201230260 34532twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於-種半導體結構及其製作方法，且特 別是有關於一種封裝載板及其製作方法。 【先前技術】 晶片封裝的目的在於保護裸露的晶片、降低晶片接點 的密度及提供晶片良好的散熱。傳統的打線（諸e ） 技術通常採料線架Ue邊ame)料晶片的承載哭 (earner)。隨著晶片的接點密度逐漸提高，導線架已^ =供更尚的接點密度’故可利用具有高接點密度的封 :=_a=bstrate)來取代之，並藉由金屬導線或 凸塊（b_P)轉電媒體’將晶片封裝至難基板上。 以目前常用的發光二極體封裝結構來說，由於發光二 = f先進行封裝，且發光二極體在發出光線時 ===倘若’發光二極體所產生的熱能無法 逸政而不_堆積在發光二極體封裝結構内，·光二極 體封裝結構的溫度會_地上升。如此—來，發光二極體 ^能會因為過熱科致亮度衰減及使財命駿，嚴重者 甚至造成永久性的損壞。 山。nr決上述之的問題，已有—些習知技術相繼被提 歹"說’台灣專利公告號200945961是於基板上形 =熱絕緣層及_層，且基板具有通孔以電性連接設置 土板上下側料電圖案’因此有效地排除電子元件所產 201230260 34532twf.doc/n 生的熱量’進而改善電子元件的效率及使料命。一般來 說，由於基板與通孔内的導電材料之間必須電性絕緣，以 避免產生電性問題，ϋ此台灣專利公告號勘Μ·亦必 須形成一絕緣層於通孔的側壁上。 【發明内容】 本舍明提供-種封裝載板，其具有良好絕緣性及導熱 性之類鑽石碳層。 本發明提供一種封裝載板的製作方法，其可減少製程 步驟，以降低成本，並可改善製程良率。 本^提出-種封裝載板，其包括—基板、一類鑽石 =、夕個接塾以及多個導電柱。基板具有彼此相對的一 表面與-下表面以及多個貫孔。貫孔連接上表面與下表 面。類鑽石碳層覆蓋基板的上表面、下表 Ϊ雷Ϊ墊對應貫孔而配置於基板的上表面上與下I面上： 導電柱分觀置於貫㈣，且與接墊·連接。 型。在本發批-實補巾，±述之錄料電柱一體成 板的上述之每-貫孔的孔徑由基 板的:縮一貫孔_基 緣芦在實施例中，上述之封裝載板更包括一絕 、，象層’而導電柱包括多個仏導餘。絕緣層配置於空心 201230260 34532twt.d〇c/n 導電柱内，且接墊覆蓋絕緣層。201230260 34532twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a semiconductor structure and a method of fabricating the same, and in particular to a package carrier and a method of fabricating the same. [Prior Art] The purpose of the chip package is to protect the exposed wafer, reduce the density of the wafer contacts, and provide good heat dissipation of the wafer. The traditional wire-laying technology (e) is usually used to pick up the wire carrier Ue. As the junction density of the wafer is gradually increased, the lead frame has been replaced by a higher contact density, so that it can be replaced by a metal wire or a convex with a high contact density: = _a = bstrate The block (b_P) transfer medium 'packages the wafer onto the difficult substrate. In the currently used light-emitting diode package structure, since the light-emitting two=f is first packaged, and the light-emitting diode emits light, ===if the heat energy generated by the light-emitting diode cannot be evaded without _ Stacked in the light-emitting diode package structure, the temperature of the photodiode package structure will rise. In this way, the light-emitting diodes can cause a decrease in brightness and a fatality due to overheating, and even cause permanent damage. mountain. Nr has decided to solve the above problems, and some conventional techniques have been proposed in the past. "Taiwan Patent Publication No. 200945961 is formed on the substrate = thermal insulation layer and _ layer, and the substrate has through holes for electrical connection. The underlying electrical pattern on the earthboard 'is therefore effectively eliminates the heat generated by the electronic components, which in turn improves the efficiency and the life of the electronic components. In general, since the substrate and the conductive material in the via hole must be electrically insulated to avoid electrical problems, an insulating layer must be formed on the sidewall of the via hole. SUMMARY OF THE INVENTION The present invention provides a package carrier having a diamond carbon layer of good insulating and thermal conductivity. The present invention provides a method of fabricating a package carrier that reduces process steps to reduce cost and improve process yield. The present invention proposes a package carrier board comprising: a substrate, a type of diamond =, a tandem junction, and a plurality of conductive pillars. The substrate has a surface and a lower surface opposite to each other and a plurality of through holes. The through holes are connected to the upper surface and the lower surface. The diamond-like carbon layer covers the upper surface of the substrate, and the lower surface of the substrate is disposed on the upper surface of the substrate and the lower surface of the substrate corresponding to the through-holes: the conductive pillars are placed at a position (4) and connected to the pads. type. In the present invention, the aperture of the above-mentioned perforated hole is integrated into the plate by the substrate: the shrinking hole_base edge reed in the embodiment, the above package carrier further includes A permanent, like layer 'and the conductive column includes a plurality of 仏 conduction. The insulating layer is disposed in the hollow 201230260 34532twt.d〇c/n conductive pillar, and the pad covers the insulating layer.
