201207633 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種伺服器系統，特別是有關於一 種具有多個主機板的伺服器系統。 、 【先前技術】 隨著科技的進步以及人們對電腦系統的依賴程度 越來越高，市場對電腦系統的運算能力與資料存儲容量 的要求也逐漸提高。目而，為了滿足使用者針對該電腦 系統的資料需求和存儲規格，必須在電腦系統中設置多 個硬碟和其他的相關元件。例如，設計人員往往=置很 多溫度感測器，以便檢測這些硬碟的工作溫度和諸如主 機板等控制it件的工作溫度。與此同時，針對硬碟工作 f度的具體數值，還需配置具有多種不同轉速的風扇， 從而在系統元件的工作溫度過高時，增加風扇轉速以迅 Φ 逮散熱。 然而，多個主機板、相關元件以及多個硬碟均被安 裝於機殼中，以伺服器為例，通常伺服器的機箱空間相 對有限’在如此狹窄的機箱空間中合理佈局這些主機 板、硬碟和其他元件，並在物理連接和電路連接上進行 優化配置並非易事。 β有鑒於此，如何設計一種新型的伺服器系統架構， 是相關技術人員亟需解決的一項課題。 201207633 【發明内容】 針對現有技術中飼服器系統在機殼内組裝多個部 件時所存在的上述缺陷，本發明提供了一種新型的飼服 器系統。 根據本發明的一個方面’提供了一種伺服器系統， ，括·第一組主機板模組和一第二組主機板模組、一 第一轉接板和一第二轉接板、一硬碟陣列、一第一電源 控制板和一第二電源控制板以及一管理板。其中，第二 組主機板模組和第二組主機板模組分別包括多個主機 板模組，每一該主機板模組包括：一主機板和一主機板 子板，該主機板子板電性連接至該主機板，該主機板的 所有電性連接經由該主機板子板轉接。該第一轉接板電 陡連接至该第一組主機板模組的每一該主機板模組的 該主機板子板，該第二轉接板電性連接至該第二組主機 板模組的每一該主機板模組的該主機板子板。該硬碟陣 包括一硬碟背板和多個硬碟，該硬碟背板電性連接該 多個硬碟，並且該硬碟背板電性連接至該第一轉接板和 第二轉接板，該第一組主機板模組的每一該主機板通過 °亥主機板子板、該第一轉接板以及該硬碟背板電性連接 至該多個硬碟，該第二組主機板模組的每一該主機板通 過該主機板子板、該第二轉接板以及該硬碟背板電性連 接至該多個硬碟。該第一電源控制板和該第二電源控制 板分別電性連接至少一電源供應器，該第一電源控制板 電性連接至該第一轉接板，該第一組主機板模組通過該 201207633 第一轉接板接收該第一電源控制板的供電；該第二電源 控制板電性連接至該第二轉接板，該第二組主機板模組 通過該第二轉接板接收該第二電源控制板的供電，並且 該第一電源控制板和第二電源控制板電性連接至該硬 碟陣列，該硬碟背板和該多個硬碟接收該第一電源控制 板和第一電源控制板的供電。該管理板電性連接至該第 一轉接板和該第二轉接板，該管理板通過該第一轉接板 和該第一轉接板接收電源以及由該第一組主機板模組 籲和第二組主機板模組的該主機板發出的風扇控制信 號’以對該伺服器系統中的多個風扇進行統一管理。 其中’該管理板還用於接收多個第一開關機信號， 每一第一開關機信號對應地對該多個主機板的其中之 一執行開關機動作，該管理板接收到任一該第一開關機 信號時’根據該第一開關機信號與該主機板的對應關 係，向該主機板對應的該第一電源控制板或第二電源控 馨制板發送一第一電源控制信號’使對應的該第一電源控 制板或第二電源控制板所連接的該電源供應器開始供 電或停止供電’以便使對應的該主機板執行開機或關機 操作。 其中，該管理板接收到任一該第一開關機信號時， 首先發送一第二開關機信號至對應的該主機板，然後該 主機板根據接收到的該第二開關機信號發送一第二電 源控制信號至該管理板，最後該管理板再將該第一電源 控制信號發給對應的該第一電源控制板或第二電源控 201207633 制板，使對應的該電源供應器針對對應的該主機板開始 供電或停止供電。 依據本發明的一實施例，該伺服器系統更包括一開 關機面板’電性連接至該管理板，該開關機面板包括多 ^ 個開關機按鈕，每一該開關機按鈕對應該多個主機板的 ' 其中之一 ’該第一開關機信號由該開關機按鈕發出。優 選地，該開關機面板包括一第一開關機面板及一第二開 關機面板，該第一開關機面板與連接至該第一轉接板的 _ 該主機板對應’該第二開關機面板與連接至該第二轉接 板的該主機板對應。依據本發明的又一實施例，每一該 主機板包括一基板管理控制器（BMC )，該第一開關機 信號由該基板管理控制器發出。 其中’每一該主機板包括一基板管理控制器 (BMC )’用於監控所在的該主機板的工作狀態，該基 板管理控制器根據所在的該主機板的工作狀態產生該 _ 風扇控制信號，並將該風扇控制信號發送至該管理板。 優選地，每一該主機板還包括多個溫度感測器，用於監 測所在的該主機板的工作溫度，並電性連接至所在的該 主機板的該基板管理控制器，將該主機板的工作溫度資 料傳送至該基板管理控制器，該風扇控制信號包括該主 機板的工作溫度資料。優選地，該基板管理控制器經由 I2C匯流排與該管理板通訊。 其中，該硬碟陣列還包括多個溫度感測器，該溫度 感測器偵測該硬碟陣列的工作溫度，該硬碟背板電性連 201207633 接至該管理板’將該硬碟陣列的工作溫度資料傳送至該 管理板’該管理板根據該主機板發出的該風扇控制信號 及該硬碟陣列的工作溫度資料對該風扇進行統一管理。 其中，該主機板和該主機板子板分別包括對應的電 源介面、硬碟資料介面以及控制信號介面，並透過線纜 -電性連接。優選地，該主機板子板包括—金手指，並通 過該金手指與該第一轉接板或該第二轉接板電性連 接，該金手指的接腳對應該電源介面、該硬碟資料介面 籲 以及該控制信號介面的接腳。 其中，該第一轉接板或第二轉接板通過硬碟資料介 面與該硬碟背板電性連接。 其中，该硬碟背板電性連接至該管理板，該管理板 還用於偵測該多個主機板是否存在並產生一主機板組 態資料，然後將該主機板組態資料傳送至該硬碟背板， 該硬碟背板根據該主機板組態資料動態分配該多個硬 ^ 碟與該主機板的對應關係。 採用本發明的伺服器系統，通過多個主機板模組、 轉接板、硬碟陣列、電源控制板和管理板之間的連接， 可以即時地監測主機板的工作溫度和硬碟陣列的工作 溫度，並根據所發出的風扇控制信號和溫度資料對風扇 進行統一管理，上述各部件之間容易組裝，配置靈活方 便。 【實施方式】 201207633 下面參照附圖’對本發明的具體實施方式作進一步 的詳細描述。 第1圖繪示依據本發明一實施例的伺服器系統的 整體結構框圖。參照第1圖，伺服器系統包括：兩組主 機板模組10和20、兩塊轉接板3〇和40、兩個電源控 制板50和60、一管理板7〇和一硬碟陣列8〇。其中， 第一組主機板模組1〇包括主機板模組1〇1和1〇3，第 二組主機板模組20包括主機板模組2〇1和2〇3。優選 地，可以採用完全相同的配置元件來形成第一組主機板 模組10和第二組主機板模組2〇。那麼，在主機板模組 101、103、201和203中，每一主機板模組均包括一主 機板和一主機板子板，主機板的所有電性連接線路都藉 由對應的主機板子板轉接。具體地，主機板模組1〇1 包括主機板loii和主機板子板1〇13，主機板模組1〇3 包括主機板1012和主機板子板1〇14，主機板模組2〇1 包括主機板2011和主機板子板2013,以及主機板模組 203包括主機板2012和主機板子板2〇14。 依據一實施例，主機板模組HH、103、201和203 中的每一主機板模組的主機板和對應的主機板子板均 包括相應的電源介面、硬碟資料介面和控制信號介面， 主機板的這三類介面與主機板子板上對應的介面通過 線纜電性連接在一起。較佳地，主機板子板還包括一金 手指’並且含有該主機板子板的主機板模組通過金手指 與轉接板電性連接。金手指的接腳對應主機板子板的電 201207633 源介面、硬碟資料介面以及控制信號介面的接腳。 相對于現有技術中主機板模組僅具有單一主機板 的形式，本發明的主機板模組包括主機板和主機板子 板，且主機板和主機板子板之間通過線纜電性連接，有 效解決了現有技術中單一主機板上的零件佈局以及板 内走線受主機板空間限制而影響信號品質的問題，進而 減小了主機板的體積以及主機板模組的體積，並且通過 主機板子板的金手指與轉接板電性連接，便於主機板模 組在伺服器系統中的熱插拔。 