TW201226543A - Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions - Google Patents
Dopo-derived flame retardant and synthetic hydrogarnets for epoxy resin compositions Download PDFInfo
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- TW201226543A TW201226543A TW100141037A TW100141037A TW201226543A TW 201226543 A TW201226543 A TW 201226543A TW 100141037 A TW100141037 A TW 100141037A TW 100141037 A TW100141037 A TW 100141037A TW 201226543 A TW201226543 A TW 201226543A
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- 239000000203 mixture Substances 0.000 title claims abstract description 96
- 239000003063 flame retardant Substances 0.000 title claims abstract description 62
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 35
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 35
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims description 52
- 239000000654 additive Substances 0.000 claims abstract description 8
- 230000000996 additive effect Effects 0.000 claims abstract 4
- -1 bis s Chemical compound 0.000 claims description 63
- 150000001875 compounds Chemical class 0.000 claims description 54
- 239000002223 garnet Substances 0.000 claims description 33
- 239000004593 Epoxy Substances 0.000 claims description 32
- 239000002253 acid Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000003795 chemical substances by application Substances 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 24
- 229910001868 water Inorganic materials 0.000 claims description 23
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 claims description 20
- 125000000217 alkyl group Chemical group 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 19
- 125000003118 aryl group Chemical group 0.000 claims description 18
- 229920000642 polymer Polymers 0.000 claims description 18
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 17
- 229920003986 novolac Polymers 0.000 claims description 16
- 239000002270 dispersing agent Substances 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 14
- 150000003839 salts Chemical class 0.000 claims description 13
- 125000004429 atom Chemical group 0.000 claims description 12
- 239000004575 stone Substances 0.000 claims description 12
- 229910052909 inorganic silicate Inorganic materials 0.000 claims description 11
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 claims description 10
- 239000004305 biphenyl Substances 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 229920006395 saturated elastomer Polymers 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 7
- 125000004122 cyclic group Chemical group 0.000 claims description 7
- 239000002966 varnish Substances 0.000 claims description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 6
- 125000005210 alkyl ammonium group Chemical group 0.000 claims description 6
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 6
- 125000006267 biphenyl group Chemical group 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 6
- 239000000194 fatty acid Substances 0.000 claims description 6
- 229930195729 fatty acid Natural products 0.000 claims description 6
- 239000000080 wetting agent Substances 0.000 claims description 6
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 5
- 125000000392 cycloalkenyl group Chemical group 0.000 claims description 5
- 150000004665 fatty acids Chemical class 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 5
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 5
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 4
- 125000000623 heterocyclic group Chemical group 0.000 claims description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 4
- 239000004114 Ammonium polyphosphate Substances 0.000 claims description 3
- 229920000877 Melamine resin Polymers 0.000 claims description 3
- 229920000388 Polyphosphate Polymers 0.000 claims description 3
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims description 3
- 229920001276 ammonium polyphosphate Polymers 0.000 claims description 3
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims description 3
- 239000000975 dye Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 235000011187 glycerol Nutrition 0.000 claims description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000001205 polyphosphate Substances 0.000 claims description 3
- 235000011176 polyphosphates Nutrition 0.000 claims description 3
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 2
- 239000003963 antioxidant agent Substances 0.000 claims description 2
- 230000003078 antioxidant effect Effects 0.000 claims description 2
- 239000002216 antistatic agent Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000011256 inorganic filler Substances 0.000 claims description 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 2
- 239000006082 mold release agent Substances 0.000 claims description 2
- 239000004014 plasticizer Substances 0.000 claims description 2
- 239000003755 preservative agent Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 239000001509 sodium citrate Substances 0.000 claims description 2
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 claims 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- ODJUOZPKKHIEOZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3,5-dimethylphenyl)propan-2-yl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=C(C)C=2)=C1 ODJUOZPKKHIEOZ-UHFFFAOYSA-N 0.000 claims 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 claims 1
- XJDCHDFUMGSEHD-UHFFFAOYSA-N NCCCC(C(OC)(OC)OC)CCCCCCCC Chemical compound NCCCC(C(OC)(OC)OC)CCCCCCCC XJDCHDFUMGSEHD-UHFFFAOYSA-N 0.000 claims 1
- KMOBFLCSHAYZJE-UHFFFAOYSA-N NCCCC(CCCCCCCCC)OCC Chemical compound NCCCC(CCCCCCCCC)OCC KMOBFLCSHAYZJE-UHFFFAOYSA-N 0.000 claims 1
- 241000283973 Oryctolagus cuniculus Species 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 150000007973 cyanuric acids Chemical class 0.000 claims 1
- 239000004088 foaming agent Substances 0.000 claims 1
- 239000000417 fungicide Substances 0.000 claims 1
- RSAZYXZUJROYKR-UHFFFAOYSA-N indophenol Chemical compound C1=CC(O)=CC=C1N=C1C=CC(=O)C=C1 RSAZYXZUJROYKR-UHFFFAOYSA-N 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000004611 light stabiliser Substances 0.000 claims 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical class CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 claims 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- XZTOTRSSGPPNTB-UHFFFAOYSA-N phosphono dihydrogen phosphate;1,3,5-triazine-2,4,6-triamine Chemical compound NC1=NC(N)=NC(N)=N1.OP(O)(=O)OP(O)(O)=O XZTOTRSSGPPNTB-UHFFFAOYSA-N 0.000 claims 1
- XFZRQAZGUOTJCS-UHFFFAOYSA-N phosphoric acid;1,3,5-triazine-2,4,6-triamine Chemical compound OP(O)(O)=O.NC1=NC(N)=NC(N)=N1 XFZRQAZGUOTJCS-UHFFFAOYSA-N 0.000 claims 1
- NQQWFVUVBGSGQN-UHFFFAOYSA-N phosphoric acid;piperazine Chemical compound OP(O)(O)=O.C1CNCCN1 NQQWFVUVBGSGQN-UHFFFAOYSA-N 0.000 claims 1
- 229960001954 piperazine phosphate Drugs 0.000 claims 1
- 150000008442 polyphenolic compounds Chemical class 0.000 claims 1
- 235000013824 polyphenols Nutrition 0.000 claims 1
- 239000001508 potassium citrate Substances 0.000 claims 1
- 229960002635 potassium citrate Drugs 0.000 claims 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 claims 1
- 235000011082 potassium citrates Nutrition 0.000 claims 1
- 239000012779 reinforcing material Substances 0.000 claims 1
- 239000000779 smoke Substances 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 150000003431 steroids Chemical class 0.000 claims 1
- 150000003648 triterpenes Chemical class 0.000 claims 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims 1
- 239000002131 composite material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 32
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- 239000011347 resin Substances 0.000 description 27
- 239000000047 product Substances 0.000 description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- 229910052698 phosphorus Inorganic materials 0.000 description 18
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- 239000000243 solution Substances 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- DWSWCPPGLRSPIT-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinin-6-ium 6-oxide Chemical compound C1=CC=C2[P+](=O)OC3=CC=CC=C3C2=C1 DWSWCPPGLRSPIT-UHFFFAOYSA-N 0.000 description 13
- 230000015572 biosynthetic process Effects 0.000 description 13
- 239000000306 component Substances 0.000 description 13
- 238000012360 testing method Methods 0.000 description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 10
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- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
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- 238000003786 synthesis reaction Methods 0.000 description 8
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- XIVQMBJJCVVPCF-UHFFFAOYSA-N methylcyclohexane;toluene Chemical compound CC1CCCCC1.CC1=CC=CC=C1 XIVQMBJJCVVPCF-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- MFHKEJIIHDNPQE-UHFFFAOYSA-N n-nonylnonan-1-amine Chemical compound CCCCCCCCCNCCCCCCCCC MFHKEJIIHDNPQE-UHFFFAOYSA-N 0.000 description 1
- 239000012802 nanoclay Substances 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000002892 organic cations Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- QUANRIQJNFHVEU-UHFFFAOYSA-N oxirane;propane-1,2,3-triol Chemical class C1CO1.OCC(O)CO QUANRIQJNFHVEU-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229940085991 phosphate ion Drugs 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000012985 polymerization agent Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- RPDAUEIUDPHABB-UHFFFAOYSA-N potassium ethoxide Chemical compound [K+].CC[O-] RPDAUEIUDPHABB-UHFFFAOYSA-N 0.000 description 1
- BDAWXSQJJCIFIK-UHFFFAOYSA-N potassium methoxide Chemical compound [K+].[O-]C BDAWXSQJJCIFIK-UHFFFAOYSA-N 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 210000003296 saliva Anatomy 0.000 description 1
- NNNVXFKZMRGJPM-KHPPLWFESA-N sapienic acid Chemical compound CCCCCCCCC\C=C/CCCCC(O)=O NNNVXFKZMRGJPM-KHPPLWFESA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- PCMORTLOPMLEFB-UHFFFAOYSA-N sinapinic acid Natural products COC1=CC(C=CC(O)=O)=CC(OC)=C1O PCMORTLOPMLEFB-UHFFFAOYSA-N 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- QDRKDTQENPPHOJ-UHFFFAOYSA-N sodium ethoxide Chemical compound [Na+].CC[O-] QDRKDTQENPPHOJ-UHFFFAOYSA-N 0.000 description 1
- RYYKJJJTJZKILX-UHFFFAOYSA-M sodium octadecanoate Chemical compound [Na+].CCCCCCCCCCCCCCCCCC([O-])=O RYYKJJJTJZKILX-UHFFFAOYSA-M 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000000527 sonication Methods 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 210000003802 sputum Anatomy 0.000 description 1
- 208000024794 sputum Diseases 0.000 description 1
- PWEBUXCTKOWPCW-UHFFFAOYSA-N squaric acid Chemical compound OC1=C(O)C(=O)C1=O PWEBUXCTKOWPCW-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000012258 stirred mixture Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 239000002352 surface water Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 235000013337 tricalcium citrate Nutrition 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000004684 trihydrates Chemical class 0.000 description 1
- QPHWEDCMUQUXAD-UHFFFAOYSA-N trimethoxy(propyl)-lambda4-sulfane Chemical compound C(CC)S(OC)(OC)OC QPHWEDCMUQUXAD-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229940116269 uric acid Drugs 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/06—Organic materials
- C09K21/12—Organic materials containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K3/2279—Oxides; Hydroxides of metals of antimony
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Fireproofing Substances (AREA)
Abstract
Description
201226543 六、發明說明: 【發明所屬之技術領域】 本奴明涉及可用⑨ί辰氧樹脂組成物的合成水榴石和 9,10-二氫-9-氧雜-10-碟雜菲,-氧化物衍生的添加阻燃 劑。氧樹脂組成物可用於製備印刷線路板和複合材料 的預浸帶或層壓板。 【先前技術】 %氧樹脂用於多種應用,例如電子元件 '電氣設備、 機動車部件和運動設備’因為環氧樹脂具有期望的性 能,例如黏附性、耐熱性和成膜性。阻燃劑、特別是溴 化%氧樹脂化合物用於電子元件和電氣設備中使用的覆 銅層壓板和密封劑。然而,含_素化合物引起有關環境 和人類安全的關注,因此期望更加環境友好的阻燃劑。 已知更加環境友好的阻燃劑類型包括有機磷阻燃 劑。在環氧樹脂和層壓板領域中,有機磷阻燃劑具有反 應性基團,例如衍生自9,1〇-二氫_9_氧雜_1〇_磷雜菲_1〇_ 氧化物(DOPO)的那些,其典型地用於環氧樹脂製劑,因 為匕們和環氧基反應以形成構改性的環氧樹脂。製備填 改性的環氧樹脂的技術和它們的用途(包括它們在形成 預浸帶、層壓板和覆銅層壓板中的用途)是本領域熟知 的。例如參見美國專利No. 5,036,135 ; ; 5,376,453; 5,587,243; 5,759,690; 5,8 1 7,736^ 6,291,626 Bl, 6,291,627 Bl; 6,2 96,940 Bl; 6,353,080 B1; 6,403,220201226543 VI. Description of the invention: [Technical field to which the invention pertains] Bennomin is involved in the synthesis of garnet and 9,10-dihydro-9-oxa-10-disphenanthrene,-oxide, which can be used as a composition of 9 eq. Derived flame retardant added. The oxy-resin composition can be used to prepare prepreg tapes or laminates for printed wiring boards and composite materials. [Prior Art] The % oxygen resin is used in various applications such as electronic components 'electrical equipment, automobile parts, and sports equipment' because the epoxy resin has desired properties such as adhesion, heat resistance, and film forming property. Flame retardants, particularly brominated % oxy-resin compounds, are used in copper clad laminates and sealants for use in electronic components and electrical equipment. However, γ-containing compounds raise concerns about environmental and human safety, and therefore a more environmentally friendly flame retardant is desired. More environmentally friendly flame retardant types are known to include organophosphorus flame retardants. In the field of epoxy resins and laminates, organophosphorus flame retardants have reactive groups, for example derived from 9,1 fluorene-dihydro-9-oxaxanium-phosphaphenanthrene-oxide ( Those of DOPO), which are typically used in epoxy resin formulations, react with epoxy groups to form a modified epoxy resin. Techniques for preparing modified epoxy resins and their use, including their use in forming prepreg tapes, laminates, and copper clad laminates, are well known in the art. See, for example, U.S. Patent No. 5,036,135; 5,376,453; 5,587,243; 5,759,690; 5,8 1 7,736^ 6,291,626 Bl, 6,291,627 Bl; 6,2 96,940 Bl; 6,353,080 B1; 6,403,220
