201212329 六、發明說明： 【發明所屬之技術領域】 本發明係關於光電子裝置及用於製造此裝置之方法，該 裝置包含兩個電極層，其中一功能層介於該兩個電極層之 間。該光電子裝置可特定地為有機發光二極體（〇led)。 【先前技術】 WO 2010/05301 A1揭示了一種光電子裝置（特定言之， OLED) ’其中電子組件配置於連續層中。$ 了提供對内層 之電存取，使用垂直地延行穿過料層之導體橋接器。此 等導體橋接益係藉由在該等層中鑽孔且用導電材料填充該 等孔或藉由在橋接ϋ㈣後位置處建置包含孔之結構化層 (圖4Β)而製造。 【發明内容】 基於此月景’本發明之一目標為提供一種可以節省成本 方式製造的具有一高穩固性之光電子裝置。 此目私係藉由如技術方案i之方法及如技術方案4之光電 子裝置達成。在附屬請求項中揭示較佳實施例。 根據本發明之第—態樣，本發明係關於—種用於製造一 光電子裝置(例如’ —〇LED或一光伏打電池)之方法，該 方法包含以下步驟： 供應一第一電極層。如術語「層」指示，此組件實質 上將為平坦的(特疋言之平面的)，亦即相較於該組件 在垂直於厚度之方向上的寬度延伸及/或深度延伸而言， 牛’、有低厚度。此外’此層將為導電的以使得其稍 156013.doc 201212329 後可充當一電極。在許多狀況下，該第一電極層將進一步 對於將由該光電子裝置產生或處理之光而言為透明的。 b) 在該第一電極層上沈積一或多個島狀物（直接地或間 接地）。在下文中，表述「（多個）島狀物」將用以指代此/ 此等島狀物。該（等）島狀物將具有一實質上小於該第一電 極層之寬度及/或深度’垂直地上升至該第一電極層。在 以下描述中’將採用自該電極層至該（等）島狀物之方向對 應於一自「底部」至「頂部」（或自「下部」至「上部」） 之方向的慣例。 c) 首先在該第一電極層及該（等）島狀物上沈積一功能層 且接著沈積一第二電極層，以使得此功能層及第二電極層 覆蓋該（等）島狀物。該「功能層」之組成取決於該光電子 裝置之特定實施例，且其可包含複數個子層。在一光伏打 電池之狀況下，該功能層將（例如）包含感光材料。該第二 電極層通常可由金屬組成，且其可視情況為透明的。在該 功能層及該第二電極層之該沈積之後，此等所得表面通常 將為不平坦的，其中該（等）（所覆蓋之）島狀物上升至高於 周圍平面。 d) 將一蓋安置於該第二電極層上方，其中該蓋包含至少 一導體且其中進行該沈積以使得此導體（至少部分地）位於 該（等）島狀物上方。若存在若干導體及島狀物，則在一導 體位於每-島狀物上方之情況下，滿足需要。該蓋為一通 常提供該光電子裝置至環境之介面的組件。因此，該蓋通 常經設計而具有一特定機械穩定性。此外，除了該導體所 156013.doc 201212329 位於之專用區域之外，通常為電隔離的。應注意，該導體 在该（等）島狀物上方」的位置包含該導體與該（等）島狀 物之間存在一（電）接觸的狀況或不存在一（電）接觸的狀 況。 該所描述之方法具有以下優點：可製造具有一分層設計 之一光電子裝置（該光電子裝置包含垂直延行之組件—該 等島狀物），而無需已經在沈積期間使該等層（電極層、功 旎層）結構化或（例如）藉由鑽孔對該等層進行後處理。因此 可促進該光電子裝置之該製造且使該製造更節省成本。 該所製造之光電子裝置之該島狀物或複數個島狀物中的 至少一者可（例如）藉由包含一導電材料或由一導電材料組 成而為導電的。在此狀況下，在於該上述方法之步驟d)中 安置該蓋之前，在該導電島狀物之位置處移除該第二電極 層且視情況亦移除該功能層。較佳地，此移除在該島狀物 上方進行且另外亦在該島狀物之一特定周圍中進行。在該 移除之後，可得到一導電橋接器，該導電橋接器為該蓋之 該導體提供對層之堆疊中更深處的該第一電極層之存取。 在本發明之其他實施例（該等實施例可單獨實現或結合 前述實施例實現）中，該島狀物或複數個島狀物中之至少 一者為電隔離的，且該蓋之該導體接觸該隔離島狀物上方 之該第二電極層。因為該第二電極層與某一導體（此處， 為該蓋之導體）之間的連接通常伴隨有某一機械應力，所 以在此等位置處可能發生材料之失效（如裂痕）。配置該第 二電極層與一電隔離島狀物上方之一導體之間的連接具有 156013.doc 201212329 以下優點：此等裂痕無法藉由一短路中斷該整個裝置之功 能，此係因為該等各別層藉由該隔離島狀物而分離。 根據該前述實施例，本發明進一步係關於一種包含以下 _ 組件之光電子裝置： •一第一電極層。 -至少一電隔離島狀物’其安置於該第一電極層上。 功月b層，其女置於该第一電極層上且敌入（且視情 況亦覆蓋）該島狀物。 • 一第二電極層，其覆蓋該功能層及該島狀物。 -具有至少一導體之一蓋，該至少一導體在該（等）島狀 物處電接觸該第二電極層。 可藉由上文所描述之種類之一方法製造該光電子裝置。 因此，關於此裝置之細節、優點及修改的更多資訊參看上 述描述。另外，對於該等電隔離島狀物，該光電子裝置較 佳亦可包含導電島狀物，該等導電島狀物藉由該蓋之至少 一導體而接觸且提供對該第一電極層之存取。 在下文中，將描述本發明之各種較佳實施例，該等較佳 實施例大體而言係關於該方法與具有該（等）電隔離島狀物 - 之該光電子裝置兩者。 . 根據一第一較佳實施例，存在以一圖案配置於該第一電 極層上之複數個島狀物。若存在導電島狀物與電隔離島狀 物兩者，則此等類型中之每-者可以一單獨圖案存在。此 等圖案可接著彼此有關（例如，交錯）。島狀物之該圖案需 要：該蓋之該(等)導體經配置以使得該(等)導體可接觸該 156013.doc 201212329 等相關聯之島狀物。 大體而言’可以多種形狀及設計來實現該蓋。在一較佳 實施例中，該蓋包含一電隔離基板（例如，一塑膠板或玻 璃板），在該組裝之光電子裝置中，該電隔離基板在面向 該第二電極層之側上載運至少一導線。舉例而言，可藉由 印刷將該導線塗覆至該隔離基板之表面。 在該則述實施例之另一發展中，該蓋包含至少一饋通 件，該至少一饋通件連接該導線與該蓋之相反側。在此狀 況下，可有利地在該蓋之上表面處接觸該光電子裝置。 該蓋較佳憑藉一導電膠而附接至該第二電極層及/或附 接至導電島狀物。通常，此導電膠配置於該蓋之該至少一 導體與该第二電極層及/或該（等）導電島狀物之間，從而提 供該等各別組件之間的機械附接與電連接兩者。為了使可 能歸因於收縮效應而發生之機械應力的效應最小化，較佳 將該導電膠塗覆於小的隔離點中（代替連續線或區）。 在本發明之另一發展中，一膠環將該蓋連接至下方之該 等層（亦即，連接至該第二電極層、該功能層、該第一電/ 極層及/或-基板最佳地，此環係封閉的。該環提供該 光電子裝置之-密封，且該環通常沿該蓋之周邊延行。 在另-實施例中’沿一封閉輪廓線移除該第二電極層， 且視情況亦移除該功能層，且進一步視情況亦移除該第一 電極層。構成該光電子裝置之該分層結構因此沿此輪廓線 中斷，亦即，該分層結構限於該線内部之區。以此方弋， 可容易地製造具有各種形狀之光電子裝置。 > 156013.doc201212329 VI. Description of the Invention: [Technical Field] The present invention relates to an optoelectronic device and a method for manufacturing the same, the device comprising two electrode layers, wherein a functional layer is interposed between the two electrode layers. The optoelectronic device can be specifically an organic light emitting diode. [Prior Art] WO 2010/05301 A1 discloses an optoelectronic device (specifically, OLED) where electronic components are disposed in a continuous layer. $ provides electrical access to the inner layer, using a conductor bridge that extends vertically through the layer. These conductor bridges are fabricated by drilling holes in the layers and filling the holes with a conductive material or by constructing a structured layer comprising holes (Fig. 4A) at a position behind the bridge (4). SUMMARY OF THE INVENTION An object of the present invention is to provide an optoelectronic device having a high stability that can be manufactured in a cost-effective manner. This object is achieved by a method such as the solution of the solution i and a photonic device as in the fourth aspect. The preferred embodiment is disclosed in the accompanying claims. In accordance with a first aspect of the present invention, the present invention is directed to a method for fabricating an optoelectronic device (e.g., a <RTIgt; 〇LED or a photovoltaic cell), the method comprising the steps of: supplying a first electrode layer. As the term "layer" indicates, the component will be substantially flat (in particular, planar), that is, in relation to the width extension and/or depth extension of the component in a direction perpendicular to the thickness, ', has a low thickness. In addition, this layer will be electrically conductive so that it can act as an electrode after a little 156013.doc 201212329. In many cases, the first electrode layer will be further transparent to the light to be produced or processed by the optoelectronic device. b) depositing one or more islands (directly or indirectly) on the first electrode layer. In the following, the expression "(a plurality of islands)" will be used to refer to this / such islands. The islands will have a substantially smaller width and/or depth ' than the first electrode layer rising vertically to the first electrode layer. In the following description, the direction from the electrode layer to the island is used in a direction from "bottom" to "top" (or from "lower" to "upper"). c) first depositing a functional layer on the first electrode layer and the island, and then depositing a second electrode layer such that the functional layer and the second electrode layer cover the island. The composition of the "functional layer" depends on the particular embodiment of the optoelectronic device and it may comprise a plurality of sub-layers. In the case of a photovoltaic cell, the functional layer will, for example, comprise a photosensitive material. The second electrode layer can generally be composed of metal and it can be transparent as appropriate. After the deposition of the functional layer and the second electrode layer, the resulting surface will generally be uneven, wherein the (or) (covered) islands rise above the surrounding plane. d) placing a cover over the second electrode layer, wherein the cover comprises at least one conductor and wherein the depositing is performed such that the conductor is (at least partially) positioned over the island. If there are several conductors and islands, it is sufficient if a conductor is located above each island. The cover is an assembly that typically provides the interface of the optoelectronic device to the environment. Therefore, the cover is often designed to have a specific mechanical stability. In addition, it is usually electrically isolated except for the dedicated area where the conductor 156013.doc 201212329 is located. It should be noted that the location of the conductor above the island or the like includes a condition in which there is an (electrical) contact between the conductor and the island or a (electrical) contact. The method described has the advantage that an optoelectronic device having a layered design can be fabricated (the optoelectronic device comprises vertically extending components - such islands) without having to have the layers (electrodes) during deposition The layers, layers, etc. are structured or post-processed, for example by drilling holes. This facilitates the manufacture of the optoelectronic device and makes the manufacturing more cost effective. At least one of the island or plurality of islands of the fabricated optoelectronic device can be electrically conductive, for example, by comprising a conductive material or consisting of a conductive material. In this case, before the cover is placed in step d) of the above method, the second electrode layer is removed at the location of the conductive island and the functional layer is removed as appropriate. Preferably, this removal takes place over the island and additionally in a particular periphery of the island. After the removal, a conductive bridge is obtained which provides access to the conductor of the cover to the deeper portion of the first electrode layer in the stack of layers. In other embodiments of the invention, which may be implemented separately or in combination with the foregoing embodiments, at least one of the island or plurality of islands is electrically isolated and the conductor of the cover Contacting the second electrode layer above the isolation island. Since the connection between the second electrode layer and a conductor (here, the conductor of the cover) is usually accompanied by a certain mechanical stress, material failure (e.g., cracks) may occur at such locations. Configuring the connection between the second electrode layer and a conductor above an electrically isolated island has the following