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TW201132655A - Radiation sensitive linear resin composition and method for forming photoresist pattern - Google Patents

Radiation sensitive linear resin composition and method for forming photoresist pattern Download PDF

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Publication number
TW201132655A
TW201132655A TW100105089A TW100105089A TW201132655A TW 201132655 A TW201132655 A TW 201132655A TW 100105089 A TW100105089 A TW 100105089A TW 100105089 A TW100105089 A TW 100105089A TW 201132655 A TW201132655 A TW 201132655A
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group
formula
represented
polymer
repeating unit
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TW100105089A
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TWI527832B (en
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Yoshifumi Ooizumi
Akimasa Soyano
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Jsr Corp
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • H10P76/00
    • H10P76/20

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A radiation sensitive linear resin composition having excellent LWR and may not easily occur film reduction is provided. A radiation sensitive resin composition containing (A) polymer having the repeat unit represented by the following general formula (1) and acid dissociation groups, (B) radiation sensitive linear acid generating agent, and (C) polymer containing fluorine atoms is provided (where in the general formula (1), R.sup.1 represents a hydrogen atom and so on, and R.sup.2 represents a single bond and so on. R.sup.3 represents a trivalent organic group).

Description

201132655 六、發明說明: 【發明所屬之技術領域】 本發明爲有關敏輻射線性樹脂組成物及光阻圖型之形 成方法。更詳細而言,爲有關一種可形成顯影後具有良好 之線路邊緣凹凸(Line Width Roughness : LWR ),不易 產生膜消減之光阻膜的敏輻射線性樹脂組成物及光阻圖型 之形成方法。 【先前技術】 於製造積體電路元件之微細加工領域中,爲得到更高 之集積度,亟需一種可於0.10ΜΠ1以下之階段(Level) (即,Sub-Quarter Micron)下可進行微細加工之微影蝕 刻技術,其中又以KrF準分子雷射(波長248nm )或ArF 準分子雷射(波長193 nm)受到極大之注目。 但是,於微細加工之領域中,更希望可形成更微細之 光阻圖型(例如,線寬爲45nm左右之微細光阻圖型), 爲形成更微細之光阻圖型,例如,已有進行將曝光裝置之 光源波長短波長化,或增大透鏡之開口數(NA)等處理 。但,爲使光源波長達成短波長化之目的,常會造成必須 使用高價之新式曝光裝置等問題。又,增大透鏡之開口數 時,常需對解析度與焦點深度進行取捨,例如提高解析度 時,則會有造成焦點深度降低等問題。 因此,近年來,爲解決前述問題之微影蝕刻技術,例 如已有提出浸潤式曝光(液體浸漬式微影蝕刻)法等方法 -5- 201132655 之報告。該方法爲,於曝光時,在透鏡與光阻膜之間(光 阻膜上)介入浸潤式曝光用液體(例如,純水、氟系惰性 液體等)之方法。該方法可使以往充滿空氣或氮氣等惰性 氣體之曝光光路空間,充滿折射率較空氣等之屈折率(η )爲大之浸潤式曝光用液體,而即使使用與以往相同之曝 光光源之情形,亦可得到與使曝光裝置之光源波長短波長 化等之情形所得之相同效果,即,可得到高解析性。又, 不會造成焦點深度降低。 因此,依該些浸潤式曝光法時,可使用實際裝設於現 有裝置內之透鏡,而以低費用、優良解析性,甚至更優良 之焦點深度形成形成優良之光阻圖型》 浸潤式曝光製程,例如,已有提出爲保護敏輻射線性 樹脂組成物所形成之光阻膜,於光阻膜上所形成之浸潤上 層膜之上,進行浸潤式曝光之手法(例如,專利文獻1 ) ,或爲去除浸潤上層膜等目的,而使用含有含氟原子之聚 合物的敏輻射線性樹脂組成物以形成光阻膜之手法(例如 ,專利文獻2),而期待其可達成提高產量(即,提高處 理能力)之目的。 [先前技術文獻] [專利文獻] [專利文獻1]國際公開05/069076號公報 [專利文獻2]國際公開(Π/ΙΙ6664號公報 201132655 【發明內容】 [發明所欲解決之問題] 但是,上述使用含有含氟原子之聚合物的敏輻射線性 樹脂組成物之情形,會於顯影後產生光阻圖型之LWR ( Line Width Roughness)惡化、膜消減等問題。因此,亟 需開發出一種可以形成顯影後具有良好之LWR ’不易產 生膜消減之光阻膜的敏輻射線性樹脂組成物。 本發明爲,爲解決上述以往技術所產生之問題所提出 者,而以提出一種可以形成顯影後具有良好之LWR,不 易產生膜消減之光阻膜的敏輻射線性樹脂組成物及使用其 之光阻圖型之形成方法爲目的。 [解決問題之手段] 本發明者們爲達成上述課題經過深入硏究結果,得知 使用含有(A)特定之重複單位,及,具有酸解離性基之 聚合物,與(B )敏輻射線性酸產生劑,與(C )含有氟 原子之聚合物所得之敏輻射線性樹脂組成物時,即可使達 成上述問題變得容易,因而完成本發明。 本發明爲提供以下之敏輻射線性樹脂組成物,及光阻 圖型之形成方法。 〔1〕一種敏輻射線性樹脂組成物,其特徵爲包含( A)下述通式(1)所表示重複單位,及,具有酸解離性 基之聚合物’與(B )敏輻射線性酸產生劑,與(c )含 有氟原子之聚合物。 201132655 【化1】201132655 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method for forming a linear composition of a radiation sensitive resin and a photoresist pattern. More specifically, it relates to a method for forming a radiation sensitive linear resin composition and a photoresist pattern which can form a photoresist film having good line edge width roughness (LWR) after development and which is less likely to cause film reduction. [Prior Art] In the field of microfabrication for manufacturing integrated circuit components, in order to obtain a higher degree of integration, it is desirable to perform microfabrication at a level of 0.10 ΜΠ 1 or less (ie, Sub-Quarter Micron). The lithography etching technique, in which KrF excimer laser (wavelength 248nm) or ArF excimer laser (wavelength 193 nm) is attracting great attention. However, in the field of microfabrication, it is more desirable to form a finer photoresist pattern (for example, a fine photoresist pattern having a line width of about 45 nm), in order to form a finer photoresist pattern, for example, A process of shortening the wavelength of the light source of the exposure device or increasing the number of apertures (NA) of the lens is performed. However, in order to achieve a short wavelength of the wavelength of the light source, it is often problematic to use a new expensive exposure apparatus. Further, when the number of openings of the lens is increased, it is often necessary to select the resolution and the depth of focus. For example, when the resolution is increased, there is a problem that the depth of focus is lowered. Therefore, in recent years, in order to solve the above-mentioned problem of the lithography etching technique, for example, a report of a method such as an immersion exposure (liquid immersion lithography) method has been proposed -5-201132655. This method is a method of interposing a liquid for immersion exposure (for example, pure water, a fluorine-based inert liquid or the like) between a lens and a photoresist film (on a photoresist film) during exposure. According to this method, the exposure light path space filled with an inert gas such as air or nitrogen can be filled with a liquid having a refractive index (η) having a refractive index higher than that of air or the like, and even if the same exposure light source as in the related art is used, It is also possible to obtain the same effect as that obtained by shortening the wavelength of the light source of the exposure device, that is, high resolution can be obtained. Also, it does not cause a decrease in the depth of focus. Therefore, according to the immersion exposure method, the lens actually installed in the existing device can be used to form an excellent photoresist pattern with low cost, excellent resolution, and even better depth of focus. For the process, for example, a photoresist film formed by protecting a linear radiation-sensitive resin composition and an infiltrated exposure film formed on the wetted upper film formed on the photoresist film have been proposed (for example, Patent Document 1). Or a method of forming a photoresist film using a radiation-sensitive linear resin composition containing a fluorine atom-containing polymer for the purpose of removing the infiltrated upper film or the like (for example, Patent Document 2), and expecting it to achieve an increase in yield (ie, Improve the processing capacity). [PRIOR ART DOCUMENT] [Patent Document 1] International Publication No. 05/069076 (Patent Document 2) International Publication (KOKAI-A No. 6664 No. 201132655) [Problems to be Solved by the Invention] However, the above-mentioned In the case of using a radiation sensitive linear resin composition containing a fluorine atom-containing polymer, problems such as deterioration of LWR (Line Width Roughness) and film reduction of the photoresist pattern may occur after development. Therefore, it is urgent to develop a form which can be formed. A photosensitive radiation linear resin composition having a good LWR 'resistance of a photoresist film which is less likely to cause film reduction after development. The present invention has been made to solve the problems caused by the above prior art, and it is proposed to have a good development after development. LWR, a sensitive radiation linear resin composition of a photoresist film which is less likely to cause film reduction, and a method for forming a photoresist pattern using the same. [Means for Solving the Problem] The inventors have intensively studied to achieve the above problems. As a result, it was found that a polymer containing (A) specific repeating unit, and having an acid-dissociable group, and (B) a radiation-sensitive linear acid generator were used. And (C) a radiation-sensitive linear resin composition obtained by using a polymer containing a fluorine atom, the above problem can be easily attained, and the present invention has been completed. The present invention provides the following radiation-sensitive linear resin composition, and A method for forming a photoresist pattern. [1] A radiation sensitive linear resin composition comprising (A) a repeating unit represented by the following formula (1), and a polymer having an acid dissociable group' (B) a radiation-sensitive linear acid generator, and (c) a polymer containing a fluorine atom. 201132655 [Chem. 1]

(通式(1)中,R1表示氫原子、低級烷基,或鹵化低級 烷基;R2表示單鍵結、碳數1〜5之2價之烴基、烷二基 氧基’或烷二基羰氧基;R3表示3價之有機基) 〔2〕如前述〔1〕所記載之敏輻射線性樹脂組成物, 其中’前述通式(1)所表示重複單位爲下述通式(Id) 所表示重複單位, 【化2】(In the formula (1), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; and R2 represents a single bond, a divalent hydrocarbon group having a carbon number of 1 to 5, an alkanediyloxy group or an alkanediyl group; (2) The sensible radiation linear resin composition according to the above [1], wherein the repeating unit represented by the above formula (1) is the following formula (Id) Represented repeat unit, [Chemical 2]

(通式(1-1)中,R1表示氫原子、低級院基,或_化低 級烷基;R2表示單鍵結、碳數1〜5之2價之烴基、烷二 基氧基’或烷二基羰氧基;R5()表示下述通式(a)所表示 -8- 201132655 之基,或,下述通式(b)所表示之基) 【化3】(In the formula (1-1), R1 represents a hydrogen atom, a lower-grade or a lower alkyl group; R2 represents a single bond, a divalent hydrocarbon group having a carbon number of 1 to 5, an alkanediyloxy group or Alkyldicarbonyloxy; R5() represents a group of -8 to 201132655 represented by the following formula (a), or a group represented by the following formula (b);

(通式(a)中’ nl表示〇〜2之整數·,通式(b)中’ n2 〜η5各自獨立表示〇〜2之整數;通式(a)及通式(b) 中,*表示通式(1 -1 )中與R2鍵結之鍵結鍵;又,通式 (a)所表示之基及通式(b)所表示之基爲’構成該些之 基之碳原子的至少1個可被氧原子、氮原子或羰基所取代 。又,通式(a)所表示之基及通式(b)所表示之基,可 具有取代基) 〔3〕如前述〔2〕所記載之敏輻射線性樹脂組成物, 其中’前述通式(1)所表示重複單位爲下述通式(1-la )所表示重複單位, 【化4】(In the formula (a), 'nl represents an integer of 〇~2, and 'n2 to η5 in the formula (b) each independently represent an integer of 〇~2; in the formula (a) and the formula (b), * And a bond represented by the formula (a) and a group represented by the formula (b) are 'carbon atoms constituting the bases' At least one may be substituted by an oxygen atom, a nitrogen atom or a carbonyl group. Further, the group represented by the formula (a) and the group represented by the formula (b) may have a substituent) [3] as described above [2] The sensitive radiation linear resin composition, wherein the repeating unit represented by the above formula (1) is a repeating unit represented by the following formula (1-la), [Chemical 4]

(1-la) -9- 201132655 (通式(l-la)中,R1表示氫原子、低級烷基,或鹵化低 級烷基;R2表示單鍵結、碳數1〜5之2價之烴基、烷二 基氧基,或烷二基羰氧基;R51爲下述通式(al)所表示 之基,或,下述通式(bl)所表示之基) 【化5】(1-la) -9- 201132655 (In the formula (1-la), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; and R2 represents a single bond, a hydrocarbon group having a carbon number of 1 to 5; , alkanediyloxy, or alkanedicarbonyloxy; R51 is a group represented by the following formula (al), or a group represented by the following formula (bl);

(通式(al)及通式(bl)中,*表示通式(Ι-la)中之 R2鍵結之鍵結鍵) 〔4〕如前述〔1〕所記載之敏輻射線性樹脂組成物, 其中’前述(C)聚合物具有由下述通式(2-1)〜(2_3 )所表示之各重複單位所形成之群所選出之至少1種之重 複單位, -10- 201132655 【化6】(In the formula (al) and the formula (b1), * represents a bond bond of the R2 bond in the formula (Ι-la)) [4] The radiation-sensitive linear resin composition as described in the above [1] Wherein the '(C) polymer has at least one repeating unit selected from the group consisting of each repeating unit represented by the following general formulae (2-1) to (2_3), -10- 201132655 6]

(2-1) (2-2) (2-3) (通式(2-1)〜(2-3)中’ R1表示氫原子、低級烷基’ 或鹵化低級烷基;通式(2-1 )中,R9表示碳數1〜30之 氟化烷基;通式(2-2)中’ R6表示單鍵或(g+Ι)價之 鍵結基,g爲1〜3之整數;通式(2-3 )中’ R7表示2價 之鍵結基;通式(2-2)及通式(2-3)中’ R8表示氫原子 、酸解離性基,或鹼解離性基’ Rl()各自獨立表示氫原子 、氟原子,或碳數1〜10之氟化烷基:又,全部之R1()並 無爲氫原子之情形)。 〔5〕如前述〔4〕所記載之敏輻射線性樹脂組成物, 其中’則述(C)聚合物尙含有,含有下述通式(2-4)所 表示之基與下述通式(2-5)所表示之基之至少一者之基 的重複單位(又’前述通式(2_3)所表示重複單位除外 -11 - 201132655 【化7】 NH I I =S=0 I COOH R11 (2-4) (2-5) (通式(2_4)中,R11表示被氟原子所取代之碳數ι〜1〇 之烴基)。 〔6〕如前述〔5〕所記載之敏輻射線性樹脂組成物, 其中’前述(C)聚合物之含量,相對於前述(A)聚合 物100質量份,爲0.1〜40質量份。 〔7〕一種光阻圖型之形成方法,其特徵爲,具備前 述〔1〕〜〔6〕之任一項所記載之敏輻射線性樹脂組成物 塗佈於基板上以形成光阻膜之光阻膜形成步驟,與於形成 之前述光阻膜上配置浸潤式曝光用液體,介由前述浸潤式 曝光用液體以輻射線照射前述光阻膜之曝光步驟,與使用 顯影液對照射後之前述光阻膜進行顯影以形成光阻圖型之 顯影步驟。 [發明之效果] 本發明之敏輻射線性樹脂組成物,具有可形成顯影後 具有良好之LWR,不易產生膜消減之光阻膜之效果。 [發明之實施形態] -12- 201132655 以下,將對實施本發明之形態進行說明,但本發明並 不受以下之實施形態所限定。即,未超出本發明之主旨之 範圍’基於該業者之通常知識’對於以下實施形態再加入 適當變更、改良等之內容,亦屬於本發明之範圍內。 〔1〕敏輻射線性樹脂組成物: 本發明之敏輻射線性樹脂組成物,爲包含(A )上 述通式(1)所表示重複單位(以下,亦有稱爲「重複單 位(Ϊ )」之情形),及,具有酸解離性基之聚合物(以 下’亦有稱爲「( A )聚合物」之情形),與(B )敏輻 射線性酸產生劑(以下,亦有僅稱爲「( B )酸產生劑」 之情形),與(C)含有氟原子之聚合物(以下,亦有稱 爲「( C )聚合物」之情形)之組成物。 又’本說明書中’通式中之「Rx」所表示之內容中, 表示相同之內容時,亦爲使用相同之編號。 〔1-1〕 ( A)聚合物: (A)聚合物爲具有上述通式(1)所表示重複單位 ,及,酸解離性基,其爲形成本發明之敏輻射線性樹脂組 成物中基材之成份。其中’ 「基材」係指具有膜形成能之 成份之意。該些(A)聚合物’爲可經由酸之作用使酸解 離性基解離而形成鹼可溶性之物,其於酸解離性基解離之 前爲鹼不溶性或鹼難溶性之物。又,本說明書中,「驗不 溶性或驗難溶性」係指使用含有(A )聚合物之敏輻射線 -13- 201132655 性樹脂組成物所形成之光阻膜而形成光阻圖 之鹼顯影條件下,以僅使用(A )聚合物戶 1 OOnm之被膜替代光阻膜進行顯影之情形中 影後仍殘留有初期膜厚的50%以上之性質。 〔l-1-la〕通式(1)所表示重複單位: 通式(1)中之R1以氫原子、甲基、三 〇 通式(1)中之R2所表示之碳數1〜5;; ,例如直鏈狀或分支狀之碳數1〜5之2價 體而言,例如-C Η 2 -、伸乙基、1,3 -伸丙基、 2,2-伸丙基、1,4-伸 丁基、l,3-伸 丁基、l,2-f 通式(1)中之R2所表示之烷二基氧基 〜5之2價之烴基與氧原子鍵結所得之基。β 價之烴基,例如,-CH2-、伸乙基' 1,3-伸丙 基、2,2 -伸丙基、1,4 -伸丁基、1,3-伸丁基、 〇 * 通式(1)中之R2所表示之烷二基羰氧 1〜5之2價之烴基與羰氧基鍵結所得之基| 之2價之烴基,例如,-C Η 2 -、伸乙基、1,3 . 伸丙基、2,2-伸丙基、1,4-伸丁基、1,3-伸丁 基等。 通式(1)中’R3表示3價之有機基, 如3價之鏈狀烴基、具有環狀烴構造之3價 型之際所採用 斤形成之膜厚 ,該被膜於顯 氟甲基爲較佳 匕2價之烴基 之烴基等。具 1,2-伸丙基、 申丁基等。 ,例如碳數1 契數1〜5之2 基' 1,2 -伸丙 1,2-伸丁基等 基,例如碳數 ^。碳數1〜5 -伸丙基、1,2 -基、1,2-伸丁 具體而言,例 之基、具有雜 14 - 201132655 環構造之3價之基等。該些之基,可被羥基、羧基、氰基 等所取代。 通式(1 )所表示重複單位,例如上述通式(1 -1 )所 表示重複單位等,通式(1-1)所表示重複單位之中又以 上述通式(Ι-la)所表示重複單位爲較佳之例。爲上述通 式(1 -1 a )所表示重複單位時,可形成顯影後之LWR更 胃&好’且更不容易產生膜消減之光阻膜。 又’通式(1-1)中之R5。及通式(Ι-la)中之R51, 如上所述般,構成該些之基之碳原子之1個可被氧原子、 氮原子或羰基所取代,亦可具有取代基。取代基例如,碳 數1〜4之直鏈狀、分支狀或環狀之烷基、羥基、氰基、 碳數1〜10之羥烷基、羧基等。 重複單位(I )例如,下述通式(3-1 )〜(3-21 )所 表示之各重複單位等。該些之中,就製得可形成顯影後爲 更優良之LWR、非常不易產生膜消減之光阻膜的敏輻射 線性樹脂組成物之觀點,以使用下述通式(3 - 1 )所表示 重複單位、下述通式(3-9)所表示重複單位爲較佳。又 ,下述通式(3-1)〜(3-21)中之R1表示氫原子、低級 烷基,或鹵化低級烷基。 -15- 201132655 【化8】(2-1) (2-2) (2-3) (In the formula (2-1) to (2-3), 'R1 represents a hydrogen atom, a lower alkyl group' or a halogenated lower alkyl group; In the formula -1), R9 represents a fluorinated alkyl group having a carbon number of 1 to 30; in the formula (2-2), 'R6 represents a single bond or a (g+Ι) valent bond group, and g is an integer of 1 to 3 In the formula (2-3), 'R7 represents a divalent bond group; in the formula (2-2) and the formula (2-3), 'R8 represents a hydrogen atom, an acid dissociable group, or an alkali dissociation property; The radical 'Rl() each independently represents a hydrogen atom, a fluorine atom, or a fluorinated alkyl group having 1 to 10 carbon atoms: further, all of R1() is not a hydrogen atom). [5] The radiation sensitive linear resin composition according to the above [4], wherein the (C) polymer oxime contains a group represented by the following formula (2-4) and a formula (hereinafter) ( 2-5) A repeating unit of at least one of the indicated groups (other than the repeating unit represented by the above formula (2_3) -11 - 201132655 [Chemical 7] NH II = S = 0 I COOH R11 (2 -4) (2-5) (In the formula (2-4), R11 represents a hydrocarbon group having a carbon number of 1 to 1 取代 which is substituted by a fluorine atom). [6] A linear composition of a radiation sensitive resin as described in the above [5] The content of the polymer (C) is 0.1 to 40 parts by mass based on 100 parts by mass of the polymer (A). [7] A method for forming a photoresist pattern, characterized in that it has the aforementioned The photosensitive radiation linear resin composition according to any one of [1] to [6], which is coated on a substrate to form a photoresist film forming step of the photoresist film, and is provided with an immersion exposure on the formed photoresist film. Exposure step of irradiating the photoresist film with radiation through the liquid of the aforementioned immersion exposure, in comparison with the use of the developer The above-mentioned photoresist film is developed to form a resistive pattern development step. [Effect of the Invention] The sensitive radiation linear resin composition of the present invention has a light which can form a good LWR after development and is less likely to cause film reduction. [Embodiment of the Invention] [Embodiment of the Invention] -12-201132655 Hereinafter, the embodiment of the present invention will be described, but the present invention is not limited to the following embodiments. That is, the scope of the present invention is not exceeded. It is also within the scope of the invention to add appropriate modifications, improvements, etc. to the following embodiments. [1] Sensitive radiation linear resin composition: The sensitive radiation linear resin composition of the present invention, (A) a repeating unit represented by the above formula (1) (hereinafter also referred to as "repeating unit (Ϊ)"), and a polymer having an acid dissociable group (hereinafter referred to as 'the same' "(A) polymer"), and (B) a radiation-sensitive linear acid generator (hereinafter, also referred to as "(B) acid generator"), and (C) contains a fluorine atom. The composition of the polymer (hereinafter, also referred to as "(C) polymer"). In the case of "Rx" in the general formula of the present specification, when the same content is expressed, The same number is used. [1-1] (A) Polymer: (A) The polymer is a repeating unit represented by the above formula (1), and an acid dissociable group which forms the linearity of the sensitive radiation of the present invention. The composition of the substrate in the resin composition. The term "substrate" means the composition of the film forming energy. The (A) polymer 'is dissociated from the acid dissociable group to form alkali solubility through the action of an acid. A substance which is alkali-insoluble or poorly soluble in alkali before dissociation of the acid-dissociable group. In addition, in the present specification, "insoluble or poorly soluble" refers to an alkali developing condition in which a photoresist pattern formed by using a photosensitive film composition of (A) polymer-sensitive radiation-13-201132655 resin composition is formed. Next, in the case where only the (A) polymer film of 100 nm was used instead of the photoresist film for development, the property of 50% or more of the initial film thickness remained after the shadow. [l-1-la] The repeating unit represented by the formula (1): R1 in the formula (1) is a hydrogen atom, a methyl group, a carbon number represented by R2 in the formula (1), and a carbon number of 1 to 5 ;; for example, a linear or branched carbon number of 1 to 5, such as -C Η 2 -, ethyl, 1,3 -propyl, 2,2-propyl, 1,4-butylene, 1, 3-butylene, 1,2-f The alkyl group of the alkanediyloxy group ~5 represented by R2 in the formula (1) is bonded to an oxygen atom. The basis. a hydrocarbon group of a β valence, for example, -CH2-, an extended ethyl '1,3-1,3-propyl group, a 2,2-propanyl group, a 1,4-butylene group, a 1,3-butylene group, a 〇* a divalent hydrocarbon group of a divalent alkyl group represented by R2 represented by R2 in the formula (1) and a carbonyloxy group bonded to a carbonyloxy group, for example, -C Η 2 -, an ethyl group 1,3, propyl, 2,2-propenyl, 1,4-tert-butyl, 1,3-butylene, and the like. In the general formula (1), 'R3' represents a trivalent organic group, such as a trivalent chain hydrocarbon group or a trivalent type having a cyclic hydrocarbon structure, and a film thickness of jin is used. A hydrocarbon group such as a hydrocarbon group having a valence of 2 is preferable. With 1,2-propyl, butyl and the like. For example, a carbon number of 1 is a compound of 1 to 5, and a base of 1, 2 -extended is a 1,2-butylene group, such as a carbon number. Carbon number 1 to 5 - a propyl group, a 1,2-group group, a 1,2-diene group, specifically, a group having a trivalent group having a ring structure of a heterotetra 14 - 201132655. These groups may be substituted by a hydroxyl group, a carboxyl group, a cyano group or the like. The repeating unit represented by the formula (1) is, for example, a repeating unit represented by the above formula (1-1), and the repeating unit represented by the formula (1-1) is represented by the above formula (Ι-la). The repeating unit is a preferred example. When the repeating unit is represented by the above formula (1 -1 a ), a photoresist film having a LWR after development and having a better stomach and a film reduction can be formed. Further, R5 in the formula (1-1). And R51 in the formula (Ι-la), as described above, one of the carbon atoms constituting the groups may be substituted by an oxygen atom, a nitrogen atom or a carbonyl group, or may have a substituent. The substituent is, for example, a linear, branched or cyclic alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a cyano group, a hydroxyalkyl group having 1 to 10 carbon atoms, a carboxyl group or the like. The repeating unit (I) is, for example, each repeating unit represented by the following general formulae (3-1) to (3-21). Among these, from the viewpoint of producing a radiation sensitive linear resin composition which can form a more excellent LWR after development and a film resist which is less likely to cause film reduction, it is represented by the following general formula (3 - 1). The repeating unit and the repeating unit represented by the following formula (3-9) are preferred. Further, R1 in the following general formulae (3-1) to (3-21) represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group. -15- 201132655 【化8】

(3·1) (3-2) (3-3) (3-4) (3·5) (3-6) (3·7)(3·1) (3-2) (3-3) (3-4) (3·5) (3-6) (3·7)

上述通式(3-1)〜(3-21)所表示重複單位中,通 式(3-1)〜(3-16)爲相當於上述通式(1-1)所表示重 複單位及上述通式(1 -1 a )所表示重複單位之單位。特別 是上述通式(3-4)〜(3-7)所表示重複單位爲相當於上 述通式(1-1)及通式(Ι-la)中之R5()爲具有取代基之情 形(即,通式(a )所表示之基具有取代基之情形)的重 -16- 201132655 複單位。上述通式(3-11) 、(3-12)所表示重複單位爲 相當於通式(b )所表示之基具有取代基之情形的重複單 位’具體而言,例如構成R5<)之碳原子中之任一個被氧原 子或氮原子所取代之單位。上述式(3-13)〜(3-16)所 表示重複單位,爲相當於通式(b)所表示之基具有取代 基之情形的重複單位,具體而言,例如構成R5()之碳原子 中之任一個被氧原子、氮原子或羰基所取代,且具有取代 基之單位。 又’爲形成重複單位(I)之單體,可使用以往公知 之方法予以合成,具體而言,例如Tetrahedron Letters,In the repeating unit represented by the above formula (3-1) to (3-21), the formulae (3-1) to (3-16) correspond to the repeating unit represented by the above formula (1-1) and the above The unit of the repeating unit represented by the formula (1 -1 a ). In particular, the above formula (3-4) to (3-7) represents a repeating unit in which R5() in the above formula (1-1) and formula (Ι-la) is substituted. (i.e., the case where the group represented by the formula (a) has a substituent) is a weight of -16 to 201132655. The repeating unit represented by the above formula (3-11) and (3-12) is a repeating unit corresponding to the case where the group represented by the formula (b) has a substituent, specifically, for example, carbon constituting R5 < Any unit in which an atom is replaced by an oxygen atom or a nitrogen atom. The repeating unit represented by the above formulas (3-13) to (3-16) is a repeating unit in the case where the group represented by the formula (b) has a substituent, and specifically, for example, a carbon constituting R5() Any one of the atoms is substituted by an oxygen atom, a nitrogen atom or a carbonyl group, and has a unit of a substituent. Further, the monomers which form the repeating unit (I) can be synthesized by a conventionally known method, specifically, for example, Tetrahedron Letters,

Vol. 27,No.32 ρ· 3 74 1 ( 1 98 6)、Organic Letters,Vol. 4,Vol. 27, No. 32 ρ· 3 74 1 (1 98 6), Organic Letters, Vol. 4,

No. 15 p.2561 ( 2002)等所記載之方法予以合成。 〔1 — blb〕其他之重複單位(a): (A)聚合物’除上述通式(1)所表示重複單位以 外,亦可具有其他重複單位(a)之單體。其他之重複單 位(a ),例如以下所示之重複單位(II )〜(VI )等。 〔l-1-lb-l〕重複單位(II ): 重複單位(II )例如下述通式(4-1 )〜(4_7 )所表 示重複單位等》 -17- 201132655 【化9】 R1The method described in No. 15 p.2561 (2002) is synthesized. [1 - blb] Other repeating units (a): (A) The polymer 'in addition to the repeating unit represented by the above formula (1), may also have other repeating units (a). The other repeating unit (a) is, for example, the repeating unit (II) to (VI) shown below. [l-1-lb-1] Repeating unit (II): The repeating unit (II) is represented by the following formula (4-1) to (4_7), and the repeating unit is expressed by the following formula: -17- 201132655 [Chemical 9] R1

R14 (4-1) (通式(4-1)中,R1表示M原子、低級院基’或鹵化低 級烷基;R12〜R14表示相互獨立之碳數1〜4之直鏈狀或 分支狀之烷基,或碳數4〜20之1價之脂環式烴基。又, R13與R14可相互鍵結形成碳數4〜20之2價之脂環式烴 基或其衍生物)。R14 (4-1) (In the formula (4-1), R1 represents a M atom, a lower-grade or a halogenated lower alkyl group; and R12 to R14 represent a linear or branched carbon number of 1 to 4 independently of each other. An alkyl group or an alicyclic hydrocarbon group having a carbon number of 4 to 20, and R13 and R14 may be bonded to each other to form a divalent alicyclic hydrocarbon group having a carbon number of 4 to 20 or a derivative thereof.

