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TW201237048A - Compound suitable for photopolymerization initiator, photopolymerization initiator, and photocurable resin composition - Google Patents

Compound suitable for photopolymerization initiator, photopolymerization initiator, and photocurable resin composition Download PDF

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Publication number
TW201237048A
TW201237048A TW100145541A TW100145541A TW201237048A TW 201237048 A TW201237048 A TW 201237048A TW 100145541 A TW100145541 A TW 100145541A TW 100145541 A TW100145541 A TW 100145541A TW 201237048 A TW201237048 A TW 201237048A
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compound
photopolymerization initiator
liquid crystal
resin composition
photocurable resin
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TW100145541A
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Chinese (zh)
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TWI561539B (en
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Taikou Usui
Masahiro Morimoto
Teruyoshi Kitamura
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Kyoritsu Chemical & Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D335/00Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom
    • C07D335/04Heterocyclic compounds containing six-membered rings having one sulfur atom as the only ring hetero atom condensed with carbocyclic rings or ring systems
    • C07D335/10Dibenzothiopyrans; Hydrogenated dibenzothiopyrans
    • C07D335/12Thioxanthenes
    • C07D335/14Thioxanthenes with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached in position 9
    • C07D335/16Oxygen atoms, e.g. thioxanthones
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C229/00Compounds containing amino and carboxyl groups bound to the same carbon skeleton
    • C07C229/52Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
    • C07C229/54Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring
    • C07C229/60Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring with amino and carboxyl groups bound in meta- or para- positions
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/064Polymers containing more than one epoxy group per molecule
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014Nitrogen containing compounds
    • C08G59/4035Hydrazines; Hydrazides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/08Polyhydrazides; Polytriazoles; Polyaminotriazoles; Polyoxadiazoles
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/06Ethers; Acetals; Ketals; Ortho-esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37Thiols
    • C08K5/378Thiols containing heterocyclic rings

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
  • Polymerisation Methods In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

To provide: a compound, which is suitable for a sealing agent for electronic components or the like, especially suitable for a liquid crystal sealing agent and does not easily generate out gas, and which can be used for a photopolymerization initiator that is photocurable within a visible range; a photopolymerization initiator which contains the compound; and a photocurable resin composition. (1) A compound, which is obtained by having an organic acid compound and/or a hydroxy compound react with a compound that contains at least two epoxy groups in each molecule, said compound being a compound A that is obtained using dimethyl amino benzoic acid as the organic acid compound or being a compound B that is obtained using hydroxythioxanthone as the hydroxy compound. (2) A photopolymerization initiator, which is composed of a photoinitiating compound and a visible light sensitizing compound, and wherein the photoinitiating compound is the compound A and the visible light sensitizing compound is the compound B. (3) A photocurable resin composition which contains a photopolymerizable monomer or oligomer and a photopolymerization initiator set forth in (2).

Description

201237048 六、發明說明: 【發明所屬之技術領域】 本發明有關使特定的有機酸化合物及/或羥基化合物 與含環氧基之化合物進行反應所得之化合物、經使用該化 合物之光聚合起始劑(photo polymerization initiator)及光 硬化性樹脂組成物(photohardening resin composite)。 【先前技術】 近年來,作爲大型液晶電視、行動電話以及各種設備 之顯示面板(display panel)而具有輕量,高精細、低耗電 之特徵之液晶顯示面板(liquid crystal display panel),多 半係依液晶滴下技法(liquid crystal dispensing technique) 所生產者。 液晶滴下技法,係將光及熱倂用硬化型液晶密封劑 (photo and thermal use hardening type liquid crystal sealant)塗佈於施加有電極圖型(electrode pattern)及定向 膜(orientating film)之基板上、再對其塗佈有液晶密封劑 之基板、或對與此成對之基板上滴下液晶後,貼合對置基 板(opposite substrate),作爲第一階段利用紫外線照射等 進行光碛化藉以進行基板之迅速的固定亦即,液晶胞間隙 形成(cell-gap forming)、作爲第二階段利用無鎖模夾具之 熱硬化以使密封劑完全硬化,藉以製造液晶顯示面板之手 法。 由於此種液晶滴下技法,係未硬化之密封劑與液晶在 -5- 201237048 相接觸之狀態下進行光硬化以及熱硬化之故,對液晶密封 劑,要求能達成硬化的過程中,亦即於光硬化前後、熱硬 化前後之源自液晶密封劑對液晶的污染的降低。 同樣,對電子零件的氣密密封劑等的密封劑,亦要求 達成能硬化的過程中之源自密封劑對電子零件的污染的降 低。 又,隨著近年來的液晶面板的性能之提升,於定向方 向、定向膜之種類、液晶材料中,因紫外光的影響而有時 特性會變化之情形,因此希望開於一種能在能量小的可見 光區域(visible light region)中硬化之密封劑。 作爲在液晶密封劑等的電子材料領域等所使用之光硬 化性樹脂組成物,專利文獻1中,揭示有一種含有:數平 均分子量爲400至3000之二胺基二苯甲酮衍生物之光敏 劑(photo sensitizer)、及數平均分子量爲350至3000的奪 氫反應式(hydrogen abstraction reaction type)的光自由基 聚合起始劑(photoradical polymerization initiator)、以及 特定的單體及/或單體之光硬化性樹脂組成物。 作爲使塗料的塗膜(coating)或印刷油墨硬化之用的自 聚合式光聚合起始劑(self-polymerization photo polymerizaton initiator),專利文獻2中,揭示有一種特定的環氧化合物 與噻噸酮(thio xanthone)羧酸所成之反應生成物。 [先前技術文獻] [專利文獻] [專利文獻1 ]日本專利特開2 0 0 5 - 2 6 3 9 8 7號公報 201237048 [專利文獻2]日本專利特開2004-224993號公報 【發明內容】 [發明所欲解決之課題] 但,引用文獻1中所揭示之作爲光敏劑之特定數分子 量的二胺基二苯甲酮衍生物,係在可見光區域中具有光敏 性且脫氣(out-gas)亦難於發生者,惟由於官能基係源自一 級胺之胺基之緣故,有儲存穩定性會成爲不穩定之問題。 又,引用文獻2中所揭示之自聚合式光聚合起始劑的 主要用途,爲塗料或印刷用油墨,而作爲課題之脫氣係在 於臭氣,而並非能對應於如液晶密封般之對高速回應性 (high speed responsibility)發生影響之脫氣、對液晶的溶 解、殘液滲出(bleed)等所引起之污染準位(contamination level)者。 本發明之課題,在於提供一種適合於電子零件等的密 封劑、特別是液晶密封劑之難於發生脫氣而可使用爲具有 在可見光區域之光硬化性之光聚合起始劑之化合物、含有 該化合物之光聚合起始劑以及光硬化性樹脂組成物。 [用以解決課題之手段] 本發明,具有如下述之構成。 (1) 一種化合物,係使有機酸化合物及/或羥基化合物 與分子中含有至少2個環氧基之化合物進行反應所得之化 合物’其特徵爲:前述化合物係,前述有機酸化合物爲屬 201237048 於二甲基胺基安息香酸之化合物A、或者,前述羥基化合 物爲屬於羥基噻噸酮之化合物B之化合物。 (2) —種光聚合起始劑,係由光起始性化合物 (photoinitiating compound)與可見光增感性化合物(visible light senstization compound)所成之光聚合起始劑,其特 徵爲: 前述光起始性化合物爲前述化合物A、而 前述可見光增感性化合物爲前述化合物B。 (3)—種光硬化性樹脂組成物,其特徵爲:含有 光聚合性單體(photopolimerization monomer)或低聚 物(oligomer)及前述(2)記載之光聚合起始劑。 [發明之效果] 如採用本發明,則可提供一種適合於電子零件等的密 封劑、特別是液晶密封劑之難於發生脫氣而具有在可見光 區域之光硬化性之光聚合起始劑之化合物、含有該化合物 之光聚合起始劑以及光硬化性樹脂組成物。 [發明之最佳實施形態] [化合物] 本發明之化合物,係使有機酸化合物及/或羥基化合 物與分子中含有至少2個環氧基之化合物(以下,簡稱含 環氧基之化合物)進行反應所得之化合物,其特徵爲:201237048 VI. Description of the Invention: [Technical Field] The present invention relates to a compound obtained by reacting a specific organic acid compound and/or a hydroxy compound with an epoxy group-containing compound, and a photopolymerization initiator using the compound (photo polymerization initiator) and photohardening resin composite. [Prior Art] In recent years, liquid crystal display panels, which are lightweight, high-definition, and low-power, are widely used as large LCD TVs, mobile phones, and display panels for various devices. Produced by liquid crystal dispensing technique. The liquid crystal dropping technique is applied to a substrate to which an electrode pattern and an orientation film are applied, by applying a photo and thermal use hardening type liquid crystal sealant. Further, the substrate coated with the liquid crystal sealing agent or the liquid crystal is dropped on the pair of substrates, and the opposite substrate is bonded to the substrate, and the substrate is subjected to photo-deuteration by ultraviolet irradiation or the like as a first stage. The rapid fixation, that is, liquid crystal cell formation, is used as a second stage by thermal hardening using a moldless jig to completely harden the sealant, thereby manufacturing a liquid crystal display panel. Due to such a liquid crystal dropping technique, the uncured sealant is photohardened and thermally cured in contact with the liquid crystal in the state of -5 to 201237048, and the liquid crystal sealing agent is required to be hardened, that is, The reduction of contamination of the liquid crystal by the liquid crystal sealing agent before and after photohardening and before and after thermal hardening. Similarly, for a sealant such as a hermetic sealant for electronic parts, it is also required to achieve a reduction in contamination of the electronic parts by the sealant during the hardening process. Moreover, with the improvement of the performance of the liquid crystal panel in recent years, in the orientation direction, the type of the alignment film, and the liquid crystal material, the characteristics may change due to the influence of the ultraviolet light, and therefore it is desirable to have a small energy. a hardenable sealant in the visible light region. As a photocurable resin composition used in the field of electronic materials such as a liquid crystal sealing agent, Patent Document 1 discloses a photosensitive film containing a diaminobenzophenone derivative having a number average molecular weight of 400 to 3,000. Photo sensitizer, and a photoradical polymerization initiator having a number average molecular weight of 350 to 3000, and a specific monomer and/or monomer Photocurable resin composition. As a self-polymerization photopolymerizaton initiator for curing a coating or a printing ink, Patent Document 2 discloses a specific epoxy compound and thioxanthone. (thio xanthone) a reaction product formed by a carboxylic acid. [PRIOR ART DOCUMENT] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. JP-A No. 2004-224993 [Patent Document 2] JP-A-2004-224993 [Problems to be Solved by the Invention] However, the diaminobenzophenone derivative having a specific number of molecular weights as a photosensitizer disclosed in Document 1 has photosensitivity and degassing in the visible light region (out-gas) It is also difficult to occur, but since the functional group is derived from the amine group of the primary amine, storage stability may become unstable. Further, the main use of the self-polymerized photopolymerization initiator disclosed in Document 2 is a paint or a printing ink, and the degassing as a problem lies in an odor, and does not correspond to a liquid crystal seal. The high speed response affects the degree of contamination caused by degassing, dissolution of liquid crystals, and bleed of residual liquid. An object of the present invention is to provide a compound which is suitable for a sealing agent for an electronic component or the like, particularly a liquid crystal sealing agent, which is difficult to be degassed and which can be used as a photopolymerization initiator having photocurability in a visible light region, and contains the same. A photopolymerization initiator of the compound and a photocurable resin composition. [Means for Solving the Problem] The present invention has the following constitution. (1) A compound obtained by reacting an organic acid compound and/or a hydroxy compound with a compound having at least two epoxy groups in a molecule, wherein the compound is a compound, and the organic acid compound is a genus 201237048 The compound A of dimethylamino benzoic acid or the aforementioned hydroxy compound is a compound of the compound B belonging to the hydroxythioxanthone. (2) A photopolymerization initiator, which is a photopolymerization initiator formed from a photoinitiating compound and a visible light sensitization compound, and is characterized by: The compound is the compound A, and the visible light sensitizing compound is the compound B described above. (3) A photocurable resin composition comprising a photopolymerizable monomer or an oligomer and an optical polymerization initiator according to the above (2). [Effects of the Invention] According to the present invention, it is possible to provide a compound suitable for a sealing agent for an electronic component or the like, particularly a liquid crystal sealing agent, which is difficult to generate degassing and has a photocurable initiator in the visible light region. A photopolymerization initiator containing the compound and a photocurable resin composition. [Best Mode for the Invention] [Compound] The compound of the present invention is an organic acid compound and/or a hydroxy compound and a compound having at least two epoxy groups in the molecule (hereinafter, abbreviated as an epoxy group-containing compound). The compound obtained by the reaction is characterized by:

