201228487 六、發明說明： 【發明所屬之技術領域】 本發明係指一種撓性電路’尤指一種具有較小彎折半徑或者角度的 可彎折軟性電路。 【先前技術】 隨著各種電子技術的大行其道，可撓性透明導電膜，尤其是可撓氧 化銦錫(ITO)透明導電膜，成了許多電子技術中的共通核心必要材料， 舉例：在觸控技術領域之中，就需要使用可撓性透明導電膜。常見的 IT◦透明導電膜，多採用捲對捲(Roll to Roll)製程生產，其先以光學級聚 對苯二甲二乙酯(ΡΕΊ)膜作為薄膜之基材，後在PET基材上濺鍍IT〇形 成一層導電膜，最後可在ΙΤΟ層之表面上再形成一層抗刮硬化處理層 (hard coating layer，H/C)，從而完成一片ΙΤΟ透明導電膜的製作，如此 製成的ITO導電膜，本身呈現透明狀並具有可撓性。 觸控面板中’至少有朝向觸碰感應面的上導電層與訊號排線兩個元 件，會需要使用ITO導電膜，但由於兩個元件彼此最後需要電連接， 同時又使用相同材質，即ITO導電膜，因此出現了一體成型軟板，其 合併上導電層與訊號排線兩個元件而成為一體成型軟板，如第一圖(Α) 所示；-體成型軟板的製作方式是先使用ΙΤ〇導電膜作為基板，然後 將銀漿材料以印刷(priming)的方式附著在ΓΓΟ導電膜上，而在ΙΤ〇導 電膜上形成銀麟線，但由於形成在ΙΤ〇導電膜表面的h/c，其質地 脆而易裂，當H/C受到彎折後容易產生裂隙(cmck)，將使得附著於h/c 層上的銀漿佈線，也會隨之斷裂，導致電子訊號無法透過銀渡傳輸而喪 失觸控功能，一體成型軟板的彎折狀態如第一圖出)所示。 也就是’銀渡與IT〇導電膜的結合，雖然可以製成具有可捷性的 -3- 201228487 軟性=路’但這種具有可撓性的軟性電路，其可彎折程纟，似乎仍有很 的乂升二間職疋之故，申請人鏜於習知技術中，在線性分壓電極方 面所產生之種種缺失’經過悉^試驗與研究，並—本_不捨之精神， 終構思出本案「撓性電路與其製作方法」以克社述缺點，以下為本案 之簡要說明。 【發明内容】 本發明經由在導膜，例如：具有硬塗層(hard⑽ting，H/Q的 導電膜與銀聚佈線之間，增力σ一層耐彎折的彈性體，例如：絕緣膠、 防焊油墨、紫外線硬化膝_膠、及其他高分子聚合物等則可避免導電 薄膜在料時’硬塗層所產生之_直接影響到練佈線，使得銀漿佈 線亦Ik之賴’如此即可纽增加軟性電路整體的最何料半徑；可 ，彎折半徑主要將由雜體和銀漿佈喊的可彎折摊所決定。 因此根據本發明的第一構想，提出一種挽性電路，其包括一導電基 板；-彈性層’其設置於該導板之—部份上；以及—導電層，其設 置於該彈性層與該導電基板上。 根據本發明的第二構想’提出―種製作撓性電路的方法，其包括提 供-導電基板；於料電基板上形成__硬塗層；於硬塗層之—部份上形 成一彈性層；以及於該彈性層與該硬塗層上形成一導電層。 根據本發明的第三構想，提出一種製作撓性電路的方法，其包括提 供一導電基板；於該導電基板之—部份上形成—彈性層；以及於該彈性 層與該導電基板上形成一導電層。 【實施方式】 本案將可由町的實關而制充分瞭解，使得翻本技藝之 201228487 人士可以據以完成之，然本案之實施並非可由下列實施案例而被限制其 實施型’4 ’亦即’本發明的細不受已提出之實施繼限制，而應以本 發明提出之申請專利範圍為準。 °月參閱第二圖，其係為本發明第一實施例之示意圖。第二圖所揭示 之軟丨生電路結構200 ’包括軟性導電基板210、彈性層230以及導電層 240軟性導電基板210較佳為包括光學級聚對苯二曱二乙醋(ΡΕΊ)氧化 姻錫(ITO)、聚醋系材質、聚乙烯_系材質、聚碳酸酯 系材質聚一甲酸乙二醇酯(PEN)材質或者三醋酸纖維素(TAC)材質之 薄膜導電基板’彈性層咖較佳為絕緣膠或者絕緣油墨，導電層較 佳為銀衆或者導電油墨，經由在可撓導電基板別與導電層 240之間設 置-層彈性層23〇 ’關使綠電路結構·之最小可彎鄉e▲幻半 徑有效縮小。值得注意的是，可彎折半徑係指材料彎曲後，由材料本身 所形成的弧面與其HJd距離，可由材料力學之侧書籍中獲知。 經實驗後得知，f知技射綠置雜層而在雖導電基板上直接 設置導電層之紐電路’其整體最何騎摊_為5_，但本發 明在相同條件下’經由在軟性導電基板與導電層之間設置彈性層之後， 軟性電路其最何f折半彳蝴著縮小至3mm社，當然，可騎半徑 會隨著軟性導電基板採用不同材質之基板而不同。 請繼續參閱第三圖，其係為本發明第二實施例之示意圖。第三圖所 揭示之撓性電路結構300,包括可撓性導電薄膜31〇、硬塗層办 c〇ating)32〇、彈性材料層330以及導電材料層34〇，可撓性導電薄膜 較佳為包括光學級聚對笨二甲二乙酯氧化銦錫gT〇) '聚醋 (Polyester)系材質、聚乙烯(PE)系材質、聚碳酸酯㈣系材質、聚二甲酸 乙一醇g曰(PEN)材質或者二醋酸纖維素aAC)材質之薄膜導電基板，彈 性材料層330較佳為絕緣膠、防焊油墨、紫外線固化膠^^膠或者高分 201228487 子聚合物料’導電材料層_較佳為銀漿或者導電油墨。 經由在可撓性導電薄膜之硬塗層與導電材料層之間，增加一層彈性 材料層’使得可撓性導電薄膜彎折時，由硬塗層所產生之裂隙(crack)， 不致直接影響到導電材料層，可避免導電材料層受到硬塗隙的影響 而隨之斷裂，如此可有效增加撓性電路結構其整體的可彎折半徑，可彎 折半徑主要將由彈性體和導電材料層搭配後的可彎折半徑所決定。 請繼續參閱第四圖，其係為本發明第三實施例之示意圖。第三圖所 揭不之觸控面板包括作誠舰D與訊號交醒s，作動感應區d 中形成有作域應場，綴感應外來的觸碰作動，而峨紐區s具有 »孔號父換以及訊號匯流之功能，用於接收由外部控制電路所輸入的，用 於形成感蘭猶_作誠觸所需要耕雜制域，並將作動感 應區D __之感應纖傳送餅部控制。峨交匯區s將與 外部控制電路電連接，城交_ s通常必須是—個可彎峰咖㈤ 電路’以利電路之走線或者佈局，且可彎折電路之可彎折半役越大，對 電路之走線或者佈局越為有利。 則訊號交匯區S中具有可彎折電路45〇，可弯折電路45〇包括ιτ〇 導電薄膜彻、設置在ΙΤΟ導電薄膜上的硬塗層CO、設置在硬塗 層(H/C)42〇上的彈性賴43〇以及設置在硬塗層.與彈性膠體柳之 上的銀衆佈線44〇 ;經由在H/C層42〇與銀漿佈線之間，增加一層 而憎折的彈性膠體，可避開H/c層·彎折時裂隙對銀聚佈線相 的影響’彎折伟齡雜賴和練佈線搭_f折半徑決定。 根據以上所述，可歸納出—種製作撓性電路的方法。請參閱第五 圖，其係為本發明之製作撓性電路的方法，其包括步驟观：提供導電 基板；㈣5〇2 :在導電基板上形成硬塗層；麵5〇3 :在硬塗層之一 部份上形成彈性層；以及步驟5〇4 :在彈性層與硬塗層上形成導電層。 -6- 201228487 實施例 ι· 一種撓性電路，其包括— 電基板之一部份上；以及一導電厚 2.如實施例1所提供之撓性電路，更包括_硬塗層，其設置在該 導電基板與該彈性層之間。201228487 VI. Description of the Invention: [Technical Field] The present invention relates to a flexible circuit, particularly a bendable flexible circuit having a small bending radius or angle. [Prior Art] With the popularity of various electronic technologies, flexible transparent conductive films, especially flexible indium tin oxide (ITO) transparent conductive films, have become a common core material in many electronic technologies. For example: in touch Among the technical fields, it is required to use a