TW201131009A - Vacuum processing device and processing method performed by the same - Google Patents
Vacuum processing device and processing method performed by the same Download PDFInfo
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- TW201131009A TW201131009A TW099142386A TW99142386A TW201131009A TW 201131009 A TW201131009 A TW 201131009A TW 099142386 A TW099142386 A TW 099142386A TW 99142386 A TW99142386 A TW 99142386A TW 201131009 A TW201131009 A TW 201131009A
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- vacuum chamber
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- sealing plate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
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- H10P72/3312—
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
201131009 j^^oyyu 六、發明說明: 【發明所屬之技術領域】 本發明是有關於-種真空處理裝置以及利用真空處 理裝釁的處理方法。 / 【先前技術】 於包括承载室及處理室的例如化學氣相沈積 (Chemlcal Vap〇rDep()siti()n,CVD)冑置等的真空處理裝 置中,通常是以如下方式對基板等的工件(讀)進行處 US:搬入ΐ真空預加熱室而進行預加熱。將經預加 件搬送至處理室並騎處理。將處理後的工件返回 熱室’並搬出至裝置外部。於此種裝置中,若 元成,則不能投人下-工件。因此,已知有如下的 彳及搬出路 = 一工件自真空預加熱室搬送至處理室(例如 先前技術文獻 專利文獻 日本專利特開2〇〇1_239144號公報 自處理室返的真空處理裝置中,若工件 ㈣的動作未完成,則無法將真 時間變ΐΤ紅件搬送至處理室。因此,搬送時所需的 【發明内容】 201131009 j*tzo^pu 括.案i的本發明的真空處理裝置的特徵在於包 及二=,,包含—面具有第1開口部的第1真空室 (panel),‘ 的第2真第1密封用板 開口部…= 部;第2密封用板’其覆蓋第2 的筮1叫 升降機’其將第1密封用板擠壓於裝置本體 第2升二4的周邊部,而自外部對第1真空室進行密封; 口邱^其將第2密封用板擠壓於裝置本體的第2開 送而自外部對第2真空室進行密封;第1搬 所載詈的、用以搬送自第1開口部開放的第1密封用板上 自楚9 ϋ至少被處理體;以及第2搬送機構,其用以搬送 體。,σ室開放的第2密封用板上所載置的至少被處理 法的二2本Γ的湘真空處观置的處理方 行做在於包括如下步驟:使第1升降機下降,將密封 m空室的第1密封用板保持在第1段的位置處的步 拓徂姓第2升降機下降’將密封第2真空室的第2密封用 六於笛在第2段的位置處的步驟;藉由第1搬送體,將收 了; 1真空室内的被處理體或載置有被處理體的托盤 ay)予以保持的步驟;藉由第2搬送體,將收容於第2 ^室⑽被處频絲置有被處雜的托舒以保持的 _ ,藉由第1搬送機構來驅動第1搬送體,而使被處@ 體或載置有被處的減機至與第2真空室 位置處的步驟;藉由第2搬送機構來驅動第2搬送體,而 使被處理體或載置有被處理體的托盤移動至與第丨真空室 201131009 相對應的位置處的步驟;使由第】升降機所保持的第】密 處理體的托盤收容至第1真空= 降機所支撐的第2密_板上升,將收容於 被處輯或+裁置有被處理體的托盤收容至上述第2真空室 的^驟’且藉由第j搬送機構來 使 ==處理體的托盤移動至與第2上而= 而理二驟’與藉由第2搬送機構來驅動第2搬送;、 室被處理體__與第^ 一g;二處的步驟’至少-部分是以相同時序 法的的=真空處理裝置的處理方 :板=:降機下降,密封 ===位置處的步驟;藉由第』二 容邱2真空室内的被處理體一併二板與收 ,機構來驅動第i搬送體,力而==藉由 ::11真空室内的被處理體一併移動至與第2真 :應的位置處的步驟;藉由第2搬送機構來 併==封用板與收容於第2真空室内的以 併移動至與第1真空室相對應如置處的步驟;=體 201131009 升,機上升,將第2密封用板密著於第丨真空室,並且 收容於^ 2真空室的被處理體收容至第 j201131009 j^^oyyu VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a vacuum processing apparatus and a processing method using a vacuum processing apparatus. [Prior Art] In a vacuum processing apparatus such as a chemical vapor deposition (Chemlcal Vap〇rDep() siti()n, CVD), which includes a carrier chamber and a processing chamber, the substrate or the like is usually used in the following manner. The workpiece (read) is carried out at the US: it is carried into the vacuum preheating chamber and preheated. The pre-added parts are transported to the processing chamber and rided. The processed workpiece is returned to the hot chamber' and carried out to the outside of the apparatus. In such a device, if the element is formed, the lower workpiece cannot be cast. For this reason, it is known that the sputum and the ejector are as follows: a workpiece is transported from the vacuum preheating chamber to the processing chamber (for example, the vacuum processing device returned from the processing chamber is disclosed in Japanese Patent Laid-Open Publication No. Hei No. Hei. If the operation of the workpiece (4) is not completed, the true time-changing blush member cannot be transported to the processing chamber. Therefore, the invention is required for the transportation. 201131009 j*tzo^pu The vacuum processing device of the present invention. The second package includes a first vacuum chamber having a first opening, a second true first sealing plate opening portion = a portion, and a second sealing plate The second 筮1 is called an elevator, and the first sealing plate is pressed against the peripheral portion of the second liter 2 and 4 of the apparatus body, and the first vacuum chamber is sealed from the outside; The second vacuum chamber is sealed from the outside by the second opening of the apparatus main body, and the first sealing plate for transporting the first opening from the first loading port is at least 9 a body to be processed; and a second conveying mechanism for conveying the body. The processing of the at least two Γ Γ 真空 真空 真空 真空 真空 所载 所载 第 第 第 第 第 第 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空 真空(1) The sealing plate is held at the position of the first stage, and the step of the second lift is lowered. The step of sealing the second seal of the second vacuum chamber is at the position of the second stage; The transporting body is received; the step of holding the object to be processed in the vacuum chamber or the tray ay) on which the object to be processed is placed; and the second transporting body is placed in the second chamber (10) In the case where the first transporting body is driven by the first transport mechanism, the first transporting body is driven by the first transport mechanism, and the step of reducing the load to the second vacuum chamber is performed. The second transporting body is driven by the second transporting means, and the workpiece or the pallet on which the object to be processed is placed is moved to a position corresponding to the second vacuum chamber 201131009; The tray of the first dense container to be held is placed until the first vacuum _ plate supported by the first vacuum = lowering machine, and will be received. The tray of the object to be processed is placed in the second vacuum chamber, and the tray of the == processing body is moved to the second side by the j-th transfer mechanism. The second step 'and the second transport by the second transport mechanism; the chamber to-be-processed body __ and the second g; the steps of the two steps are at least partially processed by the same timing method = vacuum processing device Side: Plate =: descending machine, sealing === position at the position; by the second body of the second chamber of the second ventilated vacuum chamber, the first and second plates are connected and the mechanism is used to drive the ith conveyor, force = = by: 11: the step of moving the object to be processed in the vacuum chamber to the position corresponding to the second true; the second transfer mechanism is used to == the sealing plate and the housing in the second vacuum chamber And moving to the step corresponding to the first vacuum chamber; if the body is 201131009 liter, the machine rises, the second sealing plate is adhered to the second vacuum chamber, and the object to be processed accommodated in the vacuum chamber is accommodated To j
錢使第2升降機上升,將第1密板㈣於第η 至,並且將收容於第丨真空室的被處理體收容至第2直^ 至的步驟,且藉由第1搬送機構來驅動第1搬送體,而^ 第工密封用板與收容於第i真空室内的被處理體一併= 至與第2真“相對應的位置處的倾,與藉由第2搬 機構來驅動第2搬送體,㈣第2㈣用板魏容於第2 被處理體一併搬送至與第1真空室相對應的位 置處的步驟’至少—部分是以相同時序而進行。 [發明的效果] 可藉由第1搬送機構而將被處理體收容至第丨真空 室,並且藉由第2搬送機構而將被處理體收容至第2真空 室。 1 為讓本發明之上述特徵和優點能更明顯易懂,下文特 舉實施例,並配合所附圖式作詳細說明如下。 【實施方式】 (實施形態1) 以下,一併說明本發明之真空處理裝置及圖式。圖i 是表示實施形態1的俯視觀察時的剖面圖,圖2是圖i的 II-II線切斷剖面圖’圖3是圖1的ΠΙ-ΙΙΙ線切斷剖面圖。 真空處理裝置100具有用以形成承載室(Lc : L〇ck Chamber) 2、處理室(PC : Process Chamber) 3、及搬送 室4的本體框架1。於本體框架丨的形成承載室2的區域 201131009 中形成開口部1L·,於形成虚理它1 IP。開口部…於圖i中是以二==成開口部 口料周園的本體框架 厂貞置The money raises the second elevator, and the first dense plate (four) is at the nth, and the object to be processed accommodated in the second vacuum chamber is accommodated in the second straight step, and the first transport mechanism drives the first (1) the transporting body, and the workpiece sealing plate together with the object to be processed accommodated in the i-th vacuum chamber = the tilt at the position corresponding to the second true "and the second transport mechanism to drive the second (4) The second step (4) The second (fourth) plate is conveyed to the position corresponding to the first vacuum chamber by the second object to be processed, at least in part, at the same timing. [Effect of the Invention] The object to be processed is housed in the second vacuum chamber by the first transport mechanism, and the object to be processed is housed in the second vacuum chamber by the second transport mechanism. 1 The above features and advantages of the present invention can be made more apparent. The following is a detailed description of the embodiments as follows: [Embodiment] (Embodiment 1) Hereinafter, a vacuum processing apparatus and a drawing of the present invention will be described together. A cross-sectional view in a plan view, and FIG. 2 is a cross-sectional view taken along line II-II of FIG. Fig. 3 is a cross-sectional view of the ΠΙ-ΙΙΙ line of Fig. 1. The vacuum processing apparatus 100 has a stacking chamber (Lc: L〇ck Chamber) 2, a processing chamber (PC: Process Chamber) 3, and a transfer chamber 4 The body frame 1. The opening portion 1L· is formed in the region 201131009 of the body frame 形成 forming the bearing chamber 2, and the imaginary structure 1 IP is formed. The opening portion is in the figure i is the opening of the opening portion Garden body frame factory installation
上邬笫射用kc 、, 配置有可開閉的LC 於開口部1L周搬出或搬人工件(被處理體)。而且, 密封用板6。^開口部内面侧,配置有LC下部 有PC密封用板7。。圍的本體框架1的内面側配置 構/^^卩㈣批5上連財升降機構20。升降機 稱A B枯馬達(mot〇r) 2卜 導引構件26、升降構件27 (祕咖)25、 ί ^5 25 22 珠螺二正轉或反轉’藉此使滚 而上下編Ί 使升降構件27沿著導引構件26 件28上的t降構件27的上下移動,固定於連接構 自本體框加1 ΐ部密封用板5,在圖2所示的密封位置與 itt:1離開的開放位置之間位移。於開口部1L的 該密^^件U ’猎由將LC上部密封用板5擠壓於 封構件11上而自外部將承载室2予以密封。 降機30L,且在與處理室3相對應的一侧 置有升降機30P。升降機亂及3〇p包括未圖示的液壓 (hydraulic cylinder )或馬達等的驅動裝置。升降機3儿 201131009 及3OP分別具有4根連桿(rod) 31。升降機30L的4根連 桿31貫穿本體框架1而於搬送室4内的承載室2側突出。 此外,升降機30P的4根連桿31貫穿本體框架1而於搬 送室4内的處理室3側突出。雖未圖示,但為了將搬送室 4内維持成真空,升降機30L及30P貫穿本體框架1的部 分為密封結構。 升降機30L的4根連桿31是藉由加強板32L連結而 加強。升降機30P的4根連桿31是藉由加強板32P連結 鲁 而加強。搬送室4連接有用以使搬送室4内變成真空的包 括閥(valve)與真空泵的真空裝置19。搬送室4於長度方 向上形成為較承載室2及處理室3的合計長度更長,且於 寬度方向上形成為較承載室2或處理室3的寬度更大。而 且,如以下說明所示,高度方向上形成為容許連桿31伸 長、收縮的尺寸。因此,搬送室4的容積形成為較承載室 2的容積及處理室3的容積的合計容積更大。 藉由使升降機30L的連桿31上升,將LC下部密封用 # 板6擠壓於設置在本體框架1的開口部1L周圍的密封構 件12上’自搬送室4對承載室2進行密封。若LC下部密 封用板6在升降機30L的連桿31下降的同時以保持在連 桿31上的狀態而下降,則承載室2内變成與搬送室4相同 的環境。承載室2連接有用以使承載室2内變成真空的包 括閥與真空泵的真空裝置14及通氣(vent)系統配管15。 藉由使升降機30P的連桿31上升,將pc密封用板7 擠壓於設置在本體框架1的開口部lp周圍的密封構件Η 201131009 JHZOVpn 上’自搬送室4對處理室3進行密封。若pc密封用板7 在升降機30P的連桿31下降的同時以保持在連桿3ι上的 狀態而下降’則處理室3内變成與搬送室4相同的環境。 於處理室3内配置有高頻電極16。於高頻電極16上連接 有南賴電源4卜而且,處理室3上連接有用以使處理室3 内變成真空的包括閥與真空制真空裝置17及導入原料 氣體的氣體導入管18。 於承載室2时容錢置於Lc下部密著帛板6上的 加熱器(heater)饥、及載置於該加_ 42L上的托盤 43L。於托盤机上搭載有多個工件w。加熱器饥的電 源配線44L插人於1根連桿31内部而連接於未圖示的裝 置外部的電源。電源配線44L亦可捲繞於連桿31的周圍。 如11所示’托盤43L形成為較開口部1L小一圈的尺寸。 於處理室3内收容有載置於PC密著用板7上的加熱 器42P、及載置於該加熱器42p上的托盤43p。於托盤们p 上搭載有多個工件w。加熱器43P的電源配線44p插入於 1根連桿31内部而連接於未圖示的裝置外部的電源。電源 配線44P亦可捲繞於連桿31的周圍。如圖1所示,托盤 43P形成為較開口部1L小一圈的尺寸。 於搬送室4内,在上段侧與下段側此兩段處安裝有搬 送機構。如圖3所示,上段側的搬送機構包括一對之本體 框架1左侧的搬送機構50UL與右側的搬送機構5〇UR。下 段側的搬送機構包括一對之本體框架丨左側的搬送機構 50LL與右側的搬送機構50Lr。各搬送機構5〇UL、5〇UR、 201131009 jHzoypn 50LL、50LR是由相同的構 搬送機構50而說明。 成,因此以下作為 搬,機構5G包括馬達5卜搬送體5 4是馬達Μ崎的搬送機構5Q的 圖 搬送體52包括核() 丨喊大千面圖 辞t杜恭罢加 ' ° a、及工件载置部52b, 該件載置σΡ 52b愈支牟邱士 μα 置的中♦ _ Γ 體化且自支架部52a 朝哀置的τ央側突出。