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TW201226602A - Articles and method for making the same - Google Patents

Articles and method for making the same Download PDF

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TW201226602A
TW201226602A TW99145676A TW99145676A TW201226602A TW 201226602 A TW201226602 A TW 201226602A TW 99145676 A TW99145676 A TW 99145676A TW 99145676 A TW99145676 A TW 99145676A TW 201226602 A TW201226602 A TW 201226602A
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Taiwan
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layer
chromium
substrate
target
flow rate
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TW99145676A
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Chinese (zh)
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TWI503431B (en
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Hsin-Pei Chang
Wen-Rong Chen
Huan-Wu Chiang
Cheng-Shi Chen
Kao-Yu Liao
xiao-qing Xiong
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Hon Hai Prec Ind Co Ltd
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Abstract

An article is provided which includes a substrate, and a chromium layer, a CrON layer and an Al2O3 layer formed on the substrate in that order. The article has excellent high temperature oxidation resistance and abrasion resistance. A method for making the article is also provided.

Description

201226602 六、發明說明: 【發明所屬之技術領域】 [0001] 本發明涉及一種被覆件及其製造方法。 【先前技術】 [0002] 習知的鎂、錢合金、銘或銘合金等低熔點材料的成型模 具的材質通常為不錄鋼。然而,在高溫氧化性環境中, 不錄鋼基體表面易形成疏鬆的氧化絡層;當溫 度逐漸升南,以2〇3層變得不穩定並開始分解,使得不錄 〇 鋼基體内部Fe、Nl等金屬離子向Cr2〇3層擴散,引起 %03層出現裂紋、剝落等氧齡效現象,大大降低了不 銹鋼基體的高溫抗氧化性。 剛此夕卜,所述W層的形成將使成型模具表面變得粗縫, 如此將影響成型產品的外觀、降低成型產品的良率,同 時亦會縮短成型模具的使用壽命。 【發明内容】 國#鑒於此,有必要提供一種能較好的解決上述問題的被 〇 覆件。 [0005]另外,還提供上述被覆件的製造方法。 剛-種被覆件,包括基體、依次形成於基體上的鉻層、氮 氧化鉻層及氧化紹層。 [0007] 一種被覆件的製造方法,包括以下步驟: [〇〇〇8] 提供基體; [0009]以鉻靶為靶材’於基體上磁控濺射鉻層; 099145676 表單編號A0101 第3頁/共15頁 0992078629-0 201226602 [0010] 以鉻祀為靶材,以氮氣及氧氣為反應氣體,於鉻層上磁 控濺射氮氧化鉻層; [0011] 以鋁靶為靶材,以氧氣為反應氣體,於氮氧化鉻層上磁 控濺射氧化鋁層。 [0012] 本發明被覆件的製造方法,在基體上藉由磁控濺射鍍膜 法依次形成鉻層、氮氧化鉻層及氧化鋁層。所述鉻層及 氮氧化鉻層的形成,可有效提高所述基體的高溫抗氧化 性;所述氧化鋁層的形成可防止所述氮氧化鉻層被刮傷 ,從而使所述被覆件具有良好的耐磨性。 [0013] 此外,當被覆件為用於成型鎂、鎂合金、鋁或鋁合金等 低熔點材料的成型模具時,所述被覆件高溫抗氧化性的 提高,可提高成型產品的良率,還可延長被覆件的使用 壽命。 【實施方式】 [0014] 請參閱圖1,本發明一較佳實施例的被覆件10包括基體11 、依次形成於基體11上的鉻層13、氮氧化鉻(CrON)層 15及氧化鋁(ΑΙρΟ。)層17。 L ϋ [0015] 所述基體11的材質為不銹鋼、模具鋼或高速鋼等。 [0016] 所述被覆件10可為用於成型鎂、鎂合金、鋁或鋁合金等 低炫點材料的成型模具。 [0017] 所述鉻層13、CrON層15及Aljq層17可分別藉由磁控藏 L 〇 射鍍膜法形成。 [0018] 所述鉻層13的厚度為100〜200nm。 099145676 表單編號A0101 第4頁/共15頁 0992078629-0 201226602 [0019] 所述CrON層15的厚度為0. 5~1 "in。所述CrON層15中鉻 元素的質量百分含量為40%〜60%,氧元素的質量百分含量 為30%~50%,氮元素的質量百分含量為5%~15%。 [0020] [0021] 所述Al2〇3層17的厚度為0. 3〜0. δβιη。 請一併參閱圖2所示,本發明一較佳實施例的被覆件1〇的 製造方法主要包括如下步驟·· [0022] 提供一基體11。該基體11可以藉由沖壓成型得到。 〇 [0023] [0024] [0025] ❹ 099145676 對該基體π進行預處理。該預處理可包括常規的對基體 11進行化學除油、除蠟、酸洗、超聲波清洗及烘乾等步 驟。 提供一鍵膜機100,將所述基體11置於該鍵膜機100内, 採用磁控濺射鍍膜法依次於基體11上形1絡層13、CrON 層 15及A190Q層 17。 如圖2所示,該鍍膜機1〇〇包括一鍍膜室20及連接在鍍膜 室20的一真空泵30 ,真空泵3{κ用以對鍍膜室2〇抽真空。 該鍍膜室20内設有轉架(未圖示)、二第一靶材22及二 第二靶材23。轉架帶動基體u沿圓形執跡21運行,且基 體11在沿轨跡21運行時亦自轉。二第一靶材22與二第二 乾材23關於軌跡21的中心對稱設置,且二第一把材22相 對地設置在軌跡21的内外侧,二第二靶材23相對地設置 在轨跡21的内外側。每一第—靶材22及每一第二靶材23 的兩端均設有氣源通道24,氣體經該氣源通道24進入所 述鍍膜室20中。當基體丨丨穿過二第一靶材22之間時,將 鍍上第一靶材22表面濺射出的粒子,當基體過二第 表單編號A0101 第5頁/共15頁 〇9 201226602 二靶材23之間時,將鍍上第二靶材23表面濺射出的粒子 。本實例中,所述第一靶材22為鉻靶,所述第二靶材23 為鋁靶。 [0026] [0027] [0028] 於该基體11的表面磁控濺射鉻層13。形成所述鉻層13的 具體操作方法及工藝參數為:對該鍍膜室2〇進行抽真空 處理至本底真空度為8. 0x1 0_3Pa,以氬氣為工作氣體, 向鍍膜至20内通入流量為〜2〇〇sc cm的氬氣,於基體 11上施加-loo —300V的偏壓,加熱該鍍膜室2〇至 100~150°C (即鍍膜溫度為100~150。〇 ,開啟第一乾材 22的電源,設置其功率為5~1〇kw,沉積該鉻層。沉積 5玄絡層13的時間為5〜15miη。 所述鉻層13中的Cr原子在高溫氧化環境下可與〇原子結合 形成〇2〇3保護膜,因而可有效防止基體丨〗發生氧化而失 效。 於該鉻層13上形成CrON層15。形成隸CrON層15的具體操 作方法及工藝參數為:保持氬氣流量、鍍膜溫度、第— 乾材22的電源功率及施加於‘體11的偏壓不變,以氮氣 及氧氣為反應氣體,設置氮氣的流量為1〇〜1〇〇sccm、氧 氣的流量為10〜lOOsccm ’沉積該cr〇N層15。沉積該 CrON層15的時間為30〜60min,沉積完畢後關閉所述第__ 靶材22的電源並停止通入氮氣。 所述的CrON層15在其形成過程t可形成Cr—〇&Cr_N兩相 化合物,該兩相化合物同時形成可相互抑制各相晶粒的 生長’從而可降低各相晶粒的尺寸’增強該^训層15的 099145676 表單編號A0101 第6頁/共15頁 0992078629-0 [0029] 201226602 [0030] 緻密性而達到阻礙氧氣向Cr ΟΝ層丨5内邛擴散的作用,可 進一步防止基體11發生氧化而失蛛° 於該CrON層15上形成Al2〇3層17。形成该Al2〇3層17的具 體操作方法及工藝參數為:保掎氬氟流量、鍍膜溫度及 施加於基體11的偏壓不變,以氧氯為反應氣體,設置氧 氣的流量為50〜10 Osccm,開啟所述第一把材23的電源’ 設置其功率為5〜l〇kw,沉積該7 /儿積邊ΑΙ^Ο〗 層17的時間為20〜40min。 Ο [0031] 所述人1。0_3層17具有高熔點、高硬度及優異的耐磨性能, L· 〇 因此該A190Q層17能夠對CrON層15進行保護’防止CrON u U 層1 5被到傷。 ί [0032] 關閉負偏壓及靶材的電源,停止通入氬氣及氧氣,待所 述Α 12〇3層17冷卻後,向鍍膜内通入空氣,打開鍍膜室門 ’取出鍍覆有鉻層13、CrON層15及A 1203層17的基體11 〇 [0033] 本發明較佳實施例被覆件10的製造方法在基體11上藉由 磁控濺射鍍膜法依次形成鉻層13、CrON層15及A1 0層 « 〇 17。所述絡層13及CrON層15的形成,可有效提高所述基 體11的高溫抗氧化性;所述AlQOq層17的形成可防止 CrON層15被刮傷,從而使所述被覆件1〇具有良好的耐磨 性。 [0034] 此外,當被覆件10為用於成型鎂、鎂合金、鋁或鋁合金 等低熔點材料的成型模具時,所述被覆件1〇高溫抗氧化 性的提高,可提高成型產品的良率,還可延長被覆件1〇 099145676 表單編號A0101 第7頁/共15頁 0992078629-0 201226602 的使用壽命。 [0035] 下面藉由實施例來對本發明進行具體說明。 [0036] 實施例1 [0037] ( 1 )磁控濺射形成鉻層13 [0038] 對該鍍膜室20進行抽真空處理至本底真空度為8x1 (T3Pa ,以氬氣為工作氣體,向鍍膜室20内通入流量為 150sccm的氬氣,於基體11上施加-200V的偏壓,加熱該 鍍膜室20至120°C (即鍍膜溫度為120°C),開啟第一靶 材22的電源,設置其功率為8kw,沉積該鉻層13。沉積該 鉻層13的時間為5min。 [0039] ( 2 )磁控濺射形成CrON層15 [0040] 保持氬氣流量、鑛膜溫度、第一把材2 2的電源功率及施 加於基體11的偏壓不變,以氮氣及氧氣為反應氣體,設 置II氣的流量為30sccm、氧氣的流量為40sccm,沉積該 CrON層15。沉積該CrON層15的時間為40min,沉積完畢 後關閉所述第一靶材22的電源並停止通入氮氣。 [0041] (3)磁控藏射形成Al2〇3層17 [0042] 保持氬氣流量、鍍膜溫度及施加於基體11的偏壓不變, 以氧氣為反應氣體,設置氧氣的流量為80sccm,開啟所 述第二靶材23的電源,設置其功率為8kw,沉積該Al2〇3 層17。沉積該Al2〇3層17的時間為40min。 [0043] 實施例2 099145676 表單編號A0101 第8頁/共15頁 0992078629-0 201226602 [0044] ( 1 )磁控濺射形成鉻層13 [0045] 對該鍍膜室20進行抽真空處理至本底真空度為8x1 0_3Pa ,以氬氣為工作氣體,向鍍膜室20内通入流量為 150sccm的氬氣,於基體11上施加-200V的偏壓,加熱該 鍍膜室20至120°C (即鍍膜溫度為120°C),開啟第一靶 材22的電源,設置其功率為5kw,沉積該鉻層13。沉積該 鉻層13的時間為lOmin。 [0046] ( 2 )磁控濺射形成CrON層15 〇 [0047] 保持氬氣流量、鍍膜溫度、第一靶材22的電源功率及施 加於基體11的偏壓不變,以氮氣及氧氣為反應氣體,設 置氮氣的流量為60sccm、氧氣的流量為80sccm,沉積該 CrON層15。沉積該CrON層15的時間為60min,沉積完畢 後關閉所述第一靶材22的電源並停止通入氮氣。 [0048] (3)磁控濺射形成人19013層17 L 〇 [0049] 保持氬氣流量、鍍膜溫度及施加於基體11的偏壓不變, 以氧氣為反應氣體,設置氧氣的流量為1 0 0 sccm,開啟所 述第二靶材23的電源,設置其功率為8kw,沉積該Al2〇3 層17。沉積該人1,(^層17的時間為30min。 [0050] 性能測試 [0051] 將上述製得的被覆件10進行電磁遮罩效能測試、百格測 試、鹽霧測試和高溫高濕測試,具體測試方法及結果如 下: [0052] (1)高溫抗氧化測試 099145676 表單編號A0101 第9頁/共15頁 0992078629-0 201226602 [0053] 採用管式熱處理爐,以10°C/min的升溫速率升溫至800 °C,並800°C下保溫10h,然後冷卻該熱處理爐。 、 [0054] 測試表明,由本發明實施例1及2所製得的被覆件10經800 °C熱處理1 Oh後未見發生氧化、脫落等不良。可見,由本 發明實施例方法所製得的被覆件1 0具有良好的高溫抗氧 化性。 [0055] (2)耐磨性測試 [0056] 採用5700型線性耐磨性測試儀,在載荷為lkg力的作用下 ,以2英寸的滑行長度、25迴圈/分鐘的迴圈速度摩擦被 覆件10的表面。 [0057] 結果表明,由本發明實施例1和2所製得的被覆件10在10 個迴圈後均沒有露出基材。可見,該被覆件10具有較好 的耐磨性。 【圖式簡單說明】 [0058] 圖1為本發明一較佳實施例的被覆件的剖視圖; [0059] 圖2為製造圖1中鍍膜件所用真空鍍膜機的示意圖。 