TW201130656A - Polishing pad and method of making the same - Google Patents

Abstract

The disclosure is directed to polishing pads with porous polishing layers, methods of making such polishing pads, and methods of using such pads in a polishing process. The polishing pad includes a compliant layer having first and second opposing sides and a porous polishing layer disposed on the first side of the compliant layer. The porous polishing layer includes a crosslinked network comprising a thermally cured component and a radiation cured component, wherein the radiation cured component and the thermally cured component are covalently bonded in the crosslinked network. The porous polishing layer also includes polymer particles dispersed within the crosslinked network, wherein the polymer particles comprise at least one of thermoplastic polymers or thermoset polymers. The porous polishing layer typically also includes closed cell pores dispersed within the crosslinked network.

Description

201130656 VI. Description of the Invention: [Prior Art] During the manufacture of a semiconductor device and an integrated circuit, the Shihua wafer is repeatedly processed through a series of deposition and etching steps to form an overlying material layer and a device structure. Polishing techniques known as chemical mechanical planarization (CMP) can be used to remove surface irregularities (such as bumps, unequal south regions, trenches, and trenches) remaining after the deposition and etching steps, with the goal of A smooth wafer surface with no scratches or sags (referred to as surface depressions) and high uniformity on the wafer surface is obtained. In a typical CMP polishing process, a substrate, such as a wafer, is pressed against a polishing pad and relatively moved relative to the polishing pad in the presence of a working liquid, typically the abrasive particles are in water and/or etch chemistry. Grinding the slurry. Various CMP polishing pads for use with a slurry have been disclosed, for example, in U.S. Patent No. 5,257,478 (Hyde et al.); 5,921,855 (Osterheld et al.); 6, 126,532 (Sevilla et al.); No. 6,899,598 (Prasad); and 7,267,610 (Elmufdi et al.). A polishing pad of a fixed abrasive is also known, as exemplified by U.S. Patent No. 6,908,366 (Gagliardi), in which abrasive particles are generally fixed to the surface of the pad, often with a precision-formed abrasive composite extending from the surface of the pad. form. Recently, a polishing pad having a plurality of polishing elements extending from a compressible lower layer has been described in International Application Publication No. WO/2006057714 (Bajaj). Although a variety of polishing pads are known and used, this technology continues to search for CMP (particularly in CMP processes where larger die sizes are used or where higher levels of wafer surface flatness and polishing uniformity are required) ) 153112.doc 201130656 New modified polishing pad. SUMMARY OF THE INVENTION The present invention provides a porous polishing pad having a polishing layer comprising a thermally curable component and a radiation curable component, and a method of making the same. The pores are incorporated into the polishing layer by using polymer particles. The apertures in the porous polishing pads disclosed herein are closed-cell apertures. These closed-chamber apertures generally have lower aperture non-uniformities and smaller apertures than conventional thermally cured polishing apertures. Controlling the aperture and distribution can facilitate, for example, the polishing performance of the polishing pad. In one aspect, the present invention provides a polishing pad comprising: a flexible layer having first and second opposite sides; and a porous polishing layer disposed on a first side of the flexible layer, the porous polishing layer comprising: a crosslinked network structure of a heat curing component and a radiation curing component, wherein the conditioned curing component and the heat curing component are covalently bonded in the crosslinked network structure; the polymer particles dispersed in the crosslinked network structure; A closed cell cavity that is dispersed within the interconnected network structure. In some embodiments the polishing pad further comprises a support layer interposed between the flexible layer and the porous polishing layer. In another aspect, the present invention provides a method of making a polishing pad, the method comprising: providing a composition comprising a heat curable resin composition, a radiation curable resin composition, and polymer particles; forming a hole in the composition 153112.doc 201130656 positioning the composition on the support layer; and at least partially curing the radiation curable resin composition and heating the composition to at least partially cure the heat curable resin composition by exposing the composition to radiation A porous polishing layer is formed on the support layer. In some embodiments, the method further comprises bonding the flexible layer to the surface of the porous polishing layer opposite the support layer in an adhesive manner. In still another aspect, the present invention provides a polishing method comprising: contacting a surface of a substrate with a porous polishing layer of a polishing pad according to the present invention; and relatively moving the polishing pad relative to the substrate to polish a surface of the substrate. An exemplary embodiment of a polishing pad in accordance with the present invention has various features and characteristics that enable it to be used in a variety of polishing applications. In some embodiments, the polishing pad of the present invention is particularly useful for chemical mechanical planarization (CMP) of integrated circuits and wafers used in the fabrication of semiconductor devices. In some embodiments, the polishing pads described in this disclosure may provide some or all of the following advantages. For example, in some embodiments, a polishing pad in accordance with the present invention can be used to preferably maintain a working fluid for a CMP process at the interface between the polishing surface of the pad and the surface of the substrate being polished, thereby improving the work. The effectiveness of liquids in intensive polishing. In other exemplary embodiments, the polishing pad in accordance with the present invention can reduce or eliminate dishing and/or edge erosion of the wafer surface during polishing. In some exemplary embodiments, the use of a polishing pad in accordance with the present invention in a CMP process results in improved in-wafer polishing uniformity, flatter 153112.doc 201130656 polished wafer surface, self-wafer edge dies The increase in yield, and the improved (10) process conditions and properties. In other implementations, the use of a polishing pad in accordance with the present invention allows for handling of relatively large wafers while maintaining the desired degree of surface uniformity to achieve high wafer yields, requiring more wafers to be processed prior to conditioning the pad surface. In order to maintain the polishing uniformity of the wafer surface, or to reduce the processing time and wear on the pad conditioner. In the present invention: "aperture non-uniformity" means the average value of the pore diameter divided by the average pore diameter multiplied by 100 standard deviation. The term "polyurethane" refers to an amine-based vinegar bond having one or more combinations in any combination (·ΝΗ-(:(0)-0-), a urea bond (_nh_c(〇)_nh_ or -NH a polymer of -C(〇)-N(R)-, wherein r can be hydrogen, aliphatic, cycloaliphatic or aromatic), biuret, allophanate, uretdione or isocyanate linkage The term "(meth)acrylate" means acrylate and mercapto acrylate" which may include a combination of amino phthalate acrylate, methacrylate, and acrylate and methacrylate. "Polymerization" means a molecule having a structure comprising a plurality of repeating units derived from molecules of low relative molecular mass. The term "polymerization" includes "oligomerization". Terms such as "a" and "the" are not intended to mean singular. Entity, but includes general categories that can be used for specific examples of the description. The terms "a" and "the" are used interchangeably with the term "at least one J. The phrase "at least one of J" and "includes... At least one of the following is a list of 153112.doc 201130656 which refers to any of the items in the list and Any combination of two or more items in the list. Unless otherwise stated, all numerical ranges include non-integer values between the endpoints and the endpoints. The various embodiments of the exemplary embodiments of the present invention have been summarized. The above summary is not intended to describe the embodiments or the various embodiments of the present invention. The following drawings and embodiments more particularly exemplify some embodiments of the present invention. In the drawings, the same reference numerals are used to refer to the same elements. The figures herein are not drawn to scale, and in the figures, the dimensions of the components of the polishing pad are determined to emphasize selected features. A typical CMP pad is constructed of a thermoset (e.g., polyurethane) material having pores that can be produced using a variety of methods, such as microspheres, soluble fiber methods, gas entrapment (e.g. In situ or off-site) and physical air trapping. When using these methods, due to the temperature gradient formed during the polymerization, caused by the forming operation Skin/core effects, fiber distribution, dissolution rate of soluble fibers, and polishing chemistry, pore size, pore volume, and pore distribution throughout the pad can be challenging. Some commercially available CMP pads have thermal cure in isocyanate resins. Open air chamber pad construction produced during the period. Figure 1 shows a cross-sectional view and a top view of a commercially available open cell CMP crucible available from PPG Industries (Pittsburgh, PA) under the trade designation "S7". The size, shape and distribution of the hole I53112.doc 201130656 in this crucible are not controlled. The present invention is directed to an improved porous polishing pad in which a closed cell cavity having a controlled size and uniformity is typically formed. Various illustrative embodiments of the invention are described. Various modifications and changes may be made without departing from the spirit and scope of the invention. Therefore, it is to be understood that the embodiments of the invention are not limited to the exemplified embodiments described below, but are limited by the scope of the claims and any equivalents thereof. Referring now to Figure 2, the porous polishing pad 2a comprises a flexible layer 1a and a porous polishing layer 2a disposed on the side of the flexible layer (i.e., a major surface of the flexible layer). A support layer 8a, optionally selected, is interposed between the porous polishing layer 12a and the flexible layer 10a, which can be used in some embodiments of the porous polishing pad and method of the present invention. The porous polishing layer comprises a crosslinked network structure, polymer particles dispersed in the interconnected network structure, and dispersed in the crosslinked networked junction holes: as compared to removing one of the components of the polishing crucible during polishing to be shaped by erosion or The polishing pad and method of the present invention, the polishing pad according to the present invention is porous prior to the start of the polishing process. Exemplary polymer particles in the polishing layer can include thermoplastic polymer particles, thermoset polymer particles, and mixtures thereof. The term "thermoplastic polymer" means a composite material that is substantially non-crosslinking and does not substantially form a three-dimensional network structure. The term "thermosetting" refers to a polymer that is at least substantially crosslinked, wherein the polymer has substantially a three-dimensional network structure. In the case of (4), the polymer particles may be selected such that after heating (IV) UU, (ie, there is minimal plastic flow at the boundary of the polymer particles and at 153112.doc 201130656 the polymer particles of the polishing pad of the present invention There is almost no grain coalescence between the particles. In the example, when the polymer particles of the crucible contain a micro: thermoplastic polymer, a polishing crucible can be prepared below the melting point or sintering point of the microparticulate thermoplastic polymer. In other embodiments, the polymer particles comprise (iv) a solid polymer. The polymer particles useful in the practice of the invention can be prepared by a variety of methods, such as condensation reactions, free radical initiated reactions, or combinations thereof. In other embodiments, the polymer may comprise an interpenetrating polymer network formed by stepwise or simultaneous condensation and free radical polymerization. In the present invention, the torsion "interpenetrating polymer network structure" () refers to a combination of two polymers in the form of a network structure, at least one of which is in the other Synthetic or cross-linking in the presence of direct. Usually, in (iv), there is no induced covalent bond between the two polymers. Thus, in addition to mechanical blending and copolymerization, /ΡΝ represents another mechanism by which different polymers can be physically combined. The polymer particles can be prepared by various methods. In some embodiments, the bulk polymer can be cryogenically milled and classified into the desired particle size range. The shape of the polymeric particles can be regular or irregular and can include the following forms: bodies, fibers, disks, flakes, and any combination or mixture thereof. In the embodiment: the polymer particles are substantially spheres. The term "substantially jade" means that the particles have a sphericity of at least 0.75 (in some embodiments, at least 0.85, 〇9, 〇95, 〇96, 〇97 or (4)). In one, 'the polymer particles are fibers. Fibres useful in the practice of the invention typically have at least, for example, at least 2:1, 3:1, 4:1, 5:1, 10.1, 25:1, 5〇·ι, 7<·ι • ”, 100:1 Or larger) aspect ratio (ie, 153IJ2.doc 201130656 longest dimension pair minimum 2:1 to 100:1 ratio). Fibers useful in the practice of the invention may have a cross-section in the range of 5:1 to 75:1 or 1〇:1 to 5〇:1. In some embodiments, the polymer particles may have at least 5 (in some embodiments) Average to 7, 5, 15, 20, 25, 40, or 50) micrometers In some embodiments, the polymer particles can have up to 5 (9) (in one embodiment, at most _, 30 〇, 200) Or the average particle size of _micron is the diameter of the particle; however, in the embodiment where the particle is not a sphere (for example, fiber), the particle size may refer to the largest size of the particle. To determine the average particle size of the polymer particles. For example, light scattering techniques such as the Coulter LS particle size analyzer manufactured and sold by Beckman C〇uher Inc. Particle size. As used herein and in the scope of the patent application, "particle size" means the particle diameter or maximum size based on volume percent, as determined by light scattering using a Coulter Counter LS particle size analyzer. In the technology, the particle system is determined from the hydrodynamic radius of gyration. Regardless of the actual shape of the particles. "Average" particle size is based on the average volume percentage of particles of linear live Example In some embodiments consistent 'particles are particularly fibers, the web