flexible transparent conductive film. The common IT ◦ transparent conductive film is mostly produced by Roll-Roll process, which uses optical grade poly(p-dimethylene terephthalate) film as the substrate of the film and then on the PET substrate. Sputtering IT〇 forms a conductive film, and finally a layer of anti-scratch hard coating layer (H/C) is formed on the surface of the enamel layer to complete the fabrication of a transparent conductive film. The conductive film itself is transparent and flexible. In the touch panel, at least two elements of the upper conductive layer and the signal line facing the touch sensing surface may require the use of an ITO conductive film, but since the two components finally need to be electrically connected to each other, the same material, that is, ITO is used. Conductive film, so there is an integrally formed soft board, which combines the upper conductive layer and the signal cable to form an integrally formed soft board, as shown in the first figure (Α); the body forming soft board is made first. A tantalum conductive film is used as the substrate, and then the silver paste material is attached to the tantalum conductive film in a priming manner, and a silver pitch line is formed on the tantalum conductive film, but due to the surface formed on the surface of the tantalum conductive film /c, its texture is brittle and easy to crack. When the H/C is bent, it is easy to produce cracks (cmck), which will cause the silver paste attached to the h/c layer to break, which will cause the electronic signal to pass through. Yindu transmission loses the touch function, and the bent state of the integrally formed flexible board is as shown in the first figure. That is, the combination of 'Yindu and IT〇 conductive film, although it can be made into a flexible -3- 201228487 soft = road ' but this flexible flexible circuit, its bendable process, it still seems There are a lot of soaring two jobs, the applicants are in the know-how, the various defects in the linear voltage-dividing electrodes are 'through the test and research, and the spirit of the present, I conceived that the "flexible circuit and its manufacturing method" in this case is based on the shortcomings of the company. The following is a brief description of the case. SUMMARY OF THE INVENTION The present invention passes through a conductive film, for example, a hard coating layer (hard) (H), a conductive film and a silver poly wiring, and a tensile force of σ, a layer of an elastic body, such as an insulating glue, Welding ink, UV-cured knee glue, and other high-molecular polymers can avoid the conductive film being produced when the 'hard coating layer' is directly affected by the wiring, so that the silver paste wiring is also OK. The button increases the maximum radius of the overall flexible circuit; however, the bending radius is mainly determined by the bendable booth of the hybrid and the silver paste. Therefore, according to the first concept of the present invention a conductive substrate; an elastic layer disposed on a portion of the guide; and a conductive layer disposed on the elastic layer and the conductive substrate. According to the second concept of the present invention, And a method of providing a conductive substrate; forming a __ hard coat layer on the material substrate; forming an elastic layer on a portion of the hard coat layer; and forming the elastic layer and the hard