201207313 六、發明說明： 【發明所屬之技術領域】 本發明大體上係關於一種照明裝置，其包括一光源及用 於消散由該光源產生之熱之一熱釋放構件。 【先前技術】 近年來，基於LED之照明裝置之使用已增多且正擴展至 各種照明應用。因為咼強度照明裝置之需求报大，所以必 須重視基於LED之照明裝置中所產生之熱之消除問題，以 確保照明裝置之一良好性能、效率及高預期壽命。此外， led照明裝置如今越來越多用在需求環境（如（例如）溫室） 中，其中人造光係用以刺激植物生長。溫室中之潮濕及溫 暖環境（其中溫室工作人員在L E D照明裝置之就近處工作） 除要求足夠冷卻之外，亦要求重視其他需求，如提供具有 足夠絕緣性之LED照明裝置以保護電安全及進入。 CN 201 196403 Y揭示一種光源模組，其具有安裝在一印 刷電路板（PCB)上之一 LED元件，該PCB配置在由鋁合金製 成之一基座上。一預定間隙係形成於該pCB之底面與該基 座之間。一絕緣及導熱材料（諸如矽橡膠及絕緣凝膠或糊 膏）係填充於該PCB之底面與該基座之間。該？(：8之表面填 充有防水絕緣膠。 ' 【發明内容】 本發明之一目的為提供一種替代及改良照明裝置，其提 供需求環境中之一高安全性及同時提供一有效率冷卻。另 一目的為提供一種提供此一改良照明裝置之方法。 157117.doc 201207313 根據本發明之一第一態樣，此等及其他目的係經由一照 明裝置而實現，該照明裝置包括：一印刷電路板（pcB)、 其具有一上表面及一下表面，該PCB進一步包括至少一導 電及導熱部分；一光源，其安裝在該PCB之該上側上以用 於照明，該光源係藉由該光源之至少一接點而熱連接至該 至少-導電及導熱部分；及-熱釋放構件，其用於消散由 »玄光源產生之熱。該熱釋放構件包括一空腔，該PCB係配 置在該空腔内側使得該PCB之該上表面經配置以與該空腔 之一上内表面熱連接。該光源係配置在該空腔之一孔隙 中。由該光源產生之熱係經由該PCB之該上表面與該熱釋 放構件所形成之界面而沿一傳熱路徑傳送，該傳熱路徑自 該光源經由至少一接點及至少一導熱部分而延伸至該熱釋 放構件。 藉此，揭示一種照明裝置，其中提供一良好冷卻給光源 同時提供進入保護及容易組裝。因為？(：^係配置在熱釋放 構件之空腔内，且更特定言之，因為PCB鄰接空腔之上内 壁，所以通常與電源電連接之PCB之下表面係與熱釋放構 件隔開且因此無需隔開電源絕緣，此節約製造步驟及安裝 時間之成本。 另一優點在於在此組態中部件之數量被最小化且各子部 件可僅使用標準技術而製造，因此在照明裝置之生產中無 需特定加工及投入。 另外’有利的是將PCB配置在熱釋放構件（其較佳為一金 屬外殼）之空腔内側使得該金屬外殼完全圍住pCB及對應電 157117.doc 201207313 子器件以在發生火災時防止出現有害情況。PCB之帶電部 件不會脫落’因為該金屬外殼不會像（例如）一塑膠外殼一 樣在咼溫時溶化或分解。 根據照明裝置之一實施例，光源與熱釋放結構之間之空 間填充有罐封材料。此可僅發生在頂側上以提供接觸安 全。又’配置在PCB上之光源（例如可在高電壓下操作之 LED)之間之電絕緣係由pCB之絕緣材料（玻璃增強環氧樹 脂）提供且自頂側由罐封材料提供。此外，pCB下方之空間 可被填滿，但此未必使用電安全。藉此，存在於熱釋放構 件之孔隙中之連接至電壓之任何部件（例如未完全插入peg 中之一電源接點）或PCB之上表面之一部件（其可接通孔隙） 係由熱釋放構件（其可為（例如）一鋁結構）有效密封。罐封 材料亦使電部件防潮防塵。此外，罐封材料提供一有效率 之進入保護》因此，可使照明裝置完全防水且更安全以防 止觸電。此外，因為照明裝置之罐封材料僅限於一小的有 限空間，如(例如)PCB之背面上無需罐封材料，所以照明 裝置易組裝且最終照明裝置之總重量及成本被減少。 根據照明裝置之一實施例’㈣之下側及空腔之相對内 側具有一預定間隔以提供PCB與熱釋放結構之間之足夠電 絕緣。 根據照明裝置之-實施例，照明襄置進一步包括配置在 空腔内侧以將PCB夾緊至熱釋放元件之一彈簧元件。 根據照明裝置之一實施例，照明装置進一步包括配置於 PCB之下側與空腔之相對内側之間之一電絕緣元件。此具 157117.doc • 6 - 201207313 有之優點在於可減小預定距離，因此提供一更薄照明裝 置。 根據照明裝置之一實施例’導電及導熱部分之至少一者 係配置在PCB之上表面上。 根據照明裝置之一實施例，接點係光源之一電接點或一 傳熱構件。 根據照明裝置之一實施例’光源包括至少一發光二極體 (LED)。 根據照明裝置之一實施例，至少一 LED係一表面安裝 LED(SMD-LED)。 根據照明裝置之一實施例，照明裝置進一步包括配置在 光源上之一蓋構件。 根據照明裝置之一實施例’蓋構件經配置以進一步提供 一光學功能。 根據照明裝置之一實施例’光學功能係配置為準直功 能、去準直（de-collimating)功能、漫射功能、散射功能及 碟光體轉換功能之一者。 根據本發明之一第二態樣，提供一種發光系統，其包括 根據本發明之複數個照明裝置。 根據發光系統之一實施例’照明裝置之至少兩者經配置 以具有一共同熱釋放構件及一共同PCB與一共同熱釋放結 構之一者。PCB未與熱釋放構件電連接使得光源彼此隔 開’此允許有極高之光源供應電壓及配置在相同發光系統 中之大量光源。因此，發光系統係有利用地用於高功率照 157117.doc 201207313 明應用。 根據本發明之一第三態樣，提供一種提供—照明裝置之 方法，其包括： ^ -提供具有一空腔及一孔隙之一熱釋放構件； -將一光源安裝在一PCB上； -將該PCB插入至該空腔中使得該光源係配置在該孔隙 中； -使該PCB抵靠該熱釋放構件而夾緊；及 -罐封該光源以進入由至少該PCB及該孔隙界定之空間。 藉此，實現一照明裝置之一簡單構造及組裴。 應注意’本發明係關於技術方案中所詳述之特徵之全部 可能組合。 【實施方式】 現將參考展示本發明之（若干）實施例之附圖而更詳細描 述本發明之此及其他態樣。 現將參考展示本發明之某些實施例之附圖而在下文令更 完全描述本發明之若干實施例。然而’本發明可體現為諸 多不同形式且不應被解譯為受限於本文中所闡述之該等實 施例；相反，以舉例方式提供此等實施例使得本揭示内容 透徹明瞭且將向熟習技術者完全傳達本發明之範圍。相同 元件符號意指全部相同元件。 參考根據本發明之一照明裝置之一實施例之一示意性說201207313 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention generally relates to a lighting device including a light source and a heat release member for dissipating heat generated by the light source. [Prior Art] In recent years, the use of LED-based lighting devices has increased and is expanding to various lighting applications. Since the demand for neon intensity lighting devices is large, it is necessary to pay attention to the elimination of heat generated in LED-based lighting devices to ensure good performance, efficiency and high life expectancy of one of the lighting devices. In addition, led lighting devices are increasingly used in demanding environments such as, for example, greenhouses where artificial light is used to stimulate plant growth. The humid and warm environment in the greenhouse (where the greenhouse workers work close to the LED lighting fixtures), in addition to requiring adequate cooling, also requires attention to other needs, such as providing adequately insulated LED lighting to protect electrical safety and access. . CN 201 196403 Y discloses a light source module