201204188 發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及柔性電路板技術領域，特別涉及一種具有補 強片之柔性電路板及其製作方法。 [0002] [先前技術3 隨著折疊手機與滑蓋手機等可折疊數位產品之不斷發展 ，具有輕、薄、短、小以及可彎折特點之軟性印刷電路 板（Flexible Printed Circuit B〇ard，FpcB)被廣 泛應用於數位產品中，,χ實現不同電路間之電性連接。、 為獲得具有更好撓浙性能谢CB，改善_〇所用基膜材 I 料之撓折性能成為研究熱點。請參見文獻…咖⑻ Insulation Maganize, v〇lume 5, Issue 1, ^•攸 198”一:15_23，“Appllcati〇ns PolyUide Films t〇 加_ Electronic Industries in 。 [0003] 為滿足可折疊數位產品多功能化之設計需求，安袋於 FPCB表面之數位元器件之數量亦相應增加。惟，與魏 電路板相比具有良好撓折性能之FpcB，機械強度小承 載犯力低，並於使料程中，如表面貼裝卫藝（k — e Technology ’ SMT)中安裝數位器件時㈣b易 裂或又知纟去承栽較大品質或較多數量之數位器件 P礙可折叠數位產品多功能化之發展。此外，隨著數 =品中傳輸數位訊號頻率之提高，對於電路板之電磁 遮罩性能要求亦相應増加。 【發明内容】 099122765 表單編號A0101 頁/共 26 頁 0992040121-0 201204188 [0004] [0005] ❹ [0006] Ο [0007] 有鑑於此，提供一種柔性電路板及其製作方法，以提高 柔性電路板之機械強度及電磁遮罩性能實屬必要。 一種柔性電路板，包括第一導電圖形、絕緣層、第二導 電圖形、導電膠層與補強片。所述第一導電圖形與第二 導電圖形形成於所述絕緣層相對之兩側。所述第一導電 圖形包括電連接之接地導線與第一連接端子。所述第二 導電圖形包括與所述第一連接端子電連接之第二連接端 子。所述第二連接端子用於安裝接地零件。所述導電膠 層位於所述第二導電圖形與補強片之間。所述補強片包 括金屬基底層與形成於金屬基底層表面之至少一表面鍍 層。所述至少一表面鍍層藉由所述導電膠層與所述第一 連接端子電性連接。 一種柔性電路板之製作方法，包括步驟：提供柔性覆銅 板，其包括第一導電層、絕緣層與第二導電層，所述第 一導電層與第二導電層位於絕緣層之相對兩側；將所述 第一導電層形成第一導電圖形，所述萆一導電圖形包括 電連接之接地導線與第一連接端子，將第二導電層形成 第二導電圖形，所述第二導電圖形包括與所述第一連接 端子電連接之第二連接端子，所述第二連接端子用於安 裝接地零件；提供補強片，所述補強片包括金屬基底層 及形成於所述金屬基底層表面之至少一表面鍍層；以及 於所述至少一表面鍍層形成導電膠層，藉由所述導電膠 層將所述補強片黏接於所述第一導電圖形以使得所述補 強片電連接於所述第一連接端子。 本技術方案提供製作方法得到之柔性電路板具有第一導 099122765 表單編號Α0101 第5頁/共26頁 0992040121-0 201204188 電圖形、第二導電圖形盥鈾 補強片。所述第二導電圖形可 安裝接地零件。所述補㈣安裝於第—導㈣形之一側 ’並藉由導電膠料轉層與導通孔電連接於第二導電 圖形之接地端子’從而可於支撐第二導電圖形上之接地 零件之同時對第-導電圖形起到導電遮罩之作用。所述 表面鐘層之存在可使得補強片具有較小且穩定之電阻值 ，提高補強片之耐熱性及外觀性等。 【實施方式】 酬τ面將結合附圖及複數實施例對本技術方案提供之柔性 電路板及其製作方法作進一步詳細說明。 闕請-併參閱m至圖3,本技術方案第一實施例提供一種 柔性電路板100，其包括絕緣層n、第一導電圖形12〇、 第二導電圖形130、第一覆蓋膜14〇、第二覆蓋膜15〇、 導電膠層160與補強片170。 [0010]所述絕緣層11用於承載第—導電圖形12〇與第二導電圖形 130。 所述絕緣層η可為_r(『船薄膜絲醯亞胺（ PI )薄膜。 _]所述第一導電圖形12〇與第二導電圖形13〇形成於所述絕 緣層11相對之兩侧。所述第—導電圖形12〇包括電連接之 接地導線121與第一連接端子丨22。所述第二導電圖形 130包括與所述第一連接端子丨22電連接之第二連接端子 131。 所述第二連接端子131用於安裝接地零件。所述接 地零件可為具有遮罩外殼之零件（如連接器、三極管等 )。所述第二連接端子131可包括接地端子132與訊號端 子133。所述接地端子132用於與所述接地零件之私 099122765 表單編號A0101 第6頁/共26頁 卜设電 0992040121-0 201204188 連接以接地。所述訊號端子133用於與所述接地零件之其 他訊號端子電連接。 [0012] 所述柔性電路板100還具有貫穿所述第一導電圖形120、 絕緣層11與第二導電圖形130之導通孔111。所述第一連 接端子122與所述第二連接端子131藉由所述導通孔111 電連接。當然，所述柔性電路板100之導通孔111數量並 不限於為一個，還可具有其它用於進行第一導電圖形120 與第二導電圖形130之間訊號傳輸之導通孔。 [0013] 所述第一覆蓋膜140用於保護所述第一導電圖形120。所 述第一覆蓋膜140覆蓋於所述第一導電圖形120遠離所述 絕緣層11之一側。所述第一覆蓋膜140具有開口 141，所 述第一連接端子122暴露於所述開口 141且部分填充所述 開口 141。 [0014] 所述第二覆蓋膜150用於保護所述第二導電圖形130。所 述第二覆蓋膜150覆蓋於所述第二導電圖开il30遠離所述 絕緣層11之一側。所述第二覆蓋膜150具有開窗151，所 述第二連接端子131暴露於所述開窗151且部分填充所述 開窗151。 [0015] 所述導電膠層160位於所述第二導電圖形130與補強片 170之間。所述導電膠層160填充所述第一覆蓋膜140之 開口 141，並與所述第一連接端子122電連接。 [0016] 所述補強片170包括金屬基底層171與形成於所述金屬基 底層171表面之至少一表面鑛層172。所述金屬基底層 171之材質可為不銹鋼、鋁或鈹銅合金等。所述至少一表 099122765 表單編號 A0101 第 7 頁/共 26 頁 0992040121-0 201204188 面鍍層172藉由所述導電膠層160與所述第一連接端子 122電性連接。所述表面鍍層172可採用鎳、金或銀等具 有良好導電性能之材料製成。所述表面鍍層172之厚度範 圍為0.8ym-5.0/zni 〇本實施例中，所述金屬基底層171 為長方形板體，所述表面鍍層172為兩個，其中一個與所 述導電膠層160相接觸，另一個位於所述金屬基底層171 遠離所述導電膠層160之一侧。 [0017] 本技術方案第一實施例提供之柔性電路板1 0 0具有第一導 電圖形120、第二導電圖形130與補強片170。所述第二 導電圖形130可安裝接地零件。所述補強片170安裝於第 一導電圖形120之一側，並藉由導電膠層導電膠層160與 導通孔111電連接於第二導電圖形130之接地端子132， 從而可於支撐第二導電圖形130上之接地零件之同時對第 一導電圖形120起到導電遮罩之作用。所述表面鍍層172 之存在可使得補強片170具有較小且穩定之電阻值，提高 補強片170之耐熱性及外觀性等。 [0018] 本技術方案第二實施例提供一種如上所述之柔性電路板 100之製作方法，其包括以下步驟： [0019] 第一步，請參閱圖4，提供柔性覆銅板10，其包括絕緣層 11、第一導電層12與第二導電層13，所述第一導電層12 與第二導電層13位於絕緣層11之相對兩側。 [0020] 第二步，於所述柔性覆銅板10中形成訊號連接於所述第 一導電層12與第二導電層13之間之導通孔111，如圖5所 示。具體地，可先對所述柔性覆銅板10進行鑽孔得到貫 099122765 表單編號A0101 第8頁/共26頁 0992040121-0 201204188 [0021] Ο [0022] [0023]Ο [0024] 穿所述絕緣層11、第—導電層12與第二導電層13之通孔 ’然後藉由化學鍍、電鍍等方式於所得通孔之内壁形成導電金屬層，再以油墨等材料填料電金制圍合形成 之空間，從而得到導通孔丨丨J。 第三步’請一併參閲圖6至_ 至圖8，將所述第-導電層12形 成第V電圖H20 ’所述第—導電圖形12〇包括電連接 之接地導線121與第—連接端子122。將第二導電層13形 成第二導電圖形130’所述第二導電圖形13〇包括與所述 第連接端子122電連接之第二連接端子i3i，所述第二 連接端子131心絲接_件》可先㈣述第-導電層 12與第一導電層13上形絲致私卿，再經曝光、顯 影、蚀刻等工藝除去第一導電層12與第二導電層13之部 分導電材料，形成導電圖案。 具體地’將所述第一導電層12形成第一導電圖彻包括 以下步驟： ：： ：：!： 4 II1 l | in '； 首先刻所述第一骞雷展τ m2 ’以形成電連接之接地導線121與第—連接盤123。 其人於所述第一導電層12上貼覆第一覆蓋膜“〇，所述 第-覆蓋膜14〇具有開口14卜以暴露所述第一連接盤 123。本實施例中’所述第1蓋膜U0藉由油墨印刷之 方式形成。 [0025] 最後ί所述第-連接盤123進行表面賴從而形成第一 連接端子122 m對所述第—連減123暴露於所述開口丨4丨之部分進行鍍化金或有機覆蓋膜（OSP)等表 099122765 表單编號A0101 第9頁/共26頁 0992040121-0 201204188 面加工，形成部分填充所述開口 141之第一加強層124， 得到第一連接端子122。 [0026] 將第二導電層13形成第二導電圖形130之方法與上述步驟 大致相同，即，先蝕刻第二導電層13以形成第二連接頭 134。然後於所述第二導電層13上貼覆第二覆蓋膜150， 所述第二覆蓋膜150具有開窗151，以暴露所述第二連接 頭134。最後對所述第二連接頭134進行表面鍍膜形成部 分填充所述開窗151之第二加強層135，得到第二連接端 子131。所述第二連接端子131藉由導通孔111與第一連 接端子122電連接。 [0027] 當然，實際生產過程中，對第一導電層12與第二導電層 13進行蝕刻可同時進行，貼覆第一覆蓋膜140與第二覆蓋 膜150亦可同時進行。 [0028] 第四步，請參閱圖9,提供補強片170，所述補強片170包 括金屬基底層171及形成於所述金屬基底層171表面之至 少一表面鍍層172。所述金屬基底層171可為不銹鋼、鋁 或鈹銅合金等。所述表面鍍層172可採用鎳、金或銀等具 有良好導電性能之材料製成。所述表面鍍層172可藉由電 鑛、化學锻、化學氣相沈積或物理氣相沈積方式形成於 所述金屬基底層171之表面。實際生產過程中，通常係提 供一塊較大之金屬基底層171，於其各個表面均形成表面 鑛層172，再裁切成所需之形狀。 [0029] 第五步，於所述至少一表面鍍層172形成導電膠層160， 藉由所述導電膠層160將所述補強片170黏接於所述第一 099122765 表單編號A0101 第10頁/共26頁 0992040121-0 201204188 Ο 導電圖形12(Ux使得所述補強片17G電連接於所述第一連 接端子122，得到如圖丄所示之柔性電路板咖。具體地， 可先於所述至少—表讀層172上貼附導電㈣。再將所 述補強片17G對準所述第—連接端子122置於所述第一導 電圖形120上。最後藉由導電膠膜本壓機對所述導電膠膜 ^高溫高壓’如此，所述導電膠膜中之樹脂點著劑於 向溫及高壓條件下，與所述第—覆蓋膜14G及所述補強片 170之表面鑛層172發生化學鍵接，有部分樹脂黏著劑受 ^後流動至所述第—覆蓋膜1歡開口 U1内，從而填滿 開口141 °而導電膠膜中之導電粒子則電連接於所述第一 連接端子122與補強片17〇之間，從而得到導電膠層16〇 〇 翻f!:摩：::罐. 」繼雜 "||κΐ| [0030] 於上述柔性電路板1〇〇，可採用表面貼裝（SMt )或焊 接等工藝於第二連接端子131上安裝接地零件，並使第二 連接端子131之接地端子丨32連接於接地零件之遮罩外殼 ’從而亦將所述補強片17 0無地。 〇 [0031] 本技術方案第實施例提供之柔性電路板之製作方法於 不銹鋼等材質之金屬基底層171上形成鎳、金等材質之表 面錢層172得到補強片170。再將所述補強片170貼合於 第一導電圖形120之一侧，並藉由導電膠層“ο與導通孔 111電連接於用於安裝接地零件之第二連接端子131。所 得柔性電路板1〇〇之補強片170可於支撐第二導電圖形 130上之接地零件之同時對第一導電圖形120起到導電遮 罩之作用。所述表面鍍層172之存在可使得補強片170具 有較小且穩定之電阻值，提高補強片170之耐熱性及外觀 099122765 表單煸號Α0101 第11頁/共26頁 0992040121-0 201204188 性等。 [0032] [0033] [0034] [0035] [0036] [0037] [0038] [0039] [0040] [0041] 099122765 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案第一實施例提供之柔性電路板之俯視圖 〇 圖2係本技術方案第一實施例提供之柔性電路板之另一侧 之俯視圖。 圖3係圖1沿111 -111線之剖面示意圖。 圖4係本技術方案第二實施例提供之柔性覆銅板之部分剖 面示意圖。 圖5係於上述柔性覆銅板中形成導通孔後之剖面示意圖。 圖6係得到第一導電圖形與第二導電圖形後之剖面示意圖 〇 圖7係於上述柔性覆銅板上形成第一覆蓋膜與第二覆蓋膜 之剖面示意圖。 圖8係形成第一連接端子與第二連接端子後之剖面示意圖 〇 圖9係於本技術方案第二實施例提供之金屬基底層上形成 表面鑛層後之剖面示意圖。 表單編號A0101 第12頁/共26頁 0992040121-0 201204188 【主要元件符號說明】 [0042] 柔性覆銅板：10 [0043] 絕緣層：11 [0044] 導通孔：111 [0045] 第一導電層：12 [0046] 第一導電圖形：120 [0047] 接地導線：121 〇 [0048] 第一連接端子：122 [0049] 第一連接盤：123 [0050] 第一加強層：124 [0051] 第二導電層：13 [0052] 第二導電圖形：130 [0053] 第二連接端子：131 〇 [0054] 接地端子：132 [0055] 訊號端子：133 [0056] 第二連接頭：134 [0057] 第二加強層：135 [0058] 第一覆蓋膜：140 [0059] 開口 ： 141 [0060] 第二覆蓋膜：150 099122765 表單編號A0101 第13頁/共26頁 0992040121-0 201204188 [0061] 開窗：151 [0062] 導電膠層：160 [0063] 補強片：170 [0064] 金屬基底層：171 [0065] 表面鍍層：172 [0066] 柔性電路板：100 0992040121-0 099122765 表單編號A0101 第14頁/共26頁201204188 Description of the Invention: [Technical Field] The present invention relates to the field of flexible circuit boards, and in particular to a flexible circuit board having a reinforcing sheet and a method of fabricating the same. [0002] [Prior Art 3 With the development of foldable digital products such as folding mobile phones and slider phones, flexible printed circuit boards (Flexible Printed Circuit B〇ard, which are light, thin, short, small, and bendable) FpcB) is widely used in digital products to realize electrical connection between different circuits. In order to obtain better performance, the flexural properties of the base film I used have become a research hotspot. See the literature... Coffee (8) Insulation Maganize, v〇lume 5, Issue 1, ^•攸 198” 1: 15_23, “Appllcati〇ns PolyUide Films t〇 Plus _ Electronic Industries in . [0003] In order to meet the design requirements for the versatility of foldable digital products, the number of digital components on the surface of the FPCB has also increased accordingly. However, FpcB with good flexural performance compared with Wei circuit board has low mechanical strength and low load-carrying force, and is used in the process of manufacturing digital devices such as surface mount technology (K-e Technology 'SMT). (4) b is prone to cracking or knowing to carry a large-quality or a large number of digital devices to hinder the development of multi-functional folding digital products. In addition, as the frequency of the digital signal transmitted in the number = product increases, the performance requirements for the electromagnetic mask of the board are correspondingly increased. SUMMARY OF THE INVENTION 099122765 Form No. A0101 Page / Total 26 Page 0992040121-0 201204188 [0004] [0005] [0007] In view of this, a flexible circuit board and a manufacturing method thereof are provided to improve a flexible circuit board The mechanical strength and electromagnetic shielding performance are necessary. A flexible circuit board comprising a first conductive pattern, an insulating layer, a second conductive pattern, a conductive adhesive layer and a reinforcing sheet. The first conductive pattern and the second conductive pattern are formed on opposite sides of the insulating layer. The first conductive pattern includes an electrically connected ground conductor and a first connection terminal. The second conductive pattern includes a second connection terminal electrically connected to the first connection terminal. The second connection terminal is used to mount a grounding part. The conductive adhesive layer is located between the second conductive pattern and the reinforcing sheet. The reinforcing sheet includes a metal base layer and at least one surface plating layer formed on a surface of the metal base layer. The at least one surface plating layer is electrically connected to the first connection terminal by the conductive adhesive layer. A method for fabricating a flexible circuit board, comprising the steps of: providing a flexible copper clad laminate comprising a first conductive layer, an insulating layer and a second conductive layer, wherein the first conductive layer and the second conductive layer are located on opposite sides of the insulating layer; Forming the first