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TW201205434A - Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices - Google Patents

Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices Download PDF

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Publication number
TW201205434A
TW201205434A TW100116777A TW100116777A TW201205434A TW 201205434 A TW201205434 A TW 201205434A TW 100116777 A TW100116777 A TW 100116777A TW 100116777 A TW100116777 A TW 100116777A TW 201205434 A TW201205434 A TW 201205434A
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TW
Taiwan
Prior art keywords
electronic device
housing
electronic
dielectric
electrode
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TW100116777A
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Chinese (zh)
Inventor
Nels Jewell-Larsen
Kenneth A Honer
Ron Goldman
Matthew Keith Schwiebert
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Tessera Inc
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Priority claimed from US13/105,343 external-priority patent/US8824142B2/en
Application filed by Tessera Inc filed Critical Tessera Inc
Publication of TW201205434A publication Critical patent/TW201205434A/en

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Abstract

Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device (e.g., 100, 700, 1000). In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions (e.g., 392, 393, 792, 793, 794, 1192, 1193 and/or 1194) of an EHD fluid mover (e.g., 110, 310, 710, 910, 1010A, 1010B) are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.

Description

201205434 六、發明說明: 【發明所屬之技術領域】 本案係關於熱管理’尤指關於微尺度冷卻裝置,其產生離 子及電場以驅動流體(例如空氣)之流,作為用以散熱之一熱 管理解決方案之一部分。 【先前技術】 用以利用越之離子機之裝置在讀巾廣魏指離子 風機、電風機、電暈風泵、電-流體-動力學(EFD)裝置、電流 力學(EHD)驅動器、腦氣體泵及咖流體或氣體驅動器: 此技術之某些方面已廣泛利用於稱為靜電氣體清潔器或靜電 除塵器之裝置中。當用作-熱管理方案之—部分時,離子流 流體驅動器可使冷卻效率改善並使震動、功率消耗、電子裝 置溫度及/或噪音產生降低。這些屬性可降健體壽命成本: 裝置尺寸或體積、及在某些情財可改善系統效能或使用者 經驗。 當電子裝置設計者處理越來越小之形狀因子(f〇rm_fa_) 時,例如在由蘋果公司(Α_,-)推出之UM及 细TM㈣及之極薄料料置娜及子祕之封裝密度 產生顯著的鮮理之挑戰。某雜财,可麟㈣以將埶 排出^園環境。某些情況中,可能不需要跨越一排氣邊緣 之大里傳輸,但可能需要或期望裝置内的熱傳輸以減少敎點。 離子流流體驅動器提供熱管理解決方案之-具吸力的 技術部分。期望此等解决方案能允許離子流流體驅動器整合 201205434 =且/«密練之電子妓,通常在—_尺 如2至3公厘之間隙之體積中。尤其,期 驗供 允許具有電子組件之產生高電壓、離子流之H力、:案此 :緊密封裝,該等組件在其他情況下可能對靜;放電Γ電: 干々相當彳罐感。料纽下,雜料解 和特定高強度場及/或放電之臭氧難品。h理成緩 【發明内容】 已發現電流力學驅動財電磁雜、維持靜電電荷及 f貫收集離子電流之表面有機會形成為-電子裝置中之其他 部件及^結構之表面或形成於其± π此方式,可降低尺寸 並心加密度。某些航下’電流力學驅魅之靜電操作部分 一成,4體、電磁干涉顏、電路板及/或熱管或散播器之 其=表面或形成於—殼體、電针涉遮蔽、電路板及/或熱 了或散=器之-内部表面上。依這些靜電操作部分之角色, 可應用&quot;Ί、阻抗性及/或臭氧強健性或催化劑塗層或調節。 一本七明之某些實施例中,—種電子裝置包括-殼體;至少 風/件其包括配置於其上之一或多個熱源;及一電流 ’其經組態以作為用於該電子裝置之—熱管理系 、先之a ’其巾職電流力學驅動ϋ之至少-靜電操作部分 $成為該设體之—内部表面或形成於該殼體之一内部表面 上。在某些示例下,該電子裝置具有少於約10公厘之一厚 又且具有一或多個橫向維度之範圍,該維度以至少10 : 1 之一比率超過該厚度。 201205434 某些實施财,該t流力學轉 及至少-收集器電極,其中該至少 發射器電極 集器電極。某些實施例中,該至少作部分包括該收 於該發射iff極之該殼體之該 蛛作部分包括鄰近 形部分。草此干彳5丨由姑人°卩表面之—介電質塗佈場塑 質塗佈場塑形部分 器電極至收集器電極 向該發射n電極之上游延伸約三個發射 之長度。 x 上方某些不例中,該内部表面之該介電 驅 某二=财’餅蠢線裝置進—步包括該電流力學呢 操作部分,其職至少—部分之該電子組 件。某些利种,難倾件之轉蓋找部 以提供能量給該電流力學驅_之_高電壓電源供應器。某 些示例中1該電子組件包括-電路板及-顯示裝置之-或多 者。某些不财’該祕包括:_處職;—射頻⑽)或光 學收發H ’·及麟-顯示|置之轩照明來源。 某些實施例中,該Μ係實質密封的,以使得由該電流力 學驅動H輔之流驗被實f包含於該殼軸。某些實施例 中,該殼體允許至少一些流體流通過其内之一内部體積及該 外部之間的一邊緣。某些示例中,通過該電流力學驅動器之 流體之流量以至少為二之一比率而超過通過該邊緣者。某些 示例中,該殼體包括該邊緣之一或多個排氣部分,由電流力 學驅動器驅動之該流體流之該一實質整體透過該排氣部分而 被允許進入且排出。 201205434 私某些實施射,該熱縣峋3公助之距雜切接近該 戍體之-畴表面’該齡理㈣可操作以將在熱源處散發 出之熱散播於該内部表面之—實質部分。 某些實施例中,該電子裝置經組態為以下之一或多者:一 手持仃動電錢個人數位助理;-膝上型電腦、筆記型電腦 或平板型電腦,·及-數位、雜概器或遊戲裝置。 某些實施财,該電子裝置她態為以下之—❹者:一顯 示面板;及一電視。 本發明之某些實補中,—種電子裝置包含:至少一電子 組件,其包括一或多個配置於其上之熱源;導電材料之-電 磁干涉(EMI)遮蔽;及一電流力學驅動器,其經 ::二熱管理系統之部分;其中將該電流力無^ 學驅動器之至少-靜電操作部分形成為該殼體之-内 箱面或形成於該電磁干涉遮蔽之—表面上。 j些實施财,電斜涉鑛至少部分該電子組件 之„(5刀。某些不例中’經覆蓋之該電子組件之該部分包括 絚耦合績絲粒力學轉紅 器之至少一部分。箪 %I电你仏應 半而ϋ㈣版〜補巾,輯子組件之—❹個導電 平面或引線提供該電磁干涉遮蔽。 某些實施财,電我置财少於約ω 之一 且具有一或多個橫向維度之範圍,該維度以至少ι〇厚度 比率超過該厚度。 及電=:器=-發_極 中3至V —静電輛作部分包括該收 7 201205434 中’该至少-靜電操作部分包括鄰近 磁干涉遮蔽之該表面之—介電質塗佈 集II電極。某些實施例中, 於該發射器電極之該電磁吁 ,塑f部分。某些示射,該曝露之表面之該介電質塗佈場 77向雜射器電極之上游延伸約三個發㈣電極至收 集器電極之長度。某些示例巾,該介電質塗佈防止含臭氧之 流體之衰解(degradation)。 、 某些實施例中,該電子組件包括一電路板及一顯示裝置之 或夕者。某些實施例中,該熱源包括下列之一或多者:一 處理器;一射頻(RF)或光學收發器;及用於一顯示裝置之若 干照明來源。 某些實施例中’該電子裝置進一步包含;一實質密封的殼 體’使得由該電流力學驅動器驅動之流體流被實質包含於該 殼體内。某些實施例中,該電子裝置進一步包括一殼體,其 允許至少一些流體流通過其内之一内部體積及該外部之間的 一邊緣。某些示例中,通過該電流力學驅動器之流體之流量 以至少為二之一比率而超過通過該邊緣者。某些示例中,該 殼體包括該邊緣之一或多個排氣部分,由電流力學驅動器驅 動之該流體流之該一實質整體透過該排氣部分而被允許進入 且排出。 某些實施例中,該電子裝置進一步包括一殼體,其中該熱 源係以約3公厘内之距離密切接近該殼體之一内部表面’該 熱管理系統可操作以將在熱源處散發出之熱散播於該内部表 面之一實質部分。 某些實施例中,該電子裝置進一步包括一殼體,該電流力 201205434 =區動器之至少—其他靜電操作部分係形成為該殼體之一内 邛表面或形成於該殼體之一内部表面上。 某^實施财’魏子裝置進—步包括—殼體,其中該電 驅動器之至少-其他靜電操作部分係形成為該殼體之 内°卩表面或形成於該殼體之一内部表面上。 =些實施例中’該電磁干涉遮蔽亦定義在—流祕徑中從 至熱轉移表面之—熱料路徑的至少—部分,當該電 受供能時,流體流沿該流動路徑而被該電流力 本發明之某些實施例中,—種電子裝置包含··—顯示器、 至少-電路板、-電流力學驅動器及—殼體,石: 將該電子褒置之一總厚度定義為少於約10公厘I該電二 =:態為用於該電子裝置之-熱管理d 編’ i卜㈣輸ϋ多個收集 電崎放於轉勒之㈣介電表面之間 =藉此_電子裝置内之流體流,其二集 干涉遮蔽之-表蝴蝴 之一表面上。 &lt; 電磁干涉遮蔽 某些實施财,該魏絲電極讀量至 集器電極之-第—者形成為該電路板之一曝露 形成於該^屬^或 該等收集H輸之_第二 中’ 喊马締體之1部表面或形 201205434 成於該殼狀-㈣表社。某些實_巾,該電磁干涉遮 蔽之至少,分形成於該t路板之—介電質塗佈金屬化層。 某二實础巾,該電子裝置進—步包含:—熱轉移路徑, 其在-流動路徑中由配置於該電路板上之—或多個熱源至熱 轉移表面,該電流力學·當受供能時沿著該流動路徑驅 動流體流。某些示例巾,該電軒涉雜提健轉移路徑 之至少一部分。 某些貫知例中,該熱源係以約3公厘内之距離密切接近該 殼體之-内部表面,該熱管理系統可操作以將在熱源處散發 出之熱散播於έ亥内部表面之一實質部分。 某些實施例中,該殼體實質密封該電子裝置,使得由該電 流力學驅動器驅動之流體流被實質包含於該殼體内。某些實 施例中,該殼體允許至少一些流體流通過其内之一内部體積 及該外部之間的一邊緣。某些實施例中,通過該電流力學驅 動器之流體之流量以至少為二之一比率而超過通過該邊緣 者。某些實施例中,該殼體包括該邊緣之一或多個排氣部分, 由電流力學驅動器驅動之該流體流之該一實質整體透過該排 氣部分而被允許進入且排出。 某些實施例中’該電子裝置經組態為以下之一或多者:— 手持行動電話或個人數位助理;一膝上型電腦、筆記型電腦 或平板型電腦;及一數位閱讀器、媒體播放器或遊戲裝置。 某些實施例中,該電子裝置經組態為以下之一或多者:一顯 示面板;及一電視。 某些貫施例中’ §亥设體之该電路板及一内部表面兩者之— 10 201205434 或兩者的至少-部分崎臭氧具強健性之—保護塗層塗佈。 某些實施财’對缝料舰之該賴塗層塗佈包括四氣 乙烯之-m聚合物’例如—峨隆® (TeflGn@)材料。某些實施 例中,驗狀該魏缺—_表面兩者之—或兩相至 少-部分相-臭氧催化劑歧應性材料塗佈。 本發明之錢實施财,—電子裝置包括-電子組件,今 • t子組件具有配置於其上之—❹個_ ;及—熱管理系 * 、统’其包括一電流力學驅動器及由該電流力學驅動器之操作 所驅動之流體之-流祕徑巾從雜源至熱轉移表面之一妖 轉移路徑,該熱轉移路徑包括以臭氧阻抗介電質塗佈之表面;; 某些實施例中’熱轉移路徑包括一熱管及一熱傳播器兩者 之-或兩者。某些實施例中,熱轉移路徑之至少—部分係以 一臭氧催化或反應性材料塗佈。此等或其他實施例將可在參 照此處之實施方式、圖式及騎之巾請專娜圍下更清 了解。 【實施方式】 應知者為,於此所述的許多種設計及技術對於密集封裝 的裝置及小型的現代消費性電子裝置的熱力管理問題特別適 用。事實上’於績叙某些EHD氣雜置設計及技術能有 助於電子裝置的主動熱力管理,因為電子裝置之薄型化或是 工業設計限制了機械性氣流裝置(例如風扇、吹送器等)的声 命。在某些實施例中,此種EHD氣流裝置可完全整合於操= 系統中,例如平板型或是攜帶型電腦、投影機或是視頻顯示 201205434 ^置、機上盒等。在其他實施例中,此種職)氣流襄置可為 、於提供具有EHD轉氣流之子組件或是殼體的形式。 致上而言’可構,以提供場娜或是魏性地構成 木盗電極的靜鶴絲面之各種尺寸、幾何職及宜他設 計魏,並可構思給定的㈣裝置的各種靜電操作表面及發 ^電極及/或轉H電極之間驗置相互_。為了說明, 者重於特定_示性實施舰蚊的表科财與其他元件 之間的位置相互難。例如’在大部分的說财,對向的平 ,集器電極是形成於殼體的内部表面或是電磁干涉(Ε皿) ,蔽或是_電路板(PCB)縣絲面之上,並設置為靠近電 暈放電類型的發射器電線(其與彳_收絲電極的前端為錯 位)的平行表面。儘管如此,於此所述之其他實施例可以採用 其他靜電操作表面構減是其_子生成技術,且仍可了解 之。 在此申請案中,所述之實施例的某些態樣被稱為電流體 動力學流體加速裝置,亦被稱為「EHD」裝置、「ΕΗ〇流體 加速器」、「EHD氣流裝置」等。為了要說明,某些實施例以 特定的EHD裝置構·明,其巾位於或是#近發㈣電極的 電暈放電器用以產生在出現電場時會被加速的離子,藉此而 驅動流體流動。應了解者為,即使此份綱書歧置電晕類 型的裝置,但亦可應用其他離子產生技術。舉例而言,在某 些實施例中,例如無聲放電、AC放電、介電障壁放電(dbd) 等可用以產生出現電場時會被加速的離子,藉此而驅動流體 流動。 12 201205434 某二見猶彳巾’使用熱轉移表面(在某些實施例中為熱 轉移韓板的购’職抒置⑽補理n、_單元等) 及/或其他7L件散逸的熱能可被轉移至EHD驅動的流體流 動’並通過排氣邊緣而從殼體排出。—般而言,當熱力管理 ΐ充正Γ於操作3滅中時’在殼體之内設置熱轉移路徑(通常 是2熱管或是叫倾術實現),峨散峨是賴處轉移 熱此至其巾—個EHD裝置(歧彡個㈣裝置)驅動氣流通 過熱轉移表面上的一處或多處。 …為了說明’繪製各種例雜實施例的熱轉⑽板。然而, 從兑月㈢中可知’在某些實施例中,不需要設置習知的熱沉 二板陣?j _E_EHD驅動的流體流過暴露的内部表面,無論是 靠近發熱裝置(例如微處理器、記憶體、即部位、光電或是 ㈣來源)或是從該處移除,皆可提供充分的熱轉移。在各 障況中紅者為在熱轉移表面上提供臭氧催化劑或是反應 性表面/材料。—般而言,發射器電極的熱轉移表面、場塑形 表面及^要離子收絲面呈現出不_設計挑戰,且相對於 其他貝施例’可設置為不同結構或是不同表面條件。然而, 在某二貫⑯例中’單—結構可為靜電操作性(例如用以塑形場 或收集離?)並提供鱗料EHD驅_流體流動。 應注意者為’在某些杨風的實施财,EHD驅動的流 f流動可雜财觀,且可為傭性或是骸性地轉移熱 里至周圍環境。以此方式,即使沒有明顯職流通過排氣邊 緣,但殼體的外表_熱點可彬肖除絲少被減輕。當然, 在某些實施辦’ EHD 的越可祕#継域性熱點並 13 201205434 藉由強制性的對流熱轉移而排熱至通至排氣邊緣的氣流。 電流體動力學(EHD)流體加速,概述 熟知本技藝者可輕易了解電流體動力學(EHD)流體流動 的基本原理,Jewell-Larsen,N.等人所著的「具有COMSOL 多重物理學的電暈感應式電流體力學流動的模型」(2 〇 〇 8年 靜電ESA年會論文集),以下稱為「jeweii_Larsen模型文獻」。 相似的,Krichtafovitch等人在1999年10月14日申請的美 國專利6504308號(名稱為「靜電流體加速器」)描述了在某 些EHD裝置中有用的一些電極與高壓電源構造。在此以參考 為料方式結合美國專利第6504308號及Jewell-Larsen模型文 獻的部分1(介紹)、Π(背景技術)、ΙΠ(數值模型)。 於此所述的EHD氣流裝置設計可包含一個或更多個電 暈放電型發射器電極。大致上而言,此種電暈放電電極包含 展現小曲率半徑的一個部位(或多個部位),並為電線、棒、 邊緣或點的形式。電暈放電電極的其他形狀亦為可能;例如, 電暈放電電極可為勾形電線、寬金屬條、具有尖銳或是薄形 部位的鋸狀板或是非鋸狀板,以辅助在施加高電壓時於具有 小曲率半徑的電極產生離子。大致上而言,能以廣泛類型的 材料製造電暈放電電極。例如,在某些實施例中,可以使用 Krichtaf〇vitch等人為發明人,在2003年12月2日提申的美 國專利第71577〇4!虎「電暈放電電極及其操作方法」中所述 201205434 的組成。在此合併_專· 715擺號以說明可用於某些 電暈放電類型實施例的㈣器電極的材料。大致上而言,高 壓電源會在電暈放電電極與收集器電極之間製造電場。 於此所述之EHD氣流裳置設計包含位於一個或更多個 電暈放電電極的下游處的離子收集表面。通常,ΕΗ〇氣流裝 置的離子收集表面包含大致上成平坦的收集器電極的引導表 面,其向電暈放電電極的下游處延伸4某些情況中,收集 器電極可如同熱轉移表面般進行雙重工作。在某些情況中, 可以設置流體可滲透的離子收集表面。 大致上而言,收集器電極表面可任何合適的導電材 料製造,例如铭或是銅。或者’如Krichtaf〇vitch巾請的美國 專利第6919698號所述,收集器電極(於此稱為「加速」電極) 可為利用高随材_成本體,其可輕純導通電暈電流, 但是沿著高阻抗收㈣,電極材料本體㈣流路徑的電壓餅 會減少表面電位,_抑織是關她放電事件。此種相 對高阻抗的材料包含_填充碳、秒,化鎵、磷化錮、氮 化删、碳化石夕及石西化録。於此結合美國專利第ό9ΐ9698號的 内容以說明可用於某些實施例中的收集器電極的材料。應注 意者為,在此所賴某些實補巾,可_高阻抗材料的表 面調節或是塗佈。 薄、低外型曲線或是高寬長比的裝置,概述 15 201205434 圖1A為平板型消費性電子裝置1〇〇的立體圖,其總厚 度d小於大約10mm,且其中顯示表面1〇1實質覆蓋整個主 要表面。圖1A顯示例示性的氣流1〇2,其可藉由根據本發明 的創新概念所設計並裝設於有限的内部空間的氣流裝 置110驅動並通過此消費性電子裝置。在某些實例中,可用 的内部容積及/或組件僅容許EHD氣流裝置110的總厚度d 為5 mm或更少。g然,所示的進出氣流及熱轉移表面12〇 僅為範例,更一般而έ,排氣邊緣可由元件的内部配置、特 定裝置構成的挑戰及/或工業設計因素來決定。 圖1Β(以上視平面圖且移除顯示表面)顯示EHD氣流裝 置110的氣流佈局及相對於處理器(例如Cj&gt;U、GPU等)的個 別電子組件(或是電路板)130、140的說明性設計的配置,且/ 或射頻(RF)部位(例如WiFi、WiMax、3G/4G語音/資料、GPS 等)係朝向裝置100的上緣,且其中設置一些位於邊緣的排氣 邊緣(例如進口 151及出口 152)。圖1C顯示另一說明性的 EHD氣流裝置11〇的通風氣流佈局及相對於個別組件及熱轉 移表面120的配置。如前所述,進口(151)及出口(152)排氣邊 緣僅為範例,且更一般性而言,排氣邊緣可由元件的内部配 置、特定裝置構成的挑戰及/或工業設計因素來決定。 圖2A為另一說明性的低外型曲線平板類型的消費性電 子裳置200 ’其總厚度d小於大約1〇 mm,且顯示表面1〇1 16 201205434 實質覆蓋整個主要表面,但其帽域置殼體_循環氣流 (或是其他流體)2G2辅助熱力管理,且其中被驅動的氣流不需 要通過排氣邊緣。圖2A顯示麻性的氣流,其可根據本發 明的創新概念所設計並裝設於有限的内部空間的ehd氣流 裝置210而於此消費性電子裝置中驅動。如前所述,在某些 實例十’可用的内部容積及/或組件僅容許EHD氣流裳置21〇 的總厚度d為5 mm或更少。 圖2B(亦為以上視圖並移除顯示表面)顯示實質上包含於 裝置内的氣流佈局及EHD IU錄置21〇靖域理器個別組 件(或是_板)230、240的配置,且/或射頻(RF)部位係朝向 裝置200的上緣。當然’所示的氣流佈局僅為範例,且更一 般性而言’氣流佈局可由元件的畴配置、特定裝置構成的 挑戰及/或ji業設計因素來決定。圖2C顯示—種變型,其中 氣流佈局包含循環氣流組成202A及透過排氣邊緣251、况 進出裝置的氣流202B。 亦可構思其他薄且低外型曲線或是高長寬比的裝置。例 如,圖7A為說明性的攜帶型消費電子裝置7〇〇的立體圖, 其中,根據本發明的某些實施例,EHD氣流裝置設置於總厚 度d小於大約10 mm的本體部位7〇1八之内。圖7a顯示例 示性的入流702及出流703,其可根據本發明的創新概念所 設計並裝設於有限_輕_ EHD氣流裝置71()而驅動並 201205434 穿過此消費性電子裝置。在某些實施例中,可用的内部容積 及/或組件僅容許EHD氣流裝置710的總厚度d為5 mm或 更少。當然’所示的入流、出流及熱轉移表面720的位置僅 為範例’更一般性而言,排氣邊緣可由元件的内部配置、特 定裝置構成的挑戰及/或工業設計因素來決定。 圖7B及7C(以上視平面圖)顯示EHD氣流裝置710的氣 流佈局及配置,其中個別電子組件,例如鍵盤組件74〇及處 理器(例如CPU、GPU等)的電路板730及/或射頻(RF)部位(例 如WiFi、WiMax、3G/4G語音/資料、GPS等)係朝向本體部 位701A的上緣,且其中設置一些位於邊緣的排氣邊緣(例如 進口 751及出口 752)。在圖7B及7C中,為了明晰而移除顯 示部位701B。在圖7C中,亦移除鍵盤組件74〇及本體部位 701A的上表面以顯示說明性的内部佈局及被EHD氣流裝置 710驅動通過電路板73〇及/或熱轉移表面72〇之上的說明性 的内部氣流。熱管(或是散熱器)721從選定的電路板73〇上的 熱源(例如CPU 731及圖形單元732)提供了到達熱轉移表面 720的熱轉移路徑’而㈣氣流裝置71〇吸引通過電路板73〇 之上的氣流提供額外的冷卻。 又可構思另一類型的裝置,圖10A及10B分別為說明性 的平板顯示_消電子裝置麵_賴及立體圖。圖 m顯示例示性的入流1002及出流聰,其可根據本發明 201205434 的創新概念所設計並裝設於有限的内部空間的EHD氣流裝 置1010而驅動並穿過此消費性電子裝置。在某些實施例中, 可用的内部容積及/或組件僅容許EHD氣流裝置1010的總厚 度d為5 mm或更少。 當然,所示的入流、出流及熱轉移表面1〇2〇的位置僅為 範例’更一般性而言,排氣邊緣可由元件的内部配置、特定 裝置構成的挑戰及/或工業設計因素來決定。圖11A顯示大致 上為根據圖10A及10B的一實施例,其中配置於邊緣的照明 源延伸陣列(LED光源1150)會在操作期間發熱,且此熱量會 藉由熱轉移表面1020以對流方式轉移到EHD氣流裝置 1010A、1010B驅動的氣流(10〇2、聰)中。於此所述的構成 中女裝於底部的EHD氣流裝置範例(ιοιοΑ)迫使空氣從消 費性電子裝置1_的底部進人殼體,而安裝於上方的ehd 氣流裝置範例(1010B)從上方排出氣體。 上述之平板類型、攜帶型類型及電視型消費性裝置僅為 說明性的。事實上’根據本說明書’熟知本技藝者可了解利 用本發明峰馳念的該等及其他種裝置類型(包含變型及/ 或適用於特定形式时、電伟件麵及配置、熱學問題及/ 或有關給定設計的工業設計因素的轉化型)。根據前述,吾人 將EHD氣流裝置設計成適雜整合在有限厚度之消費 子裝置之内。 19 201205434 EHD氣流裝置設計 平板類型裝置實施例 &gt;圖1A及其中所緣示之平板類型消費性電子裳置 100,:見在說明圖3、5、6的數個㈣流體(或氣流)袭置構 成的橫剖_ ’其中該等設計的靜作部位為形成於裝置 1内的表社。在某些情況中,至少其中-贿電_部 位是形成在殼體本身_表面上。在某些情況中,至少其中 個靜電操作部位是形成在覆蓋電子組件(例如電路板或是 顯示裝置)的EMI遮蔽的表面上。在各情況中,藉由將靜電 #作部位職機等表面上,則EHD流體H裝置可容設 於十分有限的内部空間中。 舉例而言’在薄的低外型曲線或是高寬長比的消費性電 子裝置(例如® 3、5、6所示者)巾,總厚度d較佳為小於大 約10mm,而安裝積體電路、散粒、連接器等的印刷電路板 (PCB)佔料肋部空_大部分。安裝有積體電路的pcB 的例子包含巾央處理科元(CPU)、目形處理科元(Gpu)、 通訊處理器及收發器、記憶體等,其等經常產生大部分的褒 置熱負載’且在某些實施射’储由設置在十分靠近熱源 (或熱耦接於鰭板/散熱器)的EHD流體/氣流裝置來冷卻之。 20 201205434 在某些情況中,如圖3所示,所欲者為容納①顯示器 301 ; (ii)雙面PCB 361(具有連接的積體電路362、363、364、 散粒365、連接1§ 366) ; (iii)EHD氣流裝置310在由殼體309 至少部分包圍的裝置堆疊及容積中。儘管一般上而言,可用 的内部容積及谷忍空間為相關於實例及設計,但從圖及說明 應可了解,消費性電子裝置可允許EHD氣流裝置31〇佔用5 mm或更少的總厚度d。在某些實施例中,熱轉移(Ητ)鰭板 320亦可被修整尺寸以適合於有限的厚度。 圖4(以概略形式)顯示說明性的構成,其中高壓電源491 耦接於發射器電極491與收集器電極492之間,以產生電場, 且在某些情況巾會產生離子’其大致上沿著下游方向驅動流 體流動499。在此圖中,發射器電極491耦接於電源491的 正極高壓端(例如+3.5 KV,雖然此為特定電壓值,但實際上 可根據設計選擇而提供任何電源波形),且收集器電極492 輕接於近端地面。給定發射器電極491及收集器電極492的 引導表面之間大量電壓差以及很短的距離(大約丨咖或更 )則可產生強力電場,其將對於流體中帶正電的離子(或 r子)產生往下游的驅動力。場線顯示出(大致上的)最終電場 的二間方位’且所示場線的間隙用來表示強度。 θ熟知本技藝者當可了解,料放電原理可祕在靠近電 曰放電類型的發射器電極的表面附近的強力電場中產生離 201205434 子。因此,在根據圖4的電暈放電類型的實施例中,靠近發 射器電極491的流體分子(例如周圍的空氣分子)被離子化, 且最終的τ正電離子在電場中加速朝向收集器電極视,撞 擊處理中的巾性流體分子。郷的結果為離子的動量轉移至 中性的流體分子’使流體分子往下游方向鶴。當收集器電 極492吸引帶正電的離子並將其中性化時,巾性的流體分子 是以所授無速度移動超過㈣器電極攸(如趙流動 所不)。電暈放電顧造成的流體轉可被不同地稱呼為「電 子」、「電暈」、或是「離子」風’且—般是定義為從靠近高電 壓放電電極處的離子移動產生的氣體移動。 儘管說明是著重於電暈放電類型的發射器電極構成,但 熟知本技藝者當可知,離何藉由其他_產生,例如無聲 放電、AC放電、介轉壁放電(DBD)等,且—但產生了離子, 則可被電場加速以驅動如此處所述之流體軸。為了避免混 淆’發射H電極不必絲電暈放電的_。且特定實施例所 述的電源的電壓大小、極性及波形(若有說明),僅為說明性 者,可與其他實施例所述之内容不同。 若依照在發射器電極491上游設置的特定表面以塑形前 述的電場及/且設置障壁於離子移動的上游處,則可更進一步 地了解某些實施例。例如’相對於圖4,可設置介電表面A%, 於介電表面493上易於累積在電暈放電類型的發射器電極 22 201205434 491的情況中所產生的帶正電離子。因為介電表面無法 提供接地的吸引路徑,則易於累積淨正電荷,之後會以靜電 形式操作而斥拒同性電荷。因此,靜電操作的介電表面493 對於往上游的離子移動為阻障。上游的介電表面493亦能靜 電性地遮蔽其它接地的吸引路徑,因此可娜前述的電場成 為主要朝向收集器電極492的下游方向。為了要提高效能, :收集器電極492的前緣與介電表面493的相鄰部位之間 «又置氣隙。例如,在某些實施例中,以介電表面柳中形成 、心冓H又置氣隙’如圖4戶斤示。選擇性地,在某些實施 例中,可以在介電表面493的上游處設置接地的一或更多個 2電路彳工494峨取向上游機的軒。在某些通風裝置的 貫施例中’接地的導電路徑物可設置於靠近入口孔。 …土;月漢況明’現在參照圖3,可發現在商業上較佳的 素的内。[5空間的熱力管理解決方案的可用的有限給定 厚度中,在靜電操作表面(例如收集器電極或是場塑形並可收 ^電荷的表面)的設計中’傾㈣省寶貴的厚度空間,否則將 :把空間浪費在封裝電極於咖氣流裝置子級件的壁面 平班If _情況,圖3顯示―種設計,其中—對大致上為 、4電極392形成於對向的表面上,以利用發射哭 ^91於受高細供給能量時,如參照圖4所述’粒 上朝向下游的EHD驅動氣流。 