having an LED component mounted on a printed circuit board (PCB), the PCB being disposed on a pedestal made of an aluminum alloy. A predetermined gap is formed between the bottom surface of the pCB and the base. An insulating and thermally conductive material, such as a silicone rubber and an insulating gel or paste, is filled between the bottom surface of the PCB and the base. What? (The surface of 8 is filled with a waterproof insulating rubber. ' SUMMARY OF THE INVENTION An object of the present invention is to provide an alternative and improved lighting device that provides one of the high security requirements in a demanding environment while providing an efficient cooling. It is an object to provide a method of providing such an improved illumination device. 157117.doc 201207313 In accordance with a first aspect of the present invention, these and other objects are achieved by a lighting device comprising: a printed circuit board ( a pcB) having an upper surface and a lower surface, the PCB further comprising at least one conductive and thermally conductive portion; a light source mounted on the upper side of the PCB for illumination, the light source being at least one of the light sources a junction and a thermal connection to the at least one conductive and thermally conductive portion; and a heat release member for dissipating heat generated by the x-ray source. The heat release member includes a cavity disposed inside the cavity The upper surface of the PCB is configured to be thermally coupled to an inner surface of one of the cavities. The light source is disposed in one of the apertures of the cavity. An interface formed by the upper surface of the PCB and the heat releasing member is transported along a heat transfer path extending from the light source to the heat releasing member via at least one contact and at least one heat conducting portion. A lighting device is disclosed in which a good cooling is provided to the light source while providing ingress protection and ease of assembly. Because the system is disposed within the cavity of the heat release member, and more specifically because the PCB is adjacent to the cavity The inner wall, so the lower surface of the PCB, which is usually electrically connected to the power source, is separated from the heat release member and therefore does not need to be separated from the power supply, which saves the cost of manufacturing steps and installation time. Another advantage is the number of components in this configuration Minimized and sub-components can be fabricated using only standard techniques, so no special processing and investment is required in the production of the lighting device. Further, it is advantageous to arrange the PCB in a heat release member (which is preferably a metal casing) The inside of the cavity allows the metal casing to completely enclose the pCB and the corresponding 157117.doc 201207313 sub-device to prevent harmful conditions in the event of a fire. PCB The live part does not fall off' because the metal case does not melt or decompose at the temperature of the temperature like, for example, a plastic case. According to one embodiment of the illumination device, the space between the light source and the heat release structure is filled with a can seal Material. This can only occur on the top side to provide contact safety. The electrical insulation between the light source (such as an LED that can be operated at high voltage) configured on the PCB is made of pCB insulation (glass reinforced epoxy). The resin is provided and supplied from the top side by the potting material. Furthermore, the space below the pCB can be filled, but this does not necessarily use electrical safety. Thereby, any component connected to the voltage present in the pores of the heat releasing member ( For example, one of the power contacts in one of the pegs or one of the upper surfaces of the PCB (which can be turned on) can be effectively sealed by a heat release member (which can be, for example, an aluminum structure). The potting material also protects the electrical components from moisture and dust. In addition, the potting material provides an efficient entry protection so that the lighting unit is completely waterproof and safer to prevent electric shock. In addition, because the potting material of the lighting device is limited to a small limited space, such as, for example, no encapsulating material is required on the back side of the PCB, the lighting device is easy to assemble and the total weight and cost of the final lighting device is reduced. According to one embodiment of the illumination device, the lower side of the (4) and the opposite inner sides of the cavity have a predetermined spacing to provide sufficient electrical isolation between the PCB and the heat release structure. According to an embodiment of the illumination device, the illumination device further comprises a spring element disposed inside the cavity to clamp the PCB to one of the heat release elements. According to an embodiment of the illumination device, the illumination device further comprises an electrically insulating element disposed between the underside of the PCB and the opposite inner side of the cavity. This 157117.doc • 6 - 201207313 has the advantage of reducing the predetermined distance and thus providing a thinner illumination device. According to one embodiment of the illumination device, at least one of the conductive and thermally conductive portions is disposed on the upper surface of the PCB. According to one embodiment of the illumination device, the contact is an electrical contact or a heat transfer member. According to one embodiment of the illumination device, the light source comprises at least one light emitting diode (LED). According to one embodiment of the illumination device, at least one of the LEDs is a surface mount LED (SMD-LED). According to an embodiment of the illumination device, the illumination device further comprises a cover member disposed on the light source. The cover member is configured to further provide an optical function in accordance with an embodiment of the illumination device. According to one embodiment of the illumination device, the optical function is configured as one of a collimation function, a de-collimating function, a diffusing function, a scattering function, and a disc conversion function. According to a second aspect of the present invention, there is provided an illumination system comprising a plurality of illumination devices in accordance with the present invention. At least two of the illumination devices according to one embodiment of the illumination system are configured to have a common heat release member and one of a common PCB and a common heat release structure. The PCB is not electrically connected to the heat release member such that the light sources are separated from one another' which allows for a very high source supply voltage and a large number of light sources disposed in the same illumination system. Therefore, the illuminating system is used for high power illumination 157117.doc 201207313 applications. According to a third aspect of the present invention, a method of providing a lighting device is provided, comprising: - providing a heat release member having a cavity and a void; - mounting a light source on a PCB; - Inserting a PCB into the cavity such that the light source is disposed in the aperture; - clamping the PCB against the heat release member; and - sealing the light source to enter a space defined by at least the PCB and the aperture. Thereby, a simple construction and