201200864 六、發明說明： 【發明所屬之技術領域】 本發明關於一種檢查裝置，可偵測混入晶片式發光二極體 (Chip LED)的密封樹脂部或附著於其表面的不透光性異物。 【先前技術】 過去以來，晶片式LED已知有各種形態，而其中一個如 圖12所示。 如同圖12所示般，此晶片式LED50係由：具有透光性的 基板51 ;在該基板51的背面以互相分離的狀態形成的至少兩 個不透光性的電極部52、52 ;配置於前述基板51的表面中央 部之發光部53 ;與被覆基板51的表面，並密封前述發光部53 之透光性密封樹脂54所構成。 述密封樹脂54 ’其被覆發光部53的部分成形為凸曲面 狀(在此例找乎呈半球狀），除了㈣上述發光部53的功能 以外，凸曲面部54a還能發揮集光鏡片的功能而將由發光部 53發出的光線集光。 所以’在發揮這些功能的凸曲面部54a有不透光性異物混 入或附著於其表面的情況下，會發生由發光部S3發出的光線 會被此異物遮蔽’㈣⑼式LED5G照糾麵光線變得不 均勻這樣的不正常狀況。 曰因此’-直以來都需要—種可制混人密封樹脂54(特別 是凸曲面部Ma)或附著於其表面的前述不透光性異物的檢查 另一方面，在以往已知有一種檢查裝置，並非以晶片式 201200864 LED作為檢查對象的裝置，而為檢查半導體封裝配線圖案的 裝置’如日本特開2_—288㈣公報所揭示的檢查裝置。 +該檢查裝置_由間接_手段照亮被檢體，藉由線性掃 描相機拍攝該被檢體並解析其影像，而偵測出缺陷，間接照明 手段係具備具有呈弯頂狀的凹曲面狀反射面的本體，由形成於 本體開口部側内面的光線射出口對前述反射面照射光線，藉由 被該反射面反射的光線照亮下方的被檢體。另外，相機可由形 成於前述本體的觀察窗拍攝前述被檢體。 然而在sa>；式LED具有上賴成的航，即使將以往的 檢查裝置直接翻於檢錢w式led，因為該晶片式led 的構成，而無法正確_到存在於該密封翻旨部的不透光性異 物。 、 使用上述雜關接卿手段照亮^式咖的情況， 由相機對其拍剩_像會成為騎影像，如® 13所示般， 由平面觀察，前述凸曲面部的外周部分(由基板立起的部分)(符 號55)以及不具有電極的部分(從表面透光至背面的部分)(符 號56)為暗部，其他電極部及發光部為亮部。另外，影像中相 當於晶片SLED%的部分以外亦會成為暗部。 電極部及發辆可錄好歧射猶，·穿透密封樹脂 及基板的級倾魏極做射，絲再射透紐及密封樹 脂，而入射至相機，因此相同部位會成為亮部，相對於此，在 並未形成電極之處，穿透密騎脂及基板的光線不會被反射， 因此會成為暗部。 另外’關於前述凸曲面部的由基板立起的部分(外周部 201200864 分）’認為在具備上述構造以往的間接照明手段的情況，有助 於照明的前述反射光（照明光）會往下方具有某程度的方向 性’因此’在與此照明光線成銳角相交的前述外周部，被該外 周部表面正規反射的照明光線多，另外，入射至樹脂内部的照 明光線少，所以由該外周部入射至相機的反射光少，因此會成 為暗部。 另一方面，由於光線不會穿透不透光性異物，因此會成為 暗部。所以，在不透光性異物在凸曲面部的外周部(符號55)、 或並未形成電極的部分(符號56)所對應的位置的情況下，任一 者皆會成為暗部，因此極難偵測到該異物(參照圖13，在圖U 之中符號57為異物）。 另外’晶片式LED除了上述形態以外，還可在基板背面 的全面設置不透級的樹脂或其他構#，然而關於前述密封樹 脂的凸曲面外周部會成為暗部這點並沒有不同。 本發月的實際狀況而完成，其目的為提供一讎 查裝置，可正補_在於^式咖_封樹轉的不透 光性異物，不受其存在位置所限制。 【發明内容】 為了解決上述課題的本發明，侧於—種晶#式咖檢 一裝置’其係_混人晶片式LED的密封細旨或附著其表面 f不透紐熟之檢查裝置，m㈣係由：具有透光 的基板，核於該基板背面的不透光性電極部；罐於前述 j表面中央部的發光部；與被覆前述基板表面而密封前述發 的透紐密峨麟構成，該密封_之至少覆蓋前述發 201200864 光P的。卩分形成凸曲面狀’其特徵在於，包括： 支持前述晶片式led的板狀或薄片狀支持構件； 酉己，於前述支持構件的上方，並拍攝載置於該支持構件上 、曰曰片式LED表面側影像之相機； 相=她置於前述支持齡的上方，照亮載置於該支持構 的阳片式LED的表面之上部照明麵；以及 解析由前述相__㈣像，並欺前述異物的有無之 判定部； 前述上部照明機構係由； Η 口 ^在下面中心部具備圓形開口部且在頂部具備拍攝用的 =奴弯頂狀本體與配置於対頂本體内的複數個光源所 才=梦前述f頂本難__面構成反射面，前述光源係在 刚^弯頂本體㈣絲上沿其_方向制隔配置而成並且 ΐϋ述凹曲面照射親，被前相曲面反射的光線域述弯頂 的下面開口部往下方騎的方式構成之第 1照明部7與 具有呈環狀的本體、與在該環狀本_下面沿其圓周方向 間隔配置並且往下方照射光線的複數個光源之第2照明部 所構成； .月J述第2照明部’係以該環狀本體與前述第】照明部的弯 頂本體成為同轴的方式配置於該第j照明部下方〆 進一步以前述相機配置於前述第！照明部上方，透過前述 ?頂本體的拍攝關口部拍攝前述晶片式LED的表面影像， 在本發明所關聯之檢查裝置t，首先，錄查對象的 式LED位於支持構件上的檢查區域(前述相機的拍攝視野^曰域） 6 201200864 内。另外’搬運晶片s led的機構，除了例如藉由適當的搬 運手段搬運晶収LED ’域置於前述支賴件上的檢查區 域内以外’還可在支持構件上藉由適當的搬運手段搬運晶片式 LED並以適g的搬運速度使其通過前述檢查區域内，或可在 載置晶片式LED驗態下使支持構件義，並㈣當的搬運 速度使該晶片式LED通過前述檢查區域内。 、在支持構件上的檢查區域中，藉由上部照明麟照亮晶片 式LED的表面’透過形成於第〗朗部的？頂本體的拍攝用 開口部，藉由相機拍攝晶片式LED的表面側的影像。 前述上部照明機構具有第1照明部與第2照明部，藉由該 等兩個照明部照亮晶片式LED的表面，藉此，在由前述相機 拍攝的晶；1式LED縣巾，相#於其f極部及發絲的部分 以及相當於凸曲面部的部分會成為亮部。 在第1照明部中，從弯頂本體的内部底面上沿其圓周方向 等間隔配置的各個光源往弯頂本體内面的凹曲面照射光線，被 此凹曲面反射的反射光會由下關口部往下方照射，藉由此反 射光照免晶>}式led全部表面。亦即，可藉由第丨照明部間 接照亮晶片式LED其全部表面。 然後’從第1照明部照射出來的光線會穿透密封樹脂及基 板’電極部及發光部可較良好地反射，光線，因此穿透的光線會 被該電極部及發光部反射，然後再度穿透基板及密封樹脂，而 入射至相機。目此’電極部及相當於發光部的部分會成為亮部。 另一方面，在第2照明部中，從環狀本體的下面沿其圓周 方向蓴間隔配置的複數個各個光源對於以其正下方位置為中 201200864 心的平面視圓形區域内照射光線，複數個光源全體主要照亮下 方環狀區域而使其成為高照度區域。 由此第2照明部照射出的光線中，主要藉由内侧斜往下方 照射出的光賴党晶以LED的表面。前述第！照明部係利 用被弯頂本體内面的凹曲面反射的反縣之間接卿，與前述 以往的間接酬手段同樣地，會往下方具有某程度的方向性， 因此僅藉著此第1照明部，與此照明光線成銳角相交的前述凸 曲面部的外周部(由基板立起的部分)會成為暗部，而前述第2 照明部係從其外方的斜上方照亮此凸曲面部，所以也能以充足 光量照亮該凸曲面·外周部，因此，被_部位反射或穿透 相同部位的光齡以充足光量人射至域。所以，藉由此第2 照明部的賴，可使前述凸曲面㈣賴部成為亮部。 如此一來’藉由前述第丨照明部及第2照明部而照明，並 藉由前述相機所拍攝到的晶片式LED影像其全體為亮部。 所以’在不透光性異物混入密封樹脂中或者附著於其表面 的情況下，由前述相機拍攝的影像僅該異物成為暗部，因此在 前述判定聰析該縣並欺異物的有糾，可料且正確地 進行。 另外在本發明中，前述第2照明部還可具備配置於此光源 下方的環狀擴散透光膜。 此外，在基板背面以互相分離的狀態形成有至少兩個不透 光^電極部的⑼式LED #，在“式哪從表面透光 至背面的冑分的,隋況下’若僅藉由前述上部照明機構對其進行 照明’則在該具有透光性的部分，穿透密封梏愧部及基板的光 201200864 f會被反射，因輯祕_影像巾相當於此的部分會成為 的情況下，無法正確地偵測。心所對應的部分有異物存在 為了解決這樣關題’在本翻中可採關雜為：由透 明構件構祕物_，.麵前述支雜件下方設置下 部照明機構，透過該支持構件照明晶片式㈣的背面。 如前述般’僅藉由上部照明機構進行照明的情況下，在從 表面透光至背_部分，料__部縣_光線不會被 反射而成為暗部，然喃由下部_機_亮晶以咖的 背面’穿透支持構件的光線進—步轉透前述透絲分而入射 至相機，因此可得到前述透光部分為亮部的影像。 所以’即使在異物存在於前述觀部分的情況下，藉由此 下部照明機構照亮晶片式led的背面，可正確地憤測。 另外’別述下部照明機構並不特別需要具備光源 ，亦可由 配置於前述域構件的下方域該域構件平行，與該支持構 件呈對向的一面為反射面的反射板所構成。 如上述所述般，藉由前述上部照明機構照亮日日日片式led 的表面側。因此，由前述上戰明機構發出的光線會穿透前述 透光部，進-步紐支持構制達反射板的反射面並被此反射 面反射，然後再度穿透支持構件並穿透前述透光部，而入射至 相機。所以，即使使用該反射板，仍然可得到前述透光部成為 亮部的影像。另外，在此情況下，反射板的反射面係以呈白色 為佳。另外還可由呈白色的材料構成支持構件，在此情況下不 需要前述下部照明機構。 201200864 另外，作為檢查對象的晶片式LED，係由：具有透光性 的土板’形成於該基板背面的不透光性電極部；配置於： 前述基 f表面中㈣的發絲；無«穩絲Μ㈣前述發^ ^透光軸封翻旨所構成，崎密封細旨之至少覆蓋前述發 ，部的部分形成凸曲面狀，關於凸曲面部的形狀完全.