201221883 六、發明說明： 【發明所屬之技術領域】 本發明係關於對平板狀構件執行特定處理之處理裝置。 【先前技術】 先前，以作為處理裝置之加熱處理裝置加熱處理玻璃基 板等處理對象構件時，以上升銷機構之不動銷（固定銷）與 可動銷支持處理對象構件（例如參照專利文獻丨、2)。專利 文獻1所揭示之上升銷機構中，以可動銷與固定銷交互支 持基板。 另一方面，專利文獻2所揭示之上升銷機構中，可動銷 在上下方向與水平方向移動。以上升之可動銷支持處理對 象構件並於水平方向移動，使可動銷下降，以不動銷支 持。藉由重複該動作，而使可動銷與不動銷與處理對象構 件接觸之位置經常變化，抑制起因於銷接觸之處理對象構 件之溫度不均。 此外’作為揭示上升銷機構之文獻，有專利文獻3、4。 又，本令請人提案可對處理對象構件均一地執行加熱處 理等之構件處理裝置。根據該技術，以又使處理對象構件 從待機位置前進至處理位置，使叉相對移動至複數條支持 線材之下方，從而以並列配置之複數條支持線材將處理對 象構件支持於處理位置。 該狀態下，藉由又移動機構使位於複數條支持線材下方 之叉從處理位置後退至待機位置。如此狀態下，對以複數 條支持線材支持於處理位置之對象構件以平板加熱器執行 158694.doc 201221883 加熱處理（專利文獻5)。 先行技術文獻 專利文獻 專利文獻1:曰本特開平10-76211號公報 專利文獻2:曰本特開2006-061755號公報 專利文獻3:日本特開2009-94 182號公報 專利文獻4:國際公開W02008/029943說明書 專利文獻5:日本特開2010-149953號公報 【發明内容】 但，專利文獻1〜4之處理裝置中’藉由上升銷機構之可 動銷與不動銷在複數部位水平地點狀支持平板狀處理對象 構件。 因此，藉由可動銷與不動銷之處理對象構件之支持位置 上，應力及傳熱集中成點狀，對處理對象構件均一地執行 加熱處理或減壓乾燥等特定處理較困難。 又，專利文獻5之構件處理裝置中，由於以複數條支持 線材將處理對象構件支持於處理位置，因此相比如專利文 獻1〜4以銷支持之情形’可對處理對象構件均—地執行加 熱處理或減壓乾燥等特定處理…即使如此亦會在支持 線材所支持之部分盥不去牲 +叉符之。卩刀對加熱處理或減壓乾燥 荨特定處理產生不均” 本發明係鑑於如上& + & & _ 對象構件均地P。 &成者、、提供-種可對處理 理均-地執行加熱處理或㈣乾燥等敎處理之處 I58694.doc 201221883 根據本發明’提供—種處理裝置，其係將平板狀構件配 置於處理位置上並執行處理者，其具備：第-線材部及第 一線材部’其在俯視觀察下使前述平板狀構件跨越配置， 用以從下方側支持前述平板狀構件；驅動部，其用以使前 :第一線材部相對於前述第二線材部於上下方向相對移 二，使上下方向之第一線材部與第二線材部之位置關係逆 移機構’其使前述第—線材部相對於前述第二線材 m向相對移動；及處理部，其龍支持於前述第 一!述第二線材部之前述平板狀構件實施處理。 部相對於第二線材部於上動部’其使第-線材 幻#笛一㈣ 下方向相對移動；及位移機構， :- ^相對於第二線材部於水平方 :此，例如於第-線材部支持成為 ： 件後，可使第-線材部比第：線之千板狀構 而使平板狀構件支持於第二線材部上。料此二目對移動， 材部支持平板狀構件之同—部位。再者止以線 部支持平板狀構件㈣，τ 胃由第二線材 部於水平方向相對移動。JL後，若使°Μ目對於第二線材 r材部於上方相對移動二 狀構件。在藉由第二錄田弟線材部支持平板 由第-線材部支持前述構;，::=:之:驟前後雖是 述構件之步驟前後，第—μ μ由第二線材部支持前 係在错由第-结丄 158694.doc 第—線材部支持平板狀構件 201221883 期間，使第一線材部相對於第二線材部於水平方向 L二限於此T在藉由第一線材部支持平板= 使第一線材>=»卩於水平方向相對移動。 不發明中 力 、’ α银数條線材構成之情形 中’只要使至少-部分線材相對於構成第二線材 於上下方向驅動，而使構成第一線材部之線材之位 對調=第二線材部之線材之位置於上下方向之位置關係 另，要使前述第一線材部相對於前述第二線材部於上下 方向相對移動，可使第一線材部於上下方向移動，亦可使 第二線材部於上下方向移動，再者亦可使第一線材部及第 一線材部兩方於上下方向移動。 另，本發明之各種構成要素未必—定各自獨立存在可 :复數之構成要素作為一個構件形成，或一個構成要素以複 數之構件形成，或某構成要素係其他構成要素之一部分， 或某構成要素之—部分與其他構成要素之—部分重複等。 再者’以下實施形態中，規定前後左右上下方向，但此 係用以簡單說明本發明之構成要素之相對關係而方便規定 者’並非用來限；t實施本發明之情形之製造時或使用時之 方向β 月J後左右上下方向無需完全幾何學正交，只要相對 性成别後左右上下之方向即可，例如各方向亦可向任意方 向傾斜。 例如本發明巾邱· + 4 i 斤β之在上下方向相對移動，意指作為位 15S694.doc 201221883 移結果在上下方向不同位置移動，位移之方向本身無需為 表面嚴密之上下方向。 發明之效果 根據本發明之處理裝置，可對成處理對象之構件均一地 執行加熱處理或減壓乾燥等特定處理。 【實施方式】 上述目的及其他目的、特徵及優點藉由以下所述之較佳 實施形態、及附加於其之以下附圖進而明瞭。 以下參照附圖說明本發明之第一實施形態。另，本實施 形態中如圖示除上下方向外亦規定前後左右方向說明。但 此係用以簡單說明構成要素之相對關係而方便規定者。因 此，並非用來限定實施本發明之製品之製造時或使用時之 方向。 另’前後左右方向係沿著水平方向之方向，前後方向與 左右方向正交。 首先針對本實施形態之處理裝置100之概要進行說明。 處理裝置100即所謂預先烘烤裝置。處理裝置100中.，將 用於液晶面板之玻璃基板或印刷佈線基板等基板之平板狀 處理對象構件GB配置於處理位置BP，執行特定處理之加 熱處理。 該處理裝置100係將平板狀構件（處理對象構件GB)配置 於處理位置BP(參照圖5)而執行處理者。如圖1及圖2所 示，該處理裝置100具備：第一線材部112及第2線材部 122，其在俯視觀察下以處理對象構件GB跨越之方式配 158694.doc 201221883 置，且從下方側支持處理對象構件GB ;驅動部（上下機 構）113，其使第—線材部112相對於第二線材部122於上下 方向相對移動；位移機構（位移機構部132、134)，其使前 述第-線材部112相對於前述第二線材部122於水平方向相 對移動；及處理部130，其對支持於第-線材部112或第二 線材部122之處理對象構件（]^實施處理。 接者，針對本實施形態之處理裝置100詳細說明。 第一線材部112具有複數條（本實施形態中4條）第一線材 112A。複數條第一線材⑴八亦如圖i、2所示互相平行配 置，向前後方向延伸。 各第一線材112Λ張架於一對對向配置之第一軸（處理上 下軸)111之上端。對向配置之一對第一軸i"設於分別對向 配置之-對支持台117(第—單元部）上。各支持台m上以 從各支持台117突出之方式設有複數根軸1Ue 換吕之，以複數條第一線材丨12Α、分別橫架第一線材 112Α之複數對第一軸lu與一對支持台117構成第一單元 110 〇 設於各支持台U7之複數根軸111於左右方向並列平行配 置。 根據本實施形態，第一單元110複數個於左右方向分離 配置。處理裝置100中各第一線材112A互相平行配置。 第一線材112A例如包含：使具有20(rc以上耐熱性之金 屬系芳綸纖維或聚醯亞胺纖維等人工纖維或金屬芯線通過 氟系樹脂皆之線，或將前述人工纖維或金屬芯線以氟系樹 158694.doc 201221883 脂實施塗層之線等。因此，第一線材U2A包含與長度方向 正父之剖面面積充分小之線材，物理性上熱容量亦比處理 對象構件GB充分小。 另’構成後述第二線材部122之第二線材亦可以與第一 線材112A相同材料之線構成，又，第二線材亦可以與第一 線材112A不同之材料，例如熱容量比第一線材U2A大之 材料之線構成。 圖4所示之驅動部U3係用以使第一線材部112於上下方 向驅動者。如圖4所示，驅動部113具有：連接於各第一軸 111之偏心凸輪115 ;用以驅動該偏心凸輪115之驅動轴 114 ;用以驅動驅動軸114之驅動馬達116(參照圖1、2)。1 條驅動軸114與沿著左右方向排列之複數個支持台117連 通，連結於一個驅動馬達116。又，於支持台117之内部收 納有複數個例如4個偏心凸輪115，各偏心凸輪115上固定 有第一軸111 ^因此第一軸U1在上下方向自如位移地設於 支持台117上。 換言之，分別支持複數個第一單元11〇之複數條第一線 材112A之一端部之複數個第一軸1U分別經由偏心凸輪 固定於同-驅動軸114上。又，分別支持複數個第一單元 11〇之複數條第一線材112A之另一端部之複數個第一軸U1 分別經由偏心凸輪115固定於另一同一前述驅動軸^々上。 驅動部113在各第一單元110中，使複數對第一軸丨丨丨每 一對選擇性上升或下降。 再者，根據本實施形態，如圖3所示，處理對象構件仙 158694.doc 201221883 區分成複數個區域HS與區域DS。區域HS係熱處理後所利 用之部分（處理對象區域），區域DS係熱處理後未利用之部 分。區域HS於水平方向，具體言之於前後方向及左右方向 空出特定間隔配置，區域HS間變成區域DS。複數條第一 線材112A配置於支持複數個區域HS之位置上。構成第二 線材部122之第二線材位在主要支持區域ds之位置上，但 亦可配置於支持區域HS之位置上。 再者’本實施形態之處理裝置1〇〇具有第二線材部122。 第二線材部122在本實施形態中以〗條第二線材構成。 並且，第一線材其端部固定於一對第二軸121上，橫架 於一對第二軸121間。一對第二軸121設於分別對向配置之 支持台127上。各支持台127上以從支持台127突出之方式 設有1條第二轴121。第二轴121於上下方向位移自如地被 支持於支持台（第二單元部）127上。 換言之，以第二線材、橫架第二線材之一對第二軸i2i 與一對支持台127構成第二單元12〇。 根據本貫施形態，第二單元12〇在對應於區域之位置 複數個左右方向分離配置。複數個第二單元12〇之第二線 材互相平行配置。 又，根據本實施形態，第二單元12〇與第一單元削沿著 —右方向交互配置。並且第—線材心與第二線材互相平 再者，處理裝置1〇〇具有 之驅動部（未圖示）。具體言 用以於上下方向驅動第二線材 之，具有使對向配置之橫架^条 158694.doc 201221883 第二線材之一對第二軸121上下驅動之螺線管等驅動機 構。以該螺線管等驅動機構與驅動部113，構成使第一線 材部112與第二線材部122相對地在上下方向移動之驅動 部。 再者，如圖1及圖2所示’本實施形態之處理裝置1〇〇具 有位移機構部132，其具有··搭載有複數個第一單元11〇並 於左右方向滑動自如之一個第一基底131;及使第一基底 131於左右方向位移之馬達（移動機構）132 A。 位移機構部132係用以使第一線材部丨12相對於第二線材 部122相對在水平方向（本實施形態中左右方向）移動者。例 如位移機構部132具備：脈衝馬達132A ;藉由脈衝馬達 132A旋轉之進給螺桿13窈；及藉由進給螺桿^⑸之旋轉 而於左右方向直線移動之第一基底131。 第一基底131係平面矩形形狀之平板狀構件，於該第一 基底上搭載有複數個第—單元11〇。沿著第一基底i3i 之對向之-對邊上分離配置支持台117。另，第一基底i3i 於未圖示之軌道上移動。例如亦可為於第一基底i3i上設 置轉動體即輪胎或親子’而於軌道上滾動移動者。又，第 基底131亦可在藉由空氣而上浮於軌道上之狀態下於軌 道上移動。如此而可抑制因第一基底131移動而產生微 粒。 位移機構部U2使第-線材部112於水平方向移動，但第 一線材部112主要在處理對象椹处* 处王对象構件GB之下方區域内移動。 惟在熱處理中，亦可以筮_ & u201221883 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a processing apparatus that performs a specific process on a flat member. [Prior Art] When the processing target member such as a glass substrate is heat-treated by a heat treatment device as a processing device, the fixed pin (fixed pin) and the movable pin support processing target member of the rising pin mechanism (for example, refer to Patent Document 丨, 2) ). In the ascending pin mechanism disclosed in Patent Document 1, the substrate is supported by the movable pin and the fixed pin. On the other hand, in the ascending pin mechanism disclosed in Patent Document 2, the movable pin moves in the vertical direction and the horizontal direction. The moving member is supported by the rising movable support and moved in the horizontal direction, so that the movable pin is lowered to be supported by the non-moving pin. By repeating this operation, the position at which the movable pin and the fixed pin come into contact with the processing target member is constantly changed, and the temperature unevenness of the processing target member due to the pin contact is suppressed. Further, as documents for revealing the upselling mechanism, there are Patent Documents 3 and 4. In addition, the present invention has proposed a component processing apparatus that can perform heat treatment or the like uniformly on the processing target member. According to this technique, the processing target member is further advanced from the standby position to the processing position, and the fork is relatively moved below the plurality of support wires, thereby supporting the processing member in the processing position by a plurality of support wires arranged in parallel. In this state, the fork located below the plurality of support wires is retracted from the processing position