201218348 六、發明說明： 【技術領域】 本發明一般說來係關於用於系統層級電子產品之封 裝。本發明係特別適宜用於封裝電力電子產品。 【相關技術】 系’’先層級電力電子產品（例如電源供應器）一般係包含 複數個電性元件，其係裝設於一印刷電路板之上。該印刷 電路板一般係裝置於一外殼之中，例如一塑膠或金屬外 殼。通常一灌封化合物或一保角塗層係施加於該印刷電路 板與裝設於其上的該等部件，以將該等各個電性元件與該 外殼電性絕緣、將該等各個電性元件彼此電性絕緣及/或 額外外露《當使用該等金屬外殼時，絕緣紙通常係用以幫 助進一步將該金屬外殼與設置於該印刷電路板上的該等電 性元件電性絕緣。 雖然已有存在的系統層級電力產品封裝配置運作良 好，仍有持續的努力以提供更有經濟效益、更可靠的方法 與配置用於封裝電源供應器與其他系統等級電力電子裝 置。 "" 【發明内容】 本文中係描述用於系統層級電子產品的封裝的改進方 法與配置。一觀點中，該封裝的一額外的外殼係由絕緣紙 形成。一印刷電路板係放置於該絕緣紙外殼中，且係實質 上完全由一灌封材料圍繞，其係實質上完全填滿該外殼。 該印刷電路板支撐並承載複數個電性元件。至少係提供一 201218348 電性互連以電性相接該印刷電路板及/或所選電性元件至外 加裝置，其係由該印刷電路板承載。該絕緣紙外殼實質上 完全圍繞該印刷電路板，且其包含至少—開孔，其准許該 内部連接外露該外殼的外部。該所描述的封裝係特別適宜 ';封凌系統層級電力電子產品，例如電源供應器。 本發明的一些方法觀點中，該絕緣紙係形成為一盒 =。一插件印刷電路板係置於該絕緣紙盒中，且灌封材料 係配置為一盒子。該灌封材料係配置為實質上完全地圍繞 / p刷電路板’且實質上填滿該絕緣紙盒。該灌封材料係 接著被固化以將於該絕緣紙盒中的該灌封材料固化並且 將該灌封材料黏結至該絕緣紙上，以使該絕緣紙形成灌封 材料方塊地一外殼’其囊封該印刷電路板。以此配置，係 提供一封裝的電子裝置，且該絕緣紙形成該經封裝梦 置的該外露的外表面^ 又 -些實施例中，該灌封材料係以複數個步驟提供。— :佳實行中，灌封材料的一第一容積係提供於該絕緣紙各 中’其係於將該印刷電路板放置人該盒子中之前 | :路板係接著被置於該黏性灌封材料之上，且外加的： 頂^係被提供於該印刷電路板之上，於固化前覆蓋該盒子 解。本發明與其優點可由參考下列描述並伴隨附圖而理 於本文附圖中，相同的圖示元件符號有時係用 相同的結料件。應理解該等圖中的描繪係圖示而非= 201218348 比例。 【實施方式】 本發明一般係關於系統層級產品的封奘 &衣，具係例如電 源供應器。一般說來，具有複數個電性元#的 什的一印刷電路 板係置於一盒子中，其係由絕緣紙形成。該盒子係以—霍 封化合物填滿，以此該電性元件係裝箱於灌封化合物的一 方塊中於該絕緣紙中，且該絕緣紙係有效率地作為用於y 封裝方塊的一外殼。 根據本發明一實施例的一經封裝電子裝置5〇係顯示於 圖1中。所顯示實施例中，一最佳理解係配合附圖 5(a)-5(d) ’電子裝置60係完全浸於灌封材料7〇的—方塊 中’其係具有一外露的電性互連。該示範實施例中，該電 性互連所採取的型式係複數條線80，其係自一方塊延伸， 雖然於其他實施例中，該互連可採取一連結.器型式，或是 '' ^ 接頭，及/或其它適宜的結構。該特定的電子裝置可 有相當大的變化幅度，其係基於該封裝產品的實質但其 一般係包含複數個電性元件62，其係裝設於一印刷電路板 64之上。該電性互連一般係電性耦接至關聯部件62或該印 刷電路板64。該互連（例如線8〇)係用以促進該電子裝置 至該等外部裝置的電性連結。 該灌封材料70係由—絕緣紙形成的盒子1〇〇裝箱。該 /瞿封材料70貫質上係完整的填滿該絕緣紙盒i 〇〇，且較佳 而言係於所有側邊皆圍繞該等電子裝置60,以此該等電子 A置60 /又有任何部件接觸該絕緣紙。以此配置，該等電性 201218348 几件係自外部裝置電性絕緣，其係 與該灌封材料70達成。該等線：由該絕緣紙盒⑽ 的開口以促使該等電子裝置60至外部：：絕緣紙盒_中 絕緣紙盒1。"、作為該封裝裝置的=的Γ連結。該 封材料方塊中。此提供一非常堅固、=本其係裝設於灌 裝，其具有良好的散熱特性以及二本，且可靠的封 如同孰習太良奸的電性絕緣特性。 焰延遲材料’其具有相當好的電性：缘：-般係-火 高介電常數），且可來自多個供^ 、、特（例如高電阻與 與電性特性可被選定以符合任何特定庫用厚度 電子裝置係6入：心用的而要’雖然在 戶存 、70王被封裝_，一般說來絕緣紙並不需要計 厚度，其將於下文中詳細描述。 …要特定 應特別注意該絕緣紙盒100 其係相當不同於傳M U /成用於封裳的該外殼。 m 、系 '’先層級的電力電子的封裝，I 一炉 又於—金屬或塑膠外殼中，如圖6與7中所_ \ 又 =統層級電力電子裝置的封裝的該等人士將了解二：習 :屬:’絕緣紙有時係用以協助將該 ：二 屬外殼電性絕緣。於此等配置，，該電子裝置一 由絕緣紙形成的一，，各+，，由士 ± 般係置於 兮¥绫姑由 | ?巾。有呀候一灌封材料也置於 “將该手-性元件與該金屬外殼進—步電 :巴、’並協助將該等電子裝置支撐於其位置上 :料也提供環境保護並且對散熱有所協助。據該^理 解’此灌封材料傳統上並不填充該絕緣紙盒 里 外殼#用丨V切w 亥金屬 ’、 所需結構性支撐。相反的，本發明中絕緣 201218348 亦即該封裝產品並不 種與先前技藝非常不 紙係用做為該封裝產品的外部殼體β 放置於—金屬（或其他）外殼令。此係— 同的配置，且其具有多個重要的優點 起初’該絕緣紙/灌封化合物方塊封裝標的係據信為較 傳統金屬或塑膠外殼封裝大為便宜。舉例來說，一成本分 析估計該絕緣紙/灌封化合物方塊封裝可在用於封裝電力電 子裝置的材料上提供超過30%的節省，其係相對於利用金 屬或塑膠封裝。然而，材料節約的成本僅為利用所述封裝 的該等優點之-。產生一最終產品的該工具成本節約與該 改善的費時係更為顯著。舉例來說’當利用—金屬封裝， 其會花費4周並花費贿以製造該所需工具以形成該金屬 封裝。含使用一塑膠封裝’其會花費“Ο周並花費$2狄以 製造該所需模具以形成該塑膠封裝。相反的，當使用所述 絕緣紙/灌封化合物方塊封裝方法，該適宜的絕緣紙很有可 能可設計並於-周内或更快便送達，並且㈣—點點的工 具成本。此使得可有非常快速的產品發展週期，並且使得 產品封裝可幾乎立刻改變完成，且僅需一點點的成本，盆 係關於發展及/或變化傳統塑膠或金屬外殼。—些狀況中， 該絕緣紙/灌封化合物方塊方法的較短費時甚至較材料的節 約更為重要。 該所述封裝配置實質上可被用以封裝任何種類的電子 裝置H其係特別適用於系統層級電力電子裝 裝。透過範例’該所述製车 叮41程係適且使用在電源供應器的 裝。該等所述封裝係非當m 书堅固。其。P分原因係絕緣紙本身 201218348 p相田堅固，而部分原因係因為該灌封材料方塊提供一非 常堅固的基底予該絕緣紙。因此，該等所述封裝係適宜用 於非常廣泛的應用。 接著參考圖2並配合圖3_5，下文中將描述一種封裝一 ^統層級電子產品的方法，其利用該絕緣紙盒做為該外部 作又組以封裝。起初於步驟702中，一張絕緣紙101係以一 種方式被圖形化，其係適宜形成一摺紙盒100。該紙張101 的《玄實際幾何形狀與該成果盒子⑽可有廣泛的變化以符 «任何特疋封裝的需要。透過範例，在圖3中所示的該實 靶例中，該紙張101係分為複數個區域，其係藉由切縫104 ^抵線106(圖3中係指示為肖等虛線）所區&。該等例示區 域包含一底部外壁丨丨〇、相對末端外壁丨丨2與丨丨3、前部外 壁U4、背部外壁115，與蓋子117。該前部與背部外壁i 14 與115;各自包含一對封蓋121，其係各自配置以摺疊於一關 %末端外壁"2、113之上。該蓋子區域117也包含複數個 封盍123，其係各自配置以摺疊於一關聯的末端外壁之上， 而封蓋125係配置以摺疊於該前部外壁丨丨4之上。在該 示範實施例中，該蓋子區域117也具有—對孔洞134，盆: 配置以使得線路可通出該盒m雖“顯示兩個孔洞 應了解該等孔洞的數量與其各自的幾何圖形可有廣泛 的變化，以符合任何特定封裝的需要。 有複數個供應商販賣絕緣紙，且„般說㈣絕緣紙的 圖形化係由該供應商完成（雖然其並非必需）。該絕緣紙張 ⑼可被摺叠以形成-盒子100，如圆4中所例示。（步驟 201218348 704)。若為配合所希’可施加黏膠至該封蓋(或於該等封蓋 接觸的忒等表面之上)以協助將該盒子以自行支撐方式維持 料在-¾，雖,然其並非必需，其將於下文中有更詳細的 描述。若使用該黏膠，應了解該絕緣紙張1〇1與該盒子 的實際幾何形狀皆可有廣泛的變化以符合任何特^封 需要。 在该絕緣紙盒100形成之後，該絕緣紙盒100可選擇 性地至於一支撐孔洞（未顯示於圖中）。當使用時，該支撐孔 洞較佳而言係緊密地維持該絕緣紙，以此其可維持其盒子 型式，其係於接續的灌封製程。當該盒子並未黏結在一起 時’其係特別有用。