轉接板30電性連接至第一組主機板模組1〇，轉接 板40電性連接至第二組主機板模組^確切地說，轉 接板30連接至主機板模組1〇1的主機板子板1〇13，以 及連接至主機板模組1〇3的主機板子板1〇14<}類似地， 轉接板40連接至主機板模組2〇1的主機板子板2〇13， 以及連接至主機板模組203的主機板子板2014。 此外，伺服器系統還包括兩個電源控制板5〇和 6〇，它們分別電性連接至相應的電源供應器（圖中未 不），以提供該伺服器系統正常運作所需的電能。其中 電源控制板50電性連接至轉接板3〇，第一組主機板模 組10通過轉接板30接收來自電源控制板5〇的供電， 電源控制板60電性連接至轉接板4〇，第二組主機板模 組20通過轉接板40接收來自電源控制板6〇的供電。 如第1圖所示，該伺服器系統還包括一管理板7〇, 該管理板70電性連接至轉接板3〇和4〇以及電源控制 201207633 板50和60。更為詳細地，管理板7〇通過轉接板3〇接 收電源以及來自第一組主機板模組1〇的主機板1〇11和 1012發出的風扇控制信號，並且通過轉接板接收電 源以及來自第二組主機板模組2〇的主機板2〇η和2012 ^發出的風扇控制信號，從而對系統中的多個風扇進行統 一管理。 硬碟陣列80包括一硬碟背板8〇1和多個硬碟，其 中硬碟背板801電性連接至這些硬碟。硬碟背板 籲還電性連接至轉接板30和轉接板4〇。優選地，轉接板 40或轉接板50通過硬碟資料介面與硬碟背板8〇1電性 連接。如此一來，第一組主機板模組1〇的主機板模組 101和103中對應的主機板1011和1012可以分別通過 主機板子板1013和1014、轉接板30以及硬碟背板8〇1 電性連接至這些硬碟，以及第二組主機板模組2〇的主 機板模組201和203可以分別通過主機板子板2〇13和 • 2014、轉接板40以及硬碟背板8〇1電性連接至這些硬 碟。此外，硬碟陣列80還電性連接至電源控制板50 和60以及管理板7〇,進而硬碟陣列8〇的硬碟背板⑽工 和多個硬碟相應地接收電源控制板5〇和6〇的供電。 在本發明的一實施例中，硬碟陣列80還包括多個 溫度感測器’這些溫度感測器伯測硬碟陣列8()的工作 溫度，藉由硬碟背板801電性連接至管理板7〇，可以 將硬碟陣列8G的工作溫度資料傳送至管理板7〇，然後 管理板7G根據對應的主機板所發出的風扇控制信號及 201207633 硬碟陣列80的工作溫度資料對多個風扇進行統-管 理。 在本發明的另一實施例中，硬碟背板8〇1電性連接 管理板70’通過管理板7〇來檢測第一組主機板模組1〇 和第二組主機板模組20中的多個主機板是否存在，並 產生一主機板組態資料。利用管理板7〇和硬碟背板8〇ι 之間的電性連接關係，將所生成的主機板組態資料傳送 至硬碟背板801 ’接著硬碟背板8〇1根據主機板組態資 _ 料來動態分配多個硬碟與多個主機板之間的對應關係。 在本發明的伺服器系統中，通過管理板7〇還可以 執行伺服器系統的開機或關機操作。當管理板7〇接到 多個開關機信號（此處稱為第一開關機信號，每個開關 機信號相應地對每個主機板執行開機或關機操作）時， 根據第一開關機信號與主機板之間的匹配關係，向該主 機板對應的電源控制板50或電源控制板6〇發送一電源 鲁控制信號（此處稱為第一電源控制信號），使對應的電 源控制板50或60所連接的電源供應器開始供電或停止 供電。較佳地’管理板70在收到任一第一開關機信號 時’首先發送一第二開關機信號至對應的主機板，然後 該主機板根據收到的第二開關機信號再發送一第二電 源控制信號至管理板70，最後管理板70再將前述的第 一電源控制信號發給對應的電源控制板50或60。 依據一實施例，該伺服器系統包括一開關機面板， 電性連接至管理板70，並且此開關機面板包括多個開 12 201207633 關機按鈕，每一開關機按鈕對應地控制一主機板，並且 通過開關機按鈕所發出的第一開關機信號來執行主機 板的開機或關機操作。優選地，為了對應於第一組主機 板模組ίο和第二組主機板模組20，該開關機面板可設 置包括第一開關機面板和第二開關機面板，其中，第一 ,開關機面板與連接至轉接板30的第一組主機板模組1〇 的夕個主機板對應，第二開關機面板與連接至轉接板 4〇的第二組主機板模組20的多個主機板對應。 修與上述實施例不同，在本發明的伺服器系統的又一 實施例中，第一開關機信號由每個主機板中的基板管理 控制器發送至管理板70，而並非上述的開關機面板。 此外，主機板的基板管理控制器還可用來監控所在主機 板的工作狀態，並根據主機板的工作狀態產生風扇控制 信號’發送至管理板70。在主機板1〇11、1〇12、2〇11 和2012中，每一主機板還包括多個溫度感測器，用來 φ 監測所在主機板的工作溫度，並將該主機板的工作溫度 資料傳送至主機板上的基板管理控制器。其中，由基板 管理控制器產生的風扇控制信號包括主機板的工作溫 度-貝料。例如，主機板上的基板管理控制器經由12(：匯 流排與管理板70通訊。 採用本發明的伺服器系統，通過多個主機板模組、 轉接板、硬碟陣列、電源控制板和管理板之間的連接， 可以即時地監測主機板的工作溫度和硬碟陣列的工作 /m·度，並根據所發出的風扇控制信號和溫度資料對風扇 13 201207633 進行統一管理，上述各部件之間容易組裝，配置靈活方 便。此外’本發明的主機板模組包括主機板和主機板子 板，主機板和主機板子板之間通過線纜電性連接，減小 了主機板的體積以及主機板模組的體積，並且通過主機 板子板的金手指與轉接板電性連接，便於主機板模組在 伺服器系統中進行熱插拔。 雖然本發明已以實施方式揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精 神和範圍内，當可作各種之更動與潤飾，因此本發明之 保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 讀者在參照附圖閱讀了本發明的具體實施方式以 後’將會更清楚地瞭解本發明的各個方面。其中， 第1圖繪示依據本發明一實施例的伺服器系統的 整體結構框圖。 【主要元件符號說明】 1 〇 第一組主機板模組 20 第二組主機板模組 3〇 轉接板 40 轉接板 50 電源控制板 201207633 電源控制板 管理板 硬碟陣列 主機板模組 主機板模組 主機板模組 主機板模組 主機板 主機板子板 主機板 主機板子板 主機板 主機板子板 主機板 主機板子板 硬碟背板201207633 VI. Description of the Invention: [Technical Field] The present invention relates to a server system, and more particularly to a server system having a plurality of motherboards. [Prior Art] With the advancement of technology and the increasing dependence of people on computer systems, the market's computing power and data storage capacity requirements for computer systems have gradually increased. In order to meet the data requirements and storage specifications of the computer system, a plurality of hard disks and other related components must be set in the computer system. For example, designers often have a large number of temperature sensors to detect the operating temperature of these hard disks and the operating temperature of the control components such as the main board. At the same time, for the specific value of the working degree of the hard disk, it is also necessary to configure