assembly of a lighting device is achieved. It should be noted that the present invention is all possible combinations of the features detailed in the technical solutions. [Embodiment] This and other aspects of the present invention will now be described in more detail with reference to the accompanying drawings. Several embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. However, the present invention may be embodied in a variety of different forms and should not be construed as being limited to the embodiments described herein; rather, the embodiments are provided by way of example, and the disclosure The skilled artisan fully communicates the scope of the invention. The same component symbols mean all the same components. Referring to one of the embodiments of the lighting device according to the invention, schematically
明圖之圖丨，照明裝置100包括安裝在一印刷電路板 (PCB)106之一上側107上之一發光二極體（LED)1〇1。pCB 157117.doc 201207313In the drawings, the illumination device 100 includes a light emitting diode (LED) 1〇1 mounted on an upper side 107 of a printed circuit board (PCB) 106. pCB 157117.doc 201207313
106係具有在其多層結構内之至少一導電及導熱部分1〇4之 一 4層；FR4 ’該導電及導熱部分係一金屬聚合物或一導電聚 合物。此處，導熱部分104被設置為PCB 106之銅層。pcB 可由此項技術中常用之任何材料製成，但通常係由玻壤環 氧樹脂製成。 LED 101經配置以具有各熱連接至pCB ι〇6之導電及導 熱部分104之至少一者之電接點丨1〇、}丨丨。替代地，光源 可包括複數個LED。此外，LED可為圖7中所繪示之一或多 個表面安裝LED(SMD-LED)，其中一照明裝置7〇〇經配置 以具有安裝在一 PCB 106上之一 SMD-LED 701使得光源之 電接點710、711係與PCB熱及電接觸。 為使光源與PCB熱連接，在照明裝置之替代實施例中， 傳熱構件係配置在光源上。例如，當光源係一 smd_led 時，用於在焊接電接點之前安裝組件之一導熱黏著劑將構 成一傳熱構件以將SMD-LED中所產生之熱傳送至PCB， PCB接著可經配置以具有配置於傳熱構件處之一導熱部分 (圖中未展示）。 照明裝置100進一步包括用於消散由光源1〇1產生之熱之 一熱釋放構件105。發熱構件係由具有可接受熱性質之任 何適合材料（例如鋁、銅、鎂或一陶瓷材料）製成。利用前 述内容’為簡單起見’本文例示性實施例中之熱釋放構件 全被稱為金屬外殼1 〇5。此處，金屬外殼1 〇5係一折疊鋁 片。然而’在替代實施例中，金屬外殼可為一擠壓型材。 金屬外殼105基本上被配置為一中空金屬盒，其包括一 I57117.doc -9- 201207313 空腔115及配置在界定金屬外殼i〇5之空腔ii5之一上壁中 之一孔隙118。金屬外殼1〇5進一步包括配置在其上外表面 上以包圍孔隙118之一垂直延伸壁128。此外，在照明裝置 100之組裝期間’ PCB 1 06被引入至空腔115中且經配置以 鄰接在上内表面116上，使得PCB之上表面1〇7經配置以與 金屬外殼105之内表面116熱連接。空腔115經配置使得一 預定距離係分別設置於金屬外殼1 〇5之下内側i丨7與pCB 106之下側108之間及至電接點11〇、m ’以提供pcB 1〇6 之背面108上之帶電部件與金屬外殼i 〇5之間之足夠電絕 緣。 PCB 106經定位使得光源丨〇丨係配置在孔隙n 8中且突出 進入由包圍壁128界定之空間》此外，pcB 1〇6係由一彈簧 元件127夾緊，該彈簧元件係插入於PCB 106之背面1〇8與 空腔11 5之下内表面丄丨7之間以維持pCB i 〇6之位置。此 處’彈簧元件127係一彈性塑膠型材。 光源ιοί與金屬外殼105之間之空間（即由pCB ι〇6之上 表面界定之空間）填充有罐封材料1〇9(此處為一雙組分聚胺 基f酸酯）’該空間係暴露穿過孔隙118、金屬外殼孔隙 118及金屬外殼包圍壁128〇罐封材料可選自（例如）各種環 氧樹月曰’ 可經设計以符合與導熱十生、防水性帛等相關之 特定要求。此外’若需要具有高抗熱性或抗UV性之一罐 封材料’則；6夕可用作為罐封材料。在—些應用巾，可能需 要避免罐封材料之變色且（例如）—亮白表面需要光反射， 時氧化欽顏料可用在罐封材料中。如熟習技術者所認 157117.doc 201207313 知，存在熱固型罐封材料、uv固化罐封材料或其他 之罐封材料。 士 —凡全破固化，罐封材料藉由使PCB 106抵靠金屬外 殼1〇5固疋而接管彈簧元件127之機械功能。隨後，彈簧元 ^ 127可視情況自照明裝置1〇〇移除或被保持在適當位置以 提供-額外電隔離，從而可使外殼更扁平。 為提供一完全密封照明裝置，金屬外殼具有一封閉元件 (圖中未展示）（如一蓋子）以封閉空腔。 由光源101產生之熱係經由PCB之上表面1 與熱釋放構 件所形成之界面116而沿一傳熱路徑傳送，該傳熱路徑自 光源101經由電接點110、1U及導電導熱部分1〇4而延伸至 熱釋放構件。 在參考圖2而描述之根據本發明之一照明裝置2〇〇之一實 施例中，以如上參考圖丨之照明裝置1〇〇而描述之一類似方 式…明裝置200具有安裝在一 pCB 1〇6上之一光源， 該PCB係配置在一金屬外殼1〇5中且具有絕緣罐封材料 109。然而，在後者（照明裝置2〇〇)中彈簧元件127係由一 、邑緣2膠發/包件250替換。塑膠發泡件250係用以將peg 106之上表面1〇7夾緊至熱釋放結構（即，金屬外殼105)之内 表面216上。在提供罐封材料1〇9以電密封光源1〇1及 106之步驟期間，塑膠發泡件或任何其他適合材料經選擇 以除夾緊PCB以外，亦提供PCB 106之背面1〇8與金屬外殼 105之内表面117之間之電絕緣及隔離。因此，可使金屬外 殼105内側之空腔比未提供塑膠發泡件25〇時更扁平。 157117.doc 201207313 在一替代實施例中，塑膠發泡體係設置在空腔中以作為 填滿PCB下方空腔之一反應物，該反應物隨後形成完全填 滿空腔且在PCB下方硬化之一發泡體，從而抵靠金屬外殼 中之空腔之内上表面而擠壓PCB。 此外，在照明裝置200中，PCB 1 06之導電及導熱部件 104之至少一者（即，此處之一銅層）係設置在上表面I”處 之PCB 106之頂側上。為了安全，具導電及導熱性之頂部 銅層104與照明裝置中之帶電部件必須間隔一校正安全距 離。 在參考圖3而描述之根據本發明之一照明裝置3 〇〇之一實 施例中，以如上參考圖1之照明裝置1 〇〇而描述之一類似方 式’照明裝置300具有安裝在一 PCB 106上之一光源ιοί， 該PCB係配置在一金屬外殼105中且具有絕緣罐封材料 109。然而，在後者（照明裝置300)中，彈簧元件127係由金 屬所製成之一葉片彈簧350替換。葉片彈簧35〇將Pcb 1〇6 擠壓至金屬外殼105。由於葉片彈簧350具導電性，所以 PCB 106之背面108上之葉片彈簣350之接觸表面必須經選 擇以便與PCB 106之背面108之帶電部件維持校正之漏電及 間隙距離。 圖4繪示根據本發明之一照明裝置4〇〇之一實施例，其進 一步包括配置在光源101上之一蓋構件450«可在用罐封材 料109罐封光源之步驟期間或在用罐封材料1 〇9罐封光源之 步驟後設置蓋構件450。藉此，蓋構件係在隨後硬化程序 期間附接至罐封材料109中。