馬達51是安 壁,馬遠51疋女裝於本體框架1的側 馬違的疑轉軸54經由設置於本體框上M +穿 孔而朝裝置内部突出。於1上的貝穿 出狀地設有卡止 =馬達51㈣軸54的前端,突 人的丨^= 52的支架部52&上配置有與支架部52a喷 55。於小齒輪55的軸芯上固定有中 疋轉軸56,且於該旋轉轴%上沿著軸方向而形成有 可將馬達51的卡止構件54禮人的槽56a。闕該馬達51 而使旋轉體54正轉或反轉,藉此可使卡止於卡止構件54a 的小齒輪55旋轉,從而使包含支架部52a的搬送體52於 導板53上自承載室2侧移動至處理室3側(B方向),或 者自處理室3側移動至承載室2側(c方向)。 搬送機構50UL或50UR的導板53的兩端側分別固定 於支樓構件57上。各支撐構件57連接於氣缸(cylinder) (搬送體間隔位移構件)58的連桿58a (參照圖3)上。 支樓構件57可滑動(slide)地安裝於固定在本體框架! 的前壁或後壁附近的導引體61 (參照圖3)上。搬送機構 50LL或50LR的導板53的兩端側分別固定於支撐構件59 11 201131009 ί 259連接於氣虹(搬送體間隔位移構件)58 加! 捕構件57可滑動地安裝糊定在本體框 木1的刖壁或後壁附近的導引體62 (參昭圖3)上 58的連桿58a自氣缸伸長’則支撐構件57及 支撐構件59受到導引體61或導引體62的導引,而朝裝置 箭頭A方向)位移。隨著支撐構件57的位移, A ttH53及導板53上的搬送體52及小齒輪55以相 同的位=朝裝置中央側位移。詳細内容於下文敍述,圖 表不驅動上制的顧機構而L及5qur 缸 =樓構件57、導板53、搬送體52以及小齒輪 的狀態。 的狀的連桿撕伸長(朝八方向移動) 的狀L下的圖4所示的搬送機構的主要部的狀態。即便於 =紅58的連桿58a伸長,且搬送體%及小齒輪&盘導板 中央側移動的情形時,亦可維持如下狀 二上1 構件54a嵌入於小齒輪55的旋轉軸56 2 便於圖5的狀態下,亦可藉由驅動 ,而使搬送體52於導板53上自承載室2側移動至 處理至3側(B方向)’或者自處理室3側 侧(C方向)。 f戟至z 接下來,根據圖6及圖7所示的流程圖,來說明實施 形態1所示的本發日⑽利用真空處理裝置的處理方法。 為明確地理解本發明的處理方法,而 的抗反射膜的情形為例,但此僅為-例,本4 = 12 201131009 ^ΗΖδνριι 空處理裝置的處理方法可適用於發明主旨所包含的所有# 理方法。另外,於圖6及圖7所示的流程圖中,LC表示= 載室,PC表示處理室。The top shot is kc, and the LC that can be opened and closed is placed in the opening 1L to carry out or move the workpiece (the object to be processed). Moreover, the sealing plate 6 is used. ^ The inner surface side of the opening is provided with a PC sealing plate 7 at the lower portion of the LC. . The inner side of the main body frame 1 is disposed on the inner side of the body frame (4). The lift is called AB dry motor (mot〇r) 2 guide member 26, lifting member 27 (secret coffee) 25, ί ^ 5 25 22 bead screw two forward or reverse 'by making the roll up and down to make lifting The member 27 is moved up and down along the t-lowering member 27 on the member 28 of the guiding member 26, and is fixed to the connecting frame from the main body frame and the first sealing plate 5, and is separated from the butt:1 in the sealing position shown in FIG. Displacement between open positions. The sealing member U' of the opening portion 1L is sealed from the outside by pressing the LC upper sealing plate 5 against the sealing member 11. The lowering machine 30L is provided with an elevator 30P on the side corresponding to the processing chamber 3. The elevator chaos and the brakes include a hydraulic cylinder (not shown) or a drive device such as a motor. The lift 3 children 201131009 and 3OP have 4 rods 31 respectively. The four links 31 of the elevator 30L are inserted through the main body frame 1 and protrude from the side of the carrying chamber 2 in the transfer chamber 4. Further, the four links 31 of the elevator 30P are inserted through the main body frame 1 and protrude from the processing chamber 3 side in the transfer chamber 4. Although not shown, in order to maintain the vacuum in the transfer chamber 4, the portions of the lifters 30L and 30P that penetrate the main body frame 1 are sealed. The four links 31 of the elevator 30L are reinforced by the connection of the reinforcing plates 32L. The four links 31 of the elevator 30P are reinforced by the reinforcing plates 32P. The transfer chamber 4 is connected to a vacuum device 19 including a valve and a vacuum pump for making the inside of the transfer chamber 4 vacuum. The transfer chamber 4 is formed longer in the length direction than the total length of the load chamber 2 and the process chamber 3, and is formed to be larger than the width of the load chamber 2 or the process chamber 3 in the width direction. Further, as shown in the following description, the height direction is formed to allow the link 31 to extend and contract. Therefore, the volume of the transfer chamber 4 is formed to be larger than the total volume of the volume of the load chamber 2 and the volume of the processing chamber 3. By raising the link 31 of the lifter 30L, the LC lower seal # plate 6 is pressed against the seal member 12 provided around the opening 1L of the main body frame 1, and the load chamber 2 is sealed from the transfer chamber 4. When the LC lower sealing plate 6 is lowered while the link 31 of the lifter 30L is lowered while being held by the link 31, the inside of the load cell 2 becomes the same environment as the transfer chamber 4. The carrying chamber 2 is connected to a vacuum device 14 and a vent system piping 15 including a valve and a vacuum pump for making the inside of the carrying chamber 2 vacuum. By raising the link 31 of the lifter 30P, the pc sealing plate 7 is pressed against the sealing member Η 201131009 JHZOVpn provided around the opening lp of the main body frame 1 and the processing chamber 3 is sealed from the transfer chamber 4. When the pc sealing plate 7 is lowered while the link 31 of the elevator 30P is lowered while being held by the link 3, the inside of the processing chamber 3 becomes the same environment as the transfer chamber 4. The high frequency electrode 16 is disposed in the processing chamber 3. A high-voltage electrode 16 is connected to the south power source 4, and the processing chamber 3 is connected to a gas introducing pipe 18 including a valve and a vacuum vacuuming device 17 and a raw material gas for vacuuming the inside of the processing chamber 3. At the time of carrying the chamber 2, a heater placed on the lower portion of the Lc is placed in a hung, and a tray 43L placed on the _42L is placed. A plurality of workpieces w are mounted on the tray machine. The power source wiring 44L of the heater is inserted into one of the links 31 and connected to a power source external to the device (not shown). The power supply wiring 44L may also be wound around the link 31. As shown in Fig. 11, the tray 43L is formed to have a size smaller than the opening portion 1L. A heater 42P placed on the PC adhesion board 7 and a tray 43p placed on the heater 42p are housed in the processing chamber 3. A plurality of workpieces w are mounted on the trays p. The power supply wiring 44p of the heater 43P is inserted into the inside of one link 31 and connected to a power supply outside the apparatus (not shown). The power supply wiring 44P can also be wound around the link 31. As shown in Fig. 1, the tray 43P is formed to have a size smaller than the opening portion 1L. In the transfer chamber 4, a transfer mechanism is attached to the two sections on the upper side and the lower side. As shown in Fig. 3, the transport mechanism on the upper side includes a pair of transport mechanisms 50UL on the left side of the main body frame 1 and a transport mechanism 5〇UR on the right side. The transport mechanism on the lower side includes a pair of transport mechanisms 50LL on the left side of the main body frame 与 and a transport mechanism 50Lr on the right side. Each of the transport mechanisms 5〇UL, 5〇UR, 201131009 jHzoypn 50LL, 50LR is described by the same configuration transport mechanism 50. In the following, the mechanism 5G includes the motor 5, and the transporting body 5 is the motor transport mechanism 5Q of the motor Miyazaki. The transport body 52 includes a core (), and the screaming of the singer In the workpiece mounting portion 52b, the σ Ρ 52b of the workpiece mounting portion b Ρ b b b b 且 且 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The motor 51 is an armor, and the horse's suspected shaft 54 protrudes toward the inside of the apparatus via a M + through hole provided in the main body frame. The front end of the shaft 1 is provided with a locking end = the front end of the shaft 51 of the motor 51 (four), and the bracket portion 52 & 52 of the protrusion = ^ = 52 is disposed to be sprayed with the bracket portion 52a. A center shaft 56 is fixed to the shaft core of the pinion gear 55, and a groove 56a for accommodating the locking member 54 of the motor 51 is formed along the shaft direction in the shaft %. The motor 51 rotates the rotating body 54 forward or reverse, whereby the pinion 55 that is locked to the locking member 54a can be rotated, so that the conveying body 52 including the bracket portion 52a is self-supporting on the guide plate 53. The 2 side moves to the processing chamber 3 side (B direction), or moves from the processing chamber 3 side to the carrying chamber 2 side (c direction). Both end sides of the guide plate 53 of the conveying mechanism 50UL or 50UR are fixed to the branch member 57, respectively. Each of the support members 57 is connected to a link 58a (see Fig. 3) of a cylinder (transport body spacing displacement member) 58. The branch member 57 is slidably mounted to the body frame! The guide body 61 (refer to FIG. 3) near the front wall or the rear wall. Both ends of the guide plate 53 of the transport mechanism 50LL or 50LR are respectively fixed to the support member 59 11 201131009 ί 259 connected to the gas rainbow (transport body spacer displacement member) 58 plus! The catching member 57 slidably mounts the link 58a of the guide body 62 (refer to FIG. 3) 58 attached to the side wall or the rear wall of the main body frame 1 from the cylinder. Then the support member 57 and the support member 59 It is guided by the guide body 61 or the guide body 62, and is displaced toward the direction of the arrow A of the device. With the displacement of the support member 57, the transport body 52 and the pinion 55 on the A ttH53 and the guide 53 are displaced at the same position = toward the center side of the apparatus. The details are described below, and the drawings do not drive the state of the upper mechanism and the state of the L and 5qur cylinders = floor member 57, the guide plate 53, the conveying body 52, and the pinion gear. The state of the main portion of the conveying mechanism shown in Fig. 4 in the shape L of the shape of the link tearing elongation (moving in the eight directions). In other words, when the link 58a of the red 58 is extended and the carrier % and the center of the pinion & disc guide are moved, the first member 54a can be held in the rotation shaft 56 2 of the pinion 55 as follows. In the state of FIG. 5, the conveyance body 52 can be moved from the side of the carrying case 2 to the processing to the 3 side (B direction) or the side of the processing chamber 3 (C direction) by the driving. . F戟 to z Next, a processing method using the vacuum processing apparatus in the present day (10) shown in the first embodiment will be described based on the flowcharts shown in Figs. 6 and 7 . In order to clearly understand the treatment method of the present invention, the case of the anti-reflection film is exemplified, but this is only an example, and this 4 = 12 201131009 ^ ΗΖ δνριι The processing method of the empty processing device can be applied to all the inclusions included in the inventive subject matter. Method. Further, in the flowcharts shown in Figs. 6 and 7, LC indicates = carrier chamber, and PC indicates processing chamber.