其他實施例中（且特別於該絕緣紙盒為 自行支撐的實施例中），並無須要將該盒子至於一支撐孔洞 中0 一旦該盒子係適當地置放後，一些灌封材料70係被置 於該絕緣紙盒100之中。步驟706。灌封材料的初步置放係 部分填充该盒子。在該初步的灌封材料7 〇係置放後該等 電子裝置60係備至於該盒子100中，其係於該初步的灌封 材料之上。步驟708，圖5(a-b)。該等電子裝置係經設置， 使得該印刷電路板係有效的靜置於該初步灌封材料7〇的頂 部之上。因此，該灌封材料可被用以界定該絕緣紙與該印 刷電路板64的底部表面之間的起始距離。若任何電性元件 自該印刷電路板的該底部表面延伸’該印刷電路板係被壓 入定位’以此於該印刷電路板64的下表面上的任何部件係 被壓入該灌封材料中，且該印刷電路板本身係仍然浮在該 10 201218348 初步灌封材料之上，如圖5(c)中可有最佳表示。 在該等電子裝置被放置於該盒子100中之後，額外的 灌封材料係置於該盒子中，以實質上填充該盒子。步驟 710，圖5(d)。該所述實施例中，該灌封材料的置放係於兩 個階段中完成。該兩個階段的置放方法的一優點為其對於 該絕緣紙丨0 0與該印刷電路板6 4 (且因此包含該印刷電路板 上承載的該等部件）之間的隔絕距離有良好控制。該等兩個 階段灌封製程的另一優點為其實質上地協助減少該印刷電 路板下的灌封材料中形成氣體間隙的可能性。雖然一般而 言係偏好兩階段置放製程，其並不需要且其可能會於一單 ϋ中置放該灌封材料。^另一實施例中，其可能係所 希的於多於兩個階段中置放該灌封材料。透過範例，額外 置放階段可為所希地於特定環境中，其中有複數個部件分 開地置.放於該盒子中，且所希係於該灌封化合物中垂直地 分開該等部件。 在該灌封化合物裝滿後，該等線路80係透過該盒蓋開 孔134插入，且該盒蓋區域117係降低於定位以有效地關 閉該盒子100。步驟712。以此配置’該等線路80係自該 關閉的絕緣紙盒100的頂部延伸出纟，其係如圖i中所示。 該盒蓋區域較佳而言係與該灌封材料接觸，以此該盒蓋係 穩固地黏結至該灌封材料。 在該盒蓋被關閉後，該灌封材料係固化以形成一固體 方塊，其將該電子裝置6〇裝箱。步驟714。該固化的實質 主要係隨使用於任何特定應用中的該灌封材料種類而有不 11 201218348 同。可使用種類相當廣$乏的傳統電子 材料70。透過範例，傳统的招 '…以，«封 傅汍的樹酯、胺甲酸乙酯、矽與 酸基底灌封化合物皆可運作良好。該灌封材料較佳而 有一=著品質，以此當其固化時，其會穩固地接合至 ，=紙益_。其„地將該絕緣紙維持於定位，其係當該封 。该所述方法的一附加好處為任何並非已經黏著性 地接合至其關聯外壁的封蓋（例如封蓋i2i、⑵⑵ 會經由該灌封材料本身而被黏著。 、 如上文所述，當一支撐孔洞係利用以在該灌封操作其 門、隹持》亥、..邑緣紙盒，並不需要在該灌封操作之前將該等封 蓋黏結置其關聯外壁。此可簡化該絕緣盒組裝但其有潛 在缺點，即須要建立適宜的支樓結構。實作中，該等支標 結構常常係相當大的支撐孔洞矩陣，其使得許多裝置可； 夺瞿封抑或，當3玄盒子係於灌封操作前以一自行支撐方 法組裝’則可除去一支撐孔洞的需要—亦即，不需要一支 摟孔洞即可完成該灌封’其可在開始製造前，除去放置或 製造一適宜支撐結構的潛在需要。 該所述封裝係非常堅固且耐用的，其具有良好的散熱 /、柷火焰特性，其具有良好的防護（IP)等級，且適用於非常 廣的應用中。s亥所述絕緣紙/灌封化合物方塊封裝結構可 用於非常廣泛的電子裝置封裝應用中。據信該描述封裝係 特別適用於封裝系統層級電力電子產品，例如電源供應 益。然而’應理解該描述方法並不限於電力電子產品。一 有利的特定應用為使用於LED向下式照明的該電源供應 12 201218348 由於所述封裝50係相當堅固，其於使用其間可直接裝 設於任何適宜的支撐結構。藉由範例，圖8中的該實施例 中’一小支架5 3可用以將該封裝5 0穩固置一支撐結構5 9， 例如一基板、一框架，或任何其他適宜結構。藉由範例， 一 LED下光式應用中，該支撐結構59可為光的框架以支撐 該LED。當然，所述的該封裝50也可被用於廣泛的其他支 撐結構中。 一 iL應用中，根據本發明的一電力電子裝置封裝會產 生大量的熱，且因此其會希望可提供一熱槽，其可協助冷 卻該裝置。熱槽可以多種方式被應用至該經封裝電子裝置 5〇。一簡單方法係顯示於圖9中。該示範實施例中，其係 相對廣泛的，一般係使用U型支架55以將該經封裝電子裝 置穩固.至該支撐59(再一次，其可為一基底、一支架，或任 何其他適宜的結構八該u型支架接觸該經封裝電子裝置5〇 的數個側邊，其協助散熱並因而作為一有效的熱槽。 雖然僅本發明幾個實施例詳細描述於本文中，應了解 本發明可以許多其他形式實行’而不會脫離本發明：精神 或範齊。該絕緣紙的細節並未於本文中被詳細討論，係由 於熟習本技藝人士可有充分理解。絕緣紙_般係提供為紙 張型式，且係可由複數種來源並具有廣泛的組成。舉例來 說’-些㈣的絕緣紙係㈣聚㈣紙張。熟係本技蔽人 士將理解，有複數個絕緣紙的供應來源。這些供應商包含 、3M、Sumitomo，與Dup〇nt。該絕緣紙的該等特性 13 201218348 可歧的變化以迎合任何特殊應用的需求或規格。然而， ；^ 八你指出絕緣紙一般具有適宜的火焰延遲特 !生问電阻、向介電強度、一相對高的熱係數與一適宜的 熱折射溫度。不同的供應商將其產品稱為絕緣紙、火焰延 遲紙張’等等。藉由實施例，適宜的絕緣紙包含ρΓ〇_ gk f焰延遲聚丙稀紙張係可來自鳩靖驗㈣的^… δ亥絕緣紙地適官姐^7 # ^ 特性了基於该應用的實質而有變化。經由 範例對於介多應用，絕緣紙具有下列特性以運作良好 一 ν'0火焰等級；2)-介電強度為2_volts/mU或更大. L一二熱折射溫度為至少攝氏120度;4) -相對熱係數 超過1 1 0度c。 於該例示的實施例中’線80係自該灌封化合物方塊延 伸以促進電性連接至外加裝置。然而，應了解 ::電性連接器、終端、接頭，等等，可用做為該電性内 π接，其係替換或外加至該等線。一些實行中，該等内 料接可具有結構（例如線、連接器，等等）其延伸穿越且於 I絕緣紙之外。其他應用中，該等内部連接（例如終端連 接β ’等等)可僅經由該等開口外露。於各種實施例中該 等複數個不同型式的互連可被使用。 =示的實施例中’用以形成該封裝外殼的該絕緣紙 方便，：並：張的型式。雖然此配置於一製程站點係特別 ”並“須的。因此，本發明實施例應被視為 例“非限制，且本發明並不被線於本文中所提供細節， 而可於本文令附加申請專利範圍地等效範田壽甲加以修改。 14 201218348 【圖式簡單說明】 視圖 圖1係根據本發明一實施例的一經封裝電子裝置的透 圖2係根據本發明一實施例的一種封裝一系統層級電 子裝置的方法的一流程圖。 另圖3係根據本發明一實施例的適宜形成一經封裝電子 裝置的外加外殼的一切片的絕緣紙的一頂部示圖。、 圖4係圖3所示一張絕緣紙的—透禎 甘及，α 迟現圖，其係經摺疊 電=置封裝容器外殼，其係用於包含-印刷電路板的- 的封 圖5(a)-5(d)所示係根據圖2的方法的一電子 裝中的各個步驟。 、 圖6所示係一先前技術的電源供應器封裝， 金屬外殼。 、 I a 圖7所示係一先前技術的電 塑膠外殼。 [應益封震，其包含 電子裝置 ’其利用- -支 電子裴置, 1其利用- -熱 圖8係一圖示圖1的該經封 架裝設。 圖9係一圖示圖1的該經封 槽支架裝設。 【主要元件符號說明】 50 經封裝電子裝置或封裝 53, 55 支架 5 9 支撐結構或支稽· 15 201218348 60 電 子 裝 置 62 電 性 元 件 64 印 刷 電 路板 70 灌 封材 料 80 線 100 絕 緣 紙 盒 101 絕 緣 紙 張 104 細 縫 106 折 線 110 底 部 外 壁 112, 113 末端 外 壁 114 前 部 外 115 背 部 外 壁 1 17 蓋 子 或 蓋子 部 分 121〜 125 封 蓋 134 孔 洞 或 蓋子 開 孔 702〜714 步 驟 16201218348 VI. Description of the Invention: [Technical Field] The present invention relates generally to packaging for system level electronic products. The invention is particularly suitable for packaging power electronics. [Related Art] A prior art power electronic product (e.g., a power supply) generally includes a plurality of electrical components mounted on