替代地，金屬外殼丨〇5及尤其 12· 157117.docThe 106 series has 4 layers of at least one of the conductive and thermally conductive portions 1〇4 in its multilayer structure; the conductive and thermally conductive portion of the FR4' is a metal polymer or a conductive polymer. Here, the thermally conductive portion 104 is provided as a copper layer of the PCB 106. The pcB can be made of any material commonly used in the art, but is usually made of glassy epoxy resin. The LED 101 is configured to have electrical contacts 丨1, 丨丨, each of which is thermally coupled to at least one of the conductive and thermally conductive portions 104 of the pCB 〇6. Alternatively, the light source can include a plurality of LEDs. In addition, the LED can be one or more surface mount LEDs (SMD-LEDs) as depicted in FIG. 7, wherein one illumination device 7 is configured to have one of the SMD-LEDs 701 mounted on a PCB 106 such that the light source The electrical contacts 710, 711 are in thermal and electrical contact with the PCB. In order to thermally connect the light source to the PCB, in an alternative embodiment of the illumination device, the heat transfer member is disposed on the light source. For example, when the light source is a smd_led, one of the thermally conductive adhesives used to mount the component prior to soldering the electrical contacts will form a heat transfer member to transfer the heat generated in the SMD-LED to the PCB, which may then be configured to There is a heat conducting portion (not shown) disposed at the heat transfer member. The illumination device 100 further includes a heat release member 105 for dissipating heat generated by the light source 1〇1. The heat generating component is made of any suitable material (e.g., aluminum, copper, magnesium, or a ceramic material) having acceptable thermal properties. Using the foregoing contents 'for the sake of simplicity', the heat release member in the exemplary embodiment herein is referred to as a metal case 1 〇5. Here, the metal casing 1 〇 5 is a folded aluminum sheet. However, in an alternative embodiment, the metal outer casing can be an extruded profile. The metal casing 105 is basically configured as a hollow metal casing comprising an I57117.doc -9-201207313 cavity 115 and an aperture 118 disposed in a wall of one of the cavities ii5 defining the metal casing i〇5. The metal casing 1〇5 further includes a vertically extending wall 128 disposed on an upper outer surface thereof to surround one of the apertures 118. Moreover, during assembly of the illumination device 100, the PCB 106 is introduced into the cavity 115 and configured to abut on the upper inner surface 116 such that the PCB top surface 1〇7 is configured to interface with the inner surface of the metal housing 105. 116 hot connection. The cavity 115 is configured such that a predetermined distance is disposed between the inner side of the metal casing 1 〇5 and the lower side 108 of the pCB 106 and to the electrical contacts 11〇, m' to provide the back of the pcB 1〇6. Sufficiently electrically insulated between the live parts on the 108 and the metal casing i 〇5. The PCB 106 is positioned such that the light source is configured in the aperture n 8 and protrudes into the space defined by the surrounding wall 128. In addition, the pcB 1〇6 is clamped by a spring element 127 that is inserted into the PCB 106. The back side 1 〇 8 is spaced from the inner surface 丄丨 7 below the cavity 11 5 to maintain the position of pCB i 〇6. Here, the spring element 127 is an elastic plastic profile. The space between the light source ιοί and the metal casing 105 (i.e., the space defined by the surface above the pCB 〇6) is filled with the potting material 1〇9 (here, a two-component polyamine-based acid ester). The exposed material is exposed through the aperture 118, the metal outer casing aperture 118, and the metal outer casing surrounding wall 128. The can sealing material can be selected, for