真空處理裝置所進行的處理開始時,首先,於步驟S1 中將真空處理裝置1設定為初始狀態、或者確認其已設定 為初始狀態。該情形時初始狀態設為如下所示。搬送機構 50的上段側的搬送機構50UL及50UR、下段側的搬送機 構50LL及50LR此4個搬送機構所有的搬送體52,均位 於本體框架1的側壁侧、即,位於拉回位置處。升降機3〇l 及升降機30R的連桿31上升至最上部位置處,且lc下部 密封用板6對承載室2進行密封,PC密封用板7對處理室 3進行密封。如圖2所示,下段側的搬送機構5〇Ll及50LR 的搬送體(以下稱作「下段侧搬送體」)52位於LC側,上 段側的搬送機構50UL及50UR的搬送體(以下稱作「上 段側搬送體」)52位於PC側。 而且,於上述狀態下,在LC下部密封用板6上載置 有加熱器42L及托盤43L,且於PC密封用板7上載置有 加熱器42P及托盤43P。 在_認上述初始狀態之後,驅動真空裝置丨9而使搬 送室4變成真空。若使搬送室4變成真空,則如圖8所示, 打開LC上部密封用板5並將工件w裝载至承載室2 (步 驟S2)。要打開LC上部密封用板5,則驅動該馬達21, 經由女裝於该馬達21的旋轉軸的傘齒輪22、及安裝於滚 珠螺桿25的前端的傘齒輪23,而使滾珠螺桿25旋轉。隨 13 201131009 著滚珠螺桿25的旋轉,升降構件27受到導引構件%的導 引而士升,固定於連接構件28上的LC上部密封用板5上 升。藉由將連接構件28相對於升降構件27可轉 著,t可使^上部㈣耻5自圖8所_^=; .虽於處理至3中形成太陽電池的抗反射膜時,將主表 面側形成㈣由光騎Μ生電練(de伽喊…f_ ) 的㈣接面部的包括單晶石夕基板、非晶石夕基板或多晶石夕基板 等的多個太陽電池基板作為工件w而收容於承載室2内。 當太陽電池基板較薄時,為防止基板的斷裂,而使用非接 觸式的柏努利(B_祕)吸_構,將各太陽電池基板 載置於托盤视上。若騎w的裝載完成,職馬達21 反轉,並利用LC上部密封用板5對承載室2進行密封。 另外,圖8是於處理室3中收容的托盤43p上已配置 者工件W的圖,但此時於處理室3中收容的㈣43p上並 未配置該工件W。 接下來,驅動真空裝置14及真空裂置17,而使承載 室2及處理室3變成真空(步驟S3)。 接下來’驅動該升降機3GL,而使下部側的搬送體52 的工件載置部52b位於托盤43L與Lc下部密_板6的 中間(以下將該位置作為「下段保持位置」)。此外,驅動 該升降機30Ρ,而使上部側的搬送體52的工件載置部5此 位於托盤43P與PC下部密封用板7的中間(以下將該位 置作為「上段保持位置」)(步驟S4)。 接下來,驅動上段側的搬送機構5呱及5隱的氣 201131009 tr長、:ΐί:旱58a朝裝置的中央側伸長(步驟s5)。藉 工## a而使上段側的搬送機構50UL及50UR的 ^t^i!52b的前端,如圖9所示到達與托盤43p的側 30P 位置處。右成域狀態,則接下來驅動升降機 30Ρ而使連桿31朝下方收縮。 藉由雜作,將域43ρ魅於上段_搬送機構When the processing by the vacuum processing apparatus is started, first, in step S1, the vacuum processing apparatus 1 is set to the initial state, or it is confirmed that it has been set to the initial state. In this case, the initial state is set as follows. The transport mechanisms 50UL and 50UR on the upper side of the transport mechanism 50 and the transport mechanisms 52 of the four transport mechanisms of the lower transport mechanisms 50LL and 50LR are located on the side wall side of the main body frame 1, that is, at the pullback position. The link 31 of the elevator 3〇 and the lifter 30R is raised to the uppermost position, and the lc lower sealing plate 6 seals the load chamber 2, and the PC sealing plate 7 seals the processing chamber 3. As shown in Fig. 2, the conveyance mechanism (hereinafter referred to as "lower side conveyance body") 52 of the conveyance mechanism 5〇L1 and 50LR on the lower stage side is located on the LC side, and the conveyance mechanism of the conveyance mechanism 50UL and 50UR of the upper stage side (hereinafter referred to as The "upper side transfer body" 52 is located on the PC side. In the above-described state, the heater 42L and the tray 43L are placed on the LC lower sealing plate 6, and the heater 42P and the tray 43P are placed on the PC sealing plate 7. After recognizing the above initial state, the vacuum device 驱动 9 is driven to make the transfer chamber 4 a vacuum. When the transfer chamber 4 is brought into a vacuum, as shown in Fig. 8, the LC upper sealing plate 5 is opened and the workpiece w is loaded into the carrier chamber 2 (step S2). When the LC upper sealing plate 5 is opened, the motor 21 is driven, and the ball screw 25 is rotated by the bevel gear 22 which is attached to the rotating shaft of the motor 21 and the bevel gear 23 attached to the tip end of the ball screw 25. With the rotation of the ball screw 25 in accordance with 13 201131009, the elevating member 27 is guided by the guide member %, and the LC upper sealing plate 5 fixed to the connecting member 28 is lifted up. By rotating the connecting member 28 relative to the lifting member 27, t can make the upper portion (four) shame 5 from Fig. 8; although the anti-reflection film of the solar cell is formed in the process of 3, the main surface is Side forming (4) A plurality of solar cell substrates including a single crystal slab substrate, an amorphous slab substrate, or a polycrystalline slab substrate are used as workpieces by (4) the face of the electric riding (de screaming...f_) It is housed in the carrying room 2. When the solar cell substrate is thin, in order to prevent the substrate from being broken, a non-contact Bernoulli (B_sec) suction structure is used, and each solar cell substrate is placed on the tray. When the loading of the ride w is completed, the service motor 21 is reversed, and the load chamber 2 is sealed by the LC upper sealing plate 5. In addition, Fig. 8 is a view showing the workpiece W placed on the tray 43p accommodated in the processing chamber 3. However, the workpiece W is not disposed on the (four) 43p accommodated in the processing chamber 3. Next, the vacuum device 14 and the vacuum crack 17 are driven to bring the load chamber 2 and the process chamber 3 into a vacuum (step S3). Then, the lifter 3GL is driven, and the workpiece mounting portion 52b of the lower transfer body 52 is positioned between the tray 43L and the Lc lower-side plate 6 (hereinafter, this position is referred to as "lower holding position"). In addition, the workpiece mounting portion 5 of the upper transfer member 52 is placed between the tray 43P and the PC lower sealing plate 7 (hereinafter, this position is referred to as "upper holding position") (step S4). . Next, the conveyance mechanism 5呱 and the 5 hidden gas of the upper stage side are driven to 201131009 tr long, and the 58ί: drought 58a is extended toward the center side of the apparatus (step s5). The front end of the transfer mechanism 50UL and 50UR of the upper stage side is at the position of the side 30P of the tray 43p as shown in Fig. 9 by borrowing ## a. In the right domain state, the elevator 30 is next driven to contract the link 31 downward. By the miscellaneous work, the domain 43p charms the upper segment_transport mechanism
力勒。及5〇UR的托盤載置部52b上,且PC密封用板7及 口=器42P由升降機3〇p的連桿31保持著。圖ι〇表示該 2。自_ 10的狀態起,進一步驅動該升降機寶而使 連桿31收縮至最下段的位置為止(步驟%)。於該升降機 30P的連桿31收縮至最下段位置的狀態下,連桿的前 端處於較下段側的搬送機構5GLL及5GLR的讀載置部 52b更低的位置。 接下來,驅動下段側的搬送機構5〇LL及5〇LR的氣 虹58,而使連桿58a朝裝置的中央側伸長(步驟S7)。藉 由伸長連桿58a而使上段側的搬送機構5〇UL及5〇UR的 工件載置部52b的如端到達與托盤43L·的側端部重疊的位 置處。若成為該狀態,則接下來驅動升降機3〇L,而使連 桿31收縮至最下段位置為止(步驟%)。藉由該動作,如 圖11所示,將托盤43L載置於下段側的搬送機構50LL·及 5^)LR的托盤載置部52b上,且LC下部密封用板6及加熱 器42L由升降機30L的連桿31保持著。於升降機3〇L的 連桿31收縮至最下段位置的狀態下,連桿31的前端處於 較下段侧的搬送機構50LL及50LR的工件載置部52b更低 15 201131009 OHzoypu 的位置。 於圖11所示的狀態下,即,於步驟S8已完成的狀態 下,對承載室2進行密封的LC下部密封用板6及加熱器 42L是由升降機30L的連桿31來保持。而且,將收容於承 載室2内的托盤43L與配置於托盤43L上的工件W,搭載 至下段側搬送機構50LL及50LR的工件載置部52b。 並且,對處理室3進行密封的pc密封用板7及加熱 器42P是由升降機30P的連桿31來保持。而且,將收容 於處理室3内的托盤43P與配置於托盤43P上的工件W, 搭載至上段侧搬送機構50UL及50UR的工件載置部52b。 接下來,驅動下段側的搬送機構5〇LL及5〇LR的各 馬達51 ’而使下段側的搬送體52朝圖2的b方向移動, 若托M 43L及配置於托盤43L上的工件w已到達與處理 至3相對應的位置,則停止各馬達51。而且,驅動上段側 的搬送機構50UL及50UR的各馬達51,使上段側的搬送 體52朝圖2的C方向移動’若托盤43ρ及配置於托盤43ρ 上的工件W已到達與承載室2相對應的位置,則停止各馬 達51 (步驟S9)。圖12表示步驟S9已完成的狀態。 接下來,使升降機30P上升至下段保持位置。藉由該 動作,將下段侧的搬送體52所搭載的托盤43L及工件w 轉載至PC岔封用板7上搭載的加熱器42p上(步驟sl〇)。 接下來,驅動下段側的搬送機構5〇LL及5〇LR的各馬達 51丄使下段側的工件载置部52b後退,從而使搬送體^ 的前端朝本體框架1的側壁側移動至不與托盤仉的前端 16 201131009 部重疊的位置為止(牛 U的狀態下,Μ 43Ϊ·Λ圖13表示該狀態。於圖 儿可通過下段侧搬送體之間。 置(步驟t使升降機3〇L上升而置於上段保持位 韵的扛船/ 稭由5亥動作,使上段側的搬送體52所搭 載的托盤43P及工株w絲此 1伶 牛轉载至…下部密封用板6上搭載Liler. And the pallet mounting portion 52b of the 5〇UR, and the PC sealing plate 7 and the porter 42P are held by the link 31 of the elevator 3〇p. Figure ι〇 indicates the 2 . From the state of _10, the elevator is further driven to contract the link 31 to the lowest position (step %). In a state where the link 31 of the lifter 30P is contracted to the lowermost position, the front end of the link is lower than the reading and placing portion 52b of the transport mechanism 5GLL and 5GLR on the lower stage side. Next, the conveyance mechanisms 5〇LL and 5气LR of the lower stage side are driven, and the link 58a is extended toward the center side of the apparatus (step S7). By the extension link 58a, the end of the workpiece mounting portion 52b of the upper-stage conveying mechanisms 5〇UL and 5〇UR reaches a position overlapping the side end portion of the tray 43L·. When this state is reached, the elevator 3〇L is next driven, and the link 31 is contracted to the lowest position (step %). By this operation, as shown in FIG. 11, the tray 43L is placed on the tray mounting portion 52b of the conveying mechanisms 50LL and 5^) LR on the lower stage side, and the LC lower sealing plate 6 and the heater 42L are lifted. The 30L link 31 is held. In a state where the link 31 of the elevator 3〇L is contracted to the lowermost position, the front end of the link 31 is located lower than the workpiece mounting portion 52b of the conveyance mechanisms 50LL and 50LR on the lower stage side by 15 201131009 OHzoypu. In the state shown in Fig. 11, that is, in the state where the step S8 is completed, the LC lower sealing plate 6 and the heater 42L which seal the load chamber 2 are held by the link 31 of the lifter 30L. Then, the tray 43L accommodated in the loading chamber 2 and the workpiece W placed on the tray 43L are mounted on the workpiece mounting portion 52b of the lower-stage conveying mechanisms 50LL and 50LR. Further, the pc sealing plate 7 and the heater 42P that seal the processing chamber 3 are held by the link 31 of the elevator 30P. Then, the tray 43P accommodated in the processing chamber 3 and the workpiece W placed on the tray 43P are mounted on the workpiece mounting portion 52b of the upper-stage conveying mechanisms 50UL and 50UR. Then, the motor 51' of the transport mechanisms 5〇LL and 5〇LR of the lower stage side is driven, and the transport body 52 of the lower stage side is moved in the b direction of FIG. 2, and the M 43L and the workpiece w placed on the tray 43L are supported. When the position corresponding to the processing to 3 has been reached, the motors 51 are stopped. Further, each of the motors 51 of the transport mechanisms 50UL and 50UR on the upper side is driven to move the transport body 52 on the upper side in the direction C of FIG. 2. If the tray 43p and the workpiece W disposed on the tray 43p have reached the load chamber 2 At the corresponding position, each of the motors 51 is stopped (step S9). Fig. 12 shows the state in which the step S9 has been completed. Next, the elevator 30P is raised to the lower holding position. By this operation, the tray 43L and the workpiece w mounted on the lower conveyance body 52 are transferred to the heater 42p mounted on the PC/sealing panel 7 (step sl). Then, the motor 51 of the lower conveying mechanism 5〇LL and 5〇LR is driven to retract the lower workpiece loading unit 52b, and the front end of the conveying body is moved toward the side wall side of the main body frame 1 to The front end of the tray 16 16 201131009 The position where the part is overlapped (in the state of the cow U, Μ 43Ϊ·Λ Figure 13 shows this state. The figure can be passed between the lower side conveyors. (Step t raises the lift 3〇L In the upper part, the barge/stalk which is placed in the upper part is moved by the 5th sea, and the tray 43P and the worker's w wire which are carried on the upper side of the transport body 52 are reloaded to the lower sealing plate 6
R °7^ 上。接下來,驅動上段侧的搬送機構50UL w &的各馬達51 ’使上段側的工件載置部52b後退,R °7^ on. Then, each of the motors 51' of the transport mechanism 50UL w & on the upper side is driven to retract the workpiece mounting portion 52b on the upper stage side.