a printed circuit board. The printed circuit board is typically mounted in a housing such as a plastic or metal housing. Typically, a potting compound or a conformal coating is applied to the printed circuit board and the components mounted thereon to electrically insulate the respective electrical components from the outer casing, and to electrically charge the respective electrical components. The components are electrically insulated from each other and/or additionally exposed. When using such metal casings, the insulating paper is typically used to help further electrically insulate the metal casing from the electrical components disposed on the printed circuit board. While existing system-level power product package configurations are well-functioning, there is ongoing effort to provide more cost-effective, more reliable methods and configurations for packaging power supplies and other system-level power electronics. "" [Summary] This document describes improved methods and configurations for packaging of system level electronic products. In one aspect, an additional outer casing of the package is formed from insulating paper. A printed circuit board is placed in the insulating paper outer casing and is substantially completely surrounded by a potting material that substantially completely fills the outer casing. The printed circuit board supports and carries a plurality of electrical components. At least one 201218348 electrical interconnect is provided to electrically connect the printed circuit board and/or the selected electrical component to the external device, which is carried by the printed circuit board. The insulating paper cover substantially completely surrounds the printed circuit board and includes at least an opening that permits the internal connection to expose the exterior of the outer casing. The package described is particularly suitable for '; sealing system level power electronics, such as power supplies. In some methods of the present invention, the insulating paper is formed into a box =. A plug-in printed circuit board is placed in the insulative carton and the potting material is configured as a box. The potting material is configured to substantially completely surround the /p brush circuit board' and substantially fill the insulating carton. The potting material is then cured to cure the potting material in the insulative carton and to bond the potting material to the insulating paper such that the insulating paper forms a potting material square Seal the printed circuit board. In this configuration, a packaged electronic device is provided, and the insulating paper forms the exposed outer surface of the packaged dream. In some embodiments, the potting material is provided in a plurality of steps. - : In a preferred implementation, a first volume of potting material is provided in the insulating paper 'before placing the printed circuit board in the box|: the road board is then placed in the viscous irrigation Above the sealing material, and the additional: top is provided on the printed circuit board to cover the solution before curing. The invention and its advantages are apparent from the following description, taken in conjunction with the accompanying drawings, in which the same reference numerals are used to the same. It should be understood that the depictions in the figures are not shown as = 201218348. [Embodiment] The present invention generally relates to a package & garment of a system level product, such as a power supply. In general, a printed circuit board having a plurality of electrical elements # is placed in a box formed of insulating paper. The box is filled with a sealant compound, whereby the electrical component is housed in a block of the potting compound