前述有機酸化合物爲二甲基胺基安息香酸之化合物A -8 - 201237048 、或者, 前述羥基化合物爲羥基噻噸酮之化合物B,而 二甲基胺基安息香酸的羧基及羥基噻噸酮的羥基,係 與含環氧基之化合物的環氧基進行反應後形成有羥基。 本發明之化合物,係於液晶密封劑等的密封劑用的光 聚合起始劑中, 化合物 A係作爲被可見光增感性化合物所光激發 (photoexcitation)之光起始性化合物而發揮作用、 化合物B係作爲可見光增感性化合物而發揮作用。 在此,可見光增感性化合物,係指對波長爲3 80nm以 上、較佳爲 400nm以上、更佳爲420nm以上之可見光具 有光吸收(photo absorption)之化合物之意,而光起始性化 合物,係指雖對前述可見光不具有光吸收,惟對紫外光 (ultraviolet light)則具有光吸收,並發生自由基之化合物 之意。 由於化合物A及B,係於光硬化反應中作爲光起始性 化合物或可見光增感性化合物發揮作用時,化合物本身不 會解理(cleavage)之故,不致於分解生成物揮發而發生液 晶污染(liguid crystal contamination),又,由於化合物本 身的分子量大而難於揮發之故,因化合物本身之揮發所引 起之液晶污染亦難於發生。又,由於構成化合物A之源自 二胺基安息香酸之殘基’係具有源自三級胺之胺基、且於 光硬化反應中作爲觸媒發揮作用之故,穩定性優異者。 由於化合物B ’係所謂奪氫反應式光自由基聚合起始 201237048 性化合物’當吸收活性能量射線(active energy ray)後在三 重激發狀態(triplet excitation state)之光自由基聚合起始 劑將與氫予體(hydrogen donor)形成激發狀態之複合物 (complex)、亦即激發複合物(exciplex),且從氫予體奪取 氫原子而生成活性自由基以起始自由基聚合之故,分解生 成物少、而殆不發生脫氣成分。 又,由於化合物A及B,係在分子內具有OH基且極 性(polarity)高之緣故,通常,與爲光硬化性樹脂組成物所 使用之極性高的光聚合性低聚物之間的相溶性優異之同時 ,由於與液晶材料的極性相異之緣故對液晶中之溶解度低 之故,可推測爲液晶的污染物制性優異者。 化合物A,如使本身爲有機酸化合物之二胺基安息香 酸與含環氧基之化合物進行反應即可製造,而 化合物B,如使本身爲羥基化合物之羥基噻噸酮與含 環氧基之化合物進行反應即可製造。 具體而言,將二胺基安息香酸或羥基噻噸酮與含環氧 基之化合物在鹼性觸媒之存在下,從反應性之觀點來看, 較佳爲在如後所述之3元的有機磷酸化合物及/或胺化合 物之存在下,對環氧基1當量使二胺基安息香酸或羥基噻 噸酮的1 〇〇當量%進行反應。接著,將此反應生成物藉由 過濾或離心分離或水洗等處理,而去除鹼性觸媒以進行精 製。 當製造化合物A及B時所使用之含環氧基之化合物而 言,從化合物A能確保被可見光增感性化合物所激發之光 -10 - 201237048 起始性之觀點,及從化合物B能確保可見光增感性之 來看,爲屬於含有至少2個以上之環氧基之多官能環 脂,較佳爲屬於脂肪族或芳香族的2官能環氧樹脂。 多官能環氧樹脂而言’可例舉:三羥甲基丙烷聚 甘油醚、甘油聚縮水甘油醚、異戊四醇聚縮水甘油醚 梨糖醇聚縮水甘油醚、苯酚漆用酚醛型縮水甘油醚、 漆用酚醛型縮水甘油醚、四縮水甘油基二胺基苯基甲 三縮水甘油基胺基苯酚等、 脂肪族之2官能環氧樹脂係以聚乙二醇二縮水甘 、二乙二醇二縮水甘油醚、三乙二醇二縮水甘油醚、 二醇二縮水甘油醚、己二醇二縮水甘油醚等爲佳。 芳香族的2官能環氧樹脂而言’較佳爲可例舉: A型二縮水甘油醚、雙酚F型縮水甘油―、雙酚AD 縮水甘油醚、雙酚型二縮水甘油醚 '間苯二酚型縮水 酸等,其中,更佳爲 可以下述式(5)表示之二乙二醇二縮水甘油醚、及 下述式(6)表示之雙酚A二縮水甘油醚。 觀點 氧樹 縮水 、山 甲酚 院、 油醚 聚丙 雙酚 型二 甘油 可以 【化1】The organic acid compound is dimethylamino benzoic acid compound A -8 - 201237048, or the hydroxy compound is hydroxy thioxanthone compound B, and dimethylamino benzoic acid carboxyl group and hydroxy thioxanthone The hydroxyl group is reacted with an epoxy group of the epoxy group-containing compound to form a hydroxyl group. The compound of the present invention is a photopolymerization initiator for a sealant such as a liquid crystal sealing agent, and the compound A functions as a photoinitiating compound which is photoexcitation by a visible light sensitizing compound, and the compound B It functions as a visible light sensitizing compound. Here, the visible light sensitizing compound means a compound having a light absorption of visible light having a wavelength of 380 nm or more, preferably 400 nm or more, more preferably 420 nm or more, and a photoinitiating compound. It refers to a compound which does not have light absorption to the aforementioned visible light, but has a light absorption for ultraviolet light and a radical generating. Since the compounds A and B act as a photoinitiating compound or a visible light sensitizing compound in a photohardening reaction, the compound itself does not cleavate, and liquid crystal contamination does not occur due to volatilization of the decomposition product ( Liguid crystal contamination) Moreover, since the molecular weight of the compound itself is large and difficult to volatilize, liquid crystal contamination caused by the volatilization of the compound itself is also difficult to occur. Further, since the residue derived from the diamine benzoic acid constituting the compound A has an amine group derived from a tertiary amine and functions as a catalyst in a photocuring reaction, it is excellent in stability. Since compound B' is a so-called hydrogen-removing reaction type photoradical polymerization initiation 201237048 compound 'when absorbing active energy ray, the photo-radical polymerization initiator in the triplet excitation state will be A hydrogen donor forms a complex of an excited state, that is, an exciplex, and a hydrogen atom is taken from a hydrogen donor to form an active radical to initiate radical polymerization, and is decomposed into a hydrogen donor. There are few substances, and there is no degassing component. In addition, since the compounds A and B have an OH group in the molecule and have high polarity, they are usually in a phase with a photopolymerizable oligomer having a high polarity which is used for the photocurable resin composition. When the solubility is excellent, the solubility in the liquid crystal is low because of the difference in polarity of the liquid crystal material, and it is presumed that the liquid crystal has excellent contaminant properties. Compound A can be produced by reacting a diamine benzoic acid which is an organic acid compound itself with an epoxy group-containing compound, and Compound B, such as a hydroxy thioxanthone which is itself a hydroxy compound, and an epoxy group-containing compound The compound can be produced by carrying out a reaction. Specifically, the diamino benzoic acid or the hydroxythioxanthone and the epoxy group-containing compound are preferably in the presence of a basic catalyst from the viewpoint of reactivity, preferably 3 yuan as described later. In the presence of an organophosphorus compound and/or an amine compound, 1 equivalent of the epoxy group is reacted with 1 〇〇 equivalent % of the diamino benzoic acid or the hydroxy thioxanthone. Next, the reaction product is treated by filtration or centrifugation or water washing to remove the basic catalyst for purification. In the epoxy group-containing compound used in the production of the compounds A and B, the compound A can ensure the light-excited by the visible light sensitizing compound - 10, 201237048, and the visible light can be ensured from the compound B. In view of sensitization, it is a polyfunctional cyclic ester which contains at least two or more epoxy groups, and is preferably an aliphatic or aromatic bifunctional epoxy resin. The polyfunctional epoxy resin may be exemplified by trimethylolpropane polyglyceryl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether sorbitol polyglycidyl ether, and phenolic glycerol type glycerol Ether, phenolic glycidyl ether, tetraglycidyldiaminophenyltriglycidylaminophenol, etc., aliphatic bifunctional epoxy resin is polyethylene glycol diglycid, diethylene An alcohol diglycidyl ether, a triethylene glycol diglycidyl ether, a diol diglycidyl ether, a hexanediol diglycidyl ether or the like is preferred. The aromatic bifunctional epoxy resin is preferably exemplified by A-type diglycidyl ether, bisphenol F-glycidol, bisphenol AD glycidyl ether, and bisphenol-type diglycidyl ether. Among them, diethylene glycol diglycidyl ether represented by the following formula (5) and bisphenol A diglycidyl ether represented by the following formula (6) are more preferable. Viewpoint Oxygen tree shrinkage, cresylphenol, oil ether, polypropylene, bisphenol, diglycerol,

(5)(5)

(6) 201237048 從爲能穩定確保被可見光增感性化合物所光激發之光 起始性之觀點來看, 化合物A,更佳爲使二胺基安息香酸與二乙二醇二縮 水甘油醚進行反應所得之可以下述式(1 ): 【化2】(6) 201237048 Compound A is more preferably a reaction of diamine benzoic acid with diethylene glycol diglycidyl ether from the viewpoint of stably ensuring the photoinitiation of light excited by a visible light sensitizing compound. The obtained formula can be expressed by the following formula (1): [Chemical 2]

表示之化合物A1、或者, 使二胺基安息香酸與雙酚A二縮水甘油醚進行反應所 得之可以下述式(2):The compound A1 represented by or the reaction of diamine benzoic acid with bisphenol A diglycidyl ether can be obtained by the following formula (2):

表示之化合物A2。 從爲能穩定確保可見光敏性之觀點來看, 化合物B,更佳爲使羥基噻噸酮與二乙二醇二縮水甘 油醚進行反應所得之可以下述式(3): -12- 201237048 【化4】Represents compound A2. From the viewpoint of stably ensuring visible light sensitivity, the compound B, more preferably the reaction of the hydroxythioxanthone with the diethylene glycol diglycidyl ether, can be obtained by the following formula (3): -12- 201237048 4]

表示之化合物B1,或者, 使羥基噻噸酮與雙酚A二縮水甘油醚進行反應所得之 可以下述式(4)= 【化5】The compound B1 represented by the reaction, or the reaction of the hydroxythioxanthone with the bisphenol A diglycidyl ether, can be obtained by the following formula (4) = [Chemical 5]