【主要元件符號說明】 [0060] 被覆件:10 [0061] 基體:11 [0062] 鉻層:13 [0063] 氮氧化鉻層:15 [0064] 氧化鋁層:17 099145676 表單編號A0101 第10頁/共15頁 0992078629-0 100 201226602 [0065] 鍍膜機: [0066] 鍍膜室: [0067] 真空泵: [0068] 軌跡:21 • [0069] 第一靶材 [0070] 第二靶材 [0071] 氣源通道 ❹ 20 30 :22 :23 :24 099145676 表單編號A0101 第11頁/共15頁 0992078629-0201226602 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a covering member and a method of manufacturing the same. [Prior Art] [0002] A molding tool of a conventional low-melting material such as magnesium, a carbon alloy, or an inscription alloy is usually not recorded. However, in the high-temperature oxidizing environment, the surface of the non-recorded steel substrate tends to form a loose oxide layer; when the temperature gradually rises to the south, the layer becomes unstable and begins to decompose, so that the Fe inside the steel matrix is not recorded. Metal ions such as Nl diffuse into the Cr2〇3 layer, causing oxygen ageing phenomena such as cracking and spalling in the %03 layer, which greatly reduces the high temperature oxidation resistance of the stainless steel substrate. Immediately thereafter, the formation of the W layer will make the surface of the molding die rough, which will affect the appearance of the molded product, reduce the yield of the molded product, and shorten the service life of the molding die. SUMMARY OF THE INVENTION In view of this, it is necessary to provide a quilt that can better solve the above problems. Further, a method of manufacturing the above-described covering member is also provided. The rigid-coated member comprises a substrate, a chromium layer sequentially formed on the substrate, a chromium oxynitride layer and an oxide layer. [0007] A method of manufacturing a coated member, comprising the steps of: [〇〇〇8] providing a substrate; [0009] magnetron sputtering a chromium layer on a substrate with a chromium target as a target; 099145676 Form No. A0101 Page 3 / Total 15 pages 0992078629-0 201226602 [0010] Using chrome ruthenium as a target material, using nitrogen and oxygen as reaction gases, magnetron sputtering a chromium oxynitride layer on a chromium layer; [0011] using an aluminum target as a target Oxygen is the reactive gas, and the aluminum oxide layer is magnetron sputtered on the chromium oxynitride layer. [0012] In the method for producing a coated article of the present invention, a chromium layer, a chromium oxynitride layer and an aluminum oxide layer are sequentially formed on the substrate by a magnetron sputtering coating method. The formation of the chromium layer and the chromium oxynitride layer can effectively improve the high temperature oxidation resistance of the substrate; the formation of the aluminum oxide layer can prevent the chromium oxynitride layer from being scratched, so that the coated member has Good wear resistance. [0013] Further, when the covering member is a molding die for molding a low melting point material such as magnesium, magnesium alloy, aluminum or aluminum alloy, the high temperature oxidation resistance of the coated member can improve the yield of the molded product, and It can extend the service life of the coated parts. Embodiments [0014] Referring to FIG. 1, a covering member 10 according to a preferred embodiment of the present invention includes a base 11 , a chromium layer 13 sequentially formed on the base 11 , a chromium oxynitride (CrON) layer 15 , and alumina ( ΑΙρΟ.) Layer 17. L ϋ [0015] The material of the base 11 is stainless steel, die steel or high speed steel. [0016] The covering member 10 may be a molding die for molding a low-spot material such as magnesium, magnesium alloy, aluminum or aluminum alloy. [0017] The chromium layer 13, the CrON layer 15, and the Aljq layer 17 may be formed by a magnetron storage coating method, respectively. [0018] The chromium layer 13 has a thickness of 100 to 200 nm. 5〜1 "in。 