201218302 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種運輸系統及方法，且特別是有關 於一種基板運輸系統及方法。 【先前技術】 隨著積體電路的需求及應用的增加，如何降低製造成 本便成為各半導體廠及/或面板廠首要面臨的問題。 在半導體及/或面板製程中，大量之製程係在一基板上 進行，用以在此基板上製造積體電路及/或薄膜電晶體。這 些製程包含有在基板上連續地沉積及蝕刻數層傳導層與絕 緣層。由於在每一個處理步驟後通常會在基板表面上留下 反應之殘留物，為了避免這些製程殘餘物影響後續製程之 進行，並防止反應室與其他基板受到製程殘餘物的污染， 目前大都在完成一處理步驟後，對處理後之基板進行清 潔，藉以移除黏附於基板上之製程殘餘物，同時也可以一 併清除在運輸過程中黏附於基板上之灰塵或髒污，來確保 製程可靠度。 由於機台多為批次加工的特性，各個機台之間的時間 配合便顯得特別重要。以目前的機台運作情況而言，基板 的處理效率常常會受限於機械手臂的速度以及基板取放片 效率，而無法有效提升。 【發明内容】 因此本發明的目的就是在提供一種基板運輸處理系統 201218302 及方法，用以提升基板的搬運及處理效率。 依照本發明一實施例，提出一種基板運輸處理系統， - 包含基板容置卡匣、對應於基板容置卡匣設置之第一機械 . 手臂、基板清潔機台、設置於基板清潔機台與第一機械手 臂之間的暫存機台、對應於第一機械手臂設置之可旋轉暫 存機台、基板加工機台，以及設置於可旋轉暫存機台與基 板加工機台之間的第二機械手臂。第一機械手臂包含第一 上手臂與第二下手臂。暫存機台包含雙層進片裝置與雙層 • 出片裝置。可旋轉暫存機台包含第一雙層取放片裝置及第 二雙層取放片裝置。第二機械手臂包含第二上手臂與第二 下手臂。 基板加工機台可為物理氣相基板加工機台或化學氣相 基板加工機台。雙層進片裝置與雙層出片裝置分別包含多 個傳送機構。傳送機構包含多個滚輪。傳送機構更包含多 個升降頂針，配置於滾輪之間。第一雙層取放片裝置及第 二雙層取放片裝置分別包含多個升降頂針。 • 本發明之另一態樣為一種應用前述之基板運輸處理系 統之基板運輸處理方法，包含提供多個基板於基板容置卡 匣中，接著第一上手臂與第一下手臂各自從基板容置卡匣 中取出基板，並將兩基板輸送至雙層進片裝置。雙層進片 裝置輸送兩基板至基板清潔機台，基板清潔機台對兩基板 進行清潔，再將清潔完成之兩基板輸送至雙層出片裝置， 第一上手臂與第一下手臂自雙層出片裝置中取出清潔完成 之兩基板，並將清潔完成之兩基板輸送至第一雙層取放片 裝置。此方法更包含將可旋轉暫存機台轉動第一角度，第 201218302 二上手臂與第二下手臂自第一雙層取放片裝置中取出清潔 完成之兩基板，並將清潔完成之兩基板輸送至基板加工機 台。基板加工機台對清潔完成之兩基板進行加工，接著， 第二上手臂與第二下手臂自基板加工機台中取出加工完成 之兩基板，並將加工完成之兩基板輸送至第二雙層取放片 裝置。此方法更包含將可旋轉暫存機台轉動第二角度，第 :上手臂與第一下手臂自第二雙層取放片裝置中取出加工 元成之兩基板’並將加工完成之兩基板輸送至另—基板容 置卡E °其中第-機械手f對兩基板的平均工作，小 於或等於基板&機㈣料㈣平私作時間。 本^減少了第—機械手f對每—塊基板的平均工作 “ 技術中第—機械手臂的搬運效率追不上 加^之處理效率而導致產能浪f的情形 縮短製程的關鍵時間，提升製程效率。’ 【實施方式】 以下將以圖式及詳細說明 何所屬技術領域中具有通二在二::之精神，任 施例後，當可由本發明所教示=瞭，月之較佳實 其並不脫離本發明之精神與範圍技術’加以改變及修飾， 實施發明之基板運輸處理系統-基板容置卡jjt、輸，系統刚中包含有至少-潔機台13〇、-暫存機台14()第===、-基板清 基板加工機台_，以及—第二機械手臂^台150、一 201218302 基板容置卡匣110及112用以放置多個基板。基板容 置卡匣110與112之内部側壁上設置有多個突出部，用以 支撐基板。第一機械手臂120包含有第一上手臂122與第 一下手臂124。第一機械手臂120對應於基板容置卡匣110 設置。暫存機台140設置於基板清潔機台130與第一機械 手臂120之間。暫存機台140包含有雙層進片裝置142以 及雙層出片裝置144，其中，由於基板清潔機台130通常 為上進下出的設計，故雙層進片裝置142較佳地相應設置 於雙層出片裝置144上方。 可旋轉暫存機台150亦對應於第一機械手臂120設 置。可旋轉暫存機台150包含有第一雙層取放片裝置152 以及第二雙層取放片裝置154,第一雙層取放片裝置152 係設置於第二雙層取放片裝置154之上。第二機械手臂170 設置於可旋轉暫存機台150與基板加工機台160之間。第 二機械手臂170包含有第二上手臂172以及第二下手臂 174。第一上手臂122、第一下手臂124、第二上手臂172 及第二下手臂174均包含指狀或叉狀結構。 本發明所揭露之基板運輸處理系統100可以有效提升 基板的搬運效率。具體而言，基板可為液晶玻璃。設置在 基板清潔機台130之前的暫存機台140具有雙層進片裝置 142與雙層出片裝置144,使得第一機械手臂120可以同時 搬運兩片基板至暫存機台140的雙層進片裝置142中暫 放，而接著由雙層進片裝置142依序進入基板清潔機台130 之中清潔。接著，清潔完的基板再從基板清潔機台130送 至暫存機台H0的雙層出片裝置144中暫放，後由第一機 201218302 械手臂U0將兩塊基板搬運至可旋轉暫存機台15〇上。 如此來，同樣以兩塊基板的清潔製程相比，傳統一 次僅能搬運-塊基板的製程，如需完成兩塊基板清潔，前 後所花費的時間，需包含兩次第—機械手f㈣在基板容 置卡E 110與基板清潔機纟13〇之間移動的時間、兩次基 板清潔機台130清潔基板的時間，以及兩次第一機械手臂 120在基板清潔機台13()與可旋轉暫存機台⑼之間移動201218302 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a transportation system and method, and more particularly to a substrate transportation system and method. [Prior Art] With the increasing demand and application of integrated circuits, how to reduce manufacturing costs has become the primary problem faced by semiconductor factories and/or panel manufacturers. In semiconductor and/or panel processes, a large number of processes are performed on a substrate to fabricate integrated circuits and/or thin film transistors on the substrate. These processes involve the continuous deposition and etching of several conductive and insulating layers on a substrate. Since the residue of the reaction is usually left on the surface of the substrate after each processing step, in order to prevent these process residues from affecting the subsequent processes and preventing the reaction chamber and other substrates from being contaminated by the process residues, most of them are currently completed. After a processing step, the processed substrate is cleaned to remove the process residue adhered to the substrate, and the dust or dirt adhered to the substrate during transportation can be removed together to ensure process reliability. . Since the machine is mostly batch-processed, the time coordination between the machines is particularly important. In terms of the current operation of the machine, the processing efficiency of the substrate is often limited by the speed of the robot arm and the efficiency of the substrate pick-and-place film, and cannot be effectively improved. SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a substrate transport processing system 201218302 and method for improving substrate handling and processing efficiency. According to an embodiment of the invention, a substrate transport processing system is provided, comprising: a substrate receiving cassette, a first machine corresponding