dianhydride is selected from the group consisting of: pyromellitic dianhydride; 3,3,4,4-diphenyltetracarboxylic acid (tetracarb® Xy) ic dianhydride 3,3',4,4'-diphenylphosphonium tetracarboxylic acid dianhydride; 4,4-oxy oxydiphthalic anhydride; 3,3,4,4 Two-needle; 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane; bisphenol A dianhydride; and mixtures and derivatives thereof Things. 154225.doc 12

S 201233548 在另一實施例中S 201233548 in another embodiment

該芳族二酐係選自由下列所組成之群 2,3,6,7-萘四竣酸二酐; 1,2,5,6-萘四竣酸二酐; 2,2',3,3'-聯苯四羧酸二酐; 又(3,4-—缓苯基)丙烧二奸; 雙(3,4-二缓基苯基)$風二奸; 3,4,9,1〇-茈四羧酸二酐; 1’1又(2,3-一緩基笨基)乙烧二軒; 1’1又(3,4-一叛基苯基)乙烧二軒; 雙(2,3-二缓基苯基)曱烧二酐; 雙(3,4-二羧基苯基)甲烷二酐; 氧基二酞酸二酐; 雙(3,4-二羧基苯基)砜二酐; 其混合物與衍生物。 脂族二酐之實例包括: 丁燒二針; ⑽,5Κ*,6δ*]-3-氡雜雙環并[3.21]辛仏冬二明 3-(四氫呋喃_2,5_二酮); ’、 其混合物。 族二胺與其混合物< 下列所組成之群組: 3,4'-氧基二苯胺; — 、4 π 伤二胺 在一實施例中,兮芸娃_ 这方族一胺係選 I54225.doc -13· 201233548 1,3-雙-(4-胺基苯氧基)苯; 4,4'-氧基二苯胺; 1,4-二胺基苯; 1,3-二胺基苯; 2,2’-雙(三氟曱基)聯苯胺(2,2'-bis(trifluoromethyl) benzidene); 4,4'-二胺基聯苯; 4,4'-二胺基二苯基硫醚; 9,9’·雙(4-胺基)氟; 其混合物與衍生物。 在另一實施例中,該芳族二胺係選自由下列所組成之群 組: 4,4'-二胺基二苯基丙烷; 4,4'-二胺基二苯基甲烷; 聯苯胺; 3,3’-二氣聯苯胺; 3,3’-二胺基二苯基砜; 4,4'-二胺基二苯基砜; 1,5-二胺基萘; 4,4'-二胺基二苯基二乙基矽烷; 4,4’-二胺基二苯基矽烷; 4,4'-二胺基二苯基乙基膦氧化物(4,4·-diamino diphenyl ethyl phosphine oxide); 4,4·-二胺基二苯基N-甲基胺; 154225.doc -14-The aromatic dianhydride is selected from the group consisting of 2,3,6,7-naphthalene tetraphthalic acid dianhydride; 1,2,5,6-naphthalene tetraphthalic acid dianhydride; 2,2',3, 3'-biphenyltetracarboxylic dianhydride; (3,4-diphenyl)propanol; bis(3,4-di-hydroxyphenyl)$ wind traitor; 3,4,9, 1〇-茈tetracarboxylic dianhydride; 1'1 (2,3-a slow-base stupid) E-baked two-neck; 1'1 (3,4--re- phenyl) Ethylene; Bis(2,3-dibuylphenyl) sulfonated dianhydride; bis(3,4-dicarboxyphenyl)methane dianhydride; oxydiphthalic acid dianhydride; bis(3,4-dicarboxyphenyl) Sulfone dianhydride; mixtures and derivatives thereof. Examples of aliphatic dianhydrides include: Dingzhu two needles; (10), 5Κ*, 6δ*]-3-indole bicyclo[3.21] Xindong Dongming-3(tetrahydrofuran-2,5-dione); , a mixture thereof. Group of diamines and mixtures thereof < group consisting of: 3,4'-oxydiphenylamine; - 4 π saponin in one embodiment, 兮芸 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Doc -13· 201233548 1,3-bis-(4-aminophenoxy)benzene; 4,4'-oxydiphenylamine; 1,4-diaminobenzene; 1,3-diaminobenzene; 2,2'-bis(trifluoromethyl)benzidine; 2,4'-diaminobiphenyl; 4,4'-diaminodiphenylsulfide Ether; 9,9'-bis(4-amino)fluoro; mixtures and derivatives thereof. In another embodiment, the aromatic diamine is selected from the group consisting of: 4,4'-diaminodiphenylpropane; 4,4'-diaminodiphenylmethane; benzidine 3,3'-di-cyclobenzidine; 3,3'-diaminodiphenyl sulfone; 4,4'-diaminodiphenyl sulfone; 1,5-diaminonaphthalene; 4,4' -diaminodiphenyldiethyldecane; 4,4'-diaminodiphenylnonane; 4,4'-diaminodiphenylethylphosphine oxide (4,4·-diamino diphenyl ethyl Phosphine oxide); 4,4·-diaminodiphenyl N-methylamine; 154225.doc -14-

S 201233548 4,4'-二胺基二苯基N—苯基胺; 1,4-—胺基苯(對伸苯二胺); 1,2_—胺基苯; 其^合物與衍生物。 合適之脂族二胺實例包括: 六亞甲基二胺、 十一烧二胺、 環己燒二胺; 及其混合物。 在一貫施例中,該經化學轉化之聚醯亞胺係衍生自焦蜜 石酸二酐(「PMDA」)與4,4·_氧基二苯胺(「4,4 〇DA」)。 在-實施例中,本發明之該聚臨亞胺為共聚酿亞胺 (cop〇iyimides),其係衍生自任何上述之二胺與二酐。在― 實施例中,該共㈣亞胺係衍生自15至85莫耳%的聯笨四 羧酸二酐、15至85莫耳%的焦蜜石酸二酐、30至100莫耳0/〇 的對伸苯二胺並選擇性地包括〇至7〇莫耳%的4,4,_二胺基二 苯基醚與/或4,4,-二胺基二苯基醚。該等共聚醯亞胺係進一 步描述於美國專利第4,778,872號與美國專利第5,ι66,3〇8 號。 ’ 在一實施例令,該聚醯亞胺二酐組分為焦蜜石酸二酐 (「PMDA」)並且該聚醯亞胺二胺組分為4,4,-氧基二苯胺 (「4,4 ODA」)與對伸苯二胺(「ppD」)之組合。在一實施 例中’ s亥聚醯亞胺二酐組分為焦蜜石酸二酐(「PMDA j ) 並且該聚醯亞胺二胺組分為4〆1-氧基二苯胺(「4,4 154225.doc 15 201233548 ODA」)與對伸苯二胺(「PPD」)之組合,其中〇DA與PPD (ODA:PPD)之比例係為任何下列莫耳比例:〗20至80: 80 至 20 ; ii. 50至 70:50至 30 ;或 in· 55至 65: 45至 35。在一實 施例中,該聚醯亞胺二酐組分為PMDA,並且該二胺組分 係ODA比PPD(ODA:PPD)之莫耳比例為約6〇:4〇。 在一實施例中,該聚醯亞胺二酐組分為3,3i,4,4i_聯苯四 羧酸二酐(「BPDA」)並且該聚醯亞胺二胺組分為4,4,_氧基 二苯胺(「4,4 ODA」)與對伸苯二胺(r PPDj )之組合。在 貫施例中’該聚酿亞胺二酐組分為BPDA並且該聚醯亞 胺二胺組分為4,4 ODA與PPD之組合’其中〇DA與ppD (ODA:PPD)之比例係為任何下列莫耳比例:丨2〇至8〇: 8〇 至 20 ; ii. 50 至 70:50 至 30 ;或 iii. 55 至 65:45 至 35。在一實 施例中’該聚醯亞胺二酐組分為BPDA,並且該二胺組分 係ODA比PPD之莫耳比例(〇da:PPD)為約60:40。 在一實施例中,該聚醯胺酸溶劑必須能溶解該聚合反應 物之一者或兩者,並且在一實施例中,能溶解該聚醯胺酸 聚合產物。溶劑應對於所有聚合反應物與聚醯胺酸聚合產 物幾乎不具反應性。 在一實施例中,該聚醯胺酸溶劑為液態Ν,Ν·二烷基羧醯 胺(N’N-chalkylcarboxylamide),例如低分子量綾醯胺,特 別是n,n-二曱基曱醯胺與N,N_二乙基乙醯胺。此類溶劑之 其他可用化合物為N,N-二乙基曱醯胺與Ν,Ν·二乙基乙醯 胺。其他可用之溶劑為環丁颯、Ν_甲基_2“比略相、四 甲基脲、二曱基砜與類似者。該些溶劑可單獨使用或與其 154225.doc 201233548 他溶劑組合使用。溶劑用量之較佳範圍為該聚醯胺酸之75 至90重量百分比。 聚醯胺酸溶液一般為將二胺溶解於乾燥溶劑並於攪動與 控溫之惰氣環境緩慢加入二酐形成。 顏料 實際上在實施本發明時,可以使用任何顏料(或顏料之 組合)。在某些實施例中,可用之顏料包括但不限於下 列:鋇檸檬黃(Barium Lemon Yellow)、編择檬黃(Cadmium Yellow Lemon)、淺锅黃(Cadmium Yellow Light)、中锡黃 (Cadmium Yellow Middle)、橘鎘黃(Cadmium Yellow Orange)、鮮紅(Scarlet Lake)、鎘紅(Cadmium Red)、鎘朱 红(Cadmium Vermilion)、暗紅(Alizarin Crimson)、耐久紫 红(Permanent Magenta)、凡戴克棕(Van Dyke brown)、茶 黃帶綠(Raw Umber Greenish)或暗茶(Burnt Umber)。在某 些貫施例中’可用之黑色顏料包括:氧化姑(c〇balt oxide)、Fe-Mn-Bi 黑、Fe-Mn氧化物尖晶石黑(Fe-Mn oxide spinel black)、(Fe,Mn)203黑、銅鉻鐵礦黑尖晶石(copper chromite black spinel)、燈黑(lampblack)、骨黑(bone black)、骨灰(bone ash)、骨炭(b〇ne char)、赤鐵礦 (hematite)、黑色氧化鐵、雲母狀氧化鐵、黑色錯合無機 色料(CICP)、CuCr204 黑、(Ni,Mn,Co)(Cr,Fe)204 黑、苯胺 黑、茈黑、蒽酿黑、絡綠黑赤鐵礦、鉻鐵氧化物、顏料綠 17、顏料黑26、顏料黑27、顏料黑28、顏料棕29、顏料黑 30、顏料黑32、顏料黑33或其混合物。 154225.doc 17· 201233548 在某些實施例中,係使用低傳導度碳黑。該低傳導度碳 黑之量與該基膜之厚度通常會影響光學密度。若該低傳導 度碳黑之裝载程度過高’即使已使用低傳導度碳黑,該基 膜仍將具傳導性。若太低,則該基膜可能無法達到所欲之 光學密度與顏色。使用該低傳導度碳黑於本發明中之目 的’係賦予該基膜黑色並且達到所欲之光學密度,該基膜 具有厚度介於且選擇性地包括下列任兩者:8、、15、 20、25、30、35、40、45、50、60、70、80、90、1〇〇、 110、120、130、140與152微米。在某些實施例中,該基 膜厚度為由8至152微米。在某些實施例中,該基膜厚度為 由8至127微米。在又一實施例中,該基膜厚度為由1〇至4〇 微米。低傳導度碳黑意指槽型黑(channel type black)或爐 黑。在某些實施例中,骨黑可用以賦予黑色。在一實施例 中,该低傳導度碳黑之存在量係介於且選擇性地包括下列 任兩者:該基膜之2、3、4、5、6、7、8與9重量百分比。 在某些實施例中,該光學密度(不透明度)理想為(例如將導 體圖形隱藏於該撓性電路中以避免被看見)大於或等於2。 光學密度為2意指1 X 1 〇_2或1 %的光可通過該基膜。 在某些實施例令,該低傳導度碳黑為表面經氧化之碳 黑。评估表面氧化(指碳黑)程度的一個方法為測量該碳黑 的揮發物含量。此揮發物含量之測量,可藉由在950〇C煅 燒7分鐘後計算重量損失而得到。一般而言,表面經高度 氧化之碳黑(高揮發物含量)可輕易分散於聚醯胺酸溶液(聚 醯亞胺前驅物)中,其接著可經醯亞胺化為本發明之(分散 154225.docS 201233548 4,4'-diaminodiphenyl N-phenylamine; 1,4-aminobenzene (p-phenylenediamine); 1,2_-aminobenzene; its compounds and derivatives . Examples of suitable aliphatic diamines include: hexamethylenediamine, eleven-diamine, cyclohexene diamine; and mixtures thereof. In a consistent embodiment, the chemically converted polyimide is derived from pyromellitic dianhydride ("PMDA") and 4,4-dioxydiphenylamine ("4,4 〇DA"). In an embodiment, the polylinimide of the present invention is a cop〇iyimides derived from any of the above-described diamines and dianhydrides. In an embodiment, the co-(i)imide is derived from 15 to 85 mole % of biphenyl tetracarboxylic dianhydride, 15 to 85 mole % of pyruvate dianhydride, 30 to 100 moles of 0/ The p-phenylenediamine of hydrazine and optionally 4,4,-diaminodiphenyl ether and/or 4,4,-diaminodiphenyl ether having a hydrazine to 7 〇 mol%. Such copolyimines are further described in U.S. Patent No. 4,778,872 and U.S. Patent No. 5, ι 66, No. 3, No. 8. In one embodiment, the polyamidiamine dianhydride component is pyromellitic dianhydride ("PMDA") and the polyamidimide diamine component is 4,4,-oxydiphenylamine (" 4,4 ODA") in combination with p-phenylenediamine ("ppD"). In one embodiment, the component is a pyromellitic dianhydride ("PMDA j ) and the polyamidiamine diamine component is 4 〆 1-oxydiphenylamine ("4 , 4 154225.doc 15 201233548 ODA") in combination with p-phenylenediamine ("PPD"), where the ratio of 〇DA to PPD (ODA:PPD) is any of the following molar ratios: 〖20 to 80: 80 To 20; ii. 50 to 70:50 to 30; or in 55 to 65: 45 to 35. In one embodiment, the polyamidiamine dianhydride component is PMDA and the molar ratio of the diamine component to ODA to PPD (ODA:PPD) is about 6 〇:4 〇. In one embodiment, the polyamidiamine dianhydride component is 3,3i, 4,4i-biphenyltetracarboxylic dianhydride ("BPDA") and the polyamidimide diamine component is 4,4 , _oxydiphenylamine ("4,4 ODA") and p-phenylenediamine (r PPDj ) combination. In the examples, the polyacrylonitrile dianhydride component is BPDA and the polyamidimide diamine component is a combination of 4,4 ODA and PPD, wherein the ratio of 〇DA to ppD (ODA:PPD) is For any of the following molar ratios: 丨2〇 to 8〇: 8〇 to 20; ii. 50 to 70:50 to 30; or iii.55 to 65:45 to 35. In one embodiment, the polyamidiamine dianhydride component is BPDA, and the diamine component has an ODA to PPD molar ratio (〇da:PPD) of about 60:40. In one embodiment, the polylysine solvent must be capable of dissolving one or both of the polymerization reactants, and in one embodiment, is capable of dissolving the polyglycolic acid polymerization product. The solvent should be almost non-reactive with all polymeric reactants and polyglycolic acid polymerization products. In one embodiment, the polylysine solvent is a liquid hydrazine, N'N-chalkylcarboxylamide, such as a low molecular weight guanamine, particularly n, n-diindenyl hydrazine. Amine with N,N-diethylacetamide. Other useful compounds for such solvents are N,N-diethylguanamine and hydrazine, hydrazine diethylamine. Other solvents which may be used are cyclobutyl hydrazine, hydrazine-methyl-2 "pyrophase, tetramethylurea, dimercaptosulfone and the like. These solvents may be used alone or in combination with their solvents 154225.doc 201233548. The solvent is preferably used in an amount ranging from 75 to 90% by weight of the polyamic acid. The polyaminic acid solution is generally formed by dissolving the diamine in a dry solvent and slowly adding a dianhydride in an inert gas atmosphere of agitation and temperature control. In practice, any pigment (or combination of pigments) may be used in the practice of the invention. In certain embodiments, useful pigments include, but are not limited to, the following: Barium Lemon Yellow, Calmium Yellow Lemon), Cadmium Yellow Light, Cadmium Yellow Middle, Cadmium Yellow Orange, Scarlet Lake, Cadmium Red, Cadmium Vermilion , Alizarin Crimson, Permanent Magenta, Van Dyke brown, Raw Umber Greenish or Burnt Umber. In some examples The black pigments used include: c〇balt oxide, Fe-Mn-Bi black, Fe-Mn oxide spinel black, (Fe, Mn) 203 black, copper chromium Copper chromite black spinel, lampblack, bone black, bone ash, bone char (b〇ne char), hematite, black iron oxide , mica-like iron oxide, black miscellaneous inorganic pigment (CICP), CuCr204 black, (Ni, Mn, Co) (Cr, Fe) 204 black, aniline black, black, black, green and black hematite , ferrochrome oxide, pigment green 17, pigment black 26, pigment black 27, pigment black 28, pigment brown 29, pigment black 30, pigment black 32, pigment black 33 or mixtures thereof. 154225.doc 17· 201233548 in certain In the examples, a low conductivity carbon black is used. The amount of the low conductivity carbon black and the thickness of the base film generally affect the optical density. If the low conductivity carbon black is loaded too high, even if it has been used low Conductivity carbon black, the base film will still be conductive. If it is too low, the base film may not reach the desired optical density and color. The low conductivity carbon black is used in the present invention to impart a black color to the base film and achieve a desired optical density, the base film having a thickness between and optionally including any of the following: 8, 15, 20 25, 30, 35, 40, 45, 50, 60, 70, 80, 90, 1 〇〇, 110, 120, 130, 140 and 152 microns. In certain embodiments, the base film thickness is from 8 to 152 microns. In certain embodiments, the base film has a thickness of from 8 to 127 microns. In still another embodiment, the base film has a thickness of from 1 Å to 4 Å. Low conductivity carbon black means channel type black or furnace black. In certain embodiments, bone black can be used to impart black color. In one embodiment, the low conductivity carbon black is present in an amount and optionally comprises any two of: 2, 3, 4, 5, 6, 7, 8, and 9 weight percent of the base film. In some embodiments, the optical density (opacity) is desirably (e.g., concealing the conductor pattern in the flex circuit to avoid being seen) greater than or equal to two. An optical density of 2 means that 1 X 1 〇 2 or 1% of light can pass through the base film. In some embodiments, the low conductivity carbon black is a surface oxidized carbon black. One method of assessing the extent of surface oxidation (referred to as carbon black) is to measure the volatile content of the carbon black. The measurement of the volatile content can be obtained by calculating the weight loss after calcination at 950 ° C for 7 minutes. In general, the highly oxidized carbon black (high volatile content) of the surface can be easily dispersed in a poly-proline solution (polyimine precursor), which can then be imidized into the present invention (dispersed) 154225.doc