表示之化合物B2。 [光聚合起始劑] 本發明之光聚合起始劑,係 含有光起始性化合物及可見光增感性化合物之光聚合 起始劑,其特徵爲: 光起始性化合物爲化合物A,及/或可見光增感性化合 物爲化合物B。 如此,由於本發明之光聚合起始劑,係爲光起始性化 合物及可見光增感性化合物之至少任一使用化合物A或化 合物B之結果,可較在來的光聚合起始劑爲能降低脫氣之 -13- 201237048 故,可爲密封劑而構成合適的光硬化性樹脂組成物。於本 發明之光聚合起始劑中,較佳的化合物A及B,可舉如前 述之化合物A及B的較佳者。 於本發明之光聚合起始劑中,如作爲光起始性化合物 而使用化合物A之情形,作爲可見光增感性化合物而言, 可使用:烷基二胺基二苯甲酮、二胺基二苯甲酮、烷基胺 基安息香酸酯、菌、噻噸酮、薰草素(coumerin)、氧代薰 草素(ketocoumarin)、菁(cyanine)、駄菁(phthalocyanine) 、萘菁(naphthalocyanine)等,從利用能量傳遞(energy transfer)之反應性的效率之觀點來看,較佳爲二苯甲酮骨 架及/或噻噸酮骨架,更佳爲噻噸酮骨架,再佳爲化合物B 〇 於本發明之光聚合起始劑中,如作爲可見光增感性化 合物,而使用化合物B之情形,作爲光起始性化合物而言 ,可使用, 自解理式(self-cleavage)的苯偶姻(benzoin)系化合物 、乙醯苯類、羥基乙醯苯類、α-胺基乙醯苯類、α-醯基 肟酯類、醯基氧化膦系化合物、偶氮基系等, 奪氫式的二苯甲酮類、苯偶姻醚類、苄基酮縮醇類、 二苯並環庚酮類、蔥酮類、氧雜蔥酮類、噻噸酮類、鹵絡 乙醯苯類、二烷氧乙醯苯類、羥基乙醯苯類、鹵絡雙咪唑 類、鹵絡三哄類等。 光起始性化合物,係從控制因脫氣所引起之液晶污染 的觀點來看,較佳爲氫奪式者,其中,更佳爲二苯甲酮類 -14- 201237048 、蔥酮類、噻噸酮類,再佳爲噻噸酮類,而此等數平均分 子量較佳爲5 00至3000者。再佳爲,作爲光起始性化合 物而使用化合物A。 於本發明之光聚合起始劑中,光起始性化合物與可見 光增感性化合物的莫耳比(光起始性化合物/可見光增感性 化合物),係從能穩定且供給充分的自由基之觀點來看, 較佳爲1/5至1/1、更佳爲1/3至1/1,再佳爲1/2至1/1 [光硬化性樹脂組成物] 本發明之光硬化性樹脂組成物,含有光聚合性單體或 低聚物及本發明之光聚合起始劑。 光聚合性單體或低聚物,可使用周知的材料,惟從抑 制對液晶之溶解所引起之污染之觀點來看, 較佳爲:使(甲基)丙烯酸酯單體及/或此等的低聚物以 及雙酚A型環氧樹脂與(甲基)丙烯酸進行反應所得之部分 (甲基)丙烯基化環氧樹脂, 更佳爲:使雙酚A型環氧樹脂與(甲基)丙烯酸進行反 應所得之部分(甲基)丙烯基化環氧樹脂。 (甲基)丙烯酸酯單體及/或此等的低聚物而言, 較佳爲2-羥基乙基(甲基)丙烯酸酯、二、三或四乙二 醇二(甲基)戸烯酸酯、環氧基改性二(甲基)丙烯酸酯、胺 基甲酸酯改性二(甲基)丙烯酸酯, 更佳爲:環氧基改性二(甲基)丙烯酸酯、胺基甲酸酯 -15- 201237048 改性二(甲基)丙烯酸酯, 再佳爲:環氧基改性二(甲基)丙烯酸酯。 使雙酚A型環氧樹脂與(甲基)丙烯酸進行反應所得之 部分(甲基)丙烯基化環氧樹脂,可由如下所述之方式製得 〇 首先,將雙酚A型環氧樹脂與(甲基)丙烯酸,在鹼性 觸媒之存在下,較佳爲在3元的有機磷酸化合物及/或胺 化合物之存在下,對環氧基1當量,使(甲基)丙烯酸10至 90當量%進行反應。接著,將此反應生成物,藉由過濾, 離心分離及/或水洗等處理而去除鹼性觸媒之方式加以精 製。 作爲鹼性觸媒,可使用藉由環氧樹脂與(甲基)丙烯酸 之反應所用之周知的鹼性觸媒。又,亦可使用經使鹼性觸 媒載持於聚合物中之聚合物載持鹼性觸媒。 3元的有機磷化合物而言,可例舉:如三甲基膦、三 正丙基膦、三正丁基膦般的烷基膦類及其鹽、如三苯基膦 、正間甲苯基膦、參(2,6-二甲氧苯基)膦等的芳基膦類及 其鹽、如三苯基亞磷酸酯、三乙基亞磷酸酯、參(壬基苯 基)亞磷酸酯等的亞磷酸三酯類及其鹽等》3元的有機化合 物之鹽而言,可例舉:三苯基膦•乙基溴化物、三苯基膦 •丁基溴化物、三苯基膦、辛基溴化物、三苯基膦•癸基 溴化物、三苯基膦·異丁基溴化物、三苯基膦•丙基氯化 物、三苯基膦•戊基氯化物、三苯基膦•己基溴化物等。 其中,較佳爲三苯基膦。 -16- 201237048 胺化合物而言,可例舉:如二乙醇胺等的二級胺,如 三乙基胺、三乙醇胺、二甲基苄基胺、參二甲基胺基甲基 苯酚、參二乙基胺基甲基苯酚等的三級胺,如1,5,7-三氮 雜雙環[4.4.0]癸-5-烯(TBD)、7-甲基·1,5,7-三氮雜雙環 [4.4.0]癸-5-烯(1\^-78〇)、1,8-二氮雜雙環[5.4.0]十一基-7-烯(DBU)、6-二基胺基-1,8-二氮雜雙環[5.4.0]十一基-7_ 烯、1,5-二氮雜雙環[4.3.0]壬基-5-烯(DBN)、1,1,3,3_四甲 基胍等的強鹼性胺及其鹽。其中,較佳爲1,5,7-三氮雜雙 環[4.4.0]癸-5-烯(TBD)。胺化合物的鹽而言,可例舉:氯 化苄基三甲基銨、氯化千基三乙基銨。 從適合於樹脂組成物之操作處理容易度,亦即,去泡 性、塗佈性、印刷性之黏度的觀點來看,本發明之光硬化 性樹脂組成物中,光聚合性單體或低聚物的含量,較佳爲 50至90重量°/〇,更佳爲60至80重量%、更佳爲70至80 重量%。 從降低光聚合性單體或低聚物的未硬化部分的殘留以 抑制液晶的污染,又,對液晶之光起始劑成分的溶出所引 起之污染的影響之觀點來看,本發明之光聚合起始劑之用 量,係對光聚合性單體或低聚物100重量份,較佳爲0.5 至5.0重量份、更佳爲0.5至3.0重量份。 含有本發明之光聚合起始劑之光硬化性樹脂組成物, 如作爲密封劑、特別是液晶密封劑使用時,則可在大幅降 低脫氣之下,即使難於對液晶或取向膜損害之可見光仍能 使光硬化性樹脂硬化。 -17- 201237048 另一方面,近年來’由於電子零件的配線的高密度化 ’特別是在採用〇DF(液晶滴下)技法之液晶領域中,發生 有如下述之課題。 ODF技法係指在真空下實施對密封劑的閉合環路 (closed loop)內之液晶之直接滴下、貼合、真空開放,藉 以製作液晶面板之技法之意,較採用在來的利用注入方式 之製法,有很多如液晶使用量之減少、液晶對面板之注入 時間的縮短等的優點,係作爲使用現在的大型基板之液晶 面板的製造方法上成爲主流之技法。 依0DF技法所製作之液晶基板,係由同時持有屬於 光硬化性官能基之(甲基)丙烯基及屬於熱硬化性官能基之 環氧基之樹脂所構成者,在液晶滴下後貼合、並照射紫外 線以使其假硬化,然後使其熱硬化。 此時,如利用紫外線照射之(甲基)丙烯基的反應不充 分、或成爲配線等的陰影而未照到紫外線時,則在進行熱 硬化時液晶密封劑成分流出於液晶,其結果,將成爲發生 顯示不良之原因。 由於近年來,如前所述,在增加採取使用較紫外線爲 能量弱的可見光之光硬化之情形,再者,因配線的高密度 化而有紫外線難於照到之傾向之故,上述之新課題逐漸成 爲更顯著。 由於本發明之光硬化性樹脂組成物中,含有本發明之 光聚合起始劑之故,即使對上述的課題,不僅在可見光仍 能硬化、低照射量的紫外線亦能硬化之故’即使在陰影部 -18- 201237048 分仍會硬化,而能頁獻於上述課題的解決。 本發明之光硬化性樹脂組成物中,爲以高水準解決上 述之新課題起見,較佳爲再含有熱硬化劑。 熱硬化劑而言,從即使在低溫下仍然硬化速度快速、 黏度穩定性良好之觀點來看,較佳爲選自混晶(mixed crystal) 系醯肼(hydrazide)化合物、有機酸二醯肼化合物、咪唑及 其衍生物、雙氰胺(dicy and i amide)、芳香族胺、脂肪族胺 及其衍生物所成群之至少一種化合物、更佳爲醯肼混晶化 合物及/或有機酸二醯肼化合物、再佳爲醯肼系混晶化合 物。 醯肼系混晶化合物,係指能符合下述規定(I)及(Π)之 化合物之意。 (I)需要爲能將1分子中至少具有1個醯肼基之結晶性 醯肼化合物之2種以上,加熱熔融爲熔點以上以製得加熱 熔融物後,冷卻前述加熱熔融物以使其固化而製得之化合 物。 (Π)需要爲於前述化合物之使用CuK(鉀化酮)〇:線之X 射線繞射光譜(X-ray diffraction spectrum)中,在布勒格角 度(8^§丫31^1〇(20±〇.20。)的5.5°至7.5°,具有混晶特有 之繞射峰値(diffraction peak)。 前述化合物中,具有醯肼基之醯肼化合物含有較佳爲 5至70重量%、更佳爲5至50重量%、再佳爲5至30重 量%、再更佳爲1 0至2 0重量。/。。 醯肼系混晶化合物,能由包含將結晶性醯肼化合物的 -19- 201237048 2種以上加熱熔融於熔點以上並混合之過程、及將該混合 物冷卻使其固化之過程之方法製造^ 本發明中,從熔點及熱時反應性、儲存穩定性的觀點 來看,將成爲原料之結晶性醯肼化合物而言,較佳爲選自 可以一般式(1): 【化6】Represents compound B2. [Photopolymerization initiator] The photopolymerization initiator of the present invention is a photopolymerization initiator containing a photoinitiating compound and a visible light sensitizing compound, characterized in that the photoinitiating compound is Compound A, and / Or the visible light sensitizing compound is Compound B. Thus, since the photopolymerization initiator of the present invention is a result of using either Compound A or Compound B as at least one of a photoinitiating compound and a visible light sensitizing compound, it can be reduced compared with the existing photopolymerization initiator. Degassing-13 - 201237048 Therefore, a suitable photocurable resin composition can be formed as a sealant. Among the photopolymerization initiators of the present invention, preferred compounds A and B are preferred from the above-mentioned compounds A and B. In the photopolymerization initiator of the present invention, when Compound A is used as a photoinitiating compound, as the visible light sensitizing compound, an alkyldiamine benzophenone or a diamine group can be used. Benzophenone, alkylamine benzoate, bacteria, thioxanthone, coumerin, ketocoumarin, cyanine, phthalocyanine, naphthalocyanine From the viewpoint of the efficiency of the reactivity by energy transfer, the benzophenone skeleton and/or the thioxanthone skeleton are preferred, and the thioxanthone skeleton is more preferred, and the compound B is preferably used. In the photopolymerization initiator of the present invention, as the visible light sensitizing compound, when the compound B is used, as the photoinitiating compound, a self-cleavage benzoin can be used. (benzoin) compound, acetophenone benzene, hydroxyacetamidine benzene, α-aminoethyl benzene benzene, α-mercapto oxime ester, fluorenyl phosphine oxide compound, azo group, etc., hydrogen abstraction Benzophenones, benzoin ethers, benzyl ketals Classes, dibenzocycloheptanones, onion ketones, xanthones, thioxanthones, halogenated acetophenones, dialkoxybenzenes, hydroxyacetamidines, halogenated bisimidazoles Class, halogen triterpenoids, etc. The photoinitiating compound is preferably a hydrogen absorbing type from the viewpoint of controlling liquid crystal contamination due to degassing, and more preferably benzophenone-14-201237048, onion ketone, thiophene The ketones are preferably thioxanthone, and the number average molecular weight is preferably from 50,000 to 3,000. Further preferably, Compound A is used as a photoinitiating compound. In the photopolymerization initiator of the present invention, the molar ratio (photoinitiating compound/visible sensitizing compound) of the photoinitiating compound to the visible light sensitizing compound is from the viewpoint of being stable and supplying sufficient radicals. In view of the above, it is preferably from 1/5 to 1/1, more preferably from 1/3 to 1/1, still more preferably from 1/2 to 1/1 [Photocurable resin composition] Photocurable resin of the present invention The composition contains a photopolymerizable monomer or oligomer and a photopolymerization initiator of the present invention. As the photopolymerizable monomer or oligomer, a known material can be used, but from the viewpoint of suppressing the contamination caused by the dissolution of the liquid crystal, it is preferred to use a (meth) acrylate monomer and/or the like. The oligomer and a part of the (meth)acrylylated epoxy resin obtained by reacting the bisphenol A type epoxy resin with (meth)acrylic acid, more preferably: the bisphenol A type epoxy resin and the (methyl group) A part of the (meth)acrylylated epoxy resin obtained by the reaction of acrylic acid. The (meth) acrylate monomer and/or the oligomers are preferably 2-hydroxyethyl (meth) acrylate, di, tri or tetraethylene glycol di(methyl) decene. Acid ester, epoxy-modified di(meth)acrylate, urethane-modified di(meth)acrylate, more preferably: epoxy-modified di(meth)acrylate, amine group Formate-15-201237048 Modified di(meth)acrylate, again preferably: epoxy-modified di(meth)acrylate. A part of the (meth)acrylylated epoxy resin obtained by reacting a bisphenol A type epoxy resin with (meth)acrylic acid can be obtained by the following method. First, a bisphenol A type epoxy resin is used. (Meth)acrylic acid, in the presence of a basic catalyst, preferably in the presence of a 3-membered organic phosphoric acid compound and/or an amine compound, 1 equivalent to an epoxy group, and 10 to 90 (meth)acrylic acid The equivalent % is reacted. Then, the reaction product is refined by filtration, centrifugation, and/or washing to remove the basic catalyst. As the basic catalyst, a well-known basic catalyst used for the reaction of an epoxy resin with (meth)acrylic acid can be used. Further, a basic catalyst supported on a polymer which is supported by a basic catalyst in a polymer may also be used. The trivalent organic phosphorus compound may, for example, be an alkylphosphine such as trimethylphosphine, tri-n-propylphosphine or tri-n-butylphosphine, or a salt thereof, such as triphenylphosphine or n-tolylylene. Arylphosphines such as phosphine, ginseng (2,6-dimethoxyphenyl)phosphine, and salts thereof, such as triphenylphosphite, triethylphosphite, and decylphenylphosphite Examples of the salts of the tribasic organic compound such as a phosphite triester or a salt thereof include triphenylphosphine ethyl bromide, triphenylphosphine butyl bromide, and triphenylphosphine. , octyl bromide, triphenylphosphine decyl bromide, triphenylphosphine isobutyl bromide, triphenylphosphine propyl chloride, triphenylphosphine pentyl chloride, triphenyl Phosphine·hexyl bromide and the like. Among them, triphenylphosphine is preferred. -16- 201237048 The amine compound may, for example, be a secondary amine such as diethanolamine, such as triethylamine, triethanolamine, dimethylbenzylamine, dimethylaminomethylphenol, or the like. a tertiary amine such as ethylaminomethylphenol, such as 1,5,7-triazabicyclo[4.4.0]non-5-ene (TBD), 7-methyl·1,5,7-three Azabicyclo[4.4.0]non-5-ene (1\^-78〇), 1,8-diazabicyclo[5.4.0]undecyl-7-ene (DBU), 6-diyl Amino-1,8-diazabicyclo[5.4.0]undecyl-7-ene, 1,5-diazabicyclo[4.3.0]nonyl-5-ene (DBN), 1,1, Strongly basic amines such as 3,3_tetramethylguanidine and salts thereof. Among them, preferred is 1,5,7-triazabicyclo[4.4.0]non-5-ene (TBD). The salt of the amine compound may, for example, be benzyltrimethylammonium chloride or benzyltriethylammonium chloride. The photopolymerizable monomer or the photocurable resin composition of the present invention is low in the ease of handling of the resin composition, that is, the viscosity of the defoaming property, the coating property, and the printability. The content of the polymer is preferably from 50 to 90% by weight, more preferably from 60 to 80% by weight, still more preferably from 70 to 80% by weight. The light of the present invention is obtained from the viewpoint of reducing the residual of the uncured portion of the photopolymerizable monomer or the oligomer to suppress the contamination of the liquid crystal, and also the influence of the contamination caused by the dissolution of the photoinitiator component of the liquid crystal. The polymerization initiator is used in an amount of preferably 0.5 to 5.0 parts by weight, more preferably 0.5 to 3.0 parts by weight, per 100 parts by weight of the photopolymerizable monomer or oligomer. When the photocurable resin composition containing the photopolymerization initiator of the present invention is used as a sealant, particularly a liquid crystal sealing agent, it is possible to greatly reduce the devitrification, even if it is difficult to damage the liquid crystal or the alignment film. The photocurable resin can still be cured. -17-201237048 On the other hand, in recent years, the "densification of wiring of electronic components" has occurred in particular in the field of liquid crystals using 〇 DF (liquid crystal dropping) technology. The ODF technique refers to the technique of fabricating a liquid crystal panel by directly performing direct dropping, laminating, and vacuum opening of a liquid crystal in a closed loop of a sealant under vacuum, and adopting an injection method in use. In the manufacturing method, there are many advantages such as a decrease in the amount of use of the liquid crystal and a shortening of the injection time of the liquid crystal to the panel, and it is a technique that is mainly used as a method of manufacturing a liquid crystal panel using a large-sized substrate. The liquid crystal substrate produced by the 0DF technique is composed of a resin which simultaneously holds a (meth)acryl group which is a photocurable functional group and an epoxy group which is a thermosetting functional group, and is bonded after the liquid crystal is dropped. And irradiate ultraviolet rays to make them pseudo-hardened, and then heat-harden them. In this case, when the reaction of the (meth)acryl group by ultraviolet irradiation is insufficient, or the shadow of wiring or the like is not applied to the ultraviolet ray, the liquid crystal sealing agent component flows out of the liquid crystal during thermal curing, and as a result, It becomes the cause of display failure. In recent years, as described above, in the case of increasing the light hardening using visible light having a weaker ultraviolet light, the higher the density of the wiring, the more difficult the ultraviolet light is to be irradiated, and the above-mentioned new subject Gradually become more prominent. Since the photocurable resin composition of the present invention contains the photopolymerization initiator of the present invention, even if it is the above-mentioned problem, it can be cured not only in visible light but also in low-intensity ultraviolet rays. The shadow part -18- 201237048 points will still harden, and the page can be solved for the above problems. In the photocurable resin composition of the present invention, in order to solve the above-mentioned new problems at a high level, it is preferred to further contain a thermosetting agent. The thermal hardener is preferably selected from a mixed crystal hydrazide compound or an organic acid diterpene compound from the viewpoint of rapid curing speed and good viscosity stability even at a low temperature. At least one compound, preferably a ruthenium mixed crystal compound and/or an organic acid group, in which imidazole and its derivatives, dicy and i amide, aromatic amine, aliphatic amine and derivatives thereof are grouped. The ruthenium compound is preferably a ruthenium mixed crystal compound. The lanthanide mixed crystal compound means a compound which can meet the following requirements (I) and (Π). (I) It is necessary to heat-melt two or more kinds of crystalline cerium compounds having at least one fluorenyl group in one molecule to obtain a heated melt, and then to cool the molten melt to solidify it. And the compound obtained. (Π) Needed for the use of the above compound CuK (potassium ketone) 〇: X-ray diffraction spectrum of the line, at the Bleuger angle (8^§丫31^1〇(20 ±〇.20.) 5.5° to 7.5°, having a diffraction peak characteristic of a mixed crystal. Among the above compounds, the ruthenium compound having a mercapto group preferably contains 5 to 70% by weight, more preferably It is preferably from 5 to 50% by weight, more preferably from 5 to 30% by weight, still more preferably from 10 to 20% by weight. The lanthanide mixed crystal compound can be composed of a -19 compound containing a crystalline ruthenium compound. - 201237048 Two or more processes of heating and melting above the melting point and mixing, and a process of cooling the mixture to solidify it. In the present invention, from the viewpoints of melting point, thermal reactivity, and storage stability, The crystalline ruthenium compound to be a raw material is preferably selected from the general formula (1):