to the substrate receiving cassette, an arm, a substrate cleaning machine, a substrate cleaning machine, and a a temporary storage machine between the robot arms, a rotatable temporary storage machine corresponding to the first mechanical arm, a substrate processing machine, and a second device disposed between the rotatable temporary storage machine and the substrate processing machine Mechanical arm. The first robot arm includes a first upper arm and a second lower arm. The temporary machine includes a double-layer feeding device and a double-layered device. The rotatable temporary storage machine comprises a first double-layer pick-and-place device and a second double-layer pick-and-place device. The second robot arm includes a second upper arm and a second lower arm. The substrate processing machine can be a physical vapor substrate processing machine or a chemical vapor substrate processing machine. The double-layer feeding device and the double-layer feeding device respectively comprise a plurality of conveying mechanisms. The transport mechanism contains a plurality of rollers. The transport mechanism further includes a plurality of lifting thimbles disposed between the rollers. The first double-layer pick-and-place device and the second double-layer pick-and-place device each include a plurality of lifting thimbles. Another aspect of the present invention is a substrate transport processing method using the substrate transport processing system described above, comprising providing a plurality of substrates in a substrate receiving cassette, and then the first upper arm and the first lower arm are each supported from the substrate The substrate is taken out in the cassette and the two substrates are transported to the double-layer feeding device. The double-layer feeding device transports the two substrates to the substrate cleaning machine, the substrate cleaning machine cleans the two substrates, and then transports the cleaned two substrates to the double-layer ejection device, the first upper arm and the first lower arm are double The cleaned two substrates are taken out from the layer ejection device, and the cleaned two substrates are transferred to the first double-layer pick-and-place device. The method further comprises rotating the rotatable temporary storage machine at a first angle, and the second upper arm and the second lower arm are taken out from the first double-layer pick-and-place device, and the two substrates are cleaned and the two substrates are cleaned. Transfer to the substrate processing machine. The substrate processing machine processes the two substrates that have been cleaned, and then the second upper arm and the second lower arm take out the processed two substrates from the substrate processing machine, and transport the processed two substrates to the second double layer. Release device. The method further comprises rotating the rotatable temporary storage machine by a second angle, the first arm and the first lower arm are taken out from the second double-layer pick-and-place device, and the two substrates are processed and the two substrates are processed. The average operation of the first substrate holding card E ° and the first manipulator f to the two substrates is less than or equal to the substrate & machine (4) material (4) flat private time. This reduces the average work of the first robot to each of the substrates. "Technology - the handling efficiency of the robot arm can not catch up with the processing efficiency of the processing, resulting in a capacity wave f, shortening the critical time of the process, and improving the process. Efficiency. 'Embodiment】 The following is a schematic diagram and a detailed description of the technical field of the art in the technical field, after any example, when the invention can be taught by the present invention, The substrate transportation processing system-substrate storage card jjt and the transmission of the invention are not deviated from the spirit and scope of the present invention. The system includes at least a cleaning machine 13〇, a temporary storage machine. 