to the standby position by the moving mechanism. In this state, the object member supported by the plurality of support wires at the processing position is subjected to heat treatment by a flat heater (158694.doc 201221883) (Patent Document 5). CITATION LIST Patent Literature Patent Literature 1: Japanese Patent Application Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. In the processing device of Patent Documents 1 to 4, 'the movable pin and the non-moving pin of the rising pin mechanism support the horizontal position in the plurality of parts in the processing device of the patent documents 1 to 4 A flat object to be processed. Therefore, stress and heat transfer are concentrated in a dot shape at the support position of the member to be processed by the movable pin and the non-moving pin, and it is difficult to uniformly perform specific processing such as heat treatment or reduced-pressure drying on the member to be processed. Further, in the member processing apparatus of the patent document 5, since the processing target member is supported at the processing position by a plurality of support wires, heating can be performed uniformly on the processing target member as compared with the case of pin support as in Patent Documents 1 to 4. Specific treatments such as treatment or decompression drying... Even so, it will not be able to support the parts supported by the wire. The boring tool produces unevenness in heat treatment or decompression drying 荨 specific treatment. The present invention is directed to the above & + && _ object components are uniformly P. & Where the heat treatment or (4) drying or the like is performed, I58694.doc 201221883 According to the present invention, there is provided a processing apparatus for arranging a flat member at a processing position and executing a processor, comprising: a first wire portion and a first wire portion ′ that positions the flat member in a plan view to support the flat member from a lower side; and a driving portion for causing a front portion of the first wire portion to be opposite to the second wire portion The vertical direction is shifted by two, and the positional relationship between the first wire portion and the second wire portion in the vertical direction is reversed to move the first wire portion relative to the second wire m; and the processing portion is Supporting the processing of the flat member of the second wire portion of the first embodiment described above. The portion is relatively moved relative to the second wire portion in the upper moving portion 'the second wire portion is rotated downward; and the displacement machine Structure: :- ^ Relative to the second wire portion on the horizontal side: Here, for example, after the first wire portion is supported as a piece, the first wire portion can be made to support the flat member than the first wire; On the second wire portion, the two meshes are moved, and the material portion supports the same portion of the flat member. Further, the wire portion supports the flat member (4), and the τ stomach is relatively moved in the horizontal direction by the second wire portion. After JL, if the second wire r-shaped portion is relatively moved above the two-shaped member, the second wire member supports the flat plate by the first-wire portion to support the structure;;::=: Before and after the step of the member, the first μm portion is opposite to the first wire portion supported by the second wire portion before the first wire member supports the flat member 201221883 by the first wire member 158694.doc. The second wire portion is limited to the horizontal direction L2, and the T is supported by the first wire portion. The first wire is relatively moved in the horizontal direction. In the case of 'as long as at least - part of the wire relative to the second line The position of the wire constituting the first wire portion is reversed to the position of the wire of the second wire portion in the vertical direction, and the first wire portion is moved up and down with respect to the second wire portion. When the direction is relatively moved, the first wire portion can be moved in the vertical direction, and the second wire portion can be moved in the vertical direction. Further, the first wire portion and the first wire portion can be moved in the vertical direction. The various constituent elements of the present invention are not necessarily independent of each other: a plurality of constituent elements are formed as one member, or one constituent element is formed by a plurality of components, or a constituent element is a part of other constituent elements, or a constituent element - Part of the other components - part of the repetition. Further, in the following embodiments, the front, rear, left, and right directions are defined, but the present invention is used to simply describe the relative relationship of the constituent elements of the present invention, and is convenient for the user to define the present invention. In the direction of time β, the left and right directions after the month J need not be completely geometrically orthogonal, as long as the relative orientation is different, then the direction may be left and right. For example, the directions may be inclined in any direction. For example, the towel of the present invention has a relative movement in the up-and-down direction, which means that the movement is performed at different positions in the up-and-down direction as a result of the movement of the position 15S694.doc 201221883, and the direction of the displacement itself does not need to be a strict upper and lower direction of the surface. Advantageous Effects of Invention According to the processing apparatus of the present invention, it is possible to uniformly perform specific processing such as heat treatment or reduced-pressure drying on the members to be processed. The above and other objects, features, and advantages of the invention will be apparent from the appended claims appended claims Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. Further, in the present embodiment, the front, rear, left and right directions are also specified in addition to the vertical direction as shown. However, this is used to briefly describe the relative relationship of the constituent elements and to facilitate the stipulation. Therefore, it is not intended to limit the direction of manufacture or use of the articles of the invention. The other front and rear directions are in the horizontal direction, and the front-rear direction is orthogonal to the left-right direction. First, the outline of the processing apparatus 100 of the present embodiment will be described. The processing device 100 is a so-called pre-baking device. In the processing apparatus 100, the flat processing target member GB for the substrate such as the glass substrate or the printed