XX

R NHNH2 [式中R,表示氫原子、烷基、或可能具有取代基之芳 基]。表示之單醯肼化合物及可以一般式(2): 【化7】 h2nhn nhnh2 (2) [式中A ’表示可能具有取代基之伸烷基、可能具有 取代基之芳基或氧基]。表示之二醯肼化合物所成群之2 種以上的化合物,而較佳爲日本專利特開平2010-143872 號公報段落0020及002 1中所揭示之醯肼化合物。 本發明中’作爲醯肼系混晶化合物的原料使用之結晶 性醯肼化合物而言’從熔點及熱時反應性、儲存穩定性的 觀點來看’較佳爲至少1種係具有2個以上的醯肼基之二 元酸二醯肼、而與二元二醯胼組合之醯肼化合物而言,可 -20- 201237048 爲單醯肼及/或三元酸三醯肼等的多官能醯肼化合物、惟 更佳爲所有醯肼化合物係具有2個以上的醯肼之二元酸二 醯肼者。 二元酸二醯肼而言,較佳爲選自草酸二醯肼、丙二酸 二醯肼、琥珀酸二醯肼、己二酸二醯肼、庚二酸二醯肼、 辛二酸二醯肼、壬二酸二醯肼、癸二酸二醯肼、月桂二酸 二醯胼、十六烷二酸二醯肼、間酞酸二醯肼、對酞酸二醯 肼、卡肼(carbo hydrazide)、馬來酸二醯肼、富馬酸二醯 肼、二甘醇酸二醯肼、酒石酸二醯肼、蘋果酸二醯肼、 2,6-萘甲酸二醯肼、1,4-萘甲酸二醯肼、4,4’-雙苯二醯肼 、氫醌二甘二醇酸二醯肼、間苯二酚二甘醇酸二醯肼、鄰 苯二酚二甘醇酸二醯肼、4,4’-亞乙基雙酚-二甘醇酸二醯 肼、4,4’亞乙烯基雙酚-二甘醇酸二醯肼所成群之1種以上 的化合物, 更佳爲選自草酸二醯肼、丙二酸二醯肼、琥珀酸二醯 肼、己二酸二醯肼、庚二酸二醯肼、辛二酸二醯肼、壬二 酸二醯肼、癸二酸二醯肼、月桂二酸二醯肼、十六烷二酸 二醯肼、間酞酸二醯肼、對酞酸二醯肼所成群之1種以上 的化合物。 單醯肼化合物而言,較佳爲選自乙醯肼、丙酸醯肼、 戊酸醯肼、月桂酸醯肼、環己烷卡肼、水楊酸醯肼、對羥 基安息香酸醯肼、萘甲酸醯肼所成群之1種以上的化合物 > 更佳爲選自乙醯肼、丙酸醯肼、戊酸醯肼、月桂酸醯 -21 - 201237048 肼、環己烷卡肼、水楊酸醯肼所成群之〗種以上的化合物 〇 其中,二元酸二醯肼的組合而言,較佳爲 己二酸二醯肼與癸二酸二醯肼、 己二酸二醯肼與癸二酮二醯肼、 癸二酸二醯肼與癸二酮二醯肼的組合。 於本發明之光硬化性樹脂組成物中,熱硬化劑之含量 ,係從具有充分的熱反應性、且維持儲存穩定性之觀點來 看,對光聚合性單體或低聚物1〇〇重量份, 較佳爲5至50重量份、更佳爲5至30重量份。 本發明之光硬化性樹脂組成物中,從後述之觀點來看 ,較佳爲含有塡料(filler)粒子、矽烷偶合劑(silan coupling agent)等的偶合劑,需要時,可含有本發明中所 合適之光聚合性單體或低聚物、熱硬化劑以外的硬化劑、 本發明中所合適之光聚合起始劑以外的起始劑、彈性物 (elastomer)、鏈轉移劑(chain transfer agent)、離子陷 P并劑 (ion trap agent)、離子交換劑、調平劑(leveling agent)、 顏料、染料、可塑劑、消沫劑等的添加劑。 塡料用粒子,係爲硬化性組成物的黏度控制或經使硬 化性組成物硬化之硬化物的強度提升、或者抑制線膨脹性 藉以提升硬化性組成物的黏著可靠性等之目的所添加者。 作爲塡料用粒子’塡料用無機粒子及/或塡料用有機樹脂 粒子很適合使用,惟從線膨脹係數小,爲顯現黏著強度以 使硬化收縮率降低之觀點來看,較佳爲塡料用無機粒子。 -22- 201237048 作爲塡料用無機粒子,從容易獲得密封劑很適合使用 之粒徑之觀點來看,較佳爲選自碳酸鈣、碳酸鎂、硫酸鋇 、硫酸鎂、矽酸鋁、氧化鈦、氧化鋁、氧化鋅、二氧化矽 、高嶺土、滑石、玻璃熔珠、絹雲母活性黏土(sericite activated clay)、皂土(bentonite)、氮化鋁、以及氮化矽所 成群之至少1種以上的無機粒子、更佳爲選自二氧化矽、 滑石、氧化鋁、皂土所成群之至少1種以上的無機粒子、 再佳爲二氧化矽及/或滑石、再更佳爲二氧化矽。 作爲塡料用有機樹脂粒子,從爲顯現利用硬化時的應 力鬆驰(stress relaxation)所引起之作爲黏著強度之添加效 果之觀點來看,較佳爲選自聚甲基丙烯酸酯、聚苯乙烯、 使構成此等之單體與其他單體進行共聚合後所得之共聚物 、聚酯微粒、聚胺基甲酸酯微粒、橡膠微粒、以及由含有 具有高的玻璃化溫度之共聚物之外殼(shell)與具有低的玻 璃化溫度之共聚物的蕊體(core)所構成之蕊殼型微粒所成 群之至少1種以上的有機樹脂粒子、更佳爲選自聚酯微粒 、聚胺基甲酸酯微粒、橡膠微粒、以及由含有具有高的玻 璃化溫度之共聚物之外殼與具有低的玻璃化溫度之共聚物 的蕊體所構成之蕊殼型微粒所成群之至少1種以上的有機 樹脂粒子、更佳爲由含有具有高的玻璃化溫度之共聚物之 外殼與具有低的玻璃化溫度之共聚物的蕊體所構成之蕊殼 型微粒。又,蕊殼型微粒而言,較佳爲具有高的玻璃化溫 度之共聚物係聚甲基丙烯酸、而具有低的玻璃化溫度之共 聚物係丁基丙烯酸酯者。 •23- 201237048 於本發明之光硬化性樹脂組成物中,塡料用無機粒子 的含量,爲從利用應力分散效果(stress dispersion effect) 之黏著性的改善,線膨脹率的改善之觀點來看,係對光聚 合性單體或低聚物100重量份,較佳爲2至40重量份、 更佳爲5至3 0重量份。 矽烷偶合劑,如將本發明之熱硬化性樹脂組成物作爲 液晶密封劑使用時,係作爲使液晶密封劑與液晶顯示板順 利黏著之用的黏著促進劑很適合者。 矽烷偶合劑而言,較佳爲選自(7-胺基丙基三甲氧矽 烷、r-锍基丙基三甲氧矽烷、r-縮水甘油氧基丙基三甲 氧矽烷、r-異氰酸酯丙基三甲氧矽烷所成群之1種以上 的化合物,更佳爲r-縮水甘油氧基丙基三甲氧矽烷。 於本發明之光硬化性樹脂組成物中,偶合劑的含量, 從黏著強度’特別是保持防潮強度(moisture proof strength) 的觀點來看,係對光聚合性單體或低聚物100重量份、較 佳爲0.1至10重量份、更佳爲〇.5至2重量份^ 【實施方式】 [實施例] [實施例1]化合物A1之合成 混合得奈科爾EX-8 5 0L(二乙二醇二縮水甘油醚、長 瀨化學科技(股)製)13.7g、 4-二甲基胺基安息香酸i4 8g、 PS-PPh3(聚苯乙烯(PS)中載持有三苯基膦(pph3)之鹼 -24- 201237048 性觸媒、生技塔吉社製)9〇〇mg、 甲苯200ml,並在110°C下攪拌48小時。 將反應混合物冷卻爲室溫後,藉由過濾而去除觸媒。 將溶劑進行減壓餾除後,製得德奈科爾EX-85〇L的胺 加成物。 利用 HPLC(高效液體色譜)實施鑑定之結果,經確認 含有目的成分70%以上之事實。 [實施例2]化合物A2之合成 混合埃比克隆EXA- 85 0CRP(雙酚A二縮水甘油酸、 DIC(股)製)1.70g、 4-二甲基胺基安息香酸1.57g、 PS-PPh3(生技塔吉社製)50mg、 甲苯20ml’並在11〇 °C下攪拌48小時。 將反應混合物冷卻爲室溫後,藉由過濾而去除觸媒。 將溶劑進行減壓餾除後,製得埃比克隆EXA-8 50CRP 的胺加成物。 利用HPLC實施鑑定之結果,經確認含有目的成分 70%以上之事實。 [實施例3 ]化合物b 1之合成 混合得奈科爾EX-8 5 0L(二乙二醇二縮水甘油醚、長 瀨化學科技(股)製)13.7g、 經基硫雜菌_ 14.8g、 -25- 201237048 ?8-??113(生技塔吉社製)90〇1^、 甲苯200ml’並在110 °C下攪拌48小時。 將反應混合物冷卻爲室溫後,藉由過濾而去除觸媒。 將溶劑進行減壓餾除後,製得德奈科爾EX-850L的胺 加成物。 利用HPLC實施鑑定之結果,經確認含有目的成分 6 0 %以上之事實。 [實施例4]化合物B2之合成 混合埃比克隆EXA-850CRP(雙酚A二縮水甘油醚、 DIC(股)製)1.70g、 2-羥基硫雜蔥-10-酮2.17g、 PS-PPh3(生技塔吉社製)100mg、 ?5-丁8〇(?5上載持有1,5,7-三氮雜雙環[4.4.0]癸-5-烯 之固態觸媒而爲鹼性觸媒、生技塔吉社製)100mg、 甲苯20ml,並在110°C下攪拌48小時。 將反應混合物冷卻爲室溫後,藉由過濾而去除觸媒。 將溶劑進行減壓餾除後,製得EXA-8 50CRP的硫雜蔥 酮加成物。 利用HPLC實施鑑定之結果,經確認含有目的成分 60°/。以上之事實。 (a)光聚合性低聚物(PR85 0CRP:雙酚A型環氧樹脂之 部分甲基丙烯基化環氧樹酯)之合成 混合雙酚 A型環氧樹脂(EXA850CRP、DIC(股)製 -26- 201237048 )320.2g 、 甲基丙烯酸(東京化成社製)90.4g、 PS-PPh3(生技塔吉社製)1.5g、以及 BHT 100mg,並在100°C下攪拌6小時。 反應完成後,藉由過濾而去除觸媒,製得部分甲基丙 烯基化環氧樹酯。 (b) 光聚合起始劑 分解型(可見光硬化型式):伊格裘亞、I-369(BASF日 本社製) 分解型(含有反應性基之型式):EY樹脂、KR-2(iC.S.M 社製) (c) 熱硬化劑(醯肼系混晶化合物) ADH :己二酸二醯肼(大塚化學社製) C3 :混晶系熱硬化劑(協立化學產業社製) VDH:異丙基乙內醯脲骨架之二醯肼(味之素精密科 技社製) (d) 樹脂塡料:美利布利連、J-5800(三菱嫘縈社製) (e) 無機塡料:二氧化矽(西荷士達、KE-C50HG、日本 觸媒社製、〇.5μηι) (f) 偶合劑:ΚΒΜ403(信越化學工業社製) [實施例5] 於光聚合性低聚物PR-8 5 0CRP 100重量份(l〇〇g)中, 溶解由光起始性化合物A 1爲1重量份與可見光增感性化 -27- 201237048 合物B1爲1重量份所成之光聚合起始劑。 然後’混合偶合劑1重量份、無機塡料1 〇重量份、 熱硬化劑15重量份,使用三輥式磨機(three-roll mill)(輕 子尺寸:Φ 121x250mm'井上製作所製),按壓力5M Pa(兆 帕)、2軋道(pass)之方式充分加以揑和後,製得硬化性樹 脂組成物。 [實施例6、7及比較例1至3] 按與實施例5同樣條件,並依表1中所示實施例6、7 及比較例1至3的調配組成加以混合後,使用三輥式磨機 充分揑和後,製得各樹脂組成物。R NHNH2 [wherein R represents a hydrogen atom, an alkyl group, or an aryl group which may have a substituent]. The monoterpene compound represented by the formula (2): [Chemical Formula 7] h2nhn nhnh2 (2) [wherein A ' represents an alkylene group which may have a substituent, an aryl group or an oxy group which may have a substituent]. The two or more compounds represented by the diterpenoid compounds are preferably the anthracene compounds disclosed in paragraphs 0020 and 002 of JP-A-2010-143872. In the present invention, 'the crystalline ruthenium compound used as a raw material of the lanthanoid mixed crystal compound' is preferably at least one type from the viewpoint of melting point, thermal reactivity, and storage stability. The bismuth dibasic acid diterpene, and the bismuth compound combined with the binary diterpene, -20-201237048 is a polyfunctional hydrazine such as a monoterpene and/or a tribasic acid triterpene. The hydrazine compound is more preferably a dibasic acid diterpenoid having two or more hydrazine compounds. The dibasic acid dioxime is preferably selected from the group consisting of dioxonium oxalate, diammonium malonate, diterpene succinate, diammonium adipate, diammonium pimelate, and suberic acid. Bismuth, bismuth azelaic acid, bismuth azelaic acid, bismuth laurate, hexadecandioic acid diterpene, bismuth citrate, diterpene bismuth, carben Carbo hydrazide), diterpene maleate, diammonium fumarate, diammonium diglycolate, diterpenic tartrate, diterpene malate, diammonium 2,6-naphthoic acid, 1,4 - Di-naphthoic acid, 4,4'-bisbenzodiazepine, hydroquinone diglycolate diterpene, resorcinol diglycol diacetate, catechol diglycolate II醯肼, 4,4'-ethylene bisphenol-diglycolic acid diterpene, 4,4' vinylidene bisphenol-diglycolic acid diterpene in a group of more than one compound, Preferably, it is selected from the group consisting of dioxonium oxalate, diammonium malonate, diterpene succinate, diammonium adipate, diupoleic acid, diterpene dipicate, diterpene sebacate, Diterpene sebacate, diammonium laurate, dihexadecane diacetate, hydrazine Acyl hydrazine two, or more kinds of terephthalic acid compound acyl groups of the hydrazine. The monoterpene compound is preferably selected from the group consisting of acetamidine, bismuth propionate, bismuth valerate, lauric acid laurate, cyclohexane hydrazine, hydrazine salicylate, hydrazine hydroxybenzoate, More than one compound of the group consisting of cerium naphthoate > more preferably selected from the group consisting of acetamidine, strontium propionate, bismuth valerate, bismuth laurate-21 - 201237048 hydrazine, cyclohexane carbaryl, water Among the compounds of the above-mentioned group, the combination of dibasic acid diterpene is preferably diammonium adipate and diterpene sebacate, diammonium adipate. A combination with an oxadione dioxime, azelaic acid dioxime and an oxadione dioxime. In the photocurable resin composition of the present invention, the content of the thermosetting agent is such that the photopolymerizable monomer or oligomer is one from the viewpoint of having sufficient thermal reactivity and maintaining storage stability. The parts by weight are preferably 5 to 50 parts by weight, more preferably 5 to 30 parts by weight. The photocurable resin composition of the present invention preferably contains a coupling agent such as a filler particle or a silan coupling agent from the viewpoint of the latter, and may contain the present invention as needed. Suitable photopolymerizable monomers or oligomers, hardeners other than thermosetting agents, initiators other than photopolymerization initiators suitable for use in the present invention, elastomers, chain transfer agents An agent, an ion trap agent, an ion exchanger, a leveling agent, an additive for a pigment, a dye, a plasticizer, an antifoaming agent, and the like. The binder particles are added for the purpose of controlling the viscosity of the curable composition, improving the strength of the cured product which hardens the hardenable composition, or suppressing the linear expansion property to improve the adhesion reliability of the curable composition. . The particle for the coating material is preferably used as the inorganic particle for the coating and/or the organic resin particle for the coating, but the linear expansion coefficient is small, and the adhesion strength is lowered to lower the curing shrinkage ratio. Inorganic particles are used. -22-201237048 The inorganic particles for use as a raw material are preferably selected from the group consisting of calcium carbonate, magnesium carbonate, barium sulfate, magnesium sulfate, aluminum niobate, and titanium oxide from the viewpoint of easily obtaining a particle size suitable for use as a sealant. At least one of a group of alumina, zinc oxide, cerium oxide, kaolin, talc, glass beads, sericite activated clay, bentonite, aluminum nitride, and tantalum nitride The above inorganic particles are more preferably at least one inorganic particle selected from the group consisting of ceria, talc, alumina, and bentonite, more preferably ceria and/or talc, and even more preferably dioxide. Hey. The organic resin particles for dip is preferably selected from the group consisting of polymethacrylate and polystyrene from the viewpoint of the effect of adding adhesive strength due to stress relaxation during curing. a copolymer obtained by copolymerizing monomers constituting these monomers with other monomers, polyester fine particles, polyurethane fine particles, rubber fine particles, and an outer shell containing a copolymer having a high glass transition temperature At least one or more kinds of organic resin particles of a core-shell type fine particle composed of a core having a copolymer having a low glass transition temperature, more preferably selected from the group consisting of polyester particles and polyamines At least one of a group of fine particles composed of a urethane fine particle, a rubber fine particle, and a core-shaped fine particle composed of a core containing a copolymer having a high glass transition temperature and a core having a low glass transition temperature The above organic resin particles are more preferably core-shaped fine particles composed of a core body containing a copolymer having a copolymer having a high glass transition temperature and a core having a copolymer having a low glass transition temperature. Further, the core-shell type fine particles are preferably a copolymer-based polymethacrylic acid having a high glass transition temperature and a copolymer-based butyl acrylate having a low glass transition temperature. In the photocurable resin composition of the present invention, the content of the inorganic particles for the coating is improved from the improvement in the adhesion by the stress dispersion effect and the improvement in the linear expansion ratio. It is preferably from 2 to 40 parts by weight, more preferably from 5 to 30 parts by weight, per 100 parts by weight of the photopolymerizable monomer or oligomer. When the thermosetting resin composition of the present invention is used as a liquid crystal sealing agent, the decane coupling agent is suitable as an adhesion promoter for adhering a liquid crystal sealing agent to a liquid crystal display panel. The decane coupling agent is preferably selected from the group consisting of (7-aminopropyltrimethoxysilane, r-mercaptopropyltrimethoxysilane, r-glycidoxypropyltrimethoxysilane, r-isocyanatepropyltrimethyl) More preferably, one or more compounds of the group consisting of oxoxane are r-glycidoxypropyltrimethoxy decane. In the photocurable resin composition of the present invention, the content of the coupling agent is from the adhesion strength 'especially From the viewpoint of maintaining moisture proof strength, 100 parts by weight, preferably 0.1 to 10 parts by weight, more preferably 0.5 to 2 parts by weight, of the photopolymerizable monomer or oligomer. [Examples] [Example 1] Synthesis of Compound A1 was synthesized by Naikel EX-8 50 L (diethylene glycol diglycidyl ether, manufactured by Nagase Chemical Technology Co., Ltd.) 13.7 g, 4-di Methylamino benzoic acid i4 8g, PS-PPh3 (polystyrene (PS) containing triphenylphosphine (pph3) base-24-201237048 sexual catalyst, biotechnology Taji company) 9〇〇 Mg, toluene 200 ml, and stirred at 110 ° C for 48 hours. After cooling the reaction mixture to room temperature, the catalyst was removed by filtration. After the solvent was distilled off under reduced pressure, the amine-added product of the product was obtained by HPLC (high-performance liquid chromatography), and it was confirmed that the content of the target component was 70% or more. Example 2] Synthesis of Compound A2 Mixed eppylon EXA- 85 0CRP (bisphenol A diglycidic acid, DIC (manufactured by DIC)) 1.70 g, 4-dimethylamino benzoic acid 1.57 g, PS-PPh3 (raw 50 mg of toluene and 20 ml of toluene were stirred at 11 ° C for 48 hours. After cooling the reaction mixture to room temperature, the catalyst was removed by filtration. The solvent was distilled off under reduced pressure to obtain a solvent. The amine adduct of EBClEX EXC-8 50CRP. The result of the identification by HPLC was confirmed to contain the fact that the target component was 70% or more. [Example 3] Synthesis of compound b 1 was synthesized to obtain Nikel EX-8 5 0L (diethylene glycol diglycidyl ether, Changchun Chemical Technology Co., Ltd.) 13.7g, thiol-containing bacteria _ 14.8g, -25- 201237048 ?8-?? 113 (made by Biotech Taji) 90〇1^, toluene 200ml' and stirred at 110 ° C for 48 hours. After cooling the reaction mixture to room temperature, the catalyst was removed by filtration. After the solvent was distilled off under reduced pressure, the amine adduct of the product was obtained by HPLC. The result of the identification by HPLC was confirmed to contain the fact that the target component was 60% or more. [Example 4] Compound B2 Synthetic mixed eppylon EXA-850CRP (bisphenol A diglycidyl ether, DIC (manufactured by DIC)) 1.70 g, 2-hydroxythiazolin-10-one 2.17 g, PS-PPh3 (manufactured by Biotech Taji) ) 100mg, ?5-butyl 8〇 (?5 uploading 1,5,7-triazabicyclo[4.4.0]癸-5-ene solid catalyst for alkaline catalyst, biotechnology Taji 100 mg of toluene, 20 ml of toluene, and stirred at 110 ° C for 48 hours. After the reaction mixture was cooled to room temperature, the catalyst was removed by filtration. After the solvent was distilled off under reduced pressure, a thioglycol adduct of EXA-8 50 CRP was obtained. The result of the identification by HPLC was confirmed to contain the target component of 60 ° /. The above facts. (a) Synthesis of a photopolymerizable oligomer (PR85 0CRP: a partially methacrylylated epoxy resin of a bisphenol A type epoxy resin) mixed with a bisphenol A type epoxy resin (EXA850CRP, DIC) -26-201237048 ) 320.2 g, 90.4 g of methacrylic acid (manufactured by Tokyo Chemical Industry Co., Ltd.), 1.5 g of PS-PPh3 (manufactured by Biotech Taji), and 100 mg of BHT, and stirred at 100 ° C for 6 hours. After completion of the reaction, the catalyst was removed by filtration to obtain a partially methylenylated epoxy resin. (b) Photopolymerization initiator decomposition type (visible light curing type): Igya, I-369 (manufactured by BASF Japan) Decomposition type (type containing reactive group): EY resin, KR-2 (iC. (c) Thermosetting agent (anthraquinone mixed crystal compound) ADH: Diterpene adipate (manufactured by Otsuka Chemical Co., Ltd.) C3: Mixed crystal heat curing agent (manufactured by Kyoritsu Chemical Industry Co., Ltd.) VDH: Diisopropyl acetoin skeleton (manufactured by Ajinomoto Precision Technology Co., Ltd.) (d) Resin pigment: Meribrion, J-5800 (manufactured by Mitsubishi Rayon Co., Ltd.) (e) Inorganic beverage : cerium oxide (Western Star, KE-C50HG, manufactured by Nippon Shokubai Co., Ltd., 〇.5μηι) (f) Coupling agent: ΚΒΜ403 (manufactured by Shin-Etsu Chemical Co., Ltd.) [Example 5] Photopolymerizable oligomer PR-8 5 0 CRP 100 parts by weight (10 μg), photopolymerization obtained by dissolving 1 part by weight of the photoinitiating compound A 1 and 1 part by weight of visible light sensitizing -27-201237048 B1 Starting agent. Then, 1 part by weight of the mixed coupling agent, 1 part by weight of the inorganic material, and 15 parts by weight of the heat curing agent were used, and a three-roll mill (lepton size: Φ 121 x 250 mm 'manufactured by Inoue Co., Ltd.) was used. The kneaded resin composition was obtained by sufficiently kneading in a manner of a pressure of 5 M Pa (megapascal) or 2 passes. [Examples 6, 7 and Comparative Examples 1 to 3] According to the same conditions as in Example 5, and mixing according to the blending compositions of Examples 6, 7 and Comparative Examples 1 to 3 shown in Table 1, a three-roll type was used. After the mill was sufficiently kneaded, each resin composition was obtained.

