201212147 六、發明說明： 【發明所屬之技術領域】 本發明，是有關於將複數處理室與複數真空搬運室連 接的基板處理裝置及具有複數台此基板處理裝置的基板處 理系統》 【先前技術】 將平面顯示器（FPD; Flat Panel Display)所使用的 玻璃基板和形成有半導體裝置（設備）的半導體基板（半 導體晶圓）作爲被處理體，進行蝕刻處理、CVD (化學蒸 汽沈積、Chemical Vapor Deposition)等的鍍膜處理和灰 化處理等的處理的基板處理裝置中，爲了提高處理量（能 力）等目的，已知有在共通的真空搬運室連接複數台處理 室的多室方式的基板處理裝置。 在第9圖中，揭示了在例如平面形狀爲四角形的真空 搬運室4的側面，將3個處理室5a〜5c、及預備真空室 也就是裝載鎖定室3連接的多室方式的基板處理裝置100 的一例。在裝載鎖定室3的前方側中，配置有在裝載鎖定 室3及外部之間實行基板S的搬入出的空氣裝載機2。如 此具備複數處理室5a〜5c的基板處理裝置100，即使發 生需要對於例如一個處理室5 a進行維修的情況，也可以 由其他的處理室5b、5c繼續基板S的處理。 考慮在例如框體形狀的處理室本體上，維修設有供塞 住朝向此處理室本體的上面側形成的開口部用的蓋體的處 -5- 201212147 理室5a〜5c的情況時。具有在蓋體中，設有將蝕刻氣體 和鍍膜氣體等的處理氣體供給至處理室5a〜5c內的氣體 噴灑頭等的情況，從處理室本體取下如此的蓋體時，若使 上下（上下）反轉，將氣體噴灑頭朝向上面的話，維修時 的作業性就可提高。 在例如專利文獻1中，記載了具備導軌機構的基板處 理裝置，並在各處理室5a〜5c的側方側，設置供進行蓋 體的收授等用的維修領域6，當將從處理室本體被取下的 蓋體朝向此維修領域6搬運時，該導軌機構可使該蓋體反 轉。 此以外，在如第9圖所示型式的基板處理裝置100中 ，真空搬運室4因爲是將其周圍藉由裝載鎖定室3和處理 室5a〜5c包圍，所以當進行設在真空搬運室4內的基板 搬運機構41的維修的情況時，有需要將真空搬運室4的 頂面取下，藉由例如起重機等將基板搬運機構41擧升地 搬出。因此有需要在工場內設置起重機，而需要大規模的 設備，並且必需將基板處理裝置100配置在起重機可到達 的領域，裝置佈局配置上的限制也大。 但是在多室方式的基板處理裝置中，要求實現更高的 處理量·（能力），滿足如此的要求的一個手法是考慮增加 與真空搬運室連接的處理室的設置台數。但是基板處理裝 置要求省空間化，另一方面在如第9圖所示的基板處理裝 置1 〇〇增設處理室的情況時，如何不會損失維修性地配置 新的處理室成爲很大的課題9 ⑧ 201212147 [先行技術文獻] [專利文獻] [專利文獻1]日本特開2007-672 1 8號公報：段落 0024、第1圖、第4圖 【發明內容】 (本發明所欲解決的課題） 本發明是有鑑於此，其目的是提供一種維修性高且配 置空間（設置面積）小的基板處理裝置及具備此基板處理 裝置的基板處理系統。 (用以解決課題的手段） 本發明的基板處理裝置，其特徵爲，具備：真空搬運 室，設有將被處理體也就是基板搬運的基板搬運機構，並 使平面形狀成爲五角形以上的多角形的方式被複數側面包 圍；複數處理室，是與前述真空搬運室的複數側面之中除 了在外側具備維修領域的側面以外的側面連接，且在上部 具有蓋體；及蓋體搬運機構，是在前述處理室及前述維修 領域之間，將前述蓋體搬運。 前述基板處理裝置是具備以下的特徵也可以。 (a )在除了在外側具備前述維修領域的側面及連接 前述處理室的側面以外的前述真空搬運室的側面，與將前 述基板被放置的環境在常壓環境及真空環境之間切換的預 201212147 備真空室連接。 (b)前述預備真空室連接的側面及在外側具備前述 維修領域的側面，是相面對。 (c )在前述外側在具備維修領域的側面，設有：將 前述基板搬運機構搬入出用的開口部、及將此開口部開閉 用的開閉構件。 (d)前述真空搬運室，可分割成三個以上的部分。 且其他的發明的基板處理系統，是具有複數台前述（ b)所記載的基板處理裝置的基板處理系統，具備：第1 列，是將前述預備真空室朝向相同方向，並將複數台的前 述基板處理裝置朝左右方向配置；及第2列，是將複數台 的前述基板處理裝置與前述第1列平行地配置，並使前述 預備真空室的方向，與前述第1列的預備真空室的方向相 反，且使在外側具備維修領域的真空搬運室的側面，與前 述第1列的具備維修領域的真空搬運室的側面相面對；在 前述第1列及第2列之間，構成將前述維修領域連結的搬 運路。 前述基板處理系統是具備以下的特徵也可以。 前述1列中的彼此之間相鄰接的基板處理裝置的間隔 、及第2列中的彼此之間相鄰接的基板處理裝置的間隔， 是比前述搬運路更狹窄。 [發明的效果] 依據本發明，將複數處理室連接與平面形狀爲五角形 -8- ⑧， 201212147 以上的多角形的真空搬運室的側面，因爲由複數處理室間 將成爲各處理室的蓋體的搬運終點等的維修領域共有化， 所以可達成基板處理裝置的省空間化。且因爲具備從各處 理室朝維修領域將處理室的蓋體搬運的蓋體搬運機構，所 以維修領域即使共有化也可以簡便地將處理室開放。 【實施方式】 本發明的實施例的多室型的基板處理裝置的其中一例 ，對於FPD用的玻璃基板（以下只是稱爲基板），實行 真空處理也就是蝕刻處理的裝置的整體構成，是一邊參照 第1圖、第2圖一邊說明。第1圖是顯示基板處理裝置1 的外觀構成的立體圖，第2圖是顯示其內部構成的平面圖 〇 本實施例的基板處理裝置1，是設有：.空氣裝載機2 ，是在被收容從外部搬運來的多數枚的基板S的載體C1 、C2及裝載鎖定室3之間實行基板S的搬入出；及真空 搬運室4,是將藉由空氣裝載機2被搬入來的基板S被放 置的環境，在常壓環境及真空環境之間切換的預備真空室 也就是裝載鎖定室3及處理室5a〜5d之間由真空環境下 將基板S搬運。在真空搬運室4中連接有對於基板S進行 蝕刻處理的4個處理室5a〜5d。 空氣裝載機2，具備：載體Cl、C2被載置的2個載 體載置部201、2 02、及在這些的載體Cl、C2及裝載鎖定 室3之間實行基板S的搬運的大氣側基板搬運機構23。 • 9 - 201212147 各載體載置部201、202具備將載體Cl、C2昇降用的昇 降機構21，在本例中在一方側的載體載置部201中被載 置有將處理前的基板S收容的載體C1，在另一方側的載 體載置部201中被載置有收容處理後的基板S的載體C2 〇 載體載置部201、2 02，是在大氣環境下將實行基板S 搬運的大氣側基板搬運機構23挾持地設置。大氣側基板 搬運機構23，例如具備：被上下2段連設的搬運臂23 1、 及將這些搬運臂231可進退自如和可旋轉自如地支撐的基 台部232。第1圖中，22是將大氣側基板搬運機構23支 撐的支撐台。 裝載鎖定室3，是將在空氣裝載機2及真空搬運室4 之間被搬運的基板S —旦收容的真空容器，在本例中2個 裝載鎖定室3是呈上下被堆積。這些2個裝載鎖定室3的 構成是幾乎同樣，如第2圖的平面圖所示各裝載鎖定室3 具備：將基板S支撐的機架緩衝器32、及將基板S的載 置位置導引的定位器31。且各裝載鎖定室3是連接與未 圖示的排氣手段連接的排氣管，可以將各內部環境在常壓 環境及真空環境之間切換。 真空搬運室4,是在各裝載鎖定室3及4個處理室5a 〜5d之間使基板S被搬運的空間，例如透過與未圖示的 排氣手段連接的排氣管使內部環境被排氣，使時常被維持 於真空環境。在真空搬運室4內設有基板搬運機構41， 其是可昇降自且如可繞旋轉軸旋轉自且如將基板S保持的 -10- 201212147 鎬412是可進退自由地構成。 如第6圖（a)所示，在基板搬運機構41的下部設有 將該基板搬運機構41驅動用的驅動機構411。配置有基 板搬運機構41的本體的空間、及配置有驅動機構411的 空間，是藉由底板44各被上下區劃成搬運空間401及機 械室402。在本例中底板44的上方側的搬運空間401是 如已述被維持在真空環境，另一方面底板44的下方側的 機械室402是成爲大氣環境。基板搬運機構41及驅動機 構411是在維修時等中被上下切離而可以各別從搬運空間 401及機械室402取出》且第6圖（a)中，413是波紋管 ，用來密封從底板44使基板搬運機構41突出沒入用的開 口部供維持搬運空間4 0 1的真空狀態用。 如第2圖的平面圖所示，本例的真空搬運室4是平面 形狀爲幾乎正六角形，在該真空搬運室4的1個側面中連 接有已述的裝載鎖定室3。且連接有除了相面對於裝載鎖 定室3的側面、及該一側面的側面以外，在其他4個側面 連接有處理室5a〜5d。此結果，如第2圖所示這些裝載 鎖定室3和4個處理室5a〜5d，是成爲以六角形的真空 搬運室4爲中心呈放射狀被配置。 處理室5a〜5d，是在其內部對於基板S施加蝕刻處 理用的直方體形狀的處理容器，相當於本實施例的真空處 理室。在本例中處理室 5a〜5d，是構成橫剖平面的一邊 爲2.5m、另一邊爲2.2m程度的大小，可處理例如一邊爲 1 500mm、另一邊爲1 800mm程度的大小的角型的基板S。 -11 - 201212147 在各處理室5a〜5d的內部，基板S被載置，並且與 形成下部電極的載置台、和呈上下相面對於前述載置台被 設置，在處理室5a〜5d內構成供給例如氯氣體等的蝕刻 氣體的氣體供給部，並且設有形成上部電極的氣體噴灑頭 等。且藉由例如對於載置台側外加高頻電力，將被供給至 處理室5a〜5d內的蝕刻氣體等離子化，藉由生成的活性 種實行基板S的蝕刻。在第1圖、第2圖中爲了圖示方便 ，省略這些載置台及氣體供給部的揭示。 且在使基板S從空氣裝載機2朝裝載鎖定室3內被搬 入出的開口部、裝載鎖定室3及真空搬運室4之間，且在 真空搬運室4及各處理室5a〜5d之間，各被隔設有將這 些氣密地密封，且可開閉地構成的閘門閥G1〜G3。 且如第1圖所示本實施例的各處理室5a〜5d，是形 成供進行蝕刻處理的空間，且可以上下分割成：其上面側 開口的處理室本體51、及設在此處理室本體51上將該處 理室本體51的開口部覆蓋並且形成有例如已述的氣體噴 灑頭等的蓋體52。此結果，如以上習知技術之說明’在 氣體噴灑頭等的維修時中，可以將蓋體52從處理室本體 51取下。 以上說明的基板處理裝置1’是具備將從例如真空搬 運室4被搬出的基板搬運機構41和從驅動機構411、各 處理室5a〜5d被取下的蓋體52維修時可以利用的共通的 維修領域6。進一步基板處理裝置1是具備將從各處理室 5a〜5d被取下的蓋體52朝向維修領域6搬運用的蓋體搬 -12- ⑧ 201212147 運機構7。以下，說明維修領域6的配置位置和蓋體搬運 機構7的構成。 如第2圖所示，在本例的基板處理裝置1中，在平面 形狀形成六角形的真空搬運室4的6個的側面之中與連接 裝載鎖定室3的側面相面對的側面未連接有裝載鎖定室3 和處理室5 a〜5 d，就可以在此側面的外方側確保維修領 域6。將此側面稱爲維修面的話，維修領域6是形成於該 維修面的外方側，即面向該維修面的位置。換言之，維修 面，可說是在外側具備維修領域6的側面。且，此維修領 域6也與其他的裝載鎖定室3、處理室5a〜5d同樣地， 成爲以真空搬運室4爲中心呈放射狀被配置。 在維修領域6中，可進行被搬運至該維修領域6的蓋 體52的收授程度的面積被確保，蓋體52是在專用的搬運 台也就是蓋體搬運夾具61被收授。一邊參照第2圖、第 4圖一邊對於蓋體搬運夾具61的構成簡單地說明。蓋體 搬運夾具61具備：將蓋體52的外周側底面部保持的框體 部611、及將此框體部611的相面對的二邊的中央部可繞 水平軸旋轉地支撐的旋轉支撐部613、及透過此旋轉支撐 部613將框體部611保持在預定的高度位置的支柱構件 612、及設在此支柱構件612的下端的台車部614。 在蓋體52的側周面，具備被載置在前述框體部611 上的未圖示的托架，在此托架中設有螺栓孔。且在框體部 611側也在對應此托架的位置設有螺栓孔，藉由將這些托 架及框體部611由螺栓結合，使蓋體52被固定保持在框 -13- 201212147 體部611上。且，在旋轉支撐部613中，設有未圖示的旋 轉定位器’將保持蓋體52的框體部611旋轉180度，藉 由將蓋體52的上下反轉，就可將氣體噴灑頭朝向上面側 ，由此可提高維修時的作業性。 接著說明蓋體搬運機構7的構成。蓋體搬運機構7可 達成：在被配置於維修領域6內的前述蓋體搬運夾具61 、及各處理室5a〜5d之間搬運蓋體52的功能。如第1圖 、第3圖、第4圖所示蓋體搬運機構7，具備：設在真空 搬運室4的頂板上將該頂板上繞垂直軸旋轉的旋轉台721 、及被固定於此旋轉台721上並從該旋轉台721的徑方向 即中心位置的真空搬運室4朝向設有各處理室5a〜5d的 方向延伸出的方式設置的支撐臂71、及設在此支撐臂71 的基端側並藉由使前述旋轉台72 1旋轉將支撐臂71旋轉 移動用的驅動機構73、及設在前述支撐臂71的先端側供 將蓋體52保持用的挾盤部741。 支撐臂7 1，是藉著由例如連結構件7 1 1被連結的2 枚長的樑板所構成，其先端側是朝向與真空搬運室4的周 圍連結的處理室5a〜5d延伸出，另一方面基端側是將旋 轉台72 1呈直徑方向橫剖的方式被固定於該旋轉台72 1上 。如第1圖、第4圖所示挾盤部741，是下端部呈L字曲 折的2個鉤狀的德件，使這些的折曲部分彼此之間相面對 的方式，被配置於支撐臂71延伸的徑方向內側位置、及 外側位置。 另一方面在各處理室5a〜5d的蓋體52的上面中設有 -14- ⑧ 201212147 由呈逆L字曲折的2個鉤狀的構件所構成的把手部53, 把手部53是將這些的折曲部分彼此之間朝向相反的方向 地被配置。挾盤部741是藉由昇降機構742可昇降自如地 構成，藉由在將挾盤部741側的折曲部分及蓋體52的把 手部5 3側的折曲部分彼此之間卡合的狀態下使挾盤部 741上昇，就可以將蓋體52擧升直到不與其他的處理室 5a〜5d干涉的高度位置爲止。且支撐臂71是使在先端部 將蓋體52保持時可剛性保持的方式，使基端側形成較粗 ，並使先端側形成較細。 如第1圖所示，在旋轉台721的周圍，輪環狀的齒輪 7 22是被固定於真空搬運室4的天板上。另一方面，在支 撐臂71的一方側的樑板中，固定有具備小型的齒輪731 的驅動機構73。將輪環狀的齒輪722及驅動機構73側的 齒輪731齒合藉由使驅動機構73的齒輪731旋轉，使驅 動機構73的齒輪731在輪環狀的齒輪722的周圍移動， 由此可以旋轉被固定於旋轉台721及其上的支撐臂71。 此結果，如第3圖（a)所示，可使挾盤部741通過：設 有各處理室5a〜5d的把手部53的位置、及被配置於維修 領域6的蓋體搬運夾具61的上方位置的方式，使支撐臂 71旋轉。 且如已述維修領域6因爲是設在面向真空搬運室4的 側面的1個也就是維修面的位置，不會如習知技術說明的 習知的基板處理裝置100將真空搬運室4的頂面取下藉由 起重機等將基板搬運機構41舉昇地搬出，只要將構成前 -15- 201212147 述檢修面的構件取下，就可將基板搬運機構41和 機構411朝橫方向拉出。在此，在本實施例的真空 4中，如第6圖所示，從搬運空間401將基板搬運ί 取出用的開口部431、及從機械室402將驅動機構 出用的開口部43 2，是設在檢修面。這些的開口部 43 2，在基板處理裝置1的運轉期間，是藉由各開 421、422被關閉。 具備以上的構成的基板處理裝置1，是如第2 與控制部8連接。控制部8是具備無圖示的CPU 部的電腦所構成，在記憶部中被記錄有程式，其是 步驟（命令）群，可控制有關於：當由基板處理裝丨 行基板S的蝕刻處理時的動作以及處理室5a〜5d 時，藉由蓋體搬運機構7直到維修領域6爲止搬 52的動作。此程式，是被容納在例如硬碟、光碟 碟、記億卡等的記億媒體，並從那被安裝在電腦。 以下，一邊參照第1圖〜第6圖一邊說明本實 基板處理裝置1的作用。若發生需要對於處理室5 維修的話。在此情況下，使真空搬運室4的真空被 方式將閘門閥G3關閉，解除處理室5a內的真空狀 行從處理室本體51將蓋體52取下的準備。此時， 的處理室5b〜5d中可以繼續基板S的蝕刻處理。 然後，如第1圖所示，將支撐臂71的先端的 74 1降下之後將支撐臂71旋轉’在被設在處理室5 體52的把手部53的折曲部分的下方位置，進入 其驅動 搬運室 幾構41 411取 431、 閉構件 圖所示 及記憶 被組入 置1進 的維修 運蓋體 、磁光 施例的 a進行 確保的 態，進 在其他 挾盤部 a的蓋 挾盤部 -16- ⑧ 201212147 741的折曲部分。且藉由上昇挾盤部741使挾盤部741及 把手部53的折曲部分彼此之間卡合使蓋體52朝上方擧升 。在此在搬運時使蓋體52的把手部53不會從挾盤部741 滑動落下的方式，將這些把手部53及挾盤部741由螺栓 結合也可以。 如此的話將處理室5a的蓋體52，擧升至不與相鄰的 處理室5b干涉的高度位置的話，將驅動機構73作動從第 3圖（a)所示的處理室5a的上方位置，直到在維修領域 6待機的蓋體搬運夾具61的上方位置爲止將蓋體52搬運 。且如第4圖（a)所示使挾盤部741降下，將蓋體52載 置在蓋體搬運夾具61的框體部611上將這些蓋體52及框 體部611結合，進一步將挾盤部741降下使把手部53及 挾盤部741的卡合狀態被解除。