wiring board of the liquid crystal panel is placed at the processing position BP, and the heat treatment for the specific processing is performed. In the processing apparatus 100, the flat member (processing target member GB) is placed at the processing position BP (see Fig. 5) to execute the processor. As shown in FIG. 1 and FIG. 2, the processing apparatus 100 includes a first wire portion 112 and a second wire portion 122 which are disposed with a processing target member GB spanning in a plan view, and are disposed 158694.doc 201221883, and from below. The side support processing target member GB; the driving portion (upper and lower mechanism) 113 that relatively moves the first wire portion 112 in the vertical direction with respect to the second wire portion 122; and the displacement mechanism (displacement mechanism portion 132, 134) that makes the aforementioned The wire portion 112 relatively moves in the horizontal direction with respect to the second wire portion 122, and the processing portion 130 performs processing on the processing target member supported by the first wire portion 112 or the second wire portion 122. The first wire member 112 has a plurality of (four in the present embodiment) first wire members 112A. The plurality of first wires (1) eight are also parallel to each other as shown in FIGS. Arrangement, extending in the forward and backward directions. Each of the first wires 112 is stretched over a pair of oppositely disposed first shafts (processing upper and lower shafts) 111. One of the opposite configurations is disposed on the first axis i" - support 117 (the first unit). Each of the support bases m is provided with a plurality of shafts 1Ue in a manner protruding from the respective support bases 117, and the plurality of first wires 丨12Α are respectively arranged, and the first wires 112 are respectively traversed. The plurality of first shafts lu and the pair of support bases 117 constitute a first unit 110. The plurality of shafts 111 disposed on the respective support bases U7 are arranged in parallel in the left-right direction. According to the present embodiment, the first unit 110 is plural in the left-right direction. The first wire 112A is disposed in parallel with each other in the processing device 100. The first wire 112A includes, for example, a synthetic fiber or a metal core wire having a metal-based aramid fiber or a polyimide fiber having a heat resistance of 20 or more. A line of a fluorine-based resin, or a line in which the artificial fiber or the metal core wire is coated with a fluorine-based tree 158694.doc 201221883 grease, etc. Therefore, the first wire U2A includes a wire having a sufficiently small cross-sectional area with respect to the longitudinal direction of the father. The physical heat capacity is also sufficiently smaller than the processing target member GB. The second wire constituting the second wire portion 122, which will be described later, may be formed of the same material as the first wire 112A, and second. The wire may be made of a material different from the first wire 112A, for example, a wire having a larger heat capacity than the first wire U2A. The driving portion U3 shown in Fig. 4 is for driving the first wire portion 112 in the vertical direction. As shown in FIG. 4, the driving portion 113 has: an eccentric cam 115 connected to each of the first shafts 111; a driving shaft 114 for driving the eccentric cam 115; and a driving motor 116 for driving the driving shaft 114 (refer to Figs. One drive shaft 114 communicates with a plurality of support tables 117 arranged in the left-right direction, and is coupled to one drive motor 116. Further, a plurality of, for example, four eccentric cams 115 are accommodated in the support base 117, and the first shaft 111 is fixed to each of the eccentric cams 115. Therefore, the first shaft U1 is movably disposed on the support base 117 in the vertical direction. In other words, the plurality of first axes 1U supporting the ends of the plurality of first wires 112A of the plurality of first cells 11A are respectively fixed to the same-drive shaft 114 via the eccentric cams. Further, a plurality of first axes U1 supporting the other end portions of the plurality of first wires 112A of the plurality of first cells 11A are respectively fixed to the other same drive shaft via the eccentric cam 115. The drive unit 113 selectively increases or decreases each of the first axes 110 in each of the first units 110. Further, according to the present embodiment, as shown in Fig. 3, the processing target component 158694.doc 201221883 is divided into a plurality of regions HS and a region DS. The portion of the area where the HS is used after the heat treatment (the treatment target area) and the area DS are not used after the heat treatment. The area HS is arranged in a horizontal direction, specifically, in a front-rear direction and a left-right direction, and the area HS becomes an area DS. The plurality of first wires 112A are disposed at positions supporting a plurality of regions HS. The second wire constituting the second wire portion 122 is located at the position of the main support region ds, but may be disposed at the position of the support region HS. Further, the processing apparatus 1 of the present embodiment has the second wire portion 122. In the present embodiment, the second wire portion 122 is formed of a second wire. Further, the end portion of the first wire is fixed to the pair of second shafts 121 and is horizontally disposed between the pair of second shafts 121. A pair of second shafts 121 are provided on the support tables 127 which are disposed opposite each other. Each of the support bases 127 is provided with one second shaft 121 so as to protrude from the support base 127. The second shaft 121 is movably supported by the support table (second unit portion) 127 in the vertical direction. In other words, the second unit 12 is formed by the pair of the second wire i2i and the pair of support tables 127 in one of the second wire and the second wire of the transverse frame. According to the present embodiment, the second unit 12 is disposed in a plurality of left and right directions at positions corresponding to the regions. The second wires of the plurality of second cells 12 are arranged in parallel with each other. Further, according to the present embodiment, the second unit 12A and the first unit are alternately arranged in the right direction. Further, the first wire core and the second wire are flush with each other, and the processing device 1 has a driving portion (not shown). Specifically, the driving mechanism for driving the second wire in the up-and-down direction has a solenoid such as one of the second wire members 158694.doc 201221883 and the second wire 121 is driven up and down. The drive mechanism such as the solenoid and the drive unit 113 constitute a drive