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TW201219512A - exhibiting a high conductivity even at a low temperature regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin - Google Patents

exhibiting a high conductivity even at a low temperature regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin Download PDF

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Publication number
TW201219512A
TW201219512A TW099137434A TW99137434A TW201219512A TW 201219512 A TW201219512 A TW 201219512A TW 099137434 A TW099137434 A TW 099137434A TW 99137434 A TW99137434 A TW 99137434A TW 201219512 A TW201219512 A TW 201219512A
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Taiwan
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resin
acid
silver
paste
conductive
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TW099137434A
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Chinese (zh)
Inventor
Takashi Hinotsu
Yuto Hiyama
Toshihiko Ueyama
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Dowa Electronics Materials Co Ltd
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Priority to TW099137434A priority Critical patent/TW201219512A/en
Publication of TW201219512A publication Critical patent/TW201219512A/en

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Abstract

The present invention provides a conductive paste capable of forming a conductive film exhibiting a high conductivity even at a low temperature of approximately 120 DEG C regardless of whether the constituting resin is a thermosetting resin or a thermoplastic resin. The technical means of the present invention involves a method for forming a conductive film, wherein a conductive paste, which is used as the wiring formation paste, and in which a C2-8 dicarboxylic acid is added to a paste, comprises a resin, a dispersion medium, and silver nanoparticles covered with an organic substance consisting of C2-8 carboxylic acid or its derivative thereof, and the conductive paste.

Description

201219512 六、發明說明: 【發明所屬之技術領域】 本發明係關於-種藉由低溫處理亦可… 導電電路的導電性糊膏及使用置 /、導電性優異之 之形成方法。 所^之導-和導電膜 【先前技術】 金屬粒子、樹脂、溶劑所構成之導電 機器,尤其是電子機器中之金屬微細配線心=電子 之小型化趨於顯著,叫f求更加微細之配線电子機器 業界不僅對先前所利用之陶究基板進行研究,而且對古八 子所構成之基板之應用亦進行研究。㈣,如此:二 料通常_性差,且先㈣叙齡在為了抑導電性= 需之熱處理(例如於大氣中且於赃锻燒i小時等)中’右 時會舍生㈣。因此’為了亦可_於此種基板,業界正 求即使藉由低溫驗亦可形成導電膜之導電性糊膏。〜 古作為即使藉由低溫下切燒亦可形成導電膜之導電性糊 月尤/、疋:^年來㈤始研究使用所具有物性與微米級之粒 子不同的奈米級金屬粒子(平均一次粒徑〜200 nm,以下稱 為金屬不米粒子」)之糊膏以解決上述問題。藉由採用如 此之粒子’可提供尤其適合於微細配線之糊膏。 但是,由於金屬奈米教子之活性極高,故而大部分粒子係 於其表面$成由有機物形成之保護層而石_粒子之獨立性 099137434 3 201219512 者。然而,如此之保護層雖然於保存粒子時可有效地發揮作 用,但在表現出金屬性質時有阻礙因素之作用。於此情形 時,即使已形成配線’有時亦因電阻較大而不實用。 據專利文獻1所記載之技術,若對奈米級之銀粒子糊膏添 加具有離子交換能力之物質,則可使銀粒子表面之有機保護 膜剝離。而且記載,即使於丨50。〇進行10分鐘左右之熱處 理亦可獲得4〜10 //Ω · cm之體積電阻率之配線。但是, 若利用該文獻所揭示之技術,則必須採用乾對濕(dry 〇n wet) 或濕對濕(wet on wet)之特殊塗佈方法,且難以形成複雜之 微細配線。 專利文獻2中揭示有在糊膏中含有具有烷基所構成之側 鏈的一元酸及具有脂環構造的二元酸中之任一者,且包含環 氧樹脂與酚樹脂之導電性糊膏。並且記載,在該糊膏中上述 一元酸發揮去除銀粒子表面之氧化膜之作用,且藉由於 180°C進行10分鐘之熱處理,可獲得顯示17〜25 · cm 之體積電阻率的配線。但是,專利文獻2所記載之技術尚未 達到在低於150 C之區域内表現出充分之導電性。 [先前技術文獻] [專利文獻] [專利文獻1]曰本專利特開2010_132736號 [專利文獻2]曰本專利特開2009-298963號 【發明内容】 099137434 4 201219512 (發明所欲解決之問題) 若欲利用尤其是耐熱性低之基板 等之附近之熱處理。即,藉由於二=產生變形 度使導電性粒子航接觸、燒結而表現出導電=熱溫 膏具有極高之利用價值,可應用於各種用途。但θ v電性糊 述之先前技術中至今尚未提供低溫下之導電性糊^。吐所 又,期待若能夠提供不偈限於樹脂之種類而可^現低 化之糊貧,則亦可設計滿足其 、_包 變廣。 目的之糊月,且應用領域亦會 一本發明彳轉於如此之要求而完成者。即,本朗書中所揭 不之内容係提出-種可藉由纟12(rc左右之低溫之熱處理 形成的顯示低體積電阻率之金屬導電膜。更具體而言,係揭 不如下之導電性糊膏:無論構成成分之樹脂為熱硬化性樹脂 亦或熱可錄樹脂,㈣滅考慮料之差異,㈣成在2 溫處理之條件下顯示低電阻之導電膜。 (解決問題之手段) 所謂本發明之可形成導電膜之導電性糊膏,具體而言係包 含經妷數2〜8之羧酸或其衍生物所構成之有機物所被覆之 金屬粒子、分散媒及樹脂、以及碳數2〜8之二羧酸者。本 說明書中所謂「衍生物」係指主要構造具有碳數2〜8之羧 酸構造,且分子内之一部分經其他官能基取代而成者。再 者,此處將金屬種類為「銀」者特別稱為「樹脂型銀糊膏 099137434 5 201219512 構成糊膏中所添加之1 糊膏之總重量為0. 〇 5〜9 Λ 之—竣酸相對於導電性 2.0質量。/。之範圚 就上述構成之導電性糊膏中所 ^可。 解溫度方面而言,構成銀粒子之 〇之—竣酸之沸點或分 2〜8之羧酸。 ,表面之主要成分更佳為碳數 上述構成之樹脂型銀 子分散之分散劑。 糊 丹更佳為進-步包含可使金 屬粒 將上述構成之導電性糊膏 藉由使銀錢制级⑼表具有 而且’將上述構成之導電性糊膏於 60分鐘而獲得之導電膜於以 =於=煅燒 值為2.G以下。 b表色絲不之情形時a* 又,本發明之導電性配線之形成方法係具有下述步驟者: 將上述導電性糊膏塗佈於基板上之步驟;於大氣中或惰性氣 體環境中於HK)〜·。C之條件τ進行熱處理,而將所塗 佈之上述導電性糊膏製成金屬膜之步驟。 (發明效果) 藉由上述導電性糊膏之構成,尤其是藉由在其構成中添加 二羧酸’即使在低於先前熱處理溫度之溫度中亦可形成低電 阻之配線。並且,確認對於熱硬化性或熱可塑性之樹脂種_ 均適用,因此可靈活應對其所應用之用途,可飛躍性地拓寬 利用領域。 099137434 6 201219512 【實施方式】 作為導電性之粒子’可使用金、銀、銅、鎳、鋁等,但就 價格、可靠性方面而言,使用最普遍者為銀。因此,於本說 明書中,對將銀粒子用作導電性粒子之例具體地進行說明, 但銀以外之物質亦適用本發明。 <銀奈求粒子> 於本發明中使用銀奈米粒子之情形時,係使用自穿透式電 子顯微鏡(TEM ’ Transmission Electron Microscope)照片算出 之平均一次粒徑為200 nm以下,較佳為i〜15〇 nm,更佳 為10〜100 nm者。藉由使用具有此種粒徑之粒子,即便對 使用樹脂之糊霄於120°C左右之低溫下進行熱處理,亦可形 成具有南導電性之導電膜。 利用穿透式電子顯微鏡之平均一次粒徑的評估,係進行如 下。首先,將洗淨後之銀奈米粒子2質量份添加至環己烷 96質量份與油酸2質量份之混合溶液中,藉由超音波使其 分散。將分散溶液滴加至附帶支持膜之Cu微細拇格 (microgrid)中,旅使其乾燥’藉此製成TEM試樣。針對所 製作之TEM試樣微細栅格,使用穿透式電子顯微鏡(日本電 子股份有限公司製造之JEM-lOOCXMark-Π型),以1〇〇 kv 之加速電壓觀察以明視野所觀察到之粒子的影像。又,使用 藉由將該圖像放大而將照片倍率設為300,000倍者。 為了自所獲得之照片算出粒徑’可直接利用游標卡尺等測 099137434 7 201219512 定粒子,亦可利用圖像解析軟體算出粒徑。此時之平均一次 粒徑係使用針對TEM照片中之各自獨立的粒子測定至少 200個所得的結果,算出其數量平均值。 經有機被覆物所被覆之銀奈米粒子中之銀含量可笋由如 下方法异出:稱量試樣(經有機被覆物所被覆之銀奈米粒 子)0.5 g以上置於灰分測定用灰皿中,且於馬弗爐⑽神201219512 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a conductive paste which can be used for a low-temperature treatment, a conductive paste, and a method for forming a conductive material which is excellent in electrical conductivity. Conductor-and conductive film [Prior Art] Conductive devices composed of metal particles, resins, and solvents, especially metal micro-wiring cores in electronic devices = miniaturization of electrons tends to be remarkable, so that it is required to obtain more fine wiring. The electronic equipment industry not only studies the ceramic substrates previously used, but also studies the application of the substrate formed by the ancient eight. (d), this: the second material is usually _ poor, and the first (four) narrative age will be relegated to the right in order to suppress the conductivity = heat treatment (for example, in the atmosphere and forging for i hours, etc.) (4). Therefore, in order to make such a substrate, the industry is expected to form a conductive paste of a conductive film even by a low temperature test. ~ Ancient as a conductive paste that can form a conductive film even by cutting at a low temperature. / 疋: ^ Years (5) began to study the use of nano-sized metal particles with different physical properties and micron-sized particles (average primary particle size) A paste of ~200 nm, hereinafter referred to as a metal non-particle particle"), solves the above problem. A paste which is particularly suitable for fine wiring can be provided by using such a particle. However, since the activity of the metal nano-teacher is extremely high, most of the particles are on the surface of which is a protective layer formed of organic matter and the independence of the stone-particles is 099137434 3 201219512. However, such a protective layer can effectively function when preserving particles, but has a hindrance effect when exhibiting metallic properties. In this case, even if the wiring has been formed, it is sometimes not practical because of the large resistance. According to the technique described in Patent Document 1, when a substance having ion exchange ability is added to the nano-sized silver particle paste, the organic protective film on the surface of the silver particles can be peeled off. Also recorded, even at 丨50. 〇 Heat treatment for about 10 minutes can also obtain wiring with a volume resistivity of 4 to 10 // Ω · cm. However, if the technique disclosed in this document is used, it is necessary to adopt a special coating method of dry 〇n wet or wet on wet, and it is difficult to form complicated fine wiring. Patent Document 2 discloses a conductive paste containing an epoxy resin and a phenol resin, which comprises a monobasic acid having a side chain composed of an alkyl group and a dibasic acid having an alicyclic structure. . Further, it is described that the monobasic acid functions as an oxide film for removing the surface of the silver particles in the paste, and a wire having a volume resistivity of 17 to 25 cm is obtained by heat treatment at 180 ° C for 10 minutes. However, the technique described in Patent Document 2 has not yet achieved sufficient conductivity in a region of less than 150 C. [Prior Art Document] [Patent Document 1] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-132736 [Patent Document 2] Japanese Patent Laid-Open No. 2009-298963 (Summary of the Invention) 099137434 4 201219512 (Problems to be Solved by the Invention) It is desirable to use heat treatment in the vicinity of a substrate or the like which is particularly low in heat resistance. In other words, the conductive particles are contacted and sintered by the second degree of deformation, and the conductive = hot paste has an extremely high utility value and can be applied to various applications. However, the prior art of θ v electrical pasting has not yet provided a conductive paste at a low temperature. In addition, it is expected that if it is possible to provide a kind of paste that is not limited to the type of resin, it can be designed to meet the needs of the package. The purpose of the month, and the field of application will also be completed by a invention that is fulfilled by such requirements. That is, what is not disclosed in this book is a metal conductive film which can be formed by heat treatment at a low temperature of about 12 rc, which exhibits low volume resistivity. More specifically, it is not conductive as follows. Slim paste: Whether the resin of the constituent component is a thermosetting resin or a heat recordable resin, (4) the difference in the material is considered, and (4) the conductive film exhibiting a low resistance under the condition of 2 temperature treatment. (Means for solving the problem) The conductive paste which can form a conductive film of the present invention is specifically a metal particle, a dispersion medium, a resin, and a carbon number which are coated with an organic substance composed of a carboxylic acid having 2 to 8 turns or a derivative thereof. In the present specification, the term "derivative" means a structure in which a main structure has a carboxylic acid structure having 2 to 8 carbon atoms, and one part of the molecule is substituted by another functional group. The metal type is "silver", especially the "resin type silver paste 099137434 5 201219512. The total weight of the paste added to the paste is 0. 〇5~9 Λ - 竣 acid relative to conductivity 2.0 quality. /. In terms of temperature, the boiling point of the silver particles, the boiling point of the citric acid or the carboxylic acid of 2 to 8 is formed. The main component of the surface is more preferably the carbon number. Resin-type silver-dispersed dispersing agent. Preferably, the paste-forming step comprises the step of allowing the metal particles to have the conductive paste of the above-mentioned composition by having the silver-based grade (9) and having the conductive paste of the above composition at 60. The conductive film obtained in minutes has a calcination value of 2.G or less. b When the color of the conductive yarn is not the same, a* The method for forming the conductive wiring of the present invention has the following steps: The step of applying the paste to the substrate; and subjecting the coated conductive paste to a metal film by heat treatment in the atmosphere or in an inert gas atmosphere at a condition τ of HK) to C. (Effect of the Invention) By the configuration of the above-mentioned conductive paste, in particular, by adding a dicarboxylic acid to its constitution, a wiring having a low resistance can be formed even at a temperature lower than the temperature of the previous heat treatment. Hardenable or thermoplastic resin _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In terms of price and reliability, the most common use is silver. Therefore, in the present specification, an example in which silver particles are used as the conductive particles will be specifically described, but the present invention is also applicable to substances other than silver. In the case where silver nanoparticles are used in the present invention, the average primary particle diameter calculated using a TEM 'Transmission Electron Microscope' photograph is 200 nm or less, preferably i~15〇nm, more preferably 10~100 nm. By using particles having such a particle diameter, a conductive film having a south conductivity can be formed even if heat treatment is performed at a low temperature of about 120 °C using a resin paste. The evaluation of the average primary particle diameter by a transmission electron microscope was carried out as follows. First, 2 parts by mass of the washed silver nanoparticles are added to a mixed solution of 96 parts by mass of cyclohexane and 2 parts by mass of oleic acid, and dispersed by ultrasonic waves. The dispersion solution was dropped into a Cu microgrid with a support film, and allowed to dry, thereby making a TEM sample. Using a transmission electron microscope (JEM-100CXMark-Π type manufactured by JEOL Ltd.) to observe the fine particles of the TEM sample produced, the particles observed in the bright field were observed at an acceleration voltage of 1 〇〇 kv. Image. Further, the image magnification is set to 300,000 times by enlarging the image. In order to calculate the particle size from the obtained photograph, the particle size can be directly measured by a vernier caliper or the like, and the particle size can be calculated by using an image analysis software. The average primary particle size at this time was obtained by measuring at least 200 results for each of the independent particles in the TEM photograph, and the average value thereof was calculated. The silver content in the silver nanoparticles coated with the organic coating can be obtained by the following method: a weighing sample (silver nanoparticle coated with an organic coating) is placed in an ash dish for ash determination by 0.5 g or more. And in the muffle furnace (10) god

