201133948 六、發明說明： 【發明所屬之技術領域】 本發明「發光二極體封裝結構」，尤指一種將發 光晶片與螢光粉以非接觸式之封裝設計。 【先前技術】201133948 VI. Description of the Invention: [Technical Field of the Invention] The "light emitting diode package structure" of the present invention, in particular, a non-contact package design of a light-emitting chip and a phosphor powder. [Prior Art]
按’發光二極體（LED )的應用已十分廣泛且 逐漸地應用更為多元化，目前應用於照明的led基 本結構，如第9圖所示，為第一種習用結構，主要 係在一圍起的外封體（〇uter package )内設有一晶 片，該晶片表面再封設有一螢光混合膠，該螢光混 合膠内包含有：基礎膠體（一般為矽膠）、螢光粉、 活化劑等，該螢光混合膠封設於該外封體的上方， 並與晶片直接或間接接觸，因此當晶片發光時，該 光線穿過保護透鏡，並與保護透鏡内的螢光粉產生 作用而形成不同的色澤。 請參看第10圖所示 和上一種的不同處，係先 加上螢光混合膠，使螢光 第1 1圖所示，為第3種 粉設於螢光混合膠的上層 光粉而發出白光。 ，係為第2種習用結構， 將螢光粉覆在晶片處，再 粉更接近晶片；再請參看 習用結構，主要是將螢光 ’使晶片射出之光經過螢 照明用LED)， 惟由於高功率的LED (例如： 201133948 發出的熱量極高，因此由晶片發出的熱，會直接傳 導至螢光混合膠，使得該基礎膠體（一般為梦膠）、 螢光粉、活化劑長時間被燒烤於高熱之下，使得螢 光粉容易因LED產生之高溫而劣化變質，同時產生 光衰之現象，而螢光混合膠長時間則容易發生脆裂 ' 情形，是習用LED最常見的缺點。 其次，為了減緩上述高功率LED的高熱對螢光 • 混合膠及螢光粉的影響，必需研發及使用耐高溫的 螢光粉及膠體，使得LED的成本一直居高不下，是 習用另一缺點。 由於LED在裝設晶片後，係以含有螢光粉的混 合膠體塗佈封设於晶片並結合為一體，但由於榮光 粉在螢光混合膠内的分佈不易均勻，且容易在凝固 時產生飄移的現象，故LED在塗佈螢光粉後，需再 進行光學測試，一旦光飽和度有偏差或色澤失真， ® 則將連同優良的外封體及晶片一併捨棄，使得良率 一直無法提昇’成本無法有效控制，是習用又一缺 ' 點。 【發明内容】 本發明之主要目的’是將發光二極體的晶片與 含螢光粉的保護透鏡以非接觸式的方式完成封裝， 藉此使晶片的熱無法直接傳導至螢光粉及保護透 鏡，不但使螢光粉及保護透鏡具有更佳的壽命，同 201133948 時若LED在光學測試後不合格，可以直接將該保護 透鏡剝除，重新封設光學測試合格之保護透鏡即 可，並不影響良好的晶片系統，可以節省成本，為 本發明之主要特色。 為達上述之目的，本發明可以下列的方式來達 成的： 設一基板（Substrate)，其上至少設有一個晶片； 0 再設一外封體’係圍設前揭之晶片，且該外封體 之南度係南於晶片之南度；更設一具有螢光粉 (Phosphors)的保護透鏡（Lens)係封合於外封體的 頂部，且使外封體内的晶片與保護透鏡之間係留 有一空間。 藉此’使晶片所發出的高熱，不會直接接觸 傳導到保護透鏡及螢光粉’而是先被一空間阻 隔，只能以輻射的方式至達保護透鏡，因此對於 φ 保護透鏡及螢光粉的熱破壞即減少許多；同時若 保護透鏡及螢光粉的測試為不良品，則可將該保 、 1蔓透鏡自外封體的上方剝除更換，且選用的螢光 _ ㈣料不需W高溫而節省成H本發明之諸項 優點。 【實施方式】 之内容，僅 為使責審查委員能清楚了解本發明 以下列說明搭配圖式，說明如后。 201133948 明參看第1圖所示，本發明至少包含有： 一基板（1 0 )( Substrate )，其上至少設有一 個晶片（2 〇 )(本圖以三顆為實施例）。 一外封體（3 〇 )(outerpackage)，係圍設前 揭之晶片（2 0 ) ’且該外封體（3 〇 )之高度係高 於晶片（2〇)之高度，且該外封體（3〇)於頂 部係設有或凸或凹的接合部（3丄）。 φ 一具有勞光粉（60)( Phosphors )的保護透 鏡（5 0 )( Lens)係封合於外封體（3 〇 )的頂部， 且使外封體（3 〇 )内的晶片（2 〇 )與保護透鏡 (5 0 )之間係留有一空間（4 〇 );該空間（4 0 ) 可為抽真空狀或填充有鈍氣，或其他稀薄的空氣。 上述之保護透鏡（5 0 )封合於外封體（3 0 ) 的頂部，可以各種不同的方法，例如第工圖所示， 係以保濩透鏡（5 〇 )的邊緣（5 3 )直接與外封 Φ 體（3〇)的接合部（31)封合，但也可使用習 知的其他技藝，如：鳩尾槽的扣固等方式封接，並 , 不影響本案的實施。 , 而本發明在第1圖所示的保護透鏡（50)，其 榮光粉（6 0 )係以塗佈的方式均勻設於保護透鏡 (5 〇 )的内側面（5丄），也可以如第6、7圖所 不將螢光粉（6 0 )塗佈在保護透鏡（5 〇 )的外 側面（5 2 )，但第1、6、7圖所示的方式，係在 相對的保護透鏡（5 〇 )内側面（5工）或外側面 6 m 201133948 (5 2 )形成一凹部，以供容設螢光粉（6 〇 );但 也可以如第8圖所示’將保護透鏡（5 〇 〇)直接 形成一平板鏡面’在任一側面以均勻塗佈或以離心 旋轉的方式，在該保護透鏡（5 0 〇 )上形成均勾 的螢光粉（6 0)薄膜’並可視需要而增加或減少 厚度。 本發明之製程亦十分方便’請參看第2圖所 示’係在基板（1 〇 )上設有數個晶片（2 〇 )，並 打上金線（8 0 )’以構成一基本的線路，再由一外 封體（30)予以圍設成一 LED區域，再如第3圖 所示，為使該晶片（2 0 )及金線（8 〇 )等線路 不被破壞，可在此時先塗上一層高透光的封膠（7 〇 )(即EnCapsulant)作為保護膜，其目的是防止 塵埃落下，或減少因震動而損害線路。 請參看第4、5圖所示，一具有螢光粉（6〇) 的保護透鏡（5 G )係封合於外封體（3 ◦)的頂 部，且使外封體（3Q)内的晶片（20)與保護 透鏡（5 0 )之間留有一空間（4 〇 )。 •由於本發明的設計中，該晶片（2 〇 )與保護 :鏡（50)並不接觸，故該晶片（2〇)所發出 熱’不會直接接觸傳導到保護透鏡（5 〇 )，而 :先被-空間（4 〇 )阻隔’只能以輻射的方式至 技保護透鏡（5 0 )，因此對於保護透鏡（5 0 )及 勞光粉（6 〇 )的熱破壞即減少許多，而該空間（4 201133948 ο)内亦可填充有鈍氣’更能保護内部電路或元件 不易受氧化’為本發明之主要優點。 另外’如第5圖所示，若保護透鏡（5 〇 )及 螢光粉（6 0 )的測試為不良品，則如第4圖所示， 可將該保護透鏡（5 〇 )自外封體（3 〇 )的上方 剝除’由於該保護透鏡（5 〇 )並不與晶片（2 〇 ) 接觸，因此並不會破壞基板（1〇)、數個晶片 ◦)、外封體（3 0 )的結構，即可保留優良的元件， 故能節省成本，為本發明之另一優點。 又由於本發明的保護透鏡（5 0 )及螢光粉（6 〇)並不直接與晶片（2〇)接觸，故可僅需適度 選用適合溫度的原料，能節省成本，為本發明之又 一優點。 