201145596 、發明說明： 【發明所屬之技術領域】 本發明係有關於-種發光元件組立裝置及其方法，尤有關 於裝設多健光元件之發光元件組立裝置及其方法，可固定發 光元件於基板上_對位置使其發光中心點偏差於可控制^ 圍内。 【先前技術】 由於發光二極體（Light Emitting Diode，簡稱LED)具高 色彩飽和度、快速啟動、無汞及壽命長等優點，從60年^問 世以來’已發展出相當廣的朗顧，如：早期多應用在手機、 遙控益等小雜置，近年因高亮度LED出現，顧範圍更擴 及至汽車、照明、戶外大型顯示ϋ等產品，；I見LED極具發 展潛力。 ，然而’叉P艮於LED佈光角度小以及製程技術，以咖為 光源所建構社朗微倾常是㈣作成晶粒料顆LED 透過在基板上陣列排列出所需的形狀後，再驅動發光所產生 的。為了使_形式的大型卿設備可提供更為均勻的光照效 果’咖之_間隔轉就顯得相當重要。若LED之間間隔 距離太大’會明顯產生紐和暗區的現象，並且降低平均亮 ，因此’如何拉近LED之間的間隔距離實乃座需研究之課 201145596 【發明内容】 本么月之目的係在提供—種發光元件組立裝置及盆方 法’透過發光元件所裝载之基板具有―高度落差㈣性，藉由 銲錫材料Μ力流動帶動發光元件往1定方向移動。 依據本發明，提供-種發光元件組立裝置，包括一基板、 一録錫材料以及至少-發光元件。基板—側上形成—組立區，201145596, the invention relates to: [Technical Field] The present invention relates to a light-emitting element assembly device and a method thereof, and more particularly to a light-emitting element assembly device and a method thereof for mounting a multi-gloss light element, wherein the light-emitting element can be fixed The position on the substrate _ is opposite to the position of the illuminating center point within the controllable range. [Prior Art] Since the Light Emitting Diode (LED) has the advantages of high color saturation, fast start-up, no mercury, and long life, it has developed quite a wide range since the 60th year. For example, early multi-applications in mobile phones, remote control and other small miscellaneous, in recent years due to the emergence of high-brightness LEDs, the scope of the expansion to automotive, lighting, outdoor large display ϋ and other products; I see LED has great development potential. However, 'fork P 艮 LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED LED Illuminated by the light. In order to make the _ form of large-scale equipment to provide a more uniform lighting effect, it is very important to turn around. If the distance between the LEDs is too large, the phenomenon of neon and dark areas will be apparent, and the average brightness will be reduced. Therefore, 'how to narrow the separation distance between the LEDs is a study class 201145596. [Invention content] This month The object of the invention is to provide a light-emitting device assembly device and a pot method. The substrate loaded through the light-emitting element has a height drop (four) property, and the light-emitting element moves in a predetermined direction by the force flow of the solder material. According to the present invention, there is provided a light-emitting element assembly apparatus comprising a substrate, a tin recording material and at least a light-emitting element. a substrate-side formed on the side,
獻區中以-南度洛差形成至少—低位處。銲錫材料設置於級 立區上，發光元件則是對應設置於銲錫材料上。 依據本發賴供—歸光元倾财法，包括下列步驟： 在-基板上形成-組立區，組立區中以_高度落差形成至少一 低=處；在組立區中放置一薛錫材料後，將至少一發光元件對 應设置於組立區中；以及加熱銲錫材料以使銲錫材翁化後往 低位處流動，並帶動發光元件往—默方向移動。 在本發财’上述銲錫材料的熔點限制端視於所應用的發 件物^特性’如·此魅絲為不致破壞發光元件的正常 二的最间/皿度’般來說，此銲錫材料較佳是炫點較低的混 :勿’更佳是兼有價廉且胁轉之合金材料，如：各種含錫 D列的焊鍚或其他合金材料，然而並不限於此。因此當鲜锡材 =破加細使觸材梅化後，銲錫簡會往健處流動， 亚▼動發S元雜—預定方向移動。 在本發明巾之—實施祕中，上賴立區可藉由基板的設 的I法在基板—側上形成，如··產生陽刻線條以標示出組立區 、輪摩、或者以-膠體_她立區之外緣以限顺立區的外 201145596 =方式。《體縣t_其祕，健是 度環境的膠體，其可耐受的、旧声 又力熱之咖 _溫度，舉例來說前鱗錫㈣ 樹脂，使郷體在加熱贿錫材咖⑽ 好的外形，關其中的發缸件的移動。