14 () ===, - substrate clearing substrate processing machine _, and - second mechanical arm ^ 150, a 201218302 substrate accommodating cassettes 110 and 112 for placing a plurality of substrates. The substrate receiving cassette 110 A plurality of protrusions are disposed on the inner sidewall of the housing 112 for supporting the substrate. The first robot arm 120 includes a first upper arm 122 and a first lower arm 124. The first robot arm 120 corresponds to the substrate receiving cassette 110. Settings. Temporary machine 140 settings The substrate cleaning machine 130 is disposed between the first robot arm 120. The temporary storage machine 140 includes a double layer feeding device 142 and a double layer ejection device 144, wherein the substrate cleaning machine 130 is generally up and down. The double-layer feeding device 142 is preferably disposed above the double-layer ejection device 144. The rotatable temporary storage station 150 is also disposed corresponding to the first mechanical arm 120. The rotatable temporary storage station 150 includes a first A double-layer pick-and-place device 152 and a second double-layer pick-and-place device 154 are disposed on the second double-layer pick-and-place device 154. The second mechanical arm 170 is disposed on The second robot arm 170 includes a second upper arm 172 and a second lower arm 174. The first upper arm 122, the first lower arm 124, and the second upper arm The arm 172 and the second lower arm 174 each include a finger or fork structure. The substrate transport processing system 100 disclosed in the present invention can effectively improve the transport efficiency of the substrate. Specifically, the substrate can be liquid crystal glass. Temporary machine 1 before station 130 40 has a double-layer feeding device 142 and a double-layer filming device 144, so that the first robot arm 120 can simultaneously carry two substrates to the double-layer feeding device 142 of the temporary storage station 140, and then is double-layered. The film feeding device 142 sequentially enters the substrate cleaning machine 130 for cleaning. Then, the cleaned substrate is sent from the substrate cleaning machine 130 to the double-layer film discharging device 144 of the temporary machine table H0 for temporary release. A machine 201218302 arm U0 transports two substrates to the rotatable temporary storage table 15 。. In this way, compared with the cleaning process of two substrates, the traditional process of only transferring the substrate can be carried out at once. The two substrates are cleaned, and the time taken before and after the time needs to include the time when the first robot-f (four) moves between the substrate accommodation card E 110 and the substrate cleaning machine 13 and the time when the substrate cleaning machine 130 cleans the substrate twice. And moving the first robot arm 120 between the substrate cleaning machine 13 () and the rotatable temporary machine table (9) twice
的時間。而本發明所需花費的時間則是—次第—機械手臂 120在基板办置卡g 11〇與暫存機纟14〇之間移動的時間、 兩次基板清潔機台13G清潔基板的時間，以及—次第一機 械手臂120在暫存機台14〇與可旋轉暫存機台⑼之間移 動的時間。明顯地，花費在基板搬運上的時間可以大幅地 縮小，提升製鋥#銮。 同=，雖然基板加工機台⑽一次僅能加工一塊 板，但疋第—機械手臂17G可以同時搬運兩塊基板，同; 可以縮減第二機械手臂17〇在基板加工機台16〇與物 暫存機台150之間移動所需的時間。 除此之外，以成本較為昂貴的基板加工機台16〇 :”【氣相基板加工機台或是化學氣相基板力… I = 2 —機械手臂⑶搬運的速度追不上基板加~ 口 160的處理速度，則會造成產能的浪費。本發明之 運輸處理系統100可以減少每一塊基板的平均搬運時^ 進而調整基板在各_停留時間，使得第—機械手臂^ 對每兩塊基板的平均工作時間，小於或是等於基板力叫 台160對母兩塊基板的平均工作時間，藉以解決因第叫 201218302 械手臂120搬運的速度追不上基板加工機台16〇的處理速 度而導致產能浪費的情形。 為更具體的說明本發明之功效，以下以物理氣相沉積 機台之基板加工機台160說明。 以第一機械手臂120與第二機械手臂170 —次僅能取 放一片基板的運作流程而言，自第一機械手臂12〇從基板 容置卡E 110取出基板起至將清潔完成的基板放到可旋轉 暫存機台150上’對每兩塊基板所花費的平均工作時間約 需120秒（每塊基板60秒的循環時間）’而物理氣相沉積 機台對每兩塊基板所花費的平均工作時間僅需約1〇〇秒 (每塊基板50秒的作業），因此會出現成本較為昂貴的物 理氣相沉積機台等待第一機械手臂12〇取放片的情形，造 成產能浪費。 應用本發明之基板運輸處理系統100之後，第一機械 手臂120從基板容置卡匣11〇取出兩塊基板起至將兩塊清 潔完成的基板放到可旋轉暫存機台15〇上所花費的平均工 作時間約需90秒，平均每塊基板的循環時間約為45秒， 小於物理氣相沉積機台約5〇秒的作業時間，便可以解決成 本較為昂貴的物理氣相沉積機台等待第一機械手臂12〇取 放片的情形。 製程的關鍵時間從原本基板循環時間的6〇秒縮短至 物理氣相沉積機台的50秒，除了解決第一機械手臂12〇的 搬運效率追不上基板加工機台160之處理效率而導致產能 浪費的情形之外，更進一步地縮短製程的關鍵時間，提升 製程效率。 201218302 參照第2A圖至第2H圖，其係分別繪示本發明之基板 f輸處理系統中之基板清潔階段一實施例的不同步驟的示 意圖。暫存機台140設置於第一機械手臂12〇與基板清潔 機台130之間。第一機械手臂12〇包含有第一上手臂122 以及第下手臂124。暫存機台14〇包含有雙層進片裝置 142以及雙層出片裝置144。雙層進片裝置以及雙層出 二裝置144刀別包含有傳送機構’傳送機構包含有設置於 :進片裝置142中之多個第一滾輪186與設置於雙層出 2置144中之多個第二滚輪188，第-滾輪186與第二 分別為對應於基板清潔機台⑽之輸送帶入口 132 帶出口 13U。傳送機構更包含有雙層地設置在 之間的多個第一升降頂針191與多個第二升 =頂=92，以及雙層地設置在第二滾輪188之間的多個 第—升_針193與帛四升降 滾輪186與第二滾輪188之 ;置於第一 升降頂斜收 第一升降頂針191、第二 配—升降頂針193與第四升降頂針194,更 -己置，與第-上手臂122及第—下手臂124錯開。 臂” L2A圖之步驟210 +，第一上手臂122與第一下手 第二基板182，並將第圖)搬來第—基板180與 中之第-升降頂針二η至雙層進片裝置⑷ 驻丄 财第一基板182送至雙層谁片 裝置142中之第二升降頂針192上。 达主又層進片 第2B圖之步驟220中，第一卜车 以離開雙層進片裝置142。第與第一下手臂 頂針192下降，以將第-魏升降頂針191與第二升降 下降乂將第-升降頂針192上的第二基板182 201218302 放置到第一滚輪186上，再藉由第一滾輪186的輸送而將 第二基板182進入基板清潔機台130中清潔。 第2C圖之步驟230中，再一次地下降第一升降頂針 191與第二升降頂針192,使得位於第一升降頂針191上的 第一基板180放置到第一滾輪186上，同樣藉由第一滚輪 186的輸送將第一基板180送入基板清潔機台130中清潔。 