201234634 六、發明說明： 【發明所屬之技術領域】 所主張之發明關於熱擴散室設備之領域以及製造供太 陽能面板生產之熱擴散室的方法，且更尤其是關於冷卻熱 擴散室之處理室之外部表面的方法。 【先前技術】 太陽能生產方式有賴於太陽面板，該面板依次有賴於 選材在基板上面之擴散。在一實例中，使用玻璃作爲基板， 其曝露於氣態之硒化物以形成含銅、銦及硒化物之薄膜於 基板上。已知該等氣態之硒化物對人類有毒害，其強調包 含熱調節系統之審慎的處理方法。 就其本身而言，能以有效率及可靠方式防止該等氣態 之硒化物種自處理室中變遷及洩露至大氣的熱調節系統能 高度改善熱腔室之運作及生產輸出，該熱腔室係用以對基 板提供擴散於其中之含銅、銦及硒化物之薄膜。 因此，對熱擴散室之處理室之熱調節的改良機構及方 法有不斷之需求。 【發明内容】 本揭露內容關於熱擴散室且尤其是關於熱控制系統以 及用於控制熱擴散室設備之處理室溫度的方法。 依據各種例示性實施例，建構支撐圍阻室之支架。該 圍阻室係配置成支撐、圍住且約束受約束在圍阻室中之處 理室。在例示性實施例中，熱源模組係配置在該圍阻室與 該處理室之間，且熱調節空腔係形成在該熱源模組與該處 201234634 理室之間。在例示性實施例中，至少一個流體入口箱與該 熱調節空腔流動連通’該流體入口箱較佳是提供平板閥， 該平板閥減緩自該熱調節空腔流經該流體入口箱且至該熱 調雀卩空腔外部環境之流體的流量。較佳是，該流體入口箱 更包含與該平板閥互動，以控制自該熱調節空腔之外部環 境通過該平板閥且流入該熱調節空腔之流體流量的流量調 整結構。 在交替之例示性實施例中，形成熱擴散室之方法包含 至少以下步驟··設置支架、將圍阻室支撐在該支架上且將 熱源模組配置在該圍阻室中。隨熱源模組定位，使處理室 受圍、受約束且支撐在該熱源模組中，其在該熱源模組與 該處理室之間形成熱調節空腔。隨熱調節空腔形成，下一 步驟包含將至少一個流體入口箱固定於與該熱調節空腔流 動連通之該圍阻室’其中該流體入口箱提供平板閥，該平 板閥減緩自該熱調節空腔流經該流體入口箱且至該熱調節 空腔外部環境之流體的流量，且其中該流體入口箱更包含 與該平板閥互動，以控制自該熱調節空腔之外部環境通過 該平板閥’且流入該熱調節空腔之流體流量的流量調整結 構。 然後’藉由將出口歧管中之壓力降低至低於大氣壓之 値’其中與熱調節空腔流動連通之出口歧管汲取通過該入 口流體箱之平板閥、圍繞該處理室且排出該排淨導管的流 體’其中該排淨導管係固定於出口歧管與熱調節空.腔之間。 讀畢下列詳細說明以及檢閱該等相關聯圖式後，所主 201234634 張發明具有此等及各種其它特性與優點之特徵即瞭然。 【實施方式】 現將詳細參考該等圖式中所描述之本發明各種實施例 之一個或更多實例。藉本發明各種實施例之解釋提供每一 實例，且無意作爲該發明之侷限。例如，作爲實施例之一 部分而例示或說明之特性可與另一實施例結合以又產生一 相異實施例。對於該等所述實施例之其它修飾及變更亦被 認爲在所主張發明之範圍及精神內。 翻至該等圖式，第1圖顯示例示性熱擴散室100，其 至少含由支架104所支撐之圍阻室102，該圍阻室102依 次支撐處理室106。較佳是，該例示性熱擴散室100更包 含配置在處理室106與圍阻室102間之熱源模組108，及 形成在處理室106與熱源模組108間之熱調節空腔110。 第1圖更顯示至少提供一與熱調節空腔110流動連通之流 體入口箱1 1 2。 第2圖顯示配置用於（第1圖之）熱擴散室1〇〇之例示 性實施例之例示性基板支架1 1 3。在較佳實施例中，基板 支架113係由容器把持所形成且容納複數個基板115(未顯 示）。作業時，依基板115之容量充塡基板支架113且使其 位在處理室106中。在處理室106中，基板支架113於擴 散程序期間作爲基板115之固定裝置。較佳是，基板115 係寬度大致爲650mm且長度大致爲1650mm之矩形，且較 佳由鹼石灰矽土之玻璃所形成。 由第3圖所示熱擴散室1 00之截面、右側正視圖提供 201234634 與熱調節空腔110作流體聯繫之入口箱112的更詳細描 述。第3圖還顯示較佳是位在熱源模組1 0 8與處理室1 06 間之複數個支架1 1 4。 在較佳例示性實施例中，熱源模組1 〇 8係由複數個加 熱器1 1 6所形成，其在例示性實施例中大致由總共22個加 熱器組成。較佳是，每一加熱器設有加熱器殼層118'鄰 接加熱器殼層118之加熱器絕緣物120及複數個加熱元件 1 22。在例示性實施例中，對加熱元件1 22施加電力’且加 熱元件122較佳是線圈元件。 回到第1圖，其顯示流體入口箱112更包含固定在入 口歧管126之入口導管124»較佳是，如第4圖中之描述， 入口歧管126傳遞流體給流體入口箱112供分配遍及處理 室 1 06。 第4圖更顯示例示性熱擴散室100包含與熱調節空腔 110流動連通且固定至出口歧管130之排淨導管128,該出 口歧管130選擇性提供小於大氣壓力之內壓，透過流體入 口箱112汲取空氣、圍繞處理室106且排出排淨導管128 的流體。 第4圖亦顯示與處理室106之鄰近接觸、延伸經過相 對應之加熱器116且展現電鉛線133供連接自圍阻室102 外部之複數個熱感測器1 32。在例示性熱擴散室1 00運作 之較佳模式中，使流體之流量懸浮，亦即，流體之流量受 到流體之流量調變，以提供處理室1 06外溫之更準確讀 値。使用自複數個熱感測器1 32所收集之資訊以判定哪個 201234634 流體入口箱Η 2應受到流體之流量限制，且哪個應調整爲 最大流體之流量。 藉由透過複數個流體入口箱112調整流體之流量，可 達成處理室106之更均勻冷卻。而且，在例示性熱擴散室 100之交替較佳運作模式中，複數個熱感測器132提供資 訊，用於調節在處理室106之加熱周期期間供應至加熱元 件122之電量。亦即，在處理室1〇6之加熱周期期間，供 應電力至複數個加熱器Π6之每一者。藉由調變供應至複 數個加熱器116之每一者的電力’且可達成處理室106之 更均勻加熱。 第5圖描述流體入口箱112包含平板閥134，其減緩 自熱調節空腔110流經流體入口箱112及至熱調節空腔外 部環境之流動氣體。第5圖更顯示流體入口箱112包含流 量調整結構136，其與平板閥134互動’控制自熱調節空 腔外部通過平板閥1 3 4且流入熱調節空腔11 0之流體的流 量。 第6圖提供流體入口箱1 1 2之更詳細視圖。在較佳實 施例中，流體入口箱112更提供支撐入口導管124之引入 埠138，該入口導管124與平板閥134之鄰近接觸。較佳 是，流體入口箱112更提供支撐出口導管M2之排出埠 140，該出口導管142係與熱調節空腔11〇流動連通。 第7圖提供交替流體入口箱144之詳細視圖。在除設 置支撐入口導管124之引入埠138外的較佳實施例中，其 與平板閥1 34之鄰近接觸，該流體入口箱1 44響應檢測到 溫度不平衡之第4圖的熱感測器 1 4 8互動之馬達1 4 6，以控制自熱 板閥134且流入熱調節空腔110 量控制棒148係與該平板閥134 箱1 1 2之強化視圖。在除設置支 1 40外的較佳實施例中，流體入 末梢端的延長導管150，該近端 觸且固定在出口導管M2，設置 調節空腔外部環境之流體傳導至 。延長導管150之末梢端較佳是 件152，其中該擴散構件152配 部環境傳導之流體以垂直於處理 圖之處理室1 06。 口箱112更設置樞軸栓154，該 134與樞軸支架156之間。樞軸 124鄰近。樞軸栓154與流量調 流體進入熱調節空腔1 1 〇時，促 預定且可調整之位移免於與入口 源流體停止時，該樞軸栓1 54更 處封閉平板閥134。