TW201227015A - Light guide panel and fabricating method thereof - Google Patents
Light guide panel and fabricating method thereof Download PDFInfo
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- TW201227015A TW201227015A TW99147318A TW99147318A TW201227015A TW 201227015 A TW201227015 A TW 201227015A TW 99147318 A TW99147318 A TW 99147318A TW 99147318 A TW99147318 A TW 99147318A TW 201227015 A TW201227015 A TW 201227015A
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000005520 cutting process Methods 0.000 claims abstract description 105
- 230000003287 optical effect Effects 0.000 claims abstract description 75
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 230000000295 complement effect Effects 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 description 8
- 238000003754 machining Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
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- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
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- 238000005259 measurement Methods 0.000 description 1
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Abstract
Description
201227015 GLT10032TW(I) 36512twf.doc/n 六、發明說明: 【發明所屬之技術領域】 本發明是有關於一種導光板及其製作方法,且特別是 有關於一種具有光學元件陣列的導光板、及利用切割工具 於導光板上形成該光學元件陣列之導光板的製作方法。八 【先前技術】201227015 GLT10032TW(I) 36512twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a light guide plate and a method of fabricating the same, and more particularly to a light guide plate having an array of optical elements, and A method of fabricating a light guide plate of the optical element array on a light guide plate by using a cutting tool. Eight [previous technology]
在精密加工的領域中,通常是利用刀具對於各樣導光 板進行切割來形成光學微結構。以導光板的表面處理為 例,當欲在導光板上製作導光微結構時,可利用單一刀具 來回地於導光板的表面上進行溝槽的刻劃。然而,這樣的 做法會有以下的缺點: ’ 首先’刀具的壽命會縮短。在進行刻劃溝槽的過程中, 由於刀具持續地與導光板直接磨擦,而使刀具容易產生磨 損、變形、因高熱而硬度降低、斷裂等問題;並且,當刀 具產生損毀的情形時,所刻劃出的溝槽的精密度也會^之 下降’造成導光板的良率無法提昇。 再者,上述加工方法的速度極慢。由於每一溝栌均以 單-刀具销來回進行_工作,所以當溝槽數量^多 所刻劃的面積相當大時,整體加工時間會拉長。 來看’也可嘗試利關短刀具的單—行 來提昇加工速度,但是這樣的方式會因刀”,法, 而產生瞬間高熱,反而縮短刀具的使用壽命。〜速移動 還有,上述的刀具不適合特殊形狀的微結構加工盘大 201227015 GLT10032TW(I) 36512twf.doc/n 量生產。當使用者想絲作具有特殊 必須分別更換不同的刀具來進行。更.^,且有第- 種微結構㈣-凹槽需第—種刀具來^關,具有 第二種微結構的第二凹槽需以第二種刀具來進行刻劃。如 此一來’將導致刀具的加工路徑、拖 而難以大縣料歧。細辦變躲為複雜, 構的2疋胳述早—刀具來製作導光板的導光微結 構的方式,將祕導光微結_射衫麵問題。由上 開發-種㈣解決現有問題的導光板的製作方法 疋有其必要的。 【發明内容】 列 工具 有^本發明提供一種導光板,具有光學元 ’且還具有能提昇導光板的光學效果的刻劃線。 本發明提供-種導光板的製作方法,利用新賴 ,而能夠製作上述的導光板 本發明提出-種導缺,具有—表面,該表面 方向與第二方向,該第一方向與該第二方向之間 度。此導光板包括:光學元件陣列以及刻 Λ 劃線 角 陣列設置於導光板的表面上、且於第—方向中^70件 線設置於導光板的表面上、且於第二方向中延伸。。刻劃 本發明又提出一種導光板的製作方法。首 =一導光板,該導光板具有一表面,該表面具有第二供至 也哲一一 ’該第-方向與該第二方向之間失—角户方向 與第二方向 再 201227015 GLT10032TW(I) 36512twf.doc/nIn the field of precision machining, it is common to use a cutter to cut a variety of light guide plates to form an optical microstructure. Taking the surface treatment of the light guide plate as an example, when a light guiding microstructure is to be formed on the light guide plate, the groove can be scribed on the surface of the light guide plate with a single tool. However, such an approach has the following disadvantages: 'First' the life of the tool will be shortened. In the process of scribed grooves, since the tool continuously rubs directly with the light guide plate, the tool is prone to wear, deformation, hardness reduction, fracture due to high heat, and the like, and when the tool is damaged, The precision of the grooved groove will also drop, which will result in a failure in the yield of the light guide plate. Furthermore, the above processing method is extremely slow. Since each gully is operated back and forth with a single-tool pin, the overall machining time is lengthened when the number of grooves is large and the area scribed is considerable. Look at the 'can also try to close the single-row of short tools to increase the processing speed, but this way will be due to the knife, method, and produce instant high heat, but shorten the life of the tool. ~ Speed moving, the above The tool is not suitable for the special shape of the microstructure processing disk 201227015 GLT10032TW (I) 36512twf.doc / n mass production. When the user wants to have a