201234026 六、發明說明： 【發明所屬之技術領域】 一種光耦合接收元件之檢測系統及其方法，本發0月 尤指一種驅使待測元件處於不穩定之工作狀態，而形同 一震盪電路，進而驅使其產生作動，藉由檢測其輪出端 所產生之震盪波形，以判定此待測元件是否於晶片封装 後’產生電性線路斷線之瑕疵的光耦合接收元件之檢測 ^ 系統及其方法。 【先前技術】 按’資訊科技高度發展的現今，諸多資訊逐漸轉換 ~ 成以數位的方式儲存，同時亦造成了資訊膨脹，然而， ' 以往網際網路通訊大多使用數位用戶迴路（Digital201234026 VI. Description of the invention: [Technical field of invention] A detection system and method for an optical coupling receiving component, in particular, a driving operation in which an element to be tested is in an unstable state, and the same oscillating circuit is further By detecting the oscillating waveform generated by the wheel end of the wheel, to determine whether the device under test is after the chip package, the detection of the optical coupling receiving element after the chip is broken, and the method thereof . [Prior Art] According to the current development of information technology, many information is gradually being converted into digital storage, which also causes information expansion. However, in the past, most Internet communication used digital user loops (Digital).
Subscriber Line，DSL)以傳送數位資訊的網路通訊架 構’已無法滿足現今動輒數千百萬位元組（Megabyte , # MB)的資訊傳輸量’因此’光纖通訊（Optic fiber communication)因應而生，光纖通訊係具有高資訊傳輸 量等優點，主要係由一光耦合發射元件、一光纖傳輸通 道以及一光輕合接收元件所組構而成，實施時，光柄合 發射元件係將所接收到的一數位訊號，調變成一特定波 長的光訊號，藉由光纖傳輸通道的傳輸，最後藉由光耦 合接收元件將其接收並解調成數位訊號，以完成資訊傳 輸；請參閱「第1圖」，圖中所示係為現今光耦合接收元 201234026 件之電性組成圖，承上所述，光耦合接收元件丨〇係為光 纖通訊中主要的元件之一，然而，為使光耦合接收元件 ίο作動時，可產生特定的電氣現象，係將光耦合接收元 件10的一類比端工作電壓源avdd與一數位端工作電壓源 Dm產生電性連結，又，為使類比端工作電壓源Avdd作動 時，不受數位端工作電壓源Dvd1)上之雜訊的干擾，更於兩 工作電壓源（Avdd與Dvdd)之間串接一低阻值的電阻rvdd，以 解決雜訊干擾之問題，請搭配參照「第2圖」，圖中所示 係為現今光耦合接收元件之封裝示意圖，承上所述，光 耦合接收元件1 〇完成晶片封裝後，兩工作電壓源（Avdd與 Dvdd)係產生電性連結，並與封裝後之光耦合接收元件1〇 的電壓源腳位vcc呈電性連結，而兩接地點（△㈣與Dgnd)亦 產生電性連結’並與光搞合接收元件1〇之接地腳位Gnd 呈電性連結，輸出端V〇UT則與輸出腳位〇ut呈電性連結， 又，光耦合接收元件1〇於晶片封裝製程後，雖以完成封 裝’但在自動化製程中難免出現瑕庇，而使兩工作電壓 源（Avdd與Dvdd)未產生電性連結（如圖中所示的a)，並請參 閱「第1圖」，兩工作電壓源（八㈣與Dvdd)雖未產生電性連 結’類比端之工作電壓’係由數位端工作電壓源dvdd經由 電阻RVDD傳導至類比端，又或是類比端傳導至數位端，而 因電阻Rvdd阻值較小，類比端所獲得之工作電壓僅略小於 數位端’因此光耗合接收元件仍可產生作動，又，光 耦合接收元件10雖可作動，但於接收光訊號時，易產生 201234026 波形遺漏及波形異常的情事，所述的波形遺漏係如「第3 圖」所示，圖中所示係為接收波形遺漏示意圖，而波形 異常係如「第4圖」所示，圖中所示係為接收波形異常 示意圖，承上述，波形異常（或遺漏）對於接收或傳遞數 位化訊號有極大的影響，波形異常（或遺漏）係使光耦合 接收元件10所解調的數位訊號，與原先所傳遞的數位訊 號相異，進而使數位化資訊產生錯誤或損毀，因此，製 造端需針對封裝後之光耦合接收元件1〇進行相關的電性 檢測’以提升出貨時的產品良率，又’現有的檢測方法 大多驅使光耦合接收元件1〇處於穩定的工作狀態，藉由 光耦合接收元件1 〇持續接收訊號於一檢測時間，當檢測 時間結束，透過檢測光耦合接收元件於檢測時間内所 接收之訊號，是否有上述兩情事的產生，以得知封裝後， 兩工作電壓源（Avdd與Dvdd)是否產生斷線之瑕庇，如此， 雖可提升產品出貨良率，卻導致產能下降，且製造端更 需另闢新的檢測工作站，以進行檢測，故，若能針對檢 測流程進行適度的改良，必能改善檢測導致產能降低的 情事。 【發明内容】 〜有鑒於上述的問題，本發明人係依據多年來從事相 關行業的經驗’針對光耦合接收元件之電性組成及其檢 測方法進行分析，期能研究出更為適切的檢測方法；緣 201234026 • 此，本發明主要的目的在於提供一種可快速檢測斷線瑕 疵，以避免檢測所造成之產能降低情事發生的光耦合接 收元件之檢測系統及其方法。 為達上述目的，本發明所稱的光耦合接收元件之檢 測系統及其方法，其主要係於檢測系統中建構有一檢測 源產生模組、一檢測源傳遞模組、一量測模組以及一頻 率檢測模組，檢測時，係驅使待測元件處於不穩定之工 • 作狀態，形同一震盈電路，藉由檢測源產生模組調制檢 測時所需的檢測源，並經由檢測源傳遞模組的傳導，驅 使待測元件產生作動，而量測模組於待測元件作動時， 量測其輸出端所產生的震盪波形，並將此震盪波形資訊 . 傳遞給頻率檢測模組，以進行差異比較，進而判定出待 - 測元件是否於封裝時產生斷線之瑕疵，藉此，本發明不 僅可快速的進行檢測，更可避免因檢測而使產能降低的 情事產生。 Φ 以上關於本發明内容之說明及以下之實施方式之說 明’係用以示範與解釋本發明之精神與原理，並且提供 本發明之專利範圍更進一步解釋。 【實施方式】 请參照「第5圖」，圖中所示係為本發明之系統組成 示意圖，並請參照「第1圖」，如圖所示，本發明所稱的 光耦合接收元件之檢測系統20，其主要係用於檢測光耦 6 201234026 合接收元件ίο於晶片封装製程後，兩工作電壓源（^⑽與 Dm)是否確實產生電性連結，其主要係建構有一檢測源產 生模組201、一檢測源傳遞模組2〇2、一量測模組2〇3以 及一頻率檢測模組204，其中，檢測源產生模組2〇1係可 依據各光耦合接收元件1〇内部電性組成的不同，調製不 同的檢測源D1，例如電壓源或一特定頻率的光訊號等， 而檢測源產生模組201係與檢測源傳遞模組2〇2呈電性 連結，常態下，檢測源產生模組201係透過檢測源傳遞 模組202將檢測源D1傳導至一待測元件21上，以驅使 待測元件21產生作動，而檢測源傳遞模組2〇2係可為一 光耦合發送元件，又，量測模組2〇3供以量測待測元件 21於作動時，待測元件21輸出腳位〇ut(如「第2圖」 所示）所產生的電性參數D2,例如一波形或一頻率等，而 量測模組203係與頻率檢測模組2〇4呈資訊連結，並將 其所檢測之電性參數D2,傳導至頻率檢測模組2〇4,以 進行差異比較’又，頻率檢測模组2Q4係接收來自量測 模組2G3所傳遞的電性參數D2，其主要係比較良品與待 測元件2卜兩者之間電性參數⑽的差異’以判定待測元 件21是否產生有斷線之瑕疫，又，頻率檢測模组2〇4係 可為一計頻裝置等。 請參閱「第6圖」，圖中所示係為本發明之實施流程 示意圖（一）’並請搭配參照「第5圖」，承上所述，檢測 源產生模組2(H係可依據待測元件21調製不同的檢測源 201234026 D1，以針對不同的光耦合接收元件l〇進行檢測，而本實 施利係以檢測源D1為電壓源進行舉例，實施方法係如下 所述： (1)待測元件處於不穩定之工作狀態31:請搭配參 照「第2圖」’ 一般光耦合接收元件1〇作動時， 為使其工作穩定，大多於光耦合接收元件1〇的 電壓源腳位Vcc及接地腳位GND之間，跨接有 • 一旁路電容C!