201231913 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種執行以所銲接有零件之基板（ 以下稱為「零件裝配基板」”為目標的三維測量並根據 該測量結果檢查該基板之零件的I配狀態或銲接狀態的 檢查裝置、以及一種確認該檢查之結果的顯示技術。 【先前技術】 關於零件裝配基板的檢查裝置方面，歷來―種拍攝 基板後實施二維測量處理的外觀檢查裝置（例如參照專 利文獻1)已為人所習知。 此外，近來正開發一種測量銲料高度的裝置，立係 使用圓頂型之照明裝置或立體相機，並依每台相機測量 影像中與銲料對應的㈣之法線方向，再根據該法線方 向對映相機間之像素（mapping)，從而測量銲料之高度（ 參照專利文獻2、3)。此外’另正開發一種藉由以電子零 件為目標的立體測量而測量零件本體或電極之高度的技 術（參照專利文獻4)。 此外，關於確認對基板之三維測量的結果之技術， 有纪載將以等高線顯示高度資訊的三維平面影像與二維 的實際影像一起顯示的文獻（參照專利文獻5)。 [先前技術文獻] [專利文獻] [專利文獻1]特公平6-1 173號公報 [專利文獻2]國際公開WO20 1 0/1 18281號公報 [專利文獻3]特開20 10-7 1782號公報 201231913 [專利文獻4]國際公開w〇2 00 6/13 5040號公報 [專利文獻5]特開2006-2670 18號公報 【發明内容】 [發明所欲解決之課題] 根據上述專利文獻2及3所記載之技術，可高精度地 取得表示零件裝配基板上的銲料之表面形狀的三維資訊 此外亦可應用專利文獻4等之三維測量技術而取得零 件裝配基板上的三維資訊。因此’—般認為若對基板上 的零件及銲料進行因應於各自之特性的三維測量處理， 即可比外觀檢查更高精度地分析兩者的關係，並可實施 高精度的檢查。 '201231913 VI. Description of the Invention: [Technical Field] The present invention relates to a three-dimensional measurement for performing a substrate on which a component is welded (hereinafter referred to as a "part assembly substrate"" and inspecting the substrate based on the measurement result An inspection device for the I-distributed state or the welded state of the component, and a display technique for confirming the result of the inspection. [Prior Art] As for the inspection device for the component-mounted substrate, the appearance of the two-dimensional measurement process is conventionally performed after the substrate is photographed. An inspection apparatus (for example, refer to Patent Document 1) is known. Further, a device for measuring the height of a solder has recently been developed, and a dome type illumination device or a stereo camera is used, and each image is measured by each camera. The normal direction of the solder corresponds to the normal direction of (4), and the pixel between the cameras is mapped according to the normal direction to measure the height of the solder (refer to Patent Documents 2 and 3). In addition, another electronic component is being developed. A technique for measuring the height of a part body or an electrode for stereoscopic measurement of a target (refer to Patent Document 4). In addition, as for the technique of confirming the result of the three-dimensional measurement of the substrate, there is a document in which the three-dimensional plane image in which the height information is displayed on the contour line and the two-dimensional actual image are displayed (refer to Patent Document 5). [Prior Art Document] [ [Patent Document 1] Japanese Unexamined Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Problem to be Solved by the Invention] According to the techniques described in Patent Documents 2 and 3, the techniques described in the above Patent Documents 2 and 3 are disclosed. Three-dimensional information indicating the surface shape of the solder on the component mounting substrate can be obtained with high precision. In addition, three-dimensional information on the component mounting substrate can be obtained by using the three-dimensional measurement technique of Patent Document 4, etc. Therefore, it is generally considered to be on the substrate. Parts and solders can be analyzed in three-dimensional measurement according to their respective characteristics, and the relationship between the two can be analyzed with higher precision than the visual inspection, and high-precision inspection can be performed.
最好作 、或良/ 前進行 實際狀 行使用 果的檢 查結I 成使用者可確認成 不良的判定結果是 設定判定基準的作 態或亦可確認應測 本發明之課題 者可易於確認根據 查結果或檢查目標 的確認作業。 [解決課題之手段;| 根據本發明之 係在既定照明下拍 定手段，其係根據 接部位；三維測量 根據二維資訊之檢查的情況， 為檢查目標之部分的具體狀態 否妥當。此外，最好在檢查之 業時亦可確認檢查目標部分的 量的部分。 為’著眼於上述論點，藉由進 對於零件及銲料之三維測量結 部位之狀態的顯示，以支援檢 基板檢查裝置係具備：攝像手 攝如接於基板上的零件；銲接 利用攝像手段所產生之影像以 手段，其係按所特定之銲接部 201231913 清影 者之 三維 判別 ，其 類讀 存手 之關 示用 顯現 於各 用記 用記 設定 或者 亮度 比對 及鲜 別碼 本發 部位: 確認! 像中之零件與對應於該零件的銲料，並執行對於各 三維測量；檢查執行手段，其係執行目的為使用藉 T量手段的測量所導出之零件及銲料的三維資訊以 ▽件之裝配狀態及銲接狀態的檢查；結果儲存手段 係將令件及銲料的三維資訊以可按銲接部位及按種 t之狀態儲存；及顯示控制手段，其係使用結果儲 段所儲存之資訊，產生按銲接部位顯示零件與銲料 ，的影像，並輸出用以顯示包含該影像之晝面的顯 資訊。 上述的構成中，三維測量手段係根據產生之影像所 的特徵分清零件錢料，㈣零件與銲料實施因應 自之特性的三維測量處理。例如，對於銲料，可應 載於專利文獻2或3之測量處理，對於零件，則可^ 载於專利文獻4之測量處理。 〜 銲接部位特定手段係例如可根據預先登錄於穿置的 資料而個別地特定影像中之包含銲接部位的範圍： ^亦可利用銲料的鏡面反射性，藉由抽出影像中之 南的區域並將該區域的分布圖案與基板的映像資訊 ，以將相當於各銲墊之範圍特定為銲接部位。^ =儲=段中’利用檢查時之測量所取得之零件 、一、准貝Λ以附加例如基板、零件、電極之各 的'、且合與零件或銲料之種類碼的狀態下被保存。^ 中，因為根據此等儲存資訊而產生並顯示 不零件與鋒料之關係的影像，所以使用者可 者之關係呈現何種狀態。 勿於 201231913 此外，該確認用畫面的顯示可在檢查裝 ，亦可將顯示用資訊輪出至其它的 x本體實施 以該其它的裝置顯示畫面。此外，在利^電腦等）而 確認用畫面的情>兄’可將畫面的顯示用資訊二：置顯示 或數位影像光碟等的記憶裝置。此外，顯示j =硬碟 零件或按銲接進行，亦可依後述之第5實施例所：：可按 -起進行與同一規格之複數個零件相關的顯示：、的方式 上述基板檢查裝置之理想的第丨實施例中， 手段係將在零件之與銲料之接合面(零件電極的：= 側面)的附近位置剖開銲料的三維資訊所表示之立體: 狀的情況所得之鲜料的剖面作為正面，產生二：：形 之剖面與零件之關係的影像。 、-蚌科 據第1實施例，因為顯示零件與銲料的接合、 及相對於該面之銲料的位 ° 以 像，所以變成使用者可县 顇不的影 。 易於確遇零件與銲料的接合狀態 此外，所顯示之書面中 面中之至少-面相關的銲料的接合 接合面相關的影像。 即可，但亦可包含與複數個 手段： = 查裝置之理想的第2實施例中，顯示控制 手焱係根據零件及銲料 刊 視銲接部位之狀態的影像二，准資訊以產生顯示從上方俯 合面中之至少-面為二’同時以該零件之與銲料的接 示的立體形狀從該接合二使在將銲料的三維資訊所表 之銲料的剖面作為正面^近位置剖開之情況下所得 產生顯示該銲料之刳面與零件 201231913 面的顯示用資訊 之關係的影像後，輸出包含各影像之書 依：第2實施例，為將顯示從上方俯視鮮接部位的 狀匕、之衫像及與第1貫施例一樣的影像— _ ^顯不，所以可 Z確認零件或銲料的偏差或傾斜等，—面確認兩者之 接&部分的關係。因此，變成可更仔細地 料的關係。 …_ 上述基板檢查裝置之理想的第3實施例中，銲接部位 ’疋手段係在利用攝像手段所產生之影像中特定盥 立之銲塾對應的範圍。此外，顯示控制手段係根據藉料 #位特料段所特定之料的範圍與利用三維測量手^ 所分清之零件及銲㈣關係，產生將零件與銲料之關^ 以及兩者與銲墊之關係一起顯示的影像。 ’、 依據第3實施例，因為顯示零件、銲料及銲墊三 像會被顯示’所以使用使用者可易於確認‘ 之零件電極及銲料的裝g2i範圍是否充分 否位置偏離銲墊等。 一 疋 二外’若要特定銲墊’例如只要抽出影像中之亮产 :可「二並對該區域的分布圖案比對基板的映像資訊 在銲料：I:亦可讀取在檢查目標基板被銲接之前(例如 開==呈曰或零件裝配製程等、或在銲料印刷製程 中之鮮塾的範圍。 …特疋影像 將檢2第1〜第4實施例中’在結果儲存手段進-步以可 欢一中所貫施之測量處理的結果按銲接部位讀出之狀 201231913 態而儲存的情況，顯示控制手段可設定對所產生的影像 中之為了檢查所測量的部位映上測量結果及顯示在檢查 中所使用的判定基準之指標的畫面。例如，在測量針對 零件電極之高度方向及寬度方向之銲料的比例的情況， 能以對影像中之銲料或零件映上顯示測量目標範圍的量 規的方式，顯示測量資料的實測值或測量資料的良範圍 。此外，在測量銲料之圓角的傾斜角度的情況，能以對 表示銲料之傾斜狀態的影像映上顯示所測量的角度範圍 或顯示良好的角度範圍之記號的方式顯示。 如上述所示，以在所產生的影像中對為了檢查所測 量的部位映上測量結果與在檢查中所使用的判定基準的 方式顯示，使得使用者可易於以將測量目標部位與實際 之測量結果對映的方式確認，並可易於判斷判定基準是 否為適當的。 此外，第1〜第3實施例中，顯示控制手段可受理對根 據顯示用資訊所顯示的影像設定顯示剖開位置之直線的 操作，同時能以表示沿著藉該操作所設定之直線的剖面 之形狀的影像被顯示的方式更新顯示用資訊。據此，使 用者可自由地設定想確認的部分而確認其剖面形狀，所 以便利性更為提升。 上述基板檢查裝置之較佳的第5實施例中，顯示控制 手段係使用同一規格之複數個零件中每個零件之儲存於 結果儲存手段的三維資訊而根據共同的影像產生法則按 零件產生顯示此等零件與銲料之關係的影像，.並產生及 輸出包含各影像的一覽之晝面的顯示用資訊。 201231913It is preferable to perform the inspection of the actual use or the result of the good or the former. The result of the determination that the user can confirm the failure is the setting of the judgment criterion or the confirmation of the subject of the present invention can be easily confirmed. The result or check the confirmation of the target. [Means for Solving the Problem; | According to the present invention, the means for photographing under a predetermined illumination is based on the joint portion; and the three-dimensional measurement is based on the inspection of the two-dimensional information, and it is appropriate to check the specific state of the target portion. In addition, it is preferable to confirm the amount of the target portion of the inspection during inspection. In order to focus on the above-mentioned arguments, by supporting the display of the state of the three-dimensional measurement junction portion of the component and the solder, the substrate inspection device is provided with a component that is attached to the substrate by the camera, and the welding is generated by the imaging means. The image is determined by means of a three-dimensional discriminator of the specified soldering portion 201231913, and the display of the type of reading is displayed in each of the usage notes or the brightness comparison and the fresh code: Confirmation! The part in the image and the solder corresponding to the part, and perform the measurement for each three-dimensional; the inspection execution means is performed by using the measurement of the T-quantity means and the three-dimensional information of the solder. The inspection state of the assembly state and the welding state; the result storage means that the three-dimensional information of the fastener and the solder can be stored according to the welding position and the state of the t; and the display control means uses the information stored in the result storage section to generate the pressing The soldered portion displays an image of the part and the solder, and outputs a display for displaying the image containing the image. In the above configuration, the three-dimensional measuring means separates the parts from the characteristics of the generated image, and (4) the three-dimensional measuring process in which the parts and the solder are subjected to the characteristics. For example, the solder may be subjected to the measurement processing of Patent Document 2 or 3, and the parts may be subjected to the measurement processing of Patent Document 4. ~ The soldering site specific means is, for example, a range of soldering sites that can be individually specified in a particular image based on the information previously registered in the placement: ^ The specular reflectivity of the solder can also be utilized by extracting the southern region of the image and The distribution pattern of the region and the imaging information of the substrate are defined as the welding portion corresponding to the range of each bonding pad. ^ = Storage = Segments The parts obtained by the measurement at the time of inspection are first stored in a state