special need to change the different tools to carry out the different. ^, and there is the first - micro Structure (4) - The groove needs the first type of tool to be closed, and the second groove with the second type of microstructure needs to be scribed with the second type of tool. This will cause the machining path of the tool to be difficult to drag. The big county is awkward. It is complicated to do so. The structure of the 2 疋 述 早 — 刀具 刀具 刀具 刀具 刀具 制作 制作 制作 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具 刀具(4) A method for fabricating a light guide plate that solves the prior art is required. SUMMARY OF THE INVENTION The present invention provides a light guide plate having an optical element and also having a score line capable of improving the optical effect of the light guide plate. The invention provides The present invention provides a light guide plate, which has a surface, a surface direction and a second direction, the first direction and the second direction. The light guide plate comprises: an array of optical elements and an array of engraved scribe lines disposed on a surface of the light guide plate, and wherein the line of the first direction is disposed on the surface of the light guide plate and in the second direction The present invention further provides a method for fabricating a light guide plate. The first = a light guide plate having a surface having a second supply to the same direction - the first direction and the second direction Loss between - corner direction and second direction again 201227015 GLT10032TW(I) 36512twf.doc/n
來,提供至少一切割工具,其中,每一切割工具包括··基 部、至少一切割部以及多個微結構。基部具有一旋轉軸。 切割部設置於基部上、且沿著旋轉轴的延伸方向而排列。 微結構設置於切割部上。之後,使切割工具進行旋轉而切 割導光板,其中,被切割後的該導光板包括:光學元件陣 列以及刻劃線。光學元件陣列設置於導光板的該表面上、 且於第一方向中延伸。刻劃線設置於導光板的該表面上、 且於第二方向中延伸。 在本發明的一實施例中,上述的刻劃線分佈於該表面 的同一水平/垂直基準線上、或不同的水平/垂直基準線上。 在本發明的一實施例中,上述的角度為90±10度。 在本發明的一實施例中,上述的表面包括:該導光板 的入光面、出光面或反光面。 在本發明的一實施例中,上述的光學元件陣列包括: 多個光學微透鏡,突出於導光板的表面,且光學微透鏡的 形狀是選自於半圓形、V字形、R溝及其組合。 在本發明的一實施例中,上述的光學元件陣列包括: 夕,個光學微透鏡,内凹於導光板的表面,且光學微透鏡的 形狀是選自於半圓形、v字形、R溝及其組合。 义、 實施例中,上述的光學元件陣列包括: 這些光學微透鏡彼此之間的尺寸為相 在本發明的一 多個光學微透鏡, 或不相同。 著旋轉軸的 在本發明的一實施例中,上述的切割部沿 延伸方向而同軸排列。 201227015 GLT10032TW(I) 36512twf.doc/„ 在本發明的一實施例中,上述的切割部沿著旋轉軸的 延伸方向而螺旋排列。 、在本發明的一實施例中,上述的基部與切割部為一體 成型、或為彼此組裝。 在本發明的—實施例中,上述的微結構突出於切割 邛,且微結構的形狀是選自於半圓形、V字形、R溝及其 組二,且微結構的形狀互補於光學元件陣列的光學微透鏡 的形狀。 在本發_-實施例巾,上述的微結構内凹於切判 和微結構的形狀是選自於半κ形、V字形、R溝及心且 t且微結構的形狀互補於光學元件陣列的絲微透 形狀。 寸為二實施射’上述的微結構彼此之間的尺 基於上述,本發明的導光板具有光學元件陣列盘刻 線’其中,刻劃線可提供霧化光線的光學效果。利用二 HH對於導絲騎_或表面處 ,可以於導歧的絲上㈣地軸絲元 ,線。尤其是’該導光板的製作方法適合在厚度極薄^導 光板上形成光學元件陣列以及刻劃線。 為讓本發明之上述特徵和優點能更明顯易懂, 舉實施例,並配合所附圖式作詳細說明如下。 . 201227015 GLT 10032TW(I) 36512twf.doc/n 【實施方式】At least one cutting tool is provided, wherein each cutting tool includes a base, at least one cut, and a plurality of microstructures. The base has a rotating shaft. The cutting portions are provided on the base and arranged along the extending direction of the rotating shaft. The microstructure is disposed on the cutting portion. Thereafter, the cutting tool is rotated to cut the light guide plate, wherein the cut light guide plate includes: an array of optical elements and a score line. The optical element array is disposed on the surface of the light guide plate and extends in the first direction. The scribe line is disposed on the surface of the light guide plate and extends in the second direction. In an embodiment of the invention, the scribe lines are distributed on the same horizontal/vertical reference line of the surface or on different horizontal/vertical reference lines. In an embodiment of the invention, the angle is 90 ± 10 degrees. In an embodiment of the invention, the surface includes: a light incident surface, a light exit surface or a light reflecting surface of the light guide plate. In an embodiment of the invention, the optical element array includes: a plurality of optical microlenses protruding from a surface of the light guide plate, and the shape of the optical microlens is selected from the group consisting of a semicircular shape, a V shape, and an R groove. combination. In an embodiment of the invention, the optical element array includes: an optical microlens, recessed on a surface of the light guide plate, and the shape of the optical microlens is selected from a semicircular shape, a v shape, and a R groove. And their combinations. In the embodiment, the optical element array described above includes: the optical microlenses are different from each other in size relative to one or more optical microlenses of the present invention. In one embodiment of the invention, the cutting portions are coaxially arranged in the extending direction. 