TW201202336A - Resin composition, transparent composite substrate and display device substrate - Google Patents
Resin composition, transparent composite substrate and display device substrate Download PDFInfo
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- TW201202336A TW201202336A TW100121282A TW100121282A TW201202336A TW 201202336 A TW201202336 A TW 201202336A TW 100121282 A TW100121282 A TW 100121282A TW 100121282 A TW100121282 A TW 100121282A TW 201202336 A TW201202336 A TW 201202336A
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- Prior art keywords
- resin composition
- antioxidant
- substrate
- resin
- glass
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 116
- 239000002131 composite material Substances 0.000 title claims abstract description 78
- 239000011342 resin composition Substances 0.000 title claims abstract description 56
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 69
- 239000011521 glass Substances 0.000 claims abstract description 67
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 57
- 239000003822 epoxy resin Substances 0.000 claims abstract description 55
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 55
- 239000000945 filler Substances 0.000 claims abstract description 26
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 25
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000004744 fabric Substances 0.000 claims abstract description 17
- 239000003365 glass fiber Substances 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims description 36
- 239000011347 resin Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 14
- 239000004593 Epoxy Substances 0.000 claims description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 8
- 239000001301 oxygen Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 206010034133 Pathogen resistance Diseases 0.000 claims 1
- 206010036790 Productive cough Diseases 0.000 claims 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims 1
- 150000004056 anthraquinones Chemical class 0.000 claims 1
- 238000010276 construction Methods 0.000 claims 1
- 210000003802 sputum Anatomy 0.000 claims 1
- 208000024794 sputum Diseases 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 29
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 abstract description 13
- 238000012360 testing method Methods 0.000 abstract description 10
- 230000006866 deterioration Effects 0.000 abstract description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 4
- 239000011574 phosphorus Substances 0.000 abstract description 4
- 230000002977 hyperthermial effect Effects 0.000 abstract 1
- 235000006708 antioxidants Nutrition 0.000 description 58
- 238000011156 evaluation Methods 0.000 description 11
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- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 7
- 125000002091 cationic group Chemical group 0.000 description 7
- 238000000034 method Methods 0.000 description 7
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- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 5
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- 229910052782 aluminium Inorganic materials 0.000 description 3
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
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- 239000004973 liquid crystal related substance Substances 0.000 description 3
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000004817 gas chromatography Methods 0.000 description 2
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- 150000002500 ions Chemical class 0.000 description 2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
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- 125000001424 substituent group Chemical group 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- VNQNXQYZMPJLQX-UHFFFAOYSA-N 1,3,5-tris[(3,5-ditert-butyl-4-hydroxyphenyl)methyl]-1,3,5-triazinane-2,4,6-trione Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CN2C(N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C(=O)N(CC=3C=C(C(O)=C(C=3)C(C)(C)C)C(C)(C)C)C2=O)=O)=C1 VNQNXQYZMPJLQX-UHFFFAOYSA-N 0.000 description 1
- ZQXCQTAELHSNAT-UHFFFAOYSA-N 1-chloro-3-nitro-5-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC(Cl)=CC(C(F)(F)F)=C1 ZQXCQTAELHSNAT-UHFFFAOYSA-N 0.000 description 1
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Natural products C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 1
- BVUXDWXKPROUDO-UHFFFAOYSA-N 2,6-di-tert-butyl-4-ethylphenol Chemical compound CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 BVUXDWXKPROUDO-UHFFFAOYSA-N 0.000 description 1
- JRMAQQQTXDJDNC-UHFFFAOYSA-M 2-ethoxy-2-oxoacetate Chemical compound CCOC(=O)C([O-])=O JRMAQQQTXDJDNC-UHFFFAOYSA-M 0.000 description 1
- ODJQKYXPKWQWNK-UHFFFAOYSA-N 3,3'-Thiobispropanoic acid Chemical compound OC(=O)CCSCCC(O)=O ODJQKYXPKWQWNK-UHFFFAOYSA-N 0.000 description 1
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 1
- BYRKZZJQBLXWPY-UHFFFAOYSA-N 3-(3-dodecanoyloxy-3-oxopropyl)sulfanylpropanoyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OC(=O)CCSCCC(=O)OC(=O)CCCCCCCCCCC BYRKZZJQBLXWPY-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
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- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
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- 210000003298 dental enamel Anatomy 0.000 description 1
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- 238000001514 detection method Methods 0.000 description 1
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- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
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- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical group CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
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- 125000000962 organic group Chemical group 0.000 description 1
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- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
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- 239000002689 soil Substances 0.000 description 1
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- 239000011593 sulfur Substances 0.000 description 1
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- 229920005992 thermoplastic resin Polymers 0.000 description 1
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- 235000019303 thiodipropionic acid Nutrition 0.000 description 1
- JOUDBUYBGJYFFP-FOCLMDBBSA-N thioindigo Chemical compound S\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2S1 JOUDBUYBGJYFFP-FOCLMDBBSA-N 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- MZHULIWXRDLGRR-UHFFFAOYSA-N tridecyl 3-(3-oxo-3-tridecoxypropyl)sulfanylpropanoate Chemical compound CCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCC MZHULIWXRDLGRR-UHFFFAOYSA-N 0.000 description 1
- QTUIJRIDZOSXHJ-UHFFFAOYSA-N tridecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCCOS(O)(=O)=O QTUIJRIDZOSXHJ-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Liquid Crystal (AREA)
- Laminated Bodies (AREA)
Abstract
Description
201202336 六、發明說明: 【發明所屬之技術領域】 本發明係有關樹脂組成物、透明複合基板以及顯示元 件基板。 …μ 【先前技術】 液晶顯示元件或錢EL顯示元件賴示元件中使用 之基板(顯示元件基板)' 彩色遽光片基板、太陽能電池用基 板等係廣泛地使用玻璃板。然而,由於玻璃板有易裂、無 法彎曲以及不適於輕量化等的缺點,因此,近年來研究著 以塑膠材料所構成之基板為其取代材。 例如在專利文獻1、2中記載-種液晶顯示元件用透明 樹脂基板’其係由使包含環氧樹脂、酸酐系硬化劑以及硬 化觸媒的環氧樹脂組成物硬化而得的硬化體所構成者。然 而,該等之以往取代玻璃使用的塑膠材料,其線膨脹係數 較玻璃板大。因此’特別是使用在主動矩陣顯示元件基板 時,在該製造步驟中會產生基板的翹曲以及隨之而來的配 線的斷線之問題。因此,在該等用途上難以使用。 因此,為了降低線膨脹係數而將破璃粉或玻璃纖維等 無機填充物調配在樹脂材料中以進行材料的複合化。然 而,由於樹脂材料與無機填充物之折射率不同,因此,穿 透樹脂材料的光在樹脂材料與無機填充物之界面上散射 時,會損及複合材料的透明性。 為了解決上述問題,專利文獻3揭示—種透光性環氧 樹脂組成物,其係由與由酸酐硬化而成之環氧樹脂實質上 為相同折射率的填充材所構成者。其係在如此之樹脂組成 4/31 201202336 物中,試著藉由壓低椒氧樹脂與填充材之間的折射率差而 使複合材料透明化。 在如上所述之複合材料中,即使透明性提高,也會產 生基於複合材料所1有之構造而產生峨之光學各向異 • 性。具體而言,由於樹脂材料與填充物(填充材)之熱膨脹係 • 數不同’因此’在兩者的界面中會產生微小的内部應力, • 隨而發生樹脂材料的分子定向,藉此產生光學各向異性。 如此之光學各向異性’由於穿透複合材料之光會造成相位 差,因此在使用複合材料製造例如顯示元件基板時,會難 以達到清楚的顯示。尤其,在近年來,因顯示像素的精細 化之進展,複合材枓中之光學各向異性成為更加重要之特 性。 例如’在顯不凡件基板中,於歷熱處理的嚴苛環境下 進行可靠性試驗,求取可耐該嚴苛環境的耐久性。铁而, 卻出現由可靠性試驗之先學各向紐惡化的問題。 [先前技術文獻] [技術文獻1 ]日本特開平6-337408號公報 [技術文獻2]日本特開平7_】2〇74〇號公報 [技術文獻3]日本特開平4_2362丨7號公報 【發明内容】 [發明所欲解決之課題] 本發明之目的係提供一種樹心 成物所f ^成㈣該樹脂組 成物料以縣板,該樹脂組 物了楗供一種透明设合基板, 板’而可提供在财钟難處轉的可靠 5/31 201202336 制因内部應力所引起的光學各向異性(〇pticalanis〇tr〇py) 之惡化的透明複合基板。 [用以解決課題之手段] 如此之目的係藉由下述(1)至(12)之發明而達成: (1) 一種樹脂組成物’係在透明複合基板之製造中使用 的樹爿曰組成物,其特徵係包含:環氧系樹脂、玻璃填充物 以及受阻酚系抗氧化劑。 (2) 如上述(丨)之樹脂組成物,其中上述受阻酚系抗氧 化wj之δ里在〇.〇 1質量%以上、5質量%以下。 (3) 如上述(1)或(2)之樹脂組成物,其中上述受阻齡系 抗氧化劑之融點為1〇〇。(;以上。 (4) 如上述(〗)至(3)中任一項之樹脂組成物,其中上述 受阻酚系抗氧化 劑係在該分子構造中具有新戊烷構造者。 (5) 如上述(1)至(4)中任一項之樹脂組成物,其係相對 於受阻酚系抗氧 化劑100質量份而言,進一步含有3〇至3〇〇質量份之 比例的填糸抗氧化劑。 (6) 如上述(1)至(5)中任一項之樹脂組成物,其中上述 環氧系樹脂係包 含脂環式環氧樹脂與縮水甘油型環氧樹脂者。 (7) 如上述(6)之樹脂組成物,其中上述脂環式環氧樹 脂係包含下述化學 式(1)所示之脂環式環氧樹脂以及下述化學式(2)所示之 脂年式壤乳樹月旨中的至少一者, 6/31 201202336201202336 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a resin composition, a transparent composite substrate, and a display element substrate. ... [Prior Art] A liquid crystal display element or a substrate (display element substrate) used in a display device for a light EL display device is widely used as a color plate substrate, a solar cell substrate, or the like. However, since the glass plate has the disadvantages of being cracked, not bendable, and not suitable for weight reduction, in recent years, a substrate made of a plastic material has been studied as a substitute material. For example, the transparent resin substrate for a liquid crystal display element described in the patent documents 1 and 2 is composed of a cured body obtained by curing an epoxy resin composition containing an epoxy resin, an acid anhydride-based curing agent, and a curing catalyst. By. However, these plastic materials used in the past for replacing glass have a larger coefficient of linear expansion than glass plates. Therefore, in particular, when the active matrix display element substrate is used, the warpage of the substrate and the consequent disconnection of the wiring are caused in this manufacturing step. Therefore, it is difficult to use in such applications. Therefore, in order to lower the coefficient of linear expansion, an inorganic filler such as glass frit or glass fiber is blended in a resin material to composite the material. However, since the refractive index of the resin material and the inorganic filler are different, when the light penetrating the resin material is scattered at the interface between the resin material and the inorganic filler, the transparency of the composite material is impaired. In order to solve the above problems, Patent Document 3 discloses a light-transmitting epoxy resin composition comprising a filler having substantially the same refractive index as an epoxy resin obtained by curing an acid anhydride. In such a resin composition 4/31 201202336, it is attempted to make the composite transparent by lowering the refractive index difference between the oxide resin and the filler. In the composite material as described above, even if the transparency is improved, optical anisotropy due to the structure of the composite material is generated. Specifically, since the thermal expansion coefficient of the resin material and the filler (filler) is different, "there is a slight internal stress in the interface between the two, and the molecular orientation of the resin material occurs, thereby generating optical Anisotropy. Such an optical anisotropy is difficult to achieve a clear display when a composite material is used to fabricate, for example, a display element substrate because the light penetrating the composite material causes a phase difference. In particular, in recent years, optical anisotropy in composite enamel has become a more important characteristic due to the progress of the refinement of display pixels. For example, in the display substrate, the reliability test was carried out under the harsh environment of the heat treatment, and the durability against the severe environment was obtained. Iron, but there is a problem of deterioration in the first test of the reliability test. [J] Japanese Patent Application Laid-Open No. Hei. No. Hei. No. Hei. No. Hei. [Problem to be Solved by the Invention] The object of the present invention is to provide a tree core material, which is a material of the resin composition, which is provided with a transparent substrate, a plate. Providing a reliable composite substrate with a deterioration of optical anisotropy (〇pticalanis〇tr〇py) due to internal stress caused by the reliable 5/31 201202336. [Means for Solving the Problem] The object is achieved by the inventions of the following (1) to (12): (1) A resin composition' is a tree 爿曰 composition used in the manufacture of a transparent composite substrate The article is characterized by comprising an epoxy resin, a glass filler, and a hindered phenol antioxidant. (2) The resin composition of the above (丨), wherein the δ of the hindered phenol-based antioxidant wj is 质量·〇 1% by mass or more and 5% by mass or less. (3) The resin composition according to (1) or (2) above, wherein the melting point of the antioxidant group is 1 Å. (4) The resin composition according to any one of the above (1) to (3) wherein the hindered phenol-based antioxidant has a neopentane structure in the molecular structure. The resin composition according to any one of (1) to (4) further comprising a ruthenium-containing antioxidant in a ratio of from 3 to 3 parts by mass based on 100 parts by mass of the hindered phenol-based antioxidant. (6) The resin composition according to any one of the above (1) to (5), wherein the epoxy resin is an alicyclic epoxy resin and a glycidyl epoxy resin. (7) as described above (6) The resin composition of the present invention, wherein the alicyclic epoxy resin comprises an alicyclic epoxy resin represented by the following chemical formula (1) and a lipid-type poplar tree represented by the following chemical formula (2) At least one of them, 6/31 201202336
p Ο) 〇p Ο) 〇
(2) [上述式[2]中,-X-表示·〇_、-S-、-SO-、-S02-、_CH _、 -CH(CH3)- 2-' 或-C(CH3)2-]。 (8) 如上述(6)或(7)之樹脂組成物,其中,相對於上述 脂環式環氧樹脂100質量份而言,上述縮水甘油型環氧樹 脂之含量為0.5至丨〇質量份。 (9) 如上述(丨)至(8)中任一者之樹脂組成物,其中上述 玻璃填充物為玻璃纖維布。 (10) 如上述(1)至(9)中任一者之樹脂組成物,其中該樹 脂組成物在30(TC之溫度下經加熱丨分鐘之後,實質上=二 檢測出上述抗氧化劑或其分解成分之氣體。 、、久 (11) 一種透明複合基板,其特徵係^如上述⑴ 中任一者之樹脂組成物的硬化物所構成者。 (12) —種顯示元件基板,其特徵係具備如上 明複合基板。 远 [發明之效果] 依據本發明,可得到-種樹脂組成物,而該樹脂 物可提供-種透明複合基板,_脂組祕在硬化作成^ 合基板時,可減低内部應力㈣起的光學各向里性,= 提供可取代玻璃基板的透明複合基板。 、 做為顯示元件基板之用途,透明複合基板之長期可靠 7/31 201202336 性是必要的,故須尋求於可靠性試驗中沒有或少有特性惡 化之透明複合基板。依據本發明,可得到在可靠性試於中 光子各向異性的惡化小的透明複合基板、以及光學各Θ里 性小而可清楚地顯示之顯示元件基板。 【實施方式】 [用以實施發明之形態] 以下,對於本發明之樹脂組成物、透明複合基板以及 顯示元件基板,根據附圖所示之較佳實施形態進行詳細戈 本發明之樹脂組成物係將其成形並使之硬化 明之複合體所財,其包含魏系樹脂、玻輯充物 受阻龄系抗氧化劑。 及 本發明之透明複合基板係由上述樹脂組成物 狀、予以硬化而成,而具有小的光學各向異性小者。、為板 :且,本發明之顯示元件基板具備上述透明複 板’,、光學各向異性小而可清楚地顯示。 σ 土 〈樹脂組成物> 首先’對於本發明之樹驗祕it行說明。 玻璃填充物 本發,之樹脂组成物係包括環 及受阻酚系抗氧化劑。 (環氧樹脂) 本=明中所使用之環氧樹脂可 樹脂、雙IF型環氧樹脂 牛二A型^ 化物、具有二環戊二歸骨竿之产¥讀脂或該等之氮 基異三聚氰_料之氧„胳、具有三縮水甘油 乳树月日、具有Cardo(各種苯環與 8/31 201202336 第結合而成者)骨架的環氧樹腊、具有聚砍氧烷構造之環氧 樹脂、脂環式多官能環氧樹脂、具有氫化聯笨骨架之脂環 式%氧樹脂、具有氣化雙紛A骨架之脂環•錄樹脂等, 可使用1種或2種以上之該等環氧樹脂的混合物。 並且’上述環氧樹脂大致可分類為:如包含縮水甘油 基及醚鍵之縮水甘油醚型環氧樹脂、包含縮水甘油基及酯 鍵之縮水甘油醋型環氧樹脂、包含縮水甘油基及胺基之縮 水甘油胺型環氧樹脂的縮水甘油型環氧樹脂;以及具有脂 裱式環氧基之脂環式環氧樹脂,惟在本發明中,特別以使 用分子内具有2似上環魏環己賊之轉式環氧樹脂 為佳。 、又,特別以使用下述化學式(1)所示之氫化聯笨型脂環 式環氧構造、或下述化學式(2)所示之脂環式環氧構造為佳^(2) [In the above formula [2], -X- represents ·〇_, -S-, -SO-, -S02-, _CH _, -CH(CH3)- 2-' or -C(CH3)2 -]. (8) The resin composition according to the above (6) or (7), wherein the content of the glycidyl type epoxy resin is from 0.5 to 丨〇 by mass based on 100 parts by mass of the alicyclic epoxy resin . (9) The resin composition according to any one of (1) to (8) above, wherein the glass filler is a glass fiber cloth. (10) The resin composition according to any one of the above (1) to (9), wherein the resin composition is substantially at least two times after the temperature of TC is heated for 丨 minutes to detect the antioxidant or (1) A transparent composite substrate characterized by being a cured product of the resin composition according to any one of the above (1). (12) A display element substrate, the characteristics of which are The composite substrate is as described above. [Effect of the Invention] According to the present invention, a resin composition can be obtained, and the resin can provide a transparent composite substrate, and the _ lipid group can be reduced when it is hardened into a substrate. Optical entanglement from internal stress (4), providing a transparent composite substrate that can replace the glass substrate. As a display substrate, the long-term reliability of the transparent composite substrate is necessary. Therefore, it is necessary to seek In the reliability test, there is no or a small number of transparent composite substrates having deteriorated characteristics. According to the present invention, it is possible to obtain a transparent composite substrate which is less susceptible to deterioration in photonic anisotropy in reliability, and which is small in optical properties. [Brief Description of the Invention] [Embodiment] The resin composition, the transparent composite substrate, and the display element substrate of the present invention will be described in detail with reference to preferred embodiments shown in the drawings. The resin composition of the invention is formed by forming and hardening the composite of the invention, which comprises a Wei resin, a glass-filled age-resistant antioxidant, and the transparent composite substrate of the invention is composed of the above resin composition. In the shape and hardening, it has a small optical anisotropy, and is a plate: and the display element substrate of the present invention includes the above-mentioned transparent composite plate, and the optical anisotropy is small and can be clearly displayed. Soil <Resin Composition> First, the description of the tree of the present invention is explained. The glass filler is a resin composition comprising a ring and a hindered phenol-based antioxidant. (Epoxy resin) The epoxy resin can be used as a resin, the double IF type epoxy resin, the second type A compound, the product having the dicyclopentane quinone bismuth, or the oxygen of the nitrogen-based iso-cyanide. Ethylene wax with a triglycidyl milk tree, a skeleton with Cardo (a combination of various benzene rings and 8/31 201202336), an epoxy resin with polycaxane structure, and an alicyclic polyfunctional An epoxy resin, an alicyclic type oxy-resin having a hydrogenated double-branched skeleton, an alicyclic resin having a gasified double-A skeleton, a recording resin, or the like may be used, and one or a mixture of two or more of these epoxy resins may be used. 'The above epoxy resins can be roughly classified into: glycidyl ether type epoxy resins containing glycidyl groups and ether bonds, glycidol type epoxy resins containing glycidyl groups and ester bonds, glycidyl groups and amine groups. a glycidyl type epoxy resin of a glycidylamine type epoxy resin; and an alicyclic epoxy resin having a lipid oxime type epoxy group, but in the present invention, in particular, the use of a molecule like a ring-like ring The thief's rotary epoxy resin is preferred. Further, it is preferable to use a hydrogenated biphenyl type epoxy ring structure represented by the following chemical formula (1) or an alicyclic epoxy structure represented by the following chemical formula (2).