Scientific股份有限公司製造之F〇31〇)中以約忉它/分鐘之 速度使其升溫至700°C,而將存在於銀奈米粒子之表面之有 機被覆物去除’其後於藉由自然放置冷卻而使爐内之溫度達 到500°C以下之階段將灰皿取出,於乾燥器内冷卻至常溫, 並對冷卻後之試樣之重量與加熱處理前之重量進行比較。再 者,被覆表面之有機物可根據使用例如TG_MS或gc_ms 等加熱分析裝置,於惰性氣體環境下所測得的氣體成分而得 知。 於本發明中使用之銀奈米粒子具有上述平均一次粒徑,並 且經有機物被覆其表面。具體而言,所謂上述有機物,可較 佳地使用碳數2〜8之綾酸或其衍生物所構成之有機物。具 體而言,雖然並不限定於以下物質,但可列舉為飽和脂肪酸 之辛酸(caprylic acid)、庚酸(enanthk acid)、己酸(capr〇ic acid)、戊酉夂(valeric acid)、丁酸(butyric acid)、丙酸(Pr〇pi〇nic acid)等。又,作為二羧酸,可列舉乙二酸、丙二酸、丁二酸、 戊二酸、己一酸、庚二酸、辛二酸等。不飽和脂肪酸可列舉 099137434 8 201219512 己二烯酸、順丁烯二酸等。 上述中,尤其是利用己酸、庚酸、己二酸、己二烯酸被覆 • 銀奈米粒子表面時,可容易地製造且提供粉末之形態。提供 • 如此之粉末形態在如本發明般形成糊膏時可使調配變得容 易故而幸又佳。進而’以此種物質被覆表面而形成之粒子可 一面保持一次粒子之形態,一面進行凝聚而容易地回收。此 時之凝聚塊至少為能夠以JISp_38〇1之5種c回收之大小, 因此可視為2.5 //in以上。 再者’ ^進行過濾时則可獲得澄清之it液,因此上述 2.5 # m之减聚(二次)粒徑係與所謂銀粒子之平均粒徑①%) 不同者。其原因在於,絲上述粒徑設為D5。值,則利用濾 氏未月b過;慮而通過之凝聚塊會增多。因此,亦可解釋為,上 述凝聚(二次)粒徑並非平均值,而是形成至少具有2.5 _ 左右之大小之凝聚塊。又,若施加低溫(未達之乾 操作,則亦可以乾燥粒子之形式回收。 、 又,亦可使用經複數種有機物被覆之銀奈米粒子,或將且 有不同之平均-次粒徑之銀奈米粒子併用。 、 &lt;銀次微米粒子&gt; 發明者等人得知即使採用某種程度之大粒徑之銀粒子,从 由滿足特定之必要條件亦可表現出與銀奈米粒子’错 果。相對於銀奈米粒子,將平均粒徑(〇5心為〇5〜扣放 之4等粒子%為銀次微米粒子。作為具體態樣,用於被费m 4是之 099137434 S. 201219512 有機酸係使用碳數2〜8之叛酸或其衍生物所構成之有機 物’來被覆粒子表面。雖然並不限定於以下物質,但可列舉 為飽和脂肪酸之辛酸(caprylic acid)、廣:酸(enanthic acid)、 己西夂(caproic acid)、戊酸(valeric acid)、丁酸(butyric acid)、 丙酸(propionic acid)等。又,作為二羧酸,可列舉乙二酸、 丙一酸、丁二酸、戊二酸、己二酸、庚二酸、辛二酸等。不 飽和脂肪酸可列舉己二烯酸、順丁烯二酸等。 上述粒子可使用預先自銀粒子之製造階段對其進行被覆 而形成者,亦可使用預先針對市售之粒子藉由置換法等更換 被覆物質而形成者。再者,於本說明書中,「銀粒子」包括 「銀奈米粒子」與「銀次微米粒子」。 &lt;分散媒&gt; 本發明之糊膏係將銀粒子(包含銀奈米粒子及銀In F〇31〇) manufactured by Scientific Co., Ltd., it is heated to 700 ° C at a rate of about 忉 / min, and the organic coating present on the surface of the silver nanoparticles is removed. The ash dish was taken out in a stage where the temperature in the furnace reached 500 ° C or lower, and it was cooled to normal temperature in a desiccator, and the weight of the sample after cooling was compared with the weight before heat treatment. Further, the organic substance covering the surface can be known from the gas component measured under an inert gas atmosphere using a heating analysis device such as TG_MS or gc_ms. The silver nanoparticles used in the present invention have the above average primary particle diameter and are coated with the surface of the organic material. Specifically, as the organic substance, an organic substance composed of a carbonic acid of 2 to 8 or a derivative thereof can be preferably used. Specifically, the present invention is not limited to the following, but examples thereof include caprylic acid, enanthk acid, capr〇ic acid, valeric acid, and diced as saturated fatty acids. Butyric acid, propionic acid (Pr〇pi〇nic acid), and the like. Further, examples of the dicarboxylic acid include oxalic acid, malonic acid, succinic acid, glutaric acid, caproic acid, pimelic acid, and suberic acid. Examples of the unsaturated fatty acid include 099137434 8 201219512 hexadienoic acid, maleic acid, and the like. Among the above, in particular, when the surface of the silver nanoparticles is coated with caproic acid, heptanoic acid, adipic acid or hexadienoic acid, the form of the powder can be easily produced. Provided • Such a powder form makes it easy to formulate when forming a paste as in the present invention. Further, the particles formed by coating the surface with such a substance can be easily collected while being agglomerated while maintaining the form of primary particles. At this time, the agglomerate block is at least a size that can be recovered by five kinds of c of JISp_38〇1, and thus can be regarded as 2.5 // in or more. Further, when the filtration is carried out, a clear liquid solution can be obtained, so that the above-mentioned 2.5 #m reduction (secondary) particle size is different from the average particle diameter of the so-called silver particles by 1%). The reason for this is that the above-mentioned particle diameter of the silk is D5. For the value, the filter is not used for the month b; the agglomerates passed through will increase. Therefore, it can also be explained that the agglomerated (secondary) particle diameter is not an average value but forms agglomerates having a size of at least about 2.5 Å. Further, if a low temperature is applied (the dry operation is not performed, it may be recovered in the form of dry particles. Further, silver nanoparticles coated with a plurality of organic substances may be used, or different average-secondary particle diameters may be used. Silver nano particles are used together. &lt;Silver submicron particles&gt; The inventors have found that even if a certain size of silver particles is used, it is possible to exhibit silver nanoparticles with satisfactory conditions. 'The wrong fruit. Compared with the silver nanoparticles, the average particle size (〇5 core is 〇5~ 扣4, etc. The particle% is silver submicron particles. As a specific aspect, it is used for the fee m 4 is 099137434 S. 201219512 The organic acid is used to coat the surface of the particle with an organic substance composed of a tickic acid having 2 to 8 carbon atoms or a derivative thereof. The resin is not limited to the following, but may be a caprylic acid of a saturated fatty acid. Wide: acid (enanthic acid), caproic acid, valeric acid, butyric acid, propionic acid, etc. Further, as the dicarboxylic acid, oxalic acid can be cited. , propionic acid, succinic acid, glutaric acid, adipic acid, g Examples of the unsaturated fatty acid include hexadienoic acid, maleic acid, etc. The particles may be formed by coating the silver particles in advance at the production stage, or may be used in advance for commercially available particles. In the present specification, "silver particles" include "silver nanoparticles" and "silver submicron particles". <Dispersion medium> The paste system of the present invention is formed by replacing the coating material. Silver particles (including silver nanoparticles and silver)

