201139851 六、發明說明 【發明所屬之技術領域】 本發明’係有關於將處理室排氣爲真空狀態之真空排 氣裝置以及真空排氣方法。 又’本發明，係有關於被連接有真空排氣裝置之基板 處理裝置。 【先前技術】 在進行配線用金屬膜之成膜處理的處理裝置中，係具 備有用以進行特定之製程的基板處理室（處理室）。基板 處理室’係藉由真空幫浦而被作排氣，並作出與處理相對 應的真空環境。在成膜處理中，由於係多所使用有反應性 爲強之氣體’因此’作爲真空幫浦，係使用有在吸入室中 並不存在有油而由大氣壓來得到真空的乾真空幫浦。 伴隨著半導體之製造製程的複合化，在使複數之處理 室相互獨立了的狀態下而將全部的處理室作真空排氣之基 板處理裝置’係逐漸成爲此種設備之主流。因此，係成爲 使用有將複數台之真空幫浦作了並聯連接的真空排氣裝 置。爲了得到特定之真空環境，係使複數台之真空幫浦動 作’以得到基板處理室之真空狀態，但是，因應於處理， 會成爲反覆進行有用以得到特定之真空狀態的額定運轉和 將已得到了的真空狀態作維持的運轉（待機運轉）。 在真空排氣裝置中所被作使用的真空幫浦，一般係爲 容積移送型之真空幫浦，在運轉中，最終段之容積部，係 -5- 201139851 在排氣時而反覆被暴露在大氣之中。在待機運轉時，由於 係並不進行氣體之移送，因此，真空幫浦之工作，理論上 係爲〇，但是，係成爲需要將最終段之容積部設爲真空狀 態（作減壓）的動力。因此，於先前技術中，係進行有： 設置進行最終段之容積部的排氣之輔助幫浦，並藉由輔助 爾浦來保持最終段之容積部的真空狀態，而藉由此來減少 在待機運轉時之真空幫浦的工作a，並抑制消耗電力（例 如，參考專利文獻1、專利文獻2 )。 近年來，係成爲進行有對於像是平面面板顯示器一般 之大型玻璃基板所進行之配線用金屬的成膜等。因此，處 理室之容積係逐漸大型化。由於就算是基板變大，若是處 理時間變長，則生產性仍會降低，因此，在具備有對應於 大型之基板的處理室之基板處理裝置處的真空排氣裝置 中’係成爲將真空m浦之台數增多以便就算是對於大型之 處理室亦能夠在短時間內而得到真空狀態。就算是在具備 有複數台之真空幫浦的真空排氣裝置中，亦能夠使用輔助 辩浦來對於待機運轉時之消耗電力作抑制。 然而，當對於複數台之真空辩浦而分別設置了輔助幫 浦的情況時，由於輔助甯浦之台數係變多，並會有雖然抑 制了消耗電力但是卻反而使設備成本變得更高之虞，因 此，實際上，係難以適用在具備有複數台之真空幫浦的真 空排氣裝置中。又，在對於複數台之真空幫浦而將1個的 輔助幫浦作連接的情況時，除了輔助幫浦本身的設備成本 以外，也會有使得像是相對於多數之真空锴浦所設置的配 -6- 201139851 管等之設備成本大幅增加之虞，而同樣的在實際上爲難以 適用在具備有複數台之真空幫浦的真空排氣裝置中。 [先前技術文獻] [專利文獻] [專利文獻1]日本特開2003-155988號公報 [專利文獻2 ]日本特開2 0 0 3 -1 3 9 0 5 4號公報 【發明內容】 [發明所欲解決之課題] 本發明’係爲有鑑於上述狀況而進行者，其目的，係 在於提供一種：並不使用輔助幫浦便能夠對於複數台之真 空幫浦的消耗電力作抑制之真空排氣裝置以及真空排氣方 法。 又，本發明’係爲有鑑於上述狀況而進行者，其目 的，係在於提供一種：具備有並不使用輔助幫浦便能夠對 於複數台之真空幫浦的消耗電力作抑制之真空排氣裝置的 基板處理裝置。 [用以解決課題之手段] 爲了達成上述目的，申請項1之本發明之真空排氣裝 置，其特徵爲，具備有：複數之真空幫浦，係相對於處理 室而被作並聯連接，並將前述處理室設爲特定之真空狀 態；和排氣集合管，係被與前述真空幫浦之排氣側相通 連；和輔助配管，係將至少1個的前述真空幫浦之吸氣側 201139851 與前述排氣集合管作連接；和切換手段，係在前述處理室 側或者是前述輔助配管側處而將前述至少1個的前述真空 幫浦之吸氣側的流路作切換。 在申請項1所記載之本發明中，在進行將既存之真空 壓狀態作維持之運轉的情況時，係藉由切換手段而將至少 1個的前述真空爾浦之吸氣側的通路與排氣集合管側相通 連，並藉由至少1個的真空幫浦來進行其他的真空幫浦之 最終段的容積部之排氣，而使其他的真空幫浦處之由於氣 體之移送所導致的負載近似於〇。其結果，藉由切換手段 之動作，係成爲能夠並不使用輔助幫浦便對於複數台之真 空焐浦的消耗電力作抑制。 對於像是對平面面板顯示器一般之大型玻璃基板進行 處理的處理室，係成爲將數台乃至十數台之真空幫浦作並 聯設置，但是，就算是在此種情況下，當進行將既存之真 空壓狀態作維持的運轉時，藉由以1個的真空幫浦來進行 其他的真空幫浦之最終段的容積部之排氣，係能夠將其他 的真空羝浦之消耗電力大幅度地作抑制。亦即是，係能夠 與對於各真空辩浦而各別地使用有輔助m浦時相同的而對 於消耗電力作抑制。 例如，在將本案發明適用在將1 〇台之真空幫浦作了 並聯連接之真空排氣裝置中的情況時，係能夠將耗費數十 萬元之設備成本的輔助幫浦作1〇台的省略，亦即是，係 在削減了數百萬元之設備成本的狀態下，而成爲能夠達成 與使用有輔助幫浦時相同程度的消耗電力之抑制。亦即 -8- 201139851 是，在維持既存之真空壓狀態時而伴隨著用以將最 容積部作減壓的運轉之真空幫浦的情況時，例如 7.5 Kw之消耗電力，但是，當實施有最終段的容積 氣的情況時，消耗電力係成爲例如2.5Kw。故而， 了數百萬元之設備成本，並實施將既存之真空壓狀 持的運轉時，對於1台的真空幫浦係成爲能夠抑 5 Kw之電力。 而，申請項2之本發明之真空排氣裝置，係在 1所記載之真空排氣裝置中，具備有下述特徵：亦 前述至少1個的前述真空幫浦，係藉由吸氣管而被 處理室作連接，前述切換手段，係在前述吸氣管處 將前述吸氣管之流路作開閉的排氣調整閥，在前述 整閥之下流側的前述吸氣管處，係被連接有前述 管’在前述輔助配管處，係具備有將前述輔助配管 因應於前述排氣調整閥之開閉而作閉開的輔助排氣 在申請項2之本發明中，係藉由對於排氣調整 輔助排氣閥之開閉作控制，而能夠藉由至少1個的 浦來進行其他的真空幫浦之最終段的容積部之排 此’係能夠藉由簡單的操作來對於複數之真空幫浦 電力作抑制。 又’申請項3之本發明之真空排氣裝置，係在 1或申請項2所記載之真空排氣裝置中，具備有 徵：亦即是’前述至少1個的真空幫浦以外之前述 浦的排氣側’係藉由排氣管而被與前述排氣集合 終段之 係需要 部之排 在削減 態作維 制例如 申請項 即是， 與前述 具備有 排氣調 輔助配 之流路 閥。 閥以及 真空幫 氣。因 的消耗 申請項 下述特 真空幫 管作連 -9- 201139851 接，在前述排氣管處，係具備有與前述輔助排氣閥之開閉 作連動而進行開閉之真空維持閥。 在申請項3之本發明中，係在藉由至少1個的真空幫 浦來進行了其他的真空幫浦之最終段的容積部之排氣後， 以真空維持閥來將排氣管關閉，藉由此來將其他的真空幫 浦之最終段的容積部之排氣側的流路維持爲真空狀態，而 能夠將接下來進行最終段之容積部的排氣時之負載抑制在 最小限度。 又，申請項4之本發明之真空排氣裝置，係在申請項 1〜申請項3中之任一項所記載之真空排氣裝置中，具備 有下述特徵：亦即是，係具備有將前述至少1個的真空幫 浦之排氣側作減壓的減壓手段。 在申請項4之本發明中，係能夠藉由減壓手段，來進 行至少1個的真空幫浦之最終段的容積部之排氣，而能夠 將至少1個的真空馎浦之消耗電力作抑制》 又，申請項5之本發明之真空排氣裝置，係在申請項 1〜申請項4中之任一項所記載之真空排氣裝置中，具備 有下述特徵：亦即是，係具備有將前述處理室側的壓力狀 態檢測出來之壓力檢測手段，前述切換手段，係根據前述 壓力檢測手段之檢測資訊而動作。 在申請項5之本發明中，係能夠因應於處理室側之壓 力狀態，來使切換手段動作，而能夠因應於實際之壓力狀 態來對於真空辩浦之運轉作控制。