unit that moves the first wire portion 112 and the second wire portion 122 in the vertical direction. Further, as shown in FIG. 1 and FIG. 2, the processing apparatus 1 of the present embodiment includes a displacement mechanism unit 132 having a plurality of first units 11 搭载 and slidable in the left-right direction. a base 131; and a motor (moving mechanism) 132 A that displaces the first base 131 in the left-right direction. The displacement mechanism portion 132 is for moving the first wire portion 相对12 relative to the second wire portion 122 in the horizontal direction (the horizontal direction in the present embodiment). For example, the displacement mechanism portion 132 includes a pulse motor 132A, a feed screw 13A that is rotated by the pulse motor 132A, and a first substrate 131 that linearly moves in the left-right direction by the rotation of the feed screw (5). The first substrate 131 is a flat member having a planar rectangular shape, and a plurality of first cells 11 are mounted on the first substrate. The support table 117 is disposed along the opposite side of the first substrate i3i on the opposite side. Further, the first substrate i3i moves on a track (not shown). For example, it is also possible to provide a tire or a parent who is a rotating body on the first substrate i3i and to move on the track. Further, the first base 131 can also be moved on the rail in a state of floating up on the rail by air. Thus, generation of fine particles due to the movement of the first substrate 131 can be suppressed. The displacement mechanism portion U2 moves the first wire portion 112 in the horizontal direction, but the first wire portion 112 mainly moves in the lower region of the king object member GB at the processing target **. However, in the heat treatment, you can also 筮 _ & u
第線材部112從處理對象構件GB 158694.doc •11· 201221883 伸出之方式於水平方向移動。 又’本實施形態之處理裝置100具有位移機構部！34，位 移機構部134具有：搭載有第二單元12〇並於左右方向滑動 自如之一個第二基底133 ;及使第二基底133於左右方向位 移之馬達134A。 位移機構部134係用以使第二線材部122相對於第一線材 部112於水平方向（本實施形態中為左右方向）相對移動者。 例如位移機構部134具備：脈衝馬達134A;藉由脈衝馬達 134A而旋轉之進給螺桿134B ;及藉由進給螺桿13牝之旋 轉而於左右方向直線移動之第二基底133。 第二基底133係平面矩形形狀之平板狀構件，於該第二 基底133上搭載有複數個第二單元12〇。支持台m沿著第 一基底133之對向之一對邊而分離配置。另，第二基底Η] 於未圖不之軌道上移動》例如，亦可為於第二基底133上 設置轉動體即輪胎或輥子而於軌道上滾動移動者。又，第 二基底133亦可在藉由空氣而上浮於執道上之狀態下於軌 道上移動。如此而可抑㈣第：基底133移動*產生微 粒0 位移機構部丨34使第二線材部122於水平方向移動，但第 二線材部122在處理對象構件GB之下方區域内移動。即， 熱處理中’不會以第二線材部122從處理對象構件伸出 之方式於水平方向移動。 再者，如圖3及圖5所示，本實施开;{能占 貝她小態之處理裝置100亦 具有：又140，其以通過橫架之複數條笙 双條第一線材部112之間 158694.doc -12- 201221883 隙之形狀之至少一對爪141大致水平地支持處理對象構件 GB ;及前後移動機構（未圖示），其使又14〇前後移動於待 機位置WP與處理位置bp。 使又140在至少處理位置Bp相對移動於複數條第二線材 部122之第二線材的上方與下方。更具體言之如圖5⑷所 示，驅動部使配置於比又14〇下方之初始位置之第二線材 部I22之第二線材上升，從又丨4〇接收處理位置31>之處理對 象構件GB。 但，亦可使第二線材部122之第二線材上升，使搬入於 比其上方之又140下降，使處娌對象構件GB支持於第二線 材部122之第二線材上（未圖示）。 又，本實施形態之處理裝置100進而具有平板加熱器 130，其對以複數條第一線材112八支持於處理位置之處 理對象構件GB實施作為特定處理之加熱處理。 該平板加熱器（構件處理機❹3〇形&為與處理對象構 件GB同等之平板狀（平面矩形形狀），如圖3所示，在其前 後方向之緣部’於左右方向排列有五對第二單元12〇與四 對第-單元no。上述平板加熱器130例如以8〇〜15代從下 方加熱處理以複數條第-線材112入支持⑨處理位置抑之 處理對象構件GB。 另，平板加熱器13〇設於基底131之上部，但從基底i3i 分離。平板加熱器130係不隨基底131等之移動而移動，係 固定者。 如上述之構成中 本實施形態之處理裝置100如前述 158694.doc -13- 201221883 將平板狀處理對象構件GB從後方之待機位置WP搬入至處 理位置BP，執行加熱處理。 參照圖5及圖6進行說明。圖5係與左右方向正交地觀察 圖1之處理裝置100之圖，圖6係與前後方向正交地觀察圖j 之處理裝置100之圖。 更詳細言之’如圖5(a)所示，本實施形態之處理裝置ι〇〇The first wire portion 112 is moved in the horizontal direction so as to extend from the processing target member GB 158694.doc •11·201221883. Further, the processing apparatus 100 of the present embodiment has a displacement mechanism unit! 34. The displacement mechanism unit 134 has a second base 133 on which the second unit 12A is mounted and slidable in the left-right direction, and a motor 134A that moves the second base 133 in the left-right direction. The displacement mechanism portion 134 is configured to relatively move the second wire portion 122 relative to the first wire portion 112 in the horizontal direction (the left-right direction in the present embodiment). For example, the displacement mechanism unit 134 includes a pulse motor 134A, a feed screw 134B that is rotated by the pulse motor 134A, and a second base 133 that linearly moves in the left-right direction by the rotation of the feed screw 13A. The second substrate 133 is a flat member having a planar rectangular shape, and a plurality of second units 12 are mounted on the second substrate 133. The support table m is disposed apart along one of the opposite sides of the first substrate 133. Further, the second substrate 移动] is moved on the track which is not shown. For example, it is also possible to provide a rotating body, that is, a tire or a roller, on the second substrate 133 to roll the person on the track. Further, the second base 133 can also be moved on the track in a state of being floated on the road by air. In this way, the fourth substrate 133 is moved* to generate the microparticles 0. The displacement mechanism portion 34 moves the second wire portion 122 in the horizontal direction, but the second wire portion 122 moves in the lower region of the processing target member GB. In other words, in the heat treatment, the second wire portion 122 does not move in the horizontal direction so as to protrude from the processing target member. Furthermore, as shown in FIG. 3 and FIG. 5, the present embodiment is open; the processing device 100 capable of occupying her small state also has: 140, which is a plurality of first wire portions 112 that pass through a plurality of transverse frames. 158694.doc -12-201221883 The at least one pair of claws 141 of the shape of the gap substantially support the processing target member GB; and the front and rear moving mechanism (not shown), which moves the 14 〇 back and forth to the standby position WP and the processing position Bp. The further 140 is relatively moved above and below the second wire of the plurality of second wire portions 122 at at least the processing position Bp. More specifically, as shown in Fig. 5 (4), the drive unit raises the second wire of the second wire portion I22 disposed at an initial position lower than 14 〇, and receives the processing target member 3 from the processing position 31 > . However, the second wire of the second wire portion 122 may be raised to lower the load 140, and the upper object member GB may be supported by the second wire member of the second wire portion 122 (not shown). . Further, the processing apparatus 100 of the present embodiment further includes a flat panel heater 130 that performs heating processing as a specific process on the processing target member GB supported by the plurality of first wires 112. The plate heater (the member processing machine 3 is formed in a flat shape (planar rectangular shape) equivalent to the processing target member GB, and as shown in FIG. 3, five pairs of the edge portions in the front-rear direction are arranged in the left-right direction. The second unit 12〇 and the four pairs of the unit-unit no. The flat panel heater 130 is heat-treated from below by, for example, 8 to 15 generations, and the plurality of first-wire members 112 are supported by the processing target member GB. The plate heater 13 is disposed on the upper portion of the base 131, but is separated from the base i3i. The plate heater 130 does not move with the movement of the base 131 or the like, and is fixed. The processing device 100 of the present embodiment is configured as described above. 158694.doc -13 - 201221883 The flat processing target member GB is carried from the rear standby position WP to the processing position BP, and heat processing is performed. This will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is observed orthogonally to the left and right direction. FIG. 6 is a view of the processing apparatus 100 of FIG. 1 viewed orthogonally to the front-rear direction. More specifically, as shown in FIG. 5(a), the processing apparatus of the present embodiment is 〇 〇