本發明提出一種封裝載板的製作方法，其中製作方法 包括下述步驟。提供一已形成有多個貫孔的基板。基板具 有彼此相對的一上表面與一下表面，且貫孔連接上表面與 下表面。形成一類鑽石碳層於基板的上表面、下表面以及 貝孔的側壁。形成一金屬層於類鐵石碳層上。圖案化金屬 層，以形成多個位於基板之上表面與下表面上且對應貫孔 的接墊以及多個與接墊電性連接的導電柱。 、、在本發明之一實施例中，上述之形成類鑽石碳層的方 去包括化學氣相沈積(Chemical Vapor Deposition, CVD)或 物理氣相沈積(Physical Vapor Deposition, PVD)。 在本發明之一實施例中，上述之形成金屬層的方法 括電鍍法。 努月〜貝❿丨η τ ,工迷炙母一貫孔的孔徑由基 板的上表面朝下表面漸縮。 板的t發明之—實施例中，上述之每一貫孔的孔徑由基 的上表面與下表面朝内漸縮。 —實施例中，上述之形成貫孔的方法包括 及機械鑽孔法。 壁上發明之—實施例中，上述之金屬層覆蓋貫孔之側 、突員鑽石碳層且填滿貫孔。 更包=本發明之—實施例中’上述於圖案化金屬層之前， 側^上的形成—絕緣層於貫孔中’其中金屬層覆蓋貫孔之 土的類鑽石碳層，而絕緣層填滿貫孔。 201230260 34532twf.doc/n ，於上述，由於本發明之封裝載板是採用類鑽石碳層 來覆蓋基板的上表面、下表面以及貫孔的側壁，且類鑽石 碳層具有良好的絕雜與導熱性。因此，本發明之封裝載 板的接塾可直接透過類鑽石韻與基板電性騎。如此一 來’除了可減少製作絕緣層的步驟外，亦可降低成本並可 改善製程良率。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 上圖1為本發明之—實施例之—種封裝載板的剖面示意 ° π參考圖1，在本實施例中，封裝載板100a包括一基 反lio、一類鑽石碳層12〇、多個接墊13〇以及多個導電枉 14〇a。其中，本實施例之封裝載板100a適於承載一發光元 件（未繪示），例如是一發光二極體晶片。 一詳細來說，基板no具有彼此相對的一上表面112與 114以及多個貫孔116a，其中這些貫孔服連 =表面m與下表面114。在本實施例中，基板11〇例 =熱傳導性較佳的銅基板、銅合金基板、喊板或銘合 二^反’其中_導熱性極佳，能快速傳導發光元件（未 、、曰不）所產生的熱能，以降低發光元件的工作溫度。 H4類鑽石碳層120覆蓋基板110的上表面U2t下表面 置於以及貫孔116&的側壁，其中類鑽石碳層120可視為設 ;封裴載板100a上之發光元件（未繪示）的散熱途徑。 201230260 34532twf.doc/n 這些接墊130對應這些貫孔116a而配置於基板no的上表 面112上與下表面114上。這些導電柱14〇a分別配置於這 些貫孔116a内，且與這些接墊130電性連接。特別是，在 本實施例中，這些接墊130與這些導電柱14〇a例如是—體The present invention provides a method of fabricating a package carrier, wherein the fabrication method comprises the following steps. A substrate having a plurality of through holes is formed. The substrate has an upper surface and a lower surface opposite to each other, and the through holes connect the upper surface and the lower surface. A diamond carbon layer is formed on the upper surface, the lower surface of the substrate, and the sidewall of the via hole. A metal layer is formed on the iron-like carbon layer. The metal layer is patterned to form a plurality of pads on the upper and lower surfaces of the substrate and corresponding to the via holes and a plurality of conductive posts electrically connected to the pads. In an embodiment of the invention, the diamond-forming carbon layer is formed by chemical vapor deposition (CVD) or physical vapor deposition (PVD). In an embodiment of the invention, the above method of forming a metal layer comprises electroplating. From the moon to the shell η τ, the hole diameter of the uniform hole of the worker's mother is tapered from the upper surface of the substrate to the lower surface. In the embodiment of the invention, in the embodiment, the aperture of each of the above-mentioned holes is tapered inwardly from the upper surface and the lower surface of the substrate. - In the embodiment, the above method of forming a through hole includes a mechanical drilling method. Invented on the wall - in the embodiment, the metal layer covers the side of the through hole, protrudes from the diamond carbon layer, and fills the through hole. Further, in the embodiment of the present invention, in the embodiment, before the patterning of the metal layer, the formation of the insulating layer on the side is in the through hole, wherein the metal layer covers the diamond-like carbon layer of the soil of the through hole, and the insulating layer is filled. Full aperture. 