子)分散至分散媒中。此時所使用之分散媒較佳為極性I 劑。、若^極性溶劑,則蒸氣遷低,故而適合操作。冷 尤其是錢料有與各種樹脂相溶之性質者 較佳為使則旨系、_系、酮系、_系、醇系、經二’ 等之有機溶劑。 二糸、胺系 作為具體例,可列舉水、辛二醇等二醇類、乙醇、夕_ 二…甲基t各…⑽旨醇、丁基卡醇、 基卡必醇乙酸g旨、Texan〇卜笨氧基丙醇、二乙。丁 二乙二醇單了醚乙㈣早丁喊、 乙一私早曱越乙峻_、 099137434 2U1219512 乙二醇單乙醚乙酸酯、乙酸甲氧基丁酽 二乙二醇單乙喊己酸醋、乳酸乙醋及;二酸甲氧細、 尤其是’導電性糊膏通常係用以藉由印^專。 此較佳為使用印刷時之揮發性低 ^形成電路,因 用松脂醇或丁基卡必醇乙酸醋、辛二=之溶劑,更佳為使 劑组合而#用。兮w ^, &quot; 又’亦可將多種溶 知“且口而使用。该溶劑之量較佳為 60 f t%^T ® ^ ;祕脂與金屬成分之 負里/°以下,更佳為5〇質量% &lt;分散劑成分&gt; ° 於本發明之糊膏中亦可添加適當分散銀粒子粉末之分散 Γ=如此之分散劑’而於糊膏中確保粒子之獨立 :二=只要為與粒子表面具有親和性,並且對分 亦八有親和性者即可,亦可採用市售之通用者。又,可 採用單獨種類’亦可組合制。其添加量相對於包含銀奈米 粒子及銀次微錄子之銀總質量為3.0質量%以下,較佳為 1.0質量%以下’更佳為0 5質量%以下。 作為具有上述性質之分散劑,具代表性者為:脂肪酸鹽(肥 皂)、α -續基脂肪_鹽(聰)、烧基苯續酸鹽(ABS)、直鍵 烧基苯項酸鹽(LAS)、烧基硫酸鹽(AS)、烧基醚硫㈣鹽 (AES)、烷基硫酸三乙醇等低分子陰離子性(ani〇nic)化合 物,脂肪酸乙醇醯胺、聚氧乙烯烷基醚(AE)、聚氧乙烯烷基 苯ϋ(ΑΡΕ)、山梨糖醇、山梨糖醇酐等低分子非離子系化合 物,烷基三曱基銨鹽、氯化二烷基二甲基銨、氯化烷基吡啶Disperse into the dispersion medium. The dispersing medium used at this time is preferably a polar I agent. If the polar solvent is used, the vapor is lowered, so it is suitable for operation. Cold, especially in the case where the money is compatible with various resins, it is preferred to use an organic solvent such as a ketone system, a ketone system, a ketone system, an alcohol system or a solvent. Specific examples of the diterpene and the amines include glycols such as water and octanediol, ethanol, oxime, and methyl groups. (10) Alcohol, butyl carbitol, carbitol alcohol acetic acid, Texan笨 笨 氧基 oxypropanol, two. Dibutyl glycol alone ether B (four) early shouting, B a private early 曱 乙 峻 _, 099137434 2U1219512 ethylene glycol monoethyl ether acetate, methoxybutyl phthalate diethylene glycol single yin vinegar Ethyl lactic acid and methic acid; especially the 'conductive paste' is usually used for printing. Preferably, the use of a low volatility forming circuit during printing is carried out by using a solvent of rosin or butyl carbitol acetate vinegar or octane = more preferably as a combination of the agents.兮w ^, &quot; also 'can also use a variety of dissolution and use. The amount of the solvent is preferably 60 ft% ^ T ® ^; the secret fat and metal components minus / ° below, more preferably 5 〇% by mass &lt;dispersant component&gt; ° In the paste of the present invention, it is also possible to add a dispersion of appropriately dispersed silver particle powder Γ = such a dispersant' to ensure particle independence in the paste: It has affinity with the surface of the particles, and it can also be used for halving. It can also be used as a general-purpose one. It can also be used in a single type. It can also be combined with the amount of silver nanoparticles. The silver total mass of the silver micro-recorder is 3.0% by mass or less, preferably 1.0% by mass or less, and more preferably 0.5% by mass or less. As a dispersing agent having the above properties, a representative one is a fatty acid salt ( Soap), α-renering fat _ salt (Cong), alkyl benzoate (ABS), direct-bonding benzoate (LAS), alkyl sulfate (AS), alkyl ether sulfur (tetra) salt Low molecular anionic (anisnic) compounds such as (AES), alkyl triacetate, fatty acid ethanol decylamine, polyoxyethylene hydride Low molecular nonionic compounds such as alkyl ether (AE), polyoxyethylene alkyl benzoquinone (ΑΡΕ), sorbitol, sorbitol, alkyl tridecyl ammonium salt, dialkyl dimethyl ammonium chloride Alkyl pyridine chloride

S 099137434 11 201219512 鑌專低分子陽離子性(cati〇nic)化合物,烧基缓基甜菜驗、石黃 基甜菜驗、卵磷脂等低分子兩性系化合物,或萘續酸鹽之曱 醛縮合物,聚苯乙烯磺酸鹽,聚丙烯酸鹽,乙烯系化合物與 羧酸系單體之共聚物鹽,羧曱基纖維素,聚乙烯醇等所代表 之高分子水系分散劑;聚丙烯酸部分烷基酯、聚伸烷基多胺 之高分子非水系分散劑;及聚乙烯亞胺、曱基丙烯酸胺燒基 酯共聚物等高分子陽離子系分散劑’但只要為適用於本發明 之粒子者,則不排除具有如此處所例示之形態者以外之構造 者。 作為分散劑,若列舉具體名稱,已知有如下述者,但不排 除使用具有上述性質之本項目中所記載者以外之分散劑。例 如’可例示三洋化成股份有限公司製造之ViewLight LCA-H、LCA-25H等,共榮社化學股份有限公司製造之 Flowlen DOPA-15B等,日本Lubrizol股份有限公司製造之 Solplus AX5、Solsperse 9000、Solthix 250 等,EFKA Additives 公司製造之 EFKA 4008 等,Ajinomoto Fine-Techno 股份有 限公司製造之Ajisper PA111等,Cognis Japan股份有限公司 製造之 TEXAPHOR-UV21 等,BYK-Chemie Japan 股份有限 公司製造之Disper BYK2020或BYK220S等,楠本化成股 份有限公司製造之 Disparlon 1751N、Hiplaad ED-152 等, NEOS股份有限公司製造之FTX-207S、Ftergent 212P等, 東亞合成股份有限公司製造之AS-1100等,花王股份有限 099137434 12 201219512 公司製造之 Kaocer 2000、KDH-154、MX-2045L、Homogenol L-l8、Rheodol SP-010V等,第一工業製藥股份有限公司製 造之 Epan U103、Sharol DC902B、Noigen EA-167、Plysurf A2·等’ DIC股份有限公司製造之MegafacF-477等,日 信化學工業股份有限公司製造之西魯非斯SAG5〇3A、Dynol 604等’ San N〇pC〇股份有限公司製造之SN Sperse 2180、S 099137434 11 201219512 镔Special low-molecular cationic (cati〇nic) compound, pyrolysis-based sugar beet test, Shihuang-based beet test, lecithin and other low molecular amphoteric compounds, or naphthoate furfural condensate, Polystyrene sulfonate, polyacrylate, copolymer salt of vinyl compound and carboxylic acid monomer, polymer aqueous dispersant represented by carboxymethyl cellulose, polyvinyl alcohol, etc.; polyalkyl acrylate a polymer non-aqueous dispersing agent for polyalkylene polyamine; and a polymeric cationic dispersing agent such as polyethyleneimine or mercapto methacrylate copolymer, but as long as it is suitable for the particles of the present invention, Constructors other than those exemplified herein are not excluded. As the dispersing agent, the following names are known, but the dispersing agents other than those described in the present item having the above properties are not excluded. For example, 'ViewLight LCA-H, LCA-25H, etc. manufactured by Sanyo Chemical Co., Ltd., Flowlen DOPA-15B manufactured by Kyoei Chemical Co., Ltd., etc., Solplus AX5, Solsperse 9000, Solthix manufactured by Lubrizol Co., Ltd., Japan 250, etc., EFKA 4008 manufactured by EFKA Additives, Ajisper PA111 manufactured by Ajinomoto Fine-Techno Co., Ltd., TEXAPHOR-UV21 manufactured by Cognis Japan Co., Ltd., Disper BYK2020 or BYK220S manufactured by BYK-Chemie Japan Co., Ltd. Etc., Disparlon 1751N, Hiplaad ED-152, etc. manufactured by Nanben Chemical Co., Ltd., FTX-207S, Ftergent 212P manufactured by NEOS Co., Ltd., AS-1100 manufactured by East Asia Synthetic Co., Ltd., etc., Kao shares limited 099137434 12 201219512 Kaocer 2000, KDH-154, MX-2045L, Homogenol L-l8, Rheodol SP-010V, etc. manufactured by the company, Epan U103, Sharol DC902B, Noigen EA-167, Plysurf A2·, etc. manufactured by First Industrial Pharmaceutical Co., Ltd. McAfee Co., Ltd. manufactured by Megafac F-477, etc. SN Sperse 2180 manufactured by San N〇pC〇 Co., Ltd., manufactured by the company, West Africa, SAG5〇3A, Dynol 604, etc.

SN Leveler S-906 等, S-386 等。 進而,除分散劑以外, 印刷性之各種添加劑。$ 流變控制劑、消泡劑、(3 &lt;樹脂&gt; ’亦可添加用以改善糊膏之安定性或 例如,可列舉調平劑、黏度調整劑、 防沉劑等。 本發明之糊膏中摩恭加之樹脂可採用眾所周知之熱硬化 ^•或,、、、可塑型中任#型之樹脂。作為樹脂之添加量,較佳 為設為如下添加量:相·銀奈綠子及銀次微米粒子之合 計之銀總質量與樹脂之合計質量,宜為2〜2G質量%,較佳 為15資里/〇右所添加之樹脂量過多,則於煅燒後樹脂 S超出所*地殘g於配線中’極大影響導電性,故而欠佳。 另方面,右使添加®減少,則無法確保配線與基板之密接 性’因此必須至少添加2質量%左右。 (熱可塑性樹脂) 於本發明中’可使用已知之熱可塑性樹脂中之任一者,其SN Leveler S-906, etc., S-386, etc. Further, in addition to the dispersant, various additives are printed. The rheology control agent, the antifoaming agent, (3 &lt;resin&gt;' may also be added to improve the stability of the paste or may, for example, be a leveling agent, a viscosity modifier, an anti-settling agent, etc. In the paste, the resin can be a well-known thermosetting resin, which can be used as a resin. The amount of the resin to be added is preferably set as follows: phase · Yinnai green And the total mass of the silver and the total mass of the resin of the silver submicron particles are preferably 2 to 2 G mass%, preferably 15 cc / 〇 right added resin amount is too much, then the resin S exceeds after calcination* In the case of the wiring, the wiring is extremely inferior in conductivity. Therefore, if the addition is reduced to the right, the adhesion between the wiring and the substrate cannot be ensured. Therefore, it is necessary to add at least about 2% by mass. (Thermoplastic resin) In the present invention, any of known thermoplastic resins can be used,