Bl ’ 6,403,690 B1 ; 6,486,242 B1 ;和 w〇 01/42359 A1(也 於2001年6月14日在英國公開)。 典型地 機磷阻 度和尺 用 (ATH) 的效率 關燃燒 某些燃 電氣性 解,這 化矽是 孔所需 201226543 而,:Γ β 不具有反應性基團的「添加」有機磷阻 =於環氧製劑’目為據信環氧樹脂和反應 :之間的共價鍵合需要提供較高玻璃化轉 寸穩定性。 於聚合物的通常使用的礦物阻燃劑例如氫氧 •虱乳化鎂(MDH)和氧化石夕在氧樹脂中具有 2 $ it —些鑛物阻燃劑需要較高負載以通 試驗。在—些情況下,即使在最高負載下使月 燒試驗對於最終產品的機械性、熱學、流變 能也是要求太高的。例如ATH在約200。匸開 限制應用於在低溫下加工的環氧樹脂。同樣 非常耐磨的材料並且快速鈍化在印刷線路板 要的鑽頭。 如果發現方式來提供下列阻燃劑的新的性At 月 ti、、^flBl ’ 6, 403, 690 B1; 6, 486, 242 B1; and w〇 01/42359 A1 (also published in the UK on June 14, 2001). The typical ground phosphorus resistance and the efficiency of the ruler (ATH) are used to burn some of the electrical and electrical solutions. This is the 201226543 required for the hole, and: Γ β “additional” organic phosphorus resistance without reactive groups. In the case of epoxy formulations, it is believed that the covalent bonding between the epoxy resin and the reaction: needs to provide higher vitrification stability. Commonly used mineral flame retardants for polymers such as oxyhydroxide, hydrazine emulsified magnesium (MDH) and oxidized stone have 2 $ it in oxyresin - some mineral flame retardants require higher loading for testing. In some cases, the monthly burn test is too demanding for the mechanical, thermal, and rheological properties of the final product, even at the highest load. For example ATH is around 200. Open Limits apply to epoxy resins that are processed at low temperatures. The same very wear resistant material and fast passivation of the drill bit required on the printed circuit board. If found to provide the new properties of the following flame retardants At month ti, ^fl
這將被5忍為是本領域有利的:該阻燃劑具有A 率,並且還滿足環氧應用所需要的要求較高的機 熱學、流變學或電氣性能。 " 【發明内容】 本發明涉及阻燃環氧組成物,包含: ⑴環氧化合物; (ii)具有下列結構的二-d〇p〇化合物: 燃劑 性有 化溫 化鋁 有限 過相 時, 學或 始分 ,氧 中鑽 合, 燃效 性、 201226543This would be tolerable in the art: the flame retardant has an A rate and also meets the more demanding thermal, rheological or electrical properties required for epoxy applications. < SUMMARY OF THE INVENTION The present invention relates to a flame-retardant epoxy composition comprising: (1) an epoxy compound; (ii) a di-d〇p〇 compound having the following structure: when the flammability is limited to a temperature-defining aluminum , learning or beginning, oxygen drilling, fuel efficiency, 201226543
朴各R ’ r2’ R3和R4獨立地是氫,Cl_Cl5烧基,c6-c12 方基,CVC〗5芳烷基或eve"烷芳基;或者在〆起的R1 和R2或R3和R4能夠形成飽和或不飽和環狀環,其中所述 飽和或不飽和環狀環可以任選地被Ci_c6烷基取代; 各m獨立地是1,2,3或4 各R5和R6獨立地是氫或Cl-C6烷基; 各η獨立地是0,1,2,3,4或5; 前提條件是當Α是芳基或直接鍵時,^不能是〇;以及 (i i i)具有下列經驗式的合成水權石: (八)厘113]^1112(011)12_43{(8104);1’其中1^11是11人族金屬 原子’ M111是IIIA族金屬原子,並且X是約〇.〇5至約1.5的 & ;或 (B) ,其中 Μπ和 M111 如(A) 中定義,並且y是約0.05至約1.5的數;或 (C) Mn3Mni2〇y(0H)12-5y-4x(P04)y(Si04)x,其中 M11 201226543 和ΜΙΠ如(A)中定義,其中叉如(A)中定義,並且其中 (B)中定義,前提條件是X + y的和為約0.05至約i 5 ;或 (D) ΜΠ3ΜΠΙ2(0Η)12,其中 M11 和 M111 如(八)中定義。 合成水權石 特別地,該申請提供合成水榴石阻燃劑,包含任選 地通過在其晶體結構中引入矽酸鹽和/或磷酸鹽而改性 的合成水榴石。 本發明的一個實施方案是具有下式的合成水權石: Μη3ΜΙΠ2(〇Η)丨2。 本發明的另一個實施方案是合成水榴石,其特徵在 於 : ⑴ 具有 經驗式 ,其中 Mu是一種鹼 土金屬或多於一種鹼土金屬的混合物,較佳為Ca ;以及 X和y是0至約1.5的數,其中x + y為〇至約1.5,較佳為約 〇·〇5至約丨.5 ;更佳為約〇丨至約丨5 ;甚至更佳約〇 〇5至 約 1 · 2。 合成水榴石還可具有下列性能: a) 中值粒控d50 ’其為約〇 !至約1 〇卩爪,或〇 25至約 ,或o h至約2 〇μηι,或〇 25至約〖祚泔,這通過雷射 衍射法來測定; b) 表面積’其為約〇. 5至約3 〇 m2/g,這通過BET來測 定較佳為約1至約3 0 m2/g,較佳為約〇 · 5至約丨5以及約丄 至約15 m2/g ’甚至更佳為約1至約ι〇或約2至約1〇 m2/g ; 或者 c) 以1 〇C/分的加速速率並且在4小時的期間内在 201226543 105°C預乾燥之後,2%失水量的TGA溫度>230°C,較佳 >240°C ’ 更佳為 >250°C。 合成水榴石的特徵還可在於表面含水量為<0.7 重 量% ’較佳為<〇. 5重量%,這通過在1 〇5。C的紅外水分平 衡來測定,並且鈉氧化物含量<〇 5重量%,這通過火焰光 譜法來測定。 如上所述,合成水榴石可以由下列通式(1)來表示: MII3MIII2〇y(〇H)12.5y.4x(p〇4)y(Si〇4)x (1) 其中Μ11是Π A族金屬原子,典型為ca,Sr或Ba,或 运些中至少兩種的混合物,或這些中任意一種或多種和 微量(即,小於約50重量%)]^§的混合物; M疋111A族金屬原子,特別是鋁,但其可混合少量 (例如小於約20重量%)的3’ Ga,比或丁丨,或這些中任意 兩種或多種的混合;以及其中又和y是〇至約15的數,其 中X + y為0至約1.5,較佳為約〇 〇5至約丨5,更佳為約〇 1 至、力1.5甚至更佳為約〇. 〇 5至約1 2。可以存在痕跡量的 其他金屬原子’ a亥金屬原子不會對阻燃劑以及阻燃 熱穩定劑造成不利影塑 a a 备在合成產物中不使用矽或破 源時,該產物可以由式 田式Μ 3Μιπ2(〇η)ι2來表示,其中 和Μ1如上述式(1)中那崧 ^ 那樣。當在合成產物中不使用磷泝 時’ '成水榴石可以由下列總經驗式來表示: ’、 M 3MI,i^〇h)i2.4x(Si〇4)x 〇a) 其中M和M 1如上述式(1)中那樣,並且X為約〇,〇5 至約1 _ 5,較佳為約〇 人、 .1至約^,更佳為約0.05至約1.2 0 當在合成產物中不使用 夕原時’合成水權石可以由下列 201226543 總經驗式來表示: M1I3MIII2〇y(〇H)12.5y(P〇4)y (1B) 其中Μ11和Mm如上述式(η中那樣,益且y為約〇·〇5 至約1.5 ’較佳為約〇丨至約丨$,更佳為約0.05至約1.2。 另一貫施方案是合成水梅石,其·^以由下列總經驗 式(2)來表示:R'r2' R3 and R4 are independently hydrogen, Cl_Cl5 alkyl, c6-c12, KVC 5 aralkyl or eve"alkaryl; or can be raised in R1 and R2 or R3 and R4 Forming a saturated or unsaturated cyclic ring wherein the saturated or unsaturated cyclic ring may be optionally substituted by Ci-c6 alkyl; each m is independently 1, 2, 3 or 4, each R5 and R6 are independently hydrogen or Cl-C6 alkyl; each η is independently 0, 1, 2, 3, 4 or 5; provided that Α is an aryl or direct bond, ^ cannot be 〇; and (iii) has the following empirical formula Synthetic water weight: (8) PCT 113]^1112(011)12_43{(8104); 1' where 1^11 is a 11-member metal atom' M111 is a Group IIIA metal atom, and X is about 〇.〇5 to Approximately 1.5 & or (B), where Μπ and M111 are as defined in (A), and y is a number from about 0.05 to about 1.5; or (C) Mn3Mni2〇y(0H)12-5y-4x (P04 y(Si04)x, wherein M11 201226543 and ΜΙΠ as defined in (A), wherein the cross is as defined in (A), and wherein (B) is defined, provided that the sum of X + y is from about 0.05 to about i 5 ; or (D) ΜΠ 3 ΜΠΙ 2 (0 Η) 12, where M11 and M111 such as (eight Defined. Synthetic water stone In particular, this application provides a synthetic garnet flame retardant comprising a synthetic garnet optionally modified by the introduction of citrate and/or phosphate in its crystal structure. One embodiment of the present invention is a synthetic water stone having the formula: Μη3ΜΙΠ2(〇Η)丨2. Another embodiment of the present invention is a synthetic garnet characterized by: (1) having an empirical formula wherein Mu is an alkaline earth metal or a mixture of more than one alkaline earth metal, preferably Ca; and X and y are from 0 to about a number of 1.5, wherein x + y is from 〇 to about 1.5, preferably from about 〇·〇5 to about 丨.5; more preferably from about 〇丨 to about ;5; even more preferably from about 〇〇5 to about 1 2. Synthetic garnet may also have the following properties: a) Median granules d50 'which is about 〇! to about 1 〇卩, or 〇25 to about, or oh to about 2 〇μηι, or 〇25 to about 〖祚泔, which is determined by a laser diffraction method; b) a surface area of from about 5 to about 3 〇m 2 /g, which is preferably from about 1 to about 30 m 2 /g as determined by BET, preferably It is from about 5 to about 5 and from about m to about 15 m2/g', even more preferably from about 1 to about ι〇 or from about 2 to about 1 〇 m2/g; or c) at 1 〇C/min The rate of acceleration and the pre-drying at 201226543 105 °C over a period of 4 hours, the TGA temperature of 2% water loss > 230 ° C, preferably > 240 ° C 'better > 250 °C. Synthetic garnet may also be characterized by a surface water content of <0.7 weight%' preferably < 5% by weight, which is at 1 〇5. The infrared moisture balance of C was measured and the sodium oxide content < 〇 5% by weight, which was determined by flame spectroscopy. As described above, the synthetic garnet can be represented by the following general formula (1): MII3MIII2〇y(〇H)12.5y.4x(p〇4)y(Si〇4)x (1) wherein Μ11 is ΠA a metal atom of a group, typically ca, Sr or Ba, or a mixture of at least two of these, or a mixture of any one or more of these and minor amounts (i.e., less than about 50% by weight); M疋111A a metal atom, particularly aluminum, but which may be mixed with a small amount (e.g., less than about 20% by weight) of 3' Ga, a ratio or a butyl group, or a mixture of any two or more of these; and wherein y is from about 〇 to about The number of 15 wherein X + y is from 0 to about 1.5, preferably from about 〇〇5 to about 丨5, more preferably from about 〇1 to about 1.5, even more preferably from about 〇5 to about 12. There may be trace amounts of other metal atoms 'a hai metal atom does not adversely affect the flame retardant and the flame retardant heat stabilizer aa. When the product is not used in the synthetic product or the source is broken, the product can be Μ 3Μιπ2(〇η)ι2 is expressed as the sum of Μ1 as in the above formula (1). When phosphorus is not used in the synthesis product, the 'water garnet can be expressed by the following general empirical formula: ', M 3MI, i^〇h) i2.4x(Si〇4)x 〇a) where M and M 1 is as in the above formula (1), and X is about 〇, 〇5 to about 1 _ 5, preferably about 〇, .1 to about ^, more preferably from about 0.05 to about 1.2 0. When the product is not used in the original, the synthetic water weight can be expressed by the following 201226543 total empirical formula: M1I3MIII2〇y(〇H)12.5y(P〇4)y (1B) where Μ11 and Mm are as in the above formula (η In that case, Yi and y are from about 〇·〇5 to about 1.5', preferably from about 〇丨 to about 丨$, more preferably from about 0.05 to about 1.2. Another consistent scheme is synthetic water plum, which is The following general empirical formula (2) is used to indicate:
Mn3Al2Oy(〇H)12.5y.4x(P〇4)y(Si〇4)x (2) 其中Mn是Π A族金屬原子,典型為Ca,Sr或Ba,或 這些中至少兩種的混合物,或這些中任意一種或多種和 微量(即’小於約5〇重量%)Mg的混合物;其中X和y是〇至 約1 · 5的數’其中X + y為〇至約1 5,較佳為約〇. 〇 5至約 15 ’更佳為約(M至約丨.5,甚至更佳為約〇.〇5至約1.2。 此處再次,可以存在微量的其他金屬原子,該金屬原子 不會對阻燃劑以及阻燃劑的熱穩定劑造成不利影響。當 在合成產物中不使用矽或磷源時,該產物可以由式 Μ 3Αΐ2(〇Η)〗2來表示,其中μ11如上述式(2)中那樣。當在 合成產物中不使用磷源時,合成水榴石可以由下列總經 驗式來表示:Mn3Al2Oy(〇H)12.5y.4x(P〇4)y(Si〇4)x (2) wherein Mn is a Group A metal atom, typically Ca, Sr or Ba, or a mixture of at least two of these, Or a mixture of any one or more of these and a trace amount (i.e., 'less than about 5 weight percent) of Mg; wherein X and y are from 〇 to a number of about 1.25, wherein X + y is from 〇 to about 15 , preferably It is preferably about 〇5 to about 15' (m to about 丨.5, even more preferably about 〇.〇5 to about 1.2. Here again, there may be traces of other metal atoms, the metal atom It does not adversely affect the flame retardant and the heat stabilizer of the flame retardant. When a source of ruthenium or phosphorus is not used in the synthesis product, the product can be represented by the formula Αΐ 3Αΐ2(〇Η) 2, where μ11 is As in the above formula (2), when a phosphorus source is not used in the synthesized product, the synthetic garnet can be expressed by the following general empirical formula:
Mn3Al2(0H)12.4x(Si04)x (2A) 其中Μπ如上述式(2)中那樣,並且χ為約〇 〇5至約 u ’較佳為約0.1至約1.5,更佳為約0.〇s至約丨2。當在 合成產物十不使用矽源時,合成水榴石可以由下列總經 驗式來表示:Mn3Al2(0H)12.4x(Si04)x (2A) wherein Μπ is as in the above formula (2), and χ is from about 〇〇5 to about u' is preferably from about 0.1 to about 1.5, more preferably about 0. 〇s to about 丨2. When the product is not used in the synthesis of the product, the synthetic garnet can be expressed by the following general formula:
Mu3Al2Oy(〇H)12.5y(P〇4)y (2B) 其中Μ11如上述式(2)中那樣,並且y為約〇.〇5至約 201226543 1.5,較佳為約〇.丨至約丨5,更佳為約〇 〇5至約丨2。 另一貫施方案是合成水榴石,其可以由下列總經驗 式(3)來表示:Mu3Al2Oy(〇H)12.5y(P〇4)y (2B) wherein Μ11 is as in the above formula (2), and y is from about 〇.〇5 to about 201226543 1.5, preferably about 〇.丨 to about 丨5, more preferably about 5 to about 丨 2. Another consistent solution is synthetic garnet, which can be represented by the following general empirical formula (3):
Ca3Al2〇y(〇H)12..5y.4x(p〇4)y(Si〇4)x 、, 其中X和y是0至約1_5的數,其中X + y為〇至約1.5, 較佳為約〇·〇5至約1 .5,更佳為約〇」至約1.5以及約0 05 至約1.2。如上所述’可以存在微量的其他金屬原子,該 金屬原子不會對阻燃劑以及阻燃劑的熱穩定劑造成不利 影響。當在合成產物中不使用矽或磷源時,該產物可以 由式CasAldOHh2來表示。當在合成產物中不使用磷源 時,合成水榴石可以由下列總經驗式來表示:Ca3Al2〇y(〇H)12..5y.4x(p〇4)y(Si〇4)x , where X and y are numbers from 0 to about 1_5, wherein X + y is from 〇 to about 1.5, Preferably, it is from about 5 to about 1.5, more preferably from about 1.5 to about 0.5 and from about 0 to about 1.2. As described above, there may be traces of other metal atoms which do not adversely affect the flame retardant and the heat stabilizer of the flame retardant. When no ruthenium or phosphorus source is used in the synthesis product, the product can be represented by the formula CasAldOHh2. When a phosphorus source is not used in the synthesis product, the synthetic garnet can be represented by the following general empirical formula:
Ca3Al2(〇H)12.4x(Si〇4)x (3A) 其中x為約0.05至約1.5,較佳為約〇1至約丨5,更佳 為約0 · 0 5至約1 · 2。當在合成產物中不使用矽源時,合成 水權石可以由下列總經驗式來表示:Ca3Al2(〇H)12.4x(Si〇4)x (3A) wherein x is from about 0.05 to about 1.5, preferably from about 〇1 to about 丨5, more preferably from about 0.001 to about 1.25. When no helium source is used in the synthesis product, the synthetic water weight can be represented by the following general empirical formula:
Ca3Al2Oy(〇H)12.5y(P〇4)y (3B) 其中y為約0.05至約i.5,較佳為約〇1至約15,更佳 為約0.0 5至約1.2。 本發明的合成水榴石(上述式(1),(1A),(ib),(2), (2A)’(2B)’(3),(3A)或(3B)的合成水榴石)是效果 的阻燃劑,並且特徵進一步在於具有增強的熱穩定性。 此外’據信借助於在晶體結構中引人料鹽和 鹽,合成水榴石的所得a垆法且 ^ … 特性可以以有利的方式 文到衫響。适進而可對於合成水榴石的多種飞 度)產後有益的影響。就此而士,. ' (例如純 砘此而3在本發明的特佳的合成 201226543 水榴石(上述式(1),(1A),(1B),(2),(2A), (2B),, (3A)或(3B)的阻燃劑)令,至少約98重量。/。的…丨是。,並 且至少約98重量%的mu丨是A1。 製備合成水權石的方、土济Α & ^ n 〜万法可在20 1 〇年5月27日公開的 WO 20 10/059508中找至丨丨。.3各 人丄、 。通常,合成水榴石可以通過下 列方式來製備:授拌由下列物質形成的混合物: (1) IIIA族金屬源(特別是鋁源), (2) ΠΑ族金屬源(特別是鹼土金屬源), (3) 任選的石夕源(特另3 • 〈付别疋矽酸鹽水溶液,例如(i)例如Ca3Al2Oy(〇H)12.5y(P〇4)y (3B) wherein y is from about 0.05 to about i.5, preferably from about 1 to about 15, more preferably from about 0.05 to about 1.2. Synthetic garnet of the present invention (the above formula (1), (1A), (ib), (2), (2A) '(2B) '(3), (3A) or (3B) synthetic garnet It is an effective flame retardant and is further characterized by enhanced thermal stability. Furthermore, it is believed that by virtue of the introduction of salts and salts in the crystal structure, the resulting a 垆 method of synthesizing garnet can be advantageously applied to the shirt. Suitably, it can have a beneficial effect on the postpartum of various plumes of synthetic garnet. In this regard, . ' (for example purely this and 3 in the special synthesis 201226543 water garnet of the present invention (the above formula (1), (1A), (1B), (2), (2A), (2B Or, (3A) or (3B) a flame retardant), at least about 98% by weight, and at least about 98% by weight of the mu is A1.土 Α & ^ n ~ Wanfa can be found in WO 20 10/059508 published on May 27, 2001. 33. Each person 丄, usually, synthetic garnet can be obtained in the following ways To prepare a mixture of: (1) a Group IIIA source of metal (especially an aluminum source), (2) a source of a lanthanum metal (especially an alkaline earth metal source), (3) an optional Shi Xiyuan (Special 3 • <Payment of an aqueous solution of citrate, such as (i) for example
NaSA或NajbO7的一種或多種溶液,例如銷售為「水 玻璃」和/或⑴)粉末形式的無定形或結晶:氧化 或 ()任選的磷源(特別是構酸鹽水溶液,例如鱗酸, 驗金屬或錢石粦酸豳, 坤队-例如 Na3P04,Na2HP04,NaH2P〇4, 驗金屬或録破酿-急, , , r 一飞=〇例如Na4P207,和/或驗金屬成聚 磷酸銨鹽), < 八 斤过(1) (2),(3)和/或(4)獨立地和/或它們各 自的X。物為固體形式或水溶液形式’以及 (5)瞼金屬氫氧化物, 以 >9 , y* ’在約50至約1〇〇〇c的溫度下加熱所述攪拌的混 合物; 選地冷部反應產物或允許反應產物冷卻;以及 ®收所得產物; 、“ 法的特徵還在於形成混合物中使用的ΠΙΑ族 金屬源和11Α故jg、κ 族金屬源的比例為:ΙΙΑ族金屬與ΙΙΙΑ族金屬 -10- 201226543 的莫耳比為約1:1至約2:1。當存在日寺,形成混合物中使 用的石夕源提供料鹽,其量為約GG5至約15莫耳的石夕酸 鹽/莫耳的製備的改性合成無機水榴石,和/或當存在 時,形成混合物中使用的磷源提供磷酸鹽,其量為約〇 μ 至約1·5莫耳的磷酸鹽/莫耳的製備的改性合成無機水權 石。形成混合物中使用的矽源和/或形成混合物中使用的 磷源的較佳比例提供矽酸鹽和/或磷酸鹽,其量為約〇 3 至約1 _5莫耳/莫耳的製備的改性合成無機水榴石,更佳為 約0.05至約ΐ·2莫耳的矽酸鹽和/或磷酸鹽/莫耳的製備的 改性合成無機水榴石。通常,來自矽源的各矽原子在改 性的合成水榴石中形成一個矽酸鹽離子,並且來自磷源 的各磷原子在改性的合成水榴石中形成一個磷酸鹽離 子。 1 本發明的製備合成水權石的較佳方法涉及其中引入 合適量的碎酸鹽和/或磷酸鹽。該方法包括:授拌由下列 物質形成的混合物:鋁源、鈣源、水、矽和/或麟源、以 及鹼金屬氫氧化物;以及’在約5〇至約1 〇0。c的溫度下加 熱所述撥拌的混合物;鋁源是⑴氫氧化鋁,勃姆石,擬 薄水鋁石,氧化鋁或上述中任意兩種或多種的混合物, 以及(i〇粉末形式,鈣源是(i)無機鹽’氫氧化鈣或氧化 詞,包括其水合物,以及(i i)粉末形式; 任選地冷卻反應產物或允許反應產物冷卻;以及 回收所得產物; 所述方法的特徵還在於形成混合物中使用的鋁源和 鈣源的比例提供C a: A1的莫耳比為約1:1至約2:1,形成混 -11 - 201226543 合物中使用的矽源提供矽酸鹽,其量為每莫耳的製備的 合成阻燃劑,約〇 · 〇 5至約1 · 5莫耳、較佳約〇 1至約1 5莫 耳、更佳為約〇.05至約丨.2莫耳的矽酸鹽,和/或形成混合 物中使用的磷源提供磷酸鹽’其量為每莫耳的製備的合 成阻燃劑,約〇.〇5至約1.5莫耳、較佳為約01至約1.5莫 耳、更佳約〇. 〇 5至約1.2莫耳的鱗酸鹽。 如上所述’製備本發明的合成水榴石中可以使用多 種原料。11A和11A紅原料的非限制性例子、以及製備合 成水權石的較佳實施方案和加工條件可以在W 0 20 10/059508 中找到。 二-dopo化合物 本申請還提供具有下列結構的二_d〇p。化合物:One or more solutions of NaSA or NajbO7, such as amorphous or crystalline in the form of a powder sold as "water glass" and/or (1)): oxidized or () an optional source of phosphorus (especially an aqueous solution of a chemistry, such as squaric acid, Metal or money stone bismuth, Kun team - such as Na3P04, Na2HP04, NaH2P 〇 4, metal or recorded broken brew - urgent, ,, r a fly = 〇 such as Na4P207, and / or metal into ammonium polyphosphate ), < eight pounds over (1) (2), (3) and / or (4) independently and / or their respective X. The mixture is in solid form or in aqueous solution ' and (5) ruthenium metal hydroxide, and the stirred mixture is heated at a temperature of from about 50 to about 1 〇〇〇c with >9, y*'; The reaction product or the reaction product is allowed to cool; and the product is obtained; "The method is also characterized by the formation of a source of a lanthanum metal in the mixture and the ratio of the source of the xg and κ metals of the group: the lanthanum metal and the lanthanum metal -10- 201226543 The molar ratio is from about 1:1 to about 2:1. When there is a Japanese temple, the stone cherries used in the formation of the mixture are supplied with a salt of about GG5 to about 15 moles. Salt/mol prepared modified synthetic inorganic garnet, and/or when present, forms a phosphate source for use in the mixture to provide phosphate in an amount from about 〇μ to about 1.5 moles of phosphate per A modified synthetic inorganic water-weighted stone prepared by Mohr. A preferred ratio of the source of lanthanum used in forming the mixture and/or the source of phosphorus used in forming the mixture provides ruthenate and/or phosphate in an amount of about 〇3 Modified synthetic inorganic garnet prepared to about 1 _5 mole/mole, preferably Modified synthetic inorganic garnet prepared from about 0.05 to about 2 moles of citrate and/or phosphate/mole. Typically, each ruthenium atom from a ruthenium source is in a modified synthetic garnet. A citrate ion is formed, and each phosphorus atom from the phosphorus source forms a phosphate ion in the modified synthetic garnet. 1 A preferred method of preparing a synthetic water boulder according to the present invention involves introducing a suitable amount of comminuted An acid salt and/or a phosphate salt. The method comprises: mixing a mixture of the following materials: an aluminum source, a calcium source, water, a hydrazine and/or a lining source, and an alkali metal hydroxide; and 'at about 5 Torr to Heating the dialling mixture at a temperature of about 1 〇0.c; the aluminum source is (1) aluminum hydroxide, boehmite, pseudoboehmite, alumina or a mixture of any two or more of the foregoing, and i 〇 powder form, the calcium source is (i) an inorganic salt 'calcium hydroxide or oxidation word, including its hydrate, and (ii) a powder form; optionally cooling the reaction product or allowing the reaction product to cool; and recovering the resulting product; The method is also characterized by forming a mixture The ratio of the aluminum source to the calcium source used provides a molar ratio of C a: A1 of from about 1:1 to about 2:1, and the amount of lanthanum used in the formation of the mixed -11 - 201226543 compound provides the amount of bismuth citrate. For the preparation of the synthetic flame retardant per mole, from about 5 to about 1.25 m, preferably from about 1 to about 15 m, more preferably from about 〇.05 to about 丨.2 Mo The eric acid salt of the ear, and/or the phosphorus source used in forming the mixture, provides a phosphate, a synthetic flame retardant in an amount of from about 至5 to about 1.5 moles, preferably about 01. To about 1.5 moles, more preferably about 〇5 to about 1.2 moles of sulphate. As described above, a variety of materials can be used in the preparation of the synthetic garnet of the present invention. Non-limiting examples of 11A and 11A red materials, and preferred embodiments and processing conditions for preparing synthetic water stones can be found in W 0 20 10/059508. Di-dopo compounds The present application also provides bis-dp having the following structure. Compound:
如6卜十Such as 6 Bu
式I 其中A是直接鍵,Cd笔Λ 瑷烯某,1中阱、+、 丨2方基,匸3-〇:12環烷基或c3-c12 土 '、斤述環烷基或環 叮 ..r c .夂Τ3ΐ 长邮基可以任選地被C〗-C6 坑基取代,各Ri ’ ,r3 r r ^ A ^ r 蜀立地是氫,C1-C15烧基, C6-C丨2方丞,C7-Cl5^ -其十r 兀土或CrC丨5烷芳基;或者在一起 -12- 201226543 的Ri和R2或尺3和R4供约^ 所、f約* —、 b句形成飽和或不飽和環狀環,其中 代. 衣狀環可以任選地被C丨-C6烷基取 代,各Π1獨立地是1,9 Ρ ^ ^ ^ ,3或4 ;各R5和R6獨立地是氫或 L 1 - C 6烷基;以及夂 條件是當Α是芳基二二是。,1,2’3,5… 4直接鍵時,η不能是〇。 在一個方面,η-ρ.谇上 —士二 下&都為1或2並且Α是直接鍵。在另 η下標都為1並且 μ Τ) 1 „ 2 . 八疋C6-Ci2方基。在另一方面’ R ’ R ,R3和R4獨立妯θ & P 5 _< _,6 疋虱或Cl - C6烧基。在另一方面, 各自獨立地是氫或甲基。 本發明中可# + n ^ 之用的式1的特定化合物是6H-ibenz[c,e] H2]氧雜膦雜苯 物; 尽6,6 -(Μ-乙烷二基)雙-,6,6,-二氧化 雙,了苯[(^][1,2]氧雜膦雜苯,6,6,-(1,4-丁烷二基) “,6,6 -一氧化物;或611_二苯[c,e][l,2]氧雜膦雜苯, ,♦二曱苯二基)雙·,M,-二氧化物。 具除非另有說明,如本文中使用的術語「烷基」包括 〃、有直鏈或支化部分的飽和單價烴基。烷基的例子包 但·不限於甲基 其 T丞乙基,丙基,異丙基,丁基,異丁基, u丁基,戊基和己基。 除非另有說明,如本文中使用的術語「芳基 ^去一個虱而衍生自芳族烴的有機基團,例如笨 基萘基,茚基和芴基。「芳基」包括稠環基團,其中 至少—個環是芳族的。 、 如本文中使用的術語「芳烷基表示「芳基_烷基- 方炫基的非限制性例子是苄基(C6H5CH2_)和甲基节 (CH3C6H4CH2-)。 土 -13- 201226543 如本文中使用的術語「烷芳基」表示「烷基-芳基_」。 烧芳基的非限制性例子是甲基苯基-,二曱基苯基_,乙 基苯基-丙基笨基異丙基苯基_,丁基苯基_,異丁基 苯基-和t -丁基苯基-。 除非另有說明,如本文中使用的術語「烯基」包括 具有至少一個碳碳雙鍵的烷基部分,其中烷基如上所定 義。烯基的例子包括但不限於乙烯基和丙烯基。 除非另有說明,如本文中使用的術語「環烷基」包 括非芳族飽和環狀烷基部分,其中烷基如上所定義。環 烷基的例子包括但不限於環丙基、環丁基、環戊基、環 己基和環庚基。 除非另有說明,如本文 括非芳族環狀稀基部分,豆 的例子包括但不限於環丙稀 環己烯基和環庚烯基。 中使用的術語「環烯基」包 中烯基如上所定義。環烯基 基、環丁烯基、環戊稀基、 除非另有說明,衍生自烴的所有上述基團可具有至 多約丨至約20個碳原子(例如Ci_C2〇烷基,c6_c2G芳基, C7-C2〇烷方基,CVC2。芳烷基)或}至約12個碳原子(例如 cvc12烧基,c6-c12芳基’ c7_Ci2院芳基,C7_Ci2芳烷基) 或1至約8個碳原子或1至約6個碳原子。 法可在PCT申請 到。該方法包括 製備式I的二-d〇po化合物的一種方 PCT/US 1 0/35359和 PCT/usl〇/35354 中找 製備具有下列結構的I的二_d〇p〇化合物: -14- 201226543Wherein A is a direct bond, Cd pen 瑷 瑷 某, 1 middle well, +, 丨 2 square, 匸3-〇: 12 cycloalkyl or c3-c12 soil ', Cyclohexyl or cyclo ..rc .夂Τ3ΐ Long postal base can be optionally replaced by C--C6 pit base, each Ri ' , r3 rr ^ A ^ r is hydrogen, C1-C15 alkyl, C6-C丨2 square , C7-Cl5^ - its ten r bauxite or CrC丨5 alkylaryl; or together with -12- 201226543 Ri and R2 or 尺 3 and R4 for about ^, f about * —, b form saturating or An unsaturated cyclic ring wherein the cyclization ring may be optionally substituted by a C丨-C6 alkyl group, each Π1 being independently 1,9 Ρ ^ ^ ^ , 3 or 4 ; each of R 5 and R 6 is independently hydrogen Or L 1 -C 6 alkyl; and the oxime condition is when hydrazine is aryl bis. When 1, 2'3, 5... 4 direct keys, η cannot be 〇. In one aspect, η-ρ.谇上-士二下& is 1 or 2 and Α is a direct bond. The other η subscripts are 1 and μ Τ) 1 „ 2 . 疋 C6-Ci2 square. On the other hand ' R ' R , R3 and R4 are independent 妯 θ & P 5 _< _,6 疋虱Or Cl - C6 alkyl. In another aspect, each is independently hydrogen or methyl. The specific compound of formula 1 which can be used in the present invention is 6H-ibenz[c,e]H2]oxalate Phosphine benzene; 6,6-(Μ-ethanediyl) bis-,6,6,-dioxybis, benzene[(^][1,2]oxaphosphorane, 6,6 ,-(1,4-butanediyl) ",6,6-monooxide; or 611_diphenyl[c,e][l,2]oxaphosphorane, ♦diphenylene diphenyl ) bis, M, - dioxide. The term "alkyl" as used herein, unless otherwise indicated, includes hydrazine, a saturated monovalent hydrocarbon radical having a straight or branched moiety. Examples of alkyl groups include, but are not limited to, methyl, T 丞 ethyl, propyl, isopropyl, butyl, isobutyl, u butyl, pentyl and hexyl. As used herein, unless otherwise indicated, the term "aryl" refers to an organic group derived from an aromatic hydrocarbon, such as a strepinyl, anthracenyl and an anthracenyl group. "Aryl" includes fused ring groups. At least one of the rings is aromatic. As used herein, the term "aralkyl represents a non-limiting example of an aryl-alkyl-aryl aryl group which is benzyl (C6H5CH2_) and a methyl group (CH3C6H4CH2-). Soil-13-201226543 as used herein The term "alkaryl" means "alkyl-aryl". Non-limiting examples of calcined aryl groups are methylphenyl-, dinonylphenyl-, ethylphenyl-propylphenyl isopropylphenyl-, butylphenyl-, isobutylphenyl- And t-butylphenyl-. The term "alkenyl" as used herein, unless otherwise indicated, includes alkyl moieties having at least one carbon-carbon double bond, wherein alkyl is as defined above. Examples of alkenyl groups include, but are not limited to, ethenyl and propenyl. The term "cycloalkyl" as used herein, unless otherwise indicated, includes a non-aromatic saturated cyclic alkyl moiety, wherein alkyl is as defined above. Examples of cycloalkyl groups include, but are not limited to, cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl and cycloheptyl. Unless otherwise indicated, examples of beans include, but are not limited to, cyclopropylcyclohexenyl and cycloheptenyl, as described herein, including non-aromatic cyclic dilute moieties. The term "cycloalkenyl" as used in the package includes alkenyl as defined above. Cycloalkenyl, cyclobutenyl, cyclopentyl, unless otherwise stated, all of the above groups derived from a hydrocarbon may have up to about 丨 to about 20 carbon atoms (eg, Ci_C 2 decyl, c 6 _ c 2 G aryl, C7-C2 decane square, CVC2. aralkyl) or} to about 12 carbon atoms (eg cvc12 alkyl, c6-c12 aryl 'c7_Ci2 aryl, C7_Ci2 aralkyl) or 1 to about 8 A carbon atom or from 1 to about 6 carbon atoms. The law can be applied at the PCT. The method comprises the preparation of a bis-d〇p〇 compound prepared by the preparation of a di-d〇po compound of the formula I, PCT/US 1 0/35359 and PCT/usl/35354, having the following structure: -14- 201226543
式i 其中A是直接鍵,C6-C12芳基,(:3-(:12環烷基或C3-C12 環烯基,其中所述環烷基或環烯基可以任選地被C! -C6 烷基取代;各R1,R2,R3和R4獨立地是氫,CrCu烷基, C6-C12芳基,C7-C15芳烷基或(:7-(:15烷芳基;或者在一起 的R1和R2或R3和R4能夠形成飽和或不飽和環狀環,其中 所述飽和或不飽和環狀環可以任選地被C 1 - C 6烧基取 代;各m獨立地是1,2,3或4 ;各R5和R6獨立地是氫或 CVC6烷基;以及各η獨立地是0,1,2,3,4或5;前提 條件是當Α是芳基或直接鍵時,η不能是0 ;包括使式Α的 化合物Wherein A is a direct bond, a C6-C12 aryl group, (: 3-(:12 cycloalkyl or C3-C12 cycloalkenyl, wherein the cycloalkyl or cycloalkenyl group may be optionally C! C6 alkyl substituted; each R1, R2, R3 and R4 are independently hydrogen, CrCu alkyl, C6-C12 aryl, C7-C15 aralkyl or (:7-(:15 alkaryl; or together) R1 and R2 or R3 and R4 are capable of forming a saturated or unsaturated cyclic ring, wherein the saturated or unsaturated cyclic ring may be optionally substituted by a C 1 -C 6 alkyl group; each m is independently 1,2, 3 or 4; each of R5 and R6 is independently hydrogen or CVC6 alkyl; and each η is independently 0, 1, 2, 3, 4 or 5; provided that when hydrazine is an aryl group or a direct bond, η cannot Is 0; includes a compound of the formula