比較例3中,貝II 作爲光起始性化合物,使用EHA(製品名:DAR0CURE EHA ’成分名:2-乙基己基-4-(二甲基胺基)苯甲酸酯、 BASF社製), 作爲光敏性化合物,使用DETX(製品名:photo cure DETX、成分名:2,4-二乙基硫雜蒽酮、EUTEC CHEMICAL社 製)。 [實施例8] 於光聚合性低聚物PR-850CRP 100重量份(1〇〇g)中, 溶解由光起始性化合物A1爲1重量份與可見光增感 性化合物B 1爲1重量份所成之光聚合起始劑^ 然後,混合偶合劑1重量份、有機塡料1 〇重量份、 -28- 201237048 無機塡料5重量份、熱硬化劑15重量份,使用三輥式磨 機(輥子尺寸:Φ 1 2 1 X 250mm、井上製作所製),按壓力 5 MPa、2軋道之方式充分力Π以揑和後,製得硬化性樹脂組 成物。 [實施例9至1 2及參考例1 ] 按與實施例8同樣條件,並依表2中所示實施例9至 1 2及參考例1的調配組成加以混合後,使用三輥式磨機充 分揑和後,製得各光硬化性樹脂組成物。 [評價條件] (1) 加熱減量(weight loss on heating) 使用差示熱天砰(d i f f e r e n t i c a 1 t h e r m a 1 b a I a u c e) (T G-DTA、製品名:熱塑(thermo plas)TG8120,理學社製),將 經秤重之各光起始劑置入鋁平鍋內,並測定依升溫速度10 °C /分鐘升溫至3 00°C時所減量之比例。減少量較大者表示 容易作爲脫氣而揮發之可能性,如揮發量多時,則液晶將 被污染,其結果容易引起顯示不良之情形。 (2) 反應率 將光硬化性樹脂組成物,按: —邊使用25mmx25mm厚度〇.7mm的LCD(液晶顯示 器)用玻璃、 另一邊使用25mmx25mm厚度0.1mm的PET(聚對苯 -29- 201237048 二甲酸乙二醇酯)薄膜, 光硬化性樹脂組成物厚度能成爲〇.5mm之方式加以夾 住, 利用紫外線照射裝置(UVX-0 1 224S 1,伍西歐電機製) ,依l〇〇mW/cm2的紫外線照射照度實施200至3000mJ/cm2 的光能量之照射,作爲硬化性測定用的試樣。 此時,使用紫外線,熱線截止媳光器(heat-ray cutting filter),照射 (i)波長 340nm 至 450nm、及 (Π)波長420nm至450nm的紫外光及可見光。 硬化率的測定係採用FT-IR(傅立葉轉換紅外線光譜儀 )(Spectrum One、拍金埃爾瑪社製)加以測定、 從所得IR(紅外線)光譜的(甲基)丙烯基的峰値面積, 算出(甲基)丙烯基的反應率(轉化率)。 反應率的算出,係將(甲基)丙烯基的吸收lGSOcnr1(或 945cm—)的面積的減少,以苯環的雙鍵結的吸收1 500CHT1 的面積作爲基準加以計算者。 (3)脫氣量 採用TG-DTA(熱重量分析-差示熱分析法)(理學社製) 的裝置,以測定在120 °C x60分鐘下之脫氣量’並進行來 自密封劑之揮發成分量的比較,將 揮發成分量爲1 . 5 %以下的情形作成:「〇J ’ 揮發成分量爲1 . 5 %以上的情形作成:「X」。 -30- 201237048 (4)污染性 將光硬化性樹脂組成物,採用密封劑定量分配器(seal dispenser),對剖面積 4000μηι2 而經硏磨處理(rubbing treatment) 之附有定向膜(燦伊拔SE- 7492、日產化學工業社製)之 ITO(姻錫氧化物)玻璃基板上(60mmx70mmx0.7mm厚)上, 實施定量分配塗佈(dispensing coating)。 然後,將液晶(TN(扭曲向列)液晶、MLC- 1 1 900-080, 美爾克社製)滴下於基板上,將上下基板依液晶滴下技法 (ODF技法)進行貼合,以製作試驗用液晶片。 對試驗用液晶片,照射紫外線(UV照射裝置:UVX-0 1 224 S1、伍西歐電機社製,照度:200mJ : 100mW/cm2/ 在3 65nm下2秒鐘)以使其硬化,然後,在12(TC的熱風 烘箱(oven)內進行熱硬化1小時,以製作爲定向性試驗之 用的試驗用硬化液晶片。 就所得試驗用硬化液晶片,實施密封時的液晶的定向 狀態之確認。 確認作業係使用光學顯微鏡進行,將偏光板依十字尼 科耳(Cross Nicol)的狀態夾住試片(test cell),並依透射加 以觀察。 將表示試驗用硬化片的隅角部的定向狀態之顯微鏡照 片’表示於第1圖至第6圖。在此第1圖至第6圖,均爲 縱向900μιηχ橫向1 2 00μιη的尺度。 液晶的定向性的評價基準,係按密封時的定向無序之 -31 - 201237048 有無而加以判斷者。 將密封時定向無序在50μηι以下之情形,作成「〇」 » 有較此以上之定向無序之情形,作成「X」。 (5)穩定性 測定光硬化性樹脂組成物在室溫(25°C )下的黏度變化, 將5日後的黏度變化在2 0%以下之情形,作成「〇」 將5曰後的黏度變化在20%以上之情形,作成「X」 加以判斷。 黏度之測定,係 按光硬化性樹脂組成物能成爲2 5 t之方式加以恆溫處 理, 於RE-105 U型黏度計(東機產業社機)上裝附3°xR7.7 錐形轉子(cone rotor),將成爲對象之樹脂組成物〇.15ml 設置於錐形轉子內,以測定依2.5rpm而25 °C下之光硬化 性樹脂組成物的黏度。 將作爲測定對象之剛製作後的光硬化性樹脂組成物, 在2 5 °C下靜置5日, 將5日後的該光硬化性樹脂組成物的黏度,依上述方 法加以測定。 將光硬化性樹脂組成物剛製作後的黏度作爲初期黏度 -32- 201237048 算出從初期黏度之後的變化率,以作爲穩定性之評價 〇 如超過測定範圍之情形,則作成不能測定者。在此, 測定範圍超過之基準,爲l,200,000mPa· S(兆泊)。 (6)熱硬化性 將作爲測定對象之光硬化性樹脂組成物依旋轉式流變 計(rotary rheometer)(流變應力300、Haake社製)之黏度, 在熱硬化開始後,按 將60分鐘以內到達飽和黏度之情形,作成「◎」、 將1 20分鐘以內到達飽和黏度之情形,作成「〇」、 將即使1 20分鐘以上仍不能到達飽和黏度之情形,作 成^ X」、之方式加以判斷。 黏度之測定,係 將作爲測定對象之光硬化性樹脂組成物使用旋轉式流 變計(流變應力3 00、Haake社製),以測定在120 °C下之黏 度變化。 使用平行板(Parallel Plate)’依試樣品量〇.6g’面板 間隙(gap)lmm、應變控制模式(strain control mode),而溫 度條件係從室溫至120°C止按20°C/分鐘加以升溫’在保 持12CTC之下實施測定120分鐘。測定到達不會再有黏度 變化之黏度(飽和黏度)所需之時間。 (7)電氣特性 -33- 201237048 藉由密封劑而實施安瓿試驗(ampoule test),以測定電 壓保持率(VHR)、離子密度(ID)並加以評價。 [測定用試樣之製作] 於安瓿瓶(ampoule bottle)中置入所調配之光硬化性樹 脂組成物〇.lg,並添加TN液晶(MLC-11900-080、米爾克 社製)lg。將此安瓿瓶置入12(TC供箱內1小時,然後在室 溫下靜置,待恢復室溫(25 °C )後取出液晶部分,利用 0.2 μηι過濾器加以過濾,作爲電氣特性評價用的液晶試樣 [電壓保持率及離子密度之測定] 使用電氣特性評價用的液晶試樣,以製作電氣特性評 價用片。片之製作方法,係於經硏磨處理之附有ΤΝ液晶 用定向膜(燦伊法SE-7492、日產化學工業社製)之ιτο玻 璃基板(55mmx60mmx0.7mmt(厚))上,將市售之密封劑(瓦 爾特羅克No.717、協立化學產業社製)作爲框架密封劑使 用,將電氣特性評價用的液晶試料滴下於基板上,藉由液 晶滴下技法(0 D F技法)而加以貼合,並照射紫外線(u V照 射裝置:UVX-0 1 224S1、伍西歐電機社製、照度及照射時 間:在3000mJ、100mW/cm2/365mm下30秒鐘)以使其硬 化’然後在1 2 0 °C的熱風烘箱內實施熱硬化1小時,以製 作爲電氣特性評價之用的試驗用液晶片。 電壓保持率之測定,係採用液晶物性評價裝置(6254C 、東陽德克尼佳社製)所實施者。測定施加電壓5V、6〇Hz( -34- 201237048 赫茲)、1 6 m s e c (兆秒鐘)時的電壓保持率。測定係在5 0 °c 下進行。 電壓特性的評價基準,係從電壓保持率的値所判斷者 〇 將電壓保持率之値在9 8 %以上的情形,作成「〇j 、 將電壓保持率之値在98%以下的情形,作成「X」。 (8)配線部之定向性 經依表2中所示調配例混合後,使用三輥式磨機(輥 子尺寸:φ 121 x2 50 mm、井上製作所製)、按壓力5 MPa、2 軋道之方式充分加以揑和後,製得各光硬化性樹脂組成物 (實施例8至1 2及參考例1 )。將如此所得之光硬化性樹脂 組成物,使用密封劑定量分配器,於剖面積4000μιη2、而 經硏磨處理之附有定向膜(燦伊法SE-5 662、日產化學工業 社製)之附有配線圖型(使用Cr(鉻)之列/間距(line/space): 200μιη/200μιη)之玻璃基板上(60mmx70mmx0.7mmt(厚))進 行定量分配塗佈。 然後,於基板上滴下液晶VA(垂直定向)液晶、MLC-6609、美爾克社製),將面板間隙設定爲4μιη,藉由液晶 滴下技法(ODF技法)而進行貼合,以製作試驗用液晶片。 將試驗用液晶片,照射紫外線(UV照射裝置:UVX-01 224S1、伍西歐電機社製、照度及照射時間:3 000mJ、 100mW/cm2/3 65nm而10秒鐘)以使其硬化,然後在120°C 的熱風烘箱內實施熱硬化1小時,以製作爲定向性試驗之 -35- 201237048 用的試驗用硬化液晶片。 就所得試驗用硬化液晶片,實施配線間的密封時之液 晶的定向狀態之確認。確認作業係使用光學照微鏡之下進 行,將偏光板在十字尼科耳的狀態下夾住試片,依透射進 行觀察。將表示試驗用硬化液晶片的配線部分的定向狀態 之顯微鏡照片,表示於第7圖至第9圖中。在此,第7圖 至第9圖,均爲縱向900μηιχ橫向1200μηι的尺度。 液晶的定向性之評價基準,係藉由進行密封時之定向 無序的有無而加以判斷者。 將進行密封時定向無序在2 0 μηι以下之情形,作成^ 〇」、 將有較此以上的定向無序之情形,作成「X」。 -36- 201237048 [表1] 加熱 減量 % 實施例 5 實施例 6 實施例 7 比較例 1 比較例 2 比較例 3 低聚物(PR-MOCRP) 100 100 100 100 100 100 光聚合 起始劑 化合物A 1 4 1 2 化合物B 1 3 1 2 光起始性化合物 (D ET X) 35 1 光敏性化合物 (EH A) 81 1 光聚合起始劑 化合物A 2 3 1 化合物B 2 1 1 光聚合起始劑(卜369) 25 1 光聚合起始劑(KR-2) 28 4 熱硬化劑(ADH) 15 15 15 15 15 15 無機塡料(二氧化矽) 10 10 10 10 10 10 偶合劑(KBM403) 1 1 1 1 1 1 340mm濾光器反應率 200mj 60 70 65 72 38 73 340mni濾光器反應率 2000mj 90 92 87 76 72 90 420_濾光器反應率 200mj 42 48 43 39 0 45 420_濾光器反應率 2000mj 81 85 85 72 0 86 脫氣量 〇 〇 〇 X 〇 X 污染性 〇 〇 〇 X X 〇 -37- 201237048In Comparative Example 3, Baye II was used as a photoinitiating compound, and EHA (product name: DAR0CURE EHA 'component name: 2-ethylhexyl-4-(dimethylamino) benzoate, manufactured by BASF Corporation) was used. As the photosensitive compound, DETX (product name: photo cure DETX, component name: 2,4-diethylthiaxanthone, manufactured by EUTEC Chemical Co., Ltd.) was used. [Example 8] In 100 parts by weight (1 g) of the photopolymerizable oligomer PR-850CRP, 1 part by weight of the photoinitiating compound A1 and 1 part by weight of the visible light sensitizing compound B1 were dissolved. The photopolymerization initiator ^ is then mixed with 1 part by weight of the coupling agent, 1 part by weight of the organic material, 5 parts by weight of the -28-201237048 inorganic material, and 15 parts by weight of the heat curing agent, using a three-roll mill ( Roller size: Φ 1 2 1 X 250 mm, manufactured by Inoue Co., Ltd.), and kneaded with a pressure of 5 MPa and 2 passes, and a curable resin composition was obtained. [Examples 9 to 12 and Reference Example 1] The same conditions as in Example 8 were carried out, and according to the mixing compositions of Examples 9 to 12 and Table 1 shown in Table 2, a three-roll mill was used. After sufficiently kneading, each photocurable resin composition was obtained. [Evaluation conditions] (1) Weight loss on heating Using differential solar 1 (therma 1 ba I auce) (T G-DTA, product name: thermo plas TG8120, manufactured by Rigaku Corporation The weighted photoinitiator was placed in an aluminum pan and the ratio of the amount of decrease was raised to 300 ° C at a heating rate of 10 ° C / min. A larger amount of reduction means that it is easy to be volatilized and volatilized. If the amount of volatilization is large, the liquid crystal will be contaminated, and as a result, the display may be poor. (2) Reaction rate The photocurable resin composition is as follows: - using a glass of 25 mm x 25 mm thickness 〇 7 mm for LCD (liquid crystal display), and the other side using 25 mm x 25 mm thickness of 0.1 mm PET (polyparaphenyl -29-201237048 II) The film of the ethylene glycol formate film, the thickness of the photocurable resin composition can be clamped in a manner of 〇5 mm, using an ultraviolet irradiation device (UVX-0 1 224S 1, Wuxi Ou electric mechanism), according to l〇〇mW/ The ultraviolet illuminance of cm2 is irradiated with light energy of 200 to 3000 mJ/cm 2 as a sample for measurement of curability. At this time, ultraviolet rays and a heat-ray cutting filter are used to irradiate (i) ultraviolet light and visible light having a wavelength of 340 nm to 450 nm and a wavelength of 420 nm to 450 nm. The measurement of the hardening rate was carried out by FT-IR (Fourier Transform Infrared Spectrometer) (Spectrum One, manufactured by Goldman Co., Ltd.), and the peak area of the (meth)acryl group of the obtained IR (infrared) spectrum was calculated. Reaction rate (conversion ratio) of (meth) propylene group. The calculation of the reaction rate is based on the decrease in the area of the (meth)acryl-based absorption of 1GSOcnr1 (or 945 cm-), and the calculation of the area of the double bond of the benzene ring of 1,500 CHT1. (3) The amount of degassing was measured by a TG-DTA (thermogravimetric analysis-differential thermal analysis method) (manufactured by Rigaku Corporation) to measure the amount of degassing at 120 ° C for x 60 minutes and to carry out the amount of volatile components from the sealant. In the case of the case where the amount of the volatile component is 1.5% or less, "X" is obtained when the amount of the volatile component is 1.5% or more. -30- 201237048 (4) Contaminant photocurable resin composition, with a sealant dispenser, attached to the rubbing treatment with a cross-sectional area of 4000 μm 2 (canibing treatment) A dispensing coating was applied to an ITO (Golden Tin Oxide) glass substrate (60 mm x 70 mm x 0.7 mm thick) of SE-7940 and manufactured by Nissan Chemical Industries, Ltd.). Then, liquid crystal (TN (twisted nematic) liquid