以上所述者，僅為本發明之較佳實施例而已，The application of 'LEDs' has been widely and gradually applied more diversified. The basic structure of LEDs currently used for illumination, as shown in Figure 9, is the first conventional structure, mainly in a A wafer is disposed in the enclosed 〇uter package, and the surface of the wafer is further sealed with a fluorescent mixed rubber. The fluorescent mixed rubber comprises: a base gel (generally silicone), phosphor powder, and activation. The fluorescent hybrid rubber is sealed on the outer sealing body and directly or indirectly in contact with the wafer, so when the wafer emits light, the light passes through the protective lens and acts on the fluorescent powder in the protective lens. And form a different color. Please refer to the difference between the above and the previous one. First, add the fluorescent mixed glue to make the fluorescent light shown in Figure 11. The third kind of powder is set on the upper layer of the fluorescent mixed glue. White light. Is the second conventional structure, the fluorescent powder is coated on the wafer, and the powder is closer to the wafer; please refer to the conventional structure, mainly to fluoresce the light emitted by the wafer through the LED for illumination, but High-power LEDs (for example: 201133948 emits a very high amount of heat, so the heat emitted by the wafer is directly transmitted to the fluorescent hybrid, making the base colloid (usually Mengjiao), phosphor powder, and activator for a long time Under the high heat of the barbecue, the fluorescent powder is easily deteriorated due to the high temperature generated by the LED, and at the same time, the phenomenon of light decay occurs, and the fluorescent hybrid rubber is prone to brittleness for a long time, which is the most common shortcoming of the conventional LED. Secondly, in order to alleviate the influence of the high heat of the high-power LED on the fluorescent, hybrid and fluorescent powders, it is necessary to develop and use high-temperature resistant phosphors and colloids, so that the cost of LEDs has always been high, which is another disadvantage of the conventional use. Since the LED is packaged on the wafer and integrated with a mixed colloid containing phosphor powder after the wafer is mounted, since the distribution of the glory powder in the fluorescent hybrid is not uniform, It is easy to drift during solidification. Therefore, after coating the phosphor powder, the LED needs to be optically tested. Once the light saturation is deviated or the color is distorted, ® will be discarded together with the excellent outer seal and wafer. The yield is always unable to improve. 'The cost cannot be effectively controlled, and it is a common use.' The main purpose of the present invention is to make the LED of the light-emitting diode and the protective lens containing the phosphor powder non-contact type. The way to complete the package, so that the heat of the wafer can not be directly transmitted to the phosphor powder and the protective lens, not only the fluorescent powder and the protective lens have a better life, and if the LED is not qualified after the optical test in 201133948, it can be directly Stripping the protective lens and re-encapsulating the optical lens with acceptable optical test can not affect the good wafer system, and can save cost, which is the main feature of the present invention. To achieve the above purpose, the present invention can be as follows To achieve: a substrate (Substrate), at least one wafer is provided; 0, an external sealing body is set to surround the exposed wafer, and the outer The southern part of the body is south to the south of the wafer; a protective lens (Lens) with phosphor powder is attached to the top of the outer sealing body, and the wafer in the outer sealing body and the protective lens