其中R3,R4和m如上所定義; 和式B的化合物在驗存在下進行反應 -15- 201226543Wherein R3, R4 and m are as defined above; and the compound of formula B is reacted in the presence of the test -15-201226543
Hal—(CR5CR6)-A~(CR5R6)rHalHal—(CR5CR6)-A~(CR5R6)rHal
SB 其中R5 ’ R6和n如上所定義並且Hal是鹵素(例如F, Cl’ I或Br);前提條件是當A是芳基或直接鍵時,η不能 是0。 可以使用的一種驗是驗金屬驗,例如驗金屬醇鹽’ 驗金屬醯胺和鹼金屬烷基醯胺。鹼的鹼金屬包括鋰、鈉 和钟。可以使用的驗的例子包括但不限於曱醇鉀、曱醇 鈉、甲醇鋰、乙醇鉀、乙醇鈉、乙醇鋰、叔丁醇鉀、叔 丁醇鈉、二異丙基醯胺鋰、及其混合物。較佳叔丁醇鉀 和甲醇鈉。 在本發明的方法中可以使用任何合適量的鹼。基於 式Α的化合物的量,這些合適的量包括約〇1至約1〇當量 或約0.5至約5當量。 该方法還可含有任選的溶劑。這些溶劑的例子可包 括但不限於庚烷,己烷,石油醚,甲基環己烷;曱苯, —曱苯,乙基苯’四氫呋喃,二曱基亞砜(DMS〇),1>4_ 号燒’二曱基曱驢胺 (DMF),二曱基乙酿胺 (DMAc) ’乙腈,乙二醇,二甲基醚,乙二醇二乙基醚、 戈其’/¾合物。 該方法可以在約_l〇°c至約75°C的溫度下進行。 可以用於製備式I的亞烧基橋化合物的另一種方法 、 从在分別於2010年3月31日和2010年11月5日提交的美 國於B主tb °°呀甲請Nos. 6 1/3 1 9580和61/410,694中找到,它們的 稱都為 “process for the preparation of DOPO-Derived -16 - 201226543SB wherein R5' R6 and n are as defined above and Hal is halogen (e.g., F, Cl' I or Br); provided that when A is an aryl group or a direct bond, η cannot be zero. One type of test that can be used is a metal test, such as a metal alkoxide test and a metal amide. The alkali metal of the base includes lithium, sodium and a clock. Examples of tests that may be used include, but are not limited to, potassium decoxide, sodium decoxide, lithium methoxide, potassium ethoxide, sodium ethoxide, lithium ethoxide, potassium t-butoxide, sodium t-butoxide, lithium diisopropyl guanamine, and mixture. Potassium tert-butoxide and sodium methoxide are preferred. Any suitable amount of base can be used in the process of the invention. These suitable amounts include from about 1 to about 1 equivalent or from about 0.5 to about 5 equivalents based on the amount of the hydrazine-based compound. The process may also contain an optional solvent. Examples of such solvents may include, but are not limited to, heptane, hexane, petroleum ether, methylcyclohexane; toluene, toluene, ethylbenzene 'tetrahydrofuran, dimercaptosulfoxide (DMS), 1 > 4_ No. burning 'dimercaptodecylamine (DMF), dimercaptoacetamide (DMAc) 'acetonitrile, ethylene glycol, dimethyl ether, ethylene glycol diethyl ether, geqi' / 3⁄4 compound. The process can be carried out at a temperature of from about 10 ° C to about 75 ° C. Another method that can be used to prepare the subsinging bridging compounds of Formula I, from the United States in March 31, 2010 and November 5, 2010, respectively, in the main Tb ° ° A No. 6 1 Found in /3 1 9580 and 61/410,694, they are called "process for the preparation of DOPO-Derived -16 - 201226543
Compounds” ’並且全部藉由引用的方式併入本文。在該 方法中,DOPO和式C的化合物Compounds"' and all incorporated herein by reference. In this method, DOPO and compounds of formula C
H〇-(CH2)n-〇H 式C 在催化劑存在、在約100°C至約25〇°C的溫度下進行 反應。可以使用的催化劑是用於脫水和/或Arbuz〇v反應 的任何合適的催化劑。通常合適的催化劑是烷基鹵化 物、驗金屬ii化物、驗土金屬鹵化物、過渡金屬和它們 的鹵化物、或酸催化劑例如曱基p -甲苯續酸醋,乙基p _ 甲苯磺酸酯。Arbuzov反應催化劑是特別合適的。該方法 可任選地使用溶劑較佳高沸點溶劑、和任選的夾帶劑。 較佳的是當聯合環氧化物時,式I的化合物的純度應 該大於約95%或約98%或約99%。純度水準可以通過使用 NMR光譜法來測定。NMR光譜學領域的技術人員可以開 發方法來測量式I化合物的純度,並且一種方法可以在 PCT/US1 0/35359 中找到。 較佳地,式I化合物在聯合聚合物之前被滾圓或研 磨。在滾圓或研磨後d5〇粒徑可以小於約1 5 μιη或小於1 〇 μηι或小於約5 μηι或小於約3 μηι或小於約2 μηι。d5〇粒徑可 甚至+於1 μιη,例如約100 nm至800 nm。d50粒徑是中值 粒徑,其中一半顆粒高於該值,並且一半顆粒低於該值。 可以使用任何合適的研磨或滾圓技術,例如喷射研磨。 還較佳的是,當d5Q粒徑大於約2 μηι時,式I化合物的 單模粒徑分佈較佳為使得化合物可以更均勻地混合聚合 物。 -17- 201226543 為了測定中值粒徑,使用具有較小體積模量的 Coulter LS-230計數器或等同設備。遵守生產商的操作說 明。或者,可以使用Horiba雷射散射裝置(例如Η〇ι^& LA900 Model 799 1)或等同設備。該方法包括:稱重樣。 (典型地約〇.〇1克至約0.015克的量)並置於清潔乾躁銘: 中,該鋁杯在使用之前已經使用去離子水來洗滌。裝置 自動取樣器使用〇·4 „^的1% Trit〇n χ·ι〇〇表面活性劑和 超聲處理來將0.05 §樣品分散在水中。該混懸液通過測量 疋件進行迴圈,在測量元件中粉末顆粒散射雷射光束。 裝置中的檢測器測量散射的光的強度。裝置中的電腦從 迫種測量來計算均值粒徑’平均粒徑和粒徑分佈。 車乂佳的是’式工化合物基本上或完全不含有機驗,因 =機驗可以有害地影響其用作阻燃劑,在用於環氧化 ^中時特別是這樣。基本上不含有機驗是指含量低於約 ’ 〇 ppm或低於約100() ppm或低於約1〇〇 ρ师或低於 方fpm種使式I化合物基本上或完全不含有機鹼的 ’,:在反應中不使用任何有機鹼來製備化合物。如果 —種測量有機鹼的量的方法是]^馗尺光譜法。 有機鹼是作為鹼的有機化合物。有機鹼通常但非一 化疋質子接受體。它們通常含有氮原子,其可容易質子 =和含氮雜環化合物典型以有㈣。例子包括但 二 土月女,二曱基胺,三乙基胺,三丙基胺, 鹼、二:_N•乙基嗎啉,咪唑’苯并咪唑’組胺’磷腈 些有機陽離子的碳酸鹽或氫氧化物。 幸乂佳的疋,式1化合物基本上不含未反應的DOPO, -18- 201226543 因為DOPO可以有害地影響其用作阻燃劑。基本上不含 DOPO是指含量低於約50,000 ppm或低於約2〇 ,〇〇〇叩爪或 低於約10,000 ppm或低於約1〇00 ppm或低於約ι〇〇 ppn^降低DOPO的一種較佳方法是使用水或水可混溶的 溶劑例如醇(例如異丙醇)、醛或酮(例如丙酮)在過減之前 和/或之後洗滌產物。DOPO含量可以使用nmr光譜法來 測量。 較佳的是’在純化後殘留在式I的化合物中的溶劑的 里應β玄小於約10 0 0 p p m或小於約1 〇 〇 p p m或小於約5 〇 ppm。溶劑的量可以使用NMR光譜法來測量。 降低式I化合物中溶劑的量的一種方法是在約1〇〇<3C 至1 7 0 ° C的溫度下真空乾燥或氮氣清掃約2至約2 4小時。 如果化合物被滾圓或研磨’較佳在高於室溫的溫度下進 行,例如通過熱空氣喷射研磨以僅以降低揮發性物質。 環氧樹脂 本領域t可使用的任何合適的環氧樹脂可以在本發 明中用作環氧化合物。適用於本發明的代表性環氧樹脂 展示於 Clayton A· May編輯的 Epoxy Resins Chemistry and Technology,第二版(Marcel Dekker,Inc· New York’ 1988),B. Ellis編輯的 Chemistry and Technology ofH〇-(CH2)n-〇H Formula C is carried out in the presence of a catalyst at a temperature of from about 100 ° C to about 25 ° C. The catalyst which can be used is any suitable catalyst for the dehydration and/or Arbuz〇v reaction. Generally suitable catalysts are alkyl halides, metal ii compounds, soil metal halides, transition metals and their halides, or acid catalysts such as decyl p-toluene sulphuric acid, ethyl p-toluene sulphonate . Arbuzov reaction catalysts are particularly suitable. The process may optionally employ a solvent, preferably a high boiling solvent, and optionally an entrainer. Preferably, the compound of formula I should have a purity greater than about 95% or about 98% or about 99% when combined with an epoxide. The purity level can be determined by using NMR spectroscopy. One skilled in the art of NMR spectroscopy can develop methods to measure the purity of a compound of formula I, and one method can be found in PCT/US1 0/35359. Preferably, the compound of formula I is spheronized or ground prior to the combined polymer. The d5 〇 particle size after spheronization or grinding may be less than about 15 μm or less than 1 〇 μηι or less than about 5 μηι or less than about 3 μηι or less than about 2 μηι. The d5 〇 particle size can even be +1 μηη, for example about 100 nm to 800 nm. The d50 particle size is the median particle size, with half of the particles above this value and half of the particles below this value. Any suitable grinding or spheronization technique can be used, such as jet milling. It is also preferred that when the d5Q particle size is greater than about 2 μηι, the single mode particle size distribution of the compound of formula I is preferably such that the compound can more uniformly mix the polymer. -17- 201226543 To determine the median particle size, use a Coulter LS-230 counter with a smaller bulk modulus or equivalent. Follow the manufacturer's instructions. Alternatively, a Horiba laser scattering device (e.g., Η〇ι^& LA900 Model 799 1) or equivalent can be used. The method includes: weighing a sample. (typically in an amount of from about 1 gram to about 0.015 grams) and placed in a clean dry:: the aluminum cup has been washed with deionized water prior to use. The device autosampler uses a 1% Trit〇n®·ι〇〇 surfactant and sonication to disperse the 0.05 § sample in water. The suspension is looped by measuring the element and is measured The powder particles in the component scatter the laser beam. The detector in the device measures the intensity of the scattered light. The computer in the device calculates the mean particle size 'average particle size and particle size distribution from the tamper measurement. The compound is essentially or completely free of organic tests, because the machine test can adversely affect its use as a flame retardant, especially when used in epoxidation. Substantially free of organic tests means less than about ' 〇 ppm or less than about 100 () ppm or less than about 1 〇〇 or lower than the fpm species to make the compound of formula I substantially or completely free of organic base ',: do not use any organic base in the reaction To prepare a compound, if the method of measuring the amount of the organic base is a method of spectroscopy. The organic base is an organic compound as a base. The organic base is usually but not a proton acceptor. They usually contain a nitrogen atom, Easy proton = and nitrogen-containing The compounds are typically (iv). Examples include but not only virgin, dinonylamine, triethylamine, tripropylamine, base, di: _N•ethylmorpholine, imidazole 'benzimidazole' histamine 'phosphorus A carbonate or hydroxide of some organic cations. Fortunately, the compound of formula 1 is substantially free of unreacted DOPO, -18-201226543 because DOPO can adversely affect its use as a flame retardant. Containing DOPO means a lower than DOO of less than about 50,000 ppm or less than about 2 Torr, a paw or less than about 10,000 ppm or less than about 10,000 ppm or less than about ι〇〇ppn^ A preferred method is to wash the product before and/or after the reduction using water or a water miscible solvent such as an alcohol (e.g., isopropanol), an aldehyde or a ketone (e.g., acetone). The DOPO content can be measured using nmr spectroscopy. Preferably, the solvent remaining in the compound of formula I after purification should be less than about 100 ppm or less than about 1 ppm or less than about 5 ppm. The amount of solvent can be determined using NMR spectroscopy. One method of reducing the amount of solvent in a compound of formula I is about 1 Torr. <3C to 1 70 ° C under vacuum or nitrogen purge for about 2 to about 24 hours. If the compound is rounded or ground 'preferably at a temperature above room temperature, such as by hot air jet milling To reduce only volatile materials. Epoxy Resins Any suitable epoxy resin that can be used in the art can be used as an epoxy compound in the present invention. Representative epoxy resins suitable for use in the present invention are shown in Clayton A. May Edited by Epoxy Resins Chemistry and Technology, Second Edition (Marcel Dekker, Inc. New York' 1988), B. Ellis, Editor and Technology of
Epoxy Resins (Blackie Academic & Professional »Epoxy Resins (Blackie Academic & Professional »
Glasgow,1 993) ’ Η. E. Lee和 K. Neville的 Handbook of Epoxy Resins (McGraw Hill,New York,1967)。 通常有利的是使用環氧樹脂,其具有平均官能度大 於1並且較佳至少1.8,更佳至少2個環氧基/分子。在更佳 •19- 201226543 的情況下,環氧樹脂是具有至少25個環氧基/分子、务 清漆環氧樹脂。在本發明的另一方面中,$ 的酚醛 樹脂可以 是任何飽和或不飽和脂肪族,脂環族’芳族或雜環化人 物,其具有多於一個的丨.2_環氧基。雜環環氧化:物σ 例子是二縮水甘油基乙内醯脲或三縮水 I的 @l(TGIC)〇 &異亂尿酸 合適的環氧樹脂是但不限於基於雙酚和 7附(例如 雙盼A,四曱基雙酚A,雙酚f,雙酚s, w本乙燒 (tetrakisphenylolethane),聚苯并 听,間苯二酚,4 , 二苯基,二羥基亞萘基)的環氧樹脂、以及衍生自酚醛清 漆(例如酚:曱醛酚醛清漆,甲酚:曱醛酚醛清Glasgow, 1 993) Η. E. Lee and K. Neville's Handbook of Epoxy Resins (McGraw Hill, New York, 1967). It is generally advantageous to use an epoxy resin having an average functionality of greater than 1 and preferably at least 1.8, more preferably at least 2 epoxy groups per molecule. In the case of more preferably 19-201226543, the epoxy resin has at least 25 epoxy/molecular, varnish epoxy resins. In another aspect of the invention, the phenolic resin of $ can be any saturated or unsaturated aliphatic, alicyclic 'aromatic or heterocyclic human having more than one 丨.2-epoxy group. Heterocyclic epoxidation: σ exemplification is diglycidyl carbazide or trihydration I @l(TGIC) 〇 & disorganized uric acid Suitable epoxy resins are, but not limited to, based on bisphenol and 7 attached (eg Double expectant A, tetradecyl bisphenol A, bisphenol f, bisphenol s, w tetrakisphenylolethane, polybenzopyrene, resorcinol, 4, diphenyl, dihydroxynaphthylene Epoxy resin, and derived from novolac (eg phenol: furfural novolac, cresol: furfural novolac
!盼 A 酚醛清漆,二苯基-,曱苯_,二曱苯或三曱基笨-改性的 齡:甲酸酌·酸清漆,氨基三畔酿酿清漆樹脂)的環氧樹月匕、 以及衍生自p -氨基酚和氰尿酸的雜環環氧樹脂。另外, 例如衍生自M-丁二醇’甘油和二環戊二烯骨架的脂肪 族環氧樹脂是合適的。多種其他合適的環氧樹脂體系是 可付的’並且也可以被本領域技術人員合適地識別。 環氧盼醛清漆樹脂(包括環氧甲酚酚醛清漆樹辟)容 易以下列商品名購得,例如D.E.Ntm,QUATREX. TM (DqwHope A novolac, diphenyl-, anthracene _, diphenyl or tridecyl stupid - modified age: formic acid, acid varnish, amino amphibious varnish resin) And a heterocyclic epoxy resin derived from p-aminophenol and cyanuric acid. Further, for example, an aliphatic epoxy resin derived from an M-butylene glycol 'glycerin and a dicyclopentadiene skeleton is suitable. A variety of other suitable epoxy resin systems are available' and can also be suitably identified by those skilled in the art. Epoxy acetal varnish resins (including epoxy cresol novolacs) are commercially available under the following trade names, for example, D.E.Ntm, QUATREX.TM (Dqw)