in the insulating paper, and the insulating paper is effectively used as a y-packaged block. shell. A packaged electronic device 5 in accordance with an embodiment of the present invention is shown in FIG. In the illustrated embodiment, a preferred understanding is in conjunction with Figures 5(a)-5(d) 'The electronic device 60 is completely immersed in the block of the potting material 7〇' which has an exposed electrical mutuality. even. In the exemplary embodiment, the electrical interconnection takes the form of a plurality of lines 80 extending from a block, although in other embodiments, the interconnection may take the form of a link, or '' ^ Joints, and / or other suitable structures. The particular electronic device can vary considerably depending on the nature of the packaged product but generally includes a plurality of electrical components 62 mounted on a printed circuit board 64. The electrical interconnect is typically electrically coupled to associated component 62 or printed circuit board 64. The interconnect (e.g., line 8) is used to facilitate electrical connection of the electronic device to the external devices. The potting material 70 is a box 1 box formed of insulating paper. The encapsulating material 70 is substantially completely filled with the insulating carton, and preferably surrounds the electronic devices 60 on all sides, so that the electronic A is 60/re Any part touches the insulation paper. With this configuration, several of the electrical properties 201218348 are electrically insulated from the external device, which is achieved with the potting material 70. The wires are: an opening of the insulating carton (10) to urge the electronic device 60 to the outside:: an insulating carton_in the insulating carton 1. ", as the Γ link of the package device. The sealing material is in the box. This provides a very sturdy, = united in the package, which has good heat dissipation characteristics and two, and a reliable seal is like the electrical insulation properties of the savage. The flame retardant material 'has a fairly good electrical properties: edge: general-fire high dielectric constant), and can come from multiple supplies, special (eg high resistance and electrical properties can be selected to match any The specific library uses the thickness of the electronic device to enter: the heart is used to 'although in the household, 70 king is packaged_, generally speaking, the insulation paper does not need to measure the thickness, which will be described in detail below. It is particularly noted that the insulative carton 100 is quite different from the casing that is used to seal the jacket. m, is a 'first-stage power electronic package, I is in a metal or plastic casing, such as Those skilled in the art of packaging of the power level electronic devices in Figures 6 and 7 will understand that the following: "Insulation paper is sometimes used to assist in the electrical insulation of the two-shell housing. And other configurations, the electronic device is formed of one piece of insulating paper, each of which is placed on the 兮 绫 绫 | ? ? ? ? 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 - the sexual element and the metal casing enter - step: ", and assist in supporting the electronic device Set up: The material also provides environmental protection and assists in heat dissipation. According to the ^ understanding, 'this potting material is traditionally not filled with the outer casing of the insulated carton # 丨V cut w hai metal', the required structural support Conversely, in the present invention, the insulation 201218348, that is, the package product is not placed in the outer casing β of the package product as a metal (or other) casing order. Configuration, and it