處理室側之壓力狀態， 係能夠將處理室內之壓力檢測出來，亦能夠將複數之真空 -10- 201139851 幫浦的吸氣側之集合管內的壓力檢測出來。 爲了達成上述目的，申請項6之本發明之真 法，其特徵爲：在藉由被並聯地作了配置的複數 浦而將處理室設爲特定之真空狀態時，在爲了維 理室之真空壓所進行的前述真空幫浦之運轉時， 少1個的前述真空幫浦來進行其他之前述真空幫 側之大氣開放容積部的排氣。 在申請項6之本發明中，在進行維持真空壓 轉時，係藉由以至少1個的前述真空幫浦來進行 述真空幫浦之排氣側的大氣開放容積部之排氣， 不使用輔助幫浦便對於複數台之真空幫浦的消耗 制。 又，申請項7之本發明之真空排氣方法，係 6所記載之真空排氣方法中，具備有下述特徵： 在爲了維持前述處理室之真空壓所進行的前述真 運轉時，係以較在將前述處理室設爲特定之真空 轉時之旋轉數而更低之旋轉數，來使其他之前述 運轉。 在申請項7之本發明中，由於身爲待機狀態 前述真空幫浦，係被控制在較將處理室設爲特定 態的運轉時之旋轉數更低之旋轉數，因此，係能 幫浦之消耗電力作抑制。 又，申請項8之本發明之真空排氣方法，係 7所記載之真空排氣方法中，具備有下述特徵： 空排氣方 之真空幫 持前述處 係藉由至 浦的排氣 狀態之運 其他的前 而能夠並 電力作抑 在申請項 亦即是， 空幫浦之 狀態的運 真空幫浦 之其他的 之真空狀 夠將真空 在申請項 亦即是， -11 - 201139851 在爲了維持前述處理室之真空壓所進行的前述真空幫浦之 運轉時，其他之前述真空幫浦的旋轉數，係爲能夠在特定 之恢復時間內而將前述處理室設爲特定之真空狀態的旋轉 數。 在申請項8之本發明中，藉由將身爲待機狀態之其他 的前述真空幫浦，控制爲能夠於特定之恢復時間內來將處 理室設爲真空狀態的待機狀態之旋轉數，係能夠以最小之 旋轉數來使真空幫浦作旋轉，而能夠對消耗電力作抑制。 爲了達成上述目的的申請項9之本發明之基板處理裝 置，其特徵爲：係具備有使基板被作搬入並被進行特定之 處理的基板處理室，並將如申請項1〜申請項5中之任一 項所記載之真空排氣裝置的前述複數之真空幫浦，並聯地 連接於前述基板處理室處。 在申請項9之本發明中，係成爲一種具備有能夠藉由 切換手段之動作而成爲並不使用輔助焐浦便對於複數台之 真空幫浦的消耗電力作抑制的真空排氣裝置之基板處理裝 置。 又，申請項10之本發明之基板處理裝置，係在申請 項9所記載之基板處理裝置中，具備有下述特徵：亦即 是，係異備有：將從前述基板處理裝置而來之基板作搬入 並進行特定之處理之第2基板處理室，在前述第2基板處 理室處，連結第2真空幫浦，將前述真空幫浦之其中丨個 與前述第2真空辩浦之吸氣側作並聯連接，在前述真空幫 浦之其中1個與前述第2真空幫浦之連接部處，具備有流 -12- 201139851 路選擇手段。 在申請項10之本發明中，就算是當在將第2基板處 理室設爲真空狀態之第2真空幫浦處產生有問題的情況 時’亦可藉由以流路選擇手段來將真空幫浦的其中1個連 接於第2基板處理室處，來將真空幫浦的其中1個適用於 第2基板處理室之真空維持用的用途。 又，申請項U之本發明之基板處理裝置，係在申請 項1 〇所記載之基板處理裝置中，具備有下述特徵··亦即 是’在前述排氣集合管處，係通連有前述第2真空幫浦之 排氣側’藉由至少1個的前述真空幫浦，來經由前述排氣 集合管而將前述第2真空幫浦之排氣側的流體排出。 在申請項11之本發明中，當在第2真空幫浦之待機 運轉時等而進行維持真空壓狀態之運轉時，係能夠藉由真 空幫浦來進行第2真空幫浦之排氣側的容積部之排氣，而 能夠對於用以進行第2真空幫浦之排氣的消耗電力作抑 制。 [發明之效果] 本發明之真空排氣裝置以及真空排氣方法，係能夠並 不使用輔助幫浦便對於複數台之真空幫浦的消耗電力作抑 制。 又，本發明之基板處理裝置，係成爲具備有能夠並不 使用輔助幫浦便對於複數台之真空幫浦的消耗電力作抑制 之真空排氣裝置的基板處理裝置。 -13- 201139851 【實施方式】 以下所展示之實施形態例，係作爲基板處理裝置，而 以對於大型之玻璃基板施加處理，並將加熱裝置、電漿 CVD裝置、濺鍍裝置、乾蝕刻裝置等之處理室作了串聯 並排，而從其中一方之端部的處理室（裝載鎖定室：基板 處理室）來將基板作搬入、搬出的線內（in-line )式之縱 型處理裝置爲例來作說明。而，在裝載鎖定室處，係被並 聯連接有複數之真空幫浦，並藉由真空幫浦之驅動來將包 含裝載鎖定室之複數的處理室之內部設爲特定之真空狀 態。 作爲將本發明作適用之基板處理裝置，係並不被限定 於在實施形態例中所示之線內式的縱型處理裝置，亦可適 用在於中央部具備有基板搬送共通室並在基板供給室之週 邊具備有複數之基板處理室的基板處理裝置中、或者是適 用在藉由1個處理室來進行批次處理之批次式的基板處理 裝置中。 根據圖1〜圖1 1，針對本發明之贲施形態例作說明。 於圖1中，對於本發明之第1贲施形態例的基板處理 裝置之槪略系統作展示，於圖2中，對於本發明之第2實 施形態例的基板處理裝置之槪略系統作展示，於圖3中， 對於本發明之第3實施形態例的基板處理裝置之槪略系統 作展示，於圖4中，對於本發明之第4實施形態例的基板 處理裝置之槪略系統作展示，於圖5中，對於本發明之第 -14- 201139851 5實施形態例的基板處理裝置之槪略系統作展示，於圖6 中’對於本發明之第6實施形態例的基板處理裝置之槪略 系統作展示’於圖7中，對於本發明之第7實施形態例的 基板處理裝置之槪略系統作展示，於圖8中，對於本發明 之第8實施形態例的基板處理裝置之槪略系統作展示。 又，於圖9中，係對於本發明之第9實施形態例的基 板處理裝置之槪略系統作展示，於圖1 0中，係對於代表 相對於真空幫浦之旋轉數的消耗電力與恢復時間之間之關 係的圖表作展示’於圖11中，係對於代表消耗電力之變 化的圖表作展示。 另外，關於第1實施形態例〜第9實施形態例之構 件’對於相同之構件，係附加相同之符號，並省略重複之 說明。 根據圖1，針對第1實施形態例作說明。 圖示之基板處理裝置1，係爲對於被略垂直地作保持 之大型玻璃基板（基板：例如，平面面板顯示器）而進行 處理的縱型處理裝置，並爲將裝載鎖定室2、加熱室3、 第1處理室4、第2處理室5、第3處理室6以及第4處 理室7依序作連接所構成的線內式之裝置。在基板處理裝 置1之內部，係從裝載鎖定室2起直到第4處理室7爲止 而設置有用以將基板作搬送之往路以及返路。 被搬入至裝載鎖定室2中之基板，係在裝載鎖定室2 中而被保持於真空狀態，之後，在加熱室3中被作加熱， 並依序被搬送至第1處理室4乃至第4處理室7中，再使 -15- 201139851 經過路徑作反轉，而通過第4處理室7〜第1處理室4、 加熱室3並回到裝載鎖定室2中，再被搬出。 在裝載鎖定室2處，係被連接有真空排氣裝置11， 藉由真空排氣裝置11，包含裝載鎖定室2的複數之處理 室的內部’係被設爲特定之真空狀態。各處理室，係被設 爲與大型基板相對應之大容ji的處理室，爲了將排氣速度 保持在特定之速度，在真空排氣裝置11處，係並聯地具 備有複數台（於圖示例中，係爲10台）之真空幫浦12。 針對真空排氣裝置11作說明。 在裝載鎖定室2處，係被連接有真空配管13之其中 —端’真空配管1 3之另外一端，係被與吸氣集合管1 4作 連接。在1 〇台的真空m浦1 2之吸氣側處，係分別被連接 有吸氣管15’吸氣管15，係被與吸氣集合管14相連接》 亦即是’10台的真空幣浦12，係藉由各自之吸氣管15、 1個的吸氣集合管1 4以及真空配管1 3，而相對於基板處 理裝置1來並聯地作連接。 10台的真空幫浦12，例如，係爲容積移送型之乾式 错浦’在最終段之容積部（容積室）處，係被連接有具備 消音器16之排氣系17。藉由將1〇台的真空幫浦12 —齊 作驅動’在各真空m浦12處，從吸氣側而來之流體係依 序被移送至容積室處並被移送至排氣側處，再從最終段之 容積室而被排氣至排氣系1 7處。