，以使光耦合接收元件1〇之整體 電氣特性趨於穩定’據此，本發明為使檢測時 間縮短，而於檢測的初始，移除待測元件21之 電壓源腳位Vcc及接地腳位GND之間所跨接的 ' 旁路電容〇，或於待測元件21組設時，直接省 ' 略旁路電容〇 ’又，經上述流程後，待測元件 21因未跨接旁路電容Ci的緣故，而使其内部電 路形同一震盪電路； • (2)驅使待測元件產生作動32 :承上所述，待測元 件21進一步與光耦合接收元件之檢測系統2〇 呈電性連結，且檢測源產生模組201產生一檢 測源D1，承上所述’其為一電壓源，透過檢測 源傳遞模組202將檢測源D1傳導至待測元件21 的電壓源腳位Vcc，請搭配參照「第7圖」，圖 中所示係為本發明之實施示意圖（一），承上所 述，檢測源D1經由電壓源腳位Vcc，傳導至兩 Λ 8 201234026 ' '作電壓源―或Μ其中之-，進而驅使待 測元件2丄產生作動，且因待測元件21當下形 同一震盘電路，因此，待測元件21於作動時， 其内部電路開始產生震盪； (3) 量測輸出端之電性參數33:承上所述，待測元件 21震！作動後，係產生有一震還波形，此時， 本發明所稱的電性參數！)2係為上述的震盪波 • 形’藉由量測模組203與待測元件21之輸出腳 位Out電性連結，以量測出待測元件21所產生 的震盪波形； (4) 判定待測元件是否產生瑕疵34:承上述，量測 模組203將其所量測出的震盪波形，傳遞至頻 率檢測模組2 0 4 ’以進行頻率之檢測，請參閱「第 8圖」’圖中所示係為本發明之檢測結果示意圖 (一），承上述’頻率檢測模組204係依據良品 • 所產生之震盪波形作為比較基礎，比較待測元 件21所產生之震盪波形，是否與良品之震盪波 形產生差異，以判定待測元件21於晶片封裝製 程後’是否產生斷線之瑕庇，如圖所示，良品 所產生的震盪波形W1其振幅（或頻率），係與不 良品所產生的震盪波形W2之振幅（或頻率）相 異’如此，便可依此快速檢測光耦合接收元件 • 1〇於封裝製程後，是否產生瑕疵，又，上述良 9 201234026 品之震盪頻率係可於光耦合接收元件10進行元 件規格定義時’即定義出，又或是於檢測前， 預先針對良品，進行震盪頻率之量測，以作為 比較之基礎’且每一待測元件21所產生的震盪 頻率不盡相同，因此進行比較震盪頻率時，可 進一步建構有一彈性機制，以減少誤判的情事 產生。 鲁 承上所述，上述實施例係利用電壓源作為檢測源 D1，以驅動待測元件21產生作動，並透過量測待測元件 21之震盪頻率，以判定是否產生斷線之瑕疵，然而，本 發明除上述實施方式外’更可進一步使檢測源D1為一特 ' 定頻率的光訊號，請參照「第9圖」，圖中所示係為本發 " 明之實施流程示意圖（二），上述實施方式之實施流程係 如下所述： (1) 待測元件處於不穩定之工作狀態41 :本步驟係 φ 與待測元件處於不穩定之工作狀態31步驟所述 相同’實施時，係將跨接於待測元件21之電壓 源腳位Vcc及接地腳位GND之間的旁路電容Ci 移除，使待測元件21形同一震盪電路； (2) 產生檢測用之光檢測源42 :承上所述，檢測源 產生模組201於檢測前，產生一特定頻率的光 訊號，以做為檢測源D1 ; (3) 驅使待測元件產生作動43 :請搭配參照「第10 201234026 圖」，圖中所示係為本發明之實施示意圖（二）， 承上所述，待測元件21與本發明所稱的光耦合 接收元件之檢測系統2〇呈電性連結，其中，檢 測源傳遞模組202係與待測元件21之一光接收 部PD連結，並將檢測源產生模組2〇1所產生 的檢測源D1，持續性的傳遞至待測元件21上的 光接收部PD，此時，光耦合接收元件之檢測系 統20除產生檢測源D2供以檢測外，更供給電 能驅使待測元件21產生作動； (4) 量測輸出端之電性參數44 :承驅使待測元件產 生作動43步驟所述，待測元件21作動後，持 續性的接收來自檢測源傳遞模組2〇2所傳遞的 光訊號，又，因待測元件21未接設旁路電容Cl 的緣故，使其内部電路形同一震盪電路，並因 持續性的接收光訊號而產生震盪，且產生有一 震蓋波形，此時，量測模組2〇3經由待測元件 21之輸出腳位Out將震盪波形量測出； (5) 判定待測元件是否產生瑕疵45:承上所述，量 測模組203將震盪波形量測出後，並將其傳遞 至頻率檢測模組204以進行後續流程，請參閱 「第11圖」及「第12圖」，「第11圖」中所示 係為本發明之檢測結果示意圖（二），而「第12 圖」中所示係為本發明之檢測結果示意圖 11 201234026 (三），如圖所示，圖中所示的震盪波形係為 待測元件21經上述流程所產生之震盪波形，而 震盪波形W4係為另一待測元件21經上述流程 所產之另一震盪波形，兩圖中所示的檢測波形 W5則為本實施例檢測源D1所使用之特定頻率 光訊號的等效波形，又，比較兩待測元件21所 產的兩震盪波形（W3、W4)，可得知兩震盪波形 | (W3、W4)的震幅及頻率皆相異，且依據光耦合 接收元件於設計時’所定義之工程文件，或經 統計後，可得知未產生斷線瑕疵之元件，所量 測出的震盪波形其頻率較低，而產生有斷線瑕 疵的元件’所量測出的震盪波形其頻率相對較 ' 高，如此’量測出震盪波形W4之待測元件21 係為一瑕疵品’而量測出震盪波形W3之待測元 件21為一良品’據此，本發明便可快速判定待 • 測元件21是否產生斷線之瑕庇。 承上所述’上述實施例係藉由一特定頻率之光訊號 以做為檢測源D1 ’而因元件設計的不同，同一頻率之光 訊號檢測源’未必能使良品與瑕疵品之間的差異明顯 化，因此，為使檢測結果可產生明顯差異化，本發明實 施時’係可依據元件特性，調製不同頻率之光訊號，以 使良品與瑕庇品之間的差異更佳明顯，進而縮短判定元 件之時間；又，上述實施例為使整體敘述更為具體，而 12 201234026 . 於判定元件是否產生瑕寐步驟，藉由比對的方式將其呈 現’而具體實施時，此步驟係可藉由-運算模組，透過 其内部所建構的檢測機制，以快速的進行檢測。 由上所述可知，本發明所稱的光耦合接收元件之檢 測系統及其方法，其主要係於所稱的檢測系統中建構有 -檢測源產生模組、—檢測源傳遞模組、—量測模組以 及一頻率㈣频’實施時，係使待測元件處於不穩定 Φ 之工作狀態，使其形同-震盪電路，並藉由檢測源產生 模組依據待測元件之特性或檢測流程的不同，調製檢測 時所需之檢測源，再經由檢測源傳遞模組的傳導，驅使 待測元件產生作動，而待測元件作動的同時，量測模組 1 藉由量測待測元件之輸出端，將待測元件所產生之震盪 - 波形量測出，且此震盪波形進一步被傳遞至頻率檢測模 組，以進行良品與瑕疵品的判定，藉此，本發明不僅可 快速的進行檢測，更可避免因檢測而使產能降低的情事 Φ 產生，據此，本發明其據以實施後，確實可提供一種可 快速檢測元件於晶片封裝製程後，是否產生斷線瑕疵的 光耦合接收元件之檢測系統及其方法。 唯，以上所述者，僅為本發明之較佳之實施例而已， 並非用以限定本發明實施之範圍；任何熟習此技藝者， 在不脫離本發明之精神與範圍下所作之均等變化與修 飾’皆應涵蓋於本發明之專利範圍内。 綜上所述，本發明之功效，係具有發明之「產業可 13 201234026 利用性」、「新穎性」與「進步性」等專利要件；申請 爰依專利法之規定，向 鈞局提起發明專利之申請。 201234026 【圖式簡單說明】 第1圖’係為現今光耦合接收元件之電性組成圖。 第2圖’係為現今光耦合接收元件之封裝示意圖。 第3圖，係為接收波形遺漏示意圖。 第4圖，係為接收波形異常示意圖。 第5圖，係為本發明之系統組成示意圖。 第6圖，係為本發明之實施流程示意圖（一）。 第7圖，係為本發明之實施示意圖（一）。 第8圓，係為本發明之檢測結果示意圖（一）。 第9圖，係為本發明之實施流程示意圖（二）。 第圖，係為本發明之實施示意圖（二）。 第11圖，係為本發明之檢測結果示意圖（二）。 第12圖，係為本發明之檢測結果示意圖（三）。 【主要元件符號說明】 !0 光耦合接收元件 20 201 203 21 〇2檢測源傳遞模組 〇4頻率撿測模組 光耦合接收元件之檢測系统 檢測源產生模組 量測模組 待測元件 31 待測元件處於不穩定之工作狀離 15 201234026 32 驅使待測元件產生作動 33 量測輸出端之電性參數 34 判定待測元件是否產生瑕疵Subscriber Line, DSL) is a network communication architecture that transmits digital information. It can't meet the current information transmission volume of millions of bytes (Megabyte, #MB), so 'Optic fiber communication' The optical fiber communication system has the advantages of high information transmission capacity, etc., and is mainly composed of an optical coupling transmitting component, a fiber transmission channel, and a light-lighting receiving component. When