通式(4-2 )〜(4-7 )中’ R1表示氫原子、低級烷基 ,或鹵化低級烷基:通式(4-2 )中’ R15表示氫原子或碳 數1〜4之取代或非取代之烷基,Ρ表示1〜3之整數。前 述通式(4-5)及(4-6)中’ R16各自獨立表示氫原子或 甲氧基。前述通式(4-3)及(4-4)中,R17各自獨立表 示單鍵結或-CH2-,m各自獨立表示0或1»前述通式(4- -18- 201132655 4 )及(4-6 )中’ R18各自獨立表示氧原子或_Cii2… 通式(4-1)中之R12〜Rm所表示之碳數丨〜4之烷基 ’例如’甲基、乙基、η -丙基、i_丙基、.n_ 丁基、2_甲基 丙基、1-甲基丙基、t-丁基等。 通式(4-1)中之R12〜Ri4所表示之碳數4〜2〇之1 價之脂環式烴基’及’ R 13及R 14相互鍵結並與各自鍵結 之碳原子共同形成之碳數4〜20之2價之脂環式烴基,例 如,金剛烷骨架、原冰片烷骨架、三環癸烷骨架、四環十 二烷骨架等有橋式骨架,或,環丁烷、環戊烷、環己烷、 環庚烷、環辛烷等之具有環鏈烷骨架之基;該些之基被1 種或1個以上之例如,甲基、乙基、η -丙基、i·丙基、n-丁基、2 -甲基丙基、1-甲基丙基、t -丁基等碳數1〜10之 直鏈狀、分支狀或環狀之烷基所取代之基等的具有脂環式 骨架之基。 該些之脂環式烴基中,以具有金剛烷骨架者、雙環〔 2.2.1〕庚烷骨架者、具有環戊基骨架者、具有環己基骨 架者、具有環庚基骨架者、具有環辛基骨架者爲較佳。 通式(4-1)中之「-CR12R13R14」,具體而言,例如 t-丁基、l-n-(l-乙基-1-甲基)丙基、l-n-(l,l-二甲基 )丙基、l-n-(l,l - —•甲基)丁基、1·η-(1,1- 一 甲基)戊 基、1-(1,1-二乙基)丙基、1-η- (1,1-二乙基)丁基、1-η-(1,1-二乙基)戊基、1-(1-甲基)環戊基、1-(1-乙 基)環戊基、丙基)環戊基、丙基)環 戊基、1-(1-甲基)環己基、1-(1-乙基)環己基' 1-( -19- 201132655 l-n-丙基)環己基、丙基)環己基、1-{卜甲基_ 1-(2 -原冰片基)}乙基、1-{1-甲基-1-(2 -四環癸基) }乙基、1-丨1-甲基-1-(1-金剛烷基)丨乙基、2-(2-甲 基)原冰片基、2- ( 2-乙基)原冰片基、2- ( 2-n-丙基) 原冰片基、2-(2-i -丙基)原冰片基、2- (2 -甲基)四環 癸基' 2-(2-乙基)四環癸基、2-(2-n-丙基)四環癸基 、2-(2-i-丙基)四環癸基、2-(2-甲基)金剛烷基、2-(2-乙基)金剛烷基、2- ( 2-n-丙基)金剛烷基、2- ( 2-i-丙基)金剛烷基或,該些脂環族環所形成之基被1種以上 或1個以上之例如,甲基、乙基、η-丙基' i-丙基、η-丁 基、2-甲基丙基、1-甲基丙基、t-丁基等碳數1〜4之直鏈 狀、分支狀或環狀之烷基所取代之基等。 形成重複單位(II)之單體,例如,(甲基)丙烯酸 2·甲基金剛烷基-2-基酯、(甲基)丙烯酸2-甲基-3-羥基 金剛烷基-2-基酯、(甲基)丙烯酸2-乙基金剛烷基-2-基 酯、(甲基)丙烯酸2 -乙基-3-羥基金剛烷基-2-基酯、( 甲基)丙烯酸2-n-丙基金剛烷基-2-基酯、(甲基)丙烯 酸2-異丙基金剛烷基-2-基酯、(甲基)丙烯酸-2-甲基雙 環〔2.2.1〕庚-2-基酯、(甲基)丙烯酸-2-乙基雙環〔 2.2.1〕庚-2-基酯、(甲基)丙烯酸-8 -甲基三環〔 5.2.1.02’6〕癸烷-8-基酯、(甲基)丙烯酸-8-乙基三環〔 5·2.1.02,6〕癸烷-8-基酯、 (甲基)丙烯酸-4-甲基四環〔6.2.13’6.02’7〕十二烷-4-基酯、(甲基)丙烯酸-4-乙基四環〔6.2.13,6.02,7〕十 -20- 201132655 二烷-4-基酯、(甲基)丙烯酸1-(雙環〔2.2.1〕庚-2-基 )-1-甲基乙基酯、(甲基)丙烯酸1-(三環〔5.2.1.02’6 〕癸烷-8-基)-1-甲基乙基酯、(甲基)丙烯酸1-(四環 〔6.2.13’6.02’7〕十二烷-4-基)-1-甲基乙基酯、(甲基) 丙烯酸1-(金剛烷-1-基)-1-甲基乙基酯、(甲基)丙烯 酸1-(3 -羥基金剛烷-1-基)-1-甲基乙基酯、(甲基)丙 烯酸1,1-二環己基乙基酯、(甲基)丙烯酸1,1-二(雙環 〔2.2.1〕庚-2-基)乙基酯、(甲基)丙烯酸1,1-二(三 環〔5.2.1.02’6〕癸烷-8-基)乙基酯、(甲基)丙烯酸 1,1-二(四環〔6.2_13’6.02’7〕十二烷-4-基)乙基酯、(甲 基)丙烯酸1,1-二(金剛烷-1-基)乙基酯、(甲基)丙 烯酸1-甲基-1-環戊基酯、(甲基)丙烯酸1-乙基-1-環戊 基酯、(甲基)丙烯酸1-甲基-1-環己基酯、(甲基)丙 烯酸1-乙基-卜環己基酯等。 該些單體之中,(甲基)丙烯酸2-甲基金剛烷基-2-基酯、(甲基)丙烯酸2-乙基金剛烷基-2-基酯、(甲基 )丙烯酸-2-甲基雙環〔2.2.1〕庚-2-基酯、(甲基)丙烯 酸-2-乙基雙環〔2.2. 1〕庚-2-基酯、(甲基)丙烯酸1-( 雙環〔2.2.1〕庚-2-基)-1-甲基乙基酯、(甲基)丙烯酸 1-(金剛烷-1-基)-1-甲基乙基酯、(甲基)丙烯酸1-甲 基-1-環戊基酯、(甲基)丙烯酸1-乙基-1-環戊基酯、( 甲基)丙烯酸1-甲基-1-環己基酯、(甲基)丙烯酸1-乙 基-1-環己基酯爲較佳。 通式(4-2)中之R15所表示之可具有碳數1〜4之取 -21 - 201132655 代基的院基,例如,甲基、乙基、n_丙基、k丙基、心丁 基、2_甲基丙基' 1·甲基丙基、〖_丁基等。 重複單位(II)之含有比例,於(Α)聚合物之全重 複單位作爲1 0 0莫耳%之情形,以丨5〜8 5莫耳%爲佳, 以25〜75莫耳%爲更佳’以35〜6〇莫耳%爲特佳。上述 含有比例未達1 5莫耳%時,會損及溶解後之對比(即, 可容解於顯影液之部分與不溶解之部分之對比),而降低 圖型形狀(即’無法得到截面爲矩型之光阻圖型)之疑慮 。又’超過85莫耳%時,將無法充分得到與基板之密著 性’而會有造成所得光阻圖型由基板剝落之疑慮。 〔;l-l-lb-2〕重複單位(III): 其他之重複單位(a )中之重複單位(III ),例如由 以下所示單體所產生之重複單位。即,上述單體例如,( 甲基)丙烯酸-5-側氧基(oxo) -4-氧雜(oxa)-三環〔 4.2.1.03’7〕壬-2-基酯、(甲基)丙烯酸-9-甲氧基羰基- 5-側氧基-4-氧雜-三環〔4.2.1.03’7〕壬-2-基酯、(甲基)丙 烯酸-5-側氧基-4-氧雜-三環〔5.2.1 ·03’8〕癸-2-基酯、( 甲基)丙烯酸-10-甲氧基羰基-5-側氧基-4-氧雜-三環〔 5.2.1.03’8〕壬-2 -基酯、(甲基)丙烯酸-6 -側氧基-7-氧 雜-雙環〔3.2.1〕辛-2-基酯、(甲基)丙烯酸甲氧基羰 基-6-側氧基-7-氧雜-雙環〔3.2.1〕辛-2-基酯、(甲基) 丙烯酸-7-側氧基-8-氧雜-雙環〔3.3.1〕辛-2-基酯、(甲 基)丙烯酸-4 -甲氧基羰基-7-側氧基-8-氧雜-雙環〔3.3.1 -22- 201132655 〕辛-2-基酯、 (甲基)丙烯酸-2-側氧基四氫吡喃-4-基酯、(甲基 )丙烯酸-4-甲基-2-側氧基四氫吡喃-4-基酯、(甲基)丙 嫌酸-4-乙基-2-側氧基四氫吡喃-4-基酯、(甲基)丙烯 酸_4·丙基-2-側氧基四氫吡喃-4-基酯、(甲基)丙烯酸-5-側氧基四氫呋喃-3-基酯、(甲基)丙烯酸-2,2-二甲基-5-側氧基四氫呋喃-3_基酯、(甲基)丙烯酸-4,4 -二甲基- 5-側氧基四氫呋喃-3_基酯、(甲基)丙烯酸-2-側氧基四氫 呋喃-3-基酯、(甲基)丙烯酸-4,4·二甲基-2-側氧基四氫 肤喃-3-基酯、(甲基)丙烯酸-5,5-二甲基-2-側氧基四氫 呋喃-3-基酯、(甲基)丙烯酸_2_側氧基四氫呋喃-3 _基酯 、(甲基)丙烯酸-5-側氧基四氫呋喃_2_基甲基酯、(甲 基)丙儲酸-3,3-二甲基-5-側氧基四氫呋喃-2-基甲基酯、 (甲基)丙烯酸-4,4-二甲基-5-側氧基四氫呋喃-2-基甲基 酯等。 重複單位(III )之含有比例,於(A )聚合物之全重 複單位作爲1 00莫耳%之情形,以〗〇〜5 〇莫耳%爲佳, 以20〜40莫耳%爲更佳。上述含有比例未達10莫耳%時 ’會造成與基板之密著性不充分,而有圖型剝離之情形。 又’超過50莫耳%時,會造成對鹼顯影液之溶解性不充 分’而會有增加顯影缺陷之情形。 〔卜l-lb-3〕重複單位(IV ): 其他之重複單位(a)中之重複單位(IV),例如具 -23- 201132655 有脂環式烴基之重複單位。 具有脂環式烴基之重複單位,例如,下述通式(5 ) 所表示重複單位等。 【化1 1】In the general formulae (4-2) to (4-7), 'R1' represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group: in the formula (4-2), 'R15 represents a hydrogen atom or a carbon number of 1 to 4; A substituted or unsubstituted alkyl group, Ρ represents an integer of from 1 to 3. In the above formulae (4-5) and (4-6), R16 independently represents a hydrogen atom or a methoxy group. In the above formulae (4-3) and (4-4), R17 each independently represents a single bond or -CH2-, and m each independently represents 0 or 1» the above formula (4--18-201132655 4 ) and ( 4-6) wherein R18 independently represents an oxygen atom or _Cii2: an alkyl group having a carbon number of 丨~4 represented by R12 to Rm in the formula (4-1), for example, 'methyl, ethyl, η- Propyl, i-propyl, .n-butyl, 2-methylpropyl, 1-methylpropyl, t-butyl, and the like. The alicyclic hydrocarbon group ' and the R 13 and R 14 having a carbon number of 4 to 2 Å represented by R12 to Ri4 in the formula (4-1) are bonded to each other and form a carbon atom bonded to each other. An alicyclic hydrocarbon group having a carbon number of 4 to 20, for example, a bridged skeleton such as an adamantane skeleton, an ornidyl skeleton, a tricyclodecane skeleton or a tetracyclododecane skeleton, or a cyclobutane, a group having a cycloalkane skeleton such as cyclopentane, cyclohexane, cycloheptane or cyclooctane; and the group having one or more of, for example, a methyl group, an ethyl group, an η-propyl group, Substituted by a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms such as propyl, n-butyl, 2-methylpropyl, 1-methylpropyl or t-butyl. A group having an alicyclic skeleton or the like. Among the alicyclic hydrocarbon groups, those having an adamantane skeleton, a bicyclo [2.2.1] heptane skeleton, a cyclopentyl skeleton, a cyclohexyl skeleton, a cycloheptyl skeleton, and a cyclooctane The base skeleton is preferred. "-CR12R13R14" in the formula (4-1), specifically, for example, t-butyl, ln-(l-ethyl-1-methyl)propyl, ln-(l,l-dimethyl )propyl, ln-(l,l--•methyl)butyl, 1·η-(1,1-methyl)pentyl, 1-(1,1-diethyl)propyl, 1 -η-(1,1-diethyl)butyl, 1-η-(1,1-diethyl)pentyl, 1-(1-methyl)cyclopentyl, 1-(1-ethyl Cyclopentyl, propyl)cyclopentyl, propyl)cyclopentyl, 1-(1-methyl)cyclohexyl, 1-(1-ethyl)cyclohexyl' 1-( -19- 201132655 ln- Propyl)cyclohexyl, propyl)cyclohexyl, 1-{b-methyl-1-(2-anbornyl)}ethyl, 1-{1-methyl-1-(2-tetracyclodecyl)}B Base, 1-丨1-methyl-1-(1-adamantyl)fluorenylethyl, 2-(2-methyl) borneol, 2-(2-ethyl) borneol, 2-( 2-n-propyl) borneol, 2-(2-i-propyl) borneol, 2-(2-methyl)tetracyclononyl '2-(2-ethyl)tetracyclodecyl , 2-(2-n-propyl)tetracyclodecyl, 2-(2-i-propyl)tetracyclodecyl, 2-(2-methyl)adamantyl, 2-(2-ethyl Adamantyl, 2-(2-n-propyl)adamantyl, 2- (2-i -propyl)adamantyl or the group formed by the alicyclic ring is one or more or more, for example, methyl, ethyl, η-propyl 'i-propyl, η-butyl a group substituted with a linear, branched or cyclic alkyl group having 1 to 4 carbon atoms such as 2-methylpropyl group, 1-methylpropyl group or t-butyl group. A monomer forming a repeating unit (II), for example, (meth)acrylic acid 2·methyladamantyl-2-yl ester, (meth)acrylic acid 2-methyl-3-hydroxyadamantyl-2-yl Ester, 2-ethyladamantyl-2-yl (meth)acrylate, 2-ethyl-3-hydroxyadamantyl-2-yl (meth)acrylate, 2-n (meth)acrylate -propyladamantyl-2-yl ester, 2-isopropylidenyl-2-yl (meth)acrylate, 2-methylbicyclo(2.2.1)heptane-2 -yl ester, 2-ethylbicyclo(2.2.1)heptan-2-yl (meth)acrylate, -8-methyltricyclo(5.2.1.02'6]nonane-8 -Base ester, 8-methyltricyclo(5.2.1.02,6)nonane-8-yl ester, (meth)acrylic acid-4-methyltetracyclo[6.2.13' 6.02'7]dodecyl-4-yl ester, (meth)acrylic acid-4-ethyltetracyclo[6.2.13,6.02,7]Te-20-201132655 Dialkyl-4-yl ester, (methyl ) 1-(bicyclo[2.2.1]hept-2-yl)-1-methylethyl acrylate, 1-(tricyclo[5.2.1.02'6]nonane-8-yl) (meth)acrylate -1-methylethyl ester, (A 1-(tetracycline [6.2.13'6.02'7] dodec-4-yl)-1-methylethyl acrylate, 1-(adamantan-1-yl)(meth)acrylate 1-methylethyl ester, 1-(3-hydroxyadamantan-1-yl)-1-methylethyl (meth)acrylate, 1,1-dicyclohexylethyl (meth)acrylate 1,1-di(bicyclo[2.2.1]heptan-2-yl)ethyl (meth)acrylate, 1,1-di(tricyclo[5.2.1.02'6]decane (meth)acrylate -8-yl)ethyl ester, 1,1-di(tetracyclo[6.2_13'6.02'7]dodecan-4-yl)ethyl (meth)acrylate, 1,1 (meth)acrylic acid - bis(adamantan-1-yl)ethyl ester, 1-methyl-1-cyclopentyl (meth)acrylate, 1-ethyl-1-cyclopentyl (meth)acrylate, (A) Base) 1-methyl-1-cyclohexyl acrylate, 1-ethyl-cyclohexyl (meth) acrylate, and the like. Among these monomers, 2-methyladamantyl-2-yl (meth)acrylate, 2-ethyladamantyl-2-yl (meth)acrylate, (meth)acrylic acid-2 -Methylbicyclo[2.2.1]heptan-2-yl ester, (meth)acrylic acid-2-ethylbicyclo[2.2.1]hept-2-yl, (meth)acrylic acid 1-(bicyclo[2.2 .1]hept-2-yl)-1-methylethyl ester, 1-(adamantan-1-yl)-1-methylethyl (meth)acrylate, 1-methyl (meth)acrylate 1--1-cyclopentyl ester, 1-ethyl-1-cyclopentyl (meth)acrylate, 1-methyl-1-cyclohexyl (meth)acrylate, 1-B (meth)acrylate Alkyl-1-cyclohexyl ester is preferred. The base group represented by R15 in the general formula (4-2) which may have a carbon number of 1 to 4 and taken from the group - 21, 201132655, for example, methyl, ethyl, n-propyl, k-propyl, and heart Butyl, 2-methylpropyl ' 1 methyl propyl, _ butyl and the like. The ratio of the repeating unit (II) is, in the case where the total repeating unit of the (Α) polymer is 100% by mole, preferably 丨5 to 8 5 mol%, and more preferably 25 to 75 mol%. Jia's 35~6〇% is especially good. When the above content ratio is less than 15 mol%, the contrast after dissolution (i.e., the portion which can be dissolved in the developing solution and the insoluble portion) is degraded, and the shape of the pattern is lowered (that is, the cross section cannot be obtained). It is a doubt about the rectangular photoresist pattern. Further, when it exceeds 85 mol%, the adhesion to the substrate cannot be sufficiently obtained, and there is a fear that the obtained photoresist pattern is peeled off from the substrate. [; l-l-lb-2] Repeating unit (III): The repeating unit (III) in the other repeating unit (a), for example, a repeating unit produced by the monomer shown below. Namely, the above monomer is, for example, (meth)acrylic acid-5-side oxo(oxo)-4-oxa(oxa)-tricyclo[4.2.1.03'7]non-2-yl ester, (methyl) 9-methoxycarbonyl-5-oxo-4-oxa-tricyclo[4.2.1.03'7]non-2-yl acrylate, 5-(oxy)-4-(oxy)-4-(ethyl) acrylate Oxa-tricyclo[5.2.1 ·03'8]non-2-yl ester, (meth)acrylic acid-10-methoxycarbonyl-5-sideoxy-4-oxa-tricyclic [5.2. 1.03'8]壬-2-yl ester, (meth)acrylic acid-6-o-oxy-7-oxa-bicyclo[3.2.1]oct-2-yl ester, methoxycarbonyl (meth)acrylate -6-Phenoxy-7-oxa-bicyclo[3.2.1]oct-2-yl ester, (meth)acrylic acid-7-c-oxy-8-oxa-bicyclo[3.3.1]- 2-Based ester, (meth)acrylic acid 4-methoxycarbonyl-7-sideoxy-8-oxa-bicyclo[3.3.1-22-201132655]oct-2-yl ester, (methyl) 2-oxo-tetrahydropyran-4-yl acrylate, 4-methyl-2-oxotetrahydropyran-4-yl (meth)acrylate, (methyl)propionic acid 4-ethyl-2-oxo-tetrahydropyran-4-yl ester, (meth)acrylic acid _4·propyl-2-side oxygen Tetrahydropyran-4-yl ester, 5-(oxy)tetrahydrofuran-3-yl (meth)acrylate, 2,2-dimethyl-5-oxo-tetrahydrofuran (meth)acrylate- 3_based ester, (meth)acrylic acid-4,4-dimethyl-5-sided oxytetrahydrofuran-3-yl ester, (meth)acrylic acid-2-oxotetrahydrofuran-3-yl ester, ( Methyl)acrylic acid-4,4·dimethyl-2-oxooxytetrahydrofuran-3-yl, (meth)acrylic acid-5,5-dimethyl-2-oxooxytetrahydrofuran-3 -yl ester, (meth)acrylic acid 2_sideoxytetrahydrofuran-3 yl ester, (meth)acrylic acid-5-sided oxytetrahydrofuran-2-ylmethyl ester, (methyl)-propionic acid- 3,3-Dimethyl-5-oxo-tetrahydrofuran-2-ylmethyl ester, (meth)acrylic acid-4,4-dimethyl-5-oxo-tetrahydrofuran-2-ylmethyl ester, etc. . The ratio of the repeating unit (III) is preferably in the case where the total repeating unit of the (A) polymer is 100% by mole, preferably 〇 5 5 〇 耳 %, and preferably 20 to 40 摩尔 %. . When the content ratio is less than 10 mol%, the adhesion to the substrate may be insufficient, and the pattern may be peeled off. Further, when it exceeds 50 mol%, the solubility in the alkali developing solution may be insufficient, and the development defect may be increased. [Bu-l-3-3] repeating unit (IV): Repeat unit (IV) in other repeating units (a), for example, repeating units having an alicyclic hydrocarbon group of -23-201132655. The repeating unit having an alicyclic hydrocarbon group is, for example, a repeating unit represented by the following formula (5). [1 1]

(通式(5 )中,R1表示氫原子、低級烷基,或鹵化低級 烷基;R19表示碳數4〜20之脂環式烴基)。 通式(5)中之R19所表示之碳數4〜20之脂環式烴 基,例如,環丁烷、環戊烷、環己烷、雙環〔2.2·1〕庚 烷、雙環〔2.2.2〕辛烷、三環〔5.2.1.02’6〕癸烷、四環 〔6·173,6·02,7〕十二烷、三環〔3.3.1.13,7〕癸烷等由環鏈 烷類所產生之脂環族環所形成之烴基等。 該些由環鏈烷所產生之脂環族環,亦可具有取代基, 例如可被1種以上或1個以上之甲基、乙基、η-丙基、i-丙基、η-丁基、2-甲基丙基、1-甲基丙基、t-丁基等碳數 1〜4之直鏈狀、分支狀或環狀之烷基所取代。該些內容 ,並不限定於爲由上述烷基所取代者,亦可由羥基、氰基 、碳數1〜10之羥烷基、羧基、氧所取代者亦可。 可形成重複單位(IV )之單體,例如,(甲基)丙烯 酸-雙環〔2.2.1〕庚-2-基酯、(甲基)丙烯酸·雙環〔 2.2.2〕辛-2-基酯、(甲基)丙烯酸-三環〔5.2.1. 〇2’6〕 -24- 201132655 癸-7-基酯 ' (甲基)丙烯酸-四環〔6.173,6.〇2,7〕十二院_ 9-基酯、(甲基)丙烯酸-三環〔3.3.1.13,7〕癸-1-基酯、 (甲基)丙烯酸·三環〔3.3.1.I3,7〕癸-2-基酯等。 重複單位(IV)之含有比例,於(Α)聚合物之全重 複單位作爲1 0 0莫耳%之情形時,以3 〇莫耳%以下爲佳 ’以25莫耳%以下爲更佳。上述含有比例超過3〇莫耳% 時’會有造成光阻圖型形狀惡化、解析度降低等疑慮。 〔l-l-lb-4〕重複單位(V): 其他之重複單位(a)中之重複單位(V),例如下述 通式(6 )所表示重複單位等。 【化1 2】(In the formula (5), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; and R19 represents an alicyclic hydrocarbon group having 4 to 20 carbon atoms). An alicyclic hydrocarbon group having 4 to 20 carbon atoms represented by R19 in the formula (5), for example, cyclobutane, cyclopentane, cyclohexane, bicyclo[2.2.1]heptane, bicyclo[2.2.2 Octane, tricyclo[5.2.1.0''6]nonane, tetracyclo[6.173,6.02,7]dodecane, tricyclo[3.3.1.13,7]decane, etc. The hydrocarbon group formed by the alicyclic ring produced or the like. The alicyclic ring derived from a cycloalkane may have a substituent, and for example, one or more or more methyl, ethyl, η-propyl, i-propyl, η-butyl may be used. The base group, 2-methylpropyl group, 1-methylpropyl group, t-butyl group and the like are substituted with a linear, branched or cyclic alkyl group having 1 to 4 carbon atoms. These contents are not limited to those substituted by the above alkyl group, and may be substituted by a hydroxyl group, a cyano group, a hydroxyalkyl group having 1 to 10 carbon atoms, a carboxyl group or oxygen. A monomer which can form a repeating unit (IV), for example, (meth)acrylic acid-bicyclo[2.2.1]hept-2-yl ester, (meth)acrylic acid bicyclo[2.2.2]oct-2-yl ester , (meth)acrylic acid-tricyclo[5.2.1. 〇2'6] -24- 201132655 癸-7-yl ester '(meth)acrylic acid-tetracyclo[6.173,6.〇2,7]12院 9-yl ester, (meth)acrylic acid-tricyclo[3.3.1.13,7]non-1-yl ester, (meth)acrylic acid tricyclo [3.3.1.I3,7]癸-2- Base ester and the like. The content of the repeating unit (IV) is preferably in the range of 3 〇 mol% or less when the total repeating unit of the (Α) polymer is 1.0% by mole, and more preferably 25 mol% or less. When the content ratio exceeds 3 〇 mol%, there is a concern that the shape of the photoresist pattern is deteriorated and the resolution is lowered. [l-l-lb-4] repeating unit (V): a repeating unit (V) in the other repeating unit (a), for example, a repeating unit represented by the following formula (6). [1 2]