201227015 GLT10032TW(I) 36512twf.doc/ „ In one embodiment of the invention, the cutting portions are spirally arranged along the extending direction of the rotating shaft. In an embodiment of the invention, the base portion and the cutting portion are In the embodiment of the present invention, the microstructure is protruded from the cutting ridge, and the shape of the microstructure is selected from the group consisting of a semicircle, a V shape, a R groove, and a group thereof. And the shape of the microstructure is complementary to the shape of the optical microlens of the optical element array. In the present invention, the shape of the above-mentioned microstructure is concave and the shape of the microstructure is selected from the group consisting of a half κ shape and a V shape. The R groove and the core and the shape of the microstructure are complementary to the shape of the wire micro-transparent of the optical element array. The size of the above-mentioned microstructures is based on the above. The light guide plate of the present invention has an optical element array. The engraved line 'where the scribing line can provide the optical effect of atomizing light. Using the two HH for the guide wire to ride on the _ or the surface, it can be on the guide wire (4) the ground wire element, the wire. Especially the 'light guide plate Suitable for making The optical element array and the scribe line are formed on the extremely thin thickness of the light guide plate. The above features and advantages of the present invention can be more clearly understood, and the embodiments will be described in detail below with reference to the accompanying drawings. 201227015 GLT 10032TW(I) 36512twf.doc/n [Embodiment]
[導光板I 圖1為本發明實施例的一種導光板的立體示意圖、及 導光板表面的光學微結構的示意圖。請參照圖1,導光板 LGP具有一表面S1(S2或S3),該表面S1(S2或S3) 具有第一方向D1以及與第一方向D1夾一角度Θ的第二方 向D2。在一實施例中,導光板LGP的表面S1可以是入光 面,該導光板LGP的表面S2可以是出光面,而該導光板 LGP的表面S3可以是反光面。該角度Θ可為90±10度、 較佳為90度。 上述導光板L G P的光學微結構可包括:光學元件陣列 OPA以及刻劃線CL。光學元件陣列OPA可設置於導光板 LGP的表面si、S2、S3上、且於第一方向D1中延伸。 更詳細而言,光學元件陣列OPA可包括:多個光學 微透鏡LEN ’内凹於導光板LGP的表面,且光學微透鏡 LEN的形狀是選自於半圓形、v字形、R溝及其組合(互 補於後續圖6所示的突出於切割部12〇的微結構13〇 )。 另外,光學元件陣列OPA也可包括:多個光學微透 鏡LEN,突出於導光板LGP的表面,且光學微透鏡lEN 的形狀可選自於半圓形、V字形、R溝及其組合(互補於 後續圖7所示的内凹於切割部12〇的微結構13〇)。再者, 光學元件陣列〇PA的多個光學微透鏡LEN的彼此之間的 尺寸可為相同或不相同,其中尺寸相同或不相同係指二積 相同或不相同,或者是體積的相同或不相同。先學元件陣 201227015 GLT10032TW(I) 36512twf.doc/n 列OPA可以是規律地、或隨機地排列在導光板LGP的表 面SI、S2、S3上,端看所需的光學效果。 請再參照圖1,刻劃線CL可設置於導光板LGP的表 面SI、S2、S3上、且於第二方向D2中延伸。更詳細而言, 可在導光板LGP的至少一表面SI、S2或S3,或者全部表 面SI、S2、S3上形成光學元件陣列OPA以及刻劃線Cl。 再者,刻劃線CL可隨機地分佈於該表面SI、S2、S3 上,亦即,刻劃線CL可分佈於表面S1的同一水平/垂直 基準線(未纟會不)上、或不同的水平/垂直基準線上。更詳 細而言’表面S1可具有多條水平基準線,且將水平基準 線轉90度來看即可視為多條垂直基準線,而刻劃線cl可 位於同一條水平基準線的位置(規律設置),或位於不同 一條水平基準線的位置(隨機設置),使得可藉由刻劃線 CL的設置而造成霧面的光學效果。 以下’將進一步說明本發明之導光板的製作方法。 【導光板的製作方法】 圖2為本發明實施例的一種導光板的製作方法的製作 流程示意圖。圖3為本發明實施例的一種切割工具的示意 圖。請同時參照圖1、圖2與圖3來理解本發明的導光板 的製作方法M100。由圖2可知,導光板的製作方法M100 包括步驟S110〜S130。 首先’在步驟S110中,提供如圖1所示的至少一導 光板LGP ’該導光板LGP具有一表面SI、S2、S3,該表 201227015 GLT10032T W (I) 36512twf. doc/n 面SI、S2、S3具有第一方向D1以及與第一方向D1夾一 角度Θ的第二方向D2。