S 099137434 13 201219512 中較佳為添加丙烯酸系樹脂、聚酯樹脂或聚胺基曱酸酯樹 脂’作為眾所周知者已知有如下者,但不排除使用具有上述 性質之本項目中所記載者以外之樹脂。 聚胺基曱酸酯樹脂只要為通常市售之熱可塑性胺基曱酸 醋樹脂’則無特別限制。例如可列舉:以多元醇成分與有機 聚異氰酸酯作為必需成分,且使用鏈伸長劑、終止劑等作為 任意成分並使其聚合而獲得之熱可塑性胺基甲酸酯樹脂。 此處,作為上述所使用之聚異氰酸酯,可列舉:1,6-己二 異亂酸S旨(HDI ’ hexamethylene diisocyanate)、離胺酸異氰酸 酯(LDI ’ lysine isocyanate)、異佛爾酮二異氰酸酯(IPDI, isophorone diisocyanate)、苯二曱基二異氰酸酯(XDI, xylylene diisocyanate)、氫化苯二曱基二異氰酸酯(H6-XDI)、 氫化曱二苯二異氰酸酉旨(H12-MDI,Hn-methylene diphenyl diisocyanate)、反式1,4-環己二異氰酸酯、四曱基苯二曱基 二異氰酸酉旨(TMXDI,tetramethyl xylylene diisocyanate)、 1,6,11-十一烷三異氰酸酯、1,8-二異氰酸酯基-4-異氰酸甲酯 基辛烷、1,3,6-六亞曱基三異氰酸酯、聯環庚烷三異氰酸酯、 三曱基六亞甲基二異鼠酸S旨(TMDI,trimethyl hexamethylene diisocyanate)等或該等之衍生物,其中就黃變性小等方面而 言,更佳為 HDI、IPDI、H6-XDI、H12-MDI。 又,作為與上述聚異氰酸酯同時使用之多元醇,認為較佳 為作為多元醇之低結晶性者。具體可例示:聚己二酸乙二酯 099137434 14 201219512 (PEA,polyethylene adipate)、 聚己二酸丁二酯(PBA, Polybutylene adipate)、聚碳酸酯(PCD,polycarbonate)、聚 1,4-丁二醇(PTMG ’ polytetramethyleneglycol)、聚己内酯聚 酉旨(PCL,polycaprolactone polyester)、聚丙二醇(PPG, polypropylene glycol)等0 丙烯酸系樹脂係指具有(甲基)丙烯酸酯單位及/或(甲基) 丙烯酸單位作為構成單位之樹脂。亦可為如具有源自(曱基) 丙烯酸酯或(曱基)丙烯酸之衍生物之構成單位者。 此處,作為(甲基)丙烯酸酯單位,例如係指源自如下單體 之構成單位:(曱基)丙烯酸曱酯、(曱基)丙烯酸乙酯、(曱基) 丙烯酸正丙酯、(甲基)丙烯酸正丁酯、(曱基)丙烯酸第三丁 酉旨、(甲基)丙稀酸正己酷、(甲基)丙烯酸環己醋、(曱基)丙 烯酸2-乙基己酯、(曱基)丙烯酸苄酯、(曱基)丙烯酸二環戊 氧基乙酯、(曱基)丙烯酸二環戊酯、(曱基)丙烯酸氯甲酯、(曱 基)丙烯酸2-氣乙酯、(曱基)丙烯酸2-羥基乙酯、(甲基)丙烯 酸3-羥基丙酯、(甲基)丙烯酸2,3,4,5,6-五羥基己酯、(甲基) 丙稀酸2,3,4,5-四羥基戊酯、2_(羥基甲基)丙稀酸曱酯、2-(羥 基曱基)丙烯酸乙酯、2-(羥基乙基)丙烯酸曱酯等。 另一方面’作為(甲基)丙烯酸單位,例如係指源自如下單 體之構成單位:丙烯酸、曱基丙烯酸、丁烯酸、2-(羥基甲 基)丙烯酸、2-(羥基乙基)丙烯酸等。 作為聚酯樹脂’可使用通常已知之樹脂中之任一者。其製 4 099137434 15 201219512 造方法可列舉:藉由低分子二醇與多羧酸或其酯形成 物[酸酐、低級炫基(碳數1〜4)酯、酿齒化物等]之端八 而成者,或以低分子二醇作為起始劑將内酯單體開 ° 长來合而 成者等。又,使用該等之2種以上之混合物亦無妨。 (熱硬化型樹脂) 於本發明中,可使用已知之熱硬化性樹脂中之任—者。作 ^具體例,熱硬化性樹脂可選自朌樹脂、環氧樹脂、不飽和 小酉曰树,、異氰酸g旨化合物、三聚氰胺樹脂、腺樹脂、聚石夕 氧樹脂等。在此,對環氧樹脂與酚樹脂進行說明。 &lt; 一本《明之核氧樹脂具有改善塗臈之耐候性的效果。具體而 -作為%氧樹脂’可使用單環氧化合物、多環氧化合物中 之任一錢該等之混合物。此處,作為單環氧化合物,可列 /目尺甘油_、己基縮水甘油⑽、苯基縮水甘油謎、稀 四^/广甘對第二丁基笨基縮水甘油_、環氧乙炫、 氧、元對一甲苯基縮水甘油趟、乙酸縮水甘油醋、丁酸 、” =@日、己酸縮水甘油自旨、苯甲酸縮水甘油醋等。 作為夕%氧化合物,例如可例示:將雙酚Α、雙酚F、雙 又酚S、四甲基雙酚Α、四曱基雙酚F、四曱基雙 盼 ㈤曱基雙酚S、四溴雙酚A、四氣雙酚A、四氟雙 0等4類予以縮水甘油化而成之雙㈣環氧樹脂;將 ^本紛—搜基萘、9,9·雙(4省基苯基)料其他二酴類予 以縮水甘叙環氧樹脂;將 1,1,1-三(4-羥基苯基)曱 099137434 201219512 聋-舱相&amp; , 本基)+歹基乙基)苯基)亞乙基)雙酚 二甘油化而成之環氧樹脂;將⑽,* 、基本基)乙烷荨四酚類予 將苯齡祕料、㈣轉化W氧樹脂; 苯㈣藤清漆、漠化雙3八A W、雙紛Α祕清漆、漠化 水甘油化而成清漆等祕清漆類予以縮 縮水甘油化而成之環氧_衣賴脂等;將多元苯紛類予以 以縮水甘油化而成將甘油或聚乙二醇等多元醇予 酸1織蔡甲酸等絲環氧樹脂;將對經基苯甲 型環氧樹脂;將鄰苯-甲西夂予以縮水甘油化而成之_ 縮水甘油化而成之甲酸之類的多致酸予以 胺基苯盼等胺化合物’㈣一本甲说或間 油酯等胺创± 、、、7甘油化物或異尿氰酸三縮水甘 产?其 _脂等之縮水甘油型環氧樹脂,與认環氧 =基;Μ’氧環己甲酸酿㈣ 多環二_高_安定性之觀點而言,較佳為 產率罝&amp;㈣八聽合物巾,縮水甘油型環氧樹脂因生 屋旱具壓倒性優勢,故 優異之方_言,更#2\,就硬化物之接紐或耐熱性 環氧樹脂。更佳為類予以縮水甘油化而成之 縮水甘、、由h /、、 氧樹脂’尤佳為將雙盼A予以 而成之環氧樹^成之環氧樹脂與將雙^ F予以縮水甘油化 (之L乂佳為呈液狀者。再者,環氧當量較佳為 099137434 17 201219512 300以下。甚搭# 衣乳▲量係大於300之值, 體,電阻值料,並且於使_不^/核會變成固 作為熱硬·_===故而仏 :,甲燒系樹脂、她基::、__ 〈導電性提昇成分&gt; _曰專。 本發明之導電軸!·之最大特徵在於 亦添加作為導電性㈣成分之有機物。分以外, 少具有兩個叛基之二賴。藉由選擇添::5’可選擇至 二:包含經有機物被覆之_'”二 性糊貧於低溫進行熱處理,銀奈米粒子或=子 子亦會發生燒結,而形成表現出高⑽粒 酸關丙於:r電性提昇成分,可例示具有二^。之乙- 西夂丙—酸、丁二酸、戊二酸等。若構造中之合計石山紅、 則活性會降低且於低溫對包含銀奈米—或銀二 之導電性糊膏進行熱處理時,變得難以使銀奈米粒 = 微米粒子發生燒結,導致變得難以形成表現出高導電n 電膜。又’若使用碳數過高者’則所添加之物質本:會:導 燒結,或殘留於膜内,導致變得難以表現 曰抑制 欠佳。 电改’故而 更具體而言’作為二魏’構造中之合計碳數越 宜為碳數2〜8’較佳為2〜7,更佳為2〜5之範 ,子, 闺之二幾駿。 099137434 18 201219512 要上述成力相對於導電性糊膏之總重量為G 〇5〜2 〇 質量%即可,較佳為0,1〜1.5質量%之範圍。 關於導电|'生糊貫中所包含之二叛酸之量,例如可使用高效 液相層析儀(HpLc,mgh卩时㈣継^叫祝S 099137434 13 201219512 It is preferable to add an acrylic resin, a polyester resin or a polyamino phthalate resin as a well-known person, but it is not excluded to use other than those described in the present item having the above properties. Resin. The polyamino phthalate resin is not particularly limited as long as it is a commercially available thermoplastic amino phthalic acid vinegar resin. For example, a thermoplastic urethane resin obtained by polymerizing a polyol component and an organic polyisocyanate as essential components and using a chain extender or a terminator as an optional component can be mentioned. Here, examples of the polyisocyanate to be used include HDI 'hexamethylene diisocyanate, LDI ' lysine isocyanate, and isophorone diisocyanate (HDI ' hexamethylene diisocyanate). IPDI, isophorone diisocyanate), XDI, xylylene diisocyanate, hydrogenated benzodiazepine diisocyanate (H6-XDI), hydrogenated diphenyl diisocyanate (H12-MDI, Hn-methylene) Diphenyl diisocyanate), trans 1,4-cyclohexane diisocyanate, tetramethyl xylylene diisocyanate, 1,6,11-undecane triisocyanate, 1, 8-Diisocyanate-4-isocyanatomethyl octane, 1,3,6-hexa-indenyl triisocyanate, bicycloheptane triisocyanate, tridecyl hexamethylene diiso citrate (TMDI, trimethyl hexamethylene diisocyanate) or the like, and among them, HDI, IPDI, H6-XDI, H12-MDI are more preferable in terms of small yellow denaturation. Further, as the polyol to be used together with the above polyisocyanate, it is considered to be preferable as a low crystallinity of the polyol. Specifically, it can be exemplified: polyethylene adipate 099137434 14 201219512 (PEA, polyethylene adipate), polybutylene adipate (PBA), polycarbonate (PCD, polycarbonate), polytetradecene 0 (acrylic resin) such as PTMG 'polytetramethyleneglycol, polycaprolactone polyester, polypropylene glycol (PPG), etc. means having a (meth) acrylate unit and/or (A) Base) Acrylic unit as a constituent resin. It may also be a constituent unit such as a derivative derived from (fluorenyl) acrylate or (mercapto)acrylic acid. Here, the (meth) acrylate unit means, for example, a constituent unit derived from (meth) decyl acrylate, (mercapto) ethyl acrylate, (mercapto) n-propyl acrylate, ( N-butyl acrylate, n-butyl phthalate, (meth) acrylic acid, cyclohexyl acrylate, 2-ethylhexyl acrylate, Benzyl) benzyl acrylate, dicyclopentyloxyethyl (mercapto) acrylate, dicyclopentanyl (decyl) acrylate, chloromethyl (meth) acrylate, 2-oxoethyl (meth) acrylate, (mercapto) 2-hydroxyethyl acrylate, 3-hydroxypropyl (meth) acrylate, 2,3,4,5,6-pentahydroxyhexyl (meth) acrylate, (meth) acrylate 2 3,4,5-tetrahydroxypentyl ester, 2-(hydroxymethyl) acrylate decyl ester, 2-(hydroxyindenyl) acrylate ethyl ester, 2-(hydroxyethyl) decyl acrylate, and the like. On the other hand 'as a (meth)acrylic unit, for example, means a constituent unit derived from the following monomers: acrylic acid, mercaptoacrylic acid, crotonic acid, 2-(hydroxymethyl)acrylic acid, 2-(hydroxyethyl) Acrylic, etc. As the polyester resin, any of generally known resins can be used. The method for producing 4 099137434 15 201219512 can be exemplified by the formation of a low molecular diol and a polycarboxylic acid or an ester thereof [anhydride, a lower leuco (carbon number 1 to 4) ester, a brewing compound, etc.] Or the like, or a low molecular diol as a starting agent, the lactone monomer can be combined to form a long length. Further, it is also possible to use a mixture of two or more of these. (Thermosetting Resin) In the present invention, any of the known thermosetting resins can be used. As a specific example, the thermosetting resin may be selected from the group consisting of an anthracene resin, an epoxy resin, an unsaturated eucalyptus, an isocyanate compound, a melamine resin, a gland resin, a polyoxo resin, and the like. Here, the epoxy resin and the phenol resin will be described. &lt; A "Nuclear Oxygen Resin" has the effect of improving the weatherability of the coating. Specifically, as the % oxygen resin, a mixture of any of a monoepoxy compound and a polyepoxy compound may be used. Here, as a monoepoxy compound, glycerin _, hexyl glycidol (10), phenyl glycidol enigma, dilute four ^ / Guanggan to the second butyl styl glycidol, epoxy, Oxygen, n-p-tolyl glycidyl hydrazine, acetic acid glycidol vinegar, butyric acid, "@@日, hexanoic acid glycidol, benzoic acid glycidol vinegar, etc. As an oxime oxygen compound, for example, it is exemplified: Phenolphthalein, bisphenol F, bisphenol S, tetramethyl bisphenol quinone, tetradecyl bisphenol F, tetradecyl bis (5) decyl bisphenol S, tetrabromobisphenol A, tetra bisphenol A, Four (four) epoxy resins obtained by glycidylation of four types such as tetrafluorobis 0; the other two diterpenoids of the bismuth-septyl naphthalene, 9,9·bis (four provinces-based phenyl) Resin; diglycerolized 1,1,1-tris(4-hydroxyphenyl)fluorene 099137434 201219512 聋-cabin phase &amp;, benzyl) fluorenylethyl)phenyl)ethylidene bisphenol Epoxy resin; (10), *, basic base ethane quinone tetraphenols to benzene age secrets, (four) conversion W oxygen resin; benzene (four) vine varnish, desertification double 3 eight AW, double sputum secret varnish, Desertified water An epoxidized varnish such as varnish, which is obtained by shrinking condensed glycerin, such as lyophilized lyophilized glycerin, etc.; A silky epoxy resin such as zebraic acid; a polybasic acid such as formic acid which is obtained by glycidylating a phthalic acid-based epoxy resin; Benzene and other amine compounds '(4) an amine such as A or m-oil ester, ±,,, 7 glycerides or isocyanuric acid trihydrate, its glycidyl epoxy resin, etc. Oxygen = base; Μ 'oxocyclohexanoic acid brewed (iv) polycyclic di-high _ stability from the viewpoint of the preferred yield 罝 &amp; (four) eight listener towel, glycidyl epoxy resin due to the house It has an overwhelming advantage, so the excellent side _言,更#2\, the hardened joint or the heat-resistant epoxy resin. It is better to shrink the glycidylate into a class, by h /, The oxy-resin is especially suitable for the epoxy resin of the epoxy tree formed by the double-anti-A and the glycidation of the double-F (the L-good is Further, the epoxy equivalent is preferably 099137434 17 201219512 300 or less. Very good #衣乳 ▲ quantity is greater than 300, body, resistance value, and so that _ no ^ / nuclear will become solid as heat Hard _=== 故 仏 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲 甲In addition to the organic matter, there are two renegade bismuths. By selecting Tim::5' can be selected to two: containing the organic-coated _'" bismuth paste at low temperature for heat treatment, silver nanoparticles Or = the child will also be sintered, and the formation of high (10) granules is shown in the following: r electrical lifting component, which can be exemplified as having two. B - Cichong - acid, succinic acid, glutaric acid and so on. If the total amount of rock red is in the structure, the activity is lowered and when the conductive paste containing silver nano- or silver is heat-treated at a low temperature, it becomes difficult to cause the silver nanoparticle=microparticle to be sintered, resulting in difficulty in formation. Shows a highly conductive n-electrode film. In addition, if the amount of carbon used is too high, the substance added may be: sintered or left in the film, resulting in difficulty in performance and poor suppression. Electric change ', and more specifically' as the total number of carbon in the structure of the two Wei's is more suitable for carbon number 2~8' is preferably 2~7, more preferably 2~5, sub, 闺二Jun. 099137434 18 201219512 The total weight of the above-mentioned forming force with respect to the conductive paste is G 〇 5 〜 2 〇 by mass%, preferably in the range of 0, 1 to 1.5% by mass. Regarding the amount of the two kinds of oxic acid contained in the conductive|'s raw paste, for example, a high-performance liquid chromatography (HpLc, mgh卩 (4) 継 ^ 祝