攸而使搬送體52的前端朝本體框架1的侧壁侧移動至不與 托盤4=的則端部重疊的位置為止(步驟si3)。圖μ表 不該狀,%。於圖14所示的狀態下,上段側及下段側的工件 載置。P 52b的刖端均位於較LC下部密封用板6及pc密封 用板7的側端部更靠本體框架1的側壁侧。 =接下來,驅動升降機3〇L及3〇p,使各連桿31伸長 至最上部為止(步驟S14)。藉由該動作,將pc密封用板 7擠壓於處理室3周圍的密封構件13,自搬送室4對處理 室3進行密封。而且,將加熱器42p、托盤43L以及工件 W收容於處理室3内。 同時’將LC下部密封用板6抵壓於承載室2周圍的 密封構件12,且自搬送室4對承載室2進行密封。而且, 將加熱器42L及托盤43P收容於承載室2内。圖15表示 該狀態。若對比圖15與圖2,則圖2中收容於承載室2内 的托盤43L及工件w在圖15中是收容於處理室3内。而 且’圖2中收容於處理室3的托盤43P在圖15中是收容 於承載室2内。 201131009 厶 O^pu· 於步驟S15中,判斷此次於處理室3中進行 θ 否為最初的處理。當為最初的處理時,於承載室2处理疋 容工件w,因此無需步驟S16的卸載。因此二步H二 的處理室3内進行工件W的處理。若並非最初的^理Then, the distal end of the transport body 52 is moved toward the side wall side of the main body frame 1 to a position where it does not overlap the end portion of the tray 4 = (step si3). Figure μ table does not have the shape, %. In the state shown in Fig. 14, the workpieces on the upper side and the lower side are placed. The ends of the P 52b are located closer to the side wall side of the main body frame 1 than the side end portions of the LC lower sealing plate 6 and the pc sealing plate 7. = Next, the elevators 3〇L and 3〇p are driven to extend the respective links 31 to the uppermost portion (step S14). By this operation, the pc sealing plate 7 is pressed against the sealing member 13 around the processing chamber 3, and the processing chamber 3 is sealed from the transfer chamber 4. Further, the heater 42p, the tray 43L, and the workpiece W are housed in the processing chamber 3. At the same time, the LC lower sealing plate 6 is pressed against the sealing member 12 around the carrying chamber 2, and the carrying chamber 2 is sealed from the transfer chamber 4. Further, the heater 42L and the tray 43P are housed in the carrying case 2. Fig. 15 shows this state. Referring to Fig. 15 and Fig. 2, the tray 43L and the workpiece w housed in the carrying case 2 in Fig. 2 are housed in the processing chamber 3 in Fig. 15 . Further, the tray 43P accommodated in the processing chamber 3 in Fig. 2 is housed in the carrying chamber 2 in Fig. 15 . 201131009 厶 O^pu· In step S15, it is determined whether or not θ is the first process in the processing chamber 3 this time. When the initial processing is performed, the handling workpiece w is processed in the carrying chamber 2, so that the unloading of step S16 is not required. Therefore, the processing of the workpiece W is performed in the processing chamber 3 of the second step H2. If it is not the original
如以下的處理流程明確所示般,於承載室2内卸 ,J 室3内已處理的工件w,同時於處理室3内處理工j牛^里 當於處理室3内形成太陽電池的抗反射膜時, ° 下的處理。藉由真空裝置17而使處理室3内變成真/ = 自氣體導入管18向處理室3 Μ導入&氣體、〇2氣^細 等的掣程氣體(process gas)。藉由加熱器42p而將作1 3 陽電池基板的工件W加熱至28(TC以上,自氣體導入管18 導入SiH4氣體,並藉由高頻電源41來對高頻電極π =加 射頻(Radio Frequency’RF)電壓從而產生電聚。當:^ 43L是由碳形成時,托盤43L成為對向電極。藉由上 程而於各I件W駐表面形成氮切膜。氮切膜含 % ’諒H2與矽基板的主表面的懸鍵(dangUng b〇nd )鍵社, 因此具有減小缺陷密度、延長發光壽命的效果。 、、、σ 若於處理室3内完成對工件W的處理,則於步驟S18 =判斷此:欠衫為最後的纽。若並非最後的處理,則進As shown in the following processing flow, the workpiece w that has been processed in the J chamber 3 is unloaded in the carrying chamber 2, and the solar cell is formed in the processing chamber 3 in the processing chamber 3 at the same time. When the film is reflected, the treatment under °. The inside of the processing chamber 3 is turned into true/by the vacuum device 17 to introduce a process gas such as a gas or a gas into the processing chamber 3 from the gas introduction pipe 18. The workpiece W as the 13-cell battery substrate is heated to 28 (TC or more by the heater 42p, and the SiH4 gas is introduced from the gas introduction pipe 18, and the high-frequency electrode π = RF is applied by the high-frequency power source 41 (Radio The voltage 'RF' voltage is generated to generate electropolymerization. When 43 L is formed of carbon, the tray 43L serves as a counter electrode. A nitrogen cut film is formed on the surface of each of the W pieces by the upper path. The nitrogen cut film contains % 'forgiveness H2 and the dangUng b〇nd bond of the main surface of the ruthenium substrate have the effect of reducing the defect density and prolonging the luminescence lifetime. 、, σ If the processing of the workpiece W is completed in the processing chamber 3, In step S18, it is judged that: the shirt is the last button. If it is not the last process, then
订步驟S19的處理。若為最後的處理,則進行步驟幻 處理。 J 於步驟S19中,如圖2所示,驅動升降機構2〇,打開 LC上部畨封用板5,於承載室2内的托盤43P上配置下一 工件w。若將工件w收容於承載室2内,則關閉上; 201131009 JHZoypu 费封用板5,並藉由直办 當進行步驟S19時,Γ/驟ς = 内變成真空。 的處理同時進行。〃步驟817的處理室17中的工件〜 15所以:步驟S2〇〜步驟S3〇的處理。此處,若將圖 送體二二t圖2所示的狀態進行對比,則下段侧的搬 是位於承載室2側,而於圖15中是位於 理〜^ ’而且,上段側的搬送體52於圖2中是位於處 SI二而於圖15中是位於承載室2側。因此,除了將 ^於承载室2側的托盤w及排列於托盤仰上的 ^置:上段側的搬送體52上,將收容讀理室3側的 搬m及排列於托盤饥上的工件W載置於下段側的 达體52上這一點以外,步驟S20〜S30的處理與步驟S4 〜S14相同。 傷 驅動升降機3GP、3GL、及搬送機構5G,將托盤及工 件轉載至上段側及下段侧的搬送體52並加以搬送的方 法,均於步驟S20〜S30中進行了說明,所以應該可以充 分地理解圖6的處理絲。因此,省略此處的再次說明。 若步驟S30完成,則成為圖2所示的狀態。即’最初收容 於承載室2内的工件W在處理室3中進行處理,變成以: 列於托盤43L上的狀態而返回到承載室2内的狀態。而 且,以最初配置於處理室3内的托盤43p上排列有^件 的狀態而返回到處理室3内。 於步驟S31中,卸載返回到承載室2内的工件w。 且,於處理室3中對工件W進行處理。接下來,判斷於: 19 201131009 理室/3中進行的處理是否為最後的處理(步驟如)。當並 非最後的處理而是進行連續處理時,返回到步驟中,The processing of step S19 is set. If it is the last processing, the step magic processing is performed. In step S19, as shown in Fig. 2, the elevating mechanism 2 is driven to open the LC upper crucible sealing plate 5, and the next workpiece w is placed on the tray 43P in the carrying chamber 2. When the workpiece w is housed in the carrying chamber 2, the upper portion is closed; 201131009 JHZoypu is sealed with the plate 5, and when the step S19 is performed, the Γ/ς ς = becomes a vacuum. The processing is carried out simultaneously.工件The workpieces in the processing chamber 17 of step 817 are so 15: the processing of steps S2 to S3. Here, when the state shown in FIG. 2 is compared with the state shown in FIG. 2, the moving of the lower stage side is located on the side of the carrying room 2, and in FIG. 15, the moving body of the upper side is located. 52 is located at SI 2 in FIG. 2 and on the side of the carrying room 2 in FIG. Therefore, in addition to the tray w on the side of the load-bearing chamber 2 and the transport body 52 arranged on the upper side of the tray, the loading body on the side of the reading chamber 3 and the workpiece W arranged on the tray are hung. The processing of steps S20 to S30 is the same as steps S4 to S14 except that the upper body 52 is placed on the lower side. The method of transferring the tray and the workpiece to the transport body 52 on the upper side and the lower side and transporting the transported lifts 3GP, 3GL, and the transport mechanism 5G are described in steps S20 to S30, and therefore should be fully understood. Figure 6 is a treated wire. Therefore, the re-explanation here is omitted. When the step S30 is completed, the state shown in Fig. 2 is obtained. In other words, the workpiece W that has been initially accommodated in the carrying chamber 2 is processed in the processing chamber 3, and is returned to the inside of the carrying chamber 2 in a state of being listed on the tray 43L. Further, the tray 43p initially placed in the processing chamber 3 is placed in a state of being placed in the processing chamber 3 in a state of being arranged. In step S31, the workpiece w returned to the carrying chamber 2 is unloaded. Further, the workpiece W is processed in the processing chamber 3. Next, it is judged whether: 19 201131009 The processing performed in the room / 3 is the last processing (steps such as). When it is not the last processing but continuous processing, return to the step,
重複將工件W收容於承載室2内並於處理室3中對工件W 進行處理的過程。當為最後的處理時,進行步驟泌的處 理。 當於步驟S18中判斷為最後的處理時,進行步驟s33 以下的處理。步驟S33〜步驟S43的過程與步驟^〇〜s3〇 的過程相同,故省略說明。步驟S2q〜S3g的過程用以使 處理室3中已處理的讀W返_承載室2而結束處理。 因此’在步驟S43之後,卸載返回到承載室2内的工件w (步驟S44)並結束所有處理。 當於步驟S32中為最後的處理時,進行步驟s45以下 的處琿。步驟S45〜S54〜S43的處理與步驟S4〜步驟 的處理相同,故省略說明。步驟S45〜S54〜S43的過程用 以使處理室3巾已處理的工件w返回到承载室2並結束處 理。因此,在步驟S43之後,卸載返回到承载室2内的工 件W,(步驟S44)並結束所有處理。 於上述處理流程中,當在步驟S18中判斷為最後的處 理並經過步驟S33〜S44的處理而結束時,處理次數為奇 數。當處理次數為奇數時,如圖2所示,是以下段_搬 送體52位於承載室2側,上段侧的搬送體52位於處理室 3側的狀態而結束。相對於此,當於步驟幻2中判斷為最 後的處理並經過步驟S45〜S54〜S43〜S44而結束時,處 理次數為偶數。 201131009 當處理次數為偶數時,如圖15所示,是以下段側的 搬送體52位於處理室3側,上段側的搬送體52位於承載 室2側的狀態而結束。該狀態與初始狀態不同。因此,必 須在結束所有處理之前,移動上段側及下段側的搬送體52 而使其成為初始狀態,或者於下次開始時進行用以使其成 為初始狀態的處理。 另外’於圖6及圖7所示的處理流程中,亦可於升降 ^ 機30L及3〇P上升至最上段的步驟S14的狀態下,驅動處 於後退位置的搬送機構50,使下段侧的搬送體52返回到 承載室2側且使上段側的搬送體52返回到處理室3側。換 言之’搬送工件W時,下段側的搬送體52始終將工件W 自承載室2側搬送至處理室3側,上段側的搬送體52始終 將工件W自處理室3側搬送至承載室2側。當然,亦可與 此相反,下段侧的搬送體52始終將工件w自處理室3側 搬送至承載室2側,上段側的搬送體52始終將工件w自 承載室2側搬送至處理室3側。由此,當搬送體&的搬送 籲鱗為相同方向時’無論處理次數是奇㈣是偶數,均不 會以搬送體52的位置與初始狀態不同的狀態而結束。 如上所述,實施形態1所示的本發明的真空°處理裝置 1〇〇’在包含工件w的托盤43L的搬送時序中,搬送包八 工件W的托盤43P。即,同時搬送工件w。因此,盥二 $真空室搬出工件之後,開始向該真空室内搬人工相: 刖的真空處理裝置相比,可大幅度地縮短搬送時間。 此外,本發明的真空處理裝置1〇〇包括搬送0室彳,該 21 201131009 搬送室4具有較承載室2的容積與處理室3的容積的合計 容積更大的容積。因此,當打開自搬送室4而對承載室2 或處理室3進行密封的LC下部密封用板6或?(:板密封板 7,而與搬送室4連通時,可以使整體大致成為與搬送室4 相同的真空度。^4表示右使搬送室4具有充分的真空度, 則即使當承載至2或處理室3内未達到充分的真空度時, 亦可俵真空度接近於搬送室4的真空度,從而使承載室2 或處理室3的真空處理時間縮短。 转合上述理由,與先前的裝置相比,本發明的真空處 理裝覃100的處理時間大幅度縮短。 作為一例,當真空處理裝置1〇〇為200cm(長度)x21〇 cm (寬度)χ50 cm (高度)的大致長方體時,在先前的真 空處理裝置中1次處理整體需要4分鐘左右的時間。相對 於此,於實施形態1的真空處理裝置中可為i分鐘至i 5 分鐘左右。其中’於圖6的處理流程中,步驟S9的工件 更換所需的時間極短,為3秒左右。 另外’於上述實施形態1中’可形成為升降機3〇L及 3〇P收容於搬送室4内的結構。此外,亦可形成為不設置 連接於承載室2的真空裝置14或連接於處理室3的真*带 置17中的一者或兩者的結構,而使連接於搬送室*的真★ 裝置19兼具其等的功能。 二 (實施形態2) 圖16表示本發明的真空處理裝置的實施形態2的剖 面圖。實施形態2的真空處理裝置101與實施形^ i的^ 22 201131009 空處理裝置100的不同點在於與搬送機構70相關的方面。 圖17是表示搬送機構70的主要部放大平面圖。搬送 機構70包括多個輥(r〇iler) 71及可轉動地支撐該些輥71 的支撐構件72。各輥71於旋轉軸的前端固定有傘齒輪73。 於各傘齒輪73上,在旋轉軸體77上固定有與該傘齒輪73 嚙合的傘齒輪74。傘齒輪75與多個傘齒輪74中的一個嚙 合〇 傘齒輪75具有中空的旋轉轴76,且於中空的旋轉軸 76上形成有沿著軸方向的槽76a。於槽76a内嵌合有實施 形態1中說明的馬達51的旋轉軸54的前端所設置的卡止 構件54a。於該結構中,若驅動馬達51而使旋轉轴54旋 轉,則與旋轉軸76 —體的傘齒輪75因卡止構件54a而旋 轉。傘齒輪75的旋轉經由傘齒輪74-旋轉軸體77-傘齒輪 73而傳達至各輥(71。藉由使馬達51的旋轉軸54正轉及反 轉,各輥71於圖Π中朝順時針方向及逆時針方向旋轉。 與搬送機構50同樣地,搬送機構7〇於本體框架j上 安裝有4個:上段側的左側的7〇UL、右側的7〇UR、下段 侧的左側70LL、及右側的7〇LRo如圖19所示,若驅動氣 缸58而使搬送機構7〇前進,則輥71到達與托盤43l或 43P的前端部重疊的位置。使升降機3〇L或3〇p下降,將 ^盤43L或43P與工件w 一併轉載於輥71上,使馬達51 旋轉,便可搬送托盤43L或43P。 當搬送機構70前進時,如圖18所示,馬達51的旋 轉軸76上所設置的卡止構件54a,嵌合於傘齒輪%的旋 23 201131009 -—r — 轉軸76的槽76a内,因此可將旋轉傳達至各輥71。 實施形態2所示的利用真空處理裝置的處理方法可與 圖6及圖7所示的處理流程同樣地進行。其中,親71可遍 及真空處理裝置101的長度方向的大致全長而排列,若如 此,則即便將托盤43L或43P載置於輥71上的任意位置 亦可進行搬送。因此,無需如實施形態丨的搬送機構% 的情形般’留意是初始位置還是結束位置。