(通式(6 )中,R1表示氫原子、低級烷基,或鹵化低級 烷基;R2C>表示2價之有機基)。 通式(6 )中之R2G所表示之2價之有機基,以2價 之烴基爲佳,以鏈狀或環狀之烴基爲更佳,其亦可爲烷二 醇基,亦可爲伸烷酯基。 R2()所表示之2價之有機基,具體而言,例如-CH2-、 伸乙基、1,3-伸丙基或1,2-伸丙基等之伸丙基、四伸甲基 、五伸甲基、六伸甲基、七伸甲基、八伸甲基、九伸甲基 -25- 201132655 、十伸甲基、十一伸甲基、十二伸甲基、十三伸甲基、十 四伸甲基、十五伸甲基、十六伸甲基、十七伸甲基、十八 伸甲基、十九伸甲基、icosylene基、1-甲基-1,3-伸丙基 、2-甲基1,3-伸丙基、2-甲基-1,2-伸丙基、1-甲基-1,4-伸 丁基、2-甲基-1,4-伸丁基、亞甲基、亞乙基、亞丙基,或 ,2-亞丙基等飽和鏈狀烴基、1,3-環伸丁基等之環伸丁基 、1,3-環伸戊基等之環伸戊基、1,4-環伸己基等之環伸己 基、1,5-環伸辛基等之環伸辛基等之碳數3〜10之環伸烷 基等單環式烴環基、1,4-伸原冰片基或2,5-伸原冰片基等 之伸原冰片基、1,5-伸金剛烷基、2,6-伸金剛烷基等之伸 金剛烷基等2〜4環式碳數4〜30之烴環基等交聯環式烴 環基等。 又,含有R2C)之2價之脂肪族環狀烴基之情形,以於 雙三氟甲基-羥基-甲基,與上述2價之脂肪族環狀烴基之 間設置有作爲間隔物(spacer)之碳數1〜4之伸烷基爲 較佳。又,R2()所表示之2價之有機基,亦例如含有2,5-伸原冰片基之烴基、1,2-伸乙基、伸丙基等爲佳。 形成重複單位(V )之單體,例如,(甲基)丙烯酸 (1,1,1·三氟-2-三氟甲基-2-羥基-3-丙基)酯、(甲基) 丙烯酸(1,1,1-三氟-2-三氟甲基-2-羥基-4-丁基)酯、( 甲基)丙烯酸(1,1,1-三氟-2-三氟甲基-2-羥基-5-戊基) 酯、(甲基)丙烯酸(1,1,1-三氟-2-三氟甲基-2 -羥基- 4-戊基)酯、(甲基)丙烯酸2-{ 〔5-(l,,l’,l,-三氟-2’- 三氟甲基-2’-羥基)丙基〕雙環〔2.2·l〕庚基}酯、 (甲 -26- 201132655 基)丙嫌酸3-{ 〔8-(1,,1,,1,-三氟-2,-三氟甲基_2,-羥基 )丙基〕四環〔6.173,6.〇2,7〕十二烷基}酯等。 重複單位(V)之含有比例,於(A)聚合物之全重 複單位作爲1 0 0莫耳%之情形時,以3 0莫耳%以下爲佳 ’以25莫耳%以下爲更佳。上述含有比例超過3〇莫耳% 時’會有造成所形成之光阻膜更容易受到鹼顯影液而產生 膨潤之疑慮。 〔l-l-lb-5〕重複單位(VI): 其他之重複單位(a )中之重複單位(VI ),例如芳 香族化合物所產生之重複單位等。 形成芳香族化合物所產生之重複單位的單體,例如, 苯乙烯、α-甲基苯乙烯、2-甲基苯乙烯、3-甲基苯乙烯 、4-甲基苯乙烯、2-甲氧基苯乙烯、3-甲氧基苯乙烯、4-甲氧基苯乙烯、4- (2-t-丁氧羰基乙基氧基(oxy))苯乙 烯2-羥基苯乙烯、3-羥基苯乙烯、4_羥基苯乙烯、2_羥 基-α-甲基苯乙烯、3-羥基-α-甲基苯乙烯、4-羥基-α -甲 基苯乙烯、2-甲基-3-羥基苯乙烯、4-甲基-3-羥基苯乙烯 、5-甲基-3-羥基苯乙烯、2-甲基-4-羥基苯乙烯、3-甲基― 4-羥基苯乙烯、3,4-二羥基苯乙烯、2,4,6-三羥基苯乙烯 、4-1-丁氧苯乙烯'4小丁氧-«-甲基苯乙烯、4-(2-乙 基-2-丙氧基)苯乙烯、4-(2-乙基-2-丙氧基)·α-甲基苯 乙稀、4-( 1-乙氧乙氧基)苯乙嫌、4·( 1·乙氧乙氧基)_ α-甲基苯乙烯、(甲基)丙烯酸苯基、(甲基)丙烯酸 -27- 201132655 苄基、苊烯、5 -羥基苊烯、丨-乙烯基萘、2_乙烯基萘、2_ 羥基-6-乙烯基萘、1-萘基(甲基)丙烯酸酯、2_萘基(甲 基)丙烯酸酯、1-萘基甲基(甲基)丙烯酸酯、蒽基( 甲基)丙烯酸酯、2-蒽基(甲基)丙烯酸酯、9_蒽基(甲 基)丙烯酸酯、9-蒽基甲基(甲基)丙烯酸酯、丨_乙烯基 芘等。 重複單位(VI)之含有比例,於(a)聚合物之全重 複單位作爲1 0 0莫耳%之情形時,以4 0莫耳%以下爲佳 ’以30莫耳%以下爲更佳。上述含有比例超過4〇莫耳% 時’於所形成之光阻膜中,因會造成輻射線之透過率降低 ’故會有造成圖型外觀惡化(顯影後之圖型形狀無法形成 矩形)之疑慮。 又’上述各重複單位(II)〜(VI)分別可單獨含有 1種,或含有2種以上亦可。 〔1-1-2〕酸解離性基: 酸解離性基係指,取代羥基、羧基等之極性官能基中 之氫原子後所得之基,而於酸之存在下可以解離之基之意 。該些酸解離性基,具體而言,例如t-丁氧羰基、四氫吡 喃基、四氫呋喃基、(硫代四氫吡喃基磺醯基)甲基、( 硫代四氫呋喃基磺醯基)甲基,或烷氧基取代甲基、烷基 磺醯基取代甲基等。又,烷氧基取代甲基中之烷氧基(取 代基)’例如,碳數1〜4之烷氧基。又,烷基磺醯基取 代甲基中之烷基(取代基),例如,碳數1〜4之烷基。 -28- 201132655 此外,酸解離性基例如通式「-C(R)3」所表示之基等 。又,3個之R表示相互獨立之碳數1〜4之直鏈狀或分 支狀之烷基、碳數4〜20之1價之脂環式烴基或由該些所 衍生之基’或,任意2個之R相互鍵結,各自與鍵結之碳 原子共同形成碳數4〜20之2價之脂環式烴基或由該些所 衍生之基,殘留之1個之R,表示碳數1〜4之直鏈狀或 分支狀之烷基、碳數4〜20之1價之脂環式烴基或由該些 所衍生之基。 通式「-C(R)3」所表示之基中之R所表示之碳數1〜 4之直鏈狀或分支狀之烷基,例如,甲基、乙基、η -丙基 、i-丙基、η-丁基、2 -甲基丙基、1-甲基丙基、t-丁基等 〇 通式「-C(R)3」所表示之基中之R所表示之碳數4〜 2 〇之1價之脂環式烴基,例如,原冰片烷、三環癸烷、 四環十二烷、金剛烷,或環丁烷、環戊烷、環己烷、環庚 烷、環辛烷等之由環鏈烷類等所產生之脂環族環所形成之 基等。又’上述脂環式烴基所衍生之基,例如上述之1價 之脂環式烴基被1種以上或1個以上之例如,甲基、乙基 、η-丙基、i-丙基、n-丁基、2_甲基丙基、丨-甲基丙基、t_ 丁基等之碳數1〜4之直鏈狀、分支狀或環狀之烷基所取 代之基等。 該些之中又以R所表示之碳數4〜20之1價之脂環式 烴基爲,原冰片烷、三環癸烷、四環十二烷、金剛烷、環 戊烷或環己烷所產生之脂環族環所形成之脂環式烴基、該 -29 - 201132655 脂環式烴基被烷基所取代之基爲較佳。 通式「-C(R)3」所表示之基中之R所表示之任意2個 之R相互鍵結,並與各自鍵結之碳原子(鍵結於氧原子之 碳原子)同時形成碳數4〜20之2價之脂環式烴基,例如 ,環伸丁基、環伸戊基、環伸己基、環伸辛基等單環式烴 基、伸原冰片烷基、三環伸癸烷基、四環伸壬烷基等多環 式烴基、伸金剛烷基等交聯多環式烴基等。 又,通式「-C(R)3」所表示之基中之R所表示之任意 2個之R相互鍵結,各自與鍵結之碳原子共同形成碳數4 〜20之2價之脂環式烴基所衍生之基,例如上述之2價 之脂環式烴基被1種以上或1個以上之例如,甲基、乙基 、η-丙基、i-丙基、n-丁基、2-甲基丙基、1-甲基丙基、t-丁基等碳數1〜4之直鏈狀、分支狀或環狀之烷基所取代 之基等。 該些之中又以環伸戊基、環伸己基等單環式烴基,或 其2價之脂環式烴基(單環式烴基)被烷基所取代之基爲 較佳。 其中,通式「-C(R)3」所表示之基,具體而言,例如 t-丁基、1-n- ( 1-乙基-1-甲基)丙基、l-n- ( 1,1-二甲基 )丙基、l-n-(l,l-二甲基)丁基、二甲基)戊 基、1-(1,1-二乙基)丙基、l-n-(l,l-二乙基)丁基、1-n-(l,l-二乙基)戊基、•甲基)環戊基、丨-(1-乙 基)環戊基、l-(l-n-丙基)環戊基、丙基)環 戊基、1·(1-甲基)環己基、1-(1-乙基)環己基、1-( -30- 201132655 l-n-丙基)環己基、^(丨-丨·丙基)環己基、1{1甲基· 1-(2 -原冰片烷基)}乙基、^丨卜甲基-丨-^ -四環癸基 )}乙基、1-{1-甲基金剛烷基)丨乙基、2·(2· 甲基)原冰片烷基、2 - ( 2 -乙基)原冰片烷基、2 _ ( 2 _ η _ 丙基)原冰片烷基、2- ( 2-i·丙基)原冰片烷基、2_ ( 2_ 甲基)四環癸基、2- (2-乙基)四環癸基、2_(2n_丙基 )四環癸基、2-(2-i-丙基)四環癸基、1-(1_甲基)金 剛烷基、1 - ( 1 -乙基)金剛烷基、丨_ (丨_ n _丙基)金剛烷 基、1- ( Ι-i-丙基)金剛烷基,或該些之脂環族環所形成 之基被1種以上或1個以上之例如,甲基、乙基、n_丙基 、i-丙基、η -丁基、2 -甲基丙基、丨_甲基丙基、t_ 丁基等 碳數1〜4之直鏈狀、分支狀或環狀之烷基所取代之基等 〇 該些酸解離性基之中’又以通式「-C(R)3」所表示之 基、t-丁氧羰基、烷氧基取代甲基爲較佳。 〔1-1-3〕氟原子之含有比例: (A)聚合物,可含有氟原子亦可,不含有氟原子亦 可,含有氟原子之情形’相對於(C)聚合物中之氟原子 的含有比例,氟原子之含有比例爲更小。(A )聚合物中 之氟原子之含有比例’於(A )聚合物之總量爲1 〇 〇質量 %之情形,通常爲未達5質量% ’―般以0〜4·9質量% 爲佳,以〇〜4.0質量%爲更佳。(A)聚合物中之氟原子 的含有比例於較(C )聚合物中之比例爲小時’ (c )聚 -31 - 201132655 合物容易偏趨於光阻膜表層。因此,可提高所形成之光阻 膜的表層部分的撥水性,於浸潤式曝光時不需另外形成浸 潤上層膜的同時,即可形成具有良好撥水性之光阻膜的優 點。又,(A)聚合物與(C)聚合物之氟原子的含有比 例差以1質量%以上爲較佳。上述差爲1質量%以上時, (C)聚合物容易偏趨於光阻膜表層。 除了該些(A)聚合物以外,於含有後述(C)聚合 物時,可得到特別適合於浸潤式曝光中形成光阻膜的敏輻 射線性樹脂組成物。具體而言,例如(A )聚合物含有氟 原子之情形,如上所述般,(A)聚合物中之氟原子之含 有比例較(C)聚合物中之氟原子的含有比例爲小。氟原 子之含有比例,相較於(C)聚合物而言,(A)聚合物 之側爲較小時,於形成光阻膜之際,基於(C )聚合物之 撥油性之原因,(C)聚合物於光阻膜表面中,具有分布 較高之傾向。即,(C)聚合物偏趨於光阻膜表層(配置 浸潤式曝光用液體之側)。因此,無須另外設置以阻隔光 阻膜與浸潤媒體爲目的之上層膜,故適用於浸潤式曝光法 使用。其中,本說明書中之氟原子之含有比例,爲使用 13C-NMR所測定之値。 (A)聚合物之凝膠滲透色層分析(GPC )法所測得 之重量平均分子量(Mw),並未有特別限定,一般以 1,000〜1 00,000爲佳,以1,000〜30,000爲更佳,以 1,000〜20, 〇〇〇爲特佳β上述Mw未達1,000時,會有造 成所形成之光阻膜的耐熱性降低之疑慮。又,超過 -32- 201132655 1 00,000時,會有造成所形成之光阻膜的顯影性降低之疑 慮。又,Mw以GPC法所得之與數平均分子量(Μη)之 比(Mw/Mn),通常爲1〜5,較佳爲1〜3。 又,(A)聚合物中之實際製造(A)聚合物之際所 使用之由單體產生之低分子量成份的換算爲固形分之含有 比例,於(A )聚合物之總量爲1 〇〇質量%之情形,以 0.1質量%以下爲佳,以〇.〇7質量%以下爲更佳,以0.05 質量%以下爲特佳。上述含有比例爲〇. 1質量%以下時, 可降低於浸潤式曝光時溶入浸潤式曝光用液體的溶出物量 。此外,可防止存放時異物之發生,又因可防止塗佈時塗 佈斑之發生,故可充分抑制光阻圖型形成時缺陷之發生。 上述由單體產生之低分子量成份,爲Mw5 00以下之 成份,例如,單體、二聚物、三聚物、寡聚物等。該 MW500以下之成份的去除方法(即,(A)聚合物之精製 方法),例如,可使用水洗、溶液萃取等化學性精製法, 或將該些化學性精製法與臨界過濾、離心分離等物理性精 製法組合使用等方法。又,(A)聚合物中之上述由單體 產生之低分子量成份,可使用高速液體色層分析(HPLC )予以檢測。 此外,(A)聚合物以鹵素、金屬等雜質之含量越少 爲越佳。上述雜質之含量較少時,可再改善所形成之光阻 膜的感度、解析度、製程安定性等,而可得到良好之光阻 圖型形狀。 (A )聚合物,例如可將爲形成上述各重複單位所使 -33- 201132655 用之單體(聚合性不飽和單體),使用過氧化氫類、二烷 基過氧化物類、二醯基過氧化物類、偶氮化合物等之自由 基聚合起始劑,必要時於鏈移動劑之存在下,適當之溶劑 中進行聚合之方式予以製造。 上述聚合所使用之溶劑,例如,η -戊烷、η -己烷、η - 庚烷、η-辛烷、η-壬烷、η-癸烷等之鏈烷類;環己烷、環 庚院、環辛焼、Decalin®、原冰片院等之環鍵焼類;苯、 甲苯、二甲苯、乙基苯、異丙苯等之芳香族烴類;氯丁烷 類、溴己烷類、二氯乙烷類、六甲基二溴化物、氯苯等鹵 化烴類;乙酸乙酯、乙酸η-丁酯、乙酸i-丁酯、丙酸甲酯 等飽和殘酸醋類;丙酮、2 -丁酮、4 -甲基-2 -戊酮、2 -庚酮 等之酮類;四氫呋喃、二甲氧基乙烷類、二乙氧基乙烷類 等之醚類;甲醇、乙醇、1-丙醇、2-丙醇、4 -甲基-2-戊醇 等之醇類等。該些之溶劑,可單獨或將2種以上組合使用 〇 聚合時之反應溫度,通常爲40〜150 °C,較佳爲50〜 1 2 〇 °C。反應時間通常爲1〜4 8小時,又以1〜2 4小時爲 較佳。 〔1 -2〕 ( B )敏輻射線性酸產生劑: (B )敏輻射線性酸產生劑爲經由輻射線等光照射( 以下,亦稱爲「曝光」)而產生酸之物質。隨後,經由經 曝光而使(B)酸產生劑產生之酸的作用,使(A)聚合 物中所存在之酸解離性基由(A)聚合物解離。隨後,經 -34- 201132655 酸解離性基解離後之(A )聚合物則形成鹼可溶性。即’ 光阻膜之曝光部對鹼顯影液形成易溶性。隨後,經由鹼顯 影液進行顯影結果,即可形成正型之光阻圖型。前述(B )酸產生劑,例如,特開2 0 0 9 - 1 3 4 0 8 8號公報之段落〔 0080〕〜〔01 13〕所記載之化合物等。 又,(B )酸產生劑可單獨使用1種或將2種以上組 合使用。 (B) 酸產生劑之含量,相對於(A)聚合物100質 量份,以〇 · 1〜3 0質量份爲佳,以2〜2 7質量份爲更佳, 以5〜2 5質量份爲特佳。上述含量未達〇. 1質量份時,所 形成之光阻膜之感度及解析度會有降低之疑慮。又,超過 3 0質量份時,所形成之光阻膜的塗佈性及圖型形狀會有 降低之疑慮。 〔1-3〕 ( C )聚合物: (C )聚合物爲,本發明之敏輻射線性樹脂組成物中 作爲高分子添加劑所含之成份,其爲含有氟原子之聚合物 。含有該些聚合物時,可使所形成之光阻膜具有良好之撥 水性,於浸潤式曝光步驟中可不需形成浸潤上層膜亦可進 行曝光之優點。又’含有(A)聚合物與(C)聚合物結 果’可使(C )聚合物偏趨於光阻膜表層,而可得到良好 之撥水性。 (C) 聚合物’如上所述般,只要爲分子中含有氟原 子之前提下則無特別限制,又以由下述通式(2 -1 )所表 -35- 201132655 示重複單位(以下’亦有稱爲「重複單位(2 -1 )」之情 形)、下述通式(2-2)所表示重複單位(以下,亦有稱 爲「重複單位(2-2 )」之情形),及下述通式(2-3 )所 表示重複單位(以下,亦有稱爲「重複單位(2-3)」之 情形)所形成之群所選出之至少1種之重複單位爲較佳。 具有該些之重複單位結果,可抑制光阻膜中之(B )酸產 生劑或酸擴散控制劑等,溶出於浸潤式曝光用液體中。此 外,因可提高光阻膜與浸潤式曝光用液體之後退接觸角( 增大),故於光阻膜上不易殘留由浸潤式曝光用液體所產 生之水滴,而可抑制因進行浸潤式曝光爲起因之缺陷的發 生。 【化1 3】(In the formula (6), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; and R2C> represents a divalent organic group). The divalent organic group represented by R2G in the formula (6) is preferably a divalent hydrocarbon group, more preferably a chain or cyclic hydrocarbon group, and may be an alkanediol group or a stretching group. Alkyl ester group. a divalent organic group represented by R2(), specifically, a propyl group, a tetramethyl group such as -CH2-, an ethylidene group, a 1,3-propanyl group or a 1,2-propanyl group , five-extension methyl, six-extension methyl, seven-extension methyl, eight-extension methyl, nine-extension methyl-25- 201132655, ten-extension methyl, eleven-extension methyl, twelve-extension methyl, thirteen-extension Methyl, fourteen methyl, fifteen methyl, sixteen methyl, seventeen methyl, eighteen methyl, nineteen methyl, icosylene, 1-methyl-1,3 - propyl, 2-methyl 1,3-propanyl, 2-methyl-1,2-propanyl, 1-methyl-1,4-butylene, 2-methyl-1, a 4-butyl group, a methylene group, an ethylene group, a propylene group, or a saturated chain hydrocarbon group such as a 2-propylene group, a cyclobutyl group such as a 1,3-cyclobutylene group, or a 1,3-butyl group. a cycloalkyl group having a carbon number of 3 to 10, such as a cyclopentyl group such as a pentyl group, a 1,4-cyclohexyl group or the like, a cyclopentyl group such as a 1,5-cyclooctyl group or the like. Or a monocyclic hydrocarbon ring group, a 1,4-extension borneol group or a 2,5-extension borneol base, etc., a 1,5-adamantyl group, a 2,6-exetadamantyl group, etc. 2 to 4 ring carbon such as adenine 4~30 hydrocarbon ring group of the crosslinked cyclic hydrocarbon ring group. Further, in the case of containing a divalent aliphatic cyclic hydrocarbon group of R2C), a spacer is provided between the bistrifluoromethyl-hydroxy-methyl group and the above divalent aliphatic cyclic hydrocarbon group. The alkylene group having 1 to 4 carbon atoms is preferred. Further, the divalent organic group represented by R2 () is preferably, for example, a hydrocarbon group containing a 2,5-extension borneol group, a 1,2-extended ethyl group, a propyl group or the like. a monomer forming a repeating unit (V), for example, (meth)acrylic acid (1,1,1·trifluoro-2-trifluoromethyl-2-hydroxy-3-propyl) ester, (meth)acrylic acid (1,1,1-Trifluoro-2-trifluoromethyl-2-hydroxy-4-butyl)ester, (meth)acrylic acid (1,1,1-trifluoro-2-trifluoromethyl- 2-hydroxy-5-pentyl)ester, (1,1,1-trifluoro-2-trifluoromethyl-2-hydroxy-4-pentyl) (meth)acrylate, (meth)acrylic acid 2 -{[5-(l,,l',l,-trifluoro-2'-trifluoromethyl-2'-hydroxy)propyl]bicyclo[2.2.l]heptyl} ester, (A-26- 201132655 base) Aromatic acid 3-{[8-(1,1,1,-trifluoro-2,-trifluoromethyl-2,-hydroxy)propyl]tetracycline [6.173,6.〇2 , 7] dodecyl} ester and the like. The content ratio of the repeating unit (V) is preferably 30% by mole or less in terms of the total repeating unit of the (A) polymer being 100% by mole, and more preferably 25 % by mole or less. When the content ratio exceeds 3 〇 mol%, there is a fear that the formed photoresist film is more likely to be swollen by the alkali developer. [l-l-lb-5] repeating unit (VI): the repeating unit (VI) in the other repeating unit (a), such as the repeating unit produced by the aromatic compound. a monomer which forms a repeating unit produced by an aromatic compound, for example, styrene, α-methylstyrene, 2-methylstyrene, 3-methylstyrene, 4-methylstyrene, 2-methoxy Styrene, 3-methoxystyrene, 4-methoxystyrene, 4-(2-t-butoxycarbonylethyloxy)styrene 2-hydroxystyrene, 3-hydroxybenzene Ethylene, 4-hydroxystyrene, 2-hydroxy-α-methylstyrene, 3-hydroxy-α-methylstyrene, 4-hydroxy-α-methylstyrene, 2-methyl-3-hydroxybenzene Ethylene, 4-methyl-3-hydroxystyrene, 5-methyl-3-hydroxystyrene, 2-methyl-4-hydroxystyrene, 3-methyl-4-hydroxystyrene, 3,4- Dihydroxystyrene, 2,4,6-trihydroxystyrene, 4-1-butoxystyrene '4 small butoxy-«-methylstyrene, 4-(2-ethyl-2-propoxy) ) styrene, 4-(2-ethyl-2-propoxy)·α-methylphenylethylene, 4-(1-ethoxyethoxy)benzene, 4·(1·ethoxy B Oxy) _ α-methyl styrene, phenyl (meth) acrylate, (meth) acrylate -27- 201132655 benzyl, decene, 5-hydroxy decene, fluorene-vinyl naphthalene, 2 - vinyl Naphthalene , 2_ hydroxy-6-vinylnaphthalene, 1-naphthyl (meth) acrylate, 2-naphthyl (meth) acrylate, 1-naphthylmethyl (meth) acrylate, decyl (methyl) Acrylate, 2-mercapto (meth) acrylate, 9-fluorenyl (meth) acrylate, 9-fluorenylmethyl (meth) acrylate, fluorene-vinyl hydrazine, and the like. The content of the repeating unit (VI) is preferably in the range of 40% by mole or less, more preferably 30% by mole or less, in the case where (a) the total repeating unit of the polymer is 100% by mole. When the content ratio exceeds 4 〇 mol%, the transmittance of the radiation is lowered in the formed photoresist film, so that the appearance of the pattern is deteriorated (the shape of the pattern after development cannot be formed into a rectangle). doubt. Further, each of the above-mentioned repeating units (II) to (VI) may be contained alone or in combination of two or more. [1-1-2] Acid dissociable group: The acid dissociable group means a group obtained by substituting a hydrogen atom in a polar functional group such as a hydroxyl group or a carboxyl group, and is capable of dissociating in the presence of an acid. The acid dissociable group, specifically, for example, t-butoxycarbonyl, tetrahydropyranyl, tetrahydrofuranyl, (thiotetrahydropyranylsulfonyl)methyl, (thiotetrahydrofuranylsulfonyl) a methyl group, or an alkoxy group substituted methyl group, an alkylsulfonyl group substituted methyl group or the like. Further, the alkoxy group is substituted with an alkoxy group (substituted group) in the methyl group, for example, an alkoxy group having 1 to 4 carbon atoms. Further, the alkylsulfonyl group is substituted with an alkyl group (substituent) in the methyl group, for example, an alkyl group having 1 to 4 carbon atoms. -28- 201132655 Further, the acid dissociable group is represented by a group represented by the formula "-C(R)3" or the like. Further, three R's represent a linear or branched alkyl group having a carbon number of 1 to 4 independently, a monovalent alicyclic hydrocarbon group having a carbon number of 4 to 20, or a group derived from the above. Any two R's are bonded to each other, and each of the carbon atoms bonded to the bond forms a divalent alicyclic hydrocarbon group having a carbon number of 4 to 20 or a group derived therefrom, and a residual R represents a carbon number. A linear or branched alkyl group of 1 to 4, a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms, or a group derived therefrom. a linear or branched alkyl group having 1 to 4 carbon atoms represented by R in the group represented by the formula "-C(R)3", for example, methyl group, ethyl group, η-propyl group, i -propyl, η-butyl, 2-methylpropyl, 1-methylpropyl, t-butyl, etc., carbon represented by R in the group represented by the formula "-C(R)3" a monovalent alicyclic hydrocarbon group of 4 to 2 Å, for example, norbornane, tricyclodecane, tetracyclododecane, adamantane, or cyclobutane, cyclopentane, cyclohexane, cycloheptane And a group formed by an alicyclic ring produced by a cycloalkane or the like, such as cyclooctane. Further, the group derived from the above alicyclic hydrocarbon group, for example, the above monovalent alicyclic hydrocarbon group is one or more or more, for example, methyl, ethyl, η-propyl, i-propyl, n. a group substituted with a linear, branched or cyclic alkyl group having 1 to 4 carbon atoms such as a butyl group, a 2-methyl group, a fluorene-methylpropyl group or a t-butyl group. Among the above, the alicyclic hydrocarbon group having a carbon number of 4 to 20 represented by R is an ornidyl, tricyclodecane, tetracyclododecane, adamantane, cyclopentane or cyclohexane. The alicyclic hydrocarbon group formed by the resulting alicyclic ring is preferably a group in which the -29 - 201132655 alicyclic hydrocarbon group is substituted by an alkyl group. Any two Rs represented by R in the group represented by the formula "-C(R)3" are bonded to each other, and carbon atoms are formed simultaneously with the carbon atoms (carbon atoms bonded to the oxygen atom) bonded thereto. The alicyclic hydrocarbon group having a valence of 4 to 20, for example, a monocyclic hydrocarbon group such as a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, or a cyclooctyl group; an exo-norbornyl group; a tricyclodecane A polycyclic hydrocarbon group such as a tetracyclic alkylene group or a crosslinked polycyclic hydrocarbon group such as an adamantyl group. Further, any two Rs represented by R in the group represented by the formula "-C(R)3" are bonded to each other, and each of them forms a carbon number of 4 to 20 carbon atoms together with the bonded carbon atoms. The group derived from the cyclic hydrocarbon group, for example, the above-mentioned divalent alicyclic hydrocarbon group is one or more or more, for example, methyl, ethyl, η-propyl, i-propyl, n-butyl, A group substituted with a linear, branched or cyclic alkyl group having 1 to 4 carbon atoms such as 2-methylpropyl group, 1-methylpropyl group or t-butyl group. Among these, a monocyclic hydrocarbon group such as a cyclopentyl group or a cyclohexyl group or a group in which a divalent alicyclic hydrocarbon group (monocyclic hydrocarbon group) is substituted by an alkyl group is preferred. Wherein, the group represented by the formula "-C(R)3", specifically, for example, t-butyl, 1-n-(1-ethyl-1-methyl)propyl, ln-(1) 1-dimethyl)propyl, ln-(l,l-dimethyl)butyl, dimethyl)pentyl, 1-(1,1-diethyl)propyl, ln-(l,l -diethyl)butyl, 1-n-(l,l-diethyl)pentyl, •methyl)cyclopentyl, fluorenyl-(1-ethyl)cyclopentyl, 1-(ln-propyl Cyclopentyl, propyl)cyclopentyl, 1·(1-methyl)cyclohexyl, 1-(1-ethyl)cyclohexyl, 1-( -30- 201132655 ln-propyl)cyclohexyl, ^(丨-丨·propyl)cyclohexyl, 1{1 methyl·1-(2-arbornyl)}ethyl, 丨 甲基 methyl-丨-^-tetracyclononyl)}ethyl, 1 -{1-methyladamantyl) fluorenylethyl, 2·(2·methyl) ornitonyl, 2 - (2-ethyl) ornithyl, 2 _ ( 2 η η propyl) Insulinic acid alkyl, 2-(2-i.propyl) probornopyl, 2_(2-methyl)tetracyclononyl, 2-(2-ethyl)tetracyclononyl, 2_(2n-propyl Tetracyclic fluorenyl, 2-(2-i-propyl)tetracyclodecyl, 1-(1-methyl)adamantyl, 1-(1-ethyl)adamantyl, 丨_ (丨_ n _ propyl) adamantyl, 1-( Ι-i-propyl)adamantyl, or a group formed by the alicyclic ring is one or more or more, for example, a methyl group, a linear, branched or cyclic carbon number of 1 to 4 such as ethyl, n-propyl, i-propyl, η-butyl, 2-methylpropyl, 丨-methylpropyl or t-butyl The group substituted with an alkyl group is equivalent to the group represented by the formula "-C(R)3", t-butoxycarbonyl group or alkoxy-substituted methyl group among the acid dissociable groups. good. [1-1-3] Content ratio of fluorine atom: (A) The polymer may contain a fluorine atom, may not contain a fluorine atom, and may contain a fluorine atom with respect to the fluorine atom in the (C) polymer. The content ratio of the fluorine atom is smaller. (A) The content ratio of the fluorine atom in the polymer 'in the case where the total amount of the (A) polymer is 1% by mass, usually less than 5% by mass' - generally 0 to 4.9 % by mass Good, with 〇~4.0% by mass as better. (A) The content ratio of fluorine atoms in the polymer is smaller than that in the (C) polymer' (c) Poly-31 - 201132655 The composition tends to favor the surface layer of the photoresist film. Therefore, the water repellency of the surface layer portion of the formed photoresist film can be improved, and the advantage of forming a photoresist film having good water repellency can be formed without separately forming an underlayer film during immersion exposure. Further, the ratio of the fluorine atoms of the (A) polymer to the (C) polymer is preferably 1% by mass or more. When the difference is 1% by mass or more, the (C) polymer tends to tend to be on the surface of the photoresist film. In addition to the (A) polymer, when the polymer (C) described later is contained, a radiation sensitive resin composition which is particularly suitable for forming a photoresist film in the immersion exposure can be obtained. Specifically, for example, when (A) the polymer contains a fluorine atom, as described above, the content ratio of the fluorine atom in the (A) polymer is smaller than the content ratio of the fluorine atom in the (C) polymer. The content of the fluorine atom is smaller than when the side of the (A) polymer is smaller than the (C) polymer, and based on the oil repellency of the (C) polymer when the photoresist film is formed ( C) The polymer has a tendency to be highly distributed in the surface of the photoresist film. That is, the (C) polymer tends to be on the surface of the photoresist film (the side on which the liquid for immersion exposure is disposed). Therefore, it is not necessary to separately provide an overlayer film for blocking the photoresist film and the wetting medium, and therefore it is suitable for use in an immersion exposure method. Here, the content ratio of the fluorine atom in the present specification is ruthenium measured by 13C-NMR. (A) The weight average molecular weight (Mw) measured by the gel permeation chromatography (GPC) method of the polymer is not particularly limited, and is generally preferably 1,000 to 1,000,000, and more preferably 1,000 to 30,000. Preferably, it is 1,000 to 20, and 〇〇〇 is particularly good. When the above Mw is less than 1,000, there is a fear that the heat resistance of the formed photoresist film is lowered. Further, when it exceeds -32 - 201132655 1 00,000, there is a fear that the developability of the formed photoresist film is lowered. Further, the ratio (Mw/Mn) of the Mw obtained by the GPC method to the number average molecular weight (??) is usually from 1 to 5, preferably from 1 to 3. Further, in the (A) polymer, the ratio of the low molecular weight component derived from the monomer used in the actual production of the (A) polymer is the solid content, and the total amount of the (A) polymer is 1 〇. In the case of 〇% by mass, it is preferably 0.1% by mass or less, more preferably 7% by mass or less, and most preferably 0.05% by mass or less. When the content ratio is 〇. 1% by mass or less, the amount of eluted matter dissolved in the immersion exposure liquid at the time of immersion exposure can be reduced. In addition, it is possible to prevent the occurrence of foreign matter during storage, and to prevent the occurrence of coating spots during coating, so that the occurrence of defects during formation of the photoresist pattern can be sufficiently suppressed. The above-mentioned low molecular weight component derived from a monomer is a component of Mw500 or less, for example, a monomer, a dimer, a trimer, an oligomer, or the like. The method for removing the components below MW500 (that is, the method for purifying the polymer (A)) may be, for example, a chemical purification method such as water washing or solution extraction, or a chemical purification method, a critical filtration method, a centrifugal separation method, or the like. A combination of physical refining methods and the like. Further, the above-mentioned low molecular weight component derived from the monomer in the polymer (A) can be detected by high-speed liquid chromatography (HPLC). Further, it is preferable that the (A) polymer has a smaller content of impurities such as a halogen or a metal. When the content of the above impurities is small, the sensitivity, resolution, process stability, and the like of the formed photoresist film can be further improved, and a good photoresist pattern shape can be obtained. (A) a polymer, for example, a monomer (polymerizable unsaturated monomer) used for forming the above-mentioned respective repeating units, -32-201132655, using hydrogen peroxide, a dialkyl peroxide, or a hydrazine The radical polymerization initiator such as a base peroxide or an azo compound is produced by, if necessary, polymerization in a suitable solvent in the presence of a chain shifting agent. The solvent used in the above polymerization, for example, an alkane such as η-pentane, η-hexane, η-heptane, η-octane, η-decane or η-decane; cyclohexane or cycloheptane Ring-ring oximes such as phenyl, toluene, xylene, ethylbenzene, cumene, etc.; chlorobutanes, bromohexanes, etc. Halogenated hydrocarbons such as dichloroethane, hexamethyldibromide and chlorobenzene; saturated residual acid vinegar such as ethyl acetate, η-butyl acetate, i-butyl acetate, methyl propionate; acetone, 2 a ketone such as butanone, 4-methyl-2-pentanone or 2-heptanone; an ether such as tetrahydrofuran, dimethoxyethane or diethoxyethane; methanol, ethanol, 1 An alcohol such as propanol, 2-propanol or 4-methyl-2-pentanol. These solvents may be used singly or in combination of two or more kinds. The reaction temperature at the time of polymerization is usually 40 to 150 ° C, preferably 50 to 12 ° C. The reaction time is usually from 1 to 4 8 hours, preferably from 1 to 24 hours. [1 - 2] (B) Sensitive radiation linear acid generator: (B) The radiation sensitive linear acid generator is a substance which generates an acid by irradiation with light such as radiation (hereinafter also referred to as "exposure"). Subsequently, the acid dissociable group present in the (A) polymer is dissociated from the (A) polymer by the action of the acid produced by the (B) acid generator by exposure. Subsequently, the (A) polymer which is dissociated by the acid dissociable group after -34-201132655 forms alkali solubility. That is, the exposed portion of the photoresist film is easily soluble in the alkali developing solution. Subsequently, the development result is carried out via an alkali developing solution to form a positive resist pattern. The above (B) acid generator is, for example, a compound described in paragraphs [0800] to [0113] of JP-A-2000-135040. Further, the (B) acid generator may be used singly or in combination of two or more. (B) The content of the acid generator is preferably 〇1 to 30 parts by mass, more preferably 2 to 27 parts by mass, based on 100 parts by mass of the (A) polymer, and more preferably 5 to 2 parts by mass. It is especially good. When the above content is less than 0.1 part by mass, the sensitivity and resolution of the formed photoresist film may be lowered. On the other hand, when it exceeds 30 parts by mass, the coating property and pattern shape of the formed photoresist film may be lowered. [1-3] (C) Polymer: (C) The polymer is a component of the polymerizable radiation linear resin composition of the present invention as a polymer additive, which is a polymer containing a fluorine atom. When the polymer is contained, the formed photoresist film can have good water repellency, and the immersion exposure step can be used without exposure to the infiltrated upper film. Further, the inclusion of the (A) polymer and the (C) polymer result allows the (C) polymer to be biased toward the surface of the photoresist film to obtain good water repellency. (C) The polymer 'as described above is not particularly limited as long as it is contained before the fluorine atom is contained in the molecule, and is represented by the following formula (2 -1 ) -35-201132655. There is also a case called "repeating unit (2 -1 )"), and a repeating unit represented by the following formula (2-2) (hereinafter, also referred to as "repetitive unit (2-2)"), It is preferable that at least one of the repeating units selected from the group formed by the repeating unit represented by the following formula (2-3) (hereinafter, also referred to as "repeating unit (2-3)") is preferable. With such a repeating unit result, it is possible to suppress the (B) acid generator or the acid diffusion controlling agent in the resist film from being dissolved in the immersion exposure liquid. In addition, since the contact angle (increased) of the photoresist film and the immersion exposure liquid can be increased, water droplets generated by the immersion exposure liquid are less likely to remain on the photoresist film, and the immersion exposure can be suppressed. The occurrence of defects as a cause. 【化1 3】