在初始狀態下’構成第一線材部112之所有第一線材U2A 及第二線材部122下降。並且’藉由位於比該等線材上方 之待機位置WP之又140，而大致水平地支持處理對象構件 GB。 接著’如圖5(b)所示’該叉140藉由又移動機構從待機 位置WP前進至處理位置Βρβ此時，叉ι4〇位於比構成第一 線材部112之所有第一線材112八及第二線材部122上方。 接著’如圖5(c)、圖6(a)所示，所有第二轴121上升，沿 著左右方向排列之複數條第二線材部122朝上方同樣移 動。藉此，如圖3所示，處理對象構件GB在區域DS之位置 上’藉由第二線材部122之第二線材支持（處理S1)。 如此狀態下’如圖5(c)所示’又140從處理位置bp退避 至待機位置WP。接著，如圖5(d)及圖6(b)所示，第二軸 121下降，伴隨於此，支持處理對象構件GB之第二線材部 122下降。另一方面，藉由第一軸111上升，第一線材112Λ 上升而藉由第一線材112A在區域HS之位置支持處理對 象構件GB。 此處，各第一單元110中，對向之一對軸lu上升，一條 158694.doc 14· 201221883 第一線材112A上升。各第一單元11()中，其他第一線材 112A不上升。又，各第—單元11〇中，位在共通位置例如 從右配置於第1號之第一線材n2A上升。 又’將支持於第二線材部122之處理對象構件GB交接於 第一線材112A時，處理對象構件GB之高度位置不變動較 佳。即，使第一線材部112A上升至支持處理對象構件GB 之第二線材部112之高度後，使第二線材部丨22下降較佳。 另，後段步驟中亦相同，在第二線材部122及第一線材部 112A間交接處理對象構件(53時，處理對象構件GB之高度 位置不變動較佳。 如此狀態下藉由平板加熱器13〇加熱處理處理對象構件 GB。但各第一單元11〇中，在區*HS支持處理對象構件 GB之第一線材112A變成4條中每一條依次上升，三條下降 之狀態。不會以-條第-線材112續續支持處理對象構件 GB。 更詳細說明，如圖6(b)、（c)所示，各第一單元11〇中， 複數條第一線材⑴八中藉由條第一線材1UA支持處理 對象構件GB 〇接著，橫架不支持處理對象構件GB之第以条 第-線材心之一對第一轴m上升，藉由上升之第一線 材mA支持處理對象構件GB。另—方面，^夺處理對象 構件GB之第i條第一線材U2A下降，變成不支持處理對象 構件GB之狀態。 接著，橫架不1持處理對象構件⑽之第3條第一線材 112A之一對第一轴111上升’藉由上升之第-線材U2A支 158694.doc -15- 201221883 持處理對象構件GB。另—方面，支持處理對象構件gb之 第2條第一線材112A下降，變成不支持處理對象構件gB之 狀態。 接著’橫架不支持處理對象構件GB之第4條第一線材 112A之一對第一軸ιη上升，藉由上升之第一線材U2A支 持處理對象構件GB。另一方面，支持處理對象構件GB之 第3條第一線材112a下降，變成不支持處理對象構件gb之 狀態（處理S2)。 如此’使複數條第一線材112A依次每1條上升之同時使 每一條下降。 另’各第一單元110中，使位在共通位置之第一線材 112A同步上升下降。 又’將一個第一線材112A所支持之處理對象構件GB交 接至另一第一線材U2A時，處理對象構件gb之高度位置 不變動較佳。即，使另一第一線材112A上升至支持處理對 象構件GB之一個第一線材112A之高度後，使一個第一線 材112A下降較佳。 此處’藉由第一線材部112支持處理對象構件GB期間， 第二線材部122變成下降狀態。然後，第二線材部122不支 持處理對象構件GB之狀態下，如圖6(c)所示，藉由位移機 構部134使全部第二線材部ία於左右方向滑動移動。本實 施形態之處理裝置1〇〇中，第二線材部122定期上升並支持 處理對象構件GB，但第二線材部122上升並支持處理對象 構件GB時’將在與前次（滑動前）不同之位置支持處理對象 158694.doc -16 - 201221883 構件GB(參照圖6(d))。 接著，各第一單元110中，從第！條第一線材U2A至第4 條第一線材112A依次支持處理對象構件GB後，第二線材 部122上升（處理S3)。其後，使第4條第一線材112A下降。 藉此，藉由第二線材部122支持處理對象構件GB。其後， 如圖6(d)所示，藉由位移機構部132使全部第一線材部U2 於左右方向滑動移動。接著，如圖6(e)所示，使第j條第一 線材122A上升之同時使第二線材部122下降，藉由第1條第 一線材112 A在與滑動前不同之位置支持處理對象構件 GB。但第一線材112 A在處理對象構件gb之區域liS内支持 處理對象構件GB。然後與處理S2相同，使複數條第一線 材112 A依次每1條上升並每1條下降，在第一線材丨丨2 a間 進行處理對象構件GB之交接（處理S4)。 第二線材部122下降，變成第二線材部122不支持處理對 象構件GB之狀態後，如圖6(f)所示，藉由位移機構部j 34 使全部第一線材部122於左右方向滑動移動（處理|§5) β接 著’第一線材部122上升並支持處理對象構件gb時，將在 與前次（滑動前）不同之位置支持處理對象構件GB。以下重 複處理S1〜處理S5之步驟。但亦有第二線材部122藉由滑動 在處理對象構件GB之區域HS内支持處理對象構件gB之情 形。 如上述之處理對象構件GB之加熱處理結束後，藉由相 反執行前述圖5(a)〜(d)之動作’將經加熱處理之處理對象 構件GB搬出至待機位置WP。 158694.doc •17· 201221883 接著，針對本實施形態之效果進行說明。 根據本實施形態，以第一線材112Α支持處理對象構件 GB後，使第一線材112Α下降，使第二線材部122上升。其 後使基底13 1滑動。接著使第二線材部丨22下降，使第一線 材112Α上升，從而可錯開第二線材部112支持處理對象構 件GB之步驟前後之第一線材112八之位置。藉此，可防止 以第一線材112Α支持處理對象構件（38之相同位置對處 理對象構件GB均一地執行加熱處理。 再者，以第一線材112Α支持處理對象構件GB期間，可 使基底133滑動，並位移第二線材部122之左右方向之位 置。藉此亦可對處理對象構件〇8均一地執行加熱處理。 本實施形態之處理裝置100中，如上述，使複數條第一 線材112Α每1條依次上升之同時依次下降。藉此，可防止 以-個第-，線材112Α持續支持處理對象構件仰。因此可 對處理對象構件GB均一地執行加熱處理。 再者，由於在第-線材112Α間交接處理對象構件GB， 因此支持處理對象構件〇3時之應力亦不會局部集中。因 此處理對象構件GB亦不會產生因應力集中而變形等地進 行加熱處理。 各第-單元上僅有i條第—線材之情形中，考慮到對處 理對象構件GB之應力負擔等’需要頻繁進行第-線材部 及第二線材部間之處理對象構件〇6之交接。 相對於此’根據本實施形態’可於各第一單元上嗲 置複數條第-線材112A，在第—線材U2a間進行處理: 158694.doc -18- 201221883 象構件GB之交接，因此不頻繁進行第_線材部ιΐ2及第二 線材部122間之處理對象構件GB之交接即可完成。 又於各第單疋上僅有i條第—線材之情形中，為防 止在相㈣位支持處理對㈣件仙，”要頻繁滑動第 一線材部及第二線材部’有處理裝置之處理性變差之虞。 相對於此，根據本實施形態，於各第一單元ιι〇上設有 複數條第-線材112A，在第—線材U2—進行處理對象 構件GB之交接期間，可有餘裕地使第二線材部122於左右 方向滑動’不頻繁滑動第-線材部122及第二線材部122即 可，因此可成為處理性優良之裝置。 再者，可在熱處理後未利用之區域〇8藉由第二線材部 122支持搬入於處理位置Bp之處理對象構件〇8，因此可將 對熱處理後利用之區域HS之第二線材部122之支持之影響 抑制在最小限度。 並且第一線材Π2Α如前述，剖面積與熱容量充分小，因 此熱傳導亦降低。因此可抑制藉由平板加熱器13〇加熱處 理之處理對象構件GB之溫度分佈之偏差，可均一地加熱 處理處理對象構件GB。 再者，本實施形態之處理裝置1〇〇中，藉由一個驅動馬 達116在複數個第一單元110上使四根第一軸lu同樣地上 下移動，因此其結構簡單且確實第一線材112A之上下移動 同步。 又，根據本實施形態，使第一線材部丨12、第二線材部 122中，不支持處理對象構件GB之線材部於水平方向移 158694.doc •19- 201221883 動。因此可防止伴隨線材部之水平方向之移動而處理對象 構件GB移動，處理對象構件GB在加熱處理中可停留於相 同位置β 此外，第一線材部112及第二線材部122間之處理對象構 件GB之交接時，及第一線材112 Α間之處理對象構件Gb之 交接時，處理對象構件GB之高度位置不變動。 因此’可防止移動處理對象構件GB而於周圍產生對 流，處理對象構件GB之溫度分佈產生變化，可高效地加 熱處理處理對象構件GB。 再者’根據本實施形態，使第一單元110與第二單元12〇 沿著左右方向交互配置。藉此，可穩定支持處理對象構件 GB 〇 又’根據本實施形態，將第一單元丨10搭載於第一基底 131，將第二單元120搭載於第二基底133。然後使第一 基底131與第二基底133直線移動，從而調整第一線材部 112、第二線材部122之水平方向之位置。僅滑動基底 131、133，即可調整第一線材部112、第二線材部122之水 平方向之位置，因此第一線材部112及第二線材部122之位 置調整較容易。又’僅使基底13 1、133沿著水平方向移 動，即可調整第一線材部112、第二線材部122之水平方向 之位置，其滑動量亦可適當簡單地設定。 另，本發明不限於本實施形態，在不脫離其主旨之範圍 内可允許各種變形。根據上述形態，例示熱處理中處理對 象構件GB不於水平方向滑動移動，但其亦可滑動移動。 158694.doc -20- 201221883 例如亦可在第一線材112 a支持處理對象構件GB之狀態 下，使基底131於水平方向移動β 又，根據上述形態，如圖3所示，例示為將處理對象區 域HS區分成2x4之處理對象構件Gb進行加熱處理，而排列 有5個第二單元120與4個第一單元η〇。 但當然該等單元可對應處理對象構件<30之區分而進行 各種佈局。再者，以對應於複數種處理對象構件GB之區 分之方式排列複數個第二單元12〇與複數個第一單元11〇， 使該複數個第二單元120與複數個第一單元11〇選擇性動 作，從而亦可對應於複數種處理對象構件GB(未圖示）。 再者，使複數個第二單元12〇與複數個第一單元11〇於左 右方向移動自如地配置，藉由變更該複數個第二單元12〇 與複數個第-單元HG之位置，從而亦可對應於複數種處 理對象構件GB (未圖示）。 另，根據上述形態’例示第'線材112八之剖面積與熱容 量充分小，從而降低熱傳導’而抑制藉由平板加熱器13〇 加熱處理之處理對象構件GB之溫度分佈之偏差。 當然’第-線材mA之剖面積或熱容量係將所允許之處 理對象構件GB之溫度分佈之偏差、用以支持處理對象構 件GB之強度制久性#作為條件㈣當規定。 再者，根據上述實施形態，如 如圖4所不’例不驅動部113 包含以共通之驅動轴114彡拄夕伯 叉持之偏心凸輪115，但亦可以曲 軸機構形成驅動部113 » 又，根據上述形態 例不處理裝置1〇〇藉由平板加熱器 158694.doc -21· 201221883 130從下方加熱處理處理對象構件GB。但亦可為藉由平板 加熱器130從上方加熱處理處理對象構件（}]8之處理裝置， 或藉由一對平板加熱器13〇從上方與下方兩方加熱處理處 理對象構件GB之處理裝置等（都未圖示）。 再者，根據上述形態，例示將藉由面板加熱器13〇加熱 處理處理對象構件GB之預烘烤裝置作為處理裝置1〇〇。 但，亦可將減壓乾燥處理對象構件GB之減壓乾燥裝置作 為處理裝置（未圖示）。例如亦可將前述實施形態之處理裝 置100配置於連接於真空泵等減壓機構之腔室内，構成減 壓乾燥裝置。 ' 再者，根據前述實施形態，使基底131、133沿著水平方 向移動，從而使第一線材部112、第二線材部122於水平方 向移動，但不限於此。例如亦可不設置基底133，使用基 底131，使第一線材部112相對於第二線材部122於水平= 向移動。 又，根據前述實施形態，第一線材部112以複數條第一 線材112A構成，但不限於此，亦可以丨條第一線材u2A構 成。如此而可謀求裝置之簡化。再者，第—線材112八為4 條’但*限於此。[線材112八為複數條之情科，例如 亦可為5條或3條。 再者，根據前述實施形態，使構成第一線材部ιΐ2之複 數條第-線材mA依次上升及下降，但不限於此，亦可_ 部分第-線材112A固定’另一部分第一線材U2A於上下 方向驅動。例如以-部分第—線材112A支持處理對象構件 158694.doc •22- 201221883 GB後’使另一部分第一線材1〗2A位於比一部分第一線材 H2A上方之方式驅動，藉由另一部分第一線材U2A支持 處理對象構件GB。其後，使另一部分第一線材丨]2A朝下 方驅動，對一部分第一線材U2A交接處理對象構件〇Β。 再者，根據前述實施形態，第一線材部丨12及第二線材 部122兩方於上下方向驅動，但不限於此，亦可僅任一方 線材部於上下方向驅動。 另’當然上述實施形態及複數之變形例可在其内容不相 反之範圍内進行組合。又，上述實施形態及變形例中，具 體說明各部分之結構等，但其結構等在滿足本申請發明之 範圍内可進行各種變更。 該申請主張基於2010年9月14曰申請之日本專利申請特 願2010-205527、日本專利申請特願2〇1〇_2〇5528之優先 權，此處援用其所有内容。 【圖式簡單說明】 圖1係顯示本發明之實施形態之處理裝置之内部結構之 模式化立體圖。 圖2係顯示處理裝置之内部結構之模式化立體圖。 圖3係顯示處理裝置之内部結構之模式化平面圖。 圖4係顯示驅動部之結構之側視圖。 圖5(a)-(d)係顯不處理裝置之動作之模式化步驟圖。 圖6(aHf)係顯示處理裝置之動作之模式化步驟圖。 