201225356 六、發明說明： 【發明所屬之技術領域】 • [0001] 本發明涉及一種發光二極管導線架，尤其係一種表面黏 著型發光二極管導線架。 【先前技術】 [0002] 發光二極管是一種固態的半導體元件，不同於鎢絲燈泡 發光原理，屬於冷光發光，只需極小電流就可以發光。 發光二極管不但具有壽命長、省電、耐用、耐震、牢靠 、適合量產、體積小及反應快_等優點，更普遍應用在生 Ο 活中多項產品，如:手機、PDA產品的背光源、信息與消 費性電子產品的指示燈、工業儀表設備、汽車用儀表指 示燈與煞車燈及大型廣告看板等》 [〇〇〇3] 習知之表面黏著型發光二極管導線通常包括一膠座、兩 個金屬接腳、一發光晶片及二條導線。膠座具有一中空 狀之功能區，金屬接腳埋設於膠座中，其中金屬接腳部 分暴露於功能區底部，部分延伸出膠座相對兩侧，並且 〇 沿膠座外側彎折至膠座底面以作為後續製程之接點。在 金屬接腳表面上設有鍍銀層，通過鍍銀層將發光晶片發 出的光反射出去。膠座於功能區中形成間隔區塊以區隔 兩金屬接腳之極性。發光晶片設置於功能區内後，通過 兩條導線將發光晶片與兩個金屬接腳分別連接，並於膠 座之功能區内覆蓋一層可透光的環氧樹脂以封裝該發光 二極管導線架。當給露出於職外的金屬接腳施加電壓 即可使發光晶片發光。 [0004] 099142193 然，此發光二極管導線架之膠座與金屬接聊之間會產生 表單編號A0101 第3頁/共12頁 0992073318-0 201225356 間隙，容易導致外部環境周圍的水氣及硫化物沿此間隙 擴散到功能區内部，當水氣及硫化物共同存在時，水氣 會加速硫化物把鑛銀層反應成黑色的硫化銀，當鑛銀層 變黑後，發光晶片的光會在鍍銀層反射率下降的情況下 降低亮度，最終會導致發光二極管導線架失效。 [0005] 請參閱第一圖所示，揭示了 一種改善上述發光二極管導 線架，其在金屬接腳2’與膠座Γ結合的表面設置有複數 凹槽20’，通過增加水氣通過的路徑來延緩鑛銀層變黑的 速度。然，該發光二極管導線架長時間後，鍍銀層仍會 變黑，發光晶片的亮度仍會降低。 [0006] 鑒於此，實有必要克服上述發光二極管導線架之缺陷。 【發明内容】 [0007] 本發明所解決之技術問題係提供一種消除膠座及金屬接 腳之間間隙之發光二極管導線架。 [0008] 為解決前述技術問題，本發明提供一種發光二極管導線 架，其包括：設有中空之功能區的膠座及間隔暴露於功 能區内並延伸至膠座之外的複數金屬接腳，金屬接腳上 設有鍍銀層，在鍍銀層上設有含有醯胺基團物質組成的 結合促進層。 [0009] 與習知技術相比，本發明之結合促進層可消除金屬接腳 與膠座之間的間隙，可以防止發光二極管導線架之鍍銀 層變黑，提高發光二極管導線架之使用壽命。 【實施方式】 [0010] 參閱第二圖所示，本發明為一種表面黏著型發光二極管 099142193 表單編號A0101 第4頁/共12頁 0992073318-0 201225356 [0011] [0012] Ο ο [0013] 099142193 導線架，其包括一絕緣之膠座1及固持於膠座丨中之兩金 屬接腳2。 參閲第二圖至第三圖所示，膠座丨大致呈長方體，通過塑 膠射出成型於金屬接腳2之上。膠座1外側形成外膠 ’膠座1中部凹設形成中空狀之功能區丨〇，該功能區丨〇為 長方形狀，其亦可為圓形狀、橢圓形狀或其它多邊形狀 〇 金屬接腳2埋設於谬座1中，每一金屬接腳2均有部分可見 於功能區10底部，並通過導線4與放置在其中一個金屬接 腳2上的發光晶片3連接，每一金屬接腳2從功能區1〇向膠 座1外部延伸’並彎折至膠座ί之外膠壁11之底部形成弯 折部20，該彎折部20低於膠座1之底面以作為後續製程之 接點。本發明之金屬接腳2係通過銅合金導電金屬以衝壓 成型方式形成，其中將金屬接腳2朝向功能區10之表面定 義為上表面，與上表面相對的表φ定義為卞表面。參閱 第四圖所示，在金屬接腳2的上表面設有鍍銀層21，以反 射發光晶片3所發出的光，該鍍银層21也可以同時設置在 金屬接腳2的上、下表面。在鍍銀層21的上面又設有一結 合促進層22，可減少膠座1及鍍銀層21之間產生間隙，同 時亦可以防止外部環境中的水氣及硫化物通過膠座1與金 屬接腳2之間進入功能區10内。所述結合促進層22也可以 僅設置在膠座1與金屬接腳2之結合處。 在本發明中之結合促進層22係由一種含有醯胺基團物質 組成，這種含有醯胺基團物質之化學式為： HSCH2NH2COOH4HSCH2CH(NHCOCH3)(COOH)。 表單編號A0101 第5頁/共12頁 0992073318-0 201225356 C00H或hsch9ch(nhcoch,)(cooh)中具有硫醇基團’硫 醇基團會與鑛銀層21的表面作用，即硫醇基團内之硫原 子會與鍍銀層21之銀表面結合，可使鍍銀層21與結合促 進層22之間的結合力增強從而可消除鍍銀層21與結合促 進層22之間的間隙。膠座1常用的樹脂成份是聚醯胺’其 化學結構中亦同樣含有醯胺基團，醯胺基團之間的氧原 子和氫原子會互相吸引而產生一種氫鍵作用力，使結合 促進層22與膠座1之間具有較強的結合力，可減少膠座1 與結合促進層2 2之間產生間隙使得水氣無法進入功能區 10内部，從而提高發光晶片3的像用壽命及發光的亮度。 [〇〇14] 本發明利用金屬接腳2表面之結合促進層22及膠座1的醯 胺基團物質之特性，以使金屬接:腳2輿膠座1之間具有很 強的結合力而無法產生間隙，可防止水氣進入功能區1 〇 中，如此就會使發光二極管導線架之鑛銀層21不易變黑 ，提高其使用壽命。 ：" ：: [0015] 本發明之結合促進層2 g係由含有醯胺基團物質組成並列 出 HSCHJLCOOH 和 HSCHJIKNHCOCH J(COOH)兩種較佳 L L L 〇 的實施方式。惟，應當指出其他含有醯胺基團的其他物 質同樣可達到相似的功效。 [0016] 综上所述’本發明確已符合發明專利之要件，爰依法提 出專利申請。惟，以上所述者僅係本發明之較佳實施方 式’本發明之範圍並不以上述實施方式為限舉凡熟習本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 099142193 表單編號A0101 第6頁/共12頁 0992073318-0 201225356 [0017] 第一圖為習知發光二極管導線架之剖視圖； [0018] 第二圖為本發明發光二極管導線架之立體圖； [0019] 第三圖為沿第二圖中之III-III線之剖視圖；及 [0020] 第四圖為第三圖中虛線框A標示部分之局部放大圖。 