藉由此，係能夠得到所 期望之Λ空狀態。 在上述之真空排氣裝置11中，在進行將既存之真空 -16- 201139851 狀態作維持之運轉（待機運轉）的情況時，係藉由 真空幫浦12a (圖中之從右邊起第5個）來進行其 空幫浦12之最終段的容積室之排氣，並維持其他 幫浦1 2之最終段的真空。藉由此，在待機運轉時 的真空幫浦12之動力，理論上，由於並沒有流 送’因此係成爲僅有機械性損失，而能夠並不使用 浦等便將真空幫浦1 2之消耗電力大幅度地作削減 另外，作爲用以維持其他的真空幫浦1 2之最 真空之幫浦，係亦可將其他的真空幫浦12與真 12a —同作倂用。 對於用以藉由1個的真空幫浦12a來維持其他 幫浦1 2之最終段的真空之構成作說明。 在（除了真空幫浦l2a以外的）真空幫浦12 段的容積室（排氣側）處，係分別被連接有排氣管 其中一端，另外，係具備有與排氣管1 8之另外一 接的排氣集合管19。另一方面，在真空幫浦12( 空幫浦12a)之吸氣管15處，係分別被設置有 2 1 ’真空幫浦1 2a之開閉閥，係成爲排氣調整閥： 蓋排氣調整閥21a之真空幫浦丨2a側與排氣集f 地’而設置有輔助配管22，在輔助配管22處，係 有輔助排氣閥23 (切換手段）。 與排氣調整閥2 1 a (開閉閥2 1 )作開閉之動 動’輔助排氣閥2 3係進行開閉動作。亦即是，當 整閥2 1 a (開閉閥2 1 )開啓的情況時，輔助排氣厲 1個的 他的真 的真空 之其他 體之移 輔助幫 終段的 空幫浦 的真空 之最終 18之 端作連 包含真 開閉閥 1 a。涵 ί管19 被設置 作相連 排氣調 23係 -17- 201139851 被關閉，藉由全部的真空餺浦12之驅動，基板處理裝置 1係被設爲特定之真空狀態。又，在待機運轉時，排氣調 整閥2 1 a (開閉閥2 1 )係被關閉，並且，輔助排氣閥2 3 係被開啓，其他的真空辩浦1 2之最終段的容積室之流 體’係經由排氣管1 8、排氣集合管1 9以及輔助配管2 2 而藉由1個的真空幫浦12a來作排氣，並維持爲真空狀 態。 又’在吸氣集合管14處，係被設置有壓力檢測手段 (壓力感測器）2 4，根據壓力檢測手段2 4之檢測資訊， 排氣調整閥2 1 a (開閉閥2 1 )之開閉動作以及輔助排氣閥 23之閉開動作係被作控制》亦即是，係根據吸氣集合管 Μ之贲際的壓力（真空程度：基板處理裝置1之真空 度），來控制減壓動作。 另外，亦可在基板處理裝置1之適當的場所，設置壓 力檢測手段，並直接檢測出基板處理裝置1側之真空度， 而對於真空排氣裝置Π之運轉作控制。 針對具備有上述之真空排氣裝置11的基板處理裝置 1之作用作說明。 被搬入至裝載鎖定室2中之平面面板顯示器等之基 板’係在裝載鎖定室2中而被保持於真空狀態，之後，在 加熱室3中被作加熱，並依序被搬送至第1處理室4乃至 第4處理室7中，再使經過路徑作反轉，而通過第4處理 室7〜第1處理室4、加熱室3並回到裝載鎖定室2中， 再被搬出。於此期間中，在真空處理室內係被施加有必要 -18- 201139851 之處理。 基板處理裝置1，係藉由真空排氣裝置11而將處理 室內設爲特定之真空狀態。當進行用以得到在處理中所需 要的真空狀態之運轉的情況時，排氣調整閥2 1 a (開閉閥 2 1 )係被開啓’並且輔助排氣閥2 3係被關閉，藉由1 〇台 的真空幫浦12之驅動，基板處理裝置1係被設爲特定之 真空狀態（與處理相對應之真空狀態）。 在基板的搬送行程等之進行將既存的真空狀態作維持 之運轉（待機運轉）的情況時，排氣調整閥2 1 a (開閉閥 21)係被關閉’並且，輔助排氣閥23係被開啓，除了 1 個的真空幫浦l2a以外之其他的真空幫浦12之最終段的 容積室之流體’係經由排氣管1 8、排氣集合管1 9以及輔 助配管22而藉由真空幫浦12a來作排氣，並維持爲真空 狀態。 藉由此’在待機運轉時，其他的真空幫浦1 2之最終 段的處理室’係並不會被開放於大氣中，其他的真空幫浦 1 2 ’係成爲不需要用以將最終段之處理室從大氣而減壓至 真空時所需要的動力。因此，真空幫浦12之動力，理論 上，由於並沒有流體之移送，因此係成爲僅有機械性損 失’而能夠並不使用輔助幫浦等便將真空幫浦12之消耗 電力大幅度地作削減。 在對於像是平面面板顯示器一般之大型玻璃基板進行 處理的基板處理裝置1中，係成爲將例如1 0台之真空幫 浦1 2作並聯設置’但是，就算是在此種情況下，在待機 -19- 201139851 運轉時，藉由以1個的真空馆浦12a來進行其他的真空 浦1 2之最終段的容積部之排氣，係能夠將其他的真空 浦1 2之消耗電力大幅度地作抑制。 亦即是，係能夠與對於各真空幫浦1 2而各別地使 有輔助幫浦時相同的而對於消耗電力作抑制。而且，係 夠藉由僅對於排氣調整閥21a以及輔助排氣閥23之開 作控制一般的簡單操作，來對於複數之真空幫浦12的 耗電力作抑制。 根據圖2，針對第2實施形態例作說明。 第2贸施形態例之真空排氣裝置3 1，係成爲在圖 中所示之真空排氣裝置11的排氣管18處而具備有真空 持閥2 7之構成。真空維持閥2 7，係與輔助排氣閥2 3 連動地作開閉。 亦即是，當輔助排氣閥23被開啓時，真空維持閥 係被開啓，藉由1個的真空幫浦12a，其他的真空幫浦 之最終段的容積室之排氣係被進行，在輔助排氣閥23 關閉時，真空維持閥27係被關閉，在由全部的真空常 1 2所進行的運轉時，最終段之容積室的真空狀態係被 維持。 因此，係在藉由至少1個的真空幫浦12a來進行了 他的真空幫浦1 2之最終段的容積部之排氣後，以真空 持閥2 7來將排氣管1 8關閉，而藉由此來將從輔助排氣 23起直到真空維持閥27爲止之間的包含有輔助配管 之流路維持在真空狀態下，而能夠將接下來進行最終段 幫 幫 用 能 閉 消 維 相 2 7 12 被 浦 作 其 維 閥 22 之 -20- 201139851 容積部的排氣時之負載抑制在最小限度，並以良好的回應 性來實施容積室之排氣運轉。 根據圖3，針對第3實施形態例作說明。 第3實施形態例之真空排氣裝置3 2，係成爲在圖1 中所示之真空排氣裝置11之1個的真空排氣裝置12a之 排氣側處而具備有減壓手段2 9之構成。亦即是，係藉由 減壓手段29而將1個的真空幫浦12a之最終段的容積室 作減壓’在真空幫浦12a處之用以將最終段之處理室從大 氣而減壓至真空所需要的動力，係成爲不需要。 因此，1個的真空幫浦12a之動力，理論上，由於並 沒有流體之移送’因此係成爲僅有機械性損失，而能夠將 全部的真空幫浦1 2之消耗電力大幅度地作抑制。 根據圖4，針對第4實施形態例作說明。 第4實施形態例之真空排氣裝置33，係成爲具備有 圖2中所示之真空維持閥2 7和圖3中所示之減壓手段2 9 之構成。因此’由1個的真空幫浦1 2 a所得到之最終段的 容積室之排氣運轉開始時的真空狀態，係被作維持，並 且，係能夠將全部的真空幫浦1 2之消耗電力大幅度地作 削減。 根據圖5，針對第5實施形態例作說明。 第5實施形態例之真空排氣裝置3 4，係成爲在圖1 中所示之真空排氣裝置11的與真空幫浦Ua相鄰接之真 空幫浦12b的吸氣管15處，連接輔助配管22之分歧管 2 2b ’並在排氣管1 8b處而具備有開閉閥28之構成。亦即 -21 - 201139851 是，係成爲：作爲真空幫浦12a之後備，而將相鄰接之真 空幫浦1 2b設爲用以進行其他的真空锴浦1 2之最終段的 容積室之排氣的幫浦之構成。 當在真空辩浦1 2a處產生有問題的情況時，係藉由將 輔助排氣閥23關閉，並將分歧管22b之輔助排氣閥23b 開啓，且將開閉閥28關閉，而藉由相鄰接之真空幫浦 1 2b來進行其他的真空幫浦1 2之最終段的容積室之排 氣。因此，就算是在真空辩浦12a處產生有問題，亦能夠 確K地進行真空镇浦12之消耗電力的抑制。 根據圖6，針對第6實施形態例作說明。 