are There is a space between the two systems. By this, the high heat generated by the wafer is not directly contacted to the protective lens and the phosphor powder, but is first blocked by a space, and can only reach the protective lens by radiation, so The thermal damage of the protective lens and the phosphor powder is reduced a lot. At the same time, if the test of the protective lens and the fluorescent powder is a defective product, the protective lens and the 1 vine lens can be stripped and replaced from the upper side of the outer sealing body, and the selected firefly is selected. The light_(4) material does not need to be high temperature and saves the advantages of the present invention. [Embodiment] The content of the invention is only for the responsibility of the reviewing committee to clearly understand the present invention with the following description and the accompanying drawings, as explained later. Referring to Fig. 1, the present invention at least includes a substrate (10) (substrate) having at least one wafer (2 〇) thereon (three in the figure). An outer package (3 〇) (outer package) enclosing the previously uncovered wafer (20) and the height of the outer envelope (3 〇) is higher than the height of the wafer (2 〇), and the outer seal The body (3〇) is provided with a convex or concave joint (3丄) on the top. φ A protective lens (50) with a phosphorous powder (60) (Lens) is sealed on the top of the outer sealing body (3 〇), and the wafer in the outer sealing body (3 〇) (2) 〇) There is a space (4 〇) between the protective lens (50); the space (40) can be vacuumed or filled with blunt gas, or other thin air. The protective lens (50) described above is sealed on the top of the outer sealing body (30), and can be directly applied to the edge (5 3 ) of the lens (5 〇) by various methods, for example, as shown in the drawing. It is sealed with the joint portion (31) of the outer seal Φ body (3 〇), but it can also be sealed by other conventional techniques, such as fastening of the dovetail groove, and the like, and does not affect the implementation of the present case. Further, in the protective lens (50) shown in Fig. 1, the glare powder (60) is uniformly applied to the inner side surface (5 丄) of the protective lens (5 〇) by coating, or may be In Figures 6 and 7, the phosphor powder (60) is not applied to the outer side surface (5 2 ) of the protective lens (5 〇), but the methods shown in Figures 1, 6, and 7 are relative protection. The inner side of the lens (5 〇) or the outer side 6 m 201133948 (5 2 ) forms a recess for fluorinating powder (6 〇); however, it can also be as shown in Fig. 8 (5 〇〇) directly form a flat mirror 'on either side to uniformly coat or rotate by centrifugation, form a uniform fluorescent powder (60) film on the protective lens (50 〇) and visualize Increase or decrease the thickness as needed. The process of the present invention is also very convenient 'please refer to Fig. 2' to set a number of wafers (2 〇) on the substrate (1 〇) and put a gold wire (80) to form a basic circuit. An LED body is surrounded by an outer sealing body (30), and as shown in FIG. 3, in order to prevent the circuit such as the wafer (20) and the gold wire (8 inch) from being damaged, Apply a high-transparent sealant (7 〇) (ie EnCapsulant) as a protective film to prevent dust from falling or to reduce damage to the circuit due to vibration. Please refer to Figures 4 and 5, a protective lens (5 G) with phosphor powder (6 )) is