crystal, MLC-1 1 900-080, manufactured by Melco) was dropped on the substrate, and the upper and lower substrates were bonded together by a liquid crystal dropping technique (ODF technique) to prepare a test. Use a liquid crystal film. The test liquid crystal cell was irradiated with ultraviolet rays (UV irradiation device: UVX-0 1 224 S1, manufactured by Wuxiou Electric Co., Ltd., illuminance: 200 mJ: 100 mW/cm 2 / 2 sec at 3 65 nm) to harden it, and then, 12 (The hot air oven of TC was thermally hardened for 1 hour to prepare a test cured liquid crystal sheet for the orientation test. The obtained cured liquid crystal sheet for test was used to confirm the orientation state of the liquid crystal during sealing. The confirmation operation was performed using an optical microscope, and the polarizing plate was sandwiched between test cells according to the state of Cross Nicol, and observed by transmission. The orientation state of the corner portion of the test cured sheet was indicated. The photomicrograph 'is shown in Figs. 1 to 6. Fig. 1 to Fig. 6 are the dimensions of the longitudinal direction of 900 μm χ lateral direction of 1 00 μm. The evaluation criteria of the directionality of the liquid crystal are based on the orientation at the time of sealing. Preface -31 - 201237048 If there is any judgment, the orientation disorder will be less than 50μηι, and it will be made into "〇". If there is more than the above orientation disorder, create "X". (5) Stability Determination When the viscosity of the curable resin composition changes at room temperature (25 ° C), the viscosity after 5 days is changed to 20% or less, and the viscosity after 5 曰 is changed to 20% or more. It is judged by the "X". The viscosity is measured by thermostatically treating the photocurable resin composition to 25 t, and attaching it to the RE-105 U-type viscometer (Dongji Industry Machinery Co., Ltd.). The xR7.7 cone rotor was placed in a conical rotor to measure the viscosity of the photocurable resin composition at 25 ° C at 2.5 rpm. The photocurable resin composition immediately after the measurement was allowed to stand at 25 ° C for 5 days, and the viscosity of the photocurable resin composition after 5 days was measured by the above method. The viscosity immediately after the composition is prepared as the initial viscosity -32 - 201237048. The rate of change from the initial viscosity is calculated, and if the evaluation of the stability is exceeded, for example, if the measurement range is exceeded, the measurement cannot be performed. Benchmark, l, 200, (6) Thermosetting property The photocurable resin composition to be measured is a viscosity of a rotary rheometer (flow stress 300, manufactured by Haake Co., Ltd.). After the hardening is started, the saturated viscosity is reached within 60 minutes, and the "0.00" is reached, and the saturated viscosity is reached within 1 to 20 minutes to make "〇", and the saturated viscosity cannot be reached even if it is more than 20 minutes. Judging by the way of making X X. In the photocurable resin composition to be measured, a rotary rheometer (flow stress 300, manufactured by Haake Co., Ltd.) was used to measure the viscosity change at 120 °C. Use parallel plate (Parallel Plate) 'test sample volume 〇.6g' panel gap (gap) lmm, strain control mode, and temperature conditions from room temperature to 120 ° C stop at 20 ° C / min The temperature was raised and the measurement was carried out for 120 minutes while maintaining 12 CTC. The time required to reach the viscosity (saturated viscosity) at which no viscosity changes are reached. (7) Electrical characteristics -33- 201237048 An ampoule test was carried out by means of a sealant to measure and maintain the voltage holding ratio (VHR) and ion density (ID). [Preparation of the sample for measurement] The photocurable resin composition 〇.lg was placed in an ampoule bottle, and TN liquid crystal (MLC-11900-080, manufactured by Milk Co., Ltd.) was added. Place the ampoule in 12 (TC for 1 hour, then let it stand at room temperature. After returning to room temperature (25 °C), take out the liquid crystal part and filter it with a 0.2 μηι filter for electrical evaluation. Liquid crystal sample [Measurement of voltage holding ratio and ion density] A liquid crystal sample for evaluation of electrical characteristics was used to produce a sheet for evaluation of electrical characteristics. The method for producing a sheet was subjected to honing treatment with orientation for liquid crystal. On the ιτο glass substrate (55mm x 60mm x 0.7mmt (thickness)) of the film (Caneifa SE-7492, manufactured by Nissan Chemical Industries, Ltd.), a commercially available sealant (Walterok No. 717, manufactured by Kyoritsu Chemical Industry Co., Ltd.) As a frame sealant, a liquid crystal sample for electrical property evaluation is dropped on a substrate, and is bonded by a liquid crystal dropping technique (0 DF technique), and irradiated with ultraviolet rays (u V irradiation device: UVX-0 1 224S1) Wuxiou Electric Co., Ltd., illuminance and irradiation time: 30 seconds at 3000mJ, 100mW/cm2/365mm) to harden it's then heat-hardened in a hot air oven at 120 °C for 1 hour to make electrical Characteristic evaluation The liquid crystal film for the test was measured by a liquid crystal physical property evaluation device (6254C, manufactured by Toyo Kaikeki Co., Ltd.). The applied voltage was measured at 5 V, 6 Hz (-34 - 201237048 Hz), and 1 The voltage holding ratio at 6 msec (milliseconds) is measured at 50 °c. The evaluation criteria for the voltage characteristics are based on the voltage holding ratio, and the voltage holding ratio is 9 8 %. In the above case, "X" is created in the case where the voltage holding ratio is 98% or less. (8) The orientation of the wiring portion is mixed by the mixing example shown in Table 2, and three rolls are used. A mill (roller size: φ 121 x 2 50 mm, manufactured by Inoue Seisakusho Co., Ltd.) was sufficiently kneaded by a pressure of 5 MPa and 2 rolls to obtain each photocurable resin composition (Examples 8 to 12). And Reference Example 1). The photocurable resin composition thus obtained was subjected to a honing treatment with an orientation film at a cross-sectional area of 4000 μm 2 using a sealant quantitative dispenser (Canei SE-5 662, Nissan Chemical Co., Ltd.) Industrial Co., Ltd.) with wiring pattern (using Cr (chromium) Quantitative distribution coating on a glass substrate (line/space: 200 μm / 200 μm) (60 mm x 70 mm x 0.7 mmt (thickness)). Then, liquid crystal VA (vertical alignment) liquid crystal, MLC-6609, and beauty were dropped on the substrate. The panel gap was set to 4 μm, and the film was bonded by a liquid crystal dropping technique (ODF technique) to prepare a test liquid crystal cell. The test liquid crystal film was irradiated with ultraviolet rays (UV irradiation device: UVX-01 224S1, manufactured by Wusei Electric Co., Ltd., illuminance and irradiation time: 3 000 mJ, 100 mW/cm 2 / 3 65 nm for 10 seconds) to harden it, and then The glass was thermally hardened in a hot air oven at 120 ° C for 1 hour to prepare a test hardened liquid crystal for use in the orientation test -35-201237048. In the obtained cured liquid crystal sheet for test, the orientation state of the liquid crystal at the time of sealing between wirings was confirmed. The confirmation operation was carried out under the optical micromirror, and the polarizing plate was sandwiched between the test pieces in the state of the Nikon, and observed by transmission. A micrograph showing the orientation state of the wiring portion of the hardened liquid crystal cell for test is shown in Figs. 7 to 9. Here, the 7th to 9th drawings are all dimensions of the longitudinal direction 900μηι χ lateral 1200μηι. The evaluation criteria of the directivity of the liquid crystal are judged by the presence or absence of the orientation disorder at the time of sealing. When the sealing disorder is performed under the condition of 20 μηι or less, the result is "^", and the orientation disorder is more than the above, and "X" is created. -36-201237048 [Table 1] % heating loss Example 5 Example 6 Example 7 Comparative Example 1 Comparative Example 2 Comparative Example 3 Oligomer (PR-MOCRP) 100 100 100 100 100 100 Photopolymerization initiator Compound A 1 4 1 2 Compound B 1 3 1 2 Photoinitiating compound (D ET X) 35 1 Photosensitive compound (EH A) 81 1 Photopolymerization initiator Compound A 2 3 1 Compound B 2 1 1 Photopolymerization initiation Agent (Bu 369) 25 1 Photopolymerization initiator (KR-2) 28 4 Thermal hardener (ADH) 15 15 15 15 15 15 Inorganic tantalum (cerium oxide) 10 10 10 10 10 10 Coupler (KBM403) 1 1 1 1 1 1 340mm filter reaction rate 200mj 60 70 65 72 38 73 340mni filter reaction rate 2000mj 90 92 87 76 72 90 420_ filter reaction rate 200mj 42 48 43 39 0 45 420_Filter Reactor reaction rate 2000mj 81 85 85 72 0 86 Degassing amount 〇〇〇X 〇X Contaminant 〇〇〇XX 〇-37- 201237048