in which, for example, the substrate, the component, and the electrode are attached, and the type code of the component or the solder is added. ^, because the image is generated based on such stored information and displays the image of the relationship between the part and the front material, so what state the user can have. Do not use 201231913. The display screen for this confirmation can be displayed in the inspection device, or the information for display can be displayed on the other x body to display the screen. In addition, in the case of the computer screen, etc., the screen for displaying the screen can be displayed as a memory device such as a display or a digital video disc. In addition, the display j = hard disk parts or by welding, or according to the fifth embodiment to be described later:: display can be performed in accordance with a plurality of parts of the same specification: In the third embodiment, the means is to cut the three-dimensional information represented by the three-dimensional information of the solder in the vicinity of the joint surface of the part and the solder (the side of the part electrode: = side): the profile of the fresh material obtained as a condition The front side produces an image of the relationship between the profile of the shape and the part. According to the first embodiment, since the bonding between the display part and the solder and the position of the solder on the surface are displayed, it becomes a shadow of the user. It is easy to confirm the joint state of the part and the solder. In addition, the image of the joint surface of at least the surface-related solder in the written middle surface is displayed. Yes, but it can also be included with a plurality of means: = In the second embodiment of the device, the display control system is based on the image of the part and the state of the solder joint, and the quasi-information is generated to generate the display from above. At least the surface of the prone surface is two', and the three-dimensional shape of the contact of the part with the solder is used to cut the cross section of the solder in the three-dimensional information of the solder as the front surface. The image obtained by displaying the relationship between the surface of the solder and the display information of the surface of the part 201231913 is outputted, and the book containing each image is output. In the second embodiment, the display is viewed from above. The image of the shirt and the same image as the first embodiment - _ ^ are not visible, so it is possible to confirm the deviation or inclination of the part or solder, and to confirm the relationship between the two parts. Therefore, it becomes a more carefully related relationship. In the third embodiment of the above-described substrate inspecting apparatus, the welding portion is a range corresponding to the specific welding bead among the images generated by the imaging means. In addition, the display control means generates the relationship between the parts and the solder and the solder pads according to the range of materials specified by the material section of the borrowing material and the parts and welding (four) which are separated by the three-dimensional measuring hand. The image that the relationship shows together. According to the third embodiment, since the display part, the solder, and the pad three images are displayed, the user can easily confirm whether or not the range of the component electrode and the solder g2i is sufficient or not, and the position is deviated from the pad or the like. For example, if you want to use a specific solder pad, for example, you can extract the bright light in the image: "The distribution pattern of the area is compared with the image information of the substrate in the solder: I: can also be read on the inspection target substrate to be soldered. Before (for example, open == presentation or part assembly process, etc., or the range of fresh enamel in the solder printing process. ...Special image will be detected in the first to fourth embodiments in the 'result storage means to step by step The result of the measurement processing performed by Huanyou can be stored in the state of 201231913 when the welding part is read. The display control means can set the measurement result and display for the part to be inspected for the inspection. A screen for the index of the criterion used for the inspection. For example, when measuring the ratio of the solder in the height direction and the width direction of the component electrode, the amount of the measurement target range can be displayed on the solder or the part in the image. The method of the gauge shows the measured value of the measured data or the good range of the measured data. In addition, in the case of measuring the tilt angle of the fillet of the solder, the tilt of the solder can be indicated The image of the state is displayed in the manner of displaying the measured angular range or the symbol showing the good angular range. As shown above, in the generated image, the measurement result is reflected in the inspection for the part to be inspected. The method of the determination criterion used is displayed so that the user can easily confirm the measurement target portion and the actual measurement result, and it is easy to determine whether or not the determination criterion is appropriate. Further, the first to third embodiments The display control means can accept the operation of setting a line for displaying the cut position based on the image displayed by the display information, and can update the image indicating the shape of the cross section along the line set by the operation. According to this, the user can freely set the portion to be confirmed and confirm the cross-sectional shape, so that the convenience is further improved. In the fifth preferred embodiment of the substrate inspection apparatus, the display control means uses the same Each of the plurality of parts of the specification is stored in the three-dimensional information of the result storage means according to the common image Health rules generated by the display part to display an image with such a relationship to part of the solder,., And generates and outputs a list comprising a day of the surface of each image by the information. 201231913
依據上述實施例，因A 杜妓為可針對同一規格之複數個零 件，統一顯示之目標範圍、 ^ 視線的方向、倍率等確切、條 件而產生影像並一覽顯示 午寺確…條 之 所以使用者變得可县於破 認各個零件中之零件與銲料 、 了叶之關係的不均程度。 第5實施例中，顯示控制手段可按一覽顯 零件將在零件之與銲料的接 " ^ 件對應之銲料的三維資訊 《亥令 到之r料❹…不的立體形狀之情況所得 到之知枓的剖面形狀作為正 之關係的影像》 生顯不此銲料與零件 此外，第5實施例_，在姓 〜, 。果储存手段以可按锃桩邱 位讀出之狀態儲存在檢 叔銲接4 你俄笪中所貫施之測量處理之紝 情況，顯示控制手段可對於一 ' 影像中之為了檢杳所.目丨曰、 ‘不 影像以分別對 豕Τ之為了檢查所測篁的部位映 檢查中所使用之判定基準的指標的方式顯示果及顯不在 本發明可應用於包含以下之裝置的系統 裝配基板的基板檢杳穿置·… ' 欢—7件 存基板檢杳裝置Λ τβ —发置靖取並儲 —衮置為了檢查所實施之測量處理 訊儲存處理裝置·；冷山一 、、口果的負 处里裒置’及§賣出貧訊儲存處理裝 讯並使用所讀出之資訊 4存之資 貝貫：fL顯不檢查結果的確 =終：裝置。該系統*的基板檢查裝置係I;面：： 又、係在既定照明下拍攝銲接於基板JL的零件·俨 接部位特定手段，其係根據利用攝像手段所Π件’* 以特定銲接部位.m *攝像子&所產生之影像 伕丨位，二維測量手段，其係按所 部位而分清影像中堂 ·疋之在于接 月汾像中之零件與對應於該 行對於各者之=维：目，丨暑· & 士 卞们紅枓，並執 -、准測檢查執行手段，其係執行目的 -10- 201231913 為 使 用 藉 三 維 維 資 訊 以 判別 出 手 段 5 其 係 及 按 種 類 而 特 處 理 裝 置 之 〇 資 訊 儲存 前 述 資 訊 儲 存 零 件 與 銲 料 之 在 確 認 用 終端 生 手 段 而 產 生 依 據 上 述 查 所 實 施 之 測 在 確 認 用 終 端 面 的 情 況 仍 的 影 像 0 此 外 先 用 於 此 基 板檢 其 次 > 根 按 照 在 既 定 照 像 中 的 銲 接 部 行 對 於 各 者 之 出 之 零 件 及 銲 接狀 態 的 檢 查 該 方 法 中 維 資 訊 以 可 按 測量手段的測 零件之裝配狀 將零件及銲料 定的形式構成 處理裝置或確 手段所儲存之 關係的影像之 裝置中係顯示 之影像的確認 系統，即使為 置結果儲存於 裝置中顯示使 可按銲接部位 前所述之基板 查系統。 據本發明之顯 明下拍攝銲接 位，分清零件 三維測量，並 料的三維資訊 〇 係將藉三維測 銲接部位及按 量所導出之零 態及麵接狀態 之三維資訊以 的資訊輸出至 認用終端裝置 資訊而產生按 顯示用影像產 包含利用前述 用晝面。 將在基板檢查 外部的資訊儲 用所儲存之資 確認表示零件 檢查裝置的各 示方法係因應 於基板上的零 與對應於該零 執行目的為使 以判別零件之 量所導出之零 種類讀出之狀 件及銲料的三 的檢查；及輸 可按銲接部位 前述資訊儲存 中係設有使用 知接部位顯示 生手段，同時 顯示用影像產 裝置中為了檢 存處理裝置並 訊的確認用晝 與銲料之關係 實施例亦可應 以下而實施： 件而產生之影 件的銲料而執 用藉測量所導 裝配狀態及辉 件及銲料的三 態儲存。然後 -11- 201231913 ，使用所儲存之資訊，按録 接合面的附近位置剖開鲜料 狀的情況所得之輝料的剖面 之剖面與零件之關係的影像 接部位將在零件之與銲料之 的三維資訊所表示之立體形 作為正面，產生顯示該銲料 並顯不包含該影像的畫面 此外’根據理想的實施例之顯示方法中係以對對畫 面中之影像之為了檢查所測量的部位映上測量結果及顯 示在檢查所使用之判定基準的指標的方式顯示。 上述的方法除了可在實施檢查的檢查裝置中以外， 另可在取得該檢查裝置所實施之三維測量或檢查的妹果 的外部之電腦中實施。此外，亦可作成在檢查裝置中產 生顯示目標的影像，並將該影像的資料或包含該影像之 晝面整體的顯示用資訊從檢查裝置傳送至外部裝置後， 在外部裝置中進行顯示確認用晝面的處理。 [發明之效果] 依據本發明，可根據基板上之零件及銲料之三維測 量的結果，產生適合於確認零件與銲料之關係的影像， 並顯示包含該影像的畫面。因此，使用者可易於根據所 顯示的晝面確認所檢查的部分的狀態，並可判斷檢杳結 果是否為妥當的。 一… 【實施方式】 [實施發明之形態] 第1圖係顯示應用本發明之基板檢查裝置的一例。 本實施例的基板檢查裝置丨00(以下僅稱為「檢查裝 置100」）係以經由至零件裝配基板之生產線的回流製程 -12- 201231913 之各製程的基板s為檢杳目押 ^ &目松’檢查基板s上之零件的裝 配狀態或銲接狀皞者^丄 〜、 並由立體相機1、照明裝置2、基 板工作台4及控制處理部3等所構成。 作〇4面以水平姿勢支撐檢查目標的基板s ，一面使該基板S在沿著各邊的方向移動。 立體相機1由2台彩色相機1A、1B(以下僅稱為「相機 ΙΑ、1B」）所構成。一方的相機ia係在使光軸朝向大致 鈍垂方向之狀態（正視工作台4上之基板s的狀態）配備於 基板工作台4的上方，另—台相機1B係在使光軸傾斜地朝 向鉛垂方向之狀態所配備。 照明裝置2係以圓頂狀的筐體2〇為本體，並配置於相 機ΙΑ、1B與基板工作台4之間。在筐體2〇的内周面，在 整個面排列LED等的點光源。此外，在第丨圖雖未圖示， 篮體2 0之與各相機1 a、丨B的光軸對應的部分，形成攝像 用的窗部。 在控制處理部3，包含各相機1A、1B的影像介面3〇A 、30B、照明控制部3!、工作台控制部32、控制部、記 隐體34、硬碟裝置35、通信用介面36、輸入部37及顯示 部3 8等。 在影像介面30A、30B，包含對應之相機^、^的驅 動電路或處理來自相機ΙΑ、1B之影像信號的電路（放大器 、A/D變換電路等）。照明控制部3丨控制照明裝置2内之各 光源的發光強度或發光時序，而工作台控制部32控制基 板工作台4的動作。 控制部33 —面統籌控制上述的光學系或基板工作台 •13- ；3 201231913 勺 面貫施關於檢查的各種計算。在控制部3 3 ，包含CPU，但是亦可更包含影像處理用的數位計算電 路或具有向速計算之功能的電路（FPGA等）。 在°己隐體3 4 ,除了保存基本的程式以外，還暫時保 處里目‘的影像資料或計算結果等。在硬碟裝置3 5， :存在與檢查相關之各種處理(包含影像處理或測量處 斤使用的程式群、或後述之檢查結果資料庫1 08、法 線/特徵量表1 1 1等。 用介面36係用於經由在現場所設置之LAN線路 圖不）與在其它製程所設置之檢查裝置或管理生產 或：服器裝置進行通信。