has several important advantages. Initially, the insulating paper/potting compound block package is believed to be much cheaper than conventional metal or plastic case packages. For example, a cost analysis estimates the insulation paper/ The potting compound block package can provide over 30% savings in materials used to package power electronics, as opposed to utilizing metal or plastic packaging. However, the cost savings of materials is only the advantage of utilizing the package. - The cost savings of the tool that produces a final product is more significant than the time-consuming improvement of the improvement. For example, 'when using - metal packaging, it takes 4 weeks and costs a bribe Manufacturing the required tool to form the metal package, including the use of a plastic package, which would take "weeks and cost $2 to make the desired mold to form the plastic package. Conversely, when using the insulation paper/irrigation Sealing compound block encapsulation method, the suitable insulating paper is likely to be designed and delivered in - weeks or faster, and (d) - point tool cost. This makes it possible to have a very fast product development cycle and make the product The package can be changed almost immediately and at a small cost, the basin is about developing and/or changing the traditional plastic or metal casing. In some cases, the insulating paper/potting compound square method is shorter and even more time-consuming than the material. The savings are even more important. The package configuration can be used to package any kind of electronic device H that is particularly suitable for system level power electronics. By way of example, the brake system 41 is suitable for use in a power supply. These packages are not sturdy. its. The reason for P is the insulating paper itself 201218348 p phase field is strong, and partly because the potting material block provides a very strong substrate to the insulating paper. Therefore, the packages are suitable for a very wide range of applications. Referring next to Fig. 2 in conjunction with Fig. 3-5, a method of packaging a hierarchical electronic product will be described hereinafter, which utilizes the insulated carton as a package for the exterior. Initially in step 702, a sheet of insulating paper 101 is patterned in a manner that is suitable for forming a carton 100. The paper 101's "real geometry" and the result box (10) can be widely changed to meet the needs of any special packaging. By way of example, in the actual target example shown in FIG. 3, the paper 101 is divided into a plurality of regions, which are separated by a slit 104 to the line 106 (indicated by a dotted line such as Xiao in FIG. 3). &. The exemplary areas include a bottom outer wall 丨丨〇, opposite end outer walls 丨丨 2 and 丨丨 3, a front outer wall U4, a back outer wall 115, and a cover 117. The front and back outer walls i 14 and 115; each comprising a pair of closures 121 each configured to be folded over an outer end wall "2, 113. The cover region 117 also includes a plurality of closures 123 that are each configured to fold over an associated outer end wall, and the closure 125 is configured to fold over the front outer wall raft 4. In the exemplary embodiment, the cover region 117 also has a pair of holes 134, the basin: configured such that the line can pass out of the box m. "To display two holes, it should be understood that the number of such holes may be different from their respective geometric shapes. Extensive changes to meet the needs of any particular package. There are a number of suppliers selling insulation paper, and the graphic representation of the insulation paper is done by the supplier (although it is not required). The insulating paper (9) can be folded