【主要元件符號說明】 λ ° 100 處理裝置 158694.doc -23· 201221883 110 第一單元 111 第一軸 112 第一線材部 112A 第一線材 113 驅動部 114 驅動轴 115 偏心凸輪 116 驅動馬達 117 支持台 120 第二單元 121 第二軸 122 第2線材部 127 支持台 130 處理部 131 第一基底 132 位移機構部 132A 馬達 132B 進給螺桿 133 第二基底 134 位移機構部 134A 馬達 134B 進給螺桿 140 叉 141 爪 158694.doc 201221883In the initial state, all of the first wire U2A and the second wire portion 122 constituting the first wire portion 112 are lowered. And the processing object member GB is supported substantially horizontally by the further 140 located at the standby position WP above the wires. Then, as shown in FIG. 5(b), the fork 140 is advanced from the standby position WP to the processing position Βρβ by the moving mechanism. At this time, the fork 〇4 is located at all the first wires 112 constituting the first wire portion 112. Above the second wire portion 122. Then, as shown in Figs. 5(c) and 6(a), all of the second shafts 121 are raised, and the plurality of second wire portions 122 arranged in the left-right direction are moved upward as well. Thereby, as shown in Fig. 3, the processing target member GB is supported by the second wire of the second wire portion 122 at the position of the region DS (processing S1). In this state, as shown in Fig. 5(c), 140 is retracted from the processing position bp to the standby position WP. Then, as shown in Fig. 5 (d) and Fig. 6 (b), the second shaft 121 is lowered, and accordingly, the second wire portion 122 of the processing target member GB is lowered. On the other hand, by the first shaft 111 rising, the first wire 112 is raised to support the processing of the object member GB by the first wire 112A at the position of the region HS. Here, in each of the first units 110, one of the opposite axes lu rises, and one 158694.doc 14· 201221883 rises the first wire 112A. In each of the first units 11 (), the other first wires 112A do not rise. Further, in each of the first cells 11A, the bit rises at the common position, for example, from the first wire member n2A disposed on the right side. Further, when the processing target member GB supported by the second wire portion 122 is transferred to the first wire member 112A, the height position of the processing target member GB does not change. That is, after the first wire portion 112A is raised to the height of the second wire portion 112 supporting the processing target member GB, the second wire portion 22 is preferably lowered. In the same manner as in the subsequent step, when the processing target member (53 is transferred between the second wire portion 122 and the first wire portion 112A, the height position of the processing target member GB is preferably not changed. In this state, the flat heater 13 is used. 〇 Heat treatment processing target member GB. However, in each of the first units 11A, each of the first wires 112A of the area *HS support processing target member GB becomes four in turn, and three of them fall in a state of being lowered. The first wire member 112 continues to support the processing target member GB. In more detail, as shown in FIGS. 6(b) and 6(c), among the first units 11A, a plurality of first wires (1) are firstly used by the bars. The wire 1UA supports the processing target member GB. Then, the horizontal frame does not support one of the first-wire cores of the processing target member GB to rise toward the first axis m, and the processing target member GB is supported by the raised first wire mA. On the other hand, the first wire U2A of the i-th processing target member GB is lowered to become a state in which the processing target member GB is not supported. Next, the horizontal frame does not hold one of the third first wires 112A of the third processing target member (10). Raising the first axis 111 by The second wire member UBA 158694.doc -15-201221883 holds the processing target member GB. On the other hand, the second wire 112A that supports the processing target member gb is lowered, and the processing target member gB is not supported. 'The cross frame does not support one of the fourth wire 112A of the fourth processing target member GB, and the first axis i is raised, and the processing target member GB is supported by the rising first wire U2A. On the other hand, the processing target member GB is supported. In the third state, the first wire member 112a is lowered to the state in which the processing target member gb is not supported (process S2). Thus, the plurality of first wire members 112A are successively raised one by one while descending each other. In the case of 110, the first wire 112A at the common position is synchronously raised and lowered. Further, when the processing target member GB supported by the first wire 112A is transferred to the other first wire U2A, the height position of the processing target member gb is not Preferably, the first wire 112A is raised to a height of the first wire 112A supporting the processing target member GB, and then the first wire 112A is lowered preferably. While the first wire portion 112 supports the processing target member GB, the second wire portion 122 becomes a descending state. Then, in a state where the second wire portion 122 does not support the processing target member GB, as shown in FIG. 6(c), by displacement The mechanism unit 134 slides all of the second wire portions ία in the left-right direction. In the processing device 1 of the embodiment, the second wire portion 122 periodically rises and supports the processing target member GB, but the second wire portion 122 rises and supports When the object member GB is processed, the processing object 158694.doc -16 - 201221883 component GB (see Fig. 6(d)) will be supported at a position different from the previous (before sliding). Next, in each of the first units 110, from the first! After the strip first wire U2A to the fourth strip first wire 112A sequentially support the processing target member GB, the second wire portion 122 rises (process S3). Thereafter, the fourth strip first wire 112A is lowered. Thereby, the processing target member GB is supported by the second wire portion 122. Thereafter, as shown in FIG. 6(d), all of the first wire portions U2 are slidably moved in the left-right direction by the displacement mechanism portion 132. Next, as shown in FIG. 6(e), the first wire member 122A is raised while the second wire portion 122 is lowered, and the first wire member 112A supports the processing target at a position different from that before the sliding. Component GB. However, the first wire 112A supports the processing target member GB in the region liS of the processing target member gb. Then, in the same manner as the processing S2, the plurality of first wires 112A are sequentially raised one by one and lowered one by one, and the processing target member GB is transferred between the first wires 丨丨2a (process S4). When the second wire portion 122 is lowered and the second wire portion 122 does not support the state of the processing target member GB, as shown in FIG. 6(f), all of the first wire portions 122 are slid in the left-right direction by the displacement mechanism portion j34. Movement (Processing|§5) β When the first wire portion 122 rises and supports the processing target member gb, the processing target member GB is supported at a position different from the previous time (before the sliding). The steps of S1 to S5 are repeated as follows. However, the second wire portion 122 also supports the processing target member gB in the region HS of the processing target member GB by sliding. After the heat treatment of the processing target member GB is completed, the heat-treated processing target member GB is carried out to the standby position WP by performing the above-described operations of Figs. 5(a) to 5(d). 