coat layer a conductive layer. According to the present invention A third concept is directed to a method of fabricating a flexible circuit comprising: providing a conductive substrate; forming an elastic layer on a portion of the conductive substrate; and forming a conductive layer on the elastic layer and the conductive substrate. [Embodiment] The case will be fully understood by the real customs of the town, so that the 201228487 person who can turn the technology can complete it. However, the implementation of this case cannot be restricted by the following implementation cases. The details of the present invention are not limited by the implementations of the present invention, but should be based on the scope of the patent application of the present invention. The second embodiment is a schematic view of the first embodiment of the present invention. The soft-generating circuit structure 200' includes a flexible conductive substrate 210, an elastic layer 230, and a conductive layer 240. The flexible conductive substrate 210 preferably includes an optical grade poly(p-phenylene terephthalate) (ITO) oxidized agglomerate (ITO). Vinegar-based material, polyethylene _-based material, polycarbonate-based material polyethylene terephthalate (PEN) material or cellulose triacetate (TAC) film conductive substrate 'elastic layer coffee is better The edge layer or the insulating ink, the conductive layer is preferably a silver or conductive ink, and the green layer structure is provided by providing a layer of elastic layer 23 〇 between the flexible conductive substrate and the conductive layer 240. ▲The radius of the magic is effectively reduced. It is worth noting that the bendable radius refers to the distance between the curved surface formed by the material itself and the HJd after the material is bent, which can be known from the side of the material mechanics. The technique of arranging a green impurity layer and directly providing a conductive layer on a conductive substrate, the overall circuit of the circuit is '5', but the present invention provides flexibility between the flexible conductive substrate and the conductive layer under the same conditions. After the layer, the soft circuit is reduced to 3mm. Of course, the rideable radius will vary depending on the substrate of the flexible conductive substrate. Please refer to the third figure, which is a schematic diagram of a second embodiment of the present invention. The flexible circuit structure 300 disclosed in the third embodiment includes a flexible conductive film 31, a hard coat layer 32, an elastic material layer 330, and a conductive material layer 34, and the flexible conductive film is preferably used. Including optical grade poly(p-xylylenedicarboxylate indium tin oxide gT)) Polyester (PE) material, Polyethylene (PE) material, Polycarbonate (4) material, Polyethylene glycol dicarboxylate (曰) PEN) material or a thin film conductive substrate made of cellulose diacetate aAC), the elastic material layer 330 is preferably an insulating paste, a solder resist ink, a UV curable adhesive or a high score 201228487 subpolymer material 'conductive material layer _ preferably It is a silver paste or a conductive ink. When a flexible conductive film is bent between the hard coat layer of the flexible conductive film and the conductive material layer to make the flexible conductive film bend, the crack generated by the hard coat