201208139 九、發明說明： 【發明所屬之技術領域】 一特定結構比例 本發明是關於一種光電元件’特別是具有 之透明封裝結構的發光元件。 少、 【先前技術】 發光二極體（Light Emitting Diode)在具絲電轉換特性 的固態元件裡十分重要。—般而言，它具―發光層⑹_ Layer) ’被兩種不同電性的半導體層 semiconductor layer)所包夾而成。當施加一驅動電流於兩半導 體層上方之電極時，兩半導體層之電子與電洞會注入發光層， 並於發光層中結合而放出光線，此時所產生之光線具有全向 性’會自發光層由發光二極體的各個表面射出。 同時，發光二極體也是一種被廣泛使用的光源，相較於 傳統的白熾燈泡或螢光燈管，發光二極體具有省電與使用壽命 較長的優異特性，因此逐漸取代傳統光源，而應用於各種不同 領域’如交通號誌、背光模組、路燈照明、醫療設備等產業。 隨著發光二極體光源的應用與發展’對於亮度的需求越來越 高’所以如何增加其發光效率而提高其亮度，便成為產業界所 共同努力的重要方向。 其中一個值得研究的領域是如何透過封裝結構的設計來 201208139 增加發光效率。目前-般是採_杯結構之設計，將發光二極 體置於碗杯狀中，讀，_碗杯無鱗體之形狀設計，以 雛光型分佈。此外’封裝膠材之選擇、底部载體之反射能力 與碗杯形狀之設計等，亦會影響發光效率。 【發明内容】 載: 一光電元件，連 本發明提供一種光電元件包含··一 'ΐϊ載體之上；—_化結構’形成於載體之表面，並且環練 光電元件’·以及-透明封裝結構’形成於光電元件之 = ㈣日職結構，集ί =的區域，並藉由控制透明封裝結 fff 具有特定結構比例之透明封裝結構。装 m讀可以是-發光二極體元件，或任何具光電轉辦寺 ^發明又提供-種光電元件包含’一載體；一光電 ^-最大寬度Z ’形成於載體之上；以及—透明封裝，ς 的最大县丄甘ί ”度為乂與投射於該載體之表面 Λ y之比值是介於α4〜α8之間，且其中 z/x之比值是介於0.3〜〇 5之間。 丹甲 ^發明更提供-種光電元件包含，—_，具有一 ，為b之凸部，—光f元件，其最大寬度為&，連結於凸 ^以及-高度為α透明封裝結構，包覆凸部與光電H 光;件則位於W之位置附近，且^之值是小於 iit本發明透過上述各種不同特定比例之透明封 -又片，可以使光電讀之發歧率，獲得鴨的提昇。、。 201208139 【實施方式】 第1圖係本發明之第一實施例，其中各標號之涵義分別如 下所述：1〇4係表示载體；1〇2係表示反射層；1〇3係表示發 光元件；105係表示透明封裝結構；1〇7係表示圖案化結構。 下述其他圖式中之相同元件，將標以相同之標號，且不再費 述，合先述明。 如第1圖所示，本實施例主要是於一平坦之載體1〇4的表 面’形成一具有高反射率之反射層1〇2，再於反射層1〇2之上 將形成發光7L件1G3連結於反射層1G2之上；接著，於發光元 件103周圍塗佈上—層具有疏水特性之_化結構研，例如 為將發光元件103包圍起來之圓形圖案化結構、矩形圖案化結 構或方形W案化結構’再將透簡裝材料，_點膠技術形成 於發光元件103之上方。因圖案化結構1()7具有疏水性，使得 透明封裝材料侷限於圖案化結構1〇7與發光元件ι〇3之間的區 域’同時於點膠時，可藉由控制透明封裝材料之膠量，獲得如 圖所不之-具有固定凸起形狀之透鴨裝結構收。如上述步 驟所完成之光電元件，可以透過發光^件103下方之反射層 1〇2的反射作用’使發光元件103所產生的光，經反射後由透 明封裝結構105出光。藉由反射層1〇2與透明封裝結構1〇5之 搭配設計，可大幅提高其出光效率。 -1光元件103之最大寬度為z，翻封裝結構⑽ 201208139 之高度為y，透明封裝結構⑽與反射層⑽雜觸面積之最 大長度為X。當y/x之比值介於0冬0.8時，其發光效率較高， 且最佳是當y/x之比值約為0.6時；另一方面，當ζ/χ之比值 介於0.3~0·5時’也會有較佳之發光效率；且最佳是當汾之 比值是在0.4附近時。 賴104可以是一印刷電路板(pCB)、軟性印刷電路板 (FCB)、陶莞基板或複合基板。除了負責承載發光元件之 外，更進-步將發光元件1〇3所產生的熱導出，進而達到散熱 之效果。反射層102具有高反射係數，可以由金(Au)、銀(Ag)、 紹(A1)、銅(Cu)或以上組合之合金所形成，也可以是由具有反 射特性之高分子組合物所形成。發光元件1〇3可以是一四元或 三元系列之發光二極體，其所發出的光可以是紅色、藍色、綠 色、黃色等。圖案化結構107係由具有疏水特性之材料組成， 會與透明封裝材料間形成表面張力，使得點膠時該透明封裝材 料集中於圖案化結構1〇7與發光元件1〇3之間的區域而產生 凸起的透明封裝結構1〇5。其中圖案化結構1〇7可為一具有疏 水性官能基的高分子材料，如具有甲基(me%1抑叩)與氟基 (fluorine gr〇up)等官能基之高分子材料。其製備可以是利用溶 膠-凝膠法(sol-gel method)或高分子聚合法，製成此高分子材 料，並使用網版印刷(screen printing)製程或喷塗㈣⑽printing) 製程等方式，於載體104之表面形成一特定圖案，例如為一環 8 201208139 形、矩形或方形。透明封裝結構1G5，翁—透裝材料利 用點膠技細彡成於發光元件⑽上，再加熱硬化成型，且中該 =封裝材料係—具有高光穿透雜之錢絕緣㈣，例如環 氧納曰㈨㈣、聚競胺(pGly imides)、娜蝴_ msin)或上 述所混成之材料等。 第2圖為本發明之第二實施例，如第一實施例所述，於一 载體(圖未7F)上喊—具有高反射率之反射層⑽之後，將發 光疋件103連結於反射層1〇2之上；接著，利用點膠技術將透 明封裝材料形成於發光元件⑽之上方，藉由控繼明封褒材 料之膠1 ’形成一具有特定凸起雜之透明封裝結構105。為 了使本發明得到最佳的發光效率，此透明封裝結構1G5之尺寸 必須有-定搭配與設計。如第2圖所示，發光元件1〇3之最大 寬度為z ’透明封襄結構105之高度為y，透明封裝結構105 =反射層102的接觸面之最大長度為X。其中發光元件103以 常見之15mil至4〇mii大小的晶片，變化各種點膠的條件形 成各種具有凸起形狀之透明封裝結構105於發光元件103之上 方’以獲得各種y/x不同比值時所產生之發光效率，並以兩者 為座標繪圖’其結果如第4A圖所示。依第4A圖所示，不管 晶片的大小為何’當y/x之比值是介於0.4〜0.8之間時，其發 光效率較高；尤其是當y/χ之比值是在0.6附近時，其發光效 率最高。再者’當透明封裝結構105之y/x比值固定為0.5時， 201208139 變化各種不同的z/x之比值，同時量測其個別的發光效率，並 以兩者為座標繪圖’其結果如第4B圖所示，不管晶片的大小 為何，當z/x之比值是介於0.3〜0.5之間時，其發光效率較高； 尤其是當z/x之比值是在0.4附近時，其發光效率最高。 第3圖為本發明之第三實施例，更進一步於發光元件 之表面塗佈一螢光粉層1〇8，以達成波長轉換之目的。其中發 光元件103可以是一 InGaN系列之發光二極體，發出藍光’ 激發螢光粉層108之一 YGA系列的黃色螢光粉，以產生白光。 本發明之第四實施例如第5圖所示，是將第二實施例中之 發光元件103，用複數個發光元件123、133及143來取代， 其中發光元件123、133及143各發出不同顏色的光，分別為 紅色、綠色及藍色，並於透明封裝結構1〇5中進行混光而產生 白光。