輸入部37係在指定檢查之開始 係結束的操作或各種設定資料的輸入所使用。顯示部38 '、用於顯示檢查結果之確認用的晝面或設定用之晝面。 零控=部33使用藉相機1A、1B所產生之立體影像，對 根2銲料實施二維測量。此外，關於基板S的銲墊，亦 據影像中之銲料的分布圖案或基板s的映像資訊等，製 的’准資汛。然後，使用各三維資訊，檢查銲墊與零件 斜=係、零件電極與銲料的關係、銲料之圓角的傾 L #。進而，按零件及基板合併此等檢查結果後， 女‘、'、零件單位及基板單位判定良、不良。 與/其次，說明用以實現對零件及銲料的三維測量之光 =構成。在本實施例的照明裝置2’，用在圓頂狀的 之内面的整個區域所配置的點光源，從全方位對 可=相機1之測量範圍照射光。進而，在本實施例，使用 對R、g、b之各色成分調整發光強度的發光體，作為 -14- 201231913 點 照 之 分 側 度 變 等 實 ί 對 的 作 強 之 相 被 各 原. 1Α 生 進行適合，量之 第2圖及第3圖係以模式顯示在 .,., 月裝置2的筐體20 的變化。在本實施例，使各色成 的強度各自沿者從董體20的一端緣經由天頂部往相反 之端緣的方向變化，而且在各蠻 的角度差。 在各變化方向之間設定⑽ 第圖二以映像對各色成分表示各色成分之強度的 I:疋為了便於圖示，設定8條連接強度相同的點( 免度線），並以此等等亮度線為境界，變更塗布圖案。 際上，任-種色成 >，都沿著映像上之粗箭號的方向 ，從〇至255之範圍逐漸加強強度。該強度變化係藉由 每一個光源或包含複數個光源的各方塊變更r、◦、Β 發光強度，而實現。利用各色成分之強度變化的相互 用，在從照明裝置2之各位置所照射的光之R、G、B的 度比成為因各個光的方位角或入射角而異。 進而，在本實施例，以即使是銲料的表面不是完全 鏡面的情況’亦正反射光之成分以外的反射成分（來自 機之光軸方向及與正反射無關之方向的光的反射光） 抵消，並產生僅反映正反射成分之光像的方式調整在 強度變化之方向的變化量（關於具體之調整的構造或 理，請參照專利文獻2)。 利用該調整’在照明裝置2的照明下拍攝時，在相機 、1B之任一個的影像，都可根據其影像中之銲料所產 勺正反射光像之R、G、B的強度比例’特定產生該像 -15- 201231913 之 之 同 強 等 之 射 射 因 件 ¥m 部 顯 徵 碟 相 區 > 料 該 光的方向。此外’可根據所特定之方向與相機1 A、i B 光軸方向的關係’特定銲料之傾斜面的法線方向。 進而’在本實施例’以將來自照明裝置2之天頂角相 之高度的光（參照第3圖）作為目標求得各R、G、B之總 度的情况之R的總強度、G的總強度、B的總強度成為 值的方式’調整各光源的發光強度◊因此，來自全部 光源的光之各R、G、B的總強度亦變成大致一致，照 於零件或基板本體等之具有擴散反射性的構成物所反 的光混合而成為白色光後，射入相機丨A、丨B。因此， 為可在與進行白色照明的情況—樣的照明狀態拍攝零 或基板本體，所以可產生接近實際之顏色的影像。 其次，第4圖顯示在上述檢查裝置i 〇〇所設定之功能 如第4圖所示，在本實施例的檢查裝置1〇〇，設定影= 入。Μ 0 1、如墊特定部丨〇2、銲料測量部丨〇3、零件測量 1_〇4二維貝讯產生部丨〇 5、檢查執行部^ %及確認晝面 =。卩1 07的各功能。此外，銲料測量部丨〇3内的法線/特 量表1 1 1及檢查結果資料庫1 0 8儲存於第1圖所示的硕 狴番n β石更 影像輸入部101經由影像介面3〇Α、3〇β，輸入由各 A 1Β所產生的立體影像。在第4圖雖然未特According to the above embodiment, because A Du Fu is a plurality of parts of the same specification, the target range of the display, the direction of the line of sight, the magnification, and the like are uniformly generated, and the image is displayed and the user is displayed in the list. It became the degree of unevenness in the relationship between the parts and the solder and the leaves in each part. In the fifth embodiment, the display control means can obtain the three-dimensional information of the solder corresponding to the solder joints of the parts in the outline of the parts. The shape of the cross-section of the knuckle is used as the image of the positive relationship. In addition to the solder and parts, the fifth embodiment _, in the last name ~,. The storage means can be stored in the state of reading and unloading in the state of the inspection. The display control means can be used for the inspection of a 'image'.丨曰, 'The image is displayed separately for the purpose of checking the index of the determination criteria used in the inspection of the part of the sputum, and the present invention is applicable to the system mounting substrate including the following device. Substrate inspection and boring...... 欢—7 pieces of substrate inspection device Λ τβ — 发 取 取 取 取 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 为了 ; In the negative place, 'and § sell the poor news storage processing package and use the information read 4 to survive: fL does not check the result is indeed = final: device. The substrate inspection device of the system* is a surface:: a means for photographing a part and a joint portion welded to the substrate JL under a predetermined illumination, which is based on a part of the image by means of an image pickup means. m * camera & generated image position, two-dimensional measurement means, which distinguishes the image according to the location, and the part in the image of the moon is corresponding to the line for each :目,丨暑·& 卞 枓 枓 枓 并 并 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 -10- 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 The information of the processing device stores the information of the information storage component and the solder in the confirmation terminal, and the image of the terminal surface for verification according to the above-mentioned inspection is generated. In addition, the substrate is used first. According to the welding part in the established photo, the parts for each one And the inspection of the welding state. In this method, the information system of the image displayed in the apparatus of the image of the relationship between the parts and the solder in the form of the measuring part of the measuring means can be formed by the processing means or the image stored by the means. Even if the result is stored in the device, the substrate inspection system described above can be used. According to the invention, the welding position is photographed, and the three-dimensional measurement of the parts is separated, and the three-dimensional information of the material is outputted to the three-dimensional information by the three-dimensional welding part and the zero-state and the surface-connected state derived from the quantity. The terminal device information is generated in accordance with the display video product. The verification of the information stored in the information storage outside the substrate inspection indicates that each method of the component inspection device is based on the zero on the substrate and the zero-type readout derived from the amount of the component is determined in accordance with the purpose of the zero execution. The inspection of the three parts of the shape and the solder; and the transmission of the information in the above-mentioned information storage is provided by the use of the known location display means, and the display imaging device is used for the confirmation of the processing device. The solder relationship embodiment can also be implemented as follows: The solder of the shadow member is used to measure the assembled state and the three-state storage of the solder and solder. Then, -11-201231913, using the stored information, the image of the cross-section of the cross-section of the material obtained by cutting the fresh material in the vicinity of the recorded joint surface will be in the part and the solder. The three-dimensional information represents a three-dimensional shape as a front surface, and a screen for displaying the solder and displaying the image is not provided. Further, in the display method according to the preferred embodiment, the portion of the image in the screen is inspected for inspection. The measurement results and the indicators displayed in the inspection criteria used for inspection are displayed. The above method can be carried out in addition to the inspection apparatus that performs the inspection, or in a computer that is external to the sister who performs the three-dimensional measurement or inspection performed by the inspection apparatus. Further, it is also possible to create an image of the display target in the inspection device, and to transmit the image data or the display information including the entire face of the image from the inspection device to the external device, and then display the display in the external device. The treatment of the face. [Effect of the Invention] According to the present invention, it is possible to generate an image suitable for confirming the relationship between the component and the solder based on the result of three-dimensional measurement of the component and the solder on the substrate, and to display a screen including the image. Therefore, the user can easily confirm the state of the checked portion based on the displayed face and can judge whether the check result is proper. [Embodiment] [Embodiment of the Invention] Fig. 1 is a view showing an example of a substrate inspecting apparatus to which the present invention is applied. The substrate inspection device 丨00 (hereinafter simply referred to as "inspection device 100") of the present embodiment is a substrate s which is processed by a reflow process -12-201231913 to a production line of a component mounting substrate. Meguro's inspection of the assembly state or the welding condition of the components on the substrate s is performed by the stereo camera 1, the illumination device 2, the substrate stage 4, the control processing unit 3, and the like. The substrate s of the inspection target is supported in a horizontal posture on the four sides, and the substrate S is moved in the direction along each side. The stereo camera 1 is composed of two color cameras 1A and 1B (hereinafter simply referred to as "camera ΙΑ, 1B"). One of the cameras ia is disposed above the substrate stage 4 in a state in which the optical axis is directed in a substantially slanting direction (the state in which the substrate s on the table 4 is viewed), and the other camera 1B is oriented to tilt the optical axis toward the lead. It is equipped in the vertical direction. The illuminating device 2 is a main body of a dome-shaped casing 2, and is disposed between the camera ΙΑ, 1B and the substrate table 4. On the inner peripheral surface of the casing 2, a point light source such as an LED is arranged on the entire surface. Further, although not shown in the drawings, the portion of the basket 20 corresponding to the optical axes of the cameras 1a and 丨B forms a window portion for imaging. The control processing unit 3 includes video interfaces 