[Light Guide Plate I] FIG. 1 is a schematic perspective view of a light guide plate according to an embodiment of the present invention, and a schematic view of an optical microstructure of a surface of the light guide plate. Referring to Fig. 1, the light guide plate LGP has a surface S1 (S2 or S3) having a first direction D1 and a second direction D2 which is at an angle Θ to the first direction D1. In one embodiment, the surface S1 of the light guide plate LGP may be a light incident surface, the surface S2 of the light guide plate LGP may be a light exit surface, and the surface S3 of the light guide plate LGP may be a light reflecting surface. The angle Θ may be 90 ± 10 degrees, preferably 90 degrees. The optical microstructure of the light guide plate L G P may include an optical element array OPA and a scribe line CL. The optical element array OPA may be disposed on the surfaces si, S2, S3 of the light guide plate LGP and extend in the first direction D1. In more detail, the optical element array OPA may include: a plurality of optical microlenses LEN' are recessed on the surface of the light guide plate LGP, and the shape of the optical microlens LEN is selected from semicircular, v-shaped, R-grooves and Combined (complementary to the microstructure 13〇 protruding from the cutting portion 12〇 shown in Fig. 6). In addition, the optical element array OPA may further include: a plurality of optical microlenses LEN protruding from the surface of the light guide plate LGP, and the shape of the optical microlens 1EN may be selected from a semicircular shape, a V shape, an R groove, and a combination thereof (complementary Subsequent to the microstructure 13 内) recessed in the cutting portion 12A shown in FIG. Furthermore, the dimensions of the plurality of optical microlenses LEN of the optical element array 〇PA may be the same or different, wherein the same or different dimensions mean the same or different, or the same or no volume the same. Learning element array 201227015 GLT10032TW(I) 36512twf.doc/n Column OPA can be regularly or randomly arranged on the surface SI, S2, S3 of the light guide LGP to see the desired optical effect. Referring again to Fig. 1, the scribe line CL may be disposed on the surfaces SI, S2, and S3 of the light guide plate LGP and extended in the second direction D2. In more detail, the optical element array OPA and the scribe line C1 may be formed on at least one surface SI, S2 or S3 of the light guide plate LGP, or on all of the surfaces SI, S2, S3. Furthermore, the scribe lines CL may be randomly distributed on the surfaces SI, S2, S3, that is, the scribe lines CL may be distributed on the same horizontal/vertical reference line (not yet) or different from the surface S1. Horizontal/vertical reference line. In more detail, the surface S1 may have a plurality of horizontal reference lines, and the horizontal reference line may be regarded as a plurality of vertical reference lines by turning 90 degrees, and the scribe line cl may be located at the same horizontal reference line (regularity) Set), or the position of a different horizontal reference line (random setting), so that the optical effect of the matte surface can be caused by the setting of the scribe line CL. The method of producing the light guide plate of the present invention will be further described below. [Manufacturing Method of Light Guide Plate] FIG. 2 is a schematic flow chart showing a manufacturing method of a light guide plate according to an embodiment of the present invention. Figure 3 is a schematic illustration of a cutting tool in accordance with an embodiment of the present invention. The method of manufacturing the light guide plate M100 of the present invention will be understood by referring to Figs. 1, 2 and 3. As can be seen from FIG. 2, the method 100 of manufacturing the light guide plate includes steps S110 to S130. First, in step S110, at least one light guide plate LGP as shown in FIG. 1 is provided. The light guide plate LGP has a surface SI1, S2, S3, which is 201227015 GLT10032T W (I) 36512twf. doc/n surface SI, S2 S3 has a first direction D1 and a second direction D2 that is at an angle Θ to the first direction D1.