第6實施形態例之真空排氣裝置3 5，係成爲將圖2 中所示之真空維持閥27和關5中所示之作爲後備而使用 了相鄰接之真空幫浦12b者作了組合的構成。 因此，係能夠將接下來進行最終段之容積部的排氣時 之負載抑制在最小限度，並以良好的回應性來實施容積室 之排氣運轉，同時，就算是在真空甯浦1 2a處產生有問 題，亦能夠確實地進行真空幫浦1 2之消耗電力的抑制。 根據圖7，針對第7 施形態例作說明。 第7實施形態例之真空排氣裝置3 6，係成爲在將圖3 中所示之減壓手段29和圖5中所示之作爲後備而使用了 相鄰接之真空辩浦12b者作了組合的構成中，更進而具備 有用以進行相鄰接之真空幫浦12b的最終段之容積室的排 氣之輔助減壓手段30的構成。 因此，就算是在真空幫浦1 2a處產生有問題，亦能夠 -22- 201139851 確實地進行真空幫浦1 2之消耗電力的抑制，並且，係能 夠進行亦包含有真空幫浦12a以及真空幫浦i2b的全部之 真空幫浦1 2的消耗電力之抑制。 根據圖8，針對第8實施形態例作說明。 第8實施形態例之真空排氣裝置3 7，係成爲將圖2 中所示之真空維持閥27和圖7中所示之減壓手段29、作 爲後備而使用了相鄰接之真空幫浦12b —事、以及輔助減 壓手段3 0，作了組合的構成。 因此，係能夠將接下來進行最終段之容積部的排氣時 之負載抑制在最小限度，並以良好的回應性來實施容積室 之排氣運轉，，並且，就算是在真空幫浦12a處產生有問 題，亦能夠確實地進行真空幫浦1 2之消耗電力的抑制， 進而，係能夠進行亦包含有真空幫浦12a以及真空幫浦 12b的全部之真空幫浦12的消耗電力之抑制。 根據圖9〜圖1 1，針對第9實施形態例作說明。 第9實施形態例之真空排氣裝置3 8，係成爲將圖8 中所示之真空排氣裝置37的輔助減壓手段30作了省略之 構成。而，在作爲第2基板處理室之加熱室3、第1處理 室4、第2處理室5、第3處理室6以及第4處理室7 處，係經由真空配管40而被連接有1個的第2真空幫浦 41 〇 在第2真空幫浦41之吸氣側的真空配管40處，係具 備有開閉閥42，藉由將開閉閥42開啓並驅動1個的第2 真空幫浦41，加熱室3、第1處理室4、第2處理室5、 -23- 201139851 第3處理室6以及第4處理室7之內部係被設爲真空狀 態，並被設爲在工程處理中所需要之真空氛圍。 在開閉閥42之上流側處的真空配管40，係被與將裝 載鎖定室2維持在特定之真空狀態的吸氣集合管14(真 空幫浦12的其中1個）作連接，在連接部處，係被設置 有對於流路作切換之流路選擇手段43。又，係被連接於 真空幫浦12之其中一個（真空幫浦12s)之吸氣管處， 在連接部處，係具備有流路選擇手段43。第2真空幫浦 41之最終段的容積室（排氣側），係藉由排氣管1 8來透 過真空維持閥27而被與排氣集合管19作連接。 當在第2真空捃浦41處產生了問題的情況時，藉由 以流路選擇手段43來將流路切換至真空幫浦1 2s側處， 能夠藉由真空幫浦12s來將加熱室3、第1處理室4、第 2處理室5、第3處理室6以及第4處理室7之內部設爲 真空狀態。故而，就算是在萬一發生問題的情況時，亦能 夠將在工程處理中所需要的真空氛圍作維持，並成爲能夠 繼續進行在加熱室3、第1處理室4、第2處理室5、第3 處理室6以及第4處理室7處之處理。 而，第2真空幫浦41之最終段的容積室（排氣 側），由於係藉由排氣集合管1 9以及輔助配管22而被與 真空幫浦12a作連接，因此，係能夠藉由真空幫浦12a來 進行第2真空幫浦41之最終段的容積室之排氣。藉由 此，在待機運轉時之第2真空幫浦41之動力，理論上， 由於並沒有流體之移送，因此係成爲僅有機械性損失，而 •24- 201139851 能夠將消耗電力大幅度地作削減。 根據圖1 0，針對真空幫浦1 2之旋轉控制作說明。 當藉由基板處理裝置1而進行工程處理的情況時，係 藉由第2真空幫浦41之驅動，來將裝載鎖定室2、加熱 室3、第1處理室4、第2處理室5、第3處理室6以及 第4處理室7設爲特定之真空狀態。 在進行將既存之真空狀態作維持之運轉（待機運轉） 的情況時’係藉由1個的真空幫浦12a來進行其他的真空 幫浦12之最終段的容積室之排氣，並維持其他的真空幫 浦12之最終段的真空。於此情況，其他的真空幫浦12之 旋轉，係被控制爲較進行將裝載鎖定室2設爲特定之真空 狀態之運轉的情況時之旋轉數而更低的旋轉數。亦即是， 在爲了維持裝載鎖定室2之真空壓所進行的真空幫浦12 之運轉時的旋轉數，係被設定爲能夠在特定之恢復時間內 而將裝載鎖定室2設爲特定之真空狀態的最小之旋轉數。 如圖10中所示一般，當真空幫浦12之旋轉數爲高的 情況時’爲了將裝載鎖定室2之真空壓作維持所需要的恢 復時間’係爲0秒。又，當真空幫浦1 2之旋轉數爲落在 特定之範圍內時（圖中的Tlrpm〜T3rpm之間），恢復至 將裝載鎖定室2之真空壓作維持的狀態之恢復時間，係不 會有大幅的變化。而’當真空幫浦1 2之旋轉數爲低的情 況時’恢復至將裝載鎖定室2之真空壓作維持的狀態之恢 復時間’係會變長（超過了圖中之點線）。 用以恢復至將裝載鎖定室2之真空壓作維持的狀態所 -25- 201139851 需之恢復時間，係以越快爲越理想，但是，由於在基板處 理裝置1中，係有多數的機器在作動，因此，係並不需要 使恢復時間成爲〇秒，只要是在特定之恢復時間內，則不 會對於基板處理造成影響。故而，係在恢復時間大略不會 作改變的範圍之旋轉數（圖中之Tlrpm〜T3rpm之間） 中，將在最短的恢復時間處之真空幫浦12的旋轉數（圖 中之T2rpm近旁），設爲真空幫浦12之旋轉數，並使其 運轉。 因此，在進行待機運轉的情況時，係能夠以最小的旋 轉數來使真空幫浦1 2作旋轉，而能夠對於消耗電力作抑 制。 根據圖11，針對在以特定之恢復時間而對於真空幫 浦1 2之旋轉作了控制的情況時之消耗電力的狀況作說 明。 如同在圖中以Η線所示一般，若是在時刻11處而成 爲待機運轉’則真空幫浦1 2之旋轉數係一直降低至在最 短的恢復時間處之旋轉數，而消耗電力係一直降低至了 P 1。又’如同圖中以點線所示一般，當將真空幫浦1 2之 旋轉數’控制爲在進行將裝載鎖定室2設爲特定之真空狀 態的運轉時之旋轉數的情況時，消耗電力係只會降低至較 P1而更高的P2處。 又’當使真空幫浦12從待機運轉而恢復至用以設爲 特定之真空狀態的運轉時之旋轉數的情況時，由於係成爲 從低旋轉數所進行之恢復，因此，不會有旋轉數變得過高 -26- 201139851 的情況’如同在圖中時刻t2處而以點線所展示一般，能 夠對於消耗電力暫時性地變高一事作抑制。 故而，係能夠將從時刻11起直到時刻12爲止的一次 之待機期間（直到恢復爲止的期間）中之消耗電力大幅度 的作削減’而成爲能夠對於能源之有效消耗有所助益。 另外’上述之真空幫浦1 2的旋轉數之控制，雖係列 舉出適用在第9實施形態例之真空排氣裝置3 8中的例子 而作了說明，但是’亦能夠適用在第1實施形態例〜第8 實施形態例之真空排氣裝置處的真空幫浦1 2之旋轉數的 控制中。 上述之真空排氣裝置，係能夠並不使用輔助幫浦便對 於複數台之真空幫浦1 2的消耗電力作抑制。 又，上述之基板處理裝置，係成爲具備有能夠並不使 用輔助幫浦便對於複數台之真空幫浦12的消耗電力作抑 制之真空排氣裝置的基板處理裝置。 [產業上之利用可能性] 本發明，係能夠在將處理室排氣爲真空狀態之真空排 氣裝置以及真空排氣方法的產業領域中作利用。 又，本發明，係能夠在被連接有真空排氣裝置之基板 處理裝置的產業領域中作利用。 【圖式簡單說明】 [圖1 ]本發明之第1實施形態例的基板處理裝置之槪 -27- 201139851 略系統圖。 [圖2]本發明之第2實施形態例的基板處理裝置之槪 略系統圖。 [圖3]本發明之第3贲施形態例的基板處理裝置之槪 略系統圖。 [圖4]本發明之第4實施形態例的基板處理裝置之槪 略系統圖。 [圖5]本發明之第5實施形態例的基板處理裝置之槪 略系統圖。 [圖6]本發明之第6實施形態例的基板處理裝置之槪 略系統圖。 [圖7]本發明之第7實施形態例的基板處理裝置之槪 略系統圖。 [圖8 ]本發明之第8實施形態例的基板處理裝置之槪 略系統岡。 [圖9]本發明之第9實施形態例的基板處理裝置之槪 略系統圖》 [圖10]幫浦旋轉數之狀況的圖表。 [圖π ]消耗電力之圖表。 【主要元件符號說明】 1 :基板處理裝置 2 :裝載鎖定室 3 :加熱室 -28- 201139851 4 :第1處理室 5 :第2處理室 6 :第3處理室 7 :第4處理室 11、 31、 32、 33、 34、 35、 36、 37、 38:真空排氣裝 12、 12a、12b :真空幫浦 1 3、4 0 :真空配管 1 4 :吸氣集合管 1 5 :吸氣管 16 :消音器 1 7 :排氣系 1 8、1 8 b :排氣管 1 9 :排氣集合管 2 1 :開閉閥 2 1 a :排氣調整閥 22 :輔助配管 23 :輔助排氣閥 24 :壓力檢測手段 27 :真空維持閥 2 8、4 2 :開閉閥 2 9 :減壓手段 3 0 :輔助減壓手段 41 :第2真空幫浦 -29-BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum exhausting device that evacuates a processing chamber to a vacuum state, and a vacuum exhausting method. Further, the present invention relates to a substrate processing apparatus to which a vacuum exhausting device is connected. [Prior Art] A processing apparatus for performing a film forming process for a wiring metal film is provided with a substrate processing chamber (processing chamber) for performing a specific process. The substrate processing chamber is evacuated by a vacuum pump and a vacuum environment corresponding to the treatment is made. In the film forming process, a gas having a high reactivity is used. Therefore, as a vacuum pump, a dry vacuum pump in which no oil is present in the suction chamber and a vacuum is obtained from atmospheric pressure is used. With the compositing of the semiconductor manufacturing process, the substrate processing apparatus which vacuum-vents all the processing chambers in a state in which a plurality of processing chambers are independent of each other has gradually become the mainstream of such equipment. Therefore, it is a vacuum evacuation device in which a plurality of vacuum pumps are connected in parallel. In order to obtain a specific vacuum environment, a plurality of vacuum pumps are operated to obtain a vacuum state of the substrate processing chamber, but, in response to the processing, it will become a rated operation that is useful for obtaining a specific vacuum state and will be obtained. The vacuum state is maintained (standby operation). The vacuum pump used in the vacuum exhaust device is generally a vacuum pump of volume transfer type. During operation, the volume portion of the final section is -5-201139851 and is repeatedly exposed during exhaust. In the atmosphere. In the standby operation, since the gas is not transferred, the operation of the vacuum pump is theoretically 〇, but it is necessary to set the volume of the final section to a vacuum state (for decompression). . Therefore, in the prior art, the auxiliary pump is provided for performing the exhaust of the volume portion of the final section, and the vacuum state of the volume portion of the final section is maintained by the auxiliary pump, thereby reducing the The operation of the vacuum pump in the standby operation is performed, and power consumption is suppressed (for example, refer to Patent Document 1 and Patent Document 2). In recent years, film formation of a wiring metal for a large-sized glass substrate such as a flat panel display has been carried out. Therefore, the volume of the treatment room is gradually increased. Even if the substrate becomes large, if the processing time is long, the productivity is still lowered. Therefore, in the vacuum evacuation device provided in the