201221260 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種參數調校方法，特別是一種雷射製程 參數調校方法。 【先前技術】 雷射劃線製程廣泛地應用於太陽能電池片（Sok cdi)、 矽晶圓（Wafer)、半導體材料及陶瓷材料之劃線切割。以雷射 s’J線製程取代傳統刀輪切割之優勢在於僅需切割表面，省略刀 輪切割後需再經過磨邊與清洗的動作，並改善以刀輪切割易產 生碎片之缺點。但其可能造成切割表面焦黑或表面因壓力碎裂 而將融熔材料賴成山脊狀之突目縣⑽滅）。因此，雷 射參數的選擇是提供良好切割表面品質之重要關鍵。 雷射設備的機構複雜，因此其製程的參數繁多，諸如：雷 =率^雷射焦距、#射鶴速率、雷射觸發鮮、Q開關頻 迎ί不同產品需求，需對各參數進行調整，以找出 難。因貫驗測3式再者，亦有分析不易之困 ΐ製校經驗之專家於生產線上直接針 對製程、，，。果進订，反覆測試，影響製程效率且耗費人力。 求，獨的雷射製程妨雌品品質要 生產出方法，以利快速找出最佳參數組合，而 【發明内容】 調校_射製程參數 求。 、、出適且之參數以滿足雷射加工品質需 用以調校Q開 本發明提出—射㈣齡數峨方法， 201221260 雷射參數^含下列步驟：以實驗取得雷射參 έ且人中’ 1射參數之候選數值範圍之上下限數值及中間值之 組口中，以實驗取得符合製程品質需 < ίΐί值之間距符合雷射參數之最小呢定解析度。據此， 可件到雷射參數之最佳設定數值。 人·=二實驗取得雷射參數之候選數值範圍之步驟，包 i膏給ίίΐ功ΐ及5開關頻率為適當數值範圍之中間值， 製栽深度壯製程科之候驗健目，若均不符 1 射功率再進行實驗；蚊焦距深度為候選 ΐΐί圍之中間值，固定雷射功率為適當數值範圍之中間值， Q _醉符合触品質之_數值細， ，降低雷射功率再進行實驗；及固定焦距深度及ί 開關頻率為候魏值範圍之巾，實驗出#射神符 =之候魏值麵，糾不符製程品質，麟低 率再進行實驗。 V )剛两 較佳地’自雷射參數之候選數值細之上下限數值及 值之組合巾，以實驗取得符合製程品ff求之最佳參 合之步驟可採用灰關聯法進行。 較佳地’最佳參數數值组合是否符合製程品質係以複數個 特徵參數進行觸，概參數包含_、鱗響區大小、 切割邊緣之突B1大小、蝴線靖與否及蝴_勻與否。 本發明亦提出一種雷射製程參數調校方法，用以調校脈 式雷射之複數瓣射參數，包含下列步H實驗取得雷射失 數之候選數絲圍，f射參數包含焦距深度及雷射功率；自^ 射參數之候選數值範圍之上下限數值及中間值之組合中，以實 201221260 驗取得符合製程品質需求之最佳參數數值組合；根據最佳參 數值組合，以二分法更新雷射參數之候選數值範圍；及重複矿 一步驟直至雷射參數之候選數值範圍之中間值至上下限數 之間距符合雷射參數之最小可設定解析度。據此，可得^ 參數之最佳設定數值。 較佳地，以實驗取得雷射參數之候選數值範圍之步驟， 含：固定觸發頻率及雷射運動速度；固定雷射功率，以實驗取 知·焦距深度符合製程品質之候選數值範圍；及固定焦距深度 候選數值範圍之中間值，調整雷射功率至可達最低去除能力二 φ 並設定為雷射功率之候選數值範圍之中間值，以雷射功率之最 小可設定解析度擴大為雷射功率之候選數值範圍之上下限 值。 較佳地， ，曰，击耵爹數之候選數值範圍之上下限數值及中 值之組合中，以實驗取得符合製程品質需求之最佳參數二 合之步驟可採用灰關聯法進行。 較佳地’祕參缝餘合是倾合製程品_ 特徵參數進行麟，特徵參數包含切麟寬、熱影響區^ 切割邊緣之突圓大小、切割線切斷與否及切割線均勻與否。 較佳地’於重複前-步驟直至雷射參數之候選 :間值至上下錄值之間距符合雷射錄之最何設^析 射觸發_，_償雷_發至魏之延遲時間。^及雷 發明之-人要目的在於應用前述之雷射製程參數調校方 法，使得雷射加工機台自動進行參數最佳化。 工平ΐ發參數調校之雷射加卫機台，包含：加 ，’雷射裝置’發出雷射光而加工加工件； 後之複數轉徵參數；及 、控制裝置’控制加平台、雷射裝置及複數個感測装置， 201221260 並接收外部設定之製程品質需求，中央控㈣置包含··運動控 制模組，用以控制雷射裝置與加工平台間相對運動；雷射控制 模組，用以控制雷射裝置之觸發時間及複數個雷射參數；及自 動調校模組’根據特徵參數，以前述之雷射製程參數調校方法 校正雷射參數。 有關本發明之較佳實施例及其功效，茲配合圖式說明如 後。 【實施方式】 以下舉出具體實施例以詳細說明本發明之内容，並以圖式 作為輔助說明。說明中提及之符號係參照圖式符號。 雷射之種類依功率變化可分為連續波雷射（c〇ntinu〇us ^ave laser, CW laser)及脈衝雷射（Pulsed laser)二種。而脈 衝雷射又可細分為一般脈衝式雷射、Q開關雷射及鎖模雷射 (Mode-lock laser)，其脈衝時間分別約為1〇-3至1〇·6秒、數個 至數百個109秒及1〇.12至1〇-丨5秒。於此，本發明第一實施例 係用於向量模式製程’尤指以q開關雷射進行向量移動加工； 本發明第二實施例係用於離散點運動模式製程，尤指以一般脈 衝式雷射進行點陣運動加工。以下實施例係以對面板進行切卹 為例進行說明。 ° 請參照第1圖所示，係為本發明第一實施例之雷射製程參 數調校方法流程圖。一種雷射製程參數調校方法，用以調校q 開關雷射之複數個雷射參數，包含下列步驟： 步驟S11 :以實驗取得雷射參數之候選數值範圍，雷射參 數包含焦距深度、Q開關頻率及雷射功率。 於此，凡熟習本領域者應可理解，本發明所述之方法進行 之前，應預先進行雷射加工機台校正，以確認雷射加工之可行 性。例如：確認加工平台為水平、瞭解雷射焦距深度（Depth 〇f focus，DOF)範圍。步驟S11更包含下列步驟： 201221260 並以實數值範圍 圍’右均不贿程品9，選數值範 靜^此每以雷射功率及卩開關頻率為固定因子魅在201221260 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a parameter adjustment method, and more particularly to a laser process parameter adjustment method. [Prior Art] The laser scribing process is widely used for scribing of solar cells (Sok cdi), germanium wafers (wafer), semiconductor materials, and ceramic materials. The advantage of replacing the traditional cutter wheel cutting with the laser s'J line process is that it only needs to cut the surface, omitting the action of edging and cleaning after the cutter wheel is cut, and improving the shortcomings of cutting with the cutter wheel. However, it may cause the surface of the cut surface to be blackened or the surface to be crushed by pressure to cause the molten material to be ridged in the ridge-like county (10). Therefore, the choice of laser parameters is an important key to providing good cut surface quality. The mechanism of the laser equipment is