23 201205434 在所述構成中,在殼體309的内部表面(或其一部份)上 形成第-較低收集器電極392。例如,在某些實施例令,可 口疋導電(例如金&gt;!)▼或是條於大致上料電性的殼體(或是 狀表面)_部表面上,其接地以形成第—收集器電極 貫心 i大致上而„’可切割導電帶或是條為所欲之形狀及幅 度以用於收集器電極392。或者,其它覆蓋於接地導電(例如 金屬)層或區域的非導電性(例如介電)層可祕刻,或被選擇 性地移除’以暴露出收集器電極392所欲之形狀及幅度。在 某些情況中’接地的導電層或是部分可為與該殼體一體 形成。 可相似地於EMI遮罩3〇8(或於其一部分)上形成第二較 高收集器電極392,EMI遮罩細隔離娜氣流裝置31〇 及固定於雙面PCB 361的積體電路(362、363、祕)、散粒 365、及/或連接器366。導電(例如金屬)帶或是條可以固定於 歷遮蔽308的非導電性的暴露表面,並麵接於地面以形成 第二收集器電極。或者,其它覆蓋於接地導細如金屬)内 層或是EMI遮蔽遍區域的非導電性(例如介電)層可祕 刻’或被選擇性地移除’以暴露出收集器電極392所欲之形 狀及幅度。 如收集器電極392,個別的介電表面393的上及下實例 為設置於EMI遮蔽308或是殼體3〇9 _面上,或是做^其 24 201205434 之一部分。如參照圖4所述,此種介電表面為靜電操作性的, 且可有助於EHD氣流裝置的場塑形,並同時提供離子移動的 上游障壁。進一步而言,於EHD氣流裝置31〇操作期間,介 電表面393累積電荷(例如從電暈放電類型的發射器電極 實例所形成的正離子)。因為介電表面393無法提供接地的吸 引路控’則淨電荷易於累積,且之後能夠靜電性操作以斥拒 同性電荷。因此,介電表面393可為靜電操作性的離子移動 上游障壁。上游的介電表面493亦能靜電性地遮蔽其它接地 的吸引路徑’例如PCB 361上所形成的引線、固定於pcB 361 的元件、電池367、殼體309或是其它未明確顯示的電子元 件所形成者,藉此可塑猶賴電場成為主要朝向收集器電 極492的下游方向。 如同收集器電極392 ’介電表面393可形成於前述的表 面上或是與其—體形成。在各情況巾,藉由把軸收集器電 極392及介電表面393的靜電操作表面形成於前述表面上, EHD氣流裝置31〇可包含於十分有限的内部空間中,如圖3 所示。在某些實施财’可以以聚亞_誠是帶的形式設 置-或更多個所示的介電表面,例如EI dup〇ntdeN咖祕 公司以KAPTQN商鑛餘,叫岐於腦雜或是殼 體的個別部位。 25 201205434 左思,在某些實施例中,至少一部分的表面通(於1上 形成收集n電極搬實取介電場細彡絲393)可被構形以 如同鋪遮蔽般作為散姑。在某些航巾,可娜性地設 置此種散熱器及熱轉移鰭板32(),如圖3所示。在此種情況 中(並考慮尺寸的空隙),所欲者為設置熱緩衝3〇7(例如閉孔 泡珠塑膠或是其他絕熱材料)以避免外殼珊的熱點,並引導 EHD驅動的流體流動通過熱轉移鰭板咖。一般而言是顯示 通風及循it流體流動路徑,但熟知本技藝者可基於此處之說 明而了解㈣給枝計t的其他職及循魏動路徑。 圖 丨必衣1褥城上的另一變型的橫剖面 ’其中醜)紐裝置的靜賴作絲為形成料置殼體及 或覆盍電子子組件的電磁干涉(簡)遮蔽的個別表面上。儘 官圖增示者為包含EHD氣流裝置的裝置堆叠的一部分的顯 —雜例,射尺相定贼置堆疊包含 子組件,其上固定有元件,且咖氣流襄置位於 ^09的制表面之間。圖晴示更進-步的替換性構^ 二中EHD乳流褒置的其中一個收集器電極係利用形成於包 3於殼體609中的電子組件的pCB㈣線而形成。為了 了解’以相似的參考標號標示的相似特徵部位可I ^ 4的說明。基於麵·,熟知本·者當可 的變型。 听口 3及6 26 201205434 攜帶型實施例 θ 7A 7B、7C&amp;5兄明性的攜帶類型消費性電子穿置 7〇〇(及本體部位7〇1A),現在以橫杳i面說明圖H 9A 及犯的EHD氣流褒置的構成,其中此種設計的靜電操作部 位係形成於裝置殼體之_表面上。在某些情況中,至少— 個靜電操作雜是形成在殼體本身㈣部絲上。在某此情 況中,至少-傳縣作雜是形録錢電子崎(例崎 盤組件或是板)的聰雜的表面上。在各情況中,藉 ,成靜電操作部位於該縣面上,Effl)流體/氣流裝置‘ 谷置於十分有限的内部空間中。 舉例而言,在例如圖8A及8C所示的消費性電子裝置的 本體部位觀的橫剖關中,總厚度d小於大約10 mm, 鍵i、’且件74G佔用可用的垂直空間—部分。回想圖7c的平 面佈局’ ϋ 8A及8(:所稀横剖面容許實質上整侧部垂直 空間用來容置EHD氣流裝置710。另-方面,圖9Α及9Β 所不的相她更緊㈣裝㈣賴础容置ΕΗ〇氣流裝置 71〇及6又有積體電路、散粒、連接器等的印刷電路板(pcB), 其佔用可用内部空間的大部分。如祕述’設有積體電路的 PCB的例子包含中央處理ϋ單元(CPU)、®碱理器單元 (GPU)、通訊處理器及收發器、記憶體等,其等經常產生大 β刀的裝置熱貞載’且在某些實施例中,絲由設置在十分 27 201205434 罪近熱源(或熱轉接於鰭板/散熱器)的EHD流體/氣流裝置來 冷卻。 首先參照圖8A的橫剖面,一對大致上平坦的收集器電 極792形成於底部部位7〇1A的對向内部表面上。更明確而 言,第—較低收集器電極實例792形成於殼體7〇9的内部表 面的一部分上。如前所述’在某些實施例中,導電(例如金屬) 帶或是條可固定於大致上非導電性殼體或是表面的内部表面 上,並耦接於地以形成第一收集器電極實例。大致上而言, 可切割導電帶或是條為所欲之形狀及幅度以用於收集器電極 792 °或者,其它覆蓋於接地導電(例如金屬)層或區域的非導 電性(例如介電)層可被餘刻’或被選擇性地移除,以暴露出 收集器電極792所欲之形狀及幅度。在某些情況中,接地的 導電層或是部分可為與該殼體709 —體形成。 可相似地於EMI遮罩708(或於其一部分)上形成第二較 高收集器電極792,EMI遮罩708隔離EHD氣流裝置71〇 及鍵盤組件740。導電(例如金屬)帶或是條可以固定於 遮蔽708的非導電性的暴露表面,並耦接於地面以形成第二 收集器電極。如前所述,可切割導電帶是條為所欲之形狀及 幅度以用於收集器電極792。或者,其它覆蓋於接地導電(例 如金屬)内層或EMI遮蔽708區域的非導電性(例如介電)層可 28 201205434 被蝕刻,或被選擇性地移除, 之形狀及幅度。 以暴露出收集器電極792所欲 端之發射器電極791触於綱源的兩 =1未明確顯示,大致上如_所解釋),以產生以 巾^ _^(__蝴_的實施例 7_Γ3離子)。舉例而言’在某些實施例令,發射器電極 ㈣κν,雜此為特定 i貫際上可根據設計選擇而提供任何電源波形), 電極792输於近端地面。咖氣流裝請的操 作可參照圖4所述。 對於收集器電極而言,介電表面793的上及下實例設置 於職遮蔽708或是殼體·的表面上或為其之-部分。此 f介電表岭靜紐操作,且對於EHD流雜置的場塑形有 $響’且亦對於離子往上游移動設置阻障。特別而言,於EHD 机體j置71G的操作期間中,介電表面793會累積電荷(例如 么射盗電極791或其他處之電暈放電類型實例產生的正離 =)。因此,介電表面793可靜電操作為離子向上游移動的阻 ^。上游的介電表面793亦傾向靜電遮蔽接地的任何其它吸 引路徑,例如鍵盤組件740、電池767、殼體709本身或是其 它未顯示的電子元件的部分。以此方式,介電表面793能塑 29 201205434 使其主要朝向收集器電極 形EHD氣流裝置刑建立的電場, 792的方向。 中’空氣的通風入流702透過鍵盤組件 圖8B顯示上介電表面793中的孔洞7% 注思’在圖8A中, 740的孔洞而通過。圖&amp; 的部分底面圖(從細氣流裝置刑的内部觀視)。儘管所示 者為循環孔_例雜陣列,但熟知本技藝者當可了解:可 設置各種it過上介電表面793的穿孔(及其樣式)以輔助通風 入流702。亦應知者為,上述的介電表面793上的靜電操作 累積電荷能對於EHD氣流裝置谓的離子移動設置阻障,使201205434 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to thermal management, particularly to micro-scale cooling devices that generate ions and electric fields to drive a fluid (eg, air) as a thermal management for heat dissipation. Part of the solution. [Prior Art] The device used to utilize the ion-to-ion machine in the towel, the Weifang Ion fan, the electric fan, the corona wind pump, the electro-hydrodynamic-dynamic (EFD) device, the electrodynamics (EHD) driver, the brain gas pump Coffee fluid or gas drive: Certain aspects of this technology have been widely utilized in devices known as electrostatic gas cleaners or electrostatic precipitators. When used as part of a thermal management scheme, the ion flow fluid actuator can improve cooling efficiency and reduce vibration, power consumption, electronic device temperature, and/or noise. These attributes reduce the cost of life of the device: device size or volume, and in some cases, improve system performance or user experience. When electronic device designers deal with smaller and smaller shape factors (f〇rm_fa_), such as the UM and fine TM (four) introduced by Apple (Α_,-) and the extremely thin material material and the sub-package density Produce significant fresh challenges. Some kind of miscellaneous wealth, Ke Lin (four) to discharge the 埶 to the environment of the park. In some cases, it may not be necessary to travel across a large exhaust edge, but heat transfer within the device may be required or desired to reduce defects. The ion flow fluid drive provides the suction-technical part of the thermal management solution. It is expected that these solutions will allow ion flow fluid actuators to integrate 201205434 = and / / «Electronic enthalpy, usually in a volume of - _ feet, such as 2 to 3 mm. In particular, the test is to allow the H component of the electronic component to generate a high voltage, ion current, such as: tightly packed, these components may be static in other cases; discharge: electricity is dry and quite a sense of can. Under the material, the miscellaneous solution and the specific high-intensity field and / or discharge of ozone difficult products. h理成缓 [Summary of the Invention] It has been found that the surface of the surface of the electronic device that drives the electromagnetic interference, maintains the electrostatic charge, and collects the ion current has the opportunity to form or be formed on the surface of other components and structures in the electronic device. In this way, the size can be reduced and the density added. Some of the submersible 'current mechanics drive the electrostatic operation part of the body, 4 body, electromagnetic interference face, circuit board and / or heat pipe or spreader its = surface or formed in the - housing, electric needle shielding, circuit board And / or hot or scattered = on the internal surface. Depending on the role of these electrostatically operated parts, &quot;Ί, resistance and/or ozone robustness or catalyst coating or conditioning may be applied. In some embodiments of the present invention, an electronic device includes a housing; at least the wind/piece includes one or more heat sources disposed thereon; and a current 'configured to serve as the electronic The thermal management system of the device, first a 'their operating current mechanics drive ϋ at least - the electrostatic operating portion $ becomes the body - the inner surface or is formed on one of the inner surfaces of the housing. In some examples, the electronic device has a thickness of less than about 10 mm and has a range of one or more lateral dimensions that exceed the thickness in a ratio of at least 10:1. 201205434 For some implementations, the t-flow mechanics are transferred to at least a collector electrode, wherein the at least emitter electrode collector electrode. In some embodiments, the at least portion includes the spider portion of the housing that receives the emitter iff pole includes a contiguous portion. The dry coating is applied to the surface of the dielectric coating field by the dielectric coating field to form a length of about three emission lengths upstream of the transmitting n electrode. In some instances above x, the dielectric drive of the internal surface includes a step of the current mechanics operation, at least part of the electronic component. In some kinds of advantages, it is difficult to turn the cover to find the part to provide energy to the current mechanics drive_ high voltage power supply. In some examples, the electronic component includes - or a plurality of - circuit boards and - display devices. Some don't have money. The secret includes: _ service; - radio frequency (10)) or optical transceiver H ’· and lin-display | In some embodiments, the crucible is substantially sealed such that the current-assisted driving of the H-assisted force is included in the shell shaft. In some embodiments, the housing allows at least some fluid flow through one of the interior volumes and an edge between the exteriors. In some examples, the flow of fluid through the electromechanical actuator exceeds the edge through the edge by a ratio of at least two. In some examples, the housing includes one or more exhaust portions of the rim, and the substantially integral of the fluid flow driven by the electro-dynamic actuator is allowed to enter and exit through the venting portion. 201205434 Some private implementations, the hot county 峋3 public assistance is close to the body-domain surface of the corpus; the age (4) is operable to spread the heat radiated from the heat source to the internal surface - the essence section. In some embodiments, the electronic device is configured to be one or more of the following: a hand-held mobile money personal digital assistant; a laptop, a notebook or a tablet computer, and - digital, miscellaneous General device or game device. In some implementations, the electronic device is in the following state: a display panel; a display panel; and a television. In some implementations of the invention, an electronic device includes: at least one electronic component including one or more heat sources disposed thereon; an electromagnetic interference (EMI) shield of conductive material; and a current mechanics driver, The:: part of the two thermal management system; wherein at least the electrostatically operated portion of the current forceless actuator is formed as an inner box surface of the housing or formed on the surface of the electromagnetic interference shield. Some implementation of the financial, electrical oblique mining at least part of the electronic component „ (5 knives. In some cases, the covered electronic component of the part includes at least a part of the 絚 coupling performance 丝 力学 mechanics red 器. %I electricity you should be half and ϋ (four) version ~ patch, the sub-components - a conductive plane or lead to provide the electromagnetic interference shielding. Some implementation, electricity, I have less than about ω and have one or a range of a plurality of lateral dimensions that exceed the thickness in a thickness ratio of at least ι 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The operating portion includes a dielectric coated set II electrode adjacent the surface of the magnetic interference shield. In some embodiments, the electromagnetically applied portion of the emitter electrode, the portion of the f. Some of the exposed surface The dielectric coating field 77 extends about three hair (four) electrodes upstream of the diffuser electrode to the length of the collector electrode. In some example towels, the dielectric coating prevents degradation of the ozone-containing fluid ( Degradation). In some embodiments, the electronic component package a circuit board and a display device. In some embodiments, the heat source comprises one or more of the following: a processor; a radio frequency (RF) or optical transceiver; and a plurality of display devices Illumination source. In some embodiments 'the electronic device further comprises; a substantially sealed housing' such that fluid flow driven by the electromechanical actuator is substantially contained within the housing. In some embodiments, the electronic device Further included is a housing that allows at least some of the fluid flow therethrough through an inner volume and an edge between the outer portions. In some examples, the flow of fluid through the electromechanical actuator is at least a ratio of two Exceeding the edge passing through the edge. In some examples, the housing includes one or more exhaust portions of the edge, the substantially integral of the fluid flow driven by the electromechanical actuator being allowed to enter through the exhaust portion and In some embodiments, the electronic device further includes a housing, wherein the heat source is in close proximity to an interior surface of the housing within a distance of about 3 mm The thermal management system is operable to spread heat radiated at the heat source to a substantial portion of the interior surface. In some embodiments, the electronic device further includes a housing, the current force 201205434 = at least one of the regional actuators - The other electrostatically operated portion is formed as an inner surface of the inner casing or formed on one inner surface of the outer casing. A