a fan with a plurality of different speeds, so that when the operating temperature of the system component is too high, the fan speed is increased to quickly capture heat. However, a plurality of motherboards, related components, and a plurality of hard disks are installed in the casing. Taking a server as an example, the server has a relatively limited chassis space, and the motherboards are properly arranged in such a narrow chassis space. Hard disk and other components, and optimal configuration on physical connections and circuit connections are not easy. In view of this, how to design a new type of server system architecture is an urgent problem for the related art. 201207633 SUMMARY OF THE INVENTION The present invention provides a novel feeding device system in view of the above-described drawbacks of the prior art feeding device system in assembling a plurality of components in a casing. According to an aspect of the present invention, a server system is provided, including: a first group of motherboard modules and a second group of motherboard modules, a first adapter board and a second adapter board, and a hard A disk array, a first power control board and a second power control board, and a management board. The second set of motherboard modules and the second set of motherboard modules respectively comprise a plurality of motherboard modules, and each of the motherboard modules comprises: a motherboard and a motherboard board, and the motherboard board is electrically Connected to the motherboard, all electrical connections of the motherboard are transferred via the motherboard subboard. The first adapter board is electrically connected to the motherboard board of each of the motherboard modules of the first group of motherboard modules, and the second adapter board is electrically connected to the second group of motherboard modules. The motherboard board of each of the motherboard modules. The hard disk array includes a hard disk backplane and a plurality of hard disks. The hard disk backplane is electrically connected to the plurality of hard disks, and the hard disk backplane is electrically connected to the first riser board and the second turn Each of the motherboards of the first group of motherboard modules is electrically connected to the plurality of hard disks through the motherboard board, the first adapter board, and the hard disk backplane, the second group Each of the motherboards of the motherboard module is electrically connected to the plurality of hard disks through the motherboard board, the second adapter board, and the hard disk backplane. The first power control board and the second power control board are respectively electrically connected to the at least one power supply. The first power control board is electrically connected to the first adapter board, and the first group of motherboard modules passes the 201207633, the first adapter board receives the power supply of the first power control board; the second power control board is electrically connected to the second adapter board, and the second group of motherboard modules receive the second power distribution board Powering the second power control board, and the first power control board and the second power control board are electrically connected to the hard disk array, and the hard disk backplane and the plurality of hard disks receive the first power control board and the first A power supply board is powered. The management board is electrically connected to the first riser board and the second riser board, and the