第2D圖之步驟240中，清潔完的第二基板182由基 板清潔機台130送出至第二滚輪188，再由第二滚輪188 輸送至預定位置。 第2E圖之步驟250中，第三升降頂針193與第四升降 頂針194上升，使得清潔完的第二基板182被第三升降頂 針193支撐。 第2F圖之步驟260中，後一步清潔完成的第一基板 180亦由基板清潔機台130送出至第二滚輪188上，再由 第二滚輪188輸送至預定位置。 第2G圖之步驟270中，第三升降頂針193與第四升 降頂針194再一次上升，使得清潔完的第一基板180被第 四升降頂針194支撐。如此一來，清潔完成的第一基板180 與第二基板182均被暫存在雙層出片裝置144之中。 第2H圖之步驟280中，第一機械手臂120之第一上 手臂122與第一下手臂124分別進入第三升降頂針193與 第四升降頂針194的下方，之後第一上手臂122與第一下 手臂124上升或是第三升降頂針193與第四升降頂針194 下降，使第一機械手臂120從雙層出片裝置144中取出第 一基板180與第二基板182，進而將第一基板180與第二 201218302 基板182送至可旋轉暫存機台150(見第1圖）。 本實施例中的暫存機台140亦可配合基板清潔機台 130而有其他的變形，如基板清潔機台130具有雙層軌道 可以同時清洗兩塊基板，則升降頂針可以省略。或者，滚 輪可以換成輸送帶等。 參照第3A圖至第3H圖，其係分別繪示第1圖中之基 板加工階段一實施例之不同步驟的示意圖。第二機械手臂 170設置於基板加工機台160與可旋轉暫存機台150之間。 可旋轉暫存機台150包含有第一雙層取放片裝置152以及 第二雙層取放片裝置154。第一雙層取放片裝置152包含 有雙層設置的多個第五升降頂針195及第六升降頂針 196。第二雙層取放片裝置154包含有雙層設置的多個第七 升降頂針197及第八升降頂針198。其中第五升降頂針 195、第六升降頂針196、第七升降頂針197與第八升降頂 針198配置為與第一上手臂122、第一下手臂124、第二上 手臂172與第二下手臂174之指狀或叉狀結構錯開。為方 便說明，第3A圖至第3H圖未依照實際擺設位置繪製，本 實施例之實際擺設位置，請參閱第1圖。 第3A圖之步驟310中，第一機械手臂120之第一上 手臂122與第一下手臂124將清潔完成的第一基板180與 第二基板182送至可旋轉暫存機台150之第一雙層取放片 裝置152中暫存，第一基板180與第二基板182分別放置 在雙層設置的第五升降頂針195與第六升降頂針196上。 第3B圖之步驟320中，可旋轉暫存機台150旋轉第一 角度，以轉向置放於第一雙層取放片裝置152中的第一基 12 [S1 201218302 板180與第二基板182。在本實施例中，由於可旋轉暫存 機台150僅具有一個取放口，故第一角度並不會等於零。 然而在其它實施例中’可旋轉暫存機台150可以具有多個 取放口，故可旋轉暫存機台15〇並不需要特意旋轉，亦即 第一角度可以為零。 第3C圖之步驟330中，第二機械手臂170之第二上手 臂172與第二下手臂174伸入第一雙層取放片裝置152 中’以取出清潔完並轉向的第一基板18〇與第二基板182。 第3D圖之步驟340中，第二機械手臂170轉向，將 第一基板180送入基板加工機台160中加工，第二基板182 暫時先放置在第二上手臂172上。 第3E圖中之步驟350中’加工完成的第一基板18〇 由第二下手臂174取回暫放’第二上手臂172再將第二基 板182送入基板加工機台160中加工。在本實施例中，基 板加工機台160與基板清潔機台130類似，亦通常為上進 下出的設計。加工完成的第二基板182再由第二上手臂172 取出（圖中未示）。 第3F圖中之步驟360中，第一基板180與第二基板 182均已加工完成，第二機械手臂170再次轉向，將加工 完成的第一基板180與第二基板182送入可旋轉暫存機台 150之第二雙層取放片裝置154中暫存。其中第一基板180 與第二基板182分別放置在第七升降頂針197與第八升降 頂針198上。 第3G圖之步驟370中，可旋轉暫存機台150旋轉第 二角度。接著’第一上手臂122與第一下手臂124伸入第 201218302 二雙層取放片裝置154中，以將加工完成的第一基板180 與第二基板182從第二雙層取放片裝置154中取出。與第 3B圖之步驟320類似，第二角度也可以為零。 第3H圖之步驟380中，第一機械手臂120將加工完 成的第一基板180與第二基板182送入另一基板容置卡匣 112之中。 綜合上述之實施例，以第一機械手臂120的一次工作 程序而言，第一機械手臂120始於將第一基板180與第二 基板182從基板容置卡匣110中取出，接著，將第一基板 180與第二基板182送入雙層進片裝置142之後，第一上 手臂122與第一下手臂124即可移動至雙層出片裝置144, 取出前一批清潔完成的第一基板180與第二基板182。接 著’再將清潔完成之第一基板180與第二基板182搬運至 可旋轉暫存機台150之第一雙層取放片裝置152中，然後 第一上手臂122與第一下手臂124再移動至第二雙層取放 片裝置154中，取出前一批加工完成的第一基板丨8〇與第 二基板182，最後，再將加工完成的第一基板18〇與第二 基板182送入另一基板容置卡昆112之中。 其中第一機械手臂120完成一次工作程序，包含前述 由基板容置卡匣110取出第一基板180與第二基板182至 將加工完成之第一基板18〇與第二基板182放回另一基板 谷置卡匣112的每兩基板的平均工作時間，小於或是等於 基板加工機台160加工第一基板180與第二基板182的每 的兩基板平均工作時間。 參照第4圖，其係繪示應用此基板運輪處理系統1〇〇 201218302 之基板運輸處理方法一實施例的流程圖。步驟402為提供 多個基板於基板容置卡匣中。接著，步驟404為第一上手 臂與第一下手臂自基板容置卡匣t取出該些基板中之兩基 板’並將兩基板輸送至雙層進片裝置。步驟406中，雙層 進片裝置輸送兩基板至基板清潔機台。接著，步驟408為 基板清潔機台對兩基板進行清潔，再將清潔完成之兩基板 輸送至雙層出片裝置。步驟410為第一上手臂與第一下手 臂自雙層出片裝置中取出清潔完成之兩基板，並將清潔完 成之兩基板輸送至第一雙層取放片裝置。 步驟412為將可旋轉暫存機台轉動第一角度。接著， 步驟414中’第二上手臂與第二下手臂自第一雙層取放片 裝置中取出清潔完成之兩基板，並將清潔完成之兩基板輸 送至基板加工機台。步驟416為基板加工機台對清潔完成 之兩基板進行加工。步驟418中，第二上手臂與第二下手 臂自基板加工機台中取出加工完成之兩基板，並將加工完 成之兩基板輸送至第二雙層取放片裝置。 步驟420為可旋轉暫存機台轉動第二角度。步驟422 中’第一上手臂與第一下手臂自第二雙層取放片裝置中取 出加工凡成之兩基板’並將加工完成之兩基板輸送至另一 基板容置卡g。 由上述本發明較佳實施例可知，應用本發明具有下列 €點°本發Μ少了第-機械手臂對每-塊基板的平均工 作時間解決了習知技術中第一機械手臂的搬運效率追不 上基板力^機台之處理效率而導致產能浪費的情形，更進 -步地縮紐製程的關鍵時間，提升製程效率。 15 [S] 201218302 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作各種之更動與潤飾，因此本發明之保 護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖係繪示本發明之基板運輸處理系統一實施例的 示意圖。 第2A圖至第2H圖其係分別繪示本發明之基板運輸處 理系統中之基板清潔階段一實施例的不同步驟的示意圖。 第3A圖至第3H圖係分別繪示第1圖中之基板加工階 段一實施例之不同步驟的示意圖。 第4圖係繪示應用此基板運輸處理系統100之基板運 輸處理方法一實施例的流程圖。 【主要元件符號說明】 100 ： 基板運輸處理系統 172 第 二上手臂 110、 112 :基板容置卡匣 174 第 二下手臂 120 ： 第一機械手臂 180 第 一基板 122 ： 第一上手臂 182 第 二基板 124 ： 第一下手臂 186 第 一滾輪 130 ： 基板清潔機台 188 第二滚輪time. The time required for the present invention is the time when the robot arm 120 moves between the substrate handling card g 11〇 and the temporary storage device 14〇, the time when the substrate cleaning machine 13G cleans the substrate twice, and - The time during which the first first robot arm 120 moves between the temporary machine 14 〇 and the rotatable temporary machine (9). Obviously, the time spent on substrate handling can be greatly reduced, and the system can be improved. Same as =, although the substrate processing machine (10) can only process one plate at a time, the first mechanical arm 17G can carry two substrates at the same time, the same; the second mechanical arm 17 can be reduced on the substrate processing machine 16 The time required to move between the storage stations 150. In addition, the cost of the more expensive substrate processing machine 16 〇: "[GC