158694.doc •17· 201221883 Next, the effects of the present embodiment will be described. According to the present embodiment, after the processing target member GB is supported by the first wire member 112, the first wire member 112 is lowered, and the second wire portion 122 is raised. Thereafter, the substrate 13 1 is slid. Then, the second wire portion 22 is lowered to raise the first wire 112, so that the position of the first wire 112 before and after the step of supporting the object member GB by the second wire portion 112 can be shifted. Thereby, it is possible to prevent the heat treatment from being uniformly performed on the processing target member GB at the same position of the processing target member 38 by the first wire member 112. Further, while the first wire member 112 supports the processing target member GB, the substrate 133 can be slid. And shifting the position of the second wire portion 122 in the left-right direction. Thereby, the heat treatment can be uniformly performed on the processing target member 8 . In the processing device 100 of the present embodiment, as described above, the plurality of first wires 112 are each In this way, it is possible to prevent the processing target member from being tilted continuously by the wire member 112. Therefore, the heat treatment can be uniformly performed on the processing target member GB. Further, since the first wire member Since the processing target member GB is transferred between the 112 and the processing target member GB3, the stress is not locally concentrated. Therefore, the processing target member GB is not subjected to heat treatment due to stress concentration or the like. In the case of the i-th wire-wire material, it is necessary to frequently perform the first-wire portion and the second wire in consideration of the stress burden on the processing target member GB. The processing object member 6 is transferred between the material portions. In contrast, according to the present embodiment, a plurality of first-wire members 112A can be placed on each of the first units, and processed between the first-wire members U2a: 158694.doc - 18-201221883 The transfer of the image member GB is performed, so that the transfer of the processing target member GB between the first wire portion ι2 and the second wire portion 122 is performed infrequently. On the first sheet, only the first wire is provided. In this case, in order to prevent the (four) pieces from being supported in the phase (four) position, "the first wire portion and the second wire portion are frequently slid, and the processing device is deteriorated rationally. In contrast, according to the present embodiment A plurality of first-wire members 112A are disposed on each of the first units ιι, and the second wire portion 122 is slid in the left-right direction during the transfer of the processing member GB during the first wire U2. Since the first wire portion 122 and the second wire portion 122 are slid, the device having excellent handleability can be obtained. Further, the region 〇8 which is not used after the heat treatment can be supported by the second wire portion 122 to be carried into the processing position Bp. Processing object component 8. Therefore, the influence of the support of the second wire portion 122 of the region HS used after the heat treatment can be minimized. As described above, the cross-sectional area and the heat capacity are sufficiently small as described above, and thus the heat conduction is also lowered. The processing target member GB can be uniformly heated by the deviation of the temperature distribution of the processing target member GB by the flat heater 13 。. Further, in the processing apparatus 1 of the present embodiment, a driving motor 116 is used. The four first axes lu are moved up and down in the same manner on the plurality of first units 110. Therefore, the structure is simple and the first wire 112A is moved up and down synchronously. Further, according to the present embodiment, the first wire portion 丨12, In the second wire portion 122, the wire portion of the processing target member GB is not supported to move in the horizontal direction by 158694.doc • 19-201221883. Therefore, it is possible to prevent the movement of the processing target member GB accompanying the movement of the wire portion in the horizontal direction, and the processing target member GB can stay at the same position β in the heating process. Further, the processing target member between the first wire portion 112 and the second wire portion 122 When the transfer of GB is performed, and when the processing target member Gb between the first wire 112 is transferred, the height position of the processing target member GB does not change. Therefore, the movement processing target member GB can be prevented from being convected around, and the temperature distribution of the processing target member GB can be changed, and the processing target member GB can be efficiently heat-treated. Further, according to the present embodiment, the first unit 110 and the second unit 12 are alternately arranged in the left-right direction. Thereby, the processing target member GB 〇 can be stably supported. According to the present embodiment, the first unit 丨 10 is mounted on the first base 131 and the second unit 120 is mounted on the second base 133. Then, the first substrate 131 and the second substrate 133 are linearly moved to adjust the position of the first wire portion 112 and the second wire portion 122 in the horizontal direction. Since the positions of the first wire portion 112 and the second wire portion 122 in the horizontal direction can be adjusted by merely sliding the substrates 131 and 133, the position of the first wire portion 112 and the second wire portion 122 can be easily adjusted. Further, the position of the first wire portion 112 and the second wire portion 122 in the horizontal direction can be adjusted by merely moving the bases 13 1 and 133 in the horizontal direction, and the amount of sliding can be appropriately set. The present invention is not limited to the embodiment, and various modifications may be made without departing from the spirit and scope of the invention. According to the above aspect, the processing object member GB is not slidably moved in the horizontal direction during the heat treatment, but it is also slidable. 