conductive layer into a first conductive pattern, the first conductive pattern comprising an electrically connected ground wire and a first connection terminal, the second conductive layer forming a second conductive pattern, the second conductive pattern including a first connection terminal electrically connected to the second connection terminal, the second connection terminal is used for mounting a grounding component; a reinforcing sheet is provided, the reinforcing sheet comprises a metal base layer and at least one surface formed on the surface of the metal base layer Surface plating; and forming a conductive adhesive layer on the at least one surface plating layer, the reinforcing sheet is adhered to the first conductive pattern by the conductive adhesive layer to electrically connect the reinforcing sheet to the first layer Connection terminal. The technical solution provides a flexible circuit board with a first method. 099122765 Form No. 1010101 Page 5 of 26 0992040121-0 201204188 Electrical pattern, second conductive pattern 盥 uranium reinforcing sheet. The second conductive pattern can mount a grounded part. The complement (4) is mounted on one side of the first (four) shape and electrically connected to the ground terminal of the second conductive pattern by the conductive rubber layer and the via hole so as to be capable of supporting the grounded part on the second conductive pattern At the same time, the first conductive pattern acts as a conductive mask. The presence of the surface clock layer allows the reinforcing sheet to have a small and stable electrical resistance value, and the heat resistance and appearance of the reinforcing sheet are improved. [Embodiment] The flexible circuit board provided by the technical solution and the manufacturing method thereof will be further described in detail in conjunction with the accompanying drawings and the plural embodiments. The first embodiment of the present invention provides a flexible circuit board 100 including an insulating layer n, a first conductive pattern 12A, a second conductive pattern 130, and a first cover film 14A. The second cover film 15 , the conductive adhesive layer 160 and the reinforcing sheet 170 . The insulating layer 11 is used to carry the first conductive pattern 12A and the second conductive pattern 130. The insulating layer η may be _r ("ship film yttrium imine (PI) film. _] the first conductive pattern 12 〇 and the second conductive pattern 13 〇 are formed on opposite sides of the insulating layer 11 The first conductive pattern 12 includes an electrically connected ground wire 121 and a first connection terminal 22. The second conductive pattern 130 includes a second connection terminal 131 electrically connected to the first connection terminal 22. The second connecting terminal 131 is used for mounting a grounding component. The grounding component may be a component having a masking shell (such as a connector, a triode, etc.) The second connecting terminal 131 may include a grounding terminal 132 and a signal terminal 133. The grounding terminal 132 is configured to be connected to the grounding part of the grounding part 099122765 Form No. A0101, and the grounding terminal 133 is used for grounding. The other