substrate processing machine or chemical vapor substrate force... I = 2 - robot arm (3) transport speed can not catch the substrate plus ~ mouth The processing speed of 160 may result in waste of productivity. The transportation processing system 100 of the present invention can reduce the average handling time of each substrate, and then adjust the retention time of the substrate at each time, so that the first mechanical arm is applied to each of the two substrates. The average working time is less than or equal to the average working time of the base plate 160 to the two mother substrates, so as to solve the problem that the processing speed of the first processing machine is not able to catch up with the processing speed of the first processing machine. In the case of a more detailed description of the effects of the present invention, the following description is based on the substrate processing machine 160 of the physical vapor deposition machine. The first robot arm 120 and the second robot arm 170 can only take one substrate. In terms of operational flow, from the first robot arm 12〇, the substrate is taken out from the substrate receiving card E110, and the cleaned substrate is placed on the rotatable temporary storage station 150. The average working time of the block substrate takes about 120 seconds (60 seconds per substrate). The physical working time of the physical vapor deposition machine for each two substrates is only about 1 second (per The block substrate has a 50 second operation), so that a relatively expensive physical vapor deposition machine waits for the first robot arm 12 to pick up and release the film, resulting in waste of productivity. After applying the substrate transportation processing system 100 of the present invention, The average working time taken by a robot arm 120 from the substrate receiving cassette 11 to take out two substrates to the two cleaned substrates onto the rotatable temporary storage station 15 is about 90 seconds, on average. The cycle time of the substrate is about 45 seconds, which is less than the working time of the physical vapor deposition machine of about 5 sec., so that the more expensive physical vapor deposition machine waits for the first robot arm 12 to pick up and release the film. The critical time of the process is shortened from 6 seconds of the original substrate cycle time to 50 seconds of the physical vapor deposition machine, except that the handling efficiency of the first robot arm 12〇 cannot be traced to the substrate processing machine 160. In addition to the situation that the productivity is wasteful, the critical time of the process is further shortened, and the process efficiency is improved. 201218302 Referring to FIG. 2A to FIG. 2H, respectively, the substrate in the substrate f transmission processing system of the present invention is shown. A schematic diagram of different steps of an embodiment of the cleaning stage. The temporary machine 140 is disposed between the first robot arm 12A and the substrate cleaning machine 130. The first robot arm 12 includes a first upper arm 122 and a lower arm 124. The temporary storage machine 14A includes a double-layer feeding device 142 and a double-layer feeding device 144. The double-layer feeding device and the double-layer discharging device 144 include a conveying mechanism. The conveying mechanism includes: a plurality of first rollers 186 of the film feeding device 142 and a plurality of second rollers 188 disposed in the double-layered output 144, the first roller 186 and the second respectively are conveyor belt inlets corresponding to the substrate cleaning machine (10) 132 with outlet 13U. The conveying mechanism further comprises a plurality of first lifting thimbles 191 and a plurality of second liters=top=92 disposed between the two layers, and a plurality of first liters disposed between the second rollers 188 in a double layer. The needle 193 and the fourth lifting roller 186 and the second roller 188; the first lifting top obliquely receives the first lifting ejector pin 191, the second matching lifting ejector pin 193 and the fourth lifting ejector pin 194, and more - Upper arm 122 and first-lower arm 124 are staggered. Step 210 + of the arm L2A diagram, the first upper arm 122 and the first lower hand second substrate 182, and the first figure is moved to the first substrate 180 and the middle first lifting ejector pin η to the double layer feeding