(2-1) (2-2) (2-3) (通式(2-1 )〜(2-3 )中,R1表示氫原子、低級烷基, 或齒化低級烷基;通式(2-1 )中,R9表示碳數1〜30之 氟化烷基;通式(2-2)中,R6表示單鍵或(g+Ι)價之 鍵結基,g爲1〜3之整數;通式(2-3)中,R7表示2價 -36- 201132655 之鍵結基;通式(2-2)及通式(2-3)中’ R8表示氫原子 、酸解離性基’或鹼解離性基’ 各自獨立表示氫原子 、氟原子,或碳數1〜1〇之氟化烷基。又’全部之R10並 無爲氫原子之情形)。 〔1-3-1〕通式(2-1)所表示重複單位: 通式(2 - 1 )中之R1所表示之低級烷基,例如,甲基 等。通式(2 -1 )中之R1所表示之鹵化低級烷基,例如, 三氟甲基等。 通式(2-1 )中之R9所表示之碳數1〜30之氟化烷基 ,例如,至少被1個以上之氟原子所取代之碳數1〜6之 直鏈狀或分支狀之烷基、至少被1個以上之氟原子所取代 之碳數4〜20之1價之脂環式烴基或由該些所衍生之基等 〇 其中,至少被1個以上之氟原子所取代之碳數1〜6 之直鏈狀或分支狀之烷基,例如,甲基、乙基、1-丙基、 2- 丙基、1-丁基、2-丁基、2-(2-甲基丙基)基、1-戊基 、2-戊基、3-戊基、1-(2-甲基丁基)基、1-(3-甲基丁 基)基、2-(2-甲基丁基)基、2-(3-甲基丁基)基 '新 戊基、1-己基、2 -己基、3 -己基、1-(2 -甲基戊基)基、 1-(3-甲基戊基)基、1-(4-甲基戊基)基、2-(2·甲基 戊基)基、2-(3 -甲基戊基)基、2-(4 -甲基戊基)基、 3- (2-甲基戊基)基、3-(3-甲基戊基)基等之直鏈狀或 分支狀之烷基的部分氟化或全氟烷基等。 -37- 201132655 又,至少被1個以上之氟原子所取代之碳數4〜20之 1價之脂環式烴基或由該些所衍生之基,例如,環戊基、 環戊基甲基、1-(1-環戊基乙基)基、1-(2-環戊基乙基 )基、環己基、環己基甲基、1-(1-環己基乙基)基、1-(2-環己基乙基)、環庚基、環庚基甲基、1-( 1-環庚基 乙基)基、1-(2-環庚基乙基)基、2-原冰片基等之脂 環式烷基的部分氟化或全氟烷基等。 可形成通式(2 -1 )所表示重複單位之單體,例如, 三氟甲基(甲基)丙烯酸酯' 2,2,2-三氟乙基(甲基)丙 烯酸酯、全氟乙基(甲基)丙烯酸酯、全氟n_丙基(甲 基)丙稀酸醋、全氟i -丙基(甲基)丙燃酸酯、全氟n-丁 基(甲基)丙烯酸酯、全氟i-丁基(甲基)丙烯酸酯、全 氟t-丁基(甲基)丙烯酸酯、、(^^^六氟丙基) (甲基)丙烯酸酯、1- (2,2,3,3,4,4,5,5-八氟戊基)(甲 基)丙烯酸酯、全氟環己基甲基(甲基)丙烯酸酯、丨_( 2,2,3,3,3-五氟丙基)(甲基)丙烯酸酯、 3,3,4,4,5,5,6,6,7,7,8,8,9,9,1〇,1〇,1〇-十七氟癸基)(甲基 )丙烯酸酯、1- ( 5-三氟甲基_3,3,4,4,5,6,6,6·八氟己基) (甲基)丙烯酸酯等》 重複單位(2-1)之含有比例’於(c)聚合物之全重 複單位作爲100莫耳%之情形時,以2〇〜9〇莫耳%爲佳 ,以20〜80莫耳%爲更佳,以2〇〜7〇莫耳%爲特佳。上 述含有比例於上述範圍內時,於所形成之光阻膜中,具有 可得到兼具有撥水性與對顯影液之親和性之平衡性的良好 -38- 201132655 優點。 〔1-3-2〕通式(2-2)所表示重複單位: 通式(2-2 )中之R6所表示之(g + 1 )價之鍵結基’ 具體而言,例如碳數爲1〜3〇之(g+Ι)價之烴基,或該 些之煙基與氧原子、硫原子、亞胺基、鑛基、-CO-0 -或 -CO-NH-之組合所得之構造等。又,g爲1〜3之整數,g 爲2或3之情形,通式(2-2)中之下述通式(2-2a)所 表示之構造爲互相獨立表示者。 [it 14] R10 -(2-2a) OR8 碳數爲1〜30之(g+1)價之烴基中,具有鏈狀構造 之R6,例如,由甲烷、乙烷、丙烷、丁烷、2-甲基丙烷 、戊烷、2-甲基丁烷、2,2-二甲基丙烷、己烷、庚烷、辛 烷、壬烷、癸烷等碳數1〜1〇之鏈狀烴去除(g+Ι)個氫 原子所得之構造等。 又,環狀構造之R6,例如,由環丁烷、環戊烷、環 己烷、雙環〔2.2.1〕庚烷、雙環〔2.2.2〕辛烷、三環〔 5.2.1.02’6〕癸烷、三環〔3.3.1.13’7〕癸烷等碳數4〜20之 脂環式烴去除(g+Ι)個氫原子所得之構造;苯、萘等碳 數6〜30之芳香族烴去除(g+Ι)個氫原子所得之構造等 〇 R6中,烴基與氧原子、硫原子、亞胺基、羰基、 -39 - 201132655 -CO-O-或-CO-NH-組合所得之構造,例如,下述通式所表 示之構造等。又,下述通式中’ R21各自獨立表示單鍵結 、碳數1〜1〇之2價之鏈狀烴基、碳數4〜20之2價之環 狀烴基或碳數6〜30之2價之芳香族烴基。g爲1〜3之 整數; 【化1 5】(2-1) (2-2) (2-3) (In the formula (2-1) to (2-3), R1 represents a hydrogen atom, a lower alkyl group, or a dentated lower alkyl group; In 2-1), R9 represents a fluorinated alkyl group having a carbon number of 1 to 30; in the formula (2-2), R6 represents a single bond or a (g+Ι) valent bond group, and g is 1 to 3 In the formula (2-3), R7 represents a bond group of divalent-36-201132655; in the formula (2-2) and formula (2-3), R8 represents a hydrogen atom and an acid dissociable group. The 'or alkali dissociable group' each independently represents a hydrogen atom, a fluorine atom, or a fluorinated alkyl group having a carbon number of 1 to 1 Å. Further, all of R10 are not a hydrogen atom. [1-3-1] The repeating unit represented by the formula (2-1): a lower alkyl group represented by R1 in the formula (2-1), for example, a methyl group or the like. A halogenated lower alkyl group represented by R1 in the formula (2-1), for example, a trifluoromethyl group or the like. A fluorinated alkyl group having 1 to 30 carbon atoms represented by R9 in the formula (2-1), for example, a linear or branched carbon number of 1 to 6 substituted with at least one or more fluorine atoms An alkyl group, a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms, which is substituted by at least one fluorine atom, or a group derived therefrom, which is substituted with at least one fluorine atom. a linear or branched alkyl group having 1 to 6 carbon atoms, for example, methyl, ethyl, 1-propyl, 2-propyl, 1-butyl, 2-butyl, 2-(2-methyl) Propyl), 1-pentyl, 2-pentyl, 3-pentyl, 1-(2-methylbutyl), 1-(3-methylbutyl), 2-(2- Methylbutyl), 2-(3-methylbutyl)-p-pentyl, 1-hexyl, 2-hexyl, 3-hexyl, 1-(2-methylpentyl), 1-( 3-methylpentyl), 1-(4-methylpentyl), 2-(2-methylpentyl), 2-(3-methylpentyl), 2-(4- a partially fluorinated or perfluoroalkyl group of a linear or branched alkyl group such as methylpentyl), 3-(2-methylpentyl) or 3-(3-methylpentyl) Wait. Further, the alicyclic hydrocarbon group having a carbon number of 4 to 20, which is substituted by at least one fluorine atom, or a group derived therefrom, for example, a cyclopentyl group or a cyclopentylmethyl group , 1-(1-cyclopentylethyl), 1-(2-cyclopentylethyl), cyclohexyl, cyclohexylmethyl, 1-(1-cyclohexylethyl), 1-( 2-cyclohexylethyl), cycloheptyl, cycloheptylmethyl, 1-(1-cycloheptylethyl), 1-(2-cycloheptylethyl), 2-originyl, etc. A partially fluorinated or perfluoroalkyl group of the alicyclic alkyl group. A monomer which can form a repeating unit represented by the formula (2 -1 ), for example, trifluoromethyl (meth) acrylate ' 2,2,2-trifluoroethyl (meth) acrylate, perfluoroethane (meth) acrylate, perfluoro n-propyl (meth) acrylate vinegar, perfluoro i-propyl (meth) propionate, perfluoro n-butyl (meth) acrylate , perfluoro i-butyl (meth) acrylate, perfluoro t-butyl (meth) acrylate, (^^^hexafluoropropyl) (meth) acrylate, 1- (2, 2 ,3,3,4,4,5,5-octafluoropentyl)(meth)acrylate, perfluorocyclohexylmethyl(meth)acrylate,丨_( 2,2,3,3,3 -pentafluoropropyl)(meth)acrylate, 3,3,4,4,5,5,6,6,7,7,8,8,9,9,1〇,1〇,1〇- Heptadecyl sulfhydryl) (meth) acrylate, 1-( 5-trifluoromethyl_3,3,4,4,5,6,6,6-octafluorohexyl) (meth) acrylate, etc. 》 The ratio of the repeating unit (2-1) is 'in the case of (c) the total repeating unit of the polymer is 100 mol%, preferably 2 〇 to 9 〇 mol%, and 20 to 80 mol% For better, it is especially good for 2〇~7〇%. When the content ratio is within the above range, it is advantageous in the formed photoresist film to have a balance between water repellency and affinity for the developer -38-201132655. [1-3-2] The repeating unit represented by the formula (2-2): a (g + 1 )-valent bond group represented by R6 in the formula (2-2) Specifically, for example, a carbon number a hydrocarbon group of 1 to 3 Å (g + Ι), or a combination of the same with an oxygen atom, a sulfur atom, an imine group, a mineral group, -CO-0 - or -CO-NH- Construction, etc. Further, g is an integer of 1 to 3, and g is 2 or 3. The structures represented by the following formula (2-2a) in the formula (2-2) are independent of each other. [it 14] R10 -(2-2a) OR8 A hydrocarbon group having a (g+1) valence of 1 to 30, having a chain structure of R6, for example, methane, ethane, propane, butane, 2 -Methylpropane, pentane, 2-methylbutane, 2,2-dimethylpropane, hexane, heptane, octane, decane, decane, etc. (g + Ι) a structure obtained by hydrogen atoms. Further, R6 of the cyclic structure is, for example, cyclobutane, cyclopentane, cyclohexane, bicyclo [2.2.1] heptane, bicyclo [2.2.2] octane, tricyclo [5.2.1.02'6] a structure obtained by removing (g + Ι) hydrogen atoms from a condensed hydrocarbon having 4 to 20 carbon atoms such as decane or tricyclo[3.3.1.13'7] decane; and an aromatic group having 6 to 30 carbon atoms such as benzene or naphthalene The structure obtained by removing (g + Ι) hydrogen atoms by hydrocarbons is equivalent to 构造R6, and the hydrocarbon group is combined with an oxygen atom, a sulfur atom, an imine group, a carbonyl group, -39 - 201132655 -CO-O- or -CO-NH- The structure is, for example, a structure represented by the following general formula or the like. Further, in the following formula, 'R21 each independently represents a single bond, a chain hydrocarbon group having a carbon number of 1 to 1 fluorene, a cyclic hydrocarbon group having a carbon number of 4 to 20, or a carbon number of 6 to 30. Aromatic hydrocarbon group. g is an integer from 1 to 3; [Chemical 1 5]

上述通式中之R21所表示之碳數1〜10之2價之鏈狀 烴基,例如,甲烷、乙烷、丙烷、丁烷、2-甲基丙烷、戊 烷、2-甲基丁烷、2,2-二甲基丙烷、己烷、庚烷、辛烷、 壬烷、癸烷等所產生之基等。碳數4〜20之2價之環狀烴 基,例如,環丁烷、環戊烷、環己烷、雙環〔2.2.1〕庚 烷、雙環〔2.2.2〕.辛烷 '三環〔5·2_1.02’6〕癸院、三環 〔3.3.1_13’7〕癸烷等所產生之基等。碳數6〜3〇之2價之 芳香族烴基’例如苯、甲苯、二甲苯、乙基苯、異丙苯等 所產生之基等。又’ R61亦可具有取代基’取代基,例如 ,甲基、乙基、η-丙基、i-丙基、η-丁基、2 -由甘^甘 中基丙基、 201132655 1-甲基丙基、t-丁基等碳數1〜4之直鏈狀、分支狀 之烷基。 通式(2 -2 )中之R8所表示之酸解離性基,例 述(A )聚合物中之酸解離性基爲相同之例示。具 酸解離性基時,可提高存在於被曝光部分之(C) 的溶解性。其推測應爲於後述之光阻圖型之形成方 曝光步驟所發生之酸與(C)聚合物之酸解離性基 而生成極性基所得之效果。 通式(2 - 2 )中之R8所表示之鹼解離性基,例 代羥基、羧基等之極性官能基中之氫原子所得之基 鹼之存在下可以解離之基。該鹼解離性基,只要爲 述性質者,則並未有特別限定,例如下述通式(2 所表示之基等。 【化16】 或環狀 如與上 有該些 聚合物 法中的 反應, 如,取 ,並於 具有上 -2al ) Οa chain hydrocarbon group having a carbon number of 1 to 10 represented by R21 in the above formula, for example, methane, ethane, propane, butane, 2-methylpropane, pentane, 2-methylbutane, A group derived from 2,2-dimethylpropane, hexane, heptane, octane, decane, decane, or the like. a cyclic hydrocarbon group having a carbon number of 4 to 20, for example, cyclobutane, cyclopentane, cyclohexane, bicyclo[2.2.1]heptane, bicyclo[2.2.2].octane' tricyclic [5 ·2_1.02'6] The base generated by brothel, tricyclic [3.3.1_13'7] decane, etc. The aromatic hydrocarbon group having a carbon number of 6 to 3 Å is, for example, a group derived from benzene, toluene, xylene, ethylbenzene or cumene. Further, 'R61 may also have a substituent 'substituent, for example, methyl, ethyl, η-propyl, i-propyl, η-butyl, 2 - from ganyl propyl, 201132655 1-methyl propyl A linear or branched alkyl group having a carbon number of 1 to 4 such as a group or a t-butyl group. The acid dissociable group represented by R8 in the formula (2-2), and the acid dissociable group in the polymer of (A) are exemplified by the same. When the acid dissociable group is present, the solubility of (C) present in the exposed portion can be improved. It is presumed that the effect of the formation of a polar group by the acid generated by the exposure step and the acid-dissociable group of the (C) polymer in the formation step of the photoresist pattern described later. The base dissociable group represented by R8 in the formula (2-2) may be a group which can be dissociated in the presence of a base obtained by a hydrogen atom in a polar functional group such as a hydroxyl group or a carboxyl group. The base dissociable group is not particularly limited as long as it is of the nature described above, and is, for example, a group represented by the following formula (2), or a cyclic group as in the above-mentioned polymer method. Reaction, such as, taken, and has a -2al) Ο