to form a - box 100 as exemplified in the circle 4. (Step 201218348 704). If it is appropriate to apply glue to the cover (or above the surface of the cover that is in contact with the cover) to assist in maintaining the case in a self-supporting manner, although it is not necessary It will be described in more detail below. If the adhesive is used, it should be understood that the insulating paper 1〇1 and the actual geometry of the box can be varied widely to meet any special sealing needs. After the insulating carton 100 is formed, the insulative carton 100 is selectively accessible to a support hole (not shown). When used, the support aperture preferably maintains the insulating paper tightly, thereby maintaining its box format for subsequent potting processes. It is especially useful when the box is not bonded together. In other embodiments (and particularly in embodiments where the insulated carton is self-supporting), there is no need to place the box in a support hole. Once the box is properly placed, some of the potting material 70 is Placed in the insulated carton 100. Step 706. The initial placement of the potting material partially fills the box. After the preliminary potting material 7 is placed, the electronic device 60 is attached to the box 100 and attached to the preliminary potting material. Step 708, Figure 5 (a-b). The electronic devices are arranged such that the printed circuit board is effectively placed over the top of the preliminary potting material 7〇. Accordingly, the potting material can be used to define a starting distance between the insulating paper and the bottom surface of the printed circuit board 64. If any electrical component extends from the bottom surface of the printed circuit board 'the printed circuit board is pressed into position', any component on the lower surface of the printed circuit board 64 is pressed into the potting material And the printed circuit board itself still floats on the 10 201218348 preliminary potting material, as best shown in Figure 5(c). After the electronic devices are placed in the box 100, additional potting material is placed in the box to substantially fill the box. Step 710, Figure 5(d). In the described embodiment, the placement of the potting material is accomplished in two stages. An advantage of the two-stage placement method is that it has good control over the isolation distance between the insulating paper 丨0 0 and the printed circuit board 64 (and thus the components carried on the printed circuit board) . Another advantage of these two stage potting processes is that they substantially assist in reducing the likelihood of gas gap formation in the potting material under the printed circuit board. Although it is generally preferred to have a two-stage placement process, it is not required and it may place the potting material in a single bowl. In another embodiment, it may be desirable to place the potting material in more than two stages. By way of example, the additional placement phase can be placed in a particular environment in which a plurality of components are placed apart, placed in the box, and the components are vertically separated from the potting compound. After the potting compound is filled, the lines 80 are inserted through the lid opening 134 and the lid region 117 is lowered to position to effectively close the box 100. Step 712. In this configuration, the lines 80 extend from the top of the closed insulating carton 100, as shown in Figure i. Preferably, the lid region is in contact with the potting material such that the lid is firmly bonded to the potting material. After the lid is closed, the potting material cures to form a solid block that boxes the electronic device 6A. Step 714. The nature of this cure is