[上述式[2]中,-X-表示_〇_、各、_S0_、_s〇 -CH(CH3)- 2_、 或-C(CH.3)2_]。 里如此之脂環式環氧樹脂,由於在低溫中的硬化性優 ^ ’故可在低溫中進行硬化處理。藉由此,則無需使樹脂 組成物設在高溫下硬化,因此,之後即使將樹脂組成二^ 1至室溫亦可抑制溫度所致的變化量。其結果,用使用本 發明之樹脂組成物而得的透明複合基板,可抑制伴隨著1 9/31 201202336 度變化之熱應力的產生,而可抑制光學各向異性 如上述之脂環式環氧樹脂,因硬化後料脹 低,因此,在制包含娜環輕氧㈣旨 == =透Γί基板中,在玻璃填充物與環氧樹二界面中 的界面應力幾乎成為〇的溫度係接近室溫。因此,夢由使 用^:之樹脂組成物,即可得到上述界面透明 複&基板’⑽該相複合紐之光學各向異[In the above formula [2], -X- represents _〇_, each, _S0_, _s〇 -CH(CH3)-2_, or -C(CH.3)2_]. Such an alicyclic epoxy resin can be hardened at a low temperature because of its excellent hardenability at low temperatures. By this, it is not necessary to set the resin composition to be hardened at a high temperature, and therefore, the amount of change due to temperature can be suppressed even if the resin is composed of 2 to 1 room temperature. As a result, the transparent composite substrate obtained by using the resin composition of the present invention can suppress the generation of thermal stress accompanying the change of the degree of 19/31 201202336, and can suppress the optical anisotropy such as the above-mentioned alicyclic epoxy. Resin, because of the expansion of the material after hardening, therefore, in the preparation of the substrate containing the ring of light oxygen (4), the interface stress in the interface between the glass filler and the epoxy tree is almost the temperature of the system close to the chamber. temperature. Therefore, the dream is obtained by using the resin composition of ^: to obtain the above-mentioned interface transparent complex & substrate' (10) optical phase of the composite
且,由於輯脹係數較低,何在翻複合基板 曲或彎捲等之變形。 I 由於該等脂環式環氧樹脂之透明性以及耐敎性優異, =而有助於透紐優異、且耐祕高崎明複合基板之實 並且’本發明之樹驗成物巾,環氧樹脂係以併用脂 衣式壤氧韻無水甘油型環氧_者為佳。藉此,可確 ^氧樹脂之透,性,且提高環氧伽與抗氧化劑的相溶 人。其結果’可得到透級高且光學各向異性低的透 二基板。並且’由於環氧樹職抗氧化狀娜性的提高, 可抑制抗氧化劑_發性,亦提高透明複合基板之耐熱性。 —此時&水甘'由型%、氧樹脂之添加量,相對於脂環式 展輯脂HK)質量份,以〇丨至1G f量份左右為佳,以]Moreover, since the coefficient of expansion is low, the deformation of the composite substrate is curved or curved. I. Because of the excellent transparency and stagnation resistance of these alicyclic epoxy resins, it is helpful for the excellent and resistant to the high-tech composite substrate and the 'inventive tree of the present invention, epoxy It is preferred that the resin is used in combination with a fat-based type of oxyhydrogen glycerin type epoxy. Thereby, the permeability of the oxygen resin can be confirmed, and the compatibility of the epoxy glycerol with the antioxidant can be improved. As a result, a translucent substrate having high transmittance and low optical anisotropy was obtained. Further, since the oxidation resistance of the epoxy tree is improved, the antioxidant resistance can be suppressed, and the heat resistance of the transparent composite substrate can also be improved. - At this time, the amount of & water Gan's type, the amount of oxygen resin added, relative to the alicyclic synthetic grease HK) parts by mass, preferably from about G to 1G f parts, to]
=5質量份左红佳。藉此,即可高度地兼顧透光性 保與光學各向異性的抑制。 S 在使用之縮水甘油型環氧樹脂之中亦以使用具有c則 毒造之縮水甘油型環氧樹脂為佳。亦即,藉由在脂環 =樹脂中添加具有eardG構造之縮水甘油型環氧樹脂^ ’即成為包含源自雙芳基㈣架的多數個芳香環,因而 10/31 201202336 可抑制透明複合基板之光學各向異性,並可更加提升透明 性及耐熱性。 如此具有cardo構造之縮水甘油型環氧樹脂可列舉 如:〇n-C〇at EX系列(長瀨產業公司製)、〇gs〇丨(大阪瓦斯化 學公司製)等。 (硬化劑) 本發明之樹脂組成物可包含環氧樹脂之硬化劑。該硬 化劑可列舉如:酸酐、脂肪族胺等之㈣冑、陽離子系硬 化劑、陰離子系硬化劑等,可使用該等之】種或2種以上 的混合物。 X 4之中特別以使用陽離子系硬化劑為佳。使用陽離 子系硬^劑日夺’可在較低溫度下使環氧樹脂硬化,因此, 在更化¥無骷將樹脂組成物設在高溫,即可將隨菩、θ庚 :之熱應力的產生進行抑制。因而,可得到光;::ί 性低的透明複合基板。 ” 舰ΐί ’藉由使用陽離子系硬化劑,可得到耐熱性(例如: 離子系高的ί賴合基板。此可認為是藉由使用陽 故。’、沖丨而使核氧樹脂之硬化物的交聯密度增高之 發陽離劑’可列舉如:藉由加熱而釋出引 合劑系陽離;硬:;硬化劑、_ 人夕払c 由化此線而釋出弓丨發陽離工¥ ““域鹽系陽離子系硬化劑等。該等之中:^ 硬=化更化瞻。藉此,可得到耐熱性更為優異之 熱陽離子系硬化劑之例可列舉如:芳香族綺鹽、芳香 201202336 族鏘鹽、銨鹽、I呂螯合劑、三敗化石朋胺錯合物等。具體而 5,可列舉如:做為芳香族疏鹽的三新化學工業製造之 %601^S1_80L、ST_】00L,旭電化工業製造之§ρ_66'或队乃 等的六氟銻酸鹽等;做為鋁螯合劑之乙醯乙酸乙基鋁二異 丙酸酯(al_inum ethy丨acetoacetate d丨is〇pr〇py丨他)、鋁三(乙 醯乙酸乙酯)等,做為三氟化硼胺錯合物可列舉如:三氟化 石朋單乙胺錯合物、三氟化石朋味嗤錯合物、三氣化縣咬錯 合物等。 另外,光陽離子系硬化劑之例可列舉如:旭電化工業 製造之SP-ΠΟ等。 ’、 如此之陽離子系硬化_含量並無_㈣,惟例如 在使用上軌學切)所社環⑽糾,相對於環氧樹脂 】〇〇質量份’ m至5質量份左右為佳,特別以〇 5至3 質量份更佳。含量未達上述之τ限值時,會有硬化性低落 的情形,而超出上述之上限值時,透明複合基板會有易破 裂之情形。 ,在使光硬化時,可因應需要而併用促進硬化反應之用 的增敏劑、酸增殖劑(acidAmplifiers)等。 (玻璃填充物) ★玻璃填充物係以由無機系玻璃材料所成之纖維或粒子 等而構成的填充物(填充材)。 具體而言’可列舉如:玻璃布、破璃不織布等玻璃纖 維布;玻璃纖維絲(glass fllament);玻璃纖維切股⑹挪 chopped strand);玻璃珠;玻璃片;破璃粉、研磨玻璃等’ 其中’亦以透賴合基板之線膨脹係、數的減低效果為高, 因而以玻璃纖維絲以及玻璃纖維布為適用,尤以玻璃纖維 12/31 201202336 布更適用。 無機系玻璃材料可列舉如:E玻璃、c玻璃、A玻璃、 S玻璃、T玻璃、D玻璃、NE玻璃、石英(玻璃)、低介電率 玻璃、高介電率玻璃等,其中以使用鹼金屬等之離子性雜 質少且可容易取得的E玻璃、S玻璃、T玻璃、N£玻璃為 佳,尤其以使用30t至250t:中之平均線膨脹係數為5ppm 以下的S玻璃或T玻璃更佳。 玻璃填充物之含量係以在透明複合基板中】至90質量 %之量者為佳,以成為10至80質量%之量為更佳,以為3〇 至70質量。/。之量又更佳。玻璃填充物之含量在該範圍時, 則易於成升>,且有因複合化而降低線膨脹之效果。並且, 如玻璃填充物之量多,因應力的均一性提高,故每單位體 積的樹脂量之均一性提高。該等之均—性提高時,透明^ 合基板的彎捲變小。 玻璃纖維絲及玻璃纖維布之直徑以lOOmn以下為佳。 如此之玻璃纖維絲及玻璃纖維布,不易因該等之折射率與 環氧樹脂之折射率的差而產生在界面的散射,因此,透明 複合基板之透明性變的較高。 反之,直徑超出丨OOnm時,則宜考量到與環氧樹脂之 折射率的差。此時,在構成玻璃纖維絲及玻璃纖維布之玻 璃材料中,以折射率丨.4至丨.6者為適用,以丨,5至丨.55者 更適用。藉此,可得到寬廣波長領域中具有高的透 透明複合魏。 ~ < 另外,玻璃纖維切股、玻璃珠、玻璃片、玻螭粉、研 磨玻璃等的平均粒徑,亦以l〇0nm以下為佳,以8〇〇阳以 下更佳。 13/31 C. 201202336 (抗氧化劑) 做為受阻酚系抗氧化劑,可列舉例如:BHT、2,2’ -亞甲基雙(4-甲基-6-第三丁g分)、新戊四醇四|;3-(3,5-二第三丁 基-4-羥苯基)丙酸酯]、3,3’,3”,5,5’,5” -六第三丁基-α, α’,α” -(均三甲苯-2,4,6-三基)三對曱酚、十八基-3-(3,5-二第三丁基-4-羥苯基)丙酸酯、:l,3,5-三[(4-第三丁基-3-羥基 -2,6-二曱苯基)甲基;μ,3,5-三嗪-2,4,6-(1Η,3Η,5Η)-5,、 1,3,5-三(3,5-二第三丁基-4-羥苄基)-1,3,5-三嗪 -2,4,6-(1凡31-丨,5印-三酮、二乙基雙[{3,5-雙(],1-二曱基乙 基)-4-羥苯基}曱基]磷酸鈣、雙(2,2’ -二羥基-3,3’ -二第三 丁基-5,5’ -二曱基苯基)乙烷、Ν,Ν’ -己烷-1,6-二醯基雙 [3-(3,5-二第三丁基)-4-羥苯基j丙醯胺等之受阻酚系抗氧化 劑’可使用該等之1種或2種以上之混合物。