Chemical Company 的商標)’ TactixTM 742 (Ciba的商桿) 和 Epon (Resolution Performance Products 的商標)。商 業材料通常包含多種環氧丙氧基苯基和曱基_,乙基_丙 基-壤氧丙氧基苯基的混合物。 通常’阻燃環氧組成物中式I化合物的量為約〇丨至 約100重量份或約1至70重量份/100重量份的環氧化人 -20- 201226543 物。 或者,阻燃環氧組成物中磷式i化合物的量被選擇為 使得基於組成物的總重量,組成物將含有約0.5重量%至 約10重量%、或約1.2重量。/〇至約7重量%、或約1.5重量% 至約5重量%的構成分。 通常,阻燃環氧組成物中合成水榴石的量為約0.1至 約100重量份、或約1至70重量份/100重量份的環氧化合 物。 含磷阻燃環氧組成物的環氧當量通常為約1 〇〇 g/eq 至約 1000 g/eq、或約 1 00 g/eq至約 800 g/eq、或約 150 g/eq 至約 500 g/eq。 分散劑或潤濕劑也可用在阻燃環氧組成物中。分散 劑是這樣的化合物,其用於將顆粒混懸或分散在液體介 質中’並且本質上通常為聚合物或低聚物。分散劑的討 s余可以在 Kirl-Othmer Encyclopedia of ChemicalTrade Company's trademark) ' TactixTM 742 (Ciba's business bar) and Epon (Resolution Performance Products' trademark). Commercial materials typically comprise a mixture of a plurality of glycidoxyphenyl groups and fluorenyl-, ethyl-propyl-phosphooxyphenyl groups. Typically, the amount of the compound of formula I in the flame retardant epoxy composition is from about 〇丨 to about 100 parts by weight or from about 1 to 70 parts by weight per 100 parts by weight of epoxidized human-20-201226543. Alternatively, the amount of the phosphorus i compound in the flame retardant epoxy composition is selected such that the composition will contain from about 0.5% to about 10% by weight, or about 1.2% by weight, based on the total weight of the composition. /〇 to about 7% by weight, or from about 1.5% by weight to about 5% by weight of the constituents. Typically, the amount of synthetic garnet in the flame retardant epoxy composition is from about 0.1 to about 100 parts by weight, or from about 1 to 70 parts by weight per 100 parts by weight of the epoxide. The phosphorus equivalent of the phosphorus-containing flame retardant epoxy composition is typically from about 1 〇〇g/eq to about 1000 g/eq, or from about 100 g/eq to about 800 g/eq, or from about 150 g/eq to about 500 g/eq. Dispersing or wetting agents can also be used in the flame retardant epoxy composition. Dispersants are compounds which are used to suspend or disperse particles in a liquid medium' and are typically polymers or oligomers in nature. The dispersant can be found in Kirl-Othmer Encyclopedia of Chemical
Technology,John Wiley and s〇ns,v〇1 8,第 672·697 頁,5111版2004中找到。任何合適的分散劑可用在阻燃 環氧組成物中。 合適的分散劑的非限制性例子為多元羧酸的烷基銨 鹽,脂肪酸的烷基銨鹽;酸性聚合物的烷醇銨鹽;丙二 醇甲基醚乙酸酯或聚乙二醇單甲基醚,都任選地含有少 量的聚磷酸或聚磷酸鹽低聚物;或其混合物· 在一個實施方案中,多元羧酸的烷基銨鹽可由下式 來表示: N(rM)4+ 0-C(0)-R12.(C00H)n -21- 201226543 其中各R〗1獨立地*Cl-Cu烷基,c3_Ci8環烷基, CVC,8芳基或C7-Cis芳院基;是Ci_c_亞煙基,任選 地含有峻鍵,並且至約50。這些類型的烧基季銨多 元叛酸化合物是本領域熟知的。例如,美國專利n〇 5,州,921(通過引用併入本文)公開了多種這樣的燒基錄 多兀缓酸化合物以及如何製備它們。多元缓酸可以通過 使用季錢氫氧化物中和或者通過佶田 便用季銨碳酸鹽陰離子 交換來轉化為季敍鹽。 在-個實施方案中,R"是Ci_Cu烧基。在 方案中,R12是C2-C20亞烷基。在另 貫 隹另—貫施方案中, 2,3,4,5,6,7,8,9或 1〇。 ^ 1 合適的季錢陽離子的例子包括四 如三甲基乙基-,三乙基甲基…一土(C^)録,例 辛基-,三丁基辛基-,三甲基癸基- 二甲基 三甲基十六烷基-和曱基三辛基-銨 土四烷基 子的多元羧酸的例子包括但 X用於形成陰離 元羧酸的陰離子:草酸,丙二 自下列物質的多 二酸,庚二酸,辛二酸,壬《$珀酸’戊二酸,己 义工一酸,癸_ 十二烷二酸,十三烷二酸,十 •九 —烷二酸, 十六烷二酸,十七烷二酸,十五烷二酸,Technology, John Wiley and s〇ns, v〇1 8, 672, 697, 5111, 2004. Any suitable dispersant can be used in the flame retardant epoxy composition. Non-limiting examples of suitable dispersants are alkylammonium salts of polycarboxylic acids, alkylammonium salts of fatty acids; alkanolammonium salts of acidic polymers; propylene glycol methyl ether acetate or polyethylene glycol monomethyl The ether, optionally containing a small amount of polyphosphoric acid or polyphosphate oligomer; or a mixture thereof. In one embodiment, the alkylammonium salt of the polycarboxylic acid can be represented by the formula: N(rM)4+ 0 -C(0)-R12.(C00H)n -21- 201226543 wherein each R 1 is independently *Cl-Cu alkyl, c3_Ci8 cycloalkyl, CVC, 8 aryl or C7-Cis aromatic base; is Ci_c A submethanol group, optionally containing a Junction, and up to about 50. These types of burned quaternary ammonium polybasic compounds are well known in the art. For example, U.S. Patent No. 5, pp. The polybasic acid can be converted to a quaternary salt by the use of a quaternary hydroxide or by an anion exchange with a quaternary ammonium carbonate. In one embodiment, R" is a Ci_Cu alkyl group. In the scheme, R12 is a C2-C20 alkylene group. In the alternative scheme, 2, 3, 4, 5, 6, 7, 8, 9 or 1 〇. ^ 1 Examples of suitable quarter cations include tetramethylethyl-, triethylmethyl...one earth (C^), octyl-, tributyloctyl-, trimethylsulfonyl Examples of the polycarboxylic acid of dimethyltrimethylhexadecyl- and decyltrioctyl-ammonium tetraalkyl include but the anion of X used to form the anionic acid: oxalic acid, the following Substance of polyacid, pimelic acid, suberic acid, 壬 "$ PER acid' glutaric acid, hexanic acid, 癸_dodecanedioic acid, tridecanedioic acid, decanoic acid , hexadecanedioic acid, heptadecanedioic acid, pentadecanedioic acid,
Τ八烷二酿,丄L 二十烷二酸,鄰笨二甲酸,間笨_ 欠十九烷二酸, 六氫鄰苯二曱酸,檸檬酸,烏頭本酸一,甲酸,對笨二甲酸, 苯均三酸或其混合物。 ^,丙烷_i,2,夂三羧酸, 本發明中可使用的另外分 鹽。其可以由下式來表示:歧蜊是脂肪酸的烷基銨 '22- 201226543 N(R13)4+ 〇-C(〇)_Rl4 其中各R13獨立地是Cl-C18烷基,C3_Clpf<烷基, c6-c18芳基或(:7-(:18芳烧基;尺14是Ci C3〇烧基或Ci_c3〇稀 基。 脂肪酸可以通過使用季銨氫氧化物中和或者通過使 用季敍碳酸鹽陰離子交換來轉化為季銨鹽。在一個實施 方案中,脂肪酸陰離子衍生自不飽和脂肪酸。這種不飽 和脂肪酸的例子包括但不限於:肉豆蔻腦酸,十六碳烯 酸,油酸,亞油酸,α-亞麻酸,花生四烯酸,二十碳五 烯酸,芥子酸,二十二碳六烯酸或其混合物。㈣陽離 子的合適例子包括但不限於四烷基(c丨_ c〗8)銨,例如三甲 基乙基三乙基曱基-,三曱基己基…三甲基辛基_,三Τ octane di-branched, 丄L eicosane diacid, o-p-dicarboxylic acid, stupid _ untoxidecanedioic acid, hexahydrophthalic acid, citric acid, aconitine, formic acid, stupid Formic acid, trimesic acid or a mixture thereof. ^, propane_i, 2, hydrazine tricarboxylic acid, additional salt to be used in the present invention. It can be represented by the following formula: The oxime is an alkylammonium of a fatty acid '22- 201226543 N(R13)4+ 〇-C(〇)_Rl4 wherein each R13 is independently a Cl-C18 alkyl group, C3_Clpf<alkyl group, C6-c18 aryl or (:7-(:18 arylalkyl; rule 14 is Ci C3 decyl or Ci_c3 〇. The fatty acid can be neutralized by using quaternary ammonium hydroxide or by using a quaternary carbonate anion Exchanged to convert to a quaternary ammonium salt. In one embodiment, the fatty acid anion is derived from an unsaturated fatty acid. Examples of such unsaturated fatty acids include, but are not limited to, myristic acid, hexadecenoic acid, oleic acid, linoleic oil Acid, alpha-linolenic acid, arachidonic acid, eicosapentaenoic acid, sinapic acid, docosahexaenoic acid or mixtures thereof. Suitable examples of (iv) cations include, but are not limited to, tetraalkyl (c丨_c 8) ammonium, such as trimethylethyl triethyl decyl-, tridecyl hexyl ... trimethyl octyl _, three
丁基辛基-,三甲基癸基_,=甲I ^ —甲基十四烷基-,三曱基十 六烧基-和甲基三辛基-I安。 本發明中使用的另外分勒南丨Β μ ^ Γ刀政片丨丨疋酸性聚合物的烷醇銨 鹽。其可由下式來表示: v v J4 L·Butyloctyl-, trimethylsulfonyl-, =methyl I^-methyltetradecyl-, trimethylsulfanyl- and methyltrioctyl-I. The alkanolammonium salt of the acidic polymer used in the present invention is further divided into Le 丨Β 丨Β μ ^ Γ knife. It can be expressed by the following formula: v v J4 L·
其中各R15獨立地是Cl-C p I 1 L!8烷基,(:3-(:18環烷基, C6-C18 芳基,(:7-(:18芳烧基,c Γ _ L1_C15羥烷基,c c 羥基 環烷基CVC,8羥基芳基, ,,暴次C7_C丨8羥基芳烷基;條件是 至少一個R含有羥基;2;是數垧八 a 敌均刀子直(Μη)為1000至 100,000的含羧基的聚合物。 酸性聚合物的烷醇銨鹽是 疋尽項域已知的。例如,奉 國專利No_ 6,680,266(通過引 、 的烷基銨酸性聚合物化合物 文)公開多種這楨 物以及如何製備它們。含羧基 -23- 201226543 的聚合物可以通過使用季銨氫氧化物中和或者通過使用 季銨碳酸鹽陰離子交換來轉化為季銨鹽。 R15羥烷基的合適例子包括但不限於:羥基乙基,羥 基丙基,羥基丁基,羥基己基和羥基辛基。 可以使用的烧醇季敍陽離子的合適例子包括但不限 於.二經基烧基(C2 - C s)烧基(C i - C6)銨,例如三經基乙基 己基錢;三經基甲基乙基銨;三羥基乙基戊基銨;三羥 基曱基丁基錢;十八烧基三羥基乙基錢;二烧基(C8_C18) 二羥基乙基銨鹽例如二月桂基二羥基乙基銨。 含羧基的聚合物的Μη為約1,〇〇〇至約1〇〇, 〇〇〇、或約 3,000至約30,〇〇〇,並且]^通常為約1,1〇〇至約15〇,〇〇〇、 或約3,3 0 0至約4 〇,〇 〇 〇。所述聚合物的酸值通常為至少約 250、或約500至約970、或約550至約900、或約700至約 780 ° fee性聚合物的一個實施方案是烯鍵式不飽和含羧基 的單體、或者烯鍵式不飽和含羧基的單體和至少一種其 他可聚合單體的共聚物。合適的烯鍵式不飽和含叛基的 單體包括但不限於:α,β -不飽和一元羧酸,例如(甲基) 丙烯酸和巴豆酸;二元羧酸,例如馬來酸,富馬酸,衣 康酸’甲基丁烯二酸,中康酸,亞曱基丙二酸和肉桂酸; 二兀叛酸’例如烏頭酸;二元酸酐,例如馬來酸針,衣 康酸酐和甲基丁烯二酸酐;上述二元羧酸和一元醇(例如 烷醇,溶纖劑和二甘醇一乙醚,含有2至16個碳原子)的 單3曰例如馬來酸單丁酯,馬來酸單乙基二甘醇一乙謎 S曰等,對應於這些馬來酸酯的富馬酸酯和衣康酸醋;以 -24- 201226543 及這些單體中兩種或多種的組合。 酸性聚合物的另一實施 榭浐行生自_ -祕 案疋含羧基的聚酯。這此 樹月H自—讀酸或酸軒和多⑭化合物 ^ 用的疋夕元政酸例如鄰苯二甲 :。有 苯二曱酸’對苯二甲酸,六氣鄰笨二曱酸,間 二烷基琥珀酸,降冰片烯二酸, 』ό s久,十 酸,二聚酸,以及這些酸在它:::二酸’癸二 鄰苯二甲酸,間苯二甲酸,J存在時的酸軒。較佳為 對本二甲酸,六氫鄰苯二甲 酸,=,十二炫基_•,馬來酸,降冰片烯二:, 它們存在&的酸酐,及其思合物。和多元緩酸或酸針反 應的多元醇包括甘油,三¥醇乙燒,三甲醇丙烧,季戊 四醇,山梨糖醇’甘露醇’乙二醇,二乙二醇,23· 丁 二醇及其氧院基化衍生物。較佳為季戊四醇,三甲醇丙 统,甘油’氧録化衍生物及其混合物。兩種反應物的 莫耳比被選擇為使得所得聚醋樹脂是富羧基的。Wherein each R15 is independently Cl-C p I 1 L!8 alkyl, (: 3-(: 18 cycloalkyl, C6-C18 aryl, (: 7-(: 18 aryl, c Γ _ L1_C15) Hydroxyalkyl, cc hydroxycycloalkyl CVC, 8-hydroxyaryl, ,, violent C7_C丨8 hydroxyaralkyl; conditionally at least one R contains a hydroxyl group; 2; is a number 垧a a enemy knife straight (Μη) It is a carboxyl group-containing polymer of from 1,000 to 100,000. The alkanolammonium salt of an acidic polymer is known in the field. For example, the patent No. 6,680,266 (by the cited alkylammonium acidic polymer compound) is disclosed. A variety of such cockroaches and how to prepare them. Polymers containing carboxy-23-201226543 can be converted to quaternary ammonium salts by using quaternary ammonium hydroxides or by anion exchange using quaternary ammonium carbonates. Examples include, but are not limited to, hydroxyethyl, hydroxypropyl, hydroxybutyl, hydroxyhexyl, and hydroxyoctyl. Suitable examples of stanol quaternary cations that may be used include, but are not limited to, dibasic alkyl (C2 - C) s) alkyl (C i - C6) ammonium, such as triethyl hexyl hexyl; trimethyl methethyl ammonium Trihydroxyethyl amyl ammonium; trihydroxydecyl butyl ketone; octadecyl trihydroxyethyl ketone; dialkyl (C8_C18) dihydroxyethyl ammonium salt such as dilauryl dihydroxyethyl ammonium. The polymer has a Μη of about 1, 〇〇〇 to about 1 〇〇, 〇〇〇, or about 3,000 to about 30, 〇〇〇, and ^^ is usually about 1,1 〇〇 to about 15 〇, 〇 〇〇, or about 3,300 to about 4 Å, 〇〇〇. The polymer typically has an acid number of at least about 250, or from about 500 to about 970, or from about 550 to about 900, or from about 700 to One embodiment of the polymer of about 780 ° is a copolymer of an ethylenically unsaturated carboxyl group-containing monomer, or an ethylenically unsaturated carboxyl group-containing monomer, and at least one other polymerizable monomer. Suitable ethylenic bond Monounsaturated tert-containing monomers include, but are not limited to, α,β-unsaturated monocarboxylic acids such as (meth)acrylic acid and crotonic acid; dicarboxylic acids such as maleic acid, fumaric acid, and itaconol Acid 'methylbutenedioic acid, mesaconic acid, alkylidene malonic acid and cinnamic acid; diterpene tauric acid' such as aconitic acid; dibasic acid anhydride, such as maleic acid needle, Itaconic anhydride and methyl methacrylate; a mono- 3 hydrazine such as maleic acid of the above dicarboxylic acid and monohydric alcohol (for example, alkanol, cellosolve and diethylene glycol monoethyl ether, containing 2 to 16 carbon atoms) Monobutyl acrylate, maleic acid monoethyl diglycol - sigma, etc., corresponding to these maleate fumarate and itaconic acid vinegar; -24-201226543 and two of these monomers Or a combination of various. Another implementation of the acidic polymer is produced from the _-secret 疋 carboxyl-containing polyester. This tree is H-reading acid or acid Xuan and more than 14 compounds ^ Political acid such as phthalic acid:. There are phthalic acid 'terephthalic acid, six gas o-dibenzoic acid, m-dialkyl succinic acid, norbornene diacid, ό s long, ten acid, dimer acid, and these acids in it: :: Diacid '癸 diphthalic acid, isophthalic acid, acid Xu in the presence of J. Preferably, the present dicarboxylic acid, hexahydrophthalic acid, =, 12-decyl-•, maleic acid, norbornene II: they are present in & anhydrides, and their complexes. Polyols reacted with a polybasic acid or acid needle include glycerin, triethyl alcohol, trimethyl alcohol, pentaerythritol, sorbitol 'mannitol' ethylene glycol, diethylene glycol, 23 · butanediol and Oxygenated derivatives. Preferred are pentaerythritol, trimethyl methacrylate, glycerol oxirane derivatives and mixtures thereof. The molar ratio of the two reactants was chosen such that the resulting polyester resin was carboxyl-rich.
這些分散劑的市售例子是分散劑家族的,並且潤濕 劑典I地可得自供應商例如Αν6(^ Additives和BYKCommercially available examples of these dispersants are in the dispersant family, and wetting agents are available from suppliers such as Αν6 (^ Additives and BYK).
Chemie,例如 Byk® W90 3 ’ W93 5,W961 和 W969。特定 類型的表面活性劑、潤濕劑或分散劑的選擇取決於層壓 板或印刷線路板的樹脂以及期望性能。 儘管为散劑或潤濕劑的量可以改變,典型地基於組 成物的總重量’將加入組成物中的基於重量的量為約 0.0 1重量%至約4重量。/〇或約〇丨重量%至約2重量%。 合成水梅石還可以至少部分塗覆矽烷塗覆劑。可以 使用的這些矽烷的例子是:氨基丙基三乙氧基矽烷,氨 -25- 201226543 基乙基胺丙基三曱氧基矽烷,氨基乙基氨基丙基三曱氧 基石夕炫氨基乙基氨基丙基矽烧’ 3 -氨基丙基三甲氧基 石夕烧’ N_(2-氨基乙基)_3_氨基丙基三曱氧基矽烷,n_(2_ 氨基乙基)-3-氨基丙基曱基二曱氧基矽烷,n_(2_氨基乙 基)-3_氨基丙基曱基二罕氧基矽烷,N_環己基_3氨基丙 基-三甲氧基矽烷,苄基氨基乙基氨基丙基三甲氧基矽 烧乙稀基苄基氨基_乙基氨基丙基三曱氧基石夕烧,乙稀 基三甲氧基矽烷,乙烯基三乙氧基矽烷,乙烯基二甲氧 基甲基矽烷,乙烯基(三)曱氧基乙氧基)矽烷,乙烯基甲 氧基甲基矽烷,乙烯基三(2_甲氧基乙氧基)矽烷,乙烯基 三乙醯氧基矽烷,甲基三曱氧基矽烷,η-己基三甲氧基 夕烧η辛基二乙氧基石夕烧,丙基三甲氧基石夕烧,丙基 三乙氧基矽烷,t_ 丁基三曱氧基矽烷,異丁基三乙氧基 夕烧氣丙基二甲氧基石夕烧’ 3 -環氧丙氧基丙基三曱氧 基矽烷’ 3-環氧丙氧基丙基三乙氧基矽烷環氧丙氧基丙 基-曱基二乙氧基矽烷’苯基三甲氧基矽烷,苯基三乙氧 基矽烷,巯基丙基-三甲氧基矽烷,雙_三乙氧基甲矽烷 基丙基二硫代矽烷,雙-三乙氧基曱矽烷基-丙基二硫代 石夕烧,雙-三乙氧基甲矽烷基丙基四硫代矽烷,四乙氧基 石夕烧,N-環己基氨基曱基甲基二乙氧基矽烷,n_環己基 氨基甲基三乙氧基矽烧,η-苯基氨基甲基三曱氧基矽 烧’(曱基丙烯醯氧基曱基)曱基二曱氧基矽烷,曱基丙 烯醯氧基甲基三曱氧基矽烧’(曱基丙稀醯氧基曱基)甲 基一乙氧基石夕院’甲基丙稀酿氧基甲基-三乙氧基石夕烧, 3-曱基丙烯醯氧基丙基三曱氧基矽烷,3-曱基丙烯醯氧 -26- 201226543 基丙基三曱氡基矽烷,3_甲基丙烯醯氧基丙基三乙醯氧 基石夕烧’(異氰醯基曱基)曱基二甲氧基矽烷’ 3 -異氰醯基 丙基三曱氧基矽烷,3-三曱氧基甲矽烷基甲基-◦-曱基氨 基甲酸酯,n_二曱氧基-(甲基)甲矽烷基甲基-0-甲基-氨 基曱酸酯’ 3-(三乙氧基甲矽烷基)丙基琥珀酸酐,甲基三 甲氧基矽烷,曱基三乙氧基矽烷,二甲基二曱氧基矽烷, 二甲基二乙氧基矽烷,三曱基乙氧基矽烷,異辛基三曱 氧基矽烷,異辛基三乙氧基矽烷,六癸基三甲氧基矽烷, (八癸基)甲基二甲氧基矽烷,苯基三乙氧基矽烷,(環己 基)曱基二曱氧基石夕烧,二環戊基二曱氧基石夕烧和四乙基 石夕酸鹽。 合成水榴石可以通過任何合適的方法塗覆矽烷。一 種方法是喷塗法,其中使用來自生產商例如Loedige, Littleford Day,Hosokawa Alpine和 Thyssen Henschel這 些的混合設備來將矽烷噴射到良好攪拌地合成水榴石 中 〇 可以使用的市售石夕炫的例子來自Degussa (Evonik Industries AG)的多官能石夕烧Dynasylan®家族。 本發明還涉及固化的阻燃環氧樹脂,其包含和固化 劑或聚合物引發劑反應的上述阻燃環氧樹脂組成物。 上述固化或聚合引發劑不限於特定固化劑或聚合引 發劑,只要該試劑有助於阻燃環氧組成物中環氧樹脂的 聚合。 聚合引發劑的例子是陽離子聚合引發劑,例如甲烷 磺酸,氯化鋁’氣化錫’三氟硼乙基胺複合物,三氤硼 -27- 201226543 乙醚複合物等;自由基聚合引發劑例如過氧苯甲醯,過 氧化二枯基’偶氣雙-異丁腈等;以及陰離子聚合引發劑 例如甲醇鉀’三乙基胺’ 2_二甲基氨基酚等及其混合物。 上述環氧固化劑包括本領域技術人員已知的任何環 氧固化劑。例子包括但不限於:乙二胺,三亞甲基二胺, 四亞甲基二胺’六亞甲基二胺,間苯二胺,對苯二胺, 對二甲苯二胺,4,4’-二氨基二苯基甲烷,4,4,_二氨基二 苯基丙烷,4,4’-二氣基二苯基醚,4,4,-二氨基二苯基砜, 4,4,-二氨基二環己烧’雙(4-氨基苯基)苯基甲烷,i,5_二 氨基萘,間二甲苯二胺’對二曱苯二胺,1,1-雙(4 -氨基 笨基)環己烷,二氰基二醯胺,酚/甲醛酚醛清漆,甲酚/ 甲醛酚醛清漆,雙酚A酚醛清漆,二苯基_,曱苯_,二曱 苯-或三甲基苯-改性的酚/曱搭酚醛清漆,氨基三啡酚醛 清漆,曱紛/甲媒/氨基二听紛越清漆’盼/曱酸/氨基三吩 酚醛清漆或其混合物。 可以使用的固化劑的量基於固化劑中固化官能基團 的莫耳當量與阻燃環氧樹脂組成物中未反應的環氧基團 的莫耳當量。因呜’基於含磷環氧樹脂中未反應的環氧 基團的當量’固化劑的量可以為約〇. 1當量至約丨〇當量、 或約0.3當量至約5當量、或約0.7當量至約2當量。 