certain implementation of the "weizi device" includes a casing, wherein the electric drive is at least - The other electrostatically operated portion is formed as an inner surface of the housing or formed on an inner surface of the housing. In some embodiments, the electromagnetic interference shielding is also defined in the flow path from the heat transfer surface to the heat transfer surface. At least a portion of the hot material path, when the electricity is energized, the fluid flow is subjected to the current flow along the flow path. In some embodiments of the invention, the electronic device includes a display, at least - Circuit board, current mechanics driver and housing, stone: the total thickness of one of the electronic devices is defined as less than about 10 mm I. The electric two =: state for the electronic device - thermal management d 'i Bu (four) lose multiple receipts Kawasaki thereby put in electrical _ = fluid flow within the electronic device between the dielectric surface of said rotating Le (iv), the interference shielding of the other set - Butterfly butterfly table on one of the surfaces. &lt; Electromagnetic interference obscures certain implementations, the WE-electrode readings to the collector electrode - the formation of one of the circuit boards is formed in the second or the second 'Calling a body surface or shape 201205434 into the shell--(four) table. In some embodiments, at least a portion of the electromagnetic interference mask is formed on the dielectric coated metallization layer of the t-plate. In a second embodiment, the electronic device further comprises: a thermal transfer path, which is disposed on the circuit board in the flow path, or a plurality of heat sources to the heat transfer surface, the current mechanics The fluid flow can be driven along the flow path as it can. In some example towels, the electric switch is involved in at least a portion of the health transfer path. In some embodiments, the heat source is in close proximity to the inner surface of the housing at a distance of about 3 mm, and the thermal management system is operable to spread the heat emanating from the heat source to the interior surface of the interior. A substantial part. In some embodiments, the housing substantially seals the electronic device such that fluid flow driven by the electrodynamic drive is substantially contained within the housing. In some embodiments, the housing allows at least some fluid flow through an interior volume therein and an edge between the exterior. In some embodiments, the flow of fluid through the electromechanical actuator exceeds the edge through the edge by a ratio of at least two. In some embodiments, the housing includes one or more of the venting portions, the substantially integral of the fluid flow driven by the electromechanical actuator being allowed to enter and exit through the venting portion. In some embodiments, the electronic device is configured to be one or more of the following: - a handheld mobile phone or a personal digital assistant; a laptop, a notebook or a tablet; and a digital reader, media Player or game device. In some embodiments, the electronic device is configured to be one or more of the following: a display panel; and a television. In some embodiments, the circuit board and an internal surface of the § 亥 体 — 2012 10 201205434 or both of the at least - part of the ozone is robust - protective coating coating. Some of the implementation coatings for the sewing ship include a tetra-ethylene-m polymer, such as a TeflGn@ material. In some embodiments, the test is coated with either a surface-- or a two-phase-partial phase-ozone catalyst-compatible material. The money of the present invention is implemented, the electronic device includes an electronic component, and the t-sub-assembly has a plurality of components disposed thereon, and a thermal management system*, which includes a current mechanics driver and the current The flow-flow path of the fluid driven by the actuator of the mechanical drive from the source to the heat transfer surface, the heat transfer path comprising a surface coated with an ozone-impedance dielectric; in some embodiments The heat transfer path includes both a heat pipe and a heat spreader - or both. In some embodiments, at least a portion of the thermal transfer path is coated with an ozone catalyzed or reactive material. These and other embodiments will be better understood by reference to the embodiments, drawings, and riding towels herein. [Embodiment] It is understood that many of the designs and techniques described herein are particularly useful for the thermal management of densely packed devices and small modern consumer electronic devices. In fact, some of the EHD gas miscellaneous design and technology can contribute to the active thermal management of electronic devices, because the thinning of electronic devices or industrial design limits mechanical airflow devices (such as fans, blowers, etc.) The fate of life. In some embodiments, such an EHD airflow device can be fully integrated into a system, such as a tablet or portable computer, a projector, or a video display, a set-top box, and the like. In other embodiments, such an airflow arrangement may be in the form of a subassembly having an EHD turbulent flow or a housing. In terms of the above, it can be constructed to provide a variety of sizes, geometrical functions, and design of the static crane wire that constitutes the thief electrode, and can conceive various electrostatic operations of a given device. Check the mutual _ between the surface and the electrode and/or the H electrode. For the sake of explanation, it is more difficult to position the position between the table money and other components of the specific mosquito. For example, 'in most of the money, the opposite is flat, the collector electrode is formed on the inner surface of the casing or electromagnetic interference (dish), cover or _ circuit board (PCB) county silk surface, and A parallel surface that is placed close to the corona discharge type of emitter wire that is misaligned with the front end of the 彳_retraction electrode. Nonetheless, other embodiments described herein may employ other electrostatically operated surface reduction techniques as their _ sub-generation techniques, and still be understood. In this application, certain aspects of the described embodiments are referred to as electrohydrodynamic fluid acceleration devices, also referred to as "EHD" devices, "sputum fluid accelerators", "EHD airflow devices", and the like. For purposes of illustration, some embodiments have a specific EHD device that has a wiper located at or near the (four) electrode to generate ions that will be accelerated in the presence of an electric field, thereby driving fluid flow. . It should be understood that even if this scheme disposes of a corona type device, other ion generation techniques can be applied. For example, in some embodiments, for example, silent discharge, AC discharge, dielectric barrier discharge (dbd), etc., can be used to generate ions that are accelerated when an electric field is present, thereby driving fluid flow. 12 201205434 A second to see the use of a heat transfer surface (in some embodiments, the heat transfer of the Korean plate purchases (10) to repair n, _ units, etc.) and / or other 7L pieces of heat can be dissipated The fluid flow transferred to the EHD drive is discharged from the housing through the exhaust rim. In general, when the thermal management is in the middle of the operation 3, the heat transfer path is set in the housing (usually 2 heat pipes or the implementation of the tilting process). To its towel, an EHD device (a device (4)) drives airflow through one or more locations on the heat transfer surface. ...to illustrate the heat transfer (10) panels of various examples. However, it is known from the month (3) that in some embodiments, it is not necessary to provide a conventional heat sink two array. j _E_EHD-driven fluid flows through the exposed internal surface, providing adequate heat transfer, whether close to or removed from a heat-generating device such as a microprocessor, memory, ie, part, optoelectronic or (four) source . In each of the obstacles, the red person provides an ozone catalyst or a reactive surface/material on the heat transfer surface. In general, the heat transfer surface of the emitter electrode, the field shaping surface, and the ion-receiving surface exhibit no design challenges and can be set to different structures or different surface conditions relative to other shell examples. However, in a twoteenth case, the 'single-structure can be electrostatically operable (e.g., to shape the field or collect away) and provide a squama EHD flood-fluid flow. It should be noted that in some Yang Feng's implementation, EHD-driven flow can be mixed, and can be transferred to the surrounding environment for servant or defamatory. In this way, even if there is no apparent flow through the exhaust rim, the outer surface of the housing is less susceptible to lightening. Of course, in some implementations, the EHD's Vietnamese hotspots and 13 201205434 exhaust heat to the airflow to the exhaust edge by forced convective heat transfer. Electrohydrodynamics (EHD) fluid acceleration, an overview of the basic principles of current flow dynamics (EHD) fluid flow, as well known to those skilled in the art, by Jewell-Larsen, N. et al., "COMSOL Multiphysics" The model of halo inductive electrohydrodynamic flow (2 〇〇 8 years electrostatic ESA annual conference proceedings), hereinafter referred to as "jeweii_Larsen model literature". U.S. Patent No. 6,504,308, entitled "Electrostatic Fluid Accelerator", filed on Oct. 14, 1999, to Krichtafovitch et al., describes some of the electrodes and high voltage power supply configurations useful in certain EHD devices. U.S. Patent No. 6,504,308 and the Jewell-Larsen Model Document, Part 1 (Introduction), Π (Background Art), and ΙΠ (Numerical Model) are incorporated herein by reference. The EHD airflow device design described herein may include one or more corona discharge type transmitter electrodes. In general, such corona discharge electrodes comprise a portion (or portions) exhibiting a small radius of curvature and are in the form of wires, rods, edges or points. Other shapes of the corona discharge electrode are also possible; for example, the corona discharge electrode can be a hook wire, a wide metal strip, a saw blade having a sharp or thin portion, or a non-saw plate to assist in applying a high voltage. The ions are generated at an electrode having a small radius of curvature. In general, corona discharge electrodes can be fabricated from a wide variety of materials. For example, in some embodiments, Krichtaf〇vitch et al., U.S. Patent No. 71,577, 4, issued toK. The composition of 201205434. The _ _ 715 is hereby incorporated to illustrate the materials that can be used for the (four) electrode of certain corona discharge type embodiments. In general, a high voltage power source creates an electric field between the corona discharge electrode and the collector electrode. The EHD airflow design described herein includes an ion collecting surface located downstream of one or more corona discharge electrodes. Typically, the ion collecting surface of the helium gas flow device comprises a substantially planar guiding surface of the collector electrode that extends downstream of the corona discharge electrode. 