Ch_atGgi;aphy)、聚合物系逆相層析儀進行綠認。 &lt;導電性糊膏之製造&gt; 依據本發明之導電性糊膏係如上所述般使祕由碳數2 〜8之有機物被覆銀奈来粒子之表面而成者來製造。此種構 成之銀*米粒子之製造方法並不受任何限制,例如可例示公 知之以上述範圍之碳數之有機物置換銀奈米粒子之表面之 方法。 亚且’於上述極性溶劑中添加銀奈米粒子與具有上述性質 之導電性提昇成分,以及視情形添加之分散劑。再者,此處 亦可合有銀次微米粒子。其後,導入至混練脫泡機而形成該 成分之混練物。其後,視情形進行機械分散處理而形成糊膏。 於上述機械性分散處理中,在不伴有銀粒子之顯著改質之 條件下,可採用公知之任一種方法。具體而言,可例示超音 波分散、分散機(disper)、三輥研磨機(three roll mill)、球磨 機(ball mill)、珠磨機(beads-mill)、兩軸捏合機(tW0-axis kneader)、自公轉式攪拌機等,該等可單獨使用,或可將多 種併用。 &lt;導電膜之評估&gt; 099137434 19 201219512 (印刷方法) 使用網版印刷機或金屬掩模’印刷所製作之導電性糊膏, 於锻燒後實施導電膜之評估。再者,關於實施例、比較例所 使用之糊膏’係以為了不產生污點等印刷+良而使黏度成為 30 Pa · s之方式製作’其調配量如表1〜表3中所記載。 (網版印刷) 使用膜厚34 /z m之網版’以線寬3〇〇 # m之圖案印刷至 聚對苯二甲酸乙二酯膜(Toray製造之Liimirror 75 S10)。將所 獲付之印刷基板置於瓜燒爐(Yamato Scientific公司製造之 DKM400)内’於大氣中且於120°C進行60分鐘之熱處理, 計算所得者之體積電阻率。 (金屬掩模印刷) 使用膜厚30 //m之金屬掩模’以1〇 mm□之圖案實體印 刷至氧化鋁上。將所獲得之印刷基板置於煅燒爐(Yamato Scientific公司製造之DKM400)内,於大氣中且於120°C進 行60分鐘之熱處理,計算所得者之體積電阻率。 &lt;體積電阻率之計算&gt; (配線) 利用二端子型電阻率計(曰置電機股份有限公司製造之 3540 Milliohm HiTESTER)測定藉由網版印刷而形成於基板 上之配線之線電阻,並利用表面粗度計(東京精密股份有限 公司製造之Surfcom 1500D型)測定導電膜之厚度而算出。 099137434 20 201219512 最終根據以下之式(1)算出配線之體積電阻率。 體積電阻率(// Ω · cm)=實測電阻(Ω)Χ膜厚(/z m)x線寬〇 m)+線長(/zm)xl02 _··(1) (實體膜) 利用金屬掩模印刷至基板上,利用四端子型電阻率計(三 菱化學股份有限公司製造之Loresta GP MCP-T610型)測定 所形成之10 mm□圖案之導電膜之表面電阻,並利用表面粗 度計(東京精密股份有限公司製造之Surfcom 1500D型)測定 導電膜之厚度而算出。最終根據式(2)算出10 mm□圖案之 實體膜之體積電阻率。 體積電阻率(//Ω · cm)=表面電阻(0/□)&gt;&lt;膜厚(/zm)xl00 …(2) &lt;色差&gt; 將糊膏以縱2.0〜2.5 cm、橫1.5〜2.0 cm實體印刷至玻璃 基板(EAGLE XG)上,將該糊膏於大氣中且於120°C烺燒60 分鐘而形成膜,並測定所得之膜的表色。再者,色差測定係 使用色差測定裝置(日本電色工業股份有限公司製造之 SQ-2000)而進行。測定結果係以L*a*b*表色系來記述。尤 其是本發明之糊膏之特徵在於藉由L*a*b*表色系表示時之 a*值,當未添加包含二缓酸之添加物時,該值變得高於2.0, 於已添加之情形時則顯示2.0以下之值。 即,於a*值高於2.0之情形時,導電膜之電阻顯示極高 099137434 21 201219512 值’於低於2.0之情形時導電膜之電阻低。即,於本發明中, 於使已完成之導電膜含有二缓酸而製成導電性優異之導電 膜時,可根據導電膜之色調進行判斷。 (因煅燒所造成之結晶成長性評估) 將糊膏於銅赫爾槽板上印刷1 〇 m m □之圖案,將該物膏於 120°C煅燒60分鐘而形成膜,並對該膜進行χ射線繞射測 定’藉此測定結晶子徑並確認結晶之成長程度。再者,此時 係使用X射線繞射裝置(RIGAKU股份有限公司製造之 RINT-2100)而進行。燈管係使用鈷燈管,以燈管電壓kV 燈管電流30 mA進行測定。結晶子之成長程度之計算係比 較結晶子徑之大小。尤其由於係在Ag(lll)之繞射面進行, 因此以2Θ =40〜50°之範圍(掃描速度:〇.167。/分鐘)進行則 定。再者,結晶子徑係藉由謝樂(Scherrer)法而算出。 [實施例] 首先,對表1中所記載之使用銀奈米粒子之例子進行說 明。 &lt;實施例1&gt; (銀奈米粒子之合成例) 揭示製造經己二細酸被覆之銀奈米粒子的例子’作為實施 例中所示之粒子之製作例。於500 mL燒杯中,使硝酸銀(東 洋化學股份有限公司製造)13.4 g溶解於純水72·1 g中,製 作銀溶液。 099137434 22 201219512 、、麈而將1.34 L之純水倒人5乙之燒杯中,並通入氮氣3〇 刀知藉此去除溶氧,同時使其升溫至6(TC。添加己二稀 酋夂(和光純m股份有限公司製造)n 9 g。其後添加观Ch_atGgi; aphy), polymer-based reverse phase chromatography for green recognition. &lt;Production of Conductive Paste&gt; The conductive paste according to the present invention is produced by coating the surface of silver nanoparticles with an organic substance having a carbon number of 2 to 8 as described above. The method for producing the silver * rice particles of such a composition is not limited in any way. For example, a method of replacing the surface of the silver nanoparticles with a carbon having a carbon number in the above range can be exemplified. Further, silver nano particles and a conductivity-enhancing component having the above properties and a dispersing agent added as the case may be added to the above polar solvent. Furthermore, silver submicron particles may also be incorporated herein. Thereafter, it is introduced into a kneading defoaming machine to form a kneaded material of the component. Thereafter, mechanical dispersion treatment is performed as the case may be to form a paste. In the above mechanical dispersion treatment, any of the known methods can be employed without the significant modification of the silver particles. Specifically, an ultrasonic dispersion, a disper, a three roll mill, a ball mill, a beads-mill, and a two-axis kneader can be exemplified (tW0-axis kneader) ), self-propelled mixers, etc., which may be used alone or in combination. &lt;Evaluation of Conductive Film&gt; 099137434 19 201219512 (Printing method) The conductive paste prepared by printing with a screen printing machine or a metal mask was subjected to evaluation of the conductive film after calcination. In addition, the pastes used in the examples and the comparative examples were produced so as to have a viscosity of 30 Pa · s in order to prevent the occurrence of stains such as stains, and the blending amounts are as shown in Tables 1 to 3. (Screen printing) A screen having a film thickness of 34 /z m was printed on a polyethylene terephthalate film (Liimirror 75 S10 manufactured by Toray) in a line width of 3 〇〇 #m. The obtained printed substrate was placed in a melon burner (DKM400 manufactured by Yamato Scientific Co., Ltd.) and heat-treated at 120 ° C for 60 minutes in the atmosphere to calculate the volume resistivity of the obtained product. (Metal mask printing) A metal mask of a film thickness of 30 //m was used to physically print onto the alumina in a pattern of 1 mm. The obtained printed substrate was placed in a calciner (DKM400 manufactured by Yamato Scientific Co., Ltd.), and heat-treated at 120 ° C for 60 minutes in the air to calculate the volume resistivity of the resultant. &lt;Calculation of Volume Resistivity&gt; (Wiring) The wire resistance of the wiring formed on the substrate by screen printing was measured using a two-terminal type resistivity meter (3540 Milliohm HiTESTER manufactured by Konica Electric Co., Ltd.), and The thickness of the conductive film was measured by a surface roughness meter (Surfcom 1500D model manufactured by Tokyo Seimitsu Co., Ltd.). 099137434 20 201219512 Finally, the volume resistivity of the wiring is calculated according to the following formula (1). Volume resistivity (// Ω · cm) = measured resistance (Ω) Χ film thickness (/zm) x line width 〇 m) + line length (/zm) xl02 _··(1) (solid film) The mold was printed on the substrate, and the surface resistance of the formed 10 mm □ pattern of the conductive film was measured by a four-terminal type resistivity meter (Loresta GP MCP-T610 type manufactured by Mitsubishi Chemical Corporation), and the surface roughness meter was used ( The thickness of the conductive film was calculated by measuring the thickness of the conductive film by the Surfcom 1500D model manufactured by Tokyo Precision Co., Ltd. Finally, the volume resistivity of the solid film of the 10 mm □ pattern was calculated according to the formula (2). Volume resistivity (//Ω · cm) = surface resistance (0/□) &gt;&lt; Film thickness (/zm) xl00 (2) &lt;Color difference&gt; The paste was 2.0 to 2.5 cm in length and 1.5 in width. The ~2.0 cm body was printed on a glass substrate (EAGLE XG), and the paste was baked in the air at 120 ° C for 60 minutes to form a film, and the color of the obtained film was measured. Further, the color difference measurement was carried out using a color difference measuring device (SQ-2000 manufactured by Nippon Denshoku Industries Co., Ltd.). The measurement results are described by the L*a*b* color system. In particular, the paste of the present invention is characterized by the a* value when represented by the L*a*b* color system, and when the additive containing the dibasic acid is not added, the value becomes higher than 2.0. In the case of adding, a value of 2.0 or less is displayed. That is, when the a* value is higher than 2.0, the electric resistance of the electroconductive film is extremely high. 099137434 21 201219512 The value 'below the case where the electric resistance of the electroconductive film is lower than 2.0. In other words, in the present invention, when the completed conductive film contains a dilute acid to form a conductive film having excellent conductivity, it can be judged based on the color tone of the conductive film. (Evaluation of crystal growth due to calcination) A paste of 1 〇mm □ was printed on a copper hull plate, and the paste was calcined at 120 ° C for 60 minutes to form a film, and the film was kneaded. The ray diffraction measurement 'determines the crystal seed diameter and confirms the degree of crystal growth. In this case, the X-ray diffraction apparatus (RINT-2100 manufactured by RIGAKU Co., Ltd.) was used. The lamp tube was measured using a cobalt lamp tube at a lamp tube voltage of kV and a lamp current of 30 mA. The degree of growth of the crystallizer is calculated as the diameter of the crystallizer. In particular, since it is carried out on the diffraction surface of Ag (lll), it is determined in the range of 2 Θ = 40 to 50 ° (scanning speed: 167. 167 / min). Further, the crystal seed diameter was calculated by the Scherrer method. [Examples] First, an example of using silver nanoparticles described in Table 1 will be described. &lt;Example 1&gt; (Synthesis Example of Silver Nanoparticles) An example of producing silver nanoparticles coated with adipic acid was disclosed as a production example of the particles shown in the examples. In a 500 mL beaker, 13.4 g of silver nitrate (manufactured by Toyo Chemical Co., Ltd.) was dissolved in 72.1 g of pure water to prepare a silver solution. 099137434 22 201219512 ,, and 1.34 L of pure water was poured into a 5 B beaker, and a nitrogen gas was introduced to remove dissolved oxygen, and the temperature was raised to 6 (TC. Adding hexahydrate 夂(made by Heguang Pure M Co., Ltd.) n 9 g.