Dimensions up to about 600, 500 or 450 microns (30, 35 or 40 mesh (U S

The maximum particle size of Mesh)) is determined by conventional screening techniques. By way of example, in some embodiments, at least 97%, 98%, or 99% of the fibers pass through a screen having apertures of 600, 500, or 400 microns (30, 35, or 40 mesh). In some embodiments, the polymer particles are highly uniform. In some embodiments, the non-uniformity of the size of the polymer particles is at most 75% (in some embodiments, I53112.doc -11 - 201130656, in some embodiments, up to 70 〇 / 〇, 65%, 60 〇 / 〇, 55 ./〇 or 50〇/〇). Particle size non-uniformity refers to the standard deviation of the particle size divided by the average particle size multiplied by 1 〇〇. In some embodiments, the polymer particles are substantially solid. As used herein, the term "substantially solid" means that the particulate polymer is not hollow, for example, the polymeric particles are not in the form of hollow microcapsules. However, in some embodiments, substantially solid polymer particles may contain trapped bubbles. Suitable polymer particles include polyethylene, polyvinyl fluoride, polyethylene, polypropylene, nylon, polycarbonate, polyester, poly(meth)acrylate, polyether, polyamine, polyurethane vinegar Polyepoxides, polystyrenes, polyimines (such as polyetherimine), polysulfones, and mixtures thereof. In some embodiments, the polymer particles can be selected from the group consisting of poly(methyl) acrylate vinegars, polyurethanes, polyepoxides, and mixtures thereof. In some embodiments, the polymer particles comprise water soluble particles. Exemplary useful water soluble particles include those derived from sugars (eg, polysaccharides such as dextrin, cyclodextrin, dinosaur, glycerol, and lactose), cellulose (eg, propylcellulose and methylcellulose), proteins, Granules made of polyethylene glycol, polyvinylpyrrolidine _, polyacrylic acid, polyethylene oxide, water-soluble photosensitive resin, canned polyisoprene, synthetic polyisoprene and any combination thereof: in some The implementation of the polymer particles contains cellulose. In some of these embodiments, the polymer particles comprise methylcellulose. Even though the polymer particles comprise water soluble particles in these embodiments, the #forming polishing layer" or the like particles can still form pores in the polishing layer. It is not necessary to dissolve the working liquid of the particles during polishing to form pores. In some embodiments, the polymer particles comprise a polyurethane, which may be 153112.doc -12· 201130656, for example, from a blocked isocyanate reactant comprising at least two isocyanate groups and/or having at least two blocked isocyanate groups. And a second resin prepared having at least two groups reactive with isocyanate groups. In some embodiments, the first and second resins may be mixed together and polymerized or cured to form a bulk polyamine group. An acid ester, which can then be ground (e.g., cryogenically ground), and optionally classified. In some embodiments, the polymer particles can be slowly poured into the agitated mixture by mixing the first and second resins together. Separating the formed particulate material (eg by filtration) in heated deionized water (as appropriate in the presence of organic cosolvents and/or surfactants) The separated particulate material, and optionally the dried particulate polyamine-based f-acid vinegar, is formed. In another embodiment, there may be: a solvent (eg, an alcohol, a water-insoluble ether, a branched chain, and a linear hydrocarbon, a ketone). , abenz, xylene, and mixtures thereof, the presence of τ to mix isocyanic acid with the hydrogen material. The first resin of the 死 * 例 w w / : : : : : : : : : : : : : : : Sexual monomer, isocyanate functional prepolymer and its exemplary suitable isocyanate (tetra) monomer including aliphatic polyisocyanuric acid; == polyiso-acid vinegar; alicyclic polyiso-acid vinegar; Aromatic polyisocyanuric acid which is not attached to the aryl group of the aryl group, for example, xylene diisyl group is directly bonded to the aromatic polyaryl vinegar of the aromatic ring: by burning oxygen: chemicalizing: Cyanate vinegar (4), rnzirm oximation, imine modification, urea modification and chemistry of the street; and the polymerization and trimerization of these polyacid vinegars 153112.doc 13 201130656 Aliphatic polyisocyanates include ethyl diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate , octadecyl diisocyanate, nona decyl diisocyanate, 2,2·-dimethylpentane diisocyanate, 2,2,4·trimethylhexane diisocyanate, diisocyanate Decylene ester, 2,4,4-trimethylhexamethylene diisocyanate, 1,6,1-undecane triisocyanate, 1,3,6·hexamethylene phthalate, 1,8-Diisocyanato-4-(isocyanatodecyl)octane, 2,5,7-trimethyl-1,8-diisocyanato-5-(isocyanato Methyl)octane, bis(isocyanatoethyl)-carbonate, bis(isocyanatoethyl)ether, 2-isocyanatopropyl-2,6-diisocyanatohexanoic acid Ester, lysine mono-ocyanate methyl acetonate, leuco-trisocyanate succinate S and mixtures thereof. Exemplary suitable ethylenically unsaturated polyisocyanates may include butylene diisocyanate and 1,3-butadiene -1,4-diisocyanate. Exemplary suitable alicyclic polyisocyanates include isophorone diisocyanate, cyclohexane diisocyanate, methylcyclohexane diisocyanate, bis(isocyanatomethyl)cyclohexane, bis(isocyanato ring) Hexyl) decane, bis(isocyanatocyclohexyl)_2,2-propane, bis(isocyanatocyclohexyl)·1,2-ethane, 2-isocyanatomethyl-3-(3) -isocyanatopropyl)-5-isocyanatodecyl-bicyclo[2.2.1]-heptane, 2-isocyanatomethyl-3-(3-isocyanatopropyl)- 6-Isocyanatomethyl-bicyclo[2.2.1]-heptane, 2-isocyanatomethyl-2-(3-isocyanatopropyl)-5-isocyanatodecyl- Bicyclo[2.2.1]-heptane, 2-isocyanatomethyl-2(3-isocyanatopropyl)-6-isocyanatomethyl-bicyclo[2.2.1]-heptane 2-isocyanatomethyl-3-(3-isocyanatopropyl)-6-(2-isocyanatoethyl)-bicyclo[2 2丨]-heptane, 2-isocyano Acid fluorenyl-2-(3-isocyanatopropyl)-5-(2-isocyanatoethyl)-bicyclo[2.2.1]-heptane, 2-isocyanatomethyl group 2_(3_isocyanatopropyl 153112.doc -14, 201130656 base)-6-(2-isocyanatoethyl)-bicyclo[m]-heptane Mixtures thereof. Exemplary aromatic polyisocyanates in which the isocyanate group is not directly bonded to the aromatic ring include bis(isocyanatoethyl)benzene, α,α,α',α'-tetramethylxylene diisocyanate, 1 , 3-bis(1-isocyanato-i.methylethyl)benzene 'bis(isocyanatobutyl)benzene, bis(isocyanatodecyl)naphthalene, bis(isocyanatosyl) Diphenyl ether, bis(isocyanatoethyl) phthalate, mesitylene triisocyanate, 2,5 _ (isocyanatomethyl) mixture. Illustrative suitable aromatic polyisocyanates having an isocyanate group bonded directly to the aromatic ring include a diisopropyl cyanide ester, an ethyl stearate diisocyanate, an isopropyl phenyl diisocyanate, a diisocyanate Dimethyl phenyl phenyl ester, diethyl phenyl diphenyl phthalate, diisopropyl phenyl diisocyanate, trimethyl benzene triisocyanate, benzene triisocyanate, naphthalene diisocyanate, decyl naphthalene diisocyanate Sour vinegar, biphenyl diisocyanate, o-toluidine diisocyanate, 4,4,-diphenylmethane diisocyanate, bis(3-methyl-4-isocyanatophenyl)decane, bis(isocyanocyanate) Acid phenyl)ethylene, 3,3'-dimethoxy-biphenyl-4,4,-diisocyanate, triphenylmethane triisocyanate 'polymerized 4,4,-diphenylnonane II Isocyanate, naphthalene triisocyanate, diphenylmethane-2,4,4,-triisocyanate, 4-methyldiphenylmethane_3,5,2,4,6'-pentaisocyanate, Phenyl ether diisocyanate, bis(isocyanatophenyl ether) ethylene glycol, bis(isocyanatophenyl ether)-1,3-propanediol, benzophenone diisocyanate, carbazole diisocyanate vinegar Ethylcarbazole diisocyanate, two gas carbazole diisocyanate and mixtures thereof. In some embodiments, the first resin comprising at least two isocyanate groups is selected from the group consisting of α,α'-diphenylene diisocyanate, α,α,α,,α|-tetradecyl xylene 153112.doc -15 · 201130656 Group of diisocyanate, isophorone diisocyanate, bis(isocyanatocyclohexyl)methane, toluene diisocyanate, 4,4·-diphenylmethane diisocyanate and mixtures thereof. In some embodiments, the first resin having at least two isocyanate groups may comprise an isocyanate functional polyurethane prepolymer. Isocyanate functional polyaminophthalate prepolymers can be prepared by a variety of conventional techniques. In some embodiments, at least one polyol (such as a diol) and at least one ionic acid-functional monomer (such as a diisocyanate monomer) can be reacted together to form a polyaminocarboxylic acid having at least two isocyanate groups. Ester prepolymer. Exemplary suitable isocyanate functional monomers include the aforementioned isocyanate functional monomers. Suitable isocyanate functional polyurethane prepolymers useful in the practice of this invention can have molecular weights that vary over a wide range. In some embodiments the 'isocyanate functional polyurethane prepolymer may have a number average molecular weight (Μη) of from 5〇〇 to 15,000 or from 500 to 5000, such as, for example, by using a polystyrene standard. Determined by analysis (GPC). Exemplary polyols useful in the preparation of isocyanate functional polyaminophthalate prepolymers include linear or branched alkane polyols such as 1,2, ethylene glycol, 1,3-propanediol, 1,2-propanediol. , i, 4-butanediol, 1,3-butanediol, glycerin, neopentyl glycol, trimethylolethane, trimethylolpropane, di-trihydroxydecylpropane, erythritol, Isopentanol and di-isopentaerythritol; poly-alkylene alcohols such as ethylene glycol, tri-ethylene glycol and tetra-ethylene glycol, and di-propylene glycol, tri-propylene glycol and tetra-propylene glycol; a cyclic polyhydric alcohol such as cyclopentanediol, cyclohexanediol, cyclohexanetriol, cyclohexanedimethanol, hydroxypropylcyclohexane 153112.doc •16-201130656 alcohol and cyclohexane diacetate; Aromatic polyols such as dihydroxybenzene, benzenetriol, hydroxy benzyl alcohol and dihydroxytoluene; bisphenols such as 4,4'-isopropylidenediol (bisphenol A); 4,4,-oxyl Bisphenol, 4,4,-dihydroxydibenzophenone, 4,4,-thiobision, phenolphthlalein, bis(4-phenylene) calcination (bisphenol F), 4,4 ,-(1,2·ethylenediyl)bisphenol and 4,4,-sulfonyl double Phenol; halogenated bisphenols such as 4,4,-isopropylidene bis(2,6-dibromophenol), 4,4,-isopropylidene bis(2,6-diphenol) and 4,4 '-Isopropyl bis(2,3,5,6-tetraqi); alkoxylated bisphenols, such as having one or more alkoxy groups (such as ethoxy, propoxy, alpha-) Alkoxylated 4,4'-isopropylidenes of butoxy and β-butoxy); and dicyclohexanol, which can be prepared by hydrogenation of the corresponding bisphenol, such as 4,4'- Isopropyl-bicyclohexanol, 4,4,-oxydicyclohexanol, 4,4,-thiobicyclohexanol and bis(4-hydroxycyclohexanol)decane. Other examples of suitable polyols useful in the preparation of isocyanate-functional polyaminophthalate prepolymers include high carbon number polyalkylene glycols, such as having a number average molecular weight (Μη) of from 2 to 2000 g/mole. Polyethylene glycol; an acrylic acid compound having a hydroxyl group, such as a copolymer of (mercapto) acrylate and a hydroxy functional (meth) acrylate, such as methacrylate and methyl methacrylate a hydroxyethyl acrylate copolymer; and a hydroxy-functional polyester such as those formed by the reaction of a diol such as butylene glycol with a diacid or a diester such as adipic acid or adipic acid monoethyl hydrazine. In some embodiments, the polyols useful in the practice of the invention may have a number average molecular weight (?n) of from 200 to 2000 grams per mole. In some implementations, you can make a heterogeneous 153IJ2.doc 201130656 ester function by reacting a di-isocyanoguanidine such as f $ diiso-acid vinegar with a polyalkylene glycol such as poly(tetrahydrofuran). Polyurethane prepolymer. In some embodiments, an isocyanate functional polyurethane prepolymer can be prepared in the presence of a catalyst. In some embodiments, a polyol and an isocyanate functional monomer are used. The amount of catalyst used may be less than 5% by weight, or less than 3% by weight, or less than 1% by weight, based on the total weight of the body. In some embodiments, exemplary suitable catalysts include stannous adducts of organic acids. , such as stannous octoate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin thiolate, dibutyltin dimaleate, dimethyltin diacetate, dinonyltin dilaurate, 1,4- Diazodicyclo[2.2.2]octane and mixtures thereof. In other embodiments, the catalyst may be zinc octoate, hydrazine or iron acetylacetonate. Other exemplary suitable catalysts include tertiary amines such as triethyl ethane. Amine, triisopropylamine and N,N-didecyl Amine. In some embodiments 'for a polyamine phthalic acid S that can be used to make polymer particles, the first resin having at least two isocyanate groups comprises at least two blocked isocyanate groups. Blocked isocyanate compound. The term blocked isocyanate compound refers to a terminal and/or pendant blocked isocyanate group which is convertible to a deblocked (ie free) isocyanate group and which separates or releases the capping group. Monomer or prepolymer. Any of the foregoing examples of suitable isocyanate compounds. Exemplary non-short-acting capping groups that can be blocked with blocked isocyanates include 1H-sitting, such as 1H-imidazole, 1H-indole ratio beta, 3,5-dimethyl -1Η·pyrazole, 1Η-1,2,3-triazole, 1Η-1,2,3-benzotriazole, 1Η·1,2,4-triazole, 1Η-5-mercapto_1, 2,4-triazole and 1Η-3-aminol_1,2,4_2°, internal amine, such as e_caprolactam and ketone; morphine, such as 3-aminopropylmorpholine; And the hydroxy group is stupid diimine. Blocked isocyanic acid 1531I2.doc • 18· 201130656 Exemplary short-acting blocking groups for vinegar compounds include alcohols such as propanol, isopropanol, butanol, isobutanol, tert-butanol and hexanol; An alkylene glycol monoalkyl group, such as ethylene glycol monoalkyl ethers (such as ethylene glycol monobutyl ether and ethylene hexyl hexyl ether) and propylene glycol monoalkyl ether (such as propylene glycol monomethyl ether); Ketone oxime, such as methyl ethyl ketone oxime. Without wishing to be bound by any theory, it is believed that the inclusion of a blocked isocyanate material in a first resin having at least two isocyanate groups can result in the formation of a covalent bond at: (a) in the particulate polyaminophthalate particles Between at least a portion thereof; and/or (b) between at least a portion of the particulate polyurethane and at least a portion of the interconnected network structure. In some embodiments, the blocked isocyanate compound is present in an amount such that the amount of the first resin blocked isocyanate group is at least 5 mole percent, or at least 10 moles, based on the total moles of free isocyanate and blocked isocyanate groups. %, or less than 4 〇 mol %, or less than 5 〇 mol % 0 The second resin having at least two groups reactive with isocyanate groups may be selected from a variety of materials. In some embodiments, the second resin has a functional group selected from the group consisting of a hydroxyl group, a sulfhydryl group, a primary amine, a secondary amine, and combinations thereof. An exemplary suitable second resin comprises the aforementioned polyol. In some embodiments, the second resin, which may have at least two groups reactive with isocyanate groups, comprises a polyamine. Exemplary polyamines include ethylamine, such as ethylenediamine (EDA), diethylidene triamine (DETA), tri-ethyltetramine (TETA), tetraethylamamine (TEPA), and pentaethylene Hexaamine (PEHA), piperazine, diethylenediamine (DEDA) a2_amine small ethyl piperazine. Other exemplary suitable polyamines include one or more of the dialkylmethylamines 153112.doc •19·201130656 isomers such as 3,5-dimethyl-2,4-toluenediamine, 3,5 - dimethyl-2,6-toluenediamine, 3,5-diethyl-2,4-toluenediamine, 3,5-diethyl-2,6-nonylphenylenediamine, 3,5· Diisopropyl-2,4-toluenediamine, 3,5-diisopropyl-2,6-nonylphenylenediamine, and mixtures thereof. In some embodiments, the polyamine can be selected from the group consisting of methylene diphenylamine, propylene glycol bis(p-aminobenzoate), and amine terminated oligomers and prepolymers. In some embodiments, a suitable polyamine can be selected from the group consisting of 4,4'-methylene-bis(dialkylaniline) (eg, 4,4--indenylene-bis(2,6-dimethyl) Aniline), 4,4,-decylene-bis(2,6-diethylaniline), 4,4'-methylene-bis(2-ethyl-6-mercaptoaniline), 4,4 '-Amidino-bis(2,6-diisopropylaniline), 4,4'-methylene-bis(2-isopropyl-6-mercaptoaniline), 4,4·-Aa Polyamines of bis-bis(2,6-diethyl-3-haloaniline) and mixtures thereof. In some embodiments, the particulate polyurethane may be prepared from a first resin comprising at least two isocyanate groups and a second resin comprising at least two groups reactive with isocyanate in the presence of a catalyst. Suitable catalysts include those listed above for the preparation of isocyanate functional polyurethane prepolymers. In some embodiments, the isocyanate group and, optionally, the blocked isocyanate group have a molar equivalent ratio of from 0.5: 1.0 to 1.5: 1.0, such as oxime, for isocyanate-reactive groups useful in the preparation of particulate polyaminophthalic acid esters. • 7:1. 〇 to 1.3:1.0 or 0.8:1.0 to 1,2:1.0. In some embodiments, the crosslinked polyaminophthalic acid ester can be prepared by using a second resin that is less than the stoichiometrically required amount such that the amine phthalate or urea linkage will react with the remaining isocyanate. In other embodiments, partial substitution of a difunctional compound with a trifunctional compound 153112.doc -20·201130656 will result in a more thermally stable chemical crosslink. Some useful particulate polyurethanes are commercially available, for example, from Dainichiseika Color & Chemicals Mfg. Co., Ltd. Advanced Polymer Group (Tokyo, Japan) under the trade name "DAIMIC-BEAZ", grade "UCN-5350D". "UCN-5150D" and "UCN-5070D"; Polyurethane S particles can be purchased from Negami Chemical Industrial Co., Ltd. (Nomi-city, Japan) under the trade name "ART PEARL"; Thermoplastic polyamino phthalates of aliphatic polyethers are available, for example, from Bayer

