201221905 六、發明說明： 【發明所屬之技術領域】 本發明係一種應用於表面量測及應力量測方面的技術領 域’尤指一種可作全場域且非接觸性的量測、單一光柵可量測 之變形量增加、架設簡單、環境穩定要求低及量測快速精確之 利用光柵調變相位移產生疊紋干涉的量測裝置者。201221905 VI. Description of the Invention: [Technical Field] The present invention is a technical field applied to surface measurement and stress measurement, especially a measurement that can be used as a full field and non-contact, single grating The measuring device has the advantages of increased deformation, simple erection, low environmental stability requirement and fast and accurate measurement, and the use of grating modulation and phase shift to generate the moiré interference.
【先前技術】 目刖在機械工業上量測表面形貌及量測應力大小的方 法，大多是以非接觸光學的方法來檢測物體表面及微小的位 移，而其中常用的技術不外乎光學應變規、傳統光學干涉術、 斑點干涉、疊紋等，從量測待測元件本身的位移量去推算應變 畺，再從應變量轉化成力的大小。陰影疊紋干涉術的優勢是它 可以做全場域的量測、非接觸性、實驗架設簡單、對環境穩定 性要求低且量測快速。因此疊紋技術在力學上的應用非常廣 泛。 疊紋法最早由Weller和Shepard於1948年所提出，用於 位移的量測。而在㈣年Μ_等人成功的將疊紋干涉法運 用在應力的分析上。⑽待TheQearis#明了陰影疊纟文干涉 術，量測了面外位移。在1970年代，相位偏移干涉法開始被 運用在干涉儀做許多的量測。 陰影疊紋干涉儀是利用一光線通過一參考光柵在待測物 201221905 上开ϋ开v陰衫光柵’再利用影像娜系統揭取陰影光栅與參 考光，成之疊紋。從面外位移公式看來，當光栅越密其靈敏 - 度越:’但是實際上光栅間隔若是太小⑽行/毫米）則將引 起光場繞射，使得i之陰f彡疊崎比減弱，腑度降低。因 此相位移技術就被應用在疊紋干涉儀中。相位移技術是可決 疋干涉條財每個像素相位之她估測方法之…藉由相位移 技術，物件表面位移場的連續分佈將可顯示出來，並且提高精 # 度。 f知的相位移疊紋干涉儀’如台灣公告帛1247881號專利 所不，其主要係利用一液晶相位調變器用以調變該干涉儀中光 束之光相位，然而其光源必須選定雷射，系統較為昂貴，而且 必須製做試片光栅，步驟較為繁瑣。 另-習知的相位移疊紋干涉儀，如台灣公告第ι26讓號 糊所不’其主要係為垂直式單光束陰影疊紋干涉儀，應用於 BGA電子構裝撓曲量量測。然而由於其之樣品設置方式，對於 軟性電子基板的量測會引入誤差量。 有鑒於此’本發明人御情上述習知的相位移疊紋干涉儀 於設計上未臻完善所導致之衫缺失及不便，而深人構思，且 積極研究改良試做而開發設計出本發明。 【發明内容】 本發明之主要目_在於提供—種可作全場域且非接觸 201221905 性的量測、單一光柵可量測之變形量增加、架設簡單、環境穩 疋要求低及量測快速精確之利用光栅調變相位移產生疊紋干 涉的量測裝置者。 本發明所述之利用光栅調變相位移產生疊紋干涉的量測 裝置包括一光源產生模組、一分光器、一載座、一參考光栅、 一相位移器、一第一反射鏡組、一第二反射鏡組、一影像擷取 單元及一處理單元❶其中，該光源產生模組係供產生一光束。 該分光器係供將該光源產生模組的光束分成一第一光束及一 第二光束。該載座係供承載及固定一待量測元件。該參考光柵 位在該待量測元件一側。該相位移器係供帶動該參考光柵平移 接近或遠離該待量測元件以產生數個平移相位。該第一反射鏡 組係供反射該第一光束，並使該第一光束從一方向以一第一入 射角照射在該參考光栅上，使於該待量測元件上產生一第一陰 影光柵。該第二反射鏡組係供反射該第二光束，並使該第一光 束從另一方向以一第二入射角照射在該參考光栅上，使於該待 量測元件上產生一第二陰影光栅，該第二入射角與該第一入射 角相同。該影像擷取單元係供擷取該參考光柵在數個平移相位 時與該第一、一陰影光柵所形成的疊紋干涉影像。該處理單元 係電連接該影像擷取單元用以處理該影像擷取單元所擷取的 疊紋干涉影像，並以澤尼克（Zernike)多項式計算出該待量 測元件之表面狀態。 本發明所述之利用光柵調變相位移產生疊紋干涉的量測[$ ] 6 201221905 方法包括將mu光束及—第二光束；使該第一、 -光束分猶兩方向以相_人射細射在—參考光拇上使 ;待量測7L件上產生一第一陰影光拇及一第二陰影光拇；平 移該參考光栅使接近或遠_待胸元件料生數個平移相 位；再·—影像娜單元練該參考光柵在數辦移相位時 與該第一、二陰影光柵所形成的疊紋干涉影像；最後利用一處 理單元處職雜娜單元所齡的倾干涉潍並以澤尼 克（Zernike)多項式擬合出該待制元件的表面形貌。 如此，藉由上述之量測裝置及方法，係可利用發展出一種 數學運算模式，只要於—㈣紋干涉影像中左右各出現一條對 稱式疊紋便可叫算錄性t子基域力值，因此係具有快 速，確、簡科伽。_是可將光柵平魏鱗定相位， 取三幅以上的4紋干涉鱗，便可做待麯元絲面形貌重 建’而且藉由變频後的高度差值係計算錄性電子基板應力 值，使得本發明可以提高量測精财。另外，本發明亦可將分 光器移除以使其絲單光束光栅調變相位移之麟疊紋干涉 儀，進而可進一步減少運算時間提升量測效率。 【實施方式】 請參閱第—圖所示，係顯示本發明所述之_光栅調變 相位移產生疊紋干涉的量測裝置包括—光源產生模組i、—分 光器2、-载座3、-參考光栅4、一相位移器5、一第一反 201221905 射鏡組6、-第二反射鏡組7、—影像擷取單元8及一處理單 元9。其中： 該光源產生模組1包含-光源產生器1{)、—空間滤波器 (Spatial Filter) 1 卜一光圈 12 及一傅立葉透鏡（F〇urier lens) 13。該光源產生器1〇可供產生一光源，該光源可為雷 射光或鹵素光。該空間濾波器U設在該錢、產生器1〇之一 側可供赃兩者_距離，㈣供除去該絲时氣中粒子 的散射或是光學瑕疵影響所產生的空間雜訊（315扣比1 noise)。該光圈12設在該空間濾波器丨丨之相反於該光源產 生器10的一侧可供光源通過，且可調整該光圈12與該空間 濾波器11之間的距離。該傅立葉透鏡13設在該光圈12之相 反於該空間濾波器11的一側，可供該光源通過以產生一光 束，且可調整該傅立葉透鏡13與該光圈12之間的距離。該 玉間渡波器11係為於一共焦點凸透鏡組14的焦點位置設置 一針孔15 (直徑10〜20//m)而成者。 該分光器2係用以供將該光源產生模組1的光束分成一 第一光束A及一第二光束B。 該載座3係供承載及固定一待量測元件3〇，且可調整該 待量測元件30昇降或移動。 該參考光柵4位在該待量測元件30的前側，其係為網版 印刷在一光學玻璃上之穿透式光柵。 該相位移器5係供該參考光柵4組裝於其上，該相位移[s] 8 201221905 器5可帶動該參考光栅4水平移動地接近或遠離該待量測元 件30以產生數個平移相位。該相位移器5具有一步進馬達5〇 供作為其帶動參考光柵4平移的驅動器。 該第一反射鏡組6包含一第一反射鏡片6〇、一第一旋轉 座61及-第—光圈62。該第—光圈62位在該第一反射鏡片 60與該參考光柵4之間。