又乃厚声维良 並無限制，然在—實施態樣中，可為⑽綠至圍In the donation area, at least the low position is formed by the south-duty. The solder material is disposed on the stage, and the light-emitting elements are correspondingly disposed on the solder material. According to the present invention, the method includes the following steps: forming a grouping area on the substrate, forming at least one low=where height difference in the grouping area; placing a Xuexi material in the grouping area And at least one light-emitting element is correspondingly disposed in the grouping area; and the solder material is heated to flow the solder material to the lower position, and the light-emitting element is moved in the silent direction. In the fate of the above-mentioned solder material, the melting point limit of the above-mentioned solder material depends on the applied object's characteristics, such as the charm of the second wire of the normal two of the light-emitting elements. It is preferable to have a lower blending ratio: it is not preferable that it is an alloy material which is inexpensive and has a tendency to be transferred, such as various solder bumps or other alloy materials containing tin D, but is not limited thereto. Therefore, when the fresh tin material = broken and fined to make the contact material beautified, the solder will flow to the health, and the sub-H will send the S element miscellaneous - the predetermined direction moves. In the implementation of the towel of the present invention, the upper erecting zone can be formed on the substrate-side by the I method of the substrate, such as generating a slanted line to mark the grouping zone, the wheeling, or the -colloid _ The outer edge of her district is limited to the outside of 201145596 = way. "The body of the county t_ its secret, health is the environment of the colloid, its tolerable, old and hot coffee _ temperature, for example, the front scale tin (four) resin, so that the body in the heating bribe tin coffee (10) Good shape, the movement of the hair cylinders in which it is closed. There is no limit to the sound and goodness. However, in the implementation, it can be (10) green to the surrounding.
可再細分紐触立子區，紐舰立子區 為一陣列，使得每個組立子區可對 可依據f應裝叹一發先兀件，如此即 了依據各贿光元件的移動方式，產生不同的效果。 比如說’當低健是位在此些組立子區之間時，執行本發明所 提供的發光it倾立方法的各個步驟之後，在—實施態樣中， 因銲錫材料往低位區流動而帶動發光元件，可使得對應者些植 立子區的發光元件以彼此靠近的方式移動，從而減少發光元件 之間的間隔距離。 是故由上述中可以得知，本發明的發光元件組立裝置及 其方法設計具有高度落差的組立區，並透過銲錫材料的炼化流 動帶動其上的發光元件往預定方向移動，從喊少發光元件之 間的間隔距離。 【實施方式】 為進一步說明各實施例，本發明乃提供有圖式。此些圖式 乃為本創作揭露内容之-部分，其主要_以說明實施例，並 可配合說明書之相關描述來解釋實施例的運作原理。配合參考 201145596 14些内容’本領域具有通常知識者應能理解其他可能的實施方 式以及本發明之優點。圖中的元件並未按比例緣製，而類似的 70件符號通常用來表示類似的元件。 —百先喷一併參寺第！圖、第2圖及第3圖，其中第工圖顯 丁依據本土明的第_實施例的發光元件組立裝置的爆炸圖，第 2一圖立顯示依據本發明的第一實施例的發光元件組立裝置的剖面 不思圖，第3圖顯示依據本發明的發光元件組立方法的流程 圖雖然第3圖所揭示的發光元件組立方法在此是應用在第— 實施例的發光元件組立裝置中，然而本發明的發光元件組立方 法無須限制於此，亦可應用於其他裝置中。如圖中所示，發光 凡件組立裝置1包括一基板10、-輝錫材料12以及-發光元 214。基板ίο -側上以一膠體18，如：塗佈厚度為001公 屋至0 05公釐的防焊漆形成-組立區16 (步驟S310)，在本實 知例中，膠體18雖然是包圍在組立區16的外圍，然而，在其 他實施例中，膠體無須以包圍方式界定出組立區，亦可僅沿著 、、’立區輪廟塗佈。本實施例示例性地應用一含鍚合金作為 鲜錫材料12 ’如：各種含錫比例的銲鍚，以一防焊漆、一耐 问咖/黍、—矽膠或一環氧樹脂之任意組合作為膠體18。由第2 圖中了以看出組立區16中存在一低位處a，因此形成一高度 洛差dl。銲錫材料12設置於組立區16中，發光元件14則是 對應設置於銲錫材料12上方(步驟S320)。因此，以上述方式 在基板ίο從下至上依序放置銲錫材料12及發光元件14之 後，即可將基板1〇、銲錫材料12及發光元件14 一併進行加 熱或僅加熱銲錫材料12，乃至銲錫材料12熔化。在銲錫材料 [S1 201145596 12熔化後，銲錫材料會受到重力或内聚力等因素往低位處 A流動，並帶動上方的發光元件14往一預定方向χ移動(步驟 S330)。銲錫材料12降溫之後，回復固相狀態而固定發光元件 14的位置，故發光元件組立裝置丨可改變發光元件14組立位 置。 另請參考第4圖及第5圖，其中第4圖顯示依據本發明的 第二實施例的發光元件組立裝置的上視圖，第5圖顯示依據本 發明的第二實施例的發光元件組立裝置的剖面示意圖。