layer does not directly affect The conductive material layer can prevent the conductive material layer from being affected by the hard coating gap and then fracture, so that the flexible radius of the flexible circuit structure can be effectively increased, and the bending radius is mainly composed of the elastic body and the conductive material layer. The bendable radius is determined. Please refer to the fourth figure, which is a schematic diagram of a third embodiment of the present invention. The touch panel disclosed in the third figure includes the ship D and the signal waking s. The action sensing area d is formed with a field application field, and the touch-sensing external touch action, and the button area has a » hole number The function of the parent exchange and the signal convergence is used to receive the input from the external control circuit, which is used to form the sensation of the sensation of the sensation, and the induction fiber of the actuation zone D __ control. The intersection area s will be electrically connected to the external control circuit. The city intersection _ s must usually be a bendable peak coffee (5) circuit 'to facilitate the circuit trace or layout, and the bendable circuit can be bent more. The more favorable the routing or layout of the circuit. The signal intersection area S has a bendable circuit 45〇, and the bendable circuit 45〇 includes a conductive film, a hard coat CO disposed on the conductive film, and a hard coat layer (H/C) 42. The elastic layer on the crucible and the silver wiring 44〇 disposed on the hard coating layer and the elastic colloidal willow; via the H/C layer 42 and the silver paste wiring, a layer of elastic colloid is added Can avoid the impact of the H/c layer and the crack on the silver poly-wiring phase when bending. 'Bending the age of the miscellaneous and practicing wiring to determine the radius of the _f. From the above, a method of fabricating a flexible circuit can be summarized. Please refer to the fifth figure, which is a method for fabricating a flexible circuit according to the present invention, which comprises the steps of: providing a conductive substrate; (4) 5〇2: forming a hard coat layer on the conductive substrate; surface 5〇3: in a hard coat layer An elastic layer is formed on one portion; and step 5〇4: a conductive layer is formed on the elastic layer and the hard coat layer. -6- 201228487 Embodiment ι· A flexible circuit comprising: one part of an electric substrate; and a conductive thickness 2. The flexible circuit as provided in Embodiment 1, further comprising a _ hard coat layer, the setting Between the conductive substrate and the elastic layer.
3·如實施例1至,J 2所提供之撓性電路，其中該導電基板為包括一 聚酯㈣—辦材質、—聚乙締㈣系材f、-聚碳義(PQ系材質、 聚對苯-曱一乙醋(ΡΕη材質、一聚二曱酸乙二醇醋㈣^材質或者一 二醋酸纖維素(TAC)材質之導電膜。 4·如實施例1到3所提供之撓性電路，其中該彈性層為—絕緣膠、 一防焊油墨、—料線硬化膠或者-高分子聚合物。 5·如實施例1到4所提供之撓性電路，其中該導電層較佳為一銀 漿層或者一導電油墨層。 6· -種製作紐電路的方法，其包括提供—導電基板；於該導電 基板上形成-硬塗層；於硬塗層之—部份上形成—雜層；以及於該彈 性層與該硬塗層上形成一導電層。3. The flexible circuit as provided in Embodiments 1 to J2, wherein the conductive substrate comprises a polyester (four) material, a polyethylene (four) material f, a poly carbon (PQ material, poly) a conductive film of benzoquinone-acetic acid (yttrium-based material, polyethylene terephthalate vinegar (tetra)) or cellulose diacetate (TAC). 4. Flexibility as provided in Examples 1 to 3. The circuit wherein the elastic layer is an insulating glue, a solder resist ink, a line hardening glue or a high molecular polymer. 5. The flexible circuit as provided in Embodiments 1 to 4, wherein the conductive layer is preferably a silver paste layer or a conductive ink layer. 6. A method for fabricating a circuit, comprising: providing a conductive substrate; forming a hard coating on the conductive substrate; forming a portion on the hard coating layer a layer; and forming a conductive layer on the elastic layer and the hard coat layer.