The process of accommodating the workpiece W in the carrying chamber 2 and processing the workpiece W in the processing chamber 3 is repeated. When it is the final treatment, the processing of the step is performed. When it is determined in the step S18 that the last processing is performed, the processing in the step s33 or lower is performed. The process of steps S33 to S43 is the same as the process of steps 〇 to s3, and the description thereof is omitted. The process of steps S2q to S3g is for ending the processing by returning the processed read W in the processing chamber 3 to the carrier chamber 2. Therefore, after the step S43, the workpiece w returned to the inside of the carrying room 2 is unloaded (step S44) and all the processing is ended. When it is the last processing in step S32, the processing below step s45 is performed. The processing of steps S45 to S54 to S43 is the same as the processing of steps S4 to S43, and thus the description thereof is omitted. The processes of steps S45 to S54 to S43 are for returning the workpiece w to which the processing chamber 3 has been processed to the carrying chamber 2 and ending the processing. Therefore, after the step S43, the workpiece W returned to the inside of the carrying room 2 is unloaded (step S44) and all the processing is ended. In the above-described processing flow, when it is judged as the last processing in step S18 and the processing of steps S33 to S44 is ended, the number of processing is odd. When the number of times of processing is an odd number, as shown in Fig. 2, the following section_the transport body 52 is located on the side of the load-bearing chamber 2, and the transport body 52 on the upper-stage side is in the state of the processing chamber 3, and is completed. On the other hand, when it is determined in step S2 that the last processing has ended with steps S45 to S54 to S43 to S44, the number of processing is an even number. When the number of times of processing is an even number, as shown in Fig. 15, the conveying body 52 on the lower side is located on the side of the processing chamber 3, and the conveying body 52 on the upper side is in the state of the side of the carrying chamber 2, and is completed. This state is different from the initial state. Therefore, it is necessary to move the transport body 52 on the upper side and the lower side to the initial state before the completion of all the processes, or to perform the process for bringing it into the initial state at the next start. In addition, in the process flow shown in FIG. 6 and FIG. 7, the transport mechanism 50 in the retracted position can be driven in the state where the lifters 30L and 3〇P are raised to the uppermost step S14, and the lower side can be driven. The conveyance body 52 returns to the side of the carrying case 2, and the conveyance body 52 of the upper stage side is returned to the processing chamber 3 side. In other words, when the workpiece W is transported, the transport body 52 on the lower stage always transports the workpiece W from the side of the load chamber 2 to the side of the processing chamber 3, and the transport body 52 on the upper side always transports the workpiece W from the side of the processing chamber 3 to the side of the load chamber 2 . On the other hand, the conveyance body 52 on the lower stage side always conveys the workpiece w from the processing chamber 3 side to the carrier chamber 2 side, and the upper conveyance body 52 always conveys the workpiece w from the carrier chamber 2 side to the processing chamber 3 side. Therefore, when the transporting scales of the transporting bodies & are in the same direction, the processing is terminated in a state different from the initial state, regardless of whether the number of processing times is odd (four) or even. As described above, the vacuum processing apparatus 1A of the present invention shown in the first embodiment conveys the tray 43P of the workpiece W in the conveyance timing of the tray 43L including the workpiece w. That is, the workpiece w is conveyed at the same time. Therefore, after the vacuum chamber is moved out of the workpiece, the manual phase is started to be moved into the vacuum chamber: the transfer time can be greatly shortened compared to the vacuum processing device of the crucible. Further, the vacuum processing apparatus 1 of the present invention includes a transport chamber 0, which has a volume larger than the total volume of the volume of the load chamber 2 and the volume of the processing chamber 3. Therefore, when the LC lower sealing plate 6 that seals the load chamber 2 or the processing chamber 3 from the transfer chamber 4 is opened, or? (When the plate sealing plate 7 is connected to the transfer chamber 4, the entire vacuum can be made substantially the same as the transfer chamber 4. ^4 indicates that the transfer chamber 4 has a sufficient degree of vacuum, even when carried to 2 or When a sufficient degree of vacuum is not reached in the processing chamber 3, the degree of vacuum may be close to the degree of vacuum of the transfer chamber 4, thereby shortening the vacuum processing time of the load chamber 2 or the processing chamber 3. Turning to the above reasons, with the previous device In contrast, the processing time of the vacuum processing device 100 of the present invention is greatly shortened. As an example, when the vacuum processing apparatus 1 is a substantially rectangular parallelepiped of 200 cm (length) x 21 〇 cm (width) χ 50 cm (height), In the vacuum processing apparatus of the prior art, it takes about 4 minutes to complete the entire processing. In contrast, in the vacuum processing apparatus of the first embodiment, it may be about 1 minute to about 5 minutes, wherein 'in the processing flow of FIG. 6, The time required for the workpiece replacement in the step S9 is extremely short, and is about 3 seconds. Further, in the above-described first embodiment, the elevators 3〇L and 3〇P may be housed in the transfer chamber 4. Formed as not set The vacuum device 14 connected to the carrying case 2 or the one or both of the true/belt 17 connected to the processing chamber 3 is configured to have the function of the real device 19 connected to the transfer chamber* (Embodiment 2) Fig. 16 is a cross-sectional view showing a vacuum processing apparatus according to a second embodiment of the present invention. The vacuum processing apparatus 101 of the second embodiment differs from the air handling apparatus 100 of the embodiment 22 22 201131009 in that Fig. 17 is an enlarged plan view showing a main portion of the transport mechanism 70. The transport mechanism 70 includes a plurality of rollers 71 and support members 72 that rotatably support the rollers 71. A bevel gear 73 is fixed to the front end of the rotating shaft. On each of the bevel gears 73, a bevel gear 74 meshing with the bevel gear 73 is fixed to the rotating shaft body 77. The bevel gear 75 meshes with one of the plurality of bevel gears 74. The bevel gear 75 has a hollow rotating shaft 76, and a groove 76a along the axial direction is formed in the hollow rotating shaft 76. The front end of the rotating shaft 54 of the motor 51 described in the first embodiment is fitted into the groove 76a. a locking member 54a is provided. In the structure When the motor 51 is driven to rotate the rotating shaft 54, the bevel gear 75 that is integral with the rotating shaft 76 is rotated by the locking member 54a. The rotation of the bevel gear 75 is via the bevel gear 74 - the rotating shaft 77 - the bevel gear 73 Each of the rollers 71 is rotated in the clockwise direction and the counterclockwise direction in the drawing by the normal rotation and the reverse rotation of the rotary shaft 54 of the motor 51. Similarly to the conveying mechanism 50, the conveying mechanism 7〇 Four bodies are attached to the main body frame j: 7〇UL on the left side on the upper side, 7〇UR on the right side, 70LL on the left side on the lower side, and 7〇LRo on the right side as shown in Fig. 19, and the cylinder 58 is driven to be transported. When the mechanism 7 is advanced, the roller 71 reaches a position overlapping the front end portion of the tray 43l or 43P. When the elevator 3〇L or 3〇p is lowered, the disk 43L or 43P is transferred to the roller 71 together with the workpiece w, and the motor 51 is rotated to transport the tray 43L or 43P. When the conveying mechanism 70 is advanced, as shown in FIG. 18, the locking member 54a provided on the rotating shaft 76 of the motor 51 is fitted into the groove 76a of the bevel gear % 201131009 - -r - the rotating shaft 76, so Rotation can be communicated to each roller 71. The processing method using the vacuum processing apparatus shown in the second embodiment can be performed in the same manner as the processing flow shown in Figs. 6 and 7 . Here, the pro-71 can be arranged over substantially the entire length of the vacuum processing apparatus 101 in the longitudinal direction, and thus, the tray 43L or 43P can be transported at any position on the roller 71. Therefore, it is not necessary to pay attention to the initial position or the end position as in the case of the transport mechanism % of the embodiment.
實施形態2所示的本發明的真空處理裝置1〇1,亦可 獲得與實施形態1所示的真空處理裝置丨⑻相同的效果。 關於该真空處理裝置1〇1的搬送時間,於圖6的處理流程 中步驟S9的工件更換所f的時間略長,為1q〜i5秒户 右’但結養得簡單。g,祕是直祕滅載置於^ 上並加以搬送’故無需托賴置用構件,從何 置的寬度尺寸。 衣 (實施形態3)In the vacuum processing apparatus 1〇1 of the present invention shown in the second embodiment, the same effects as those of the vacuum processing apparatus (8) shown in the first embodiment can be obtained. Regarding the transport time of the vacuum processing apparatus 1〇1, the time of the workpiece replacement f in the step S9 in the processing flow of Fig. 6 is slightly longer, and it is 1q to i5 seconds, but it is simple to raise. g, the secret is that the secret is placed on the ^ and transported. Therefore, there is no need to trust the member to be used. Clothing (Embodiment 3)
井Jit1及2的結構如下:當保持托盤的升降機 ^或下降時’使搬送體後退,當搬送托麟使搬送體前过 進施=的3機所構示的真空處理裝置⑽不包括使搬送體 ,20是真空處理裝置1()2的俯視觀察時的剖面圖 =3 Ϊ的XXI规線切斷剖面圖,圖22是圖Μ ΧΧΙΙ_ΧΧΙΙ線切斷剖面圖。 真工處理裝置⑴2與實施形 機構5〇變為搬送機構,於真空處理裝 24 201131009 JHZO^pil 段側與下段側的兩段安裝著搬送機構。上段側的搬送機構 包括一對之本體框架1左側的搬送機構8〇UL與右側的搬 送機構8GUR。下段_搬賴構包括—對之本體框架^ 左側的搬送機構80LL與右側的搬送機構8〇LR (特別參奶 圖22)。各搬送機構8〇UL、8〇UR、8〇ll、8贴是由相•同 的構成構件而構成,因此以下作為搬送機構8G而說明。 搬送機構80包括搬送構件81,該搬送構件81 人本體外殼(CaSe)1上形成的貫穿孔而朝裝置外 =延伸。搬送構件81具有較自承載室2至處理室3卜 =的長度’且於搬賴件81的前 置 之搬送構件81的間隔d且女协__ 前端的間隔d2。即dl>dw>d2^: 一==:的 的間隔4大於Lc下部密封 對之搬运構件81 ^ L〇\" ^ 而且,工件裁置部82的長度略大 至3的長度。然而,如下所述 件i或處理 與承載室2或處理室3相對夺件载置部82定位於 置㈣為未到達相鄰的處理;置處的^態下,工件載 另外,於圖on占丄 A氣載至2的長度。 中,右侧的搬送部82是上段側的搬送 25 201131009 機構80UL或80UR的構成槿杜,v , 侧的搬送機構80LR或8〇ll的構搬送部82是下段 搬送構件81的抽出至裝置外部的牛°八^ (bel丨ows) 83而覆蓋周圍。 。刀疋错由波紋管 體外殼!的壁面上安裝的波紋二=構^貫穿本 内突出。於波紋管83所插入的本 ^,而於搬送室4 密封件84:與纽㈣-併部安裝有 於搬达構件81及波紋管83的 9〇。移動機構90包括馬達9卜滾珠置有移動機構 二:。馬達91是安裝於移動構件96上;固定 舛上。於馬達91賴轉軸上 7保持構件 桿%的前端固定有與齒輪92喃合的=9923’。且於滾珠螺 若驅動該馬達91而使齒輪92正轉或反 IS旋轉,則移動構件%與保持構件%及馬達9; $紋管83與移動構件96的密著面形成為 件ί隨ΐΐ變化而麼縮或擴展。驅動該馬達91使移動構 工〜者滾珠螺桿95而移動,藉此可將搬送機構9〇的各 载置部82如圖21所示般定位於與承載室2相對 置處及與處理室3相對應的位置處。 ’心 直*接下來,跟隨圖20〜圖28而說明利用實施形雊3的 具-處理裝置1〇2來搬送工件w的方法。 〜 26 201131009 jn^oypuThe structure of the wells Jit1 and 2 is as follows: when the lifter of the tray is lowered or lowered, the vacuum conveyance device (10) constructed by the three machines for transporting the support to the conveyor is not included. The body 20 is a cross-sectional view in a plan view of the vacuum processing apparatus 1 () 2 = 3 Ϊ XXI gauge cut sectional view, and Fig. 22 is a cross-sectional view taken along the line 。 