如圖中 所不，本實施例的發光元件組立裝置2與前一實施例不同之處 主要在於本實施例的發光元件組立裝置2是供組立多個發光 兀件24之用，發光元件組立裝置2的組立區26經由膠體28 框出外圍輪廓之後’其内更劃分出多個組立子區261作陣列排 列，如：四個以2x2陣列排列的組立子區261。組立子區261 ，間透過基板佈局的製作方法設計出低位區Β與高位區c，在 第3圖中以斜線標出低位區B的範圍’使得低位區b與高位 區c之間存有一高度落差d2。將銲錫材料22設置於組立區 26内之後’每一組立子區261都對應設置有一發光元件％於 其上。其後，將基板20、銲錫材料22及發光元件24 一併進 行加熱或僅加熱觸材料22至銲鍚㈣Μ ，使得銲錫材 料22因重力或内聚力等因素往低位區b流動，並一併帶動其 上的發光凡件24往預定方向移動。在此以第3圖的位置關係 作"兒月’位於圖中左上方的發光元件24會往右下方(預定方向 )移動’位於圖中右上方的發光元件％會往左下方(預^方向 Q)移動，位於圖中右下方的發光元件24會往左上方(預定方向 201145596 R)移動，而位於圖中左下方的發光元件24會往右 。當銲錫材料22降溫之後，回復固她 ㈣綠1，故鄉各個發光元件 是故’由上射可以得知，本發明的發光元件組立裝置及 ，、方法設計具有紐落差的組題，並透過 動帶動其上的發光元雜歡柯義，從喊少發The New Zealand Lizizi area can be subdivided, and the New Ship Lizi area is an array, so that each group of sub-areas can be sighed according to the f, so that it is different according to the movement mode of each bribe light component. Effect. For example, when the low-health is located between the group sub-areas, after performing the various steps of the illuminating-it tilting method provided by the present invention, in the embodiment, the solder material flows to the lower region. The light-emitting elements can move the light-emitting elements of the corresponding implant sub-regions in close proximity to each other, thereby reducing the separation distance between the light-emitting elements. Therefore, it can be known from the above that the light-emitting element assembly device and the method thereof of the present invention are designed to have a height drop of the assembly area, and the light-emitting element on the light-emitting element is moved in a predetermined direction by the refining flow of the solder material, and the light is emitted from the shout. The separation distance between components. [Embodiment] To further illustrate the various embodiments, the present invention is provided with drawings. The drawings are a part of the disclosure of the present invention, which is mainly to explain the embodiments, and can explain the operation principle of the embodiments in conjunction with the description of the specification. With reference to 201145596, the contents of the present invention should be understood by those of ordinary skill in the art, as well as other possible embodiments and advantages of the present invention. Elements in the figures are not to scale, and a similar 70 symbol is generally used to indicate similar elements. - Hundreds of first sprays to join the temple! FIG. 2, FIG. 3 and FIG. 3, wherein the first drawing shows an exploded view of the light-emitting element assembly device according to the first embodiment of the present invention, and FIG. 2 shows the light-emitting element according to the first embodiment of the present invention. The cross-section of the erecting device is not considered, and FIG. 3 is a flow chart showing the method of illuminating the illuminating component according to the present invention. Although the illuminating component illuminating method disclosed in FIG. 3 is applied to the illuminating component arranging device of the first embodiment, However, the light-emitting element assembly method of the present invention is not limited thereto, and can be applied to other devices. As shown in the figure, the light-emitting unit assembly apparatus 1 includes a substrate 10, a tin-tin material 12, and a light-emitting element 214. The