The thickness of the CrON layer 15 is 0. 5~1 "in. The thickness of the CrON layer 15 is 0. 5~1 "in. The content of chromium in the CrON layer 15 is 40% to 60%, the mass percentage of oxygen is 30% to 50%, and the mass percentage of nitrogen is 5% to 15%. Δβιη。 [0021] The thickness of the layer of the Al 2 〇 3 is 0. 3~0. δβιη. Referring to FIG. 2, the manufacturing method of the covering member 1 of the preferred embodiment of the present invention mainly includes the following steps: [0022] A substrate 11 is provided. The base 11 can be obtained by press forming. [0025] [0025] ❹ 099145676 Pre-treating the substrate π. The pretreatment may include conventional steps of chemical degreasing, wax removal, pickling, ultrasonic cleaning, and drying of the substrate 11. A bonding machine 100 is provided, and the substrate 11 is placed in the bonding machine 100, and a layer 13, a CrON layer 15, and an A190Q layer 17 are sequentially formed on the substrate 11 by magnetron sputtering. As shown in Fig. 2, the coater 1 includes a coating chamber 20 and a vacuum pump 30 connected to the coating chamber 20, and a vacuum pump 3{κ is used to evacuate the coating chamber 2〇. In the coating chamber 20, a turret (not shown), two first targets 22, and two second targets 23 are provided. The turret drives the base u to run along the circular track 21, and the base 11 also rotates as it travels along the trajectory 21. The two first targets 22 and the two second dry materials 23 are symmetrically disposed with respect to the center of the track 21, and the two first materials 22 are oppositely disposed on the inner and outer sides of the track 21, and the second targets 23 are oppositely disposed on the track. The inner and outer sides of 21. A gas source passage 24 is provided at each end of each of the first target 22 and each of the second targets 23, and the gas enters the coating chamber 20 through the gas source passage 24. When the substrate 丨丨 passes between the two first targets 22, the particles sputtered on the surface of the first target 22 are plated, and the substrate is passed through the second form No. A0101, page 5 / 15 pages 2012 9 201226602 When the material 23 is between, the particles sputtered on the surface of the second target 23 are plated. In the present example, the first target 22 is a chromium target and the second target 23 is an aluminum target. [0028] [0028] The chromium layer 13 is magnetron sputtered on the surface of the substrate 11. The specific operation method and process parameters for forming the chromium layer 13 are as follows: vacuuming the coating chamber 2 to a background vacuum of 8. 