management board receives power through the first riser board and the first riser board and is configured by the first group of motherboard modules Calling the fan control signal sent by the motherboard of the second group of motherboard modules to uniformly manage the plurality of fans in the server system. Wherein the management board is further configured to receive a plurality of first switch signals, each of the first switch signals correspondingly performing a switch action on one of the plurality of motherboards, and the management board receives any of the When a switch signal is sent, 'corresponding to the corresponding relationship between the first switch signal and the motherboard, sending a first power control signal to the first power control board or the second power control board corresponding to the motherboard The corresponding power supply connected to the first power control board or the second power control board starts to supply power or stops supplying power to enable the corresponding motherboard to perform a power on or power off operation. When the management board receives any of the first switch signals, first sends a second switch signal to the corresponding motherboard, and then the motherboard sends a second according to the received second switch signal. The power control signal is sent to the management board, and finally the management board sends the first power control signal to the corresponding first power control board or the second power control 201207633 board, so that the corresponding power supply is corresponding to the power supply The motherboard starts to supply power or stops power. According to an embodiment of the invention, the server system further includes a switch panel that is electrically connected to the management board, the switch panel includes a plurality of switch buttons, each of the switch buttons corresponding to the plurality of hosts The 'one of the'' of the board is signaled by the on/off button. Preferably, the switch panel comprises a first switch panel and a second switch panel, and the first switch panel corresponds to the motherboard connected to the first adapter board. Corresponding to the motherboard connected to the second riser board. In accordance with still another embodiment of the present invention, each of the motherboards includes a baseboard management controller (BMC) that is signaled by the baseboard management controller. Wherein each of the motherboards includes a baseboard management controller (BMC) for monitoring the working state of the motherboard, and the baseboard management controller generates the _fan control signal according to the working state of the motherboard. And send the fan control signal to the management board. Preferably, each of the motherboards further includes a plurality of temperature sensors for monitoring the operating temperature of the motherboard, and is electrically connected to the baseboard management controller of the motherboard where the motherboard is located. The working temperature data is transmitted to the baseboard management controller, and the fan control signal includes operating temperature data of the motherboard. Preferably, the baseboard management controller communicates with the management board via an I2C bus. The hard disk array further includes a plurality of temperature sensors, the temperature sensor detects an operating temperature of the hard disk array, and the hard disk backplane is electrically connected to the management board to connect the hard disk array to the management