complicated, so the parameters of the manufacturing process are numerous, such as: lightning = rate ^ laser focal length, #shooting rate, laser triggering fresh, Q switching frequency, different product requirements, need to adjust various parameters, To find out the difficulty. In addition to the continuous test 3, there are also analysis that is difficult to overcome. Experts in the school experience directly on the production line, the process, and. If you make a reservation, repeat the test, which affects the process efficiency and is labor intensive. Seeking, the unique laser process can make the quality of the female product to produce a method to quickly find the best combination of parameters, and [invention content] calibrating _ shooting process parameters. And the appropriate parameters to meet the laser processing quality needs to be adjusted to Q. The invention proposes the method of shooting (four) age, 201221260 laser parameters ^ with the following steps: the laser is obtained by experiment and the person In the group of the upper and lower limit values and the intermediate value of the candidate value range of the 1st shot parameter, the experimentally obtained quality in accordance with the process quality needs to be in accordance with the minimum resolution of the laser parameter. According to this, the optimum setting value of the laser parameters can be obtained. The human == two experiment to obtain the candidate value range of the laser parameters, the package i paste to the ίίΐ ΐ and the 5 switching frequency is the middle value of the appropriate value range, the planting depth of the process of the process of the test of health, if none of the 1 The power of the shot is further tested; the depth of the mosquito focal length is the middle value of the candidate ΐΐί circumference, the fixed laser power is the middle value of the appropriate value range, Q _ drunk meets the _ value of the touch quality, and the laser power is reduced and the experiment is performed; And the fixed focal depth and the ί switching frequency are the range of the Wei value range. The experiment shows that the #神神符=waiting the Wei value surface, the correction does not match the process quality, and the Lin low rate is further tested. V) Just two preferred combinations of the upper and lower limit values and values of the candidate values of the laser parameters, the steps of obtaining the best participation in accordance with the process product ff can be carried out by the gray correlation method. Preferably, whether the optimal parameter value combination conforms to the process quality is touched by a plurality of characteristic parameters, and the parameter includes _, the size of the scaled area, the size of the cut edge B1, the butterfly line or not and the butterfly _ uniform or not . The invention also proposes a laser process parameter adjustment method for adjusting the complex valve parameters of the pulsed laser, comprising the following steps: the H experiment to obtain the candidate number of laser missing numbers, and the f-radiation parameter includes the focal depth and Laser power; from the combination of the upper and lower limit values and the median value of the candidate value range of the parameters, the actual parameter value combination that meets the process quality requirements is obtained by the 201221260 test; according to the optimal parameter