Corporation is commercially available under the trade name "ΤΕΧΙΝ". In some embodiments, suitable polymeric particles useful in the practice of the invention include particulate polyepoxides. The particulate polyepoxide can be prepared, for example, from a first resin having at least two epoxy groups and a second resin having at least two groups reactive with the epoxy group of the epoxide. In some embodiments, the first resin comprising at least two epoxy groups can be mixed with the second resin and polymerized or cured to form a bulk polyepoxide and then the block polyepoxide can be ground ( For example, low temperature grinding) or as appropriate. In some embodiments, the particulate polyepoxide can be formed by slowly mixing the epoxide together with the hydrogen functional material and slowly pouring the mixture into heated deionized water under agitation. The particulate material (e.g., by filtration), the dried particulate material is dried, and the dried particulate polyepoxide is optionally classified. Suitable epoxide linear materials useful in the practice of this invention in some embodiments include epoxide functional monoterpenes, epoxide functional prepolymers, and combinations thereof. Exemplary suitable epoxide functional monomers may be included in 153112.doc • 21 - 201130656 including aliphatic polyepoxides such as (10) dicyclooxybutane, dicyclooxyoctane; cycloaliphatic poly Epoxides such as U,4,5-dicyclooxycyclohexanium, 1,2,5,6-dicyclooxycyclooctane, 7-oxa-bicyclo[4 Geng-3-carboxylic acid 7-oxabicyclo[41〇]glycol-3-ylyl, 1>2-epoxy-4·epoxyethyl·cyclohexene and 23(epoxypropyl)cyclohexane; An aromatic polyepoxide, such as bis(4-diphenyl)methane diglycidyl; gasified bis-A epoxide; and mixtures thereof. The epoxide functional monomers useful in the present invention are typically prepared by the reaction of a polyol with an epidentate alcohol such as a surface alcohol. Polyols which may be used to prepare the epoxide functional monomer include those previously described herein for the preparation of the isocyanate functional prepolymer. Suitable types of epoxide functional monomers include those prepared by the reaction of double expectant with epigas alcohol (for example, the reaction of 4, isopropylidenediol and epigas alcohol to form 4,4'-sub-different Propyl diol diglycidyl ether). In some embodiments, epoxide functional prepolymers useful in the preparation of particular epoxides can be prepared by reacting a polymeric polyol with a surface gas alcohol. Exemplary suitable polymeric polyols may include polyalkylene glycols such as polyethylene glycol and polytetrahydrofuran; polyester polyols; polyurethane polyols; poly((meth)acrylate) polyols ; and mixtures thereof. In some embodiments of the invention, the epoxide functional prepolymer may comprise an epoxide functional poly((meth) acrylate) polymer which may be derived from (mercapto) acrylate monomers and epoxides Prepared from a functional free-radically polymerizable monomer such as glycidyl (meth) acrylate, suitable epoxide functional prepolymers can have a wide range of molecular weights. In some embodiments, the epoxide functional prepolymer may have a molecular weight of from 500 to 15, in grams per mole, 153112.doc -22 to 201130656 or from 500 to 5000 grams per mole, as by, for example, It was determined using a polystyrene standard for gel permeation chromatography (GPC). The second resin having at least two groups reactive with the epoxide may comprise at least one of a benzyl group, a sulfhydryl group, a slow acid, a primary amine or a secondary amine. In some embodiments, the second resin can include the polyols previously described herein. In other embodiments, the second resin can include a polyamine as previously described herein. In some embodiments, suitable polyamines can include polyamido prepolymers having at least two amine groups selected from the group consisting of primary amines, secondary amines, and combinations thereof. Suitable exemplary polyamido prepolymers can be obtained, for example, from c〇gnis Corporation, Coating & Inks Division (Monheim, Germany) under the trade name "versamid". In some embodiments, the particulate epoxide can be prepared from a first resin comprising at least two epoxy groups and a second resin comprising at least two groups reactive with the epoxide in the presence of a catalyst. Exemplary suitable catalysts include tertiary amines such as triethylamine, triisopropylamine, tri-tert-butylamine, tetra-glycolic acid, and N'N-dimethylbenzylamine. In some embodiments, the catalyst can be incorporated into the second resin prior to combining the second resin oxime epoxide functional material. In some embodiments, the amount of catalyst used may be less than 5% by weight, or less than 3% by weight or less than 1% by weight, based on the combined weight of the first and second resins. The molar equivalent ratio of the epoxide-reactive group of the reactant used to prepare the particulate cross-linked polyepoxide is usually from 〇5:1 〇 to 211 你, such as 0.7:1.0 to 1.3:1 〇 or 〇.8:1.0 to 1.2:1.0. EXAMPLES In some embodiments, the first resin and/or the second resin having at least two isocyanate groups or at least two 153112.doc -23-201130656 epoxy groups may optionally contain known conventional additives. Examples of such additives include heat stabilizers, antioxidants, mold release agents, static dyes, pigments, toughening additives (such as epoxidized phenyl benzoate and poly(alkylene glycol) dibenzoate) And a surfactant (such as an ethylene oxide / propylene oxide block copolymerization surfactant). In some embodiments, the levels of the additives may add up to 10% by weight, or up to 5% by weight, or up to 3% by weight, based on the total weight of the combined first and second resins. Other polymer particles useful in the practice of this invention include thermoplastic poly(meth)acrylates which are available, for example, from R0HM America, Inc.

(Lawrence Ville, Ge〇rgia) is commercially available under the trade name "R〇HAD〇N" and from Negami Chemical Industrial C., Ud under the trade name "ART PEARL". Other polymer particles useful in the practice of the invention include cellulose particles' which may be, for example, from D0w Chemieal C() mpany (Midland>

Michigan) is available under the trade name "METHOCEL". The amount of polymer particles in the polishing pad of the present invention can vary. Interestingly, it has been found that, in some embodiments, the amount of polymer particles mixed using a particular technique affects the porosity of the resulting polishing layer in an unexpected manner. For example, when using a combination of rotating and rotating mixers, we have found that a particle content of up to 20% by weight provides a pore size compared to a particle content of up to 15% by weight. However, other mixing techniques can provide different results. In some embodiments, the polymer particles are present in an amount of at least 1% by weight, or at least 25% by weight, or at least 5% by weight based on the total weight of the particulate polymer and the crosslinked network structure. In one example, the polymer particles may be present in an amount of up to 25% by weight, or up to 2% by weight, based on the total weight of the polymer particles and the crosslinked network structure of 153112.doc -24 to 201130656. In some embodiments (including embodiments in which the polymer particles are fibers), the polymer particles may be present in an amount of up to 10% by weight, or up to 5, based on the total weight of the granules and the crosslinked network structure. % by weight, or less than 5% by weight. Advantageously, the polymer particles in the form of fibers provide a suitable degree of porosity even at a content of up to 2% by weight, based on the total weight of the polymer particles and the crosslinked network structure. In some of these embodiments, the polymer particles are water soluble fibers (e.g., fluorenyl cellulose fibers). The pores obtained with fluorenyl cellulose fibers are as shown in Tables 1 and 2 of the Examples. The rate is higher than a ti: the degree of porosity obtained by equalizing <spherical polyamine & vinegar granules. Figure 8 (which is a micrograph of a cross-sectional view of the cured composition of Example 12) and Figures 7A and 7B (which are respectively A visual comparison between the cross-sectional view of the cured composition of Example 15 and the micrograph of the top view shows that the degree of porosity obtained with 2% by weight of the fiber (Fig. 8) is comparable to the particle weight of 1 ( (Fig. 7a). And the degree of porosity obtained is about the same as in Figure 7B. Incorporating lower levels of particles to obtain the same porosity can be advantageous, for example, to improve the uniformity of distribution of the particles in the crosslinked network structure and to maintain the hardness of the mat surface during polishing. The polishing pad of the present invention comprises a polishing layer comprising polymer particles and a crosslinked network structure. The crosslinked network structure comprises a heat curing component and a radiation curing component. A plurality of suitable polymers can be used to form a crosslinked network structure. In some embodiments, the 'thermosetting component comprises at least one of a polyamino phthalate, a polyepoxide, or a polyepoxide modified with ruthenium carbazate. 153112.doc •25· 201130656 Ben Crosslinking of invention The structure is usually deposited in the polymer particles: in the embodiment, when the heat curable resin composition and the radiation curable resin composition are in the presence of the polymer particles, the composition is reactive. Forming a cross-linked network structure. In some embodiments, the polishing layer disclosed herein may comprise at least 75% by weight, or at least 80% by weight, or at least, based on the total weight of the polymer particles and the cross-linked network structure. 85 wt% of the cross-linked network structure. In some of the two embodiments, the cross-linked network structure may be up to 99% by weight, or at most 95% by weight, or at most 9 以 based on the total weight of the polymer particles and the cross-linked network structure. An amount of weight ° / 〇 is present in the polishing layer. The crosslinked network structure can be prepared by a conventional polymerization technique. In some embodiments, the crosslinked network structure can be formed by a condensation reaction, a free radical initiator, or a combination thereof. In some embodiments, the heat curing component may comprise a polyurethane formed by condensation of a heat curable resin composition comprising a polyurethane urethane prepolymer with a polyamine. In some embodiments, the foreshing curing component may comprise an aminocarboxylic acid formed by polymerization of an amino phthalate diacrylate or urethane bis- decyl acrylate in the presence of a photoinitiator. Ester-polyacrylate or amino phthalic acid vinegar polymethyl acetonate. In some embodiments, the cross-linked network structure is an interpenetrating polymer network formed by progressive or simultaneous thermal curing and radiation curing polymerization. In some embodiments, the radiation curable component (in some embodiments, a polyacrylate or polymethacrylate) is covalently bonded to the thermally curable component, for example, via a urethane or urea linkage group. Suitable heat curable resin compositions useful in the practice of the present invention may include 153112.doc -26· 201130656 monomers, prepolymers, and mixtures thereof. In some embodiments, the heat curable resin composition can contain a catalyst, a crosslinking agent, a curing agent, a solvent, and other conventional additives known in the art. In some embodiments, the heat curable resin composition comprises a first resin having at least two isocyanate groups (which may also be blocked isocyanate groups) or at least two epoxy groups; and having at least two isocyanates and a second resin of a group reactive with an epoxide (for example, a hydroxyl group, an amine group, a carboxyl group or a thiol group). Exemplary suitable first and second dendrimers to tau that may be used to prepare the thermally curable component are selected from the isocyanates (including prepolymers), blocked isocyanates previously described herein with respect to the microparticulate polycarbazide. , polyols and polyamines. When the first and second resins are combined, the use of a blocked isocyanate can, for example, delay the onset of gelation, thereby allowing for a longer period of time for mixing the first and second resins with the polymer particles. Some isocyanate prepolymers which can be used as the first resin are commercially available, for example, from the isocyanate prepolymer available from Air Products and Chemicals, Inc. (Allentown, PA) under the trade designation "AIRTHANE PHP-75D". Some diamines that can be used as the second resin are commercially available, for example, from the Air.