= 5 parts by weight left red. Thereby, it is possible to achieve a high degree of compatibility between light transmission and optical anisotropy. S It is also preferable to use a glycidyl type epoxy resin having a poison of c in the use of the glycidyl type epoxy resin. That is, by adding a glycidyl type epoxy resin having an eardG structure to the alicyclic ring=resin to form a plurality of aromatic rings derived from a bisaryl (tetra) frame, 10/31 201202336 can suppress the transparent composite substrate. The optical anisotropy can further improve transparency and heat resistance. Examples of the glycidyl type epoxy resin having a cardo structure include 〇n-C〇at EX series (manufactured by Nagase Industrial Co., Ltd.), 〇gs〇丨 (manufactured by Osaka Gas Chemical Co., Ltd.), and the like. (Hardener) The resin composition of the present invention may contain a hardener of an epoxy resin. Examples of the hardening agent include (IV) anthracene such as an acid anhydride or an aliphatic amine, a cationic hardening agent, and an anionic curing agent. These may be used, or a mixture of two or more thereof may be used. Among the X 4 , a cationic hardener is particularly preferably used. The use of a cationic hardening agent can harden the epoxy resin at a lower temperature. Therefore, the resin composition can be set at a high temperature in a more stable manner, and the thermal stress of the coating can be used. Production is inhibited. Thus, light can be obtained;:: A transparent composite substrate having low lusity. ΐ ΐ ' ' By using a cationic hardener, heat resistance can be obtained (for example, a high-ionic substrate with a high ion content. This can be considered to be a hardening of a nuclear oxygen resin by using a positive electrode. The cation-eliminating agent with increased cross-linking density can be exemplified by: releasing the priming agent by heating; hard:; hardening agent, _ 払 払 払 由 化 化 由 由 由 由" " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " " "绮 salt, aromatic 201202336 锵 salt, ammonium salt, Ilu chelating agent, tri-negative fossilamine complex, etc. Specific and 5, for example, as the aromatic salt-salting Sanxin chemical industry manufacturing%601 ^S1_80L, ST_]00L, §ρ_66' manufactured by Asahi Kasei Industrial Co., Ltd., or hexafluoroantimonate of Team, etc.; ethyl acetoacetate ethylaluminum diisopropylate (al_inum ethy丨acetoacetate d as aluminum chelating agent)丨is〇pr〇py丨), aluminum tris(acetate ethyl acetate), etc., as a boron trifluoride amine complex can be enumerated The trifluoride pentaethylamine complex, the trifluorocarbon pentazone complex, the Sanhuahua County bite complex, etc. Further, examples of the photocationic hardener include, for example, SP manufactured by Asahi Kasei Industrial Co., Ltd. -ΠΟ, etc. ', such a cationic hardening _ content is not _ (four), but for example, using the upper rail to cut) the ring (10) correction, relative to the epoxy resin 〇〇 mass parts 'm to 5 parts by mass Preferably, it is preferably 5 to 3 parts by mass, and if the content does not reach the above-mentioned τ limit, there is a case where the hardening property is low, and when the above upper limit is exceeded, the transparent composite substrate may be easily broken. When curing the light, a sensitizer, an acid amplifier, or the like for promoting the hardening reaction may be used in combination as needed. (Glass filler) ★ The glass filler is made of an inorganic glass material. A filler (filler) composed of fibers, particles, etc. Specifically, a glass fiber cloth such as glass cloth or glass non-woven fabric; glass fllament; glass fiber stranded (6) chopped strand) Glass beads; glass flakes; broken glass Grinding glass, etc. 'Where' is also a high-strength effect of the linear expansion system and the number of the substrate, so glass fiber fiber and glass fiber cloth are suitable, especially glass fiber 12/31 201202336 cloth is more suitable. Examples of the glass material include E glass, c glass, A glass, S glass, T glass, D glass, NE glass, quartz (glass), low dielectric glass, high dielectric glass, and the like, wherein alkali is used. E glass, S glass, T glass, and N glass, which are easy to obtain ionic impurities such as metal, are preferable, and S glass or T glass having an average linear expansion coefficient of 5 ppm or less in 30 t to 250 t: good. The content of the glass filler is preferably from 90% by mass in the transparent composite substrate, more preferably from 10 to 80% by mass, and is from 3 Å to 70% by mass. /. The amount is even better. When the content of the glass filler is within this range, it is easy to rise and the effect of reducing the linear expansion due to the compositing. Further, if the amount of the glass filler is large, the uniformity of the stress is improved, so that the uniformity of the amount of the resin per unit volume is improved. When the uniformity is improved, the bending of the transparent substrate becomes small. The diameter of the glass fiber fiber and the glass fiber cloth is preferably 100 nm or less. Such a glass fiber fiber and a glass fiber cloth are less likely to cause scattering at the interface due to the difference between the refractive index of the resin and the refractive index of the epoxy resin. Therefore, the transparency of the transparent composite substrate becomes high. Conversely, when the diameter exceeds 丨 00 nm, the difference from the refractive index of the epoxy resin should be considered. In this case, among the glass materials constituting the glass fiber yarn and the glass fiber cloth, those having a refractive index of 丨4 to 丨6 are suitable, and those of 5, 5 to 丨.55 are more suitable. Thereby, a transparent transparent composite Wei having a wide wavelength range can be obtained. ~ < In addition, the average particle diameter of glass fiber strands, glass beads, glass flakes, glass matte powder, ground glass, etc. is preferably 10 Å or less, and more preferably 8 〇〇 or less. 13/31 C. 201202336 (Antioxidant) As a hindered phenolic antioxidant, for example, BHT, 2,2'-methylenebis(4-methyl-6-third-butylene), neopenta Tetrahydrin tetra||3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 3,3',3",5,5',5"-hexa-t-butyl -α, α', α" - (mesitylene-2,4,6-triyl)trisylphenol, octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl) Propionate, :l,3,5-tri[(4-tert-butyl-3-hydroxy-2,6-diphenyl)methyl; μ,3,5-triazine-2,4 ,6-(1Η,3Η,5Η)-5,, 1,3,5-tris(3,5-di-t-butyl-4-hydroxybenzyl)-1,3,5-triazine-2, 4,6-(1 where 31-丨,5-trione, diethylbis[{3,5-bis(],1-didecylethyl)-4-hydroxyphenyl}indenyl]phosphoric acid Calcium, bis(2,2'-dihydroxy-3,3'-di-t-butyl-5,5'-didecylphenyl)ethane, hydrazine, Ν'-hexane-1,6-di One or a mixture of two or more of these may be used as the hindered phenol-based antioxidant such as fluorenyl bis[3-(3,5-di-t-butyl)-4-hydroxyphenyl-propionamide.