又，在第4圖（a)〜第 4圖（c)中爲了圖示方便，省略揭示與真空搬運室4連 接的處理室5c、5d。 接著將支撐臂71旋轉從把手部53的上方位置退避之 後，如第4圖（b)所示將框體部611旋轉180度使蓋體 52的上下反轉使氣體噴灑頭朝向上面，進行維修。且依 據需要’將蓋體搬運夾具61移動，將蓋體52搬運至預定 的維修室也可以。（第4圖（c))。 且將其他的處理室5b〜5d開放的情況時也可以實行 藉由與使用第3圖、第4圖的各圖說明的動作同樣的動作 ’從處理室本體51將蓋體52取下，進行各處理室本體 5 1側、蓋體5 2側的維修。 -17- 201212147 維修終了的情況時，由與取下時相反的順序使蓋體搬 運夾具61和蓋體搬運機構7動作，藉由蓋體52氣密地塞 住處理室本體51的開口部。然後，將蝕刻氣體和排氣管 的連接復歸，將處理室5a內成爲真空狀態準備好運轉開 始的整理之後，將閘門閥G3打開從真空搬運室4將基板 S收容再度開始進行蝕刻》 接著，說明將基板搬運機構41和其驅動機構411取 下時的動作。在此情況下停止基板處理裝置1整體的運轉 ，解除真空搬運室4內的真空狀態之後，將設在檢修面的 例如搬運空間401側的開閉構件421取下（第5圖（a ) 、第6圖（a))。且將基板搬運機構41的本體及其驅動 機構411切離，藉由將基板搬運機構41朝檢修面側拉出 ，不需使用起重機等就可以將基板搬運機構41朝維修領 域6搬出。此時，使基板搬運機構41的拉出作業成爲容 易的方式，在例如基板搬運機構41的底面部設置腳輪等 ，或在搬運空間40 1的底板44舖設軌道也可以。且將驅 動機構41 1取出時，也同樣將機械室402的開閉構件422 取下（第5圖（a)、第6圖（b))，藉由將與基板搬運 機構4 1的本體分離後的驅動機構4 1 1朝檢修面側拉出， 就可以簡便地進行從機械室402朝維修領域6的驅動機構 411的搬出（第6圖（c))。 接著，一邊比較一邊說明具有複數台以上說明的基板 處理裝置1的基板處理系統的例與習知的基板處理裝置 100的基板處理系統的情況。第7圖（a)、第7圖（b) -18- ⑧ 201212147 ，各是將如實施例的基板處理裝置1及第9圖所示的習知 例的基板處理裝置100的基板處理系統的例示意的說明圖 。在這些的圖中省略各基板處理裝置1、1〇〇的空氣裝載 機2的揭示，將配置有這些空氣裝載機2的領域總括地表 現作爲空氣裝載機配置領域20。 如第7圖（a)所示的基板處理系統，是藉由將實施 例的基板處理裝置1的裝載鎖定室3朝向相同方向，將複 數台的基板處理裝置1朝左右方向配置而形成第1列11 。且，將基板處理裝置1的裝載鎖定室3朝向與第1列 11的裝載鎖定室3的方向相反的方向，使維修領域6，與 第1列1 1的維修領域6相面對的方式，形成將複數台的 基板處理裝置1與前述第1列11平行地配置的第2列12 。即，第1列1 1及第2列12，是成爲使各列1 1、12內 的基板處理裝置1中的檢修面朝向彼此之間相面對的方向 的方式平行地被配置。且，這些第1列11及第2列12之 間，是爲了搬運從基板處理裝置1被取下的機器等而構成 將前述維修領域連結的搬運路60。 在如第7圖（a)所示的例中，搬運路60的寬度，是 使已述的蓋體搬運夾具61可以通過的程度，配合該蓋體 搬運夾具61的寬度被設定。此時在本例中，因爲如第7 圖（a)所示使未設有裝載鎖定室3和真空搬運室4等的 構造物的維修領域6相面對使第1列1 1及第2列1 2平行 地配置，所以第1列1 1及第2列1 2可以相互接近直到蓋 體搬運夾具61不會接觸朝維修領域6側延伸的各基板處 • 19 - 201212147 理裝置1的處理室5程度的位置。 在各基板處理裝置1中，因爲具備將4個處理室5的 各蓋體52朝維修領域移動的蓋體搬運機構7(第7圖（a )中省略圖示），所以在各列11、12內在左右方向相鄰 接的基板處理裝置1彼此之間，不需要設置供蓋體搬運夾 具61通過用的搬運路60。 在此在如第7圖（a )所示的例中，第1列1 1側的基 板處理裝置1及第2列12側的基板處理裝置1雖是成爲 朝前後方向（縱方向）並列在一直線上的狀態，但是基板 處理裝置1是在第1列1 1及第2列12之間朝左右方向（ 橫方向）偏離也可以。 另一方面，在第7圖（b)中，顯示基板處理系統的 例，其依據與實施例的基板處理裝置1的情況同樣的考慮 ，藉由將複數台的基板處理裝置100的裝載鎖定室3朝向 相同方向配置而形成第1列101，將裝載鎖定室3朝向與 此第1列101的裝載鎖定室3的方向相反的方向，藉由將 複數台的基板處理裝置1〇〇與前述第1列101平行地配置 而形成第2列1 02。在此例中，兩列1 01、1 02之間也成 爲與第7圖（a)的搬運路60相同寬度的搬運路60。在 此在如第9圖所示的習知例的基板處理裝置1 00在鄰接於 中各處理室5的位置設有維修領域6。但是依據情況，因 爲有需要在全部的維修領域6將蓋體搬運夾具61移動， 在各列101、102內，在左右方向相鄰接的基板處理裝置 100彼此之間也設有搬運路60。 -20- ⑧ 201212147 比較以上說明的基板處理裝置1、100的基板處 統的話，因爲在實施例的基板處理裝置1中對於複數 室5使維修領域6共有化，所以與基板處理裝置100 況相異，不需要在左右相鄰接的基板處理裝置1之間 搬運路60。因此由比較第7圖（a)及第7圖（b) ，在配置領域的橫寬度「B」的範圍內可以在列1 1、 配置5台，兩列11、12的合計10台（處理室5的總 40個）的基板處理裝置1。另一方面，基板處理裝置 的情況時，在相鄰接的基板處理裝置100之間因爲也 搬運路60，所以基板處理裝置100的配置台數，是 101、102各4台，兩列的合計8台（處理室5的總 24 個）。 且將基板處理裝置1、100的橫寬度由各裝置單 見的情況時，在習知例的基板處理裝置100中真空搬 4及設在其左右的2個處理室5也是並列在一直線上 於此，在本例的基板處理裝置1中，各處理室5因爲 於朝左右方向延伸的直線傾斜地被配置，所以左右方 橫寬度是對應此傾斜地變小。因此在例如各基板處理 1、100中直到從真空搬運室4的中心至處理室5的 位置爲止的距離爲相同的話，基板處理裝置1的裝置 寬度「bl」是比基板處理裝置100的裝置的橫寬度「 更小。 接著對於縱方向的寬度比較如第7圖（a)、第 (b)所示的基板處理系統的話，基板處理裝置丨的 理系 處理 的情 設置 可知 12各 數爲 100 設置 在列 數爲 體所 運室 。對 是對 向的 裝置 連接 的橫 b2 j 7圖 情況 -21 - 201212147 時朝縱方向延伸的直線各處理室5是被傾斜配置，對於此 ，基板處理裝置100的情況時裝載鎖定室3、真空搬運室 4、處理室5是朝縱方向被配置於一直線上。因此各列11 、1 2之間及各列1 01、1 02之間的搬運60的寬度爲相 同的話，比較如第7圖（a)所示的基板處理裝置1的基 板處理系統中的縱方向的寬度「A1」、及如第7圖（b) 所示的基板處理裝置1〇〇的基板處理系統中的縱方向的寬 度「A2」時，真空搬運室4的縱方向的寬度是相同的話 ，「A1」會變小。 且將基板處理裝置1、100由各裝置單體所見的話， 在習知例的基板處理裝置100中裝載鎖定室3、真空搬運 室4、處理室5是朝縱方向呈直線狀並列，另一方面在本 例的基板處理裝置1中裝載鎖定室3、真空搬運室4、維 修領域6是朝縱方向呈直線狀並列。且，維修領域6因爲 可以共有搬運路60的一部分，所以真空搬運室4的縱方 向的寬度是相同的話，基板處理裝置1的縱方向的寬度「 al」可以比基板處理裝置100的縱方向的寬度「a2」更小 依據本實施例的基板處理裝置1具有以下的效果。因 爲在平面形狀爲六角形的真空搬運室4的側面，將複數處 理室5連接，將成爲各處理室5的蓋體52和基板搬運機 構41的搬運終點的維修領域6，由複數處理室5之間共 有化，所以可達成基板處理裝置1的省空間化。且因爲具 備從各處理室5朝維修領域6將處理室5的蓋體52搬運 -22- 201212147 的蓋體搬運機構7，所以維修領域6即使共有化仍可以簡 便地將處理室5開放。 在此真空搬運室4’不限定於平面形狀成爲正六角形 的方式構成的情況。如第8圖所示將真空搬運室4作成扁 平的六角形，在其寬度較廣的一邊設置例如搬入用、搬出 用的2個裝載鎖定室3a、3b使基板S的搬入出速度高速 化也可以。 且在處理室5a、5b間、及處理室5c、5d之間使具備 各處理室的八角形的真空搬運室也可以。或是將設有處理 室5c、5d的二個的側面作爲一個側面，且只有設有一個 處理室的構成也可以。 真空搬運室的形狀不限定於六角形，五角形以上的多 角形較佳。特別是具有相鄰接的處理室連接的二個側面的 法線形成角度90°未滿的側面的多角形的話，在比四角形 的情況更接近圓形的領域內可以有效率地配置處理室。 進一步，真空搬運室因爲成爲大型，所以可由複數構 件及結合構件及密封構件構成地分割成例如三個以上的部 分也可以。 且蓋體搬運機構7的構成，不限定於如第1圖所示的 懸臂樑式的蓋體搬運機構7的例》將如第1圖所示的蓋體 搬運機構7的支撐臂71朝徑方向可伸縮自如地構成，且 藉由在真空搬運室4的上面設有小型的起重機的使作業半 徑可變，即使如第8圖所示真空搬運室4爲扁平的六角形 的情況也可以在各處理室5 a〜5d及維修領域6之間將蓋 -23- 201212147 體52自由地搬運。且例如從真空搬運室4所見使處理室 5a〜5d的外側的位置、及真空搬運室4的上面成爲彼此 平行的方式舖設軌道，並使在此軌道上行走的門形起重機 (橋形起重機）在各處理室5a〜5d及維修領域6的上方 位置移動的方式構成蓋體搬運機構7也可以。 且形成維修領域6的位置是如第2圖所示的基板處理 裝置1，在真空搬運室4的6個的側面，不限定於形成於 相面對於裝載鎖定室3所連接的側面之側面的外方側的情 況。例如第2圖雖在設有維修領域6的位置設置處理室5 ，但可取代在此第2圖在處理室5a〜5d連接的其中任一 的側面的外方側的位置形成維修領域6也可以。此情況時 也可以獲得基板處理裝置1省空間化的效果。 且在本例中雖顯示由處理室5a〜5d實行基板S的蝕 刻處理的例，但是在這些的處理室5a〜5d內被實行的真 空處理的種類不限定於此，進行例如CVD (化學蒸汽沈 積、Chemical Vapor Deposition)等的鍍膜處理和灰化處 理也可以。且在各處理室5a〜5d被實施的真空處理的種 類，不限定於同種，例如在相同基板處理裝置1內進行蝕 刻處理之後，使可以進行灰化處理的方式進行異種的真空 處理也可以。進一步將處理室5與除了與裝載鎖定室3連 接的側面及面向維修領域6的側面以外的真空搬運室4的 其他4個側面的全部連接也可以，處理室5的數量是2個 〜3個也可以。 且在基板處理裝置1被處理的基板S的種類不限定如 ⑧ 201212147 實施例中所示的角型的玻璃基板，對於例如半導體晶圓等 的圓形基板當然也可以適用。 【圖式簡單說明】 [第1圖]顯示實施例的基板處理裝置的外觀構成的立 體圖。 [第2圖]前述基板處理裝置的平面圖。 [第3圖]顯示將設在前述基板處理裝置的處理室的蓋 體取下的動作的第1說明圖。 [第4圖]顯示將前述蓋體取下的動作的第2說明圖。 [第5圖]顯示將設在前述基板處理裝置的真空搬運室 的基板搬運機構取下的動作的第1說明圖。 [第6圖]顯示將前述基板搬運機構取下的動作的第2 說明圖》 [第7圖]顯示具有複數台實施例及習知例的基板處理 裝置的基板處理系統的例的平面圖。 [第8圖]顯示真空搬運室的平面形狀成爲扁平的六角 形的基板處理裝置的例的平面圖。 [第9圖]顯示習知的基板處理裝置的一例的平面圖。 【主要元件符號說明】 C1 :載體 C2 :載體 G1〜G3 :閘門閥 -25- 201212147 S :基板 1 :基板處理裝置 2 :空氣裝載機 3 :裝載鎖定室 3a，3b :裝載鎖定室 4 :真空搬運室 5 :處理室 5 a ~ 5 d ：處理室 6 :維修領域 7 :蓋體搬運機構 8 :控制部 11 :列 12 :列 20 :空氣裝載機配置領域 2 1 :昇降機構 22 :支撐台 23:大氣側基板搬運機構 3 1 :定位器 32 :機架緩衝器 41 :基板搬運機構 44 :底板 51 :處理室本體 52 :蓋體 53 :把手部 -26- ⑧ 201212147 60 :搬運路 61 :蓋體搬運夾具 71 :支撐臂 73 :驅動機構 1〇〇 :基板處理裝置 101 ：歹！]201212147 VI. Description of the Invention: [Technical Field] The present invention relates to a substrate processing apparatus for connecting a plurality of processing chambers to a plurality of vacuum transfer chambers, and a substrate processing system having the plurality of substrate processing apparatuses. [Prior Art] A glass substrate used in a flat panel display (FPD) and a semiconductor substrate (semiconductor wafer) on which a semiconductor device (device) is formed are subjected to etching treatment, CVD (Chemical Vapor Deposition, Chemical Vapor Deposition) In the substrate processing apparatus for the processing such as the plating treatment and the ashing treatment, a multi-chamber substrate processing apparatus in which a plurality of processing chambers are connected to a common vacuum transfer chamber is known for the purpose of improving the amount of processing (capacity). In the ninth aspect, a multi-chamber type substrate processing apparatus in which three processing chambers 5a to 5c and a preliminary vacuum chamber, that is, a load lock chamber 3, are connected to each other, for example, a side surface of a vacuum transfer chamber 4 having a square shape in plan view is disclosed. An example of 100. On the front side of the load lock chamber 3, an air loader 2 that carries in and out of the substrate S between the load lock chamber 3 and the outside is disposed. Thus, the substrate processing apparatus 100 including the plurality of processing chambers 5a to 5c can continue the processing of the substrate S by the other processing chambers 5b and 5c even if it is necessary to perform maintenance on, for example, one processing chamber 5a. In the case of the processing chamber main body of the frame shape, for example, the case where the cover for closing the opening formed on the upper surface side of the processing chamber main body is held is in the case of the chambers 5a to 5c. In the lid body, a gas shower