再來,在步驟S120中,提供如圖3所示的至少一切 割工具100,其中,每一切割工具100包括··基部110、至 少一切割部120以及多個微結構130。基部110具有一旋 轉軸110a。切割部120設置於基部110上、沿著旋轉軸ll〇a 的延伸方向L而排列。微結構130設置於切割部120上。 切割部120的數量、長度、排列於基部11〇的位置等都可 變化’亦即根據導光板LGP所需的光學效果來進行設計。 之後,在步驟S130中,使切割工具1〇〇進行旋轉而 切割導光板LGP,其中,被切割後的如圖i所示的導光板 LGP包括:光學元件陣列〇PA以及刻劃線cL。光學元件 陣列OPA設置於導光板LGP的該表面SI、S2、S3上、且 於第一方向D1中延伸。刻劃線(^設置於導光板LGp的 該表面SI、S2、S3上、且於第二方向D2中延伸。 值得注意的是’可利用切割工具刚在導光板LGp 的至少-表面S1、S2 < S3,或者全部表面s2、幻 割或表面處理,而形成光學元件陣列〇pA以及刻 劃綠CL。 綠示了三個切割部12〇,然而 園 注蒽到 :=量並可而進行機,並: 同或彼此不同形離的微上分別設置彼此相 201227015 GLT10032TW(I) 36512twf.doc/n 上述的切割工具100藉由在切割部120上設置微結構 130 ’使付g切割工具1〇〇在進行向速旋轉時,微結構I% 可在切割工具100的旋轉方向R的切線上、對與微結構130 接觸的導光板LGP進行切割或刻劃工作。結果是,於切割 導光板LGP同時,可自然地在導光板LGp的切割面上形 成光學元件陣列OPA與刻劃線CL,且光學元件陣列〇pA 的光學微透鏡LEN的形狀與切割工具1〇〇的微結構13〇 的形狀彼此為互補。 請再參照圖3’切割部120可沿著旋轉軸11〇a的延伸 方向L而同軸排列。在另一實施例中,切割部12〇也可以 採用其他的排列方式。圖4為本發明實施例的另一種切割 工具的示意圖。請參照圖4,此切割工具1〇2與圖3的切 割工具1〇〇相同的元件標示以相同的符號。可注意到,在 此實施例中,切割部120沿著旋轉軸110&的延伸方向而螺 旋排列。藉由同軸排列或螺旋排列的方式,可以使切割部 120上的多處微結構13〇均能夠進行切割或表面刻劃的效 果,使得切割工具100適於進行具有大面積的工件的切割 或表面處理。如此一來,可解決習知利用單一刀具進行重 覆切割所引起之刀具損毁的問題。 請再參照圖3 ’基部110與切割部12〇為一體成型, 也就是說,可以利用精密機械加工、或電加工切割,直接 在一圓柱體(未繪示)上形成切割部12〇,使切割部12〇 與基部110是一體連接的。 在另一實施例中,基部110與切割部120也可以採用 201227015 GLT10032TW(I) 36512twf.doc/nFurther, in step S120, at least all of the cutting tools 100 as shown in Fig. 3 are provided, wherein each cutting tool 100 includes a base 110, at least one cutting portion 120, and a plurality of microstructures 130. The base 110 has a rotating shaft 110a. The cutting portion 120 is provided on the base portion 110 and arranged along the extending direction L of the rotation axis 11a. The microstructures 130 are disposed on the cutting portion 120. The number, length, position of the dicing portions 120, and the like arranged in the base portion 11 can be changed 'that is, designed according to the optical effect required for the light guide plate LGP. Thereafter, in step S130, the cutting tool 1 is rotated to cut the light guide plate LGP, wherein the light guide plate LGP shown in Fig. i after cutting includes the optical element array 〇PA and the scribe line cL. The optical element array OPA is disposed on the surfaces SI, S2, S3 of the light guide plate LGP and extends in the first direction D1. The scribe lines (^ are disposed on the surfaces SI, S2, S3 of the light guide plate LGp and extend in the second direction D2. It is worth noting that 'the cutting tool can be used at least on the surface S1, S2 of the light guide plate LGp < S3, or all surface s2, morphing or surface treatment, to form the optical element array 〇pA and the scribed green CL. Green shows three cutting parts 12〇, however, the quantity is: And: respectively, the same or different from each other, the micro-tops are respectively set to each other 201227015 GLT10032TW (I) 36512twf.doc / n The above cutting tool 100 by placing the microstructure 130 on the cutting portion 120 'to make the g cutting tool 1 When the idling rotation is performed, the microstructure I% can cut or scribe the light guide plate LGP that is in contact with the microstructure 130 in the tangential direction of the rotation direction R of the cutting tool 100. As a result, the light guide plate is cut. At the same time, the optical element array OPA and the score line CL are naturally formed on the cut surface of the light guide plate LGp, and the shape of the optical microlens LEN of the optical element array 〇pA and the microstructure of the cutting tool 1〇〇 are The shapes are complementary to each other. Please refer again 3' cutting portion 120 may be coaxially arranged along the extending direction L of the rotating shaft 11A. In another embodiment, the cutting portion 12A may also adopt other arrangements. FIG. 4 is another embodiment of the present invention. A schematic view of a cutting tool. Referring to Figure 4, the same components of the cutting tool 1 2 and the cutting tool 1 of Figure 3 are labeled with the same symbols. It may be noted that in this embodiment, the cutting portion 120 is along The rotation axes 110 & are arranged in a spiral direction. By means of a coaxial arrangement or a spiral arrangement, the plurality of microstructures 13 on the cutting portion 120 can be cut or surface-engraved, so that the cutting tool 100 is suitable. For the cutting or surface treatment of a workpiece having a large area, the problem of the tool damage caused by the repeated cutting by a single tool can be solved. Referring again to FIG. 3, the base 110 and the cutting portion 12 are In one piece, that is, the cutting portion 12 can be formed directly on a cylinder (not shown) by precision machining or electromachining, so that the cutting portion 12 and the base 110 are one. Connected. In another embodiment, the base 110 of the cutting portion 120 may be employed 201227015 GLT10032TW (I) 36512twf.doc / n