具體上可列舉例如:1RGANOX 1330、IRGANOX 1010、丨RGANOX 1076、IRGANOX 3114(以上為汽巴精細 化學公司製造);SUMIL1ZER BHT、SUMILIZER BP-101(以 上為住友化學公司製造);YOSH1NOX BHT、YOSHINOX 250、TOMINOX SS、TOM1NOX TT、YOSHINOX 314、 GSY-242(以上為 AH-Corp.公司製造);ADKSTABAO-50、 Mark AO-50、ADKSTAB AO-60、ADKSTAB AO-20(以上為 ADEKA公司製造)等。 受阻酚系抗氧化劑之含量係以樹脂組成物之0.01質量 %以上5質量%以下為佳,以超出〇.〇1質量%未達5質量% 更佳,又以0.1質量%以上3質量%以下左右又更佳。藉由 使抗氧化劑之含量在上述範圍内時,可得到光學各向異性 低的透明複合基板,並且,亦可得到即使在可靠性試驗中 14/31 201202336 光學各向異性之惡化小的透明複合基板。 中之====::=-:複合基板 中一項理由為:受阻酉分部位與環氧 准可列舉其 由消除或保護成為環氧樹脂劣化之起^B、目互作用係藉 樹脂的劣化。並且,由於受阻二 增加受_部=::: j便九干女疋性增大,亦即,可抑 其結果,可得到光學各向異性低^=^^的惡化。 得到即使在可靠性試驗中光學各向里性二及可 合基板。 〃、f生之…'化小的透明複 並且’受阻料、抗氧化劑之融點 靴更佳。融點如在上職㈣防^上為佳’以 確實有+ P由方;才对脂組成物在硬化時 =有=化劑的留存,因而可提高上述光學安定性。盆 ;旱到上所述之融點的受崎系抗氧化劑,即 異性的明:化:透=合可靠性試驗咖光學各向 2_並為;:,==之==,至 受阻酚七 又住又以丨_至1400尤佳。 抑·• 重量平均分子量如在上述範圍内,可 几魏叙揮發性,且可確保對魏職之相溶性。 二細分系抗氧化劑即使歷經如逕熱處理之可靠性試驗 的透US板觀料實魏㈣絲各向異性之惡化 更且,觉阻盼系抗氧化劑在該分子構造甲係以具有新 15/31 201202336 戊烧構造或異三聚氰酸酯構造者為佳。由於該等構造均為 立體或平面之較為擴大的構造,因此多數之結合位(例如 羥基)分布於寬廣區域而存在。因此,具有該等構造之受阻 盼系抗氧化劑與環氧樹脂的結合(相互作用)機率提高,使受 阻盼系抗氧化劑與環氧樹脂的結合狀態可確實地^時期$ 持。其結果,在將樹脂組成物進行硬化時,可防止受阻酚 系抗氧化儀揮發、或透明複合基板之賴性的降I — 另外,上述新戊烧構造較佳者為藉由包含在受阻盼以 外的部位而使其作用與效果更加顯著。 再者,做為分子構造中包含新戊院構造 氧化劑,可列舉下述化學式(3)所示之 = IRGANOX 1010 等)〇 則 f-Bu HO-ί-Βϋ -ch2ch2co〇ch2- 更且,做為分子構造中包含異Specifically, for example, 1RGANOX 1330, IRGANOX 1010, 丨RGANOX 1076, IRGANOX 3114 (above is manufactured by Ciba Fine Chemical Co., Ltd.); SUMIL1ZER BHT, SUMILIZER BP-101 (above), YOSH1NOX BHT, YOSHINOX 250 , TOTOMOX SS, TOM1NOX TT, YOSHINOX 314, GSY-242 (above AH-Corp.); ADKSTABAO-50, Mark AO-50, ADKSTAB AO-60, ADKSTAB AO-20 (above ADEKA) . The content of the hindered phenol-based antioxidant is preferably 0.01% by mass or more and 5% by mass or less based on the resin composition, and more preferably 5% by mass or less, and more preferably 0.1% by mass or more and 3% by mass or less. It’s better and better. When the content of the antioxidant is within the above range, a transparent composite substrate having low optical anisotropy can be obtained, and a transparent composite having a small deterioration in optical anisotropy even in the reliability test 14/31 201202336 can be obtained. Substrate. Medium ====::=-: One reason for the composite substrate is that the hindered part and the epoxy are listed as the starting point of the elimination or protection of the epoxy resin. Deterioration. Moreover, since the resistance is increased by the _ part =::: j, the virginity is increased, that is, the result is suppressed, and the deterioration of the optical anisotropy is lowered. An optical omnidirectional two and a achievable substrate were obtained even in the reliability test. 〃, f 生...'s small transparent complex and 'blocking material, antioxidant melting point boots are better. If the melting point is better in the upper (4) prevention, it is better to have + P; only when the fat composition is hardened = there is a retaining agent, so that the above optical stability can be improved. Basin; drought-to-the-point melting point of the anti-oxidant, that is, the opposite sex: chemical: penetration = reliability test coffee optical direction 2_ and is;:, == ==, to hindered phenol Seven live and again 丨 _ to 1400 is especially good. If the weight average molecular weight is within the above range, it can be volatile and can ensure the compatibility with Wei. The two sub-system antioxidants even worsened the anisotropy of the Wei (four) filament anisotropy after the reliability test of the heat treatment such as the diameter heat treatment, and the antioxidants were in the molecular structure of the system to have a new 15/31 201202336 It is better to construct a pentylene structure or a hetero-cyanate structure. Since these structures are all three-dimensional or planar enlarged structures, most of the binding sites (e.g., hydroxyl groups) are distributed over a wide area. Therefore, the resistance (the interaction) of the anti-oxidant and the epoxy resin having such a structure is improved, and the state of bonding between the anti-oxidation agent and the epoxy resin can be surely maintained. As a result, when the resin composition is cured, it is possible to prevent the volatilization of the hindered phenol-based antioxidant device or the decrease in the dependence of the transparent composite substrate. Further, the neopentyl structure is preferably contained in the block. The action and effect are more remarkable in the other parts. In addition, as a molecular structure, the oxidizing agent of the Shin-Yuan structure is included, and the following chemical formula (3) = IRGANOX 1010, etc.), f-Bu HO-ί-Βϋ -ch2ch2co〇ch2- Contains differences in molecular structure
C (3) 聚氰醆酯構 酉分系抗氧化劑,可列舉下述化學式(所Υ""1曰傅造之受阻 如:ADKSTAR ΑΟ-?Π莖、。 示之抗氧化劑(例 如:ADKSTAB ΑΟ-20 等) 16/31 201202336C (3) Polycyanate structure 抗 抗 抗 抗 抗 抗 抗 抗 抗 AD AD AD AD AD AD AD AD AD AD 聚 聚 AD 聚 AD AD 抗 AD 抗 AD 抗 抗 AD 抗 下述 AD 下述 抗 下述 下述 下述 AD AD AD AD AD AD AD AD AD AD AD AD AD AD AD AD AD AD ΑΟ-20, etc.) 16/31 201202336
OHOH
另外,本發明之樹脂組成物中,除了受阻g分系抗氧化 劑H可包含其它的抗氧化劑。其它輸氧化劑可列 舉如.抗氧化劑之外的料、抗氧化劑、鱗系抗氧 化劑、硫系抗氧化劑等。 =阻酚系抗氧化劑之外的酚系抗氧化劑可列舉如:位 於夾著羥基之取代基的一方經甲基等取代而成的半受阻型 之酚系抗氧化劑、或夾著羥基之2個取代基的雙方經曱基 等取代而成的少受阻型之酚系抗氧化劑。該等係以少於受 阻酉分糸抗氧化劑之添加量而添加。 碟系抗氧化劑之例可列舉如:亞鱗酸十三酯、亞填酸 二苯基癸酯、四(2,4-二第三丁基苯基)[1,〗-聯苯基;|_4,4,-二 酿基雙磷酸酯、雙[2,4-雙(1,1-二曱基乙基)-6-曱基苯基]乙基 酯亞碟酸、雙[2,4-二第三丁基苯基)新戊四醇二亞填酸酯 等,可使用該等之〗種或2種以上的混合物。 具體上可列舉如:GSY-P101、T0MIH0S(以上為 API-Corp.公司製造);Mark 2112、ADKSTAB PEP-36、 ADKSTAB PEP-24 ' ADKSTAB PEP-45、ADKSTAB HP_10(以上為ADEKA公司製造);SUMILIZERGP(以上為 17/31 201202336 住友化學公司製造)等。 另外丄藉由併用受崎系抗氧化劑與㈣抗氧化劑, 可啦揮4等之相乘效果,使環氧樹脂之抗氧化以及透明複 合基板之光學各向異性的抑較為顯著。此可認為是因受 阻盼系抗氧化劑與磷系抗氧化劑之抗氧化的機制不同,因 此’兩者各自獨立作用並產生相乘效果之故。 硫糸抗氧化劑可列舉如:硫基二丙酸二月桂酯、硫基 二丙酸二硬編旨等,可使贱等之】種或2種以上的混合 物。 具體上可列舉如:DLTPyashit〇mi、LMTPyashitomi、 DS1 Pyashitomi、DTTPyashitomi(以上為 Api_c〇rp.公司製 造)’ ADKSTAB ΑΟ·23(以上為ADEKA公司製造); SUMILIZER TPL·、SUMTLIZER TPM、SUMILIZER TPS、 SUMILIZER TL、SUΜ丨LIZER TP-D(以上為住友化學公司製 造)等。 此等受阻酚系抗氧化劑之外的抗氧化劑(特別是磷系抗 氧化劑)的添加量,相對於受阻酚系抗氧化劑丨〇〇質量份而 吕’以設為30至300質量份左右為佳,以設為50至200 貝里伤左右更佳。藉此,受阻g分糸抗氧化劑與此外之抗氧 化劑並不會埋沒而可發揮各自的效果,並發揮相乘效果。 又’本發明之樹脂組成物在無損及其特性之範圍下, 可因應所需而含有熱塑性樹脂或熱硬化性樹脂之寡聚物或 單體;或含有耦合劑等。另外’在使用該等之寡聚物或單 體時,可適當地設定該等之組成比例’使整體的折射率與 玻璃填充物之折射率一致。 更且,本發明之樹脂組成物在無損及其特性之範圍 18/31 201202336 下,可因應所需而含有紫外線吸收劑、染料、顏料以及盆 他之填充物等。 y、 本發明之樹脂組成物係將上述之環氧樹脂、玻璃填充 物、受阻酚系抗氧化劑等混合而得。 亚且,本㈣之樹肋成物之較佳麵在·。c之溫卢 了經加熱!分鐘之後’實質上沒有檢測出上述抗氧化劑: /刀解成分之氣體。如此之樹驗成物係如上所述, 制在硬化時之抗氧化劑的揮發,所得之硬化物,亦 各向異性低且透明性高之物者。 卞 氣體的檢測係使用氣相層析儀或氣相層析質譜 (GC-MSh其中,如依後者即可從層析ffi]i^卩㈣” =易鑑定氣體成分,因而較佳。亦即,藉由評價是曰否於 ΐϋΓ出抗氧化劑或其分解成分,即可判斷抗氧化劑 a触所谓沒有實質上檢測出上述抗氧化劑或其分解成分之 亂體,係在質譜中無法辨識波峰的存在。 <透明複合基板以及顯示元件基板> 本^之透賴合基㈣由本發明讀驗成物 ^者。亦即’本發明之透賴合基板係將上縣發明 月曰組成物成形為板狀並使之硬化所成者。 3、 法可解如:紐於成賴之綠、將樹月旨被 成物讀於溶劑後進行洗注之方法。又可舉例在使用破璃 =布?玻璃填充物時,在樹脂組成物之中,使玻璃』 充物以外的成分含浸於玻璃纖維布、 樹脂組成物之找。 τ作成細Μ板狀的 樹脂組成物之硬化條件以加熱溫度為! 5(rc至3啊左 19/31 201202336 右且加熱時間為0.5至l〇小時左右為佳,加熱溫度為17〇 至25〇°C左右且加熱時間為1至5小時左右更佳。 本發明之透明複合基板適用於例如:液晶顯示元件用 基板、有機EL元件用基板、濾光片用基板、電子紙用基板、 太陽能電池用基板、觸控板用基板等各種透明基板。 透明複合基板之平均厚度並無特別限定,惟以4〇至2〇〇 # m左右為佳’以5〇至〗〇〇 # ηι左右更佳。 並且,本發明之透明複合基板係以於30°C至15〇。(:中 之平均線膨脹係數為40叩m以下者為佳,以2〇ppm以下者 更佳,尤以〗〇ppm以下者最佳。例如將該透明複合片使用 在主動矩陣顯示元件用基板時,如超出該上限值,在該製 造步驟中,恐有翹曲或鋁配線斷線等的問題產生。 本發明之透明複合基板可適用於上述各種顯示元件用 之透明基板(顯示元件基板)。 此情況下,顯示元件基板在波長4〇〇nm中之總透光率 宜為80%以上,以85%以上為佳,又以88%以上更佳。波 長400nm中之總透光率未達下限值時,恐顯示元件中之 示性能不足。 又,本發明之透明複合基板應用在顯示元件基板時, 可在用以提絲面平雜之基板_設置細旨的塗覆層。 做為塗覆層所使用之樹脂例如以具有優異之_性、透明 性及賴性者為佳,具體而言,宜錢與透明複合基板中 所使用的環氧樹脂相同之樹脂為佳。並且,涂覆 厚度以〇.]至3G鋒左右為佳,以Q 5至· m左右更佳_。 更且,本發明之透明複合基板應用在顯示元件基板 時’可設置用以抑制基板因來自外部的衝擊而破損之衝擊 20/31 201202336 緩衝層。層構造可列舉如:在透明複合基板之炱少一側設 置平滑層,再於其上設置衝擊緩衝層之構造、或是在透明 複合基板之至少一側設置衝擊緩衝層,再於其上設置平滑 層之構造等。亦即,可在複數層之任意位置設置衝擊緩衝 層。 並且,本發明之顯示元件基板在落球衝擊試驗之耐衝 擊性上原本就比玻璃基板優異,而藉由設置如此之衝擊緩 衝層可更提升对衝擊性。 以上係對本發明之樹脂組成物、透明複合基板以及顯 示元件基板之說明,惟本發明並不僅限於此,例如可在透 明複合基板以及顯示元件基板中附加任意的構造物。 [實施例] 其次’對於本發明之具體的實施例進行說明。 1.透明複合基板之製造 (實施例1) 首先,將具有下述化學式(1)之構造的氫化聯苯型脂環 式環氧樹脂 (Daicel化學工業公司製造;E-BP、Tg : >250。〇、氣 化雙盼A型ί哀氧樹爿a (日本氧樹脂公司製造;γχ_8〇〇〇、 Tg ·】〇3 C )、方香族疏糸熱1¾離子硬化劑(三新化學公司掣 造;S1-100L)以及受阻紛系抗氡化劑(汽巴精細化學公司製 造;IRGANOX 1010、重量平均分子量丨178)以表丨所示之 比例混合,調製成樹脂材料。