S -18- 201233548 良好的)經填充聚醯亞胺之基質聚合物。一般認為若該碳 黑顆粒(聚集體)未彼此接觸,則電子穿隧、電子跳躍 (ectron hopping)或其他電子流動機制通常會受到抑制, 造成低電導度。在某些實施例中,該低傳導度碳黑具有揮 發物含量為大於或等於1%β在某些實施例中’該低傳導 f碳黑具有揮發物含量為大於或等於5、9或13%。在某些 貫施例中,爐黑可經表面處理以増加該揮發物含量。 、均勻分散的分離個別顆粒(聚集體)不但降低該導電度, 並且傾向於產生均句的顏色強度。在某些實施例中,該低 傳導度碳黑係經研磨。在某些實施例中,該傳導度碳里之 平均粒徑係介於(且選擇性地包括)下列任兩者:〇.2、 H 〇·4 ' 〇·5、〇·6、〇 7、〇 8、〇 9與】〇微米。該基膜之 尽度可針對特定應用而加以調整。 在某—只靶例中’可使用染料。可用之染料實例為(但 不限於)苯胺黑(nigr〇sin blaek)、單偶氮鉻錯合黑(m〇n咖 ch_lum complex black)或其混合物。在某些實施例中, 可使用染料與顏料之混合物。 消光劑 聚合物材料通常本身即具有表面光澤。要控制光澤⑺ :而產生消光表面特徵)’有各式可能之添加方法以達 先澤與低光澤表面特徵。概括而言,該些添加方法皆 之基礎物理經改質之表面,其(在微觀 =鍵與不規則形狀’因而使較少的光能被反 (例如大於50公分)的颧臾去 .^ ^ '丁、者。§夕道光線擊令光澤之表面 154225.doc 201233548 時,大多數的光以相同角度反射,因而可觀察到相對較高 程度之光反射率。當相同之光源擊中消光(即不規則)表面 時’該光係被散射至許多不同方向並且亦有較高比例被吸 收。因此在粗糙表面,光傾向於擴散地散射至所有方向, 並且其影像形成品質大幅下降(反射出來的物體不再呈現 清晰而是模糊)。 用於特徵化一特定表面之光澤程度的光澤計係基於相同 原理。一般而言,光源以一固定角度擊中表面,而反射後 之光反射量係由光電池所讀取。可在多個角度讀取反射。 元美光澤表面之最大光澤表現(Maximum gi〇ss performance)傾向顯現為100%反射,而完全無光澤表面則 傾向顯現為0%反射。 二氧化矽為無機顆粒並可經磨碎及過濾至特定粒徑範 圍。二氧化矽之非常不規則形狀或孔隙度與低成本使其成 為普遍的消光劑《其他可能的消光劑可包括:L其他陶 瓷,例如硼化物、氮化物、碳化物與其他氧化物(例如氧 化鋁、氧化鈦等);以及Π.有機顆粒,前提是該有機顆粒 能夠承受處理經化學轉化聚醯亞胺時的溫度(處理溫度為 由約250°C至約550t,取決於所選擇的特定聚醯亞胺程 序)。可用於聚醯亞胺應用之消光劑(可承受聚醯亞胺合成 之熱條件)為聚醯亞胺顆粒。 消光劑的量、中值粒徑及密度須足以產生所欲之6〇度光 澤值。在某些實施例中,該基膜之6〇度光澤值係介於且選 擇性地包括下列任兩者:2、5、1〇、15、2〇、25、3〇與 154225.docS -18- 201233548 Good) Polyimide-filled matrix polymer. It is generally believed that if the carbon black particles (aggregates) are not in contact with each other, electron tunneling, ectron hopping or other electron flow mechanisms are generally suppressed, resulting in low electrical conductivity. In certain embodiments, the low conductivity carbon black has a volatile content of greater than or equal to 1% beta. In certain embodiments, the low conductivity f carbon black has a volatile content greater than or equal to 5, 9, or 13. %. In some embodiments, the furnace black may be surface treated to increase the volatile content. The uniform dispersion of individual particles (aggregates) not only reduces the conductivity, but also tends to produce a uniform color intensity. In certain embodiments, the low conductivity carbon black is ground. In certain embodiments, the average particle size of the conductivity carbon is between (and optionally includes) any two of the following: 〇.2, H 〇·4 ' 〇·5, 〇·6, 〇7 , 〇 8, 〇 9 and 〇 〇 micron. The base film can be adjusted for a specific application. A dye can be used in a certain target. Examples of useful dyes are, but are not limited to, nigr〇sin blaek, mono- chrome-chromic black (m〇n coffee ch_lum complex black), or mixtures thereof. In certain embodiments, a mixture of dye and pigment can be used. Matting Agents Polymeric materials generally have a surface gloss in their own right. To control gloss (7): to produce matte surface features) there are various possible ways to add surface and low gloss surface features. In a nutshell, these addition methods are based on the physical surface of the modified surface, which (in microscopic = key and irregular shape ' thus causes less light energy to be reversed (eg greater than 50 cm). ^ ^ 'Ding, the person. § The light of the shinning surface 154225.doc 201233548, most of the light is reflected at the same angle, so a relatively high degree of light reflectivity can be observed. When the same light source hits the extinction (ie irregular) surface when the light system is scattered to many different directions and also has a higher proportion of absorption. Therefore, on rough surfaces, light tends to diffusely scatter to all directions, and its image formation quality is greatly reduced (reflection The resulting object is no longer clear but blurred.) The gloss meter used to characterize the gloss of a particular surface is based on the same principle. In general, the light source hits the surface at a fixed angle, and the reflected light reflects It is read by photocells and can be read at multiple angles. Maximum gi〇ss performance tends to appear as 100% reflection, but no Glossy surfaces tend to appear as 0% reflection. Ceria is an inorganic particle that can be ground and filtered to a specific particle size range. The very irregular shape or porosity and low cost of cerium oxide make it a common matting agent. "Other possible matting agents may include: L other ceramics such as borides, nitrides, carbides and other oxides (eg, alumina, titanium oxide, etc.); and cerium. Organic particles, provided that the organic particles are capable of withstanding treatment The temperature at which the polyimine is chemically converted (the treatment temperature is from about 250 ° C to about 550 t, depending on the particular polyimine procedure selected). It can be used as a matting agent for polyimine applications (acceptable poly The thermal condition for the synthesis of the quinone imine is a polyimine particle. The amount, median particle size and density of the matting agent must be sufficient to produce the desired 6-degree gloss value. In some embodiments, the base film is 6 The gloss value is between and optionally includes any of the following: 2, 5, 1〇, 15, 2〇, 25, 3〇 and 154225.doc

S -20· 201233548 35。在某些實施例中,該基膜之60度光澤值為1〇至35。 在某些κ施例中,s亥消光劑之存在量係介於且選擇性地 包括下列任兩者:該基膜之1.6、2、3、4、5、6、7、8、 9與10重量百分比。在某些實施例中,該消光劑具有中值 粒徑介於且選擇性地包括下列任兩者:丨3、2、34、 5、6、7、8、9與10微米《該消光劑顆粒應具有平均粒徑 為小於(或等於)約10微米且大於(或等於)約13微米。較大 之消光劑顆粒可對最終基膜之機械性質造成負面影響。在 某些實施例中,該消光劑具有密度介於且選擇性地包括下 列任兩者:2、3、4與4.5 g/cc。在某些實施例中,當該消 光劑之量為低於該基膜之丨.6重量百分比時,即使該消光 劑中值粒徑與密度在理想範圍中,仍無法達到所欲之的度 光澤值。在某些實施例中’當該中值粒徑為低於Μ微 米,即使該消光劑的量與密度在理想範目,仍&法達到所 欲之60度光澤值。在某些實施例中,該消光劑係選自由二 氧化矽、氧化鋁、硫酸鋇與其混合物。 該基膜可藉由該項技術領域中所習知的任何方法(用於 製造經化學轉化且經填充之聚醯亞胺)而製備。在此類實 施例中’係製備包含低傳導度碳黑之漿體與消光劑聚體。 該些漿體可經或未經研磨(使用球磨機)以達到所欲之粒 徑。該些漿體可經或未經過遽以去除任何殘留之大顆粒。 聚醯胺液可用該項技術領域中所熟知的方法來梦造。 該聚酿胺酸溶液可經或未經過濾。在某些實施例令,、該溶 液係於高剪切混合器令,與該低傳導度碳黑衆體與該消光 i54225.doc -21· 201233548 劑漿體混合。當聚醢胺酸溶液係在二胺稍微過量的條件下 製造時’則可加入或不加入額外之二酐溶液,以增加該混 合物之黏度至膜鑄型之所欲程度。該聚醯胺酸溶液、低傳 導度碳黑漿體與消光劑漿體的量可經調整,以在該經固化 基膜中達到所欲的裝載程度。在某些實施例中,該混合物 奋冷卻至低於〇 c並且與轉化化學品混合,而後鎮型至經 加熱之旋轉鼓或帶以產生部分醯亞胺化之膠膜。該膠膜可 由該鼓或帶上剝離、放置於一拉幅框上,並使用對流與輻 射熱將其於烘箱中予以固化,以去除溶劑並完成該醯亞胺 化至大於98%固體程度。 黏著劑 在某些實施例中,該基膜係為多層膜並包含該基膜與黏 著層。該黏著層係鄰接並直接接觸該基膜。本發明之基膜 可包含一黏著層,以在施用該基膜時維持該基膜於定位。 在一實施例中,該黏著劑係由環氧樹脂與硬化劑所組成, 並且選擇性地進一步含有額外組分,例如彈性物、硬化加 速劑(催化劑)、硬化劑、填充劑與阻燃劑。 在某些實施例中’該黏著劑為環氧樹脂。在某此實施例 中,該環氧樹脂係選自&下列所組成之群組: 雙酚F型環氧樹脂、 雙酚S型環氧樹脂、 酚酚醛型環氧樹脂、 聯苯基型環氧樹脂、 聯苯基芳院基型環氧樹脂、 154225.docS -20· 201233548 35. In certain embodiments, the base film has a 60 degree gloss value of from 1 〇 to 35. In certain κ embodiments, the amount of shai matting agent is present and optionally includes any of the following: 1.6, 2, 3, 4, 5, 6, 7, 8, 9 of the base film 10 weight percent. In certain embodiments, the matting agent has a median particle size between and optionally includes any of the following: 丨3, 2, 34, 5, 6, 7, 8, 9, and 10 microns "The matting agent The particles should have an average particle size of less than (or equal to) about 10 microns and greater than (or equal to) about 13 microns. Larger matting agent particles can have a negative impact on the mechanical properties of the final base film. In certain embodiments, the matting agent has a density between and optionally includes any of the following: 2, 3, 4, and 4.5 g/cc. In some embodiments, when the amount of the matting agent is less than 0.6% by weight of the base film, even if the matting agent median particle size and density are in a desired range, the desired degree cannot be achieved. Gloss value. In some embodiments, ' when the median particle size is below Μmicron, even if the amount and density of the matting agent are in the desired range, the & method achieves the desired 60 degree gloss value. In certain embodiments, the matting agent is selected from the group consisting of cerium oxide, aluminum oxide, barium sulfate, and mixtures thereof. The base film can be prepared by any of the methods known in the art for producing chemically converted and filled polyimine. In such embodiments, a slurry comprising a low conductivity carbon black and a matting agent are prepared. The slurries may or may not be ground (using a ball mill) to achieve the desired particle size. The slurries may or may not be crucible to remove any remaining large particles. The polyamine liquid can be dreamed by methods well known in the art. The poly-aramidic acid solution may or may not be filtered. In some embodiments, the solution is mixed with the low conductivity carbon black body and the extinction i54225.doc -21·201233548 agent slurry. When the polyamic acid solution is produced under conditions of a slight excess of diamine, then an additional dianhydride solution may or may not be added to increase the viscosity of the mixture to the desired extent of the film mold. The amount of the polyamic acid solution, the low conductivity carbon black slurry and the matting agent slurry can be adjusted to achieve the desired loading level in the cured base film. In certain embodiments, the mixture is cooled to below 〇 c and mixed with the conversion chemistry and then conditioned to a heated rotating drum or belt to produce a partially yttrium-imided film. The film can be peeled off from the drum or belt, placed on a tent frame, and cured in an oven using convection and radiation heat to remove the solvent and complete the oxime imidization to greater than 98% solids. Adhesive In some embodiments, the base film is a multilayer film and comprises the base film and an adhesive layer. The adhesive layer is adjacent to and in direct contact with the base film. The base film of the present invention may comprise an adhesive layer to maintain the base film in position when the base film is applied. In one embodiment, the adhesive consists of an epoxy resin and a hardener, and optionally further contains additional components such as an elastomer, a hardening accelerator (catalyst), a hardener, a filler, and a flame retardant. . In some embodiments, the adhesive is an epoxy resin. In one embodiment, the epoxy resin is selected from the group consisting of: bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, biphenyl type Epoxy resin, biphenyl aryl-based epoxy resin, 154225.doc

S -22* 201233548 芳烷基型環氧樹脂、 —環戊二稀型環氧樹脂' 多官能型環氧樹脂、 萘型環氧樹脂、 橡膠改質環氧樹脂以及 其混合物。 ,δ玄黏著劑為環氧樹脂,且係選自S -22* 201233548 Aralkyl-based epoxy resin, cyclopentadiene epoxy resin' polyfunctional epoxy resin, naphthalene epoxy resin, rubber modified epoxy resin and mixtures thereof. , δ 玄 adhesive is epoxy resin, and is selected from

〜q >衣軋锕脂的浞合物。 在另一實施例中, 酚A型環氧樹脂、甲 在某些實施例中,環氧黏著劑包含—硬化劑。在― 例中,a玄硬化劑為酚系化合物。在某些實施例中, 包 δ亥齡^彡 化合物係選自下列所組成之群組: ’、 酚醛型酚樹脂、 芳烷基型酚樹脂、 聯苯基芳烧基型盼樹脂、 多官能型酚樹脂、 含氮酚樹脂、 二環戍二烯型酚樹脂、 含磷酚樹脂以及 含三畊(Triazine)酚酚醛樹脂。 在另一實施例中,該硬化劑為芳族二胺化合物。, #•呆些 實施例中,該芳族二胺化合物為二胺基聯苯化合物。 在某 154225.doc -23- 201233548 些實施例中,該二胺基聯苯化合物為4,4'-二胺基聯苯或 4,4'-二胺基_2,2'-二曱基聯苯。在某些實施例中,該芳族二 胺化合物為·一胺基一苯基院(diaminodipheny lalkane)化合 物。在某些實施例中,該二胺基二苯基烷化合物為4,4,_二 胺基二苯基曱烷或4,4,-二胺基二苯基乙烷。在某些實施例 中’該芳族二胺化合物為二胺基二苯基醚化合物。在某些 實施例中’該二胺基二苯基醚化合物為4,4,_二胺基二苯基 醚(diaminodiphenylether)或二(心胺基_3•乙基苯基)醚。在 某些實施例中,該芳族二胺化合物為二胺基二苯基硫醚化 合物。在某些實施例中,該二胺基二苯基硫醚化合物為 4,4,-二胺基二苯基硫醚或二(4_胺基_3_丙基苯基)硫醚。在 某些實施例中’該芳族二胺化合物為二胺基二苯基砜化4 物。在某些實施例中’該二胺基二苯基砜化合物為4,4,-: 胺基二苯基石風或二(4·胺基_3_異丙基苯基)硬。在某些實灰 例中’該芳族二胺化合物為伸苯二胺。在一實施例中,努 硬化劑為胺化合物。在宜此择# Λ丨丄 在某些貧施例令,該胺化合物為胍。 在某些實施例中,該胍為二氰二醯胺— DICY)。在另—實施例中,㈣化合物為㈣ 些實施例中,該脂族_ 隹呆 夫一胺為乙二胺或二乙二胺 (diethylenediamine) » 在某些實施例尹,古玄孩笛& # 衣氧黏者劑含有催化劑。在某此實 :例中,該催化劑係選自由味唾型、三吨型、2·乙基:甲 三一型與其混合物所組成之群組。 %例中,該環氧點著劑含有彈性物款化劑。在 154225.doc~q > coat rolling rouge compound. In another embodiment, a phenolic A type epoxy resin, in some embodiments, the epoxy adhesive comprises a hardener. In the example, the a-binder is a phenolic compound. In certain embodiments, the compound is selected from the group consisting of: ', novolac type phenol resin, aralkyl type phenol resin, biphenyl aryl-based resin, polyfunctional A phenol resin, a nitrogen-containing phenol resin, a bicyclononadiene type phenol resin, a phosphorus-containing phenol resin, and a triazine phenol phenol resin. In another embodiment, the hardener is an aromatic diamine compound. , #• Stay some of the examples, the aromatic diamine compound is a diaminobiphenyl compound. In some embodiments of 154225.doc -23- 201233548, the diaminobiphenyl compound is 4,4'-diaminobiphenyl or 4,4'-diamino 2,2'-didecyl. Biphenyl. In certain embodiments, the aromatic diamine compound is a diaminodipheny lalkane compound. In certain embodiments, the diaminodiphenylalkane compound is 4,4,diaminodiphenylnonane or 4,4,-diaminodiphenylethane. In certain embodiments, the aromatic diamine compound is a diaminodiphenyl ether compound. In certain embodiments, the diaminodiphenyl ether compound is 4,4,diaminodiphenylether or di(aminoamine-3-ethylphenyl)ether. In certain embodiments, the aromatic diamine compound is a diaminodiphenyl sulfide compound. In certain embodiments, the diaminodiphenyl sulfide compound is 4,4,-diaminodiphenyl sulfide or bis(4-amino-3-propyl phenyl) sulfide. In certain embodiments, the aromatic diamine compound is a diaminodiphenyl sulfonate. In certain embodiments, the diaminodiphenyl sulfone compound is 4,4,-:aminodiphenyl stone or bis(4.amino-3-phenylisopropyl) hard. In some solid examples, the aromatic diamine compound is a phenylenediamine. In one embodiment, the hardener is an amine compound. In this case, in some poor practices, the amine compound is hydrazine. In certain embodiments, the hydrazine is dicyanamide - DICY). In another embodiment, the compound of (d) is (iv) in some embodiments, the aliphatic 隹 隹 一 amine is ethylenediamine or diethylenediamine » In some embodiments, Yin, ancient Xuan child flute &;#衣氧粘剂 Contains a catalyst. In some embodiments, the catalyst is selected from the group consisting of a taste saliva, a three-ton type, a 2-ethyl group, a tri-type, and a mixture thereof. In % of the examples, the epoxy doting agent contains an elastomeric agent. At 154225.doc