另言之，在 空腔110時，封閉之平板閥134 110經過至熱調節空腔之外部環 201234634 第4圖之處理室l〇6中 1 3 2，提供與流量控制棒 調節空腔外部環境通過平 之流體的流量，其中該流 互動。 第8圖提供流體入口 撐出口導管142之排出埠 口箱112設置具有近端及 與出口導管142之鄰近接 延長導管150，將流自熱 第5圖之熱調節空腔110 形成附接於其上之擴散構 置成防止自熱調節空腔外 室106之液流施加至第5 第8圖又顯示流體入 樞軸栓154配置在平板閥 支架156固定在入口導管 整結構1 3 6結合，在汲取 使平板閥1 3 4之經控制、 導管124之鄰近接觸。在 促使在鄰近入口導管124 未將流體汲取進入熱調節 阻礙流體自熱調節空腔 境。 201234634 第9圖提供依據本發明各種實施例所傳導之熱腔室 200的例示性製造方法。該製造熱腔室200之方法始於起 始處理步驟2〇2且繼之以處理步驟204。在處理步驟204， 設有支架（如1〇4)。在處理步驟206，支撐圍阻室（如102) 且將其固定於支架。在處理步驟20 8，將熱源模組配置在 圍阻室中且受約束於該圍阻室。在處理步驟210，將處理 室（如10 6)約束在熱源模組中。較佳是，該處理室包含至少 一內部表面及一外部表面。 在處理步驟212，熱調節空腔（如110)係形成在熱源模 組與處理室之間，以提供調節該處理室之能力。而在處理 步驟214，流體入口箱（如112)較佳是固定於與熱調節空腔 流動連通之圍阻室。較佳是，流體入口箱提供平板閥（如 134)，該平板閥減緩自熱調節空腔流經流體入口箱及至熱 調節空腔外部環境之流體的流量，且其中該流體入口箱更 包含與平板閥互動，控制自熱調節空腔之外部環境通過平 板閥且流入熱調節空腔之流體之流量的流量調整結構（如 13 6)。 在處理步驟216，較佳是將與該熱調節空腔流動連通 之出口歧管（如130)中的流體壓力降低至低於大氣壓力之 値，且汲取通過該流體入口箱之平板閥、圍繞該處理室且 排出排淨導管（如128)之流體，結果，降低該出口歧管中壓 力，其中該排淨導管係配置在出口歧管與熱調節空腔之 間，且該程序終止於結束處理步驟2 1 8。 須知，即使在前述說明中已陳述本發明各種實施例之 201234634 眾多特徵與優勢，以及該發明各種實施例之結構與功能細 節’此詳細說明僅爲例示，且可詳細變更，尤其是在本主 張發明之原理至表達該等附加主張項目之該等名詞之廣義 所示之完整範圍之中部件的結構與配置事物上。例如，該 等特定元件可在不偏離本主張發明之精神及範圍下，依特 定用途而變。 顯然，本發明極適合達成所提及之目的和優點以及本 文中固有者。爲此揭露’儘管目前已說明較佳實施例，然 可作眾多之變更’該等變更係熟於本技藝者容易聯想到且 其爲後附申請專利範圍所涵蓋。 【圖式簡單說明】 第1圖顯示切掉部份後之所主張發明熱腔室之例示性 實施例的正交投射圖。 第2圖提供配置用於第1圖熱腔室之例示性實施例之 例示性基板支架的正交投射圖。 第3圖顯不第1圖熱腔室之例示性實施例的截面、右 側正視圖。 第4圖例不第1圖熱腔室之例示性實施例的截面、右 側正視圖，其顯示排氣岐管及導管。 第5圖提供第1圖熱腔室之例示性實施例的截面、前 視圖。 第6圖顯示第1圖熱腔室之例示性實施例之流體入口 箱的放大詳細截面、正視圖。 第7圖顯示第1圖熱腔室之例示性實施例之機動化流 -10- 201234634 體入口箱的放大詳細截面、正視圖。 第8圖描述具備第1圖熱腔室之例示性實施例之附接 入口導管之流體入口箱的放大詳細截面、正視圖。 第9圖通常例示形成第1圖熱腔室之例示性實施例方 法的流程圖。 【圖式簡單說明】 1 00 熱擴散室 102 圍阻室 104 支架 106 處理室 108 熱源模組 110 熱調節空腔 112 流體入口箱 113 基板支架 115 基板 114 支架 116 加熱器 118 加熱器殻層 120 加熱器絕緣物 122 加熱元件 116 熱源 124 入口導管 126 入口歧管 128 排淨導管 -11 - 201234634 13 0 出口歧管 13 2 熱感測器 13 3 電鉛線 134 平板閥 13 6 流量調整結構 13 8 引入埠 140 排出埠 142 出口導管 144 流體入口箱 148 流量控制棒 146 馬達 15 0 延長導管 152 擴散構件 1 54 樞軸栓 1 56 樞軸支架 200 熱腔室 -12-201234634 VI. Description of the Invention: [Technical Field of the Invention] The claimed invention relates to the field of thermal diffusion chamber equipment and a method of manufacturing a thermal diffusion chamber for solar panel production, and more particularly to a processing chamber for cooling a thermal diffusion chamber The method of the external surface. [Prior Art] The solar energy production method relies on the solar panel, which in turn depends on the diffusion of the material on the substrate. In one example, glass is used as the substrate that is exposed to gaseous selenide to form a film comprising copper, indium, and selenide on the substrate. These gaseous selenides are known to be toxic to humans, emphasizing the prudent treatment of thermal conditioning systems. For its part, the heat regulation system capable of preventing the change of these gaseous selenized species from the treatment chamber and leaking to the atmosphere in an efficient and reliable manner can highly improve the operation and production output of the thermal chamber. It is used to provide a film containing copper, indium and selenide diffused therein. Accordingly, there is a continuing need for improved mechanisms and methods for thermal conditioning of processing chambers in thermal diffusion chambers. SUMMARY OF THE INVENTION The present disclosure relates to thermal diffusion chambers and, more particularly, to thermal control systems