Further, in the resin composition of the present invention, other antioxidants may be contained in addition to the hindered g-separation antioxidant H. Other oxidizing agents may be listed as materials other than antioxidants, antioxidants, scaly antioxidants, and sulfur-based antioxidants. The phenolic antioxidant other than the phenol-resistant antioxidant may be a semi-blocking phenolic antioxidant in which one of the substituents sandwiching the hydroxyl group is substituted with a methyl group or the like, or two hydroxy groups interposed therebetween. A phenol-based antioxidant having a less hindered type in which both of the substituents are substituted with a thiol group or the like. These are added in an amount less than the amount of the antioxidant that is blocked. Examples of the dish-based antioxidants include, for example, tridecyl sulphate, diphenyl decyl phosphite, and tetrakis(2,4-di-t-butylphenyl) [1, 〗-biphenyl; _4,4,-di-bromobisphosphate, bis[2,4-bis(1,1-didecylethyl)-6-fluorenylphenyl]ethyl oxalate, bis[2,4 - Di-tert-butylphenyl) pentaerythritol di-saltate or the like, or a mixture of these or a mixture of two or more kinds can be used. Specifically, for example, GSY-P101, T0MIH0S (above, API-Corp.); Mark 2112, ADKSTAB PEP-36, ADKSTAB PEP-24 'ADKSTAB PEP-45, ADKSTAB HP_10 (above, manufactured by ADEKA); SUMILIZERGP (above 17/31 201202336 manufactured by Sumitomo Chemical Co., Ltd.). In addition, by using the combination of the anti-oxidant and the (4) antioxidant, it is possible to synergistically effect the oxidation resistance of the epoxy resin and the optical anisotropy of the transparent composite substrate. This is considered to be because the anti-oxidation mechanism of the anti-oxidant and the phosphorus-based antioxidant is different, so that the two independently act and produce a multiplication effect. Examples of the thioindigo antioxidants include dilauroyl thiodipropionate and thiodipropionic acid, and the like, and the like, or the like, or a mixture of two or more kinds thereof. Specifically include such as: DLTPyashit〇mi, LMTPyashitomi, DS1 Pyashitomi, DTTPyashitomi (. Api_c〇rp manufactured as above) 'ADKSTAB ΑΟ · 23 (manufactured by ADEKA Corporation); SUMILIZER TPL ·, SUMTLIZER TPM, SUMILIZER TPS, SUMILIZER TL, SUΜ丨LIZER TP-D (above), manufactured by Sumitomo Chemical Co., Ltd., etc. The amount of the antioxidant (especially the phosphorus-based antioxidant) other than the hindered phenol-based antioxidant is preferably from about 30 to 300 parts by mass based on the mass of the hindered phenol-based antioxidant. It is better to set it around 50 to 200 Berry. Thereby, the hindered g-dividing antioxidant and the other antioxidant are not buried, and the respective effects can be exerted, and the multiplication effect can be exerted. Further, the resin composition of the present invention may contain an oligomer or a monomer of a thermoplastic resin or a thermosetting resin as required, or may contain a coupling agent or the like, insofar as it does not impair the properties of the resin. Further, when such oligomers or monomers are used, the composition ratios can be appropriately set so that the overall refractive index coincides with the refractive index of the glass filler. Further, the resin composition of the present invention contains ultraviolet absorbers, dyes, pigments, and potting fillers, etc., as needed in the range of non-destructive properties and properties 18/31 201202336. y. The resin composition of the present invention is obtained by mixing the above epoxy resin, glass filler, hindered phenol antioxidant, and the like. Ya, the best surface of the tree ribs of this (four) is in. c Wen Lu has been heated! After a minute, the gas of the above-mentioned antioxidant: / knife component was not substantially detected. As described above, the tree test product is obtained by volatilizing an antioxidant at the time of hardening, and the obtained cured product is also low in anisotropy and high in transparency. The detection of helium gas is preferably carried out by gas chromatography or gas chromatography mass spectrometry (GC-MSh, in which the latter can be obtained from the chromatogram ffi]i^(4)" = easy identification of gas components, that is, By evaluating whether or not the antioxidant or its decomposition component is extracted, it can be judged that the antioxidant a touches the so-called body that does not substantially detect the above-mentioned antioxidant or its decomposition component, and the peak cannot be recognized in the mass spectrum. <Transparent Composite Substrate and Display Element Substrate> The permeation substrate (4) of the present invention is a product of the present invention. That is, the permeation substrate of the present invention is formed into a plate shape by the invention of the invention. And the method of hardening it. 3. The method can be solved as follows: Newly used as the green of the sacred, and the method of reading the sap of the tree is read in the solvent and then washed. Another example is the use of broken glass = cloth? In the case of the filler, the components other than the glass filler are impregnated with the glass fiber cloth and the resin composition. The curing conditions of the resin composition in which the τ is formed into a fine plate shape are at a heating temperature of 5 (rc to 3 ah left 19/31 201202336 right and plus The time is preferably from about 0.5 to about 1 hour, the heating temperature is from about 17 Å to about 25 〇 ° C, and the heating time is from about 1 to about 5 hours. The transparent composite substrate of the present invention is suitably used, for example, for a substrate for a liquid crystal display element. Various transparent substrates such as a substrate for an organic EL device, a substrate for a filter, a substrate for an electronic paper, a substrate for a solar cell, and a substrate for a touch panel. The average thickness of the transparent composite substrate is not particularly limited, but is 4 〇 to 2 〇. 〇#m is better than 5' to 〇〇# ηι is better. Moreover, the transparent composite substrate of the present invention is used at 30 ° C to 15 〇. (: The average linear expansion coefficient is 40 叩m The following is preferable, and it is more preferably 2 〇 ppm or less, and most preferably 〇 ppm or less. For example, when the transparent composite sheet is used for a substrate for an active matrix display device, if it exceeds the upper limit, the manufacturing is performed. In the step, there is a problem that warp or aluminum wiring is broken. The transparent composite substrate of the present invention can be applied to the above-mentioned transparent substrate (display element substrate) for various display elements. In this case, the display element substrate is at wavelength 4 〇〇 The total light transmittance in nm is preferably 80% or more, preferably 85% or more, and more preferably 88% or more. When the total light transmittance in the wavelength 400 nm does not reach the lower limit value, the performance in the display element may be displayed. Further, when the transparent composite substrate of the present invention is applied to a display element substrate, it can be provided with a coating layer for a substrate having a flat surface, and the resin used as the coating layer is excellent, for example. It is preferable that the resin is the same as the epoxy resin used in the transparent composite substrate, and the coating thickness is about 3.] to about 3G front. Preferably, the transparent composite substrate of the present invention is applied to the display element substrate and can be provided to suppress the damage of the substrate due to impact from the outside. 20/31 201202336 Buffer layer . The layer structure may be, for example, a smooth layer provided on a side of the transparent composite substrate, and a shock buffer layer may be provided thereon, or an impact buffer layer may be provided on at least one side of the transparent composite substrate, and then disposed thereon. The structure of the smoothing layer, etc. That is, the shock absorbing layer can be provided at any position of the plurality of layers. Further, the display element substrate of the present invention is superior to the glass substrate in the impact resistance of the ball drop impact test, and the impact resistance can be further improved by providing such an impact buffer layer. The above description of the resin composition, the transparent composite substrate, and the display element substrate of the present invention is not limited thereto, and for example, any structure may be added to the transparent composite substrate and the display element substrate. [Embodiment] Next, a specific embodiment of the present invention will be described. 1. Production of Transparent Composite Substrate (Example 1) First, a hydrogenated biphenyl type alicyclic epoxy resin having a structure of the following chemical formula (1) (manufactured by Daicel Chemical Industry Co., Ltd.; E-BP, Tg: > 250. 〇, gasification double-seeking type A 哀 oxygen tree 爿 a (made by Nippon Oxygen Resin Co., Ltd.; γχ_8〇〇〇, Tg ·]〇3 C), Fangxiang ethnic dredging heat 13⁄4 ion hardener (Sanxin Chemical The company manufactures; S1-100L) and the blocked anti-deuteration agent (manufactured by Ciba Fine Chemical Co., Ltd.; IRGANOX 1010, weight average molecular weight 丨178) are mixed in the ratio shown in Table , to prepare a resin material.