substrate ίο - a colloid 18 on the side, such as: a coating thickness of 001 public housing to 0 05 mm of the solder resist forming-assembly area 16 (step S310), in the present embodiment, the colloid 18 is surrounded by On the periphery of the assembly area 16, however, in other embodiments, the colloid does not need to define the assembly area in an enclosing manner, or may be coated only along the 'sector'. This embodiment exemplarily applies a bismuth-containing alloy as a fresh tin material 12' such as: various tin-containing solder knives, with any combination of anti-welding varnish, a varnish, crepe, crepe or an epoxy resin. As the colloid 18. It is seen from Fig. 2 that there is a low position a in the grouping zone 16, thus forming a height loft dl. The solder material 12 is disposed in the grouping region 16, and the light-emitting elements 14 are correspondingly disposed above the solder material 12 (step S320). Therefore, after the solder material 12 and the light-emitting element 14 are sequentially placed on the substrate ίο from the bottom to the top, the substrate 1 , the solder material 12 , and the light-emitting element 14 can be heated together or only the solder material 12 or even the solder can be heated. Material 12 melts. After the solder material [S1 201145596 12 is melted, the solder material flows to the low position A by factors such as gravity or cohesion, and drives the upper light-emitting element 14 to move in a predetermined direction (step S330). After the solder material 12 is cooled, the solid phase state is restored to fix the position of the light-emitting element 14, so that the light-emitting element grouping device 改变 can change the position of the light-emitting element 14 in a group. Please refer to FIG. 4 and FIG. 5, wherein FIG. 4 is a top view showing a light-emitting element assembly device according to a second embodiment of the present invention, and FIG. 5 is a view showing a light-emitting element assembly device according to a second embodiment of the present invention. Schematic diagram of the section. As shown in the figure, the light-emitting element assembly device 2 of the present embodiment differs from the previous embodiment mainly in that the light-emitting element assembly device 2 of the present embodiment is used for assembling a plurality of light-emitting elements 24, and the light-emitting element assembly device After the assembly area 26 of the frame 26 is framed by the colloid 28, the plurality of group sub-regions 261 are further arranged in an array, such as four array sub-regions 261 arranged in a 2x2 array. The sub-region 261 is formed, and the lower region Β and the upper region c are designed by the method of fabricating the substrate layout. The range of the lower region B is marked with a slanted line in FIG. 3 such that there is a height between the lower region b and the upper region c. Drop d2. After the solder material 22 is disposed in the grouping region 26, each of the group of sub-regions 261 is provided with a light-emitting element% thereon. Thereafter, the substrate 20, the solder material 22, and the light-emitting element 24 are heated together or only the contact material 22 is heated to the solder (4), so that the solder material 22 flows to the lower