201230260 34532twf.doc/n, in the above, since the package carrier of the present invention uses a diamond-like carbon layer to cover the upper surface and the lower surface of the substrate and the sidewall of the through hole, and the diamond-like carbon layer has good impurity and heat conduction. Sex. Therefore, the connector of the package carrier of the present invention can be directly electrically driven through the diamond-like rhyme and the substrate. In this way, in addition to reducing the steps of making the insulating layer, the cost can be reduced and the process yield can be improved. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] FIG. 1 is a cross-sectional view of a package carrier according to an embodiment of the present invention. Referring to FIG. 1, in the embodiment, the package carrier 100a includes a base reverse lio, a diamond carbon layer 12 〇, a plurality of pads 13〇 and a plurality of conductive turns 14〇a. The package carrier 100a of the present embodiment is adapted to carry a light-emitting element (not shown), such as a light-emitting diode chip. In detail, the substrate no has an upper surface 112 and 114 and a plurality of through holes 116a opposed to each other, wherein the through holes are connected to the surface m and the lower surface 114. In the present embodiment, the substrate 11 is a case of a copper substrate, a copper alloy substrate, a shingling board, or a copper alloy substrate, which is excellent in thermal conductivity, and has excellent thermal conductivity, and can quickly conduct light-emitting elements (not, or not). The heat energy generated to lower the operating temperature of the light-emitting element. The H4 diamond carbon layer 120 covers the lower surface of the upper surface U2t of the substrate 110 and the sidewalls of the through holes 116 & the diamond-like carbon layer 120 can be regarded as a light-emitting element (not shown) on the sealing carrier 100a. Cooling path. 201230260 34532twf.doc/n These pads 130 are disposed on the upper surface 112 of the substrate no and the lower surface 114 corresponding to the through holes 116a. The conductive pillars 14A are respectively disposed in the through holes 116a and electrically connected to the pads 130. In particular, in the present embodiment, the pads 130 and the conductive posts 14A are, for example, body-shaped.