board. The working temperature data is transmitted to the management board. The management board uniformly manages the fan according to the fan control signal sent by the motherboard and the working temperature data of the hard disk array. The motherboard and the motherboard sub-board respectively include a corresponding power interface, a hard disk data interface, and a control signal interface, and are electrically connected through a cable. Preferably, the motherboard board includes a gold finger, and is electrically connected to the first adapter board or the second adapter board by the gold finger, and the pin of the gold finger corresponds to the power interface and the hard disk data. Interface and the pin of the control signal interface. The first riser board or the second riser board is electrically connected to the hard disk backplane through a hard disk data interface. The hard disk backplane is electrically connected to the management board, and the management board is further configured to detect whether the plurality of motherboards exist and generate a motherboard configuration data, and then transmit the motherboard configuration data to the motherboard The hard disk backplane dynamically allocates the correspondence between the plurality of hard disks and the motherboard according to the configuration information of the motherboard. With the server system of the present invention, the working temperature of the motherboard and the work of the hard disk array can be monitored instantaneously through the connection between the plurality of motherboard modules, the adapter board, the hard disk array, the power control board and the management board. Temperature, and according to the fan control signal and temperature data issued, the fan is managed uniformly. The above components are easy to assemble and flexible. [Embodiment] 201207633 A specific embodiment of the present invention will be further described in detail below with reference to the accompanying drawings. FIG. 1 is a block diagram showing the overall structure of a server system according to an embodiment of the invention. Referring to FIG. 1, the server system includes two sets of motherboard modules 10 and 20, two adapter boards 3 and 40, two power control boards 50 and 60, a management board 7 and a hard disk array 8. Hey. The first set of motherboard modules 1 includes the motherboard modules 1〇1 and 1〇3, and the second group of motherboard modules 20 includes the motherboard modules 2〇1 and 2〇3. Preferably, the first set of motherboard modules 10 and the second set of motherboard modules 2 can be formed using identical configuration elements. Then, in the motherboard modules 101, 103, 201, and 203, each motherboard module includes a motherboard and a motherboard subboard, and all electrical connection lines of the motherboard are transferred by the corresponding motherboard subboard. Pick up. Specifically, the motherboard module 101 includes a motherboard board lui and a motherboard board 1〇13, and the motherboard module 1〇3 includes a motherboard 1012 and a motherboard board 1〇14, and the motherboard module 2〇1 includes a host. The board 2011 and the motherboard board 2013, and the motherboard module 203 include a motherboard 2012 and a motherboard board 2〇14. According to an embodiment, the motherboard of each motherboard module and the corresponding motherboard sub-board of the motherboard modules HH, 103, 201, and 203 respectively include a corresponding power interface, a hard disk data interface, and a control signal interface, and the