value combination, the dichotomy is updated. The candidate value range of the laser parameter; and the repeatable ore step until the middle of the candidate value range of the laser parameter to the upper and lower limits is in accordance with the minimum settable resolution of the laser parameter. According to this, the optimal setting value of the ^ parameter can be obtained. Preferably, the step of obtaining the candidate numerical range of the laser parameters by experiments comprises: a fixed trigger frequency and a laser motion speed; a fixed laser power, an experimental value and a focal depth corresponding to a candidate value range of the process quality; The middle value of the focal length depth candidate value range, adjust the laser power to the lowest removal capability two φ and set the middle value of the candidate value range of the laser power, and expand the laser power to the minimum settable resolution of the laser power. The lower limit of the candidate value range. Preferably, 曰, the combination of the lower limit value and the median value of the candidate numerical value range of the number of hits, the step of obtaining the optimal parameter in accordance with the process quality requirement by the experiment may be performed by the gray correlation method. Preferably, the secret combination is a tilting process product _ characteristic parameter for the lining, the characteristic parameters include the cutting width, the heat affected zone ^ the size of the cutting edge of the cutting edge, the cutting line is cut or not, and the cutting line is uniform or not. . Preferably, the 'pre-repeating-steps until the candidate of the laser parameters: the distance between the inter-value and the top-to-bottom recording corresponds to the maximum of the laser recording trigger__, the delay time to the Wei. ^ and Ray Invented - the purpose of the person is to apply the aforementioned laser process parameter adjustment method, so that the laser processing machine automatically optimizes the parameters. The laser-assisted laser-adjusting machine for the adjustment of the parameters of the work, including: plus, the 'laser device' emits laser light to process the workpiece; the subsequent plural transfer parameters; and, the control device 'control plus platform, laser The device and the plurality of sensing devices, 201221260 and receiving the externally set process quality requirements, the central control (four) set includes a · motion control module for controlling the relative motion between the laser device and the processing platform; the laser control module, To control the triggering time of the laser device and a plurality of laser parameters; and the automatic calibration module 'according to the characteristic parameters, the laser parameters are corrected by the aforementioned laser process parameter adjustment method. The preferred embodiment of the invention and its efficacy are described in conjunction with the drawings. BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below with reference to specific embodiments. The symbols mentioned in the description refer to the schema symbols. The type of laser can be divided into two types: continuous wave laser (c〇ntinu〇us ^ ave laser, CW laser) and pulsed laser (Pulsed laser). The pulsed laser can be subdivided into general pulsed laser, Q-switched laser and mode-lock laser. The pulse time is