advantages: 156013.doc 201212329 The following advantages: the cracks cannot interrupt the function of the entire device by a short circuit, because of the The other layers are separated by the isolation island. According to the foregoing embodiment, the invention further relates to an optoelectronic device comprising the following: - a first electrode layer. At least one electrically isolating island is disposed on the first electrode layer. On the b-layer of the power month, the female is placed on the first electrode layer and is enemies (and as the case may also cover) the island. • A second electrode layer covering the functional layer and the island. - having a cover of at least one conductor that electrically contacts the second electrode layer at the island. The optoelectronic device can be fabricated by one of the methods described above. Therefore, for more details on the details, advantages and modifications of this device, refer to the above description. In addition, for the electrically isolated islands, the optoelectronic device preferably further includes a conductive island, the conductive islands being contacted by at least one conductor of the cover and providing the first electrode layer take. In the following, various preferred embodiments of the invention will be described, generally in relation to both the method and the optoelectronic device having the (iso) electrically isolating islands. According to a first preferred embodiment, there are a plurality of islands arranged in a pattern on the first electrode layer. If there are both conductive islands and electrically isolated islands, each of these types can exist in a single pattern. These patterns can then be related to each other (e.g., staggered). The pattern of islands requires that the conductor of the cover be configured such that the conductor can contact the associated islands such as 156013.doc 201212329. In general, the cover can be implemented in a variety of shapes and designs. In a preferred embodiment, the cover comprises an electrically isolating substrate (for example, a plastic plate or a glass plate). In the assembled optoelectronic device, the electrically isolated substrate is carried on the side facing the second electrode layer. a wire. For example, the wire can be applied to the surface of the isolation substrate by printing. In another development of the described embodiment, the cover includes at least one feedthrough that connects the wire to the opposite side of the cover. In this case, it is advantageous to contact the optoelectronic device at the upper surface of the cover. The cover is preferably attached to the second electrode layer and/or to the conductive island by means of a conductive paste. Typically, the conductive paste is disposed between the at least one conductor of the cover and the second electrode layer and/or the conductive islands to provide mechanical attachment and electrical connection between the respective components. Both. In order to minimize the effects of mechanical stresses that may occur due to the shrinkage effect, it is preferred to apply the conductive paste to a small isolation point (instead of a continuous line or zone). In another development of the invention, a rubber ring connects the cover to the underlying layers (ie, to the second electrode layer, the functional layer, the first electrode/pole layer, and/or the substrate) Most preferably, the ring is closed. The ring provides a seal for the optoelectronic device and the ring typically extends along the periphery of the cover. In another embodiment, the second electrode is removed along a closed contour Layer, and optionally removing the functional layer, and further removing the first electrode layer as appropriate. The layered structure constituting the optoelectronic device is thus interrupted along the contour, that is, the layered structure is limited to the The area inside the line. In this way, optoelectronic devices of various shapes can be easily fabricated. > 156013.doc
