201218431 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種製造方法 裝結構的製造方法。 尤其涉及一種發光二極體封 [0002] ❹ [0003] [0004] [0005] 【先前技術】 很多發光二極體（Llght Emitting Diode，LED)封裝 結構都包括一個反射杯結構，封裝材料填充在該反射杯 内。在發光二極體封裝結構的製造過程中，包括一個切 割的步驟，將形成於整塊基板上的很多個發光二極體封 裝結構切割開來。一般此轉割過程往往採用機械切割的 方式，在切割的過程中，由於切割的刀刃和基板的摩擦 會產生大量的熱’通常還需要在切割的同時洗注大量的 冷卻液幫助降溫’避免元件因高溫而被破壞。然而封 裝結構中反射杯與封裝材料之間往往會產生鏠隙，古此 降温用的冷卻液容易在切割的過程中通過封裴社構中一 射杯與封裝材料之間的縫隙滲透進封裝體.内， 元件的損壞。 【發明内容】 有鑒於此，有必要提供一種能夠避免冷卻液灸透進封事 體内的發光二極體封裝結構的製造方法。 ^ 一種發光二極體封裝結構的製造方法’包括 . 卜步驟： 提供基板，包括多個封裝載體，每個封襞載體上有兩個 導線架，封裝載體包括第一表面，該第~表面上形成有 容置槽，容置槽由一底壁和一側壁圍成； 反 從而導致 099136280 表單編號A0101 第3頁/共Π頁 0992063437-0 201218431 [0006] [0007] [0008] [0009] [0010] [0011] [0012] [0013] 099136280 將發光一極體晶片貼設於所述容置槽的底部，並與所述 兩個導線架電性連接； 在所述容置槽内形成封裝層； 在所述封裝載體和封裝層上覆蓋一疏水層； 切割所述基板，形成多個所述發光二極體封裝結構。 發光二極體封裝結構的製造方法中，由於在切割基板之 剷在封裝載體和封裝層上覆蓋了一疏水層，該疏水層能 夠有效的阻擋切割時洗注的冷卻液通過封裝結構的縫隙 滲透進封裝體内，從而有效的保護封裝結構。 【實施方式】 以下將結合附圖對本發明作進一步的詳細說明。 請參閱圖1及圖2，本發明實施方式提供的一種發光二極 體封裝結構的製造方法包括以下步驟。 步驟S201 :提供一基板1〇、所述基板1〇包括多個封裝載 體11，每個封裝載體n上有，個導線架12。所述封裝載 體11包括相對的第一表面ιη及第二表面112。該第一表 面11上形成有一容置槽113。所述容置槽113由底壁114 和側壁115圍成。所述底壁114和侧壁115可為一體成型 或採用黏膠等方式固接，本實施方式中，所述底壁114和 側壁115-體成型。所述封裝載體11可採用高導熱且電絕 緣材料製成，該高導熱且電絕緣材料可選自石墨、矽、 陶究、類鑽、環氧樹脂切烧氧樹脂等。所述每個導線 架12-端裸露在容置槽U3的底壁114上，另一端裸露在 ^裝，體11的第二表面112±。所料線幻 表早蝙號細1 第4頁/共„頁 灸層 099206 201218431 [0014] Ο [0015] ❹ [0016] [0017] 或金屬合金製成。 步驟S202 :將發光二極體晶片13貼設於所述容置槽ιΐ3 的底壁114上或導線架12上。具體地，該發光二極體晶片 13可通過黏著膠固定於容置槽113的底壁114或導線架。 上。所述發光二極體晶片13通過金屬導線131與所述兩個 導線架12電性連接。值得說明的是’該發光二極體晶片 13亦可以利用覆晶（flip-chip)或共晶（eutectic)的方 式電性連接所述兩個導線架12。優選地，所述側壁丨丨5能 夠反射發光一極體晶片.13發出的光線，.以控制發光二極 體晶片13的出光方向。 步驟S203 :在所述容置槽113内形成所述封裝層14，覆 蓋住所述發光二極體晶片13和所述底壁114。所述封裝層 14用於保護發光二極鱧晶片13免受灰塵、水氣等影響。 封裝層14的材質可以為石夕穋（siHcone)、環氧樹脂 (epoxy)或其組合物。所述封裝層14還可以包含螢光轉 換材料，該螢光轉換材料可以為石榴石基螢光粉、矽酸 鹽基螢光粉、原矽酸鹽基螢光粉'硫化物基螢光粉、硫 代鎵酸鹽基螢光粉和氮化物基螢光粉β 步驟S204 :在所述封裝載體11和封裝層14上覆蓋一疏水 層15 °所述疏水層15可以為不透明材料，在切割完成之 後’可利用研磨、蝕刻等技術去除所述疏水層15。所述 疏水層15也可以選用透明材料，切割完成之後，可保留 所述疏水層15。 步驟S205 :切割所述基板1〇，形成多個所述發光二極體 099136280 表單編號A0101 0992063437-0 201218431 封裝結構100。在切割的過程中，澆注的大量冷卻液由於 被所述疏水層15阻擋，不能通過封裝結構中封裝層14與 封裝載體11的側壁115的縫隙滲透進封裝體内，從而保護 所述發光二極體封裝結構100的内部元件不被損壞。 [0018] 本發明實施方式提供的發光二極體封裝結構的製造方法 中，由於在切割基板之前在封裝載體和封裝層上覆蓋了 一疏水層，該疏水層能夠有效的阻擋切割時澆注的冷卻 液通過封裝結構的缝隙滲透進封裝體内，從而有效的保 護封裝結構。 [0019] 另外，本領域技術人員還可在本發明精神内做其他變化 ，當然，這些依據本發明精神所做之變化，都應包含在 本發明所要求保護之範圍之内。 【圖式簡單說明】 [0020] 圖1是本發明實施方式提供的一種發光二極體封裝結構的 製造方法流程圖。 [0021] 圖2是本發明實施方式提供的一種發光二極體封裝結構的 製造方法示意圖。 【主要元件符號說明】 [0022] 發光二極體封裝結構：100 [0023] 基板：10 [0024] 封裝載體：11 [0025] 第一表面：111 [0026] 第二表面：112 uyyicJDzSu 表單編號AOiOi 第6頁/共11頁 0992063437-0 201218431 [0027] [0028] [0029] [0030] [0031] [0032] [0033] Ο [0034] 容置槽：113 底壁：114 側壁：115 導線架：12 發光二極體晶片：13 金屬導線：131 封裝層：14 疏水層：15 Ο 099136280 表單編號Α0101 第7頁/共11頁 0992063437-0201218431 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a manufacturing method of a manufacturing method. More particularly, the invention relates to a light-emitting diode package [0002] [0003] [0005] [Last-earth diode (Llght Emitting Diode, LED) package structure includes a reflective cup structure, the package material is filled in Inside the reflector cup. In the manufacturing process of the light emitting diode package structure, a cutting step is included to cut a plurality of light emitting diode packages formed on the entire substrate. Generally, this cutting process is often mechanically cut. During the cutting process, a large amount of heat is generated due to the friction between the cutting edge and the substrate. Usually, it is necessary to wash a large amount of coolant while cutting to help cool down. It was destroyed by high temperature. However, there is often a gap between the reflective cup and the encapsulating material in the package structure. The coolant for cooling is easy to penetrate into the package through the gap between the cup and the encapsulating material in the sealing mechanism during the cutting process. , component damage. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a method of manufacturing a light emitting diode package structure capable of avoiding moxibustion of a coolant into a body. ^ A manufacturing method of a light emitting diode package structure includes: a step of providing a substrate, comprising a plurality of package carriers, each of the package carriers having two lead frames, the package carrier comprising a first surface, the first surface Forming a receiving groove, the receiving groove is surrounded by a bottom wall and a side wall; thereby causing 099136280 Form No. A0101 Page 3 / Total Page 0992063437-0 201218431 [0006] [0007] [0008] [0009] [ [0013] [0013] 099136280 attaching a light-emitting one-pole wafer to the bottom of the accommodating groove, and electrically connecting with the two lead frames; forming a package in the accommodating groove a layer; covering the package carrier and the encapsulation layer with a hydrophobic layer; and cutting the substrate to form a plurality of the LED package structures. In the manufacturing method of the LED package structure, since the shovel for cutting the substrate is covered with a hydrophobic layer on the package carrier and the encapsulation layer, the hydrophobic layer can effectively block the penetration of the immersion coolant through the gap of the package structure during cutting. Into the package body, thus effectively protecting the package structure. [Embodiment] Hereinafter, the present invention will be further described in detail with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, a method for fabricating a light emitting diode package structure according to an embodiment of the present invention includes the following steps. Step S201: A substrate 1 is provided. The substrate 1 includes a plurality of package carriers 11, and each package carrier n has a lead frame 12. The package carrier 11 includes opposing first and second surfaces 112. A receiving groove 113 is formed in the first surface 11. The accommodating groove 113 is surrounded by a bottom wall 114 and a side wall 115. The bottom wall 114 and the side wall 115 may be integrally formed or adhered by means of adhesive or the like. In the embodiment, the bottom wall 114 and the side wall 115 are integrally formed. The package carrier 11 may be made of a highly thermally conductive and electrically insulating material selected from the group consisting of graphite, tantalum, ceramics, diamond-like, epoxy-cut oxy-resin, and the like. Each of the lead frames 12-end is exposed on the bottom wall 114 of the receiving groove U3, and the other end is exposed on the second surface 112± of the body 11. The material line illusion early bat number fine 1 page 4 / total „ page moxibustion layer 099206 201218431 00 [0015] ❹ [0016] [0017] or metal alloy. Step S202: the light emitting diode chip 13 is attached to the bottom wall 114 of the accommodating groove ι 3 or to the lead frame 12. Specifically, the illuminating diode 13 can be fixed to the bottom wall 114 of the accommodating groove 113 or the lead frame by adhesive. The light-emitting diode chip 13 is electrically connected to the two lead frames 12 through