3A and 30B of each of the cameras 1A and 1B, an illumination control unit 3, a table control unit 32, a control unit, a packet 34, a hard disk device 35, and a communication interface 36. The input unit 37, the display unit 38, and the like. The video interface 30A, 30B includes a drive circuit for the corresponding camera, or a circuit (amplifier, A/D conversion circuit, etc.) for processing image signals from the camera ΙΑ, 1B. The illumination control unit 3 controls the light emission intensity or the light emission timing of each light source in the illumination device 2, and the table control unit 32 controls the operation of the substrate stage 4. The control unit 33 integrally controls the above-described optical system or substrate table. • 13-; 3 201231913 The various calculations for the inspection are performed. The control unit 33 includes a CPU, but may further include a digital calculation circuit for image processing or a circuit (FPGA or the like) having a function of calculating the velocity. In addition to saving the basic program, in addition to the basic program, the image data or calculation results of the inside are temporarily saved. In the hard disk device 35, there are various processes related to the inspection (including a program group used for image processing or measurement, or a test result database 1 08, a normal/characteristic scale 1 1 1 described later, etc.). The interface 36 is for communicating with an inspection device or a management production or server device set up in another process via a LAN circuit diagram provided at the site. The input unit 37 is used for an operation at the end of the designation inspection or an input of various setting materials. The display unit 38' is configured to display a face for confirmation of the inspection result or a face for setting. The zero control = portion 33 performs two-dimensional measurement on the root 2 solder using the stereoscopic image generated by the cameras 1A, 1B. Further, the pad of the substrate S is also made of the distribution pattern of the solder in the image or the image information of the substrate s. Then, using each of the three-dimensional information, check the relationship between the pad and the component, the relationship between the electrode and the solder, and the tilt of the solder fillet. Further, after the inspection results are combined by the parts and the substrate, the female ',', the part unit, and the substrate unit are judged to be good or bad. And/or, the light = composition for achieving three-dimensional measurement of the part and the solder is explained. In the illumination device 2' of the present embodiment, the point light source disposed over the entire inner surface of the dome shape is irradiated with light from the omnidirectional range of the measurement range of the camera 1. Further, in the present embodiment, the illuminant for adjusting the illuminating intensity of each of the color components of R, g, and b is used as the strong phase of the gradation of the gradation of The second and third figures of the appropriate amount are displayed in a pattern to show the change of the casing 20 of the month device 2. In the present embodiment, the intensity of each color is changed from the one end edge of the Dong body 20 to the opposite end edge through the top of the sky, and the angle is quite different. Set between each change direction (10) Figure 2 shows the intensity of each color component by the image for each color component: 疋 For the convenience of illustration, set 8 points with the same connection strength (free line), and so on. The line is the realm and the coating pattern is changed. In the meantime, any kind of coloring >, along the direction of the thick arrow on the image, gradually strengthens the range from 〇 to 255. This change in intensity is achieved by varying the intensity of r, ◦, Β illumination for each light source or block comprising a plurality of light sources. The ratio of the R, G, and B ratios of the light irradiated from the respective positions of the illumination device 2 by the mutual use of the intensity changes of the respective color components differs depending on the azimuth angle or the incident angle of each light. Further, in the present embodiment, even in the case where the surface of the solder is not completely mirrored, the reflection component (reflected light from the optical axis direction of the machine and the direction of the light irrespective of the regular reflection) is canceled by the component of the reflected light. In addition, the amount of change in the direction of the intensity change is adjusted so as to reflect only the light image of the specular reflection component (refer to Patent Document 2 for the structure or the rationality of the specific adjustment). When the image is taken under the illumination of the illumination device 2, the image of either the camera or 1B can be 'specifically determined according to the intensity ratio of R, G, and B of the specular reflected light image of the solder in the image. Produce the same as the -15-201231913, the same as the injection of the element, the mm part of the disc phase area > the direction of the light. Further, the normal direction of the inclined surface of the solder can be specified based on the relationship between the specific direction and the optical axis directions of the cameras 1 A and i B . Further, in the present embodiment, the total intensity of R in the case where the total height of each of R, G, and B is obtained by using the light from the height of the zenith angle of the illumination device 2 (see FIG. 3) is targeted. The total intensity and the total intensity of B are values. The illumination intensity of each light source is adjusted. Therefore, the total intensity of each of R, G, and B of light from all the light sources is also substantially uniform, and is based on the part or the substrate body. The light reflected by the diffuse and reflective composition is mixed to become white light, and then incident on the cameras 丨A and 丨B. Therefore, in order to capture the zero or the substrate body in a state of illumination similar to the case of performing white illumination, an image close to the actual color can be produced. Next, Fig. 4 shows the function set in the above-described inspection device i. As shown in Fig. 4, in the inspection device 1 of the present embodiment, the setting is set to be in. Μ 0 1. For the pad specific part 丨〇 2, the solder measuring part 丨〇 3, the part measurement 1_〇 4 two-dimensional beacon generating part 丨〇 5, check the execution part ^ % and confirm the face =.卩1 07 features. Further, the normal/speciality table 1 1 1 and the inspection result database 1 0 8 in the solder measuring unit 储存3 are stored in the sapphire n β stone further image input unit 101 shown in FIG. 1 via the image interface 3 〇Α, 3〇β, input the stereoscopic image generated by each A 1Β. In Figure 4, although not
刀地表示盘各個旦;；你& y么 、另J ’、像的關係，但是在銲墊特定部丨〇 在干料測量部1 〇 3及f彳生、日丨θ加,Λ 02 後處理。及零件測-部…’輸入雙方的影像資 在影像輸入部10】，4p L 功能，在旦… 區域的設定功能。利用 v 之包含目標零件及銲接部位的範圍嗖 -16 · 201231913 定處理目標區域。 銲墊特定部1〇2根據各像素的亮度（R、G、8之坡強 幻’從影像中的處理目標區域抽出包含銲料的區域，再 將《亥抽出結果與基板s的映像f訊比對等，而特 薛墊之範圍(從映像資訊特定適合顯示録料之像素所集 的銲墊’並將銲塾的大小與該範圍對映根據 厂：墊的特定結果，亦特定銲料測量部1〇3或零件測量部 104的測量區域。 在銲料測量部103,包含特徵量算出部110、法線/ 徵里表1 1 1、法線導出部1 12、像素對映部1 13及高度算出 部⑴等。在法線/特徵量表ιη，將在照明裝置2之來自 各方向的光R、G、B的強度比例（以下稱為「R、G、B比 」)作為特徵量，按相機心1B ’保存表示該特徵量盘利 用該特徵量(以角度資訊表示)所表示之面的法線… 對應關係的表》 技特徵量算出部110係在利用銲塾特定部102特定為鮮 墊之範圍内設定測量區$，並將在該區域内r、G、^之 總強度超過既定值的像素作為目標，算出R、G、B比。 法線導出部112係藉由將上述R、G、Btb與法線/特徵量 表1比對，而導出對應的法線方向。利用此 得與表示=之各像素對應的法線方向。 求 j徵1异出部U〇及法線導出部丨12的處理係對構 立衫像的各影像所實施。利用此等處理，從各影像產 =個法線方向作為像素資訊的虛擬影像。像素對映 部11 3係對該虛擬旦彡伯士 、 I擬〜像應用相機ΙΑ、1B的關係，將在像 -17- 201231913 素間，位於滿足極線（epip〇lar)約束條件，而且對映法 方向大致一致之關係的像素。高度算出部L丨4係對被對映 之像素的每一組實施應用三角測量的計算後，算出高戶 在零件測量部104，包含零件區域抽出部丨15、测量 點抽出部1 1 ό、測量點對映部【丨7及高度算出部1丨8等。里 零件區域抽出部115對各影像比對零件的模型$像 例如進行正常化相關計算等）等，而抽出零件之形狀\ ( 徵所出現的區域（零件區域p ‘ 測量點抽出部116根據對處理目標之零件所登錄的 檢查基準’從各影像的零件區域抽出既定數的測量點。 例如，若處理目標零件是晶元零件，抽出零件本 側之雷把& , . 肋及兩 件^道 面之邊緣的構成點。此外’若處理目標零 =線零件’抽出零件本體的上面及各電極之前 刀之邊緣的構成點。 