head or the like for supplying a processing gas such as an etching gas or a plating gas to the processing chambers 5a to 5c is provided, and when such a lid body is removed from the processing chamber body, the upper and lower sides are When the gas spray head is directed upward, the workability during maintenance can be improved. For example, Patent Document 1 discloses a substrate processing apparatus including a rail mechanism, and a maintenance field 6 for receiving a cover body or the like is provided on the side of each of the processing chambers 5a to 5c, and the processing chamber is used. When the cover body from which the body is removed is transported toward the service area 6, the rail mechanism can reverse the cover. In addition, in the substrate processing apparatus 100 of the type shown in FIG. 9, the vacuum transfer chamber 4 is surrounded by the load lock chamber 3 and the process chambers 5a to 5c, so that it is provided in the vacuum transfer chamber 4 In the case of maintenance of the substrate transport mechanism 41, it is necessary to remove the top surface of the vacuum transfer chamber 4 and lift the substrate transport mechanism 41 by, for example, a crane. Therefore, there is a need to install a crane in a factory, and a large-scale equipment is required, and it is necessary to arrange the substrate processing apparatus 100 in a field reachable by a crane, and the layout of the apparatus is also limited. However, in a multi-chamber type substrate processing apparatus, it is required to achieve a higher throughput (capacity), and one method for satisfying such a requirement is to increase the number of processing chambers connected to the vacuum transfer chamber. However, the substrate processing apparatus is required to be space-saving. On the other hand, when the processing chamber is added to the substrate processing apparatus 1 shown in FIG. 9, how to arrange a new processing chamber without losing maintenance is a major problem. 9 8 201212147 [Prior Art Document] [Patent Document] [Patent Document 1] JP-A-2007-672 No. 8: Paragraph 0024, FIG. 1 and FIG. 4 [Summary of the Invention] (Problems to be Solved by the Invention) In view of the above, an object of the present invention is to provide a substrate processing apparatus having high maintainability and a small arrangement space (arrangement area) and a substrate processing system including the substrate processing apparatus. (Means for Solving the Problem) The substrate processing apparatus according to the present invention includes a vacuum transfer chamber, and a substrate transport mechanism that transports the object to be processed, that is, the substrate, and has a polygonal shape in which the planar shape is a pentagon or more. The method is surrounded by a plurality of side surfaces; the plurality of processing chambers are connected to the side surface of the plurality of side surfaces of the vacuum transfer chamber except for the side surface of the maintenance area on the outer side, and have a lid body at the upper portion; and the lid body transporting mechanism is The cover body is conveyed between the processing chamber and the maintenance area. The substrate processing apparatus described above may have the following features. (a) in addition to the side surface of the maintenance field and the side surface of the vacuum transfer chamber that is connected to the side surface of the processing chamber, and the pre-201212147 that switches the environment in which the substrate is placed between the normal pressure environment and the vacuum environment. The vacuum chamber is connected. (b) The side surface to which the preliminary vacuum chamber is connected and the side surface on the outer side of the maintenance field are facing each other. (c) The side surface provided with the maintenance area on the outer side is provided with an opening for carrying in and out of the substrate conveyance mechanism, and an opening and closing member for opening and closing the opening. (d) The vacuum transfer chamber may be divided into three or more portions. Further, the substrate processing system according to another aspect of the invention is the substrate processing system including the substrate processing apparatus according to the above (b), and the first column includes the preliminary vacuum chambers facing in the same direction and the plurality of stages The substrate processing apparatus is disposed in the left-right direction; and in the second row, the plurality of substrate processing apparatuses are disposed in parallel with the first row, and the direction of the preliminary vacuum chamber is set to be in a preliminary vacuum chamber of the first row. In the opposite direction, the side surface of the vacuum transfer chamber having the maintenance area on the outer side faces the side surface of the vacuum transfer chamber having the maintenance field in the first row; and the first column and the second column are configured The transportation path linked to the aforementioned maintenance area. The substrate processing system described above may have the following features. The interval between the substrate processing apparatuses adjacent to each other in the first row and the interval between the substrate processing apparatuses adjacent to each other in the second row are narrower than the above-described conveyance path. [Effect of the Invention] According to the present invention, the plurality of processing chambers are connected to the side surface of the vacuum transfer chamber having a polygonal shape of a pentagon shape of -8-8, 201212147 or more, because the cover chambers of the respective processing chambers are formed by the plurality of processing chambers. Since the maintenance areas such as the conveyance end point are shared, it is possible to achieve space saving of the substrate processing apparatus. Further, since the lid body transporting mechanism that transports the lid of the processing chamber from the various laboratories to the maintenance area is provided, the processing area can be easily opened even if the maintenance field is shared. [Embodiment] An example of a multi-chamber type substrate processing apparatus according to an embodiment of the present invention is an apparatus which performs vacuum processing, that is, an etching processing, on a glass substrate for FPD (hereinafter simply referred to as a substrate), and is one side. This will be described with reference to Figs. 1 and 2 . Fig. 1 is a perspective view showing the external configuration of the substrate processing apparatus 1. Fig. 2 is a plan view showing the internal structure of the substrate processing apparatus 1. The substrate processing apparatus 1 of the present embodiment is provided with: The air loader 2 carries out the loading and unloading of the substrate S between the carriers C1 and C2 and the load lock chamber 3 in which a plurality of substrates S are transported from the outside, and the vacuum transfer chamber 4 is loaded by air. In the environment in which the substrate S into which the machine 2 is loaded is placed, the substrate S is transported in a vacuum environment between the load lock chamber 3 and the processing