•24· 201233548 某些實施例中,該彈性韌化劑係選自由乙烯-丙烯系橡 膠、丙烯腈-丁二烯橡膠、末端缓基(carboxy terminated)之 丙烯腈-丁二烯橡膠與其混合物所組成之群組。 在某些實施例中,該環氧黏著劑含有阻燃劑。在某些實 施例中,該阻燃劑係選自由三氫氧化銘(aluminum trihydroxide)、 三聚氰胺聚鱗酸鹽(melamine polyphosphate)、濃縮聚填酸鹽酯、其他含構阻燃劑與其 混合物所組成之群組。 在某些實施例中,該黏著層係選自由下述所組成之群 組: 聚醯亞胺、 丁醒·盼(butyral phenolic)、 聚矽氧烷、 聚醯亞胺矽氧烷、 氟化乙稀丙浠(ethylene propylene)共聚合物、 全氣烧氧基(perfluoroalkoxy)共聚合物、 乙烯乙酸乙烯S旨(ethylene vinyl acetate)共聚合物、 乙烯乙酸乙稀酯丙浠酸縮水甘油酯三共聚物(ethylene vinyl acetate glycidyl acrylate terpolymer) ' 乙烯乙酸乙烯酯曱基丙烯酸縮水甘油酯三共聚物 (ethylene vinyl acetate glycidyl methacrylate terpolymer) ' 乙烯丙烯酸烷基酯共聚合物以及黏著促進劑、 乙烯曱基丙烯酸烷基酯共聚合物以及黏著促進劑、 乙稀丙稀酸縮水甘油酷、 154225.doc -25- 201233548 乙烯甲基丙烯酸縮水甘油酯、 乙烯丙烯酸烷基酯丙烯酸縮水甘油酯三共聚物、 乙烯甲基丙烯酸烷基酯丙烯酸縮水甘油酯三共聚物、 乙烯丙烯酸烷基酯順丁烯二酸酐三共聚物、 乙烯甲基丙烯酸烷基酯順丁烯二酸酐三共聚物、 乙烯丙烯酸烷基酯甲基丙烯酸縮水甘油酯三共聚物、 乙烯甲基丙烯酸烷基酯曱基丙烯酸縮水甘油酯三共聚 物、 丙烯酸烧基醋丙稀腈丙稀酸三共聚物、 丙烯酸烧基酯丙稀腈甲基丙稀酸三共聚物、 乙烯丙烯酸共聚合物包括其鹽、 乙稀甲基丙烯酸共聚合物包括其鹽、 丙烯酸烷基酯丙烯腈甲基丙烯酸縮水甘油酯三共聚物、 甲基丙烯酸烷基酯丙烯腈甲基丙烯酸縮水甘油酯三共聚 物、 丙烯酸烷基酯丙烯腈丙烯酸縮水甘油酯三共聚物、 曱基丙烯酸烷基酯丙烯腈丙烯酸縮水甘油酯三共聚物、 聚乙烯丁醛、 乙烯丙烯酸说基醋甲基丙稀酸三共聚物與其鹽、 乙稀烧基曱基丙稀酸酯曱基丙烯酸三共聚物與其鹽、 乙烯丙烯酸烷基酯丙烯酸三共聚物與其鹽、 乙稀烧基甲基丙稀酸酯丙烯酸三共聚物與其鹽、 乙烯氫順丁烯二酸乙酯(ethylene ethyl hydr〇gen maleat)、 154225.doc -26, s 201233548 乙烯丙烯酸烧基酯氫順丁烯二酸乙酯、 乙烯曱基丙烯酸烷基酯氫順丁烯二酸乙酯、 及其混合物。 在某些實施例中,該多層膜為一覆蓋膜。 雖然本發明的基膜可用於覆蓋之應用,一經化學轉化的 聚醯亞胺(其中該經化學轉化的聚醯亞胺係藉由混合聚醯 胺酸溶液與能夠將聚醯胺酸轉化成聚醯亞胺的催化劑及/ 或脫水劑,或者將聚醯胺酸鑄型或擠出至催化劑及/或脫 水劑之一混合物或溶液中的步驟所製成)均有益於使用任 何類型之填料填充的聚醯亞胺膜。Kreuz等人的U.S. 5,166,308揭示一芳族共聚聚醯亞胺膜,其具有6〇〇至12〇〇 Kpsi的彈性模數、5至25 ppm/t>c的熱脹係數、2至 ppm/% RH的吸濕膨脹係數、在1〇〇% RH下小於3 〇%的吸 水率、及大於藉由使用相同時間與溫度條件之熱轉化程序 所袋備之相同共聚聚醯亞胺膜的姓刻速率◊不過,Kreuz 等人並未揭示將填料添加至聚醯亞胺膜。 儘管具有高溶劑含量,藉由化學轉化程序所製成的膠膜 具有自我支撐效果。咸信使用具有如此多之必須移除之液 體的膠膜’任何填料將會隨著大量液體的移除而遷移,或 甚至會與溶劑-起從薄膜輸出。若聚醯亞胺膠财的填料 未隨者溶劑移除而遷移,薄膜將具有捲曲的傾向。所需的 是均勾的分散體。因此,咸信化學轉化將不會產生且有足 =維持遍及整個薄膜之性質之均勾分散體的填充聚醢亞胺 、。因此’ Kreuz等人並未打算使用大量的填料。沒料到 154225.doc •27- 201233548 的是,經化學轉化的聚醯亞胺膜並未如同藉由以相同填料 填充之熱轉化所製備的聚醯亞胺膜一樣脆,且可以化學轉 化來達到更均勻的填料分散體。圖1為一三層經熱轉化之 聚醯亞胺膜之橫剖面的穿透式電子顯微圖,該聚醯亞胺膜 含有20重量百分比的氣相式(fumecj)氧化紹,其可取得自Ε I. du Pont de Nemours and Company, Wilmington,DE。圖 2 為一單層經化學轉化之PMDA/4,4-ODA之橫剖面的穿透式 電子顯微圖,該PMDA/4,4-ODA具有13重量百分比的氣相 式氧化鋁’其繪示比圖丨所示之藉由熱轉化所製成的聚醯 亞胺膜更均勻的分散體。 在某些實施例中,除了碳黑或顏料以外,可用於藉由化 學轉化所製成之聚醯亞胺膜的填料係選自由滑石粉、二氧 化鈦、針狀二氧化鈦、氧化鋅、氮化硼、二氧化矽、氣相 式二氧化矽、氧化鋁、氣相式氧化鋁、海泡石、矽灰石及 其混合物所構成的群組。填料的選擇取決於聚醯亞胺膜的 所需用途《例如,可添加氮化硼來增加聚醯亞胺膜的導熱 係數。所添加的氮化硼越多,則聚醯亞胺膜的導熱係數越 大。在某些實施例中,填料為導熱填料。在另一實施例 中填料為介電質填料。在另一實施例中,填料為導電填 料在某些貫細例中,填料為任何可用於聚醯亞胺的填 '疋厚度之聚酿亞胺膜内可包含的填料量實際上有 斤If制 旦超過這個量,經填充的聚醯亞胺膜會因為薄 膜的脆度而變得難以處理。在某些實施例中,當填料選自 由滑石粉、二氧化,太、針狀二氧化鈦、氧化辞、氮化硼、 154225.doc• 24· 201233548 In certain embodiments, the elastic toughening agent is selected from the group consisting of ethylene-propylene rubber, acrylonitrile-butadiene rubber, carboxy terminated acrylonitrile-butadiene rubber, and mixtures thereof. The group that makes up. In certain embodiments, the epoxy adhesive contains a flame retardant. In certain embodiments, the flame retardant is selected from the group consisting of aluminum trihydroxide, melamine polyphosphate, concentrated poly-salt ester, other flame retardants, and mixtures thereof. Group of. In certain embodiments, the adhesive layer is selected from the group consisting of: polyimine, butyral phenolic, polyoxyalkylene, polyamidoxane, fluorinated Ethylene propylene copolymer, perfluoroalkoxy copolymer, ethylene vinyl acetate copolymer, ethylene vinyl acetate glyceryl acrylate "ethylene vinyl acetate glycidyl acrylate terpolymer" (ethylene vinyl acetate glycidyl methacrylate terpolymer) ethylene alkyl acrylate copolymer and adhesion promoter, ethylene methacrylate Alkyl ester copolymers and adhesion promoters, glycidyl methacrylate, 154225.doc -25- 201233548 ethylene glycidyl methacrylate, ethylene alkyl acrylate glycidyl acrylate triester, vinyl Alkyl acrylate acrylate glycidyl ester tri copolymer, ethylene alkyl acrylate maleic anhydride tri copolymer, Alkenyl methacrylate maleic anhydride tri copolymer, ethylene alkyl acrylate, glycidyl methacrylate tri copolymer, ethylene alkyl methacrylate, glycidyl acrylate, triacrylate, acrylic acid Acrylic acrylonitrile triacrylate copolymer, acrylonitrile acrylonitrile methacrylate triester, ethylene acrylate copolymer including salt thereof, ethylene methacrylic acid copolymer including salt, acrylic acid Alkyl ester acrylonitrile glycidyl methacrylate tri copolymer, alkyl methacrylate acrylonitrile glycidyl methacrylate tri copolymer, alkyl acrylate acrylonitrile glycidyl acrylate triester, methacrylic acid Alkyl ester acrylonitrile glycidyl acrylate tri copolymer, polyvinyl butyral, ethylene methacrylate methacrylic acid tri copolymer and its salt, ethylene thiol acrylate acrylate methacrylate And its salt, ethylene alkyl acrylate triacrylate and its salt, ethylene alkyl methacrylate acrylic copolymer and its salt, ethylene hydrogen maleate Ethyl ethyl hydr〇gen maleat, 154225.doc -26, s 201233548 ethylene acrylate alkyl ester hydrogen maleate, ethylene alkyl methacrylate hydrogen maleate, And mixtures thereof. In certain embodiments, the multilayer film is a cover film. Although the base film of the present invention can be used for covering applications, a chemically converted polyimine (wherein the chemically converted polyimine is capable of converting polylysine into a poly by mixing a polyamic acid solution The catalyst and/or dehydrating agent of the quinone imine, or the step of casting or extruding the polyglycolic acid into a mixture or solution of one of the catalyst and/or dehydrating agent, is beneficial for filling with any type of filler. Polyimine film. US 5,166,308 to Kreuz et al. discloses an aromatic copolymerized polyimide film having a modulus of elasticity of 6 to 12 Kpsi, a coefficient of thermal expansion of 5 to 25 ppm/t > c, 2 to ppm. /% RH has a coefficient of hygroscopic expansion, a water absorption of less than 3 % at 1% RH, and a copolymerization ratio of the same copolymerized polyimide film which is larger than that obtained by a thermal conversion procedure using the same time and temperature conditions. The rate of surnames is not excessive, and Kreuz et al. did not disclose the addition of fillers to the polyimide film. Despite the high solvent content, the film produced by the chemical conversion process has a self-supporting effect. It is believed that the use of a film with so many liquids that must be removed 'any filler will migrate with the removal of a large amount of liquid, or even with the solvent - from the film. If the polyimine rubber filler does not migrate with the removal of the solvent, the film will have a tendency to curl. What is needed is a homogenous dispersion. Therefore, the chemical conversion of Xianxin will not occur and there will be enough to fill the polyimine of the homogenous dispersion throughout the properties of the film. Therefore, Kreuz et al. did not intend to use a large amount of filler. Unexpectedly, 154225.doc •27-201233548, the chemically converted polyimine film is not as brittle as the polyimide film prepared by thermal conversion with the same filler, and can be chemically converted. A more uniform filler dispersion is achieved. Figure 1 is a transmission electron micrograph of a cross section of a three-layer thermally converted polyimine film containing 20% by weight of fucecj oxide, which can be obtained Since I. du Pont de Nemours and Company, Wilmington, DE. Figure 2 is a transmission electron micrograph of a cross-section of a single layer of chemically converted PMDA/4,4-ODA with 13% by weight of fumed alumina. A more uniform dispersion of the polyimide film produced by thermal conversion as shown in Figure 。. In certain embodiments, in addition to carbon black or pigment, the filler that can be used in the polyimide film produced by chemical conversion is selected from the group consisting of talc, titanium dioxide, acicular titanium dioxide, zinc oxide, boron nitride, A group consisting of cerium oxide, gas phase cerium oxide, aluminum oxide, gas phase alumina, sepiolite, apatite, and mixtures thereof. The choice of filler depends on the desired use of the polyimide film. For example, boron nitride can be added to increase the thermal conductivity of the polyimide film. The more boron nitride added, the greater the thermal conductivity of the polyimide film. In certain embodiments, the filler is a thermally conductive filler. In another embodiment the filler is a dielectric filler. In another embodiment, the filler is a conductive filler. In some specific examples, the filler may be any amount of filler that can be included in the polythene oxide film which can be used for the polythene imine. When the denier exceeds this amount, the filled polyimine film becomes difficult to handle due to the brittleness of the film. In certain embodiments, when the filler is selected from the group consisting of talc, dioxide, oxidized, acicular titanium dioxide, oxidized, boron nitride, 154225.doc

S -28- 201233548 二氧化石夕、氣相式二氧化石夕、氧化銘、氣相式氧化銘 =、梦灰石及其混合物所構成的群組時,高達9 ^ 刀比的填料可以低傳導性的碳黑或顏料來取代。I百 聚醯亞胺膜越薄,就越難在不使薄膜變脆的情況下進〜 填充。為了克服此問題,典型製造一三層薄膜。: 纽填充,而内部(核心)層未經填充或含有小於5重量百二層 的填料。核心層允許多層膜維持可接受的機械性質。 用化學轉化時,可锣造—置爲▲古士 田 氣以早層經填充的聚醯亞胺膜,且仍 、准持良好的機械性質。化學轉化之_附加優點在於: 化學轉化所製成之單層經填充的聚醯亞胺膜,可製造出比 使用熱轉化所能製造的更薄之薄膜。在某些實施例中,基 :包括一經化學轉化的聚酿亞胺,其量從基臈的40至90重 里百分比;一填料(或多種填料的混合物),其量從基膜的 10至60重量百分比,且其中基膜的厚度係從8至152微米。 輕化學轉化的聚酿亞胺衍生自以該聚醯亞胺之二針總量計 异至少50莫耳百分比之芳香族二酐,以及以該聚醢亞胺之 一胺總量計算至少5G莫耳百分比之料族二胺。在另-實 例中’基膜包括_經化學轉化的㈣践,其量從基膜 ::〇至90重量百分比;一填料(或多種填料的混合物),其 $從基膜的U)至5G重量百分比,且其中基膜的厚度係從8 至76微米。 ㈣另彳t說明’下述實例所有部份與百分比均以重量計 算。 實例 154225.doc 29. 201233548 在下列實例中將會進一步描述本發明,其非意欲限制於 申請專利範圍中所述之本發明範_。 光學密度係以Macbeth TD904光學密度計測得。所記錄 者為5至10個各別測量值的平均。 60度光澤值係以 Micro-TRI-Gloss 光澤計(Gardner USA,S -28- 201233548 When the group consisting of sulphur dioxide, gas phase sulphur dioxide, oxidation, gas phase oxidation, dream limestone and its mixture, the packing up to 9 ^ knife ratio can be low. Conductive carbon black or pigment to replace. The thinner the I-polyimine film, the more difficult it is to fill the film without making the film brittle. To overcome this problem, a three-layer film is typically fabricated. : New fill, while the inner (core) layer is unfilled or contains less than 5 parts by weight of filler. The core layer allows the multilayer film to maintain acceptable mechanical properties. When chemical conversion is used, it can be made into a yttrium film filled with an early layer, and it still has good mechanical properties. An additional advantage of chemical conversion is that a single layer of filled polyimide film produced by chemical conversion can produce a thinner film than can be produced by thermal conversion. In certain embodiments, the base comprises a chemically converted polyamidiamine in an amount from 40 to 90 weight percent of the base; a filler (or a mixture of fillers) in an amount from 10 to 60 of the base film Percent by weight, and wherein the thickness of the base film is from 8 to 152 microns. The lightly chemically converted polynitrite is derived from an aromatic dianhydride having a total of at least 50 mole percent based on the total amount of the two needles of the polyimine, and at least 5 G calculated based on the total amine of one of the polyimine The percentage of the ear is the family diamine. In another example - the base film comprises - chemically converted (four) practice, the amount from the base film:: 〇 to 90% by weight; a filler (or a mixture of fillers), which is from the base film U) to 5G Percent by weight, and wherein the thickness of the base film is from 8 to 76 microns. (d) 彳t Description 'All parts and percentages of the following examples are by weight. EXAMPLES 154225.doc 29. 201233548 The invention will be further described in the following examples, which are not intended to be limited to the scope of the invention described in the claims. Optical density was measured on a Macbeth TD904 optical densitometer. The logger is an average of 5 to 10 individual measurements. The 60-degree gloss value is based on the Micro-TRI-Gloss gloss meter (Gardner USA,

Columbia, MD)測得。所記錄者為5至1〇個各別測量值的平 均。 表面電阻率係使用Advantest Model R8340超高電阻計以 及UR型同心環探針在1000伏特所測得。所記錄者為3至5 個各別測量值的平均。 介電強度係使用 Beckman Industrial AC Dielectric Breakdown Tester依據ASTM D149測得。所記錄者為5至1〇 個各別測量值的平均。 中值粒徑係使用Horiba LA-930粒徑分析儀測得。Columbia, MD) measured. The record is the average of 5 to 1 individual measurements. The surface resistivity was measured using an Advantest Model R8340 ultra-high resistance meter and a UR-type concentric ring probe at 1000 volts. The loggers are the average of 3 to 5 individual measurements. The dielectric strength was measured using a Beckman Industrial AC Dielectric Breakdown Tester in accordance with ASTM D149. The loggers are the average of 5 to 1 各 individual measurements. The median particle size was measured using a Horiba LA-930 particle size analyzer.