Products and Chemicals, Inc. Oligomer diamines available under the trade names "veRSALINK P250" and "VERSALINKP650". In some embodiments, a radiation curable resin and a heat curable resin comprising a first resin having at least two isocyanate groups and a second resin having at least two groups reactive with isocyanate groups are included The composition may further comprise a catalyst. Exemplary suitable catalysts 153112.doc -27- 201130656 may include those previously described herein for the preparation of particulate polyamino phthalates (eg, tertiary amines such as triethylamine and organometallics such as dibutyltin dilaurate) Compound). In some embodiments, the catalyst can be incorporated into the second resin prior to combining the first and second resins. In some embodiments, the amount of catalyst may be less than 5% by weight, or less than 3% by weight, or less than i% by weight, based on the total weight of the combined first and second resins. The molar equivalent ratio of the isocyanate group in the first and second resins and, optionally, the blocked isocyanate group to the isocyanate-reactive group may be 〇5:1〇 to 2·〇:1·0, or 0.7: 1.0 to 1.3:1.0, or 〇8:1 〇 to 12:1 〇. In some embodiments, the thermally curable component can be obtained by reacting a first resin having at least two epoxy groups with at least two groups reactive with an epoxy group (eg, a hydroxyl group, an amine group, a carboxyl group, or a sulfhydryl group) The second resin is reacted to prepare. An exemplary suitable first resin having at least two epoxy groups and a second tree comprising epoxides and polyhydric alcohols as described herein previously for the preparation of particulate polyepoxides Any of them. In some embodiments, the composition comprising a radiation curable resin and a heat curable resin comprising a first and a second resin for preparing a polyepoxide thermosetting component with cerium may further comprise an epoxy Compound ring-opening catalyst. Exemplary suitable catalysts for epoxide ring opening include any of those described above (e.g., tertiary amines such as tri-tert-butylamine and tetrafluoroboric acid). In some embodiments, the catalyst may be added to the first: and second resin prior to mixing the first and second resins. In some embodiments, the amount of the epoxide ring-opening catalyst is based on the total weight of the first and second resins. It may be less than 5 wt/❶ or less than 3% by weight or i wt%. Rings in the first and second resins 153112.doc •28· 201130656 Oxygen to epoxide reactivity Qianmo Mo ## The ratio can be 〇5ι 〇 to mo, or 〇8:1 〇 to i 2 : ι 〇. The heat curable resin may contain conventional additives. Examples of suitable conventional additives include any of the additives previously described herein for the preparation of microparticles. 3⁄4 aminocarboxylic acid brewing and particulate polyepoxides, such as mold release agents, dyes, and Zeng Le Agent. In some embodiments, the additive may be present in an amount of less than 10% by weight, or less than 5% by weight, or less than 3% by weight, based on the total weight of the crosslinked network structure. A conventional additive may be added to, for example, the first or second resin. The porous polishing pad of the present invention comprises a polishing layer having a radiation curable component. The radiation curable component comprises at least one of polyacrylate, polydecyl acrylate, poly(ethylene ether), polyethylene or polyepoxide. In some embodiments, the radiation curable component comprises >, in a polyacrylate or polymethacrylate. The radiation curable component can be prepared from a radiation curable resin comprising at least two acrylate groups, mercapto acrylate groups, vinyl groups (e.g., vinyl, allyl or styrene) or epoxy groups. In some embodiments, the radiation curable resin comprises at least two acrylate groups or methacrylic acid S groups. In some embodiments the 'radiation curable resin may comprise a (fluorenyl) acrylate modified polyfunctional isocyanate material having at least two (fluorenyl) acrylate modified isocyanate groups, which may for example have Terminal and/or pendant isocyanate-based polyurethane prepolymers (such as those described above in connection with the preparation of particulate polyaminophthalate) and isocyanate-reactive The reaction product of a (meth) acrylate of a functional group (for example, a hydroxyl group, an amine group or a fluorenyl group) 153112.doc -29- 201130656. Exemplary suitable hydroxy or amine functional (meth) acrylates include hydroxyalkyl acrylates and methacrylates (eg, 2-hydroxyethyl acrylate (HEA), 2-hydroxyethyl decyl acrylate) (HEMA), 2-hydroxypropyl acrylate, 3-hydroxypropyl acrylate (ΗΡΑ), 2-hydroxypropyl methacrylate, 3-hydroxypropyl methacrylate, 1,3-dihydroxypropyl Acrylate, 2,3-dihydroxypropyl acrylate and mercapto acrylate, 2-hydroxyethyl acrylamide and methacrylamide, 2-hydroxybutyl (meth) acrylate, 4-hydroxyl Butyl (mercapto) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 1,4-butanediol mono(indenyl) acrylate, 2-hydroxyalkyl (fluorenyl) Ethyl decyl phosphate, 4-hydroxycyclohexyl (decyl) acrylate, 1,6-hexanediol mono(meth) acrylate, neopentyl glycol mono(indenyl) acrylate, trimethylol Propane di(meth)acrylate, trihydroxydecylethane bis(indenyl)acrylate, pentaerythritol tris(decyl)acrylate, diisoamyl Alcohol penta(indenyl) acrylate; Ν-alkyl-hydrazine-hydroxyethyl acrylamide and methacrylamide, hydroxyethyl-βcarboxyethyl acrylate, hydroxyhexyl acrylate, hydroxyoctylmethyl Acrylates, polypropylene glycol monomethacrylates, propylene glycol monomethacrylates, caprolactone acrylates, tert-butylaminoethyl methacrylates, and mixtures thereof, many of which are commercially available, for example, Suitable hydroxyethyl acrylates and hydroxypropyl acrylates are commercially available from Dow Chemical (Mid land, Mich) and Osaka Organic Chemical Industry Ltd. (Osaka, Japan). Suitable butyl acrylate acrylates are commercially available from Osaka Organic Chemical Industry Ltd. Applicable base-based polyacetic acid is available from Dow Chemical Company under the trade name 153112.doc -30- 201130656 "TONE MONOMER M-100" and from 〇saka 〇rganic

Chemical Industry Ltd. is constructed under the trade name "VISCOAT 2308". Suitable hydroxy polyether acrylates are commercially available from Bayer Chemicals (Pittsburgh, PA) under the trade designation "ARCOLR-2731". The (mercapto) acrylate acrylate group can be located on the side, end or combination of the prepolymer. In some embodiments, the prepolymer is capped with a (meth) acrylate group. The radiation curable resin can be prepared, for example, by reacting a (meth) acrylate having an isocyanate reactive functional group with a polyisocyanate prepolymer, usually in the presence of an excess of isocyanate. In some embodiments, the (meth)acrylic acid having a isocyanate-reactive functional group is reacted with an isocyanate-reactive prepolymer in an amount such that the isocyanate-functional prepolymer is From about 丨〇% to about 80%, from about 20% to about 70% or from about 30% to about 60% of the isocyanate groups are reacted with a (fluorenyl) acrylate having an isocyanate-reactive functional group. Some (mercapto) acrylate-modified polyfunctional isocyanate materials having at least two (meth) acrylate-modified isocyanate groups are commercially available, for example, from Bayer Materials Science (Pittsburgh, PA). Isocyanate urethane acrylates available under the trade names "DESMOLUX D100", "DESMOLUX VPLS 2396" and "DESMOLUX XP2510". Compositions comprising a radiation curable composition and a heat curable composition typically also include a combination of a photoinitiator or a photoinitiator. Suitable photoinitiators include, for example, "alpha cleavage" photoinitiators, including, for example, benzoin, benzoin acetaldehyde (e.g., alum-based didecyl ketal) 'benzoin ether (e.g., benzoin ethyl ether, benzoin isopropyl ether, and benzoin) Isobutyl ether), hydroxyalkyl benzophenone (eg 153112.doc • 31- 201130656 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl·1 phenyl propyl 丨 ketone and ke (a)-different Propyl phenyl)-2-yl-2-methylpropan-i ketone, benzoylcyclohexanol, dioxy acetophenone derivatives (eg 2,2-diethoxy phenyl) Ketone), mercaptophosphine oxide (eg bis(2,4,6-trimethyl benzhydryl)-phenylphosphine oxide, bis(2,6-dimethoxybenzylidene)-( 2,4,4_trimethylpentyl)phosphine oxide and 2'4'4-dimercaptobenzoyldiphenylphosphine oxide), methylthiophenyl(N-morpholinyl)one (e.g. 2-methyl-1-4 (decylthio) and phenyl_2_(N_morpholinyl)"-acetone) and (N-morpholinyl)phenylaminoketone; hydrogen extraction photoinitiator , which includes light based on benzophenone, oxysulfonium, p-star, benzyl, camphorquinone and coumarinone Hair and co-initiators; and combinations thereof. In some embodiments, the photoinitiator is a mercaptophosphine oxide (eg, bis(2,4,6-trimercaptophenyl)-phenylphosphine oxide, bis(2,6-dimethoxy) Benzopyridinyl;)-(2,4,4-tridecylpentyl)phosphine oxide and 2,4,4-trimethylbenzimidyldiphenylphosphine oxide). The commercially available photoinitiators are exemplified by the following trade names "IRGACURE 369", "IRGACURE 819", "IRGACURE CGI 403", "IRGACURE 651", "IRGACURE 1841", "IRGACURE 29594", "DAR〇CUR 1173" , "DAROCUR 4265" and "CGI1700" are gambling, all from ciba Specialty