測量點對映部i 17係以相機1A的正視影像為Knife ground means each disk;; you & y, another J ', image relationship, but in the specific part of the pad 干 in the dry material measurement part 1 〇 3 and f 、, 丨 θ plus, Λ 02 Post processing. And the parts measurement-section...'Enter the image resources of both sides in the image input unit 10], 4p L function, in the ... setting function of the area. Use v to include the target part and the welded part range 嗖 -16 · 201231913 to process the target area. The pad-specific portion 1〇2 extracts the region containing the solder from the processing target region in the image according to the brightness of each pixel (the slope of R, G, and 8 is strong), and then compares the image of the extraction result with the image of the substrate s. Equivalent, and the scope of the Tessa mat (from the image information is specifically suitable for displaying the pads of the recorded pixels) and the size of the soldering iron is reflected by the range. According to the specific results of the factory: pad, the specific solder measuring department 1〇3 or a measurement area of the part measurement unit 104. The solder measurement unit 103 includes a feature quantity calculation unit 110, a normal/levis table 1 1 1 , a normal line derivation unit 12, a pixel alignment unit 13 and a height. In the normal/feature amount table ιη, the intensity ratio (hereinafter referred to as "R, G, B ratio") of the light R, G, and B from the respective directions in the illumination device 2 is used as the feature amount. According to the camera core 1B', the normal line indicating the surface of the feature disk (indicated by the angle information) is stored. The table of the correspondence relationship is defined by the bead specifying unit 102. Set the measurement area $ within the range of the fresh pad, and the total of r, G, and ^ in the area The pixel having a predetermined value exceeds the predetermined value as the target, and the R, G, and B ratios are calculated. The normal line deriving unit 112 derives the corresponding normal direction by comparing the R, G, and Btb with the normal/feature scale table 1. By using this, the normal direction corresponding to each pixel indicating = is obtained. The processing of the different sign U 〇 and the normal line deriving unit 求 12 is performed on each image of the erected shirt image. From the image production = normal direction as a virtual image of the pixel information. The pixel mapping part 11 3 is the relationship between the virtual 彡 彡 、, I 〜 ~ image application camera 1, 1B, will be in the image -17- 201231913 A pixel in a relationship that satisfies the epic〇lar constraint and has a substantially uniform entropy direction. The height calculation unit L丨4 applies triangulation to each group of the mapped pixels. After the calculation, the high-level component measuring unit 104 includes the component region extracting unit 、15, the measuring point extracting unit 1 1 ό, the measuring point mapping unit [丨7, the height calculating unit 1丨8, etc. 115 pairs of images for each part of the model $ like, for example, normalization related The shape of the part is extracted, and the shape of the part is extracted. (The area where the acquisition occurs (the part area p 'measurement point extraction unit 116 extracts a predetermined number from the part area of each image based on the inspection standard registered for the part to be processed. For example, if the target part is a wafer part, extract the parts of the thunder and the ribs and the edges of the two sides of the part. Also, if the target zero = line part is extracted, the part body is extracted. The upper part and the constituent points of the edge of the knife before the electrode. The measuring point mapping part i 17 is the front view image of the camera 1A.
琢基進疋/A , W 办像令的各測量點，在另一方的影像 極線約击放& 不乐兩足 後，果條件，且周圍附近之影像的特徵類似的測量點 對映將用探索所抽出之測量點與基準影像側的測量點 應用—鬲度算出部η 8係對被對映之測量點的各組，實施 一角剛量的計算，而算出高度。 後抽 卜，/則量點抽出部116係識別零件本體與零件電極 出剩量點。在測量點對映部117及高度算出部118, ^ 0¾¾ KiJ _ 4不零件本體的測量點與顯示零件電極的 便執行處理。 、置點 -18- 201231913 二維資訊產生部l〇5取得上述銲墊特定部1〇2、銲料 測量部1 0 3及零件測量部} 〇4的處理結果後，對銲墊、銲 料、各零件種類產生三維資訊。具體而言，關於銲料與 零件，各自藉由將相機丨八之正視影像中成為測量目標之 j素的座標與所測量之高度對映，而設定三維座標。另 方面，關於銲墊，對在相機丨八之正視影像以對應於銲 ^所特定之範圍内之各像素的座標，設定定值之高度（ 是與基板之厚度對應的值，遠低於銲料或零件之高度^ 值）0 進而，二維資訊產生部1 05對各三維座標分別附加該 及標所表示之構成物（銲塾、銲料、零件）的種類的碼^ Μ零件或銲接部位的識別碼後，儲存於檢查結果資料庫 08。此外，對零件的三維座標，附加表示零件本體、零 午電極之任一個的碼。 之依據上述三維資訊產生部1 05的處理，因為將相機以 户正視影像的座標直接應用於銲墊、銲料及零件的三维 二標，所以三者的三維資訊自然整合。利用該資訊：特 在檢查執行部106,使用按零件種類所設定之檢查程 "，實施用以查核在零件、銲料及銲塾之=者間^ 的各插、Β丨曰 < 一者間之關係 種測$後，將各測量結果與判定基 良/ 丞早比對，而判定 #定結果及測量處理時所得之測量值係作為檢查社 :’以將處理目標的零件及銲接部位之識別媽對： 乃式儲存於檢查結果資料庫1 08。 、 確認晝面顯示部107係以上述檢查結束的零件為目 -19- 201231913 標’設定可易於確認其檢查或測量之結果的畫面，並將 該晝面顯示於顯示部3 8。在該畫面，包含使用檢查結果 身料庫1 08所儲存之檢查結果資訊及三維資訊所產生之 零件之模式圖的影像。 以下’將如第5圖所示之晶元零件作為確認目標的零 件，說明確認對該零件之一侧的電極之檢查結果之畫面 的顯示例。此外，在以下的實施例，將基板之長邊的方 向設為X方向，將短邊的方向設為γ方向，將高度設為z 方向。此外，確認目標的零件採用配合電極之排列邊向 及X方向所裝配者。 第6圖表示將第5圖中的晶元零件之以點線框所示的 範圍作為目標，顯示確認用晝面G1的例子。在該畫面⑺ ，在配合各自之比例尺或對準位置之狀態顯示表示從上 ㈣視晶it零件之顯示目標範圍之狀態的影像（以下稱為 XY圖」）、以YZ平面為正面的影像（以下稱為「γζ圖」 )、及以χζ平面為正面的影像（以下稱為「χζ圖」）。 在任-影像，都各自利用其構成所特有的顏色（在第 6圖」替代成塗布圖案後顯示，而且在圖中之右下的框内 顯示各圖案與構成物的對應關係）將零件本體、電極、銲 料及銲墊著色。此外，各影像之未附加圖案之空白的部 分對應於未產生三維資訊的基板本體，但是在該部分亦 設定與銲墊相同的高度資料。 ΧΥ圖係顯示從上方俯視第5圖之曰曰曰元零件之點線框 範圍W的㈣。若依據該影像’明白地顯示在鲜塾 之廣大的範圍之銲料或零件的位置關係。 -20- 201231913 yz圖係將在沿著γ_ζ vai| ^ ^ ^ ± j阀冬件電極之端面的外 側：取近位置的情況所產生之銲料的剖面作為正面，並 與为後之零件電極或下方的輝塾一 、 ^ ^ Y 7-^T ^ 起顯不。XZ圖係將在 者x-z方向剖開零件電極之端面的外側 情況所產生之銲料的叫 近位置的 極、零件及下方件電 圖，可相對零件電極之銲料的接合狀 完成狀態。 &于杆的潤濕 進而，在本實施例的確認用晝面⑴， 將量規對各影像中之Λ &， 丄由輔助線 表示測量結果及判定基準。 對映的方式，琢基进疋/A, W, each measuring point of the image, in the other image of the polar line about the shot & after the two feet, the fruit condition, and the surrounding nearby image features similar measurement points The measurement point extracted by the search and the measurement point application-twist calculation unit η 8 on the reference image side are used to calculate the height of each of the groups of the measured points to be mapped. After the pumping, the measuring point extracting unit 116 identifies the remaining parts of the part body and the component electrode. The measurement point mapping unit 117 and the height calculation unit 118, ^ 03⁄43⁄4 KiJ _ 4, perform processing without measuring points of the part body and displaying the part electrodes. , the point -18 - 201231913 The two-dimensional information generating unit l 〇 5 obtains the processing results of the pad-specific portion 1 2, the solder measuring portion 1 0 3 and the component measuring portion 〇 4, and then the pads, the solder, and the respective pads The part type produces three-dimensional information. Specifically, the solder and the parts are each set to have a three-dimensional coordinate by mapping the coordinates of the target object in the front view image of the camera to the measured height. On the other hand, regarding the bonding pad, the height of the setting value is set to a value corresponding to the thickness of the substrate in the front view image of the camera to correspond to the coordinates of each pixel within the range specified by the soldering, which is much lower than the solder. Or the height of the part ^ value) 0. Further, the two-dimensional information generating unit 506 adds the code of the type (weld, solder, and part) of the type indicated by the standard to each of the three-dimensional coordinates. After the identification code, it is stored in the inspection result database 08. In addition, a code indicating either the part body or the zero-day electrode is attached to the three-dimensional coordinates of the part. According to the processing of the three-dimensional information generating unit 105 described above, since the coordinates of the camera front view image are directly applied to the three-dimensional two-standard of the pad, the solder, and the part, the three-dimensional information of the three is naturally integrated. This information is used by the inspection execution unit 106, and the inspection program set by the type of the component is used to check the insertion and the Β丨曰 of the parts, the solder, and the solder joints. After the relationship between the two types is measured, the measurement results are compared with the judgment keliang/丞, and the measurement results obtained by determining the #determination result and the measurement processing are used as the inspection society: 'to process the target parts and the welding parts Identifying the mother pair: The formula is stored in the inspection result database 1 08. The confirmation face display unit 107 sets a screen for easily checking the result of the inspection or measurement with the component of the above-mentioned inspection as the target -19-201231913, and displays the face on the display unit 38. On this screen, an image of the pattern of the parts generated by the inspection result stored in the body library 108 and the pattern image generated by the three-dimensional information is included. In the following, the wafer element shown in Fig. 5 is used as a component to be confirmed, and an example of a screen for confirming the inspection result of the electrode on one side of the component will be described. Further, in the following embodiments, the direction of the long side of the substrate is the X direction, the direction of the short side is the γ direction, and the height is the z direction. In addition, the parts to be confirmed are assembled in the X direction and the X direction. Fig. 6 is a view showing an example in which the surface of the wafer element in Fig. 5 is indicated by a dotted line frame, and the confirmation surface G1 is displayed. On the screen (7), an image indicating the state of the display target range from the upper (four) viewing unit (hereinafter referred to as an XY image) and an image having the YZ plane as the front side are displayed in a state in which the respective scales or alignment positions are matched ( Hereinafter, it is referred to as a "gamma map", and an image having a front plane as a front surface (hereinafter referred to as "map"). Each of the image-images is displayed by using the color unique to the composition (in FIG. 6) instead of the coating pattern, and