不受限201200864 6. TECHNOLOGICAL FIELD OF THE INVENTION The present invention relates to an inspection apparatus capable of detecting a sealing resin portion mixed with a chip type LED or a opaque foreign matter attached to a surface thereof. [Prior Art] In the past, wafer type LEDs have been known in various forms, and one of them is as shown in Fig. 12. As shown in FIG. 12, the wafer type LED 50 is composed of a substrate 51 having light transmissivity, and at least two opaque electrode portions 52 and 52 formed in a state of being separated from each other on the back surface of the substrate 51. The light-emitting portion 53 at the central portion of the surface of the substrate 51 is formed of a light-transmitting sealing resin 54 that seals the surface of the substrate 51 and seals the light-emitting portion 53. The portion of the sealing resin 54' that covers the light-emitting portion 53 is formed into a convex curved shape (in this case, it is hemispherical), and in addition to the function of the fourth light-emitting portion 53, the convex curved portion 54a can also function as a collecting lens. The light emitted by the light-emitting portion 53 is collected. Therefore, when the convex curved surface portion 54a that exhibits these functions has opaque foreign matter mixed in or adhered to the surface thereof, light emitted from the light-emitting portion S3 may be blocked by the foreign matter. (4) (9) The type of LED 5G is corrected by the surface light. Uneven conditions such as unevenness. Therefore, it is necessary to test the opaque foreign matter that can be mixed with the human sealing resin 54 (especially the convex curved surface portion Ma) or the surface thereof. On the other hand, an inspection is known in the past. The device is not an apparatus for inspecting a wafer type 201200864 LED, but an apparatus for inspecting a semiconductor package wiring pattern, such as the inspection apparatus disclosed in Japanese Laid-Open Patent Publication No. Hei. + The inspection device _ illuminates the subject by indirect _ means, the subject is imaged by a linear scanning camera and the image is analyzed to detect a defect, and the indirect illumination means has a concave curved surface having a curved top shape The body of the reflecting surface irradiates the reflecting surface with light from a light exit port formed on the inner surface of the opening portion of the body, and the light reflected by the reflecting surface illuminates the object underneath. Further, the camera can photograph the aforementioned subject from an observation window formed on the aforementioned body. However, the sa>-type LED has a flying distance, and even if the conventional inspection device is directly turned over to the check-type w-type led, because of the configuration of the wafer-type led, it cannot be correctly _ to exist in the sealing portion. Opaque foreign matter. By using the above-mentioned miscellaneous splicing method to illuminate the case of the café, the camera will take the _ image to be a riding image, as shown in the ®13, as viewed from the plane, the outer peripheral portion of the convex curved portion (by the substrate) The raised portion (symbol 55) and the portion having no electrode (the portion that transmits light from the surface to the back surface) (symbol 56) are dark portions, and the other electrode portions and the light-emitting portion are bright portions. In addition, the portion of the image that is equivalent to the portion of the wafer SLED is also a dark portion. The electrode part and the transmitter can record the ray, and the penetrating sealing resin and the substrate are tilted, and the wire is then injected into the camera, so that the same part will become a bright part. Here, where the electrode is not formed, light that penetrates the dense fat and the substrate is not reflected, and thus becomes a dark portion. In addition, it is considered that the portion of the convex curved surface portion that is raised by the substrate (outer peripheral portion 201200864) is considered to have the above-described indirect illumination means having the above-described structure, and the reflected light (illumination light) that contributes to illumination has a downward direction. The directionality of a certain degree is such that, in the outer peripheral portion intersecting the illumination light at an acute angle, the amount of illumination light that is regularly reflected by the surface of the outer peripheral portion is large, and the amount of illumination light incident on the inside of the resin is small, so that the outer peripheral portion is incident. There is less reflected light to the camera, so it becomes a dark part. On the other hand, since light does not penetrate opaque foreign matter, it becomes a dark portion. Therefore, in the case where the opaque foreign matter is at the position corresponding to the outer peripheral portion (symbol 55) of the convex curved surface portion or the portion (symbol 56) where the electrode is not formed, either of them becomes a dark portion, and thus it is extremely difficult. The foreign matter is detected (refer to Fig. 13, the symbol 57 in Fig. U is a foreign matter). Further, in addition to the above-described form, the wafer type LED may be provided with a resin or other