Q (1) 0 201202336 接著,以所得樹脂材料來含浸τ玻璃系玻璃布(厚度95 折射率mo;日東紡織公司製造)後脫泡。藉此而調 製成樹脂組成物。使如此樹脂材料含浸之玻璃布(樹脂組成 物)夾在經施行脫模處理之2片玻璃板間,於8〇。〇下加熱2 小時後’在250。(:下進一步加熱2小時,得到厚度97# m(玻 璃填充物含量為63質量%)之透明複合基板。 (實施例2至22) 除了將樹脂組成物之組成變更為表】、2所示者之外, 分別進行與實施例1相同之處理,得到透明複合基板。 另外,實施例20、21中使用之脂環式環氧樹脂(Daicd 化學工業公司製造;EHPE 3150)為2,2-雙(羥甲基)_ 1 _丁醇的 1,2-裱氧基-4-(2-環氧乙烷基)環己烷加成物(分子量為 2234) ’其通式係以下述式(5)表示。Q (1) 0 201202336 Next, the obtained resin material was impregnated with a glass cloth (thickness 95; refractive index mo; manufactured by Nitto Textile Co., Ltd.). Thereby, a resin composition was prepared. The glass cloth (resin composition) impregnated with such a resin material was sandwiched between two glass plates subjected to mold release treatment at 8 inches. After heating for 2 hours under the armpits, 'at 250'. (: Further heating for 2 hours, a transparent composite substrate having a thickness of 97 # m (glass filler content of 63% by mass) was obtained. (Examples 2 to 22) In addition to changing the composition of the resin composition to the table, 2 The same procedure as in Example 1 was carried out to obtain a transparent composite substrate. The alicyclic epoxy resin (Daicd Chemical Industry Co., Ltd.; EHPE 3150) used in Examples 20 and 21 was 2,2- 1,2-decyloxy-4-(2-oxiranyl)cyclohexane adduct of bis(hydroxymethyl)-1- 1 -butanol (molecular weight 2234) (5) indicates.
[上述式(5)中,R為有機基;η為]以上之整數] 並且’實施例22中使用之脂環式環氧樹脂(Daicei化學 工業公司製造;E-DOA、Tg : > 250°C)係具有下述化學式(2) 之構造的脂環式環氧樹脂,「-X-」為「_CH(CH3y」。 22/31 (2) 201202336 ο[In the above formula (5), R is an organic group; η is an integer of the above] and the alicyclic epoxy resin used in Example 22 (manufactured by Daicei Chemical Industry Co., Ltd.; E-DOA, Tg: > 250 °C) is an alicyclic epoxy resin having the structure of the following chemical formula (2), and "-X-" is "_CH(CH3y". 22/31 (2) 201202336 ο
(實施例23) 料-二了錢玻祕取代㈣布,並將該玻璃粉與樹脂材 卢理2合成為樹脂組成物之外,進行與實施例丨相同之 處理’侍到透明複合基板。 (比較例1) 相同 除了省略抗氧化劑之使用以外,進行斑實施例 之處理’得到透明複合基板。 (比較例2) 系4一、1制表2所7^之里的碟系抗氧化劑以取代受阻盼 複人=板⑼丨之外’進行與貫施例1相同之處理,得到透明 (比較例3) 受阻所示之量的少受嶋抗氧化劑以取代 又_糸“化劑之外,進行與實施例!相同之處理 到透明複合基板。 (比較例4) 、除了使用破璃粉,並將該玻璃粉與樹脂材料一起混合 成為樹脂組成物之外,進行與比較例2相同之處理, 透明複合基板。 (比較例5) 、、除了使用破螭粉,並將該玻璃粉與樹脂材料一起混合 成為樹脂組成物之外,進行與比較例3相同之處理,得到 透明複合基板。 23/31 201202336 另外,在各實施例及各比較例中使用的受阻酚系之融 點係如下述。 IRGANOX 1010 : 110 至 125〇C ADKSTAB AO-20 : 220〇C SUM1UZERBHT : 69 至 73°C IRGANOX 1076 ·· 50 至 55°C 2.透明複合基板之評價 2.1光學各向異性之評價 對於所得透明複合基板分別施行以下所示之2階段的 溼熱處理。 <第1溼熱處理之條件> •處理溫度:85°C •處理溼度:85%RH •處理時間:1061小時 <第2溼熱處理之條件> •處理溫度:85°C •處理溼度:85°/0RH •處理時間:30丨5小時 不方法測定光學各向異性。 有關此測定之詳情係,(Example 23) The material was replaced with a (four) cloth, and the glass powder and the resin material Lu Li 2 were synthesized into a resin composition, and the same treatment as in Example ’ was carried out to serve as a transparent composite substrate. (Comparative Example 1) The same procedure was carried out except that the use of the antioxidant was omitted, and a transparent composite substrate was obtained. (Comparative Example 2) The same treatment as in Example 1 was carried out in the same manner as in Example 1 except that the dish-based antioxidant in Table 2 and Table 2 was replaced with the same treatment as in Example 1 to obtain transparency (Comparative) Example 3) The same treatment as in Example! was carried out on the transparent composite substrate in the amount of the less-receiving antioxidant indicated by the resistance. (Comparative Example 4) In addition to the use of the glass frit, The glass frit was mixed with a resin material to form a resin composition, and the same treatment as in Comparative Example 2 was carried out to form a transparent composite substrate. (Comparative Example 5) In addition to using a smashed powder, the glass frit and the resin were used. The materials were mixed together to form a resin composition, and the same treatment as in Comparative Example 3 was carried out to obtain a transparent composite substrate. 23/31 201202336 Further, the hindered phenol-based melting points used in the respective examples and comparative examples are as follows. . IRGANOX 1010: 110 to 125〇C ADKSTAB AO-20: 220〇C SUM1UZERBHT: 69 to 73 ° C IRGANOX 1076 ·· 50 to 55 ° C 2. evaluation of the transparent substrate of the composite 2.1 evaluation of the obtained optically anisotropic transparent The composite substrate is respectively subjected to the following The wet heat treatment of the second stage is shown. <Condition of the first wet heat treatment> • Treatment temperature: 85 ° C • Treatment humidity: 85% RH • Treatment time: 1061 hours < Conditions of the second wet heat treatment > • Treatment Temperature: 85 ° C • Treatment humidity: 85 ° / 0 RH • Treatment time: 30 丨 5 hours No method for measuring optical anisotropy. Details of this measurement,
24/31 接著,對於溼熱處理L倾合紐分別以下述所 、mm之觀察部分影像化(像素64〇X 將此轉換成各像素具有〇至255層次 201202336 (gradation)的黑白影像。總計所得黑白影像中的各像素之層 次並作成第1之溼熱處理後的光學各向異性之評價值。 其次,將供以第1之溼熱處理的透明複合基板再次地 供以溼熱處理,進行處理至累積之處理時間成為上述第2 . 之溼熱處理的條件為止。然後,以與上述相同之方法取得 . 黑白影像。總計所得黑白影像中的各像素之層次並作成第2 之溼熱處理後的光學各向異性之評價值。 將上述2.1之評價結果示於表1、2。 25/31 02 2 20 26/31 c»V CH- 抗氧化劑 玻璃填充物 硬彳匕觸媒 環氧樹脂 光學各向異性 少受阻酚系 抗氧化劑 磷系抗氧化劑 受阻盼系抗 氧化劑 玻璃粉 玻璃布 陽離子硬化 觸媒 縮水甘油型 環氧樹脂 : 1 脂環式環氧 樹脂 3015小時 1061小時 SUMILIZBR AO-80 ADKSTAB , PEP-36 IRGAN0X 1076 SUM1LIZER ! BHT ADKSTAB ! AO-20 IRGAN0X 1010 芳香族疏系 熱陽離子硬 化觸媒 〇 crc V) 〇_ YX-8000 E-DOA EHPE3150 E-BP X 〇 X 質量份 1 質量份 質量份 質量份 質量份 質量份 1質量份1 ί質量份1 質量份 1質量份1 質量份 質量份1 質量份 質量份1 3.59 1_2^9_ 0.01 Os — Ln ο 實施例 1 3.12 N·) Lr> p Os — ο 實施例 2 2.89 1 2.39 On — ο 實施例 3 2.61 ro UJ — Os UJ 一 ο 實施例 4 2.52 2.27 U) Os — ο 實施例 5 2.48 2.25 私 ON — Ln ο 實施例 6 2.48 ! 2.24 ON U) - ο 實施例 7 3.06 2.81 ON - ο 實施例 8 2.71 2.45 U> ON OJ — S ο 實施例 9 | 2.60 | 1 2.36 U) ON U) 一 — ο 實施例 10 2.55 2.32 Os OJ — K> ο 實施例 :11 - 2.55 2.33 Os) On U) 一 5 ο 實施例 12 | 2.74 I 2.53 U) ON U) 一 ο 實施例 13 >1】 201202336 【(Nd tbfe例 5 S IT) - r*~t 8 ΓΛ 3.93 tbl交例 4 8 iTi - rn oc rn 4.09 Mm 3 S m — 3.02 3.90 Mm 2 S iTi — 〇 ! S */Ί 一 R 4.74 實施例 23 8 — 3 234 2.56 實施例 22 8 - 2.78 3.07 實施例 21 8 in 一 «Ν - 實施例 20 S iTi — 2.44 2.73 實施例 19 S — ΓΟ S 3.14 If施例 18 8 IT) — r·) 229 3.13 實施例 17 S m - 3 Γ*-1 235 3.07 實施例 16 8 - 2 228 2.47 實施例 15 S V) — \〇 2.19 實施例 14 8 Vi 一 Γ*Ί n (N • 質量份 質量份 質量份 質量份 質量份i 質量份 質量份 質量份 質量份 質量份 質量份 質量份 質量份 質量份 X X E-BP CHPF3I50 H-DOA YX-8000 O^ol 芳香族^系熱陽離子硬化 觸媒 玻璃布 玻璃粉 IRGANOX 1010 ADKSTABAa20 SUMlLIZIZRBiri' [ ' IRGANOX1076 AI〕KSTABPEI)-36 SUM1LIZHRAO80 1061小時 3015小時 脂環式環氧樹脂 縮水甘油型環氧 樹脂 陽離子硬賴媒 受贿系 抗氧化剞 磷系坑氧化劑 少受阻齡系技^ 化劑 光學各向異性 環細脂 硬_媒 玻棘綠 抗氧化劏 評價結果 201202336 由表1、2而可明白,由各實施例所得的透明複合義 之光學各向異性均較各比較例所得的透明複合基板者反 2·2脫氣評價 對於所得的透明複合基板,使用氣相層析質譜儀_ 脫氣評價。同時,評價環境係設為3〇〇〇c下加熱丨分铲= 境。 .、里之環 其結果,各實施例中所得的透明複合基板,無法看 源自受阻紛系抗氧化劑之成分的揮發。 圖1 (a)係表示實施例7中所使用之受阻酚系抗氣 單體的脫氣之評髓果(質譜)、(b)絲轉關7中所$ 的透明複合基板之脫氣之評價結果(質譜)之圖表。 于 由圖1(a)而可明白,實施例7中使用之受阻紛系抗 劑,其單體經着C之加熱而揮發,並在質譜上檢測出波峰 A ’相對於此,在實_ 7中所得的透明複合基板,由圖 ](b)可月白,即使經3⑻c之加熱亦未能檢測出該波峰a。 由此可確認得知在實施例7中所得的透明複合基板,由於 與受阻盼系抗氧化劑間之相互作用,即使在只要 均會揮發掉的高溫中,亦可抑制抗氧化_揮發, 而使抗氧化劑持續留存。 ㈣’在各比較例中所得的透明複合基板,確認 明:人二氧化劑之成分的揮發。由此而確認出,該等之透 巧石基板經加熱而使抗氧化劑釋出。同時,可認為藉由 綱釋“加速光學各向雜特性的惡化。 28/31 201202336 【圖式簡單說明】 圖】(a)係表示實施例7中所使用之受阻酚系抗氧化劑 單體的脫氣之評價結果(質譜)、(b)係表示實施例7中所得 的透明複合基板之脫氣之評價結果(質譜)之圖表。 ' 【主要元件符號說明】 ' A波峰 29/3124/31 Next, for the wet heat treatment, the L tilting button is imaged by the observation portion of mm below (pixel 64〇X converts this into a black and white image with each pixel having a 〇 level of 201202336 (gradation). The layer of each pixel in the image is subjected to the evaluation value of the optical anisotropy after the first wet heat treatment. Next, the transparent composite substrate subjected to the first wet heat treatment is again subjected to the wet heat treatment, and the treatment is performed until the accumulation. The treatment time is the condition of the wet heat treatment of the above second. Then, a black-and-white image is obtained by the same method as described above, and the gradation of each pixel in the obtained black-and-white image is obtained to prepare the optical anisotropy after the second wet heat treatment. the evaluation value. the evaluation results are shown in the above table 2.1 1,2. 25/31 02 2 20 26/31 c »V CH- antioxidant hard glass filler left foot dagger optical anisotropy less hindered epoxy catalyst Phenolic antioxidants Phosphorus-based antioxidants are anti-oxidant glass powder glass cloth cationic hardening catalyst glycidyl epoxy resin: 1 alicyclic epoxy resin 3015 small 1061 hour SUMILIZBR AO-80 ADKSTAB , PEP-36 IRGAN0X 1076 SUM1LIZER ! BHT ADKSTAB ! AO-20 IRGAN0X 1010 Aromatic thermal cation hardening catalyst 〇crc V) 〇_ YX-8000 E-DOA EHPE3150 E-BP X 〇 X parts by mass 1 part by mass parts mass parts mass parts mass parts by mass 1 part by mass 1 ί parts by mass 1 part by mass 1 1 part by mass parts by mass 1 part by mass mass parts 1 3.59 1_2 ^ 9_ 0.01 Os - Ln ο Example 1 3.12 N·) Lr> p Os — ο Example 2 2.89 1 2.39 On — ο Example 3 2.61 ro UJ — Os UJ — Example 4 2.52 2.27 U) Os — ο Example 5 2.48 2.25 Private ON — Ln ο Embodiment 6 2.48 ! 2.24 ON U) - ο Embodiment 7 3.06 2.81 ON - ο Embodiment 8 2.71 2.45 U> ON OJ - S ο Example 9 | 2.60 | 1 2.36 U) ON U) One - ο Example 10 2.55 2.32 Os OJ — K> ο Example: 11 - 2.55 2.33 Os) On U) A 5 ο Example 12 | 2.74 I 2.53 U) ON U 1) Example 13 >1] 201202336 [(Nd tbfe example 5 S IT) - r*~t 8 ΓΛ 3.93 tbl example 4 8 iTi - rn oc rn 4.09 Mm 3 S m — 3.02 3.90 Mm 2 S iTi —〇! S */Ί A R 4.74 Example 23 8 — 3 234 2.56 Example 22 8 - 2.78 3.07 Example 21 8 in a «Ν - Example 20 S iTi — 2.44 2.73 Example 19 S — ΓΟ S 3.14 If Example 18 8 IT) — r·) 229 3.13 Example 17 S m - 3 Γ *-1 235 3.07 Example 16 8 - 2 228 2.47 Example 15 SV) — \〇 2.19 Example 14 8 Vi * Ί n parts (N • mass parts mass parts mass parts mass parts mass parts i mass parts mass parts mass parts mass parts mass parts mass parts mass parts mass parts mass XX E-BP CHPF3I50 H-DOA YX-8000 O ^ ol aromatic Family ^ Thermal cation hardening catalyst glass cloth glass powder IRGANOX 1010 ADKSTABAa20 SUMlLIZIZRBiri' [ ' IRGANOX1076 AI] KSTABPEI)-36 SUM1LIZ HRAO80 1061 hour 3015 hours alicyclic epoxy resin glycidyl epoxy resin cationic hard solvent bribery anti-oxidation bismuth phosphate pit oxidant less resistant age system chemical agent optical anisotropic ring fine fat hard _ medium glass spine Green anti-oxidation enthalpy evaluation result 201202336 It can be understood from Tables 1 and 2 that the optical anisotropy of the transparent composite sense obtained by each of the examples is higher than that of the transparent composite substrate obtained by each comparative example. The transparent composite substrate was evaluated using a gas chromatography mass spectrometer _ degassing. At the same time, the evaluation environment is set to 3〇〇〇c to heat the shovel. As a result, the transparent composite substrate obtained in each of the examples was incapable of seeing volatilization of a component derived from a hindered antioxidant. Fig. 1 (a) shows the degassing evaluation (mass spectrometry) of the hindered phenol-based anti-air monomer used in Example 7, and (b) the degassing of the transparent composite substrate of the wire transfer 7 A chart of the evaluation results (mass spectrometry). As can be understood from Fig. 1(a), the hindered antagonist used in Example 7 has its monomer volatilized by heating of C, and a peak A' is detected on the mass spectrum. The transparent composite substrate obtained in 7 can be whitened by the drawing (b), and the peak a cannot be detected even after heating by 3 (8)c. From this, it was confirmed that the transparent composite substrate obtained in Example 7 can inhibit oxidation-oxidation even at a high temperature which is volatilized as long as it interacts with the anti-suppressant antioxidant. Antioxidants remain in place. (4) In the transparent composite substrate obtained in each of the comparative examples, it was confirmed that the components of the human oxidizing agent were volatilized. From this, it was confirmed that the transparent stone substrates were heated to release the antioxidant. At the same time, it can be considered that "the acceleration of the optical heterogeneous characteristics is deteriorated by the explanation. 28/31 201202336 [Simplified description of the drawings] Fig. (a) shows the hindered phenol-based antioxidant monomer used in Example 7. The evaluation results of the degassing (mass spectrometry) and (b) are the graphs showing the evaluation results (mass spectrometry) of degassing of the transparent composite substrate obtained in Example 7. ' [Main component symbol description] 'A wave peak 29/31
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| JP2005015622A (en) * | 2003-06-26 | 2005-01-20 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for optical semiconductor encapsulation and optical semiconductor device |
| JP2005089607A (en) * | 2003-09-17 | 2005-04-07 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for optical semiconductor encapsulation and optical semiconductor device |
| JP2005133029A (en) * | 2003-10-31 | 2005-05-26 | Sumitomo Bakelite Co Ltd | Transparent composite film and display device using the same |
| JP2006176586A (en) * | 2004-12-21 | 2006-07-06 | Sumitomo Bakelite Co Ltd | Transparent composite composition and optical sheet and plastic substrate for display device |
| JP2007138017A (en) * | 2005-11-18 | 2007-06-07 | Kyocera Chemical Corp | Insulating translucent substrate and optical semiconductor device |
| JP4784390B2 (en) * | 2006-03-09 | 2011-10-05 | 住友ベークライト株式会社 | Transparent composite sheet |
| TWI278463B (en) * | 2006-09-04 | 2007-04-11 | Chang Chun Plastics Co Ltd | Flame retardant resin composition |
| JP5287166B2 (en) * | 2008-11-19 | 2013-09-11 | 東ソー株式会社 | Optical compensation film |
| JP2010128167A (en) * | 2008-11-27 | 2010-06-10 | Tosoh Corp | Method of manufacturing retardation film |
| JP5536332B2 (en) * | 2008-12-25 | 2014-07-02 | 帝人株式会社 | Polylactic acid composition and molded article thereof |
-
2011
- 2011-06-02 JP JP2011124139A patent/JP2012025935A/en active Pending
- 2011-06-17 TW TW100121282A patent/TWI496835B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI641650B (en) * | 2013-08-26 | 2018-11-21 | 日商積水化學工業股份有限公司 | Organic electroluminescent display element sealant |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012025935A (en) | 2012-02-09 |
| TWI496835B (en) | 2015-08-21 |
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