如圖所示，複數個發光元件123、133及143所組成之 陣列其最大寬度為z ’透明封裝結構1〇5之高度為y，透明封 裝結構1〇5與反射102接觸面之最大長度為X;其中y/x之 比值是介於G.4〜0.8之間’最佳為G 6 ;且a之比值是介於 0.3〜0.5之間，最佳為0.4。 第6圖為本發明之第五實施例，係—燈泡式光電元件，包 含具有-凸部203之載體2〇2 ; -發光元件2〇4連結於該凸部 203之上方；以及一透明封裴結構2〇5包覆凸部2〇3與發光元 件204。其中發光碰204之寬度為a，凸部2〇3之底部寬度 201208139 為b ’以及透明封襄結構205之高度為c。為了提昇此燈泡式 光電元件之發光效率，發光元件2〇4之寬度與凸部2G3之底部 寬度之比值a/b，較佳為小於或等於1/3 ;而發光元件2〇4則位 於c/2之位置附近。再者，該發光元件2〇4也可以是由複數個 顏色不同的發光元件所取代，例如是紅色、綠色、及藍色所組 成之白色光源。同時，也可於凸部203之底部附近，形成一圖 案化結構206，環繞於凸部203之底部周圍，使得後續所形成 之透明封裝結構205可以侷限於凸部203之上方，而獲得一個 幾近圓形的球體。 第7圖顯示一背光模組裝置。其中背光模組裝置7⑻包 含：由上述任意實施例之光電元件711所構成的一光源裝置 710 ; —光學裝置720置於光源裝置710之出光路徑上，負責 將光做適當處理後出光；以及一電源供應系統730，提供上述 光源裝置710所需之電源。 第8圖顯示一照明裝置。上述照明裝置800可以是車燈、 街燈、手電筒、路燈、指示燈等等。其中照明裝置8〇〇包含： 一光源裝置810,係由上述任意實施例的光電元件811所構 成；一電源供應系統820，提供光源裝置810所需之電源；以 及一控制元件830控制電流輸入光源裝置810。 雖然本發明已藉各實施例說明如上，然其並非用以限制本 發明之範圍；且任何對於本發明所作之各種修飾與變更，皆不 201208139 脫本發明之精神與範圍。 【圖式簡單說明】 第1圖係本發明第一實施例之光電元件。 第2圖係本發明第二實施例之光電元件。 第3圖係本發明第三實施例之光電元件。 第4A圖係發光效率與y/x比值之關係圖。 第4B圖係發光效率與z/x比值之關係圖。 第5圖係本發明第四實施例之光電元件。 第6圖係本發明第五實施例之光電元件。 第7圖係本發明之一背光模組裝置。 第8圖係本發明之一照明裝置。 123、133、143、 【主要元件符號說明】 102反射層 105透明封裝結構 108 螢光粉層 103 202 載體 205透明封裝結構 700背光模組裝置 710光源裝置 720光學裝置 800照明裝置 811光電元件 830控制元件 104載體 107圖案化結構 204發光元件 203 凸部 206圖案化結構 711光電元件 730電源供應系統 810光源裝置 820 電源供應系統 12201208139 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The present invention relates to a photovoltaic element', particularly a light-emitting element having a transparent package structure. Less, [Prior Art] Light Emitting Diodes are important in solid-state components with wire-switching characteristics. In general, it has a "light-emitting layer (6)_Layer" that is sandwiched between two different semiconductor layers. When a driving current is applied to the electrodes above the two semiconductor layers, electrons and holes of the two semiconductor layers are injected into the light-emitting layer, and combined in the light-emitting layer to emit light, and the light generated at this time is omnidirectional. The light emitting layer is emitted from each surface of the light emitting diode. At the same time, the light-emitting diode is also a widely used light source. Compared with the conventional incandescent bulb or fluorescent tube, the light-emitting diode has the advantages of power saving and long service life, so it gradually replaces the traditional light source. It is used in various fields such as traffic signs, backlight modules, street lighting, medical equipment and other industries. With the application and development of light-emitting diode light sources, the demand for brightness is increasing. Therefore, how to increase the luminous efficiency and increase the brightness thereof has become an important direction for the industry to work together. One area worth investigating is how to increase the luminous efficiency through the design of the package structure 201208139. At present, it is generally designed to adopt a cup structure, and the light-emitting diodes are placed in a cup shape, and the shape of the cup is not scaled, and is distributed in a light pattern. In addition, the choice of encapsulating adhesive, the reflective ability of the bottom carrier and the shape