structure which is not transparent throughout the back surface of the substrate. However, there is no difference in the fact that the outer peripheral portion of the convex curved surface of the sealing resin becomes a dark portion. The actual situation of this month is completed, and the purpose is to provide a check device, which can correct the opaque foreign matter in the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is directed to a device for cleaning a wafer-type LED or an inspection device for attaching a surface of the wafer. m (4) The invention comprises: a substrate having a light transmission, an opaque electrode portion nucleus on a back surface of the substrate; a light-emitting portion of the can at a central portion of the j-surface; and a tunable unicorn that covers the surface of the substrate to seal the hair. The seal _ covers at least the aforementioned hair of the 201200864 light P. The enthalpy is formed into a convex curved shape, and is characterized in that it comprises: a plate-like or flaky supporting member supporting the wafer-type led; and a support member above the supporting member, and photographing and placing the supporting member on the supporting member a camera with a surface side image of the LED; phase = she is placed above the support age, illuminating the upper surface of the surface of the positive-type LED placed on the support structure; and parsing the image from the aforementioned phase __(four), and deceiving a determination unit for the presence or absence of the foreign matter; the upper illumination unit is provided with a circular opening at the center portion of the lower portion, and includes a top portion for photographing and a plurality of bodies disposed in the dome body at the top. The light source is dream is the top of the top _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the reflected light ray, the first illuminating portion 7 configured to ride downwardly from the lower opening portion of the curved top has a body having a ring shape, and is disposed at a distance from the ring-shaped lower portion in the circumferential direction thereof and is irradiated with light downward. Plural The second illumination unit of the light source is configured to be disposed below the j-th illumination unit so that the annular body is coaxial with the curved main body of the illumination unit. The aforementioned camera is configured in the aforementioned! Above the illumination unit, the surface image of the wafer type LED is imaged through the imaging gate of the top body. In the inspection apparatus t associated with the present invention, first, the inspection type LED of the object is located on the inspection area of the support member (the aforementioned camera) The shooting field of view ^ 曰 domain) 6 201200864. In addition, the mechanism for carrying the wafer sled may be carried by the appropriate handling means on the supporting member, except for, for example, carrying the crystal-receiving LED 'domain in the inspection area on the support member by a suitable transport means. The LED is passed through the inspection region at a suitable conveyance speed, or the support member can be sensed by placing the wafer type LED, and (4) the conveyance speed of the wafer is passed through the inspection region. In the inspection area on the support member, the surface of the wafer-type LED is illuminated by the upper illumination lining. The imaging unit for the top body captures an image of the surface side of the wafer type LED by the camera. The upper illumination unit includes a first illumination unit and a second illumination unit, and the two illumination units illuminate the surface of the chip LED, thereby capturing the crystal by the camera; The portion of the f-pole portion and the hairline and the portion corresponding to the convex curved portion become bright portions. In the first illuminating unit, each of the light sources arranged at equal intervals in the circumferential direction from the inner bottom surface of the curved main body irradiates light onto the concave curved surface of the curved inner surface, and the reflected light reflected by the concave curved surface passes through the lower opening portion. The lower side is irradiated, thereby reflecting the entire surface of the crystal by the reflection light. That is, the entire surface of the wafer type LED can be illuminated by the second illumination unit. Then, the light emitted from the first illumination portion penetrates the sealing resin and the substrate. The electrode portion and the light-emitting portion reflect the light well, and the transmitted light is reflected by the electrode portion and the light-emitting portion, and then worn