4 In some cases, the collector electrode can be doubled like a heat transfer surface. jobs. In some cases, a fluid permeable ion collecting surface can be provided. In general, the collector electrode surface can be made of any suitable electrically conductive material, such as ingot or copper. Or, as described in U.S. Patent No. 6,919,698 to Krichtaf 〇vitch, the collector electrode (herein referred to as the "acceleration" electrode) can utilize a high-conducting body, which can be used to conduct light currents, but along the High-impedance (four), the electrode material body (four) flow path of the voltage cake will reduce the surface potential, _ suppression is to close her discharge event. Such relatively high-impedance materials include _filled carbon, seconds, gallium, phosphide, nitriding, carbonized stone, and lithograph. The material of the collector electrode that can be used in certain embodiments is described herein in conjunction with U.S. Patent No. 9,969,. It should be noted that some of the actual wipes may be adjusted or coated on the surface of the high-impedance material. Thin, low profile or high aspect ratio device, overview 15 201205434 Figure 1A is a perspective view of a flat panel type consumer electronic device, the total thickness d is less than about 10 mm, and the display surface 1 〇 1 substantial coverage The entire main surface. Figure 1A shows an exemplary airflow 1 〇 2 that can be driven and passed through the consuming air device 110 designed and installed in a limited interior space in accordance with the inventive concept of the present invention. In some instances, the available internal volume and/or assembly only allows the total thickness d of the EHD airflow device 110 to be 5 mm or less. However, the illustrated inflow and outflow and heat transfer surfaces 12A are merely examples, and more generally, the exhaust edge may be determined by the internal configuration of the component, the challenges posed by the particular device, and/or industrial design factors. FIG. 1A (above view and removal of the display surface) shows the airflow layout of the EHD airflow device 110 and illustrative of individual electronic components (or circuit boards) 130, 140 relative to the processor (eg, Cj>U, GPU, etc.) The configured configuration, and/or radio frequency (RF) locations (eg, WiFi, WiMax, 3G/4G voice/data, GPS, etc.) are toward the upper edge of the device 100, and some of the exhaust edges at the edges are placed therein (eg, inlet 151) And export 152). Figure 1C shows the layout of the venting airflow of another illustrative EHD airflow device 11 and its configuration relative to the individual components and thermal transfer surface 120. As mentioned earlier, the inlet (151) and outlet (152) exhaust edges are merely examples, and more generally, the exhaust edge may be determined by the internal configuration of the component, the challenges posed by the particular device, and/or industrial design factors. . 2A is another illustrative low profile curve type of consumer electronic skirt 200' having a total thickness d of less than about 1 〇 mm, and the display surface 1 〇 1 16 201205434 substantially covering the entire major surface, but its cap field The housing_circulating airflow (or other fluid) 2G2 assists thermal management, and the airflow driven therein does not need to pass through the exhaust edge. 2A shows a hemp airflow that can be driven in this consumer electronic device in accordance with the inventive concept of the present invention and installed in a limited internal space ehd airflow device 210. As previously mentioned, in some instances the internal volume and/or assembly available only allows the total thickness d of the EHD airflow 21 为 to be 5 mm or less. Figure 2B (also the above view and removal of the display surface) shows the configuration of the airflow substantially contained within the device and the configuration of the individual components (or _boards) 230, 240 of the EHD IU recording 21 and / Or the radio frequency (RF) portion is toward the upper edge of the device 200. Of course, the airflow layout shown is merely an example, and more generally the 'airflow layout' may be determined by the domain configuration of the components, the challenges posed by the particular device, and/or the design factors of the industry. Figure 2C shows a variation in which the airflow layout includes a circulating airflow composition 202A and an airflow 202B that passes through the exhaust edge 251 and the ingress and egress means. Other thin and low profile curves or high aspect ratio devices are also contemplated. For example, FIG. 7A is a perspective view of an illustrative portable consumer electronic device 7A, wherein an EHD airflow device is disposed at a body portion having a total thickness d of less than about 10 mm, according to some embodiments of the present invention. Inside. Figure 7a shows an exemplary inflow 702 and outflow 703 that can be designed and installed in accordance with the inventive concept of the present invention to be driven by a limited_light_EHD airflow device 71() and 201205434 through the consumer electronic device. In some embodiments, the available internal volume and/or assembly only allows the total thickness d of the EHD airflow device 710 to be 5 mm or less. Of course, the locations of the inflow, outflow, and heat transfer surfaces 720 shown are merely examples. More generally, the exhaust edge may be determined by the internal configuration of the component, the challenges posed by the particular device, and/or industrial design factors. Figures 7B and 7C (above plan view) show the airflow layout and configuration of the EHD airflow device 710, with individual electronic components, such as keyboard components 74, and circuit boards 730 and/or radio frequency (RF) of the processor (e.g., CPU, GPU, etc.) The location (eg, WiFi, WiMax, 3G/4G voice/data, GPS, etc.) is toward the upper edge of the body portion 701A, and some of the edge of the exhaust edge (eg, inlet 751 and outlet 752) are disposed therein. In Figs. 7B and 7C, the display portion 701B is removed for clarity. In FIG. 7C, the keyboard assembly 74 and the upper surface of the body portion 701A are also removed to show an illustrative internal layout and instructions for being driven by the EHD airflow device 710 through the circuit board 73 and/or the heat transfer surface 72A. Sexual internal airflow. The heat pipe (or heat sink) 721 provides a heat transfer path to the heat transfer surface 720 from a heat source (e.g., CPU 731 and graphics unit 732) on the selected circuit board 73. (4) Airflow device 71 is attracted through the circuit board 73. The airflow above the weir provides additional cooling. Another type of device is also conceivable, and Figures 10A and 10B are respectively an illustrative flat panel display - an electronic device surface and a perspective view. Figure m shows an exemplary inflow 1002 and an outflow, which can be driven and passed through the consumer electronic device in accordance with the inventive concept of 201205434 and installed in a limited internal space EHD airflow device 1010. In some embodiments, the available internal volume and/or assembly only allows the total thickness d of the EHD airflow device 1010 to be 5 mm or less. Of course, the locations of the inflow, outflow, and heat transfer surfaces shown are only examples. More generally, the exhaust edge may be challenged by the internal configuration of the component, the particular device, and/or industrial design factors. Decide. 11A shows an embodiment in accordance with FIGS. 10A and 10B in which an illumination source extension array (LED light source 1150) disposed at an edge generates heat during operation and the heat is transferred by convection by heat transfer surface 1020. To the airflow (10〇2, Cong) driven by the EHD airflow devices 1010A, 1010B. In the configuration described herein, the EHD airflow device example (ιοιοΑ) at the bottom of the women's clothing forces air into the housing from the bottom of the consumer electronic device 1_, and the ehd airflow device example (1010B) installed above is discharged from above. gas. The above-mentioned tablet type, portable type, and television type consumer device are merely illustrative. In fact, it will be apparent to those skilled in the art <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Or a conversion type of industrial design factors for a given design). In light of the foregoing, we have designed the EHD airflow device to be suitably integrated into a consumer device of limited thickness. 19 201205434 EHD airflow device design plate type device embodiment&gt; FIG. 1A and the flat type consumer electronic device 100 shown therein, see several (four) fluid (or airflow) attacks in the description of FIGS. 3, 5, and 6. The cross section of the configuration _ 'where the static part of the design is the table formed in the apparatus 1. In some cases, at least the portion of the bribe is formed on the surface of the casing itself. In some cases, at least one of the electrostatically operated portions is formed on an EMI shielded surface that covers an electronic component, such as a circuit board or display device. In each case, the EHD fluid H device can be accommodated in a very limited internal space by placing the static electricity on the surface of the job. For example, in a thin low profile or a high aspect ratio consumer electronic device (such as those shown in Figures 3, 5, and 6), the total thickness d is preferably less than about 10 mm, and the integrated body is installed. Printed circuit boards (PCBs) for circuits, pellets, connectors, etc. occupy the ribs empty. Examples of pcBs with integrated circuits include a central processing unit (CPU), a processing unit (Gpu), a communication processor and a transceiver, a memory, etc., which often generate most of the thermal load. 'And in some implementations, the 'storage' is cooled by an EHD fluid/airflow device placed very close to the heat source (or thermally coupled to the fin/heat sink). 20 201205434 In some cases, as shown in Figure 3, the desired one is to accommodate 1 display 301; (ii) double-sided PCB 361 (with integrated integrated circuit 362, 363, 364, shot 365, connection 1 § 366); (iii) EHD airflow device 310 is in a stack and volume of devices at least partially enclosed by housing 309. Although in general, the available internal volume and valley space are related to the examples and designs, it should be understood from the figures and description that the consumer electronic device can allow the EHD airflow device 31 to occupy a total thickness of 5 mm or less. d. In some embodiments, the thermal transfer (Ητ) fins 320 can also be sized to fit a limited thickness. Figure 4 (in schematic form) shows an illustrative configuration in which a high voltage power supply 491 is coupled between the emitter electrode 491 and the collector electrode 492 to generate an electric field, and in some cases the ion will generate ions 'substantially along The fluid flow 499 is driven in a downstream direction. In this figure, the transmitter electrode 491 is coupled to the positive high voltage terminal of the power supply 491 (eg, +3.5 KV, although this is a particular voltage value, but virtually any power supply waveform can be provided depending on design choice), and the collector electrode 492 Lightly attached to the near ground. Given a large voltage difference between a transmitter electrode 491 and the guiding surface of the collector electrode 492 and a very short distance (approximately or more), a strong electric field can be generated which will be positively charged for the fluid (or r Sub) produces a driving force downstream. The field lines show (substantially) the two orientations of the final electric field' and the gaps of the indicated field lines are used to indicate the intensity. It is known to those skilled in the art that the principle of the discharge of the material can be generated in a strong electric field near the surface of the emitter electrode of the electro-discharge type to be generated from 201205434. Thus, in the embodiment of the corona discharge type according to Fig. 4, fluid molecules (e.g., surrounding air molecules) near the emitter electrode 491 are ionized, and the final τ positively charged ions are accelerated in the electric field toward the collector electrode. Depending on the impact fluid molecules in the impact treatment. The result of enthalpy is that the momentum of the ions is transferred to the neutral fluid molecule 'the fluid molecules move downstream. When collector electrode 492 attracts positively charged ions and neutralizes them, the fluid molecules of the blanket move at a speed that is not exceeded by the (4) electrode (e.g., Zhao does not flow). The fluid transfer caused by corona discharge can be referred to differently as "electron", "corona", or "ion" wind and is generally defined as the movement of gas from the movement of ions near the high voltage discharge electrode. . Although the description is focused on the configuration of the emitter electrode of the corona discharge type, it is well known to those skilled in the art that it is generated by other sources, such as silent discharge, AC discharge, dielectric wall discharge (DBD), etc., and - but The ions are generated and then accelerated by the electric field to drive the fluid axis as described herein. In order to avoid confusion, the emission of the H electrode does not require a wire corona discharge. The voltage magnitude, polarity, and waveform (if any) of the power supply described in the specific embodiments are merely illustrative and may differ from those described in other embodiments. Some embodiments may be further understood if the specific surface disposed upstream of the emitter electrode 491 is shaped to shape the aforementioned electric field and/or the barrier is disposed upstream of the ion movement. For