of the cup shape will also affect the luminous efficiency. SUMMARY OF THE INVENTION Carrying: a photovoltaic element, and the present invention provides a photovoltaic element comprising: a 'ΐϊ carrier; a - structure is formed on the surface of the carrier, and the ring-shaped photovoltaic element '· and - transparent package structure 'Formed in the optoelectronic component = (d) the Japanese job structure, set the area of ί =, and by controlling the transparent package junction fff has a specific structural proportion of the transparent package structure. The m reading can be a light-emitting diode component, or any photoelectrically-transferred temple. The invention also provides a photovoltaic element comprising 'a carrier; an optoelectronic ^-maximum width Z' formed on the carrier; and - a transparent package The ratio of 度 y to the surface Λ y projected on the carrier is between α4 and α8, and the ratio of z/x is between 0.3 and 〇5. A further invention provides a photovoltaic element comprising -_, having a convex portion of b, a light f element having a maximum width of &, a connection to the convex and a height of a transparent packaging structure, coated The convex portion and the photoelectric H light; the member is located near the position of W, and the value of ^ is smaller than iit. The transparent sealing-chip which is different in the specific ratio of the above invention can make the difference of photoelectric reading and obtain the lifting of the duck. [0086] [Embodiment] Fig. 1 is a first embodiment of the present invention, wherein each reference has the following meanings: 1〇4 indicates a carrier; 1〇2 indicates a reflective layer; 1〇3 system Indicates a light-emitting element; 105 denotes a transparent package structure; 1〇7 denotes patterning The same elements in the other drawings will be denoted by the same reference numerals and will not be described again. As shown in Fig. 1, this embodiment is mainly for a flat carrier 1〇4. The surface 'forms a reflective layer 1〇2 having a high reflectivity, and then forms a light-emitting 7L piece 1G3 on the reflective layer 1G3 over the reflective layer 1〇2; then, a layer is coated around the light-emitting element 103. The structuring structure having a hydrophobic property, for example, a circular patterning structure, a rectangular patterning structure, or a square W-shaped structure, which surrounds the light-emitting element 103, is formed on the light-emitting element 103 by a dispensing technique. Above. Because the patterned structure 1 () 7 is hydrophobic, so that the transparent packaging material is limited to the area between the patterned structure 1〇7 and the light-emitting element '3', while controlling the transparent package, The amount of glue of the material is obtained as shown in the figure - the structure of the duck-shaped structure having a fixed convex shape. The photoelectric element completed as described above can pass through the reflection of the reflective layer 1〇2 under the light-emitting element 103' The light-emitting element 103 is generated The light is reflected by the transparent package structure 105. By