and methods for controlling the temperature of a process chamber of a thermal diffusion chamber apparatus. According to various exemplary embodiments, a bracket that supports the containment chamber is constructed. The containment chamber is configured to support, enclose, and constrain the chamber in the containment chamber. In an exemplary embodiment, a heat source module is disposed between the containment chamber and the processing chamber, and a thermal conditioning cavity is formed between the heat source module and the office portion. In an exemplary embodiment, at least one fluid inlet tank is in flow communication with the thermal conditioning cavity. The fluid inlet tank preferably provides a flat valve that slows down from the thermal conditioning cavity through the fluid inlet tank and to The heat regulates the flow of fluid from the external environment of the cavity. Preferably, the fluid inlet tank further includes a flow adjustment structure that interacts with the plate valve to control fluid flow from the outer environment of the heat regulating cavity through the plate valve and into the heat regulating cavity. In an alternate exemplary embodiment, the method of forming a thermal diffusion chamber includes at least the following steps: providing a support, supporting a containment chamber on the support, and disposing a heat source module in the containment chamber. Positioning with the heat source module allows the processing chamber to be enclosed, constrained, and supported in the heat source module, which forms a thermal conditioning cavity between the heat source module and the processing chamber. With the formation of the thermal conditioning cavity, the next step includes securing at least one fluid inlet tank to the containment chamber in flow communication with the thermal conditioning cavity, wherein the fluid inlet tank provides a flat valve that slows down from the thermal regulation a flow of fluid through the fluid inlet tank and to an environment external to the heat conditioning cavity, and wherein the fluid inlet tank further includes interacting with the flat valve to control an external environment from the thermal conditioning cavity through the slab The valve' and the flow regulating structure of the fluid flow into the thermal conditioning cavity. Then 'by reducing the pressure in the outlet manifold to below atmospheric pressure', wherein the outlet manifold in flow communication with the thermal conditioning cavity draws through the flat valve of the inlet fluid tank, surrounds the processing chamber, and discharges the drain The conduit fluid 'where the drain conduit is secured between the outlet manifold and the thermally regulated air chamber. After reading the following detailed descriptions and reviewing the associated schemas, the 201213434 inventions are characterized by these and various other features and advantages. [Embodiment] One or more examples of various embodiments of the invention described in the drawings are now referred to in detail. Each of the examples is provided by way of explanation of various embodiments of the invention and is not intended to be a limitation of the invention. For example, features illustrated or described as part of the embodiments can be