sealed on the top of the outer sealing body (3 ◦), and the inside of the outer sealing body (3Q) A space (4 〇) is left between the wafer (20) and the protective lens (50). • Since the wafer (2 〇) and the protection: mirror (50) are not in contact with the design of the present invention, the heat generated by the wafer (2 〇) is not directly contacted and transmitted to the protective lens (5 〇), and : The first space-space (4 〇) barrier can only be radiated to the technical protection lens (50), so the thermal damage to the protective lens (50) and the plaster (6 〇) is much reduced. This space (4 201133948 ο) can also be filled with an blunt gas 'more to protect internal circuits or components from oxidation" as the main advantage of the present invention. In addition, as shown in Fig. 5, if the test of the protective lens (5 〇) and the phosphor powder (60) is defective, as shown in Fig. 4, the protective lens (5 〇) can be self-sealed. Stripping above the body (3 〇) 'Because the protective lens (5 〇) is not in contact with the wafer (2 〇), it does not damage the substrate (1 〇), several wafer ◦), and the outer sealing body (3 The structure of 0) can retain excellent components, so that cost can be saved, which is another advantage of the present invention. Moreover, since the protective lens (50) and the phosphor powder (6 〇) of the present invention are not directly in contact with the wafer (2〇), it is only necessary to appropriately select a material suitable for temperature, which can save cost, and is a further An advantage. The above is only the preferred embodiment of the present invention.
综上所述，本發明實具有專利之新穎性，及In summary, the present invention has patent novelty, and
規定，向鈎届裎妞蛮糾 定’向鈞局提起專利之申請。 產業的利用價值更是無法 合業界的期待，應予專利 201133948 【圖式簡單說明】 第1圖係太总 '' 明第一種實施例之結構剖視圖。 第2圖係本發明第一種實施例之組合示意圖a 第3圖係本發明第一種實施例之組合示意圖b 第4圖係、本發明第一種實施例之組合示意圖c 第5圖係'本發明第一種實施例之組合示意圖d 第6圖係本發明第二種實施例之結構示意圖。 第7圖係本發明第二種實施例之結構剖視圖。 第8圖係本發明保護透鏡之另一種實施例圖。 第9圖係習用第1種L E D結構剖視圖。 第1 0圖係習用第2種L E D結構剖視圖。 第1 1圖係習用第3種L E D結構剖視圖。 2 〇晶片 3 1接合部 5 〇保護透鏡 5 1内侧面 5 3邊緣 7 0封膠 【主要元件符號說明】 1 〇基板 3 〇外封體 4 〇空間 5 〇 0保護透鏡 5 2外側面 6 〇螢光粉 8 〇金線It is stipulated that the application for patents will be filed with the squad. The utilization value of the industry is not expected to meet the expectations of the industry. It should be patented 201133948 [Simplified description of the drawings] Fig. 1 is a cross-sectional view showing the structure of the first embodiment of the present invention. 2 is a combination diagram of a first embodiment of the present invention. FIG. 3 is a combination diagram of a first embodiment of the present invention. FIG. 4 is a combination diagram of a first embodiment of the present invention. 'Combination diagram d of the first embodiment of the present invention. FIG. 6 is a schematic structural view of a second embodiment of the present invention. Figure 7 is a cross-sectional view showing the structure of a second embodiment of the present invention. Figure 8 is a view showing another embodiment of the protective lens of the present invention. Figure 9 is a cross-sectional view showing the first L E D structure. Fig. 10 is a cross-sectional view showing a second type of L E D structure. Fig. 1 is a cross-sectional view showing a third type of L E D structure. 2 〇 wafer 3 1 joint 5 〇 protective lens 5 1 inner side 5 3 edge 7 0 sealant [main component symbol description] 1 〇 substrate 3 〇 outer envelope 4 〇 space 5 〇 0 protective lens 5 2 outer side 6 〇 Fluorescent powder 8 sheet metal wire