the combination of the reflective layer 1〇2 and the transparent package structure 1〇5, the light extraction efficiency can be greatly improved. The maximum width of the optical element 103 is z, and the package is turned over. The height of the structure (10) 201208139 is y, and the maximum length of the hetero-contact area of the transparent package structure (10) and the reflective layer (10) is X. When the ratio of y/x is between 0 and 0.8, the luminous efficiency is high, and the best is y. The ratio of /x is about 0.6; on the other hand, when the ratio of ζ/χ is between 0.3 and 0.5, there is also a better luminous efficiency; and the best is when the ratio of 汾 is around 0.4. The Lai 104 can be a printed circuit board (pCB), a flexible printed circuit board (FCB), a ceramic board or a composite board. In addition to carrying the light-emitting elements, the heat generated by the light-emitting elements 1〇3 is further advanced, thereby achieving the effect of heat dissipation. The reflective layer 102 has a high reflection coefficient and may be formed of an alloy of gold (Au), silver (Ag), slag (A1), copper (Cu) or the like, or may be a polymer composition having a reflective property. form. The light-emitting element 1〇3 may be a four- or three-element light-emitting diode, and the light emitted may be red, blue, green, yellow or the like. The patterned structure 107 is composed of a material having hydrophobic properties, and forms a surface tension with the transparent encapsulating material, so that the transparent encapsulating material concentrates on the region between the patterned structure 1〇7 and the light-emitting element 1〇3 when dispensing. A raised transparent package structure 1〇5 is produced. The patterned structure 1〇7 may be a polymer material having a hydrophobic functional group, such as a polymer material having a functional group such as a methyl group (me%1) and a fluorine group. The preparation may be by using a sol-gel method or a polymer polymerization method to prepare the polymer material, and using a screen printing process or a spray coating process, on the carrier. The surface of 104 forms a specific pattern, such as a ring 8 201208139 shape, rectangle or square. Transparent encapsulation structure 1G5, Weng-transparent material is finely formed on the light-emitting element (10) by means of dispensing technology, and then heat-hardened and formed, and the package material is high-light-transparent (4), such as epoxy曰(9)(4), pGly imides, _msin) or the above-mentioned materials. Figure 2 is a second embodiment of the present invention. As described in the first embodiment, after illuminating a reflective layer (10) having a high reflectivity on a carrier (Fig. 7F), the illuminating element 103 is coupled to the reflection. Above the layer 1〇2; then, a transparent encapsulation material is formed on the light-emitting element (10) by using a dispensing technique, and a transparent package structure 105 having a specific protrusion is formed by controlling the glue 1' of the sealing material. In order to achieve the best luminous efficiency of the present invention, the size of