about 1〇-3 to 1〇·6 seconds, and several to Hundreds of 109 seconds and 1〇.12 to 1〇-丨5 seconds. Herein, the first embodiment of the present invention is applied to a vector mode process, especially a vector moving process using a q-switch laser; the second embodiment of the present invention is used for a discrete point motion mode process, especially a general pulse type lightning process. Shooting for lattice motion processing. The following examples are described by taking a panel cut as an example. Please refer to FIG. 1 , which is a flow chart of the laser process parameter adjustment method according to the first embodiment of the present invention. A laser process parameter adjustment method for adjusting a plurality of laser parameters of a q-switched laser, comprising the following steps: Step S11: obtaining a candidate range of laser parameters by experiments, the laser parameters including focal depth, Q Switching frequency and laser power. Here, it should be understood by those skilled in the art that the laser processing machine calibration should be performed in advance to confirm the feasibility of laser processing before the method of the present invention is carried out. For example: confirm that the processing platform is level and understand the Depth 〇f focus (DOF) range. Step S11 further includes the following steps: 201221260 and the real value range is surrounded by 'the right is not bribery product 9, select the value of the standard static ^ this each with the laser power and the switching frequency as a fixed factor charm
Q 之焦距深度範圍，則降低雷未月 =找到符合製程品質 製程品質之焦距深雷射功率再進行實驗，直至找到符合 -2驟S112 :峡焦距深度為候選數值範圍之古m 2射功率為適當數值範圍之中間值，實驗Λ f 合製程品質之候選數值範圍，H出Q =頻率符 功率再進行實驗。 ⑴mf ’畴低雷射 定ϋϊ此步驟Sln ’但改以焦距深度及雷射功率為固 ，率進行實驗。因步驟S111已找ί^ 圍’因此將此步驟之焦距深度設定為候選數值範 而敗不符合製程品質’祕調整q關頻率，進 ί開關頻率範圍。然而，因雷射功率較焦距深 開關頻率範圍，騎低雷射功率再進行實 ， 程品質之q開關頻率範圍。 找 步驟S113:固定焦距深度及Q開關頻率為候選數值範圍 之中間值’實驗出雷射功率符合製程品質之候選數值範圍，若 均不符製程品質，則降低Q開關頻率再進行實驗。 於此，如同步驟S112，但改以焦距深度及Q開關頻率為 固定因子，變換雷射功率進行實驗。因步驟3111及步驟SU2 已找到適€之焦距深度範圍及Q開關頻率範圍，因此將此步 201221260 ^焦距深度細及Q _頻率設定為候選數值範圍之中間 得有= 製0，調整雷射功率，進而取 質1雷=^圍開關頻率再進行實驗，直至找到符合製程品 自雷射參數之候驗值範®之上下限數值及中 值範Γ:=ΐ圍 ==出:射參數之候選數 出加工m + Γ ^ 下限數值及中間值。續而，找Q focal length depth range, then reduce Lei Weiyue = find the focal depth deep laser power that meets the process quality of the process and then experiment, until the found is in accordance with the -2 step S112: the depth of the focal depth of the candidate is the candidate value range of the ancient m 2 radio power The median value of the appropriate numerical range, the experimental Λ f and the candidate value range of the process quality, H out Q = frequency power and then experiment. (1) mf ′ domain low laser The step Sln ’ is determined, but the experiment is performed with the focal depth and the laser power as the solid rate. Since the step S111 has been found, the focal length of this step is set to the candidate value range and the failure is not in accordance with the process quality. However, because the laser power is deeper than the focal depth of the switching frequency range, the low-range laser power is used to perform the real-time q-switching frequency range. Looking for step S113: the fixed focal depth and the Q-switching frequency are intermediate values of the candidate numerical range'. The experimental laser power is in accordance with the candidate value range of the process quality. If none of the process quality is met, the