again. Through the substrate and sealing resin, it is incident on the camera. The electrode portion and the portion corresponding to the light-emitting portion will be bright. On the other hand, in the second illumination unit, a plurality of the respective light sources arranged at intervals in the circumferential direction from the lower surface of the annular body illuminate the light in a circular area of a plane having a center of 201200864 All of the light sources mainly illuminate the lower annular region to make it a high illumination region. As a result, among the light beams emitted from the second illumination unit, the light that is mainly irradiated downward by the inner side is the surface of the LED. The aforementioned! The illuminating unit is connected to the counter-county by the concave curved surface of the inner surface of the curved top, and has a certain degree of directivity downward as in the conventional indirect remuneration means. Therefore, only the first illuminating unit is used. The outer peripheral portion (the portion rising from the substrate) of the convex curved surface portion that intersects the illumination light at an acute angle becomes a dark portion, and the second illumination portion illuminates the convex curved surface portion obliquely from the outer side, so that The convex curved surface and the outer peripheral portion can be illuminated with a sufficient amount of light, and therefore, the light age reflected or penetrated by the same portion is irradiated to the domain with a sufficient amount of light. Therefore, the convex portion (four) portion can be made bright by the second illumination portion. In this way, illumination is performed by the second illumination unit and the second illumination unit, and the entire wafer-type LED image captured by the camera is a bright portion. Therefore, in the case where the opaque foreign matter is mixed into the sealing resin or adhered to the surface thereof, the image taken by the camera described above only the foreign matter becomes a dark portion, so that it is possible to correct the situation in the county and deceive the object. And proceed correctly. Further, in the invention, the second illumination unit may further include an annular diffusion light-transmissive film disposed under the light source. Further, the (9) type LED # having at least two opaque electrode portions formed in a state in which the back surface of the substrate is separated from each other, in the case of "where the light is transmitted from the surface to the back side, under the circumstance" The upper illumination unit illuminates the light. In the light-transmissive portion, the light 201200864 f that penetrates the sealing jaw and the substrate is reflected, and the portion corresponding to this is the case. Underneath, it can't be detected correctly. There is a foreign object in the part corresponding to the heart. In order to solve such a problem, it can be mixed in this turn: the transparent member is made of _,. The mechanism illuminates the back surface of the wafer type (4) through the support member. As described above, when the illumination is performed only by the upper illumination mechanism, the light is transmitted from the surface to the back portion, and the light is not reflected. When it becomes a dark part, the light that penetrates the support member from the lower side of the lower part of the coffee machine is turned into the camera and is incident on the camera, so that the light-transmitting portion is bright. So 'even if it’s different In the case of the above-mentioned viewing portion, the lower surface of the wafer-type led can be accurately inferred by the lower illumination mechanism. In addition, the lower illumination mechanism is not particularly required to have a light source, and may be disposed in the aforementioned domain member. In the lower field, the domain members are parallel, and the opposite side of the support member is formed by a reflecting plate having a reflecting surface. As described above, the surface side of the day-and-day type LED is illuminated by the upper illumination mechanism. Therefore, the light emitted by the foregoing upper warfare mechanism penetrates the light transmitting portion, and the step-and-step supports the reflecting surface of the reflecting plate and is reflected by the reflecting surface, and then penetrates the supporting member again and penetrates through the foregoing The light portion is incident on the camera. Therefore, even if the reflector is used, an image in which the light transmitting portion is bright can be obtained. In this case, the reflecting surface of the reflecting plate is preferably white. The support member may be made of a white material, in which case the lower illumination mechanism is not required. 201200864 In addition, the wafer type LED to be inspected is: light transmissive a soil plate 'optical portion formed on the back surface of the substrate; a hairline disposed on the surface of the base f (four); and a thin wire sealed by It is intended to cover at least the aforementioned hair, and the portion of the portion is formed into a convex curved shape, and the shape of the convex curved portion is completely unrestricted.