device (4) The first substrate 182 is sent to the second lifting ejector pin 192 of the double-layer device 142. In step 220 of the second layer of the second layer, the first car is moved away from the double-layer feeding device 142. And the first lower arm ejector pin 192 is lowered to place the first Wei lifting thimble 191 and the second lifting ejector 放置 to place the second substrate 182 201218302 on the first lifting ejector pin 192 onto the first roller 186, and then The second substrate 182 is cleaned by entering the second substrate 182 into the substrate cleaning machine 130. In step 230 of FIG. 2C, the first lifting ejector pin 191 and the second lifting ejector pin 192 are lowered again so that the first lifting ejector pin is located. The first substrate 180 on the 191 is placed on the first roller 186, and the first substrate 180 is also sent to the substrate cleaning machine 130 for cleaning by the conveyance of the first roller 186. In step 240 of FIG. 2D, the cleaning is completed. The second substrate 182 is sent by the substrate cleaning machine 130 to the second roller 188. The second roller 188 is transported to the predetermined position. In the step 250 of FIG. 2E, the third lifting ejector pin 193 and the fourth lifting ejector pin 194 are raised, so that the cleaned second substrate 182 is supported by the third lifting ejector pin 193. 2F In step 260, the first substrate 180 that has been cleaned in the latter step is also sent by the substrate cleaning machine 130 to the second roller 188, and then transported to the predetermined position by the second roller 188. In step 270 of FIG. 2G, the third The lifting ejector pin 193 and the fourth lifting ejector pin 194 are again raised, so that the cleaned first substrate 180 is supported by the fourth lifting ejector pin 194. Thus, the cleaned first substrate 180 and the second substrate 182 are temporarily stored in the double In the step 280 of the second embodiment, the first upper arm 122 and the first lower arm 124 of the first robot arm 120 respectively enter the lower side of the third lifting ejector 193 and the fourth lifting ejector pin 194, respectively. The first upper arm 122 and the first lower arm 124 are raised or the third lifting ejector pin 193 and the fourth lifting ejector pin 194 are lowered, so that the first mechanical arm 120 takes out the first substrate 180 and the second substrate from the double-layer ejection device 144. 182, The first substrate 180 and the second 201218302 substrate 182 are sent to the rotatable temporary storage station 150 (see Fig. 1). The temporary storage station 140 in this embodiment can also cooperate with the substrate cleaning machine 130 to have other Deformation, if the substrate cleaning machine 130 has a double-layer track to clean two substrates at the same time, the lifting ejector pin can be omitted. Alternatively, the roller can be replaced with a conveyor belt, etc. Referring to Figures 3A to 3H, the drawings are respectively shown. 1 is a schematic diagram of different steps of an embodiment of the substrate processing stage. The second robot arm 170 is disposed between the substrate processing machine 160 and the rotatable temporary storage station 150. The rotatable temporary storage station 150 includes a first double-layer pick-and-place device 152 and a second double-layer pick-and-place device 154. The first double-layer pick-and-place device 152 includes a plurality of fifth lifting thimbles 195 and a sixth lifting thimble 196 which are disposed in two layers. The second double-layer pick-and-place device 154 includes a plurality of seventh lifting ejector pins 197 and a second lifting ejector pin 198 disposed in a double layer. The fifth lifting ejector pin 195, the sixth lifting ejector pin 196, the seventh lifting ejector pin 197 and the eighth lifting ejector pin 198 are disposed with the first upper arm 122, the first lower arm 124, the second upper arm 172 and the second lower arm 174. The fingers or forks are staggered. For the sake of convenience, the 3A to 3H drawings are not drawn in accordance with the actual arrangement position. For the actual arrangement position of this embodiment, please refer to Fig. 1. In step 310 of FIG. 3A, the first upper arm 122 and the first lower arm 124 of the first robot arm 120 send the cleaned first substrate 180 and the second substrate 182 to the first of the rotatable temporary storage station 