host The three types of interfaces of the board are electrically connected to the corresponding interfaces on the motherboard board through cables. Preferably, the motherboard board further includes a gold finger' and the motherboard module containing the motherboard board is electrically connected to the adapter board by a gold finger. The pin of the gold finger corresponds to the power of the motherboard board, the 2012-0433 source interface, the hard disk data interface, and the pins of the control signal interface. Compared with the prior art, the motherboard module has only a single motherboard. The motherboard module of the present invention includes a motherboard and a motherboard, and the motherboard and the motherboard are electrically connected through cables. In the prior art, the layout of components on a single motherboard and the limitation of signal quality in the in-board routing are limited by the space of the motherboard, thereby reducing the volume of the motherboard and the volume of the motherboard module, and passing through the motherboard board. The gold finger is electrically connected to the adapter board to facilitate hot plugging of the motherboard module in the server system. The adapter board 30 is electrically connected to the first group of motherboard modules 1 , and the adapter board 40 is electrically connected to the second group of motherboard modules. Specifically, the adapter board 30 is connected to the motherboard module 1 . The motherboard board 1〇13 of 1 and the motherboard board 1连接14 connected to the motherboard module 1〇3] Similarly, the adapter board 40 is connected to the motherboard board 2 of the motherboard module 2〇1〇 13, and a motherboard board 2014 connected to the motherboard module 203. In addition, the server system also includes two power control boards 5 and 6 respectively electrically connected to respective power supplies (not shown) to provide the power required for the servo system to function properly. The power control board 50 is electrically connected to the adapter board 3〇, and the first group of motherboard modules 10 receive power from the power control board 5 through the adapter board 30. The power control board 60 is electrically connected to the adapter board 4 That is, the second group of motherboard modules 20 receives power from the power control board 6 through the adapter board 40. As shown in FIG. 1, the server system further includes a management board 70, which is electrically connected to the interposer boards 3 and 4 and the power supply 201207633 boards 50 and 60. In more detail, the management board 7 receives the power supply and the fan control signals from the motherboards 1〇11 and 1012 of the first group of motherboard modules 1 through the interposer 3, and receives power through the interposer and The main board 2〇η from the second group of motherboard modules 2和 and the fan control signal issued by 2012^ are used to uniformly manage multiple fans in the system. The hard disk array 80 includes a hard disk backplane 8〇1 and a plurality of hard disks, wherein the hard disk backplane 801 is electrically connected to the hard disks. The hard disk backplane is also electrically connected to the adapter board 30 and the adapter board 4A. Preferably, the adapter board 40 or the adapter board 50 is electrically connected to the hard disk backplane 8〇1 through a hard disk data interface. In this way, the corresponding motherboards 1011 and 1012 of the motherboard modules 101 and 103 of the first group of motherboard modules can pass through the motherboard boards 1013 and 1014, the adapter board 30, and the hard disk backplane 8 respectively. 