於如以上所述般，依據本發明可使由相機拍攝的晶片式LED 衫像其全體成為亮部’其結果，在前述密封樹脂部有異物存在 的2况下可得到健異物成為暗部的影像，因此在解析所得到 ，像並判定異物的有糾，可容i且正確地進行。 【實施方式】 以下針對本發明其中一個具體實施形態，以圖式為基礎 行說明。 7圖1所示般’本例之檢查裝置丨係具備：載置有檢查對 象的sa片式LED5〇之透明板狀支持構件5 ;配置於此支持構 件5的上方，並拍攝載置於該支持構件5上的晶片式LED5〇 表面侧影像之相機6 ;配置於支持構件5的上方、相機6的正 方之上°卩照明機構10，夾住支持構件5，與上部照明機構 10呈對向的方式配置於支持構件5下方之下部照明機構7 ;與 解析由相機拍攝到的影像，並對於拍攝到的晶片式LEQ5〇 判定好壞之判定部8。 另外’本例中作為檢查對象的晶片式LED50，係具有如 前述圖12所示的形態。 前述支持構件5只要是玻璃等不會使光線歪斜而穿透的 10 201200864As described above, according to the present invention, the wafer type LED shirt imaged by the camera can be made into a bright portion as a whole. As a result, in the case where foreign matter is present in the sealing resin portion, an image in which the foreign matter becomes a dark portion can be obtained. Therefore, it is obtained by analysis, and the image is judged to be correct and correct. [Embodiment] Hereinafter, one embodiment of the present invention will be described based on the drawings. In the inspection apparatus of the present example, the transparent plate-shaped support member 5 on which the sa-plate type LED 5 of the inspection object is placed is provided, and is disposed above the support member 5, and is photographed and placed thereon. The camera 6 on the surface of the wafer-type LED 5 on the support member 5 is disposed above the support member 5, above the square of the camera 6, and the illumination mechanism 10 is sandwiched between the support members 5 and opposed to the upper illumination mechanism 10. The mode is disposed in the lower portion of the illumination unit 7 below the support member 5; and the determination unit 8 that analyzes the image captured by the camera and determines the quality of the captured wafer type LEQ5. Further, the wafer type LED 50 to be inspected in this example has the form as shown in Fig. 12 described above. The support member 5 is penetrated by glass or the like without causing light to slant. 10 201200864
物質，則其材質並I 外，，為具有·的薄^’。其形態除了剛性高的板材以 部11，、:連:：1=10如圖1及2所示般’具備第1照明 ”運接於其下方的第2_部2〇。 的上:體；月二1如圖2、圖4及5所示般，係由:呈碗狀 狀下本體15祕轉德上本體13的下面並與其同軸的環 部並作A本盾成的弯頂狀本體部12 ;配置於本體部12内 。卜=為光源之複數個LED燈19所構成。 ，述上本體13其内面(凹曲面)以成為反射面，在頂部形 严壯1用的開口 14。另外’在前述下本體15的上面形成有 :狀凹溝16，前述LED燈19係在前述凹溝Μ _底面沿著 ”圓周方向等咖配置，*且其照射方向往上。 如此來’藉由此第！照明部n，則從各燈β往 上方照射的光線，會被上本體13的凹曲面以反射，透過下 本體15的開口部17，照亮配置於其下方的晶片式LED50表 面全體。另外，由此第丨照明部n進行的照明，係往下方具 有某程度财向性的間触明，該第i照明部u會照亮其下 方的圓形區域。 前述第2照明部20，如圖2及圖6所示般，係由：在上 面及下面具備開口部，連接在前述下本體15〜的下面並與其同 軸之環狀本體21 ;設置於該本體21並作為光源之複數個LED 燈23 ;與設置於本體21下面之環狀擴散透光膜24所構成。 前述本體21的下面開口部的内徑大於上面開口部的内 徑，在該呈環狀的内部X面沿著圓周方向等間隔配置有前述 201200864 LED燈23，而其照射方向往下。 如此一來’藉由此第2照明部2〇 ’則由配置成環狀的各 LED燈2 3對於以其正下方位置為中心的平面視圓形區域内照 射光線，複數個LED燈23全體主要照亮下方的環狀區域使其 成為高照度區域。然後，所照射出的光線中，主要藉由内側斜 往下方照射的光線照亮配置於其下方的晶片式LED5〇其表 面’並至少照亮凸曲面部54a的外周部以及包含其外側的晶片 式LED50的環狀區域。在圖8中，以灰色所表示的環狀區域 係該第2照、明部20的照明區域，藉由調整上部照明機構1〇的 咼度位置，前述凸曲面部54a的外周部會被包含於照明區域。 另外，前述擴散透光膜24，係用於使由LED燈23照射 出來的光線分散地透過，因此*會產纽紋，幾乎以均等的照 度照亮前述環狀區域内。 … 尸另外’本體21的上面開口部的内徑及擴散透光膜以的 控，任-者皆大於前述下本體15的開口部17的内徑，而不 對前述第1照明部11的照明造成障礙。 ：t述下部酬機構7係由配置於前述支持構件5的下方 與該支持構件5平行，與該支持構件5呈對向的—面為白〜 射面的板狀構件所構成。此下部照明機構7藉著前述反射面 反射由上舰日_構1G照㈣絲且直接穿透鱗構件5 , 光線、以及？透域财5上的⑻式咖％財持構件 的光線，而照亮前述晶片式LED5〇的背面。For the substance, the material is I and it is thin. In addition to the high-strength sheet material portion 11, the following:: 1 = 10, as shown in Figs. 1 and 2, the "first illumination" is carried on the lower portion of the second portion 2 〇. As shown in FIG. 2, FIG. 4 and FIG. 5, the second part of the body is a bowl-shaped lower body 15 which is turned to the lower side of the body 13 and is coaxial with the ring portion and is formed into a curved top shape. The main body portion 12 is disposed in the main body portion 12. It is composed of a plurality of LED lamps 19 as a light source. The inner surface (concave curved surface) of the main body 13 is referred to as a reflecting surface, and the opening 14 for the top portion is formed. Further, 'the recessed groove 16 is formed on the upper surface of the lower body 15, and the LED lamp 19 is disposed on the bottom surface of the groove Μ _ along the circumferential direction, and the irradiation direction thereof is upward. So come by this! In the illumination unit n, the light irradiated upward from each of the lamps β is reflected by the concave curved surface of the