(通式(2-2al)中,R22表示至少一個之氫原子被 所取代之碳數爲1〜10之烴基) 通式(2-2al )中之R22,以烴基之氫原子的全 原子所取代之直鏈狀或分支狀之碳數1〜1〇之全氟 佳,又以三氟甲基爲更佳。 重複單位(2-2 ),具體而言,例如下述通式 所表示重複單位、下述通式(7-2 )所表示重複單位 氟原子 部被氟 院基爲 (7-1 ) 等。 -41 - 201132655(In the formula (2-2al), R22 represents a hydrocarbon group in which at least one hydrogen atom is substituted with a carbon number of 1 to 10) R22 in the formula (2-2al), which is a total atom of a hydrogen atom of a hydrocarbon group The substituted linear or branched carbon number of 1 to 1 fluorene is preferably a trifluoromethyl group. In the repeating unit (2-2), for example, the repeating unit represented by the following formula, the repeating unit represented by the following formula (7-2), and the fluorine atomic moiety are (7-1). -41 - 201132655

(通式(7-1)及(7-2)中,R1表示氫原子、低級烷基, 或鹵化低級烷基,R24表示氫原子、酸解離性基,或鹼解 離性基。通式(7-1 )中,R23表示(g + 1 )價之鍵結基。 通式(7-2)中,g爲1〜3之整數) 形成上述通式(7-1)所表示重複單位,及,下述通 式(7-2 )所表示重複單位之化合物,具體而言,例如下 述通式所表示之化合物等。又,下述通式中,R1表示氫 原子、低級烷基,或鹵化低級烷基,R24表示氫原子、酸 解離性基,或鹼解離性基。 -42- 201132655 【化1 8】(In the formulae (7-1) and (7-2), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group, and R24 represents a hydrogen atom, an acid dissociable group, or an alkali dissociable group. In 7-1), R23 represents a bond group of (g + 1 ) valence. In the formula (7-2), g is an integer of 1 to 3), and a repeating unit represented by the above formula (7-1) is formed. In addition, the compound represented by the following formula (7-2), specifically, a compound represented by the following formula, and the like. Further, in the following formula, R1 represents a hydrogen atom, a lower alkyl group or a halogenated lower alkyl group, and R24 represents a hydrogen atom, an acid dissociable group or an alkali dissociable group. -42- 201132655 【化1 8】

例如’上述通式中之R24爲酸解離性基或鹼解離性基 之化合物,可將上述各通式中’ r24爲氫原子之化合物作 爲原料予以製得。具體而言’例如合成R24爲上述通式( 2-2al )所表示之化合物之情形,爲將上述各通式中,R24 爲氫原子之化合物於酸之存在下,與氟羧酸縮合以進行酯 化之方法,或於鹼之存在下,與氟羧酸鹵化物縮合以進行 酯化之方法等以往公知之方法予以製得。 又’通式(2-2)中之R1Q所表示之碳數1〜10之氟 化烷基,例如至少被1個以上之氟原子所取代之碳數1〜 -43- 201132655 6之直鏈狀或分支狀之烷基、至少被1個以上之氟原子所 取代之碳數4〜10之1價之脂環式烴基或由該些所衍生之 基。 通式(2-2)中之下述通式(2_2b)所表示之構造, 具體而言,例如下述式(8-1 )〜(8-5 )所表示之構造等 。該些之中,又以下述式(8-5)所表示之構造爲較佳。 【化1 9】 R10 —C——(2-2b) R10 【化2 0】For example, the compound wherein R24 in the above formula is an acid-dissociable group or an alkali-dissociable group can be obtained by using a compound in which each of the above formulas is a hydrogen atom. Specifically, for example, in the case where the compound represented by the above formula (2-2al) is synthesized, a compound in which R24 is a hydrogen atom in the above various formulas is condensed with a fluorocarboxylic acid in the presence of an acid to carry out The esterification method or a conventionally known method such as a method of condensing a fluorocarboxylic acid halide with a carboxylic acid halide in the presence of a base. Further, a fluorinated alkyl group having 1 to 10 carbon atoms represented by R1Q in the formula (2-2), for example, a carbon number of 1 to -43 to 201132655 6 substituted with at least one fluorine atom; An alkyl group having a shape or a branch shape, an alicyclic hydrocarbon group having a carbon number of 4 to 10, which is substituted with at least one fluorine atom, or a group derived therefrom. Specifically, the structure represented by the following formula (2-2b) in the formula (2-2) is, for example, a structure represented by the following formulas (8-1) to (8-5). Among these, the structure represented by the following formula (8-5) is preferable. [化1 9] R10 - C - (2-2b) R10 [Chemical 2 0]

Η——c——F (8- ΗIC—cf(8-2Η——c——F (8- ΗIC-cf(8-2

F-C-F -3) (8-F-C-F -3) (8-

F—CICF3I rrCFa(8-5) 重複單位(2-2)之含有比例,於(C)聚合物之全重 複單位作爲100莫耳%之情形時,以80莫耳%以下爲佳 ,以20〜80莫耳%爲更佳,以30〜70莫耳%爲特佳。上 述含有比例爲上述範圍內時,於所形成之光阻膜中,具有 可降低浸潤式曝光用液體之前進接觸角與後退接觸角之差 的優點。 〔1-3_3〕通式(2-3)所表示重複單位: 通式(2-3 )中之R7所表示之2價之鍵結基,例如碳 -44- 201132655 數爲1〜30之2價之烴基。又如,該些之烴基, 、亞胺基、羰基' -C0-0-或-CO-NH-組合所得之 鏈狀構造之R7,例如’具有由甲烷、乙烷 丁烷、2-甲基丙烷、戊烷、2-甲基丁烷、2,2-二 、己烷、庚烷、辛烷、壬烷、癸烷等碳數1〜1〇 去除2個氫原子所得構造之2價之烴基等。 又,環狀構造之R7,例如,具有由環丁烷 、環己烷、雙環〔2.2.1〕庚烷、雙環〔2.2.2〕 環〔5.2.1.02,6〕癸烷、三環〔3.3.1.13,7〕癸烷等 20之脂環式烴去除2個氫原子所得構造之2價 具有由苯、萘等碳數6〜30之芳香族烴去除2個 得構造之2價之烴基等。 通式(2-3)中之RIQ所表示之碳數1〜10 基,例如至少被1個以上之氟原子所取代之碳襲 直鏈狀或分支狀之烷基、至少被1個以上之氟原 之碳數4〜10之〗價之脂環式烴基或由該些所衍 〇 通式(2·3 )中之R8,具體而言,例如下述 3al)〜(2-3a3)所表示之基等。又,通式(: (2-3a2)中’ R2 5表示鹵素原子、碳數1〜1〇之 氧基 '醯基,或醯氧基,存在有複數之R25之 R25可爲相同或相異皆可。mi表示〇〜5之整數 〇〜4之整數。通式(2_3a3)中,R26及R27各自 氫原子或碳數1〜10之烷基,R26及R27可相互 與硫原子 構造等。 、丙烷、 甲基丙烷 之鏈狀烴 、環戊烷 辛烷、三 碳數4〜 之烴基; 氫原子所 之氟化烷 ΐ 1〜6之 子所取代 生之基等 ;通式(2-2-3al )及 .院基、院 情形,各 * m 2表不 獨立表示 :鍵結形成 -45- 201132655 碳數4〜20之脂環式構造。 【化2 1】F-CICF3I rrCFa (8-5) The ratio of the repeating unit (2-2), when the total repeating unit of the (C) polymer is 100 mol%, preferably 80 mol% or less, and 20 ~80% by mole is better, with 30~70% by mole. When the content ratio is within the above range, there is an advantage in that the formed resist film can reduce the difference between the contact angle and the receding contact angle before the immersion exposure liquid. [1-3_3] The repeating unit represented by the formula (2-3): a divalent bond group represented by R7 in the formula (2-3), for example, a carbon-44-201132655 number of 1 to 30 The hydrocarbon base of the valence. In another example, the chain structure R7 obtained by combining the hydrocarbyl group, the imido group, the carbonyl '-C0-0- or -CO-NH- group, for example, has methane, ethane butane, 2-methyl group. a carbon number of 1 to 1 such as propane, pentane, 2-methylbutane, 2,2-di, hexane, heptane, octane, decane or decane. Hydrocarbyl group and the like. Further, R7 of the cyclic structure has, for example, cyclobutane, cyclohexane, bicyclo[2.2.1]heptane, bicyclo[2.2.2]cyclo[5.2.1.02,6]nonane, tricyclo[3.3 .1.13,7] 20 alicyclic hydrocarbons such as decane are removed by the removal of two hydrogen atoms. The valence of the structure is such that two or more aromatic hydrocarbons having a carbon number of from 6 to 30 such as benzene or naphthalene are removed. . The carbon number represented by the RIQ in the formula (2-3) is 1 to 10 groups, and for example, at least one or more of the carbon atoms which are substituted with at least one or more fluorine atoms and which have a linear or branched alkyl group. The alicyclic hydrocarbon group having a carbon number of 4 to 10 or the R 8 of the general formula (2.3), specifically, for example, the following 3al) to (2-3a3) The base of the representation. Further, in the formula (: (2-3a2), 'R2 5 represents a halogen atom, an oxy 'indenyl group having a carbon number of 1 to 1 fluorene, or a decyloxy group, and R25 in which a plurality of R25 is present may be the same or different. Mi is an integer of 〇~5, an integer of 4~4. In the formula (2_3a3), each of R26 and R27 has a hydrogen atom or an alkyl group having a carbon number of 1 to 10, and R26 and R27 may each have a sulfur atom structure or the like. , a propane, a chain hydrocarbon of methyl propane, a cyclopentane octane, a hydrocarbon group having a carbon number of 4 to 4; a fluorinated alkane of a hydrogen atom; a substituent of a group of 1 to 6; 2-3al) and. In the case of the hospital base and the hospital, each * m 2 table does not stand alone: the bond formation -45- 201132655 carbon number 4~20 alicyclic structure. [Chem. 2 1]

CH—R26 I R27 (2-3a3) 通式(2-3a2)中之R25所表示之 原子、氯原子' 溴原子、碘原子等。該 子爲較佳。 通式(2-3a2 )中之R25所表示之{ 、烷氧基、醯基、醯氧基,具體而言, 、乙醯基等。 通式(2-3a3 )中之R26或R27所表 烷基,例如,甲基、乙基、η-丙基等。 又,通式(2-3a3)中之R26及R27 別鍵結之碳原子共同形成之脂環式構造 環戊基甲基、1-(1-環戊基乙基)基、 鹵素原子,例如氟 些之中’又以氟原 吳數1〜1 0之烷基 例如甲基、甲氧基 示之碳數1〜1 0之 相互鍵結,並與各 ’例如,環戊基' h ( 2-環戊基乙基 -46 - 201132655 )基、環己基、環己基甲基、1-(1-環己基乙基)基、1-(2-環己基乙基)、環庚基、環庚基甲基、1-(1-環庚基 乙基)基、1-(2-環庚基乙基)基、2-原冰片基等。 通式(2-3 a3 )所表示之基,具體而言,例如甲基、 乙基、1-丙基、2-丙基、1-丁基、2-丁基、1-戊基、2-戊 基、3-戊基、1-(2-甲基丁基)基、1-(3-甲基丁基)基 、2-(3-甲基丁基)基、新戊基、1-己基、2-己基、3-己 基、1-(2-甲基戊基)基、1-(3-甲基戊基)基、1-(4-甲基戊基)基、2-(3-甲基戊基)基、2-(4-甲基戊基) 基、3·(2 -甲基戊基)基等。該些之中,又以甲基、乙基 、1-丙基、2-丙基、1-丁基、2-丁基爲較佳。 重複單位(2-3 ),具體而言,例如下述通式(2-3-1 )所表示之單位等。 【化2 4】 R1CH-R26 I R27 (2-3a3) An atom represented by R25 in the formula (2-3a2), a chlorine atom, a bromine atom, an iodine atom or the like. This sub is preferred. The {, alkoxy group, fluorenyl group, decyloxy group represented by R25 in the formula (2-3a2), specifically, an oxime group or the like. The alkyl group represented by R26 or R27 in the formula (2-3a3), for example, a methyl group, an ethyl group, an η-propyl group or the like. Further, an alicyclic structure of a cyclopentylmethyl group, a 1-(1-cyclopentylethyl) group, a halogen atom, such as R26 and R27 which are bonded to each other in the formula (2-3a3), for example, Among the fluorines, the alkyl group having a fluorine atom number of 1 to 10, such as a methyl group, a methoxy group, and a carbon number of 1 to 10, is bonded to each other, for example, a cyclopentyl group 'h ( 2-cyclopentylethyl-46 - 201132655 ), cyclohexyl, cyclohexylmethyl, 1-(1-cyclohexylethyl), 1-(2-cyclohexylethyl), cycloheptyl, ring Heptylmethyl, 1-(1-cycloheptylethyl), 1-(2-cycloheptylethyl), 2-oritalyl, and the like. a group represented by the formula (2-3 a3 ), specifically, for example, methyl, ethyl, 1-propyl, 2-propyl, 1-butyl, 2-butyl, 1-pentyl, 2 -pentyl, 3-pentyl, 1-(2-methylbutyl), 1-(3-methylbutyl), 2-(3-methylbutyl), neopentyl, 1 -hexyl, 2-hexyl, 3-hexyl, 1-(2-methylpentyl), 1-(3-methylpentyl), 1-(4-methylpentyl), 2-( 3-methylpentyl), 2-(4-methylpentyl), 3-(2-methylpentyl) and the like. Among these, methyl, ethyl, 1-propyl, 2-propyl, 1-butyl and 2-butyl are preferred. The repeating unit (2-3), specifically, for example, a unit represented by the following formula (2-3-1). [Chem. 2 4] R1

F (2-3-1) (通式(2-3-1 )中,R1表示氫原子、低級烷基,或鹵化 低級烷基;R7表示2價之鍵結基;R8表示氫原子、酸解 離性基,或鹼解離性基)。 形成通式(2-3-1 )所表示重複單位之化合物,例如 -47- 201132655 ’下述通式(2-3-la)〜(2-3-ld)所表示之化合物等。 又’通式(2-3-la)〜(2-3-ld)中’ R1表示氫原子、低 級院基,或_化低級院基,R8表不氫原子、酸解離性基 ,或鹼解離性基。 【化2 5】F (2-3-1) (In the formula (2-3-1), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; R7 represents a divalent bond group; and R8 represents a hydrogen atom or an acid; Dissociable group, or base dissociative group). A compound which forms a repeating unit represented by the formula (2-3-1), for example, -47-201132655 ', a compound represented by the following formula (2-3-la) to (2-3-ld), and the like. Further, 'in the formula (2-3-la)~(2-3-ld)', R1 represents a hydrogen atom, a lower-grade courtyard group, or a lower-grade courtyard group, and R8 represents a hydrogen atom, an acid-dissociable group, or a base. Dissociative group. [化2 5]

(2-3-1 a) (2-3-1 b) (2-3-1 c) (2-3-1 d) 上述通式(2-3-la)〜(2-3-ld)中之R8爲酸解離性 基或鹼解離性基之化合物,例如,可將上述各通式中,Ri 爲氫原子之化合物或其衍生物作爲原料予以合成。例如, R8爲上述通式(2-3al)〜(2-3a3)所表示之基之情形, 該些之化合物’例如,可使下述通式(9-1 )所表示之化 合物與任一下述式(9·2)〜(9-4)所表示之化合物反應 予以製得。 -48- 201132655 【化2 6】(2-3-1 a) (2-3-1 b) (2-3-1 c) (2-3-1 d) The above formula (2-3-la)~(2-3-ld) In the above formula, R8 is a compound which is an acid dissociable group or an alkali dissociable group, and, for example, a compound wherein Ri is a hydrogen atom or a derivative thereof can be synthesized as a raw material. For example, when R8 is a group represented by the above formula (2-3al) to (2-3a3), the compound 'for example, a compound represented by the following formula (9-1) can be used with any of the following compounds The compound represented by the formula (9·2) to (9-4) is reacted. -48- 201132655 【化2 6】

'R7—C—R28'R7-C-R28

\ II \R1。。 (通式(9-1 )中,R1表示氫原子、低級烷基,或鹵化低 級烷基;R7表示2價之鍵結基;R1 ^各自獨立表示氫原子 、氟原子,或碳數1〜10之氟化烷基。又,全部之R1CI並 無爲氫原子之情形R28表示羥基或鹵素原子)。 【化2 7】\ II \R1. . (In the formula (9-1), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; and R7 represents a divalent bond group; and R1^ each independently represents a hydrogen atom, a fluorine atom, or a carbon number of 1~ A fluorinated alkyl group of 10. Further, in the case where all of R1CI is not a hydrogen atom, R28 represents a hydroxyl group or a halogen atom). [化 2 7]

(通式(9-2)中,R2 5表示鹵素原子、碳數1〜10之烷基 、烷氧基、醯基,或醯氧基,存在複數之R25之情形,各 R25可爲相同或相異皆可。R29表示鹵素原子。ml表示0 〜5之整數)。 【化2 8】(In the formula (9-2), R2 5 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group, a decyl group, or a decyloxy group, and in the case where a plurality of R25 are present, each R25 may be the same or Any difference is possible. R29 represents a halogen atom. ml represents an integer of 0 to 5). [化2 8]

-49- 201132655 (通式(9-3)中,R2 5表示鹵素原子、碳數1〜10之烷基 、烷氧基、醯基,或醯氧基,存在複數之R25之情形,各 R25可爲相同或相異皆可。R3Q表示鹵素原子。m2表示0 〜4之整數)。 【化2 9】 HO—CH—R26 I (9-4) R27 (通式(9-4)中,R2 6及R2 7各自獨立表示碳數1〜1〇之 烷基)。 通式(9-2 )中之R29所表示之鹵素原子以氯原子爲 較佳。 通式(9-3 )中之R3Q所表示之鹵素原子以硼原子爲 較佳。 通式(9-4)中之R26或R27所表示之碳數1〜10之烷 基,例如,甲基、乙基、η-丙基等。 又,通式(2-3)中之R8爲上述通式(2-3al)〜(2-3曰3 )所表不之基之情形’具有該些基之化合物,例如, 使下述通式(10-1)所表示之化合物與下述通式(10_2) 所表示之化合物進行反應而可製得。 【化3 0】 R10 HO—R7—/—C—OR8 (10-1) (通式(10-1)中,R7表示2價之鍵結基;r8爲通式( -50- 201132655 2-3al)〜(2-3a3)所表示之基,rig各自獨立表示氫原 子、氟原子,或碳數1〜10之氟化烷基。又,全部之R10 並無爲氫原子之情形) 【化3 1】-49- 201132655 (In the formula (9-3), R2 5 represents a halogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group, a fluorenyl group or a decyloxy group, and a plurality of R25 are present, and each R25 It may be the same or different. R3Q represents a halogen atom, and m2 represents an integer of 0 to 4). [Chem. 2 9] HO—CH—R26 I (9-4) R27 (In the formula (9-4), R 2 6 and R 2 7 each independently represent an alkyl group having 1 to 1 carbon atom). The halogen atom represented by R29 in the formula (9-2) is preferably a chlorine atom. The halogen atom represented by R3Q in the formula (9-3) is preferably a boron atom. The alkyl group having 1 to 10 carbon atoms represented by R26 or R27 in the formula (9-4), for example, a methyl group, an ethyl group, an η-propyl group or the like. Further, in the case where R8 in the formula (2-3) is a group represented by the above formula (2-3al) to (2-3曰3), a compound having such a group, for example, The compound represented by the formula (10-1) can be obtained by reacting with a compound represented by the following formula (10-2). [Chemical 3 0] R10 HO—R7—/—C—OR8 (10-1) (In the formula (10-1), R7 represents a divalent bond group; r8 is a formula (-50-201132655 2- 3al) to (2-3a3), the rig independently represents a hydrogen atom, a fluorine atom, or a fluorinated alkyl group having a carbon number of 1 to 10. Further, all of R10 are not hydrogen atoms) 1】

(通式(10-2 )中’ R1表示氫原子、低級烷基,或鹵化低 級烷基;R47表示羥基或鹵素原子)。 重複單位(2-3 )之含有比例,於(C )聚合物之全重 複單位作爲1 0 〇莫耳%之情形時,以5 0莫耳%以下爲佳 ’以5〜30莫耳%爲更佳,以5〜20莫耳%爲特佳。上述 含有比例爲上述範圍內時,於所形成之光阻膜中,具有兼 具有撥水性與對顯影液之親和性的良好平衡性之優點。 又’ (C )聚合物,如上所述般,以具有由重複單位 (2-1 )、重複單位(2-2 ),及重複單位(2-3 )所形成 之群所選出之至少1種之重複單位者爲較佳,其可具有任 一種重複單位(2-1 )〜(2-3 )亦可,或具有2種以上者 亦可’以具有2種以上者爲較佳,以具有重複單位(2_2 )與重複單位(2-3)者爲更佳。 _ ( C )聚合物中,重複單位(2-2 )及重複單位(2-3 )中至少一者具有鹼解離性基時,可提高(c)聚合物對 顯影液之親和性。其推測應爲於後述光阻圖型之形成方法 的顯影步驟中,(C)聚合物與顯影液反應,而生成極性 -51 · 201132655 基所得之結果。又,通式(2-2 )及(2-3 )中之R8爲氫 原子之情形’重複單位(2 - 2 )及(2 - 3 )爲具有極性基爲 羥基或羧基之單位。隨後’ (C)聚合物於含有該些重複 單位時,於後述之光阻圖型之形成方法的顯影步驟中,可 提高(C )聚合物對顯影液之親和性。 〔1-3-4〕重複單位(i): (C)聚合物以再具有至少含有下述通式(2-4)所表 示之基與下述通式(2-5)所表示之基之任一基的重複單 位(又,上述通式(2-3 )所表示重複單位除外)(以下 ,亦有稱爲「重複單位(i )」之情形)爲較佳。於再具 有該些重複單位(i)時,可提高形成之光阻膜對顯影液 之溶解性。 【化3 2】 1 NH I 1 S 0 I COOH R11 (2-4) (2-5) (通式(2-4)中,Rn表示被氟原子所取代之碳數1〜10 之烴基) 通式(2-4 )中之R11所表示之被氟原子所取代之碳 數1〜10之烴基,只要爲碳數1〜10之烴基中的1或2個 以上之氫原子被氟原子所取代之基時,並未有特別限定’ -52- 201132655 例如,以三氟甲基等爲較佳。 重複單位(i)之主鏈骨架並未有特別限定,例如以 甲基丙烯酸酯、丙烯酸酯、三氟丙烯酸酯等爲較佳。 重複單位(i ),例如,由下述通式(1 1 - 1 )所表示 之化合物所產生之重複單位、下述通式(11-2)所表示之 化合物所產生之重複單位等。 【化3 3】 R1(In the formula (10-2), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; and R47 represents a hydroxyl group or a halogen atom). The ratio of the repeating unit (2-3) is, in the case where the total repeating unit of the (C) polymer is 10% by mole, preferably 50% by mole or less, and 5 to 30% by mole. More preferably, it is particularly good at 5 to 20% by mole. When the content ratio is within the above range, the formed photoresist film has an advantage of having a good balance between water repellency and affinity for the developer. Further, the '(C) polymer, as described above, is at least one selected from the group consisting of a repeating unit (2-1), a repeating unit (2-2), and a repeating unit (2-3). The repeating unit is preferably one, and may have any one of repeating units (2-1) to (2-3), or two or more types may be used, and it is preferable to have two or more types. It is better to repeat units (2_2) and repeat units (2-3). In the (C) polymer, when at least one of the repeating unit (2-2) and the repeating unit (2-3) has an alkali-dissociable group, (c) the affinity of the polymer to the developing solution can be improved. It is presumed that the result of the reaction of the (C) polymer and the developing solution in the developing step of the formation method of the resist pattern described later to produce the polar -51 · 201132655 group. Further, in the case where R8 in the general formulae (2-2) and (2-3) is a hydrogen atom, the repeating units (2 - 2 ) and (2 - 3 ) are units having a polar group of a hydroxyl group or a carboxyl group. Then, when the '(C) polymer contains these repeating units, the affinity of the polymer (C) to the developing solution can be improved in the developing step of the method for forming the photoresist pattern described later. [1-3-4] Repeating unit (i): (C) The polymer further has at least a group represented by the following formula (2-4) and a group represented by the following formula (2-5) The repeating unit of any one of the bases (other than the repeating unit represented by the above formula (2-3)) (hereinafter, also referred to as "repeating unit (i)") is preferable. When the repeating unit (i) is further provided, the solubility of the formed photoresist film to the developing solution can be improved. [Chemical 3 2] 1 NH I 1 S 0 I COOH R11 (2-4) (2-5) (In the formula (2-4), Rn represents a hydrocarbon group having 1 to 10 carbon atoms substituted by a fluorine atom) The hydrocarbon group having 1 to 10 carbon atoms which is substituted by a fluorine atom represented by R11 in the formula (2-4), and 1 or 2 or more hydrogen atoms in the hydrocarbon group having 1 to 10 carbon atoms are each a fluorine atom. When the group is substituted, it is not particularly limited to -52-201132655. For example, a trifluoromethyl group or the like is preferable. The main chain skeleton of the repeating unit (i) is not particularly limited, and for example, methacrylate, acrylate, trifluoroacrylate or the like is preferable. The repeating unit (i) is, for example, a repeating unit produced by a compound represented by the following formula (1 1 - 1 ), a repeating unit produced by a compound represented by the following formula (11-2), and the like. [化3 3] R1

Ο HN \ 〇=S==0 / R31Ο HN \ 〇=S==0 / R31

(11-2) (1M) (通式(11-1)及(11_2)中,R1表示氫原子、低級烷基 ’或鹵化低級垸基;R32表示單鍵結,或碳數1〜2〇之2 價之直鏈狀、分支狀或環狀之飽和或不飽和之烴基。通式 (11-1)中’ R31表示被氟原子所取代之碳數1〜1〇之烴 基,t爲0或1 )。 通式(Π-1)及(h_2)中之R32所表示之碳數 2〇之2 .價之直鏈狀、分支狀或環狀的飽和或不飽和之烴 基,例如與通式(6 )中之R2〇所表示之2價之有機基爲 相同之內容。X ’通(11-。中之r3丨所表示之被氟原 子所取代之碳數1〜10之烴基,只要爲碳數ι〜1〇之烴基 -53- 201132655 中的1或2個以上之氫原子被氟原子所取代之基時,並未 有特別限定’例如,以三氟甲基等爲較佳。 又’重複單位(〇可單獨使用i種或使使用2種以 上亦可。 重複單位(i)之含有比例,於(C)聚合物之全重複 單位作爲1 00莫耳%之情形時,以50莫耳%以下爲佳, 以5〜30莫耳%爲更佳’以5〜20莫耳%爲特佳。上述含 有比例於上述範圍內時,於所形成之光阻膜中,具有得到 兼具有撥水性與對顯影液之親和性的良好平衡性之優點^ 〔1-3-5〕其他之重複單位(b ): (C)聚合物,除上述重複單位(2-1)〜(2-3)及 重複單位(i )以外,可含有其他之重複單位(b )。 其他之重複單位(b),例如,上述通式(2-1)〜( 2-5 )所表示之各重複單位等。 此外,通式(2-1)所表示重複單位之中又以下述通 式(12)所表示重複單位爲較佳。含有下述通式(12)所 表示重複單位時,因可減少光阻膜之前進接觸角與後退接 觸角之差,故可提高浸潤式曝光時之掃瞄速度。 -54- 201132655 【化3 4】 R1(11-2) (1M) (In the formulae (11-1) and (11_2), R1 represents a hydrogen atom, a lower alkyl group or a halogenated lower fluorenyl group; and R32 represents a single bond, or a carbon number of 1 to 2? a linear or branched or cyclic saturated or unsaturated hydrocarbon group of the formula 2. In the formula (11-1), 'R31 represents a hydrocarbon group having 1 to 1 carbon atom substituted by a fluorine atom, and t is 0. Or 1). a linear or branched or cyclic saturated or unsaturated hydrocarbon group represented by R32 represented by R32 in the formula (Π-1) and (h_2), for example, and a general formula (6) The organic base of the two valence represented by R2 in the middle is the same content. The hydrocarbon group having 1 to 10 carbon atoms which is replaced by a fluorine atom represented by x' (11-.) is 1 or 2 or more of the hydrocarbon group -53-201132655 having a carbon number of 1-4. When the hydrogen atom is replaced by a fluorine atom, it is not particularly limited. For example, a trifluoromethyl group or the like is preferable. Further, a repeating unit (a type may be used alone or two or more types may be used. The ratio of the unit (i) is preferably 50 mol% or less, and more preferably 5 to 30 mol%, as the total repeat unit of the (C) polymer is 100% by mole. When the content ratio is within the above range, the formed photoresist film has the advantage of obtaining a good balance between water repellency and affinity for the developer solution ^1 -3-5] Other repeating units (b): (C) Polymer, in addition to the above repeating units (2-1) to (2-3) and repeating units (i), may contain other repeating units (b) The other repeating unit (b) is, for example, each repeating unit represented by the above formula (2-1) to (2-5), etc. Further, the weight expressed by the formula (2-1) In the unit, the repeating unit represented by the following formula (12) is preferred. When the repeating unit represented by the following formula (12) is contained, the difference between the forward contact angle and the receding contact angle of the resist film can be reduced. Therefore, the scanning speed during the immersion exposure can be improved. -54- 201132655 [Chem. 3 4] R1