其他的連接方式。圖5為本發明實施例的再一種切割工具 的示意圖。請參照圖5,此切割工具104與圖3的切割^ 具100相同的元件標示以相同的符號。可注意到,在^實 施例中,基部110與切割部12〇為彼此組裝。更詳細而士、, 基部110與切割部12〇是分開製作的,並且,可利用點•接 或特殊的嵌合結構等方式使切割部120固定到基部·"ΐι〇 上,以使切割工具104在高速旋轉時,切割部备 基部110上脫離。 θ 圖6為本發明一實施例的切割工具的微結構的示咅 圖。請參照圖6,將切割部丨2〇的區域Α進行放大後, 看到微結構130的形狀。請繼續參照圖6,在一實施例中, 上述的微結構130可突出於切割部120,且微結構13〇的 形狀可以是選自於半圓形、V字形、R溝及其組合,亦即, 如圖6所繪示的半圓形微結構13〇a、v字形微結構13此、 R溝微結構130c、130d。利用圖6所示的突出於切割部12〇 的微結構130,可在導光板LGP的表面上切割出内凹於導 光板LGP表面的光學微透鏡[ΕΝ。 圖7為本發明另一實施例的切割工具的微結構的示意 圖。請參照圖7,在另一實施例中,將切割部12〇的區域 B進行放大後,可看到微結構13〇是内凹於切割部12〇, 且微結構130的形狀可以是選自於半圓形、倒v字形、尺 溝f其組合,亦即,如圖7所繪示的半圓形微結構13如、 V子形微結構130b、R溝微結構uoc、13〇d。利用圖7所 示的内凹於切割部12 0的微結構丨3 〇,可在導光板 LGP白勺 11 201227015 GLT10032TW(I) 36512twf. doc/π 表面上切割出突出於導光板LGP表面的光學微透鏡LEN。 上述各種微結構130a〜130d彼此之間的尺寸可為相 同或不相同’例如,可以採用具有不同尺寸的R溝微結構 130c、130d’或是多個尺寸相同的半圓形微結構13〇a等。 所述技術領域具有通常知識者,可以根據設計需要組合微 結構130a〜13〇d的種類、尺寸等。如此一來,可以直接於 切割部120上組合各式各樣的微結構13〇,而可解決以往Other connection methods. Figure 5 is a schematic illustration of still another cutting tool in accordance with an embodiment of the present invention. Referring to FIG. 5, the same components of the cutting tool 104 as the cutting tool 100 of FIG. 3 are denoted by the same reference numerals. It may be noted that in the embodiment, the base 110 and the cutting portion 12 are assembled to each other. In more detail, the base 110 and the cutting portion 12A are separately manufactured, and the cutting portion 120 can be fixed to the base portion by using a point or a special fitting structure or the like to make the cutting. When the tool 104 is rotated at a high speed, the cutting portion base portion 110 is detached. θ Figure 6 is a schematic view showing the microstructure of a cutting tool according to an embodiment of the present invention. Referring to Fig. 6, the area of the cutting portion 丨2〇 is enlarged, and the shape of the microstructure 130 is seen. Referring to FIG. 6 , in an embodiment, the microstructure 130 may protrude from the cutting portion 120 , and the shape of the microstructure 13 可以 may be selected from a semicircular shape, a V shape, an R groove, and a combination thereof. That is, as shown in FIG. 6, the semicircular microstructures 13a, the v-shaped microstructures 13, and the R-channel microstructures 130c, 130d. With the microstructure 130 protruding from the cutting portion 12A shown in Fig. 6, an optical microlens [内 which is recessed on the surface of the light guide plate LGP can be cut on the surface of the light guide plate LGP. Fig. 7 is a schematic view showing the microstructure of a cutting tool according to another embodiment of the present invention. Referring to FIG. 7, in another embodiment, after the area B of the cutting portion 12A is enlarged, it can be seen that the microstructure 13 is concave in the cutting portion 12A, and the shape of the microstructure 130 may be selected from The combination of a semicircular shape, an inverted v shape, and a ruler groove f, that is, a semicircular microstructure 13 as shown in FIG. 7, such as a V subshaped microstructure 130b, an R groove microstructure uoc, 13〇d. The optical structure protruding from the surface of the light guide plate LGP can be cut on the surface of the light guide plate LGP 11 201227015 GLT10032TW(I) 36512twf. doc/π by using the microstructure 丨3 内 recessed in the cutting portion 120 shown in FIG. Microlens LEN. The above various microstructures 130a to 130d may have the same or different sizes from each other. For example, R groove microstructures 130c, 130d' having different sizes or a plurality of semicircular microstructures 13a of the same size may be used. Wait. Those skilled in the art will be able to combine the types, sizes, and the like of the microstructures 130a to 13〇d according to design requirements. In this way, a wide variety of microstructures 13 can be combined directly on the cutting portion 120, and the conventional solution can be solved.