[表2] 加熱 減量 % 龍例 8 實施例 9 實施例 10 實施例 11 實施例 12 比較例 1 低聚物(PR-850CRP) 100 100 100 100 100 100 光聚合起始劑 化合物Α1 4 1 2 1 1 1 化合物Β1 3 1 2 1 1 1 1辟▲胡叫泡1 化合物Α2 3 1 化合物Β2 1 1 光聚合起始劑 (KR-2) 28 熱硬化劑(C3) 15 15 15 熱硬化劑(ADH) 15 熱硬化劑(VDH) 20 樹脂塡料(W-5800) 10 10 10 10 10 10 無機綱(二氧化矽) 5 5 5 5 5 5 偶合劑(ΚΒ_3) 1 1 1 1 1 1 穩定性 〇 〇 〇 〇 X 〇 熱硬化性 ◎ ◎ ◎ 〇 〇 X 電氣特性 UV有 〇 〇 〇 〇 〇 〇 電氣特性 UV無 〇 〇 〇 X X X 配線定向性 〇 〇 〇 X X X 定向性(無配線) 0 〇 〇 〇 〇 X 由上述結果(表1)發現,如使用3 40nm濾光器時(一般 性過程條件)、在實施例中,在2 0 0 m j (毫焦耳)、2 0 0 0 m j均 未發生定向不良之情況。另一方面,比較例1、比較例2 則在任一條件即會發生定向不良之情況。 又發現,如使用42 Onm濾光器時(特殊的液晶面板之 製造條件,有成爲今後的主流之可能性),在屬於在來的 光起始劑之比較例2中,則密封劑的硬化並未進行,而液 晶面板的可靠性上有問題之事實》 從上述事實即可知,本發明之化合物Al、A2、B1以 及B2,經使用該化合物之光聚合起始劑及光硬化性樹脂 組成物’係作爲滴下技法用的液晶密封劑之光起始劑的有 -38- 201237048 用性高的事實。 從上述結果(表2)即可明瞭,如本發明之化合物Ai、 A2、B 1以及B2中再添加熱硬化性化合物,再者,如熱硬 化性化合物爲醯肼系混晶化合物之情形,則經使用此等化 合物之光聚合起始劑及光硬化性樹脂組成物,係可作爲高 品位的液晶面板之製造上有用的液晶密封劑使用之事實。 【圖式簡單說明】 [第1圖]:實施例1之污染性。 [第2圖]:實施例2之污染性。 [第3圖]:實施例3之污染性。 [第4圖]:比較例丨之污染性。 [第5圖]:比較例2之污染性。 [第6圖]:比較例3之污染性。 [第7圖]:將測試定向性(directing)之配線部。在此 行(line)(配線部)/間距(space)(液晶部)爲 200μπι/3 00μπι。 [第8圖]:實施例4之配線部之定向性。 [第9圖]:參考例1之配線部之定向性。 -39-[Table 2] Heat reduction % Example 8 Example 9 Example 10 Example 11 Example 12 Comparative Example 1 Oligomer (PR-850 CRP) 100 100 100 100 100 100 Photopolymerization initiator compound Α1 4 1 2 1 1 1 Compound Β 1 3 1 2 1 1 1 1 ▲ 呼胡泡1 Compound Α 2 3 1 Compound Β 2 1 1 Photopolymerization initiator (KR-2) 28 Thermal hardener (C3) 15 15 15 Thermal hardener (ADH 15 Thermal Hardener (VDH) 20 Resin Dip (W-5800) 10 10 10 10 10 10 Inorganic (cerium oxide) 5 5 5 5 5 5 Coupler (ΚΒ_3) 1 1 1 1 1 1 Stability〇 〇〇〇X 〇Hot hardening ◎ ◎ ◎ 〇〇X Electrical characteristics UV 〇〇〇〇〇〇 Electrical characteristics UV flawless XXX Wiring orientation 〇〇〇 directionality (no wiring) 0 〇〇〇〇 X From the above results (Table 1), it was found that when a 3 40 nm filter was used (general process conditions), in the examples, no orientation failure occurred at 200 mj (mJ) and 2000 mj. The situation. On the other hand, in Comparative Example 1 and Comparative Example 2, the orientation failure occurred in any of the conditions. It has also been found that when a 42 Onm filter is used (the manufacturing conditions of a special liquid crystal panel are likely to become mainstream in the future), in Comparative Example 2 which is a conventional photoinitiator, the sealant is hardened. The fact that the reliability of the liquid crystal panel is not problemd. From the above facts, the compounds Al, A2, B1 and B2 of the present invention are composed of a photopolymerization initiator and a photocurable resin using the compound. The material 'as a photoinitiator for a liquid crystal sealing agent for dropping techniques has a high usability of -38-201237048. From the above results (Table 2), it is understood that a thermosetting compound is further added to the compounds Ai, A2, B1 and B2 of the present invention, and further, if the thermosetting compound is a lanthanoid mixed compound, The photopolymerization initiator and the photocurable resin composition using such a compound can be used as a liquid crystal sealing agent which is useful for the production of a high-grade liquid crystal panel. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1]: The contamination of Example 1. [Fig. 2] The contamination of Example 2. [Fig. 3]: Contamination of Example 3. [Fig. 4]: Contrast of the comparative example. [Fig. 5]: Contamination of Comparative Example 2. [Fig. 6]: Contamination of Comparative Example 3. [Fig. 7]: The wiring portion of the directing will be tested. In this line (wiring portion) / space (liquid crystal portion) is 200 μπι / 3 00 μπι. [Fig. 8] The directivity of the wiring portion of the fourth embodiment. [Fig. 9]: Orientation of the wiring portion of Reference Example 1. -39-