1 The motherboard modules 201 and 203 electrically connected to the hard disk and the second group of motherboard modules 2 can pass through the motherboard boards 2〇13 and 2014, the adapter board 40, and the hard disk backplane 8, respectively. 〇 1 is electrically connected to these hard drives. In addition, the hard disk array 80 is also electrically connected to the power control boards 50 and 60 and the management board 7〇, and the hard disk backplane (10) of the hard disk array 8 and the plurality of hard disks receive the power control board 5 6 〇 power supply. In an embodiment of the invention, the hard disk array 80 further includes a plurality of temperature sensors 'the operating temperatures of the temperature sensors of the hard disk array 8 (), which are electrically connected to the hard disk backplane 801 to The management board 7〇 can transmit the working temperature data of the hard disk array 8G to the management board 7〇, and then the management board 7G pairs the fan control signal sent by the corresponding motherboard and the operating temperature data of the 201207633 hard disk array 80. The fan is managed-managed. In another embodiment of the present invention, the hard disk backplane 8〇1 is electrically connected to the management board 70' to detect the first group of motherboard modules 1〇 and the second group of motherboard modules 20 through the management board 7〇. Whether multiple motherboards exist and generate a motherboard configuration data. The generated motherboard configuration data is transferred to the hard disk backplane 801 by the electrical connection between the management board 7〇 and the hard disk backplane 8〇. Then the hard disk backplane 8〇1 is based on the motherboard group The status information is used to dynamically allocate the correspondence between multiple hard disks and multiple motherboards. In the server system of the present invention, the power-on or power-off operation of the server system can also be performed through the management board 7. When the management board 7 is connected to a plurality of switch signals (herein referred to as a first switch signal, each switch signal correspondingly performs a power on or power off operation for each motherboard), according to the first switch signal and The matching relationship between the motherboards sends a power supply control signal (herein referred to as a first power control signal) to the power control board 50 or the power control board 6 corresponding to the motherboard, so that the corresponding power control board 50 or The 60 connected power supplies start to supply power or stop supplying power. Preferably, the management board 70 first sends a second switch signal to the corresponding motherboard when receiving any first switch signal, and then the motherboard sends a second according to the received second switch signal. The second power control signal is sent to the management board 70, and finally the management board 70 sends the aforementioned first power control signal to the corresponding power control board 50 or 60. According to an embodiment, the server system includes a switch panel electrically connected to the management board 70, and the switch panel includes a plurality of 12 201207633 shutdown buttons, each of which controls a motherboard correspondingly, and The power on or off operation of the motherboard is performed by the first power on/off signal sent by the power