implemented, the optical shank and the transmitting component are received. The digital signal is converted into a specific wavelength of optical signal, and transmitted by the optical fiber transmission channel, and finally received and demodulated into a digital signal by the optical coupling receiving component to complete the information transmission; Figure, the figure shows the electrical composition diagram of the current optical coupling receiver 201234026. As mentioned above, the optical coupling receiver is one of the main components in optical fiber communication, however, for optical coupling When the receiving component ίο is activated, a specific electrical phenomenon can be generated, which is an analog terminal operating voltage source avdd and a digital terminal operating voltage source of the optical coupling receiving component 10. Dm generates electrical connection, and in order to make the analog terminal working voltage source Avdd act, it is not interfered by the noise on the digital working voltage source Dvd1), and is connected between the two working voltage sources (Avdd and Dvdd). A low-resistance resistor rvdd to solve the problem of noise interference, please refer to "Figure 2". The figure shows the package diagram of the current optical coupling receiving component. As described above, the optical coupling receiving component 1 After the chip package is completed, the two working voltage sources (Avdd and Dvdd) are electrically connected, and are electrically connected to the voltage source pin vcc of the packaged optical coupling receiving element 1 ,, and the two grounding points (△ (4) And Dgnd) also produces an electrical connection 'and is electrically connected to the grounding pin Gnd of the receiving component 1〇, and the output terminal V〇UT is electrically connected to the output pin 〇ut, and optically coupled After the component 1 is mounted on the chip packaging process, although the package is completed, but in the automated process, it is inevitable that the two working voltage sources (Avdd and Dvdd) are not electrically connected (a shown in the figure). Please refer to "Figure 1" for two working voltage sources ( (4) Dvdd) does not produce an electrical connection 'the analog voltage of the analog terminal' is transmitted from the digital terminal operating voltage source dvdd to the analog terminal via the resistor RVDD, or the analog terminal is conducted to the digital terminal, and the resistance of the resistor Rvdd is higher. Small, the analog voltage obtained by the analog terminal is only slightly smaller than the digital terminal'. Therefore, the light-consuming receiving component can still be activated. Moreover, the optical coupling receiving component 10 can be activated, but when the optical signal is received, the 201234026 waveform missing is easily generated. In the case of waveform anomalies, the waveform omissions are as shown in "Figure 3". The figure shows the missing waveform of the received waveform, and the waveform anomaly is shown in Figure 4, which is shown in the figure. The waveform abnormality diagram is taken as follows. The waveform abnormality (or omission) has a great influence on receiving or transmitting the digitized signal. The waveform abnormality (or omission) is caused by the digital signal demodulated by the optical coupling receiving component 10, and the original signal is transmitted. The digital signals are different, which causes the digital information to be erroneous or damaged. Therefore, the manufacturing end needs to perform related electrical inspection on the packaged optical coupling receiving component 1〇. Measure 'to improve the product yield at the time of shipment, and 'the existing detection methods mostly drive the optical coupling receiving element 1 〇 to be in a stable working state, and the optical coupling receiving