signal terminals are electrically connected. [0012] The flexible circuit board 100 further has a via hole 111 penetrating through the first conductive pattern 120, the insulating layer 11 and the second conductive pattern 130. The first connection terminal 122 and the Second connection terminal 1 31 is electrically connected through the via hole 111. Of course, the number of the via holes 111 of the flexible circuit board 100 is not limited to one, and may be further used to perform the first conductive pattern 120 and the second conductive pattern 130. The first cover film 140 is used to protect the first conductive pattern 120. The first cover film 140 covers the first conductive pattern 120 away from the insulating layer 11. The first cover film 140 has an opening 141, and the first connection terminal 122 is exposed to the opening 141 and partially fills the opening 141. [0014] The second cover film 150 is used to protect the a second conductive pattern 130. The second cover film 150 covers the second conductive pattern il30 away from one side of the insulating layer 11. The second cover film 150 has a window 151, the second connection The terminal 131 is exposed to the window 151 and partially fills the window 151. [0015] The conductive adhesive layer 160 is located between the second conductive pattern 130 and the reinforcing sheet 170. The conductive adhesive layer 160 is filled with Opening 141 of the first cover film 140, and the The reinforcing substrate 170 includes a metal base layer 171 and at least one surface mineral layer 172 formed on the surface of the metal base layer 171. The metal base layer 171 may be made of stainless steel or aluminum. Or a beryllium copper alloy, etc. The at least one table 099122765 Form No. A0101, page 7 / 26 pages 0992040121-0 201204188 The surface plating layer 172 is electrically connected to the first connection terminal 122 by the conductive adhesive layer 160. The surface plating layer 172 may be made of a material having good electrical conductivity such as nickel, gold or silver. The thickness of the surface plating layer 172 ranges from 0.8 μm to 5.0/zni. In the embodiment, the metal base layer 171 is a rectangular plate body, and the surface plating layer 172 is two, one of which is opposite to the conductive adhesive layer 160. The other is located on the side of the metal base layer 171 away from the conductive paste layer 160. [0017] The flexible circuit board 100 provided by the first embodiment of the present technical solution has a first conductive pattern 120, a second conductive pattern 130, and a reinforcing sheet 170. The second conductive pattern 130 can mount a grounded component. The reinforcing sheet 170 is mounted on one side of the first conductive pattern 120, and is electrically connected to the ground terminal 132 of the second conductive pattern 130 by the conductive adhesive layer conductive layer 160 and the via hole 111, thereby supporting the second conductive layer. The grounded features on the pattern 130 simultaneously act as conductive masks for the first conductive pattern 120. The presence of the surface plating layer 172 allows the reinforcing sheet 170 to have a small and stable electrical resistance value, and the heat