Chemicals (Ardsley, Ν·Υ·) purchased. The photoinitiator is preferably present in an amount sufficient to provide the desired rate of photopolymerization. This amount will depend in part on the source, the thickness of the layer to be exposed to the radiant energy, and the extinction coefficient of the photoinitiator at that wavelength. The photoinitiator component will generally be present in an amount of at least about 0.1% by weight, at least about 0.1% by weight, at least about 0.2% by weight, up to about 1% by weight or up to about 5% by weight. 153J12.doc • 32· 201130656 The radiation curable composition and the heat curable composition can be intimately mixed in the composition for use in making the porous polishing pad disclosed herein. In some embodiments, the composition comprises at least about 1 (in some embodiments, at least about 15, 20, 25, 30, or 40) weight percent of the radiation curable composition and up to the total weight of the composition. Approximately 85 (in some embodiments, 'up to about 8 〇, 75, 70, 65, 60, 55, or 50) by weight. / 可 radiation curable composition. In some embodiments, the composition comprises at least about 15 (in some embodiments, at least about 2, 25, 3, 35, 4, 45, 50, 55, or 60, based on the total weight of the composition). And % by weight of the heat curable composition and up to about 9 Torr (in some embodiments, up to about 85, 80 or 75) by weight of the heat curable composition. In some embodiments, the composition comprising the heat curable resin composition, the radiation curable resin composition, and the polymer particles further comprises a surfactant. Similarly, in some embodiments, a crosslinked network structure comprising a thermally curable component and a radiation curable component, polymer particles dispersed in the crosslinked network structure, and a closed gas dispersed in the crosslinked network structure are included The porous polishing layer of the chamber pore further comprises an interfacial activity dispersed in the crosslinked network structure. Examples of the surfactant which can be used for the actual target of the present invention include an anionic surfactant, a cationic surfactant, a nonionic surfactant, and amphoteric Surfactants (eg, zwitterionic surfactants) and combinations thereof. Each of these types of surfactants can include a chemical, feed oxygen, and hydrocarbon based surfactant. Exemplary cationic surfactants include aliphatic ammonium salts. Exemplary suitable anionic surfactants include (iv) salts (eg, fatty acid salts and alkylated acid salts), acid salts (eg, alkyl benzoate, fenyl naphthalate 153112.doc • 33 · 201130656 and 〇 T-olefin sulfonate), sulfate (eg, high carbon alcohol sulfate and alkyl ether sulfate), and phosphate (eg, alkyl phosphate). Exemplary nonionic surfactants include polyoxyethylene Alkyl ethers, ether esters (such as polyoxyethylene ethers of glycerol vinegar), esters (such as polyethylene glycol fatty acid esters, glycerin vinegar, sorbitan esters) and polyoxyxylene glycol copolymers (such as, for example, Available from Air Pr〇dUCtS (Allent〇wn, PennSylvania) under the trade name rDABC®). The surfactant may be present in the composition or polishing layer, for example, up to 10% by weight (in some embodiments, up to 4%, 3%, or 2% by weight), based on the total weight of the composition or porous polishing layer. in. In some embodiments, the surfactant is present in an amount of at least 1%, based on the total weight of the composition or porous polishing layer. The present invention provides a method of making the polished crucible described herein. The method comprises forming pores in a composition comprising a heat curable resin composition, a radiation curable composition, and polymer particles. In some embodiments, the pores are formed in the composition by mixing the compositions. Mixing can be done by a variety of techniques, such as using a machine (4) machine or manual mixing. In some embodiments, the 'mixing process (and machine blender) can include rotation and rotation. As described above, the polymer ribs (4) and the loading amount of the resulting polishing layer are porosity. / In some embodiments, the composition of the sulphuric resin composition and the polymer particles may be mixed and placed on the support floor. The open mold on top of the support layer (e.g., without a top or cover mold) can be used in the desired shape of the (four) (iv) light layer. The mold can be uniformly filled in the mold by means of mechanical means. Suitable mechanical means can be low pressure pressurization or use of compaction rolls. 153112.doc • 34- 201130656 • The method of polishing pad disclosed herein also includes at least partially curing the radiation curable composition and heating the set by exposing the composition to Koda. : 乂 夕 。. [5 minutes to cure the heat curable resin to form a polishing layer. Radiation: Often ultraviolet radiation (i.e., radiation in the range of about 200 nm to about 400 (10)). The amount of H radiation necessary to at least partially cure the composition will depend on a variety of factors including, for example, the angle of exposure to radiation, the thickness of the composition, the amount of polymerizable groups in the composition, and the type and amount of photoinitiator. Typically, a uv light source having a wavelength of from about 2 GG nm to about 4 〇〇 nm is directed to a composition transported on a conveyor system that provides for transmission through a UV source suitable for the radiation absorption profile of the composition. rate. Suitable UV light sources include, for example, ultra-high light, high-pressure lamps, ten waste lamps, low-intensity fluorescent lamps, metal-based lamps, microwave-powered lamps, xenon lamps, and laser beam sources (including, for example, excimer mines) Shooting and chloride ion lasers) and combinations thereof. The composition can then be placed at an elevated temperature of, for example, up to about _, up to about 1:1, up to about 135 ts, or up to about 120 ton (eg, in the range of 80 〇 to 12 〇. 〇, 纯 纯 or 9 代 to _ ° C) Put it in the flood box for a period of time (for example, 30 minutes to 24 hours). Exposure to light shots and heat can be carried out in sequence or simultaneously. In some embodiments, exposure to the light system is performed prior to teaching. The polishing pad of the present invention can have one or more working surfaces, wherein "working surface" as used herein refers to a surface of the polishing pad that is in contact with the surface of the article to be polished. In some embodiments, the item to be polished may be a stone wafer. In some embodiments, the working surface of the polishing crucible can have surface features such as channels, grooves, perforations, and combinations thereof. These surface features can be enhanced by 153112.doc •35- 201130656 with more than one of the following characteristics: (1) the movement of the polishing slurry between the surface of the crucible and the surface of the object being polished; (7) the surface of the abrasive material away from the surface of the object being polished Removal and transport; or (3) Polishing or flattening efficiency of the polishing pad 0 The surface features can be incorporated into the working surface of the polishing pad by various methods. Quality, for example by abrasion or cutting. In other embodiments, the raised features of the surface of the surface of the YS can be used to provide a relief feature during the forming process by embossing features such as '35 in the surface of the surface of the YS. Printed onto the work surface of the mat. The surface features may be distributed on the surface of the polishing pad in a random or uniform pattern. Exemplary surface features may include spirals, circles, squares, cross lines, and honeycomb patterns. In some embodiments, a polishing pad made in accordance with or in accordance with the present invention comprises individual polishing elements that protrude from the support layer. Referring now to Figure 3, an embodiment of a polishing pad 2 is shown that includes a plurality of polishing elements 4, each of which is attached to a support layer 8 as desired. Polishing pad 2 further comprises a flexible layer 1 〇 β. The polishing layer comprising individual polishing elements is typically a continuous layer, but this is not shown in Figure 3. Between the individual polishing elements, the thin crucible can have a thickness of, for example, at most 0.01 mm, 0 02 mm or 0.03 mm. In other embodiments, the polishing layer comprising individual polishing elements can have discontinuities, such as in a film between individual polishing elements. Since the polishing element 4 is attached to the support layer by a film layer (not shown) between the polishing elements 4 in the illustrated embodiment, the polishing element 4 is relative to the other polishing elements 153112.doc • 36-201130656 4 The lateral movement of one or more is limited, but the polishing elements 4 generally remain independently movable on an axis perpendicular to the polishing surface 14 of each polishing element 4. As shown, each of the polishing elements 4 generally has a plurality of apertures 15 distributed substantially throughout the entire polishing element 4. In the embodiment illustrated by Figure 3, the polishing element 4 is shown attached to the first major side of the support layer 8 by, for example, being directly bonded to the support layer 8. The polishing element 4 can be formed and cured directly on the support 8. In other embodiments, the polishing element 4 can be attached to the support layer 8 using an adhesive or directly to the flexible layer 10. In this embodiment, the porous polishing layer is typically a discontinuous layer. In the particular embodiment illustrated by Figure 3, a polishing platen (not shown in Figure 3) that can be used to secure the polishing pad to a CMP polishing device (not shown in Figure 3) is optionally employed. The pressure sensitive adhesive layer 12 is adjacent to the flexible layer 1 相对 opposite the support layer 8. Referring to Figure 4, another exemplary embodiment of a polishing pad 2' is shown, the polishing pad comprising a flexible layer 3 having a first major side and a second major side opposite the first major side; a plurality of polishing Element 24, each polishing element 24 having a pressure bearing region 25 for attaching each polishing member 24 to a first major surface of the flexible layer 30; and a first major surface and a second major surface opposite the first major surface The guide plate 31 is optionally disposed, and the guide plate 31 is positioned to dispose a plurality of polishing elements 24 on the first main side of the flexible layer 3, wherein the first main surface of the guide plate 31 is away from the flexible layer 3'. As illustrated by Figure 4, each polishing element 24 extends from a first major surface/〇 of the guide plate 31 substantially perpendicular to the first direction of the first major side. In the particular embodiment illustrated by Figure 4, each of the perforated polishing elements 24 is also not a plurality of holes 15 having a distribution of the optical elements 24 throughout the (10) optical elements. . Additionally, in the particular embodiment illustrated by Figure 4, three polishing elements 24 are shown and all of the polishing elements 24 are shown as including a porous polishing surface 23 and a porous polishing substantially throughout the entire distribution of the polishing elements 24. element. However, it should be understood that a plurality of polishing elements 24 can be used, and the number of porous polishing elements can be selected from as few as one polishing element up to all of the polishing elements, or any number therebetween. Further, the polishing composition distribution layer 28 selected as appropriate will be described with reference to FIG. During the polishing process, a polishing composition distribution layer 28, optionally selected, assists in distributing the working liquid and/or polishing slurry to the individual polishing elements 24. A plurality of slits 26 extending through at least the guide sheets 31 and optionally the polishing composition distribution layer 28 may also be provided as illustrated by Figure 4. In some embodiments, the guide plate 31 can also serve as a polishing composition distribution layer. As illustrated by FIG. 4, in some embodiments, each polishing element 24 has a pressure bearing region 25, and each polishing element 24 is attached to the second major surface of the guide plate 31 by a corresponding pressure receiving region 25 to The first main side of the flexible layer 3〇. At least a portion of each of the polishing elements 24 extends into the corresponding slit 26, and each of the polishing elements 24 also extends outwardly from the first major surface of the guide plate 31 through the corresponding slit 26. Accordingly, a plurality of slits 26 of the guide plates 31 are used to guide the lateral arrangement of the polishing elements 24 on the support layer 30 while also engaging the pressure-receiving regions 25 to adhere the respective polishing elements 24 to the support layer 30. Thus, during the polishing process, the polishing element 24 is free to be independently displaced in a direction substantially perpendicular to the first major side of the baffle layer 30 while still remaining attached to the flexible layer 30 by the guide plate 31. . In some embodiments 153112.doc • 38- 201130656 'this situation may allow the use of a non-flexible polishing element, such as a porous polishing element having a hole that is only distributed on the polishing surface or only close to the polishing surface. In the particular embodiment illustrated by Figure 4, the polishing element 24 is additionally attached to the first layer of the flexible layer 3 using an optional adhesive layer 34 at the interface between the flexible layer 30 and the deflector 31. Side "However, other bonding methods can be used" include bonding the polishing element 24 directly to the flexible layer 30 using, for example, heat and pressure. In a related exemplary embodiment not illustrated in FIG. 4, a plurality of slits may be configured as an array of slits, wherein at least a portion of the slit 26 includes an undercut region of the main hole and the guide plate 31, and the undercut region is formed. a shoulder protrusion that engages the corresponding polishing element bearing region 25, thereby maintaining the polishing element 24° without the use of an adhesive between the polishing element 24 and the flexible layer 30, as further illustrated by FIG. It is noted that a second optional adhesive layer 36 can be used to attach the optional polishing composition distribution layer 28 to the first major surface of the guide plate 31. Additionally, in the particular embodiment illustrated by Figure 4, a view of a polishing platen (not shown in Figure 4) that can be used to secure the polishing pad 2 to a CMP polishing device (not shown in Figure 4) is shown. The pressure sensitive adhesive layer 32 is selected adjacent to the support layer 30 opposite the guide plate 31. The guide plates and/or distribution layers can also be used in conjunction with the embodiment shown in Figure 3, in which the porous polishing element 4 does not have a pressure bearing area. The support layer 8' can be eliminated in the presence of a guide plate and the porous polishing element can be attached to the flexible layer 10, e.g., using an adhesive. 153112.doc • 39- 201130656 Depending on the intended application, the cross-sectional shape of the polishing elements 4 and 24 (taken through the polishing elements 4 and 24 in a direction generally parallel to the polishing surfaces 14 and 23) can vary widely. Although Figures 3 and 4 show substantially cylindrical polishing elements 4 and 24 having a generally circular cross-section, other cross-sectional shapes are possible and may be desirable in some embodiments. For example, circular, elliptical, triangular, square, rectangular, hexagonal, and trapezoidal cross-sectional shapes may be suitable. For cylindrical polishing elements 4 and 24 having a circular cross section, the cross-sectional diameter of polishing elements 4 and 24 in a direction generally parallel to polishing surfaces 14 and 23 can range from about 50 μm to about 20 mm, in some implementations. In the example, the cross-sectional diameter is from about 1 mm to about 15 mm' and in other embodiments, the cross-sectional diameter is from about 5 mm to about 15 mm (or even from about 5 mm to about 10 mm). For non-cylindrical polishing elements with a non-circular cross section, the size of the polishing element can be characterized using a characteristic dimension of two degrees, width and length. In some exemplary embodiments, the characteristic size may be selected to be from about 0.1 mm to about 30 mm. In other exemplary embodiments, each of the polishing elements 4 and 24 may have a cross-sectional area in a direction generally parallel to the polishing surfaces 14 and 23 of from about i mm 2 to about 1,000 mm 2 , in other embodiments about t 〇 2 to about 5 2 2, and in other embodiments from about 20 mm 2 to about 250 mm 2 . Depending on the intended application, the polishing elements (4 in FIG. 3, Μ in FIG. 4) may be distributed in a plurality of patterns on the main side of the flexible layer (1〇 in FIG. 3, 3〇 in FIG. 4), and The pattern can be regular or irregular. The polishing element can reside on substantially the entire surface of the flexible layer, or there can be areas of the support that do not include I53I12.doc • 40· 201130656 polishing elements. In some embodiments, the polishing element has a total area of the major surface of the flexible layer of from about 3% to about, as determined by the number of polishing elements, the cross-sectional area of each polishing element, and the cross-sectional area of the polishing pad. Average surface coverage of 95% flexible layer. The cross-sectional area of the polishing pad in a direction generally parallel to the major surface of the polishing pad can range from about 100 em2 to about 3 〇〇, 〇〇〇 cm 2 in some exemplary embodiments, in other embodiments It is in the range of about 1 〇〇〇 cm 2 to about 1 〇〇〇〇〇 cm 2 'and in other embodiments is in the range of about 2, 〇〇〇 cm 2 to about 5 〇, 〇〇〇 cm 2 . Prior to the first use of polishing 塾 (2 in Figure 2, 2 in Figure 4) in a polishing operation, in some exemplary embodiments, each polishing element (4 in Figure 3, 24 in Figure 4) ) extending in a first direction substantially perpendicular to the first major side of the flexible layer (1 in FIG. 3, 30 in FIG. 4). In other exemplary embodiments, each polishing element extends in the first direction at least about 0.25 mm above the plane including the guide plate (31 in Figure 4). In other exemplary embodiments, each polishing element extends in the first direction at least about 0.25 mm above the plane including the support layer (1 图 in Figure 3). In other exemplary embodiments, depending on the polishing composition used and the material selected for the polishing element, the polishing surface (14 in Figure 3, 23 in Figure 4) is higher than the polishing element (2 in Figure 3) The height of the base or the bottom surface of 2, in FIG. 4 may be 〇25 mm, 〇5 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, 5.0 mm, 10 mm or more. Referring again to Figure 4, the depth and spacing of the slits 26 throughout the polishing composition distribution layer 28 and the guide sheets 31 may vary as needed for a particular CMp process. 153112.doc • 41 - 201130656 Polishing elements 2 4 with respect to each other and polishing composition distribution layer 28 and guide plates 31 are each maintained in a planar orientation and project above the surface of polishing composition distribution layer 28 and guide plate 31. In some exemplary embodiments, the polishing element (4 in Figure 3, 24 in Figure 4) is higher than the guide plate 31 and any polishing composition distribution layer (28 in Figure 4) or support layer (Figure 3 The volume produced by the extension of 8) can provide space for the distribution of the polishing composition on the surface of the polishing composition distribution layer (28 in Figure 4) or the support layer (8 in Figure 3). The amount of polishing element (4 in Figure 3, 24 in Figure 4) that protrudes south of the polishing composition distribution layer (28 in Figure 4) or the support layer (8 in Figure 3) depends, at least in part, on the polishing element. The material properties and the desired flow of the polishing composition (working liquid and or slurry) on the surface of the polishing composition distribution layer (28 of Figure 4) or the support layer (8 of Figure 3). The guide sheets useful in some embodiments can be formed from a variety of materials such as polymers, copolymers, polymer blends, polymer composites, or combinations thereof. Non-conductive, liquid impermeable polymeric materials are generally preferred and polycarbonates have been found to be particularly useful. The polishing composition distribution layer which may be used in some embodiments may also be formed from a variety of polymeric materials. In some embodiments, the polishing composition distribution layer can comprise at least one hydrophilic polymer. Preferred hydrophilic polymers include polyurethanes, polyacrylic acid vinegars, polyvinyl alcohols, polyoxymethylenes, and combinations thereof. The composite material is preferably porous. More preferably comprises a bubble to be used when compressing the polishing composition distribution layer. The positive pressure of the guide substrate is provided during the polishing operation. Porous or foamed materials having open or closed cells may be preferred in some embodiments. In some particular embodiments, the polishing composition distribution layer has 153112.doc • 42· 201130656 having about 10% and about 90°/. The porosity between. In an alternate embodiment, the polishing composition layer may comprise a water absorbing hydrogel material (such as a hydrophilic urethane) preferably in the range of from about 5% by weight to about 60% by weight for polishing operations. Provides a smooth surface during the period. In some exemplary embodiments, the 'polishing composition distribution layer may distribute the polishing composition substantially uniformly over the surface of the substrate subjected to polishing, which may provide a more uniform polishing. The polishing composition distribution layer may optionally include a flow resistance element. 'such as broadcast boards, grooves (not shown in the figures), holes and the like to adjust the flow rate of the polishing composition during polishing. In other exemplary embodiments, the polishing composition distribution layer can include various layers of different materials to achieve a desired polishing composition flow rate at varying depths from the polishing surface. In some exemplary embodiments, one or more of the polishing elements may include an open core region or cavity bounded within the polishing element, although such an arrangement is not required. In some embodiments, the core of the polishing element can include a sensor to detect pressure, conductivity, capacitance, eddy, as described in International Patent Application Publication No. WO 2006/055720 (T〇rgerson et al.). Current and its similar properties. In some embodiments of the polishing pad and/or method of making the polishing pad disclosed herein, the support layer comprises a flexible and flexible material. The support layer is typically a film which provides a surface on which the composition comprising the heatable resin composition and the light curable resin composition can be cured. In some exemplary embodiments in which the porous polishing layer includes a disturbing optical element, the polishing element can form a single piece of polishing element attached to the support layer with the support layer, at least 153112.doc -43· 201130656 part of the polishing element Porous polishing element. When a polishing pad is used, the cut layer is also used to (4) the flexible layer* is affected by water or other fluids in the polishing composition. Branches (4) are generally impermeable to fluids, but can be used in conjunction with barriers that are optionally used to prevent or inhibit fluid penetration (4). In some exemplary embodiments, the support comprises a polymeric material selected from the group consisting of polyamount, natural rubber, styrene butadiene rubber, butyl rubber, polyurethane, polyolefin, and combinations thereof. The support layer may further comprise a variety of additional materials such as fillers, particulates, fibers, reinforcing agents and the like. In some embodiments, the support layer is transparent. The support layer can be formed, for example, by extruding a film (e.g., polyfluorene, natural rubber, styrene butadiene rubber, butyl rubber, polyurethane phthalate, polyolefin, and combinations thereof) into a film. In some embodiments, the material is commercially available, for example, from Lubrizol Advanced Materials, Inc. (Cleveland, OH) under the trade designation "ESTANE 58887-NAT02" or from Dow Chemical (Midland, MI) under the trade name "PELLETHANE" ( For example, "PELLETHANE 2102-65D") gambling polyurethane. Commercially available films that can be used as a support layer include, for example, the trade names "ST-1882", "ST-l〇35", "SS-3331", "SS-1495L" and "" from Stevens Urethane (Easthampton, Massachusetts). ST-1880" commercially available polyamine phthalic acid vinegar film. In some embodiments of the polishing pad and/or method of making the polishing pad disclosed herein, the flexible layer comprises a flexible and flexible material such as a flexible rubber or polymer. The flexible layer is generally compressible to provide a positive pressure directed to the polishing surface and may, for example, help provide contact uniformity between the polishing pad and the surface of the polished substrate 153112.doc - 44 - 201130656. In some exemplary embodiments, the flexible layer is formed from a compressible polymeric material (e.g., a foamed polymeric material formed from, for example, natural rubber, synthetic rubber, or a thermoplastic elastomer). A closed cell type porous material can be useful. In some embodiments, the flexible layer comprises a polyamino phthalate and can be, for example, a foamed polyurethane or a polyamino phthalate impregnated hair drum. The thickness of the flexible layer can be, for example, in the range of 〇 2 mm to 3 mm. In some exemplary embodiments in which the polishing layer comprises a polishing element, a polishing element having a flexible layer as a monolithic polishing element attached to the flexible layer (which may be a porous flexible layer) may be formed, at least a portion of which comprises a porous polishing element. In some exemplary embodiments, the flexible layer comprises a polymeric material selected from the group consisting of polydecane, natural rubber, styrene butadiene rubber, butyl rubber, polyolefins, polyurethanes, and combinations thereof. The support layer may further comprise a variety of additional materials such as fillers, particulates, fibers, reinforcing agents, and the like. In some embodiments, the flexible layer is fluid impermeable (although the permeable material can be used in conjunction with the support layer described above). Suitable commercially available flexible layers include, for example, the micro-cellular polyurethane phthalate available from Rogers Corp. (Rogers, CT) under the trade designation "PORON", which has, for example, the product name 4701-60-20062-04, 4701-50-20062-04, 4701-40-20062-04. Other suitable flexible layers include those obtained from, for example, the impregnated polyurethanes available from Rodel, Incorporated (Newark, DE) under the trade designation "SUBA IV" and available from Rubberite Cypress Sponge Rubber Products, Inc. (Santa Ana, CA) A bonded rubber sheet available under the trade name "BONDTEX". 153112.doc -45- 201130656 In the embodiments of the polishing pad and/or method of making the polishing pad disclosed herein - in some embodiments, the 'polishing pad can include a window extending through the pad in a direction perpendicular to the polishing surface' or A transparent layer and/or a transparent polishing element is used to allow for optical endpoint detection of the polishing process as described in International Patent Application Publication No. WO 2009/140622 (Bajaj et al.). The term "transparent layer" as used above is intended to include a layer comprising a transparent region which may be formed from the same or a different material than the remainder of the layer. In some exemplary embodiments, at least one of the polishing element, the support floor, the flexible layer, or one of the polishing layer or one of the support layers may be transparent 'or may be applied to the material by applying heat and/or dust to the material And become transparent. In some embodiments, the transparent material can be cast in situ in an aperture suitably positioned in the layer (e.g., using a mold) to form a transparent region (e.g., in a polishing layer, a support layer, or a flexible layer). In some embodiments, the polishing layer is cured in the presence of a pre-formed window to form a transparent region in the polishing layer. In some embodiments, the entire support layer and/or flexible layer may be formed from a material that is transparent or transparent to the energy in the relevant wavelength range utilized by the endpoint detection device. Suitable transparent materials for the transparent elements, layers or regions include, for example, transparent polyurethanes. Additionally, as used above, the term "transparent" is intended to include elements, layers and or regions that are substantially transparent to energy in the relevant wavelength range utilized by the endpoint detection device. In some exemplary implementations, the endpoint detection device uses one or more sources of electromagnetic energy to emit radiation in the form of ultraviolet light, visible light, infrared light, microwaves, radio waves, combinations thereof, and the like. In some embodiments, the term "transparent" means at least about 25% (eg, at least about 35%, at least about 50%, at least about 60%) of the energy of a wavelength associated with 153112.doc-46-201130656 on a transparent element. At least about 7%, at least about 8%, at least about 90%, at least about 95% are transmitted therethrough. In some exemplary embodiments, the support layer is transparent. In some embodiments, the polishing layer is transparent. In some exemplary embodiments (including the embodiments illustrated above in Figure 3), at least one of the polishing elements is transparent. In some embodiments, the support layer is transparent, and the polishing layer (e.g., several pieces of polishing) At least a portion is transparent and there is a hole in the flexible layer that is aligned with the transparent portion of the polishing layer. In other exemplary embodiments (including the embodiments illustrated above in Figure 4), at least one of the polishing elements is transparent' and the adhesive layer and the flexible layer are also transparent. In other exemplary embodiments, the flexible layer, the guide sheet, the polishing composition distribution layer, the at least one polishing element, or a combination thereof are transparent. The present invention is further directed to a method of using a polishing crucible as described above in a polishing process comprising: contacting a surface of a substrate with a porous polishing layer of a polishing pad of the present invention and relatively moving the polishing pad relative to the substrate to polish the substrate The surface. In some embodiments, the polished enamel porous polishing layer comprises a plurality of polishing elements, at least some of which are porous. In some exemplary embodiments, a working fluid may be provided to the interface between the polishing pad surface and the substrate surface. Suitable working fluids include, for example, U.S. Patent Nos. 6,23, 592 (Hardy et al.) and 6,491,843 (Srinivasan et al.) and in International Patent Application Publication No. WO 2002/33736 (Her et al.). Said. In some embodiments, the polishing layer in the polishing pad of the present invention and/or the method of the present invention prepared 153112.doc • 47·201130656 may have an average pore size of at least 5 microns, at least 10 microns, or at least 15 microns. In some embodiments, the polishing crucible can have an average pore diameter of at most 100 microns, 75 microns, 50 microns, 45 microns, or 40 microns. For example, the average pore size can range from 5 microns to 1 inch, from 5 microns to 75 microns, from 5 microns to 50 microns, from 5 microns to 40 microns, or from 5 microns to 30 microns. In some embodiments (e.g., including at least one of the surfactants or embodiments in which the polymer particles are fibers), the polishing pad can have an average pore size of up to 30 microns, 25 microns, or 20 microns. The pore size generally refers to the diameter of the pore. However, in embodiments where the aperture is non-spherical, the aperture may refer to the largest dimension of the aperture. In some embodiments, the pore size non-uniformity is in the range of 4% to 75% or in the range of 40% to 60%. In some embodiments, the pore non-uniformity is at most 75%, 70%, 65%, 60%, 55%, or 50%. In contrast, a comparative composition comprising a heat curable composition can have a pore size non-uniformity of greater than 80%, 90% or 100%. In some embodiments, the polishing layer in the polishing crucible of the present invention may have a range of from 5% to 60% or from 5% to 55%, from 10% to 50%/〇 or from 10% to 40%. The porosity in the middle. The difference between the aperture control in the polishing layer of the present invention and in the comparative heat curable composition is illustrated in Figures 5A, 5B, 6A and 6B. 5A and 5B are a cross-sectional view and a micrograph of a top view of the cured composition described in Example 2 of the following examples, respectively. In contrast, Fig. 6a and Fig. 6b are respectively a cross-sectional view of the cured composition of Comparative Example 3 and a micrograph of the top view. Both Example 2 and Comparative Example 3 were prepared using 1% by weight of polymer particles and mixed in the same manner. However, Example 2 was cured by radiation curing and by heat curing, while Comparative Example 3 was cured by heat curing only 153112.doc •48-201130656. The micrographs show that the pores of Example 2 were better controlled than the wells of Comparative Example 3. The data in Table 1 of the following examples also supported that there was a lower size range, lower pore size non-uniformity, and higher hardness in Example 2 than in Comparative Example 3. Without wishing to be bound by theory, the control of pore size and pore size non-uniformity can be related to the hardness of the polishing layer. In some embodiments, the porous polishing layer has a hardness of at least 40 Shore D, 45 Shore D, or 50 Shore D. The hardness can be measured, for example, according to Test Method 2 described in the following examples. In contrast, a comparative composition comprising a heat curable composition can have a hardness of less than 4 angstroms D. Surfactants can be used in the compositions and porous polishing layers disclosed herein, for example, as generally used to reduce pore size and pore size range and enhance pore distribution more than dual curing methods in the absence of surfactant. In other words, the addition of surfactants can help provide better control over pore size distribution and pore size, density, and shape, which can have a positive impact on critical metrics of uniform performance, such as removal rate and in-wafer uniformity. . Figure 7a and the micrographs in Figure (which are respectively a cross-sectional view of the cured composition described in Example 15 in the following example and a micrograph of the top view) illustrate that the addition of the surfactant can be positive for the pore size range and pore distribution. influences. For example, in Example 15, there is a lower pore size range than in Example 2, and Example 2 has the same number of polymer particles and is prepared in the same manner but without an interfacial activator. / An exemplary pad of the present invention will now be described with reference to the following non-limiting examples. 70 153112.doc •49· 201130656 Example material abbreviation or trade name description D100 Isocyanate urethane acrylate PHP-75D available from Bayer Materials Science (Pittsburgh, PA) under the trade name “Desmolux DIOOj Available from Air Products And is an isocyanate prepolymer P250 available from Air Products and Chemicals, Inc. under the trade name "Versalink P250j" available from Air Products and Chemicals (Allentown, PA) under the trade name "Airthane PHP-75D". A mixture of oligo-diamine Ml 690 g of P250 and 430 g of P-650 available from Chemicals, Inc. under the trade name "Versalink P650" is available from Dainichiseika Color & Chemicals Mfg. Co., Ltd. Advanced Polymers Group ( Tokyo, Japan) 35 micron size polyamino phthalate particles 5150D available under the trade name "DAIMIC-BEAZ UCN-5350D" available from Dainichiseika Color & Chemicals Mfg. Co" Ltd-Advanced Polymers Group under the trade name " DAIMIC-BEAZ UCN-5150D" 15 micron size polyamino phthalate particles 5070D available from Dainichiseika Color & Chemicals Mfg 7" micron sized polyurethane granules TPO-L available from Co" Ltd. Advanced Polymers Group under the trade name "DAIMIC-BEAZ UCN-5070D" available from BASF (Florham Park, New Jersey) under the trade name "Lucirin TPO-L" commercially available 2,4,6-trimethylphenylnonylphenylphosphonic acid ether ST-1880 is commercially available from Stevens Urethane (Easthampton, Massachusetts) under the trade name "ST-1880". Aromatic polyurethane film A15LV is available from Dow Chemical Company (Midland, Michigan) under the trade name METHOCEL A15 Premium LV. Methylcellulose DC5604 is available from Air Products Chemicals, Inc. (Allentown, Pennsylvania). Poly' oxime diol copolymer surfactant available under the name "DABCO DC5604" 153112.doc -50- 201130656