element 1 〇 continuously receives the signal at a detection time when detecting At the end of the time, by detecting whether the signal received by the optical coupling receiving component during the detection time has the occurrence of the above two situations, it is known whether the two working voltage sources (Avdd and Dvdd) are disconnected after the package is encapsulated. Although it can improve the product shipment yield, it will lead to a decline in production capacity, and the manufacturing side needs to open a new inspection station for testing. Therefore, if the detection process can be appropriately improved, it will improve the detection and lead to the reduction of production capacity. The situation. SUMMARY OF THE INVENTION In view of the above problems, the present inventors have analyzed the electrical composition and detection method of the optical coupling receiving component based on the experience of the related industry for many years, and can study a more suitable detection method. EDGE 201234026 • Accordingly, it is a primary object of the present invention to provide a detection system and method for an optically coupled receiving element that can quickly detect a broken wire to avoid the occurrence of a production loss caused by the detection. In order to achieve the above object, the detection system and method for the optical coupling receiving component of the present invention mainly comprises a detection source generating module, a detecting source transmitting module, a measuring module and a method in the detecting system. The frequency detecting module detects that the device to be tested is in an unstable working state, and forms a same seismic circuit. The detecting source generates a detection source required for the module modulation detection, and transmits the mode through the detecting source. The conduction of the group drives the component to be tested to be activated, and the measurement module measures the oscillating waveform generated at the output end of the component to be tested, and transmits the oscillating waveform information to the frequency detecting module for performing By comparing the differences, it is further determined whether or not the component to be tested is disconnected at the time of packaging, whereby the present invention can not only detect the component quickly, but also avoid the occurrence of a decrease in productivity due to the detection. The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the spirit and principles of the invention, and the scope of the invention is further explained. [Embodiment] Please refer to "figure 5", which is a schematic diagram of the system composition of the present invention, and please refer to "the first diagram". As shown in the figure, the optical coupling receiving component of the present invention is detected. The system 20 is mainly used for detecting the optocoupler 6 201234026 and the receiving component. After the chip packaging process, whether the two working voltage sources (^(10) and Dm) actually generate an electrical connection, the main system is to construct a detection source generating module. 201, a detection source transmission module 2 〇 2, a measurement module 2 〇 3 and a frequency detection module 204, wherein the detection source generation module 2 〇 1 can be based on each optical coupling receiving component 1 〇 internal electricity Different detection components D1, such as a voltage source or a specific frequency of optical signals, etc., and the detection source generation module 201 is electrically connected to the detection source transmission module 2〇2, under normal conditions, detection The source generating module 201 transmits the detecting source D1 to a device under test 21 through the detecting source transmitting module 202 to drive the device under test 21 to be activated, and