substrate processing apparatus having the processing chamber corresponding to the large substrate, the vacuum is m. The number of Pu's stations has increased so that even for large processing rooms, vacuum conditions can be obtained in a short period of time. Even in a vacuum exhaust apparatus having a plurality of vacuum pumps, it is also possible to use an auxiliary relay to suppress power consumption during standby operation. However, when the auxiliary pump is separately set for the vacuum of the plurality of stages, the number of units in the auxiliary Ningpu is increased, and the power consumption is reduced, but the equipment cost is higher. Therefore, in practice, it is difficult to apply to a vacuum exhaust apparatus having a vacuum pump having a plurality of stages. In addition, when one auxiliary pump is connected to a plurality of vacuum pumps, in addition to the equipment cost of the auxiliary pump itself, there is also a setting such as vacuum vacuum pumping. With the equipment cost of -6-201139851, etc., the cost of the equipment has increased significantly, and the same is actually difficult to apply to a vacuum exhaust unit having a vacuum pump having a plurality of stages. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-155988 [Patent Document 2] Japanese Patent Laid-Open Publication No. JP-A No. 2 0 0 3 -1 3 9 0 5 4 [Problem to be Solved] The present invention has been made in view of the above circumstances, and an object thereof is to provide a vacuum evacuation capable of suppressing power consumption of a plurality of vacuum pumps without using an auxiliary pump. Device and vacuum evacuation method. In addition, the present invention has been made in view of the above circumstances, and an object thereof is to provide a vacuum exhaust apparatus capable of suppressing power consumption of a plurality of vacuum pumps without using an auxiliary pump. Substrate processing device. [Means for Solving the Problems] In order to achieve the above object, a vacuum exhausting device of the present invention according to claim 1 is characterized in that: a plurality of vacuum pumps are provided in parallel with respect to a processing chamber, and The processing chamber is set to a specific vacuum state; and the exhaust manifold is connected to the exhaust side of the vacuum pump; and the auxiliary piping is at least one of the suction side of the vacuum pump 201139851 And the switching means is configured to switch the flow path of the at least one of the suction sides of the vacuum pump on the processing chamber side or the auxiliary piping side. In the present invention described in the first aspect of the invention, when the operation of maintaining the existing vacuum pressure state is performed, the passage and the row on the intake side of the vacuum pump are at least one by the switching means. The side of the gas collecting pipe is connected, and at least one vacuum pump is used to exhaust the volume of the final section of the other vacuum pump, so that the other vacuum pumps are caused by the gas transfer. The load is similar to 〇. As a result, by the operation of the switching means, it is possible to suppress the power consumption of the plurality of virtual cells without using the auxiliary pump. For a processing chamber that processes a large glass