【主要元件符號說明】 [0021] 膠座：1 [0022] 功能區：1 0 0 [0023] 外膠壁：11 [0024] 金屬接腳：2 [0025] 彎折部：20 [0026] 鍍銀層：21 [0027] 結合促進層：22 [0028] 發光晶片：3 0 [0029] 導線：4 099142193 表單編號A0101 第7頁/共12頁 0992073318-0201225356 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a light-emitting diode lead frame, and more particularly to a surface-adhesive light-emitting diode lead frame. [Prior Art] [0002] A light-emitting diode is a solid-state semiconductor component. Unlike the principle of light-emitting of a tungsten filament bulb, it is a luminescent light that emits light with a very small current. LEDs not only have long life, power saving, durability, shock resistance, robustness, suitable for mass production, small size and fast response, etc., but are more commonly used in oysters, such as backlights for mobile phones and PDA products. Indicators for information and consumer electronics, industrial instrumentation, vehicle indicator lights and brake lights, and large advertising billboards, etc. [〇〇〇3] Conventional surface-adhesive LED conductors usually include a rubber seat, two Metal pin, one light emitting chip and two wires. The rubber seat has a hollow functional area, and the metal pin is buried in the rubber seat, wherein the metal pin portion is exposed to the bottom of the functional area, partially extends from opposite sides of the rubber seat, and the crucible is bent to the outer side of the rubber seat to the glue The bottom surface of the seat serves as a contact point for subsequent processes. A silver plating layer is provided on the surface of the metal pin, and the light emitted from the light-emitting chip is reflected by the silver plating layer. The rubber seat forms a spacer in the functional area to distinguish the polarity of the two metal pins. After the illuminating chip is disposed in the functional area, the illuminating chip and the two metal pins are respectively connected by two wires, and a light-transmissive epoxy resin is covered in the functional area of the pedestal to encapsulate the LED lead frame. The illuminating wafer is illuminated by applying a voltage to the exposed metal pins. [0004] 099142193 However, between the plastic seat of the LED lead frame and the metal will form Form No. A0101 Page 3 / 12 pages 0992073318-0 201225356 Clearance, easily lead to moisture and sulfide along the external environment The gap diffuses into the interior of the functional zone. When water vapor and sulfide coexist, the water vapor accelerates the sulfide to react the silver layer into black silver sulfide. When the silver layer becomes black, the light of the light-emitting wafer is plated. Reducing the brightness in the case of a decrease in the reflectivity of the silver layer eventually leads to failure of the LED lead frame. [0005] Referring to the first figure, an improved LED lead frame is disclosed, which is provided with a plurality of grooves 20' on the surface of the metal pin 2' combined with the rubber seat ,, by increasing the path of water vapor passage. To delay the rate of blackening of the silver layer. However, after the LED lead frame is left for a long time, the silver plating layer will still turn black, and the brightness of the light-emitting chip will still be lowered. In view of this, it is necessary to overcome the drawbacks of the above-mentioned LED lead frame. SUMMARY OF THE INVENTION [0007] The technical problem to be solved by the present invention is to provide an LED lead