upper body 13, and is transmitted through the opening 17 of the lower body 15 to illuminate the entire surface of the wafer-type LED 50 disposed below. Further, the illumination by the second illumination unit n is characterized by a certain degree of financial visibility downward, and the i-th illumination unit u illuminates the lower circular area. As shown in FIG. 2 and FIG. 6, the second illumination unit 20 includes an opening portion that is provided on the upper surface and the lower surface, and is connected to the lower surface of the lower body 15 to and coaxial with the annular body 21; 21 is a plurality of LED lamps 23 as a light source; and is formed by an annular diffusion transparent film 24 disposed under the body 21. The inner diameter of the lower opening of the main body 21 is larger than the inner diameter of the upper opening, and the 201200864 LED lamp 23 is disposed at equal intervals in the circumferential direction on the inner X surface of the annular shape, and the irradiation direction thereof is downward. In this way, by the second illumination unit 2', each of the LED lamps 23 arranged in a ring shape illuminates the light in a circular circular area centered on the position directly below, and the plurality of LED lamps 23 are all The upper annular area is mainly illuminated to make it a high illumination area. Then, among the irradiated light, the light of the wafer type LED 5 disposed under the light illuminating downward mainly by the inner side illuminates the surface thereof and illuminates at least the outer peripheral portion of the convex curved surface portion 54a and the wafer including the outer surface thereof The annular region of the LED 50. In FIG. 8, the annular region indicated by gray is the illumination region of the second illumination and the bright portion 20, and the outer peripheral portion of the convex curved surface portion 54a is included by adjusting the twist position of the upper illumination mechanism 1A. In the lighting area. Further, the diffused light-transmissive film 24 is used to dispersely transmit the light emitted from the LED lamp 23, so that a brilliance is generated, and the inside of the annular region is illuminated with almost uniform illumination. The inner diameter of the upper opening portion of the body 21 and the control of the diffused light-transmissive film are both larger than the inner diameter of the opening portion 17 of the lower body 15, without causing illumination of the first illumination portion 11 obstacle. The lower portion 7 is constituted by a plate-like member which is disposed in parallel with the support member 5 under the support member 5 and which faces the support member 5 and has a white-to-surface. The lower illumination mechanism 7 reflects the light from the upper ship by the aforementioned reflecting surface and directly penetrates the scale member 5, the light, and ? The light of the (8) type of the guaranty member of the domain is used to illuminate the back surface of the wafer type LED 5 。.
前述相機6可由前述上本體Π的開口 Μ拍攝其下方的曰 片式LED5G的影像，只要是可拍攝影像的任何ϋ材皆可，J 12 201200864 採用例如區域制攝相機或線性感嶋減。但是，在使用線 性感測攝相機的情況下，有必要以既定速度使晶片式腳5〇 移動。 另外’前述下部照明機構7具有至少大於前述晶片式 LED50的大小。 前述判定部8可解析由相機6拍攝到的影像，例如對拍攝 影像實行二值化處理，而判別在晶片式LED5〇的密封樹脂M 部位是否有異物存在。 若藉由具備社構成的本例之檢查裝置卜則可如以下所 述方式檢查晶片式LED50。 首先藉由適當的搬運手段，將作為檢查對象的晶片式 LED50搬運至前述支持構件5上的檢查區域，亦即，使其位 於前述相機的拍攝視野區域内。 在前述支持構件5上的前述檢查區域中，藉由上部照明機 構10照亮晶片式LED50的表面侧，同時藉由下部照明機構7 照亮該晶式LED5G的背關，在錄態下，可藉由相機6 拍攝該晶片式LED50表面側的影像。 如上述般，上部照明機構10的第丨照明部u會照亮晶片 式LED50的表面全體，第2照明部會照亮晶片式LED5〇之凸 曲勤部54a的外周部以及包含其外侧的晶片式EED5〇的環狀 區域’在不使用下部照明機構7而僅使用此上部照明機構1〇 進行照明的情況下，晶片式LED50的拍攝影像如圖9所示。 亦即’電極部52及發光部53可較良好地反射光線，因此 由第1照明部11照射出來並穿透密封樹脂部54及基板51的 13 201200864 光線’會被該電極部52及發光部53反射’然後再度穿透基板 51及密封樹脂54，而入射至相機6，因此相同部位會成為亮 部’電極52不存在的部分會成為暗部。 另外，在凸曲面部54a的外周部(由基板51立起的部分）， 藉由第2照明部20從其外方的斜上方照亮該凸曲面部5知， 所以也能以充足光量照/¾該凸曲面部54a的外周部，因此，被 相同部位反射或穿透相同部位的光線會以充足光量入射至相 機6 ’該凸曲面部54a的外周部會成為亮部。 另一方面，由前述上部照明機構1〇照射出來並通過前述 晶片式LED50的電極部52、52之間的光線，會被下部照明機 構7的反射面反射，然後再度穿透基板51及密封樹脂54，而 入射至相機6。所以如圖10所示般，由該相機6拍攝的晶片 式LED50的電極部52、52之間的影像亦會成為亮部。另外在 圖10的圖示中，為了強調此下部照明機構7的作用而進行說 明，忽視了由上部照明機構10對晶片式LED50表面的照明效 果。 ' 如此一來，藉由前述上部照明機構10及下部照明機構7 進行照明’並由相機6拍攝到的晶片式LED50影像，係將圖 9及圖1〇所示的影像重疊而且晶片式LED5〇的全部表面成為 亮部的影像(參照圖Y1)。 所以’在晶片式LED50的密封樹脂54部位有不透光性異 物存在的情況，如圖U所示般，由前述相機6拍攝的影像中， 僅該異物57成為暗部。 由相機6拍攝到的這些影像會被傳送至前述判定部8，所 14 201200864 傳送的影像會被糊定部8麟，湖異物57的有無。 此時由相機6拍攝的影像中僅異物5?成為暗部，因此可容易 且正確地偵測該異物57。 以後，將載置於支持構件5上的晶以LED依序交換為 新的，藉著進行上述-連串的檢查，可針對多個晶片式㈣ 連續進行異物檢查。 以上針對本發明其巾—個實施職進行說明，而本發明可 採用的具體職完全不受其限定，可在不麟本發明旨趣的範 圍採用其他形態。 例如下部照明機構7係由反射面為白色的反射板所構 成’然而並不受此限，亦可為_ LED燈等光源的照明機構。 在此情況下，以隔著擴散透細等，藉蝴散的光線進行照明 為佳。 另外’作為檢查對象的晶片式LED的形態並未受到上例 所限定，藉由本發明所關連之檢查裝置，可對於具有呈凸曲面 狀的密封樹脂正確地檢查異物的有無，關於凸曲面部的形狀亦 完全不受限定。 另外’只要由呈現白色的材料構成支持構件5，則電極部 52 ’ 52之間等，可從表面透光至背面的部分亦成為亮部，°因 此在此精況中不需要前述下部照明機構7。