158694.doc -20-201221883 For example, in a state in which the first wire 112a supports the processing target member GB, the base 131 may be moved in the horizontal direction by β. According to the above aspect, as shown in FIG. The region HS is divided into 2x4 processing target members Gb for heat treatment, and five second cells 120 and four first cells η are arranged. However, of course, the units can perform various layouts in accordance with the division of the processing target member <30. Furthermore, the plurality of second cells 12 and a plurality of first cells 11 are arranged in a manner corresponding to the division of the plurality of processing object members GB, and the plurality of second cells 120 and the plurality of first cells 11 are selected. The sexual action may correspond to a plurality of processing object members GB (not shown). Further, the plurality of second cells 12A and the plurality of first cells 11 are movably disposed in the left-right direction, and the positions of the plurality of second cells 12 and the plurality of first-cell HGs are changed. It can correspond to a plurality of processing target members GB (not shown). Further, according to the above-described embodiment, the cross-sectional area of the first wire member 112 and the heat capacity are sufficiently small to reduce the heat conduction ‘, and the variation in the temperature distribution of the processing target member GB by the flat heater 13 加热 heat treatment is suppressed. Of course, the sectional area or the heat capacity of the first-wire mA is defined as the condition (4) as the condition (4) of the deviation of the temperature distribution of the target member GB and the strength of the processing target member GB. Further, according to the above-described embodiment, as shown in Fig. 4, the driving unit 113 includes the eccentric cam 115 which is held by the common driving shaft 114. However, the driving mechanism 113 may be formed by the crank mechanism. According to the above-described embodiment, the processing device 1 is heat-processed from below by the flat heaters 158694.doc-21/201221883130. However, the processing means for heat-treating the processing target member (8) by the flat heater 130 may be used, or the processing means for processing the processing member GB from both the upper and lower sides by the pair of flat heaters 13 In addition, according to the above aspect, the pre-baking apparatus which heat-processes the processing target member GB by the panel heater 13 is used as a processing apparatus 1 〇〇. The vacuum drying apparatus of the processing target member GB is used as a processing apparatus (not shown). For example, the processing apparatus 100 of the above-described embodiment may be disposed in a chamber connected to a pressure reducing mechanism such as a vacuum pump to constitute a vacuum drying apparatus. According to the above-described embodiment, the first wire portion 112 and the second wire portion 122 are moved in the horizontal direction by moving the bases 131 and 133 in the horizontal direction. However, the first wire portion 112 and the second wire portion 122 are not limited thereto. For example, the base 133 may not be provided, and the base may be used. 131, the first wire portion 112 is moved horizontally with respect to the second wire portion 122. Further, according to the above embodiment, the first wire portion 112 has a plurality of first wires 112A The configuration is not limited thereto, and the first wire u2A may be configured. Therefore, the device can be simplified. Further, the first wire 112 is eight pieces but the number is limited to the above. [The wire 112 is a plurality of wires. In addition, in the above-described embodiment, the plurality of first-wire members mA constituting the first wire portion ι 2 are sequentially raised and lowered, but the present invention is not limited thereto, and may be _ part - the wire 112A is fixed 'the other part of the first wire U2A is driven in the up and down direction. For example, the -part first wire 112A supports the processing object member 158694.doc •22-201221883 GB after 'making another part of the first wire 1〗 2A located in a part The upper wire H2A is driven in a manner to support the processing target member GB by the other portion of the first wire U2A. Thereafter, the other portion of the first wire member 2A is driven downward, and the portion of the first wire U2A is transferred to the processing target member. According to the above embodiment, the first wire portion 丨12 and the second wire portion 122 are driven in the vertical direction. However, the present invention is not limited thereto, and only one of the wire portions may be driven in the vertical direction. However, the above-described embodiments and the plural modifications may be combined within a range in which the contents are not reversed. In the above-described embodiments and modifications, the configuration of each portion and the like are specifically described, but the configuration and the like satisfy the scope of the present invention. Various changes can be made in the application. The application claims the priority of Japanese Patent Application No. 2010-205527, filed on Sep. 14, 2010, and Japanese Patent Application No. 2〇1〇_2〇5528. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic perspective view showing the internal structure of a processing apparatus according to an embodiment of the present invention. Fig. 2 is a schematic perspective view showing the internal structure of the processing apparatus. Figure 3 is a schematic plan view showing the internal structure of the processing apparatus. Fig. 4 is a side view showing the structure of the driving portion. Figures 5(a)-(d) are schematic diagrams showing the steps of the operation of the non-processing device. Fig. 6 (aHf) is a schematic diagram showing the steps of the operation of the processing device. [Major component symbol description] λ ° 100 Processing device 158694.doc -23· 201221883 110 First unit 111 First shaft 112 First wire portion 112A First wire 113 Drive portion 114 Drive shaft 115 Eccentric cam 116 Drive motor 117 Support table 120 second unit 121 second shaft 122 second wire portion 127 support table 130 processing portion 131 first base 132 displacement mechanism portion 132A motor 132B feed screw 133 second base 134 displacement mechanism portion 134A motor 134B feed screw 140 fork 141 Claw 158694.doc 201221883
BP DS、 GB WP 處理位置 HS 區域 平板狀處理對象構件 待機位置 158694.doc -25-BP DS, GB WP processing position HS area Flat processing target member Standby position 158694.doc -25-