Test Method 1: FESEM Followed by a known procedure 'A scanning electron micrograph (top view and cross-sectional view) of an article was obtained using Hitachi S-4500 FESEM available from Hitachi High-Technologies Corporation (Tokyo, Japan). The cross-section of the articles is obtained by cutting with a sharp razor blade. The SEM test was then carried out after subtracting the sample with Au/Pd using conventional techniques. Obtain an image of the cross section and top surface of the item. Test Method 2: Hardness Test Hardness measurement was carried out using a 1 500 type Shore D hardness tester available from Rex Gauge Company, Inc. (Buffalo Grove, Illinois). The values reported in Table i are the average of five measurements, and each measurement is performed for different polishing characteristics of the example. Test Method 3: Aperture determination via optical microscopy Image analysis of optical images obtained with a MM-40 Nikon measuring microscope available from Nikon Instruments, Inc. (Elgin, IL), in combination with Media Cybernetics ( Image-pro plus analysis software purchased by Bethesda, MD) to determine the average pore size, the standard deviation of the pore size (std. Dev.), and the pore size range (the largest pore size observed minus the largest observed pore size. ), aperture non-uniformity (aperture standard deviation divided by average aperture multiplied by 100) and porosity (measurement area of the image consisting of holes divided by the entire area of the image multiplied by 100). Samples were prepared in the following manner prior to optical imaging. Three polishing features were cut from the article and used from 3M Company (St. Paul, Minnesota) under the trade name "3M SCOTCH-WELD Epoxy Potting Compound/ 153112.doc -51 - 201130656