之氨水(和光純藥工業股份有限公司製造)2 82 g以調整pH 值藉由添加該氨水,使反應開始。對其進行攪拌,同時於 反應開始5分鐘後添加水合肼(純度8〇%/大塚化學股份有限 公司製造)5.96 g。 於反應開始9分鐘後’添加銀減使其反應。其後進行 30刀釦热成,而形成經己二烯酸被覆之銀奈米粒子。其後 用No5C之濾紙進行過濾,並用純水洗淨,獲得銀奈米粒子 凝聚體。藉由真空乾燥機於大氣中、8〇ΐ、12小時之條件 下將忒凝聚體乾燥,獲得銀奈米粒子乾燥粉末之凝聚體。如 此而後知之凝聚體適宜使用例如藉由置換粒子表面之有機 物,或直接利用與上述相同之方法而獲得者。 (導電性糊膏之製作) 分別添加所獲得之己二烯酸被覆銀奈米粒子凝聚體乾燥 叙末(平均粒徑:100nm)70g、丁基卡必醇乙酸酯(和光純藥 股份有限公司製造)8.9 g、熱可塑性聚胺基曱酸酯樹脂 Urearno 8001(荒川化學工業股份有限公司製造)22 3 g、高分 子糸顏料分散劑 Ajisper PA-111 (Ajinomoto Fine-Techno 股份 有限公司製造)0.35 g、丙二酸(和光純藥股份有限公司製 造)0.14 g並進行混合。 £ 099137434 23 201219512 藉由利用二研磨機(EXAKT Apparatebaus公司勢生 M-80S型)使如此所獲得之混合物通過5次而製作缘本 ^ 性糊 貧。將所獲得之導電性糊膏印刷至基板上,以 C、60 分在里之條件(以下稱為「120 C 60分鐘」)進行加熱處理而开〃 成導電膜。所獲得之導電膜之體積電阻率於12〇它6〇分鐘之 處理下為24 // Ω · cm。 上述藉由X射線繞射測得之結晶子徑為37.65 nm。7 所獲得之煅燒膜呈略微夾雜有黃色之顏色,於利用色差計求 出膜之表色後,L*為60.9,a*為1.04,b*為9.3。進而,於 利用 SEM(Scanning Electron Microscope,掃描式電子顯微 鏡)觀察锻燒膜之形態後,確認如圖3中所示之形態。圖3 係300,000倍之SEM照片,照片中之i刻度相當於1以瓜。 由該照片可知,起初呈粒子狀之塊狀物每2至3個發生炫接 而形成一個。由此可確認,即使採用120°C之低溫,亦並非 保持一次粒子之形態,而是發生粒成長。 &lt;比較例1&gt; 除了於實施例1中不添加作為添加劑之丙二酸以外,重複 進行實施例1。將所獲得之煅燒膜之物性示於表1。 藉由X射線測得之結晶子徑為29.90 nm。又,所獲得之 好又燒膜呈略微夾雜有紅色之顏色,於利用色差計求出膜之表 色後’ L*為63.5,a*為4.04,b*為4.1。進而,於利用Sem 觀察煅燒膜之形態後,確認如圖4中所示之形態。圖4係與 099137434 24 201219512 圓3為相同倍率之照片,照片t之1刻度相當於! p。於 圖^ ’與圖3進行比較可確認:微細之粒子㈣其肩本之 由此可知由於採用12叱之低溫,因此微細之粒子Ammonia water (manufactured by Wako Pure Chemical Industries, Ltd.) 2 82 g to adjust the pH by adding the ammonia water to start the reaction. This was stirred while adding hydrazine hydrate (purity of 8% by weight / manufactured by Otsuka Chemical Co., Ltd.) to 5.96 g after 5 minutes from the start of the reaction. After 9 minutes from the start of the reaction, silver was added to reduce the reaction. Thereafter, 30 knives were thermally formed to form silver nanoparticle coated with hexadienoic acid. Thereafter, it was filtered with No5C filter paper and washed with pure water to obtain silver nanoparticle aggregates. The ruthenium agglomerates were dried in a vacuum dryer under the conditions of 8 Torr and 12 hours to obtain agglomerates of dry powder of silver nanoparticles. The agglomerates thus known are suitably obtained by, for example, replacing the organic matter on the surface of the particles or directly using the same method as described above. (Production of conductive paste) 70 g of dried hexadienoic acid-coated silver nanoparticles particle aggregates (average particle diameter: 100 nm) and butyl carbitol acetate (manufactured by Wako Pure Chemical Co., Ltd.) 8.9 g, thermoplastic polyurethane phthalate resin Urearno 8001 (manufactured by Arakawa Chemical Industry Co., Ltd.) 22 3 g, polymer 糸 pigment dispersant Ajisper PA-111 (manufactured by Ajinomoto Fine-Techno Co., Ltd.) 0.35 g, Malonic acid (manufactured by Wako Pure Chemical Co., Ltd.) was 0.14 g and mixed. £ 099137434 23 201219512 By using a two-grinding machine (EXAKT Apparatebaus, M-80S type), the mixture thus obtained is passed 5 times to make a poor paste. The obtained conductive paste was printed on a substrate, and heat-treated at a temperature of C and 60 (hereinafter referred to as "120 C for 60 minutes") to form a conductive film. The volume resistivity of the obtained conductive film was 24 // Ω · cm under the treatment of 12 〇 for 6 〇. The above crystal diameter measured by X-ray diffraction is 37.65 nm. 7 The calcined film obtained was slightly mixed with a yellow color. After the color of the film was determined by a color difference meter, L* was 60.9, a* was 1.04, and b* was 9.3. Further, after observing the morphology of the calcined film by SEM (Scanning Electron Microscope), the morphology as shown in Fig. 3 was confirmed. Figure 3 is a 300,000-fold SEM photograph in which the i scale is equivalent to 1 melon. As can be seen from the photograph, the block which is initially in the form of particles is spliced every two to three to form one. From this, it was confirmed that even if a low temperature of 120 ° C was used, the morphology of the primary particles was not maintained, but grain growth occurred. &lt;Comparative Example 1&gt; Example 1 was repeated except that malonic acid as an additive was not added in Example 1. The physical properties of the obtained calcined film are shown in Table 1. The crystallite diameter measured by X-ray was 29.90 nm. Further, the obtained film was slightly mixed with a red color, and after obtaining the color of the film by a color difference meter, 'L* was 63.5, a* was 4.04, and b* was 4.1. Further, after observing the morphology of the calcined film by Sem, the morphology as shown in Fig. 4 was confirmed. Fig. 4 is a photograph of the same magnification as 099137434 24 201219512, and the scale of the photo t is equivalent to! p. Comparing Fig. 2' with Fig. 3, it can be confirmed that the fine particles (4) have their shoulders. It can be seen that the fine particles are used because of the low temperature of 12 叱.