resistance and appearance of the reinforcing sheet 170 are improved. [0018] The second embodiment of the present technical solution provides a manufacturing method of the flexible circuit board 100 as described above, which includes the following steps: [0019] In the first step, referring to FIG. 4, a flexible copper clad laminate 10 is provided, which includes insulation. The layer 11 , the first conductive layer 12 and the second conductive layer 13 , the first conductive layer 12 and the second conductive layer 13 are located on opposite sides of the insulating layer 11 . [0020] In the second step, a via hole 111 is formed in the flexible copper clad laminate 10 to be connected between the first conductive layer 12 and the second conductive layer 13, as shown in FIG. Specifically, the flexible copper clad laminate 10 can be drilled first to obtain a total of 099122765. Form No. A0101 Page 8 / Total 26 Page 0992040121-0 201204188 [0022] [0023] [0024] Wear the insulation The through hole ' of the layer 11, the first conductive layer 12 and the second conductive layer 13 is then formed into a conductive metal layer on the inner wall of the obtained through hole by electroless plating, electroplating or the like, and then formed by electric gold filling of a material such as ink. The space is obtained, thereby obtaining the via hole 丨丨J. The third step 'please refer to FIG. 6 to FIG. 8 together, and the first conductive layer 12 forms the Vth conductive pattern H20'. The first conductive pattern 12 includes the grounding wire 121 and the first portion electrically connected. The terminal 122 is connected. Forming the second conductive layer 13 into the second conductive pattern 130 ′, the second conductive pattern 13 〇 includes a second connection terminal i3 i electrically connected to the first connection terminal 122 , and the second connection terminal 131 is connected to the core The first conductive layer 12 and the first conductive layer 13 may be smothered, and then the conductive materials of the first conductive layer 12 and the second conductive layer 13 are removed by exposure, development, etching, etc., to form a conductive material. Conductive pattern. Specifically, the step of forming the first conductive layer 12 into the first conductive pattern comprises the following steps: ::::: 4 II1 l | in '; first engraving the first 骞 exhibition τ m2 ' to form an electrical connection The grounding wire 121 and the first connecting plate 123. A first cover film "〇" is attached to the first conductive layer 12, and the first cover film 14 has an opening 14 to expose the first lands 123. In the present embodiment The cover film U0 is formed by ink printing. [0025] Finally, the first lands 123 are surface-surfaced to form a first connection terminal 122m, and the first-to-continuous subtraction 123 is exposed to the opening 丨4 The part of the crucible is plated with gold or organic film (OSP), etc. Table 099122765 Form No. A0101 Page 9 / Total 26 page 0992040121-0 201204188 Surface processing, forming a first reinforcement layer 124 partially filling the opening 141, The first connection terminal 122. The method of forming the second conductive pattern 13 into the second conductive pattern 130 is