example, with respect to Fig. 4, a dielectric surface A% may be provided, and positively charged ions generated in the case of the corona discharge type emitter electrode 22 201205434 491 are easily accumulated on the dielectric surface 493. Since the dielectric surface does not provide a grounded attraction path, it is easy to accumulate a net positive charge and then operate as an electrostatic charge to reject the same charge. Thus, the electrostatically operated dielectric surface 493 acts as a barrier to ions moving upstream. The upstream dielectric surface 493 can also electrostatically shield other grounded attraction paths, so that the aforementioned electric field is oriented primarily toward the downstream of the collector electrode 492. In order to improve performance, there is an air gap between the leading edge of the collector electrode 492 and the adjacent portion of the dielectric surface 493. For example, in some embodiments, the dielectric surface is formed in the willow, and the palpitations H and the air gap are as shown in Fig. 4. Alternatively, in some embodiments, one or more of the two circuits may be placed upstream of the dielectric surface 493 to complete the 494 峨 orientation of the upstream machine. In some embodiments of certain ventilation devices, the grounded conductive path may be placed adjacent to the inlet aperture. ... soil; month Hanming' Now, with reference to Figure 3, it can be found in the commercially preferred. [5 Space Thermal Management Solution Available in a limited set thickness, in the design of electrostatically operated surfaces (such as collector electrodes or field-shaped and chargeable surfaces) Otherwise, it will: waste space on the wall surface of the package electrode in the air flow device sub-level If If _ case, Figure 3 shows a design, where - the pair is roughly, the 4 electrode 392 is formed on the opposite surface, In order to utilize the emission crying, when the high-powder energy is supplied, the airflow toward the downstream EHD is driven as described with reference to FIG. 23 201205434 In the above configuration, the first-lower collector electrode 392 is formed on the inner surface (or a portion thereof) of the casing 309. For example, in some embodiments, the sputum is electrically conductive (eg, gold &gt;!) or stripped on a substantially electrically conductive housing (or surface) surface that is grounded to form a first collection. The electrode is substantially concentric and can cut the conductive strip or strip to the desired shape and amplitude for the collector electrode 392. Alternatively, other non-conductivity covering the grounded conductive (eg, metal) layer or region. The (eg, dielectric) layer may be secretly or selectively removed 'to expose the desired shape and amplitude of the collector electrode 392. In some cases the 'grounded conductive layer or portion may be with the shell The body is integrally formed. The second higher collector electrode 392 can be similarly formed on the EMI mask 3〇8 (or a portion thereof), and the EMI mask is used to separate the nano airflow device 31〇 and the product fixed on the double-sided PCB 361. Body circuit (362, 363, secret), shot 365, and/or connector 366. A conductive (eg, metal) strip or strip may be attached to the non-conductive exposed surface of the mask 308 and surfaced to the ground. Forming a second collector electrode. Or, other covering the inner layer of the grounding guide such as metal) A non-conductive (e.g., dielectric) layer that is an EMI shielding region can be secreted or selectively removed to expose the desired shape and amplitude of the collector electrode 392. For example, collector electrode 392, individual The upper and lower examples of the electrical surface 393 are disposed on the EMI shield 308 or the housing 3 〇 9 _ surface, or as part of 24 201205434. As described with reference to Figure 4, the dielectric surface is electrostatically operated. Sexually, and can contribute to the field shaping of the EHD airflow device, while providing an upstream barrier for ion movement. Further, during operation of the EHD airflow device 31, the dielectric surface 393 accumulates charge (eg, from corona discharge) Types of emitter electrodes form positive ions.) Because dielectric surface 393 does not provide grounded attraction control' then the net charge tends to accumulate and can then be electrostatically operated to reject the same charge. Thus, dielectric surface 393 The electrostatically operable ions move the upstream barrier. The upstream dielectric surface 493 can also electrostatically shield other grounded attraction paths, such as leads formed on the PCB 361, components fixed to the pcB 361, and electricity. 367, the housing 309 or other electronic components not explicitly shown, whereby the electric field can be molded to be mainly in the downstream direction of the collector electrode 492. Like the collector electrode 392 'the dielectric surface 393 can be formed in the foregoing Formed on or in the body. In each case, by forming the electrostatic collector surface of the shaft collector electrode 392 and the dielectric surface 393 on the surface, the EHD airflow device 31 can be included in a very limited internal space. In, as shown in Figure 3. In some implementations, 'can be set in the form of poly-_cheng is the belt- or more than the dielectric surface shown, such as EI dup〇ntdeN coffee company to KAPTQN commercial mine It is called a brain or an individual part of the shell. 25 201205434 Zuo Si, in some embodiments, at least a portion of the surface pass (forming the n-electrode on the 1 to pick up the dielectric field fine filaments 393) can be configured to be as a mask. In some airbags, such a heat sink and heat transfer fins 32 () are provided in a manner as shown in FIG. In this case (and considering the size of the gap), the desired person is to set the thermal buffer 3〇7 (such as closed-cell bead plastic or other insulation material) to avoid the hot spot of the shell and guide the EHD-driven fluid flow. Transfer the fins through the heat. In general, it is shown that the ventilation and the flow path of the flow are, but those skilled in the art can understand (4) the other positions and the path of the path to the branch t based on the description herein. The cross-section of another variant of the ’ 丨 ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ ’ 纽 纽 纽 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为 为The display is a part of the stack of devices containing the EHD airflow device. The ruler is set to include a subassembly with components mounted thereon, and the coffee flow is placed on the surface of the ^09. between. One of the collector electrodes of the EHD emulsion device is formed using a pCB (four) line of electronic components formed in the housing 609. In order to understand the description of similar feature parts indicated by similar reference numerals, I^4. Based on the face, I am familiar with the variants of this person. Listening port 3 and 6 26 201205434 Portable embodiment θ 7A 7B, 7C &amp; 5 brothers of the portable type of consumer electronic wear 7 〇〇 (and body part 7 〇 1A), now with a horizontal view i 9A and the composition of the EHD airflow device, wherein the electrostatically operated portion of the design is formed on the surface of the device housing. In some cases, at least one of the electrostatic handling impurities is formed on the wire of the casing itself. In some cases, at least - Chuan County is a complex surface on the form of electronic electronics (such as the plate assembly or board). In each case, the electrostatic operation unit is located on the county surface, and the Effl fluid/air flow device is placed in a very limited internal space. For example, in a cross-sectional view of the body portion of a consumer electronic device such as that shown in Figures 8A and 8C, the total thickness d is less than about 10 mm, and the keys i, 'and the portion 74G occupy the available vertical space-portion. Recall the planar layout of Figures 7c' ϋ 8A and 8 (the thin cross-section allows for substantially full side vertical space to accommodate the EHD airflow device 710. On the other hand, Figures 9Α and 9Β are not tighter (4) The printed circuit board (pcB) with integrated circuit, pellets, connectors, etc., which occupies the airflow devices 71〇 and 6, occupies most of the available internal space. Examples of PCBs include central processing unit (CPU), ® physics unit (GPU), communication processor and transceiver, memory, etc., which often generate large beta-knife devices that are hot-loaded and In an embodiment, the filaments are cooled by an EHD fluid/airflow device disposed at a very low heat source (or heat transfer to the fin/heat sink). Referring first to the cross-section of Figure 8A, a pair of substantially flat collections The electrode 792 is formed on the opposite inner surface of the bottom portion 7〇1A. More specifically, the first lower collector electrode instance 792 is formed on a portion of the inner surface of the housing 7〇9. In some embodiments, the conductive (eg, metal) strip or strip can be secured Substantially non-conductive housing or internal surface of the surface, and coupled to ground to form a first collector electrode instance. In general, the conductive strip or strip can be cut to the desired shape and amplitude for use. The collector electrode 792 ° or other non-conductive (eg, dielectric) layer overlying the grounded conductive (eg, metal) layer or region may be "removed" or selectively removed to expose the collector electrode 792 The desired shape and amplitude. In some cases, the grounded conductive layer or portion may be formed integrally with the housing 709. The second comparison may be similarly formed on the EMI mask 708 (or a portion thereof). A high collector electrode 792, an EMI mask 708 isolating the EHD airflow device 71 and the keyboard assembly 740. A conductive (eg, metal) strip or strip may be attached to the non-conductive exposed surface of the shield 708 and coupled to the ground to form Second collector electrode. As previously described, the cleavable conductive strip is of a desired shape and amplitude for the collector electrode 792. Alternatively, the other covers the grounded conductive (e.g., metal) inner layer or EMI shield 708 region. Non-conductive (eg The electrical layer 28 can be etched, or selectively removed, in shape and amplitude. The emitter electrode 791 exposing the desired end of the collector electrode 792 is not clearly shown. The above is explained as _ to generate the embossment of the embodiment ______3 ion. For example, in some embodiments, the transmitter electrode (four) κν, which is otherwise specific, can provide any power waveform according to design choices, and the electrode 792 is applied to the proximal ground. The operation of the coffee flow can be described with reference to Figure 4. For the collector electrodes, the upper and lower examples of the dielectric surface 793 are disposed on or in the portion of the surface of the shield 708 or the housing. This f dielectric sluice operation, and has a 'sound' for the field shaping of the EHD flow miscellaneous and also sets a barrier for the ions to move upstream. In particular, during operation of the EHD body j 71G, the dielectric surface 793 will accumulate charge (e.g., the positive displacement = generated by the example of the corona discharge type 791 or other type of corona discharge type). Thus, the dielectric surface 793 can be electrostatically operated as a resistance to the upstream movement of ions. The upstream dielectric surface 793 also tends to electrostatically shield any other suction path to ground, such as keyboard assembly 740, battery 767, housing 709 itself, or portions of other electronic components not shown. In this manner, dielectric surface 793 can be molded 29 201205434 so that it is oriented primarily toward the collector electrode-shaped EHD airflow device to establish the electric field, 792 direction. The venting inflow 702 of the 'air" passes through the keyboard assembly. Figure 8B shows the hole 7% in the upper dielectric surface 793. In Figure 8A, the hole of the 740 passes. Partial bottom view of the figure &amp; (from the internal view of the fine airflow device). Although shown as a recirculating aperture array, it is well known to those skilled in the art that various perforations (and styles thereof) of the upper dielectric surface 793 can be provided to assist in venting the inflow 702. It is also known that the electrostatically charged accumulated charge on the dielectric surface 793 described above can provide a barrier to the ion movement of the EHD airflow device.