由於本實施例之封裝載板l〇0a於基板11〇的上表面 112、下表面114以及貫孔116a的側壁皆配置類鑽石碳層 120，且類鑽石碳層120具有良好絕緣性以及導熱性。因 此，這些接墊130可直接透過類鑽石碳層12〇與基板ιι〇 電^絕緣。此外，當發光元件（未繪示）發出光源而產生 大量的熱能時’亦可藉由賴石碳層12G以及熱傳導性佳 的基板110有效地將熱能傳遞料界，可提升發光元件= 使用效率與使用壽命。 以上僅介紹本發明封裝載板1〇〇a的結構，並未介紹 ^發明之封裝載板職的製作方法。對此，以下將以圖^ 2封裝載板隐作為舉例說明，並配合圖2a至圖迚 對本發明關輯板職的製作方法進行詳細的說明。 製作本發批―實關之—種封裝載板的 二壯—、。不思圖。清先參考圖2A ’依照本實施例的 ί二=:的製作方法，首先，提供-基板110。在本 ，基板UG具有彼此相對的—上表面u 表面Π4，而基板110例如是埶 人今其缸^ 疋…、傳蜍性杈佳的銅基板、銅 口金基板、鋁基板或鋁合金基板。 接著，請參考圖2Β，形成多個貫穿基板U0的貫孔 201230260 34532twf.doc/] 下多些貫孔心連接基板110的上表面112以及 :14。在本實施例中，其中形成這些貫孔u6a的方 这此勺，法、機_孔法或是其他適當之方式。在此， 二貝^ 116a例如是採用蝕刻法所形成。 °月參考圖2C，形成—類鑽石碳層120於基板 由m表面112、下表面114以及貫孔116a的側壁，其 鑽料層12〇的方法包括化^氣相_ (CVD) 或物理氧相沈積（PVD)。 a然後，請參考圖2D，形成一金屬層I25於類鑽石碳 層120上’其中金屬層125覆蓋位於基板ιι〇之上表面 下表面114以及這些貫孔I〗&之側壁上的類鑽石碳 層120，且填滿這些貫孔U6a。在本實施例中，形成金屬 層125的方法例如是電鍍法。 最後，4參考圖2E，圖案化金屬層125，以形成多個 位於基板11〇之上表面112與下表面114上且對應這些貫 孔116a的接墊13〇以及多個與這些接墊13〇電性連接的導 電柱140a。至此’封裝載板1〇〇a已大致完成。 由於本實施例之類鑽石碳層120是形成於基板11〇之 上表面112、下表面114以及這些貫孔116a的側壁上，且 類鑽石碳層120具有良好絕緣性以及導熱性。因此，相較 於習知台灣專利200945961須另外形成絕緣層而言，本實 施例之封裝載板1 〇 〇 a的製作方法，可減少絕緣層的製程步 驟，意即無須額外再形成絕緣層於貫孔内，可直接透過類 鑽石碳層120與基板11〇電性絕緣。如此一來，本實施例 201230260 34532twf.doc/n 之封裝載板100a的製作方法可有效地降低製作成本並可 改善製程良率。The package carrier 10a of the present embodiment is provided with a diamond-like carbon layer 120 on the upper surface 112, the lower surface 114 of the substrate 11 and the sidewalls of the through hole 116a, and the diamond-like carbon layer 120 has good insulation and thermal conductivity. . Therefore, the pads 130 can be electrically insulated from the substrate by directly passing through the diamond-like carbon layer 12A. In addition, when a light-emitting element (not shown) emits a light source to generate a large amount of thermal energy, the heat energy can be efficiently transferred to the material boundary by using the slag carbon layer 12G and the substrate 110 having good thermal conductivity, thereby improving the light-emitting element = use efficiency. With the service life. Only the structure of the package carrier 1a of the present invention is described above, and the manufacturing method of the package carrier board of the invention is not described. In this regard, the package board is shown as an example in the following, and the manufacturing method of the board of the present invention will be described in detail with reference to FIG. 2a to FIG. The production of this batch - the real off - a kind of package carrier board two strong -,. Do not think about it. Referring first to FIG. 2A', in accordance with the fabrication method of the ί2=:, first, the substrate 110 is provided. In this case, the substrate UG has an upper surface u surface Π4 opposed to each other, and the substrate 110 is, for example, a copper substrate, a copper substrate, a copper substrate, an aluminum substrate or an aluminum alloy substrate. Next, referring to FIG. 2A, a plurality of through holes penetrating through the substrate U0 are formed 201230260 34532 twf.doc/]. The upper surface 112 of the substrate 110 and the upper surface 112 are connected to each other. In the present embodiment, the spoons, the method, the hole method or the other suitable means for forming the through holes u6a. Here, the bismuth 116a is formed, for example, by an etching method. Referring to FIG. 2C, a diamond-like carbon layer 120 is formed on the substrate from the m surface 112, the lower surface 114, and the sidewall of the through hole 116a. The method of the drill layer 12〇 includes a gas phase CVD (CVD) or physical oxygen. Phase deposition (PVD). a Then, referring to FIG. 2D, a metal layer I25 is formed on the diamond-like carbon layer 120, wherein the metal layer 125 covers the diamond-like surface on the lower surface 114 of the upper surface of the substrate and the sidewalls of the through holes I & The carbon layer 120 is filled with the through holes U6a. In the present embodiment, the method of forming the metal layer 125 is, for example, an electroplating method. Finally, referring to FIG. 2E, the metal layer 125 is patterned to form a plurality of pads 13 〇 on the upper surface 112 and the lower surface 114 of the substrate 11 and corresponding to the through holes 116a, and a plurality of pads 13 〇 Electrically connected conductive posts 140a. So far, the package carrier 1a has been substantially completed. Since the diamond carbon layer 120 of the present embodiment is formed on the upper surface 112, the lower surface 114 of the substrate 11 and the side walls of the through holes 116a, the diamond-like carbon layer 120 has good insulation and thermal conductivity. Therefore, the method for fabricating the package carrier 1a of the present embodiment can reduce the manufacturing process of the insulating layer, which means that there is no need to additionally form an insulating layer in comparison with the conventional Taiwan patent 200945961. The through hole can be electrically insulated from the substrate 11 directly through the diamond-like carbon layer 120. In this way, the manufacturing method of the package carrier 100a of the embodiment 201230260 34532 twf.doc/n can effectively reduce the manufacturing cost and improve the process yield.