聚合引發劑可以以阻燃環氧樹脂組成物的總重量的 約0.01重量%至約10重量%、或約0.05至約5%、或約01 重量%至約2重量%的濃度來加入。 固化溫度可以通常在約25〇C至約25〇。(:、或約7〇〇c 至約240°C、或約150°C至約220〇C下進行。 -28- 201226543 另外裏氧固化劑促進劑也可以用於促進阻燃環氧 、、且成物的固化$些i展氧固化劑促進劑通常基於咪唑。 這些環氧固化劑促進劑的如工—, 义疋w的例子包括但不限於:丨_甲基咪 °圭,2 -曱基咪唾,1 2 --田甘, ,一曱基咪唑’ 1,2,4,5-四曱基咪唑, 2 -乙基-4-曱基味。坐, 2-本基咮唑,1-氰基乙基_2-笨基咪Chemie, such as Byk® W90 3 ’ W93 5, W961 and W969. The choice of a particular type of surfactant, wetting agent or dispersant depends on the resin of the laminate or printed wiring board and the desired properties. While the amount of powder or wetting agent can vary, the weight-based amount to be added to the composition, typically based on the total weight of the composition, is from about 0.01% to about 4 weight. /〇 or about 〇丨% by weight to about 2% by weight. The synthetic hydrometma may also be at least partially coated with a decane coating agent. Examples of such decane which can be used are: aminopropyltriethoxydecane, ammonia-25-201226543-ethylethylaminopropyltrimethoxy decane, aminoethylaminopropyltrimethoxy oxime Aminopropyl oxime '3-aminopropyltrimethoxy sulphur' N_(2-aminoethyl)_3_aminopropyltrimethoxy decane, n-(2-aminoethyl)-3-aminopropyl hydrazine Dioxadecane, n_(2-aminoethyl)-3-aminopropyldecyldinonoxydecane, N-cyclohexyl-3aminopropyl-trimethoxydecane, benzylaminoethylamino Propyltrimethoxysulfonium ethylbenzylamino-ethylaminopropyltrimethoxy oxalate, ethylenetrimethoxydecane, vinyltriethoxydecane,vinyldimethoxymethyl Decane, vinyl (tri) methoxy ethoxy) decane, vinyl methoxy methyl decane, vinyl tris(2-methoxyethoxy) decane, vinyl triethoxy decane, A Tris-decyloxydecane, η-hexyltrimethoxy sulphide η octyldiethoxy sulphur, propyltrimethoxy sulphur, propyltriethoxy fluorene , t_butyl trimethoxy decane, isobutyl triethoxy sulfonium propyl dimethoxy zeoxime ' 3 - glycidoxypropyl tridecyloxydecane ' 3-glycoloxy Propyltriethoxydecane, glycoxypropyl-mercaptodiethoxydecane, phenyltrimethoxydecane, phenyltriethoxydecane, mercaptopropyl-trimethoxydecane, double Triethoxymethyl propyl propyl dithio decane, bis-triethoxy decyl-propyl dithiocarbazite, bis-triethoxymethyl decyl propyl tetrathio decane, four Ethoxylated sulphur, N-cyclohexylaminomethylidene methyldiethoxy decane, n-cyclohexylaminomethyltriethoxy oxime, η-phenylaminomethyltrimethoxy oxime Mercapto propylene oxime oxime) fluorenyl decyloxy decane, fluorenyl propylene methoxymethyl tri methoxy oxime '(mercapto propyl fluorenyl fluorenyl) methyl ethoxy oxime院'Methyl propylene oxymethyl-triethoxy oxysulfan, 3-mercapto propylene methoxy propyl tridecyloxy decane, 3-mercapto propylene oxime -26- 201226543 propyl propyl Mercaptodecane, 3-methyl Benzene oxypropyl triethoxy oxime oxime '(isocyanohydrazino) decyl dimethoxy decane ' 3-isocyanopropyl propyl tridecyloxy decane, 3-trimethoxyl Mercaptoalkylmethyl-nonyl-mercaptocarbamate, n-dimethoxy-(methyl)formamidinylmethyl-0-methyl-aminodecanoate' 3-(triethoxymethyl)矽alkyl)propyl succinic anhydride, methyltrimethoxy decane, decyl triethoxy decane, dimethyl dimethoxy decane, dimethyl diethoxy decane, tridecyl ethoxy decane, different Octyl trimethoxy decane, isooctyl triethoxy decane, hexamethylene trimethoxy decane, (octadecyl) methyl dimethoxy decane, phenyl triethoxy decane, (cyclohexyl) Mercapto-dioxalate, sparkle, dicyclopentyldimethoxy zeoxime and tetraethylphosphonate. The synthetic garnet may be coated with decane by any suitable method. One method is a spray method in which a mixture of equipment from manufacturers such as Loedige, Littleford Day, Hosokawa Alpine and Thyssen Henschel is used to spray decane into a well-mixed synthetic garnet. Commercially available Shi Xixuan An example is the Dynasylan® family of the multi-functional Shishi-singing of Degussa (Evonik Industries AG). The present invention also relates to a cured flame retardant epoxy resin comprising the above flame retardant epoxy resin composition which is reacted with a curing agent or a polymer initiator. The above curing or polymerization initiator is not limited to a specific curing agent or polymerization initiator as long as the agent contributes to polymerization of the epoxy resin in the flame-retardant epoxy composition. Examples of the polymerization initiator are a cationic polymerization initiator such as methanesulfonic acid, aluminum chloride 'vaporized tin' trifluoroborate ethylamine complex, triterpenyl boron-27-201226543 ether complex, etc.; radical polymerization initiator For example, benzophenone, dicumyl peroxide 'oxy-bis-isobutyronitrile, and the like; and an anionic polymerization initiator such as potassium methoxide 'triethylamine' 2 -dimethylaminophenol and the like, and mixtures thereof. The above epoxy curing agent includes any epoxy curing agent known to those skilled in the art. Examples include, but are not limited to, ethylenediamine, trimethylenediamine, tetramethylenediamine 'hexamethylenediamine, m-phenylenediamine, p-phenylenediamine, p-xylenediamine, 4,4' -diaminodiphenylmethane, 4,4,diaminodiphenylpropane, 4,4'-dioxadiphenyl ether, 4,4,-diaminodiphenyl sulfone, 4,4,- Diaminobicyclohexanol 'bis(4-aminophenyl)phenylmethane, i,5-diaminonaphthalene, m-xylylenediamine' p-diphenylene diamine, 1,1-bis(4-amino stupid Base) cyclohexane, dicyanodiamine, phenol/formaldehyde novolac, cresol/formaldehyde novolac, bisphenol A novolac, diphenyl _, fluorene benzene, diterpene benzene or trimethyl benzene - Modified phenol/曱 phenol novolak, aminotriphthol novolac, 曱 / / 甲 / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / The amount of curing agent that can be used is based on the molar equivalent of the curing functional group in the curing agent and the molar equivalent of the unreacted epoxy group in the flame retardant epoxy resin composition. The amount of the curing agent based on the equivalent of the unreacted epoxy group in the phosphorus-containing epoxy resin may be from about 1 to about 丨〇 equivalent, or from about 0.3 equivalent to about 5 equivalents, or about 0.7 equivalents. Up to about 2 equivalents. The polymerization initiator may be added in a concentration of from about 0.01% by weight to about 10% by weight, or from about 0.05% to about 5%, or from about 01% by weight to about 2% by weight based on the total mass of the flame-retardant epoxy resin composition. The curing temperature can generally range from about 25 ° C to about 25 Torr. (:, or about 7〇〇c to about 240 ° C, or about 150 ° C to about 220 ° C. -28- 201226543 In addition, the oxygen curing agent accelerator can also be used to promote flame retardant epoxy, And the curing of the product is usually based on imidazole. Examples of these epoxy curing agent accelerators, such as, for example, but not limited to: 丨 _ methyl Mimi °, 2 -曱基咪 saliva, 1 2 - tiangan, , fluorenyl imidazole ' 1,2,4,5-tetradecylimidazole, 2-ethyl-4-indolyl. Sit, 2-benzyl carbazole , 1-cyanoethyl 2 - stupid
口坐 ’ 1-(4,6 -二氨基- s-r:啡其 9 I ―听基-2-乙基)-2-苯基咪唑或其混 合物。 當酚醛清漆用作固化劑時’環氧固化劑促進劑可以 以使用的固化劑的重量的約〇 〇〇〇1重量%至約5重量%、 或約〇_〇1至約3%、或約0.1重量%至約2重量%、或約〇 15 重量%至約1重量%的濃度加入。 更高濃度的促進劑可以和不同固化劑(例如DICY, 雙氰胺)一起加入,其中促進劑濃度更典型地為固化劑重 量的5 - 2 5重量%。 逆固化的阻燃環氧樹脂和/或阻燃環 j成物冑可含有其&常規添加齋J,例如熱穩定劑,光 =劑,紫外線吸收劑,抗氧化劑,抗靜電劑,防腐劑 -占附1進劑,偶接劑例如胺基-,乙烯基-或烷基矽烷 漸^馱接枝的聚合物;硬脂酸鈉或硬脂酸鈣;金屬淨 ::或減:舌劑填,料,顏料,染料’潤滑劑,脫模劑,發 ”菌齊丨,增塑劑,加工助劑,除酸劑, 成核劑,們β m ^ ]濕劑,分散劑,增效劑,礦物填料,強# . 例如破螭纖组上 強化〗 纖·,隹,玻璃薄片,碳纖維或金屬纖維 如鈦酸鉀,烈n A 日日頌1 剧&銘或矽酸鈣;無機填料和其他阻嫩,夭, 劑與防煙削及其混合物。 ,、他阻燃… •29- 201226543 可使用的其他阻燃添加劑包括但不限於聚磷酸銨, 含氮增效劑例如多磷酸三聚氰胺,氧化銻,氡化矽,水 合氧化鋁例如氫氧化鋁(ATH),勃姆石,氧化鉍,氧化鉬 或這些化合物與鋅、鋁和/或鎂的氧化物或鹽的混合物。 無機填料可用於本發明中以影響物理性能和降低成 分。典型地,填料和強化劑包括熔融氧化矽粉末;結曰 氧化矽粉末;氧化鋁;氮化矽;氮化鋁;氮化硼;氧化 鎂;二氧化鈦;碳酸鈣;碳酸鎂;矽酸鈣;玻璃纖維; 石棉’滑石’高嶺土’斑脫土’弼石夕石’玻璃纖維,玻 璃織物,玻璃墊,研磨的玻璃纖維’玻璃珠(固體或中 二)碳化石夕曰曰須及其混合物。這些材料中的多種列舉於Oral sitting ' 1-(4,6-diamino-s-r: morphyl 9 I -heptyl-2-ethyl)-2-phenylimidazole or a mixture thereof. When the novolac is used as the curing agent, the epoxy curing agent accelerator may be from about 1% by weight to about 5% by weight, or from about 〇_〇1 to about 3%, or by weight of the curing agent used, or It is added at a concentration of from about 0.1% by weight to about 2% by weight, or from about 15% by weight to about 1% by weight. Higher concentrations of accelerator may be added with different curing agents (e.g., DICY, dicyandiamide), wherein the promoter concentration is more typically from 5 to 25 weight percent of the weight of the curing agent. The inversely cured flame-retardant epoxy resin and/or flame-retardant epoxy resin may contain the & conventional addition, such as heat stabilizer, light agent, ultraviolet absorber, antioxidant, antistatic agent, preservative - a compound containing a coupling agent such as an amine-, vinyl- or alkyl-decane graft; sodium stearate or calcium stearate; metal net:: or minus: tongue Filling, materials, pigments, dyes 'lubricants, mold release agents, hair sprays, plasticizers, processing aids, acid scavengers, nucleating agents, β m ^ ] aerosols, dispersants, synergies Agent, mineral filler, strong #. For example, the strengthening of the fiber on the broken fiber group, fiber, glass, metal fiber such as potassium titanate, Lie n A 日 日 1 1 Fillers and other barriers, sputum, agents and smoke-proofing and mixtures thereof, and he is flame retardant... • 29- 201226543 Other flame retardant additives that can be used include, but are not limited to, ammonium polyphosphate, nitrogen-containing synergists such as polyphosphoric acid Melamine, cerium oxide, cerium oxide, hydrated alumina such as aluminum hydroxide (ATH), boehmite, cerium oxide, molybdenum oxide or this A mixture of a compound and an oxide or a salt of zinc, aluminum and/or magnesium. An inorganic filler can be used in the present invention to affect physical properties and lower the composition. Typically, the filler and the reinforcing agent include a fused cerium oxide powder; Alumina; tantalum nitride; aluminum nitride; boron nitride; magnesium oxide; titanium dioxide; calcium carbonate; magnesium carbonate; calcium citrate; glass fiber; asbestos 'talc' kaolin' bentonite '弼石夕石' glass Fiber, glass fabric, glass mat, ground glass fiber 'glass beads (solid or medium) carbonized stone whiskers and mixtures thereof. Many of these materials are listed in
Encyclopedia of Materials Science and Engineering , Vol. ^ « PP. 1745 1759« MIT Press^ Cambridge Mass. (1 986), 其公開内容藉由引用併入本文。在一些實施方案中較佳 填料的聯合,而在其他實施方案中強化劑包括本發明的 夕種複合物,如在用於印刷線路板的預浸帶和層壓板中 使用的玻璃織物的情況下。 其他阻燃劑或不同其他阻燃劑的組合可加入阻燃組 成物中這些另外的阻燃劑的非限制性例子是礦物阻燃 劑例如氫氡化鋁,氫氧化鎂,勃姆石,層化雙氫氧化 物(LDH),有機改性LDH,黏土,有機改性納米-黏土, 石朋酸辞’錫酸辞和經基錫㈣,漠化阻燃劑,含磷阻燃 劑’含氮阻燃劑等。 ^本發明的上述固化的阻燃環氧樹脂和/或阻燃環氧 、且成物可用於形成預浸帶和7或層壓板。形成用於印刷線 -30- 201226543 路板的預浸帶和層壓板的典型 、主乃,走包括例如下列摇作:Encyclopedia of Materials Science and Engineering, Vol. ^ «PP. 1745 1759 « MIT Press^ Cambridge Mass. (1 986), the disclosure of which is incorporated herein by reference. In some embodiments, the combination of fillers is preferred, while in other embodiments the reinforcing agent comprises the compound of the present invention, as in the case of glass fabrics used in prepreg tapes and laminates for printed wiring boards. . Other flame retardants or combinations of different flame retardants may be added to the flame retardant composition. Non-limiting examples of such additional flame retardants are mineral flame retardants such as aluminum hydride, magnesium hydroxide, boehmite, layers Double hydroxide (LDH), organically modified LDH, clay, organically modified nano-clay, sapphire acid's sulphuric acid and sulphur-based tin (iv), desertified flame retardant, phosphorus-containing flame retardant' Nitrogen flame retardant, etc. The above cured flame retardant epoxy resin and/or flame retardant epoxy of the present invention can be used to form prepreg tapes and 7 or laminates. Typical, main, and pre-impregnated strips and laminates used for printing lines -30- 201226543 are included in the following:
A) 含環氧製劑’例如含右 J „ 有本發明的阻燃環氣组成物 的一種製劑和溶劑以及固化_ $ '' ^ Α 阳次聚合劑、以及任選的上 述其他㊉規添加劑—起配製 、此表该配製物通過滾壓、浸潰、 喷射、其他已知技術和/或立έ ^ I s & 而施加至或浸潰到基材 中。所速基材疋無機或有機強化劑,其為纖 毛、 織物或織造材料的形式,例如血 八例如典型地織造或非織造纖維 墊,含有例如玻璃纖維或紙。 B) 通過下列方式’該浸潰的基材是「B-階的」:在 這樣的溫度下進行加熱,該溫度足以排出環氧製劑中的 溶劑,並且任選地足以部分固化環氧製劑,使得冷卻至 室溫的浸潰的基材乾燥至可觸並且可以容易地處理。「b_ 階化」步驟通常在9〇cC至240γ的溫度了進行丨分鐘至1 5 分鐘的時間。源自「Β_階化」的浸漬的基材被稱為「預 浸帶」。對於複合物該為溫度最通常為1〇〇Q(:,並且對於 電子層壓板為130。C至200。C。 C)如果需要電子層壓板,一個或多個預浸帶的板以 交替層的方式和一個或多個導電材料的板(例如銅箔)堆 疊或層壓。 D)層壓的板在高溫和高壓下擠壓足以固化樹脂並形 成層壓板的時間。該層壓步驟的溫度通常為1〇〇<5C至 240°C’並且最通常為165°C至2〇0。0層壓步驟還可以在 兩個或多個階段至進行,例如第一階段為1〇〇〇C至15〇0C 並且第二階段為165(3C至2〇0。(:。壓力通常為50 N/cm2至 5 00 N/cm2。層壓步驟通常進行1分鐘至2〇〇分鐘,最通常 -31- 201226543 45分鐘至12〇分鐘。層壓步驟可任選地在更高溫度下進 更短時間(例如在連續層壓法中)或在更低溫度下進行較 長時間(例如在低能量加壓法中)。 乂 E) 任選的所得層壓板例如覆銅層壓板可通過在較 高溫度和周圍壓力下加熱一定時間來進行後處理。心 理的皿度通常為12〇。(:至250°C。後處理通常進行3〇分 至1 2小時。 F) 通常導電印刷電路應用於覆銅層壓板。典型地, 在用於上述步驟A至的環氧樹脂的溶劑是酮,例如2_ 丁酮 或曱基乙基酮(MEK)。然而,可以使用用於形成這些配 製物的任何其他合適類型的常規使用的溶劑。這些其他 冷劑的例子包括但不限於丙酮,曱基異丁基酮(ΜΙΒκ), 2 -曱氧基乙醇,ι_甲氧基_2_丙醇,丙二醇單甲基醚,乙 一醇單乙基醚乙酸酯,甲苯,N,N_二甲基甲醯胺,及其 混合物。 【實施方式】 實例 下列實例描述本發明。然而,應該理解,如本文中 充分描述和請求項中引用的,本發明不旨在受到下列實 例的細節的限制。 實例1 合成水榴石(Ca3Ah(OH)1〇 8(Si〇4)〇 3) 在該實例中’向20-升容器初始加入4升的水’然後 加入NaOH濃度為5〇重量%的4 kg Solvay溶液、未研磨的 Ca(OH)2的11.7 “的2〇%固體漿料、和計算的以〇2濃度為 -32- 201226543 27重量%(可得自Riedel-de HaSn)的680 g的水玻璃 (Na2Si307)矽酸鈉溶液。在攪拌的同時以約15°C/分鐘的 速度將該混合物加熱至95 °C。在達到期望溫度時,加入 1 8 5 0克的微細析出的三水合鋁。這提供矽酸鹽當量的理 論量為0.3莫耳/莫耳的合成阻燃劑,從而得到產物 Ca3Al2(〇H)i〇.8(Si〇4)Ci.3。將混合物保持在該溫度下,同 時攪拌1小時。然後將產物回收,在壓力篩檢程式至洗 滌,並且在喷霧乾燥器至乾燥。產物的d5〇粒徑為約3.5 μηι ° 實例2 合成水榴石(Ca3Al2(OH)1(}.8(SiO4)0.3) 進行上述實例1中的步驟,不同之處在於在聯合其他 組分之前將C a (Ο Η) 2研磨。最終產物的d 5 〇為約1 · 1 μ m。 實例3 6H-二苯[c,e】[l,2】氧雜膦雜苯,6,6’-(1,2-乙烷二基)雙-, 6,6,-二氧化物A) Epoxy-containing preparations such as a formulation and solvent containing the flame-retardant ring gas composition of the present invention and curing _ $ '' ^ Α cation polymerization agent, and optionally the other ten standard additives described above - Formulation, this formulation is applied to or impregnated into the substrate by rolling, dipping, spraying, other known techniques and/or 。 & 所 speed substrate 疋 inorganic or organic A fortifier, in the form of a cilia, fabric or woven material, such as blood VIII, such as a typically woven or nonwoven fibrous mat, containing, for example, fiberglass or paper. B) The impregnated substrate is "B-" "Step": heating at a temperature sufficient to discharge the solvent in the epoxy formulation, and optionally sufficient to partially cure the epoxy formulation, such that the impregnated substrate cooled to room temperature is dry to the touch and Can be handled easily. The "b_stage" step is usually performed at a temperature of 9 〇 cC to 240 γ for a period of 丨 minute to 15 minutes. The impregnated substrate derived from "Β_阶化" is referred to as "prepreg tape". For composites the temperature is most typically 1 〇〇 Q (:, and for electronic laminates is 130 ° C to 200 ° C. C) If an electronic laminate is required, one or more prepreg plates are in alternating layers The stack is laminated or laminated with one or more sheets of electrically conductive material, such as copper foil. D) The laminated board is extruded at a high temperature and a high pressure for a time sufficient to cure the resin and form a laminate. The temperature of the laminating step is usually from 1 〇〇 < 5C to 240 ° C ' and most usually from 165 ° C to 2 〇 0. The lamination step can also be carried out in two or more stages, for example, first The stage is 1〇〇〇C to 15〇0C and the second stage is 165 (3C to 2〇0. (: The pressure is usually 50 N/cm2 to 500 N/cm2. The lamination step is usually carried out for 1 minute to 2). 〇〇 minutes, most usually -31- 201226543 45 minutes to 12 minutes. The lamination step can optionally be carried out at a higher temperature for a shorter period of time (for example in a continuous lamination process) or at a lower temperature. For a long time (for example in a low-energy pressurization process) 乂 E) The optional resulting laminate, such as a copper-clad laminate, can be post-treated by heating at elevated temperatures and ambient pressure for a certain period of time. It is 12 〇. (: to 250 ° C. The post-treatment is usually carried out for 3 至 to 12 hours. F) Usually conductive printed circuits are used in copper clad laminates. Typically, the epoxy resin used in the above step A The solvent is a ketone such as 2-butanone or mercaptoethyl ketone (MEK). However, it can be used to form these formulations. Any other suitable type of solvent that is conventionally used. Examples of such other refrigerants include, but are not limited to, acetone, mercaptoisobutyl ketone (ΜΙΒκ), 2-methoxyethanol, ι_methoxy-2-propanol, Propylene glycol monomethyl ether, ethyl alcohol monoethyl ether acetate, toluene, N, N-dimethylformamide, and mixtures thereof. EXAMPLES The following examples describe the invention. However, it should be understood that The invention is not intended to be limited by the details of the following examples, which are fully described and claimed in the claims. Example 1 Synthetic garnet (Ca3Ah(OH)1〇8(Si〇4)〇3) In this example 'Initial addition of 4 liters of water to a 20-liter vessel' followed by a 4 kg Solvay solution with a NaOH concentration of 5 〇 wt%, a 11.7" 2% solids slurry of unmilled Ca(OH) 2 , and calculated 680 g of water glass (Na2Si307) sodium citrate solution with a concentration of 〇2 of -32-201226543 27% by weight (available from Riedel-de HaSn). The mixture was stirred at a rate of about 15 ° C/min. The mixture is heated to 95 ° C. When the desired temperature is reached, 1 8 500 grams of finely precipitated trihydrate is added. Aluminium. This provides a theoretical amount of decanoate equivalent of 0.3 mol/mole of synthetic flame retardant to give the product Ca3Al2(〇H)i.8(Si〇4) Ci.3. At the same temperature, stir for 1 hour. The product was then recovered, subjected to a pressure screening procedure to washing, and spray dried to dryness. The d5 〇 particle size of the product was about 3.5 μηι ° Example 2 Synthetic garnet (Ca3Al2 ( OH) 1 (}.8 (SiO4) 0.3) The procedure of Example 1 above was carried out, except that C a (Ο Η) 2 was ground before combining the other components. The d 5 〇 of the final product was about 1 · 1 μ m. Example 3 6H-Diphenyl [c,e][l,2]oxaphosphorane, 6,6'-(1,2-ethanediyl)bis-, 6,6,-dioxide
-33- 201226543 表1 實例3的DIDOPO化合物的製備 化合物 MW (g/mol) m.p (°C) b-P (°C) 物理狀態 莫耳 克 mis Eq. DOPO,CAS # 35948-25-5 TCI America 216.17 119 - 固體 1.96 423 - 2.1 tBuOK,CAS # 865-47-4 > igma-Aldrich > St. Louis > MO 112.21 256-258 - 固體 2.05 230 - 2.2 DMSO > CAS # 67-68-5 » Sigma- Aldrich > St. Louis > MO 78.13 16-19 189 液體 21.12 1650 1500 12 二氣乙烷CAS #75· 34-3 » Sigma-Aldrich St. Louis,MO 98.96 -35 83 液體 0.93 92 73 1.0 4-頸5L half-夾套反應器配置加料漏斗,熱電偶,機 械攪拌器和氮氣流。向反應器中加入叔丁醇鉀 (tBuOK)(230 g ’ 2.05 mol)並加入 1.5 L無水 DMSO作為溶 劑。將混合物在室溫下攪拌,直到其變成均勻溶液。將 該溶液冷卻至l〇°C,並且加入DOPO (423 g,1.96 m〇i)9 小份’同時保持反應溫度低於30°c (50_60 g/部分卜將l25 ml加料漏斗中的二氯乙烷(92 g,〇_93 mol)在lh内緩慢地 加入上述溶液中。將反應加熱至5(rc lh。將反應冷卻至 1 〇°C,並加入水(3 L)。將漿料過濾,並且將濕潤濾餅用 水、丙酮和乙酸乙酯洗滌以得到532 g的濕潤粗材料。將 粗材料在 MeCN /乙醇/H2O (5320 ml,v:v:v = 1:1:〇 5)至口 流’並且缓慢冷卻至5。〇。將白色固體通過粗燒結漏斗過 ;慮,並且在80C的真空箱至乾燥8h以得到乾燥白色粉末 (260g,68 重量 %收率,99.4 重量。/。純度,253-269。(: m p )。 -34- 201226543 31P-NMR(162 MHz,CDC13) : δ 36.45,36.25 ppm並且 ’H-NMR (400MHz,CI)C13) : δ 7.95 (d,J = 8 Hz,2H, ArH),7.88 (d,J = 8 Hz ’ 2H,ArH),7.79-7.69 (m,4H, ArH) ’ 7.48 (dd,J = 7.2 Hz,14.4 Hz,2H),7.37 (dd, J = 7.2Hz’ 7.2 Hz,2H,ArH),7.29-7.24 (m,2H,ArH), 7.16 (d,J = 12 Hz,2H,ArH),2.31 (m,4H) ppm· 實例4 6H-二苯[c,e][l,2I氧雜膦雜苯,6,6,-(l,2-乙烷二基) 雙-,6,6f-二氧化物-33- 201226543 Table 1 Preparation of DIDOPO compound of Example 3 Compound MW (g/mol) mp (°C) bP (°C) Physical state Molk mis Eq. DOPO, CAS # 35948-25-5 TCI America 216.17 119 - Solid 1.96 423 - 2.1 tBuOK, CAS # 865-47-4 > igma-Aldrich > St. Louis > MO 112.21 256-258 - Solid 2.05 230 - 2.2 DMSO > CAS # 67-68-5 » Sigma- Aldrich > St. Louis > MO 78.13 16-19 189 Liquid 21.12 1650 1500 12 Di-ethane ethane CAS #75· 34-3 » Sigma-Aldrich St. Louis, MO 98.96 -35 83 Liquid 0.93 92 73 1.0 The 4-neck 5L half-jacketed reactor was equipped with an addition funnel, thermocouple, mechanical stirrer and nitrogen flow. Potassium tert-butoxide (tBuOK) (230 g '2.05 mol) was added to the reactor and 1.5 L of anhydrous DMSO was added as a solvent. The mixture was stirred at room temperature until it became a homogeneous solution. The solution was cooled to 10 ° C and added to DOPO (423 g, 1.96 m〇i) 9 aliquots while maintaining the reaction temperature below 30 ° C (50 _ 60 g / part of the dichloride in the l25 ml addition funnel Ethane (92 g, 〇_93 mol) was slowly added to the above solution over 1 h. The reaction was heated to 5 (rc lh. The reaction was cooled to 1 〇 ° C and water (3 L) was added. Filtration, and the wet cake was washed with water, acetone and ethyl acetate to give 532 g of crude material. The crude material was in MeCN / ethanol / H2O (5320 ml, v: v: v = 1:1: 〇 5) Flow to the mouth' and slowly cool to 5. 〇. The white solid was passed through a thick fritted funnel; and, in a vacuum oven at 80 C to dry for 8 h to give a dry white powder (260 g, 68 wt% yield, 99.4 wt. Purity, 253-269. (: mp ). -34- 201226543 31P-NMR (162 MHz, CDC13) : δ 36.45, 36.25 ppm and 'H-NMR (400MHz, CI) C13) : δ 7.95 (d, J = 8 Hz, 2H, ArH), 7.88 (d, J = 8 Hz ' 2H, ArH), 7.79 - 7.69 (m, 4H, ArH) ' 7.48 (dd, J = 7.2 Hz, 14.4 Hz, 2H), 7.37 (dd, J = 7.2Hz' 7.2 Hz, 2 H, ArH), 7.29-7.24 (m, 2H, ArH), 7.16 (d, J = 12 Hz, 2H, ArH), 2.31 (m, 4H) ppm. Example 4 6H-diphenyl [c,e][ l, 2I oxaphosphorane, 6,6,-(l,2-ethanediyl)bis-,6,6f-dioxide
2H20 乙二醇(EG) 二響〇2H20 ethylene glycol (EG)
DOPO 將高純度DOPO負載到反應器中,然後將給定量的混 合的二曱苯傾倒入反應器中。製備2.62重量%NaI/EG溶液 並且加入反應器中。然後將水攪拌並且在5-6小時中加熱 至1 98 C ’同時壓力保持在4〇_41 psig。在内容物達到反 應溫度時,開始加入含有2 62重量% Nal/EG和混合的二 甲苯的共進料。共進料最少持續約1 4小時。 二曱苯進料速度為llb/min的級別。在進料1 1.5-小時 並保持2_小時後,反應器變滿。將其冷卻至1 90〇C,並且 收集反應器漿料樣品。NMR結果表明在該點D〇p〇轉化率 為約72% °將反應器再次加熱至197-199°C,進行共進料 卜】寺 然後保持2.5小時。在第二共進料結束時, D〇P〇轉化率為約93% ’將反應混合物用IPA淬火,並且 -35- 201226543 緩慢冷卻至〜100°C。 在冷部後,將反應器的内容物過濾,然後將濕潤濾 餅用新鮮1?人洗滌三次,並且在13〇。(3真空乾燥。 實例5-10 6H-二苯并[c,e】丨].,2】氧雜膦雜苯,6 6,_(12乙烷二 基)雙-’ 6,6’-二氧化物和ChAlHOU)"以训4)。3在環氧 層壓板中的用途 通常,在先樹脂、固化劑和促進劑的原料溶液都製 備好,並且單獨儲存以促進試驗。製備含有5〇重量%2_ 丁酮(MEK)的50重量%的0_甲酚環氧酚醛清漆樹脂溶液 (NPCN® 703 ’ 得自 Nan Ya Corporation)。Durite SD-1702 酿·酸β漆固化劑得自Hexion Corporation。通過將50重量 % SD-1702溶解於50重量% MEK^劑至而製備酚醛清漆 樹脂溶液。 在實例5-6中,使用噴射碾磨機將含有13 5重量% p 的實例3的二DOPO阻燃劑(6H_二苯并[c,e][1,2]氧雜膦雜 苯,6,6’-(1,2 -乙烷二基)雙·,6,6ι_二氧化物)滾圓,以降 低化合物的粒徑dS()為約2_4 μιη,之後合併聚合物。阻燃 樹脂混合物含有固體含量的3 〇重量%的ρ,排除來自礦物 填料的品質貢獻。和礦物填料(氧化矽或水榴石)一起, 樹脂混合物含有總固體含量21重量%的ρ。通過混合 128.8 g的50重量% NPCN 7〇3溶液’ 62 7 §的5〇重量% SD-1 702溶液,27.4 g阻燃劑和〇 〇83 g 2_苯基咪唑促進劑 而製備樹脂混合物。將另外3〇 g MEK加入混合物至。酚 -36- 201226543 搭’月/黍和促進劑的比例為約378。在約170-1 72°C下將約 〇_5 1 mL的樹脂混合物加入熱固化板(Thermo-electric company)。將壓舌板沿縱長對半分開並且一半壓舌板 用於在熱板上移動樹脂,直到注意到產生剛性,然後用 壓舌板地平坦部分提起樹脂,直到停止形成串。凝膠時 間為1分鐘47秒,這由這樣的點來測定,其中樹脂「串」 不再從樹脂混合物至拉出,並且環氧化物變成「無黏性 的」。樹脂混合物使用以5 7〇〇 rpm攪拌的高剪切混合器 徹底混合約20分鐘。 將1 1 X 1 1平方英寸的織造玻璃織物(具有643拋光的 7628玻璃,得自BGF Industries)從較大卷材切至一定尺DOPO loads high purity DOPO into the reactor and then pours a given amount of mixed diphenylbenzene into the reactor. A 2.62 wt% NaI/EG solution was prepared and charged to the reactor. The water was then stirred and heated to 1 98 C' in 5-6 hours while maintaining the pressure at 4 〇 41 psig. When the contents reached the reaction temperature, the co-feed containing 260 wt% of Nal/EG and mixed xylene was started. The total feed lasts for a minimum of about 14 hours. The feed rate of diphenylbenzene is llb/min. After the feed 1 was 1.5-hours and held for 2 hours, the reactor became full. It was cooled to 1 90 ° C and a sample of the reactor slurry was collected. The NMR results showed that the conversion of D〇p〇 at this point was about 72%. The reactor was again heated to 197-199 ° C for co-feeding and then held for 2.5 hours. At the end of the second co-feed, the D〇P〇 conversion was about 93%'. The reaction mixture was quenched with IPA, and -35-201226543 was slowly cooled to ~100 °C. After the cold section, the contents of the reactor were filtered and the wet cake was washed three times with fresh 1 person and at 13 Torr. (3 vacuum drying. Example 5-10 6H-dibenzo[c,e]丨]., 2] oxaphosphonium benzene, 66,_(12 ethanediyl) bis-' 6,6'- Dioxide and ChAlHOU) " to training 4). 3 Use in Epoxy Laminates Typically, the raw material solutions of the prior resins, curing agents and accelerators are prepared and stored separately to facilitate the test. A 50% by weight solution of 0-cresol epoxy novolac resin containing 5% by weight of 2-butanone (MEK) (NPCN® 703 ' from Nan Ya Corporation) was prepared. Durite SD-1702 Stearic acid beta paint curing agent was obtained from Hexion Corporation. A novolak resin solution was prepared by dissolving 50% by weight of SD-1702 in 50% by weight of MEK^. In Examples 5-6, a two DOPO flame retardant (6H_dibenzo[c,e][1,2]oxaphosphonium benzene containing Example 3 of 13 wt% p was used, using a jet mill, 6,6'-(1,2-ethanediyl) bis, 6,6ι_dioxide) is spheronized to reduce the particle size dS() of the compound to about 2_4 μηη, after which the polymer is combined. The flame retardant resin mixture contains 3% by weight of solids, ρ, excluding the quality contribution from mineral fillers. Together with the mineral filler (yttria or garnet), the resin mixture contains ρ of 21% by weight of the total solids content. A resin mixture was prepared by mixing 128.8 g of a 50 wt% NPCN 7〇3 solution '62 7 § 5 wt% SD-1 702 solution, 27.4 g of a flame retardant and 〇 83 g 2_phenylimidazole accelerator. An additional 3 g of MEK was added to the mixture. Phenol-36- 201226543 The ratio of 'month/黍 and accelerator was about 378. About 11 5 mL of the resin mixture was added to a thermo-electric plate at about 170-1 72 °C. The tongue depressor is divided in half lengthwise and half of the tongue depressor is used to move the resin on the hot plate until it is noticed that rigidity is generated, and then the resin is lifted by the flat portion of the tongue depressor until the formation of the string is stopped. The gel time was 1 minute and 47 seconds, which was determined by the point where the resin "string" was no longer pulled from the resin mixture and the epoxide became "non-sticky". The resin mixture was thoroughly mixed using a high shear mixer stirred at 5 7 rpm for about 20 minutes. 1 1 X 1 1 square inch woven glass fabric (with 643 polished 7628 glass from BGF Industries) cut from larger rolls to a certain size