另外，隹基板51 的全面形成有電極部52等’而不存在可從表面透光至背面的 部分的情況下’亦不需要前述下部照明機構7。 另外，在上例中是將前述支持構件5固定住，然而亦可在 載置有晶片式LED50的狀態下使支持構件5移動，以適舍的 15 201200864 搬運速度使該晶片式LED50通過前述檢查區域内。 【圖式簡單說明】 圖1係表示本發明其中一個實施形態所關連之檢查裝置 之正面圖。 圖2係.表示本實施形態所關連之上部照明機構之縱剖面 圖。 圖3係將本實施形態所關連之上部照明機構的第1照明部 與第2照明部分開表示之正面圖。 圖4係圖3中延A—A方向之剖面圖。 圖5係圖3中延B方向之底面圖。 圖6係圖3中延C — C方向之底面圖。 圖7係圖3中延D方向之底面圖。 圖8係表示本實施形態所關連之第丨照明部的照明區域與 第2照明部的照明區域之說明圖。 圖9係表示在本實施形態中，使用上部照明機構照明時， 晶片式LED的拍攝影像之說明圖。 圖1〇係表示在本實施形態中，使用下部照明機構照明時 ’晶片式LED的拍攝影像之說明圖。 圖11係表示在本實施形態中，使用上部照明機構及下部 照明機構照明時，晶片式LED的拍攝影像之說明圖。 圖12係用於說明晶片式LED的形態之說明圖。 圖13係表示藉由以往的檢查裝置所得到的拍攝影像之說 明圖。 【主要元件符號說明】 201200864 1檢查裝置 5支持構件 6相機 7下部照明機構 8 判定部 … 10上部照明機構 11第1照明部 12 本體部 13上本體 15下本體 19 LED 燈 20 第2照明部 21本體 23 LED 燈 24擴散透光膜 50晶片式LED 51基板 52 電極 53發光部 54密封樹脂夂 56異物The camera 6 can capture an image of the slab-shaped LED 5G below it by the opening Μ of the upper body ,, as long as it is any coffin capable of capturing an image, and J 12 201200864 uses, for example, a zone camera or a line camera. However, in the case of using a line-type sexy camera, it is necessary to move the wafer-type foot 5〇 at a predetermined speed. Further, the aforementioned lower illumination mechanism 7 has a size at least larger than that of the above-described wafer type LED 50. The determination unit 8 can analyze the image captured by the camera 6, for example, performing binarization processing on the captured image, and determining whether or not foreign matter is present in the sealing resin M portion of the wafer type LED 5A. The wafer type LED 50 can be inspected as described below by the inspection apparatus of this example having a social composition. First, the wafer type LED 50 to be inspected is transported to the inspection region on the support member 5 by an appropriate transport means, that is, in the imaging field of view of the camera. In the foregoing inspection area on the support member 5, the surface side of the wafer type LED 50 is illuminated by the upper illumination mechanism 10 while the back illumination of the crystal LED 5G is illuminated by the lower illumination mechanism 7, and in the recorded state, An image of the surface side of the wafer type LED 50 is taken by the camera 6. As described above, the second illumination unit u of the upper illumination unit 10 illuminates the entire surface of the wafer type LED 50, and the second illumination unit illuminates the outer peripheral portion of the convex curved portion 54a of the wafer type LED 5 and the wafer including the outer side thereof. In the case where the annular region 'EED5' is used to illuminate only the lower illumination unit 7 without using the lower illumination unit 7, the captured image of the wafer type LED 50 is as shown in FIG. In other words, the electrode portion 52 and the light-emitting portion 53 can reflect light well, and therefore the light that is irradiated by the first illuminating portion 11 and penetrates the sealing resin portion 54 and the substrate 51 201200864 ray 'will be the electrode portion 52 and the light-emitting portion Since the reflection 53 passes through the substrate 51 and the sealing resin 54 and enters the camera 6, the same portion becomes a bright portion. The portion where the electrode 52 does not exist becomes a dark portion. Further, in the outer peripheral portion of the convex curved surface portion 54a (the portion rising from the substrate 51), the second illuminating portion 20 illuminates the convex curved surface portion 5 from the outer oblique portion thereof, so that it can also be illuminated with sufficient light. /3⁄4 The outer peripheral portion of the convex curved surface portion 54a, therefore, light that is reflected or penetrated by the same portion at the same portion is incident on the outer peripheral portion of the convex curved portion 54a with a sufficient amount of light to become a bright portion. On the other hand, the light which is irradiated by the upper illumination mechanism 1A and passes through the electrode portions 52, 52 of the wafer type LED 50 is reflected by the reflection surface of the lower illumination mechanism 7, and then penetrates the substrate 51 and the sealing resin again. 