Horiba,Instruments, Inc.,Irvine CA. DMAC(二甲基乙醯 胺)係使用作為載體流體。 當使用連續膜鑄型程序來生產樣品時,則使用灰化 (ashing)程序來確定該膜中消光劑的量。該膜係在爐中於 900°C加熱而灰化,以燒除所有聚合物與低傳導度碳黑, 僅留下白色消光劑殘留物。比較灰化前與後之重量以顯示 該膜中所含有的消光劑的量。 聚酿胺酸黏度測量係於Brookfield Programmable DV-II + 黏度計進行,其使用rV/HA/HB #7轉軸或LV #5轉軸。該 黏度計速度係在由5至100 rpm間變化,以提供可接受之百 丨 54225.doc ,3〇.Horiba, Instruments, Inc., Irvine CA. DMAC (dimethylacetamide) is used as a carrier fluid. When a continuous film casting procedure is used to produce a sample, an ashing procedure is used to determine the amount of matting agent in the film. The film was heated and ashed at 900 ° C in an oven to burn off all of the polymer and low conductivity carbon black leaving only the white matting agent residue. The weight before and after ashing was compared to show the amount of matting agent contained in the film. The polystyrene viscosity measurement was performed on a Brookfield Programmable DV-II + viscometer using rV/HA/HB #7 spindle or LV #5 spindle. The viscometer speed is varied from 5 to 100 rpm to provide an acceptable amount of 54225.doc, 3〇.

S 201233548 分比扭矩值。讀值係經溫度校正至25°C。 拉伸性質係根據ASTM D-882-91,Method A進行測量。 標本尺寸為25 mm X 150 mm ;鉗頭分離為100 mm ;钳頭 速度為50 mm/分鐘。 100CR為三層經熱轉化的聚醯亞胺膜,其含有20重量百 分比的氣相式氧化銘。可取得自E. I. du Pont de Nemours and Company,Wilmington, DE。 實例1至5顯示化學轉化在消光劑低量下,在基膜兩側皆 達到低的60度光澤值(消光外觀)以及高介電強度。 實例1 製備碳黑漿體,其由80重量百分比DMAC、1 0重量百分 比聚醯胺酸預聚合物溶液(20.6重量百分比的聚醯胺酸固體 於DMAC中)與10重量百分比的低傳導度碳黑粉末(Special Black 4,得自Evonik Degussa)所組成。將該些成分在轉子 定子高速分散研磨機中完全混合。該漿體而後於球磨機中 加工,以分散任何大的黏聚物並達到所欲之粒徑。該漿體 之中值粒徑為0.3微米。 製備二氧化矽漿體,其由75.4重量百分比的DMAC、9.6 重量百分比聚醯胺酸預聚合物溶液(20.6重量百分比的聚醯 胺酸固體於DMAC中)與15.0重量百分比的二氧化矽粉末 (Syloid® C 803,得自W. R. Grace Co.)所組成。將該些成 分在高剪切轉子定子型混合器中完全混合。中值粒徑為 3.3至3.6微米。 將16_4 kg的該碳黑漿體與158 kg的PMDA/4,4ODA預聚 154225.doc -31- 201233548 合物溶液(20.6重量百分比的聚醯胺酸固體,約50泊之黏 度)混合於50加侖(189.3升)槽中。該槽係配備有三個獨立 控制的攪拌器軸:一低速錨式混合器、一高速碟式分散器 以及一高剪切轉子定子乳化器。該混合物係藉由加入以及 漸增式地混合約7 kg.之於DMAC中的5.8重量百分比PMDA 溶液而「完成(finished)」,以增加分子量與黏度至約3000 泊。該錨式混合器、分散器以及乳化器之速度可作必要之 調整’以確保有效地混合與分散而不會過度加熱該混合 物°藉由使冷卻乙二醇流經該混合槽之夾套,而進一步調 節該混合物之溫度。使該完成溶液係過濾通過2〇微米濾 器’並進行真空除氣以去除内附之空氣。 該一氧化梦漿體係計量供給(metered)至該完成聚合物/ 碳黑混合物的計量(metered)液流中,並且使用高剪切轉子 疋子混合器加以完全混合。將該經組合之液流冷卻至約 6 C,將轉化化學品乙酐(〇 14 cm3/cm3聚合物溶液)與甲 吡啶(〇·15 cm3/cm3聚合物溶液)計量供應至其中並混合, 並且使用狹縫式模具將膜鑄型至90°C熱的旋轉鼓上。將所 生成之膠膜由該鼓上剝離並輸送至拉幅烘箱令,其中該膜 係使用對流與輻射熱乾燥並固化至固體程度大於。該 基膜含有5重量百分比的碳黑與3 5重量百“匕的二氧化 石夕。 結果係不於表1。 拉伸強度及斷裂伸長度示於表3。 實例2 154225.docS 201233548 The ratio of torque values. The readings were temperature corrected to 25 °C. Tensile properties were measured according to ASTM D-882-91, Method A. The specimen size is 25 mm X 150 mm; the jaws are separated by 100 mm; the jaw speed is 50 mm/min. 100CR is a three-layer, thermally converted polyimine film containing 20% by weight of gas phase oxidation. Available from E. I. du Pont de Nemours and Company, Wilmington, DE. Examples 1 through 5 show that chemical conversion achieves a low 60 degree gloss value (matte appearance) and high dielectric strength on both sides of the base film at low levels of matting agent. Example 1 A carbon black slurry was prepared from 80 weight percent DMAC, 10 weight percent polyglycolic acid prepolymer solution (20.6 weight percent polyglycolic acid solids in DMAC) and 10 weight percent low conductivity carbon Black powder (Special Black 4, available from Evonik Degussa). The ingredients are thoroughly mixed in a rotor stator high speed dispersion mill. The slurry is then processed in a ball mill to disperse any large binder and achieve the desired particle size. The slurry had a median particle size of 0.3 microns. A cerium oxide slurry was prepared from 75.4 weight percent DMAC, 9.6 weight percent poly phthalic acid prepolymer solution (20.6 weight percent polyglycolic acid solids in DMAC) and 15.0 weight percent cerium oxide powder ( Syloid® C 803, available from WR Grace Co.). The ingredients are thoroughly mixed in a high shear rotor stator type mixer. The median particle size is from 3.3 to 3.6 microns. Mix 16_4 kg of this carbon black slurry with 158 kg of PMDA/4,4 ODA prepolymerized 154225.doc -31- 201233548 solution (20.6 weight percent polyglycolic acid solid, about 50 poise viscosity) mixed with 50 Gallon (189.3 liters) in the tank. The tank is equipped with three independently controlled agitator shafts: a low speed anchor mixer, a high speed disc disperser and a high shear rotor stator emulsifier. The mixture was "finished" by adding and incrementally mixing about 7 kg. of a 5.8 weight percent PMDA solution in DMAC to increase molecular weight and viscosity to about 3,000 poise. The speed of the anchor mixer, disperser and emulsifier can be adjusted as necessary to ensure efficient mixing and dispersion without excessive heating of the mixture. By passing the cooled ethylene glycol through the jacket of the mixing tank, The temperature of the mixture is further adjusted. The completion solution was filtered through a 2 〇 micron filter' and vacuum degassed to remove the enclosed air. The monoxide system is metered into the metered stream of the finished polymer/carbon black mixture and thoroughly mixed using a high shear rotor tweezers. The combined liquid stream is cooled to about 6 C, and the conversion chemical acetic anhydride (〇 14 cm 3 /cm 3 polymer solution) and pyridinium (〇·15 cm 3 /cm 3 polymer solution) are metered into and mixed. And the film was cast to a hot rotating drum of 90 ° C using a slit die. The resulting film is peeled from the drum and conveyed to a tenter oven, wherein the film is dried using convection and radiant heat and solidified to a greater extent than solids. The base film contained 5 wt% of carbon black and 35 wt% of bismuth dioxide. The results are not shown in Table 1. Tensile strength and elongation at break are shown in Table 3. Example 2 154225.doc

S -32· 201233548 製備氧化鋁漿體,其由41.7重量百分比的DMAC、23.3 重量百分比的聚醯胺酸預聚合物溶液(20.6重量百分比的聚 醯胺酸固體於DMAC中)與3 5.0重量百分比的阿伐氧化鋁粉 末(中值粒徑為約2.2微米)所組成。將該些成分在轉子定子 高速分散研磨機中完全混合。 該氧化鋁漿體隨同該轉化化學品,係計量供給至該實例 1完成聚合物/碳黑混合物的經冷卻(-7°C ·)計量液流中,並 使用基本上與實例1相同之程序來鑄型及固化聚醯亞胺 膜。所生成之基膜含有5重量百分比的碳黑與7重量百分比 的氧化鋁。 結果係不於表1。 實例3 碳黑與二氧化矽漿體係製備如實例1。該漿體係與 PMDA/4,4ODA預聚合物溶液(20.6重量百分比的聚醯胺酸 固體,約50泊之黏度)混合,其量為可在經固化膜基礎上 產生5重量百分比的碳黑與2重量百分比的二氧化矽。該混 合物藉由増量地加入於DMAC中之6重量百分比的pMDA溶 液並同時進行混合而完成,以達到最終黏度為約U 5 〇泊。 將该完成之聚合物混合物經真空除氣。使用不鏽鋼鑄型 棒將/ I D物混合物以手動方式鑄型於貼附在玻璃板上 的㈣卿對苯二甲酸乙二醇W上。將含有該濕鑄型膜 之該Myl_聚對笨二曱酸乙二醇酯片浸潰至浴中,該浴係 由3甲比疋與乙軒之5G/5G混合物所組成。將該浴溫和授拌 3至4分鐘的昧pq ’曰’以引發該膜的醢亞胺化與膠化。將該膠 154225.doc •33· 201233548 膜由該Mylar®聚對苯二曱酸乙二醇酯片上剝除,並放置於 栓框上以限制該膜並防止收縮。在使殘留溶劑自該膜排出 後’將含有該膜之栓框放置於12〇。〇。烘箱中。將該烘箱 溫度在60至75分鐘的時間内昇高至32〇。(:,在320°C持溫10 分鐘’而後轉移至400°C烘箱中並持溫5分鐘,之後將其從 該烘箱甲移出並使其冷卻。 結果係示於表1。 實例4 該基膜係製備如實例3,並且在經固化膜基礎上具有3重 量百分比的二氧化石夕。 結果係示於表1。 實例5 製備碳黑漿體如實例1。製備一合成硫酸鋇(Blanc Fixe F,from Sachtleben Chemie GmbH)聚體,其由51.7重量百 分比的DMAC、24.1重量百分比的預聚合物溶液(2〇 6重量 百分比的聚醯胺酸固體於DMAC中)與24.1重量百分比的硫 酸鋇粉末所組成《將該些成分在高剪切轉子定子型混合器 中完全混合。中值粒徑為1.3微米。 該些漿體係與卩]\/1〇八/4,4|〇〇八聚酿胺酸溶液(20.6重量百 分比的聚醯胺酸固體,約50泊之黏度)混合,其量為可在 經固化膜基礎上產生7重量百分比的碳黑與1 〇重量百分比 的硫酸鋇。該混合物藉由增量地加入於DMAC中之6重量 百分比的PMDA溶液並同時進行混合而完成,以達到最終 黏度為約2400泊。將該完成之聚合物混合物經真空除氣。 -34- 154225.docS -32· 201233548 Preparation of an alumina slurry consisting of 41.7 weight percent DMAC, 23.3 weight percent polylysine prepolymer solution (20.6 weight percent polyglycolic acid solids in DMAC) and 3 5.0 weight percent The Avalan alumina powder (with a median particle size of about 2.2 microns) is composed. The ingredients are thoroughly mixed in a rotor stator high speed dispersion mill. The alumina slurry was metered into the cooled (-7 ° C.) metering stream of the Example 1 completed polymer/carbon black mixture along with the conversion chemistry and using essentially the same procedure as in Example 1. To mold and cure polyimine film. The resulting base film contained 5 weight percent carbon black and 7 weight percent alumina. The results are not in Table 1. Example 3 A carbon black and cerium oxide slurry system was prepared as in Example 1. The slurry system is mixed with a PMDA/4,4 ODA prepolymer solution (20.6 weight percent polyglycolic acid solid, about 50 poise viscosity) in an amount to produce 5 weight percent carbon black on the cured film basis. 2 weight percent of cerium oxide. The mixture was prepared by metering a 6 weight percent pMDA solution in DMAC and mixing at the same time to achieve a final viscosity of about U 5 Torr. The finished polymer mixture was degassed by vacuum. The /I D mixture was manually cast using a stainless steel mold bar on (4) glyme terephthalate W attached to a glass plate. The Myl_poly-p-citric acid ethylene glycol ester sheet containing the wet cast film was immersed in a bath consisting of a mixture of 3 bismuth and a 5G/5G mixture. The bath was gently mixed for 3 to 4 minutes of 昧pq '曰' to initiate the ruthenium iodization and gelation of the film. The gel 154225.doc •33·201233548 film was peeled off from the Mylar® polyethylene terephthalate sheet and placed on a plug frame to limit the film and prevent shrinkage. After the residual solvent was discharged from the film, the plug containing the film was placed at 12 Torr. Hey. In the oven. The oven temperature was raised to 32 Torr over a period of 60 to 75 minutes. (:, held at 320 ° C for 10 minutes) and then transferred to a 400 ° C oven and held for 5 minutes, after which it was removed from the oven and allowed to cool. The results are shown in Table 1. Example 4 The film system was prepared as in Example 3 and had 3 weight percent of sulphur dioxide on the basis of the cured film. The results are shown in Table 1. Example 5 Preparation of a carbon black slurry as in Example 1. Preparation of a synthetic barium sulfate (Blanc Fixe F, from Sachtleben Chemie GmbH) a polymer consisting of 51.7 weight percent DMAC, 24.1 weight percent prepolymer solution (2 〇 6 weight percent polyglycolic acid solids in DMAC) and 24.1 weight percent barium sulfate powder The composition "completely mixes the ingredients in a high shear rotor stator type mixer. The median diameter is 1.3 microns. The pulp system is 卩]\/1〇8/4,4|〇〇八聚酿An amine acid solution (20.6 weight percent polyglycolic acid solid, about 50 poise viscosity) was mixed in an amount to produce 7 weight percent carbon black and 1 weight percent barium sulfate on a cured film basis. By adding 6 weights in the DMAC incrementally The percentage of PMDA solution was completed by simultaneous mixing to achieve a final viscosity of about 2400 poise. The finished polymer mixture was vacuum degassed. -34- 154225.doc