The potting compound obtained from Adhesive DP270 CLEAR was sealed in a phenolic ring (2.5 cm outer diameter x 2.2 cm inner diameter) available from Buehler Ltd. (41, Lake Bluff, Illinois). A six-step process was used at a pressure below 4.25 psi (29.3 kPa) using an Ecotem 3 grinder polisher available from Buehler Ltd., and finely polished using a 120 rpm head and platen speed for all six steps. A feature embedded in an epoxide. In all cases, the specified sandpaper or polishing pad was mounted to the Ecomet 3's jaw by using a pressure sensitive adhesive (psa). Step 1: A grinding disc of 8 inches in diameter and 240 granules obtained under the trade name "3Μ WETORDRY PSA Disc 21366" from 3Μ Company, the grinding time is 3 minutes, and water is used as the grinding fluid. Step 2: An 8-inch diameter, 600-grain disc obtained from Buehler Ltd. under the trade name "CARBIMET 8" PSA Disc 30-5 11 8-600-100, with a grinding time of 6 minutes, using water as the grinding fluid. Step 3: A 8 inch diameter pad obtained from Buehler Ltd. under the trade name "TEXMET 1500 Polishing Pad" 40-8618, polished for 6 minutes, available from Allied High Tech Products, Inc. (Rancho Dominguez, California) A 15 μιη grade polycrystalline diamond suspension of 90-30035 is obtained as a polishing fluid. Step 4: A 8 inch diameter pad obtained from Buehler Ltd. under the trade designation "ΤΕΧΜΕΤ 1500 Polishing Pad" 40-8618, polishing time of 6 minutes, available in 6 μιη grade available from Allied High Tech Products, Inc. Polycrystalline diamond suspension 90-30025 acts as a polishing fluid. Step 5: From Buehler Ltd. under the trade name "ΤΕΧΜΕΤ 1500 Polishing 153112.doc -52- 201130656

The 8" diameter pad obtained by Pad" 40-8618 has a polishing time of 6 minutes, and is available as 3 &1] [1 grade polycrystalline diamond suspension 90-30020 available from Allied High Tech Products, Inc. Polishing fluid. Step 6: A 8 inch diameter pad obtained from Buehler Ltd. under the trade name "TEXMET 1500 Polishing Pad" 40-8618, polishing time of 6 minutes, available on the 1 0111 grade available from Allied High Tech Products, Inc. Polycrystalline diamond suspension 90-30015 is used as a polishing fluid. After polishing, the polished surface of the features was then coated with carbon using conventional techniques using a sputter coater available from Denton Vacuum, LLC (Moorestown, NJ). Optical imaging is then performed. Example 1 Example 1 was prepared by placing 0.28 g of 5350D, 2.15 g of Ml, 1.83 g of PHP-75D, 1.27 g of D100, and 0.06 g of TPO-L in a 50 mL plastic beaker. By placing the beaker in Awat〇ri_

The Rentaro AR-500 Thinky blender (from Thinky Corporation (Tokyo, japan)) and the AR_5 在 in a two-step process mixes the components together. The first step was carried out for 5 minutes under a rotation of 1 rpm and a rotation of 1 rpm. Immediately after the first step, a second step was carried out, which was carried out for 15 seconds under a rotation of 30 rPm and a rotation of 2000 rpm to form a resin mixture. The resin mixture was cast into an aluminum mold formed of an iron plate coated with Teflon and recorded in a width of 19.5 cm and a width of 9.2 cm. The mold system consists of a square array of tapered, cylindrical cavities. The cavities have a diameter of 7.8 mm at the top of the cavity and a diameter 6.5 mm at the bottom of the cavity and a depth of 1.8 mm. The center distance between the cavities is approximately 153112.doc -53· 201130656 11.7 mm. A piece of polyaminophthalic acid film ST-1880 was used as the substrate. The substrate was cut to a size of about 12 cm x 10 cm and placed on the mold region containing the resin mixture. A quartz plate of 28 cm length x 17 cm width χ 3.5 mm thickness is placed on top of the polyurethane substrate, thereby pressing the resin into the cavity and forming a thin pressure-bearing area of the resin mixture between the cavities (about 〇. 5 mm thick). Passing a mold, a resin mixture, under two UV lamps operating at about 157.5 watts/cm (400 watts/inch) (a "V" bulb available from Fusion Systems Inc. (Gaithersburg, Maryland)) The substrate and the quartz plate are used to UV cure the resin mixture. The mold passes under the lamp at a speed of about 24 meters per minute (8 feet per minute) through which the radiation passes through the quartz plate and the polyurethane substrate to reach the resin mixture. The mold, partially cured resin mixture and polyurethane substrate were then transferred to an air flow oven having a set temperature of 1 Torr for two hours to thermally cure the resin mixture. The cured article is removed from the mold by gently pulling the polyamine phthalate substrate to form an article having structured polishing characteristics (Example 丨). Example 2 Example 2 was prepared in an equivalent manner to the example except that the composition of the resin mixture was 0.58 g of 5350 D, 2.15 g of Ml, 1.83 g of PHP-75D, 1.27 g of D100, and 0.06 g of tp〇_l. Example 3 Example 3 was prepared in the same manner as in Example 1, except that the curing was carried out in the reverse order (first heat curing followed by curing). Example 4 153112.doc • 54. 201130656 Example 4 was prepared identical to Example 2 except that the curing was carried out in the reverse order (first heat curing followed by UV curing). Comparative Example C1 Comparative Example C1 was prepared in the same manner as in Example 1, except that 5350D was omitted from the composition of the resin mixture. Comparative Example C2 Comparative Example C2 was prepared in a manner equivalent to Comparative Example C1 except that the composition of the resin mixture was 5350 D of 〇_31 g, Ml of 2.15 g, and PHP-75D of 3_65 g and only 100% of it was used. The curing took two hours and the υν curing step was omitted. Comparative Example C3 Comparative Example C3 was prepared in a manner equivalent to Comparative Example C2 except that the composition of the resin mixture was 0.65 g of 53 50D, 2.15 g of Ml, and 3.65 g of PHP-75D. Example 5

Example 5 was prepared by placing 9_49 g of 5350D, 35.00 g of Ml, 29.69 g of PHP-75D, 20.63 g of D100, and 1.03 g of TPO-L in a 500 mL plastic beaker. The components were mixed by placing the beaker in an Awatod-Rentaro AR-500 Thinky blender and operating AR_5 00 in a two-step process. The first step was carried out for 5 minutes at a rotation of 1000 rpm and a rotation of 1 rpm. Immediately after the first step, the first step was carried out, which was carried out under a rotation of 3 rpm and a rotation of 2000 rpm for 15 seconds to form a resin mixture. Prepare a resin mixture of approximately 28 cm x 28 on a 26 μηη thick substrate using a knife coater with a width of approximately 21 吋 (53 cm) and a gap of 153112.doc • 55· 201130656 of 60 mil (1.52 mm) Cm coating, the 26 μιη thick substrate is made of thermoplastic polyurethane urethane (TPU) ESTANE 58887·ΝΑΤ02 (available from Lubrizol)

Advanced Materials, Inc. (Cleveland, OH) was extruded at 182 ° C in a film form onto a paper release liner. The coated resin mixture and substrate were placed on an aluminum plate of 12 忖 X 12 忖 (3 0.5 cm x 3 (K5 cm) and 0.25 mm * (6.35 mm) thickness. 36 magnets (0.375 吋 (9.6 nun)) The diameter χ〇.125吋 (3.2 mm) thickness is assembled into the recess in the side of the aluminum plate. The 36 recesses are in a square array with a center distance between the recesses of about 5 cm. The diameter and depth of the recesses are respectively 9 8 mm and 4_3 mm. A Teflon-coated metal mesh having a thickness of about 41 cm x 30 cm and a thickness of about ι·ό mm is placed on top of the resin mixture coating having a circular hole a hexagonal array (each circular hole having a diameter of about 6 2 mm) and a center distance of about 8 mm. The magnetic attraction between the screen and the magnet in the aluminum plate causes the screen to be pressed through the resin mixture coating, thereby The thin pressure-bearing area β that leaves the coating between the metal screen and the substrate is equivalent to the UV curing of the coating in Example 1, except that no quartz plate is used. Then the procedure equivalent to the procedure described in the example is used. Thermal curing. After removal from the oven, the metal screen is removed from the cured resin to form an adhesion The beginning polyurethane backing substrate is a textured surface of the pad. The removal of side paper thereby exposing the polyurethane substrate using a 27 pm thick Shu

Transfer adhesive 3M Adhesive Transfer Tape 9672 (from 3M

Company), manually laminating a polyurethane substrate having a textured mat surface to a layer of polyurethane having a thickness of about 30 cm < 30 cm and 0.0625 吋 (1.59 mm) 153112.doc -56 - 201130656 Acid ester foam (Rogers "P〇R〇N" amine phthalate foam, part number 4701-50-20062-04 (from American Flexible pr〇ducts,

Inc. (Chaska, Minnesota)). A 23 cm diameter pad having a central hole of 18 claw diameter was cut from the laminate to form a pad having the structured polishing feature of the present invention (Example 5). Comparative Example C4 Comparative Example C4 was prepared in the same manner as in Example 5 except that the composition of the resin mixture was 10.48 g of 5350 D, 35.00 g of Ml and 59.38 g of PHP-75D and only the thermal curing duration of l〇〇c was used. For two hours, the υγ·curing step was omitted. The hardness values, pore diameter average, pore size standard deviation, pore size range, pore diameter non-uniformity, and porosity of Examples 1 to 5 and Comparative Examples c 1 to C4 were measured using Test Methods 2 and 3'. The results are shown in Table 1 below. Table 1 · Hardness Tester, Pore Size and Porosity Data Example Hardness Tester Pore Average (μιη) Pore Size Standard Difference (m) Pore Size Range (μιη) Pore Size Heterogeneity (%) Porosity (%) 1 55 31.5 18.2 84.4 57.8 21.3 2 55 32.5 17.8 76.6 54.7 11.2 3 60 30.8 21.9 97.4 71.1 12.1 4 60 26.2 14.0 90.3 53.3 18.4 5 50 33.7 15.7 93.7 46.6 37.3 C1* 60 - - - - - - C2 35 37.1 40.1 189.1 107.9 21.1 C3 35 37.7 31.9 161.0 84.8 23.1 C4 35 42.1 37.1 190.3 88.0 26.6 No pore size data can be measured because comparative example C1 does not have pores. 153112.doc -57- 201130656 Example 6 Example 6 is equivalent to Example 1 to prepare 0-28 g^5150D^ 2.15 g<Ml. D100 and 0.06 g of TP〇_L. 'In addition to the composition of the resin mixture is 1-83 g^PHP-75D. i.2? I 1 夕 U 丄 1 1 Description Steep example 1-1 is equivalent to the preparation of Example 1, except that the tree r ... is ~, ...: two trees wide... 厶15 g of Ml, 1 ·83 σ + PHP-75D. 1.27g^D1〇〇^〇〇6 g^Tp〇L〇 Example 7 Example 7 is equivalent to Example 1. Only 1 is prepared, except that the amount of 5350D is 〇〇f. Example 8 except that the amount of 5350D is 〇14. Example 8 is equivalent to the preparation of Example 1, g 0 Example 9 Example 9 is equivalent to Example 1 匍, only 1 Η Η 制备 , , 〇 〇 g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g g (Test Method 丨) The results indicate that it has an acceptable degree of porosity. Illustrative examples W and ^fesem (test method 〇 results indicate that it has a low degree of porosity. Example 10 153112.doc -58- 201130656 Example 10 is equivalent to Example 5 to prepare, except for the following changes: the composition of the resin mixture is 0.62 g of A15LV, 23 g of P-250, 15.83 g of PHP-75D, 22 g of D100, 1.1 g of TPO-L and 0.68 g of DC5604. Place these components in a 500 ml plastic container Medium by passing a resin mixture and a TPU substrate under two ultraviolet lamps ("V" bulbs available from Fusion Systems Inc.) operating at approximately 157.5 watts/cm (400 watts/inch) A screen is used to UV cure the resin mixture. The resin mixture is passed under the lamp at a speed of about 2.4 meters per minute (8 feet per minute), wherein the radiation passes through the resin mixture. It will then be sold under the trade name "3M SCOTCHPAK 1022 Release Liner from 3M Company. The obtained fluoropolymer-coated polyester film release liner is placed on top of the screen and the partially cured resin mixture. Then the assembly is turned over so that the polyaminophthalate substrate is on top and Coated with fluorine The polyester film/screen/partially cured resin mixture is at the bottom. The entire assembly is quickly passed through the same uv curing process for a second time, with the quartz plate on top of the substrate. After the second UV curing is completed, the quartz is removed. The sheet and the polyester film coated with the fluoropolymer, and the screen/partially cured resin mixture/substrate assembly was transferred to an air flow oven having a set temperature of 100 ° C for two hours to thermally cure the resin mixture. As described in Example 5, after cooling to room temperature, a 23 cm diameter pad having a central hole of 18 mm diameter was fabricated to give Example 10. Example 11 Example 11 was prepared in an equivalent manner to Example 10 except for the weight of A15LV. 1.25 g. 153112.doc -59- 201130656 Example 12 Example 12 was prepared identically to Example 10 except that the weight of A15LV was 3.20 g. Example 13 Example 13 was prepared in an equivalent manner to Example 10 except that the weight of A15LV was 6.76 g. Example 14 Prepare Example 14 by placing 6.88 g of A15 lv, 127.78 g of P-250, 6_11 g of TPO-L, and 3.51 giDC 56 〇4 in a 65 〇mL plastic container. In Awatori-Rentaro ΑΙΙ · 5〇〇 Thinky machine and mixed into the operating timing AR-500 for 4 minutes mixing together components at the rotating plate rotates the pawl of the pawl woo and looo knock. Remove the container from the blender and add 87.29 8 卩 1^-750 and 122.22 § 0100 to the container. The mixture was subjected to a two-step mixing process, and the first step was carried out for 4 minutes under a rotation of 1000 rpm and a rotation of 1000 rpm. Immediately after the first step, a second step was carried out, which was carried out at a rotation of 3 rpm and a rotation of 2 rpm for 15 seconds to form a resin mixture. Preparation of a resin mixture on a 4 mil (l〇2 μπι) thick substrate using a knife coater having a width of about 2 (53 cm) and a gap of 60 mil (1.52 mm) Inx23 in (53.3 cm x 58.4) coating by pressing TPU "ESTANE 5 83 09-022" at 210 ° C into a conventional 4 mil polyester release liner And formed. The coated resin mixture and substrate were placed on an aluminum plate having a thickness of 24 Å x 24 (61.0 cm x 61.0 cm) and 0. 25 leaves (6.35 mm). Install 113 magnets 153112.doc -60 - 201130656 body (four) 75 忖 (9.6 mm) diameter x () 125 leaves (32 thickness) into the recess in the back of the nameplate. The dimples are in a linear array of 15 columns. Eight of the columns have eight recesses and seven of the columns have eight recesses per column eight. The spacing between the columns is 4 mm and the spacing between the recesses in the column is 7.5 mm. The first row of recesses (near the edge of the panel) has eight recesses and the second row has seven recesses. This alternating pattern continues until the fifteenth column has eight recesses. The recesses of the even columns are positioned such that they are at the center between the recesses corresponding to the adjacent columns. The diameter and depth of the recess are 9.8 mm and 4_3 mm, respectively. Use a tape that is resistant to high temperatures to tighten the magnets in the recess. A Teflon-coated metal mesh of about 24 inx24 in (61.0 cm x 61. inch cm) and a thickness of about 16 mm is placed on top of the resin mixture coating. The metal mesh has six sides of a circular hole. The array (each circular hole has a diameter of about 6.2 mm) and a center distance of about 8 mm. The magnetic attraction between the screen and the magnet in the aluminum plate causes the screen to be forced through the resin mixture coating, leaving a thin pressure-bearing area of the coating between the metal screen and the substrate. The resin mixture was cured following the equivalent curing procedure of Example 10. After removal from the oven, the metal screen is removed from the cured resin to form a textured tantalum surface attached to the original polyester-lined TPU substrate. The 134 μιη thick transfer adhesive "3M ADHESIVE TRANSFER TAPE 9672" (from 3M Company) was used to manually laminate the polyester release liner with textured mat surface to about 21 in><23 in<23 in (53.3 cmx58.4) And a layer of polyurethane foam with a thickness of 0.0787 吋 (2 mm). A 20.0 in (50.8 cm) diameter pad was cut from the laminate to form a pad having the structured polishing features of the present invention (Example 14). 153112.doc • 61 - 201130656 Comparative Example C5 Comparative Example C5 was prepared in the same manner as in Example ι except that the A15LV was omitted from the composition of the resin mixture. Comparative Example C6 Comparative Example C6 was prepared in an equivalent manner to Example 10 except that the composition of the resin mixture was 1.44 g of A15LV, 23 g of P-250, 47.50 g of PHP-75D, and 0.68 g of DC5 604 and only 1 was used. Hey. (The following thermal curing lasted for two hours, omitting the UV curing step. Comparative Example C7 Comparative Example C7 was prepared in the same manner as Comparative Example C6 except that Ai 5lv was omitted from the composition of the resin mixture. Example 15 Example 15 is equivalent to Prepared in Example 5 except that the composition of the resin mixture was 7.58 g of 5350 D, 28.00 g of Ml, 23.75 g of PHP-75D, 16.50 g of D100, 0.83 g of TPO-L, and 0.77 g of DC5604. Comparative Example C8 Comparative Example C8 was prepared in an equivalent manner to Example 5 except that the composition of the resin mixture was 8.35 g of 5350D, 28.00 g of VII, 47.50 g of PHP-75D, and 3.5 g of DC5604 and only heat curing using a loot. The UV curing step was omitted for two hours. Using Test Methods 2 and 3, the hardness values, pore diameter average, pore size standard deviation, pore size range, and pore size non-uniformity of Examples 1 to 15 and Comparative Examples C5 to C8 were measured. And porosity. The results are shown in Table 2. 153112.doc •62· 201130656 Table 2. Hardness tester, pore size and porosity data