frame that eliminates the gap between the rubber seat and the metal pin. In order to solve the foregoing technical problems, the present invention provides an LED lead frame comprising: a rubber seat provided with a hollow functional area; and a plurality of metal pins spaced apart from the functional area and extending beyond the plastic seat, The metal pin is provided with a silver plating layer, and the silver plating layer is provided with a bonding promoting layer composed of a mercapto group substance. Compared with the prior art, the bonding promoting layer of the invention can eliminate the gap between the metal pin and the rubber seat, can prevent the silver plating layer of the LED lead frame from becoming black, and improve the service life of the LED lead frame. . [Embodiment] Referring to the second figure, the present invention is a surface-adhesive light-emitting diode 099142193. Form No. A0101 Page 4 / Total 12 Page 0992073318-0 201225356 [0012] 00 ο [0013] 099142193 The lead frame comprises an insulating rubber seat 1 and two metal pins 2 held in the rubber seat. Referring to the second to third figures, the rubber seat 丨 is substantially rectangular parallelepiped and is molded on the metal pin 2 by plastic injection. The outer side of the rubber seat 1 is formed with an outer rubber. The middle portion of the rubber seat 1 is recessed to form a hollow functional area 丨〇. The functional area is rectangular, and may also be a circular shape, an elliptical shape or other polygonal shaped metal pins 2 Buried in the sley 1, each metal pin 2 is partially visible at the bottom of the functional area 10, and is connected by a wire 4 to the luminescent wafer 3 placed on one of the metal pins 2, each metal pin 2 The functional area 1〇 extends to the outside of the rubber seat 1 and is bent to the rubber seat ί. The bottom of the rubber wall 11 forms a bent portion 20, and the bent portion 20 is lower than the bottom surface of the rubber seat 1 as a joint for subsequent processes. . The metal pin 2 of the present invention is formed by stamping molding of a copper alloy conductive metal, wherein the surface of the metal pin 2 toward the functional area 10 is defined as an upper surface, and the surface φ opposite to the upper surface is defined as a meandering surface. Referring to the fourth figure, a silver plating layer 21 is disposed on the upper surface of the metal pin 2 to reflect the light emitted by the light-emitting chip 3. The silver plating layer 21 can also be disposed on the metal pin 2 at the same time. surface. A bonding promoting layer 22 is further disposed on the silver plating layer 21 to reduce the gap between the rubber seat 1 and the silver plating layer 21, and also prevent the moisture and sulfide in the external environment from being connected to the metal through the rubber seat 1. The foot 2 enters the functional area 10. The bonding promoting layer 22 may also be disposed only at the junction of the rubber seat 1 and the metal pin 2. The binding promoting layer 22 in the present invention is composed of a substance containing a guanamine