the transparent package structure 1G5 must be matched and designed. As shown in Fig. 2, the maximum width of the light-emitting element 1〇3 is z', the height of the transparent sealing structure 105 is y, and the transparent package structure 105 = the maximum length of the contact surface of the reflective layer 102 is X. Wherein the light-emitting element 103 is formed on a wafer of a size of 15 mils to 4 mils, which is a common size, and various transparent conditions are formed to form a transparent package structure 105 having a convex shape above the light-emitting element 103 to obtain various y/x ratios. The luminous efficiency produced is plotted with the two as the coordinates'. The result is shown in Fig. 4A. According to FIG. 4A, regardless of the size of the wafer, when the ratio of y/x is between 0.4 and 0.8, the luminous efficiency is high; especially when the ratio of y/χ is around 0.6, The luminous efficiency is the highest. Furthermore, when the y/x ratio of the transparent package structure 105 is fixed at 0.5, 201208139 varies various z/x ratios, and simultaneously measures the individual luminous efficiencies, and plots the two as the coordinates. As shown in Fig. 4B, regardless of the size of the wafer, when the ratio of z/x is between 0.3 and 0.5, the luminous efficiency is high; especially when the ratio of z/x is around 0.4, the luminous efficiency is high. highest. Fig. 3 is a third embodiment of the present invention, further coating a phosphor layer 1〇8 on the surface of the light-emitting element for wavelength conversion. The light-emitting element 103 may be an InGaN series light-emitting diode that emits a yellow phosphor of the YGA series of one of the blue light-excited phosphor layers 108 to generate white light. In a fourth embodiment of the present invention, as shown in FIG. 5, the light-emitting element 103 in the second embodiment is replaced by a plurality of light-emitting elements 123, 133, and 143, wherein the light-emitting elements 123, 133, and 143 each emit a different color. The light is red, green, and blue, and is mixed in the transparent package structure 1〇5 to generate white light. As shown, an array of a plurality of light-emitting elements 123, 133, and 143 has a maximum width of z'. The height of the transparent package structure 1〇5 is y, and the maximum length of the contact surface of the transparent package structure 1〇5 and the reflection 102 is X; wherein the ratio of y/x is between G.4 and 0.8' is preferably G6; and the ratio of a is between 0.3 and 0.5, and most preferably 0.4. Figure 6 is a fifth embodiment of the present invention, a bulb-type photovoltaic element comprising a carrier 2〇2 having a convex portion 203; - a light-emitting element 2〇4 coupled to the convex portion 203; and a transparent seal The 裴 structure 2〇5 covers the convex portion 2〇3 and the light-emitting element 204. The width of the light-emitting bump 204 is a, the bottom width of the convex portion 2〇3 is 20120139, and the height of the transparent sealing structure 205 is c. In order to increase the luminous efficiency of the bulb-type photovoltaic element, the ratio a/b