the corresponding relationship between the patterns and the components is displayed in the lower right frame in the figure. Electrodes, solders and pads are colored. Further, the blank portion of each image in which the pattern is not added corresponds to the substrate body on which the three-dimensional information is not generated, but the same height data as the pad is also set in this portion. The ΧΥ map shows (4) the range W of the dotted wire frame of the element of the figure in Fig. 5 as viewed from above. According to the image, the positional relationship of the solder or the parts in a wide range of fresh enamel is clearly displayed. -20- 201231913 The yz diagram will be along the outer side of the end face of the γ_ζ vai| ^ ^ ^ ± j valve spring electrode: the profile of the solder produced by taking the near position as the front side, and with the subsequent part electrode or Below the 塾 塾, ^ ^ Y 7-^T ^ show no. The XZ pattern is a near-position electrode, a part, and a lower part of the solder generated by cutting the outer side of the end face of the part electrode in the x-z direction, and can be completed with respect to the joint of the solder of the part electrode. & Wetting of the rod Further, in the confirmation surface (1) of the present embodiment, the gauge is used to indicate the measurement result and the determination criterion for the Λ & The way of mapping,
具體而言，在圖中之各量規gA〜gF 測量終點映上黑色的三角形記號，並使二點與 號對應於良判定的基準值。2個黑、：角形記 著色部分(在圖上利用斜線圖案表號之間的 。 Η目田於所測量之值 簡單說明各量規所示之資訊的内容。 以圓的量規gA係表示對零件電端 潤濕完成狀態的檢查結果。具體而言，顯：：：圓角之 電極之端面接合的料（即，YZ圖之正與零件 相對零件電極之高度的比例、測量值之良:二的銲料)之 設定於從50%至100%之範圍、及渴J量值是、8〇^。的基準被 Υζ圖的量規gB係表示在零件電極 方向之銲料之接合狀態的檢查結果。 之在寬度 量與零件電極之端面接合的銲料對：，顯示测 仰對令件電極之寬度 -21 - 201231913 的比例、測量值之良判定的基準被設定為75%以上、及 測量值是92%。 XV圖的量規gC係表示銲墊與零件之位置關係的檢 查結果。具體而言，顯示以相對銲墊之χ方向之寬度的比 例求得在銲墊上之零件的搭載範圍、測量值之良判定的 基準被設定為1 0 0 %以下、及測量值是6 〇 %。 ΧΥ圖的量規gD及gE係表示關於銲墊與零件電極之 位置關係的檢查結果。在量規gD，顯示測量零件電極中 在X方向與銲墊重疊之部分的比例、測量值之良判定的基 準被設定為75%以上、及測量值是1〇〇%(意指零件電極整 體位於銲墊上）。在量規gE，顯示測量零件電極中在Y方 向從銲墊超出之部分的比例、測量值之良判定的基準被 設定為25%以下、及測量值是〇%(意指未超出銲墊）。 XZ圖的量規gF係表示關於銲料之傾斜角度的檢查 結果，顯示銲料之傾斜面相對銲墊之面的夾角门〇度）。 此外’在該量規gF，表示將6〇度的傾斜角度作為良判定 的基準。 如上述所不’在本實施例的確認用晝面G1，顯示從 上方看零件、銲料及銲墊之三者之關係的χγ圖、及與零 件或銲墊的關係一起表示與零件電極接合之銲料之剖面 形狀的ΥΖ圖與ΧΖ圖，而且以將測量結果或表示判定基準 的扣標與影像中之測量目標部分對映的方式所顯示。因 此，使用者可易於確認在各影像之零件、銲料及銲墊的 關：、或測量結果。此外，可從影像中之各構成的狀態與 判定基準的關係，判斷是否得到適當的檢查結果。 •22- 201231913 上述確涊用畫面G1中的χγ圖係使用檢杳社果眘枓 庫108所保存之各播士、从 口你便用檢置、，Ό果貝枓 ^ ^ .. 構成的二維座標中的X、Υ座標或零件 的=景1像所製作。例如，關於薛塾及鲜料，在繪圖用 :面上晝所保存之三維座標中的χ座標及γ座標，並設 :於各點的顏色。另-方面，關於零件，以取得表 丁輪廓之邊緣構成點的三維座標為前提，在繪圖用ΧΥ平 面上晝該三維座標中的χ座標及⑽，而特定輪廓線， 並對輪廊線及其内相,丨& /务| + 側的像素s又疋零件本體或零件電極的 顏色。 —為了製作ΥΖ圖及χζ圖，需要從各構成的三維座標決 疋剖面的位置（在γΖ圖為χ座標，在χζ圖為Υ座標）後以 該位置為基準，特定在影像所出現之構成。作為具體例 ，使用第7圖的流程圖，說明產生第6圖之γζ圖&情況的 處理例。 首先，在步驟S 1，沿著χ方向（朝向零件之外側的方 向）搜尋零件電極的三維座標，而取得零件電極之端緣的 X座標XG。接著，在步驟S2，取得在位於比Xg更往外側Δχ 的ΥΖ平面所分布之銲料的座標。此外，Λχ的值被設定成 表示數像素以内，即至與零件電極密接之位置或零件電 極之極近的位置之距離的值。 在步驟S3，使用在步驟S2所取得之座標，特定表示 在Y Z平面之銲·料之剖面形狀的線p。 在步驟S4，再參照零件電極的三維資訊，將各三維 座標投影於上述YZ平面。然後，使用各投影點中位於比 曲線P更上面的點，特定表示零件之外形的線Q。 -23- 201231913 在步驟S5，將銲墊之三維座標投影於γζ平面後，對 各投影點設定銲塾的顏色。此外，在設定銲墊的顏色之 範圍的兩側設定零件本體的顏色。藉此，產生銲墊及零 件本體的影像。 在步驟S6’在利用步驟S5的處理所設定之銲墊及零 件本體之影像的上端緣至線Ρ之範圍設定銲料的顏色。進 而，在步驟S7，在從線ρ至線Q之範圍設定零件電極的顏 色。利用此等步驟S6、S7的處理，產生銲料的影像及零 件電極的影像，而完成ΥΖ圖。 —在氚作χζ平面的情況，亦利用根據上述的步驟，沿 者Υ方向搜尋零件（在此情況，包含零件電極）的三維座標 L而取得零件之側面的γ座標。然後，使用在位於該Υ座 :之外側的最近位置之χζ平面所分布之銲料的三維座 示’特定表示銲料之剖面形狀的線。此外，將零件本體 及零件電極的三維座標投影於ΧΖ平 料 卞囟後，使用位於比銲 線更上面的投影點，特定表示零件之外形的線。進 ，再根，料的三維資訊，產生㈣及零件本體的影像 根據各線產生銲料或零件的影像， 圖。 冬精此，可完成ΧΖ 對銲料的二 因為製作將零件電極 斗的接5面之最近位置的垂直剖面作為正面的3 以可明確地表示零件電極和與其。 。此外，左 要σ之知抖的關 在鲜料未對零件電極完全潤渴，@ 4 βI 產生問階沾比. 向在兩者之 、、情況，利用正面未出現辉料 與零件雷杌八 叶料的γζ圖、或銲 電極刀開之狀態的ΧΖ圖，可明確地表示不良之 -24 - 201231913 態。 第8圖表示確認用晝面之第2例。 子 影 像 在本實施例之確認用畫面G2’顯示構成與第6圖之例 一樣的XY圖、YZ圖、XZ圖’而且受理對顯示中的各 像指定剖開位置的操作。進行該指定操作時，在各％ ’對各影像添加表示該指定位置或剖面形狀的線畫^ 想設定之剖面正交的面為正 的操作所指定。所設定之直 ，在其它的影像，亦利用與 剖面的、線畫。此夕卜，在所圖 的差異替代成線種類的差異 剖開位置係利用對以與 面的影像晝表示剖面之直線 線係各自以相異的顏色表示 該直線相同的顏色顯示表示 不的例子，將各線畫之顏色 來表示。 在第8圖的例子，在XY圖或乂乙圖，隨著從零件電極 的端緣至距離很遠的位置設定沿著γ方向的直線u，而 在yz圖，顯示表示在對應於該直線[丨之位置的γζ平面之 鲜料的剖面形狀的線μ 1。此外，在χγ圖或YZ圖，隨著 至接近零件電極之一側邊的位置設定沿著Ζ方向的直線 L 2， 、而在又2圖’顯示表示在對應於該直線L2之位置的χζ 平面之零件及銲料的剖面形狀的線M2。 進而，在ΧΖ圖或γζ圖，隨著在比零件之底部下面的 位置與比零件之上部（比銲料高的位置）設定直線L3、L4 而在XY圖顯示表示比零件下方之銲料之形狀的線M3 〃表不零件上部之輪廓形狀的線M4。 、，上述的線M1〜M4係可根據在與所設定之直線對應的 平面内所分布之三維座標特定。 •25- 201231913 在第8圖之例子的書 J躉面G2，亦可將與第ό圖之例子& 里規gA〜gF與顯示中的旦 j子的 、衫像對映。此外，所指定之 的方向未限定為沿著Y < Μ面 < Λ·Υ、γ_ζ、χ ζ的方向， 對此等方向傾斜的為丨品 』j知疋 顯示。 。，並因應於該指定，更新影像的 第9圖顯示因應於 、。丨開位置的指定，執行再測量接 顯示其結果的例子。+ 更’ 此外，在本例的確認用晝面G3，或 了簡化圖不，將顯不的目標限定為XY平面及YZ平面。： 卜在本例令件相對銲墊有轉動偏差，在χγ圖， 準該轉動之零件的端而士, 対 耵鹆面方向，並沿著在γ方向斜橫切 向剖開的方式設定直線L。 因為本確認用晝面G3的ΥΖ圖最初係利用第7圖 的處理所I作’所以顯示零件傾斜之狀態，但是隨著該 直線L的„又定’ Υζ圖的顯示被變更成將沿著對應於直線^ 之方向的剖面（沿著直線L剖開零件電極的最鄰近者）作 為正面者。進而，顯示表示在直線L的位置剖開銲料的，产 況所得之銲料的形狀的線M。 月 在本例’亦根據在檢查時所取得之測量資料，在γζ 圖’將表示零件電極與銲料之關係的量規gA、gB對映， 並顯不。進而，在本例，在所指定之剖開面之銲料的曲 線Μ設定測量點（在YZ圖利用X記號表示），再求得此等測 蓋點之間的距離後’顯示表示其測量結果的量規gK或表 丁-:目“ y '、里..之關係的量規gi。此外’量規gI顯示將沿著直 線L之|干料的表面中相當於零件電極之高度的“％之高 度位置的點、與相當於零件電極之高度的40%之高度位 -26- 201231913 置的點作為測量點。量規gK顯示此等測量點之 零件電極之寬度的40%。此等測量處理是自動實施疋 是未限定如此’亦可受理使用者對測量點的指定：再： 量。 ’、 其次，在上述之3例的確認用^G1〜G3，以特定之 零件的-處銲接部為目標，顯示複數個影像， 形式係未限定如此’亦可僅顯示其中—種影像。此外不 亦可切換各種影像後顯示。此外，在所顯示 卜二 種的情況，亦可作成因應於對該 斯 像。此等顯示形式或顯示目標部仅 面的- 的指定操作適當地切換。 因應於在輸入部37 办傻亦可作成表示在—個零件之全部的銲接部的 : 一個晝面。例如若是晶元零件，可顧亍勺“Specifically, the black triangle marks are mapped to the measurement end points of the gauges gA to gF in the figure, and the two-point sign corresponds to the reference value of the good judgment. 2 black, angled coloring parts (between the slash pattern numbers on the figure. Η目田 于 于 所 所 所 所 所 所 所 所 所 所 所 所 所 所 所 所 所 所 所 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于The result of checking the state of completion of the wet end of the electric part of the part. Specifically, the material of the end face of the rounded electrode is joined (that is, the ratio of the positive ZZ figure to the height of the part relative to the part electrode, and the measured value is good. The solder of the second is set in the range of 50% to 100%, and the amount of the thirst J is 8 〇. The gauge gB of the reference is the inspection of the bonding state of the solder in the direction of the component electrode. As a result, the pair of solders whose width is bonded to the end faces of the component electrodes: the ratio of the width of the counter electrode to the width of the electrode 21 - 201231913, and the basis for the good determination of the measured value are set to 75% or more, and the measured value It is 92%. The gauge gC of the XV diagram indicates the inspection result of the positional relationship between the pad and the component. Specifically, the mounting range of the component on the pad is determined by the ratio of the width of the pad to the width of the pad. The benchmark for good judgment of measured values is set It is less than 100%, and the measured value is 6 〇%. The gages gD and gE of the figure show the inspection results of the positional relationship between the pad and the part electrode. In the gauge gD, the measurement part electrode is displayed in the X The ratio of the ratio of the portion overlapping the pad to the pad and the good value of the measured value are set to 75% or more, and the measured value is 1% (meaning that the part electrode is entirely on the pad). On the gauge gE, the measurement is displayed. The ratio of the ratio of the portion of the component electrode that is out of the pad in the Y direction and the measurement value is set to 25% or less, and the measured value is 〇% (meaning that the pad is not exceeded). The gauge of the XZ diagram gF The result of the inspection regarding the inclination angle of the solder shows the angle of the angle between the inclined surface of the solder and the surface of the pad). Further, in the gauge gF, the inclination angle of 6 degrees is shown as a criterion for good judgment. As described above, the χγ map showing the relationship between the component, the solder, and the pad from the top, and the relationship with the component or the pad, together with the component electrode, are shown. A map and a map of the cross-sectional shape of the solder, and is displayed in such a manner that the measurement result or the deduction indicating the judgment datum is mapped to the measurement target portion in the image. Therefore, the user can easily confirm the parts of the respective images, the solder and the pads, or the measurement results. Further, it is possible to determine whether or not an appropriate inspection result is obtained from the relationship between the state of each component in the image and the criterion. • 22- 201231913 The above 涊 图 图 图 画面 画面 画面 画面 画面 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 108 The X, Υ coordinates or parts of the 2D coordinates are made with the image of the scene 1 . For example, regarding Xue Yu and fresh materials, in the drawing: the χ coordinates and γ coordinates in the three-dimensional coordinates stored in the surface are set, and the color of each point is set. On the other hand, on the premise that the part is obtained by taking the three-dimensional coordinates of the edge of the outline of the figure, the χ coordinates and (10) in the three-dimensional coordinates are drawn on the plane of the drawing, and the specific contour line, and the