example, from various epoxy tree rafts, which can be designed to conform to heat conduction, water repellency, and the like. Specific requirements. Further, if one of the potting materials having high heat resistance or UV resistance is required, it can be used as a potting material. In some applications, it may be necessary to avoid discoloration of the potting material and, for example, the bright white surface requires light reflection, and the oxidized pigment can be used in the potting material. As known to those skilled in the art, 157117.doc 201207313, there are known thermosetting can sealing materials, uv curing can sealing materials or other can sealing materials. In the case of full cure, the potting material takes over the mechanical function of the spring element 127 by abutting the PCB 106 against the metal casing 1〇5. Subsequently, the spring element ^ 127 can optionally be removed from the illumination device 1 或 or held in place to provide - additional electrical isolation to make the outer casing flatter. To provide a fully sealed illuminator, the metal housing has a closure member (not shown) such as a cover to close the cavity. The heat generated by the light source 101 is transmitted along a heat transfer path through the interface 116 formed by the upper surface 1 of the PCB and the heat release member, the heat transfer path from the light source 101 via the electrical contacts 110, 1U and the conductive heat conducting portion 1 4 extends to the heat release member. In an embodiment of the illumination device 2 according to the invention described with reference to Figure 2, a similar manner is described in the illumination device 1A as described above with reference to Figure 2... The device 200 has a mounting on a pCB 1 A light source on the crucible 6 is disposed in a metal casing 1〇5 and has an insulating potting material 109. However, in the latter (lighting device 2A), the spring element 127 is replaced by a rim 2 glue/package 250. The plastic foam member 250 is used to clamp the surface 1〇7 of the peg 106 to the inner surface 216 of the heat release structure (i.e., the metal casing 105). During the step of providing the potting material 1〇9 to electrically seal the light sources 〇1 and 106, the plastic foam member or any other suitable material is selected to provide the back side of the PCB 106 and the metal in addition to the clamping PCB. Electrical insulation and isolation between the inner surfaces 117 of the outer casing 105. Therefore, the cavity inside the metal casing 105 can be made flatter than when the plastic foam member 25 is not provided. 157117.doc 201207313 In an alternate embodiment, a plastic foaming system is disposed in the cavity to act as a reactant for filling a cavity below the PCB, the reactant then forming one that completely fills the cavity and hardens under the PCB. The foam is pressed against the upper surface of the cavity in the metal casing to press the PCB. Moreover, in the illumination device 200, at least one of the conductive and thermally conductive members 104 of the PCB 106 (i.e., one of the copper layers herein) is disposed on the top side of the PCB 106 at the upper surface I". For safety, The conductive and thermally conductive top copper layer 104 and the live parts in the illumination device must be spaced apart by a correct safety distance. In one embodiment of the illumination device 3 according to the invention described with reference to Figure 3, reference is made to The lighting device 1 of Fig. 1 describes a similar manner. The lighting device 300 has a light source ιοί mounted on a PCB 106, which is disposed in a metal casing 105 and has an insulating potting material 109. However, In the latter (lighting device 300), the spring element 127 is replaced by a leaf spring 350 made of metal. The leaf