需要更換不同刀具所引起之刀具的加工路徑、換刀順序變 得極為複雜的問題。 圖8為利用本發明實施例所述的切割工具對於導光板 進行切割的示意圖。請參見圖8,切割工具1〇〇可以在^ 在旋轉方向R上高速旋轉,以在切割方向c上對於單片^ 多片堆疊的導光板LGP進行切割。值得注意的是,由於十 割工具1〇〇的切割部12〇設置了微結構13〇,所以在對^ 導光板LGP進行切割的同時,可於導光板LGp的表面s (入光面)形成如圖1所示的光學元件陣列〇pA以及^ 線 CL。 2It is necessary to replace the machining path of the tool caused by different tools, and the problem of changing the tool sequence becomes extremely complicated. Fig. 8 is a schematic view showing the cutting of the light guide plate by the cutting tool according to the embodiment of the present invention. Referring to Fig. 8, the cutting tool 1 can be rotated at a high speed in the rotational direction R to cut a single sheet of the plurality of stacked light guide plates LGP in the cutting direction c. It is to be noted that, since the cutting portion 12 of the ten-cutting tool 1 is provided with the microstructure 13 〇, the surface s (light-in surface) of the light guide plate LGp can be formed while cutting the light guide plate LGP. The optical element array 〇pA and the line CL shown in Fig. 1 . 2
承上述,可利用切割工具1〇〇可對於多層堆疊的導光 板LGP進行快速糊’独可賴_導練LGp的勢 程時間,也可導光板LGP的表面S1 (人光面)上形^ 需的光學元件陣列0PA以及刻劃線(^。特別是,對於厚 度相當薄的導光板LGP而言,利用切割工具1〇〇可以容易 地於^光板LGP的表φ S1 (人;^面)刻|彳出光學元件 列 OPA 〇 12 201227015 GLT10032TW(I) 36512twf.doc/nAccording to the above, the cutting tool 1 可 can be used for the multi-layer stacked light guide plate LGP, and the potential time of the LGp can be adjusted, or the surface S1 (human light surface) of the light guide plate LGP can be formed. The required optical element array 0PA and the scribe line (^. In particular, for the relatively light-thickness light guide plate LGP, the cutting tool 1 〇〇 can be easily used for the table φ S1 of the light plate LGP (person; ^ face) Engraved|Extracted optical component column OPA 〇12 201227015 GLT10032TW(I) 36512twf.doc/n
圖9為利用本發明實施例所述的切割工具對於導光板 進行表面處理的示意圖。請參照圖9,可使切割工具100 高速旋轉’再使導光板LGP在輸送帶(未繪示)上於輸送 方向D上進行傳送,切割部12〇上的微結構130會與導光 板LGP的表面S2 (出光面)或S3 (反光面)接觸,而刻 劃出光學元件陣列OPA以及刻劃線CL。所形成的光學元 件陣列OPA例如是透鏡微陣列(lens array ),可提供所需 的光學效果,而刻劃線CL可以用來霧化光線。 圖10為本發明實施例的一種切割工具模組的示意 圖。請參照圖10,切割工具模組200包括:多個上述的切 割工具100,其中,這些切割工具1〇〇在旋轉軸u〇a的延 伸方向L上進行排列。 如圖9所示,僅繪示一個切割工具1〇〇進行表面處理 的不意圖,然而,本發明並不僅限於使用一個切割工具 1 夕00。更詳細而言,當導光板LGp的面積增大時,可利用 夕個切割工具10〇所構成的切割工具模組200輕易地對於 大面積的導光板LGP進行切割或表面處理。 另外’可拼裝出對應於該特定尺寸的導光板LGp 二工具杈組200,以對於該特定尺寸的導光板進 二或表面處理。再者’當切割卫具模組測中的任_ 具100損㈣,可直接抽換該損壞的㈣卫具 有利於維修效率的提昇。 特別是,也可任意組合具有各種不同的微結構 切割工具100〜刚,來形成切割工具餘200。如此一來的 13 201227015 GLT10032TW(I) 36512twf.doc/n 可製作各種形態的光學元件陣列〇PA。 综上所述’本發明的導光板及其製作方法至少具有以 下優點: 利用本發明實施例所述的切割卫具對於導光板進行 切割或表面處理’可以於導光板的表面上形成光學元件陣 歹慎刻劃線’其巾,刻劃線可提供霧化光線的光學效果。 並且’该導光板的製作方法適合在厚度極薄的導光板上形 成光學元件陣列以及刻劃線。 當進行切割或表面處理時,在切割部上設置的多個微 φ 結構可對於導光板進行刻劃’能夠提昇切割工具的加工速 度、延長切割工具的壽命。另外,藉由在切割部上形成各 式各樣的微結構,而可以在導光板上形成所需的任意光學 元件陣列,而適合特殊形狀的光學元件陣列的加工了 干 雖然本發明已以實施例揭露如上,然其並非用以限定 本發明’任何所屬技術領域中具有通常知識者,在不 本發明之精神和範圍内,當可作些許之更動與潤飾,故 發明之保護範圍當視後附之申請專利範圍所界定者為準。 魯 【圖式簡單說明】 圖1為本發明實施例的一種導光板的立體示音圖、及 導光板表面的光學微結構的示意圖。 圖2為本發明實施例的一種導光板的製作方法的势 流程示意圖。 圖3為本發明實施例的一種切割工具的示意圖。 14 201227015 GLT10032TW(I) 36512twf.doc/n 割工具的示意圖。 圖4為本發明實施綱的示意圖。 圖5為本發明實施綱的微結構的示竟 圖6為本發明一實施例的切割 " 圖0 别;^具的微結構的示意 圖7為本發明另一實施例的切^ 圖。 曰、' 圖8為利用本發明實施例所述的切」’、對於‘光板 進行切割的示意圖。 圖9為利用本發明實施例所迷的切刻 進行表面處理的示意圖。 °卫具對於導光板 圖10為本發明實施例的一種切却 ° 具模組的示意圖。 【主要元件符號說明】 100、102、104 :切割工具 110 :基部 110a :旋轉軸 120 :切割部 130 :微結構 130a :半圓形微結構 130b : V字形微結構 130c、130d : R溝微結構 200 :切割工具模組 A、B .區域 C:切割方向 15 201227015 GLT10032TW(I) 36512twf.doc/n CL :刻劃線 D :輸送方向 D1 :第一方向 D2 :第二方向 LGP :導光板 L:旋轉軸的延伸方向 M100 :導光板的製作方法 OPA :光學元件陣列 R :旋轉方向 S :工件的表面 51 :入光面 52 :出光面 53 :反光面 S110、S120、S130 :步驟 16Fig. 9 is a schematic view showing the surface treatment of the light guide plate by the cutting tool according to the embodiment of the present invention. Referring to FIG. 9, the cutting tool 100 can be rotated at a high speed. Then, the light guide plate LGP is transported on the conveyor belt (not shown) in the conveying direction D. The microstructure 130 on the cutting portion 12 is connected to the light guide plate LGP. The surface S2 (light-emitting surface) or S3 (reflective surface) is in contact with the optical element array OPA and the scribe line CL. The formed optical element array OPA is, for example, a lens array that provides the desired optical effect, and the scribe line CL can be used to atomize light. Figure 10 is a schematic illustration of a cutting tool module in accordance with an embodiment of the present invention. Referring to Fig. 10, the cutting tool module 200 includes a plurality of the above-described cutting tools 100, wherein the cutting tools 1 are arranged in the extending direction L of the rotating shaft u〇a. As shown in Fig. 9, only one cutting tool 1 is not intended to be surface-treated, however, the present invention is not limited to the use of one cutting tool 1 00. More specifically, when the area of the light guide plate LGp is increased, the cutting tool module 200 constituted by the cutting tool 10 can be easily cut or surface-treated for the large-area light