of the width of the light-emitting element 2〇4 to the bottom width of the convex portion 2G3 is preferably less than or equal to 1/3; and the light-emitting element 2〇4 is located at c Near the /2 position. Further, the light-emitting element 2〇4 may be replaced by a plurality of light-emitting elements having different colors, for example, a white light source composed of red, green, and blue. At the same time, a patterned structure 206 can be formed around the bottom of the convex portion 203 to surround the bottom of the convex portion 203, so that the subsequently formed transparent package structure 205 can be limited to the upper portion of the convex portion 203, and a few A nearly circular sphere. Figure 7 shows a backlight module device. The backlight module device 7 (8) includes: a light source device 710 composed of the photoelectric element 711 of any of the above embodiments; - the optical device 720 is placed on the light path of the light source device 710, and is responsible for light treatment after proper processing; and The power supply system 730 provides the power required by the light source device 710 described above. Figure 8 shows a lighting device. The lighting device 800 described above may be a car light, a street light, a flashlight, a street light, an indicator light, or the like. The illumination device 8A includes: a light source device 810, which is composed of the photovoltaic element 811 of any of the above embodiments; a power supply system 820 that provides the power required by the light source device 810; and a control element 830 that controls the current input source. Device 810. The present invention has been described above with reference to the embodiments, and is not intended to limit the scope of the invention; any modifications and variations of the present invention are not intended to be exhaustive. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a photovoltaic element according to a first embodiment of the present invention. Fig. 2 is a view showing a photovoltaic element of a second embodiment of the present invention. Fig. 3 is a view showing a photovoltaic element of a third embodiment of the present invention. Figure 4A is a plot of luminous efficiency versus y/x ratio. Figure 4B is a plot of luminous efficiency versus z/x ratio. Fig. 5 is a view showing a photovoltaic element of a fourth embodiment of the present invention. Fig. 6 is a view showing a photovoltaic element of a fifth embodiment of the present invention. Figure 7 is a backlight module device of the present invention. Figure 8 is a lighting device of the present invention. 123, 133, 143, [Description of main component symbols] 102 reflective layer 105 transparent package structure 108 phosphor layer 103 202 carrier 205 transparent package structure 700 backlight module device 710 light source device 720 optical device 800 illumination device 811 optoelectronic component 830 control Element 104 carrier 107 patterned structure 204 light emitting element 203 convex portion 206 patterned structure 711 photovoltaic element 730 power supply system 810 light source device 820 power supply system 12