group, and the chemical formula containing the guanamine group material is: HSCH2NH2COOH4HSCH2CH(NHCOCH3)(COOH). Form No. A0101 Page 5 of 12 0992073318-0 201225356 C00H or hsch9ch(nhcoch,)(cooh) has a thiol group, and the thiol group will interact with the surface of the mineral silver layer 21, ie, a thiol group. The sulfur atom inside is combined with the silver surface of the silver plating layer 21, so that the bonding force between the silver plating layer 21 and the adhesion promoting layer 22 is enhanced to eliminate the gap between the silver plating layer 21 and the adhesion promoting layer 22. The commonly used resin component of rubber seat 1 is polyamine. Its chemical structure also contains a guanamine group. The oxygen atom and hydrogen atom between the guanamine groups attract each other to produce a hydrogen bonding force, which promotes the bonding. The layer 22 has a strong bonding force with the rubber seat 1 to reduce the gap between the rubber seat 1 and the bonding promoting layer 2 2 so that moisture cannot enter the inside of the functional area 10, thereby improving the image life of the light-emitting chip 3 and The brightness of the light. [〇〇14] The present invention utilizes the combination of the surface of the metal pin 2 to promote the properties of the layer of the guanamine group of the layer 22 and the rubber seat 1, so that the metal bond: the foot 2 has a strong bonding force between the rubber seats 1. The gap cannot be generated, and the water vapor can be prevented from entering the functional zone 1 , so that the gold ore layer 21 of the LED lead frame is not easily blackened and the service life is improved. :" :: [0015] The binding promoting layer 2 g of the present invention is an embodiment comprising a guanamine group-containing material and two preferred L L L 〇 of HSCHJLCOOH and HSCHJIKNHCOCH J (COOH). However, it should be noted that other substances containing guanamine groups can achieve similar effects. [0016] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description of the preferred embodiments of the present invention is not intended to limit the scope of the present invention, and the equivalents and modifications of those skilled in the art in the spirit of the present invention should be It is covered by the following patent application. [Brief Description] 099142193 Form No. A0101 Page 6 / Total 12 Page 0992073318-0 201225356 [0017] The first figure is a cross-sectional view of a conventional LED lead frame; [0018] The second figure is an LED lead frame of the present invention 3 is a cross-sectional view taken along line III-III in the second diagram; and [0020] The fourth diagram is a partially enlarged view of a portion indicated by a broken line frame A in the third figure. [Main component symbol description] [0021] Plastic seat: 1 [0022] Functional area: 1 0 0 [0023] External rubber wall: 11 [0024] Metal pin: 2 [0025] Bending: 20 [0026] Plating Silver layer: 21 [0027] Bonding promoting layer: 22 [0028] Light emitting chip: 3 0 [0029] Wire: 4 099142193 Form number A0101 Page 7 / Total 12 page 0992073318-0