在某些實施射’可織另外_子義轉。例如, 在圖8A中’額外的離子斥拒阻障乃5作為介電網、格、格 栅或是其他跨越EHD驅動的流體的上游橫剖面的透氣幕。如 前所述’阻障795累積電荷(例如在發射器電極791的電暈放 電類型實例所產生的正離子),ϋ操作為離子向上游移動的靜 電陴障。在所述構成中,設置接地的導電路徑794以捕獲向 上游移動通過阻障795的離子。 在某些貫施例中’可設置(未明確示於圖8Α的)子組件結 構(例如用以固定發射器電極791及收集器電極792相對於彼 此的位置)。圖8C為穿過說明性外殼結構811(例如部分子組 件殼體)的橫剖面圖,外殼結構811可讓收集器電極792及發 30 201205434 射器電極791相對於彼此的位置為固定。注意,發射器79i 的個別端的固定點(例如812)必須設在所示的橫剖面之外,但 可從圖8D的對應立體圖的斷面而較佳地了解。如前所述, 靜電操作的上及下介電表面793有助於EHD流體裝置的場塑 形,亦能夠對於向上游移動的離子設置阻障。然而,在圖8c 的變型中,該等介電表面793重疊於所示之外殼結構8ιι的 -部分上’且-致地向(如前所述之)其所言文置的刪遮蔽· 或是殼體7〇9的表面的上游方向延伸。注意,在圖犯的立 體圖中’只有顯示重疊的靜電操作場塑形介電表面793其中 之下方者。在某些實施例中,可以以聚亞醯胺膜或是帶的形 弋°又置或更多個所示的介電表面,例如 emours A司以kapton商標販售者以其固定於刪遮 蔽或是殼體的個別部位。 在前述的圖8A及8C的實施例中,商業上較佳之形式因 素的熱力管理解決方案的内部空間是非常有限的厚度,其 中’在靜鶴作表面(例如收集請域是場娜並可收集電 f的表面)的設財,傾㈣省寶貴的厚度雜,否則將會把 工間浪費在封裝電極於咖氣流農置子組件的壁面中。將此In some implementations, the ray can be woven. For example, in Figure 8A, the additional ion repellent barrier is a gas permeable screen for the upstream cross-section of the dielectric, grid, grid or other fluid that is driven across the EHD. As previously described, the barrier 795 accumulates charge (e.g., positive ions generated by the example of the corona discharge type of the emitter electrode 791), and the helium operation is an electrostatic barrier that moves ions upstream. In the configuration, a grounded conductive path 794 is provided to capture ions moving upstream through the barrier 795. In some embodiments, a sub-assembly structure (not explicitly shown in Figure 8A) may be provided (e.g., to fix the position of emitter electrode 791 and collector electrode 792 relative to each other). Figure 8C is a cross-sectional view through the illustrative housing structure 811 (e.g., a portion of the subassembly housing) that allows the collector electrode 792 and the position of the transmitter 209210544 emitter electrode 791 to be fixed relative to one another. Note that the fixed points (e.g., 812) of the individual ends of the emitter 79i must be placed outside of the cross-section shown, but can be better understood from the cross-section of the corresponding perspective of Figure 8D. As previously discussed, the electrostatically operated upper and lower dielectric surfaces 793 facilitate field shaping of the EHD fluidic device and also provide barriers to ions moving upstream. However, in the variant of Fig. 8c, the dielectric surfaces 793 are superimposed on the - part of the housing structure 8 shown and are directed to (as previously described) their scuttles or It is an upstream direction of the surface of the casing 7〇9. Note that in the stereogram of the figure, only the overlapping electrostatic field-changing dielectric surface 793 is shown below. In some embodiments, the polyimide film or strip may be in the form of a tape or a plurality of dielectric surfaces as shown, for example, emours A is sold as a kapton trademark. Or individual parts of the housing. In the foregoing embodiments of Figures 8A and 8C, the internal space of the commercially preferred form factor thermal management solution is of very limited thickness, wherein 'the surface of the crane is used for the surface (for example, the collection field is field and can be collected The surface of the electric f) is rich, and the precious thickness is miscellaneous. Otherwise, the work will be wasted in the wall of the package electrode in the coffee flow device. Do this

条件、内入考里’圖9八及兜顯示適才說明的設計的變型, 其中(0鍵盤組件74G;⑼咖氣流裝置9⑻㈣雙面pcB 7叫具有固定的積體電路(微處理器服、記憶體泊、散粒 201205434 765、連接器766)可容納在由殼體909至少部分包圍的裝置 堆豐及容積中。 儘管可用的内部空間及容忍度大致上為取決於實用及設 計’應能從此處之圖及說明清楚了解,消費性電子裝置可容 忍其之總厚度d的5 mm或是更少用於EHD氣流裝置910。 在某些實施例中(例如圖9A所示者),熱轉移鰭板920可改變 尺寸以適合容納於有限的厚度中。在某些實施例中(如圖9B 所示者)’氣流路徑可安裝較大的熱轉移鰭板920。在各情況 中’藉由形成作為收集器電極792及/或介電表面793的靜電 操作表面於前述的表面上,則EHD氣流裝置91〇可包含於十 分有限的内部空間中,分別如圖9八及93所示。 如前所述,儘管為了簡化圖式而於此省略之,外殼結構 (例如部分子組件殼體)可讓收集器電極792及發射器電極791 相對於彼此的位置為固定。在此種情況中,介電表面793(例 如聚亞酿_膜或是帶)可重疊於外殼結構的_部分上(未明 確顯不,但可參照圖8C及8D),且可一致地往所設置的EMI 遮蔽908的表面(或其一部分)的上游方向延伸。 電視或是顯示器裴置實施例 再次參照圖10A、10B及11A及其中所示之平板顯示器 裝置1000 ’ 在將(以橫剖面圖)說明圖11B及11C的用於顯 32 201205434 :裝置的底部及頂部的EHD氣流輕構成,其中該設計的靜 電操作表面職於裝置殼_畴表面。在某輯況中,至 少一個靜鎌作雜為形成在殼體本身咖部絲上。在某 凊況中至^崎電操作部位為形成在覆蓋電子組件(例 如顯示器)的簡輕的絲上。在各情对,藉由將靜電 操作部位軸⑽縣社,EKD流獻驗裝置可裝設於 十分有限的内部空間中。 例如,在平板顯示裝置麵中,橫剖面11B及lie的 、’、《冰度d小於大約1〇mm。回想圖11A的立體圖及其中所示 的頂部及底部EHD氣流裝置,圖11B顯示橫剖面11β,其 中王部的内部深度容設一個底部EHD氣流裝置ι〇ι〇Α ^圖 11C相似地顯示橫剖面11C’其中顯示表面1〇〇1及頂部EHD 氣流裝置1010B皆容設於平板顯示裝置1000的内部深度 中。在所示的底部至頂部的氣流中,頂部EHD氣流裝置 1010B容設於顯示表面1〇〇1後方的空間,且其之靜電操作特 徵部相較於底部EHD氣流裝置1010A的相似特徵部更為密 集封裝。無論如何,個別氣流裝置的設計及操作十分相似。 在EHD氣流裝置1010八的情況中(見圖11B),靜電操作 表面可(至少部分)形成於子組件結構之上。如前所述’外殼 結構(例如部分子組件殼體)可讓收集器電極1192及發射器電 極1191相對於彼此具有固定的相對位置。在此種情況中,介 33 201205434 電表面1193(例如聚亞_膜或是帶)可重疊於外殼結構仙 的一部分上,且可—致地往所設置的EMI遮蔽1109的表面 (或其-部分)的上游方向延伸。或者,儘管並未明確顯示於 圖11B中’平坦的收集器電極1192可形成為或是直接形成 於殼體1109的對向内部表面上。 如此處所述用於平板類型及攜帶類型裝置的特定收集器 電極设計,在平板顯示器1〇〇〇的某些實施例中,導電(例如 金屬)f或是條可固定於大致上非導電性的殼體(或是其之表 面)的内部表面上,並將其接地以形成各收集器電極1192。一 般而Q,可切割導電帶或是條為所欲之形狀及幅度以用於收 集器電極1192。或者,其它覆蓋於接地導電(例如金屬)層或 區域的非導電性(例如介電)層可被蝕刻,或被選擇性地移 除’以暴路出收集器電極1192所欲之形狀及幅度。在某些情 況中’接地的導電層或是部分可為與該殼體11〇9 一體形成。 對於EHD氣流裝置1010B而言(見圖11C),第一收集器 電極實例1192為使用任何所述的方式形成,而第二收集器電 極實例1192為形成於EMI遮蔽11〇8上或形成為其之一部 分,EMI遮蔽11〇8隔絕EHD氣流裝置1010B與顯示表面 励1。儘管於某些實施例中有設置,但為了簡化圖式,因此 省略EHD子組件的外殼結構。如前所述,導電(例如金屬)帶 或是條可固定於EMI遮蔽1108的暴露表面上’並將其接地 34 201205434 以形成第二收集器電極實例1192。亦如前所述,可切割導電 帶或是條為所欲之形狀及幅度以用於收集器電極1192。或 者,其它覆蓋於接地導電(例如金屬)内層或是EMI遮蔽11〇8 區域的非導電性(例如介電)層可被蝕刻,或被選擇性地移 除,以暴露出收集器電極1192所欲之形狀及幅度。 對於EHD氣流裝置1010A及EHD氣流裝置1010B而 - 吕,個別的收集器電極1192及發射器電極1191實例耦接於 咼壓電源兩端之間(儘管未明確顯示,但可參照圖4之說明), 以產生電場及(如同所述之電暈放電類型的實施例)離子,其 可以大致上如所示般的向上游方向驅動氣流。在某些實施例 中,如前述的平板類型及攜帶類型的設計,發射器電極實例 1191婦於高壓電源(所1者為+3 5κν,實際上可使用任何 關於叹计遥擇的電壓波形〉的正極端,而收集器電極實叫11 % 耦接於近端接地端。EHD氣流裝置1〇隐及1〇·的操作 可參照圖4所述。 35 1 如收集器電極,對向的介電表面1193為形成於EMI遮 . ^測或是殼體聽的暴絲面上或形成為其之一部分。 此等介電表面為靜電操作性的,且有助於在個別勵氣流襄 置中塑形場,同時亦阻止離子向上游移動。特別而言,於咖 氣流裝置麵A及1010B的操作期間中,個別的介電表面 U93累積電荷(例如從電暈放電_的發射器電極簡實例 201205434 所形成的正離子)。耻,介絲面1193靜地作為離子 /向上游移動雜障’且胃於靜紐地舰其雌地的吸引路 仅例如设體11〇9本身或是(特別是在咖氣流裝置 的情況中)顯示器聰部位,或是其他未明確顯示的電子元 牛乂此方式個別的介電表面⑽可塑形脈^氣流裝置 1010A及1010B所建立的電場為主要朝向下游方向(圖nA 及11B的上方)’以朝向個別的收集器電極⑽。 亦可叹置額外的離子移動阻障。例如,在圖仙及 中額外的離子斥拒阻障1195作為介電網、格、格桃或是其 ^跨越EHD驅動的流體的上游橫剖面的透氣幕。如前所述, P导壁1195累積電荷(在電暈放電類型的發射器電極1191或是 其他處產生的正離子),且操作為離子向上游移動的靜電阻 障。在所福構成巾’設置接地的導電路徑1194以捕獲向上 游移動超過障壁1195的離子。 儘管可用的内部空間及容忍度大致上為取決於實用及設 °十,應月b攸此處之圖及說明清楚了解,消費性電子裝置可容 忍其之總厚度d的5 mm或是更少用於EHD氣流裝置1()i〇B 及 1010A。 在所示構成中,提供從平板顯示器1〇〇1的底部進入 (1002)並在頂部排出(1〇〇3)的單向氣流,且定位氣流裝 置以驅動熱轉移鰭板112〇的上游位置的氣流,熱轉移鰭板 36 201205434 ⑽係她接於照明源(LED光源115〇)陣列的延長邊緣 led光源⑽產生將從殼體則9排㈣熱量的—大部八 儘管此種_及雜可將EHD氣流灯1G1GB崎於深刀声° 益趨緊縮的顯示器腿中,其容許將減少臭氧的材料(: 減少臭氧_職是反舰磐)放置於驗裝置的下游表 面上,例如熱轉移韓板m〇本身(或是散熱器、咖光源组 件等)’其之發熱表面易於增加減少臭氧的效能。 、 其他實施例 儘管參照了例示性實施例而於此說明EHD裝置之技術 及實例’但熟知本技藝者當可知,可在魏離後附之申請專 利範圍之内,對其進行元件的等效變更及取代。此外,在不 脫離主要範圍之内’可為了適用於技術的特定情況或是材料 而進行修改。此外,在不脫離主要範圍之内,可為了適用於 技術的特定情況或是材料而進行修改。因此,於此所揭示之 特定的實施例、應用例及技術(其中有些是用於最佳實施例者) 並非用於限制後附申請專利範圍。 37 201205434 【圖式簡單說明】 熟知本技藝者.由參照_喊佳地了解本發明及其之 各目標、特徵及優點。附圖並不八 明音,w μ A 紐例f7F ’重點在於說 明貫細例之結構及製造原理。 圖1A為說明性的平板類費性電子裝置的立體圖,盆中, 根據本發㈣些實_,EH_裝置触置厚度通常小㈣ 刪’其包含實質覆蓋整體主要表面_示表面的厚度。 圖1B繪示EHD觀驗織轉純卿子崎(大致 於圖1A贼置的内部蝴的說雜的通風佈局及配置。〜 說明性EHD通風氣流 圖1C繪示相對於個別電子組件的另一 裝置的通風佈局及配置。 亦為根據本發明之某些實施例的說明性的平板型消費 陡電子裝置社體圖’其中㈣氣流裝置触置厚度通常小於1〇 麵其包含實質覆蓋整體主要表面的顯示表面的厚度。 、圖氣流裝置相對於侧電子赠(大致上是對應 '' Α的裳置的内部空間)的說明性的循環氣流佈局及配置。 圖2C!會不—變型,其中氣流佈局包含循環流動的成分及經 由通風邊緣進岭置的氣流。 38 201205434 圖3、5、6繪示褽置構造的橫剖面圖,其中Effl)氣流裝置的 靜電操作部娜成於裝置殼體及/«子崎的電磁干擾(EMI) 遮蔽的個別表面上。圖5及叫示說明性的橫剖關,其中顯示 表面為包含膽氣流裝置的裝置堆疊的—部分。圖6繪示說明性 的知面圖,其中收集器電極表面為形成於印刷電路板的金屬 上。 圖4緣示說明性的高壓電源構造,其中供給能量予發射器電 極及收集器電極以驅動流體流動。 圖7A為說明性的攜帶型消費性電子裝置的立體圖,其中, 根據本發明的某些實麵,㈣驗裝置容設於大約少於1〇咖 的總厚度巾。® 7B及ΤΌ繪示(大虹是分麟應於圖7A的攜帶 型裝置的平面圖及底部部分)的說雜元件之間的位題係及通 風氣流。11 7C顯示說明性的腦氣流裝置的内部圖,圖7β顯示 上表面圖’其中鍵盤(及其下方之電子組件)至少部分覆蓋娜氣 流裝置。 圖8A及8C顯示裂置構成的說明性橫剖面圖,其中EHD氣流 裝置的純獅表面形成於裝置殼體及/或電子組件下層的電磁 干擾(EMI)遮蔽的個別表面上。在某些實施例中,圖从大致上對 應於圖7B及7C所示的横剖面圖。圖8β顯示圖8A之膽氣流裝 置的靜電域透氣表面的部分内部圖。圖8G顯示替換性的橫剖 面圖,其巾EHD氣流裝置的子組件的外殼結構能獅收集器及發 39 201205434 射器電極相對於彼此的位置為固定,且射靜電操作表面其卜 者的至少一部分形成於外殼結構之上。 圖9A及9B顯示進一步的裝置構成的說明性橫剖面圖,其中 讎氣流裝置的對向的靜電操作部位形成於個別電子組件之下 (或是之上)的電磁干涉㈣)遮蔽的個別表面上。在某些實施例 中’圖9A及9B相#於電路板類型的電子組件為包含哪氣流裝 置的裝置堆疊其中一部分的變型。 圖10 A及1 〇 B為δ兒明性的平板顯示器類型的消費性電子裝置 的側視圖及立體圖,苴中,鉬诚士^ π U根據本發明之某些實施例,EHD氣流 裝置容設於通常小於1〇 mm的触置深度中。 示器類型裝置)的奘罟分彼4 BB,.. 圖HA為顯示(大致上是分卿應於圖皿請的平板Conditions, in the test into the test 'Figure 9 eight and pocket display suitable description of the design variant, where (0 keyboard component 74G; (9) coffee airflow device 9 (8) (four) double-sided pcB 7 called with a fixed integrated circuit (microprocessor service, memory The body mooring, shot 201205434 765, connector 766) can be housed in the stack and volume of the device at least partially enclosed by the housing 909. Although the available internal space and tolerance are generally dependent on utility and design 'should be able to It is clear from the drawings and description that the consumer electronic device can tolerate 5 mm or less of its total thickness d for the EHD airflow device 910. In some embodiments (e.g., as shown in Figure 9A), thermal transfer The fins 920 can be sized to accommodate a limited thickness. In some embodiments (as shown in Figure 9B), the airflow path can mount a larger heat transfer fin 920. In each case Forming the electrostatically-operated surface as the collector electrode 792 and/or the dielectric surface 793 on the aforementioned surface, the EHD airflow device 91 can be included in a very limited internal space, as shown in Figures 9 and 93, respectively. As mentioned before, even though The layout is omitted here, and the outer casing structure (e.g., a portion of the subassembly housing) can position the collector electrode 792 and the emitter electrode 791 relative to each other. In this case, the dielectric surface 793 (e.g., The poly-branched film or tape can be overlaid on the _ portion of the outer casing structure (not explicitly shown, but can be seen in Figures 8C and 8D), and can consistently face the surface of the EMI shielding 908 (or part thereof) The upstream direction extends. TV or display device embodiment Referring again to FIGS. 10A, 10B and 11A and the flat panel display device 1000' shown therein, the display for FIGS. 11B and 11C will be explained (in cross-sectional view). 201205434: The EHD airflow at the bottom and top of the device is lightly constructed, wherein the electrostatically operated surface of the design is applied to the surface of the device shell. In a certain case, at least one static mess is formed on the wire of the shell itself. In a certain situation, the operation part of the saki electric power is formed on a simple light wire covering an electronic component (for example, a display). In each case, the EKD flow evaluation device is provided by the electrostatic operation part shaft (10) Can be installed in a very limited internal space For example, in the face of the flat panel display device, the cross section 11B and the lie', 'the ice degree d is less than about 1 mm. Recall the perspective view of Fig. 11A and the top and bottom EHD airflow devices shown in Fig. 11B. Cross section 11β, wherein the inner depth of the king accommodates a bottom EHD airflow device ι〇ι〇Α ^ Figure 11C similarly shows the cross section 11C' where the display surface 1〇〇1 and the top EHD airflow device 1010B are accommodated in the flat plate In the internal depth of the display device 1000. In the bottom-to-top airflow shown, the top EHD airflow device 1010B is accommodated in the space behind the display surface 〇〇1, and its electrostatic operating features are compared to the bottom EHD airflow. Similar features of device 1010A are more densely packed. In any case, the design and operation of individual airflow devices are very similar. In the case of the EHD airflow device 1010 (see Figure 11B), the electrostatically operated surface can be formed (at least partially) over the subassembly structure. As previously described, the outer casing structure (e.g., a portion of the subassembly housing) allows the collector electrode 1192 and the emitter electrode 1191 to have a fixed relative position relative to each other. In this case, the dielectric surface 1193 (eg, poly film or tape) may overlap the portion of the outer casing structure and may be placed toward the surface of the EMI shielding 1109 (or - Partial) extends in the upstream direction. Alternatively, although the flat collector electrode 1192, which is not explicitly shown in Fig. 11B, may be formed or formed directly on the opposing inner surface of the housing 1109. In certain embodiments of the flat panel display 1A, a conductive (eg, metal) f or strip may be fixed to be substantially non-conductive, as described herein for a particular collector electrode design for a flat panel type and portable type device. The inner surface of the housing (or its surface) is grounded and grounded to form each collector electrode 1192. Typically, Q, the conductive strip or strip can be cut to the desired shape and amplitude for the collector electrode 1192. Alternatively, other non-conductive (e.g., dielectric) layers overlying a grounded conductive (e.g., metal) layer or region may be etched or selectively removed to explode the desired shape and amplitude of the collector electrode 1192. . In some cases, the grounded conductive layer or portion may be integrally formed with the housing 11〇9. For EHD airflow device 1010B (see Figure 11C), first collector electrode instance 1192 is formed using any of the described methods, while second collector electrode instance 1192 is formed on or formed on EMI shield 11〇8 In part, the EMI shields 11〇8 to isolate the EHD airflow device 1010B from the display surface. Although provided in some embodiments, the housing structure of the EHD subassembly is omitted in order to simplify the drawing. As previously mentioned, a conductive (e.g., metal) strip or strip can be attached to the exposed surface of the EMI shield 1108 and grounded 34 201205434 to form a second collector electrode instance 1192. As also previously described, the conductive strip or strip can be cut to the desired shape and amplitude for the collector electrode 1192. Alternatively, other non-conductive (eg, dielectric) layers overlying the grounded conductive (eg, metal) inner layer or EMI shield 11〇8 region may be etched or selectively removed to expose the collector electrode 1192. The shape and extent of desire. For the EHD airflow device 1010A and the EHD airflow device 1010B, an example of the individual collector electrode 1192 and the transmitter electrode 1191 are coupled between the two ends of the voltage source (although not explicitly shown, reference may be made to FIG. 4) To generate an electric field and (as in the embodiment of the corona discharge type described) ions, which can drive the gas flow in an upstream direction substantially as shown. In some embodiments, the transmitter electrode example 1191 is a high voltage power supply (one of which is +3 5 κν, which can actually use any voltage waveform regarding the remote selection), as in the aforementioned flat type and carry type design. The positive terminal, and the collector electrode is 11% coupled to the proximal ground. The operation of the EHD airflow device 1 can be as described in Figure 4. 