保持其原本之形離,B 〜、且粒成長未如之前般進行。 &lt;實施例2〜5 &gt; 除了於實施例1中,改變作為 如L·所、&amp; 义作為添加劑之丙二酸之添加量且 述進灯黏度調整而設成如 用盥眚絲办丨η 衣1所不之調配量以外,使 用與只鈿们相同之方法製成 里 將所獲得之锻制^物㈣於表a _霄,並製成锻燒膜。 關於實施例i〜5,將添加劑 日 之被覆劑存在量的比、和體積霓%加量與被覆奈米銀粒子 1中,縱軸為體積電阻率(以Ω•且率之關係示於圖1。於圖 劑量(質量比)。該值亦示於表i /) ’杈軸為添加劑量/被覆 量相對於被覆劑量之比例超過纟圖1可知,若添加劑 (36 //Ω · cm以下)且安定。S則體積電阻率為極低值 再者,圖1之添加劑之添加薏奂、 存在量之比可表示為存在量tb=覆奈米銀粒子之被覆劑 米粒子添加量(g)x奈米銀粒子中加^之添加量(g)/(銀奈 銀奈米粒子之被覆劑構成比例,^t破覆劑構成比例)。所謂 出之有機物比例,可表示為被復齊私精由上述灰分測定而算 後之殘留重量(g)/供於灰分處埋冓成比例1〜(灰分處理 就具體數值而言,實施例i t 4樣重量(g))° 099137434 覆劑構成比例為0.00 137434 . \低 201219512 據藉由灰分測定而算出之金屬比例= 99.2%而算出)。再者, 實施例2〜5中,由於所使用之奈米銀粒子之金屬比例為 99.2%,因此被覆劑比例為0.008。 &lt;實施例6〜8&gt; 除了於實施例1中,將構成導電性糊膏之銀奈米粒子之種 類改變為表1所示者以外,重複進行實施例1之方法。再者, 樹脂等之構成比不同的原因在於如上所述進行了黏度調 整。將所獲得之锻燒膜之物性示於表1。 &lt;實施例9〜10&gt; 除了於實施例1中,將銀奈米粒子之調配量改變為表1 所示者以外,重複進行實施例1之方法。將所獲得之煅燒膜 之物性示於表1。 &lt;實施例11〜12、比較例2〜3 &gt; 除了改變實施例1中所添加之添加劑之種類以外,重複進 行實施例1。將所獲得之煅燒膜之物性示於表1。 099137434 26 201219512 【I &lt;〕 比較例 3 〇 〇 I \ 1 1 I 1 2 ο 1 «ο CN 〇 CO (N fS 卜 Π ο oo o 比較例 2 〇 〇 I 1 1 1 I 寸 ο 1 1 CN 〇 cn &lt;N &lt;N &lt;〇 od m ο oo o 實施例 12 〇 〇 I 1 1 寸 ο &gt;〇 ο cn &lt;N &lt;N CO m ο 00 實施例 11 〇 〇 I 1 1 1 寸 ο t i〇 CN ο CN (N n oo to Ο oo 實施例 10 〇 jn I 1 \ V*) o 1 IT) rj ο 寸 CO r- vd Ρ; ο a\ 實施例 9 〇 I 1 \ cn o 1 \ 1 1 w-i o 寸 as ΓΛ ο Γ Η 穿 1實施例 8 1 I 1 o o o ι 1 1 1 (N o m &lt;N ιη η ο as CN U-) CO 實施例 7 1 I o o l o I 1 1 1 o r*i &lt;N 卜 oo «ο m Ο 〇 CN oo tr&gt; 實施例 6 t ο ο 卜 1 1 oo o 1 1 1 o CN CS od ιτ&gt; ΓΛ Ο r-&gt; (N 比較例 1 1 ο ο 1 t 1 1 ι ! 1 1 o ίΛ (N (S m ΙΤ) cn Ο CC; 〇 實施例 5 ο ο 1 1 1 s ι 1 ι 1 oo oo “ m oi (N ON od m ο 卜 CN v〇 m 實施例 4 ο ο I 1 1 'SO in o I 1 1 1 o rn CN ON OO ο 卜 〇〇 (N 實施例 3 ο ο 1 1 1 g o 1 1 1 1 cn o r4 (N n OO ο 寸 CN 〇 實施例 2 ο ο 1 1 1 o 1 1 1 1 沄 CN m CN ίΜ r- &lt;Τ) tn ο &lt;N so m 實施例 1 ο ο 1 1 1 2] o i 1 1 1 IT) cs o (N (N On CO ΓΛ ο cn S 1球狀ι 球狀ι I球狀| [球狀 丙二酸 戍二酸 壬二酸 乳酸 二甘醇酸 ♦j w 4 nfii Urearno 8001 (聚胺基曱酸酯樹脂) BCA (丁基卡必醇乙酸酯) I ϋ B s o G 100 nm 60 nm | 20 nm 100 nm rO敦 Vd rO 丁酸 銀粒子量(g) 添加劑量(g) φί 畐 1 樹脂量(g) 溶劑量(g) 分散劑量(g) 膜厚 體積電阻率 踩ra喝Φ St $ ^&quot;改碟电妮阐Mil a,桕啭-Ji〇※ LZ K 寸 A-660 s 201219512 由於確認添加並不依存於粒徑,因此亦對應用於粒徑更大 之粒子之情形進行了確認。 &lt;實施例13&gt; 除了於實施例1中,使用己二烯酸被覆銀片狀粉(平均粒 徑:3 Am),且設為表1中所記載之調配量以外,與實施 例1同樣地製成導電性糊膏,將所獲得之烺燒膜之物性示於 表2。 &lt;實施例14&gt; 除了於實施例13中,將丙二酸添加量減少至表2中所示 之量以外,重複進行實施例13。將所獲得之烺燒膜之物性 示於表2。可知雖然電阻略高,但亦可形成導電膜。 &lt;比較例4 &gt; 除了於實施例13中未添加丙二酸以外,重複進行實施例 13。將所獲得之锻燒膜之物性示於表2。可知若不添加丙二 酸,則完全無法獲得導電性。 &lt;比較例5 &gt; 除了於實施例13中,將所使用之銀片狀粉換為經油酸(碳 數18)被覆者以外,重複進行實施例11。將所獲得之煅燒膜 之物性示於表2。可知即使添加作為燒結促進劑之丙二酸, 若使用形成長鏈之油酸,則完全無法獲得導電性。 &lt;實施例15&gt; 為了確認於奈米粒子與微米粒子之混合狀態下是否亦可 099137434 28 201219512 獲得相同之效果,而將實施例13中之一半量之片狀粉體換 為實施例1中所使用之經己二烯酸被覆之銀奈米粒子以 外,重複進行實施例13。將所獲得之煅燒膜之物性示於表 2。確認可形成電阻低於實施例13之導電膜。 S. 099137434 29 201219512 【&lt;Ν&lt;〕 實施例15 in m m ro 1 0.14 0.44 22.3 0.35 oo CN oo 比較例5 1 1 ο 1_0.14 1 oi 22.3 CN 0.35 1 r- &lt;N pi 〇 |比較例4 1 ο ο 22.3 VO 0.35 1 oo CN Pi 〇 實施例14 1 ο 1 0.02 0.25 22.3 oi 0.35 1 OO CN 204 實施例13 1 ο 1 丨0.14」 r4 22.3 rn 0.35 1 m G\ m 球狀 片狀 片狀 丙二酸 丨量/銀粒子被覆劑量 Ureamo 8001 (聚胺基曱酸酯樹脂) BCA (丁基卡必醇乙酸酯) Ajisper PA111 βτη μ Ω · cm 100 nm 3 βΤΆ 3 βϊη 1 己二烯酸 1_ 油酸 銀粒子量(g) 添加劑量(g) 樹脂量(g) 1 1 溶劑量(g) 分散劑量(g) 膜厚 體積電阻率 調配成分 評估 祝蓀丧碟vi砸^M铖'κ唞'ao※ 0£ 17£?ει660 201219512 為了顯示本效果並非僅表現於特定樹脂的性質,而揭示將 樹脂種類改變為各種類的例子。再者,該等之體積電阻值係 與圖2進行比較而表示。 &lt;實施例16、比較例6 &gt; 除了將實施例1中之樹脂(熱可塑性聚胺基甲酸酯樹脂 Urearno 8001)量變為表3中所示之份量以外,重複進行實施 例1。又,比較例6係於實施例16中未添加丙二酸之情形 之結果。如表3中所記載,可知藉由添加丙二酸,導電性會 大幅度優化。 &lt;實施例17、比較例7&gt; 除了使用實施例1中之樹脂(熱可塑性聚酯樹脂Vylon 500/東洋紡股份有限公司製造),並變為表3中所示之份量 以外,重複進行實施例1。又,比較例7係於實施例17中 未添加丙二酸之情形之結果。如表3所記載,可知藉由添加 丙二酸,導電性會大幅度優化。 &lt;實施例18、比較例8 &gt; 除了使用實施例1中之樹脂(熱可塑性丙烯酸系樹脂 BR-102/三菱麗陽股份有限公司製造),並變為表3中所示之 份量以外,重複進行實施例1。又,比較例8係於實施例18 中未添加丙二酸之情形之結果。如表3所記載,可知藉由添 加丙二酸,導電性會大幅度優化。 &lt;實施例19、比較例9 &gt; S. 099137434 31 201219512 除了使用實施例1中 PL4348/群榮化學 化性酚樹脂Re— 份量以外,重複進 ^文為表3中所不之 中未添加丙二酸,比較例9係於實施例19 加丙一咏 情形之結果。如表3所記載,可知夢由添 加丙一酸,導電性會大幅度優化。 戟了矣猎由添 〈實施例20、比較例1〇&gt; 示了使用只施例】令之樹 三菱化學股份右pp U、、史化丨生%虱樹脂828XA/ 外,重複進行實施〇 支為表3令所示之份量以 添加丙二酸之_ , 1又,比較例10係於實施例20中未 文之〖月开〉之結果。如 二酸,導電性會大巾5产件 所圯載,可知藉由添加丙 &lt;實施例21 &gt; 除了於實施例1中 類與添加量改變為如表1成導電性糊膏之銀奈米粒子之種 如表3所示者以外,所不者,且將樹脂之添加量改變為 之物性示於表3。重規進行實施例卜將所獲得之锻燒膜 又’於實施例16〜2〇 脂與體積電阻率之關&lt; 二、比較例6〜10中,將所使用之樹 cm),橫軸表示樹月t.人示於圖2。縱軸為體積電阻率(//Ω · 電阻值過高而無法則^種颁。於以黑條表示之實施例中,將 為1⑻〇 、'定者於表3表示為「〇R」,圖2中係設 其差異顯著。 兩二酸之本發明為數十//Ω· cm, 099137434 32 201219512 一i ^ ^ ss πKeeping its original shape, B ~, and grain growth did not proceed as before. &lt;Examples 2 to 5 &gt; In addition to Example 1, the amount of malonic acid added as an additive such as L·, &amp; is changed, and the adjustment of the viscosity of the lamp is set to be performed by using a silk thread. In addition to the amount of the 丨 1 1 , , , , , 。 。 。 。 。 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻 锻In the examples i to 5, the ratio of the amount of the additive to the additive on the day of the additive, and the amount of the vol% of the amount of the coating were compared with those of the coated nano silver particle 1, and the vertical axis represents the volume resistivity (in terms of Ω•the ratio). 1. In the figure dose (mass ratio). This value is also shown in Table i /) '杈 axis is the amount of additive / the amount of coating relative to the coated dose is more than 纟 Figure 1 can be seen, if the additive (36 / Ω · cm below ) and stability. S, the volume resistivity is extremely low. Furthermore, the ratio of the added enthalpy and the amount of the additive of Fig. 1 can be expressed as the amount of tb = the coating amount of the nanoparticle of the nanoparticle silver particles (g) x nm The amount of addition of silver particles (g) / (the proportion of the coating agent of the silvery silver nanoparticles), and the ratio of the composition of the breaker. The ratio of the organic matter can be expressed as the residual weight (g) calculated by the above ash measurement and the ratio of the residual ash to the ash content is 1 to 1 (the ash treatment is specific value, the example is 4 weight (g)) ° 099137434 The composition ratio of the coating is 0.00137434. \Low 201219512 Calculated based on the metal ratio calculated by ash measurement = 99.2%). Further, in Examples 2 to 5, since the metal ratio of the nano silver particles used was 99.2%, the proportion of the coating agent was 0.008. &lt;Examples 6 to 8&gt; The method of Example 1 was repeated except that the type of the silver nanoparticles constituting the conductive paste was changed to those shown in Table 1 in Example 1. Further, the reason why the composition ratio of the resin or the like is different is that the viscosity adjustment is performed as described above. The physical properties of the obtained calcined film are shown in Table 1. &lt;Examples 9 to 10&gt; The method of Example 1 was repeated except that in Example 1, the amount of silver nanoparticles was changed to those shown in Table 1. The physical properties of the obtained calcined film are shown in Table 1. &lt;Examples 11 to 12, Comparative Examples 2 to 3 &gt; Example 1 was repeated except that the kind of the additive added in Example 1 was changed. The physical properties of the obtained calcined film are shown in Table 1. 099137434 26 201219512 [I &lt;] Comparative Example 3 〇〇I \ 1 1 I 1 2 ο 1 «ο CN 〇CO (N fS Π ο oo o Comparative Example 2 〇〇I 1 1 1 I inch ο 1 1 CN 〇cn &lt;N &lt;N &lt;〇od m ο oo o Example 12 〇〇I 1 1 inch ο &gt;〇ο cn &lt;N &lt;N CO m ο 00 Example 11 〇〇I 1 1 1 Οο ti〇CN ο CN (N n oo to Ο oo embodiment 10 〇jn I 1 \ V*) o 1 IT) rj ο inch CO r- vd Ρ; ο a\ Example 9 〇I 1 \ cn o 1 \ 1 1 wi o inch as ΓΛ ο Γ Η wear 1 embodiment 8 1 I 1 ooo ι 1 1 1 (N om &lt;N ιη η ο as CN U-) CO Example 7 1 I oolo I 1 1 1 Or*i &lt;N 卜 «ο m Ο 〇CN oo tr&gt; Example 6 t ο ο 卜 1 1 oo o 1 1 1 o CN CS od ιτ&gt; ΓΛ Ο r-&gt; (N Comparative Example 1 1 ο ο 1 t 1 1 ι ! 1 1 o Λ (N (S m ΙΤ) cn Ο CC; 〇 Example 5 ο ο 1 1 1 s ι 1 ι 1 oo oo “ m oi (N ON od m ο 卜 CN v 〇m Embodiment 4 ο ο I 1 1 'SO in o I 1 1 1 o rn CN ON OO ο 〇〇 (N Example 3 ο ο 1 1 1 go 1 1 1 1 cn o r4 (N n OO ο CN CN 〇 Embodiment 2 ο ο 1 1 1 o 1 1 1 1 沄CN m CN ίΜ r- &lt;Τ) tn ο &lt;N so m Embodiment 1 ο ο 1 1 1 2] oi 1 1 1 IT) cs o (N (N On CO ΓΛ ο cn S 1 globular ι spherical ι I Sphere | [Spherical malonate azelaic acid diacid lactic acid diglycol ♦ jw 4 nfii Urearno 8001 (poly Amino phthalate resin) BCA (butyl carbitol acetate) I ϋ B so G 100 nm 60 nm | 20 nm 100 nm rO Dun Vd rO silver butyrate particle amount (g) Adding dose (g) φί畐1 Resin amount (g) Solvent amount (g) Dispersed dose (g) Film thickness Volume resistivity step on ra drink Φ St $ ^&quot;Change disc Dini explain Mil a, 桕啭-Ji〇※ LZ K inch A- 660 s 201219512 Since it was confirmed that the addition did not depend on the particle size, it was also confirmed for the case of particles having a larger particle size. &lt;Example 13&gt; The same procedure as in Example 1 was carried out except that the hexadienoic acid-coated silver flake powder (average particle diameter: 3 Am) was used in Example 1, and the blending amount described in Table 1 was used. The conductive paste was shown in Table 2 for the physical properties of the obtained calcined film. &lt;Example 14&gt; Except that in Example 13, the amount of malonic acid added was reduced to the amount shown in Table 2, and Example 13 was repeated. The physical properties of the obtained calcined film are shown in Table 2. It is understood that although the electrical resistance is slightly higher, a conductive film can also be formed. &lt;Comparative Example 4 &gt; Example 13 was repeated except that malonic acid was not added in Example 13. The physical properties of the obtained calcined film are shown in Table 2. It is understood that if malonic acid is not added, conductivity is not obtained at all. &lt;Comparative Example 5 &gt; Example 11 was repeated except that the silver flake powder used was changed to the oleic acid (carbon number 18) coating in Example 13. The physical properties of the obtained calcined film are shown in Table 2. It is understood that even if malonic acid as a sintering accelerator is added, if oleic acid forming a long chain is used, conductivity cannot be obtained at all. &lt;Example 15&gt; In order to confirm whether or not the same effect can be obtained in the mixed state of the nanoparticle and the microparticle, 099137434 28 201219512, one half of the flake powder in Example 13 is replaced with the first embodiment. Example 13 was repeated except for the hexadienoic acid-coated silver nanoparticles used. The physical properties of the obtained calcined film are shown in Table 2. It was confirmed that a conductive film having a lower electric resistance than that of Example 13 was formed. S. 099137434 29 201219512 [&lt;Ν&lt;] Example 15 in mm ro 1 0.14 0.44 22.3 0.35 oo CN oo Comparative Example 5 1 1 ο 1_0.14 1 oi 22.3 CN 0.35 1 r- &lt;N pi 〇|Comparative Example 4 1 ο ο 22.3 VO 0.35 1 oo CN Pi 〇 Example 14 1 ο 1 0.02 0.25 22.3 oi 0.35 1 OO CN 204 Example 13 1 ο 1 丨 0.14” r4 22.3 rn 0.35 1 m G\ m Spherical piece Amount of bismuth malonate / silver particle coating dose Ureamo 8001 (polyamine phthalate resin) BCA (butyl carbitol acetate) Ajisper PA111 βτη μ Ω · cm 100 nm 3 βΤΆ 3 βϊη 1 hexadienoic acid 1_ oil Amount of silver acid particles (g) Adding dose (g) Amount of resin (g) 1 1 Solvent amount (g) Dispersing amount (g) Thickness and volume resistivity of the compounding composition evaluation wishing a dish vi砸^M铖'κ唞' Ao* 0£17£?ει660 201219512 In order to show that the effect is not only expressed in the properties of a specific resin, an example in which the type of the resin is changed to various types is disclosed. Further, these volume resistance values are shown in comparison with Fig. 2 . &lt;Example 16 and Comparative Example 6&gt; Example 1 was repeated except that the amount of the resin (thermoplastic urethane resin Urearno 8001) in Example 1 was changed to the amount shown in Table 3. Further, Comparative Example 6 is the result of the case where malonic acid was not added in Example 16. As shown in Table 3, it was found that the conductivity was greatly optimized by the addition of malonic acid. &lt;Example 17 and Comparative Example 7&gt; Except that the resin (thermoplastic polyester resin Vylon 500/Toyobo Co., Ltd.) in Example 1 was used and the amount shown in Table 3 was changed, the examples were repeated. 1. Further, Comparative Example 7 is the result of the case where malonic acid was not added in Example 17. As shown in Table 3, it was found that the conductivity was greatly optimized by the addition of malonic acid. &lt;Example 18, Comparative Example 8 &gt; In addition to using the resin (thermoplastic acrylic resin BR-102 / manufactured by Mitsubishi Rayon Co., Ltd.) in Example 1, and changing to the amount shown in Table 3, Example 1 was repeated. Further, Comparative Example 8 is the result of the case where malonic acid was not added in Example 18. As shown in Table 3, it is understood that the conductivity is greatly optimized by the addition of malonic acid. &lt;Example 19, Comparative Example 9 &gt; S. 099137434 31 201219512 Except for the use of the PL4348/Junrong chemically-based phenolic resin Re-component in Example 1, the repeated text is not added in Table 3. Malonic acid, Comparative Example 9 is the result of the addition of the case of Example 19 to the case of propylene. As shown in Table 3, it can be seen that the addition of propionic acid to the dream greatly optimizes the conductivity.戟 矣 〈 〈 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施 〈 〈 实施 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 〈 实施 实施 实施 实施 实施 〈 〈 〈 实施 实施 〈 〈 〈 实施 实施 实施 实施 实施 实施 实施 实施 实施 实施The amount shown in Table 3 is added with the addition of malonic acid, and the comparative example 10 is the result of the "monthly opening" which is not described in Example 20. For example, the diacid, the conductivity will be carried out by the product of the large towel 5, and it can be seen that by adding the propane &lt;Example 21 &gt; In addition to the silver in the example 1 and the addition amount is changed to the silver of the conductive paste as shown in Table 1. The species of the nanoparticles are shown in Table 3, and the physical properties of the resin are shown in Table 3. The procedure of the heavy gauge was carried out, and the obtained calcined film was further referred to as "the resin of Examples 16 to 2 and the volume resistivity". 2. In Comparative Examples 6 to 10, the tree used was cm), and the horizontal axis represents Shu Yue t. People are shown in Figure 2. The vertical axis is the volume resistivity (//Ω. If the resistance value is too high, it cannot be used. In the embodiment indicated by the black bar, it will be 1 (8) 〇, 'the case is expressed as "〇R" in Table 3. The difference is significant in Fig. 2. The invention of the diacid is tens of / / Ω · cm, 099137434 32 201219512 - i ^ ^ ss π