substrate such as a flat panel display, several or even a dozen vacuum pumps are arranged in parallel, but even in this case, when it is performed, When the vacuum pressure state is maintained, the vacuum of the final stage of the other vacuum pump is performed by one vacuum pump, and the power consumption of the other vacuum pump can be greatly increased. inhibition. That is, it is possible to suppress the power consumption similarly to the case where the auxiliary m-pulse is used separately for each vacuum. For example, when the invention of the present invention is applied to a vacuum exhaust device in which a vacuum pump of one turn is connected in parallel, it is possible to make an auxiliary pump that costs hundreds of thousands of dollars of equipment. In the state where the equipment cost of several million yuan is reduced, it is possible to achieve the same level of power consumption as when the auxiliary pump is used. That is, -8-201139851 is a case where a vacuum pump for operating the existing volume portion is maintained while maintaining the existing vacuum pressure state, for example, 7. 5 Kw consumes power, but when the final stage of the volumetric gas is implemented, the power consumption becomes, for example, 2. 5Kw. Therefore, when the equipment cost of several million yuan is used and the operation of the existing vacuum pressure is carried out, it is possible to reduce the power of 5 Kw for one vacuum pump system. In the vacuum exhausting apparatus of the present invention, the vacuum exhausting apparatus according to the first aspect of the present invention is characterized in that the vacuum pump is at least one of the vacuum pumps. The processing unit is connected, and the switching means is an exhaust gas regulating valve that opens and closes the flow path of the intake pipe at the intake pipe, and is connected to the intake pipe on the flow side of the valve. In the above-described auxiliary pipe, the auxiliary pipe is provided with an auxiliary exhaust that closes the auxiliary pipe in response to opening and closing of the exhaust gas regulating valve. In the invention of claim 2, the exhaust pipe is adjusted by exhaust gas. The opening and closing of the auxiliary exhaust valve is controlled, and the volume portion of the final stage of the other vacuum pump can be performed by at least one pump. This can be used for a simple vacuum pump power by a simple operation. For suppression. Further, in the vacuum exhausting apparatus of the present invention, the vacuum exhausting apparatus according to the first or the second aspect of the present invention is characterized in that the vacuum pump is not included in the vacuum pump The exhaust side is provided in a reduced state by the exhaust pipe and the required portion of the exhaust gas collection end portion, for example, the application item, and the flow path having the exhaust gas adjustment assisting valve. Valve and vacuum air. In the case of the above-mentioned exhaust pipe, the vacuum exhaust valve is opened and closed in conjunction with the opening and closing of the auxiliary exhaust valve. In the invention of claim 3, after the evacuation of the volume portion of the final stage of the other vacuum pump is performed by at least one vacuum pump, the exhaust pipe is closed by the vacuum