primarily the same as the type of potting material used in any particular application. A wide variety of conventional electronic materials 70 can be used. Through the example, the traditional tricks... can be used to seal the compounds of the resin, ethyl urethane, hydrazine and acid base. The potting material preferably has a quality such that when it is cured, it will be firmly bonded to, = paper benefit. It maintains the insulating paper in position as the seal. An additional benefit of the method is that any cover that is not adhesively bonded to its associated outer wall (eg, the cover i2i, (2) (2) will pass through The potting material itself is adhered. As described above, when a supporting hole is utilized to operate the door in the potting, the holding box is not required before the potting operation. The caps are bonded to their associated outer walls. This simplifies the assembly of the insulating box but has the potential disadvantage of requiring the establishment of a suitable branch structure. In practice, the supporting structures are often a relatively large supporting hole matrix. , which makes many devices available; the shackles are blocked or, when the 3 boxes are assembled in a self-supporting method before the potting operation, the need to remove a support hole can be removed - that is, without a boring hole The potting 'can eliminate the potential need to place or manufacture a suitable support structure before starting to manufacture. The package is very strong and durable, has good heat dissipation, and flame properties, and it has good The protective (IP) rating is suitable for a wide range of applications. The insulating paper/potting compound block package described in shai can be used in a wide range of electronic device packaging applications. It is believed that the package is particularly suitable for packaging. System level power electronics, such as power supply benefits. However, it should be understood that the method of description is not limited to power electronics. An advantageous specific application is the power supply 12 for LED downlight illumination. It is quite sturdy and can be directly mounted on any suitable support structure during use. By way of example, in the embodiment of Fig. 8, a small bracket 53 can be used to stabilize the package 50 to a support structure 5 9 . For example, a substrate, a frame, or any other suitable structure. By way of example, in an LED downlight application, the support structure 59 can be a light frame to support the LED. Of course, the package 50 can also be Used in a wide range of other support structures. In an iL application, a power electronic device package according to the present invention generates a large amount of heat, and thus it may be desirable to provide A hot bath that assists in cooling the device. The heat sink can be applied to the packaged electronic device 5 in a variety of ways. A simple method is shown in Figure 9. In the exemplary embodiment, it is relatively broad, generally U-shaped bracket 55 is used to secure the packaged electronic device to the support 59 (again, it can be a substrate, a bracket, or any other suitable structure. The u-shaped bracket contacts the packaged electronic device 5 The plurality of sides of the crucible assist in dissipating heat and thus acting as an effective heat sink. While only a few embodiments of the invention have been described in detail herein, it is understood that the invention may be embodied in many other forms without departing from the invention. The details of the insulating paper are not discussed in detail herein and are well understood by those skilled in the art. Insulating papers are generally available in paper form and are available from a wide variety