S 201212329 在該前述實施例之另一發展中，該蓋之該至少一導體並 不延伸超出由該輪摩線圍繞之該區。此情形保證了該功能 光電子裝置限於該圍繞之區。 該第一電極層上之該（等）島狀物通常誘發該第二電極層 之層級處的—不平坦之三維表面。當將—平面蓋置放至此 不平坦表面上時，通常將因此保留一些凹穴。在一較佳實 施例中，用隔熱（且較佳亦電隔離）填充材料（例如，用樹 脂、重油或液體除氣劑材料）填充該蓋與該等下部層之間 的此等凹穴。 大體而言，該第一電極層可能為自支撐的且構成該光電 子裝置之底部處的最外層。然而，在許多狀況下，該第— 電極層將安置於提供機械穩定性及支撐的某一基板上。此 外，此基板通常將為電隔離的。該基板可進一步為透明的 以允許由該裝置產生或處理之光通過。 在較佳貫現中，该功能層包含一電致發光有機材料。 在此狀況下，該整個光電子裝置可構成一有機發光二極體 (OLED)〇 【實施方式】 本發明之此等及其他態樣將自下文所描述之實施例而顯 而易見，且將參看下文所描述之實施例來闡明。將憑藉隨 附圖式藉由實例來描述此等實施例。 下文中將關於有機發光二極體（〇LED)描述本發明，但 本發明之原理亦可應用於許多其他情形。 圖1及圖2說明由設計所特定之一系列處理步驟組成的 156013.doc 201212329 OLED(例如’用於顯示器及照明）之習知製造。 此等步驟中之第一步驟為基板1之製造，基板1可（例如） 由玻璃或塑膠製成。在該基板上，形成透明導體2(例如， 透明導體氧化物（TCO)、ZnO、ITO、PEDOT:PSS等）之一 結構化層。視情況，另外將金屬線3(例如，MAM、 crAlcr、Cu等）塗覆至該導體上。此圖案化步驟之主要功 能為：形成稍後陰極與陽極將電連接所在之電分離區。此 圖案化可藉由如光微影或雷射切除之減除法進行，其中在 特定區中移除全區塗層。或者，可應用該等層之圖案化沈 積。實例為銀漿料之印刷、PED〇T:PSS之印刷、經由蔽蔭 遮罩之濺鑛，等等。 在接下來之步驟中’塗覆〇LED功能層4。在圖1中展示 此Ps #又。小分子〇LED係（例如）藉由真空中之熱蒸鍵而沈 積。必須以使得至少陰極接點不被塗佈之方式來限制有機 材料之沈積。通常亦保護陽極接點免於塗佈以便達成稍後 之良好電接觸。此結構化沈積係憑藉蔽蔭遮罩M1而達 成。此等遮罩為每一 OLED設計所特定的且在有機沈積期 間置放於基板之頂部。此情形可以實體接觸方式進行或以 基板與遮罩之間具有小間隙方式進行。在沈積製程期間， 將用有機材料來塗佈蔽蔭遮罩Ml。 圖2展示下一步驟’該步驟為陰極$之沈積。此亦可發生 於真空熱蒸鍍製程中。在此狀況下，亦必須使該層結構化 (亦即，在沈積期間省去陽極接觸點），此係因為否則在陰 極與陽極之間存在短路。此外，陰極5必須與基板丨上之陰 156013.doc •10· 201212329 極接觸點電接觸。在此陰極沈積中，亦使用蔽蔭遮罩M2 來保護裝置中之區免於沈積。將再次用材料（在此狀況 下’為陰極材料（通常為如銅、銀、鋁、金等之金屬））來塗 佈該遮罩。因為針對有機物及陰極之塗佈區不同，所以必 須在兩個製程中使用不同的遮罩集合。 所心述之製程之各種修改係可能的，例如：除了 TCO及 金屬之外’常常亦使用絕緣層來塗佈經圖案化之TTO及金 屬層的邊緣（此係因為經圖案化之ττο及金屬層常常展示尖 銳邊緣）。在僅存在TCO之設計中，僅存在一 TCO層且在基 板上無金屬化。在頂部發射〇LEDi狀況下，基板可為不 透明的，但陰極必須為透明的。在倒置式OLED之狀況 下’交換陽極與陰極之位置。 所描述之製程的主要缺點為： 因為遮罩係設計所特定的，所以設計改變需要新的遮 罩集合。此情形限制設計改變之產出時間（thr〇ughput time)且增加成本。 遮罩係在沈積期間加以塗佈。此情形需要定期清潔且 招致成本，且來自遮罩之鬆散粒子可導致短路且減少產 率。 因為遮罩在處理期間之熱膨脹導致圖案化不準確性， 所以遮罩僅可用於小的基板大小。 -真空中之遮罩處置非常昂貴。 審於上述考慮’此處建議替代OLED設計及替代製造程 序其中特疋言之避免了遮罩步驟（所使用之材料可與上 156013.doc 201212329 • · * 文所引用之材料相同）。 圖3展示前述製造程序之第-步驟。提供頂部具有第一 電極層102之基板101(例如，玻璃）。在下文中，將假定該 電極層為透明導電氧化物（TCO)，如摻雜有鋁之氧=二: 金屬小滴以規則圖案沈積於TCO層102上，，v ’從而產生複數 個（連續）島狀物1 03。舉例而言，可衮县砧 干J 。 J合易地使用銀墨之噴墨S 201212329 In another development of the foregoing embodiment, the at least one conductor of the cover does not extend beyond the area surrounded by the wheel. This situation ensures that the function optoelectronic device is limited to the surrounding area. The islands on the first electrode layer typically induce an uneven flat three-dimensional surface at the level of the second electrode layer. When the flat cover is placed on this uneven surface, some pockets will usually remain. In a preferred embodiment, the insulative (and preferably electrically isolated) filler material (eg, with a resin, heavy oil or liquid deaerator material) is used to fill the pockets between the cover and the lower layers. . In general, the first electrode layer may be self-supporting and constitute the outermost layer at the bottom of the photonic device. However, in many cases, the first electrode layer will be placed on a substrate that provides mechanical stability and support. In addition, the substrate will typically be electrically isolated. The substrate can be further transparent to allow light generated or processed by the device to pass. In a preferred embodiment, the functional layer comprises an electroluminescent organic material. In this case, the entire optoelectronic device can constitute an organic light emitting diode (OLED). [Embodiment] These and other aspects of the present invention will be apparent from the embodiments described hereinafter, and The embodiments are described to illustrate. These embodiments will be described by way of example with the accompanying drawings. The invention will be described hereinafter with respect to organic light-emitting diodes (〇LEDs), but the principles of the invention may also be applied to many other situations. Figures 1 and 2 illustrate a conventional fabrication of a 156013.doc 201212329 OLED (e.g., 'for display and illumination) consisting of a series of processing steps specific to the design. The first of these steps is the manufacture of substrate 1, which can be made, for example, of glass or plastic. On the substrate, a structured layer of a transparent conductor 2 (e.g., transparent conductor oxide (TCO), ZnO, ITO, PEDOT: PSS, etc.) is formed. Optionally, a metal wire 3 (e.g., MAM, crAlcr, Cu, etc.) is applied to the conductor. The main function of this patterning step is to form an electrical separation zone where the cathode and anode will be electrically connected later. This patterning can be performed by subtraction such as photolithography or laser ablation, in which the full area coating is removed in a particular zone. Alternatively, patterned deposition of the layers can be applied. Examples are printing of silver paste, printing of PED〇T:PSS, splashing through a shadow mask, and the like. The LED functional layer 4 is coated in the next step. This Ps # is shown in Figure 1. Small molecule 〇 LEDs are