chambers 5a to 5d in a preliminary vacuum chamber that switches between a normal pressure environment and a vacuum environment. Four processing chambers 5a to 5d for etching the substrate S are connected to the vacuum transfer chamber 4. The air loader 2 includes two carrier mounting portions 201 and 202 on which the carriers C1 and C2 are placed, and an atmospheric side substrate on which the substrate S is transported between the carriers C1 and C2 and the load lock chamber 3; Transport mechanism 23. • 9 - 201212147 Each of the carrier mounting portions 201 and 202 includes a lifting mechanism 21 for lifting and lowering the carriers C1 and C2. In this example, the carrier substrate S is placed on one of the carrier mounting portions 201. In the carrier C1 on the other side, the carrier C2 〇 carrier mounting portions 201 and 222 for accommodating the processed substrate S are placed on the carrier-side portion 201 on the other side, and the carrier S is transported in the atmosphere. The side substrate transport mechanism 23 is provided in a gripping manner. The atmospheric side substrate transporting mechanism 23 includes, for example, a transport arm 23 1 that is connected to the upper and lower stages, and a base portion 232 that can freely and rotatably support the transport arm 231. In Fig. 1, reference numeral 22 denotes a support base that supports the atmospheric side substrate transport mechanism 23. The load lock chamber 3 is a vacuum container in which the substrate S transported between the air loader 2 and the vacuum transfer chamber 4 is housed. In this example, the two load lock chambers 3 are stacked vertically. The configuration of the two load lock chambers 3 is almost the same. As shown in the plan view of Fig. 2, each of the load lock chambers 3 includes a rack buffer 32 for supporting the substrate S, and a mounting position for guiding the substrate S. Positioner 31. Each of the load lock chambers 3 is connected to an exhaust pipe connected to an exhaust means (not shown), and can switch between the internal environment and the vacuum environment. The vacuum transfer chamber 4 is a space in which the substrate S is transported between each of the load lock chambers 3 and the four process chambers 5a to 5d. For example, the exhaust pipe is connected to an exhaust unit (not shown) to align the internal environment. Gas, which is often maintained in a vacuum environment. The substrate transfer mechanism 41 is provided in the vacuum transfer chamber 4, and is configured to be movable up and down, and is rotatably rotatable from the rotation axis, and the substrate S is held. As shown in Fig. 6(a), a drive mechanism 411 for driving the substrate transport mechanism 41 is provided at a lower portion of the substrate transport mechanism 41. The space in which the main body of the substrate transport mechanism 41 is disposed and the space in which the drive mechanism 411 is disposed are formed by the bottom plate 44 being partitioned into the transport space 401 and the mechanical chamber 402. In this example, the conveyance space 401 on the upper side of the bottom plate 44 is maintained in a vacuum environment as described above, and the machine room 402 on the lower side of the bottom plate 44 is an atmospheric environment. The substrate conveyance mechanism 41 and the drive mechanism 411 are vertically separated from each other during maintenance or the like, and can be separately taken out from the conveyance space 401 and the machine room 402. In Fig. 6(a), 413 is a bellows for sealing from The bottom plate 44 causes the substrate conveyance mechanism 41 to protrude into the opening portion for immersion to maintain the vacuum state of the conveyance space 410. As shown in the plan view of Fig. 2, the vacuum transfer chamber 4 of this example has a substantially square hexagonal shape, and the load lock chamber 3 described above is connected to one side surface of the vacuum transfer chamber 4. Further, the processing chambers 5a to 5d are connected to the other four side surfaces except for the side surface of the loading lock chamber 3 and the side surface of the one side surface. As a result, as shown in Fig. 2, the load lock chamber 3 and the four process chambers 5a to 5d are radially arranged around the hexagonal vacuum transfer chamber 4. The processing chambers 5a to 5d are processing containers having a rectangular parallelepiped shape for etching the substrate S, and correspond to the vacuum processing chamber of the present embodiment. In this example, the processing chambers 5a to 5d are one side of the cross-sectional plane. 5m, the other side is 2. An angle type substrate S having a size of about 1 500 mm on one side and 1 800 mm on the other side can be processed. -11 - 201212147 In the inside of each of the processing chambers 5a to 5d, the substrate S is placed, and the mounting table on which the lower electrode is formed and the upper and lower surfaces are provided on the mounting table, and the processing is provided in the processing chambers 5a to 5d. For example, a gas supply portion of an etching gas such as chlorine gas, and a gas shower head or the like for forming an upper electrode are provided. Further, for example, by applying high-frequency power to the stage side, the etching gas supplied into the processing chambers 5a to 5d is plasma-ionized, and the substrate S is etched by the generated active species. In the first and second drawings, the disclosure of the mounting table and the gas supply unit is omitted for convenience of illustration. Further, between the opening portion into which the substrate S is carried in from the air loader 2 into the load lock chamber 3, the load lock chamber 3, and the vacuum transfer chamber 4, and between the vacuum transfer chamber 4 and the respective process chambers 5a to 5d Each of the gate valves G1 to G3 which is hermetically sealed and can be opened and closed is provided. Further, as shown in Fig. 1, each of the processing chambers 5a to 5d of the present embodiment is formed into a space for performing an etching process, and can be vertically divided into a processing chamber main body 51 having an upper surface side and a processing chamber body. The lid portion 52 of the processing chamber body 51 is covered with a lid body 52 such as a gas shower head described above. As a result, as described in the above-mentioned prior art, the cover 52 can be removed from the processing chamber body 51 during maintenance of the gas shower head or the like. The substrate processing apparatus 1' described above is provided with a common use of the substrate transport mechanism 41 that is carried out from the vacuum transfer chamber 4, and the cover 52 that has been removed from the drive mechanism 411 and the processing chambers 5a to 5d. Maintenance area 6. Further, the substrate processing apparatus 1 is provided with a lid body transporting the lid body 52 that has been removed from each of the processing chambers 5a to 5d toward the maintenance area 6. Hereinafter, the arrangement position of the maintenance area 6 and the configuration of the lid body transport mechanism 7 will be described. As shown in Fig. 2, in the substrate processing apparatus 1 of