150. The two-layer pick-and-place device 152 is temporarily stored, and the first substrate 180 and the second substrate 182 are respectively placed on the fifth lifting ejector pin 195 and the sixth lifting ejector pin 196 which are disposed on two layers. In step 320 of FIG. 3B, the rotatable temporary stage 150 is rotated by a first angle to steer the first base 12 placed in the first double-layer pick-and-place device 152 [S1 201218302 board 180 and second substrate 182 . In the present embodiment, since the rotatable temporary storage station 150 has only one pick-and-place port, the first angle does not equal zero. However, in other embodiments, the rotatable temporary storage station 150 can have a plurality of access ports, so that the rotatable temporary storage table 15 does not need to be intentionally rotated, i.e., the first angle can be zero. In step 330 of FIG. 3C, the second upper arm 172 and the second lower arm 174 of the second robot arm 170 extend into the first double-layer pick-and-place device 152 to take out the cleaned and turned first substrate 18〇 And the second substrate 182. In step 340 of Fig. 3D, the second robot arm 170 is turned, the first substrate 180 is fed into the substrate processing machine 160, and the second substrate 182 is temporarily placed on the second upper arm 172. In step 350 of Fig. 3E, the processed first substrate 18A is taken back by the second lower arm 174, and the second upper arm 172 is fed to the substrate processing machine 160 for processing. In the present embodiment, the substrate processing machine 160 is similar to the substrate cleaning machine 130 and is also generally of the up and down design. The processed second substrate 182 is then removed by the second upper arm 172 (not shown). In step 360 of FIG. 3F, both the first substrate 180 and the second substrate 182 have been processed, and the second robot arm 170 is turned again to feed the processed first substrate 180 and the second substrate 182 into the rotatable temporary storage. The second double-layer pick-and-place device 154 of the machine 150 is temporarily stored. The first substrate 180 and the second substrate 182 are respectively placed on the seventh lifting ejector pin 197 and the eighth lifting ejector pin 198. In step 370 of Fig. 3G, the rotatable temporary stage 150 is rotated by the second angle. Then, the first upper arm 122 and the first lower arm 124 extend into the second double-layer pick-and-place device 154 of the 201218302 to remove the processed first substrate 180 and the second substrate 182 from the second double-layer pick-and-place device. Take out 154. Similar to step 320 of Figure 3B, the second angle can also be zero. In step 380 of FIG. 3H, the first robot arm 120 feeds the processed first substrate 180 and the second substrate 182 into another substrate receiving cassette 112. In the above embodiment, in the first working procedure of the first robot arm 120, the first robot arm 120 starts to take the first substrate 180 and the second substrate 182 out of the substrate receiving cassette 110, and then, After the substrate 180 and the second substrate 182 are fed into the double-layer feeding device 142, the first upper arm 122 and the first lower arm 124 can be moved to the double-layer ejection device 144, and the first batch of the cleaned first substrate is taken out. 180 and a second substrate 182. Then, the cleaned first substrate 180 and the second substrate 182 are transported to the first double-layer pick-and-place device 152 of the rotatable temporary storage station 150, and then the first upper arm 122 and the first lower arm 124 are further Moving to the second double-layer pick-and-place device 154, taking out the first batch of processed first substrate 丨8〇 and the second substrate 182, and finally, sending the processed first substrate 18〇 and the second substrate 182 The other substrate is accommodated in the card. The first robot arm 120 completes a working procedure, including removing the first substrate 180 and the second substrate 182 from the substrate receiving cassette 110 to return the processed first substrate 18 and the second substrate 182 to another substrate. The average working time of each of the two substrates of the valley cassette 112 is less than or equal to the average working time of the two substrates of the first substrate 180 and the second substrate 182 processed by the substrate processing machine 