該第一反射鏡片⑼可供反射該第一 光束A ’使該第—光束八從—方向穿過該第一光圈 62而以一 籲第人射角照射在該參考光柵4上，致使於該待量測元件％ 上產生第一陰影光柵。該第一旋轉座61供該第一反射鏡片 60組裝於其上且可供調整該第一反射鏡片6〇轉動至一角 度，以達到調整該第一入射角之目的。 該第二反射鏡組7包含一第二反射鏡片7〇、一第二旋轉 座71及-第二光圈72。該第二光圈72位在該第二反射鏡片 鲁 7G與該參考光栅4之間。該第二反射 70可供反射該第二 光束B使該第光束B從另一方向穿過該第二光圈π而以 -第二入射角照射在該參考光柵4上，致使於該待量測元件 30上產生一第二陰影光栅。該第二入射角的角度與該第一入 射角相同。該第二旋轉座71供該第二反射鏡片70组裝於其 上且可供調整該第二反射鏡片7Q轉動至―角度，以達到調整 該第二入射角之目的。 該影像擷取單元8射為自感光齡树型（Charge C〇upled Device ’ C⑻影像擷取器，其係可供擷取該參考光m 9 201221905 拇4在數個平移相位時與該第一、二陰影光拇所形成的疊紋 干涉影像，如第二圖所示。 該處理單元9係電連接該影像_取單元8,供用於處理該 影像揭取單元8所榻取的疊紋干涉影像，並以澤尼克 (Z⑽ike)多項式計算出該待制元件3()之表面狀態。 凊參閱第三®所示’係顯示本發崎述之彻光拇調變 相位移產生疊紋干涉的量測方法包括： (a) 將一光束分為一第一光束及一第二光束； (b) 使該第-、二光束分別由兩方向以相同的入射角照射 在-參考光栅上，使於-待量測树上產生—第—陰影光拇 及一第二陰影光栅； (c) 平移該參考光栅使接近或遠離該待量測元件使產生 數個平移相位，該參考光栅的平移她係由該第―、二光束 的入射角及該參考光柵上的光柵條紋間距決定； ⑷利用-影像娜單元棘該參考光栅在數個平移相 位時與該第-、二陰景彡光柵所形成的疊紋干涉影像（如第二 圖所示）；以及 (e)利用-處理單元處理該影像擷取單元所操取的疊紋 干涉影像並以澤尼克（Zernike)多項式擬合出該待量測元件 的表面形貌。 在上述方法之中，該(a)步驟係可僅利用-光束直接照射 在該參考光柵上，使於絲频元件上產生—陰縣栅，因⑸ 201221905 此該(e)步射的處理單元便可財尼克（Zernike)多項式 擬&出該待里測元件的半邊表面形貌。藉此以進—步減少運 算時間提升量測效率 請參閱第四圖所示，係指出本發明所述之姻光柵調變 相位移產生姐干涉的制紐係可細在量錄性電子基 板上，其步驟係與上述大致姻，差別在於將該待量測元件 改為-軟性f子基板。織⑷步射係彻棚取單元可 齡該軟低電子基板變形前、後之數個相對應相位的疊紋干 涉影像；（e)步驟t係糊該處理單元處職些疊紋干涉影 像並以澤尼克（Zernike)多項式擬合出該倾電子基板的表 面形貌’· ：6後增加-⑴步驟利用該處理單元計算變形前、 後該軟性電子基板之表©_的姆高度及其差值以得出該 軟性電子基板應力值。在本實施方式巾，當軸紋干涉影像 為左右各出現一條對稱式疊紋時可以計算出應力。 由第五圖所示，係可得到該待量測元件3〇之面外位移值 (out-of-plane)的表示公式如下：[Prior Art] The methods of measuring the surface topography and measuring the stress in the mechanical industry mostly use non-contact optical methods to detect the surface and small displacement of the object, and the commonly used techniques are nothing more than optical strain. Rules, traditional optical interferometry, speckle interference, embossing, etc., from measuring the displacement of the component to be measured to calculate the strain 畺, and then from the strain to the magnitude of the force. The advantage of shadow overlay interference is that it can be used for full field measurement, non-contact, simple experimental setup, low environmental stability requirements and fast measurement. Therefore, the application of the moiré technique in mechanics is very extensive. The dazzling method was first proposed by Weller and Shepard in 1948 for the measurement of displacement. In the fourth year, 叠_ et al. successfully applied the moiré interferometry to the analysis of stress. (10) When TheQearis# understood the shadow and interferometry, the out-of-plane displacement was measured. In the 1970s, phase shift interferometry began to be used in interferometers to make many measurements. The shadow moiré interferometer uses a light beam to pass through a reference grating on the object to be tested 201221905 to open the v-shirt grating', and then uses the image system to extract the shadow grating and the reference light to form a pattern. From the out-of-plane displacement formula, the closer the grating is, the more sensitive it is - the more it is: 'But actually the grating spacing is too small (10) rows/mm) will cause the light field to be diffracted, making the i-f , the temperature is reduced. Therefore, phase shifting techniques are applied to the interstitial interferometer. The phase shift technique is a method of estimating the phase of each pixel of the interfering strip. By the phase shift technique, the continuous distribution