Q-switching frequency is lowered and the experiment is performed. Here, as in step S112, but by changing the focal length and the Q-switching frequency as fixed factors, the laser power is transformed to perform an experiment. Since the focal depth range and the Q-switching frequency range have been found in step 3111 and step SU2, the step 201221260^focal depth and Q_frequency are set to be in the middle of the candidate value range = 0, and the laser power is adjusted. And then take the quality 1 Ray = ^ surrounding the switching frequency and then carry out the experiment until the upper limit value and the median value of the waiting value of the process parameters from the laser parameters are found: = ΐ = = =: The candidate counts the m + Γ ^ lower limit value and the intermediate value. Continue, find
Reln；^ (〇rey 開關頻率之中間值及雷射功率之下限為最i Q 數最錄錄触合，以二分法更新雷射參 合缺候驗值範圍之趨勢， 么;:焦距深度；最佳參 值範圍之上半部。 _值賴縮小為候選數 中复前一步驟直至雷射參數之候選數值範圍之 产I 、數值之間距符合雷射參數之最小可設定解析 根^射機台之雷射參數可設定之最小解析度，做 頻率及雷’可得到焦距深度、Q開關 201221260 上述有關判斷最佳參數數值組合是否符合製程品質之依 數個特徵參數進行鱗。特徵參數包含切割線寬、 熱衫響區（Heat-affectedzone，HAZ)大小、切割邊緣之突圓大 小、切割線切斷與否及切割線均勻與否。實質上， 需求而定。於此，所述加工可為切割、消融蝕刻、‘孔 2 (^邱1111§)。因此熟習本領域者應能理解，上述判斷 製程品質之特徵參數並非以此為限。 胸日2圖所示’係為本發明第二實施例之雷射製程參 ίΐίΪ法流糊。—種雷射製程參數調校方法，用以調校脈 衝式雷射之複數個雷射參數，包含下列步驟： 數勺實驗取得雷射參數之候選數值範圍，雷射參 i3…距冰度及雷射功率。於此，步驟S21更包含下列步驟： 步驟S211 :固定觸發辭及雷射運動速度。 於此’雷射運動速度所指冑雷射光與加工平台之相對運動 加^平2mm度或雷射裝置之運動速度’而對 十口承載之加工件進仃加工。依據光斑重疊率（overiap 如u雷射線l可決定#射觸發頻率及雷射運動速度。例 ί二之線寬、重疊率為_，料動速度為—， 約需50kHz的觸發頻率。 程11 射功率’以實驗取得焦距深度符合製 程品質之候選數值範圍。 優先隹深ί較雷射功率對於加工品質之影響大，故 再調整焦觀度，轴取得纽之驗深度範圍。 整兮t =13 ·固各定焦距深度為候^^數值範圍之中間值，調 整該雷射功率至可達最低去除能力，並設定為雷射功率之候選 201221260 雷射功率之最小可設定解析度擴大為雷 射功率之候選數值範圍之上下限數值。 於此’以焦距深度為固定因子，並設定為候選數值 :間，，變換雷射功率進行實驗。當雷射達到去除材‘】 去除能力時，將此雷射功率設定為候選數值範圍之中間. =以雷射功率可設定之最小解析度自候選數值範圍之中值 擴大為候驗絲目之上下限紐，糊賴步驟進行。 步驟S22:自雷射參數之候選數值範圍之上下限數值及 =值之組合巾，雄驗取冊合製程品f需求之—最佳參數 值組合。 —於此，由步驟S211至步驟S213實驗出雷射參數之候選 值範圍，可得候選數值範圍之上下限數值及中間值。續而，、 ^加工品質最好之組合，特別是可採用灰關聯法進行。例如： '、，、距深度之上限及f射轉之巾間值為最佳參數數值組合。 步驟S23 :根據最佳參數數值組合，以二分法更新雷 數之候選數值範圍。 爹 、-於此’根據最佳參數數值組合位於候選數值範圍之趨勢， =-分法將候驗絲難小-半。例如：焦距深度之最佳表 數為其候紐值範圍之上限，則將候選數值範圍縮小為數 值範圍之上半部。 步驟S24 :重複前-步驟直至雷射參數之候選數值範圍之 間值至上下限數值之間距符合雷射參數之最小可設定解析 度。 於此’根據雷射機台之雷射參數可設定之最小解析度，做 ，重複進行二分法之停止點。據此，可得到焦距深度及雷射 率之最佳設定數值。 為使雷射觸發與雷射運動同步，步驟S24後更包含： 201221260 步驟S25 :於製崎時回授1射加工鋪及 觸發時間，以補償雷射觸發至發射之延遲時間。”雷射 於此，回授雷射對應加工平台之Χ座標及γ ，雷^觸發之時間，作為即時校正之用。據以使雷射“工平 位置與麵加工位置不符，而造成雷射光斑之ΐ 透過校正雷射觸發時間或調整雷射與加 上述有關判斷最佳參數數值組合是否符合製程品質之依 ^ ’係以複數個特徵參數s行判斷。特徵參數包含切割線寬、 衫響區大小、切#彳邊緣之突圓大小、切割線切斷與否及切巧 均勻與否。實質上，可視實際製程品f需求而^。於此，^ 發明第一級第二實施例雖以面板切割進行說明，但本發明並非 以此為限丨所述加工可為切割、消融蝕刻、鑽孔或退 火（Annealing)。因此熟習本領域者應能理解，上述判斷製 品質之特徵參數並非以此為限。 請參閱第3 ®所示，係為本發明第三實施例之雷射加工機 台方塊示意圖。一種自動參數調校之雷射加工機台3包含加工 平台31、雷射裝置32、複數個感測裝置及中央控制裝置34。 其中，複數個感測裝置係選自同軸視覺模組（c〇axial visi〇nReln;^ (The middle of the 〇rey switching frequency and the lower limit of the laser power are the most i Q number of the most recorded touch, the trend of updating the laser vacancy test value range by the dichotomy;; focal length; The upper part of the range of good values. The value of _ is reduced to the minimum number of candidate values in the candidate number until the candidate value range of the laser parameters, and the distance between the values is in accordance with the minimum settable resolution of the laser parameters. The laser parameter can be set to the minimum resolution, the frequency and the thunder can be obtained, and the Q-switch 201221260 is used to determine whether the optimal parameter value combination meets the