the detecting source transmitting module 2〇2 can be an optical coupling. Transmitting component, again, measuring module 2 When the 〇3 is used to measure the device 21 to be tested, the device 21 to be tested outputs an electrical parameter D2 (such as a waveform or a frequency) generated by the pin 〇ut (as shown in FIG. 2). The measurement module 203 is connected with the frequency detection module 2〇4, and transmits the detected electrical parameter D2 to the frequency detection module 2〇4 for comparison of differences. Further, the frequency detection module The 2Q4 system receives the electrical parameter D2 transmitted from the measurement module 2G3, which mainly compares the difference between the electrical parameter (10) between the good product and the device under test 2 to determine whether the device under test 21 is broken. The plague, in addition, the frequency detection module 2〇4 can be a frequency counting device or the like. Please refer to "Figure 6", which is a schematic diagram of the implementation process of the present invention (1) 'and please refer to the "5th figure", as described above, the detection source generation module 2 (H system can be based on The device under test 21 modulates different detection sources 201234026 D1 to detect different optical coupling receiving elements, and the present embodiment is exemplified by detecting source D1 as a voltage source, and the implementation method is as follows: (1) The device under test is in an unstable working state. 31: Please refer to "Fig. 2" when the general optical coupling receiving device is activated. In order to stabilize the operation, most of the voltage source pin Vcc of the optical coupling receiving device 1 is used. Between the grounding pin GND and the bypass capacitor C!, the overall electrical characteristics of the optical coupling receiving element 1〇 tend to be stabilized. According to the present invention, the detection time is shortened, and the initial detection is performed. The bypass capacitor 跨 across the voltage source pin Vcc of the device under test 21 and the ground pin GND is removed, or when the component 21 to be tested is assembled, the bypass capacitor 〇 is directly saved. After the above process, the component to be tested 21 is not crossed Bypass capacitor Li, and make its internal circuit form the same oscillating circuit; • (2) Drive the device under test to generate action 32: According to the above, the device under test 21 is further connected to the detection system of the optical coupling receiving component. Electrically coupled, and the detection source generating module 201 generates a detection source D1, which is a voltage source, and transmits the detection source D1 to the voltage source pin of the device under test 21 through the detection source transmission module 202. Vcc, please refer to "Figure 7", which is shown in the figure (1). According to the above description, the detection source D1 is transmitted to the two terminals through the voltage source pin Vcc. The voltage source - or any of them - drives the device under test 2 丄 to act, and because the device under test 21 is shaped as the same shock disk circuit, when the device under test 21 is activated, its internal circuit begins to oscillate; 3) Measuring the electrical parameter of the output terminal 33: According to the above, the component to be tested 21 is shaken! After the actuation, a shock waveform is generated. At this time, the electrical parameter referred to in the present invention is the above-mentioned 2 Sasser wave • shape 'by measurement module 203 and to be tested The output pin Out of the component 21 is electrically connected to measure the oscillating waveform generated by the component 21 to be tested; (4) determining whether the component to be tested generates 瑕疵34: according to the above, the measuring