35 1 As the collector electrode, the opposite interface The electrical surface 1193 is formed on or formed as part of the EMI mask or the exposed surface of the housing. These dielectric surfaces are electrostatically operable and contribute to the individual excitation airflow. The shaping field also prevents ions from moving upstream. In particular, during operation of the coffee flow device faces A and 1010B, the individual dielectric surfaces U93 accumulate charge (eg, a simple example of a transmitter electrode from corona discharge) 201205434 Formed positive ions). Shame, meso-surface 1193 statically acts as an ion/moving upstream obstacles' and the suction path of the stomach to the female ground is only for example the body 11〇9 itself or (special In the case of the coffee airflow device) Or other electronic yokes not explicitly shown. The individual dielectric surfaces (10) of the moldable gas flow devices 1010A and 1010B are mainly oriented in the downstream direction (above nA and 11B) to face individual Collector electrode (10). It is also possible to slap additional ion movement barriers. For example, in Figure 1 and the additional ion repellent barrier 1195 as a dielectric grid, grid, peach or its cross-EHD driven fluid The gas permeable screen of the upstream cross section. As described above, the P guide wall 1195 accumulates electric charges (positive ions generated at the corona discharge type emitter electrode 1191 or elsewhere), and operates as a static resistance barrier in which ions move upstream. A grounded conductive path 1194 is provided to capture the ions that move upstream beyond the barrier 1195. Although the available internal space and tolerance are substantially dependent on the utility and the setting ten, the month should be It is clearly understood that the consumer electronic device can tolerate 5 mm or less of the total thickness d of the EHD airflow device 1() i〇B and 1010A. In the configuration shown, it is provided from the flat panel display 1〇 〇1 The bottom enters (1002) and discharges (1〇〇3) of unidirectional airflow at the top, and the airflow device is positioned to drive the airflow upstream of the heat transfer fin 112〇, and the heat transfer fin 36 201205434 (10) is connected to the illumination. The source (LED source 115〇) array of extended edge led light source (10) will generate 9 (four) heat from the housing - most of the eight, although this kind of _ and miscellaneous can make the EHD airflow lamp 1G1GB slow down the sound of the knife In the display leg, it allows the ozone-reducing material (the ozone-reducing ozone to be anti-ship) to be placed on the downstream surface of the inspection device, such as the heat transfer Korean plate itself (or the heat sink, the coffee light source component, etc.) ) 'Thermal surface is easy to increase the effectiveness of ozone reduction. Other Embodiments Although the technology and examples of the EHD device are described herein with reference to the exemplary embodiments, it will be understood by those skilled in the art that the equivalents of the components can be made within the scope of the appended claims. Change and replace. In addition, modifications may be made in order to adapt to a particular situation or material of the technology without departing from the scope of the invention. In addition, modifications may be made to suit a particular situation or material of the technology, without departing from the scope of the invention. Therefore, the specific embodiments, applications, and techniques disclosed herein, some of which are used in the preferred embodiments are not intended to limit the scope of the appended claims. 37 201205434 [Simplified description of the drawings] Those skilled in the art are familiar with the present invention and its various objects, features and advantages. The figure is not eight-tone, w μ A Newton f7F ’ focuses on the structure and manufacturing principles of the detailed example. 1A is a perspective view of an illustrative tablet-type electronic device. In the basin, according to the present invention, the EH_device touch thickness is generally small (four) deleted, which includes a thickness substantially covering the entire major surface-display surface. Figure 1B shows the EHD inspection and weaving of pure Qingzizi (approximately the ventilation layout and configuration of the inner butterfly of Figure 1A.) Illustrative EHD ventilation airflow Figure 1C depicts another relative to individual electronic components. Ventilation layout and configuration of the device. Also an illustrative tablet-type consumer steep electronic device body diagram according to some embodiments of the present invention, wherein (4) the airflow device is typically less than 1 inch in thickness, and includes substantially covering the entire major surface. The thickness of the display surface. The illustrated airflow device is arranged with respect to the side electrons (substantially corresponding to the internal space of the ''Α 裳 ) ) 的 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 图 图The layout includes circulating components and airflow through the venting edge. 38 201205434 Figures 3, 5 and 6 illustrate cross-sectional views of the raft structure, wherein the Effl) airflow device is electrostatically operated in the device housing and /«Zizaki's electromagnetic interference (EMI) is masked on individual surfaces. Figure 5 is a schematic cross-sectional view in which the display surface is a portion of the stack of devices containing the bile gas flow device. Figure 6 depicts an illustrative cross-sectional view in which the collector electrode surface is formed on a metal of a printed circuit board. Figure 4 illustrates an illustrative high voltage power supply configuration in which energy is supplied to the emitter electrode and collector electrodes to drive fluid flow. Figure 7A is a perspective view of an illustrative portable consumer electronic device in which, in accordance with certain aspects of the present invention, the (four) inspection device is housed in a total thickness of less than one coffee. ® 7B and ΤΌ ( (Dahong is the plan and bottom part of the portable device of Figure 7A). 11 7C shows an internal view of an illustrative brain flow device, and Fig. 7β shows an upper surface view where the keyboard (and the electronic components below it) at least partially cover the gas flow device. Figures 8A and 8C show illustrative cross-sectional views of the split configuration in which the pure lion surface of the EHD airflow device is formed on individual surfaces of electromagnetic interference (EMI) shielding of the device housing and/or underlying electronic components. In some embodiments, the figures generally correspond to the cross-sectional views shown in Figures 7B and 7C. Figure 8 is a partial internal view of the electrostatically permeable surface of the bladder flow device of Figure 8A. Figure 8G shows an alternative cross-sectional view of the sub-assembly of the sub-assembly of the EHD airflow device with the position of the lion collector and the hairpin relative to each other, and the electrostatically-operated surface of the device is at least A portion is formed over the outer casing structure. Figures 9A and 9B show an illustrative cross-sectional view of a further device configuration in which opposing electrostatically operated portions of the helium gas flow device are formed on individual surfaces that are shielded from electromagnetic interference (4) below (or above) individual electronic components. . In some embodiments, the electronic components of the circuit board type of Figures 9A and 9B are variations of a portion of the device stack including which airflow means. 10A and 1B are side and perspective views of a delta-display flat panel display type of consumer electronic device, in which a molybdenum device is provided in accordance with certain embodiments of the present invention. In a touch depth of typically less than 1 〇 mm. The display type device) is divided into 4 BB, .. Figure HA is displayed (substantially the division should be in the plate of the plate)

…nrp衣囬欣方 蓋顯示器的電磁干擾_遮蔽的個別表面之上。 »尖貝至装置的說明性橫剖面圖, 邮TF衣囬艰欣於裝置殼體及覆...nrp clothing back to the side of the cover electromagnetic interference _ shielded on the individual surface. » Illustrated cross-sectional view of the cusp to the device, mail TF clothing back to the device shell and cover

201205434 【主要元件符號說明】 100平板型消費性電子裝置 101顯示表面 102氣流 110 EHD氣流裝置 120熱轉移表面 130電子組件 140電子組件 151 進口 152 出口 200平板型消費性電子裝置 202循環氣流 202A循環氣流 210 EHD氣流裝置 230電子組件 240電子組件 251排氣邊緣 301顯示器 307熱缓衝 308 EMI遮蔽 309殼體 310 EHD氣流裝置 320熱轉移鰭板 201205434 361 雙面PCB 362 積體電路 363 積體電路 364 積體電路 365 散粒 366 連接器 367 電池 391 發射器電極 392 收集器電極 393 介電表面 491 高壓電源(發射器電極) 492 收集器電極 493 介電表面 494 導電路徑 499 流體流動 509 殼體 609 殼體 700 攜帶型消費性電子裝置 701A 本體部位 701B 顯示部位 702 入流 703 出流 42 201205434 710 EHD氣流裝置 720熱轉移表面 730電路板 731 CPU 732圖形單元 740鍵盤組件 751 進口 752 出口 761雙面PCB 762微處理器 763記憶體 765散粒 766連接器 767電池 791發射器電極 792收集器電極 793介電表面 794導電路徑 795離子斥拒阻障 796孔洞 811外殼結構 909殼體 201205434 910 EHD氣流裝置 920熱轉移鰭板 1000平板顯示類型消費性電子裝置 1001顯示表面 1002入流 1003出流 1010 EHD氣流裝置 1010A EHD氣流裝置 1010B EHD氣流裝置 1020熱轉移表面 1109 EMI 遮蔽 1111外殼結構 1150 LED 光源 1191發射器電極 1192收集器電極 1193介電表面 1194導電路徑 1195障壁 44201205434 [Main component symbol description] 100 flat panel type consumer electronic device 101 display surface 102 airflow 110 EHD airflow device 120 thermal transfer surface 130 electronic component 140 electronic component 151 inlet 152 outlet 200 flat panel type consumer electronic device 202 circulating airflow 202A circulating airflow 210 EHD airflow device 230 electronic component 240 electronic component 251 exhaust edge 301 display 307 thermal buffer 308 EMI shielding 309 housing 310 EHD airflow device 320 thermal transfer fin 201205434 361 double-sided PCB 362 integrated circuit 363 integrated circuit 364 product Body circuit 365 Loose 366 Connector 367 Battery 391 Transmitter electrode 392 Collector electrode 393 Dielectric surface 491 High voltage power supply (transmitter electrode) 492 Collector electrode 493 Dielectric surface 494 Conductive path 499 Fluid flow 509 Housing 609 Housing 700 portable consumer electronic device 701A body portion 701B display portion 702 inflow 703 outflow 42 201205434 710 EHD airflow device 720 thermal transfer surface 730 circuit board 731 CPU 732 graphics unit 740 keyboard component 751 import 752 outlet 761 double-sided PCB 762 micro processing 763 memory 76 5 shot 766 connector 767 battery 791 transmitter electrode 792 collector electrode 793 dielectric surface 794 conductive path 795 ion repellent barrier 796 hole 811 shell structure 909 shell 201205434 910 EHD airflow device 920 heat transfer fin 1000 flat panel display Type Consumer Electronics Device 1001 Display Surface 1002 Inflow 1003 Outflow 1010 EHD Airflow Device 1010A EHD Airflow Device 1010B EHD Airflow Device 1020 Thermal Transfer Surface 1109 EMI Masking 1111 Housing Structure 1150 LED Light Source 1191 Transmitter Electrode 1192 Collector Electrode 1193 Dielectric Surface 1194 conductive path 1195 barrier 44

Claims (1)