region b due to factors such as gravity or cohesion, and drives the solder material 22 together. The upper illuminated member 24 moves in a predetermined direction. Here, in the positional relationship of FIG. 3, the light-emitting element 24 located at the upper left of the figure will move to the lower right (predetermined direction). The light-emitting element % located at the upper right of the figure will go to the lower left (pre-^ The direction Q) moves, and the light-emitting element 24 located at the lower right in the figure moves to the upper left (predetermined direction 201145596 R), and the light-emitting element 24 located at the lower left of the figure goes to the right. After the solder material 22 cools down, it restores her (four) green 1 and the various light-emitting elements of the hometown are known as 'from the upper shot. The light-emitting component assembly device of the present invention and the method design have a set of problems, and are transmitted through Bringing the illuminating element on it
間的間隔距離，故可狀發就件於基板上的相對錄使其發 光中心點偏差於可控制範圍内。 以上敍述依據本發明多個不同實施例，其中各項特徵可以 單一或不同結合方式實施。因此，本發明實施方式之揭露為闡 明本發明原則之具體實施例’應不拘限本發明於所揭示的實施 例1進-步言之，先前敍軌其關僅為本發明示範之用，並 不文其限囿。其他元件之變化或組合皆可能，且不悖于本發明 之精神與範圍。 xThe distance between the two is such that the relative recording on the substrate can cause the light-emitting center point to deviate within a controllable range. The foregoing description is in accordance with various embodiments of the present invention in which various features may be implemented in a single or different combination. Therefore, the disclosure of the embodiments of the present invention is intended to clarify the specific embodiments of the present invention. It should be understood that the present invention is not limited to the disclosed embodiments. It is not limited. Variations or combinations of other elements are possible and are not intended to be within the spirit and scope of the invention. x
【圖式簡單說明】 第1圖顯示依據本發明的第一實施例的發光元件組立裝置的 爆炸圖。 第2圖顯示依據本發明的第一實施例的發光元件組立裝置的 剖面示意圖。 第3圖顯示依據本發明的發光元件組立方法的流程圖。 第4圖顯示依據本發明的第二實施例的發光元件組立裝置的 201145596 上視圖。 第5圖顯示依據本發明的第二實施例的發光元件組立裝置的 剖面示意圖。 【主要元件符號說明】BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an exploded view of a light-emitting element assembly apparatus according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view showing the light-emitting element assembly apparatus according to the first embodiment of the present invention. Fig. 3 is a flow chart showing a method of assembling a light-emitting element according to the present invention. Fig. 4 is a top plan view showing a light-emitting element assembling device according to a second embodiment of the present invention. Fig. 5 is a cross-sectional view showing a light-emitting element assembly apparatus according to a second embodiment of the present invention. [Main component symbol description]
1，2發光元件組立裝置 12,22銲錫材料 16,26 組立區 261 組立子區 C 尚位區 dl,d2高度落差 10,20基板 14, 24發光元件 18,28膠體 A, B低位區 X，P,Q，R,S預定方向 S310, S320, S330 步驟1,2 light-emitting element assembly device 12, 22 solder material 16, 26 group vertical region 261 group sub-region C still-position region dl, d2 height drop 10, 20 substrate 14, 24 light-emitting elements 18, 28 colloid A, B low-level region X, P, Q, R, S predetermined directions S310, S320, S330