combined with another embodiment to yield a different embodiment. Other modifications and variations of the described embodiments are also considered to be within the scope and spirit of the claimed invention. Turning to the drawings, FIG. 1 shows an exemplary thermal diffusion chamber 100 having at least a containment chamber 102 supported by a support 104 that in turn supports the processing chamber 106. Preferably, the exemplary thermal diffusion chamber 100 further includes a heat source module 108 disposed between the processing chamber 106 and the containment chamber 102, and a thermal conditioning cavity 110 formed between the processing chamber 106 and the heat source module 108. Figure 1 further shows at least one fluid inlet tank 1 1 2 in flow communication with the thermal conditioning cavity 110. Fig. 2 shows an exemplary substrate holder 1 1 3 of an exemplary embodiment configured for the thermal diffusion chamber 1 (Fig. 1). In the preferred embodiment, the substrate holder 113 is formed by container holding and accommodates a plurality of substrates 115 (not shown). During operation, the substrate holder 113 is filled in the processing chamber 106 in accordance with the capacity of the substrate 115. In the process chamber 106, the substrate holder 113 serves as a fixture for the substrate 115 during the diffusion process. Preferably, the substrate 115 is a rectangle having a width of approximately 650 mm and a length of approximately 1,650 mm, and is preferably formed of glass of soda lime alumina. A more detailed description of the inlet box 112 in fluid communication with the thermal conditioning cavity 110 is provided by the cross-section, right side elevational view of the thermal diffusion chamber 100 shown in FIG. Figure 3 also shows a plurality of brackets 1 1 4 preferably positioned between the heat source module 108 and the processing chamber 106. In the preferred exemplary embodiment, heat source module 1 〇 8 is formed by a plurality of heaters 116, which in the exemplary embodiment consists essentially of a total of 22 heaters. Preferably, each heater is provided with a heater shell 118' adjacent to the heater insulator 120 of the heater shell 118 and a plurality of heating elements 1 22 . In the exemplary embodiment, power is applied to heating element 1 22 and heating element 122 is preferably a coil element. Returning to Figure 1, it is shown that the fluid inlet tank 112 further includes an inlet conduit 124 that is secured to the inlet manifold 126. Preferably, as described in Figure 4, the inlet manifold 126 delivers fluid to the fluid inlet tank 112 for distribution. Through the processing chamber 106. Figure 4 further shows that the exemplary thermal diffusion chamber 100 includes a purge conduit 128 in flow communication with the thermal conditioning cavity 110 and secured to the outlet manifold 130, the outlet manifold 130 selectively providing an internal pressure less than atmospheric pressure, through the fluid The inlet box 112 draws air, fluid surrounding the processing chamber 106 and exiting the drain conduit 128. Figure 4 also shows a plurality of thermal sensors 1 32 that are in contiguous contact with the processing chamber 106, extend through the corresponding heater 116, and exhibit