再者，在後續的製程中，當各個發光元件（未緣示） 經由打線接合製程與封裝載板l〇〇a的接墊130電性連接 時’可藉由類鑽石碳層120以及導熱性佳的基板11〇有效 地將發光元件所產生的熱能傳遞至外界。故，本實施例之 封裝載板100a亦可以有效的排除發光元件所產生的熱，進 而改善發光元件的使用效率與使用壽命。 在此必須說明的是，下述實施例沿用前述實施例的元 件標號與部分内容，其中採用相同的標號來表示相同或近 似的元件，並且省略了相同技術内容的說明。關於省略部 分的說明可參考前述實施例，下述實施例不再重複贅述。 圖3為本發明之另一實施例之一種封裝載板的剖面示 意圖。請同時參考圖1與圖3，本實施例之封裝載板1〇〇b 與圖1之封梟載板l〇〇a相似，兩者的差異在於：圖3之封 裝載板100b之每-貫孔U6b的孔徑由基板11〇的上表面 112與下表面114朝内漸縮。由於本實施例之這些貫孔 的側壁並非相互平行’因此當形成_石韻W於這些 貫孔116b之側壁時，可具有較佳的製程良率。 1^外一在衣私上，本實施例的封裝結構可以採 用與則述貫施例之封裝結構剛a大致相同的製作方式，並 且ί進行圖=之製料輯，即軸貫穿紐U0的這 貝利用控制蝕刻速率來形成孔徑由基板 、 與下表面丨丨4朝内漸縮的這些貫孔 201230260 34532twt.doc/n 116b，接著’依序進行步驟圖2C至圖2E之製程步驟，即 便可大致完成封裝結構1〇〇b的製作。 圖4為本發明之另一實施例之一種封裝载板的剖面示 意圖。請同時參考圖！與圖4，本實施例之封㈣板職 與圖1之封裝载板l00a相似，兩者的差異在於：圖4之封 裝載板100c之每-貫孔U6c的孔徑由基板11〇的上表面 112朝下表面114漸縮。由於本實施例之這些貫孔ii6c的 侧壁並非相互平行’而是由上至下漸縮，因此當形成類鑽 石碳層120於這些貫孔116〇之側壁時，可具有較佳的製程 籲 良率。Furthermore, in the subsequent process, when the respective light-emitting elements (not shown) are electrically connected to the pads 130 of the package carrier 10a via the wire bonding process, the diamond-like carbon layer 120 and the thermal conductivity can be used. The good substrate 11 is effective to transfer the heat energy generated by the light-emitting elements to the outside. Therefore, the package carrier 100a of the present embodiment can effectively eliminate the heat generated by the light-emitting elements, thereby improving the use efficiency and the service life of the light-emitting elements. It is to be noted that the following embodiments use the same reference numerals and parts in the foregoing embodiments, wherein the same reference numerals are used to refer to the same or the like elements, and the description of the same technical content is omitted. For the description of the omitted portions, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated. Figure 3 is a cross-sectional view of a package carrier in accordance with another embodiment of the present invention. Referring to FIG. 1 and FIG. 3 simultaneously, the package carrier 1b of the embodiment is similar to the package carrier l〇〇a of FIG. 1, and the difference between the two is: each of the package carriers 100b of FIG. The aperture of the through hole U6b is tapered inwardly from the upper surface 112 and the lower surface 114 of the substrate 11A. Since the sidewalls of the through holes of this embodiment are not parallel to each other, the preferred process yield can be obtained when the sidewalls of the through holes 116b are formed. 1 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The etch rate is used to form the through holes 201230260 34532twt.doc/n 116b whose aperture is tapered from the substrate and the lower surface 丨丨4, and then the steps of the steps 2C to 2E are sequentially performed, even if The fabrication of the package structure 1〇〇b can be substantially completed. 4 is a cross-sectional view of a package carrier in accordance with another embodiment of the present invention. Please refer to the map at the same time! 4, the sealing plate of the present embodiment is similar to the package carrier 100a of FIG. 1, and the difference is that the aperture of each of the through holes U6c of the package carrier 100c of FIG. 4 is the upper surface of the substrate 11〇. 112 tapers toward the lower surface 114. Since the sidewalls of the through holes ii6c of the embodiment are not parallel to each other but are tapered from top to bottom, when the diamond-like carbon layer 120 is formed on the sidewalls of the through holes 116, the process can be better. Yield.