(通式(12)中,R1表示氫原子、低級烷基,或鹵化低 級院基;R33表示碳數1〜4之直鏈狀或分支狀之院基。k 表不1〜4之整數)。 通式(12)中之R3 3所表示之碳數丨〜4之直鏈狀或 分支狀之院基,例如,甲基、乙基、η -丙基、i -丙基、n-丁基、2 -甲基丙基、1-甲基丙基、t_ 丁基等。 (C)聚合物因含有氟原子,故即使(a)聚合物爲 含有氟原子之情形’其相較於(A)聚合物時,氟原子之 含有比例亦爲更大。氟原子之含有比例,於(C)聚合物 之總量爲1 00質量%之情形,通常爲5質量%以上,又以 5〜50質量%爲佳’以5〜40質量%爲更佳。(c)聚合 物中之氟原子的含有比例於上述範圍內時,可提高所形成 之光阻膜的撥水性,於浸潤式曝光時具有不另外形成浸潤 上層膜下’亦可形成具有良好撥水性之光阻膜的優點。又 ,上述含有比例較(A)聚合物爲小時,(a)聚合物與 (C )聚合物之撥油性會有產生某種程度之逆轉的疑慮, 若撥油性產生某種程度之逆轉時,(C )聚合物將不容易 偏趨於光阻膜表層,而無法得到本發明之效果。 -55- 201132655 (c)聚合物之含量,相對於(A)聚合物100質量 份,以〇 · 1〜2 0質量份爲佳,以〇. 5〜1 〇質量份爲更佳, 以1〜5質量份爲特佳。上述含量於上述範圍內時,因(c )聚合物偏趨於光阻膜之表層,故具有可得到良好撥水性 之效果。 (C)聚合物之凝膠滲透色層分析(GPC )法之聚苯 乙烯換算的重量平均分子量(Mw),以1,〇〇〇〜50,000爲 佳’以1,000〜40,000爲更佳,以ι,〇〇〇〜3〇,〇〇〇爲特佳 。上述Mw未達1,〇〇〇時,無法得到具有充分之後退接觸 角的光阻膜,會有發生因使用浸潤式曝光用液體爲起因之 缺陷的疑慮。又’超過50,000時,會有造成光阻膜之顯 影性降低之疑慮。又,(C)聚合物之Mw與使用GPC法 之聚苯乙烯換算的數平均分子量(Μη)之比(Mw/M η ) ,以1〜5爲佳,以1〜4爲更佳。 又,(C)聚合物,與(Α)聚合物相同般,以鹵素 、金屬等雜質之含量越低爲越佳。該些雜質含量越低時, 可使光阻膜之感度、解析度、製程安定性、圖型形狀等再 向上提升。 (C )聚合物,例如,可將形成上述各重複單位所使 用之單體(聚合性不飽和單體)使用過氧化氫類、二烷基 過氧化物類、二醯基過氧化物類、偶氮化合物等自由基聚 合起始劑,必要時於鏈移動劑之存在下,於適當之溶劑中 進行聚合之方式予以製造。 上述聚合所使用之溶劑,例如與(A )聚合物於聚合 -56- 201132655 時所使用之溶劑爲相同之物質。又,聚合中之反應溫度’ 通常爲40〜150 °C,又以50〜120 °C爲較佳。反應時間通 常爲1〜48小時,又以1〜24小時爲較佳。 〔1-4〕其他成份: 本發明之敏輻射線性樹脂組成物,除(A )聚合物、 (B )敏輻射線性酸產生劑,及(C )聚合物以外,可再 含有其他之成份。其他之成份,例如,酸擴散控制劑、溶 劑、內酯化合物、其他之添加劑(例如,脂環族添加劑、 界面活性劑、增感劑、抗光暈劑、黏著助劑、保存安定劑 '消泡劑等)等。 〔1-4-1〕酸擴散控制劑: 酸擴散控制劑,例如,下述通式(1 3 )所表示之化合 物(以下,亦有稱爲「含氮化合物(I )」之情形)、同 一分子內具有2個氮原子之化合物(以下,亦有稱爲「含 氮化合物(II )」之情形)、具有3個以上之氮原子的化 合物(以下,亦有稱爲「含氮化合物(III )」之情形) 、含醯胺基之化合物、脲化合物、含氮雜環化合物等。再 含有該些酸擴散控制劑時,可提高圖型形狀或尺寸之忠實 度。 -57- 201132655 【化3 5】 R34(In the formula (12), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower-grade courtyard group; and R33 represents a linear or branched municipal group having a carbon number of 1 to 4. k represents an integer of 1 to 4) . a linear or branched hospital group having a carbon number of 丨 to 4 represented by R3 3 in the general formula (12), for example, methyl, ethyl, η-propyl, i-propyl, n-butyl , 2-methylpropyl, 1-methylpropyl, t-butyl, and the like. (C) Since the polymer contains a fluorine atom, even if (a) the polymer contains a fluorine atom, the ratio of the fluorine atom is larger than that of the (A) polymer. When the total amount of the (C) polymer is 100% by mass, the content of the fluorine atom is preferably 5% by mass or more, more preferably 5 to 50% by mass, and more preferably 5 to 40% by mass. (c) When the content ratio of the fluorine atom in the polymer is within the above range, the water repellency of the formed photoresist film can be improved, and when the immersion exposure is performed, the underlayer film is not formed separately. The advantages of water-based photoresist film. Further, when the content ratio is lower than that of the (A) polymer, (a) the oil repellency of the polymer and the (C) polymer may be somewhat reversed, and if the oil repellency is reversed to some extent, (C) The polymer will not tend to favor the surface layer of the photoresist film, and the effect of the present invention cannot be obtained. -55- 201132655 (c) The content of the polymer is preferably 〇·1 to 20 parts by mass, based on 100 parts by mass of the (A) polymer, more preferably 〇. 5~1 〇 by mass, to 1 ~5 parts by mass is especially good. When the content is within the above range, since (c) the polymer tends to be on the surface layer of the photoresist film, it has an effect of obtaining good water repellency. (C) The polystyrene-equivalent weight average molecular weight (Mw) of the gel permeation chromatography (GPC) method of the polymer, preferably from 1, 〇〇〇 50,000 to 50,000, preferably from 1,000 to 40,000, more preferably , 〇〇〇~3〇, 〇〇〇 is especially good. When the above Mw is less than 1, the photoresist film having a sufficient back-off contact angle cannot be obtained, and there is a concern that the use of the immersion-type exposure liquid is a cause. Further, when it exceeds 50,000, there is a fear that the visibility of the photoresist film is lowered. Further, the ratio (Mw/M η ) of the Mw of the (C) polymer to the number average molecular weight (?η) in terms of polystyrene by the GPC method is preferably 1 to 5, more preferably 1 to 4. Further, the (C) polymer is preferably the same as the (Α) polymer, such that the content of impurities such as halogen or metal is lower. The lower the content of these impurities, the higher the sensitivity, resolution, process stability, pattern shape, etc. of the photoresist film. (C) a polymer, for example, a hydrogen peroxide, a dialkyl peroxide or a dimercapto peroxide may be used as a monomer (polymerizable unsaturated monomer) used for forming each of the above repeating units. A radical polymerization initiator such as an azo compound is produced by, if necessary, polymerization in a suitable solvent in the presence of a chain shifting agent. The solvent used in the above polymerization is, for example, the same as the solvent used in the polymerization of (A) polymer at -56-201132655. Further, the reaction temperature in the polymerization ' is usually 40 to 150 ° C, and more preferably 50 to 120 ° C. The reaction time is usually from 1 to 48 hours, preferably from 1 to 24 hours. [1-4] Other components: The sensitive radiation linear resin composition of the present invention may further contain other components in addition to the (A) polymer, (B) the radiation-sensitive linear acid generator, and the (C) polymer. Other ingredients, such as acid diffusion control agents, solvents, lactone compounds, other additives (eg, alicyclic additives, surfactants, sensitizers, antihalation agents, adhesion aids, preservation stabilizers) Foaming agent, etc.). [1-4-1] Acid Diffusion Control Agent: An acid diffusion controlling agent, for example, a compound represented by the following formula (13) (hereinafter also referred to as "nitrogen-containing compound (I)"), a compound having two nitrogen atoms in the same molecule (hereinafter also referred to as "nitrogen-containing compound (II)"), and a compound having three or more nitrogen atoms (hereinafter, also referred to as "nitrogen-containing compound" III)", a guanamine-containing compound, a urea compound, a nitrogen-containing heterocyclic compound, and the like. When these acid diffusion controlling agents are further contained, the loyalty of the shape or size of the pattern can be improved. -57- 201132655 【化3 5】 R34

I /\ (13) r35 R36 (通式(13)中,R34〜R36表示相互獨立之氫原子、可被 取代之直鏈狀、分支狀或環狀之烷基、芳基、芳烷基,或 酸解離性基)。 上述通式(13)所表示之化合物中之酸解離性基,具 體而言,例如通式(13-1)所表示之基等。 【化3 6】I /\ (13) r35 R36 (In the formula (13), R34 to R36 represent a mutually independent hydrogen atom, a linear, branched or cyclic alkyl group, an aryl group or an aralkyl group which may be substituted. Or acid dissociable group). The acid-dissociable group in the compound represented by the above formula (13) is, for example, a group represented by the formula (13-1). [Chem. 3 6]

R3eΓΓ - ο I OMNC 3· (通式(13-1)中,R37〜R39表示相互獨立之碳數1〜4 之直鏈狀或分支狀之烷基,或碳數4〜20之1價之脂環式 烴基或由該些所衍生之基,或R38及R39相互鍵結並與各 別鍵結之碳原子同時形成碳數4〜2 0之2價之脂環式烴基 或由該些所衍生之基’ R37表示碳數1〜4之直鏈狀或分支 狀之烷基,或碳數4〜20之1價之脂環式烴基或由該些所 衍生之基)。 通式(13-1)中之R3 7〜R3 9所表示之碳數1〜4之直 鏈狀或分支狀之烷基,例如,甲基、乙基、η -丙基、i -丙 基、η-丁基、2-甲基丙基、1-甲基丙基、t_丁基等。 通式(13-1)中之R37〜R39所表示之碳數4〜20之1 價之脂環式烴基,例如,原冰片烷、三環癸烷、四環十二 -58- 201132655 烷、金剛烷,或環丁烷、環戊烷、環己烷、環庚烷、環辛 烷等之由環鏈烷類等所產生之脂環族環所形成之基等。 通式(13·1 )中之R38及R39相互鍵結並與各別鍵結 之碳原子同時形成碳數4〜20之2價之脂環式烴基或由該 些所衍生之基’例如上述之2價之脂環式烴基被例如,甲 基、乙基、η·丙基、i-丙基、η-丁基、2-甲基丙基、丨•甲 基丙基、t-丁基等碳數1〜4之直鏈狀、分支狀或環狀之 烷基之1種以上或1個以上所取代之基等。 含氮化合物(I )中’不具有酸解離性基之化合物, 具體而目’例如三- η-己胺、三-n-庚胺、三-n_辛胺等三院 胺類。 含氮化合物(I)中’具有酸解離性基之化合物,具 體而g,例如N-t -丁氧擬基_4_徑基哌淀、N-t-丁氧羯基吡 略曝、N-t -丁氧羯基二環己胺等。 含氮化合物(II ) ’具體而言,例如n,n,n,,n,-四( 2-羥基丙基)乙二胺等。 含氮化合物(III ) ’具體而言,例如聚乙烯醯亞胺 、聚醯基胺、一甲基胺基乙基丙烯酸醯胺之聚合物等。 含氮雜環化合物,例如,2_苯基苯倂咪唑、N_t 丁氧 羰基-2_苯基苯倂咪唑等等。 又,酸擴散控制劑可使用下述通式(丨4 )所表示之化 合物。 X+Z- . · . (14) (又,則述通式(14 )中’ χ+爲下述通式(或( -59- 201132655 14-2)所表示之陽離子。Z_爲OH·、通式(14-3) R41-COCT所表示之陰離子、通式(14-4) R4Q-S〇r所表示 之陰離子,或通式(14-5 ) R4()-N\S02-R41所表示之陰離 子。又,前述通式(14-3)〜(14-5)中’ R4Q爲可被取 代之烷基、脂環式烴基或芳基。R41表示可被取代之氟化 烷基、脂環式氟化烴基或氟化芳基)° 【化3 7】R3eΓΓ - ο I OMNC 3· (In the formula (13-1), R37 to R39 represent a linear or branched alkyl group having a carbon number of 1 to 4 independently of each other, or a carbon number of 4 to 20 An alicyclic hydrocarbon group or a group derived from the same, or R38 and R39 bonded to each other and simultaneously forming a carbon number of 4 to 20 alicyclic alicyclic hydrocarbon groups or a plurality of carbon atoms bonded thereto The derivatized group 'R37' represents a linear or branched alkyl group having 1 to 4 carbon atoms, or a monovalent alicyclic hydrocarbon group having 4 to 20 carbon atoms or a group derived therefrom. a linear or branched alkyl group having a carbon number of 1 to 4 represented by R3 7 to R3 9 in the formula (13-1), for example, a methyl group, an ethyl group, an η-propyl group, an i-propyl group , η-butyl, 2-methylpropyl, 1-methylpropyl, t-butyl, and the like. The alicyclic hydrocarbon group having a carbon number of 4 to 20, represented by R37 to R39 in the formula (13-1), for example, norbornane, tricyclodecane, tetracyclododeca-58-201132655 alkane, Adamantane, or a group formed of an alicyclic ring derived from a cycloalkane or the like, such as cyclobutane, cyclopentane, cyclohexane, cycloheptane or cyclooctane. R38 and R39 in the formula (13.1) are bonded to each other and form a divalent alicyclic hydrocarbon group having a carbon number of 4 to 20 at the same time as the carbon atom bonded to each other or a group derived therefrom. The divalent alicyclic hydrocarbon group is, for example, methyl, ethyl, η·propyl, i-propyl, η-butyl, 2-methylpropyl, hydrazine methylpropyl, t-butyl One or more or more substituted alkyl groups having a linear, branched or cyclic alkyl group having 1 to 4 carbon atoms. In the nitrogen-containing compound (I), a compound having no acid-dissociable group, specifically, a tri-amine such as tris-n-hexylamine, tri-n-heptylamine or tri-n-octylamine. a compound having an acid dissociable group in the nitrogen-containing compound (I), specifically, g, for example, Nt-butoxymethyl-4_ylpiperidine, Nt-butoxypyridylpyrene, Nt-butoxyxanthene Dicyclohexylamine and the like. The nitrogen-containing compound (II) 'specifically, for example, n, n, n, n, -tetrakis(2-hydroxypropyl)ethylenediamine or the like. The nitrogen-containing compound (III) 'specifically, for example, a polymer of polyvinylimine, polydecylamine, monomethylaminoethyl decylamine or the like. A nitrogen-containing heterocyclic compound, for example, 2-phenylbenzimidazole, N-t-butoxycarbonyl-2-phenylbenzimidazole, or the like. Further, as the acid diffusion controlling agent, a compound represented by the following formula (丨4) can be used. X+Z- . . . (14) (In addition, in the above formula (14), 'χ+ is a cation represented by the following formula (or (-59-201132655 14-2). Z_ is OH· , an anion represented by R41-COCT of the formula (14-3), an anion represented by the formula (14-4) R4Q-S〇r, or a formula (14-5) R4()-N\S02-R41 Further, in the above formula (14-3) to (14-5), 'R4Q is an alkyl group, an alicyclic hydrocarbon group or an aryl group which may be substituted. R41 represents a fluorinated alkyl group which may be substituted. , alicyclic fluorinated hydrocarbon group or fluorinated aryl group) ° [Chem. 3 7]