guide plate LGP. Further, a light guide plate LGp two tool set 200 corresponding to the specific size can be assembled to perform a second or surface treatment for the light guide plate of the specific size. Furthermore, when any of the cutting aids module measurement has 100 damage (four), the damaged (four) guards can be directly replaced to facilitate the improvement of maintenance efficiency. In particular, it is also possible to arbitrarily combine various cutting tools 100 to just to form a cutting tool 200. As a result, 13 201227015 GLT10032TW(I) 36512twf.doc/n can produce various types of optical element arrays 〇PA. In summary, the light guide plate of the present invention and the manufacturing method thereof have at least the following advantages: the cutting or surface treatment of the light guide plate by the cutting and protecting device according to the embodiment of the present invention can form an optical element array on the surface of the light guide plate. Carefully scribing 'the towel', the scribing line provides the optical effect of atomizing light. And the method of fabricating the light guide plate is suitable for forming an array of optical elements and scribe lines on a light guide plate having an extremely small thickness. When cutting or surface treatment is performed, a plurality of micro φ structures provided on the cutting portion can be scribed for the light guide plate' to increase the processing speed of the cutting tool and extend the life of the cutting tool. In addition, by forming a wide variety of microstructures on the dicing portion, any desired array of optical elements can be formed on the light guide plate, and processing of the array of optical elements suitable for a particular shape is performed. The disclosure of the invention is not intended to limit the invention as to the ordinary knowledge of the art, and the scope of protection of the invention may be changed without departing from the spirit and scope of the invention. The scope defined in the patent application is subject to change. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a light guide plate and an optical microstructure of a surface of a light guide plate according to an embodiment of the invention. FIG. 2 is a schematic flow chart of a method for fabricating a light guide plate according to an embodiment of the invention. 3 is a schematic view of a cutting tool according to an embodiment of the present invention. 14 201227015 GLT10032TW(I) 36512twf.doc/n Schematic diagram of the cutting tool. Figure 4 is a schematic illustration of an embodiment of the invention. Figure 5 is a schematic view of a microstructure of an embodiment of the present invention. Figure 6 is a schematic view of a microstructure of a cutting device according to another embodiment of the present invention. Figure 7 is a cross-sectional view showing another embodiment of the present invention.曰, ' Fig. 8 is a schematic view showing the cutting of the light plate by the cutting "" according to the embodiment of the present invention. Fig. 9 is a schematic view showing surface treatment by dicing in accordance with an embodiment of the present invention. ° Guard for Light Guide Figure 10 is a schematic view of a dicing block module in accordance with an embodiment of the present invention. [Main component symbol description] 100, 102, 104: cutting tool 110: base 110a: rotating shaft 120: cutting portion 130: microstructure 130a: semicircular microstructure 130b: V-shaped microstructure 130c, 130d: R groove microstructure 200: Cutting tool module A, B. Area C: Cutting direction 15 201227015 GLT10032TW(I) 36512twf.doc/n CL : scribe line D: conveying direction D1: first direction D2: second direction LGP: light guide plate L : Extension direction of the rotating shaft M100 : Method of manufacturing the light guide plate OPA : Optical element array R : Direction of rotation S : Surface 51 of the workpiece : Light-incident surface 52 : Light-emitting surface 53 : Reflective surface S110, S120, S130 : Step 16
Claims (1)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99147318A TW201227015A (en) | 2010-12-31 | 2010-12-31 | Light guide panel and fabricating method thereof |
| US13/335,982 US20120170316A1 (en) | 2010-12-31 | 2011-12-23 | Light guide panel and fabricating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99147318A TW201227015A (en) | 2010-12-31 | 2010-12-31 | Light guide panel and fabricating method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201227015A true TW201227015A (en) | 2012-07-01 |
Family
ID=46933081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99147318A TW201227015A (en) | 2010-12-31 | 2010-12-31 | Light guide panel and fabricating method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201227015A (en) |
-
2010
- 2010-12-31 TW TW99147318A patent/TW201227015A/en unknown
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