module 203 measures the same The oscillating waveform is transmitted to the frequency detection module 2 0 4 ' for frequency detection. Please refer to "Fig. 8". The figure shows the detection result of the invention (1). The module 204 compares the oscillating waveform generated by the good product to compare the oscillating waveform generated by the component 21 to be tested, and whether it is different from the oscillating waveform of the good product to determine whether the device under test 21 is generated after the chip packaging process. As shown in the figure, the amplitude (or frequency) of the oscillating waveform W1 generated by the good product is different from the amplitude (or frequency) of the oscillating waveform W2 generated by the defective product. Rapid detection of optically coupled receiving components • 1〇 After the packaging process, whether or not 瑕疵 is generated, and the oscillating frequency of the above-mentioned good 9 201234026 can be defined when the optical coupling receiving component 10 defines the component specifications. In the righteousness, or before the test, the oscillating frequency is measured in advance for the good product, as the basis of the comparison', and the oscillation frequency generated by each of the elements 21 to be tested is not the same, so when comparing the oscillation frequency, A flexible mechanism can be further constructed to reduce the occurrence of misjudgments. As described above, the above embodiment uses a voltage source as the detection source D1 to drive the device under test 21 to generate an action, and transmits the oscillation frequency of the device under test 21 to determine whether or not a wire break occurs. However, In addition to the above embodiments, the present invention can further make the detection source D1 a specific frequency of the optical signal. Please refer to the "figure 9", which is shown in the figure of the present embodiment. The implementation flow of the above embodiment is as follows: (1) The device under test is in an unstable working state 41: This step is the same as the operation of the device under test in the unstable working state 31 step. The bypass capacitor Ci connected between the voltage source pin Vcc of the device under test 21 and the ground pin GND is removed, so that the device under test 21 is shaped into the same oscillating circuit; (2) generating a light detecting source 42 for detection As described above, the detection source generating module 201 generates a specific frequency of the optical signal as the detection source D1 before the detection; (3) drives the device under test to generate the action 43: Please refer to the "10th 201234026 figure" , shown in the figure According to the embodiment of the present invention (2), the device under test 21 is electrically connected to the detection system 2 of the optical coupling receiving device of the present invention, wherein the detection source transmission module 202 is to be tested. The light receiving portion PD of one of the elements 21 is coupled, and the detection source D1 generated by the detection source generating module 2〇1 is continuously transmitted to the light receiving portion PD on the element 21 to be tested. At this time, the optical coupling receiving element The detection system 20 generates the detection source D2 for detection, and supplies the electric energy to drive the device under test 21 to act. (4) Measuring the electrical parameter 44 of the output terminal: the driving drive causes the component to be tested to generate the action 43. After the component 21 to be tested is activated, the optical signal transmitted from the detection source transmission module 2〇2 is continuously received, and the internal circuit shape is oscillated due to the fact that the component to be tested 21 is not connected to the bypass