spring 35〇 presses Pcb 1〇6 to the metal casing 105. Since the leaf spring 350 is electrically conductive, The contact surface of the blade magazine 350 on the back side 108 of the PCB 106 must be selected to maintain a corrected leakage and gap distance with the live parts of the back side 108 of the PCB 106. Figure 4 illustrates a lighting fixture in accordance with the present invention. An embodiment of the invention further comprising a cover member 450 disposed on the light source 101 after the step of sealing the light source with the potting material 109 or after the step of sealing the light source with the potting material 1 〇9 A cover member 450 is provided. Thereby, the cover member is attached to the potting material 109 during a subsequent hardening process. Alternatively, the metal casing 丨〇5 and especially 12·157117.doc
S 201207313 是包圍光源101之壁128可經配置以收納蓋構件450。此 處，蓋構件450係一透明塑膠件，然而，玻璃亦適合。蓋 構件450可配置在照明裝置4〇〇上以提供使光源ιοί防塵、 防用在溫室中之殺蟲劑及滅草劑、防UV輻射之額外保護 或提供促進照明裝置之清潔之一表面。 此外，蓋構件450可經配置以提供一光學功能，諸如準 直功能、去準直功能、漫射功能、散射功能及磷光體轉換 功能。當提供包括光學功能之一蓋構件時，較佳地在安裝 期間進行量測以使光學蓋相對於光源而對準。此外，蓋構 件450可具有一色彩濾光器或任何適合功能層。 在照明裝置之一實施例中，光源係一藍色LED，且一遠 端磷光層（YAG磷光體）係設置在蓋構件之一内側上。 如圖5中所繪示，本發明適用於包括側向隔開之複數個 光源之照明裝置。此處’光源1〇1係配置在一共同PCB ι〇6 上’且被插入至一共同熱釋放結構1 〇5中，且隨後經罐封 材料109罐封以具電絕緣性及防潮性。 在一發光系統之一實施例中，如圖6中所繪示，具有複 數個LED 1〇1之pcb係安裝在具有一内空腔（圖中不可見）及 用於暴露光源101之一孔隙118之一金屬擠壓型材1〇5中。 如前所述’罐封材料109提供光源之機械支撐及密封。一 端部分601係配置在擠壓型材ι〇5之一端部處以密封空腔。 藉此’金屬外殼完全圍住PCB，且在發生火災時避免電子 益件受損。PCB之帶電部件不會脫落，因為金屬外殼在高 溫下炫化或分解。端部分601可經進一步配置以給照明系 157117.doc -13- 201207313 統提供供應電壓。 在根據本發明之發光系統8 0 0之一實施例中，如圖8中所 繪示’若干照明裝置700、700’及700"係配置在一共同熱釋 放結構105中。熱釋放結構1 〇5為僅由一個擠壓部件組成之 一輕型鋁外殼（散熱器），在該外殼中配置具有光源（單一光 源或如圖6中所繪示之一排光源）之三個隔開pCB。此提供 本發明之一非常重要特徵，即，由一金屬外殼完全密閉電 部件。如圖8中所繪示，PCB可以不同角度安裝，此有利 地提供沿一個以上方向之光。 熟習技術者認識到，本發明絕非受限於上述較佳實施 例》相反，可在隨㈣請專職圍之㈣㈣行諸多修改 及變動。 【圖式簡單說明】 圖1係根據本發明 示性橫截面側視圖； 圖2係根據本發明 示性橫截面側視圖； -圖3係根據本發日 月<_照明裝置之_實施例之—示 示性橫截面側視圖； 一圖4係根據本發明之_照明裝置之一實施例之— 示性橫截面側視圖； 圖5係根據本發明之. . 乃之一發先系統之一示意繪 側視圖； 之一照明裝置之一實施例之 示意繪 之一照明裝置之一實施例之 示意緣 示意繪 示性橫截面 圖6係根據本發明 之一發光系統之一示意側視圖； 157117.doc 201207313 圖7係根據本發明之一照明裝置之一實施例之一禾意繪 示性橫截面側視圖；及 圖8係根據本發明之一發光系統之一示意側視圖 【主要元件符號說明】 100 照明裝置 101 光源/發光二極體（LED) 104 導電及導熱部分/頂部銅層 105 熱釋放構件/金屬外殼/金屬擠壓型材 106 印刷電路板（PCB) 107 上表面/上侧 108 下表面/下側 109 罐封材料 110 電接點 111 電接點 115 空腔 116 内表面/界面 117 内表面 118 孔隙 127 彈簧元件 128 垂直延伸壁/包圍壁 200 照明裝置 216 内表面 250 塑膠發泡件 300 照明裝置 157117.doc -15- 201207313 350 葉片彈簧 400 照明裝置 450 蓋構件 601 端部分 700 照明裝置 700， 照明裝置 700" 照明裝置 701 表面安裝發光二極體（SMD-LED) 710 電接點 711 電接點 800 發光系統 157117.doc •16- sS 201207313 is a wall 128 surrounding the light source 101 that can be configured to receive the cover member 450. Here, the cover member 450 is a transparent plastic member, however, glass is also suitable. The cover member 450 can be disposed on the illuminating device 4 to provide an additional protection against dusting of the light source, protection against insecticides and herbicides in the greenhouse, protection against UV radiation, or providing cleaning of the illumination device. Additionally, cover member 450 can be configured to provide an optical function such as a collimation function, a de-collimation function, a diffusing function, a scattering function, and a phosphor conversion function. When a cover member comprising an optical function is provided, it is preferably measured during installation to align the optical cover with respect to the light source. Additionally, cover member 450 can have a color filter or any suitable functional layer. In one embodiment of the illumination device, the light source is a blue LED and a distal phosphor layer (YAG phosphor) is disposed on one of the inner sides of the cover member. As illustrated in Figure 5, the present invention is applicable to illumination devices comprising a plurality of light sources spaced laterally apart. Here, the light source 1〇1 is disposed on a common PCB ’6 and is inserted into a common heat release structure 1 〇5, and then sealed by the potting material 109 to be electrically insulating and moisture-proof. In an embodiment of an illumination system, as illustrated in FIG. 6, a pcb having a plurality of LEDs 1〇1 is mounted to have an inner cavity (not visible in the figure) and to expose one of the apertures of the light source 101. 