^匕外三在製程上，本實施例的封裝結構1〇〇c可以採 用與前述實施例之封裝結構1〇〇a大致相同的製作方式，並 且在進行圖2B之製程步驟時，即形成貫穿基板n〇的這 些貫孔116c步驟中’採用機械鑽孔法的方式來形成孔徑由 基板110的上表面112朝下表面114漸縮的這些貫孔 116c ’接著，依序進行步驟圖2C至圖2E之製程步驟，'即 便可大致完成封裝結構100c的製作。 I 圖!為本發明之再一f施例之一種封裳m板的剖面示 意圖。請同時參考圖1與圖5，本實施例之封裝載板i〇〇d 與圖1之封裝載板l〇〇a相似，兩者的差異在於：圖5之封 裝載板io〇d更包括一絕緣層150，其中這些導電柱l4〇d 例如是多個空心導電柱，而絕緣層150配置於這些空心導 電柱（即導電柱140d)内，且這些接墊13〇覆蓋絕緣層15〇。 此外，在製程上，本實施例的封裝結構1〇〇d可以採 10 201230260 j^iwi.doc/n 用，、則述m轭例之封裝結構1〇〇a大致相同的製作方式，並 且在進行圖2D之步驟時，即形成金屬層125於類鑽石碳 層120上時’先形成金屬層125於這些貫孔内，接著， ^形成-絕緣層15G於這些貫孔U6a中，其中形成於這些 貝孔116a内的金屬層是位於絕緣層15〇與這些貫孔 116a^側壁上的類鐵石碳層120之間，且絕緣層150填滿 這些貫孔116a。然後’再進行電鍍製程成以形成金屬層125 φ 於位於基板U0之上表面112及下表面114上之類鑽石碳 層120上。最後，依序進行步驟圖2E之製程步驟，即便 可大致完成封裝結構100d的製作。 在此必須說明的是，於其他未繪示的實施例中，亦可 選用於如前述實施例所提及之設計，本領域的技術人員當 可參照前述實施例的說明，依據實際需求，而選用前述構 件’以達到所需的技術效果。 綜上所述，由於本發明之封裝載板於基板的上表面、 下表面以及貫孔的側壁皆配置類鑽石碳層，且類鑽石碳層 • &有良好絕緣性與導熱性。因此，本發明之封裝載板的接 墊可直接透過類鑽石碳層與基板電性絕緣。如此一來，除 了可減少製作絕緣層的步驟外，亦可降低成本並可改善製 程良率。此外，當發光元件經由打線接合製程與封裝載板 的接墊電性連接時，可藉由類鑽石碳層以及導熱性佳的基 板有效地將發光元件所產生的熱能傳遞至外界。故，本發 明之封裳載板可以有效提升發光元件的使用效率與使用壽 命0 11 201230260 345J^twt.doc/n 雖然本發明已以實施例揭露如上，然其並 I明’任何所屬技術領域中具有通常知識者，= 保4軏圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為本發明之一實施例之一種封裝載板的剖面示意 圖2A至圖2E為本發明之一實施例之. 製作方法的剖面示意圖。 封裝載板的The package structure 1〇〇c of the present embodiment can be manufactured in substantially the same manner as the package structure 1A of the foregoing embodiment, and is formed throughout the process of the process of FIG. 2B. In the step of the through holes 116c of the substrate n〇, the through holes 116c whose apertures are tapered from the upper surface 112 of the substrate 110 toward the lower surface 114 are formed by mechanical drilling. Then, steps are sequentially performed as shown in FIG. 2C to FIG. The process step of 2E, 'even if the fabrication of the package structure 100c can be substantially completed. I Fig. is a cross-sectional view of a skirting m plate of still another embodiment of the present invention. Referring to FIG. 1 and FIG. 5 simultaneously, the package carrier board i〇〇d of the embodiment is similar to the package carrier board l〇〇a of FIG. 1. The difference between the two is that the package carrier board io〇d of FIG. 5 further includes An insulating layer 150, wherein the conductive pillars 104d are, for example, a plurality of hollow conductive pillars, and the insulating layer 150 is disposed in the hollow conductive pillars (ie, the conductive pillars 140d), and the pads 13A cover the insulating layer 15A. In addition, in the manufacturing process, the package structure 1〇〇d of the embodiment can be used for 10 201230260 j^iwi.doc/n, and the package structure 1〇〇a of the m-yoke example is substantially the same, and When the step of FIG. 2D is performed, when the metal layer 125 is formed on the diamond-like carbon layer 120, a metal layer 125 is first formed in the through holes, and then a formation-insulating layer 15G is formed in the through holes U6a. The metal layers in the via holes 116a are located between the insulating layer 15 and the iron-like carbon layer 120 on the sidewalls of the through holes 116a, and the insulating layer 150 fills the through holes 116a. Then, an electroplating process is performed