the present embodiment, the side faces of the six side faces of the vacuum transfer chamber 4 having a hexagonal shape formed in a planar shape are not connected to the side faces facing the side surface of the load lock chamber 3. With the load lock chamber 3 and the process chambers 5 a to 5 d, the maintenance field 6 can be secured on the outer side of this side. When this side is referred to as a maintenance surface, the maintenance field 6 is formed on the outer side of the maintenance surface, that is, the position facing the maintenance surface. In other words, the maintenance surface can be said to have the side of the maintenance field 6 on the outside. In the same manner as the other load lock chambers 3 and the processing chambers 5a to 5d, the maintenance field 6 is radially arranged around the vacuum transfer chamber 4. In the maintenance field 6, the area of the cover 52 that can be transported to the maintenance area 6 is secured, and the cover 52 is received by a dedicated transport table, that is, the cover transport jig 61. The configuration of the lid conveyance jig 61 will be briefly described with reference to Figs. 2 and 4 . The lid conveyance jig 61 includes a frame body portion 611 that holds the outer peripheral side bottom surface portion of the lid body 52, and a rotation support that supports the center portions of the two facing sides of the frame body portion 611 so as to be rotatable about a horizontal axis. The portion 613 and the pillar member 612 that holds the frame portion 611 at a predetermined height position through the rotation support portion 613 and the carriage portion 614 provided at the lower end of the pillar member 612. The side peripheral surface of the lid body 52 is provided with a bracket (not shown) placed on the frame body portion 611, and a bolt hole is provided in the bracket. Further, bolt holes are provided in the frame portion 611 side at positions corresponding to the brackets, and the brackets 52 and the frame portions 611 are bolted together so that the cover 52 is fixed and held in the frame of the frame-13-201212147. On 611. Further, the rotation support portion 613 is provided with a rotary positioner (not shown). The frame portion 611 holding the lid body 52 is rotated by 180 degrees, and the gas shower head can be rotated by reversing the lid body 52 upside down. Facing the upper side, workability at the time of maintenance can be improved. Next, the configuration of the lid body transport mechanism 7 will be described. The lid body transport mechanism 7 can realize the function of transporting the lid body 52 between the lid body transport jig 61 disposed in the maintenance area 6 and the processing chambers 5a to 5d. The lid transport mechanism 7 shown in FIGS. 1 , 3 , and 4 includes a rotary table 721 that is provided on the top plate of the vacuum transfer chamber 4 to rotate the top plate about a vertical axis, and is fixed to the rotation. The support arm 71 provided on the stage 721 so as to extend from the vacuum transfer chamber 4 at the center in the radial direction of the turntable 721 toward the direction in which the processing chambers 5a to 5d are provided, and the base provided on the support arm 71 A drive mechanism 73 for rotating the support arm 71 by rotating the rotary table 72 1 and a disk portion 741 for holding the cover 52 are provided on the tip end side of the support arm 71. The support arm 171 is formed of two long beam plates connected by, for example, the connecting member 711, and the leading end side thereof extends toward the processing chambers 5a to 5d connected to the periphery of the vacuum transfer chamber 4, and On the one hand, the proximal end side is fixed to the rotary table 72 1 so that the rotary table 72 1 is transversely cut in the diameter direction. As shown in Fig. 1 and Fig. 4, the disk portion 741 is a hook-shaped member having a lower end portion which is bent in an L shape, and these bent portions are arranged to face each other so as to face each other. The radially inward position and the outer position of the arm 71 extend. On the other hand, in the upper surface of the lid body 52 of each of the processing chambers 5a to 5d, there is provided a handle portion 53 composed of two hook-shaped members which are bent in an inverse L shape, and the handle portion 53 is provided. The bent portions are arranged in opposite directions to each other. The disk portion 741 is configured to be movable up and down by the elevating mechanism 742, and is in a state in which the bent portion on the side of the disk portion 741 and the bent portion on the side of the handle portion 53 of the lid 52 are engaged with each other. When the disk portion 741 is raised, the lid body 52 can be lifted up to a height position that does not interfere with the other processing chambers 5a to 5d. Further, the support arm 71 is rigidly held when the tip end portion holds the lid body 52, so that the base end side is formed thicker and the tip end side is formed thinner. As shown in Fig. 1, around the turntable 721, the wheel-shaped gear 7 22 is fixed to the ceiling of the vacuum transfer chamber 4. On the other hand, a drive mechanism 73 including a small gear 731 is fixed to the beam plate on one side of the support arm 71. By meshing the wheel-shaped gear 722 and the gear 731 on the drive mechanism 73 side, the gear 731 of the drive mechanism 73 is rotated to move the gear 731 of the drive mechanism 73 around the wheel-shaped gear 722, thereby being rotatable The support arm 71 is fixed to the rotary table 721 and thereon. As a result, as shown in FIG. 3( a ), the disk portion 741 can pass through the position of the handle portion 53 in which the processing chambers 5 a to 5 d are provided, and the lid conveyance jig 61 disposed in the maintenance area 6 . The upper position is such that the support arm 71 rotates. Further, as the maintenance field 6 has been described as being located at one side of the side facing the vacuum transfer chamber 4, that is, the maintenance surface, the substrate processing apparatus 100 which does not have the conventional art description will be the top of the vacuum transfer chamber 4. The substrate transport mechanism 41 is lifted and lifted by a crane or the like, and the substrate transport mechanism 41 and the mechanism 411 can be pulled out in the lateral direction as long as the members constituting the inspection surface of the first -15 to 201212147 are removed. Here, in the vacuum 4 of the present embodiment, as shown in FIG. 6, the opening portion 431 for taking out the substrate from the transfer space 401 and the opening portion 43 2 for driving the drive mechanism from the machine chamber 402 are It is located on the inspection surface. These openings 43 2 are closed by the respective openings 421 and 422 during the operation of the substrate processing apparatus 1. The substrate processing apparatus 1 having the above configuration is connected to the control unit 8 as in the second. The control unit 8 is configured by a computer including a CPU unit (not shown), and a program is recorded in the storage unit, which is a step (command) group, and can be controlled by etching processing of the substrate S