ΧΧΙΙ ΧΧΙΙ. The robot processing device (1) 2 and the embodiment mechanism 5 are changed into a transport mechanism, and a transport mechanism is attached to the vacuum processing device 24 201131009 JHZO^pil segment side and the lower segment side. The transport mechanism on the upper side includes a pair of transport mechanisms 8〇UL on the left side of the main body frame 1 and a transport mechanism 8GUR on the right side. The lower section_relocation structure includes a pair of main body frames ^ a transport mechanism 80LL on the left side and a transport mechanism 8〇LR on the right side (particularly the milk map 22). Since each of the transport mechanisms 8〇UL, 8〇UR, 8〇11, and 8 is composed of the same constituent members, the transport mechanism 8G will be described below. The conveying mechanism 80 includes a conveying member 81 that extends toward the outside of the apparatus through a through hole formed in the main body casing (CaSe) 1. The conveying member 81 has a length d from the load chamber 2 to the processing chamber 3 and a distance d between the conveying members 81 at the front of the loading member 81 and an interval d2 between the front ends of the female __. That is, the interval 4 of dl >dw>d2^: is larger than the lower member of the Lc lower sealing pair 81 ^ L〇\" ^ Further, the length of the workpiece cutting portion 82 is slightly larger to a length of three. However, as described below, the member i or the process is positioned relative to the carrying chamber 2 or the processing chamber 3 relative to the workpiece mounting portion 82 in the process of positioning (four) as not reaching the adjacent; in the state of the setting, the workpiece is loaded separately, in the figure on Occupy A air load to a length of 2. In the middle, the transport unit 82 on the right side is the transport 25 on the upper side, and the transport unit 82 on the side of the transfer mechanism 80LR or 8〇 is the outer transport unit 81. The cow ° ° ^ ^ (bel丨ows) 83 and covered around. . The knife is wrong by the bellows body shell! The corrugated two mounted on the wall surface is protruded through the inside. In the case where the bellows 83 is inserted, the transfer chamber 4 seal 84: and the button (4) are attached to the transfer member 81 and the bellows 83 at the same time. The moving mechanism 90 includes a motor 9 and a ball is provided with a moving mechanism. The motor 91 is mounted on the moving member 96; it is fixed to the cymbal. On the motor shaft 91, on the rotating shaft, the front end of the holding member rod % is fixed with =9923' which is merging with the gear 92. When the ball screw drives the motor 91 to rotate the gear 92 forward or reverse IS, the moving member % and the holding member % and the motor 9; the sealing surface of the groove 83 and the moving member 96 are formed as pieces. Change or shrink. The motor 91 is driven to move the moving mechanism to the ball screw 95, whereby the placing portions 82 of the conveying mechanism 9A can be positioned opposite to the carrying chamber 2 and to the processing chamber 3 as shown in FIG. Corresponding position. The following is a description of a method of transporting the workpiece w by the tool-processing device 1〇2 of the embodiment 3 described above with reference to Figs. 20 to 28 . ~ 26 201131009 jn^oypu
如圖21所示,真空處理裝置1〇2為如下狀態:於承 載至2内收谷的托盤43L上排列有工件w,且升降機3〇L 上升至最上部,並藉由LC下部密封用板6來對承載室2 進行密封。又,亦可為如下狀態:於處理室3内收容的托 盤43P上排列有工件W,且升降機3〇p上升至最上部,並 利用PC下部密封用板7來對處理室3進行密封。而且, 搬送機構80的搬送構件81全部以工件載置部幻與處理室 3相對應的方式而最大限度地抽出至裝置外部。 、於上述狀態下,使升降機30L下降,並在下段側的工 件載置部82到達托盤43L與LC下部密板6中間的位 置处停止《下來,驅動s纟馬達91 ’使下段側的搬送機構 【OH 8GLR的搬送構件81朝搬送室4内的裏側方向移 …工件載置部82料載室2相對應的位置處停止。 及H’驅動該馬達%,使上段側的搬送機構80UL 的搬送構件81朝搬送室4内的裏侧 ^工件載置部82與承載室2相對應的位置處停止。接^ 來,使升降機卿下降,並在上段侧的工件载置部 ,托盤43Ρ與PC密封用板7中間的位置處停止 =:出=、及_的搬送構件81自搬送 相對應的位置處停止。圖2^ = 2部8二處理室3 機曹及观他咖下來,使升降 藉由該動作,將托盤43L盥 搬送構件81的工件載置邱82: 載置於下段側的 千載置°Μ2上,且LC下部密封用板6 27 201131009 及加熱器42L保持在升降機30L的連桿31上。而且, 托盤43P與工件W載置於上段側的搬送構件81的工件載 置部82上,且PC密封用板7及加熱器42p保持在升 30P的連桿31上。圖23表示該狀態。As shown in Fig. 21, the vacuum processing apparatus 1〇2 is in a state in which the workpiece w is arranged on the tray 43L carried to the inner trough, and the elevator 3〇L is raised to the uppermost portion, and the LC lower sealing plate is used. 6 to seal the load compartment 2 . Further, the workpiece W may be arranged on the tray 43P accommodated in the processing chamber 3, and the elevator 3〇p may be raised to the uppermost portion, and the processing chamber 3 may be sealed by the PC lower sealing plate 7. Further, all of the conveying members 81 of the conveying mechanism 80 are maximally extracted to the outside of the apparatus so that the workpiece placing portion is responsive to the processing chamber 3. In the above-described state, the lifter 30L is lowered, and the lower portion side transport mechanism is stopped at the position where the workpiece mounting portion 82 on the lower stage side reaches the middle between the tray 43L and the LC lower shield 6. [The transfer member 81 of the OH 8GLR moves toward the back side in the transfer chamber 4... The position where the workpiece mounting portion 82 corresponds to the load chamber 2 is stopped. And H' drives the motor % to stop the conveying member 81 of the upper conveying mechanism 80UL toward the rear side of the conveying chamber 4 at a position corresponding to the carrying chamber 2 at the workpiece mounting portion 82. When the lifter is lowered, the workpiece mounting portion on the upper stage side, the position between the tray 43Ρ and the PC sealing plate 7 is stopped =: the transfer member 81 of the output =, and _ is transferred from the corresponding position stop. Fig. 2^ = 2 parts, 8 and 2 processing chambers 3, and the machine is placed, so that the lifting and lowering of the workpiece of the tray 43L盥 conveying member 81 is carried out by the operation of the tray 82: The placement of the load placed on the lower side is Μ2 The LC lower sealing plate 6 27 201131009 and the heater 42L are held on the link 31 of the elevator 30L. Further, the tray 43P and the workpiece W are placed on the workpiece mounting portion 82 of the conveying member 81 on the upper stage side, and the PC sealing plate 7 and the heater 42p are held on the link 31 of the lift 30P. Fig. 23 shows this state.
接下來,使上段側的搬送構件81朝搬送室4的裏側 移動’並在托盤43P及工件W與承載室2相對應的位置严 停止。而且,使下段側的搬送構件81自搬送室4起朝抽= 方向移動,並在托盤43L及工件W與處理室3相 位置處停止。圖24表示該狀態。 〜 接下來,使升降機30P上升,並在加熱器42p提昇托 盤43L且PC密封用板7未到達工件載置部82的位置處浐 止。而且,使升降機30L上升,並在加熱器42L提昇托^ 43P且LC下部密封職6未到達ji件載置部82的位置 停止。圖25表示該狀態。 々Then, the transport member 81 on the upper stage side is moved toward the back side of the transport chamber 4, and the position where the tray 43P and the workpiece W correspond to the load chamber 2 is strictly stopped. Then, the conveying member 81 on the lower stage side is moved from the conveying chamber 4 in the drawing direction, and is stopped at the position of the tray 43L and the workpiece W and the processing chamber 3. Fig. 24 shows this state. Then, the lifter 30P is raised, and the position where the heater 42p lifts the tray 43L and the PC sealing plate 7 does not reach the workpiece mounting portion 82 is stopped. Then, the lifter 30L is raised, and the heater 42L lifts the holder 43P and the LC lower seal member 6 does not reach the position where the ji member mounting portion 82 is reached. Fig. 25 shows this state. 々
、,接下來,如圖26所示,使下段側的搬送構件81 送至4的裏側移動。然後,使升降機3〇p上升至最上段為 止將托盤43L及工件W收容於處理室3内。而且^將 pC密封用板7擠壓於本體_丨的開口部ιρ的周圍所設 置的讀構件U上,自搬送室4對處理室3進行密封。 接下來,使上段側的搬送構件81自搬送室4 ,方向移動,並在搬送體82與處理室3相對應的位置處停 =^後,使升降機30L上升至最上段為止,將托盤饥 厂W收容於承載室2内。而且,將Lc下部密封用板 堅於本體框架1的開口部1L的周圍所設置的密封構件 28 201131009 34Z»ypit 自搬达至4來對承載室2進行密封。圖27表示該 ^照圖27則可明瞭:藉此,可將承齡2内收容 的,盤43L與工件W _併收容至處理室3内,且可將# ^室3内收容的托盤43p與工件w —併收容至承载室1 因此,藉由實施形態3的真空處理裂置1〇2,可 與圖6及圖7所記載的處理流程相同的處理。 τ 態3的真空處理裝置搬亦可實現與真空處理 裝^ 〇及101相同的效果。於該真空處理裝置1〇2的产 先日’圖6的處理流程所記載的步驟S9的玉件 的時間為3〜5秒左右。 “ 另外’於實施形態3中,藉由包括馬達91及滾 桿%的移動機構90來移動該搬送構件81。此時,亦可蕤 由氣紅來移動搬送構件81。 9 (實施形態4) 、圖28表示實施形態4。於該真空裝置103中,擴大搬 送室4,使處理室3與本體框架丨之間具有收容搬送機 80Α的工件載置部82的空間s。根據該結構,若使搬 構80A的工件載置部82移動至搬送室4内的空間§,、則 可於保持托盤43L或43P的狀態下使升降機3〇L或3〇p j 動。因此’例如若自㈣的狀態起,使上下的搬 構8〇A_送構件81自料以起朝抽出料移^機 使工件搬送部82移動至空間S的位置處,則之後可立: 29 201131009 342»ypit 而變為圖27 使升降機30L及30P同時上升至最上部為止, 的狀態。因此,可進一步縮短搬送時間。 (實施形態5) 於實施形態卜4中,對針f诗個托盤而搬送排列於 托盤上的工件W的情形進行了說明。Next, as shown in FIG. 26, the conveyance member 81 of the lower stage side is sent to the back side of 4 to move. Then, the lifter 3〇p is raised to the uppermost stage so that the tray 43L and the workpiece W are housed in the processing chamber 3. Further, the pC sealing plate 7 is pressed against the reading member U provided around the opening portion ι of the main body 丨, and the processing chamber 3 is sealed from the transfer chamber 4. Then, the transport member 81 on the upper stage side is moved in the direction from the transfer chamber 4, and after the transport body 82 and the processing chamber 3 correspond to each other, the lifter 30L is raised to the uppermost stage, and the tray is hungry. W is housed in the carrying room 2. Further, the sealing member 28 201131009 34Z»ypit provided around the opening 1L of the main body frame 1 is sealed by the Lc lower sealing plate, and the load chamber 2 is sealed. Fig. 27 is a view showing the same as Fig. 27, whereby the tray 43L and the workpiece W_ accommodated in the socket 2 can be accommodated in the processing chamber 3, and the tray 43p accommodated in the #^ chamber 3 can be accommodated. The workpiece w is accommodated in the carrier chamber 1. Therefore, the vacuum processing split 1〇2 of the third embodiment can be handled in the same manner as the processing flow described in FIGS. 6 and 7. The vacuum processing apparatus of the τ state 3 can also achieve the same effects as the vacuum processing apparatus and 101. The time of the jade piece of the step S9 described in the processing flow of Fig. 6 in the production process of the vacuum processing apparatus 1〇2 is about 3 to 5 seconds. Further, in the third embodiment, the conveying member 81 is moved by the moving mechanism 90 including the motor 91 and the roller %. At this time, the conveying member 81 can be moved by the gas red. 9 (Embodiment 4) Fig. 28 shows a fourth embodiment. In the vacuum apparatus 103, the transfer chamber 4 is enlarged, and the space s of the workpiece mounting portion 82 for accommodating the transporter 80A is provided between the processing chamber 3 and the main body frame 。. When the workpiece mounting portion 82 of the transporting 80A is moved to the space § in the transport chamber 4, the lift 3〇L or 3〇pj can be moved while holding the tray 43L or 43P. Therefore, for example, if (4) In the state, the upper and lower moving members 8A_feeding member 81 are moved to move the workpiece conveying portion 82 to the space S toward the drawing material transfer machine, and then can be changed: 29 201131009 342»ypit In Fig. 27, the lifts 30L and 30P are simultaneously raised to the uppermost position. Therefore, the transfer time can be further shortened. (Embodiment 5) In the fourth embodiment, the needles are transferred to the trays by pallets. The case of the workpiece W is explained.
圖29表示僅搬紅件w的例子。_ 29所 處理裝置Π)4與實施形態t所示的真空處理裝置刚的不 同點在於不具有托盤。真空處理裝置1〇4中的工件貨且 與真空處理裝置_的_ 43L或43p大致相同的尺寸。 若使升降機30L及30P上升或下降,而使搬送體5: 的工件載置部52b位於工件W與LC下部密封用板6之 間、或位於工件W與PC密封用板7之間,則可將工件从 自工件載置部52向升降機30L或30P轉載、或者將工科 W自升降機30L或30P向工件載置部52轉載。Fig. 29 shows an example in which only the red member w is moved. The difference between the processing device Π) 4 and the vacuum processing device shown in the t-th embodiment is that the tray is not provided. The workpiece in the vacuum processing apparatus 1〇4 is approximately the same size as the _43L or 43p of the vacuum processing apparatus_. When the lifters 30L and 30P are raised or lowered, the workpiece mounting portion 52b of the transport body 5: is located between the workpiece W and the LC lower sealing plate 6, or between the workpiece W and the PC sealing plate 7, The workpiece is reloaded from the workpiece mounting portion 52 to the elevator 30L or 30P, or the engineering W is transferred from the elevator 30L or 30P to the workpiece mounting portion 52.