deposited, for example, by hot steaming bonds in a vacuum. The deposition of the organic material must be limited in such a way that at least the cathode contacts are not coated. The anode contacts are also typically protected from coating to achieve good electrical contact at a later time. This structured deposition is achieved by means of a shadow mask M1. These masks are specific to each OLED design and are placed on top of the substrate during organic deposition. This can be done in a physical contact manner or with a small gap between the substrate and the mask. During the deposition process, the mask mask M1 will be coated with an organic material. Figure 2 shows the next step 'This step is the deposition of the cathode $. This can also occur in a vacuum thermal evaporation process. In this case, the layer must also be structured (i.e., the anode contact point is omitted during deposition) because otherwise there is a short circuit between the cathode and the anode. In addition, the cathode 5 must be in electrical contact with the cathode contact point on the substrate 156013.doc •10· 201212329. In this cathodic deposition, a shadow mask M2 is also used to protect the area in the device from deposition. The mask will be applied again with the material (in this case, the cathode material (usually a metal such as copper, silver, aluminum, gold, etc.)). Because the coating area for organics and cathodes is different, different mask sets must be used in both processes. Various modifications of the described process are possible, for example, in addition to TCO and metal, often using an insulating layer to coat the edges of the patterned TTO and metal layers (this is due to the patterned ττο and metal Layers often show sharp edges). In designs where only TCO is present, there is only one TCO layer and no metallization on the substrate. In the case of a top emitting 〇LEDi, the substrate may be opaque, but the cathode must be transparent. The position of the anode and cathode is exchanged under the condition of an inverted OLED. The main disadvantages of the described process are: Because the mask design is specific, design changes require a new set of masks. This situation limits the design time of the design change (thr〇ughput time) and increases the cost. The mask is applied during deposition. This situation requires regular cleaning and incurs costs, and loose particles from the mask can cause short circuits and reduce yield. Because the thermal expansion of the mask during processing results in patterning inaccuracies, the mask can only be used for small substrate sizes. - Masking in vacuum is very expensive to handle. In the above considerations, it is proposed to replace the OLED design and the alternative manufacturing process in which the masking step is avoided (the material used may be the same as the material cited in the text). Figure 3 shows the first step of the aforementioned manufacturing procedure. A substrate 101 (e.g., glass) having a first electrode layer 102 on top is provided. In the following, it will be assumed that the electrode layer is a transparent conductive oxide (TCO), such as oxygen doped with aluminum = two: metal droplets are deposited on the TCO layer 102 in a regular pattern, v ' thereby producing a plurality (continuous) Island 1 03. For example, Kexian Anvil can be dried. J Yiyi uses inkjet of silver ink
印刷來沈積該等小滴。典型小滴高度h A 又1句巧ϋ, 5 μ m至2 μΠ!。一般而言，島狀物103將高於接下來沈積（參看圖㈠之 (有機層及電極層）層1〇4、1〇5之厚度。在沈積島狀物1〇3之 後，應用固化步驟以便增加金屬漿料之導電性。此操作可 (例如）在熱處理製程中進行（對於奈米級墨，通常在150^ 下歷時30分鐘）。 圖4展示下一製造步驟，在該製造步驟中，用功能 層1〇4(亦即，用有機電致發光材料）且用第二電極層1〇5(亦 即，陰極金屬）以全區方式塗佈先前所達成之中間產品 l〇〇a。此製程不需要蔽蔭遮罩。 在層之前述沈積之後，需要一結構化製程，在圖5中展 不5亥結構化製程。使用雷射系統（例如，皮秒級綠雷射束 L1)移除金屬島狀物1〇3之頂部以及此等島狀物附近的陰極 金屬105。被移除區之典型特徵大小為30〇 μπι直徑。 圖6展示第二步驟，在該第二步驟中移除有機層1〇4。此 操作可使用相同雷射系統進行或藉由在存在氧之情況下使 用UV雷射束L2進行。在此狀況下，因為有機材料被氧化 且可被提取，所以很大程度上避免了碎屑。切除區必須小 156013.doc 12- 201212329 於或等於清除了陰極金屬之區。 為了電接觸所獲得之OLED結構1 〇〇d以及氣密地密封 OLED，使用特殊蓋罩u〇。下文中參看圖7及圖8描述此蓋 110之製造。 在第一步驟中’用導電跡線112a、112b塗佈平面玻璃板 111。此操作可容易地使用以下步驟進行：金屬漿料之網 版印刷，後續接著熱退火’或後續接著金屬之雷射質量轉 移。所塗覆之圖案可由具有梳狀結構之兩個導體組成，該 等梳狀結構在不具有電接觸之狀況下彼此合併。單一導體 結構之個別線之間的距離等於基板上之島狀物1 〇 3的間距 (在X方向上）。兩個導體112&、112b電連接至玻璃罩中之金 屬饋通件114’該等金屬饋通件114實現穿過玻璃之電連 接。 在導體ll2a、im之頂部塗覆導電膠113a、U3b。對於 一導體112b而言，小滴U3b之間距等於基板上之島狀物 103的間距（在y方向上）。對於另一導體112a而言，膠u3a 之沈積之位置不受限制。然而’推薦線之斷裂，以便避免 可在陰極上引起機械應力之長的導電膠跡線。 在最後製備步驟中’用薄的膠輪緣115沿蓋11〇之周邊塗 佈蓋110。此輪緣115稍後將密封OLED裝置。 在圖7中所展示之OLED製造的下一步驟中，將所製備之 蓋罩H0置放於經預先處理之基板100d之頂部。使膠小滴 112b與基板上之島狀物1〇3對準。