S 201233548 將該聚合物混合物鑄型於My lar®聚對苯二曱酸乙二醇酯片 上’並如實例3中所述將其化學醯亞胺化及固化。 結果係示於表1。 對照實例1 比較例1展示在如實例5中之相同量消光劑進行熱轉化, 在基膜兩側上產生高的(非所欲之)60度光澤值以及低介電 強度。 製備奴黑聚體如貫例1。製備一合成硫酸鎖(Blanc Fixe F’ from Sachtleben Chemie GmbH)漿體,其由51_7重量百 分比的DMAC、24.1重量百分比的聚醯胺酸預聚合物溶液 (20.6重量百分比的聚醯胺酸固體於dmaC中)與24.1重量百 分比的硫酸鋇粉末所組成。將該些成分在高剪切轉子定子 型混合器中完全混合。中值粒徑為1 3微米。 該些製體係與PMDA/4,4,ODA預聚合物溶液(20.6重量百 分比的聚醯胺酸固體,約5 〇泊之黏度)混合,其量為可在 經固化膜基礎上產生7重量百分比的碳黑與丨〇重量百分比 的硫酸鋇。該混合物藉由增量地加入於DMAC中之6重量 百分比的PMDA溶液並同時進行混合而完成,以達到最终 黏度為約15 00泊。將該完成之聚合物混合物經真空除氣。 使用不鏽鋼鑄型棒,將膜以手動方式鑄型於玻璃板上。將 含有違濕鑄型膜之玻璃板放置於加熱板上,並在8〇至 100C放置30至45分鐘,以形成部分乾燥且部分醯亞胺化 之綠」臈。將該綠膜由該玻璃板上剝除並放置於栓框 上。將含有該綠膜之栓框放置K12(rc烘箱中。將該烘箱 154225.doc •35- 201233548 溫度在60至75分鐘的時間内昇高至32〇t,在32〇。<:持溫ι〇 分鐘,而後轉移至400°C烘箱中並持溫5分鐘,之後將其從 該烘箱中移出並使其冷卻。 結果係示於表1。 對照實例2 比較例2展示在4重量百分比之消光劑量進行熱轉化,在 基膜兩侧上產生高的(非所欲之)6〇度光澤值,並且具有低 介電強度》 碳黑與二氧化矽漿體係製備如實例丨。該漿體係與 PMDA/4,4'ODA預聚合物溶液(2〇6%的聚醯胺酸固體約 50泊之黏度)混合,其量為可在經固化膜基礎上產生5重量 百分比的碳黑與4重量百分比的二氧化矽。該混合物藉由 增量地加入於DMAC中之6重量百分比的PMDA溶液並同時 進行混合而完成,以達到最終黏度為約225〇泊。將該完成 之聚合物混合物經真空除氣。使用不鏽鋼鑄型棒,將膜以 手動方式缚型於玻璃板上。將含有該濕铸型膜之玻璃板放 置於加熱板上’並在80至loot放置30至45分鐘,以形成 为乾燥且部分醢亞胺化之「綠」膜。將該綠膜由該玻璃 板上剝除並放置於栓框上。將含有該綠膜之栓框放置於 120 C供箱中。將該烘箱溫度在6〇至75分鐘的時間内昇高 至320C ’在320C持溫10分鐘’而後轉移至4〇〇°c烘箱中 並持溫5分鐘,之後將其從該烘箱中移出並使其冷卻。 結果係示於表1。 比較例3 154225.docS 201233548 The polymer mixture was cast on Mylar® polyethylene terephthalate sheet and chemically ruminated and cured as described in Example 3. The results are shown in Table 1. Comparative Example 1 Comparative Example 1 shows the same amount of matting agent as in Example 5 for thermal conversion, producing a high (unwanted) 60 degree gloss value and a low dielectric strength on both sides of the base film. Preparation of slave black polymer such as Example 1. A synthetic sulfuric acid lock (Blanc Fixe F' from Sachtleben Chemie GmbH) slurry was prepared from 51-7 weight percent DMAC, 24.1 weight percent polylysine prepolymer solution (20.6 weight percent polylysine solids in dmaC) Medium) consists of 24.1 weight percent barium sulfate powder. The ingredients are thoroughly mixed in a high shear rotor stator type mixer. The median particle size is 13 microns. These systems are mixed with PMDA/4,4, ODA prepolymer solution (20.6 weight percent polyglycolic acid solids, viscosity of about 5 Torr) in an amount of 7 weight percent based on the cured film. The carbon black and barium weight percent of barium sulfate. The mixture was completed by incrementally adding a 6 weight percent PMDA solution in DMAC and mixing at the same time to achieve a final viscosity of about 150,000 poise. The finished polymer mixture was degassed by vacuum. The film was manually cast onto a glass plate using a stainless steel mold bar. The glass plate containing the wet cast film was placed on a hot plate and placed at 8 to 100 C for 30 to 45 minutes to form a partially dried and partially yttrium-immobilized green crucible. The green film was peeled off from the glass plate and placed on the frame. The frame containing the green film was placed in a K12 (rc oven. The temperature of the oven 154225.doc • 35-201233548 was raised to 32 〇t in the period of 60 to 75 minutes at 32 〇. <: holding temperature After 10 minutes, it was transferred to a 400 ° C oven and held for 5 minutes, after which it was removed from the oven and allowed to cool. The results are shown in Table 1. Comparative Example 2 Comparative Example 2 is shown at 4 weight percent The matting dose is thermally converted to produce a high (unwanted) 6-degree gloss value on both sides of the base film, and has a low dielectric strength. The carbon black and cerium oxide slurry system is prepared as an example. Mix with PMDA/4,4' ODA prepolymer solution (2 6% viscous solids viscosity of about 50 poise) in an amount to produce 5 weight percent carbon black and 4 on the cured film basis Percent by weight of cerium oxide. The mixture is completed by incrementally adding 6 weight percent of PMDA solution in DMAC and mixing at the same time to achieve a final viscosity of about 225 Torr. The finished polymer mixture is passed through. Vacuum degassing. Use stainless steel cast rods to apply the film manually The glass plate containing the wet cast film was placed on a hot plate' and placed at 80 to loot for 30 to 45 minutes to form a "green" film which was dried and partially yttrium. The green film is peeled off from the glass plate and placed on the plug frame. The plug frame containing the green film is placed in a 120 C supply box. The oven temperature is raised to 6 to 75 minutes to 320C 'temperature held at 320 C for 10 minutes' and then transferred to a 4 ° ° oven and held for 5 minutes, after which it was removed from the oven and allowed to cool. The results are shown in Table 1. Comparative Example 3 154225. Doc

S •36· 201233548 比車乂例3展示熱轉化需要高量消光劑,以產生低的60度 光厚值(/肖光外觀)於向空氣側,但卻具有非所欲之⑽度光 澤值於另一(非向空氣)側。 製備碳黑漿體如實例1。製備氧化紹聚體,其由51.72重 里百刀比的DMAC、24.14重量百分比的聚醯胺酸預聚合物 溶液(20.6重量百分比的聚醯胺酸固體於dmac中)以及 重里百刀比的阿伐氧化銘粉末(中值粒徑為約2.3微 米)所、.且成該些成分係於轉子定子高速分散研磨機中完 全混合。《體而後於球磨機中加卫,以碎裂大的黏聚 物。將該碳黑與氧化輯體_以去除任何殘留之大顆粒 或黏聚物。 藉由於高剪切混合器中與於DMAC中之5.8重量百分比的 PMDA溶液混合,而使pMDA/4,4,〇DA預聚合物溶液 (20.6%的聚醢胺酸固體,約5〇泊之黏度)「完成」,以増加 分子量與黏度至約1500泊。將該完成溶液過濾,並於高剪 切混合器中與該低傳導度碳黑及氧化鋁漿體混合,隨同額 外之PMDA完成溶液,以及少量的脫帶劑(其使該經鑄型綠 膜能夠輕易自該鑄型帶上剝除)。調整該pMDA完成溶液之 量以達到黏度為1200泊。該聚合物、漿體與完成溶液之相 對直皆可經調整,以達到所欲之碳黑與氧化鋁的裝载程 度,以及在鑄型模具中之壓力。將該完成聚合物/漿體混 合物壓送通過過濾器並至狹縫式模具,其中該液流係經分 流以形成三層共擠型(coextruded)膜的外層。 將PMDA/4,4ODA預聚合物聚合物溶液之第二液流完成 154225.doc -37- 201233548 於问剪切混合器中而達〗500泊的黏度,並壓送通過過濾器 且至該鑄型模具中,以形成三層共擠型膜的中間非填充聚 醯亞胺核層。6亥外層以及該非填充聚酿亞胺核層溶液的流 率係經調整,以達到所欲之層厚度。 藉由將上述組件自該狹縫式模具鑄型於移動不鏽鋼帶 上,以生產三層共擠型膜。該帶係通過對流烘箱,以蒸發 浴液並部分醯亞胺化該聚合物,而產生「綠」膜。綠膜固 體(使其加熱至300t:並測量其重量損失)為72 6%。將該綠 膜自垓鑄型帶上剝離並加以捲繞。而後使該綠膜通過拉幅 烘箱以產生經固化之聚醯亞胺膜。在拉幅過程中藉由在 邊緣限制該膜以控制收縮。經固化膜之固體程度(使其加 熱至300°C並測量其重量損失)為98.8% » 該中間未填充層包含該多層膜之33%或1/3的總厚度並 且該外層含有等厚度之氧化鋁與低傳導度碳黑。該外層含 有7重量百分比的低傳導度碳黑與3〇重量百分比的氧化 鋁。總膜厚為0.49 mils。 結果係不於表1。 拉伸強度及斷裂伸長度示於表3。 比較例4與5展示需要一些量的消光劑以達到低的6〇度光 澤值(消光外觀)於基膜兩側,並進一步展示粒徑低於13微 米之消光劑會產生光澤基膜。 比較例4 具有中值粒徑為0.3微米之碳黑漿體係製備如實例1。該 漿體係與PMDA/4,4,ODA預聚合物溶液(2〇·6%的聚醯胺酸 154225.doc •38· 201233548 固體,約5 0泊之黏度)混合,其量為可在經固化膜基礎上 產生7重量百分比的碳黑。該混合物藉由增量地加入於 DMAC中之6重量百分比的PMDA溶液並同時進行混合而完 成’以達到最終黏度為約1900泊。將該完成之聚合物混合 物經真空除氣。將該聚合物混合物鑄型於Mylar®聚對苯二 甲酸乙二醇酯片上,並如實例3中所述將其化學醯亞胺化 及固化。 結果係示於表1。 比較例5 在該完成之貫例1聚醒胺酸/¾黑混合物的計量液流_ , 計量供給額外之碳黑漿體,以使該碳黑含量在經固化膜基 礎上增加至7重量百分比’並且該兩液流使用高剪切轉子 定子混合器加以完全混合。一經化學醢亞胺化之基膜係產 生如實例1中所述。 結果係示於表1。 比較例6 比較例6展示在使用30重量百分比的BaS04來進行化學 轉化時,相較於使用10重量百分比BaS〇4來進行化學轉化 的實例5,的確顯示出介電強度如預期般降低。但令人驚 喜的是,使用30重量百分比的BaS04來進行化學轉化,相 較於使用10重量百分比BaS04來進行熱轉化的比較例1, 可產生較高的介電強度。 製備碳黑漿體如實例1。製備一合成硫酸鋇(Blanc Fixe F,from Sachtleben Chemie GmbH)漿體,其由51 7重量百 154225.doc •39· 201233548 分比的DMAC、24.1重量百分比的預聚合物溶液(20.6重量 百分比的聚醯胺酸固體於DMAC中)與24.1重量百分比的硫 酸鋇粉末所組成。將該些成分在高剪切轉子定子型混合器 中完全混合。中值粒徑為1.3微米。 該些漿體係與PMDA/4,4'ODA聚醯胺酸溶液(20.6重量百 分比的聚醯胺酸固體,約50泊之黏度)混合,其量為可在 經固化膜基礎上產生7重量百分比的碳黑與30重量百分比 的硫酸鋇。該混合物藉由增量地加入於DMAC中之6重量 百分比的PMDA溶液並同時進行混合而完成,以達到最終 黏度為約2400泊。將該完成之聚合物混合物經真空除氣。 將該聚合物混合物鑄型於Mylar®聚對苯二甲酸乙二醇酯片 上,並如實例3中所述將其化學醯亞胺化及固化。 結果係示於表1。 實例6至7展示使用較低量之消光劑以及化學轉化,仍可 於基膜兩側上達到低的60度光澤值(消光外觀)以及高介電 強度。 實例6 一經化學醯亞胺化之黑色聚醯亞胺基膜係製備如實例 1,除了二氧化矽漿體之計量流率降低37°/。。根據灰分分 析,該基膜含有2.2重量百分比的二氧化矽。 結果係示於表1。 拉伸強度及斷裂伸長度示於表3。 實例7 碳黑與二氧化矽漿體係製備如實例1。藉由於高剪切混 154225.doc • 40-S •36· 201233548 shows that the thermal conversion requires a high amount of matting agent to produce a low 60 degree light thickness value (/Shaw light appearance) on the air side, but has an undesired (10) degree gloss value. On the other (non-air) side. A carbon black slurry was prepared as in Example 1. Preparation of oxidized homopolymer, which consists of 51.72 liters of DMAC, 24.14% by weight of polyaminic acid prepolymer solution (20.6 weight percent polyglycolic acid solid in dmac) and Agra Oxidized powder (median particle size of about 2.3 microns), and these components are completely mixed in the rotor stator high speed dispersion mill. The body is then added to the ball mill to break up the large cohesive mass. The carbon black is oxidized to remove any residual large particles or cohesive polymers. PMDA/4,4,〇DA prepolymer solution (20.6% polyglycolic acid solid, about 5 Torr) by mixing with 5.8 wt% PMDA solution in DMAC in a high shear mixer Viscosity) "Complete" to add molecular weight and viscosity to about 1500 poise. The completed solution is filtered and mixed with the low conductivity carbon black and alumina slurry in a high shear mixer, along with additional PMDA completion solution, and a small amount of stripping agent (which causes the cast green film) Can be easily stripped from the mold belt). The amount of the pMDA completion solution was adjusted to achieve a viscosity of 1200 poise. The polymer, slurry and the completion solution can be adjusted to achieve the desired loading of carbon black and alumina, as well as the pressure in the mold. The finished polymer/slurry mixture is forced through a filter and to a slot die where the liquid stream is split to form an outer layer of a three layer coextruded film. The second stream of PMDA/4,4 ODA prepolymer polymer solution is completed 154225.doc -37-201233548 in a shear mixer to achieve a viscosity of 500 poise, and is passed through the filter and to the casting In the mold, an intermediate non-filled polyimine core layer of a three-layer co-extruded film is formed. The flow rate of the outer layer of 6 kel and the solution of the unfilled polyimine core layer is adjusted to achieve the desired layer thickness. A three-layer co-extruded film was produced by casting the above assembly from the slit die onto a moving stainless steel belt. The tape is passed through a convection oven to evaporate the bath and partially iridize the polymer to produce a "green" film. The green film solid (which was heated to 300 t: and its weight loss was measured) was 72 6%. The green film was peeled off from the tantalum mold tape and wound up. The green film is then passed through a tenter oven to produce a cured polyimide film. The film is restrained at the edge by the film during the tentering process to control shrinkage. The solidification degree of the cured film (heating it to 300 ° C and measuring its weight loss) was 98.8% » The intermediate unfilled layer contained a total thickness of 33% or 1/3 of the multilayer film and the outer layer contained an equal thickness Alumina and low conductivity carbon black. The outer layer contained 7 weight percent of low conductivity carbon black and 3 weight percent of aluminum oxide. The total film thickness is 0.49 mils. The results are not in Table 1. Tensile strength and elongation at break are shown in Table 3. Comparative Examples 4 and 5 show that some amount of matting agent is required to achieve a low 6-degree gloss value (matting appearance) on both sides of the base film, and further exhibiting a matting agent having a particle size of less than 13 μm produces a glossy base film. Comparative Example 4 A carbon black slurry system having a median diameter of 0.3 μm was prepared as in Example 1. The slurry system is mixed with PMDA/4,4, ODA prepolymer solution (2〇·6% poly lysine 154225.doc •38· 201233548 solid, viscosity of about 50 poise), the amount of which can be 7 weight percent of carbon black was produced on the basis of the cured film. The mixture was completed by incrementally adding a 6 weight percent PMDA solution in DMAC and mixing simultaneously to achieve a final viscosity of about 1900 poise. The finished polymer mixture was degassed by vacuum. The polymer mixture was cast onto Mylar® polyethylene terephthalate sheets and chemically imidized and cured as described in Example 3. The results are shown in Table 1. Comparative Example 5 The metered liquid stream _ of the completed polyglycine/3⁄4 black mixture was metered into an additional carbon black slurry to increase the carbon black content to 7 weight percent based on the cured film. 'And the two streams are thoroughly mixed using a high shear rotor stator mixer. The base film system which was chemically imidized was produced as described in Example 1. The results are shown in Table 1. Comparative Example 6 Comparative Example 6 shows that when chemical conversion using 30% by weight of BaS04 was carried out, Example 5, which was chemically converted using 10% by weight of BaS?4, did show a decrease in dielectric strength as expected. Surprisingly, however, the chemical conversion was carried out using 30 weight percent of BaS04, which resulted in a higher dielectric strength than Comparative Example 1 which used 10% by weight of BaS04 for thermal conversion. A carbon black slurry was prepared as in Example 1. A synthetic barium sulfate (Blanc Fixe F, from Sachtleben Chemie GmbH) slurry was prepared from 51 7 weight percent 154225.doc •39·201233548 ratio DMAC, 24.1 weight percent prepolymer solution (20.6 weight percent poly The proline acid solids were in DMAC and consisted of 24.1 weight percent barium sulfate powder. The ingredients are thoroughly mixed in a high shear rotor stator type mixer. The median particle size is 1.3 microns. The pulp systems were mixed with a PMDA/4,4' ODA polyaminic acid solution (20.6 weight percent polyglycolic acid solid, about 50 poise viscosity) in an amount of 7 weight percent based on the cured film. Carbon black with 30 weight percent barium sulfate. The mixture was completed by incrementally adding a 6 weight percent PMDA solution in DMAC while mixing to achieve a final viscosity of about 2400 poise. The finished polymer mixture was degassed by vacuum. The polymer mixture was cast on a Mylar® polyethylene terephthalate sheet and chemically imidized and cured as described in Example 3. The results are shown in Table 1. Examples 6 through 7 show that using a lower amount of matting agent and chemical conversion, a low 60 degree gloss value (matte appearance) and high dielectric strength can still be achieved on both sides of the base film. Example 6 A chemically yttrium-imided black polyimine-based film system was prepared as in Example 1, except that the metered flow rate of the cerium oxide slurry was reduced by 37°/. . According to the ash analysis, the base film contained 2.2% by weight of cerium oxide. The results are shown in Table 1. Tensile strength and elongation at break are shown in Table 3. Example 7 A carbon black and cerium oxide slurry system was prepared as in Example 1. By high shear mixing 154225.doc • 40-