by the substrate processing. At the time of the operation and the processing chambers 5a to 5d, the operation of the 52 is carried out by the lid transport mechanism 7 until the maintenance area 6. This program is housed in a computer such as a hard disk, a CD, a billion card, etc., and is installed on the computer from there. Hereinafter, the operation of the solid substrate processing apparatus 1 will be described with reference to Figs. 1 to 6 . If it is necessary to repair the process room 5. In this case, the vacuum of the vacuum transfer chamber 4 is closed to close the gate valve G3, and the preparation for removing the lid body 52 from the processing chamber main body 51 in the vacuum line in the processing chamber 5a is released. At this time, the etching process of the substrate S can be continued in the processing chambers 5b to 5d. Then, as shown in Fig. 1, the support arm 71 is rotated after the lower end 74 1 of the support arm 71 is lowered, and is driven below the bent portion of the handle portion 53 provided in the processing chamber 5 body 52. The transfer chamber structure 41 411 takes the form of the 431, the closed member diagram, and the memory cover body and the magneto-optical application example that are set in the memory, and the cover plate of the other disk portion a is secured. Part-16- 8 The flexion part of 201212147 741. Further, the lid portion 741 and the bent portion of the grip portion 53 are engaged with each other by the rising jaw portion 741, and the lid body 52 is lifted upward. Here, the handle portion 53 and the disk portion 741 may be coupled by bolts so that the handle portion 53 of the lid 52 does not slide down from the disk portion 741 during transportation. In this case, when the lid body 52 of the processing chamber 5a is lifted to a height position that does not interfere with the adjacent processing chamber 5b, the driving mechanism 73 is actuated from the upper position of the processing chamber 5a shown in Fig. 3(a). The lid body 52 is conveyed until the position above the lid body transport jig 61 that is in standby in the maintenance field 6 is moved. When the disk portion 741 is lowered as shown in Fig. 4(a), the lid body 52 is placed on the frame portion 611 of the lid conveyance jig 61, and the lid body 52 and the frame portion 611 are joined to each other. When the disk portion 741 is lowered, the engagement state of the grip portion 53 and the disk portion 741 is released. Further, in Figs. 4(a) to 4(c), the processing chambers 5c and 5d connected to the vacuum transfer chamber 4 are omitted for convenience of illustration. After the support arm 71 is rotated away from the upper position of the handle portion 53, the frame portion 611 is rotated by 180 degrees as shown in Fig. 4(b), and the lid body 52 is reversed up and down so that the gas shower head faces upward, and is repaired. . Further, the lid conveyance jig 61 is moved as needed, and the lid body 52 may be conveyed to a predetermined maintenance chamber. (Fig. 4(c)). In the case where the other processing chambers 5b to 5d are opened, the lid body 52 can be removed from the processing chamber main body 51 by performing the same operation as the operation described using the respective figures of the third and fourth figures. Maintenance of each of the processing chamber body 5 1 side and the lid body 5 2 side. -17-201212147 When the maintenance is completed, the lid transport jig 61 and the lid transport mechanism 7 are operated in the reverse order of the removal, and the lid 52 is airtightly inserted into the opening of the chamber main body 51. Then, the connection between the etching gas and the exhaust pipe is reset, and after the inside of the processing chamber 5a is in a vacuum state, the operation is started, and the gate valve G3 is opened, and the substrate S is accommodated from the vacuum transfer chamber 4 to be etched again. The operation when the substrate transport mechanism 41 and the drive mechanism 411 thereof are removed will be described. In this case, the operation of the entire substrate processing apparatus 1 is stopped, and the vacuum state in the vacuum transfer chamber 4 is released. Then, the opening/closing member 421 provided on the inspection surface, for example, the conveyance space 401 side is removed (Fig. 5(a), 6 Figure (a)). Further, the main body of the substrate transport mechanism 41 and the drive mechanism 411 are separated, and the substrate transport mechanism 41 is pulled out toward the inspection surface side, so that the substrate transport mechanism 41 can be carried out toward the maintenance field 6 without using a crane or the like. At this time, it is easy to perform the drawing operation of the substrate conveyance mechanism 41. For example, a caster or the like may be provided on the bottom surface portion of the substrate conveyance mechanism 41, or a rail may be laid on the bottom plate 44 of the conveyance space 401. When the drive mechanism 41 1 is taken out, the opening and closing member 422 of the machine room 402 is also removed (Fig. 5 (a), Fig. 6 (b)), and separated from the body of the substrate transport mechanism 4 1 . When the drive mechanism 4 1 1 is pulled out toward the inspection surface side, the drive mechanism 411 from the machine room 402 to the maintenance area 6 can be easily carried out (Fig. 6(c)). Next, an example of a substrate processing system having a plurality of substrate processing apparatuses 1 described above and a substrate processing system of a conventional substrate processing apparatus 100 will be described. 7(a) and 7(b) -18- 8 201212147, each of which is a substrate processing system of the substrate processing apparatus 100 of the conventional example, and the substrate processing apparatus 100 of the conventional example shown in FIG. An illustration of an illustration. In the drawings, the disclosure of the air loader 2 of each of the substrate processing apparatuses 1 and 1 is omitted, and the field in which these air loaders 2 are disposed is collectively shown as the air loader arrangement field 20. In the substrate processing system shown in Fig. 7 (a), the substrate processing apparatus 1 of the substrate processing apparatus 1 of the embodiment is oriented in the same direction, and the plurality of substrate processing apparatuses 1 are arranged in the left-right direction to form the first. Column 11. Further, the loading lock chamber 3 of the substrate processing apparatus 1 is oriented in a direction opposite to the direction of the load lock chamber 3 of the first row 11, so that the maintenance area 6 faces the maintenance area 6 of the first column 11 and A second row 12 in which a plurality of substrate processing apparatuses 1 are arranged in parallel with the first column 11 is formed. In other words, the first row 1 1 and the second row 12 are arranged in parallel so that the inspection faces in the substrate processing apparatus 1 in each of the columns 1 1 and 12 face each other. In the first row 11 and the second row 12, the transport path 60 that connects the maintenance area is configured to transport the equipment removed from the substrate processing apparatus 1. In the example shown in Fig. 7(a), the