圖29是以實施形態i的搬送機構5〇的結構為例而表 示的圖,但相對於實施形態2的搬送機構7〇或實施形態3 的搬送機構80而言,亦可同樣地僅搬送工件w。 乂〜 (實施形態6) 圖30是將實施形態6的本發明的真空處理裝置1〇5 於一娜面切斷後的剖面圖。 實施形態6的真空處理裝置1〇5與實施形態i的真空 處理裝置100的第1個不同點在於:於承載室2及處理室 3内僅收容工件w,而不收容托盤及加熱器。第2個不同 點在於.於處理室3内包括襯板(packingpiate) μ、固定 30 20113100929 is a view showing the configuration of the transport mechanism 5A of the embodiment i. However, the transport mechanism 7 of the second embodiment or the transport mechanism 80 of the third embodiment can similarly transport only the workpiece. w.实施 ( (Embodiment 6) Fig. 30 is a cross-sectional view showing the vacuum processing apparatus 1〇5 of the present invention in the sixth embodiment. The first difference between the vacuum processing apparatus 1〇5 of the sixth embodiment and the vacuum processing apparatus 100 of the first embodiment is that only the workpiece w is accommodated in the carrying chamber 2 and the processing chamber 3, and the tray and the heater are not accommodated. The second difference is that the processing chamber 3 includes a packingpiate μ, which is fixed 30 201131009
於,上的㈣(ta聊)62、及配置於_ 62周圍的陽 極電極63。第3個不同點在於:藉由搬送體52而將LC 下部密封用板6或PC密封用板7與卫件w搬送,詳 細内容於下文敍述。 參照圖3G〜圖33而說明上述第3個不同點。圖31是 於J 30的-側面垂直的側面切斷後的剖面圖,圖%及 圖33是表示與圖30相同剖面的搬送體的不同狀態的圖。 、自圖30所不的狀態起’使升降機30P的連桿31下降, ^於PC輯用板7略高於上段側的搬送體》的工件載置 =2b的狀態下停止升降機3Gp。驅動上部側的搬送機構 及50UL的各氣缸58,使搬送體52練置中央側前 j,並於到達工件載置部52b的一部分與pc密封用板7 的側端部重疊的位置處的狀態下停止。 使升降機3GP的連桿31下降至最下段位置。藉由該 署邱jPC密朗板7及卫件W搭載於上段側的工件載 讲 如此一來’在將pC密封用板7及工件W已搭 '产SI的工件載置部52b的狀態T ’於本實施形態的 月 > 守,升降機30Ρ的連桿31上並未搭載任何物品。 ^接下來,使升降機30L的連桿31下降,並於lc下部 密封f板f略高於下段侧的搬送體52的工件載置部52b η 、二下停止升降機3〇l。驅動上部側的搬送機構 f 50ΙΧ的錢缸58,錢送體52減置中央側前進,並 =件載置部52b的―部分與PC密封用板7的側端 重逢的位置處的狀態下停止。圖31表示該狀態。 31 201131009 自圖31的狀態起,使升降機3〇L的連桿31下降至最 下段位置。藉由該動作,而將LC下部密封用板6及工件 W搭載於下段側的工件載置部52b。如此一來,在已將 下部密封用板6及工件w搭載於下段側的工件载置部52b 的狀弊下,於該實施形態的情形時,在升降機3〇L的連桿 31上並未搭載任何物品。圖32表示該狀態。 於圖32的狀態下,朝B方向搬送下段側的搬送體52, 朝C方向搬送上段側的搬送體52。藉由該動作,如圖33 所示,收容於承載室2内的工件w與LC下部密封用板6 一併朝處理室3側移動。而且,收容於處理室3的工件w 與PC密封用板7 —併朝承載室2侧移動。此後,藉由如 實施形態1中所說明的方法,驅動升降機3〇p、及搬 送機構50LR、50LL、50UR、50UL,將工件w搬入至承 載室2内及處理室3内便可。 上述實施形態6所示的將LC下部密封用板ό及PC 岔封用板7與工件W —併搬送的方法,亦可適用於實施形 態2、4的真空處理裝置1〇1〜1〇3。 如上所述,根據本發明的真空處理裝置,於工件或托 盤的搬送時序中搬送工件W或托盤。因此,與自一個真空 至搬.出工件之後,開始向該真空室内搬入工件的先前的真 空處理裝置相比,可大幅度縮短搬送時間。此處,本發明 並不,Ρ艮疋於在其中一工件的搬送過程中另一工件的搬送已 完成的情形,還包括了其中一工件的搬送過程中另一工件 的搬送未完成的情形。而且,關於搬送開始,亦不限定於 32 201131009 其中一工件的搬送開始輿另一工件的搬送開始, 還包括在不同時間開始搬送的情形。蛐之,於 的搬送動作巾K件_送動作較重複進行一部分 亦可。 偏於上述實施形態巾H載室巾進行裝載及奸 載的情料行了 ,但亦可々^的真空㈣進行裝載 及卸載:而且,並不限於處理室為一個的情形,亦可適用 於包含多個處理室的真空處理裝置。 另夕卜,於上述實施形態中,形成為可自本體框^打 開或關閉LC上部㈣板5的結構,但亦可將設有被處理 體的搬入、搬出用門的LC上部_板5與本體框架丄一 體地形成。上述實施形態巾形麵將處理室3與本體框架 1 -體地形成的結構,但亦可自本體框架i打開或關閉處 理室3的室壁。於本發明中,裝置本體枝義為包括本體 框架1、及可開關地安裝於該本體框架i上的真空室形 用板。 將LC下部密封用板6及pc密封用板7作為平板狀 的構件而圖不’但亦可採用任意形狀,如Lc上部密封用 板5般設為帽型、或者設為圓頂(d〇me)形。 此外:本發明的真空處理裝置可於發明主旨的範圍内 進打各種變形_用,紅,只要包括如下物件便可 置本體’其包含—面具有第丨開口部的第丨真空室及一面 具有第2開口部㈣2真空m密封賊,其覆蓋第 1開口部,第2密封用板,其覆蓋第2開口部;第i升降 33 201131009 1 ’其將第1㈣用板漏於裝置本 邊部’而自外部對第,真空室進行密封;的: 將第2密封用板擠壓於褒置本體的第2開口部的Then, (4) (ta) 62, and an anode electrode 63 disposed around _62. The third difference is that the LC lower sealing plate 6 or the PC sealing plate 7 and the guard w are conveyed by the conveying body 52, and the details will be described later. The third difference will be described with reference to Figs. 3G to 33. Fig. 31 is a cross-sectional view taken along the side perpendicular to the side surface of J 30, and Fig. 33 and Fig. 33 are views showing different states of the conveying body having the same cross section as Fig. 30. In the state which is not shown in Fig. 30, the lifter 3Gp is stopped in a state where the link 31 of the lifter 30P is lowered, and the workpiece of the PC stacking plate 7 is slightly higher than the transporter of the upper stage. The state in which the transport mechanism of the upper side and the cylinders 58 of the 50UL are driven to move the transport body 52 to the center side front j and reach a position where a part of the workpiece mounting portion 52b overlaps the side end portion of the pc sealing plate 7 is driven. Stop below. The link 31 of the elevator 3GP is lowered to the lowermost position. In the case of the workpiece mounted on the upper stage side of the board, the board is placed in the upper stage side, and the state of the workpiece mounting portion 52b in which the SI is placed on the pC sealing sheet 7 and the workpiece W is set. In the month of the present embodiment, the link 31 of the elevator 30 is not loaded with any articles. Then, the link 31 of the lifter 30L is lowered, and the f-plate lower f is slightly higher than the workpiece mounting portion 52b η of the transport body 52 on the lower stage side, and the lower lifter 3〇1 is stopped. The money cylinder 58 that drives the transport mechanism f 50 of the upper side is stopped, and the center of the money feed body 52 is lowered, and the portion of the member mounting portion 52b is stopped at the position where the side end of the PC sealing plate 7 meets. . Fig. 31 shows this state. 31 201131009 From the state of Fig. 31, the link 31 of the elevator 3〇L is lowered to the lowest position. By this operation, the LC lower sealing plate 6 and the workpiece W are mounted on the workpiece mounting portion 52b on the lower stage side. In this case, in the case where the lower sealing plate 6 and the workpiece w are mounted on the workpiece mounting portion 52b on the lower stage side, in the case of the embodiment, the link 31 of the elevator 3〇L is not provided. Carry any item. Fig. 32 shows this state. In the state of FIG. 32, the conveyance body 52 of the lower stage side is conveyed in the B direction, and the conveyance body 52 of the upper stage side is conveyed in the C direction. By this operation, as shown in FIG. 33, the workpiece w accommodated in the carrying case 2 moves toward the processing chamber 3 side together with the LC lower sealing plate 6. Further, the workpiece w accommodated in the processing chamber 3 moves toward the carrier chamber 2 side with the PC sealing plate 7. Thereafter, the lifter 3〇p and the conveyance mechanisms 50LR, 50LL, 50UR, and 50UL are driven by the method described in the first embodiment, and the workpiece w can be carried into the inside of the carrier chamber 2 and the processing chamber 3. The method of transporting the LC lower sealing plate and the PC 岔 sealing plate 7 and the workpiece W as shown in the above-described sixth embodiment can also be applied to the vacuum processing apparatuses 1〇1 to 1〇3 of the second and fourth embodiments. . As described above, according to the vacuum processing apparatus of the present invention, the workpiece W or the tray is conveyed at the conveyance timing of the workpiece or the tray. Therefore, the transfer time can be significantly shortened compared to the previous vacuum processing apparatus in which the workpiece is loaded into the vacuum chamber from the vacuum to the workpiece. Here, the present invention does not, in the case where the conveyance of another workpiece is completed during the conveyance of one of the workpieces, but also the case where the conveyance of the other workpiece during the conveyance of one of the workpieces is not completed. Further, the start of the transport is not limited to 32 201131009. The transfer of one workpiece starts and the start of transport of another workpiece, and the case where transport starts at different times is also included.蛐 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In the case of the above-described embodiment, the towel H is loaded and raped, but it can be loaded and unloaded by vacuum (4): and it is not limited to the case where the processing chamber is one, and may be applied to A vacuum processing apparatus comprising a plurality of processing chambers. Further, in the above-described embodiment, the LC upper portion (four) plate 5 may be opened or closed from the main body frame, but the LC upper plate 5 and the door for carrying in and out of the object to be processed may be provided. The body frame is integrally formed. The towel-shaped surface of the above embodiment has a structure in which the processing chamber 3 is integrally formed with the main body frame, but the chamber wall of the processing chamber 3 may be opened or closed from the main body frame i. In the present invention, the apparatus body includes a body frame 1, and a vacuum chamber-shaped plate that is switchably mounted on the body frame i. The LC lower sealing plate 6 and the pc sealing plate 7 are formed as flat members, but they may be of any shape. For example, the Lc upper sealing plate 5 is a hat type or a dome (d〇) Me) shape. Further, the vacuum processing apparatus of the present invention can be variously modified within the scope of the gist of the invention. Red, as long as it includes the following items, the body can be placed with a second vacuum chamber having a second opening and a side having The second opening (4) 2 vacuum m seal thief covers the first opening, the second sealing plate covers the second opening; the i-th lifting 33 201131009 1 'the first (four) plate is leaked to the device side portion' The vacuum chamber is sealed from the outside; the second sealing plate is pressed against the second opening of the housing body
處理體;以1笛。卜開放的第1挽封用板上所載置的至少被 ,及第2搬送機構,其用以搬送自第2M 放的夢2密_板上所載置的至少被處理體。”至歼 驟·ίίΓΓΓ用真空處理裝置的處理方法包括如下步 驟.使第1升降機下降,將密封第i真空室的第 位置處的步驟;使第2升降機下降,將 社封第真工至的第2密封用板保持在第2段的位置處的 步驟;藉由第1搬送體,將收容於第i真空室内的被』 體或載置有被處理體的托盤予以保持的步驟 真空室内的被處理體或載以 體的^盤予以保持的步驟;藉由第】搬送機構來驅動第上 ft二使被處理體或载置有被處理體的托盤移動至與 驅上i 應的位置處的步驟;藉由第2搬送機構來 室而::^ 移動^興弟I異工至相對應的位置;使由第!升降機所 持f i密ΐ用板上升,將收容於第2真空室的被處理體 或載置有被處理體的托盤收容至第!真空室的步驟 使由第2升降機所支撐㈣2密封用板上升,將收容^ 1真空室的被處理體置有被處理_減收容至上^ 第2真空室的步驟;且藉由第1搬送機構來驅動第^搬送 34 201131009 j^fzdypir 體而使被處理體或載置有被處理體的托盤移動至與 對i的位置處的步驟,與藉由第2搬送_來_ 第2搬运“使被處理體或載置有被處理體的域 與第1真空室相對應的位置處的步驟,只要至少一 β 以相同時序而進行即可。 刀疋 此外,本發明的利用真空處理裝置的處理方法 下步驟:使第1升降機下降,將密封第i真空室的第^ 封用板保持在第1段的位置處的步驟;使第2升降機下在 將密封第2真空室的第2密封用板保持在第2段的位置户 的步驟;藉由第1搬送體,而將上述第丨密_板盘^ 於第1真空室_被處理體—併加以保持的步驟 2搬送體,而將第2密封用板與收容於第2真空室;的被 處理體-併加以保持的步驟;藉由第!搬 1搬送體,將第i密封用板與收容於第 理體-併移動至與第2真空室相制的位置處的步 =第^搬送機構來驅動第2搬送體,將第2密封用板與收 容於第2真空室内的被處理體一併移動至與第i真空/室相 對,$位置處的步驟;使第1升降機上升,將第2 J封用 ^密^於第1真空室’並將收容於第2真空室的被處理 體收容至第1真空f的步驟;以及使第2升降機上升,將 第1密封用板密著於第2真Μ,並且純容於第】真* 室的被處理體收容至第2真空室的步驟;且藉由第】搬^ 機構來驅動第i搬送體,將第i密板與收容於第i真 空室内的被處理體-併搬送至與第2真空室相對應的位置 35 201131009 處的步驟,與藉由第2搬送機構來驅動第2搬送體’將第 2密封用板與收容於第2真空室内的被處理體一併搬送至 與第1真空室相對應的位置處的步驟,只要至少一部分是 以相同時序而進行即可。 