S 201233548 合器中與於DMAC中之5.8重量百分比的PMDA溶液混合, 而使PMDA/4,4'ODA預聚合物溶液(20.6%的聚醯胺酸固 體,約50泊之黏度)「完成」,以增加分子量與黏度至約 25 00泊。將該完成之聚醯胺酸溶液之計量液流冷卻至約· 1〇 C。將轉化化學品乙針(0.18 cm3/cm3聚合物溶液)與3-甲吡啶(0.17 cm3/cm3聚合物溶液)之計量液流同樣地冷 卻,隨同碳黑(0.095 cm3/cm3聚合物溶液)與二氧化矽漿體 (0.029 cm3/cm3聚合物溶液)之計量液流,以高剪切混合器 混合至該聚醯胺酸溶液中。將該冷卻之混合物過濾並立即 使用狹縫式模具於l〇5°C熱旋轉鼓上鑄型為膜。將所生成 之膠膜由該鼓上剝離並輸送至拉幅烘箱中,其中該膜係使 用對流與輻射熱乾燥並固化至固體程度大於98%。該基膜 含有約5.5重量百分比的碳黑。根據灰分分析,該基膜含 有1.8重量百分比的二氧化石夕。 結果係示於表1。 拉伸強度及斷裂伸長度示於表3。 實例8 一碳黑漿體係製備如實例丨。氧化鋁漿體係製備如比較 例3。該些漿體係與PMDA/4,4,〇DA預聚合物溶液(2〇 6%的 聚醯胺酸固體,約50泊之黏度)混合,其量為可在經固化 膜基礎上產生5重量百分比的碳黑與1〇重量百分比的二氧 化矽。該混合物藉由增量地加入於DMAC中之6重量百分 比的PMDA溶液並同時進行混合而完成,以達到最終黏度 為、19 0 0泊將5亥完成之聚合物混合物經真空除氣。將該 154225.doc •41 - 201233548 聚合物混合物鎮型於My lar®聚對苯二曱酸乙二醇酯片上, 並如實例3中所述將其化學醯亞胺化及固化。 結果係不於表1。 比較例7 比較例7展示在使用如實例8中所用之相同消光劑量進行 熱轉化,在基膜兩側上產生高的(非所欲之)6〇度光澤值, 並且具有低介電強度。 一碳黑漿體係製備如實例1。氧化鋁漿體係製備如比較 例3 »該些漿體係與PMda/4,4,〇DA預聚合物溶液(20.6%的 聚酿胺酸固體’約50泊之黏度)混合,其量為可在經固化 膜基礎上產生5重量百分比的碳黑與10重量百分比的二氧 化石夕。該混合物藉由增量地加入於DMAC中之6重量百分 比的PMDA溶液並同時進行混合而完成,以達到最終黏度 為約1900泊。將該完成之聚合物混合物經真空除氣。如比 較例2中所述將膜鑄型及經熱醯亞胺化。 結果係不於表1。 比較例8與9展示需要高於1 5重量百分比的消光劑量, 以便在基膜兩側上達到低的6〇度光澤值(消光外觀)。 比較例8 該基膜係製備如實例3,並且在經固化膜基礎上具有1重 量百分比的二氧化矽。 結果係不於表1。 比較例9 該基膜係製備如實例3 ,並且在經固化膜基礎上具有i 5 154225.docS 201233548 combiner with 5.8 wt% PMDA solution in DMAC, and make PMDA/4,4' ODA prepolymer solution (20.6% polyamic acid solid, viscosity about 50 poise) "complete" To increase molecular weight and viscosity to about 25 00 poise. The metered liquid stream of the completed polyamic acid solution is cooled to about 1 〇 C. The conversion chemical needle (0.18 cm3/cm3 polymer solution) was cooled in the same manner as the metered solution of 3-methylpyridine (0.17 cm3/cm3 polymer solution), along with carbon black (0.095 cm3/cm3 polymer solution) and A metered stream of cerium oxide slurry (0.029 cm3/cm3 polymer solution) was mixed into the polyamic acid solution in a high shear mixer. The cooled mixture was filtered and immediately cast into a film on a hot rotating drum at 10 °C using a slit die. The resulting film was peeled from the drum and conveyed to a tenter oven wherein the film was dried using convection and radiant heat and solidified to a degree of solids greater than 98%. The base film contains about 5.5 weight percent carbon black. According to the ash analysis, the base film contained 1.8% by weight of cerium oxide. The results are shown in Table 1. Tensile strength and elongation at break are shown in Table 3. Example 8 A carbon black slurry system was prepared as in Example 丨. The alumina slurry system was prepared as in Comparative Example 3. The slurry systems are mixed with PMDA/4,4, 〇DA prepolymer solution (2〇6% polyamic acid solid, about 50 poise viscosity) in an amount of 5 weights on the cured film basis. Percentage of carbon black with 1% by weight of cerium oxide. The mixture was completed by incrementally adding 6 weight percent of the PMDA solution in the DMAC and mixing at the same time to achieve a final viscosity of 190 poise and 5 liters of the finished polymer mixture was vacuum degassed. The 154225.doc •41 - 201233548 polymer blend was aged on My lar® polyethylene terephthalate tablets and chemically amided and cured as described in Example 3. The results are not in Table 1. Comparative Example 7 Comparative Example 7 shows thermal conversion using the same matting dose as used in Example 8, producing high (unwanted) 6-degree gloss values on both sides of the base film, and having a low dielectric strength. A carbon black slurry system was prepared as in Example 1. Alumina slurry system preparation as in Comparative Example 3 » The slurry systems were mixed with PMda/4,4, 〇DA prepolymer solution (20.6% polyamic acid solids 'about 50 poise viscosity), the amount of which was 5 parts by weight of carbon black and 10% by weight of silica dioxide were produced on the basis of the cured film. The mixture was completed by incrementally adding 6 weight percent of PMDA solution in DMAC and mixing at the same time to achieve a final viscosity of about 1900 poise. The finished polymer mixture was degassed by vacuum. The film was cast and heat-imided as described in Comparative Example 2. The results are not in Table 1. Comparative Examples 8 and 9 show that a matting dose of more than 15 weight percent is required to achieve a low 6 twist gloss value (matte appearance) on both sides of the base film. Comparative Example 8 This base film was prepared as in Example 3, and had 1 weight percent of cerium oxide based on the cured film. The results are not in Table 1. Comparative Example 9 This base film was prepared as in Example 3 and had i 5 154225.doc on the basis of the cured film.

S -42· 201233548 重量百分比的二氧化矽。 結果係示於表1。 比李父例10與11展示該消光劑之中值粒徑具有下限,方能 達到低的60度光澤值。 比較例10 製備碳黑漿體如實例1。製備氧化鋁漿體,其由8丨4重 量百分比DMAC、8.3重量百分比的pmda/BPDA//4,4'-ODA/PPD預聚合物溶液(14.5重量百分比聚醯胺酸固體於 DMAC中)、0.1重量百分比的分散劑與1〇 2重量百分比的 氣相式(fumed)氧化鋁粉末所組成。將該些成分在轉子定 子高速分散研磨機中完全混合》該漿體而後於介質研磨機 (media mill)中加工,以碎裂大的黏聚物並達到中值粒徑為 約0.35 μιη。該些漿體係與PMDA/4,4ODA預聚合物溶液 (20_6%的聚醯胺酸固體,約5〇泊之黏度)混合,其量為可 在經固化膜基礎上產生5重量百分比的碳黑與2重量百分比 的氧化鋁。該混合物藉由增量地加入於DMAC中之6重量 百分比的PMDA溶液並同時進行混合而完成’以達到最終 黏度為約21 50泊。將該完成之聚合物混合物經真空除氣。 將該聚合物混合物鑄型於Mylar®聚對苯二曱酸乙二醇酯片 上’並如實例3中所述將其化學醯亞胺化及固化。 結果係示於表1。 比較例11 製備無水磷酸氫鈣(CaHP〇4)漿體,其由11.5重量百分比 的磷酸氫鈣、64.7重量百分比的聚醯胺酸預聚合物溶液 154225.doc -43· 201233548 (20.6重量百分比的聚醯胺酸固體於DMAC中)與23.8重量百 分比的DMAC所組成。將該些成分在高剪切轉子定子型混 合器中完全混合。令值粒徑為1,25微米。 該磷酸氫鈣漿體係計量供給至並混合以該完成之實例1 聚合物/碳黑混合物的經冷卻(-8°C )計量液流,隨同該轉化 化學品,並且使用基本上如同實例1之程序將聚醯亞胺膜 鑄型與固化。所生成之基膜含有5重量百分比的碳黑與2.8 重量百分比的磷酸氫鈣。 結果係示於表1。 比較例12 比較例12展示高密度消光劑會在基膜兩側上產生高的 (非所欲之)60度光澤值。 製備碳黑漿體如實例1 ^製備鈦酸鎖(Sakai,BT-05)漿 體,其由75重量百分比、1〇重量百分比的聚醯胺 酸預聚合物溶液(20.6重量百分比的聚醯胺酸固體於dmaC 中)與15重量百分比的鈦酸鋇粉末所組成。該些成分係於 冋剪切轉子定子型混合器中完全混合,而後經聲解處理 (sonicated)以達到中值粒徑為15微米。 該些浆體係與PMDA/4,4,〇DA預聚合物溶液(20.6%的聚 醯胺S义固體’約5 〇 $之黏度)混合,其量為可在經固化膜 基礎上產生5重量百分比的碳黑與2重量百分比的鈦酸鋇。 該混合物藉由增量地加入於DMAC中之6重量百分比的 PMDA★液並同時進行混合而完成,以達到最終黏度為約 0泊將》亥το成之聚合物混合物經真空除氣。將該聚合 154225.doc 201233548 物混合物鑄型於Mylar®聚對苯二曱酸乙二醇酯片上,並如 實例3中所述將其化學醯亞胺化及固化。 結果係示於表1。 實例9、10與11 該基膜係製備如實例3,除了該二氧化矽漿體量係經調 整,以在經固化膜基礎上分別產生5重量百分比、7·5重量 百分比與10重量百分比的二氧化矽。 結果係不於表1。 實例12與13 該膜係製備如實例1。該漿體係與?]^〇八/4,4'00八預聚合 物溶液(20.6¾的聚酿胺酸固體,約5〇泊之黏度)混合,其 量為可在經固化膜基礎上產生5重量百分比的碳黑與22重 量百分比的二氧化矽。使該混合物完成、將其鑄型為膜、 經化學醯亞胺化並固化如實例1。條件可經調整以產生2 mil與5 mil厚之基膜。 結果係示於表1。 實例14與15 二氧化矽粉末(Syloid® C 803)係於空氣分級器(air classifier)中處理’以去除部分的最大顆粒。自經該空氣分 級之二氧化矽製備將體,其製備如實例1中所述。中值粒 徑為2.1微米。碳黑漿體係製備如實例1 ^該碳黑與二氧化 矽漿體係與PMDA/4,4ODA預聚合物溶液(20.6%的聚醯胺 酸固體,約50泊之黏度)混合,其量為可在經固化膜基礎 上產生5重量百分比的碳黑與2重量百分比及4重量百分比 154225.doc -45· 201233548 的二氧化矽。使該混合物完成並且製備該基膜如實例3。 結果係示於表1。 實例16 貫例16展示使用不同之低傳導度碳黑的化學轉化,仍可 於基膜兩側上達到低的60度光澤值(消光外觀)以及高介電 強度。 製備板黑漿體,其由80重量百分比的DMAC、1 0重量百 分比的預聚合物溶液(20.6重量百分比的聚醯胺酸固體於 DMAC中)與1〇重量百分比的槽型且具有6%揮發物含量之 碳黑(Printex U,from Evonik Degussa)所組成。該些成分係 於轉子定子分散器中完全混合。該漿體而後以超音波處理 器(Sonics & Materials, Inc.,Model VCX-500)處理,以去 黏聚(deaggl〇merate)該碳黑。二氧化矽漿體係製備如實例 1。該些聚體係與卩]\40入/4,4,00八預聚合物溶液(20.6%的聚 醯胺酸固體’約5 0泊之黏度)混合,其量為可在經固化膜 基礎上產生5重量百分比的碳黑與2重量百分比的二氧化 矽。該混合物藉由增量地加入於DMAC中之6重量百分比 的PMDA溶液並同時進行混合而完成,以達到最終黏度為 約2250泊。 實例3中所述之程序係用以製備該經化學醯亞胺化之基 膜。 結果係示於表1。 比較例13 比較例13展不在如實例丨6中之相同消光劑量進行熱轉 •46- 154225.docS -42· 201233548 Percent by weight of cerium oxide. The results are shown in Table 1. It is shown that the median particle size of the matting agent has a lower limit than that of the fathers 10 and 11 to achieve a low 60 degree gloss value. Comparative Example 10 A carbon black slurry was prepared as in Example 1. An alumina slurry was prepared from 8 丨 4 weight percent DMAC, 8.3 weight percent pmda/BPDA//4, 4'-ODA/PPD prepolymer solution (14.5 weight percent polyglycolic acid solids in DMAC), 0.1% by weight of the dispersant was composed of 1% by weight of fumed alumina powder. The ingredients were thoroughly mixed in a rotor stator high speed dispersion mill. The slurry was then processed in a media mill to break up the large cohesive mass and achieve a median particle size of about 0.35 μιη. The slurry systems are mixed with a PMDA/4,4 ODA prepolymer solution (20-6% polyamic acid solid, about 5 Torr) in an amount to produce 5 weight percent carbon black on a cured film basis. With 2 weight percent alumina. The mixture was completed by incrementally adding a 6 weight percent PMDA solution in DMAC while mixing to achieve a final viscosity of about 21 50 poise. The finished polymer mixture was degassed by vacuum. The polymer mixture was cast on Mylar® polyethylene terephthalate sheet and chemically ruminated and cured as described in Example 3. The results are shown in Table 1. Comparative Example 11 An anhydrous calcium hydrogen phosphate (CaHP〇4) slurry was prepared, which consisted of 11.5 weight percent of calcium hydrogen phosphate, 64.7 weight percent of a polyamido acid prepolymer solution 154225.doc -43·201233548 (20.6 weight percent The polyglycolic acid solids were composed in DMAC with 23.8 weight percent DMAC. These ingredients are thoroughly mixed in a high shear rotor stator type mixer. The order particle size is 1,25 microns. The calcium hydrogen phosphate slurry system is metered into and mixed with the cooled (-8 ° C) metered liquid stream of the completed Example 1 polymer/carbon black mixture, along with the conversion chemical, and used substantially as in Example 1. The procedure casts and cures the polyimide film. The resulting base film contained 5 weight percent carbon black and 2.8 weight percent calcium hydrogen phosphate. The results are shown in Table 1. Comparative Example 12 Comparative Example 12 shows that a high density matting agent produces a high (unwanted) 60 degree gloss value on both sides of the base film. Preparation of a carbon black slurry as in Example 1 ^Preparation of a titanate lock (Sakai, BT-05) slurry from 75 weight percent, 1 weight percent polyphosphoric acid prepolymer solution (20.6 weight percent polyamine) The acid solid is in dmaC) and 15% by weight of barium titanate powder. The ingredients were thoroughly mixed in a tantalum shear rotor stator type mixer and then sonicated to a median particle size of 15 microns. The pulp systems are mixed with a PMDA/4,4, 〇DA prepolymer solution (20.6% of a polyamidamine S-solids viscosity of about 5 〇$) in an amount of 5 weights on a cured film basis. Percentage of carbon black with 2 weight percent barium titanate. The mixture was completed by incrementally adding 6 weight percent PMDA solution in DMAC and mixing at the same time to achieve a final viscosity of about 0 poise. The polymer mixture was vacuum degassed. The polymer mixture 154225.doc 201233548 mixture was cast onto Mylar® polyethylene terephthalate sheets and chemically imidized and cured as described in Example 3. The results are shown in Table 1. Examples 9, 10 and 11 The base film was prepared as in Example 3 except that the amount of the cerium oxide slurry was adjusted to produce 5 weight percent, 7.5 weight percent, and 10 weight percent, respectively, based on the cured film. Ceria. The results are not in Table 1. Examples 12 and 13 The film system was prepared as in Example 1. The pulp system with? ] ^ 〇 8 / 4, 4 '00 eight prepolymer solution (20.63⁄4 polyamic acid solid, about 5 Torr viscosity) mixed in an amount of 5 weight percent carbon on the basis of the cured film Black with 22 weight percent cerium oxide. The mixture was completed, cast into a film, chemically imidized and cured as in Example 1. Conditions can be adjusted to produce a base film of 2 mils and 5 mils thick. The results are shown in Table 1. Examples 14 and 15 cerium oxide powder (Syloid® C 803) was treated in an air classifier to remove a portion of the largest particles. The bulk was prepared from the air classified cerium oxide as described in Example 1. The median particle diameter was 2.1 microns. The carbon black slurry system was prepared as in Example 1 ^ The carbon black and cerium oxide slurry system was mixed with PMDA/4,4 ODA prepolymer solution (20.6% polyamic acid solid, about 50 poise viscosity), and the amount was 5 weight percent carbon black and 2 weight percent and 4 weight percent 154225.doc -45·201233548 cerium oxide were produced on a cured film basis. The mixture was completed and the base film was prepared as in Example 3. The results are shown in Table 1. Example 16 Example 16 shows chemical conversion using different low conductivity carbon blacks, still achieving a low 60 degree gloss value (matte appearance) and high dielectric strength on both sides of the base film. A black pulp body was prepared which consisted of 80 weight percent DMAC, 10 weight percent prepolymer solution (20.6 weight percent polyglycolic acid solids in DMAC) and 1 weight percent of the tank and had 6% volatilization The content of carbon black (Printex U, from Evonik Degussa). These components are completely mixed in the rotor stator disperser. The slurry was then treated with an ultrasonic processor (Sonics & Materials, Inc., Model VCX-500) to deaggl〇merate the carbon black. The cerium oxide slurry system was prepared as in Example 1. The poly system is mixed with 卩]\40/4,4,00 eight prepolymer solution (20.6% polyamic acid solids 'about 50 poise viscosity), the amount of which can be based on the cured film 5 weight percent carbon black and 2 weight percent cerium oxide were produced. The mixture was completed by incrementally adding a 6 weight percent PMDA solution in DMAC while mixing to achieve a final viscosity of about 2250 poise. The procedure described in Example 3 was used to prepare the chemically imidized base film. The results are shown in Table 1. Comparative Example 13 Comparative Example 13 was not subjected to the same extinction dose as in Example 热6 for thermal transfer. 46-154225.doc