118 one of the metal extruded profiles 1〇5. The cannula material 109 provides mechanical support and sealing of the light source as previously described. An end portion 601 is disposed at one end of the extruded profile ι 5 to seal the cavity. The metal casing completely encloses the PCB and protects the electronic components from damage in the event of a fire. The live parts of the PCB do not fall off because the metal case stuns or decomposes at high temperatures. The end portion 601 can be further configured to provide a supply voltage to the lighting system 157117.doc -13 - 201207313. In one embodiment of the illumination system 800 in accordance with the present invention, a plurality of illumination devices 700, 700' and 700" are disposed in a common thermal release structure 105 as illustrated in FIG. The heat release structure 1 〇5 is a lightweight aluminum casing (heat sink) composed of only one pressing member, in which three light sources (single light source or one row of light sources as shown in FIG. 6) are disposed in the casing Separate pCB. This provides a very important feature of the present invention in that the electrical components are completely sealed by a metal casing. As illustrated in Figure 8, the PCB can be mounted at different angles, which advantageously provides light in more than one direction. It will be appreciated by those skilled in the art that the present invention is in no way limited to the preferred embodiments described above. Instead, various modifications and variations can be made in conjunction with (4) (4). BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional side view showing an outline according to the present invention; FIG. 2 is an explanatory cross-sectional side view according to the present invention; FIG. 3 is an embodiment according to the present invention. - Figure 4 is an illustrative cross-sectional side view of one embodiment of a lighting device in accordance with the present invention; Figure 5 is one of the prior systems in accordance with the present invention. BRIEF DESCRIPTION OF THE DRAWINGS One of the illumination devices, one of the illumination devices, one of the illumination devices, a schematic representation, a schematic cross-sectional view, and a schematic side view of one of the illumination systems according to the present invention; .doc 201207313 Figure 7 is a schematic cross-sectional side view of one embodiment of an illumination device in accordance with the present invention; and Figure 8 is a schematic side view of one of the illumination systems in accordance with the present invention. 】 100 illuminating device 101 light source / light emitting diode (LED) 104 conductive and heat conducting part / top copper layer 105 heat release member / metal shell / metal extruded profile 106 printed circuit board (PCB) 107 upper surface / upper side 108 under table Face/Bottom 109 Can Sealing Material 110 Electrical Contact 111 Electrical Contact 115 Cavity 116 Inner Surface/Interface 117 Inner Surface 118 Pore 127 Spring Element 128 Vertical Extension/Envelope 200 Illumination Device 216 Inner Surface 250 Plastic Foam 300 Lighting device 157117.doc -15- 201207313 350 Leaf spring 400 Lighting device 450 Cover member 601 End portion 700 Lighting device 700, Lighting device 700" Lighting device 701 Surface mounted light-emitting diode (SMD-LED) 710 Electrical contact 711 Electric contact 800 lighting system 157117.doc •16- s