of the surface displacement field of the object will be displayed and the degree of precision will be improved. The phase shifting interferometer is known as the patent of Taiwan Publication No. 12478881. It mainly uses a liquid crystal phase modulator to modulate the optical phase of the beam in the interferometer. However, the source must select a laser. The system is relatively expensive, and the test strip grating must be made, which is cumbersome. Another-known phase-shifted interstitial interferometer, such as Taiwan's announcement No. ι26, is not a vertical single-beam shadow-stack interferometer, applied to BGA electronic assembly deflection measurement. However, due to the sample setting method, the measurement of the flexible electronic substrate introduces an error amount. In view of the fact that the present inventor's conventional phase-shifting interstitial interferometer has been designed and unsatisfactory, and has been designed and developed, and has been actively researched and improved, the invention has been developed. . SUMMARY OF THE INVENTION The main object of the present invention is to provide a field-wide and non-contact 201221905 measurement, a single grating measurable deformation amount increase, simple erection, low environmental stability requirements and rapid measurement Accurate measurement device for generating moiré interference using grating modulation phase shift. The measuring device for generating the moiré interference by using the grating modulation phase shift includes a light source generating module, a beam splitter, a carrier, a reference grating, a phase shifter, a first mirror group, and a The second mirror group, an image capturing unit and a processing unit, wherein the light source generating module is configured to generate a light beam. The beam splitter is configured to split the beam of the light source generating module into a first beam and a second beam. The carrier is for carrying and fixing a component to be measured. The reference grating is located on the side of the component to be measured. The phase shifter is configured to drive the reference grating to translate closer to or away from the to-be-measured component to produce a plurality of translational phases. The first mirror group is configured to reflect the first light beam, and the first light beam is irradiated on the reference grating from a direction at a first incident angle to generate a first shadow grating on the to-be-measured component. . The second mirror group is configured to reflect the second light beam and illuminate the first light beam from the other direction at a second incident angle on the reference grating to generate a second shadow on the to-be-measured component a grating, the second incident angle being the same as the first incident angle. The image capturing unit is configured to capture a moiré interference image formed by the first grating and the shadow grating when the reference grating is in a plurality of translation phases. The processing unit is electrically connected to the image capturing unit for processing the moiré interference image captured by the image capturing unit, and calculating the surface state of the to-be-measured component by a Zernike polynomial. The measurement of the moiré