201205434 七、申請專利範圍: 1. 一種電子裝置,其包含: 一殼體; f少-電子組件,其包括配置於其上之一或多個熱源;及 電流力學(£_!_!!,細轉彳祕 一熱管理系統之-部分; 〜奸裝置之 其中該電流力學驅動器之至少一. 嗖體之一静電刼作部分係形成於該 ㈣表面上,或作為該殼體之-内部表面。 2.=如之㈣置,其具有少於約】〇公厘之—厚度,且 率超過該厚度。 4度Μ至少1〇:】之一比 3·如請求項1之電子裝置 器電極及至少-收集㈣極,料〇'包括至少-發射 括該收集器電極。 〃 &quot;乂一皆電操作部分包 4·如睛求項1之電子裝置 器電極及至小一 W 以電“予驅動器包括至少-發射 括鄰近於鄉射極’其中該至少—靜電操作部分包 佈場塑形部^之該殼體之該内部表面之一介電質塗 45 201205434 5.二:=4之電子裝置’其中該介電質係至少部分以聚亞醯 賴或是經岐的帶_式狀,至切分設置於該内部表 面上或上方。 6.如請求項4之電子裝置,並中兮 紋 八中忒,丨電質防止含臭氧之流體衰 解。 月求項4之電子裝置,其巾勒部表面之該介電質塗佈場 ^分向該發射器電極之上游延伸約三個發射器電極至收 集裔電極之長度。 8.如請求们之電子裝置,其進_步包含: 覆蓋至少一 該電流力學驅動哭之一筮_ 動°。之第一靜電操作部分,其 邛分之該電子組件。 9·如ό月求項1之電子 定義經輕細提供能量電子組件之經覆蓋之該部分 供應器。 '電流力學驅動器之-高顏電源 電路板及. 10.如請求項丨之電子 m ^ ^中該電子組件包括一 顯不裳置之1多者。 201205434 u.如請求項1之電子裝置,其中該熱源包括下列之一或多者: —處理器; —射頻(RF)或光學收發器;及 用於一顯示裝置之若干照明來源。 ’ 12. 如請求項1之電子裝置’其中該殼體係實質密封的,以使得 由該電流力學驅動器驅動之流體流被實質包含於該殼體内。 13. 如請求項1之電子裝置,其中該殼體允許至少一些流體流通 過其内之一内部體積及該外部之間的一邊緣。 14·如請求項13之電子裝置,其中通過該電流力學驅動器之流體 之流量以至少為二之一比率而超過通過該邊緣者。 15·如請求項13之電子裝置,其中該殼體包括該邊緣之一或多個 排氣部分,由電流力學驅動器驅動之該流體流之該一實質整 體透過該排氣部分而被允許進入且排出。 如請求項1之電子裝置,其中該熱源係以約3公厘内之距離 密切接近該殼體之一内部表面,該熱管理系統可操作以將在 熱源處散發出之熱散播於該内部表面之一實質部分。 47 201205434 π.如請求項1之電子裝置,其經組態為以下之一或多者: 一手持行動電話或個人數位助理; 一膝上型電腦、筆記型電腦或平板型電腦;及 一數位閱讀器、媒體播放器或遊戲裝置。 18.如請求項1之電子裝置,其經組態為以下之-或多者: 一顯示面板;及 ' 一電視。 19. 一種電子裝置,其包含: 至少一電子組件,其包括—或多個配置於其上之 導電材料之一電磁干涉(ΕΜΙ)遮蔽;及 ’、 力學鶴器,其經域㈣作為該電子裝置之一熱 β理系統之一部分; :、:將及電流力學驅魅電流力學驅動器之至少—靜電操 作部分形成為該殼體之—内部表面或形成於該電磁干涉一 之—表面上 其中該電磁干涉遮蔽至少部分覆爹 2〇.如請求項19之電子裝置, 該電子組件之一部分。 21.如請求項20 之电子裝置,其中經覆蓋之該電子組件之該鄯分 4S 201205434 合懈罐纖力學陶之—綱電源 供應益之至少—部分。 及如請求項19之電子裝置,其中該電子組件之-或多個導電平 面或引線提供該電磁干涉遮蔽。 23.如睛求項】9 之電子裝置,其具有少於約10公厘之一厚度, ”有—或多個橫向維度之铜,該維度以至少10 :1 比率超過該厚度。 之一 24.如睛求項19夕·费μ. 電子裝置,該電流力學驅動器包括 器電極及至小 W^ 汉至乂一收集器電極,其中該至少一 括該收集器電極。 至少一發射 靜電操作部分包 質塗佈場塑形部分 電磁干涉遮蔽之該表面之一介電 26.如請求項25 體之衰解。 之電子襄置’其巾該介電餘佈防止含臭氧之流 49 201205434 27.如請求項19之電子裝置,財該電子組件包括〆電路板及一 顯示裝置之一或多者 汉如請求項19之電子裝置,其中該熱源包括下列f或多者: 一處理器; 一射頻(RF)或光學收發器;及 用於—顯示裝置之若干照明來源。 29. 如請求項19之電子裝置,其進一步包含; 一貫質密封的殼體,使得由該電流力學驅動器驅動之流體 流被實質包含於該殼體内。 30. 如請求項19之電子裝置,一殼體允許至少一些流體流通過其 内之一内部體積及該外部之間的一邊緣。 31. 如味求項3〇之電子裝置’其中通過該電流力學驅動器之流體 之流量以至少為二之一比率而超過通過該邊緣者。 32·如請求項3〇之電子裝置,其中該殼體包括該邊緣之—或多個 排氣部分,由電流力學驅動器驅動之該流體流之該一實質整 體透過該排氣部分而被允許進入且排出。 50 201205434 33.如請求項19之電子製置,其進一步包含: 一殼體; 轉αχ約3公厘内之距離密切接近該殼體之一内 部表面’該齡理系統可操作崎在熱源處散發itj之熱散播 於該内部表面之-實質部分。 34.如請求項19之電子裝置,其進—步包含: -殼體; 其中該電流力學驅 為該殼體之一内部表 動器之至少-其他靜電操作部分係形成 面或形成於該殼體之一内部表面上。 35.如胡求項19之電子裝置, 衣直该電磁干涉遮敝亦定義 狡中從該熱源至埶韓蒋矣^ 仕仙·動路 .、、、轉移表面之-熱傳導路徑的 當§亥電流力學驅動^ 。士+ σ刀’ 又供稱,流體流沿該 電流力學卿n驅動。 而破該 36.,種電子裝置,其包含: -顯不益、至少一雷牧4c 丁 10公 夕電路板、一電流力學驅動 其相互層疊蝴電子裝置之—總厚賴為^咸體 Μ ; 、、”勺 該電流力學驅動器經組態後係作為該電子裝 系統之-部分且包括對向之平面介電表面, 置之― 熱管理 ‘發射器電 201205434 单而入或夕做^電極;該發射料極置放於該等對向之 速離L電ΪΓ之間ί接近於該收集器電極,以在受供能時加 古h π亥收集為電極’且藉此驅動該電子裝置内之流體 流, 其中該等對向介電表面一. 杨之卜夕-^ 之者至少部分形成為該電路 上之-電磁干涉遮蔽之—表面或形成於該電路板之 一電磁干涉遮蔽之一表面上。 37. 如請求項36之電子灯,其中該魏絲電極之數量至 -’邊等收集器電極之—第—者形成為該_板之一曝露之 金屬化層或形成於該電路板之—曝露之金屬化層上。 38. 如請求項37之電子裝置,該等收錢電極之—第二者形 該殼體之-内部表面或形成於該殼體之一内部表面上。 39.如請求項36之電子裝置,其中該一或多個收集器電極形成為 該殼體之一内部表面或形成於該殼體之一内部表面上。 4〇.如請求項36之電子裝置,其中該電磁干涉遮蔽之至少一部分 形成於該電路板之一介電質塗佈金屬化層。 41.如請求項36之電子裝置,其進一步包含: 52 201205434 -熱轉移路從’其在-流動路#中由配置於該電路板上之 -或多個熱源至熱轉移表面,該電流力學_器當受供能時 沿著該流動路徑驅動流體流。 42.如請求項4丨之電子裝置’豸電磁干涉減提供該熱轉移路徑 之至少一部分。 43. 如請賴36之電子裝置,其巾雜祕以約3公助之距離 ==:内部表面’該熱管理系統可操作以將在 之熱散播於該内部表面之一實質部分。 44. 如請求I員36 y 使得由讀^1子裝置’射該殼體實質㈣該電子裝置, 内。〜力學驅_驅動之流被實質包含於該殼體 45.如請求;% μ 過其内之電子褒置’其中該殼體允許至少-些流體流通 〜内部體積及該外部之間的一邊緣 46.如請求I員μ 以至少為 之流量Μ 子歧,財通過該電流力學.轉器之流體 之比率而超過通過該邊緣者。 47.如請求喝45 之電子裝置,其中該殼體包括該邊緣之一或多個 53 201205434 排乳部分’由電流力學驅動II驅動之誠體流之該-實質整 體透過該排氣部分^被允許進人且排出。 48. 如請求項36之電子裝置,其經組態為以下之—或多者: 手持彳于動電話或個人數位助理; 一膝上型電腦、筆記型電腦或平板型電腦;及 一數位閱讀器、媒體播放器或遊戲裝置。 49. 如請求項36之電子裝置,其經組態為以下之—或多者: 一顯示面板;及 一電視。 50. 如請求項36之電子褒置,其中該殼體之該電路板及一内部表 面兩者之-或兩者的至少-部分㈣魏⑽舰之 塗層塗佈。 ' 儿如請柄之電子錢,其情錄細紐之該保護塗層 塗佈包括四氟乙烯之一氟聚合物,例如一鐵氟隆@(^打⑽@) 材料。 52.如請求項36之電子裳置,射該殼體之該電路板及一内部表 面兩者之-或兩者的至少-部分細—缝催化賊反應性 54 201205434 材料塗佈。201205434 VII. Patent Application Range: 1. An electronic device comprising: a housing; f-less electronic components including one or more heat sources disposed thereon; and current mechanics (£_!_!!, a part of the electromechanical actuator, wherein at least one of the electrokinetic actuators is formed on the surface of the (four) or as the interior of the housing 2. = as in (4), which has a thickness less than about 〇 〇 mm, and the rate exceeds the thickness. 4 degrees Μ at least 1 〇: one of the ratios of 3. The electronic device of claim 1 The electrode and the at least-collecting (four) pole, the material 〇 'includes at least - the emitter of the collector electrode. 〃 &quot; 乂 电 电 电 电 电 · · · · · · · · · · · · · · · 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子The pre-driver includes at least one of a dielectric coating of the inner surface of the housing adjacent to the at least one of the at least one of the electrostatically-operated portions of the package field. 201205434 5. Two:=4 An electronic device in which the dielectric system is at least partially The strip is placed on or above the inner surface. 6. The electronic device of claim 4, and the medium-sized scorpion, the antimony to prevent the ozone-containing fluid from decaying. In the electronic device of 4, the dielectric coating field on the surface of the towel portion extends from the upstream of the emitter electrode by about three emitter electrodes to the length of the collector electrode. 8. As requested by the electronic device, The step _ includes: covering at least one of the current mechanics driving crying 动 动. The first electrostatic operating part, which is divided into the electronic component. 9·If the electronic definition of the month 1 is light Providing the portion of the supply of the energy electronic component covered. 'Current mechanics drive - Gaoyan power supply circuit board and. 10. If the electronic item of the request item is m ^ ^, the electronic component includes a display of more than one The electronic device of claim 1, wherein the heat source comprises one or more of: - a processor; - a radio frequency (RF) or optical transceiver; and a plurality of illumination sources for a display device. 12. Electronic equipment as claimed in item 1 Wherein the housing is substantially sealed such that fluid flow driven by the electromechanical actuator is substantially contained within the housing. 13. The electronic device of claim 1 wherein the housing allows at least some fluid flow therethrough An internal device and an edge between the outer portion. The electronic device of claim 13, wherein the flow rate of the fluid passing through the current mechanical actuator exceeds the edge passing through the edge at a ratio of at least two. The electronic device of claim 13, wherein the housing includes one or more exhaust portions of the edge, the substantially integral of the fluid flow driven by the electromechanical actuator being allowed to enter and exit through the exhaust portion. The electronic device of claim 1, wherein the heat source is in close proximity to an inner surface of the housing within a distance of about 3 mm, the thermal management system being operable to spread heat radiated at the heat source to the inner surface One of the essential parts. 47 201205434 π. The electronic device of claim 1, configured to be one or more of: a handheld mobile phone or a personal digital assistant; a laptop, a notebook or a tablet; and a digital Reader, media player or game device. 18. The electronic device of claim 1 configured to: - or a plurality of: a display panel; and 'a television. 19. An electronic device comprising: at least one electronic component comprising - or one of a plurality of conductive materials disposed thereon, electromagnetic interference (ΕΜΙ) shielding; and ', a mechanical crane, the domain (4) as the electron One of the thermal beta systems of the device; :, and at least the electrostatically operated portion of the current mechanics drive current mechanical actuator is formed as an internal surface of the housing or formed on the surface of the electromagnetic interference - Electromagnetic interference obscures at least a portion of the electronic device, such as the electronic device of claim 19, a portion of the electronic component. 21. The electronic device of claim 20, wherein the portion of the electronic component that is covered is at least - part of the power supply. The electronic device of claim 19, wherein the electronic component or the plurality of conductive planes or leads provide the electromagnetic interference mask. 23. The electronic device of claim 9 having a thickness of less than about 10 mm, "having" or a plurality of transverse dimensions of copper, the dimension exceeding the thickness by a ratio of at least 10:1. In the electronic device, the current mechanics driver includes a device electrode and a collector electrode, wherein the collector electrode is at least one of the collector electrodes. Coating the field shaping part of the electromagnetic interference shielding of one of the surfaces of the dielectric 26. The failure of the body of claim 25. The electronic device 'the towel' of the dielectric residual cloth prevents the flow of ozone 49 201205434 27. The electronic device of claim 19, wherein the electronic component comprises one or more of a display device and a display device, wherein the heat source comprises the following f or more: a processor; a radio frequency (RF) Or an optical transceiver; and a plurality of illumination sources for the display device. 29. The electronic device of claim 19, further comprising: a substantially sealed housing such that fluid flow driven by the electromechanical actuator is The material is contained within the housing. 30. The electronic device of claim 19, wherein the housing allows at least some of the fluid to flow through an inner volume of the interior and an edge between the outer portion. The electronic device 'where the flow rate of the fluid passing through the current mechanical actuator exceeds the edge through at least one of the ratios. 32. The electronic device of claim 3, wherein the housing includes the edge - or more The exhaust portion, the substantially entirely of the fluid flow driven by the electromechanical actuator, is allowed to enter and exit through the exhaust portion. 50 201205434 33. The electronic device of claim 19, further comprising: a shell The distance of the α χ about 3 mm is close to the inner surface of one of the shells. The age system can operate the heat of the itj at the heat source to spread on the inner surface - the substantial part. The electronic device of 19, further comprising: - a housing; wherein the electromechanical drive is at least one of an internal surface actuator of the housing - the other electrostatically operated portion is formed or formed on the housing On the inner surface. 35. If the electronic device of the item 19 is used, the electromagnetic interference concealer is also defined as the heat conduction path from the heat source to the 埶韩蒋矣^ 仕仙·动路.,,, transfer surface When § Hai current mechanics drive ^. 士 + σ knife' is also said to be, the fluid flow is driven along the current mechanics. And break the 36., an electronic device, which contains: - not beneficial, at least one Leimu 4c Ding 10 Gongxi circuit board, a current mechanics driving the mutual stacking of the butterfly electronic device - the total thickness is ^ salty body; ,, "spoon the current mechanics drive is configured as part of the electronic assembly system And including the opposite planar dielectric surface, the "thermal management" transmitter electric 201205434 single-in or the evening to do ^ electrode; the emitter is placed in the opposite direction of the speed between the L electric ί close The collector electrode is used as an electrode when the energy is supplied, and the fluid flow in the electronic device is driven, wherein the opposite dielectric surface is one. At least partially formed on the circuit - electromagnetic interference shielding The surface is formed on one of the surfaces of the electromagnetic interference shield of the circuit board. 37. The electronic lamp of claim 36, wherein the number of the wire electrodes to the collector edge of the -' edge is formed as a metallized layer of one of the plates or formed on the circuit board - On the exposed metallization layer. 38. The electronic device of claim 37, wherein the second of the collection electrodes is formed on an inner surface of the housing or formed on an inner surface of the housing. 39. The electronic device of claim 36, wherein the one or more collector electrodes are formed as an interior surface of the housing or formed on an interior surface of the housing. The electronic device of claim 36, wherein at least a portion of the electromagnetic interference mask is formed on a dielectric coated metallization layer of the circuit board. 41. The electronic device of claim 36, further comprising: 52 201205434 - the thermal transfer path from the 'in-flow path# by the heat source disposed on the circuit board or the plurality of heat sources to the heat transfer surface, the current mechanics The _ device drives the fluid flow along the flow path when energized. 42. The electronic device of claim 4, 豸 electromagnetic interference minus providing at least a portion of the heat transfer path. 43. If the electronic device of the Lai 36 is used, the towel is separated by a distance of about 3 gongs ==: internal surface' The thermal management system is operable to spread the heat there to a substantial portion of the interior surface. 44. If the requester I member 36 y is caused by the reading of the sub-device, the housing is substantially (four) within the electronic device. The flow of the mechanical drive _ drive is substantially contained in the housing 45. As requested; % μ is placed inside the electronic device 'where the housing allows at least some of the fluid to circulate ~ an internal volume and an edge between the outer 46. If the requester I is asked to pass at least the flow rate, the ratio of the fluid passing through the current mechanics. 47. An electronic device as claimed in claim 45, wherein the housing includes one or more of the edges 53 201205434 The milk discharge portion 'the body flow driven by the electromechanical drive II - substantially through the exhaust portion Allow entry and discharge. 48. The electronic device of claim 36, configured to: - or a plurality of: a handheld telephone or a personal digital assistant; a laptop, a notebook or a tablet; and a digital reading , media player or game device. 49. The electronic device of claim 36, configured to - or more of: a display panel; and a television. 50. The electronic device of claim 36, wherein at least a portion of the circuit board and an internal surface of the housing or both are coated with a coating of the (10) Wei (10) ship. The child's electronic money, such as the handle of the protective coating, includes a fluoropolymer of tetrafluoroethylene, such as a Teflon@(^打(10)@) material. 52. The electronic skirt of claim 36, wherein at least a portion of the circuit board and an internal surface of the housing, or both, are spliced to catalyze thief reactivity 54 201205434 material coating.
TW100116777A 2010-05-26 2011-05-12 Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices TW201205434A (en)

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