substantially the same as the above steps, that is, etching the second conductive layer 13 to form the second connection head 134. Then A second cover film 150 is attached on the second conductive layer 13. The second cover film 150 has a window 151 to expose the second connector 134. Finally, the second connector 134 is surface-coated. Filling the second reinforcement layer 135 of the window 151 to obtain The second connection terminal 131 is electrically connected to the first connection terminal 122 through the via hole 111. [0027] Of course, in the actual production process, the first conductive layer 12 and the second conductive layer 13 are etched. Simultaneously, the first cover film 140 and the second cover film 150 may be simultaneously applied. [0028] In the fourth step, referring to FIG. 9, a reinforcing sheet 170 is provided, and the reinforcing sheet 170 includes a metal base layer 171 and At least one surface plating layer 172 formed on the surface of the metal base layer 171. The metal base layer 171 may be stainless steel, aluminum or beryllium copper alloy, etc. The surface plating layer 172 may have good electrical conductivity such as nickel, gold or silver. The surface plating layer 172 can be formed on the surface of the metal base layer 171 by electrowinning, chemical forging, chemical vapor deposition or physical vapor deposition. In actual production, a comparison is usually provided. The metal base layer 171 has a surface mineral layer 172 formed on each surface thereof and then cut into a desired shape. [0029] In the fifth step, the conductive adhesive layer 160 is formed on the at least one surface plating layer 172 by Said The adhesive layer 160 adheres the reinforcing sheet 170 to the first 099122765 Form No. A0101 Page 10 / Total 26 Page 0992040121-0 201204188 导电 Conductive pattern 12 (Ux electrically connects the reinforcing sheet 17G to the first A connection terminal 122 is obtained as shown in FIG. 。. Specifically, the conductive (four) may be attached to the at least the meter reading layer 172. The reinforcing sheet 17G is then aligned with the first portion. A connection terminal 122 is placed on the first conductive pattern 120. Finally, the conductive adhesive film is subjected to high temperature and high pressure by a conductive adhesive film press, and the resin in the conductive adhesive film is applied to the first and the cover film 14G under the conditions of mild and high pressure. The surface mineral layer 172 of the reinforcing sheet 170 is chemically bonded, and a part of the resin adhesive flows into the first covering film U1, thereby filling the opening 141 ° and the conductive particles in the conductive film. Electrically connected between the first connection terminal 122 and the reinforcing sheet 17〇, thereby obtaining a conductive adhesive layer 16 flipping f!:Mo::: can. ” & & | | | | 于 上述 上述 上述 上述 上述 上述 上述 上述 上述The flexible circuit board 1 〇〇 can be mounted on the second connection terminal 131 by a surface mount (SMt) or soldering process, and the ground terminal 丨 32 of the second connection terminal 131 is connected to the mask case of the ground part. 