to form a metal layer 125 φ on the diamond carbon layer 120 on the upper surface 112 and the lower surface 114 of the substrate U0. Finally, the process steps of FIG. 2E are sequentially performed, even though the fabrication of the package structure 100d can be substantially completed. It should be noted that, in other embodiments not shown, the design mentioned in the foregoing embodiments may be selected, and those skilled in the art may refer to the description of the foregoing embodiments, according to actual needs. The aforementioned components are selected to achieve the desired technical effect. In summary, the package carrier of the present invention is provided with a diamond-like carbon layer on the upper surface, the lower surface of the substrate, and the sidewall of the through hole, and the diamond-like carbon layer has good insulation and thermal conductivity. Therefore, the pad of the package carrier of the present invention can be electrically insulated from the substrate directly through the diamond-like carbon layer. In this way, in addition to the step of reducing the production of the insulating layer, the cost can be reduced and the process yield can be improved. In addition, when the light-emitting element is electrically connected to the pad of the package carrier via the wire bonding process, the heat energy generated by the light-emitting element can be efficiently transmitted to the outside by the diamond-like carbon layer and the substrate having good thermal conductivity. Therefore, the cover plate of the present invention can effectively improve the use efficiency and service life of the light-emitting element. Although the present invention has been disclosed in the above embodiments, it is clear that any technical field is known. Those who have the usual knowledge, which is defined in the scope of the patent application attached to the application, shall prevail. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a package carrier according to an embodiment of the present invention. FIG. 2A to FIG. 2E are schematic cross-sectional views showing a manufacturing method according to an embodiment of the present invention. Package carrier
思圖。 圖3為本發明之另一實施例之一種封裝載板的剖面示 意圖 思、圖 圖4為本發明之又一實施例之一種封裝载板的剖面示 〇 圖5為本發明之再一實施例之一種封裝載板的剖面示 【主要元件符號說明】 l〇〇a、i〇〇b、100c、i〇〇d :封裝載板 110 .基板 Π2 :上表面 114 :下表面 116a、116b、116c :貫孔 120 :類鑽石碳層Thinking. 3 is a cross-sectional view showing a package carrier according to another embodiment of the present invention, and FIG. 4 is a cross-sectional view showing a package carrier according to still another embodiment of the present invention. FIG. 5 is still another embodiment of the present invention. A cross section of a package carrier board [main element symbol description] l〇〇a, i〇〇b, 100c, i〇〇d: package carrier 110. substrate Π 2: upper surface 114: lower surface 116a, 116b, 116c :through hole 120: diamond-like carbon layer
12 201230260 34^j^twr.doc/n 125 :金屬層 130 :接墊 140a、140b、140c、140d :導電柱 150 :絕緣層12 201230260 34^j^twr.doc/n 125 : metal layer 130 : pads 140a, 140b, 140c, 140d : conductive pillar 150 : insulating layer
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