0x1 0_3Pa, using argon as the working gas, and introducing the coating into the coating to 20 The flow rate is argon gas of ~2 〇〇sc cm, and a bias of -loo - 300V is applied to the substrate 11, and the coating chamber is heated to 2 to 100 ° C (ie, the coating temperature is 100 to 150. The power source of a dry material 22 is set to have a power of 5~1〇kw, and the chromium layer is deposited. The time for depositing the 5 Xuanqi layer 13 is 5~15miη. The Cr atom in the chromium layer 13 can be in a high temperature oxidation environment. The ruthenium atom is combined with the ruthenium atom to form a ruthenium 2〇3 protective film, thereby effectively preventing oxidation of the substrate 失效 and failing. The CrON layer 15 is formed on the chrome layer 13. The specific operation method and process parameters for forming the CrON layer 15 are: The argon flow rate, the coating temperature, the power supply of the first dry material 22, and the bias voltage applied to the 'body 11 are unchanged, and nitrogen and oxygen are used as the reaction gas, and the flow rate of the nitrogen gas is set to 1 〇 1 〇〇 sccm, oxygen. The flow rate is 10 to 100 sccm 'deposited the Cr〇N layer 15. The time for depositing the CrON layer 15 is 30~60min, after the deposition is completed, the power of the __ target 22 is turned off and nitrogen gas is stopped. The CrON layer 15 can form a Cr-〇 & Cr_N two-phase compound during the formation process t, the two phases The simultaneous formation of the compounds inhibits the growth of the grains of the respective phases, thereby reducing the size of the grains of the respective phases. The enhancement of the layer 15 of the training layer 15 is exemplified. 099145676 Form No. A0101 Page 6 of 15 0992078629-0 [0029] 201226602 [0030 The compactness prevents the diffusion of oxygen into the crucible of the Cr layer 5, and further prevents the substrate 11 from being oxidized and loses the formation of the Al2〇3 layer 17 on the CrON layer 15. The Al2〇3 layer 17 is formed. The specific operation method and process parameters are: maintaining the argon fluoride flow rate, the coating temperature and the bias voltage applied to the substrate 11, and using oxygen chlorine as the reaction gas, setting the flow rate of oxygen to 50 to 10 Osccm, opening the first The power supply of the material 23 is set to have a power of 5 to l 〇 kw, and the time for depositing the layer 7 is 20 to 40 min. 003 [0031] The layer of the human 1. 0_3 has a high Melting point, high hardness and excellent wear resistance, L· 〇 Therefore, the A190Q layer 17 can Protecting the CrON layer 15 'prevents the CrON u U layer 15 from being damaged. ί [0032] Turn off the negative bias and the target power supply, stop the argon and oxygen, and wait for the Α 12〇3 layer 17 to cool. Thereafter, air is introduced into the coating film, and the coating chamber door is opened. The substrate 11 plated with the chromium layer 13, the CrON layer 15, and the A 1203 layer 17 is removed. [0033] The manufacturing method of the coated member 10 of the preferred embodiment of the present invention is On the substrate 11, a chromium layer 13, a CrON layer 15, and an A1 0 layer «〇17 are sequentially formed by magnetron sputtering. The formation of the layer 13 and the CrON layer 15 can effectively improve the high temperature oxidation resistance of the substrate 11; the formation of the AlQOq layer 17 can prevent the CrON layer 15 from being scratched, so that the coated member has Good wear resistance. [0034] Further, when the covering member 10 is a molding die for molding a low melting point material such as