interference generated by the grating modulation phase shift according to the present invention [00] 6 201221905 The method includes the mu beam and the second beam; the first and the light beams are separated by two directions. Shooting - reference light on the thumb; to measure a 7L piece to produce a first shadow light and a second shadow light; translate the reference grating to make the near or far _ chest component to produce several translational phases; · The image element unit exercises the dimple interference image formed by the reference grating with the first and second shadow gratings when the phase is shifted; and finally uses a processing unit to perform the tilting interference of the age of the unit The Zernike polynomial fits the surface topography of the component to be fabricated. Thus, by the above-mentioned measuring device and method, a mathematical operation mode can be developed, as long as a symmetric embossing appears in the left and right of the - (four)-grain interference image, the computational t-subdomain force value can be called Therefore, it is fast, accurate, and simple. _ is to set the phase of the grating flat Wei scale, take more than three 4 grain interference scales, can be reconstructed by the curvature of the surface of the curved element, and calculate the stress value of the recorded electronic substrate by the height difference after the frequency conversion, so that The invention can improve the measurement of fine money. In addition, the present invention can also remove the splitter to make the filament single-beam grating modulate the phase shifting of the lining interferometer, thereby further reducing the computation time and improving the measurement efficiency. [Embodiment] Referring to the first figure, the measuring device for generating the embossed interference of the grating modulation phase shift according to the present invention includes a light source generating module i, a beam splitter 2, a carrier 3, a reference grating 4, a phase shifter 5, a first counter 201221905 lens group 6, a second mirror group 7, an image capturing unit 8, and a processing unit 9. The light source generating module 1 includes a light source generator 1{), a spatial filter 1 , a diaphragm 12 and a Furirier lens 13 . The light source generator 1 is operable to generate a light source, which may be laser light or halogen light. The spatial filter U is disposed on one side of the money, the generator 1 赃, the distance _ distance, (4) the scattering of particles in the gas when the wire is removed, or the spatial noise generated by the optical 瑕疵 (315 buckle) Than 1 noise). The aperture 12 is disposed on a side of the spatial filter 相反 opposite to the light source generator 10 for passage of the light source, and the distance between the aperture 12 and the spatial filter 11 can be adjusted. The Fourier lens 13 is disposed on a side of the aperture 12 opposite to the spatial filter 11, for allowing the light source to pass to generate a light beam, and the distance between the Fourier lens 13 and the aperture 12 can be adjusted. The inter-cylinder ferrite 11 is formed by providing a pinhole 15 (diameter 10 to 20/m) at a focal position of a common focal convex lens group 14. The beam splitter 2 is configured to divide the light beam