寸’並且在織物的頂端和底端釘至木材支撐體(12英寸 長,1央寸寬和1/16英寸厚)。木材支撐體在轉角處含有 孔以在一端上插入紙夾,用於將織物懸掛在階烘箱 申。將A-階或樹脂清漆塗在織物的前端和背端。將紙夾 展開並且插入一個木材支撐體的兩孔中。將樹脂-飽和的 織物懸掛於實驗室通風櫥的鋁支撐體,並且允許滴乾約i 分,,之後懸掛於預加熱的(至17〇。〇強迫通風的mueM 烘相(Lab Safety Supply Inc·,General Signal的單位)中 55秒。將B-階化預浸帶的邊緣通過減小板的尺寸至i〇英 寸Χίο英寸而除去。將板切成四塊5英寸χ5英寸的板並稱 重,之後在兩層pacothane剝離膜(Insulectro corp)和兩 塊不銹鋼板(1/8英寸厚,12χ12平方英寸尺寸)之間堆疊四 層預浸帶。將層壓板在熱擠壓法中在5,_ 小時 内形成。所得層壓板是〇 〇35英寸厚,並且含有5〇重量% 37- 201226543 樹脂’並且在擠壓過程中使Π重量%樹脂經歷溢出。將5 塊0 5英寸寬的試樣使用金剛石鑛從層壓板至切下,並且 將試樣邊緣使用砂紙打磨。試驗的可燃性通過ASTM D3801-06使用Atlas UL-94燃燒室來篩選,從而導致在使 用2 1 8秒總燃燒時間的條件下燃燒評分為:所有五個試樣 至兩個試樣燃燒。在第一燃燒過程至大部分試驗的燃燒 時間都超過30秒’並且未進行第二燃燒。一些化合物緩 慢地燃燒至夾處。 和實例5 - 6類似的方式來製備實例7,不同之處在於 使用XP-78 66和多磷酸三聚氰胺(Melapur 200 (M-200), 得自BASF Corporation)的1:1重量%:重量%混合物。樹脂 混合物保持為固體含量的目標3 ·〇重量%的p,排除礦物填 料的品質貢獻。和礦物填料一起,樹脂混合物含有總固 體含量2.1重量%的p。對於所有5個試樣,在使用28秒總 燃燒時間的條件下UL-94 V-0評分為:兩個燃燒。這些結 果得自含有51重量%樹脂的0.038英寸厚的層壓板。 使用噴射碾磨機由Fluid Energy Corporation將含有 13.5重量% p的實例4的阻燃劑(6Η·二苯并[ce][12]氧雜 膦雜苯’ 6,6,-(1,2-乙烷二基)雙-,6,6,-二氧化物)滾圓, 以降低化合物的粒徑dw為約2-4 μηι 之後合併聚合物。 實例4的阻燃劑用於製備實例8_丨〇中的層壓板。實例8_ j 〇 的層壓板以和實例7至的層壓板類似的方式來製備,不同 之處在於盼酿清漆和促進劑的比例為約7 9 4。 對於實例8的層壓板’對於所有5個試樣,在使用7 9 秒總燃燒時間的條件下獲得UL-94 V-丨評分為:兩個燃 -38- 201226543Inch' and nailed to the wood support at the top and bottom ends of the fabric (12 inches long, 1 inch wide and 1/16 inch thick). The wood support contains holes at the corners to insert a paper clip on one end for suspending the fabric in a step oven. A-stage or resin varnish is applied to the front and back ends of the fabric. Spread the paper clip and insert it into the two holes of a wood support. The resin-saturated fabric was hung from the aluminum support of the laboratory fume hood and allowed to drip dry for approximately 1 minute, after which it was suspended in pre-heated (to 17 〇. 〇 forced air mueM drying phase (Lab Safety Supply Inc· , General Signal unit) 55 seconds. Remove the edge of the B-stage prepreg tape by reducing the size of the plate to i〇 inches Χίο inches. Cut the plate into four 5 inch χ 5 inch plates and weigh Then, a four-layer prepreg tape is stacked between two layers of pacothane release film (Insulectro corp) and two stainless steel plates (1/8 inch thick, 12 χ 12 square inch size). The laminate is in hot extrusion at 5, Formed within _ hours. The resulting laminate was 〇〇35 inches thick and contained 5% by weight of 37-201226543 resin' and the Π weight % resin was subjected to overflow during extrusion. Five pieces of 0 5 inch wide sample were taken. The diamond was used from the laminate to the cut and the edges of the specimen were sanded. The flammability of the test was screened by ASTM D3801-06 using an Atlas UL-94 combustor, resulting in a total burn time of 2 18 seconds. The burning score is All five samples to two samples were burned. The combustion time from the first combustion process to most of the tests exceeded 30 seconds' and no second combustion was performed. Some compounds burned slowly to the clamp. and Examples 5 - 6 Example 7 was prepared in a similar manner except that a 1:1 wt%:wt% mixture of XP-78 66 and melamine polyphosphate (Melapur 200 (M-200) from BASF Corporation) was used. The resin mixture remained The solid content target 3 · 〇 weight % p, excludes the quality contribution of the mineral filler. Together with the mineral filler, the resin mixture contains a total solids content of 2.1% by weight of p. For all 5 samples, the total burn time of 28 seconds is used. The UL-94 V-0 rating was: two burns. These results were obtained from a 0.038 inch thick laminate containing 51% by weight resin. An example of 13.5 wt% p will be used by Fluid Energy Corporation using a jet mill. 4 flame retardant (6Η·dibenzo[ce][12]oxaphosphorylbenzene 6,6,-(1,2-ethanediyl)bis-, 6,6,-dioxide) Spheronize to reduce the particle size dw of the compound to about 2-4 μηι The polymer was then combined. The flame retardant of Example 4 was used to prepare the laminate of Example 8_丨〇. The laminate of Example 8_j was prepared in a similar manner to the laminate of Example 7 except that The ratio of the varnish to the accelerator was about 7.9. For the laminate of Example 8 'For all 5 samples, the UL-94 V-丨 score was obtained using a total burn time of 79 seconds: two Burning-38- 201226543
燒。這些結果得自含有41重量%樹脂的0 〇29英寸厚的層 壓板。 B 實例9的層壓板以和實例9製備的層壓板類似的方式 來製備,不同之處在於在高剪切混合之前,加入〇 5重^ o/c^BykCliemieW-903分散劑。對於所有5個試樣在2 用5 3秒總燃燒時間的條件下獲得u L - 9 4 V -1坪分為·兩個 燃燒。這些結果得自含有46重量%樹脂的〇 〇29英寸厚的 層壓板。 實例10的層壓板以和實例10製備的層壓板類似的方 式來製備,不同之處在於在高剪切混合之前,加入08重 W-903分散劑。對於所有5個試樣,在 使用43秒總燃燒時間的條件下獲得UL_94 v_〇評分為:兩 個燃燒。這些結果得自含有49重量%樹脂的〇〇32英寸厚 的層壓板。 樣品5 -1 0的總鱗含量為2 · 1重量% p。 層壓板的比較 層壓板的阻燃性和熱性能示於下列表2中。層壓板的 可燃性(UL-94評分)通過ASTM D3801-06使用Atlas UL-94燃燒室(ν-0是最高可能的評分)來篩選。 以和IPC方法IPC-TM-650 (方法2.4.25c)中類似的内 谷、使用在N2中20°C /min升溫速率來進行層壓板的Tg測 量’不同之處如下。對於基於DEN-43 8樹脂的層壓板, 等溫保持溫度為2〇〇。〇,對於基於npcN-703的層壓板, 等溫保持溫度為22〇cC,以及對於基於NPcn_7〇3樹脂的 不含阻燃劑的層壓板,等溫保持溫度為250°C。TA裝置 -39- 201226543 軟體分析器用於測定玻璃化轉化溫度。 仕一些情況下, 進行第三掃描以確定第―、第二和第三掃描之間的3 Tg。孔鋸用於對运樣的層壓板樣品盤進行鑽孔,該樣品 盤的尺寸適於設置在標準㈣sc盤内部。將樣品邊緣輕 柔地打磨以用於匹配到盤中,並且層壓板的完整表面至 的大部分面對盤的底部進行;^立。記錄樣品重量(〜4〇_5〇 mg),並且使用柱塞式壓力機加入樣品盤的蓋子,以將蓋 子在、封到盤上。空的密封的盤加入參照平臺上。 熱重量分析(TGA)在TA Instruments Q500 TGA設備 上進行。TGA連接PC,這提供用戶介面和可操作的系統 控制。使用鎳鋁金和鎳參照標準的認證的Curie溫度來校 準溫標。使用認證的參照重量來校準微量天平。根據設 備生產商推薦的步驟來進行這些校準。樣品為約1〇 mg 至12 mg,其在紐樣品盤至在氮氣下以i〇〇c/inin從室溫加 熱至5 0 0。C。在測量過程中含有樣品重量和溫度資料的原 始資料檔案保存至PC硬碟。在完成TGA測量後,分析原 始資料植案的1 %,2 %,5 %重量損失溫度。 樣品5 -1 〇的總構含量為2 · 1重量% p。 •40- 201226543 表2.實例5至1 0的層壓板的表徵burn. These results were obtained from a 0 〇 29 inch thick laminate containing 41% by weight of resin. B. The laminate of Example 9 was prepared in a similar manner to the laminate prepared in Example 9, except that a 重5/o^c^BykCliemie W-903 dispersant was added prior to high shear mixing. For all 5 samples, u L - 9 4 V -1 ping was obtained in 2 with a total burning time of 5 3 seconds divided into two combustions. These results were obtained from a 29 inch thick laminate of 46% by weight resin. The laminate of Example 10 was prepared in a similar manner to the laminate prepared in Example 10 except that 08 weight W-903 dispersant was added prior to high shear mixing. For all 5 samples, the UL_94 v_〇 score was obtained using a total burn time of 43 seconds: two burns. These results were obtained from a 32 inch thick laminate containing 49% by weight resin. The total scale content of the sample 5 - 10 was 2 · 1 wt% p. Comparison of laminates The flame retardancy and thermal properties of the laminates are shown in Table 2 below. The flammability of the laminate (UL-94 score) was screened by ASTM D3801-06 using an Atlas UL-94 combustor (v-0 is the highest possible score). The difference in the Tg measurement of the laminate using a valley similar to that in the IPC method IPC-TM-650 (method 2.4.25c) using a temperature increase rate of 20 ° C /min in N 2 is as follows. For laminates based on DEN-43 8 resin, the isothermal holding temperature was 2 Torr. That is, for the npcN-703-based laminate, the isothermal holding temperature was 22 〇 cC, and for the NPcn_7 〇 3 resin-free flame retardant-free laminate, the isothermal holding temperature was 250 °C. TA device -39- 201226543 The software analyzer is used to determine the glass transition temperature. In some cases, a third scan is performed to determine the 3 Tg between the first, second, and third scans. A hole saw is used to drill a sample laminate tray that is sized to fit inside a standard (four) sc disk. The edges of the sample are gently sanded for mating into the pan, and the entire surface of the laminate is mostly facing the bottom of the pan; The sample weight (~4〇_5〇 mg) was recorded and the lid of the sample tray was added using a plunger press to place and seal the lid onto the tray. An empty sealed disk is added to the reference platform. Thermogravimetric analysis (TGA) was performed on a TA Instruments Q500 TGA device. The TGA connects to the PC, which provides user interface and operational system control. Calibrate the temperature scale using Nickel, Aluminum, and Nickel with reference to the certified Curie temperature. The microbalance is calibrated using the certified reference weight. Perform these calibrations according to the steps recommended by the equipment manufacturer. The sample is from about 1 mg to 12 mg which is heated from room temperature to 500 in i纽c/inin under nitrogen. C. The original data file containing the sample weight and temperature data is saved to the PC hard disk during the measurement. After completing the TGA measurement, the 1%, 2%, and 5% weight loss temperatures of the original data were analyzed. The total content of the sample 5-1 was 2.6% by weight p. • 40- 201226543 Table 2. Characterization of Laminates for Examples 5 to 10
Ex 重量% 二 DOPO 水榴石 (重量%) 氧化矽 (重量%) M-200 (重量%) UL-94 評分 總燃 燒時間 Tg°C (DSC) TGA 1% 損失 TGA 2% 損失 TGA 5% 損失 5 15.6 (實例3) - 30 - V-0 41 159 355 375 408 6 15.6 (實例3) 30 (實例1) - - 燃燒 218 163 339 360 386 7 7.9 (實例3) 30 (實例1) - 7.9 V-0 28 169 327 343 371 8 7.9 (實例4) 30 (實例2) - 7.9 V-1 79 175 324 343 381 9 7.9 (實例4) 30 (實例2) - 7.9 V-1 53 173 309 332 375 10 7.9 (實例4) 30 (實例2) - 7.9 V-0 43 173 310 334 371 該申請或其請求項中任何處的化學名稱或化學式所 指的組分無論是單數或者是複數,在與對應於化學名稱 或化學型的另一物質接觸之前存在時進行鑑定(例如,另 一組分,溶劑等等)。要緊的不是(如果有)什麼化學變 化、轉換和/或反應發生在所得混合物或溶液中,因為這 種變化、轉換和/或反應是在本發明公開的條件下將特定 的物質結合一起的天然結果。因此,將這些組分鑑定為 與進行期望操作或形成期望組成物聯合的成分。此外, 即使所附請求項可能涉及現時的物質、組分和/或成分 (「包含」,「為」等),參考的是在初次與一種或多 種本發明的公開中的其他物質、組分和/或成分接觸、 -41 - 201226543 摻合或混合之前存在的物質、組分或成分。事 化學領域普通技術人員依照本公開進行,物質 成分通過接觸、摻合或混合操作過程中的化學 換可能已經失去其初始性質,因此這不是實際 所述本發明和本文的請求項不由本文公開 例和實施方案的範圍來限制,因此這些實例和 旨在描述本發明的一些方面。任何等同實施方 入本發明的範圍内。事實上,除了本文中顯示 那些,從上述描述,本發明的各種修改對於本 人員來說是明顯的。這些修改也旨在落入所附言 【圖式簡單說明】 無。 【主要元件符號說明】 無。 實是如果 、組分或 反應或轉 關注的。 的特定實 實施方案 案旨在落 和描述的 領域技術 t求項内。 -42-Ex % by weight Two DOPO garnet (% by weight) bismuth oxide (% by weight) M-200 (% by weight) UL-94 total burn time Tg ° C (DSC) TGA 1% loss TGA 2% loss TGA 5% loss 5 15.6 (Example 3) - 30 - V-0 41 159 355 375 408 6 15.6 (Example 3) 30 (Example 1) - - Combustion 218 163 339 360 386 7 7.9 (Example 3) 30 (Example 1) - 7.9 V -0 28 169 327 343 371 8 7.9 (Example 4) 30 (Example 2) - 7.9 V-1 79 175 324 343 381 9 7.9 (Example 4) 30 (Example 2) - 7.9 V-1 53 173 309 332 375 10 7.9 (Example 4) 30 (Example 2) - 7.9 V-0 43 173 310 334 371 The chemical name or chemical formula referred to anywhere in the application or its request is either singular or plural and corresponds to Identification of a chemical name or another substance of a chemical form prior to contact (eg, another component, solvent, etc.). What is important is not, if any, what chemical changes, transformations, and/or reactions occur in the resulting mixture or solution, as such changes, transformations, and/or reactions are natural to the combination of specific materials under the conditions disclosed herein. result. Thus, these components are identified as components that are combined with the desired operation or formation of the desired composition. In addition, even if the appended claims may relate to the current substance, component and/or component ("include", "for", etc.), reference is made to other substances and components in the initial disclosure with one or more of the present disclosure. Contact with ingredients and/or ingredients, -41 - 201226543 Substance, component or ingredient present prior to blending or mixing. In accordance with the present disclosure, one of ordinary skill in the art of chemistry may have lost its initial properties by chemical exchange during contact, blending, or mixing operations, and thus this is not an actual description of the present invention and the claims herein. The scope of the embodiments is to be limited, and thus these examples are intended to describe some aspects of the invention. Any equivalent implementation is within the scope of the invention. In fact, various modifications of the invention are obvious to those skilled in the art from the foregoing description. These modifications are also intended to fall into the accompanying statement [Simple description of the schema] None. [Main component symbol description] None. It is really if, the component or the reaction is turned into concern. The specific implementation of the case is intended to fall within and describe the domain technology. -42-
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| CN103113718A (en) * | 2013-02-11 | 2013-05-22 | 中国能源建设集团山西省电力勘测设计院 | High-strength thermal insulating novolac epoxy resin composition |
| WO2016008074A1 (en) * | 2014-07-14 | 2016-01-21 | 中国科学院宁波材料技术与工程研究所 | Halogen-free flame-resistant high-temperature nylon |
| CN106751499A (en) | 2014-11-10 | 2017-05-31 | 江苏雅克科技股份有限公司 | DOPO derivatives and composition epoxy resin on high frequency substrate in applying |
| CN107082909B (en) * | 2017-04-18 | 2019-03-05 | 三峡大学 | A kind of preparation method and applications of the hydroquinone biphosphonate fire retardant containing DOPO |
| CN109400650B (en) * | 2018-11-14 | 2024-03-15 | 湖北省兴发磷化工研究院有限公司 | Synthesis method of flame retardant DOPO-ITA |
| CN109535388B (en) * | 2018-11-21 | 2021-02-09 | 苏州生益科技有限公司 | Phosphorus-containing epoxy resin composition, and prepreg and laminated board prepared from same |
| CN110218327B (en) * | 2019-05-31 | 2021-03-16 | 福建师范大学 | A kind of hyperbranched phosphorus-containing polysiloxaborane flame retardant and preparation method thereof |
| CN110951216B (en) * | 2019-11-29 | 2022-12-20 | 陕西生益科技有限公司 | Thermosetting resin composition, and prepreg and laminated board using same |
| CN111234235B (en) * | 2020-02-24 | 2022-05-13 | 桂林理工大学 | A kind of oligomeric siloxophosphate flame retardant and its preparation method and application |
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