magnesium, magnesium alloy, aluminum or aluminum alloy, the high temperature oxidation resistance of the covering member 1 can improve the quality of the molded product. Rate, can also extend the service life of the cover 1〇099145676 Form No. A0101 Page 7 / Total 15 Page 0992078629-0 201226602. [0035] The present invention will be specifically described below by way of examples. [0037] Embodiment 1 [1] (1) Magnetron sputtering to form a chromium layer 13 [0038] The coating chamber 20 is evacuated to a background vacuum of 8x1 (T3Pa, with argon as a working gas, An argon gas having a flow rate of 150 sccm is introduced into the coating chamber 20, a bias of -200 V is applied to the substrate 11, and the coating chamber is heated to a temperature of 120 ° C (ie, a coating temperature of 120 ° C) to open the first target 22 . The power source is set to a power of 8 kw, and the chromium layer 13 is deposited. The time for depositing the chromium layer 13 is 5 min. [2] Magnetron sputtering to form a CrON layer 15 [0040] Maintaining argon flow rate, film temperature, The power of the first material 22 and the bias voltage applied to the substrate 11 are unchanged, and nitrogen gas and oxygen gas are used as reaction gases, a flow rate of the second gas is set to 30 sccm, and a flow rate of oxygen gas is 40 sccm, and the CrON layer 15 is deposited. The time of the CrON layer 15 is 40 min, after the deposition is completed, the power of the first target 22 is turned off and nitrogen gas is stopped. [0041] (3) Magnetron storage forms an Al 2 〇 3 layer 17 [0042] Maintaining argon flow rate The coating temperature and the bias voltage applied to the substrate 11 are unchanged, and oxygen is used as the reaction gas, and the flow rate of the oxygen gas is set to 80 sccm. The power source of the second target 23 is set to have a power of 8 kW, and the Al 2 〇 3 layer 17 is deposited. The time for depositing the Al 2 〇 3 layer 17 is 40 min. [0043] Example 2 099145676 Form No. A0101 Page 8 / Total 15 page 0992078629-0 201226602 [0044] (1) Magnetron sputtering to form a chromium layer 13 [0045] The coating chamber 20 is vacuumed to a background vacuum of 8x1 0_3Pa, with argon as a working gas, to the coating An argon gas having a flow rate of 150 sccm is introduced into the chamber 20, a bias of -200 V is applied to the substrate 11, and the coating chamber is heated to 20 ° C to 120 ° C (ie, the coating temperature is 120 ° C), and the power of the first target 22 is turned on. The power is set to 5kw, and the chromium layer 13 is deposited. The time for depositing the chromium layer 13 is 10 minutes. [0046] (2) Magnetron sputtering to form the CrON layer 15 〇 [0047] Maintain argon flow rate, coating temperature, The power supply of a target 22 and the bias voltage applied to the substrate 11 are unchanged, and nitrogen gas and oxygen gas are used as reaction gases, a flow rate of nitrogen gas is set to 60 sccm, and a flow rate of oxygen gas is 80 sccm, and the CrON layer 15 is deposited. The CrON layer 15 is deposited. The time is 60 min, after the deposition is completed, the power of the first target 22 is turned off and the nitrogen is stopped. [0048] (3) Magnetron sputtering to form a person 19013 layer 17 L 〇 [0049] The argon gas flow rate, the coating