TW201208093A - Solar cell module and method for manufacturing the same - Google Patents
Solar cell module and method for manufacturing the same Download PDFInfo
- Publication number
- TW201208093A TW201208093A TW100108809A TW100108809A TW201208093A TW 201208093 A TW201208093 A TW 201208093A TW 100108809 A TW100108809 A TW 100108809A TW 100108809 A TW100108809 A TW 100108809A TW 201208093 A TW201208093 A TW 201208093A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- layer
- solar cell
- collector electrode
- electrode layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 238000000034 method Methods 0.000 title description 19
- 238000007747 plating Methods 0.000 claims abstract description 67
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 239000011889 copper foil Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 238000000605 extraction Methods 0.000 claims description 97
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 72
- 238000006243 chemical reaction Methods 0.000 claims description 41
- 229910052742 iron Inorganic materials 0.000 claims description 36
- 238000005476 soldering Methods 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 18
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 238000005242 forging Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 238
- 229910000679 solder Inorganic materials 0.000 description 22
- 239000010408 film Substances 0.000 description 18
- 230000020169 heat generation Effects 0.000 description 8
- 238000013316 zoning Methods 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
- 239000004575 stone Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052732 germanium Inorganic materials 0.000 description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910052727 yttrium Inorganic materials 0.000 description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 fluororesin Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
- H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010060995 | 2010-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201208093A true TW201208093A (en) | 2012-02-16 |
Family
ID=44649078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100108809A TW201208093A (en) | 2010-03-17 | 2011-03-15 | Solar cell module and method for manufacturing the same |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW201208093A (ja) |
| WO (1) | WO2011114983A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI724631B (zh) * | 2018-12-18 | 2021-04-11 | 日商亞特比目有限公司 | 超音波焊接裝置及超音波焊接方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130025673A1 (en) * | 2010-04-01 | 2013-01-31 | Somont Gmbh | Solar cells and method for producing same |
| JP5562733B2 (ja) * | 2010-06-16 | 2014-07-30 | 東芝三菱電機産業システム株式会社 | 部材接合方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3146203B1 (ja) * | 1999-09-06 | 2001-03-12 | 鐘淵化学工業株式会社 | 薄膜太陽電池モジュール及びその製造方法 |
| JP2002263880A (ja) * | 2001-03-06 | 2002-09-17 | Hitachi Cable Ltd | Ｐｂフリー半田、およびこれを使用した接続用リード線ならびに電気部品 |
| JP2003142711A (ja) * | 2001-11-06 | 2003-05-16 | Sony Corp | 集積型太陽電池の製造方法 |
| JP4101606B2 (ja) * | 2002-10-16 | 2008-06-18 | 三菱重工業株式会社 | 薄膜太陽電池モジュール |
| JP2007305876A (ja) * | 2006-05-12 | 2007-11-22 | Matsushita Electric Ind Co Ltd | 太陽電池モジュール |
| JP4780008B2 (ja) * | 2006-12-14 | 2011-09-28 | 日立電線株式会社 | 太陽電池用めっき線及びその製造方法 |
| JP2009130020A (ja) * | 2007-11-21 | 2009-06-11 | Mitsubishi Heavy Ind Ltd | 太陽電池パネル及び太陽電池パネルの製造方法 |
-
2011
- 2011-03-10 WO PCT/JP2011/055630 patent/WO2011114983A1/ja not_active Ceased
- 2011-03-15 TW TW100108809A patent/TW201208093A/zh unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI724631B (zh) * | 2018-12-18 | 2021-04-11 | 日商亞特比目有限公司 | 超音波焊接裝置及超音波焊接方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011114983A1 (ja) | 2011-09-22 |
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