雖然本發明已以實施例揭露如上,然其並非用以限定 本發明’任何所屬技術區域中具有通常知識者,在不脫離 本發明之精神和範圍内,當可作些許之更動與潤飾,故本Processing body; with 1 flute. At least the second transport mechanism is placed on the first seal plate that is opened, and is used to transport at least the object to be processed placed on the 2M board. The processing method of the vacuum processing apparatus includes the following steps: a step of lowering the first elevator, sealing the first position of the i-th vacuum chamber, and lowering the second elevator, and the social protection is completed. a step of holding the second sealing plate at the position of the second stage; and the step of holding the tray accommodated in the i-th vacuum chamber or the tray on which the object to be processed is placed in the vacuum chamber by the first conveying body a step of holding the object to be processed or a disk loaded with the body; and driving the upper ft 2 by the first conveying mechanism to move the object to be processed or the tray on which the object to be processed is placed to a position where the substrate is to be driven In the second step, the second transport unit is moved to the second vacuum chamber by the second lift chamber. The step of accommodating the processing body or the tray on which the object to be processed is placed in the first vacuum chamber raises the (4) 2 sealing plate supported by the second elevator, and places the object to be processed in the vacuum chamber to be processed. ^ the second vacuum chamber step; and by the first transport mechanism The second transport _ _ the second transport "make" the step of moving the tray to be processed to the object to be processed to the position of the object i by the second transport The step of the object to be processed or the region in which the object to be processed is placed corresponds to the first vacuum chamber, and at least one β may be performed at the same timing. Further, the processing method using the vacuum processing apparatus according to the present invention is a step of lowering the first elevator and holding the sealing plate for sealing the i-th vacuum chamber at the position of the first stage; and making the second elevator a step of holding the second sealing plate that seals the second vacuum chamber at the position of the second stage; and the first transfer member is processed in the first vacuum chamber by the first transfer body a step of holding the body in the step 2 and holding the body, and holding the second sealing plate and the object to be processed contained in the second vacuum chamber; and maintaining the body; The first transfer member is driven, and the second transfer member is driven by the step-by-step transfer mechanism that is placed in the position of the first vacuum chamber and moved to the second vacuum chamber, and the second transfer member is driven. The plate is moved to the position corresponding to the ith vacuum/chamber at a position of $ with the object to be processed in the second vacuum chamber; the first elevator is raised, and the second J is sealed to the first vacuum chamber. 'The step of accommodating the object to be processed in the second vacuum chamber to the first vacuum f; and raising the second elevator to adhere the first sealing plate to the second true one, and to be purely true * a step of accommodating the object to be processed in the second vacuum chamber; and driving the i-th transfer body by the first transfer mechanism, and transporting the i-th dense plate and the object to be processed accommodated in the i-th vacuum chamber to At the position 35 201131009 corresponding to the second vacuum chamber, the second sealing member is driven by the second conveying means to transport the second sealing plate together with the object to be processed stored in the second vacuum chamber to The step at the position corresponding to the first vacuum chamber may be performed at least in part at the same timing. The present invention has been disclosed in the above embodiments, and it is not intended to limit the invention to those skilled in the art, and it is possible to make some modifications and refinements without departing from the spirit and scope of the invention. this
發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖券簡單說明】 、阖1是表示本發明的真空處理裝置的實施形態1的俯 視觀_時的剖面圖。 圖2是圖1的II-II線切斷剖面圖。 圖3是圖1的冚-瓜線切斷剖面圖。 圖4疋圖1所示的搬送機構的放大平面圖。 :卜表示圖4的搬送機構的不同狀態的圖。 -例的處發明的利用真空處理裝置的處理抑The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a plan view of a vacuum processing apparatus according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line II-II of Fig. 1; Fig. 3 is a cross-sectional view showing the squash-melon line of Fig. 1; Fig. 4 is an enlarged plan view showing the conveying mechanism shown in Fig. 1. Fig. 4 is a view showing a different state of the conveying mechanism of Fig. 4; - The treatment of the invention using a vacuum processing device
6而表示處理方法的處理流程圖。 最初狀態發明的利用真空處理裝置的處理於 =是严示圖8的下一動作的剖面圖。 圖9的下一動作的剖面圖。 =1示Γ的J 一動作的剖面圖。 疋表不圖11的下一動作的剖面圖。 36 201131009 J4^sypit 圖13是用以說明搬送機構的後退動作的剖面圖。 圖14是表示圖13的下一動作的剖面圖。 圖15是表示圖14的下一動作的剖面圖。 圖16是表示本發明的真空處理裝置的實施形態2的 剖面圖。 圖17是圖16所示的搬送機構的放大平面圖。 圖18是表示圖17的搬送機構的不同狀態的剖面圖。 圖19是表示實施形態2中的搬送機構的前進狀態的 籲剖面圖。 圖20是表示本發明的真空處理裝置的實施形態3的 俯視觀察時的剖面圖。 圖21是圖20的XXI-XXI線切斷剖面圖。 圖22是圖20的XXII-XXII線切斷剖面圖。 圖23是用以說明圖20的真空處理裝置的搬送方法的 剖面圖。 圖24是表示圖23的下一動作的剖面圖。 _ 圖25是表示圖23的下一動作的剖面圖。 圖26是表示圖24的下一動作的剖面圖。 圖27是表示圖25的下一動作的圖。 圖28是表示本發明的真空處理裝置的實施形態4的 剖面圖。 圖29是表示本發明的真空處理裝置的實施形態5的 剖面圖。 圖30是表示本發明的真空處理裝置的實施形態6的 37 201131009 342»ypit 剖面圖。 圖31是用以說明圖30所示的真空處理裝置的搬送方 法的剖面圖。 圖32是表示圖31的下一動作的剖面圖。 圖33是表示圖32的下一動作的剖面圖。 【主要元件符號說明】 1 :本體框架 1L、1P :開口部 2 :承載室(真空室) * 3 :處理室(真空室) 4 :搬送室 5:LC上部密封用板 6 : LC下部密封用板 7 : PC密封用板 U、12、13 :密封構件 15 :通氣系統配管 16 .南頻電極 隹 18 :氣體導入管 14、17、19 :真空裝置 ,20 :升降機構 21 :馬達 22、23、73、74、75 :傘齒輪 25、95 :滚珠螺桿 26 :導引構件 38 201131009 27 :升降構件 28 :連接構件 30L、30P :升降機 31、58a :連桿 32L、32P ··加強板 41 .局頻電源 42L、42Ρ :加熱器 43L、43Ρ :托盤 _ 44L、44Ρ :電源配線 50、50LL、50LR、50UL、50UR :搬送機構 70、70LL、70LR、70UL、70UR :搬送機構 80、80Α、80LL、80LR、80UL、80UR :搬送機構 5卜91 :馬達 52 :搬送體 52a :支架部 52b、82 :工件載置部 馨 53 :導板 54、56、76 :旋轉轴 54a :卡止構件 55 :小齒輪 56a、76a :槽 57、59、72 :支撐構件 58 :氣缸(搬送體間隔位移構件) 61 :襯板6 shows a processing flow chart of the processing method. The process using the vacuum processing apparatus in the first state is a cross-sectional view showing the next operation of Fig. 8 . A cross-sectional view of the next action of Fig. 9. =1 shows a sectional view of the J-action. The cross-sectional view of the next action of FIG. 11 is not shown. 36 201131009 J4^sypit FIG. 13 is a cross-sectional view for explaining a retreating operation of the conveying mechanism. Fig. 14 is a cross-sectional view showing the next operation of Fig. 13; Fig. 15 is a cross-sectional view showing the next operation of Fig. 14; Fig. 16 is a cross-sectional view showing a second embodiment of the vacuum processing apparatus of the present invention. Fig. 17 is an enlarged plan view showing the conveying mechanism shown in Fig. 16; Fig. 18 is a cross-sectional view showing a different state of the conveying mechanism of Fig. 17; Fig. 19 is a cross-sectional view showing the forward state of the conveying mechanism in the second embodiment. Fig. 20 is a cross-sectional view showing a vacuum processing apparatus according to a third embodiment of the present invention in a plan view. Fig. 21 is a sectional view taken along line XXI-XXI of Fig. 20; Fig. 22 is a sectional view taken along line XXII-XXII of Fig. 20; Fig. 23 is a cross-sectional view for explaining a method of conveying the vacuum processing apparatus of Fig. 20; Fig. 24 is a cross-sectional view showing the next operation of Fig. 23; FIG. 25 is a cross-sectional view showing the next operation of FIG. 23. Fig. 26 is a cross-sectional view showing the next operation of Fig. 24; Fig. 27 is a view showing the next operation of Fig. 25; Fig. 28 is a cross-sectional view showing a fourth embodiment of the vacuum processing apparatus of the present invention. Fig. 29 is a cross-sectional view showing a fifth embodiment of the vacuum processing apparatus of the present invention. Figure 30 is a cross-sectional view showing a 37 201131009 342»ypit of a sixth embodiment of the vacuum processing apparatus of the present invention. Fig. 31 is a cross-sectional view for explaining a conveying method of the vacuum processing apparatus shown in Fig. 30. Figure 32 is a cross-sectional view showing the next operation of Figure 31. Figure 33 is a cross-sectional view showing the next operation of Figure 32. [Description of main component symbols] 1 : Main body frame 1L, 1P : Opening 2 : Carrying chamber (vacuum chamber) * 3 : Processing chamber (vacuum chamber) 4 : Transfer chamber 5 : LC upper sealing plate 6 : LC lower sealing Plate 7 : PC sealing plates U, 12, 13 : Sealing member 15 : Ventilation system piping 16 . South frequency electrode 隹 18 : Gas introduction pipes 14 , 17 , 19 : Vacuum device 20 : Lifting mechanism 21 : Motor 22 , 23 , 73, 74, 75: bevel gears 25, 95: ball screw 26: guide member 38 201131009 27: lifting member 28: connecting members 30L, 30P: elevators 31, 58a: connecting rods 32L, 32P · reinforcing plate 41. Local frequency power supplies 42L, 42A: heaters 43L, 43A: trays _ 44L, 44 Ρ : power supply wirings 50, 50LL, 50LR, 50UL, 50UR: transport mechanisms 70, 70LL, 70LR, 70UL, 70UR: transport mechanisms 80, 80Α, 80LL 80LR, 80UL, 80UR: transport mechanism 5: 91: motor 52: transport body 52a: bracket portion 52b, 82: workpiece mounting portion sin 53: guide plates 54, 56, 76: rotating shaft 54a: locking member 55: Pinion gears 56a, 76a: grooves 57, 59, 72: support member 58: cylinder (transport body spacing displacement member) 61: liner
S 39 201131009 62 :靶材 ¢3 :陽極電極 71 :輥 77 :旋轉軸體 81 :搬送構件 83 :波紋管 84 密封件 90 :移動機構 92、93 :齒輪 94 :保持構件 96 :移動構件 100、101、102、103、104、105 :真空處理裝置 A、B、C :方向 di、(I2、dw .間隔 S :空間 S1〜S51 :步驟 W :工件S 39 201131009 62 : target ¢ 3 : anode electrode 71 : roller 77 : rotating shaft body 81 : conveying member 83 : bellows 84 sealing member 90 : moving mechanism 92 , 93 : gear 94 : holding member 96 : moving member 100 , 101, 102, 103, 104, 105: vacuum processing apparatus A, B, C: direction di, (I2, dw. interval S: space S1 to S51: step W: workpiece
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2009/070697 WO2011070667A1 (en) | 2009-12-10 | 2009-12-10 | Vacuum processing apparatus and processing method using vacuum processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201131009A true TW201131009A (en) | 2011-09-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099142386A TW201131009A (en) | 2009-12-10 | 2010-12-06 | Vacuum processing device and processing method performed by the same |
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| Country | Link |
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| TW (1) | TW201131009A (en) |
| WO (1) | WO2011070667A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI730370B (en) * | 2013-07-25 | 2021-06-11 | 日商東京威力科創股份有限公司 | Plasma processing device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3058006B2 (en) * | 1994-05-24 | 2000-07-04 | 日新電機株式会社 | Film forming equipment |
| JP3971081B2 (en) * | 2000-04-17 | 2007-09-05 | 株式会社アルバック | Vacuum processing equipment |
| JP4531247B2 (en) * | 2000-12-19 | 2010-08-25 | 株式会社アルバック | Vacuum processing equipment |
| JP2008297584A (en) * | 2007-05-30 | 2008-12-11 | Canon Anelva Corp | Deposition equipment |
-
2009
- 2009-12-10 WO PCT/JP2009/070697 patent/WO2011070667A1/en not_active Ceased
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI730370B (en) * | 2013-07-25 | 2021-06-11 | 日商東京威力科創股份有限公司 | Plasma processing device |
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| WO2011070667A1 (en) | 2011-06-16 |
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