temperature, and the bias voltage applied to the substrate 11 are maintained, and oxygen is used as a reaction gas, and the flow rate of oxygen is set. 1 0 0 sccm, the power of the second target 23 is turned on, and the power is set to 8 kW, and the Al 2 〇 3 layer 17 is deposited. The person 1 was deposited, and the time of the layer 17 was 30 min. [0050] Performance Test [0051] The coated member 10 prepared above was subjected to an electromagnetic masking effectiveness test, a hundred-square test, a salt spray test, and a high-temperature and high-humidity test. The specific test methods and results are as follows: [0052] (1) High temperature oxidation resistance test 099145676 Form No. A0101 Page 9 of 15 0992078629-0 201226602 [0053] Using a tube heat treatment furnace at a heating rate of 10 ° C / min The temperature was raised to 800 ° C, and the temperature was maintained at 800 ° C for 10 h, and then the heat treatment furnace was cooled. [0054] Tests showed that the coated members 10 obtained by the inventive examples 1 and 2 were heat treated at 800 ° C for 1 Oh. See the occurrence of oxidation, shedding, etc. It can be seen that the coated member 10 obtained by the method of the embodiment of the present invention has good high-temperature oxidation resistance. [0055] (2) Abrasion resistance test [0056] Adopting 5700 type linear wear resistance The sex tester rubbed the surface of the covering member 10 with a sliding stroke length of 2 inches and a loop speed of 25 loops/minute under the action of a load of lkg. [0057] The results show that the inventions 1 and 2 are The obtained covering member 10 has no exposed base after 10 loops. 1 is a sectional view of a coated member according to a preferred embodiment of the present invention; [0059] FIG. 2 is a manufacturing view of FIG. Schematic diagram of the vacuum coater used for the coated member. [Main component symbol description] [0060] Cover member: 10 [0061] Base: 11 [0062] Chromium layer: 13 [0063] Chromium oxynitride layer: 15 [0064] Alumina layer :17 099145676 Form No. A0101 Page 10 of 15 0992078629-0 100 201226602 [0065] Coating machine: [0066] Coating chamber: [0067] Vacuum pump: [0068] Track: 21 • [0069] First target [ 0070] Second target [0071] Air source passage ❹ 20 30 : 22 : 23 : 24 099145676 Form No. A0101 Page 11 / Total 15 Page 0992078629-0

Claims (1)

201226602 七、申請專利範圍: 1 · 一種被覆件’包括基體,其改良在於:所述被覆件還包括 依次形成於基體上的鉻層、氮氧化鉻層及氧化鋁層。 2 .如申請專利範圍第1項所述之被覆件,其中所述鉻層、氮 氧化銘層及氧化鋁層分別藉由磁控濺射鍍膜法形成。 3 ·如申請專利範圍第1或2項所述之被覆件,其中所述氮氧化 在呂層中銘元素的質量百分含量為40%~65%,氧元素的質量 百分含量為3〇%〜45%,氮元素的質量百分含量為5%〜15% 〇 4 ·如申請專利範圍第1項所述之被覆件,其中所述鉻層的厚 度為100〜2 0 0nm。 5 ·如申請專利範圍第1項所述之被覆件,其中所述氮氧化鉻 層的厚度為0.5〜l/zm,所述氧化鋁層的厚度為0. 3〜〇. 5 // m 〇 6.如申請專利範圍第1項所述之被覆件,其中所述基體為不 錄鋼、模具鋼或高速鋼。 7 . 一種被覆件的製造方法,包括以下步驟: 提供基體; 以鉻靶為靶材,於基體上磁控濺射鉻層; 以鉻靶為靶材,以氮氣及氧氣為反應氣體,於鉻層上磁控 濺射氮氧化鉻層; 以鋁靶為靶材,以氧氣為反應氣體,於氮氧化鉻層上磁控 濺射氧化鋁層。 8 .如申請專利範圍第7項所述之被覆件的製造方法,其中磁 控濺射鉻層的步驟採用如下方式實現:以氬氣為工作氣體 099145676 表單編號A0101 第12頁/共15頁 0992078629-0 201226602 ,設置氬氣流量為100~200sccm,於基體上施加 -100~-300V的偏壓,鍍膜溫度為i〇〇~i50°C,設置鉻乾 的電源功率為5〜1 Okw,沉積時間為5〜1 5m i η。 9 .如申請專利範圍第7項所述之被覆件的製造方法,其中磁 控濺射氮氧化鉻層的步驟採用如下方式實現:以氬氣為工 作氣體’设置氬氣流量為1〇〇〜200sccm,設置I氣的流 量為10〜lOOsccra、氧氣的流量為1〇〜i〇〇sccm ;於基體 上施加-1 00 —300V的偏壓’鍍膜溫度為i〇〇~i5(TC,設 置鉻靶的電源功率為5〜l〇kw,鍍膜溫度為1〇〇〜150°C, >儿積時間為3 〇〜6 0 m i η。 ι〇 .