width of the conveyance path 60 is such that the cover conveyance jig 61 described above can pass, and the width of the cover conveyance jig 61 is set. At this time, in the present example, the maintenance field 6 of the structure in which the load lock chamber 3 and the vacuum transfer chamber 4 are not provided is faced as shown in Fig. 7(a) so that the first column 1 1 and the second Since the columns 1 2 are arranged in parallel, the first column 1 1 and the second column 1 2 can be close to each other until the cover handling jig 61 does not contact the substrates extending toward the maintenance field 6 side. 19 - 201212147 Processing of the device 1 Room 5 degree position. Each of the substrate processing apparatuses 1 includes a lid transport mechanism 7 (not shown in FIG. 7( a )) for moving the lids 52 of the four processing chambers 5 to the maintenance area. In the substrate processing apparatus 1 adjacent to each other in the left-right direction, it is not necessary to provide the conveyance path 60 for the cover conveyance jig 61 to pass. In the example shown in FIG. 7( a ), the substrate processing apparatus 1 on the first column 11 side and the substrate processing apparatus 1 on the second column 12 side are arranged side by side in the front-rear direction (longitudinal direction). In the state of the straight line, the substrate processing apparatus 1 may be shifted in the left-right direction (lateral direction) between the first column 1 1 and the second column 12 . On the other hand, in Fig. 7(b), an example of a substrate processing system is shown, which is based on the same considerations as in the case of the substrate processing apparatus 1 of the embodiment, by a load lock chamber of a plurality of substrate processing apparatuses 100. 3 is arranged in the same direction to form the first row 101, and the load lock chamber 3 is directed in a direction opposite to the direction of the load lock chamber 3 of the first column 101, by the plurality of substrate processing apparatuses 1 and the foregoing One column 101 is arranged in parallel to form a second column 102. In this example, the two rows 1 01 and 102 are also the same as the transport path 60 of the same width as the transport path 60 of Fig. 7(a). Here, the substrate processing apparatus 100 of the conventional example shown in Fig. 9 is provided with the maintenance area 6 at a position adjacent to each of the processing chambers 5. However, depending on the situation, it is necessary to move the lid transport jig 61 in all the maintenance areas 6, and in each of the rows 101 and 102, the transport path 60 is also provided between the substrate processing apparatuses 100 adjacent to each other in the left-right direction. -20- 8 201212147 When the substrate processing apparatus 1 and 100 of the above-described substrate processing apparatus 1 are compared, since the maintenance area 6 is shared for the plurality of chambers 5 in the substrate processing apparatus 1 of the embodiment, it is inconsistent with the substrate processing apparatus 100. It is not necessary to transport the path 60 between the substrate processing apparatuses 1 adjacent to each other. Therefore, by comparing Fig. 7(a) and Fig. 7(b), in the range of the horizontal width "B" of the arrangement area, it is possible to have 10 in the column 1 and 5 in the column, and 10 in the two columns 11 and 12 (processing) The substrate processing apparatus 1 of the total 40 of the chambers 5). On the other hand, in the case of the substrate processing apparatus, since the path 60 is also transported between the adjacent substrate processing apparatuses 100, the number of the substrate processing apparatuses 100 is four in each of 101 and 102, and the total of the two columns 8 units (the total 24 of the processing rooms 5). When the lateral widths of the substrate processing apparatuses 1 and 100 are singularly seen by the respective apparatuses, the vacuum processing 4 and the two processing chambers 5 provided on the left and right sides of the substrate processing apparatus 100 of the conventional example are also arranged in parallel. In the substrate processing apparatus 1 of the present example, since each of the processing chambers 5 is disposed obliquely in a line extending in the left-right direction, the horizontal width in the left and right directions is reduced in accordance with the inclination. Therefore, for example, when the distance from the center of the vacuum transfer chamber 4 to the position of the processing chamber 5 is the same in each of the substrate processes 1 and 100, the device width "b1" of the substrate processing apparatus 1 is larger than that of the substrate processing apparatus 100. The horizontal width is smaller. When the width in the vertical direction is compared with the substrate processing system shown in Fig. 7 (a) and (b), the setting of the processing of the substrate processing apparatus is known to be 10 sets of 100. In the case where the number of columns is the room to be transported, the processing chambers 100 are arranged obliquely in the horizontal direction b2 j 7 in the case of the opposite device, and the processing chambers 5 in the vertical direction are extended in the vertical direction. In the case of the load lock chamber 3, the vacuum transfer chamber 4, and the processing chamber 5, they are arranged on the straight line in the longitudinal direction. Therefore, the width of the transport 60 between the respective rows 11 and 12 and between the columns 1 01 and 102 In the same manner, the width "A1" in the longitudinal direction and the substrate processing apparatus 1 shown in Fig. 7(b) in the substrate processing system of the substrate processing apparatus 1 shown in Fig. 7(a) are compared. In the substrate processing system When the width direction "A2", the width of the longitudinal direction of the vacuum transfer chamber 4 is the same, the "A1" becomes small. In the substrate processing apparatus 100 of the prior art, the lock chamber 3, the vacuum transfer chamber 4, and the processing chamber 5 are linearly arranged in the vertical direction, and the substrate processing apparatus 1 and 100 are arranged in a straight line. In the substrate processing apparatus 1 of the present example, the lock chamber 3, the vacuum transfer chamber 4, and the maintenance area 6 are linearly arranged in the longitudinal direction. Further, since the maintenance area 6 can share a part of the conveyance path 60, the width of the vacuum transfer chamber 4 in the longitudinal direction is the same, and the width "al" of the substrate processing apparatus 1 in the longitudinal direction can be longer than the longitudinal direction of the substrate processing apparatus 100. The width "a2" is smaller. The substrate processing apparatus 1 of the present embodiment has the following effects. The plurality of processing chambers 5 are connected to the side surface of the vacuum transfer chamber 4 having a hexagonal planar shape, and the maintenance field 6 of the cover 52 of each processing chamber 5 and the transport destination of the substrate transport mechanism 41 is provided by the plurality of processing chambers 5. Since the sharing is