process quality according to several characteristic parameters. The feature parameter includes the cutting line. Width, Heat-affected zone (HAZ) size, the size of the cutting edge, the cutting line is cut or not, and the cutting line is uniform. Essentially, depending on the demand. Cutting, ablation etching, 'hole 2 (^ Qiu 1111 §). Therefore, those skilled in the art should be able to understand that the above-mentioned characteristic parameters for judging process quality are not limited to this. Implementation The laser processing method is a method for adjusting the laser process parameters, and is used for adjusting a plurality of laser parameters of the pulsed laser, including the following steps: a numerical evaluation of the laser parameter The laser is in the range of ice and laser power. Step S21 further includes the following steps: Step S211: fixed trigger speech and laser motion speed. The relative motion of the platform plus 2mm degrees or the speed of the laser device's processing of the workpieces carried by the ten ports. According to the spot overlap rate (overiap such as u thunder rays l can determine the #射 trigger frequency and laser motion Speed. For example, the width of the line is 2, the overlap rate is _, the feed speed is -, and the trigger frequency of about 50 kHz is required. The process of obtaining the focal length is experimentally determined to meet the candidate range of process quality. The laser power has a great influence on the processing quality, so the focus is adjusted again, and the axis obtains the depth range of the inspection. The whole t = 13 · The fixed focal depth is the middle value of the range of values, and the laser is adjusted. Work The minimum achievable ability to reach the minimum removal capability and set as the candidate for laser power 201221260 The minimum configurable resolution of the laser power is expanded to the upper and lower limit values of the candidate range of the laser power. Here, the focus depth is a fixed factor, and Set as the candidate value: between,, transform the laser power for experiment. When the laser reaches the removal material's removal ability, set the laser power to the middle of the candidate value range. = The minimum resolution that can be set by the laser power The degree is expanded from the value of the candidate value range to the lower limit of the candidate wire, and the paste step is performed. Step S22: the combination of the upper and lower limit values and the value of the candidate value range of the laser parameter The combination of the requirements of the product f - the best combination of parameter values. - Here, the range of candidate values of the laser parameters is experimentally calculated from step S211 to step S213, and the lower limit value and the intermediate value above the candidate value range are obtained. Continued, , ^ The best combination of processing quality, especially the gray correlation method can be used. For example: ',,, the upper limit of the depth and the value of the f-rotation is the best combination of values. Step S23: Update the candidate value range of the lightning number by a binary method according to the optimal parameter value combination.