如申請專利範圍第7項所述之被覆件的製造方法,其中磁 控賤射氧化銘層的步驟採用如下方式實現:以氬氣為工作 氣體’設置氬氣流量為100〜2〇〇sccm,於基體上施加 -100 — 300V的偏壓,設置氧氣的流量為50~100sccm, 6又置銘乾的電源功率為5〜10kw,鍍膜溫度為100〜15ITC ,沉積時間為20〜40min。 099145676 表單編號A0101 第13頁/共15頁 0992078629-0201226602 VII. Patent Application Range: 1 . A covering member 'including a base body, the improvement comprising: the covering member further comprising a chromium layer, a chromium oxynitride layer and an aluminum oxide layer which are sequentially formed on the substrate. 2. The coated article according to claim 1, wherein the chromium layer, the oxynitride layer and the aluminum oxide layer are respectively formed by magnetron sputtering. 3. The coated article according to claim 1 or 2, wherein the nitrogen oxide is 40% to 65% by mass of the element in the layer, and the mass percentage of the oxygen element is 3〇. %〜45%, the mass percentage of the nitrogen element is 5% to 15%. The coated material according to claim 1, wherein the chromium layer has a thickness of 100 to 200 nm. 5〜〇. 5 // m 〇 厚度 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 6. The coated article of claim 1, wherein the substrate is a non-recorded steel, a die steel or a high speed steel. 7. A method of manufacturing a coated member, comprising the steps of: providing a substrate; using a chromium target as a target, magnetron sputtering a chromium layer on the substrate; using a chromium target as a target, using nitrogen and oxygen as a reaction gas, and chromium The layer is magnetron sputtered with a chromium oxide layer; the aluminum target is used as a target, and oxygen is used as a reaction gas to magnetron sputter the aluminum oxide layer on the chromium oxynitride layer. 8. The method of manufacturing a coated article according to claim 7, wherein the step of magnetron sputtering the chromium layer is carried out by using argon as a working gas 099145676 Form No. A0101 Page 12 of 15 0992078629 -0 201226602, set the argon flow rate to 100~200sccm, apply a bias voltage of -100~-300V on the substrate, the coating temperature is i〇〇~i50°C, and the power supply of the chrome dry is 5~1 Okw, deposition The time is 5 to 1 5 m i η. 9. The method of manufacturing a coated article according to claim 7, wherein the step of magnetron sputtering the chromium oxynitride layer is carried out by using argon gas as the working gas to set the argon flow rate to 1 〇〇~ 200sccm, set the flow rate of I gas to 10~lOOsccra, the flow rate of oxygen is 1〇~i〇〇sccm; apply a bias voltage of -100-300V on the substrate. The coating temperature is i〇〇~i5 (TC, set chrome The power supply power of the target is 5 to 1 〇kw, the coating temperature is 1 〇〇 to 150 ° C, and the time of the product is 3 〇 to 6 0 mi η. ι〇. The coating described in claim 7 The manufacturing method of the device, wherein the step of magnetron sputtering oxidizing the inscription layer is realized by using argon gas as the working gas to set the argon gas flow rate to be 100~2 〇〇sccm, and applying a bias voltage of -100 to 300V on the substrate. The flow rate of oxygen is set to 50~100sccm, and the power supply of 6 is set to 5~10kw, the coating temperature is 100~15ITC, and the deposition time is 20~40min. 099145676 Form No. A0101 Page 13 / Total 15 Page 0992078629- 0
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