achieved, the space saving of the substrate processing apparatus 1 can be achieved. Further, since the lid body transporting mechanism 7 for transporting the lid body 52 of the processing chamber 5 from the processing chambers 5 to the maintenance area 6 is -22-201212147, the maintenance area 6 can be easily opened even if it is shared. The vacuum transfer chamber 4' is not limited to the case where the planar shape is a regular hexagonal shape. As shown in Fig. 8, the vacuum transfer chamber 4 is formed into a flat hexagonal shape, and two load lock chambers 3a and 3b for loading and unloading are provided on the wide side of the vacuum transfer chamber 4, so that the loading and unloading speed of the substrate S is also increased. can. Further, an octagonal vacuum transfer chamber provided with each processing chamber may be provided between the processing chambers 5a and 5b and between the processing chambers 5c and 5d. Alternatively, the side faces of the two chambers 5c, 5d may be provided as one side surface, and only one processing chamber may be provided. The shape of the vacuum transfer chamber is not limited to a hexagonal shape, and a polygonal shape of a pentagon or more is preferable. In particular, if the normal lines of the two side faces having the adjacent processing chambers are connected to each other to form a polygonal shape having a side angle of 90° or less, the processing chamber can be efficiently disposed in a field closer to a circle than in the case of a square shape. Further, since the vacuum transfer chamber is large, it may be divided into, for example, three or more portions by a plurality of members, a joint member, and a seal member. The configuration of the lid transport mechanism 7 is not limited to the example of the cantilever-type lid transport mechanism 7 shown in Fig. 1 . The support arm 71 of the lid transport mechanism 7 shown in Fig. 1 is oriented toward the diameter. The direction is retractable, and the working radius is variable by providing a small crane on the upper surface of the vacuum transfer chamber 4, and even if the vacuum transfer chamber 4 is a flat hexagon as shown in Fig. 8, The cover -23-201212147 body 52 is freely transported between the processing chambers 5a to 5d and the maintenance area 6. For example, a gantry crane (bridge crane) that lays a rail on the outer side of the processing chambers 5a to 5d and the upper surface of the vacuum transfer chamber 4 so as to be parallel to each other as seen from the vacuum transfer chamber 4 The lid body transport mechanism 7 may be configured to move in the upper position of each of the processing chambers 5a to 5d and the maintenance area 6. The position in which the maintenance field 6 is formed is the substrate processing apparatus 1 shown in FIG. 2, and the six side faces of the vacuum transfer chamber 4 are not limited to the side faces of the side faces that are formed on the side faces to which the load lock chambers 3 are connected. The situation on the outside side. For example, in FIG. 2, the processing chamber 5 is provided at a position where the maintenance area 6 is provided. However, the maintenance area 6 may be formed at a position on the outer side of one of the side surfaces of the processing chambers 5a to 5d connected to the second drawing. can. In this case as well, the effect of saving the space of the substrate processing apparatus 1 can be obtained. In the present example, the example in which the etching process of the substrate S is performed by the processing chambers 5a to 5d is shown. However, the type of vacuum processing performed in the processing chambers 5a to 5d is not limited thereto, and for example, CVD (chemical vapor) is performed. Coating treatment and ashing treatment such as deposition, Chemical Vapor Deposition, etc. are also possible. The type of vacuum treatment to be performed in each of the processing chambers 5a to 5d is not limited to the same type. For example, after the etching treatment is performed in the same substrate processing apparatus 1, the vacuum processing may be performed so that the ashing treatment can be performed. Further, the processing chamber 5 may be connected to all of the other four side faces of the vacuum transfer chamber 4 other than the side surface connected to the load lock chamber 3 and the side facing the maintenance area 6, and the number of the process chambers 5 may be two to three. Also. Further, the type of the substrate S to be processed in the substrate processing apparatus 1 is not limited to the angular glass substrate as shown in the embodiment of 201212147, and it is of course applicable to a circular substrate such as a semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] A perspective view showing an external configuration of a substrate processing apparatus of an embodiment. [Fig. 2] A plan view of the substrate processing apparatus. [Fig. 3] A first explanatory diagram showing an operation of removing a cover provided in a processing chamber of the substrate processing apparatus. [Fig. 4] A second explanatory diagram showing an operation of removing the cover body. [Fig. 5] Fig. 5 is a first explanatory view showing an operation of removing a substrate transport mechanism provided in a vacuum transfer chamber of the substrate processing apparatus. [Fig. 6] Fig. 6 is a plan view showing an example of a substrate processing system including a substrate processing apparatus of a plurality of embodiments and a conventional example. [Fig. 8] A plan view showing an example of a flat hexagonal substrate processing apparatus in which the planar shape of the vacuum transfer chamber is flat. [Fig. 9] A plan view showing an example of a conventional substrate processing apparatus. [Description of main component symbols] C1: Carrier C2: Carrier G1 to G3: Gate valve - 25 - 201212147 S: Substrate 1: Substrate processing apparatus 2: Air loader 3: Load lock chamber 3a, 3b: Load lock chamber 4: Vacuum Transfer chamber 5: Process chamber 5 a ~ 5 d : Process chamber 6 : Maintenance area 7 : Cover transport mechanism 8 : Control unit 11 : Column 12 : Column 20 : Air loader configuration field 2 1 : Lift mechanism 22 : Support table 23: Atmospheric side substrate transport mechanism 3 1 : Positioner 32 : Rack buffer 41 : Substrate transport mechanism 44 : Base plate 51 : Process chamber body 52 : Cover 53 : Handle portion -26 - 8 201212147 60 : Transport path 61 : Cover handling jig 71: Support arm 73: Drive mechanism 1: Substrate processing apparatus 101: 歹! ]
102 :歹IJ 201，202 :載體載置部 231 :搬運臂 2 3 2 :基台部 4 0 1 :搬運空間 402 :機械室 4 1 1 :驅動機構 412 :鎬 421 :開閉構件 422 :開閉構件 4 3 1 :開口部 4 3 2 :開口部 6 1 1 :框體部 6 1 2 :支柱構件 613 :旋轉支撐部 614 :台車部 7 1 1 :連結構件 721 :旋轉台 201212147 722 :齒輪 73 1 :齒輪 741 :挾盤部 742 :昇降機構102 : 歹 IJ 201, 202 : carrier mounting portion 231 : transport arm 2 3 2 : base portion 4 0 1 : transport space 402 : machine room 4 1 1 : drive mechanism 412 : 镐 421 : opening and closing member 422 : opening and closing member 4 3 1 : opening portion 4 3 2 : opening portion 6 1 1 : frame portion 6 1 2 : pillar member 613 : rotation support portion 614 : carriage portion 7 1 1 : coupling member 721 : rotary table 201212147 722 : gear 73 1 : Gear 741 : 挟 742 : Lifting mechanism