contour line, The inner phase, 丨 & / service | + side of the pixel s is the color of the part body or part electrode. - In order to create a map and a map, it is necessary to specify the position of the image from the position of the three-dimensional coordinate of each structure (the Ζ map is the χ coordinate, and the Υ coordinate is the Υ coordinate). . As a specific example, a processing example in which the γ ζ diagram &amp; of Fig. 6 is generated will be described using the flowchart of Fig. 7. First, in step S1, the three-dimensional coordinates of the part electrodes are searched in the x direction (toward the outer side of the part), and the X coordinate XG of the edge of the part electrode is obtained. Next, in step S2, the coordinates of the solder distributed in the pupil plane located Δχ outside Xg are obtained. Further, the value of Λχ is set to a value indicating a distance within a few pixels, that is, a position close to the position of the component electrode or a position very close to the component electrode. In step S3, the line p obtained in step S2 is used, and the line p indicating the cross-sectional shape of the welding material in the Y Z plane is specified. In step S4, the three-dimensional information of the part electrodes is further referred to, and each three-dimensional coordinate is projected on the YZ plane. Then, using a point located above the curve P among the respective projection points, a line Q indicating the shape of the part is specified. -23- 201231913 In step S5, after projecting the three-dimensional coordinates of the pad on the γζ plane, the color of the solder fillet is set for each projection point. Further, the color of the part body is set on both sides of the range in which the color of the pad is set. Thereby, an image of the pad and the part body is generated. In step S6', the color of the solder is set in the range from the upper edge of the image of the pad and the part body set by the process of step S5 to the line Ρ. Further, in step S7, the color of the part electrode is set in the range from the line ρ to the line Q. By the processes of steps S6 and S7, the image of the solder and the image of the component electrode are generated, and the image is completed. - In the case of the χζ plane, the γ-coordinate of the side of the part is obtained by searching the three-dimensional coordinates L of the part (in this case, the part electrode) in the direction of the 根据 according to the above steps. Then, the three-dimensional figure of the solder distributed in the pupil plane located at the nearest position on the outer side of the sley is used to specifically indicate the line shape of the cross section of the solder. In addition, after projecting the three-dimensional coordinates of the part body and the part electrode to the ΧΖ flat material, a projection point located above the wire is used to specify a line indicating the shape of the part. Into, re-root, three-dimensional information of the material, produce (four) and the image of the part body to generate images of solder or parts according to each line, figure. In the winter, this can be done. ΧΖ For the solder 2, the vertical section of the nearest position of the 5th surface of the part electrode bucket is made as the front 3 to clearly indicate the part electrode and the same. . In addition, the left σ zhizhi is close to the fresh material, and the electrode of the part is not completely thirsty, @ 4 βI produces a problem ratio. In the case of both, the situation, the use of the front does not appear the glow and the parts Thunder eight The γ map of the leaf material, or the map of the state of the electrode electrode open, clearly indicates the poor -24 - 201231913 state. Fig. 8 shows a second example of the confirmation use. Sub-images The XY image, the YZ image, and the XZ image ′ which are the same as the example of Fig. 6 are displayed on the confirmation screen G2' of the present embodiment, and the operation of specifying the cut-away position for each image in the display is accepted. When the designation operation is performed, each of the images is assigned to each of the images by the operation of adding a line indicating that the specified position or the cross-sectional shape of the line is orthogonal. The set is straight, and in other images, it is also used for cross-section and line drawing. In addition, in the case where the difference of the figure is replaced by the difference in the type of the line, the difference is shown in the same color as the straight line of the line representing the image of the face, and the same color is displayed in a different color. , the color of each line is represented. In the example of Fig. 8, in the XY diagram or the 图 diagram, a straight line u along the γ direction is set along a position far from the edge of the component electrode, and in the yz diagram, the display indicates that it corresponds to the straight line. [The line μ 1 of the cross-sectional shape of the fresh material of the γ ζ plane at the position of the 丨. Further, in the χγ map or the YZ map, a straight line L 2 along the Ζ direction is set to a position close to one side of the part electrode, and a 表示 corresponding to the position corresponding to the straight line L2 is displayed in FIG. Line M2 of the planar part and the cross-sectional shape of the solder. Further, in the ΧΖ map or the γ ζ diagram, the shape of the solder below the part is displayed in the XY diagram as the line L3 and L4 are set at a position lower than the bottom of the part and above the part (a position higher than the solder). Line M3 线 shows the line M4 of the outline shape of the upper part of the part. The above-mentioned lines M1 to M4 can be specified based on the three-dimensional coordinates distributed in the plane corresponding to the set straight line. • 25- 201231913 In the example of Figure 8, the book G surface G2 can also be compared with the example of the figure in the figure & gA~gF and the image of the shirt in the display. In addition, the specified direction is not limited to the direction along the Y < Μ & Υ Υ γ γ γ γ γ , 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 . And in response to the designation, Figure 9 of the updated image shows that it corresponds to . The designation of the position is performed, and an example of performing the re-measurement is displayed. + more' In addition, in this example, the confirmation face G3 or the simplified figure is not limited, and the target is not limited to the XY plane and the YZ plane. : In this case, the part has a rotational deviation with respect to the pad. In the χγ diagram, the end of the part to be rotated is placed in the direction of the face, and the line is set obliquely and tangentially in the γ direction. L. Because the map of the face G3 is used in the first place, the state of the part is tilted, so the display of the part is tilted, but the display of the line L is changed along with the display of the line L. A cross section corresponding to the direction of the straight line ^ (the nearest neighbor of the component electrode is cut along the straight line L) is displayed as a front side. Further, a line M indicating the shape of the solder obtained by cutting the solder at the position of the straight line L is displayed. In this example, the gauges gA and gB indicating the relationship between the electrode of the part and the solder are displayed in the γ ζ diagram according to the measurement data obtained at the time of inspection, and further, in this example, The curve of the designated soldering surface of the soldering surface Μ sets the measuring point (indicated by the X mark in the YZ diagram), and then obtains the distance between the measuring points, and then displays the gauge gK or the meter indicating the measurement result. : The gauge gi of the relationship of "y", 里.. In addition, the gauge gI shows a point along the line L of the dry material corresponding to the height of the part electrode "% of the position of the height of the part electrode, and the height corresponding to the height of the part electrode is -26-201231913 The set point is used as the measuring point. The gauge gK shows 40% of the width of the part electrode of these measuring points. These measuring processes are automatically implemented, which is not limited to such 'can also accept the user's designation of measuring points: again: '. Secondly, in the above-mentioned three examples of confirmation, ^G1 to G3, a plurality of images are displayed for the welding part of the specific part, and the form is not limited to such a 'only one of them can be displayed. In addition, it is not possible to switch between various images and display them. In addition, in the case of the two types of display, it is also possible to switch to the corresponding image in the display form or the display target only. In response to the stupidity in the input unit 37, it can also be made to represent the welding part of all the parts: a kneading surface. For example, if it is a wafer element, you can take care of the scoop.