electrical lead lines 133 for connection to the exterior of the containment chamber 102. In the preferred mode of operation of the exemplary thermal diffusion chamber 100, the flow of fluid is suspended, i.e., the flow rate of the fluid is modulated by the flow of the fluid to provide a more accurate reading of the external temperature of the processing chamber 106. The information collected from the plurality of thermal sensors 1 32 is used to determine which 201234634 fluid inlet tank Η 2 should be limited by the flow rate of the fluid and which should be adjusted to the maximum fluid flow rate. More uniform cooling of the processing chamber 106 can be achieved by adjusting the flow of fluid through a plurality of fluid inlet tanks 112. Moreover, in an alternate preferred mode of operation of the exemplary thermal diffusion chamber 100, a plurality of thermal sensors 132 provide information for regulating the amount of power supplied to the heating element 122 during the heating cycle of the processing chamber 106. That is, during the heating cycle of the process chambers 1-6, power is supplied to each of the plurality of heaters Π6. The more uniform heating of the processing chamber 106 can be achieved by modulating the power supplied to each of the plurality of heaters 116. Figure 5 depicts the fluid inlet tank 112 including a plate valve 134 that slows the flow of gas from the heat conditioning cavity 110 through the fluid inlet tank 112 and to the environment outside the heat conditioning cavity. Figure 5 further shows that the fluid inlet tank 112 includes a flow adjustment structure 136 that interacts with the plate valve 134 to control the flow of fluid from the outside of the heat conditioning chamber through the plate valve 134 and into the heat conditioning cavity 110. Figure 6 provides a more detailed view of the fluid inlet tank 112. In a preferred embodiment, the fluid inlet tank 112 further provides an introduction port 138 that supports the inlet conduit 124 that is in adjacent contact with the plate valve 134. Preferably, the fluid inlet tank 112 further provides a discharge port 140 for supporting the outlet conduit M2, the outlet conduit 142 being in flow communication with the thermal conditioning cavity 11 . Figure 7 provides a detailed view of the alternating fluid inlet tank 144. In a preferred embodiment other than the introduction port 138 for supporting the inlet conduit 124, which is in contiguous contact with the plate valve 134, the fluid inlet box 144 is responsive to the thermal sensor of Figure 4 which detects a temperature imbalance. 1 4 8 interactive motor 1 4 6 to control the self-heating plate valve 134 and flow into the thermal conditioning cavity 110 to control the bar 148 and the plate valve 134 box 1 1 2 enhanced view. In a preferred embodiment other than setting the branch 140, fluid is introduced into the distal end of the extension conduit 150 which is in contact with and secured to the outlet conduit M2 to which fluid is disposed to regulate the environment external to the cavity. The distal end of the extension conduit 150 is preferably a member 152, wherein the diffusion member 152 is adapted to be in contact with the environment-conducting fluid to be perpendicular to the processing