of the light source generating module 1 into a first light beam A and a second light beam B. The carrier 3 is for carrying and fixing a to-be-measured component 3〇, and the to-be-measured component 30 can be adjusted to move up or down. The reference grating 4 is located on the front side of the component to be measured 30, which is a transmissive grating which is screen printed on an optical glass. The phase shifter 5 is configured to assemble the reference grating 4 thereon, and the phase shift [s] 8 201221905 5 can drive the reference grating 4 to move horizontally close to or away from the to-be-measured component 30 to generate a plurality of translation phases. . The phase shifter 5 has a stepper motor 5 〇 as a drive for driving the reference grating 4 to translate. The first mirror group 6 includes a first reflecting mirror 6〇, a first rotating base 61 and a first-optical aperture 62. The first aperture 62 is located between the first reflective mirror 60 and the reference grating 4. The first reflecting mirror (9) is configured to reflect the first light beam A' such that the first light beam is traversed from the first optical aperture 62 from the first optical aperture 62 and is incident on the reference grating 4 at an incident angle, so that A first shadow raster is produced on the component to be measured %. The first rotating base 61 is provided with the first reflective lens 60 and can be adjusted to rotate the first reflective lens 6 to an angle to adjust the first incident angle. The second mirror group 7 includes a second reflecting mirror 7〇, a second rotating base 71 and a second aperture 72. The second aperture 72 is located between the second reflective lens 7G and the reference grating 4. The second reflection 70 is configured to reflect the second light beam B such that the first light beam B passes through the second aperture π from another direction and is irradiated on the reference grating 4 at a second incident angle, so that the second light beam is to be measured A second shadow grating is created on element 30. The angle of the second angle of incidence is the same as the first angle of incidence. The second rotating base 71 is provided with the second reflecting mirror 70 and can be adjusted to rotate the second reflecting mirror 7Q to an angle for adjusting the second incident angle. The image capturing unit 8 is a self-photosensitive tree type (Charge C〇upled Device 'C(8) image capturing device, which is capable of capturing the reference light m 9 201221905 when the thumb 4 is in a plurality of translational phases and the first And a double-shaded optical interference image formed by the shadow of the light, as shown in the second figure. The processing unit 9 is electrically connected to the image capturing unit 8 for processing the rubbing interference of the image removing unit 8 Image, and calculate the surface state of the component 3() by Zernike (Z(10)ike) polynomial. 