爹 , - This is based on the trend of the optimal parameter value in the range of candidate values, the =- division method will be difficult to test the wire - half. For example, if the optimal number of focal depths is the upper limit of its range of candidate values, the range of candidate values is reduced to the upper half of the range of values. Step S24: repeating the pre-step until the value between the candidate value range of the laser parameter and the upper and lower limit values meets the minimum settable resolution of the laser parameter. Here, according to the minimum resolution that can be set according to the laser parameters of the laser machine, the stop point of the dichotomy is repeated. According to this, the optimum setting values of the focal depth and the laser rate can be obtained. In order to synchronize the laser trigger with the laser motion, step S24 further includes: 201221260 Step S25: The 1st shot shop and the trigger time are feedbacked during the production of the clock to compensate for the delay time from the laser trigger to the launch. "The laser is here, and the laser coordinates the coordinates of the processing platform and the time of gamma and thunder triggering. It is used for immediate correction. According to the laser, the position of the laser is not in conformity with the surface processing position, resulting in laser The spot of the spot is determined by correcting the trigger time of the laser or adjusting the laser and adding the above to determine whether the combination of the optimal parameter value is in accordance with the process quality. The characteristic parameters include the cutting line width, the size of the shirting area, the size of the rounding of the cutting edge, the cutting line cutting or not, and the uniformity of the cutting. In essence, it can be seen from the actual process product f. Here, the first embodiment of the first stage of the invention is described by panel cutting, but the invention is not limited thereto, and the processing may be cutting, ablation etching, drilling or annealing. Therefore, those skilled in the art should be able to understand that the characteristic parameters of the above-mentioned judgment quality are not limited thereto. Referring to Fig. 3®, it is a block diagram of a laser processing machine according to a third embodiment of the present invention. An automatic parameter adjustment laser processing machine 3 includes a processing platform 31, a laser device 32, a plurality of sensing devices, and a central control device 34. Wherein, the plurality of sensing devices are selected from the group consisting of coaxial vision modules (c〇axial visi〇n
Sensor) 33卜表面輪廓儀（Laser profiling sensor) 332、高度 量測儀333、四點探針量測儀（Fou int b〇 33相$ 微儀335及其組成之群組。 肌，具 兩^工平台31用以承載一加工件4。雷射裝置32用以發出 雷射光321而加工加工件4。感測裝置用以感測加工件4經加 工後之複數個特徵參數。舉例而言，同轴視覺模組331用以判 別切割線寬及熱影響區大小；表面輪廓儀332用以量測切割邊 緣之突圓大小；高度量測儀333量測加工件4表面平坦度及劃 201221260 相位顯微儀335用以快速量^工^割線靖與否； 時即時修正。 加工件4表醉域，以供加工 個感有 射裝置32及複數 求。其中，中央㈣接收外部設定之製程品質需 制模組342及自“组:組34卜雷射控 雷射裝置32與加工平台、31間相組341用以控制 以㈣雷射梦署”二:f相對運動。雷射控制模組342用 模“參之數觸=ί!;Η參數。自動調校 參數調校綠校正雷射參數。 -實蝴之雷射製程 驟實施例中判斷符合製程品質之步 至自動嫩模組343。自=|=個;徵參數而輸入 之製鋥σ皙堂卡a也々°乃板模、、且343進一步根據外部輸入 1 ΐ，麻，而判斷加工是否符合製程 叩質、’續而，通知雷射控制模組342進行雷射參數之調整妹 及.ίΐ二動調:交模組343接收加工平台31之X、Υ座# 射何_發及對應之:： —射觸發進至而= 區外特H平台31除具有供加轉4進行加工之加工 射製程參數概方找行進行雷射參數 量測儀州及相位顯微儀335快速檢測加= 12 201221260 調雷射參數以符合製程品質。 