藉由機械力，實現用於 陽極接點的膠與島狀物之間的電接觸，且實現用於阶極接 156013.doc 201212329 點的陰極105與膠線113a之間的電接觸。在相同製程中， 使得輪緣膠115與基板接觸。 此製程理想地對氣密密封起作用，此係因為此製程將不 需要吸水除氣劑（乾燥劑（descidant))。舉例而言，可使用 雷射燒結密封製程。在此狀況下’因為雷射密封線僅在 ’ TC〇上且並非如古典OLED中在TCO及金屬上，所以該製 . 程非常可靠。另外，〇LED密封件之線寬將為最小的，此 情形對於無縫平鋪而言為理想的。另一可能的氣密密封可 藉由使用金屬漿料來實現。 以此方式實現之完成之OLED裝置1〇〇可經由玻璃罩11〇 而接觸。 在乾燥製程期間，當導電膠收縮時，導電膠本質上引起 特定量之機械應力。為了避免對OLED陰極之機械損傷， 可修改上述製程，如下文關於圖9至圖11所描述。 圖9展示此替代製造程序之開始步驟。與圖3中所說明之 製耘形成對比，現在基板201上方之第一電極層202上沈積 兩種交錯圖案之島狀物203、206。該新圖案由絕緣材料之 島狀物206組成。此等絕緣小滴206置放於導電（金屬）島狀 物203之間。該等島狀物之間的距離主要係藉由以下各者 來判定：每—表面積待汲取之最大電流，及對OLED光發 射之均質性的要求。電壓降及因此的光輸出之下降受限於 兩個相鄰金屬島狀物203之間的距離。典型距離（在x方向 及/或y方向上）在約5 mm與約2 cm之間。 如先前狀況下，接著用有機層2〇4及第二電極層2〇5(陰 156013.docPrint to deposit the droplets. The typical droplet height h A is 1 sentence, 5 μm to 2 μΠ!. In general, the islands 103 will be higher than the thickness of the layers (1, 4, 1 and 5) of the (organic layer and electrode layer) of Fig. (1). After the islands 1〇3 are deposited, the curing step is applied. In order to increase the conductivity of the metal paste. This operation can be carried out, for example, in a heat treatment process (for nano-scale inks, typically at 150 ° for 30 minutes). Figure 4 shows the next manufacturing step in which the manufacturing step is performed. Applying the previously achieved intermediate product l〇〇a in a holographic manner using the functional layer 1〇4 (ie, using an organic electroluminescent material) and using the second electrode layer 1〇5 (ie, the cathode metal) This process does not require a shadow mask. After the aforementioned deposition of the layer, a structured process is required, which is shown in Figure 5. The laser system is used. For example, a picosecond green laser beam L1 is used. The top of the metal islands 1〇3 and the cathode metal 105 in the vicinity of the islands are removed. The typical feature size of the removed regions is 30 μμm in diameter. Figure 6 shows a second step in which the second step Remove the organic layer 1〇4. This operation can be performed or borrowed using the same laser system In the presence of oxygen, the UV laser beam L2 is used. In this case, since the organic material is oxidized and can be extracted, the debris is largely avoided. The cut-out area must be small 156013.doc 12-201212329 Or equal to the area where the cathode metal is removed. In order to electrically contact the obtained OLED structure 1 〇〇d and hermetically seal the OLED, a special cover u is used. The manufacture of the cover 110 will be described hereinafter with reference to FIGS. 7 and 8. In a first step 'the planar glass sheet 111 is coated with conductive traces 112a, 112b. This operation can be easily carried out using the following steps: screen printing of the metal paste followed by thermal annealing ' or subsequent laser laser Mass transfer. The applied pattern may consist of two conductors having a comb structure that merge with each other without electrical contact. The distance between individual lines of a single conductor structure is equal to the island on the substrate. The spacing of the ridges 3 (in the X direction). The two conductors 112&, 112b are electrically connected to the metal feedthroughs 114' in the glass cover. The metal feedthroughs 114 enable electrical connection through the glass. The conductive pastes 113a, U3b are coated on top of the conductors ll2a, im. For one conductor 112b, the distance between the droplets U3b is equal to the pitch (in the y direction) of the islands 103 on the substrate. For the other conductor 112a The position of the deposition of the glue u3a is not limited. However, the break of the wire is recommended to avoid long conductive paste traces that can cause mechanical stress on the cathode. In the final preparation step, 'with a thin rubber rim 115 along The periphery of the cover 11 is coated with a cover 110. This rim 115 will later seal the OLED device. In the next step of the OLED fabrication shown in Figure 7, the prepared cover H0 is placed in a pre-processed The top of the substrate 100d. The glue droplet 112b is aligned with the island 1〇3 on the substrate. Electrical contact between the glue and the island for the anode contacts is achieved by mechanical force and electrical contact between the cathode 105 and the glue line 113a for the point connection 156013.doc 201212329 is achieved. In the same process, the rim glue 115 is brought into contact with the substrate. This