chamber 106 of the process map. The mouthbox 112 is further provided with a pivot pin 154 between the 134 and the pivot bracket 156. The pivot 124 is adjacent. The pivot pin 154 and the flow regulating fluid enter the thermal conditioning cavity 1 1 〇, and the pivot pin 1 54 closes the plate valve 134 when the predetermined and adjustable displacement is prevented from stopping with the inlet source fluid. In other words, in the cavity 110, the closed flat valve 134 110 passes through the outer ring of the thermal adjustment cavity 201234634, the processing chamber l6 of Fig. 4, providing a flow control rod to adjust the external environment of the cavity. Through the flow of the flat fluid, where the flow interacts. Figure 8 provides an outlet of the fluid inlet and outlet conduit 142. The outlet box 112 is provided with a proximal end and an adjacent extension conduit 150 to the outlet conduit 142, and the heat regulating cavity 110 of the heat transfer pattern 5 is attached thereto. The upper diffusion is configured to prevent the flow of the self-heating adjustment cavity outer chamber 106 from being applied to the fifth embodiment. The fluid inlet pivot pin 154 is disposed on the flat valve bracket 156 and is fixed to the inlet conduit integral structure 136. The adjacent contact of the conduit 124 is controlled by the extraction of the plate valve 134. The self-heating conditioning cavity is prevented from impinging fluid into the thermal regulation adjacent to the inlet conduit 124. 201234634 Figure 9 provides an illustrative method of fabrication of a thermal chamber 200 that is conducted in accordance with various embodiments of the present invention. The method of manufacturing the thermal chamber 200 begins with a process step 2〇2 followed by a process step 204. At process step 204, a bracket (e.g., 1〇4) is provided. At process step 206, the containment chamber (e.g., 102) is supported and secured to the bracket. At process step 20, the heat source module is disposed in the containment chamber and is constrained to the containment chamber. At process step 210, the process chamber (e.g., 106) is constrained in the heat source module. Preferably, the processing chamber includes at least one interior surface and an exterior surface. In process step 212, a thermal conditioning cavity (e.g., 110) is formed between the heat source module and the processing chamber to provide the ability to condition the processing chamber. In process step 214, the fluid inlet tank (e.g., 112) is preferably secured to the containment chamber in flow communication with the thermal conditioning cavity. Preferably, the fluid inlet tank provides a flat valve (e.g., 134) that slows the flow of fluid from the thermal conditioning cavity through the fluid inlet tank and to the environment external to the thermal conditioning chamber, and wherein the fluid inlet tank further includes The flat valve interacts to control the flow adjustment structure of the flow of the fluid flowing through the flat valve and into the thermal conditioning cavity (eg, 13 6). At process step 216, it is preferred to reduce the fluid pressure in the outlet manifold (e.g., 130) in flow communication with the thermal conditioning cavity to below atmospheric pressure, and to