件及兩側之銲接部位之範圍的ΧΥ圖盘m:、匕3令 圖。 ^各知接部位的YZ 此外，亦可關於同一種零件， 產生法則產生影像，並設定一覽顯康相同之影像 在第1 0圖顯示其一例。 荨衫像的畫面。 在第10圖的例子，以複數個 -方的銲接部相…》 類相同的晶元零件之 #位為目標，製作γ 7圓 圖之—覽顧-_ 圖’並顯示包含此等ΥΖ I顯不攔201的確認用畫 寻 各ΥΖ«，各自將第6圖之例子U旦在顯示襴201内之 對零件電極之圓自 丁、里規gA(顯示銲料相 圓角之高度的測量值未達到判定對映。進而，在 】疋基準所不的良範圍之零 -27- 201231913 件的影像（至一覽顯示中之第2段的影像），設定「nG」的 顯示。在圓角之高度的測量值包含於良範圍之零件的影 像顯示於被根據既定顏色之粗框2〇 1 a所包圍的範圍。 進而’在該晝面的右邊’顯示表示在顯示目標之晶 元零件之圓角的高度檢查所設定之判定基準的影像202 、與顯示對一覽顯示攔20 1之各目標零件所測量之圓角的 高度之分布的圖形203。影像202係使用晶元零件之三維 模型資料所產生，顯示在零件電極的端緣之銲料的高度 位於良、不良之境界邊緣的位置（零件之高度的25 %)之狀 態。此外，對該影像202亦添加表示判定基準的量規gL 〇 在顯示圓角之分布的圖形2〇3，對判定基準所示之良 τίϊϊ夕鈴圖折冷"ίίίΐ ί目丨丨县咨也L总The ΧΥFig. m:, 匕3 order diagram of the range of the welding parts on both sides and sides. ^YZ of each known part. In addition, it is also possible to generate an image with respect to the same part, and generate an image with the same appearance. An example is shown in Fig. 10. The picture of the shirt. In the example of Fig. 10, the γ 7 circle diagram - the view - _ diagram is created and the ΥΖ I is included in the number of bits of the same wafer element of the same number of squares. It is obvious that the confirmation of the 201 is used to draw each ΥΖ«, and each of the examples of Fig. 6 is shown in the display 襕201. The circle of the electrode of the part is self-measured, and the gauge gA (the measured value of the height of the solder fillet is shown). The image is not reached. In the image of the zero--27-201231913 piece of the good range (the image of the second stage in the list display), the display of "nG" is set. The image whose height is measured in the range of the part is displayed in the range enclosed by the thick frame 2〇1 a of the predetermined color. Further, 'on the right side of the facet' is displayed to indicate the circle of the wafer part of the display target. The height of the corner is checked by the image 202 of the determination criterion set and the pattern 203 showing the distribution of the height of the rounded corners measured by the respective target parts of the list display 20 1. The image 202 is a three-dimensional model data of the wafer element. Produced and displayed on the edge of the electrode of the part The height of the material is in the state of the edge of the edge of the good or bad boundary (25% of the height of the part). In addition, the image 202 is also added with a gauge gL indicating the reference, and a graph showing the distribution of the rounded corners 2〇3 , the good τ ϊϊ 铃 图 所示 & & & & & & & & & & & & & &
明不或在顯示欄20 1之良品、不 所以可易於識別修正是否適當 顯示畫面未限定為判定基準 亦可用作初次設定判定基準 準備相當多個已銲接的樣品 此外，第1 0圖之例子的顯 的確認或修正作業的目的，巾 之情況的設定畫面。例如，進 •28- 201231913 零件後’實施此等零件、銲料、銲墊之 Ώ、，θ ~維資訊的取锃 屑s ’再使用所取得之資訊，顯示與第1 〇圖一樣 覽或顯示測量資料之分布的圖形等，而可：： 用者指定測量資料的良範圍。 吏 上述之第6、8、9、10圖的各例所示之確認用 Gl〜f 4之顯示用資訊的產生及顯示未限定為在檢查裝 1 〇〇實施。例如，亦可從檢查裝置i〇〇向 1 ._ 。装置得輪白If it is not in the display column 20 1 or not, it is easy to recognize whether or not the correction is appropriate. The display screen is not limited to the determination criterion. It can also be used as the initial setting determination criterion to prepare a plurality of welded samples. In addition, the example of the first zero figure. The purpose of the confirmation or correction of the purpose of the work, the setting screen of the case of the towel. For example, after entering the 28-201231913 part, the information obtained after the implementation of these parts, solder, solder pads, and θ-dimensional information is used to display or display the same information as the first map. A graph of the distribution of the measured data, etc., but: The user specifies the good range of the measured data.产生 The generation and display of the display information for the confirmation G1 to f4 shown in each of the above-mentioned sixth, eighth, ninth, and tenth drawings are not limited to the inspection apparatus. For example, it is also possible to move from the inspection device i to 1. . Device trajectory
含三維測量結果的檢查結果資訊後，在該外邛裝置I 行確認用畫面的製作或顯示。或，亦可在檢查;’進 貫施確認用畫面之顯示用資訊的製作後，向 00 輸所製作之顯示用資訊。或者，亦可 ：：置傳 存於外部裝置後，在該外部裝置或與外部；、=訊儲 端裝置使用所儲存之資訊製作顯示用資訊， 的終 示用資訊的確認用畫面顯示於終端裝置。 艮據垓顯 此外，亦可將檢查結果資訊儲存於可移 能的 體’並將該記憶媒體與被裝入顯示用 :D己憶媒 ^ ]貝〇化之製作功能 個人電腦連接，使其顯示確認用畫面。 & 此外，在上述的各實施例，將三維測量 為零件及銲料，但是對在其它的fM象 、$限定 „ 倮所出現之構成物f 通孔、絲紋圖案等），亦可利用與對零件一樣的方法（ 三維測量，並顯示包含其測量結果的確認用晝面施 【圖式簡單說明】 第1圖係顯示基板檢查裝置之構成例的方塊圖。 第2圖係以映像顯示在照明裝詈夕夂A山 之變& 色成分的強度 之變化的圖。 5 -29- 201231913 第3圖係與來自天頂角相同之高度位置的光一起顯 示在照明裝置之各色成分的強度之變化方向的關係的圖 〇 第4圖係基板檢查裝置之功能方塊圖。 第5圖係與顯示之範圍一起顯示確認目標之晶元零 件的圖。 第6圖係顯示確認用畫面之第1例的模式圖。 第7圖係顯示製作第6圖之YZ圖的情況之處理的流 程圖。 第8圖係顯示確認用畫面之第2例的模式圖。 第9圖係顯示確認用畫面之第3例的模式圖。 第1 0圖係顯示確認用晝面之第4例的模式圖。 【主要元件符號說明】 100 基板檢查裝置 101 影像輸入部 102 銲墊特定部 103 銲料測量部 104 零件測量部 10 5 三維資訊產生部 10 6 檢查執行部 107 確認畫面顯示部 108 檢查結果資料庫 1 A、1 B 相機 1 立體相機 照明裝置 -30- 2 201231913 3 控 制 處 理 部 4 基 板 工 作 台 33 控 制 部 38 顯 示 部 G1 〜G4 確 認 用 晝 面 -31-After the inspection result information of the three-dimensional measurement result is included, the creation or display of the confirmation screen of the external device I line is performed. Alternatively, it is also possible to check the information displayed on the display screen for the confirmation screen, and then display the information for display to 00. Alternatively, it may be: after the external device is transmitted to the external device, and the external storage device and the external storage device use the stored information to create display information, and the final confirmation information display screen is displayed on the terminal. Device. In addition, according to the display, the inspection result information can also be stored in the movable body and the memory medium can be connected to the production function personal computer that is loaded into the display for use: The confirmation screen is displayed. & Further, in each of the above-described embodiments, the three-dimensional measurement is performed as a part and a solder, but it is also possible to use the other fM image, the constituent f through hole, the silk pattern, and the like which are present in the definition. The same method for the part (3D measurement, and display of the confirmation surface including the measurement results) [Simplified description of the drawing] Fig. 1 is a block diagram showing a configuration example of the substrate inspection device. Fig. 2 is shown by image A diagram showing the change in the intensity of the color component of the lighting device. 5 -29- 201231913 Figure 3 shows the intensity of each color component of the lighting device together with the light at the same height position from the zenith angle. Fig. 4 is a functional block diagram of the substrate inspection device. Fig. 5 is a view showing the target component of the confirmation target together with the display range. Fig. 6 shows the first example of the confirmation screen. Fig. 7 is a flowchart showing a process of producing a YZ map of Fig. 6. Fig. 8 is a schematic diagram showing a second example of the screen for confirmation. Fig. 9 is a view showing the screen for confirmation. 3 cases Fig. 10 is a schematic diagram showing a fourth example of the face for confirmation. [Description of main components] 100 Substrate inspection device 101 Video input unit 102 Pad specific portion 103 Solder measurement unit 104 Part measurement unit 10 3D information Generation unit 10 6 Inspection execution unit 107 Confirmation screen display unit 108 Inspection result database 1 A, 1 B Camera 1 Stereo camera illumination device -30-2 201231913 3 Control processing unit 4 Substrate table 33 Control unit 38 Display units G1 to G4 Confirmation with noodles-31-