前述通式(14-1)中,R42〜R4 4表示相互獨立之氫原 子、烷基、烷氧基、羥基,或鹵素原子,前述通式(14-2 )中,R45及R46表示相互獨立之氫原子、烷基、烷氧基 、羥基,或鹵素原子。 上述式(14)所表示之化合物可作爲經由曝光而分解 ,而失去酸擴散控制性的酸擴散控制劑(以下,亦稱爲「 光分解性酸擴散控制劑」)使用。又,含有式(1 4 )所表 示之化合物時,該酸會擴散至曝光部,酸擴散至未曝光部 之情形則受到控制,而使曝光部與未曝光部形成優良對比 (即,曝光部與未曝光部之界線部分更爲明確),特別是 以使用本發明之敏輻射線性樹脂組成物時可有效改善 LWR、MEEF ( Mask Error Enhancement Factor (遮罩寬度 -60- 201132655 之偏移所造成之線寬偏移之增寬因素))。 通式(14)中之X+,如上所述般,爲上述通式(Μ-ΐ) 或 (14-2) 所 表示之 陽離子 。又 ,通式 (14-1) 中之 R42〜R44表示相互獨立之氫原子、烷基、烷氧基、羥基, 或鹵素原子,該些之中又以上述式(14)所表示之化合物 中,就具有可降低對顯影液之溶解性的效果而言,以氫原 子、烷基、烷氧基、鹵素原子爲較佳。又,通式(14-2 ) 中之R45及R40表示相互獨立之氫原子、烷基、烷氧基、 羥基,或鹵素原子,該些之中又以氫原子、烷基、鹵素原 子爲較佳。 通式(14)中之 Ζ —爲,ΟΗ·、通式(14-3) R4<)-COO· 所表示之陰離子、通式(14-4) R4G-S ΟΓ所表示之陰離子 ,或通式(14-5 ) R4Q-N、S02-R41所表示之陰離子(又’ 前述通式(14-3)〜(14-5)中’ R4°爲可被取代之烷基 、脂環式烴基或芳基。R41爲可被取代之氟化烷基、脂環 式氟化烴基或氟化芳基)。 該些酸擴散控制劑之中’又以含氮化合物(1 )、含 氮化合物(II)、含氮雜環化合物' 光分解性酸擴散控制 劑爲較佳。又,酸擴散控制劑可單獨使用1種或將2種以 上組合使用。 酸擴散控制劑之含量’相對於(A)聚合物1 0 0質量 份,以1 〇質量份以下爲佳’以5質量份以下爲更佳。酸 擴散控制劑之含量超過1 0質量份時,會有使所形成之光 阻膜的感度顯著降低之疑慮。 -61 - 201132655 〔1-4-2〕溶劑: 溶劑,例如,直鏈狀或分支狀之酮類;環狀之酮類; 丙二醇單烷基醚乙酸酯類;2-羥基丙酸烷酯類;3-烷氧基 丙酸烷酯類等。 該些溶劑,可單獨使用1種或將2種以上組合使用亦 可,該些之中,又以直鏈狀或分支狀之酮類、環狀之酮類 、丙二醇單烷基醚乙酸酯類、2-羥基丙酸烷酯類、3-烷氧 基丙酸烷酯類爲較佳。 〔1-4-3〕內酯化合物: 內酯化合物,爲可使(C)聚合物有效地偏趨於光阻 膜表層之化合物。即,含有該些內酯化合物結果,於浸潤 式曝光中爲使光阻膜表層產生撥水性而添加之(C)聚合 物的添加量可較以往爲更少量之情形下亦可維持光阻膜表 層之撥水性。又,除對於LWR、顯影缺陷、耐圖型倒塌 性等基本特性以外,亦可控制光阻膜中之成份((B )酸 產生劑等)溶出於浸潤式曝光用液體之中,而於進行高速 浸潤式曝光時,光阻膜上也不容易殘留液滴,因此可於控 制水斑缺陷等因浸潤式曝光用液體所產生之缺陷下形成光 阻膜。 內酯化合物,例如,7-丁內酯、戊內酯、甲羥戊( Mevalonic )內酯、原冰片烷內酯等。又,內酯化合物可 單獨使用1種或將2種以上組合使用。 -62- 201132655 內酯化合物之使用量爲,相對於(A)聚合物100質 量份,以30〜200質量份爲佳,以50〜150質量份爲更佳 。上述使用量於上述範圍內時,即使(C)聚合物之使用 量較少之情形時,也可使(C )聚合物偏趨於光阻膜表層 。上述使用量未達30質量份時,(C)聚合物之使用量較 少之情形中,會有於光阻膜表層未能得到充分之撥水性的 疑慮。又,超過200質量份時,所形成之光阻膜的基本性 能及形狀會有顯著劣化之疑慮。 本發明之敏輻射線性樹脂組成物,例如,可將(A ) 聚合物、(B )敏輻射線性酸產生劑、(C )聚合物,及 其他成份(溶劑除外)混合後,以全固形分濃度爲1〜5 0 質量% (較佳爲1〜25質量%)之方式,使其溶解於溶劑 中,隨後,例如使用孔徑0.2 m左右之過濾器過濾之方 式製作組成物溶液。 〔2〕光阻圖型之形成方法: 本發明之光阻圖型之形成方法,爲具備有將本發明之 敏輻射線性樹脂組成物塗佈於基板上以形成光阻膜之光阻 膜形成步驟,與於形成之前述光阻膜上配置浸潤式曝光用 液體,介由前述浸潤式曝光用液體以輻射線照射前述光阻 膜之曝光步驟,與使用顯影液對照射後之前述光阻膜進行 顯影以形成光阻圖型之顯影步驟之方法。依該些方法時, 即可形成具有良好LWR,且具有更低膜消減之光阻圖型 -63- 201132655 〔2-1〕光阻膜形成步驟: 光阻膜形成步驟爲將本發明之敏輻射線性 塗佈於基板上以形成光阻膜之步驟。 基板,例如,矽晶圓、鋁被覆之晶圓等。 於基板上形成光阻膜之方法,例如,將本 射線性樹脂組成物溶解於溶劑所得之組成物溶 塗佈、流延塗佈、滾筒塗佈等以往公知之方法 上之方法等。 光阻膜之厚度,並未有特別之限制,其可 公知之光阻膜爲相同之厚度。 又’光阻膜形成後,可對光阻膜進行加熱 ’ 「PB」之情形)。 〔2 - 2〕曝光步驟: 曝光步驟爲,於所形成之光阻膜上配置浸 液體’並介由浸潤式曝光用液體以輻射線照射 驟。 浸潤式曝光用液體,例如,純水、氟系惰 曝光所使用之輻射線等之光線,其可配合 產生劑種類而作適當選擇使用,例如,可見光 、遠紫外線、X線、帶電電子線等,該些之中 分子雷射(波長193nm)或KrF準分子雷射( )所代表之遠紫外線爲佳,特別是以ArF準分 樹脂組成物 發明之敏輻 液,以迴轉 塗佈於基板 使用與以往 處理(以下 潤式曝光用 光阻膜之步 性液體等。 所使用之酸 線、紫外線 又以ArF準 波長248nm 子雷射(波 -64- 201132655 長193nm)爲更佳。 又’曝光量等之曝光條件,可配合光阻組成物之添加 組成或添加劑之種類等作適適當之選擇。又,曝光後,以 再進行加熱處理(曝光後之加熱處理,以下亦有稱爲「 P E B」之情形)爲較佳。經由P E B,可使(A )聚合物中 之酸解離性基之解離反應更圓滑地進行。PEB之加熱條件 ,爲依光阻組成物之添加組成內容而改變,通常爲3 0〜 200 °C,又以50〜170 °C爲較佳。 又’爲導出敏輻射線性樹脂組成物之最大潛能,故也 可於形成光阻膜之前,預先於基板上形成有機系或無機系 之抗反射膜(例如,特公平6 - 1 2 4 5 2號公報(特開昭 5 9-93 448號公報)等)。爲防止環境雰圍中所含之鹼性 雜質等之影響,亦可於光阻膜上形成保護膜(例如,特開 平5 - 1 8 8 5 9 8號公報等)。又,本發明之敏輻射線性樹脂 組成物,爲無須形成浸潤上層膜亦可使用者,即,可形成 於顯影後具有良好之LWR,不易產生膜消減之光阻膜之 組成物,例如,可形成特開2005-3 523 84號公報等所揭示 般之浸潤上層膜。又,亦可倂用該些之技術。 〔2-3〕顯影步驟: 顯影步驟爲,將經輻射線照射所得之光阻膜於顯影液 中進行顯影以形成光阻圖型之步驟。 顯影所使用之顯影液,例如溶解有由氫氧化鈉、氫氧 化鉀、碳酸鈉、矽酸鈉、甲基矽酸鈉、氨水、乙胺、η -丙 -65- 201132655 胺、二乙胺、二-n-丙胺、三乙胺、甲基二乙胺、乙基二 甲胺、三乙醇胺、氫氧化四甲基銨、吡咯、哌啶、膽鹼、 1,8-二氮雜雙環-〔5.4.0〕-7-十一烯、1,5-二氮雜雙環-〔 4 · 3.0〕- 5 -壬烯等鹼性化合物所選出之至少1種所得之鹼 性水溶液爲較佳。該鹼性水溶液之濃度,通常爲1 0質量 %以下。上述鹼性水溶液之濃度超過1 〇質量%時,會有 造成非曝光部也會溶解於顯影液之疑慮。 上述鹼性水溶液所形成之顯影液中,可再添加有機溶 劑。有機溶劑,例如,丙酮、甲基乙基酮、甲基i-丁基酮 、環戊酮、環己酮、3-甲基環戊酮、2,6-二甲基環己酮等 之酮類;甲基醇、乙基醇、η-丙基醇、i-丙基醇、η-丁基 醇、t-丁基醇、環戊醇、環己醇、1,4-己烷二醇、1,4·己 烷二羥甲酯等醇類;四氫呋喃、二噁烷等醚類;乙酸乙酯 、乙酸η-丁酯、乙酸i-戊酯等之酯類;甲苯、二甲苯等之 芳香族烴類,或酚、丙酮基丙酮、二甲基甲醯胺等。該些 之有機溶劑,可單獨或將2種以上組合使用。有機溶劑之 添加量,相對於鹼性水溶液,以1 〇〇容量%以下爲較佳。 有機溶劑之添加量超過1 〇〇容量%時,會造成顯影性降低 ,曝光部會有產生多處顯影殘留之疑慮。又,鹼性水溶液 所形成之顯影液中,可適量添加界面活性劑等。又’,經鹼 性水溶液所形成之顯影液顯影後,通常可使用水進行洗淨 後、乾燥。 【實施方式】 -66 - 201132655 [實施例] 以下,將本發明以實施例及比較例爲基礎進行具體之 說明’但本發明並不受該些實施例及比較例所限定。又, 僅以「份」及「%」記載之情形,於無特別記載下,係指 質量基準。又,各種物性値之測定方法,及各種特性之評 估方法係如以下所示。 〔溶出量〕: 使用 CLEAN TRACK ACT8 (東京電子公司製)將敏 輻射線性樹脂組成物(組成物溶液)旋轉塗佈於矽晶圓上 ’於100°C下進行60秒燒焙,而製得形成有膜厚150nm 之光阻被膜之矽晶圓。於該矽晶圓上,放置直徑1 cm、厚 1mm之鐵氟隆製「環」,使超純水lm L充満於其中之方 式,使超純水與光阻被膜接觸。使超純水與光阻被膜分別 進行3秒、5秒、10秒、3 0秒、6 0秒、1 2 0秒,及3 0 0 秒之接觸後,以玻璃針筒回收滿出之超純水,將其作爲分 析用樣品。又,實驗結束後之超純水的回收率爲9 5 %以 上。 其次,計測所得超純水中之光酸產生劑之陰離子部的 波峰強度所使用之管柱爲使用1管之資生堂公司製之「 CAPCELL PAK MG」,以流量0.2ml/分、測定溫度3 5 °C 、以於水/甲醇(3/7 )中添加0.1質量%之甲酸所得之 溶液作爲流出溶劑等條件,LC-MS (液體色層分析質量分 析計,LC 部:AGILENT 公司製 SERIES1100、MS 部: -67- 201132655In the above formula (14-1), R42 to R4 4 represent mutually independent hydrogen atoms, alkyl groups, alkoxy groups, hydroxyl groups, or halogen atoms, and in the above formula (14-2), R45 and R46 are independent of each other. A hydrogen atom, an alkyl group, an alkoxy group, a hydroxyl group, or a halogen atom. The compound represented by the above formula (14) can be used as an acid diffusion controlling agent (hereinafter also referred to as "photodecomposable acid diffusion controlling agent") which decomposes by exposure and loses acid diffusion controllability. Further, when the compound represented by the formula (14) is contained, the acid diffuses to the exposed portion, and when the acid diffuses to the unexposed portion, it is controlled, and the exposed portion and the unexposed portion are excellently contrasted (that is, the exposed portion) It is more clear with the boundary portion of the unexposed portion), in particular, the LWR, MEEF (Mask Error Enhancement Factor) can be effectively improved by using the sensitive radiation linear resin composition of the present invention (Mask Error Width -60-201132655 The widening factor of the line width offset)). X+ in the formula (14) is a cation represented by the above formula (Μ-ΐ) or (14-2) as described above. Further, R42 to R44 in the formula (14-1) represent mutually independent hydrogen atoms, alkyl groups, alkoxy groups, hydroxyl groups, or halogen atoms, among which compounds represented by the above formula (14) The effect of reducing the solubility in the developer is preferably a hydrogen atom, an alkyl group, an alkoxy group or a halogen atom. Further, R45 and R40 in the formula (14-2) represent a mutually independent hydrogen atom, an alkyl group, an alkoxy group, a hydroxyl group, or a halogen atom, and among them, a hydrogen atom, an alkyl group or a halogen atom is used. good. In the formula (14), an anion represented by the formula (14-3) R4 <)-COO·, an anion represented by the formula (14-4) R4G-S ΟΓ, or an anion An anion represented by the formula (14-5) R4Q-N, S02-R41 (also 'in the above formula (14-3) to (14-5), 'R4° is an alkyl group which may be substituted, an alicyclic hydrocarbon group Or aryl. R41 is a fluorinated alkyl group, an alicyclic fluorinated hydrocarbon group or a fluorinated aryl group which may be substituted. Among the acid diffusion controlling agents, a nitrogen-containing compound (1), a nitrogen-containing compound (II), and a nitrogen-containing heterocyclic compound 'photodegradable acid diffusion controlling agent' are preferred. Further, the acid diffusion controlling agent may be used singly or in combination of two or more. The content of the acid diffusion controlling agent is preferably 1 part by mass or less based on 100 parts by mass of the (A) polymer, and more preferably 5 parts by mass or less. When the content of the acid diffusion controlling agent exceeds 10 parts by mass, there is a fear that the sensitivity of the formed photoresist film is remarkably lowered. -61 - 201132655 [1-4-2] Solvent: Solvent, for example, linear or branched ketone; cyclic ketone; propylene glycol monoalkyl ether acetate; 2-hydroxypropionic acid alkyl ester ; 3-alkoxypropionic acid alkyl esters and the like. These solvents may be used alone or in combination of two or more. Among them, linear or branched ketones, cyclic ketones, and propylene glycol monoalkyl ether acetates may be used. Further, an alkyl 2-hydroxypropionate or an alkyl 3-alkoxypropionate is preferred. [1-4-3] Lactone compound: A lactone compound is a compound which can effectively bias the (C) polymer to the surface layer of the photoresist film. That is, as a result of containing the lactone compound, the amount of the (C) polymer added in order to cause water repellency in the surface layer of the photoresist film during immersion exposure can maintain the photoresist film in a smaller amount than in the prior art. Water repellency of the surface layer. Further, in addition to the basic characteristics such as LWR, development defects, and pattern collapse resistance, it is also possible to control the components ((B) acid generator, etc.) in the photoresist film to be dissolved in the immersion exposure liquid. In the case of high-speed immersion exposure, droplets are not easily deposited on the photoresist film, so that a photoresist film can be formed under the defects caused by the immersion exposure liquid such as water spot defects. A lactone compound, for example, 7-butyrolactone, valerolactone, mevalonic lactone, ornidyl lactone, and the like. Further, the lactone compound may be used alone or in combination of two or more. The amount of the lactone compound to be used is preferably from 30 to 200 parts by mass, more preferably from 50 to 150 parts by mass, per 100 parts by mass of the (A) polymer. When the amount used is within the above range, the (C) polymer may be biased toward the surface of the photoresist film even when the amount of the (C) polymer used is small. When the amount of use of the above (C) polymer is less than 30 parts by mass, there is a concern that the surface of the photoresist film is not sufficiently water-repellent. On the other hand, when it exceeds 200 parts by mass, the basic properties and shape of the formed photoresist film may be remarkably deteriorated. The sensitive radiation linear resin composition of the present invention can be, for example, a mixture of (A) polymer, (B) radiation sensitive linear acid generator, (C) polymer, and other components (excluding solvents), and is fully solid-shaped. The composition is dissolved in a solvent in a concentration of 1 to 50% by mass (preferably 1 to 25% by mass), and then a composition solution is prepared by, for example, filtration using a filter having a pore diameter of about 0.2 m. [2] Method for forming photoresist pattern: The method for forming a photoresist pattern of the present invention comprises forming a photoresist film having a photosensitive resin composition of the present invention coated on a substrate to form a photoresist film. a step of exposing the immersion-type exposure liquid to the formed photoresist film, irradiating the photoresist film with radiation by the immersion-type exposure liquid, and using the developer solution to irradiate the photoresist film A method of developing to form a development step of a photoresist pattern. According to these methods, a photoresist pattern having a good LWR and having a lower film reduction can be formed. -63-201132655 [2-1] Photoresist film formation step: The photoresist film formation step is to be sensitive to the present invention. The step of linearly coating the radiation on the substrate to form a photoresist film. A substrate, for example, a germanium wafer, an aluminum-coated wafer, or the like. A method of forming a photoresist film on a substrate, for example, a method of dissolving a composition obtained by dissolving a radiation composition in a solvent, a conventionally known method such as a coating method, a roll coating method, or the like. The thickness of the photoresist film is not particularly limited, and the known photoresist film has the same thickness. Further, after the formation of the photoresist film, the photoresist film can be heated by "PB". [2 - 2] Exposure step: The exposure step is such that a immersion liquid is disposed on the formed photoresist film and irradiated with radiation through the immersion exposure liquid. The immersion exposure liquid, for example, pure water or radiation used for fluorine-based immersion exposure, may be appropriately selected in accordance with the type of the generating agent, for example, visible light, far ultraviolet ray, X-ray, charged electron beam, etc. Among them, the far-ultraviolet light represented by the molecular laser (wavelength 193 nm) or the KrF excimer laser ( ) is preferable, especially the sensitive radiation solution of the ArF quasi-resin composition, which is applied to the substrate by spin coating. It is the same as the conventional treatment (the following stepping liquid for the photoresist for the exposure type exposure, etc.. The acid line and ultraviolet light used are more preferably ArF quasi-wavelength 248 nm sub-laser (wave-64-201132655 length 193 nm). The exposure conditions such as the amount can be appropriately selected in accordance with the addition composition of the photoresist composition or the type of the additive, etc. Further, after the exposure, the heat treatment is further performed (heat treatment after the exposure, which is also referred to as "PEB" hereinafter. In the case of PEB, the dissociation reaction of the acid dissociable group in the (A) polymer can be carried out more smoothly. The heating condition of the PEB is the composition of the photoresist composition. The change is usually 30 to 200 ° C and 50 to 170 ° C. It is also used to derive the maximum potential of the sensitive linear resin composition, so it can be pre-formed before the photoresist film is formed. An organic or inorganic anti-reflection film is formed on the surface (for example, Japanese Patent Publication No. Hei 6-1-2942, etc.). A protective film can also be formed on the photoresist film by the influence of an impurity or the like (for example, JP-A No. 5-8 8 8 9 8 or the like). Further, the sensitive radiation linear resin composition of the present invention does not require formation of an infiltrating upper layer. The film may be formed by a user, that is, a composition of a photoresist film which has a good LWR after development and which is less likely to cause film reduction. For example, it is possible to form an infiltrated upper layer as disclosed in Japanese Laid-Open Patent Publication No. 2005-3 523 84 Further, the techniques may be employed. [2-3] Developing step: The developing step is a step of developing a photoresist film obtained by irradiation with radiation in a developing solution to form a photoresist pattern. a developing solution used for development, for example, dissolved in sodium hydroxide, hydrogen and oxygen Potassium, sodium carbonate, sodium citrate, sodium methyl citrate, ammonia, ethylamine, η-propyl-65- 201132655 amine, diethylamine, di-n-propylamine, triethylamine, methyldiethylamine, Ethyl dimethylamine, triethanolamine, tetramethylammonium hydroxide, pyrrole, piperidine, choline, 1,8-diazabicyclo-[5.4.0]-7-undecene, 1,5-di It is preferred to obtain at least one of the obtained basic aqueous solutions of a basic compound such as azabicyclo-[4.3.0]-5-decene. The concentration of the basic aqueous solution is usually 10% by mass or less. When the concentration of the aqueous solution exceeds 1% by mass, there is a concern that the non-exposed portion is also dissolved in the developer. An organic solvent may be further added to the developer formed by the above aqueous alkaline solution. An organic solvent such as acetone, methyl ethyl ketone, methyl i-butyl ketone, cyclopentanone, cyclohexanone, 3-methylcyclopentanone, 2,6-dimethylcyclohexanone or the like Class; methyl alcohol, ethyl alcohol, η-propyl alcohol, i-propyl alcohol, η-butyl alcohol, t-butyl alcohol, cyclopentanol, cyclohexanol, 1,4-hexanediol And alcohols such as 1,4·hexane dihydroxymethyl ester; ethers such as tetrahydrofuran and dioxane; esters of ethyl acetate, η-butyl acetate, i-amyl acetate, etc.; toluene, xylene, etc. Aromatic hydrocarbons, or phenol, acetone acetone, dimethylformamide, and the like. These organic solvents may be used singly or in combination of two or more. The amount of the organic solvent to be added is preferably 1% by volume or less based on the aqueous alkaline solution. When the amount of the organic solvent added exceeds 1% by volume, the developability is lowered, and there is a fear that a plurality of development residues may remain in the exposed portion. Further, an appropriate amount of a surfactant or the like may be added to the developer formed by the aqueous alkaline solution. Further, after development of the developer formed by the aqueous alkali solution, it is usually washed with water and dried. [Embodiment] -66 - 201132655 [Examples] Hereinafter, the present invention will be specifically described based on examples and comparative examples, but the present invention is not limited by the examples and comparative examples. In addition, the conditions described in "parts" and "%" refer to the quality standard unless otherwise stated. Further, the measurement methods of various physical properties and the evaluation methods of various characteristics are as follows. [Dissolution amount]: Using a CLEAN TRACK ACT8 (manufactured by Tokyo Electronics Co., Ltd.), a radiation-sensitive linear resin composition (a composition solution) was spin-coated on a tantalum wafer, and baked at 100 ° C for 60 seconds. A tantalum wafer having a photoresist film having a film thickness of 150 nm was formed. A Teflon "ring" having a diameter of 1 cm and a thickness of 1 mm was placed on the silicon wafer to fill the ultrapure water lm L so that the ultrapure water was in contact with the photoresist film. After the ultrapure water and the photoresist film are respectively contacted for 3 seconds, 5 seconds, 10 seconds, 30 seconds, 60 seconds, 120 seconds, and 300 seconds, the glass syringe is used to recover the excess. Pure water is used as a sample for analysis. Further, the recovery rate of the ultrapure water after the end of the experiment was over 95%. Next, the column used for measuring the peak intensity of the anion portion of the photoacid generator in the ultrapure water was "CAPCELL PAK MG" manufactured by Shiseido Co., Ltd., using a tube of 0.2 ml/min, and measuring temperature 3 5 °C, a solution obtained by adding 0.1% by mass of formic acid to water/methanol (3/7) as an effluent solvent, LC-MS (Liquid chromatography analysis, LC: SERIES 1100, MS manufactured by AGILENT) Department: -67- 201132655

Perseptive Biosystems,Inc.公司製 Mariner)進行測定 ο 此時’將光酸產生劑之lppb、lOppb、lOOppb水溶液 之各波峰強度’製作依上述測定條件所測定之檢量線,使 用該檢量線由上述波峰強度算出溶出量。評估基準爲,溶 出量爲2·0Χ10‘12莫耳/cm2/秒以上之情形爲「不良」,未 達2 _ 0 X 1 (Γ 12莫耳/ c m 2 /秒之情形爲「良好」。 〔感度〕: 準備形成有l〇5nm之下層抗反射膜(「ARC66」、日 產化學公司製)之1 2英吋矽晶圓,於該矽晶圓表面上, 將組成物溶液以旋轉塗佈法塗佈於基板之薄膜上,於熱壓 板上,依表5所示溫度(l〇〇°C )進行60秒鐘之輕燒焙( SB ; Soft Bake)(表5中,簡稱爲「SB」)以形成膜厚 90nm之光阻被膜。於所形成之膜厚90nm之光阻被膜上 ,理光公司製之全方位縮小投影浸潤式曝光裝置^ S610C j (開口數1.30),介由遮罩圖型進行曝光。其後,依表 5所示溫度進行60秒鐘PEB ( PEB )後,以2.38質量% 之TMAH水溶液,於25°C下進行30秒鐘顯影,經水洗、 乾燥,形成正型光阻圖型。此時,藉由尺寸45 nm之1對 1線路與空間之遮罩所形成之線寬,以形成線寬45nm之 1對1線路與空間之曝光量(mJ/cm2)作爲最佳曝光量’ 將該最佳曝光量(mJ/cm2)作爲「感度」。 -68- 201132655 〔LWR ( Line Width Roughness )〕: 使用上述〔感度〕中所評估之最佳曝光量,於光阻被 膜上形成45nm ( 1L/1S )之圖型,將所形成之45nm ( 1 L/1 S )圖型’使用測長SEM (日立高科技公司製,型號 「CG4000」)’由圖型上部進行觀察,並以任意之點對 線寬進行測定。將測定該線寬所得之測定參數,以3 Σ表 示,並以該數値評估LWR。 〔頂部消耗〕: 使用最佳曝光量解像所得之45nmlL/lS圖型之觀察 ,爲使用日立高科技公司製之掃瞄型電子顯微鏡(SEM) 「S-4800」觀察圖型之截面,並測定其高度(圖型高度) 。隨後’由圖型高度之値與初期膜厚(9 Onm )之差距算 出頂部消耗量》並以該頂部消耗量評估頂部消耗。 又’下述合成例1〜12中,使用下述式(M-1)〜( M-1 5 )所表示之化合物製作各聚合物(A-1 )〜(A-8 ) ((A)聚合物)。 -69- 201132655 【化4 0】Measurement was carried out by Mariner (manufactured by Perseptive Biosystems, Inc.). At this time, 'the peak intensity of each of the lppb, lOppb, and 100 ppb aqueous solutions of the photoacid generator' was prepared, and the calibration curve measured by the above measurement conditions was used, and the calibration curve was used. The amount of elution was calculated from the above peak intensity. The evaluation criteria is that the case where the elution amount is 2·0Χ10'12mol/cm2/sec or more is "poor", and it is less than 2 _ 0 X 1 (Γ 12m / cm 2 / sec is "good". [Sensitivity]: A 12-inch wafer having an anti-reflection film ("ARC66", manufactured by Nissan Chemical Co., Ltd.) having a thickness of 10 nm was prepared, and the composition solution was spin-coated on the surface of the wafer. The method is applied to a film of a substrate, and is subjected to light baking (SB; Soft Bake) on a hot plate at a temperature (10 ° C) shown in Table 5 (in Table 5, simply referred to as " SB") to form a photoresist film having a film thickness of 90 nm. On the photoresist film having a film thickness of 90 nm formed, Ricoh's all-round reduction projection immersion exposure apparatus ^ S610C j (number of openings 1.30) The mask pattern was exposed. Thereafter, PEB (PEB) was applied at a temperature of Table 5 for 60 seconds, and then developed in a 2.38 mass% TMAH aqueous solution at 25 ° C for 30 seconds, washed with water, and dried to form a pattern. Positive resistive pattern. At this time, the line width formed by a mask of 1 to 1 line and space of 45 nm is formed to form a line width of 45 nm. 1 Line and space exposure amount (mJ/cm2) as the optimum exposure amount' The optimum exposure amount (mJ/cm2) is used as the "sensitivity". -68- 201132655 [LWR (Line Width Roughness)]: Use the above [ The optimum exposure amount estimated in Sensitivity] forms a 45nm (1L/1S) pattern on the photoresist film, and the 45nm (1 L/1 S) pattern formed will use the length measurement SEM (Hitachi Hi-Tech) The company model, model "CG4000") is observed from the upper part of the pattern, and the line width is measured at any point. The measurement parameters obtained by measuring the line width are expressed as 3 ,, and the LWR is evaluated by the number. [Top consumption]: The observation of the 45nml L/lS pattern obtained by the best exposure amount is used to observe the cross section of the pattern using a scanning electron microscope (SEM) "S-4800" manufactured by Hitachi High-Tech Co., Ltd. The height (pattern height) was measured. Then, the top consumption was calculated from the difference between the height of the pattern and the initial film thickness (9 Onm) and the top consumption was evaluated by the top consumption. In 12, the combination represented by the following formula (M-1) to (M-1 5 ) is used. Each of the polymers (A-1) to (A-8) ((A) polymer) was produced. -69- 201132655 [Chemical 4 0]

-70- 201132655 (合成例1 ) (聚合物(A-l)之製作) 將式(M-1)所表示之化合物(m-ι) 24.61g(30莫 耳%)、式(M-8)所表示之化合物(m-8) 54.19g(50 莫耳% ),及’下述式(M-9 )所表示之化合物(M-9 ) 9.08g(10莫耳%)溶解於2_ 丁酮2〇〇g中,再將二甲基 2’2’-偶氮二異丁腈4.00g投入其中,以製作單體溶液。 另外’將投入有式(M-5 )所表示之化合物(μ-5 ) 12.11g及100g之2 -丁酮之l〇〇〇m L之三口燒瓶以30分 鐘吹入氮氣’其後’將反應釜於攪拌中加熱至80〇c,將 事則製得之上述單體溶液,使用滴下漏斗以3小時時間滴 入。以滴下開始時間作爲聚合開始時間,進行6小時聚合 反應。聚合結束後’將聚合溶液以水冷方式冷卻至3 〇艺 以下。其後’投入2000g之甲醇中,析出白色粉末,將析 出之白色粉末濾出。濾出之白色粉末使用40〇g之甲醇以 漿液狀洗淨2次》其後’經濾出、於5 0 °C下乾燥1 7小時 *得白色粉末之共聚合物(產量79g、產率79%)。 該共聚物之 Mw 爲 5500,Mw/Mn = 1.41,"C-NMR 分 析結果,如表3所示般,式(Μ-1 )所表示之化合物( 1)、式(M-5)所表示之化合物(M-5)、式(M-8)所 表示之化合物(M-8)、式(M-9)所表示之化合物(m-9 )所產生之各重複單位之含有率(莫耳%)分別爲30.2 : 9.9: 10_2: 49.7。該共聚合物作爲聚合物(A-1)。又, 聚合物(A-1 )之物性値如表3所示。 -71 - 201132655 (合成例2〜8 ) (聚合物(A-2 )〜(A-8 )之製作) 除依表1所示化合物(單體種類)及添加率以外,其 他皆依合成例1相同方法製作聚合物(A-2 )〜(A-8 )。 又,聚合物(A-2 )〜(A-8 )之物性値係如表3所示。 -72- 201132655 【1® 其他單體 添加率 (莫耳%) 1 I I 1 1 I o I 單體種類 1 I I 1 1 I M-10 I m m * 添加率 丨(莫耳%) S 8 S 1 σ> CO o 〇 题 釦 承1 單體種類 M-8 M-8 M-8 M-8 1 M-8 M-8 M-8 特定單體 添加率 漠耳%) 〇 〇 a s o I I I 單體画 M-9 M-9 cn 士 M-9 M-9 I I I 含酸解離性基之單體 添加率 (莫耳%) 1 I I 1 1 I I o 單體種類 1 I I 1 1 I I M-5 添加率 (莫耳%) 〇 〇 I 1 1 CO 〇 o 單體種類 M-5 M-5 I 1 1 M-4 M-5 M-4 添加率 丨(莫耳%) 8 g g g g in ·»— o o 單體種類 M-1 M-1 1 Έ M-6 M-1 CsJ Έ M-1 j S 聚合物 < A-2 A-3 I A-4 A~5 A-6 A-7 A-8 -73- 201132655 (合成 (聚合 使 耳% ) 莫耳% 1 9.06g 基2,2 1 000m 氮氣吹 其 上述單 行6小 冷卻至 其後, 醇,進 單甲基 該 產率爲 析之結 表示之 M-1 3 ) (M-P (莫耳 合物( 例9) 物(C-1 )之製作) 式(M-3)所表示之化合物(m-3) 50.88g(60莫 、式(m-13)所表示之化合物(μ·13) 3〇.〇6g(i5 ’)’及式(M-14)所表示之化合物(m-14) (25莫耳%)溶解於2_ 丁酮1〇〇g中,再投入二甲 ’-偶氮二異丁腈3 . 5 5 g,以製作單體溶液。另,於 乙之三口燒瓶中投入l〇〇g之2 -丁酮,進行30分鐘 入後’將反應釜於攪拌中加熱至8〇t;。 次’使用滴下漏斗’以3小時時間滴入事前製得之 體溶液中。以滴下開始時間作爲聚合開始時間,進 時聚合反應。聚合結束後,以水冷方式將聚合溶液 3〇 °C以下’將該聚合溶液移至2L之分液漏斗中。 以300g之η -己烷稀釋聚合溶液,投入i2〇〇g之甲 行混合後,靜置30分鐘,回收下層,作爲丙二醇 醚乙酸酯溶液。 丙二醇單甲基醚乙酸酯溶液之固形分(聚合物)的 65%,Mw 爲 6400,Mw/Mn 爲 1.41,13C-NMR 分 果,得知氟含有比例爲9 · 1 4質量%、式(M-3 )所 化合物、(M-3 )所表示之化合物(M-13 )、式( 所表示之化合物(M-13),及式(M-14)化合物 所表示之化合物所產生之各重複單位的含有率 %)分別爲60.3: 24.9: 14.8。將該共聚物作爲聚 C -1 ) 〇 -74- 201132655 (合成例1 〇〜1 2 ) 除使用表2所示化合物(單體種類)及配合率以外, 其他皆依合成例9相同方法製作聚合物(C-2 )〜(C-4 ) 。又,聚合物(C - 2 )〜(C - 4 )之物性値係如表3所示。 [表2] 聚合物 含酸解離性基之單體 含有氟之單體 單體種類 添加率 (莫耳%) 單體· 添加率 (莫耳%) 單體· 添加率 (莫耳%) C-1 M-3 60 M-13 25 M-14 15 C-2 M-7 60 M-13 25 M-14 15 C-3 M-2 70 M-12 30 一 — C-4 M-7 40 M-15 60 一 — -75- 201132655 4j ^ 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 9.13 9.30 10.20 9.03 φι C Έ \ 1.41 1.43 1.39 1.48 1.39 1.38 1.39 1.41 1.38 1.41 1.45 Έ 5 ο ο 5500 Ο Ο 5500 Ο ο 6400 ο Ο ο Έ ΙΛ ιη CO g σ> (Ο 00 ιη eg ιη σ) ιη Ο C0 CO S备 卜 ΙΟ 1 | I I ο 卜 | 1 I 1 异 1 1 I I ο σ> CO 1 1 1 1 m “ήτΐ! m CD CO I 1 1 I ο CO I I 1 I 翻 GQIQ Έ Έ Έ 酹 含有比例 (質量%) 10.2 10.2 19.7 20.5 I 39.7 40.4 10.8 14.8 "Τ* 1 1 m *r\ r\ <tm11 m σ> σ) CO cp 1 CO CO LO 寸 Τ" 寸 I I 聽 乏 Έ Έ Έ Έ Έ Έ Έ 酹 s冢 !§ σ> σ> 10.C 19.£ 20.Ε 39j 45.Ϊ ιη ai CO σΐ 24.£ 25.: 30.1 59.ί m <Kf\ limit 删 gif ιη ιη 05 ? σ> 下 ιη τΤ r* Έ Έ Έ Έ Έ Έ Έ 2 Έ Έ Έ ss w 30.2 49.3 60.5 58.9 60.3 14.6 40.1 39.9 60.3 59.6 69.9 40.5 & •F!^\ «Imll m I I I CD 1 CSi Τ Ι 1·* I C0 rp Cjsl Γρ 幽 Έ Έ Έ 2 Έ Έ Έ Έ Έ 酹 聚合物 < Α-2 Α-3 Α-4 Α-5 (Ο < Α-7 Α-8 ύ CSi Ο C-3 了 Ο -76- 201132655 其次’實施例及比較例所使用之「酸產生劑」與「酸 擴散控制劑」係如以下所示。 【化4 1】-70-201132655 (Synthesis Example 1) (Production of polymer (Al)) Compound (m-ι) represented by formula (M-1): 24.61 g (30 mol%), formula (M-8) The compound (m-8) represented by 54.19 g (50 mol%), and the compound represented by the following formula (M-9) (M-9) 9.08 g (10 mol%) dissolved in 2-butanone 2 In 〇〇g, 4.00 g of dimethyl 2'2'-azobisisobutyronitrile was further added thereto to prepare a monomer solution. In addition, a mixture of 12.11 g of compound (μ-5) represented by formula (M-5) and 100 g of 2-butanone of l-butanol in a three-necked flask was blown with nitrogen for 30 minutes. The reaction vessel was heated to 80 ° C with stirring, and the above monomer solution was prepared by dropwise addition using a dropping funnel over a period of 3 hours. The polymerization reaction was carried out for 6 hours using the dropping start time as the polymerization starting time. After the completion of the polymerization, the polymerization solution was cooled to 3 liters or less by water cooling. Thereafter, it was poured into 2000 g of methanol to precipitate a white powder, and the precipitated white powder was filtered off. The white powder which was filtered off was washed twice with a slurry of 40 g of methanol, followed by 'filtering out and drying at 50 ° C for 17 hours* to obtain a white powder of a copolymer (yield 79 g, yield) 79%). The copolymer had a Mw of 5,500, Mw/Mn = 1.41, and a C-NMR analysis result, as shown in Table 3, a compound (1) and a formula (M-5) represented by the formula (Μ-1). The content of each repeating unit produced by the compound (M-5), the compound (M-8) represented by the formula (M-8), and the compound (m-9) represented by the formula (M-9) ( Moer %) is 30.2 : 9.9: 10_2: 49.7. This copolymer was used as the polymer (A-1). Further, the physical properties of the polymer (A-1) are shown in Table 3. -71 - 201132655 (Synthesis Examples 2 to 8) (Production of Polymers (A-2) to (A-8)) Except for the compounds (monomer types) and addition ratios shown in Table 1, all were synthesized according to the synthesis examples. The polymer (A-2) to (A-8) was produced in the same manner. Further, the physical properties of the polymers (A-2) to (A-8) are shown in Table 3. -72- 201132655 [1® Other monomer addition rate (mol%) 1 II 1 1 I o I Monomer type 1 II 1 1 I M-10 I mm * Addition rate 莫 (mol %) S 8 S 1 σ> CO o 扣 扣 扣 1 monomer type M-8 M-8 M-8 M-8 1 M-8 M-8 M-8 specific monomer addition rate indifference %) 〇〇 aso III M-9 M-9 cn 士 M-9 M-9 III Monomer addition rate of acid-dissociable group (% by mole) 1 II 1 1 II o Monomer type 1 II 1 1 II M-5 Addition rate ( Moer %) 〇〇I 1 1 CO 〇o monomer type M-5 M-5 I 1 1 M-4 M-5 M-4 Addition rate 莫 (mole%) 8 gggg in ·»— oo monomer Species M-1 M-1 1 Έ M-6 M-1 CsJ Έ M-1 j S Polymer < A-2 A-3 I A-4 A~5 A-6 A-7 A-8 -73 - 201132655 (Synthesis (polymerization to ear %) Mohr % 1 9.06g base 2,2 1 000m Nitrogen blowing the above single row 6 small cooling to thereafter, alcohol, monomethyl group, the yield is expressed as the knot of M -1 3 ) (MP (Production of Molybdenum (Example 9) (C-1)) Compound (m-3) represented by formula (M-3) 50.88 g (60 mol, formula (m-13) ) Compound (μ·13) 3〇.〇 6g (i5 ')' and the compound (m-14) (25 mol%) represented by the formula (M-14) are dissolved in 2 -butanone 1 〇〇g, and then added to dimethyl '-azobisisobutylene Nitrile 3.55 g to prepare a monomer solution. In addition, l〇〇g of 2-butanone was added to a three-necked flask, and after 30 minutes of incorporation, the reactor was heated to 8 Torr with stirring; The second 'use the dropping funnel' was dropped into the body solution prepared in advance for 3 hours. The polymerization start time was used as the polymerization start time, and the polymerization reaction was carried out. After the completion of the polymerization, the polymerization solution was cooled to 3 ° C or less by water cooling. 'The polymerization solution was transferred to a 2 L separatory funnel. The polymerization solution was diluted with 300 g of η-hexane, mixed in a row of i2 〇〇g, and allowed to stand for 30 minutes, and the lower layer was recovered as propylene glycol ether acetate. Solution: 65% of the solid content (polymer) of the propylene glycol monomethyl ether acetate solution, Mw was 6400, Mw/Mn was 1.41, 13C-NMR was determined, and the fluorine content was found to be 9 · 14% by mass. a compound of the formula (M-3), a compound (M-13) represented by (M-3), a compound represented by the formula (M-13), and a formula (M) -14) The content rate of each repeating unit produced by the compound represented by the compound is 60.3: 24.9: 14.8. The copolymer was prepared as the same method as in Synthesis Example 9 except that the compound (monomer type) and the compounding ratio shown in Table 2 were used, except that the compound (monomer type: 〇~1 2 ) was used. Polymer (C-2) ~ (C-4). Further, the physical properties of the polymers (C - 2 ) to (C - 4 ) are shown in Table 3. [Table 2] Polymeric acid-dispersing group-containing monomer Fluoride-containing monomer monomer type addition ratio (mol%) Monomer·addition rate (mol%) Monomer·addition rate (mol%) C -1 M-3 60 M-13 25 M-14 15 C-2 M-7 60 M-13 25 M-14 15 C-3 M-2 70 M-12 30 One — C-4 M-7 40 M -15 60 一 - -75- 201132655 4j ^ 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 9.13 9.30 10.20 9.03 φι C Έ \ 1.41 1.43 1.39 1.48 1.39 1.38 1.39 1.41 1.38 1.41 1.45 Έ 5 ο ο 5500 Ο Ο 5500 Ο ο 6400 ο ο ο Έ ΙΛ ιη CO g σ> (Ο 00 ιη eg ιη σ) ιη Ο C0 CO S ΙΟ ΙΟ 1 | II ο 卜 | 1 I 1 异 1 1 II ο σ > CO 1 1 1 1 m “ήτΐ! m CD CO I 1 1 I ο CO II 1 I Turn GQIQ Έ Έ Έ 酹 content ratio (% by mass) 10.2 10.2 19.7 20.5 I 39.7 40.4 10.8 14.8 "Τ* 1 1 m *r\ r\ <tm11 m σ&gt ; σ) CO cp 1 CO CO LO Τ quot quot 听 听 听 听 听 § § § σ 酹 冢 § § σ gt gt 10.C 19.£ 20.Ε 39j 45.Ϊ ιη ai CO σΐ 24.£ 25.: 30.1 59.ί m <Kf\ limit Delete gif ιη ιη 05 ? σ> 下ιη τΤ r* Έ Έ Έ Έ Έ Έ Έ 2 Έ Έ Έ ss w 30.2 49.3 60.5 58.9 60.3 14.6 40.1 39.9 60.3 59.6 69.9 40.5 & •F!^\ «Imll m III CD 1 CSi Τ Ι 1·* I C0 rp Cjsl Γρ Έ Έ Έ 2 Έ Έ Έ Έ 酹 酹 Polymer < Α-2 Α-3 Α-4 Α-5 (Ο < Α-7 Α-8 ύ CSi Ο C-3 Ο -76- 201132655 Next 'Example and The "acid generator" and the "acid diffusion control agent" used in the comparative examples are as follows. [化4 1]