160. Referring to Fig. 4, there is shown a flow chart of an embodiment of a substrate transport processing method using the substrate transport processing system 1201218302. Step 402 is to provide a plurality of substrates in the substrate receiving cassette. Next, in step 404, the first upper arm and the first lower arm take out two of the substrates from the substrate receiving cassette 并将t and transport the two substrates to the double-layer feeding device. In step 406, the dual layer feeding device transports the two substrates to the substrate cleaning machine. Next, in step 408, the two substrates are cleaned for the substrate cleaning machine, and then the two substrates that have been cleaned are transported to the double-layer ejection device. Step 410: The first upper arm and the first lower arm are taken out from the double-layer ejection device to clean the two substrates, and the cleaned two substrates are transported to the first double-layer pick-and-place device. Step 412 is to rotate the rotatable temporary machine table by a first angle. Next, in step 414, the second upper arm and the second lower arm take out the cleaned two substrates from the first double-layer pick-and-place device, and transport the cleaned two substrates to the substrate processing machine. Step 416 processes the two substrates that have been cleaned for the substrate processing machine. In step 418, the second upper arm and the second lower arm extract the processed two substrates from the substrate processing machine, and transport the processed two substrates to the second double-layer pick-and-place device. Step 420 is to rotate the second angle of the rotatable temporary machine. In step 422, the first upper arm and the first lower arm take out the processed two substrates from the second double-layer pick-and-place device, and transport the processed two substrates to the other substrate receiving card g. It can be seen from the above preferred embodiment of the present invention that the application of the present invention has the following points: the average working time of the first mechanical arm to each of the substrates is solved, and the handling efficiency of the first mechanical arm in the prior art is solved. Without the substrate force, the processing efficiency of the machine leads to waste of production capacity, and the key time of the process of refining the new process is improved, and the process efficiency is improved. [S] 201218302 Although the present invention has been disclosed in a preferred embodiment as above, it is not intended to limit the invention, and various modifications may be made without departing from the spirit and scope of the invention. And the scope of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A schematic of an embodiment. 2A to 2H are schematic views respectively showing different steps of an embodiment of the substrate cleaning stage in the substrate transport processing system of the present invention. 3A to 3H are schematic views respectively showing different steps of an embodiment of the substrate processing stage in Fig. 1. Figure 4 is a flow chart showing an embodiment of a substrate transport processing method using the substrate transport processing system 100. [Main component symbol description] 100: Substrate transport processing system 172 Second upper arm 110, 112: Substrate receiving cassette 174 Second lower arm 120: First robot arm 180 First substrate 122: First upper arm 182 Second Substrate 124: first lower arm 186 first roller 130: substrate cleaning machine 188 second roller
201218302 132 :輸送帶入口 134 :輸送帶出口 140 :暫存機台 142 :雙層進片裝置 144 :雙層出片裝置 150 :可旋轉暫存機台 152 :第一雙層取放片裝置 154 :第二雙層取放片裝置 160 :基板加工機台 170 :第二機械手臂 191 :第一升降頂針 192 :第二升降頂針 193 :第三升降頂針 194 :第四升降頂針 195 :第五升降頂針 196 :第六升降頂針 197 :第七升降頂針 198 :第八升降頂針 210〜422 :步驟201218302 132 : Conveyor belt inlet 134 : Conveyor belt outlet 140 : Temporary storage machine 142 : Double-layer feeding device 144 : Double-layer ejection device 150 : Rotatable temporary storage machine 152 : First double-layer feeding and unloading device 154 : second double-layer pick-and-place device 160 : substrate processing machine 170 : second mechanical arm 191 : first lifting ejector 192 : second lifting ejector 193 : third lifting ejector 194 : fourth lifting ejector 195 : fifth lifting Thimble 196: sixth lifting ejector 197: seventh lifting ejector 198: eighth lifting ejector 210 to 422: steps
17 m17 m