draw through a flat valve of the fluid inlet tank, surrounding The process chamber also discharges the fluid from the purge conduit (e.g., 128), and as a result, reduces the pressure in the outlet manifold, wherein the purge conduit is disposed between the outlet manifold and the thermal conditioning cavity, and the process terminates at the end Process step 2 1 8. It is to be understood that the various features and advantages of the various embodiments of the present invention are set forth in the foregoing description of the various embodiments of the invention. The principle of the invention is to the structure and configuration of the components in the full range of the broad meaning of the terms of the appended claims. For example, such specific elements may vary depending on the particular use without departing from the spirit and scope of the invention. It is apparent that the present invention is well adapted to attain the objects and advantages mentioned and inherent in this document. It is to be understood that the present invention is susceptible to numerous modifications, and such modifications are susceptible to those skilled in the art and are covered by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 shows an orthogonal projection view of an exemplary embodiment of the claimed inventive thermal chamber after the portion has been cut away. Figure 2 provides an orthogonal projection of an exemplary substrate holder configured for an exemplary embodiment of the thermal chamber of Figure 1. Fig. 3 shows a cross-sectional, right side elevational view of an exemplary embodiment of the thermal chamber of Fig. 1. Figure 4 is a cross-sectional, right side elevational view of an exemplary embodiment of a thermal chamber, not shown in Figure 1, showing the exhaust manifold and conduit. Figure 5 provides a cross-sectional, front view of an exemplary embodiment of the thermal chamber of Figure 1. Fig. 6 is an enlarged detailed cross-sectional, front elevational view of the fluid inlet tank of the exemplary embodiment of the thermal chamber of Fig. 1. Figure 7 shows a motorized flow of an exemplary embodiment of the thermal chamber of Figure 1 - -10-201234634 An enlarged detailed cross-section, front view of the body inlet box. Figure 8 depicts an enlarged detailed cross-sectional, front elevational view of a fluid inlet tank with an inlet conduit attached to an exemplary embodiment of the thermal chamber of Figure 1. Fig. 9 is a flow chart generally showing an exemplary embodiment of a method of forming a heat chamber of Fig. 1. [Simple diagram] 1 00 Thermal diffusion chamber 102 Enclosure chamber 104 Bracket 106 Processing chamber 108 Heat source module 110 Thermal conditioning cavity 112 Fluid inlet box 113 Substrate holder 115 Substrate 114 Bracket 116 Heater 118 Heater shell 120 Heating Insulator 122 Heating Element 116 Heat Source 124 Inlet Conduit 126 Inlet Manifold 128 Detaching Conduit-11 - 201234634 13 0 Outlet Manifold 13 2 Thermal Sensor 13 3 Electrical Lead Wire 134 Flat Valve 13 6 Flow Adjustment Structure 13 8 Introduction埠 140 discharge 埠 142 outlet conduit 144 fluid inlet tank 148 flow control rod 146 motor 15 0 extension conduit 152 diffusion member 1 54 pivot bolt 1 56 pivot bracket 200 thermal chamber-12-