Throughout this specification, reference is made to "one embodiment", "some embodiments", "one or more embodiments" or "an embodiment" (whether or not the term "exemplary" is included before the term "embodiment" The features, structures, materials, or characteristics described in connection with the embodiments are included in at least one embodiment of some exemplary embodiments of the present invention. One or more embodiments, in some embodiments, "in one embodiment" or "in a solid", are meant to refer to the same embodiments of the present invention. In particular, the particular features, structures, materials, or characteristics may be combined in any suitable manner. Although the specification has described some exemplary embodiments in detail, it should be understood that those skilled in the art can readily conceive 153112.doc.63.201130656 changes, modifications, and equivalents of the embodiments. . Therefore, it is to be understood that the invention is not limited to the illustrative embodiments set forth above. In particular, as used herein, the recitation of numerical ranges by endpoints is intended to include all numbers included in the <RTI ID=0.0> </ RTI> </ RTI> <RTI ID=0.0> </ RTI> </ RTI> (eg, 1 to 5 includes 1, 1, 5, 2, 2, 75, 3, 3.80, 4, and 5) . In addition, all numbers used herein are assumed to be modified by the term "about." In addition, all of the publications and patents cited herein are hereby incorporated by reference in their entirety in their entirety in their entirety in the extent of the disclosure in particular Various illustrative embodiments have been described. These and other embodiments are within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are respectively a cross-sectional view and a top view of a porous polished crucible in the prior art; FIG. 2 is a schematic side view of an embodiment of a polishing pad of the present invention; FIG. FIG. 4 is a side view of a polishing pad having a protruding polishing element according to still another embodiment of the present invention; FIG. 5 and FIG. FIG. 6A and FIG. 6B are a cross-sectional view and a micrograph of a top view of the cured composition of Comparative Example 3, respectively; FIG. 6A and FIG. Figure 7B is a cross-sectional view and a top view, respectively, of a cured composition of Example 153112.doc • 64-201130656 15 which can be used to form the polishing layer of the present invention; Figure 8 is an example 1 which can be used to form the polishing layer of the present invention. A micrograph of a cross-sectional view of the object. [Main component symbol description] 2 Polishing pad 2' Polishing pad 2a Porous polishing pad 4 Polishing element 8 Supporting floor 8a as appropriate Depending on the case, the floor 10 is selected as the flexible layer 10a Flexible layer 12 Depending on the pressure-sensitive adhesive layer 12a Porous polishing layer 14 Polished surface 15 Hole 23 Polished surface 24 Polishing element 25 Pressure-bearing area 26 Slit 28 Conditional polishing composition distribution layer 30 Flexible layer 31 Depending on the case, the guide plate 32 is optionally used as the pressure-sensitive adhesive layer 153112. Doc -65- 201130656 34 36 Adhesive layer selected according to the situation Secondly selected adhesive layer 153112.doc -66-

Claims (1)

201130656 VII. Patent Application Range: 1. A polishing pad comprising: a flexible layer having first and second opposite sides; and a porous polishing layer disposed on the first side of the flexible layer, the porous polishing layer comprising : a crosslinked network structure comprising a heat curing component and a radiation curing component, wherein the radiation curing component and the heat curing component are covalently bonded in the intersection network structure; dispersed in the intersection network structure Polymer particles; and closed cell pores dispersed in the interconnected network structure. 2. The polishing pad of claim 1, further comprising a support layer interposed between the flexible layer and the porous polishing layer. 3. The polishing pad of claim 1 or 2, wherein the heat curing component comprises at least one of a polyurethane or a polyepoxide, and wherein the radiation curing component comprises a polyacrylate, a polyfluorene At least one of a acrylate, a poly(vinyl ether), a polyethylene, or a polyepoxide. 4. The polishing pad of claim 3, wherein the radiation curable component comprises at least one of a polyacrylate or a polydecyl acrylate. 5. The polishing pad of claim 3, wherein the thermally curable component and the polymer particles each independently comprise a polyamine phthalate. 6. The polishing pad of claim 1 or 2, wherein the polymer particles are covalently bonded to at least one of the heat curable component or the radiation curable component in the crosslinked network structure. 7. The polishing pad of claim 6 wherein the polyacrylate or polymethyl propylene 153112.doc 201130656 acid vinegar is covalently bonded to the heat curing component via an amine phthalate or urea linkage group. 8. The polishing pad of claim 1 or 2 wherein the porous polishing layer has a hardness of at least 40 Shore D as measured by Test Method 2. 9. The polishing pad of claim 1 or 2, wherein the polymer particles have an average particle size in the range of 5 microns to 500 microns. 10. The polishing pad of claim 1 or 2, wherein the polymer particles are substantially spheres. 11. The polishing crucible of claim 1 or 2 wherein the polymer particles are fibers. 12. The polishing pad of claim 2 or 2 wherein the polymer particles are present at up to 20 weight percent per ounce of total weight of the porous polishing layer. 13. The polishing pad of claim 1 or 2, wherein the holes have a hole number of up to 75% non-uniformity. 14. A polishing pad as claimed in claim 1, wherein the holes have an average pore size in the range of from $ microns to 1 inch. 15. The polishing pad of claim 2, wherein the polishing layer comprises individual polishing elements that protrude from the support floor. The polishing pad of claim 15 wherein the polishing elements each have an end away from the support layer and wherein the end is movable on an axis perpendicular to the polishing surface of the polishing elements. 17. The polishing cartridge of claim 15 or 16, further comprising a guide plate having a plurality of apertures therein, wherein each of the individual polishing elements protrudes through one of the plurality of apertures. 18. The polishing pad of claim 1, wherein the polishing layer comprises individual polishing elements from the flexible layer 153112.doc 201130656. 19. The polishing pad of claim 18, wherein the polishing elements are attached to the flexible layer by an adhesive. 20. The polishing pad of claim 18 or 19, further comprising a guide plate having a plurality of apertures therein, wherein the individual polishing elements each protrude through one of the plurality of apertures. 21. The polishing pad of claim 1 or 2 wherein the flexible layer comprises at least one of polysulfide, natural rubber, ethene, a dilute rubber, a gas rubber, a polyolefin or a polyurethane vinegar. One. 22. The polishing pad of claim 1 or 2 wherein at least a portion of the polishing pad is transparent. 23. The polishing pad of claim 1 or 2 wherein the polymer particles are water soluble. 24. The polishing cartridge of claim 1, wherein the porous polishing crucible further comprises a surfactant in the interconnected structure. 25. A method of polishing comprising: contacting a surface of a substrate with the porous polishing layer of a polishing crucible of claim 1 or 2; and relatively moving the polishing pad relative to the substrate to abrade the surface of the substrate. 26. The method of claim 25, further comprising providing a working fluid to an interface between the porous polishing layer and the surface of the substrate. 27. A method of making a polishing pad, the method comprising: providing a composition comprising a heat curable resin composition, a radiation curable resin combination 153112.doc 201130656, and polymer particles; forming a hole in the composition; The composition is positioned on the support layer; and by at least partially curing the radiation curable resin composition by exposing the composition to radiation and heating the composition to at least partially cure the heat curable resin composition A porous polishing layer is formed on the support layer. 28. The method of claim 27, further comprising bonding the flexible layer to the surface of the support layer opposite the porous polishing layer in an adhesive manner. 29. The method of claim 27 or 28 wherein the heat curable resin composition comprises a first resin having at least two isocyanate groups or at least two epoxy groups and having at least two hydroxyl groups, amine groups, carboxyl groups or oximes At least a second resin, and wherein the radiation curable composition comprises at least two acrylate groups, methacrylate groups, vinyl groups or epoxy groups. The method of claim 29, wherein the first resin has at least two isocyanate groups, wherein the second resin has at least two hydroxyl groups or at least two amine groups, wherein the radiation curable composition comprises at least two acrylic groups An ester or methacrylate group, and wherein the radiation curable composition further comprises at least one of an isocyanate group or a mesogenic group. 31. The method of claim 30, wherein the radiation curable composition is an aliphatic isocyanate functional amine phthalate acrylate or methacrylate. 32. The method of claim 27 or 28, further comprising positioning the open mold in the composition on the support layer prior to forming the porous polishing layer. 33. The method of claim 27 or 28, wherein the holes are closed cell holes. 34. The method of claim 27 or 28, wherein the composition further comprises an interface 153112.doc 201130656 active agent. 35. The method of claim 27 or 28, wherein the porous polishing layer has a hardness of at least 40 Shore D as measured by Test Method 2. 36. The method of claim 27 or 28 wherein the polymer particles have an average particle size in the range of from 5 microns to 500 microns. 37. The method of claim 27 or 28, wherein the polymer particles are substantially spheres. 38. The method of claim 27 or 28, wherein the polymer particles are fibers. 39. The method of claim 27 or 28, wherein the polymer particles are water soluble. 40. The method of claim 27 or 28 wherein the polymer particles are present at up to 20% by weight based on the total weight of the porous polishing layer. 41. The method of claim 27 or 28, wherein the pores have a pore non-uniformity of at most 75%. 42. The method of claim 27 or 28 wherein the pores have an average pore size in the range of 5 microns to 1 micrometer. 43. The method of claim 27 or 28 wherein the polishing layer comprises individual polishing elements attached to the support layer and projecting from the support layer. The method of claim 43, wherein the individual polishing elements each have an attachment end and an end away from the support layer and wherein the end is movable on an axis perpendicular to the polishing surface of the polishing elements. 45. The method of claim 43, further comprising a guide plate having a plurality of apertures therein, each of the discrete polishing elements projecting through one of the plurality of apertures. The method of claim 27 or 28, wherein the support layer comprises at least at least one of polyoxyn, natural rubber, styrene butadiene rubber, butyl rubber, polyolefin or polyamino phthalate. One. 47. The method of claim 27 or 28, wherein at least a portion of the polishing pad is transparent. 153112.doc