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Illvd-^d-v so · 67/ (S)BW-- (60)峒i# 钱 &amp; 寸 £?εΙ660s 201219512 又,於上述實施例及比較例中,將實施例1、2、7、18、 19與比較例1、2、8、9之表色之測定結果與體積電阻率之 關係示於表4。體積電阻率為數十(//Ω · cm)之所有實施例 中之a*均為2.0以下,a*大於2.0以上之比較例之體積電阻 率非常高。藉由L*a*b*測定方式,a*之值為2.0以下的情況 顯示:若考慮以非紅色之顏色且b*為10以上之情況,則夾 雜有黃色。 又,圖5表示a*與體積電阻率(//Ω · cm)之關係。縱軸表 示體積電阻率(//Ω · cm),橫軸表示a*。可知若a*達到2.0 以下,則體積電阻率會降低。再者,於圖5中所繪製者亦包 括樹脂不同之實施例,且圖5顯示:若包含本發明之二羧 酸,則無論樹脂之種類如何,均可降低體積電阻率。 099137434 34 201219512 L_t匕較例91 60.7 4.68 11.8 360 比較例8 62.5 6.91 卜 vd 6300 比較例2 | 55.4 1 2.20 ^}· Pi 〇 比較例1 63.5 4.04 寸· Ο 實施例19 60.2 | 0.34 10.2 On 才 實施例18 66.0 -0.46 1 15.5 1 00 實施例7 .„62.7 J 0.04 r—Η 夺 實施例2 60.1 | -1.45 15.5 \〇 ΓΟ 實施例1 60.9 | 1.04 cn * h-1 % 體積電阻率(#Ω · cm) -κκ-660 201219512 (產業上之可利用性) 依據本發明之導電性糊膏可適宜地用於「印刷電子 (printed electronics),可用於目前業界正研究 」 又印刷 CPU(Central Processing Unit,中央處理單元)、印刷脬曰 / 、 印刷標籤、全印刷顯示器、感測器、印刷配線板'有機太陽 電池、電子書、奈米印刷LED(Light Emitting Diode,發光 二極體)、液晶PDP(Plasma Display Pane卜電漿顯示面板) 面板、印刷記憶體等。 【圖式簡單說明】 圖1係表示實施例1〜5之燒結促進成分與被覆粒子表面 之有機物的質量比變化、與體積電阻值之關係的圖。 圖2係表示對各樹脂添加作為燒結促進成分之丙二酸之 情形與未添加之情形之體積電阻率的圖。再者,於未添加聚 胺基曱酸酯樹脂與聚酯樹脂之燒結促進成分之情形時均超 出範圍(〇verrange),為方便起見表示為「超出顯示範圍」。 圖3係表示實施例丨的於添加有燒結促進成分之情形時藉 由在大氣中且於UOt:進行6〇分鐘之處理而獲得之煅燒膜 的掃描式電子顯微鏡照片(直接倍率50萬倍)。 圖4係表示比較例1的於未添加燒結促進成分之情形時藉 由在大氣中且於120°C進行60分鐘之處理而獲得之煅燒膜 的掃犏式電子顯微鏡照片(直接倍率50萬倍)。 圖5係表示將塗佈糊膏並於大氣中且於12〇。〇進行6〇分 099137434 36 201219512 鐘之加熱處理而成的锻燒膜之色差以L*a*b*表色系表示時 a*值與體積電阻率之關係的圖表。 £ 099137434 37Illvd-^dv so · 67/ (S)BW--(60)峒i# money &amp; inch £?εΙ660s 201219512 Further, in the above embodiments and comparative examples, Examples 1, 2, 7, and 18, The relationship between the measurement results of 19 and the color of Comparative Examples 1, 2, 8, and 9 and the volume resistivity are shown in Table 4. In all of the examples in which the volume resistivity is several tens (//? · cm), a* is 2.0 or less, and the comparative example in which a* is more than 2.0 or more has a very high volume resistivity. In the case of the L*a*b* measurement method, the value of a* is 2.0 or less. It is shown that if the color is not red and b* is 10 or more, yellow is mixed. Further, Fig. 5 shows the relationship between a* and volume resistivity (//Ω · cm). The vertical axis represents the volume resistivity (//Ω · cm), and the horizontal axis represents a*. It is understood that if a* is 2.0 or less, the volume resistivity is lowered. Further, the one drawn in Fig. 5 also includes an example in which the resin is different, and Fig. 5 shows that if the dicarboxylic acid of the present invention is contained, the volume resistivity can be lowered regardless of the kind of the resin. 099137434 34 201219512 L_t匕Comparative Example 91 60.7 4.68 11.8 360 Comparative Example 8 62.5 6.91 Bu vd 6300 Comparative Example 2 | 55.4 1 2.20 ^}· Pi 〇Comparative Example 1 63.5 4.04 inch · 实施 Example 19 60.2 | 0.34 10.2 On Example 18 66.0 -0.46 1 15.5 1 00 Example 7 . „62.7 J 0.04 r—Η Example 2 60.1 | -1.45 15.5 \〇ΓΟ Example 1 60.9 | 1.04 cn * h-1 % Volume resistivity (#Ω · cm) - κκ-660 201219512 (Industrial Applicability) The conductive paste according to the present invention can be suitably used for "printed electronics, which can be used in the current industry" and prints CPU (Central Processing) Unit, central processing unit), printing 脬曰 / , printed label, full printed display, sensor, printed wiring board 'organic solar cell, e-book, nano-printed LED (Light Emitting Diode), liquid crystal PDP (Plasma Display Panel) Panel, printed memory, etc. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a graph showing the relationship between the mass ratio of the sintering accelerating component of Examples 1 to 5 and the organic material on the surface of the coated particle, and the volume resistivity. Fig. 2 is a graph showing the case of adding malonic acid as a sintering promoting component to each resin and the volume resistivity in the case where it is not added. Further, in the case where the sintering-promoting component of the polyurethane phthalate resin and the polyester resin is not added, the range is exceeded (〇verrange), and it is expressed as "exceeding the display range" for the sake of convenience. Fig. 3 is a scanning electron micrograph (direct magnification of 500,000 times) of a calcined film obtained by treating in the atmosphere and at UOt: for 6 minutes in the case where the sintering accelerating component is added in the embodiment. . 4 is a broom-type electron micrograph of a calcined film obtained by treating in the atmosphere at 120 ° C for 60 minutes in the case where the sintering-promoting component is not added in Comparative Example 1, with a direct magnification of 500,000 times. ). Figure 5 shows that the paste will be applied to the atmosphere at 12 Torr. 〇6〇分099137434 36 201219512 The color difference of the calcined film formed by heat treatment of the clock is expressed by the L*a*b* color system. The graph of the relationship between the a* value and the volume resistivity. £ 099137434 37

Claims (1)

201219512 七、申5青專利範園: 1. 一種導電性糊膏, 其包含經碳數2〜8之羧酸或其衍峰 =構成之有機物被覆之銀粒子、分一 為2〜8之二羧酸。 人默 2. 如申請專利範圍 α “古丄 只心命屯性猢t ’其中,上述》命 性糊膏中所添加之_ 工疋導甩 為0H0質量% 對於上料電性崎之總質量 3. 如申#專賴圍第i或2項 導電性糊膏更包含你^ 包性匕其中’上述 匕3使銀粒子分散之分散劑。 4. 如申請專利範圍第1 中,將上述導電性糊膏進行熱處理=員之導電性糊膏,其 銀彼此接觸或焊、、、 ^成之配線具有藉由使 飞钇、、、。而表現出導電性之性 5. —種導電膜,其 、 項之糊膏而獲得者,且 μ利範圍第1至4項中任— \付有,且 L*a5i!b* 6. —種導電獏之形成方法,又巴糸中之a*值為2.0以下。 範圍第1至4項中任一項之其包括下述步驟:將申請專利 驟;以及於大氣中或惰性氣之導電性糊膏塗佈於基板上之步 件下進行熱處理之步驟。虱體壤境中且於100〜200ΐ之條 099137434 38201219512 VII. Shen 5 Qing Patent Fanyuan: 1. A conductive paste comprising silver particles coated with an organic substance composed of a carbon number of 2 to 8 or a derivative thereof = 2 to 8 carboxylic acid.默默 2. If the patent application scope α “古丄心心屯性猢t”, the above-mentioned 》 性 糊 糊 甩 甩 甩 甩 甩 甩 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 疋 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于3. For example, the conductive paste of the i or the second item of the application may contain the polydispersant of the above-mentioned 匕3 to disperse the silver particles. 4. In the scope of the patent application, the above-mentioned conductive The paste is subjected to a heat treatment, and the conductive paste of the member is such that the silver is in contact with or welded to each other, and the wiring is formed to have a conductive property by using a conductive film. The winner of the item, the winner of the item, and the range of items 1 to 4 of the μ profit range - \付有, and L*a5i!b* 6. - the formation method of the conductive 貘, and the a* in the 糸The value is less than 2.0. The range of any one of items 1 to 4 includes the following steps: applying the patent procedure; and performing heat treatment under the step of applying the conductive paste of the inert gas or the inert gas to the substrate. The steps of the body in the soil and in the 100~200ΐ 099137434 38
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477576B (en) * 2012-06-15 2015-03-21 Murata Manufacturing Co Conductive paste, and laminated ceramic electronic parts and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477576B (en) * 2012-06-15 2015-03-21 Murata Manufacturing Co Conductive paste, and laminated ceramic electronic parts and manufacturing method thereof
US9401244B2 (en) 2012-06-15 2016-07-26 Murata Manufacturing Co., Ltd. Conductive paste, multilayer ceramic electronic component, and method for manufacturing same

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