process desirably acts on a hermetic seal because this process will not require a water-absorbing deaerator (descidant). For example, a laser sintered sealing process can be used. In this case, the process is very reliable because the laser seal line is only on the 'TC' and not on the TCO and metal as in a classical OLED. In addition, the line width of the 〇LED seal will be minimal, which is ideal for seamless tiling. Another possible hermetic seal can be achieved by using a metal paste. The OLED device 1 that is completed in this way can be contacted via the glass cover 11 。. During the drying process, when the conductive paste shrinks, the conductive paste inherently causes a certain amount of mechanical stress. To avoid mechanical damage to the OLED cathode, the above process can be modified as described below with respect to Figures 9-11. Figure 9 shows the initial steps of this alternative manufacturing process. In contrast to the crucible illustrated in Figure 3, two staggered patterns of islands 203, 206 are now deposited on the first electrode layer 202 above the substrate 201. The new pattern consists of islands 206 of insulating material. These insulating droplets 206 are placed between the conductive (metal) islands 203. The distance between the islands is determined primarily by the maximum current per surface area to be extracted and the homogeneity of the OLED light emission. The voltage drop and hence the drop in light output is limited by the distance between two adjacent metal islands 203. The typical distance (in the x and/or y directions) is between about 5 mm and about 2 cm. As in the previous situation, the organic layer 2〇4 and the second electrode layer 2〇5 are used (yin 156013.doc
S -14· 201212329 極）以全區方式塗佈所獲得之肀間產品200a。此情形展示 於圖10中。 類似於先則程序流程’使用雷射系統移除金屬島狀物 203之頂部及金屬島狀物2〇3附近之陰極2〇5。相同情形適 用於此區中之有機材料204。絕緣體島狀物2〇6之頂部的 OLED層204、205可保持在適當位置。 圖11展不所得基板，其中當自上方將蓋罩210置放於此 基板之頂部時该基板之層係在頂部上。在此狀況下，用具 有與絕緣體島狀物206之間距相同的y間距的膠小滴213 a替 換導電膠（圖8中之113)條帶。若該膠局部地引起對陰極2〇5 之機械損傷’則此情形將並不導致短路，此係因為接觸區 在絕緣區之頂部。 為了使OLED之熱管理最佳化，可用絕緣導熱材料填充 導線112a、112b或212a、212b之間及導電膠點之間的空 間。在此狀況下，所產生之熱將朝向蓋罩傳導。另外，因 為不再存在凹穴· ’所以OLED不再對外部壓力之改變敏 感。. 所描述之製程可以若干方式變化，例如： -可使用如PEDOT:PSS之有機導體代替透明導電氧化 物。 -可用其他絕緣材料代替玻璃蓋罩。 -若將％極及/或陰極電流分佈栅格印刷至絕緣層上， 則可用金屬蓋罩代替玻璃蓋罩。 -可用聚合物OLED材料替換sin〇LED。 156013.doc -15- 201212329 -亦可使用其他圖案化製程（例如，機械圖案化或電漿 钱刻）代替該（等）層之雷射移除。 所描述之製程亦可用以藉由後沈積製程形成隨機成形之 OLED。此情形說明於圖12中，圖12為自基板之陰極3〇5檢 視的俯視圖（有機層及基板在陰極之下在此狀況下，在 移除導電島狀物303之頂部的陰極及有機層之後，應用另 一雷射製程。在此製程t，使用雷射來移除沿將形成之 OLED 300之輪廊320的陰極層及有機層，被移除之陰極層 必須較佳大於或等於被移除之有機層。必須相應地將足夠 圖案的膠輪緣及電接點印刷於蓋罩（未圖示）上。在密封製 程之後，經由標準雕合及斷裂製程來分離〇LED。 最後指出，在本申請案中，術語「包含」並不排除其他 π件或步驟，「一」並不排除複數個，且單一處理器或其 他單兀可實現若干構件之功能。本發明駐留於每一個新穎 特性特徵及特性特徵之每一個組合中。此外，不應將申請 專利範圍中之參考符號解譯為限制申請專利範圍之範疇。 【圖式簡單說明】 圖1及圖2說明使用遮罩用於層之結構化的oled之製造 的兩個步驟； 圖3至圖7說明根據本發明之OLED之連續製造步驟； 圖8展示自前述製造程序中所使用之蓋之底側檢視的視 圖； 圖9至圖11說明包含電隔離島狀物之替代OLED之連續製 造步驟； 1560l3.docS -14· 201212329 Pole) The obtained daytime product 200a is applied in a zone-wide manner. This situation is shown in Figure 10. Similar to the prior procedure, the laser system is used to remove the top of the metal island 203 and the cathode 2〇5 near the metal island 2〇3. The same applies to the organic material 204 in this zone. The OLED layers 204, 205 on top of the insulator islands 2〇6 can be held in place. Figure 11 shows a substrate in which the layer of the substrate is tied to the top when the cover 210 is placed on top of the substrate from above. In this case, the tape of the conductive paste (113 in Fig. 8) is replaced by a glue droplet 213a having the same y-pitch distance from the insulator island 206. If the glue locally causes mechanical damage to the cathode 2〇5, this situation will not result in a short circuit because the contact area is at the top of the insulating region. In order to optimize the thermal management of the OLED, the space between the wires 112a, 112b or 212a, 212b and between the conductive dots can be filled with an insulating thermally conductive material. In this case, the heat generated will be conducted towards the cover. In addition, the OLED is no longer sensitive to changes in external pressure because there are no more pockets. The described process can be varied in several ways, for example: - An organic conductor such as PEDOT:PSS can be used in place of the transparent conductive oxide. - A glass cover can be replaced by other insulating materials. - If the % pole and / or cathode current distribution grid is printed onto the insulating layer, a metal cover can be used instead of the glass cover. - The sin〇LED can be replaced with a polymer OLED material. 