Claims (1)

201237048 七、申請專利範圍: 1. 一種化合物,其係使有機酸化合物及/或羥基化合物 與分子中含有至少2個環氧基之化合物進行反應所得之化 合物,其特徵爲:前述化合物係, 前述有機酸化合物爲二甲基胺基安息香酸之化合物A 、或者, 前述羥基化合物爲羥基噻噸酮之化合物B之化合物。 2. 如申請專利範圍第1項之化合物,其中前述化合物 A係下述式(1 ):201237048 VII. Patent Application Range: 1. A compound obtained by reacting an organic acid compound and/or a hydroxy compound with a compound having at least two epoxy groups in a molecule, characterized in that the compound is the aforementioned The organic acid compound is a compound A of dimethylamino benzoic acid or a compound of the compound B in which the hydroxy compound is hydroxythioxanthone. 2. The compound of claim 1, wherein the compound A is the following formula (1): 表示之化合物A 1。 3 .如申請專利範圍第1項之化合物,其中前述化合物 A係下述式(2): 【化9】Represents compound A1. 3. The compound of claim 1, wherein the compound A is the following formula (2): 表示之化合物A2。 -40- 201237048 4 ·如申請專利範圍第1項之化合物,其中前述化合物 B係下述式(3): 【化1 0】Represents compound A2. -40- 201237048 4 · The compound of claim 1 wherein the aforementioned compound B is of the following formula (3): 表示之化合物B1。 5 _如申請專利範圍第1項之化合物,其中前述化合物 B係下述式(4): 【化1 1】Represents compound B1. 5 _ as claimed in claim 1, wherein the compound B is a compound of the following formula (4): (4) 表示之化合物B2。 6. —種光聚合起始劑’其係由光起始性化合物及可見 光增感性化合物所成之光聚合起始劑,其特徵爲: 前述光起始性化合物爲前述化合物A、而 前述可見光增感性化合物爲前述化合物B。 7. —種光硬化性樹脂組成物,其特徵爲:含有光聚合 性單體或低聚物及申請專利範圍第6項所記載之光聚合起 始劑。 8 .如申請專利範圍第7項之光硬化性樹脂組成物,其 -41 - 201237048 中再含有熱硬化性化合物。 9 .如申請專利範圍第8項之光硬化性樹脂組成物,其 中前述熱硬化性化合物,爲屬於醯肼系混晶化合物。 -42-(4) Compound B2 indicated. 6. A photopolymerization initiator which is a photopolymerization initiator derived from a photoinitiating compound and a visible light sensitizing compound, wherein the photoinitiating compound is the compound A and the visible light The sensitizing compound is the aforementioned compound B. A photocurable resin composition comprising a photopolymerizable monomer or oligomer and a photopolymerization initiator according to claim 6 of the patent application. 8. The photocurable resin composition according to item 7 of the patent application, further comprising a thermosetting compound in -41 - 201237048. 9. The photocurable resin composition according to claim 8, wherein the thermosetting compound is a lanthanide mixed crystal compound. -42-
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