S 201233548 化在基膜兩側上產生高的(非所欲之)60度光澤值以及低 介電強度。 。亥些展體係製備如實例16。使用不鏽鋼鑄型棒,將該完 成之1〇物混合物以手動方式鑄型於玻璃板上◊將含有該 '…、鑄!臈之玻璃板放置於加熱板上,並在80至l〇〇〇C放置 30至45分鐘’以形成部分乾燥且部分醯亞胺化之「綠」 膜。將該綠膜由該玻璃板上剥除並放置於栓框上。將含有 該、’彔膜之栓框放置於丨2〇它烘箱中。將該烘箱溫度在⑼至 75刀鐘的時間内昇高至32〇°C ,在32(TC持溫10分鐘,而後 轉移至4GG°C棋箱中並持溫5分鐘,之後將其從該烘箱中移 出並使其冷卻。 結果係示於表1。 實例17 實例17展不使用不同之低傳導度碳黑的化學轉化,仍可 於基膜兩側上達到低的6〇度光澤值(消光外觀)以及高介電 強度。 該基膜係製備如實例16 ’除了該碳黑漿體係製備自爐 黑’其具有3.5%的揮發物含量(Spedal Black 55〇,得自 Evonik Degussa) » 結果係示於表1。 比較例14 比較例14展示在如實例17中之相同消光劑量進行熱轉 化’在基膜兩側上產生高的(非所欲之)6〇度光澤值以及低 介電強度。 154225.doc •47· 201233548 該基膜係製備如比較例13,除了該碳黑漿體係製備自爐 黑,其具有3.5%的揮發物含量(Special Black 550,得自 Evonik Degussa) 〇 結果係示於表1。 實例18 實例1 8展示使用不同之低傳導度碳黑的化學轉化,仍可 於基膜兩側上達到低的60度光澤值(消光外觀)以及高介電 強度。 該基膜係製備如實例16,除了該碳黑漿體係製備自爐 黑,其具有1.2%的揮發物含量(Printex 55,得自以⑽比 Degussa) ° 結果係示於表1。 比較例15 比較例15展示在如實例ι8中之相同消光劑量進行熱轉 化,在基膜兩側上產生高的(非所欲之)6〇度光澤值以及低 介電強度。 該基膜係製備如比較例13,除了該碳黑漿體係製備自爐 黑’其具有1.2%的揮發物含量(printex 55,得自Evonik Degussa) ° 結果係不於表1。 比較例16 比較例16展示藉由使用高裝載(3〇重量%)之消光劑,熱 轉化可達到所欲之60度光澤值於該基膜之向空氣側但該 基膜之另一側則具有高的(非所欲之)6〇度光澤值,並且其 154225.docS 201233548 produces a high (unwanted) 60 degree gloss value and low dielectric strength on both sides of the base film. . The preparation system was prepared as in Example 16. Using a stainless steel mold bar, the finished mixture is manually cast onto a glass plate and will contain the '..., cast! The glass plate of the crucible was placed on a hot plate and placed at 80 to 1 C for 30 to 45 minutes to form a partially dried and partially pyriminated "green" film. The green film was peeled off from the glass plate and placed on a frame. The frame containing the 彔 film was placed in a 丨2〇 oven. The oven temperature was raised to 32 ° C for a period of (9) to 75 knives, held at 32 (TC for 10 minutes, then transferred to a 4 GG ° C box and held for 5 minutes, after which it was taken from The oven was removed and allowed to cool. The results are shown in Table 1. Example 17 Example 17 exhibited a low 6-degree gloss value on both sides of the base film without chemical conversion of different low-conductivity carbon blacks. The matte appearance) and the high dielectric strength. The base film was prepared as in Example 16 'except that the carbon black slurry system was prepared from Furnace Black' with a volatile content of 3.5% (Spedal Black 55〇 from Evonik Degussa) » Results The scheme is shown in Table 1. Comparative Example 14 Comparative Example 14 shows the same extinction dose as in Example 17 for thermal conversion 'produces high (unwanted) 6-degree gloss values on both sides of the base film and low dielectric 154225.doc •47· 201233548 The base film was prepared as in Comparative Example 13, except that the carbon black slurry system was prepared from Furnace Black with a volatile content of 3.5% (Special Black 550 from Evonik Degussa). The system is shown in Table 1. Example 18 Example 1 8 shows the use of different low pass Chemical conversion of carbon black can still achieve a low 60 degree gloss value (matte appearance) and high dielectric strength on both sides of the base film. The base film is prepared as in Example 16, except that the carbon black slurry system is prepared from the furnace. Black, which has a volatile content of 1.2% (Printex 55, derived from (10) to Degussa). The results are shown in Table 1. Comparative Example 15 Comparative Example 15 shows the same amount of matting as in Example ι8 for thermal conversion, A high (unwanted) 6-degree gloss value and a low dielectric strength were produced on both sides of the base film. The base film was prepared as in Comparative Example 13, except that the carbon black slurry system was prepared from Furnace Black, which had 1.2%. Volatile content (printex 55 from Evonik Degussa) ° The results are not shown in Table 1. Comparative Example 16 Comparative Example 16 shows that by using a high loading (3 重量% by weight) matting agent, thermal conversion can achieve the desired The 60 degree gloss value is on the air side of the base film but the other side of the base film has a high (unintended) 6 degree gloss value, and its 154225.doc

S •48- 201233548 介電強度為低。 碳黑與二氧化矽漿體係製備如實例1。該些漿體係與 PMDA/4,4’ODA預聚合物溶液(20.6%的聚醯胺酸固體,約 4500泊之黏度)混合,其量為可在經固化膜基礎上產生5重 量百分比的碳黑與30重量百分比的二氧化矽。該混合物藉 由增量地加入於DMAC中之6重量百分比的PMDA溶液並同 時進行混合,以調整至黏度為300泊。將該完成之聚合物 混合物經真空除氣。使用不鏽鋼鑄型棒,將膜以手動方式 鑄型於玻璃板上。將含有該濕鑄型膜之玻璃板放置於加熱 板上,並在80至1〇〇1放置3〇至45分鐘,以形成部分乾燥 且口P分酸亞胺化之「綠」膜。將該綠膜由該玻璃板上剝除 並放置於栓框上。將含有該綠膜之检框放置㈣代洪箱 中。將該供箱溫度在60至75分鐘的時間内昇高至32代, 在32(TC持溫1G分鐘,而後轉移至4㈣烘箱中並持溫以 鐘’之後將其從該烘箱中移出並使其冷卻。 結果係示於表1。 154225.doc -49- 201233548S •48- 201233548 Dielectric strength is low. The carbon black and cerium oxide slurry system was prepared as in Example 1. The slurry systems are mixed with a PMDA/4,4' ODA prepolymer solution (20.6% polyamic acid solid, about 4,500 poise viscosity) in an amount to produce 5 weight percent carbon on a cured film basis. Black with 30% by weight of cerium oxide. The mixture was adjusted to a viscosity of 300 poise by incrementally adding 6 wt% of the PMDA solution in the DMAC and mixing at the same time. The finished polymer mixture was degassed by vacuum. The film was manually cast onto a glass plate using a stainless steel mold bar. The glass plate containing the wet cast film was placed on a hot plate and placed at 80 to 1 Torr for 3 to 45 minutes to form a partially dried "green" film which was acid-imidized. The green film was peeled off from the glass plate and placed on the frame. Place the test frame containing the green film in the (4) generation box. The chamber temperature was raised to 32 generations over a period of 60 to 75 minutes, and was removed from the oven after 32 (TC held at 1 G minutes, then transferred to a 4 (four) oven and held at a temperature of 'clock' It was cooled. The results are shown in Table 1. 154225.doc -49- 201233548

Q d ΓΛ v〇 m oo 00 寸 v〇 00 in s vd ΚΓ) OO υ-ϊ <n vn ΓΛ 寸 s <> oo o ^d 寸 对· <N m 寸· ON 寸 v〇 (N v〇 S 卜 Vi m 卜 〇\ Ό Λ v〇 Λ 畋w来 〇 r- 寸 00 od CN oo CN o vo ^n m ν〇 On v〇 <N 寸 CN m (N m 寸 〇 (N ir> ON ^«4 »·< v〇 (^> 寸 m <N 卜 l> ^r> (N <N ΓΟ <N v〇 <S <Ν 卜 卜 厚度 (mils) 〇 v〇 Ο 00 o ^· o »—H H o 寸· m v〇 o v〇 〇 Os 寸 〇 ir> on (N i〇 C) 寸 o v〇 〇 in 〇 (N 寸 <N ON o 卜 VO 〇 〇 CN in o m o ΓΛ (Ν ^-Η 00 ON (N 介電 強度 (V/mil) S \o <N (N 〇 ΓΛ 00 VO v〇 <N ON r·^ 寸 o o V o 沄 V m m <N OO v〇 ON <N m 00 o ON 卜 CN oo <N (N tTi <N 〇 V 对 o 寸 (S VO 卜 (Ν o 5: (N 卜 (N Ο ΓΟ <Ν cn (N m (bs/uiqo) 吉"ϋ! yn + cs m iri + m 寸 + o ΓΛ 〇\ uo + ω s tn + PJ Os v〇 + W r*** On 00 ^o + 寸 r—Η 寸 + ω r*i 00 寸 + W 二 od IT) + ω Os oo vn + 守 m 对 + pq vo ΓΛ σ^ in + W VO CO T·^ 1"·^ + ν〇 vo »—H + UL) v〇 <N f g»jt l vo ^ 〇R W ^ m <N O vd CN <N Γ ΟΟ ψ-^ <N (N Os o vd 卜 'O o <N »—^ o \r^ oo m (N oo v〇 (N ΓΛ <N 寸 00 的 寸 〇 KTi OO κη ON 00 VO CS 〇〇 ο oo VI 糾w采 ^ ^ i〇 CN 寸 (N <N 〇 (N 〇\ r^ o 卜 CO 卜 vo o; cn oo 卜 ro m U-i m (N VO <N 〇 Os m oo 寸 卜 m ΓΛ 寸 Os vo (N cn νο ON m ^ ^ ω oi Os m (N (N 寸 寸 CN Os 寸 (N <N On m Os m CN Ν oi o CN ON oi o oo (Ν (N o <N c^· m (N 〇 (N 〇 <N ΓΛ I—H m 〇 (N m <N 1 1 ΓΛ 〇 <N 〇 (N m CN m CN Ο CN 〇 oi m o vn <N ν〇 I m m v〇 m 1 CO ΓΛ W Ί m sk jj CN Ί 寸 o C/3 CQ CQ O 寸 o C/D C〇 OQ 客 o -O 麻f Ί 寸 〇 1 1 1 1 寸 Ο ⑺ cd PQ o m <N <N Ί 00 璩 nsf g 塊 ;u isf 〇 备 Jjl Ί m 要O ^ — ^ < (N 寸 o 〇<· SC C3 u 求 00 (N 摄 (N Ί yri 容 v*> r^ 寸 PQ O) 寸 02 C/3 容 iT) 寸 CQ on 容 in 寸 PQ CO yr\ CQ C/D 卜 寸 PQ C/5 卜 寸 CQ <n s 寸 CQ oo 卜 呀 CQ C/D 容 r- 寸 ffl m % 卜 寸 PQ C/D 容 卜 寸 CQ 寸 CQ C/D *r» v-> 寸 CQ % CQ 00 寸 κη 寸 pa CO κη 寸 CQ C/D <n 寸 CQ % 寸 CO Ο) <η 寸 CQ 00 yn 寸 CQ C/D 客 yr) ¥进: 竦规 Wr jD 琳 揉· 癍 m 謝' ¥ Wr jj 謝' Wr 釙 (N m in (N m o νη VO o v〇 卜 oo 卜 ο 00 ON o o CN ο (7n O 154225.doc •50- s 201233548 (憋球) ά ό \〇 Λ 'Ο *〇 v〇 Λ 00 寸 (N 寸· 00 卜 ο «ο ρ - m *·^ (Ν (N (N 寸 卜 時w朱 〇 〇 CO ν〇 νο 卜 <N 卜 ο cn 00 CO t> CN Os 寸* (N cn m m Γ^ m ν〇 VO Os ψ-^ 寸 00 (N 厚度i (mils) (Ν CN ^•Η (Ν iT) (Ν to 00 o 00 On 〇 cn 卜 寸 寸 寸 v〇 v〇 00 o 介電 強度 (V/mil) (Ν <Ν οο 卜 CO Ο (S 卜 Os (Ν *—H cs cs ΓΟ On fO (N v-) v〇 m (M in *·~η ν〇 寸 〇\ Os vn oo 00 (N 向空氣側 之表面電 阻率 (ohtn/sq) m + ω ο ο m + ω 寸 m »-Η un »«·Η + ω 卜 Ό 卜 »—η + tQ m + Os 〇 Os V) + W oo o in + ω 卜 (Ν *-h 寸 + ω 甘 v〇 oo + ta (Ν ν〇 寸 t—< + W 00 v〇 m + ω + ω 寸 00 寸* f 1 Ό w? W ^ 00 (Ν WO CN Os 寸 C4 寸 CN Os «-Η v〇 OO v〇 OS 卜 寸 CN ν〇 νη o ^H ό 寸 寸 Os m '糾W來 守 oi 卜 CN Os <N (N (Ν ΟΊ m ON ΓΛ »—H m F—H Os Ό t**H τ—Η OO σ\ 卜 un Os 〇 消光劑 密度 g/cc (Ν <N p H oi (Ν <N 零_ 一 (N <N (N <Ν »—H (N CN (N 5 ® ν〇 ΓΛ I m ΓΟ v〇 cn 1 C^) m v〇 m 1 cn m (Ν oi v〇 cn 1 m cn v〇 m 1 m m v〇 m 1 cn ν〇 m 1 ΓΟ m 1 m v〇 m 1 C^) m v〇 1 ic -Ο Ί ο 1—^ «? Ί (Ν <N 、1 (N CN Μ (Ν irf Ί Ί (Ν 泠 Ί cs Ί CN «? Ί (Ν Ί <N «? Ί CN Μ 京 ο m 铁挑ί 2超 % ^ 寸 0Q 00 式 CQ 00 式 寸 CQ ζΛ 式 守 0Q 〇〇 寸 CQ on KTi D ^ i ^ c P ^ S ^ a 5% Special Black 550 5% Special 1 Black 550 »^ρ ^ ii KT) %^o ^ 〇v G> 寸 CQ vn Wr jJ 谢' Jj 癍 谢' 釙 Jj 癍 #. <N m 寸 yn VO co o 卜 寸 ο 00 Vi 〇 ο 154225.doc •51 - 201233548 實例19 實例19證明使用群青藍顏料的化學轉化在基膜的兩側上 達到低的60度光澤值(消光外觀),且光學密度顯著增加。 製備二氧化矽漿體,其係由75.4重量百分比的DMAC、 9.6重量百分比的PMDA/4,4'ODA聚醯胺酸預聚合物溶液 (在DMAC中之20.6重量百分比的聚醯胺酸固體)及15.0重量 百分比的二氧化石夕粉末(Syloid® C 803,來自W_ R. Grace Co.)所組成。將該些成分在高剪切轉子定子型混合器中完 全混合。中值粒徑為3.3至3.6微米。 一藍色顏料漿體係藉由首先將7.5克的群青藍顏料 (Nubicoat HWR,來自 Nubiola)分散在 38.9 克的 DMAC 中, 並以超音波處理器(Sonics & Materials, Inc.,型號VCX-5 00)進行10分鐘的處理,以反凝聚顏料所製備而成的。接 著將分散體與3.6克的PMDA/4,4’ODA聚醯胺酸預聚合物溶 液(在DMAC中之20.6重量百分比的聚醯胺酸固體)混合。 PMDA/4,4ODA預聚合物溶液(在DMAC中之20.6重量百 分比的聚醯胺酸固體)係藉由在DMAC中漸增地添加並混合 6重量百分比的PMDA溶液來完成,以達成約3000泊的最終 黏度。將6.1克的二氧化矽漿體及36.6克的藍色顏料漿體添 加至1 57.3克的已完成聚醯胺酸溶液,並徹底混合。對該 已完成的聚合物混合物進行除氣。使用不鏽鋼鑄型棒,將 該聚合物混合物以手動方式鑄型於貼附在玻璃板上的 Mylar®聚對苯二曱酸乙二醇酯片上。將含有該濕鑄型膜之 該Mylar®聚對苯二曱酸乙二醇酯片浸潰至浴中,該浴係由 •52- 154225.docQ d ΓΛ v〇m oo 00 inch v〇00 in s vd ΚΓ) OO υ-ϊ <n vn ΓΛ inch s <> oo o ^d inch pair · <N m inch · ON inch v〇( N v〇S 卜 Vi m 〇 〇 Ό 〇Λ v〇Λ 畋w to 〇r- inch 00 od CN oo CN o vo ^nm ν〇On v〇<N inch CN m (N m inch 〇 (N ir&gt ; ON ^«4 »·<v〇(^> 寸m <N 卜 l>^r> (N <N ΓΟ <N v〇<S <Ν卜卜厚度(mils) 〇 V〇Ο 00 o ^· o »—HH o inch · mv〇ov〇〇Os inch 〇 ir> on (N i〇C) inch ov〇〇in 〇 (N inch <N ON o VO 〇〇CN In omo ΓΛ (Ν ^-Η 00 ON (N dielectric strength (V/mil) S \o <N (N 〇ΓΛ 00 VO v〇<N ON r·^ inch oo V o 沄V mm < N OO v〇ON <N m 00 o ON 卜CN oo <N (N tTi <N 〇V vs o inch (S VO 卜(Ν o 5: (N 卜(N Ο ΓΟ <Ν cn ( N m (bs/uiqo) 吉 "ϋ! yn + cs m iri + m inch + o ΓΛ 〇\ uo + ω s tn + PJ Os v〇+ W r*** On 00 ^o + inch r-Η Inch + ω r*i 00 inch + W two od IT) + ω Os oo vn + m m to + pq vo ΓΛ σ^ In + W VO CO T·^ 1"·^ + ν〇vo »—H + UL) v〇<N fg»jt l vo ^ 〇RW ^ m <NO vd CN <N Γ ΟΟ ψ-^ <N (N Os o vd 卜 'O o <N »-^ o \r^ oo m (N oo v〇(N ΓΛ <N inch 00 inch 〇KTi OO κη ON 00 VO CS 〇〇ο Oo VI w w mining ^ ^ i〇CN inch (N <N 〇(N 〇\ r^ o Bu 卜 vo o; cn oo 卜 ro m Ui m (N VO <N 〇Os m oo 寸卜m寸 O Os vo (N cn νο ON m ^ ^ ω oi Os m (N (N inch N Os inch (N < N On m Os m CN Ν oi o CN ON oi o oo (Ν (N o < N c^· m (N 〇(N 〇<N ΓΛ I-H m 〇(N m <N 1 1 ΓΛ 〇<N 〇(N m CN m CN Ο CN 〇oi mo vn <N ν〇 I mmv〇m 1 CO ΓΛ W Ί m sk jj CN Ί inch o C/3 CQ CQ O inch o C/DC〇OQ guest o -O hemp f Ί inch 〇 1 1 1 1 inch Ο (7) cd PQ om < N <N Ί 00 璩nsf g block; u isf JJjl Ί m To O ^ — ^ < (N inch o 〇<· SC C3 u seeking 00 (N photo (N Ί yri v*> r^ inch PQ O) inch 02 C/3 capacity iT) inch CQ on capacity in inch PQ CO yr\ CQ C/D PQ C/5 卜寸 CQ < ns inch CQ oo 卜 呀 CQ C/D 容 r- inch ffl m % 卜 inch PQ C/D 容卜 inch CQ inch CQ C/D *r» v-> inch CQ % CQ 00 inch κη inch pa CO κη inch CQ C/D <n inch CQ % inch CO Ο) <η inch CQ 00 yn inch CQ C/D guest yr) ¥进: 竦规Wr jD 琳揉·癍m谢' ¥ Wr jj 谢' Wr 钋(N m in (N mo νη VO ov〇卜 oo ο 00 ON oo CN ο (7n O 154225.doc •50- s 201233548 (憋球) ά ό \〇Λ 'Ο *〇v〇Λ 00 inch (N inch · 00 卜 ο «ο ρ - m *·^ (Ν (N (N 寸 卜 时 〇〇 〇〇 〇〇 CO 〇 〇〇 ο & N N N N N 00 t> CN Os inch* (N cn mm Γ^ m ν〇VO Os ψ-^ 00 00 (N thickness i (mils) (Ν CN ^•Η (Ν iT) (Ν to 00 o 00 On 〇cn 卜 inch Inch v〇v〇00 o Dielectric strength (V/mil) (Ν <Ν οο Bu CO Ο (S 卜 Os (Ν *—H cs cs ΓΟ On fO (N v-) v〇m (M in * ·~η ν〇 inch〇 \ Os vn oo 00 (N-to-air side surface resistivity (ohtn/sq) m + ω ο ο m + ω inch m »-Η un »«·Η + ω Bu Ό Bu » —η + tQ m + Os Os V) + W oo o in + ω 卜 (Ν *-h 寸 + ω 甘 v〇oo + ta (Ν ν〇 inch t-< + W 00 v〇m + ω + ω inch 00 inch* f 1 Ό w? W ^ 00 (Ν WO CN Os inch C4 inch CN Os «-Η v〇OO v〇OS 卜 inch CN ν〇νη o ^H ό inch inch Os m 'correction W to keep oi 卜 CN Os <N (N (Ν ΟΊ m ON ΓΛ »—H m F—H Os Ό t**H τ—Η OO σ\ 卜 un Os 〇 matting agent density g/cc (Ν <N p H oi (Ν <N Zero_一(N <N (N <Ν »—H (N CN (N 5 ® ν〇ΓΛ I m ΓΟ v〇cn 1 C^) mv〇m 1 cn m (Ν oi v〇cn 1 m Cn v〇m 1 mmv〇m 1 cn ν〇m 1 ΓΟ m 1 mv〇m 1 C^) mv〇1 ic -Ο Ί ο 1—^ «? Ί (Ν <N , 1 (N CN Μ ( Ν irf Ί Ί (Ν 泠Ί cs Ί CN «? Ί (Ν Ί <N «? Ί CN Μ 京ο m iron pick ί 2 super% ^ inch 0Q 00 type CQ 00 type inch CQ ζΛ style 0 0Q 〇〇 Inch CQ on KTi D ^ i ^ c P ^ S ^ a 5% Special Black 550 5% Special 1 Black 550 »^ρ ^ ii KT) %^o ^ 〇v G> Inch CQ vn Wr jJ 谢' Jj 癍' 钋Jj 癍#. <N m inch yn VO co o 卜 inch ο 00 Vi 〇ο 154225.doc • 51 - 201233548 Example 19 Example 19 demonstrates that chemical conversion using ultramarine blue pigment achieves a low 60 degree gloss value (matte appearance) on both sides of the base film, and the optical density is significantly increased. A cerium oxide slurry was prepared from 75.4 weight percent DMAC, 9.6 weight percent PMDA/4,4' ODA poly phthalic acid prepolymer solution (20.6 weight percent polyglycolic acid solids in DMAC) And 15.0% by weight of sulphur dioxide powder (Syloid® C 803 from W_R. Grace Co.). These ingredients are thoroughly mixed in a high shear rotor stator type mixer. The median particle size is from 3.3 to 3.6 microns. A blue pigment slurry system was first dispersed in 38.9 grams of DMAC with 7.5 grams of ultramarine blue pigment (Nubicoat HWR from Nubiola) and used as an ultrasonic processor (Sonics & Materials, Inc., model VCX-5) 00) Processed for 10 minutes, prepared by anti-agglomerating pigments. The dispersion was then mixed with 3.6 grams of PMDA/4,4' ODA polyaminic acid prepolymer solution (20.6 weight percent polyglycolic acid solids in DMAC). The PMDA/4,4 ODA prepolymer solution (20.6 weight percent polyglycolic acid solids in DMAC) was completed by incrementally adding and mixing 6 weight percent of PMDA solution in DMAC to achieve about 3,000 poises. The final viscosity. 6.1 g of the cerium oxide slurry and 36.6 g of the blue pigment slurry were added to 1 57.3 g of the completed polyaminic acid solution and thoroughly mixed. The completed polymer mixture is degassed. The polymer mixture was manually cast onto Mylar® polyethylene terephthalate sheets attached to a glass plate using a stainless steel mold bar. The Mylar® polyethylene terephthalate tablet containing the wet cast film is dipped into a bath consisting of • 52-154225.doc