凊 Refer to the third® to show the amount of the interlacing interference generated by the out-of-light displacement of the light The measuring method comprises: (a) dividing a light beam into a first light beam and a second light beam; (b) causing the first and second light beams to be respectively irradiated on the reference grating by the same incident angle in both directions, so that - generating a --shadow light and a second shadow grating on the tree to be measured; (c) translating the reference grating to approach or move away from the element to be measured to produce a plurality of translational phases, the translation of the reference grating The incident angle of the first and second beams and the grating strip on the reference grating The spacing is determined; (4) using the image-image unit, the reference grating is a plurality of translational phases and the first and second sinusoidal gratings formed by the interlaced interference image (as shown in the second figure); and (e) utilizing The processing unit processes the moiré interference image acquired by the image capturing unit and fits the surface topography of the to-be-measured component with a Zernike polynomial. Among the above methods, the (a) step is It can be directly irradiated on the reference grating by the -beam, so that the Yinxian grid is generated on the filament frequency component, because (5) 201221905, the processing unit of the (e) step can be Zernike polynomial & The half-surface topography of the component to be measured, thereby reducing the computation time by further steps, and improving the measurement efficiency, as shown in the fourth figure, indicating that the marriage grating modulation phase shift of the present invention produces a sister interference The method can be finely smeared on the measurable electronic substrate, and the steps are substantially the same as the above, the difference is that the component to be measured is changed to a soft sub-substrate. The woven (4) step-shooting system can be used to take the soft low electron. Several corresponding before and after deformation of the substrate a layer of interlaced interference image; (e) step t is a paste of the processing unit at the work of the moiré interference image and the Zernike polynomial fits the surface topography of the tilted electronic substrate '· : 6 after adding - (1) Step Using the processing unit to calculate the height of the surface of the flexible electronic substrate before and after the deformation and the difference thereof to obtain the stress value of the flexible electronic substrate. In the embodiment, when the axial interference image is left and right The stress can be calculated when a symmetrical pattern is formed. As shown in the fifth figure, the expression of the out-of-plane of the element to be measured 3〇 is obtained as follows:
Aw = d 2 ~~ ~— tana 其中：AW代表該待量測元件之面外位移值。 a代表入射光束與參考光柵4法線之夾角。 P代表光柵條紋間距。 a及P為已知參數。 201221905 由第/、圖所示並配合上述公式，係可得到該待量測元件 30之量測位置的曲率半徑。 根據畢氏定理可知： R ~ {R ~ wY + S2 及一 w2 + S2 可得到：Aw = d 2 ~~ ~— tana where: AW represents the out-of-plane displacement value of the component to be measured. a represents the angle between the incident beam and the reference grating 4 normal. P represents the grating stripe pitch. a and P are known parameters. 201221905 The curvature radius of the measurement position of the to-be-measured component 30 can be obtained by the above-mentioned formula and the above formula. According to the Bishop's theorem, R ~ {R ~ wY + S2 and one w2 + S2 can be obtained:
其中：R代表量測元件3〇之量測位置的曲率半徑。 .△W代表該待量測元件之面外位移值。 占代表第一疊紋到中線的距離（為量測值> 由第七圖所示’當基板彈性模數心大於50GPa時，我 們稱此基板為硬縣板，由於基缺硬的，係可制硬性基 板應力值的代表公式，Stoney公式，如下： Y*t2 <Jf = — ^ ^ } 6Rtf 由第七圖所示’ #基板彈性模數&小於5GPa時，我們 稱此基板為軟性基板’所以易受應力辟喊生彎曲，因此 做Stoney公式的修正。我們假設當物體達到能量平衡狀態 下，總内能不隨應變及曲率改變，係可得到軟性電子基板應 力值修正公式，如下： 皇巧)2 r ! ! 12 201221905 綜上所述，由於本發明具有上述優點及實用價值，而且 在同類產品中均未見有相同或類似之產品或發表，故本發明 已符合發明專利之新穎性及進步性要件，爰依法提出申請。Where: R represents the radius of curvature of the measurement position of the measuring element 3〇. ΔW represents the out-of-plane displacement value of the component to be measured. The distance from the first to the middle line (for the measured value) is shown in the seventh figure. 'When the substrate elastic modulus is greater than 50 GPa, we call this substrate a hard plate, because the base is not hard, It is a representative formula of the hard substrate stress value, Stoney's formula, as follows: Y*t2 <Jf = — ^ ^ } 6Rtf As shown in the seventh figure, 'the substrate elastic modulus & less than 5GPa, we call this substrate It is a soft substrate' so it is susceptible to stress and bending, so we make the correction of the Stoney formula. We assume that when the object reaches the energy balance state, the total internal energy does not change with the strain and curvature, and the soft metal substrate stress value correction formula can be obtained. , as follows: 皇巧) 2 r ! ! 12 201221905 In summary, the present invention has been in accordance with the invention because it has the above advantages and practical value, and no identical or similar products or publications are found in similar products. The novelty and progressive elements of the patent are submitted in accordance with the law.
[s] 13 201221905 【圖式簡單說明】 第1為本發明之裝置的平面架構示意圖。 * 一圖為本發明之影像她單元所擷取的纽干涉影像。 - 第三圖為本發明之妓的流程圖。 第圖為本發明之方法的另一種實施狀態的流程圖。 第五圖為本發明之參考物與陰影光柵示意圖。 第六圖為本發明之參考光柵與待制元件的相對義示意圖。 Φ 第七圖為本發明應驗量測軟性電子基板的示意圖。[s] 13 201221905 [Simplified description of the drawings] The first is a schematic diagram of the planar architecture of the device of the present invention. * A picture of the New Zealand interference image captured by her unit of the image of the present invention. - The third figure is a flow chart of the invention. The figure is a flow chart of another embodiment of the method of the present invention. The fifth figure is a schematic diagram of the reference object and the shadow grating of the present invention. The sixth figure is a schematic diagram of the relative meaning of the reference grating and the component to be fabricated according to the present invention. Φ The seventh figure is a schematic diagram of the test for measuring the soft electronic substrate.
【主要元件符號說明】 光源產生模組1 光源產生器10 空間濾波器11 光圈12 傅立葉透鏡13 共焦點凸透鏡組14 針孔15 分光器2 載座3 待量測元件30 參考光柵4 相位移器5 步進馬達50 第一反射鏡組6 第一反射鏡片60 第一旋轉座61 第一光圈62 第二反射鏡組7 第二反射鏡片70 第二旋轉座71 第二光圈72 影像擷取單元8 處理單元9 第一光束A[Main component symbol description] Light source generation module 1 Light source generator 10 Space filter 11 Aperture 12 Fourier lens 13 Confocal convex lens group 14 Pinhole 15 Beam splitter 2 Carrier 3 To be measured component 30 Reference grating 4 Phase shifter 5 Stepper motor 50 first mirror group 6 first reflecting mirror 60 first rotating base 61 first diaphragm 62 second mirror group 7 second reflecting mirror 70 second rotating base 71 second diaphragm 72 image capturing unit 8 processing Unit 9 first beam A
[S】 14 201221905[S] 14 201221905
第二光束BSecond beam B