capacitor C1. The circuit is oscillated by the continuous receiving optical signal, and a shock cover waveform is generated. At this time, the measuring module 2〇3 measures the amplitude of the oscillating waveform through the output pin Out of the component 21 to be tested; ) Determine if the device under test produces 瑕疵45 As described above, the measurement module 203 measures the oscillating waveform and transmits it to the frequency detection module 204 for subsequent processes. Please refer to "11th" and "12th", "No. Figure 11 is a schematic diagram (2) of the test result of the present invention, and the "12th figure" is a schematic diagram of the test result of the present invention. 11 201234026 (C), as shown in the figure, as shown in the figure The oscillating waveform is the oscillating waveform generated by the device 21 to be tested through the above process, and the oscillating waveform W4 is another oscillating waveform produced by another device 21 to be tested through the above process. The detecting waveform W5 shown in the two figures is shown. For the embodiment, the equivalent waveform of the specific frequency optical signal used by the source D1 is detected, and the two oscillating waveforms (W3, W4) produced by the two components 21 to be tested are compared, and the two oscillating waveforms are obtained (W3, The amplitude and frequency of W4) are different, and according to the engineering file defined by the optical coupling receiving component at the time of design, or after statistics, the component that has not been broken can be known, and the measured oscillating waveform The frequency is lower, and the component with the broken wire is generated. The measured oscillating waveform has a relatively high frequency, so that the component 21 to be tested of the oscillating waveform W4 is measured as a product, and the component 21 to be tested of the oscillating waveform W3 is measured as a good product. The invention can quickly determine whether or not the component to be tested 21 is broken. According to the above description, the optical signal of the same frequency is used as the detection source D1', and the optical signal detection source of the same frequency does not necessarily cause the difference between the good and the defective product. Obviously, therefore, in order to make the detection result significantly different, in the implementation of the present invention, the optical signals of different frequencies can be modulated according to the characteristics of the components, so that the difference between the good products and the shelters is better and further shortened. Determining the time of the component; in addition, the above embodiment is to make the overall description more specific, and 12 201234026. In the determination of whether the component is generated, the method is presented by comparing it, and this step can be borrowed. The --computing module performs detection quickly through its internal detection mechanism. It can be seen from the above that the detection system and method for the optical coupling receiving component of the present invention are mainly constructed in the so-called detection system, the detection source generation module, the detection source transmission module, and the quantity. When the measurement module and a frequency (four) frequency are implemented, the component to be tested is in an unstable Φ working state, so that it is similar to the oscillating circuit, and the module is generated by the detection source according to the characteristics of the component to be tested or the detection process. Differently, the detection source required for the modulation detection, and then the conduction of the detection source transmission module, drives the component to be tested to be activated, and while the component to be tested is activated, the