雖然本發明的技術魄已經讀佳實關揭露如上，缺复 本發明’任何熟習此技藝者，在不脫離本發G 精神所作二許之更動與賴，皆應涵胁本發明的鱗内，因Sensor) 33 laser profiling sensor 332, height measuring instrument 333, four-point probe measuring instrument (Fou int b〇33 phase $ micrometer 335 and its group of components. Muscle, with two ^ The working platform 31 is used to carry a workpiece 4. The laser device 32 is used to emit the laser light 321 to process the workpiece 4. The sensing device is used to sense a plurality of characteristic parameters of the workpiece 4 after processing. For example, The coaxial vision module 331 is used to determine the cutting line width and the size of the heat affected zone; the surface profiler 332 is used to measure the size of the cutting edge; the height measuring instrument 333 measures the surface flatness of the workpiece 4 and the phase of the 201221260 phase. The micrometer 335 is used for rapid measurement of the secant line or not; the immediate correction is made. The workpiece 4 is drunk, for processing the sensory device 32 and the complex number. Among them, the central (four) receives the externally set process quality. The module 342 and the "group: group 34" laser-controlled laser device 32 and the processing platform, 31 phase groups 341 are used to control the relative motion of the (4) laser dream system. 342 with the mold "refer to the number of touch = ί!; Η parameters. Automatic tuning parameters adjustment green correction Laser parameters - In the embodiment of the real laser process, the process is judged to be in accordance with the process quality to the automatic die module 343. Since =|= one; the parameter input and the input system 鋥 皙 皙 卡 a The plate mold, and 343 further determines whether the processing conforms to the process enamel according to the external input 1 ΐ, hemp, and then informs the laser control module 342 to adjust the laser parameters and the adjustment of the laser parameters. The module 343 receives the X of the processing platform 31, the # # 射 及 及 及 及 及 : : : : : : = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = Looking for a laser parameter measuring instrument state and phase microscopy 335 fast detection plus = 12 201221260 Adjusting the laser parameters to meet the process quality. Although the technical know-how of the present invention has been read by the above, the invention is lacking. Anyone who is familiar with this skill, who does not deviate from the spirit of this G, should be in the scale of the invention.
====圍纽触之中料概麟界定者為準。 第1圖為本發明第一實施例之雷射製程參數調校方法流程圖。 第2圖為本發明第二實施例之雷射製程參數調校方法流程圖。 第3圖為本發明第三實施例之雷射加工機台方塊示意圖。 【主要元件符號說明】 S11 〜S14、S21 〜S25 :步驟 3:雷射加工機台 31 :加工平台 32 :雷射裝置 321 =雷射光 331 :同軸視覺模組 332 :表面輪廓儀 333 :高度量測儀 334 :四點探針量測儀 335 :相位顯微儀 13 201221260 34 :中央控制裝置 341 :運動控制模組 342 :雷射控制模組 343 :自動調校模組 4 :加工件==== The surrounding key is defined by the definition of the general. FIG. 1 is a flow chart of a method for adjusting a laser process parameter according to a first embodiment of the present invention. 2 is a flow chart of a method for adjusting a laser process parameter according to a second embodiment of the present invention. Figure 3 is a block diagram of a laser processing machine in accordance with a third embodiment of the present invention. [Description of main component symbols] S11 to S14, S21 to S25: Step 3: Laser processing machine 31: Processing platform 32: Laser device 321 = Laser light 331: Coaxial vision module 332: Surface profiler 333: Height amount 334: Four-point probe measuring instrument 335: Phase microscope 13 201221260 34: Central control unit 341: Motion control module 342: Laser control module 343: Automatic tuning module 4: Machining parts