導電基板；一彈性層，其設置於該導 ，其設置於該彈性層與該導電基板上。 7. -種製作撓性電路的方法，其包括提供—導電基板；於該導電 基板之-部份上形成-雜層；以及於卿性層與料電基板上形成一 導電層。 如實施例7所提供之方法，更包括於該導電基板與該彈性層之 間形成一硬塗層。 9.如實施例7所提供之方法，其中該導電層是經由印刷卜㈣ 的方式形成在該彈性層與該導電基板上 以上崎者’僅為本㈣之難實_，當候狀限定本發明， ’月的保勤ill當視後附之㈣專纖斷其解镇而定 ，即大凡 201228487 皆應屬於本發明專利涵 依本發明申請專利範圍所作之均等變化與修飾 蓋之範圍内。 【圖式簡單說明】 第一圖(A)係為習知技術之一體成型軟板之示意圖； 第一圖(B)係為習知技術之一體成型軟板的彎折狀態之示立 第二圖係為本發明之可撓性電路之第一實施例之示'^圖不意圖 第三圖係為本發明之軟性電路之第二實施例之示意圖· 第四圖係為本發明之可彎折電路之第三實施例之示意圖4 第五圖係為本發明一種製作撓性電路之流程圖。 及 【主要元件符號說明】 200 :軟性電路結構 230 :彈性層 3〇〇 :撓性電路結構 320 :硬塗層 34〇 :導電材料層 41〇:ΐτ〇導電薄膜 430 :彈性膠體 45〇 :可彎折電路 S:訊號交匯區 210 :軟性導電基板 24〇 :導電層 310 :可撓性導電薄膜 330 :彈性材料層 400 :觸控面板 420 :硬塗層 440 :銀漿佈線 D:作動感應區a conductive substrate; an elastic layer disposed on the conductive layer and disposed on the conductive layer and the conductive substrate. 7. A method of making a flexible circuit comprising: providing a conductive substrate; forming a hetero-layer on a portion of the conductive substrate; and forming a conductive layer on the clear layer and the electrical substrate. The method as provided in embodiment 7, further comprising forming a hard coat layer between the conductive substrate and the elastic layer. 9. The method as provided in embodiment 7, wherein the conductive layer is formed on the elastic layer and the conductive substrate by means of printing (4), and the upper surface is only for the present (4). Inventive, 'month's life insurance ill attached to the four (4) special fiber to break its solution, that is, Dafan 201228487 should belong to the scope of the invention according to the scope of the invention of the invention and the scope of the modification. BRIEF DESCRIPTION OF THE DRAWINGS The first figure (A) is a schematic view of a body-formed soft board of the prior art; the first figure (B) is a second state of the bent state of the body-formed soft board of the prior art. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a second embodiment of a flexible circuit of the present invention. FIG. 4 is a view of a second embodiment of the present invention. 4 is a flow chart of a third embodiment of the circuit. The fifth figure is a flow chart for fabricating a flexible circuit according to the present invention. And [Major component symbol description] 200: Flexible circuit structure 230: Elastic layer 3〇〇: Flexible circuit structure 320: Hard coat layer 34〇: Conductive material layer 41〇: ΐτ〇 Conductive film 430: Elastic colloid 45〇: Bending circuit S: signal intersection area 210: flexible conductive substrate 24: conductive layer 310: flexible conductive film 330: elastic material layer 400: touch panel 420: hard coat layer 440: silver paste wiring D: actuation sensing area
5〇1 :提供導電基板 502 :在導電基板上形成硬塗層 503 :在硬塗層之一部份上形成彈性層 504 :在彈性層與硬塗層上形成導電層 •8-5〇1: providing a conductive substrate 502: forming a hard coat layer on the conductive substrate 503: forming an elastic layer on a part of the hard coat layer 504: forming a conductive layer on the elastic layer and the hard coat layer • 8-