measurement module 1 measures the component to be tested. At the output end, the oscillating-waveform quantity generated by the component to be tested is measured, and the oscillating waveform is further transmitted to the frequency detecting module for determining the good product and the defective product, whereby the invention can not only quickly detect Therefore, it is possible to avoid the situation that the capacity is reduced due to the detection, and accordingly, according to the present invention, the present invention can provide a rapid detection of whether the component is produced after the wafer packaging process. A detection system and method for a light-coupled receiving element of a broken wire. The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; any change and modification made by those skilled in the art without departing from the spirit and scope of the invention 'All should be covered by the patent of the present invention. In summary, the effects of the present invention are those of the inventions such as "Industry can be used 2012 20122626", "novelty" and "progressiveness"; applications for patents are filed in accordance with the provisions of the Patent Law. Application. 201234026 [Simple description of the diagram] Figure 1 is the electrical composition diagram of the current optical coupling receiver. Figure 2 is a schematic diagram of the package of the present optical coupling receiving element. Figure 3 is a schematic diagram of the received waveform missing. Figure 4 is a schematic diagram of the received waveform anomaly. Figure 5 is a schematic diagram showing the composition of the system of the present invention. Figure 6 is a schematic diagram (I) of the implementation flow of the present invention. Figure 7 is a schematic view (I) of the implementation of the present invention. The eighth circle is a schematic diagram (1) of the test results of the present invention. Figure 9 is a schematic diagram (2) of the implementation flow of the present invention. The figure is a schematic diagram (2) of the implementation of the present invention. Figure 11 is a schematic diagram (2) of the test results of the present invention. Figure 12 is a schematic diagram (3) of the test results of the present invention. [Main component symbol description] !0 Optical coupling receiving component 20 201 203 21 〇2 detection source transmission module 〇4 frequency detection module optical coupling receiving component detection system detection source generation module measurement module test component 31 The device under test is in an unstable working condition. 15 201234026 32 Driving the device under test to generate an action 33 Measuring the electrical output of the output terminal 34 Determining whether the device under test generates 瑕疵
41 待測元件處於不穩定之工作狀態 42 產生檢測用之光檢測源 43 驅使待測元件產生作動 44 量測輸出端之電性參數 45 判定待測元件是否產生瑕庇 A 位置 Avdd 類比端工作電壓源 Dvdo 數位端工作電壓源 Agnd 類比端接地點 Dgnd 數位端接地點 Rvdd 電阻 Vout 輸出端 PD 光接收部 Vcc 電壓源腳位 GND 接地腳位 Out 輸出腳位 Cl 旁路電容 W1 震盪波形 W2 震盪波形 W3 震盪波形 W4 震盪波形 W5 檢測波形 16 201234026 D1 檢測源 D2 電性參數41 The component under test is in an unstable working state. 42 The light detection source 43 for detecting generates the operation of the device under test. 44 The electrical parameter of the measurement output. 45 Determine whether the component to be tested generates a shield A. Position Avdd Analog terminal operating voltage Source Dvdo Digital terminal working voltage source Agnd Analog terminal grounding point Dgnd Digital terminal grounding point Rvdd Resistance Vout Output terminal PD light receiving part Vcc Voltage source pin GND Ground pin Out Output pin C bypass capacitor W1 Oscillation waveform W2 Oscillation waveform W3 Oscillation waveform W4 Oscillation waveform W5 Detection waveform 16 201234026 D1 Detection source D2 Electrical parameters
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