button. Preferably, in order to correspond to the first group of motherboard modules ίο and the second group of motherboard modules 20, the switch panel may be configured to include a first switch panel and a second switch panel, wherein, first, the switch The panel corresponds to the first motherboard of the first group of motherboard modules connected to the adapter board 30, and the second switch panel and the second group of motherboard modules 20 connected to the adapter panel 4 The motherboard corresponds. Unlike the above embodiment, in another embodiment of the server system of the present invention, the first switch signal is sent to the management board 70 by the baseboard management controller in each motherboard, instead of the switch panel described above. . In addition, the motherboard management controller of the motherboard can also be used to monitor the working state of the host board and generate a fan control signal 'transmitted to the management board 70 according to the working state of the motherboard. In the motherboards 1〇11, 1〇12, 2〇11 and 2012, each motherboard also includes a plurality of temperature sensors for monitoring the operating temperature of the motherboard and the operating temperature of the motherboard. The data is transferred to the baseboard management controller on the motherboard. The fan control signal generated by the substrate management controller includes the operating temperature of the motherboard - the material. For example, the baseboard management controller on the motherboard communicates with the management board 70 via 12: the server system of the present invention, through the plurality of motherboard modules, the adapter board, the hard disk array, the power control board, and The connection between the management boards can instantly monitor the working temperature of the motherboard and the working/m·degree of the hard disk array, and uniformly manage the fan 13 201207633 according to the fan control signal and temperature data issued, and the above components The board module of the present invention includes a motherboard and a motherboard board, and the motherboard and the motherboard board are electrically connected by cables, which reduces the size of the motherboard and the motherboard. The size of the module is electrically connected to the adapter board through the gold finger of the motherboard board, so that the motherboard module can be hot swapped in the server system. Although the invention has been disclosed in the above embodiments, it is not used. In order to limit the invention, it is possible to make various modifications and retouchings without departing from the spirit and scope of the invention, and thus the present invention The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [0009] The reader will be able to more clearly understand the various aspects of the invention after reading the specific embodiments of the invention with reference to the attached drawings. 1 is a block diagram showing the overall structure of a server system according to an embodiment of the present invention. [Description of Main Components] 1 〇 First Group of Motherboard Modules 20 Second Group of Motherboard Modules 3 〇 Adapter Plates 40 Adapter Board 50 Power Control Board 201207633 Power Control Board Management Board Hard Disk Array Motherboard Module Motherboard Module Motherboard Module Motherboard Module Motherboard Motherboard Daughter Board Motherboard Motherboard Daughter Board Motherboard Motherboard Board Motherboard Motherboard subboard hard disk backplane