f2 f2 F3C〆、〆、so3 F2 (B-1)F2 f2 F3C〆, 〆, so3 F2 (B-1)

(B-5) -77- 201132655 【化4 2】(B-5) -77- 201132655 [Chem. 4 2]

(Ο-D(Ο-D

(0-2)(0-2)

(D-5)(D-5)

又,實施例及比較例所使用之「溶劑」與「添加劑」 係如以下所示。 溶劑(E-1):丙二醇單甲基醚乙酸酯、 溶劑(E-2 ):環己酮、 添加劑(F -1 ) : r - 丁內酯。 (實施例1 ) 將作爲(A )聚合物之依合成例1所製作之聚合物( -78- 201132655 A-l ) 100份、作爲(B )酸產生劑之上述式(B-丨)所表 示之化合物(B -1 ) 1 〇份、作爲(c )聚合物之依合成例9 所製作之聚合物(C- 1 ) 2份、作爲酸擴散控制劑之上述 式(D-1 )所表示之化合物(d-1 ) 1.2份、作爲溶劑之溶 劑(E- 1 ) 1 800份、溶劑(E_2 ) 75 0份,及,作爲添加劑 之添加劑(F- 1 ) 3 0份混合,以製作由敏輻射線性樹脂組 成物所製得之組成物溶液。隨後,使用所製得之組成物溶 液進行上述各種評估。 本實施例之敏輻射線性樹脂組成物,溶出量之評估爲 「良好」’感度之評估中之値爲20.0mJ/cm2,LWR之評 估中之値爲3.5rim,頂部消耗之評估中之値爲i5nm。 (實施例2〜1 8、比較例1〜4 ) 除依表4所示化合物及添加量以外,其他皆依實施例 1相同方法製作由各敏輻射線性樹脂組成物所形成之組成 物溶液。使用所製得之各組成物溶液進行上述各種評估。 評估結果係如表5所示。 -79 - 201132655 □ 1 _甶 后ΙΜ 腾麫 8 另 O CO o co O o 8 o C9 o CO 〇 CO Μ WS ilflUj m lL 丄 I r* Ll t·· 丄 丄 丄 丄 r· ll· 丄 丄 丄 lL 1— 丄 I ί iL U- ▼·· 丄 iL Y— 丄 ▼*· 丄 T— 丄 1 t-· 丄 蘅 m 君_ s Ρ-» g r- g g 卜 s r- o in S S Ο ΙΟ o in s ο LO o in o in s s s s r- s 卜 S 卜 o JO o JO o Ln ο jn s & ilrfTlI m Csl LU CM 山 CM 山 eg 山 eg Ui CSI 山 eg 山 eg LU CJ4 山 Cjsl UJ Cs( LU CNJ LU Csl LU C*J LU csi m Csl UJ CNJ LU CM LU CNJ UJ OJ 111 CNJ 山 cjg 山 CSI 山 OJ 山 eg 山 _裘 君_ 〇 〇〇 震 1 o 00 O 00 o 00 震 議 Ο CO | | o c〇 〇 00 o 00 o s o 00 〇 CO | Ο 00 o 00 o 00 o 00 〇 00 ο 00 震 Μ •Kr» t»wi1 m I Σ l l I 1 Σ 1 Σ Σ l l l Σ l l l LU Τ» LU l l Σ 蘅 Μ 雔 饀 _运 «ΦΙ mu CNl CNJ CNi CNJ CNj y— csl T— σ> 〇 <〇 d ρ 〇> CO d to CO CO CO CD CO <〇 CO CO o p ρ CsJ C>J CNJ Csl CNJ m P τ α Ύ— Ο Q Q o 〇 T Q τ~· Q Q T~ Q Cjsl Q cp Q Y a vn 〇 CO Q Q Q a Ω Q r— Q τ α Q § <Π 嵌 ϋ 另_ csl CM in CM eg Csl CM eg CM CVJ CM CM CM CM m Cvj ιο 04 m oi CNJ m in ΙΟ 1 m iimn 郷 y^~ 6 CNJ Ο cp 〇 了 〇 » 〇 1 〇 ό ύ 〇 ύ 1 〇 1 o 1 〇 1 〇 cp 〇 CO 〇 CO 〇 〇 CO 0 CO 〇 CO ό 1 罷 1 S _φ 呂¢1 滕麫 〇 o ο ο o o O o' in (〇 σ> σ> 00 CD σί c\i o o’ O o 〇 〇 O o o d (O CO CO o' (O csi CO csi 〇 o’ 〇 d o o ο ο 〇 〇 m “mil P S"· 1 CQ ι 1 m r-» CQ CNI m ? QQ 了 ω in 00 CO CO »·» ffl T CO CD T ω T ω in m CO GD CO m CO CO T CD T CD r" ffl CQ CD <〇 齡 _φ 后_ 腾® o Ο O 〇 o o o o ο Ο 〇 o 〇 o o O o O o O s s o o o o ο ο 〇 m w < ^-* < 1 < 1 < t < < 1 < 1 < < < T < < 1— < eja < ? < cp < < in < CO < r- < CO < 1 < i 握 w CM 揭 in CO 匡 m 刺 寸 握 w in 匡 m flu; (0 揭 κ i 握 舰 00 m m w 0) m K 0 1 闺 « i 闺 CNJ i 揭 n CO i 辑 佩 i 闺 Im 10 5 m n (0 i 辑 舾 I I 00 i 闺 K i 鎰 jj JA CNJ 鎰 ΛΑ C0 鎰 寸 瑙 a -80- 201132655 [表5] SB (°C) PEB (°C) 溶出量 感度 (mJ/cm2) LWR (nm) 頂部消耗 (nm) 實施例1 100 95 良好 20.0 3.5 15 實施例2 100 95 良好 19.5 3.5 13 實施例3 100 95 良好 20.5 3.7 14 實施例4 100 95 良好 19.0 3.6 16 實施例5 100 95 良好 20.0 3.5 14 實施例6 100 95 良好 21.0 3.4 13 實施例7 100 95 良好 19.5 3.3 12 實施例8 100 95 良好 20.5 3.2 11 實施例9 100 95 良好 20.0 3.6 12 實施例1 〇 100 95 良好 20.0 3.2 14 實施例11 100 95 良好 22.0 3.1 11 實施例12 100 95 卜良好 21.0 3.2 12 實施例13 100 95 良好 20.5 3.1 11 實施例14 100 95 良好 19.0 3.1 11 實施例15 100 95 良好 20.0 2.8 15 實施例1 6 100 95 良好 19.5 3.0 16 實施例17 100 95 良好 19.0 2.9 17 實施例18 100 95 良好 17.0 4.1 14 比較例1 100 110 良好 22.5 3.7 24 比較例2 100 95 良好 23.0 3.6 29 比較例3 100 100 良好 21.0 3.6 27 比較例4 100 - 不良 — - - 由表5內容即可明瞭般,實施例1〜1 8之敏輻射線性 樹脂組成物,與比較例1〜4之敏輻射線性樹脂組成物相 比較結果,確認其顯影後具有良好之LWR,且不易產生 膜消減之情事。 [產業上之利用性] 本發明之敏輻射線性樹脂組成物’適合作爲半導體之 -81 - 201132655 製造領域中,微影蝕刻技術所使用之光阻。本發明之光阻 圖型之形成方法適合作爲半導體之製造領域中,微影蝕刻 技術中形成微細圖型之方法。 -82-Further, the "solvent" and "additive" used in the examples and comparative examples are as follows. Solvent (E-1): propylene glycol monomethyl ether acetate, solvent (E-2): cyclohexanone, additive (F-1): r - butyrolactone. (Example 1) 100 parts of the polymer (-78-201132655 Al) produced in Synthesis Example 1 as a polymer (A), and the above formula (B-丨) as a (B) acid generator Compound (B-1) 1 part, 2 parts of polymer (C-1) produced according to Synthesis Example 9 as (c) polymer, and represented by the above formula (D-1) as an acid diffusion controlling agent 1.2 parts of the compound (d-1), 1 800 parts of a solvent (E-1) as a solvent, 75 parts of a solvent (E_2), and 30 parts of an additive (F-1) as an additive to prepare a sensitive substance A composition solution obtained by irradiating a linear resin composition. Subsequently, the above various evaluations were carried out using the obtained composition solution. In the sensitive radiation linear resin composition of this example, the evaluation of the dissolution amount was "good" and the sensitivity was 20.0 mJ/cm2, and the evaluation of the LWR was 3.5 rim, and the evaluation of the top consumption was I5nm. (Examples 2 to 18, Comparative Examples 1 to 4) A composition solution composed of each of the radiation sensitive linear resin compositions was produced in the same manner as in Example 1 except that the compound shown in Table 4 and the amount of addition were used. The above various evaluations were carried out using the respective composition solutions prepared. The evaluation results are shown in Table 5. -79 - 201132655 □ 1 _甶后ΙΜ Tengyi 8 Another O CO o co O o 8 o C9 o CO 〇CO Μ WS ilflUj m lL 丄I r* Ll t·· 丄丄丄丄r· ll· 丄丄丄lL 1— 丄I ί iL U- ▼·· 丄iL Y— 丄▼*· 丄T— 丄1 t-· 丄蘅m 君 _ s Ρ-» g r- gg 卜 r- o in SS Ο ΙΟ o in s ο LO o in o in ssss r- s 卜 S 卜 o JO o JO o Ln ο jn s & ilrfTlI m Csl LU CM mountain CM mountain eg mountain eg Ui CSI mountain eg mountain eg LU CJ4 mountain Cjsl UJ Cs( LU CNJ LU Csl LU C*J LU csi m Csl UJ CNJ LU CM LU CNJ UJ OJ 111 CNJ mountain cjg mountain CSI mountain OJ mountain eg mountain _ 裘君 _ 〇〇〇 1 1 o 00 O 00 o 00 Ο CO | | oc〇〇00 o 00 oso 00 〇CO | Ο 00 o 00 o 00 o 00 〇00 ο 00 Shock • Kr» t»wi1 m I Σ ll I 1 Σ 1 Σ Σ lll Σ lll LU Τ » LU ll Σ 蘅Μ 雔饀 _ _ « Ι Ι CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN CN C>J CNJ Csl CNJ m P τ α Ύ— Ο QQ o 〇TQ τ~· QQT~ Q Cjs l Q cp QY a vn 〇CO QQQ a Ω Q r— Q τ α Q § <Π ϋ ϋ _ csl CM in CM eg Csl CM eg CM CVJ CM CM CM m Cvj ιο 04 m oi CNJ m in ΙΟ 1 m iimn 郷y^~ 6 CNJ Ο cp 〇 〇» 〇1 〇ό ύ 〇ύ 1 〇1 o 1 〇1 〇cp 〇CO 〇CO 〇〇CO 0 CO 〇CO ό 1 11 S _φ 吕¢ 1 滕麫〇o ο ο oo O o' in (〇σ>σ> 00 CD σί c\io o' O o 〇〇O ood (O CO CO o' (O csi CO csi 〇o' 〇doo ο ο 〇〇m “mil P S"· 1 CQ ι 1 m r-» CQ CNI m ? QQ ω in 00 CO CO »·» ffl T CO CD T ω T ω in m CO GD CO m CO CO T CD T CD r" ffl CQ CD <〇龄_φ后_腾® o Ο O 〇oooo ο Ο 〇o 〇oo O o O o O ssoooo ο ο 〇mw < ^-* < 1 < 1 < t << 1 < 1 <<<<< 1 - < eja < ? < cp << in < CO < r- < CO < 1 &lt i grip w CM reveal in CO 匡m 刺 inch grip w in 匡m flu; (0 揭κ i grip ship 00 mmw 0) m K 0 1 闺« i 闺CNJ i 揭 n CO i佩i 闺Im 10 5 mn (0 i 舾 II 00 i 闺K i 镒jj JA CNJ 镒ΛΑ C0 镒 inch aa -80- 201132655 [Table 5] SB (°C) PEB (°C) Dissolution amount sensitivity (mJ/cm2) LWR (nm) Top Consumption (nm) Example 1 100 95 Good 20.0 3.5 15 Example 2 100 95 Good 19.5 3.5 13 Example 3 100 95 Good 20.5 3.7 14 Example 4 100 95 Good 19.0 3.6 16 Example 5 100 95 Good 20.0 3.5 14 Example 6 100 95 Good 21.0 3.4 13 Example 7 100 95 Good 19.5 3.3 12 Example 8 100 95 Good 20.5 3.2 11 Example 9 100 95 Good 20.0 3.6 12 Example 1 〇100 95 good 20.0 3.2 14 Example 11 100 95 Good 22.0 3.1 11 Example 12 100 95 Good 21.0 3.2 12 Example 13 100 95 Good 20.5 3.1 11 Example 14 100 95 Good 19.0 3.1 11 Example 15 100 95 Good 20.0 2.8 15 Example 1 6 100 95 Good 19.5 3.0 16 Example 17 100 95 Good 19.0 2.9 17 Example 18 100 95 Good 17.0 4.1 14 Comparative Example 1 100 110 Good 22.5 3.7 24 Comparative Example 2 100 95 Good 23.0 3.6 29 Comparative Example 3 100 100 good 21.0 3.6 27 Comparative Example 4 100 - Poor - - - As can be seen from the contents of Table 5, the sensitive radiation linear resin compositions of Examples 1 to 18 were compared with the sensitive radiation linear resin compositions of Comparative Examples 1 to 4, It was confirmed that it had a good LWR after development, and it was not easy to cause film reduction. [Industrial Applicability] The sensitive radiation linear resin composition of the present invention is suitable as a semiconductor. -81 - 201132655 The photoresist used in the lithography technique in the field of manufacturing. The method for forming a photoresist pattern of the present invention is suitable as a method of forming a fine pattern in a lithography technique in the field of semiconductor fabrication. -82-

Claims (1)

201132655 七、申請專利範圍: 1 · 一種敏輻射線性樹脂組成物,其特徵爲,含有 (A) 下述通式(1)所表示重複單位,及,具有酸解 離性基之聚合物,與 (B) 敏輻射線性酸產生劑,與 (C) 含有氟原子之聚合物, 【化1】201132655 VII. Patent application scope: 1 · A sensitive radiation linear resin composition characterized by containing (A) a repeating unit represented by the following general formula (1), and a polymer having an acid dissociable group, and B) a sensitive radiation linear acid generator, and (C) a polymer containing a fluorine atom, [Chemical 1] (通式(1 )中’ R1表示氫原子 '低級烷基,或鹵化低級 烷基;R2表示單鍵結、碳數〗〜5之2價之烴基' 烷二基 氧基’或烷二基羰氧基;R3表示3價之有機基)。 2 ·如申請專利範圍第1項之敏輻射線性樹脂組成物 ,其中,前述通式(1)所表示重複單位爲下述通式(!_:! )所表示重複單位, -83- 201132655 【化2】(In the formula (1), 'R1 represents a hydrogen atom' lower alkyl group, or a halogenated lower alkyl group; and R2 represents a single bond, a carbon number of 〜5, a divalent hydrocarbon group, an alkanediyloxy group or an alkanediyl group. Carbonyloxy; R3 represents a trivalent organic group). 2. The sensitive radiation linear resin composition of claim 1, wherein the repeating unit represented by the above formula (1) is a repeating unit represented by the following formula (!_:!), -83-201132655 [ 2] R50 (通式(1-1)中,R1表示氫原子、低級烷基,或鹵 級烷基;R2表示單鍵結、碳數1〜5之2價之烴基、 基氧基,或烷二基羰氧基;r5〇表示下述通式(a)所 之基’或’下述通式(b)所表示之基) 【化3】 化低 烷二 表示R50 (in the formula (1-1), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated alkyl group; and R2 represents a single bond, a hydrocarbon group having a carbon number of 1 to 5, a oxy group, a oxy group, or an alkane a carbonyloxy group; r5 〇 represents a group represented by the following formula (a) or a group represented by the following formula (b): (通式(a)中,nl表示0〜2之整數;通式(b)中 〜n5各自獨立表示〇〜2之整數;通式(a)及通式 中’*表示通式(1-1)中與R2鍵結之鍵結鍵;又, (a)所表示之基及通式(b)所表示之基中,構成該 基之碳原子的至少1個可被氧原子、氮原子或羰基所 :又,通式(a)所表示之基及通式(b)所表示之基 ,η 2 (b ) 通式 些之 取代 ,可 -84- 201132655 具有取代基)。 3 .如申請專利範圍第2項之敏輻射線性樹脂組成物 ’其中’前述通式(1)所表示重複單位爲下述通式(1_ 1 a )所表示重複單位, 【化4】(In the formula (a), nl represents an integer of 0 to 2; in the formula (b), n5 each independently represents an integer of 〇~2; in the formula (a) and the formula "*" represents a formula (1) 1) a bonding bond with an R2 bond; and, in the group represented by (a) and the group represented by the formula (b), at least one of the carbon atoms constituting the group may be an oxygen atom or a nitrogen atom. Or a carbonyl group: Further, a group represented by the formula (a) and a group represented by the formula (b), and a substituent of the formula η 2 (b) may have a substituent of -84 to 201132655. 3. The radiation sensitive linear resin composition of claim 2, wherein the repeating unit represented by the above formula (1) is a repeating unit represented by the following formula (1_1a), [Chemical 4] (通式(Ι-la)中,R1表示氫原子、低級烷基,或鹵化低 級烷基;R2表示單鍵結、碳數1〜5之2價之烴基、烷二 基氧基’或院二基羰氧基;Rh表示下述通式(al)所表 示之基’或’下述通式(bl)所表示之基) 【化5】(In the formula (Ι-la), R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; R2 represents a single bond, a carbon number of 1 to 5 carbon atoms, an alkanediyloxy group or a a bis-carbonyloxy group; Rh represents a group represented by the following formula (al) or a group represented by the following formula (bl); (通式(al)及通式(bl)中,*表示通式(i-ia)中與 R2鍵結之鍵結鍵)。 4.如申請專利範圍第1項之敏輻射線性樹脂組成物 ,其中,前述(C)聚合物具有由下述通式(2-1)〜(2- -85- 201132655 3)所表示之各重複單位所形成之群所選出之至少1種之 重複單位,(In the general formula (al) and the general formula (bl), * represents a bonding bond bonded to R2 in the general formula (i-ia)). 4. The sensitive radiation linear resin composition of claim 1, wherein the (C) polymer has each represented by the following general formula (2-1) to (2-85-201132655 3) Repeating at least one repeating unit selected by the group formed by the repeating unit, (通式(2-1)〜(2-3)中’ R1表示氫原子、低級烷基, 或鹵化低級烷基;通式(2-1 )中’ R9表示碳數1〜3〇之 氟化烷基;通式(2-2)中’ R6表示單鍵或(g+Ι)價之 鍵結基,g爲1〜3之整數:通式(2-3 )中,R7表示2價 之鍵結基:通式(2-2)及通式(2-3)中,R8表示氫原子 、酸解離性基,或鹼解離性基,R1()各自獨立表示氫原子 、氟原子,或碳數1〜1〇之氟化烷基;又,全部之R1()並 無爲氫原子之情形)》 5 .如申請專利範圍第4項之敏輻射線性樹脂組成物 ,其中,前述(C)聚合物,尙具有含有下述通式(2_4) 所表示之基與下述通式(2-5)所表示之基之至少一者之 基的重複單位(又,前述通式(2-3)所表示重複單位除 外), -86- 201132655 【化7】 〇=S=〇 1 COOH R11 (2-4) (2-5) 1〜1 0 (通式(2-4)中,Ri丨表示袖氣面 衣不被氟原子所取代之碳數 之烴基)。 6 ·如申n円專利範圍第5項之敏輻射線性樹脂組成物 ’其中Bn# (C)聚合物之含冑,相對於前述聚合 物1〇〇質量份,爲0.1〜40質量份。 7. —種光阻圖型之形成方法,其特徵爲,具備有, 將申請專利範圍第丨〜6項中任一項之敏輻射線性樹 脂組成物塗佈於基板上以形成光阻膜之光阻膜形成步驟, 與 於形成之前述光阻膜上配置浸潤式曝光用液體,介由 前述浸潤式曝光用液體以輻射線照射前述光阻膜之曝光步 驟,與 使用顯影液對輻射線照射後之前述光阻膜進行顯影以 形成光阻圖型之顯影步驟。 -87- 201132655 四、指定代表圖: (一) 本案指定代表圖為:無 (二) 本代表圖之元件符號簡單說明:無 -3- 201132655 五 本案若有化學式時,請揭示最能顯示發明特徵的化學 式:無(In the formula (2-1) to (2-3), 'R1 represents a hydrogen atom, a lower alkyl group, or a halogenated lower alkyl group; in the formula (2-1), 'R9 represents a fluorine having a carbon number of 1 to 3 fluorene. In the formula (2-2), 'R6 represents a single bond or a (g+Ι) valence bond group, and g is an integer of 1 to 3: in the formula (2-3), R7 represents a divalent value. Bonding group: In the formula (2-2) and the formula (2-3), R8 represents a hydrogen atom, an acid dissociable group, or an alkali-dissociable group, and R1() each independently represents a hydrogen atom or a fluorine atom. Or a fluorinated alkyl group having a carbon number of 1 to 1 Å; and, in the case where all of R1() is not a hydrogen atom), the sensitive radiation linear resin composition of claim 4, wherein the above (C) a polymer having a repeating unit containing at least one of a group represented by the following formula (2_4) and a group represented by the following formula (2-5) (again, the above formula (2- 3) Except for the repeating unit indicated, -86- 201132655 [Chemical 7] 〇=S=〇1 COOH R11 (2-4) (2-5) 1~1 0 (In the formula (2-4), Ri丨 denotes a hydrocarbon group in which the sleeve gas mask is not replaced by a fluorine atom). 6. The sensible radiation linear resin composition of the fifth aspect of the patent scope of the invention, wherein the ruthenium of the Bn# (C) polymer is 0.1 to 40 parts by mass based on 1 part by mass of the polymer. 7. A method for forming a photoresist pattern, comprising: applying a radiation sensitive linear resin composition according to any one of claims 1-6 to a substrate to form a photoresist film; a photoresist film forming step of disposing a immersion-type exposure liquid on the formed photoresist film, irradiating the photoresist film with radiation by the immersion-type exposure liquid, and irradiating the radiation with a developing solution The latter photoresist film is then developed to form a photoresist pattern development step. -87- 201132655 IV. Designated representative map: (1) The representative representative of the case is: No (2) The symbol of the representative figure is a simple description: No-3-201132655 If there is a chemical formula in the case, please reveal the best invention Chemical formula of the feature: none
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TWI473817B (en) * 2011-10-07 2015-02-21 Jsr股份有限公司 Photoresist composition and photoresist pattern formation method

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US9268219B2 (en) 2011-10-07 2016-02-23 Jsr Corporation Photoresist composition and resist pattern-forming method

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