156013.doc -15- 201212329 - Other patterning processes (eg, mechanical patterning or plasma stamping) may be used instead of laser removal of the (etc.) layer. The described process can also be used to form randomly shaped OLEDs by a post deposition process. This situation is illustrated in FIG. 12, which is a top view from the cathode 3〇5 of the substrate (the organic layer and the substrate under the cathode, in this case, the cathode and the organic layer at the top of the conductive island 303 are removed). Thereafter, another laser process is applied. In this process t, a laser is used to remove the cathode layer and the organic layer along the porch 320 of the OLED 300 to be formed, and the removed cathode layer must preferably be greater than or equal to The organic layer is removed. A sufficient pattern of rubber rims and electrical contacts must be printed on the cover (not shown) accordingly. After the sealing process, the 〇LEDs are separated via standard lithography and breaking processes. In the present application, the term "comprising" does not exclude other components or steps, and "a" does not exclude the plural, and a single processor or other unit can perform the functions of several components. The present invention resides in each In addition, the reference symbols in the claims are not to be construed as limiting the scope of the claims. [Simplified Schematic] FIGS. 1 and 2 illustrate the use of masks. 2 steps of the fabrication of the structured OLED of the layer; FIGS. 3 to 7 illustrate the successive manufacturing steps of the OLED according to the present invention; FIG. 8 shows a view of the bottom side of the cover used in the aforementioned manufacturing procedure; 9 to 11 illustrate a continuous manufacturing step of an alternative OLED comprising electrically isolated islands; 1560l3.doc
S •16· 201212329 圖12展示自具有頂層之基板檢視的俯視圖，其中已移除 此等層之各種輪廓線。 相似參考數字或相差100之整數倍之數字在諸圖中指代 相同或類似組件。 【主要元件符號說明】 1 基板 2 透明導體 3 金屬線 4 OLED(有機發光二極體）功能層 5 陰極 100 光電子裝置 100a 中間產品 100d OLED(有機發光二極體）結構/經預先處理 之基板 101 基板 102 第一電機層 103 島狀物 104 功能OLED(有機發光二極體）層/有機層/功 能層 105 第二電極層/陰極金屬 110 蓋罩 111 平面玻璃板/電隔離基板 112a 導電跡線/導體/導線 112b 導電跡線/導體/膠小滴/導線 156013.doc -17· 201212329S • 16· 201212329 Figure 12 shows a top view from a substrate with a top layer where various contours of the layers have been removed. Like reference numerals or integers that differ by an integer of 100 refer to the same or similar components in the figures. [Main component symbol description] 1 substrate 2 transparent conductor 3 metal wire 4 OLED (organic light-emitting diode) functional layer 5 cathode 100 optoelectronic device 100a intermediate product 100d OLED (organic light-emitting diode) structure / pre-processed substrate 101 Substrate 102 First Motor Layer 103 Island 104 Function OLED (Organic Light Emitting Diode) Layer / Organic Layer / Functional Layer 105 Second Electrode Layer / Cathode Metal 110 Cover 111 Flat Glass Plate / Electrically Isolated Substrate 112a Conductive Trace /conductor / wire 112b conductive trace / conductor / glue droplet / wire 156013.doc -17· 201212329
113a 113b 114 115 200 200a 201 202 203 204 205 206 210 211 212a 212b 213a 213b 214 300 303 305 320 LI 導電膠/膠線 導電膠/小滴 金屬饋通件 薄的膠輪緣/輪緣/輪緣膠/膠之較佳封閉環 光電子裝置 中間產品 基板 第一電極層 島狀物 有機層/有機材料/功能層 第二電極層 島狀物/絕緣小滴/絕緣體島狀物 蓋罩 電隔離基板 導線/導體 導線/導體 膠小滴/導電膠 導電膠 饋通件 OLED(有機發光二極體）/光電子裝置 導電島狀物 第二電極層/陰極 輪廓/封閉輪廓線 皮秒級綠雷射束 156013.doc -18 - 201212329 L2 Ml M2 UV(紫外線）雷射束 蔽陰遮罩 蔽蔭遮罩 156013.doc -19-113a 113b 114 115 200 200a 201 202 203 204 205 206 210 211 212a 212b 213a 213b 214 300 303 305 320 LI Conductive adhesive / glue line conductive glue / small drop metal feedthrough thin rubber rim / rim / rim glue / Glue preferred closed ring optoelectronic device intermediate product substrate first electrode layer island organic layer / organic material / functional layer second electrode layer island / insulating droplet / insulator island cover electrically isolated substrate wire / Conductor wire / conductor glue droplet / conductive adhesive conductive adhesive feedthrough OLED (organic light-emitting diode) / optoelectronic device conductive island second electrode layer / cathode profile / closed contour picosecond green laser beam 156013. Doc -18 - 201212329 L2 Ml M2 UV (ultraviolet) laser beam shaded shadow mask 156013.doc -19-