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TW201200887A - Signal integrity testing system and method - Google Patents

Signal integrity testing system and method

Info

Publication number
TW201200887A
TW201200887A TW099120969A TW99120969A TW201200887A TW 201200887 A TW201200887 A TW 201200887A TW 099120969 A TW099120969 A TW 099120969A TW 99120969 A TW99120969 A TW 99120969A TW 201200887 A TW201200887 A TW 201200887A
Authority
TW
Taiwan
Prior art keywords
test
test point
reference value
value range
test parameter
Prior art date
Application number
TW099120969A
Other languages
English (en)
Other versions
TWI445980B (zh
Inventor
Hsien-Chuan Liang
Shen-Chun Li
Shou-Kuo Hsu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW099120969A priority Critical patent/TWI445980B/zh
Priority to US12/854,912 priority patent/US8269506B2/en
Publication of TW201200887A publication Critical patent/TW201200887A/zh
Application granted granted Critical
Publication of TWI445980B publication Critical patent/TWI445980B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
TW099120969A 2010-06-25 2010-06-25 訊號完整性測試系統及方法 TWI445980B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW099120969A TWI445980B (zh) 2010-06-25 2010-06-25 訊號完整性測試系統及方法
US12/854,912 US8269506B2 (en) 2010-06-25 2010-08-12 Signal integrity test system and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099120969A TWI445980B (zh) 2010-06-25 2010-06-25 訊號完整性測試系統及方法

Publications (2)

Publication Number Publication Date
TW201200887A true TW201200887A (en) 2012-01-01
TWI445980B TWI445980B (zh) 2014-07-21

Family

ID=45351936

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099120969A TWI445980B (zh) 2010-06-25 2010-06-25 訊號完整性測試系統及方法

Country Status (2)

Country Link
US (1) US8269506B2 (zh)
TW (1) TWI445980B (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI497093B (zh) * 2013-11-29 2015-08-21 Giga Byte Tech Co Ltd 測試維修系統及其方法
CN107703435A (zh) * 2017-09-06 2018-02-16 晶晨半导体(上海)股份有限公司 一种pcb板的介电常数检测方法
CN110531162A (zh) * 2019-08-30 2019-12-03 苏州浪潮智能科技有限公司 一种测试方法及装置
CN115902405A (zh) * 2022-07-20 2023-04-04 欣强电子（清远）有限公司 应用于pcb的阻抗测试方法、装置及系统

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008043103A1 (de) * 2008-10-22 2010-04-29 Alstrom Technology Ltd. Vorrichtung und Verfahren zur Überwachung und/oder Analyse von Rotoren von elektrischen Maschinen im Betrieb
WO2013051204A1 (ja) * 2011-10-03 2013-04-11 パナソニック株式会社 動作確認支援装置および動作確認支援方法
CN102621428B (zh) * 2012-04-01 2014-07-09 东莞市冠佳电子设备有限公司 机械手式在线测试设备
TW201500747A (zh) * 2013-06-25 2015-01-01 Hon Hai Prec Ind Co Ltd 自動化測量系統及方法
JP6503916B2 (ja) * 2015-06-22 2019-04-24 イビデン株式会社 プリント配線板の検査方法
CN106445758A (zh) * 2016-11-03 2017-02-22 南京东恒通信科技有限公司 一种微波产品的自动化测试系统和测试方法
CN109188146A (zh) * 2018-09-21 2019-01-11 郑州云海信息技术有限公司 一种si测试探台装置
TWI732167B (zh) * 2019-01-03 2021-07-01 和碩聯合科技股份有限公司 阻抗檢查的方法
CN112444676B (zh) * 2019-08-27 2025-01-07 南京泊纳莱电子科技有限公司 一种电阻检测方法、装置、电阻检测机及可读存储介质
CN110988528A (zh) * 2019-11-25 2020-04-10 深圳市共进电子股份有限公司 一种产品信号完整性的测试方法、装置及系统
CN112946365B (zh) * 2021-03-01 2024-05-28 广州广合科技股份有限公司 自动制作阻抗测试文件的方法、电子设备及存储介质
CN114281624B (zh) * 2021-12-17 2025-06-27 山东云海国创云计算装备产业创新中心有限公司 一种i2c信号完整性的测试方法、系统、装置及设备
TWI815345B (zh) * 2022-03-10 2023-09-11 興城科技股份有限公司 印刷電路板阻抗檢測裝置
CN115712055A (zh) * 2022-11-17 2023-02-24 芯和半导体科技(上海)有限公司 一种加速产线自动化测试pcb的方法、系统及介质
CN117110847B (zh) * 2023-10-25 2024-01-05 珠海智锐科技有限公司 印刷电路板的内阻测试方法、装置、设备及存储介质

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7301325B2 (en) * 2004-02-02 2007-11-27 Synthesys Research, Inc. Method and apparatus for creating performance limits from parametric measurements

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI497093B (zh) * 2013-11-29 2015-08-21 Giga Byte Tech Co Ltd 測試維修系統及其方法
CN107703435A (zh) * 2017-09-06 2018-02-16 晶晨半导体(上海)股份有限公司 一种pcb板的介电常数检测方法
CN110531162A (zh) * 2019-08-30 2019-12-03 苏州浪潮智能科技有限公司 一种测试方法及装置
CN115902405A (zh) * 2022-07-20 2023-04-04 欣强电子（清远）有限公司 应用于pcb的阻抗测试方法、装置及系统

Also Published As

Publication number Publication date
TWI445980B (zh) 2014-07-21
US8269506B2 (en) 2012-09-18
US20110316555A1 (en) 2011-12-29

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MM4A Annulment or lapse of patent due to non-payment of fees