TW201236989A - Cutting method for glass plate member, and cutting device - Google Patents
Cutting method for glass plate member, and cutting device Download PDFInfo
- Publication number
- TW201236989A TW201236989A TW101107226A TW101107226A TW201236989A TW 201236989 A TW201236989 A TW 201236989A TW 101107226 A TW101107226 A TW 101107226A TW 101107226 A TW101107226 A TW 101107226A TW 201236989 A TW201236989 A TW 201236989A
- Authority
- TW
- Taiwan
- Prior art keywords
- glass member
- heating
- sheet glass
- cutting
- line
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 131
- 239000011521 glass Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000010438 heat treatment Methods 0.000 claims abstract description 237
- 239000005357 flat glass Substances 0.000 claims description 135
- 230000005484 gravity Effects 0.000 claims description 37
- 230000008646 thermal stress Effects 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 5
- 238000007710 freezing Methods 0.000 claims description 3
- 230000008014 freezing Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 45
- 239000000463 material Substances 0.000 description 18
- 239000000203 mixture Substances 0.000 description 12
- 230000035882 stress Effects 0.000 description 10
- 101100008048 Caenorhabditis elegans cut-4 gene Proteins 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- FSAJRXGMUISOIW-UHFFFAOYSA-N bismuth sodium Chemical compound [Na].[Bi] FSAJRXGMUISOIW-UHFFFAOYSA-N 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011046063A JP2012180257A (ja) | 2011-03-03 | 2011-03-03 | 板状ガラス部材の割断方法、および割断装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201236989A true TW201236989A (en) | 2012-09-16 |
Family
ID=46758014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101107226A TW201236989A (en) | 2011-03-03 | 2012-03-03 | Cutting method for glass plate member, and cutting device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2012180257A (ja) |
| TW (1) | TW201236989A (ja) |
| WO (1) | WO2012118083A1 (ja) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140006958A (ko) * | 2011-03-28 | 2014-01-16 | 피코드릴 에스 아 | 기판 절단 방법 및 절단 장치 |
| JP6038569B2 (ja) * | 2012-09-24 | 2016-12-07 | 正信 八江 | 脆性板の熱割断方法 |
| JPWO2014168246A1 (ja) * | 2013-04-12 | 2017-02-16 | 旭硝子株式会社 | 屋外用化学強化ガラス板 |
| JP2015058470A (ja) * | 2013-09-20 | 2015-03-30 | 旭硝子株式会社 | 放電補助式レーザ孔加工装置 |
| TWI658015B (zh) | 2014-02-20 | 2019-05-01 | Corning Incorporated | 在撓性薄玻璃中切割多個半徑的方法和設備與以其製造之玻璃基板 |
| CN111489990B (zh) * | 2020-04-17 | 2024-03-12 | 深圳市大族半导体装备科技有限公司 | 一种玻璃显示屏的裂片装置、裂片方法和切割系统 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034364A (ja) * | 1996-07-25 | 1998-02-10 | Souei Tsusho Kk | 複数点熱源による脆性材料の割断加工方法 |
| JP2002178179A (ja) * | 2000-12-12 | 2002-06-25 | Sony Corp | 割断装置及びその方法 |
| JP2004148438A (ja) * | 2002-10-30 | 2004-05-27 | Shibuya Kogyo Co Ltd | 脆性材料の割断方法およびその装置 |
| JP2010090010A (ja) * | 2008-10-10 | 2010-04-22 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の割断方法及び割断装置 |
-
2011
- 2011-03-03 JP JP2011046063A patent/JP2012180257A/ja not_active Withdrawn
-
2012
- 2012-02-28 WO PCT/JP2012/054955 patent/WO2012118083A1/ja not_active Ceased
- 2012-03-03 TW TW101107226A patent/TW201236989A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012180257A (ja) | 2012-09-20 |
| WO2012118083A1 (ja) | 2012-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201236989A (en) | Cutting method for glass plate member, and cutting device | |
| CN102834362B (zh) | 玻璃板的强化方法及其装置 | |
| US10358374B2 (en) | Methods for laser scribing and separating glass substrates | |
| EP2922794B1 (en) | Method of cutting a laminate strengthened glass substrate | |
| US8720228B2 (en) | Methods of separating strengthened glass substrates | |
| EP2470326B1 (en) | Methods for laser cutting glass substrates | |
| EP2507182B1 (en) | Methods for laser scribing and separating glass substrates | |
| TW201240931A (en) | Cutting method for strengthened glass plate | |
| TW201036923A (en) | Method and apparatus for producing glass sheet | |
| JP2011251879A (ja) | 化学強化ガラスの切断方法および切断装置 | |
| WO2009067164A1 (en) | Laser scoring of glass sheets at high speeds and with low residual stress | |
| TW201309609A (zh) | 強化玻璃板之切斷方法及強化玻璃板切斷裝置 | |
| CN112723728B (zh) | 生产玻璃片的方法和由此方法生产的玻璃片及其用途 | |
| CN108779016A (zh) | 玻璃板的强化方法和强化玻璃板 | |
| CN106458681A (zh) | 用于生产薄玻璃带的方法和设备以及根据这样的方法生产的薄玻璃带 | |
| JP2013035721A (ja) | ガラス板の製造方法およびディスプレイ装置用化学強化ガラス | |
| CA2994284A1 (en) | Thermally strengthened glass and related systems and methods | |
| US20190127257A1 (en) | Method of thermally tempering glass laminates using selective microwave heating and active cooling | |
| JP7318651B2 (ja) | ガラス板の製造方法 | |
| CN201971737U (zh) | 用于切割玻璃的装置 | |
| WO2013031771A1 (ja) | 強化ガラスの切断方法 | |
| CN101700957B (zh) | 消除玻璃边缘微裂纹提高玻璃强度的方法 | |
| JP5292049B2 (ja) | 脆性材料基板の割断方法 | |
| WO2012132973A1 (ja) | 板状ガラス部材の割断方法、および板状ガラス部材の割断装置 | |
| TW201245063A (en) | Cutting method for strengthened glass plate |