of sources and have a wide range of composition. For example, some (four) insulation paper (four) poly (four) paper. The skilled person will understand that there are multiple sources of insulation paper. These suppliers include, 3M, Sumitomo, and Dup〇nt. These characteristics of the insulating paper 13 201218348 can vary in order to meet the needs or specifications of any particular application. However, you pointed out that insulating paper generally has a suitable flame retardancy, electrical resistance, dielectric strength, a relatively high thermal coefficient, and a suitable thermal refraction temperature. Different suppliers refer to their products as insulating paper, flame retarded paper, and so on. By way of example, a suitable insulating paper comprising a ρΓ〇_gk f flame retarded polypropylene paper can be obtained from the 鸠 验 ( 四 四 四 四 四 四 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Change. By way of example, for insulation applications, insulating paper has the following characteristics to operate well with a ν'0 flame rating; 2) - dielectric strength is 2_volts/mU or greater. L-2 thermal refraction temperature is at least 120 degrees Celsius; 4) - The relative thermal coefficient exceeds 1 10 degrees c. In the illustrated embodiment, 'line 80 extends from the potting compound block to facilitate electrical connection to the applicator. However, it should be understood that :: electrical connectors, terminals, connectors, etc., can be used as the electrical internal connection, which is replaced or applied to the lines. In some implementations, the interior material may have structures (e.g., wires, connectors, etc.) that extend across and outside of the I insulating paper. In other applications, such internal connections (e.g., terminal connections β', etc.) may only be exposed via such openings. The plurality of different types of interconnections can be used in various embodiments. In the illustrated embodiment, the insulating paper used to form the package is convenient, and: a sheet type. Although this configuration is particularly "and required" for a process site. Therefore, the embodiments of the present invention should be considered as "unlimited" and the present invention is not limited by the details provided herein, but may be modified by the equivalent of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a flow chart of a packaged electronic device according to an embodiment of the invention. FIG. 3 is a flow chart of a method for packaging a system level electronic device according to an embodiment of the invention. A top view of an insulating paper suitable for forming a slice of an outer casing of a packaged electronic device according to an embodiment of the invention. FIG. 4 is a perspective view of a piece of insulating paper shown in FIG. It is a folded electric=packaged container casing, which is used for a package containing a printed circuit board, and the steps 5(a)-5(d) are shown in an electronic device according to the method of FIG. Figure 6 shows a prior art power supply package, metal case. Ia Figure 7 shows a prior art electro-plastic case. [Should protect the shock, it contains electronic devices] its use - Branch electronic device, 1 Fig. 9 is a view showing the sealed bracket mounting of Fig. 1. [Main component symbol description] 50 packaged electronic device or package 53, 55 Bracket 5 9 Support structure or support · 15 201218348 60 Electronic device 62 Electrical component 64 Printed circuit board 70 Potting material 80 Wire 100 Insulated carton 101 Insulating paper 104 Slit 106 Folding line 110 Bottom outer wall 112, 113 End Outer wall 114 Front outer 115 Back outer wall 1 17 Cover or cover part 121~125 Cover 134 Hole or cover opening 702~714 Step 16