54 is incident on the camera 6. Therefore, as shown in Fig. 10, the image between the electrode portions 52, 52 of the wafer type LED 50 imaged by the camera 6 also becomes a bright portion. Further, in the illustration of Fig. 10, in order to emphasize the action of the lower illumination mechanism 7, the illumination effect of the surface of the wafer type LED 50 by the upper illumination mechanism 10 is neglected. In this way, the wafer-type LED 50 image captured by the camera 6 is illuminated by the upper illumination mechanism 10 and the lower illumination mechanism 7, and the images shown in FIG. 9 and FIG. The entire surface becomes an image of a bright portion (see Fig. Y1). Therefore, in the case where the opaque foreign matter is present in the portion of the sealing resin 54 of the wafer type LED 50, as shown in Fig. U, only the foreign matter 57 becomes a dark portion in the image captured by the camera 6. These images captured by the camera 6 are transmitted to the determination unit 8, and the images transmitted by the 2012 20128864 are subjected to the paste portion 8 and the presence or absence of the lake foreign matter 57. At this time, only the foreign matter 5 is a dark portion in the image captured by the camera 6, so that the foreign matter 57 can be easily and accurately detected. Thereafter, the crystals placed on the supporting member 5 are sequentially exchanged with LEDs in a new order, and by performing the above-described series of inspections, the foreign matter inspection can be continuously performed for a plurality of wafer types (4). The above is a description of the present invention, and the specific functions that can be employed in the present invention are not limited at all, and other forms can be adopted without departing from the scope of the present invention. For example, the lower illumination mechanism 7 is constituted by a reflector having a white reflecting surface. However, the present invention is not limited thereto, and may be an illumination mechanism of a light source such as an LED lamp. In this case, it is preferable to illuminate by diffusing light through a diffusion or the like. In addition, the form of the wafer type LED to be inspected is not limited to the above example, and the inspection apparatus according to the present invention can accurately check the presence or absence of foreign matter with respect to the sealing resin having a convex curved surface, and the convex curved surface portion. The shape is also completely unrestricted. Further, as long as the support member 5 is made of a material which exhibits white color, the portion which can be transmitted from the surface to the back surface becomes a bright portion between the electrode portions 52' 52 and the like, so that the aforementioned lower illumination mechanism is not required in this fine condition. 7. Further, when the ruthenium substrate 51 is formed integrally with the electrode portion 52 or the like without the portion which can transmit light from the surface to the back surface, the lower illuminating mechanism 7 is not required. Further, in the above example, the support member 5 is fixed, but the support member 5 may be moved in a state in which the wafer type LED 50 is placed, and the wafer type LED 50 is passed through the aforementioned inspection at a conveyance speed of 15 201200864. within the area. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing an inspection apparatus associated with one embodiment of the present invention. Fig. 2 is a longitudinal sectional view showing the upper illumination unit in the embodiment. Fig. 3 is a front elevational view showing the first illumination unit and the second illumination unit of the upper illumination unit associated with the embodiment. Figure 4 is a cross-sectional view taken along line A-A of Figure 3. Figure 5 is a bottom plan view of the extension B direction of Figure 3. Figure 6 is a bottom view of the extended C-C direction of Figure 3. Figure 7 is a bottom plan view of the extended D direction of Figure 3. Fig. 8 is an explanatory view showing an illumination area of the second illumination unit and an illumination area of the second illumination unit in the embodiment. Fig. 9 is an explanatory view showing a captured image of the wafer type LED when the upper illumination unit is used for illumination in the embodiment. Fig. 1 is an explanatory view showing a captured image of a wafer type LED when the lower illumination unit is used for illumination in the present embodiment. Fig. 11 is an explanatory view showing a captured image of the wafer type LED when the upper illumination unit and the lower illumination unit are used for illumination in the embodiment. Fig. 12 is an explanatory view for explaining a form of a wafer type LED. Fig. 13 is an explanatory view showing a captured image obtained by a conventional inspection device. [Description of main component symbols] 201200864 1 Inspection device 5 support member 6 Camera 7 Lower illumination mechanism 8 Determination unit 10 Upper illumination mechanism 11 First illumination unit 12 Main body 13 Upper body 15 Lower body 19 LED lamp 20 Second illumination unit 21 Body 23 LED lamp 24 diffused light transmissive film 50 chip type LED 51 substrate 52 electrode 53 light emitting portion 54 sealing resin 夂 56 foreign matter