a metal wire 131. It is worth noting that the light-emitting diode chip 13 can also use flip-chip or eutectic. The two lead frames 12 are electrically connected in a manner of (eutectic). Preferably, the side wall 丨丨 5 is capable of reflecting light emitted from the light-emitting one-pole wafer 13. to control the light-emitting direction of the light-emitting diode chip 13. Step S203: forming the encapsulation layer 14 in the accommodating groove 113 to cover the illuminating diode chip 13 and the bottom wall 114. The encapsulation layer 14 is used to protect the illuminating diode chip 13 It is affected by dust, moisture, etc. The material of the encapsulation layer 14 can be SiHcone or epoxy tree. (epoxy) or a combination thereof. The encapsulating layer 14 may further comprise a fluorescent conversion material, which may be garnet-based phosphor powder, citrate-based phosphor powder, orthosilicate-based fluorescent material. Powder 'sulfide-based phosphor powder, thiogallate-based phosphor powder and nitride-based phosphor powder β step S204: covering the package carrier 11 and the encapsulation layer 14 with a hydrophobic layer 15 ° the hydrophobic layer 15 may be an opaque material, after the cutting is completed, the hydrophobic layer 15 may be removed by grinding, etching, etc. The hydrophobic layer 15 may also be made of a transparent material, and after the cutting is completed, the hydrophobic layer 15 may be retained. Step S205 Cutting the substrate 1 to form a plurality of the light-emitting diodes 099136280 Form No. A0101 0992063437-0 201218431 Package structure 100. During the cutting process, a large amount of the poured coolant is blocked by the hydrophobic layer 15, and cannot The internal components of the LED package structure 100 are protected from damage by the gap between the encapsulation layer 14 and the sidewalls 115 of the package carrier 11 in the package structure, thereby protecting the internal components of the LED package structure 100 from being damaged. [0018] In the manufacturing method of the LED package structure, since the package carrier and the encapsulation layer are covered with a hydrophobic layer before the substrate is cut, the hydrophobic layer can effectively block the penetration of the coolant poured during the cutting through the gap of the package structure. Into the package body, thereby effectively protecting the package structure. [0019] Further, those skilled in the art can make other changes within the spirit of the present invention. Of course, these changes according to the spirit of the present invention should be included in the present invention. Within the scope of the claimed protection. BRIEF DESCRIPTION OF THE DRAWINGS [0020] FIG. 1 is a flow chart of a method of fabricating a light emitting diode package structure according to an embodiment of the present invention. 2 is a schematic diagram of a manufacturing method of a light emitting diode package structure according to an embodiment of the present invention. [Main component symbol description] [0022] LED package structure: 100 [0023] Substrate: 10 [0024] Package carrier: 11 [0025] First surface: 111 [0026] Second surface: 112 uyyicJDzSu Form number AOiOi Page 6 / 11 pages 0992063437-0 201218431 [0027] [0029] [0033] [0033] [0034] accommodating groove: 113 bottom wall: 114 side wall: 115 lead frame :12 Light Emitting Diode Wafer: 13 Metal Wire: 131 Package Layer: 14 Hydrophobic Layer: 15 Ο 099136280 Form No. 1010101 Page 7 of 11 0992063437-0