S 201233548 3-甲吡啶與乙酐之5〇/5〇混合物所組成。將該浴溫和攪拌3 至4分鐘的時間,以引發該膜的醯亞胺化與膠化。將該膠 膜由該Mylar®聚對苯二甲酸乙二醇酯片上剝除,並放置於 栓框上以限制該膜並防止收縮。在使殘留溶劑自該膜排出 後,將含有該膜之栓框放置在12〇乞的烘箱中。將該烘箱 溫度在60至75分鐘的時間内昇高至32〇〇c ,在32〇它持溫ι〇 分鐘,而後轉移至400t烘箱中並持溫5分鐘,之後將其從 -亥烘相中移出並使其冷卻。以該已完成之聚合物混合物的 組成物為基礎,基膜含有25重量百分比的二氧化矽及b 重量百分比的顏料。 結果如表2所示。 比較例17 比李乂例17展不在以如實例19中之相同消光劑量進行熱轉 化,在基膜兩側上產生高的(非所欲之)⑼度光澤值。 使用不錄鋼鑄型棒將來自實例19之經除氣之已完成的聚 合物混合物手動鑄型於玻璃板上。將含有該濕鑄型膜之玻 璃板放置於加熱板上,並在8Q至刚t放置%至Μ分鐘, :乂形成部分乾燥且部分酿亞胺化之「綠」冑。將該綠膜由 玻璃板上剥除並放置於栓框上。將含有該綠膜之检框放 置於120 C洪和中。將該洪箱溫度在60至75分鐘的時間内 昇η至320 C,在320 C持溫1〇分鐘,而後轉移至4〇〇〇c烘 箱中並持溫5分錄,夕你收廿y 之後將其從該烘箱中移出並使其冷 卻。 結果如表2所示。 154225.doc -53· 201233548 v〇 ά 卜 ON ό CN 毗w呆 49.5 53.3 iTi 〇\ 丨H 畸旦 1 < 介電 強度 (V/mi 3792 3423 ON VO U^i 向空氣側 之60度光 澤 55.2 ί光劑 密度 g/cc Γ"Ή <N CN 消光劑 D50 (微 |米) 3.3-3.6 3.3-3.6 isrf Ί Ί <N (N 啊:s淵 _忘淵 〇3 ^ 蜩:i2命 % ^ ^ φ 与进: .〇 艰: ON 卜 〇 154225.doc -54- s 201233548 應留思的疋’並非上文—般性描述或實例中所述之動作 都是必要的,特定動作之—部分可能並非需要的,並且除 了所心述之動作外’可進—步執行其他動彳卜再者所列 各個動作之順序並不必然為該些動作實施時所必須遵守的 頁序在研4此說明書後,_般技藝者將能夠決定何種動 作可用於其特定需求或需要。 在前揭說明書中’本發明已藉由參照特定實施例的方式 加以描述。然而,該項技藝之__般技術人士可理解,在不 脫離以下申請專利II圍所述之本發明的範嘴下,可進行各 種改艾和變更。本說明書中所揭露之所有特徵,可利用能 達到相同、等效或類似目的之替代特徵加以替換。 因此,應將本說明書與圖式視為一說明性而非一限制性 之概念’且意欲將所有這類修改涵括於本發明之範嘴中。 【圖式簡單說明】 圖1為一三層經熱轉化之聚醯亞胺膜之橫剖面的穿透式 電子顯微圖’該聚醯亞胺膜含有20重量百分比的氣相式氧 化鋁。 圖2為一單層經化學轉化之PMDA/4.4-QDA之橫剖面的 穿透式電子顯微圖,該PMDA/4.4-QDA含有13重量百分比 的氣相式氧化銘。 154225.doc •55-S 201233548 3-pyridinium consists of a mixture of 5〇/5〇 of acetic anhydride. The bath was gently stirred for a period of 3 to 4 minutes to initiate the hydrazine imidization and gelation of the film. The film was peeled off from the Mylar® polyethylene terephthalate sheet and placed on a plug frame to limit the film and prevent shrinkage. After the residual solvent was discharged from the film, the plug containing the film was placed in a 12-inch oven. The oven temperature was raised to 32 〇〇c over a period of 60 to 75 minutes, held at 32 Torr for ι min, then transferred to a 400 t oven and held for 5 minutes, after which it was baked from - Remove and let it cool. Based on the composition of the completed polymer mixture, the base film contained 25 weight percent cerium oxide and b weight percent pigment. The results are shown in Table 2. Comparative Example 17 was not thermally converted by the same matting dose as in Example 19, and a high (unwanted) (9) gloss value was produced on both sides of the base film. The degassed finished polymer mixture from Example 19 was manually cast onto a glass plate using a non-recorded steel casting bar. The glass plate containing the wet cast film was placed on a hot plate and placed at 8 to just t for a minute to a minute, and the crucible was formed into a partially dried and partially immated "green" crucible. The green film was peeled off from the glass plate and placed on the frame. The test frame containing the green film was placed in a 120 C flood. The temperature of the flood box is raised to 320 C in 60 to 75 minutes, held at 320 C for 1 minute, and then transferred to a 4 °c oven and held at a temperature of 5 minutes. It is then removed from the oven and allowed to cool. The results are shown in Table 2. 154225.doc -53· 201233548 v〇ά 卜ON ό CN ww stay 49.5 53.3 iTi 〇\ 丨H 畸 1 1 < Dielectric strength (V/mi 3792 3423 ON VO U^i 60 degree gloss to the air side 55.2 ί light agent density g / cc Γ " Ή < N CN matting agent D50 (micro | m) 3.3-3.6 3.3-3.6 isrf Ί Ί <N (N ah: s _ _ _ _ _ _ 3 ^ 蜩: i2 %% ^^ φ和进: .〇难: ON 〇 〇 154225.doc -54- s 201233548 It should be thought of 'not the above--the general description or the actions described in the examples are necessary, specific actions Part of it may not be necessary, and in addition to the actions described, the order in which the actions can be performed in other steps is not necessarily the order in which the actions must be followed. After studying this specification, the skilled artisan will be able to determine which actions are available for their particular needs or needs. In the foregoing description, the invention has been described by reference to specific embodiments. __like technical people can understand, not Various modifications and changes can be made in the present invention as described in the following claims. All the features disclosed in the present specification can be replaced with alternative features which can achieve the same, equivalent or similar purpose. Therefore, the present specification and drawings are to be regarded as illustrative and not restrictive, and all such modifications are intended to be included in the scope of the invention. A transmissive electron micrograph of a cross section of a layer of thermally transformed polyimine film. The polyimide film contains 20% by weight of fumed alumina. Figure 2 is a single layer of chemically converted PMDA. Transmissive electron micrograph of the cross section of /4.4-QDA, the PMDA/4.4-QDA contains 13% by weight of gas phase oxidation. 154225.doc •55-

Claims (1)

201233548 七、申請專利範圍: 1. 一種基膜,其包含: A. —經化學轉化之聚醯亞胺,其量為該基膜之4〇至90 重量百分比,該經化學轉化之聚醯亞胺係衍生自: i. 以該聚醯亞胺之二酐總量計算,至少50莫耳百分 比之芳香族 二肝,以及 ii. 以該聚醯亞胺之二胺總量計算,至少50莫耳百分 比之芳香族二胺; B. —填料’除低傳導度碳黑及顏料之外,其量為該基 膜的10至60重量百分比;以及 其中該基膜的厚度是從8至152微米。 2. 如請求項1所述之基膜,其中該經化學轉化之聚醯亞胺 是藉由將聚醯胺酸溶液與一能夠將聚醯胺酸轉化成聚醯 亞胺的催化劑或脫水劑混合的步驟所製成。 3. 如請求項1所述之基膜,其中: a·該芳香族二酐為選自於由: 焦蜜石酸二酐、 3,3',4,4'-聯苯四羧酸二酐、 3,3',4,4’ -二苯基酮四缓酸二酐; 4,4、氧雙鄰苯二曱酸酐、 3,3',4,4·-二苯砜四羧酸二野 2,2-雙(3,4-二羧基笨基)六氟丙烷、 雙酚A二酐,以及 上述物之混合物所組成之群組;以及 154225.doc 201233548 b.該芳香族二胺為選自於由: 3,4'-氧二苯胺、 1,3-雙-(4-胺基苯氧基)苯、 4,4’-氧二苯胺、 M-二胺基苯、 1,3 _ —胺基苯、 2,2’-雙(三氟甲基)聯苯胺、 4,4'-二胺基聯苯、 4,4'-二胺基二苯硫越、 9,9’-雙(4-胺基)氟及 其混合物。 4.如请求項丨所述之基膜,其中該經化學轉化之聚醯亞胺 係衍生自焦蜜石酸二酐與4,4,-氧基二苯胺。 5·如請求項!所述之基膜,纟中該填料係選自由滑石、二 氧化鈦、針狀二乾化欽、氧化辞、氮化侧、三氧化石夕、 氣相式二氧化矽、氧化鋁、氣相式氧化鋁、海泡石、矽 灰石及其混合物所構成的群組。 154225.doc201233548 VII. Patent application scope: 1. A base film comprising: A. - chemically converted polyimine, in an amount of from 4 to 90% by weight of the base film, the chemically converted poly The amine is derived from: i. at least 50 mole percent of the aromatic liver, and ii. based on the total amount of the polydiamine dianhydride, and at least 50 moles based on the total amount of the polyamine of the polyimine. Percent of the aromatic diamine; B. - filler 'except for low conductivity carbon black and pigment, the amount is 10 to 60 weight percent of the base film; and wherein the thickness of the base film is from 8 to 152 micrometers . 2. The base film of claim 1, wherein the chemically converted polyimine is a catalyst or a dehydrating agent capable of converting a polyproline to a polyimine by using a polyamic acid solution. The mixing step is made. 3. The base film of claim 1, wherein: a. the aromatic dianhydride is selected from the group consisting of: pyromellitic dianhydride, 3,3', 4,4'-biphenyltetracarboxylic acid Anhydride, 3,3',4,4'-diphenyl ketone four acid dianhydride; 4,4, oxydiphthalic anhydride, 3,3',4,4·-diphenyl sulfone tetracarboxylic acid a group consisting of diiso 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane, bisphenol A dianhydride, and mixtures of the foregoing; and 154225.doc 201233548 b. the aromatic diamine Is selected from: 3,4'-oxydiphenylamine, 1,3-bis-(4-aminophenoxy)benzene, 4,4'-oxydiphenylamine, M-diaminobenzene, 1, 3 _ -Aminobenzene, 2,2'-bis(trifluoromethyl)benzidine, 4,4'-diaminobiphenyl, 4,4'-diaminodiphenylthiophene, 9,9' - bis(4-amino)fluoro and mixtures thereof. 4. The base film of claim 3, wherein the chemically converted polyimide is derived from pyromellitic dianhydride and 4,4,-oxydiphenylamine. 5. If requested! The base film, the filler in the crucible is selected from the group consisting of talc, titanium dioxide, needle-shaped di-drying, oxidation, nitriding, trioxite, gas phase cerium oxide, aluminum oxide, gas phase oxidation A group of aluminum, sepiolite, limestone, and mixtures thereof. 154225.doc
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103965626A (en) * 2013-01-28 2014-08-06 达迈科技股份有限公司 Polyimide film containing powdery color developing delustering agent and manufacturing method thereof
US9284424B2 (en) 2013-07-11 2016-03-15 Taimide Technology Incorporation Polyimide film and fabrication method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103965626A (en) * 2013-01-28 2014-08-06 达迈科技股份有限公司 Polyimide film containing powdery color developing delustering agent and manufacturing method thereof
TWI492970B (en) * 2013-01-28 2015-07-21 Taimide Technology Inc Colored delustrant powder, polyimide film incorporating the same, and its manufacture methods
US9914841B2 (en) 2013-01-28 2018-03-13 Taimide Technology Incorporation Polyimide film incorporating a colored polyimide matting power and manufacture thereof
US9284424B2 (en) 2013-07-11 2016-03-15 Taimide Technology Incorporation Polyimide film and fabrication method thereof
TWI550000B (en) * 2013-07-11 2016-09-21 達邁科技股份有限公司 Polyimide film

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