'Therefore, the reinforcing sheet 17 0 is also left. [0031] The method for fabricating a flexible circuit board according to the first embodiment of the present invention forms a surface layer 172 of a material such as nickel or gold on a metal base layer 171 made of stainless steel or the like to obtain a reinforcing sheet 170. The reinforcing sheet 170 is attached to one side of the first conductive pattern 120, and is electrically connected to the second connection terminal 131 for mounting the grounding member by the conductive adhesive layer “o”. The obtained flexible circuit board is obtained. The reinforcing sheet 170 can act as a conductive mask on the first conductive pattern 120 while supporting the grounded part on the second conductive pattern 130. The presence of the surface plating layer 172 can make the reinforcing sheet 170 have a smaller size. And stable resistance value, improve the heat resistance and appearance of the reinforcing sheet 170 099122765 Form No. 101 0101 Page 11 / 26 pages 0992040121-0 201204188 Sex, etc. [0033] [0034] [0036] In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above is only a preferred implementation of the present invention. In this way, the scope of the patent application in this case is not limited. Any equivalent modifications or variations made by those skilled in the art to the spirit of the present invention should be included in the scope of the following patent application. 1 series of skills 2 is a plan view of the flexible circuit board provided by the first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along line 111-111 of FIG. 4 is a schematic cross-sectional view of a flexible copper clad laminate provided by a second embodiment of the present technical solution. Fig. 5 is a schematic cross-sectional view showing the formation of a via hole in the flexible copper clad laminate. Fig. 6 shows the first conductive pattern and the second conductive pattern. FIG. 7 is a schematic cross-sectional view showing a first cover film and a second cover film formed on the flexible copper clad laminate. FIG. 8 is a schematic cross-sectional view showing the first connection terminal and the second connection terminal. FIG. The second embodiment of the technical solution provides a schematic cross-sectional view of the surface layer formed on the metal base layer. Form No. A0101 Page 12 of 26 0992040121-0 201204188 [Description of main components] [0042] Flexible copper clad laminate: 10 [ 0043] Insulation: 11 [0044] Via: 111 [0045] First conductive layer: 12 [0046] First conductive pattern: 120 [0047] Grounding wire: 121 〇 [0048] First Connection terminal: 122 [0049] First lands: 123 [0050] First reinforcement layer: 124 [0051] Second conductive layer: 13 [0052] Second conductive pattern: 130 [0053] Second connection terminal: 131 〇 [0054] Ground terminal: 132 [0055] Signal terminal: 133 [0056] Second connector: 134 [0057] Second reinforcement layer: 135 [0058] First cover film: 140 [0059] Opening: 141 [0060] Second cover film: 150 099122765 Form No. A0101 Page 13 / Total 26 Page 0992040121-0 201204188 [0061] Opening window: 151 [0062] Conductive adhesive layer: 160 [0063] Reinforcement sheet: 170 [0064] Metal base layer: 171 [0065] Surface Plating: 172 [0066] Flexible Circuit Board: 100 0992040121-0 099122765 Form No. A0101 Page 14 of 26