maintenance valve. By this, the flow path on the exhaust side of the volume portion of the final stage of the other vacuum pump is maintained in a vacuum state, and the load at the time of exhausting the volume portion of the final stage can be minimized. The vacuum exhausting apparatus according to any one of the preceding claims, wherein the vacuum exhausting apparatus according to any one of the preceding claims, wherein the vacuum exhausting apparatus according to any one of claims 1 to 3 is characterized in that The decompressing means for decompressing the exhaust side of at least one of the vacuum pumps is used. In the invention of claim 4, the exhaust of the volume of the final stage of at least one vacuum pump can be performed by the decompression means, and the power consumption of at least one vacuum pump can be made. In the vacuum exhausting apparatus of any one of the above-mentioned items 1 to 4, the vacuum exhausting apparatus of the present invention is characterized by the following feature: A pressure detecting means for detecting a pressure state on the processing chamber side is provided, and the switching means operates based on the detection information of the pressure detecting means. In the invention of the fifth aspect of the invention, the switching means can be operated in response to the pressure state on the processing chamber side, and the operation of the vacuum vibration can be controlled in accordance with the actual pressure state. The pressure state on the processing chamber side can detect the pressure in the processing chamber, and can also detect the pressure in the collecting tube of the suction side of the plurality of vacuum -10- 201139851 pumps. In order to achieve the above object, the true method of the present invention of claim 6 is characterized in that, when the processing chamber is set to a specific vacuum state by a plurality of multiplexes arranged in parallel, the vacuum is used for the maintenance chamber. When the vacuum pump is operated by the pressure, one of the vacuum pumps is used to perform the exhaust of the other atmospheric open volume of the vacuum side. In the invention of the sixth aspect of the invention, when the vacuum pressure is maintained, the exhaust of the atmospheric open volume portion on the exhaust side of the vacuum pump is performed by using at least one of the vacuum pumps, and is not used. The auxiliary pump is used for the consumption of vacuum pumps of a plurality of sets. Further, in the vacuum evacuation method according to the invention of claim 7, the vacuum evacuation method according to the sixth aspect of the invention is characterized in that: in order to maintain the vacuum operation of the processing chamber, The other operation described above is performed by setting the number of rotations of the processing chamber to a specific number of revolutions at a specific vacuum rotation. According to the invention of the seventh aspect of the invention, since the vacuum pump is in a standby state, the number of rotations is controlled to be lower than the number of rotations in the operation state in which the processing chamber is in a specific state, and therefore, Power consumption is suppressed. Further, in the vacuum evacuation method according to the seventh aspect of the invention, the vacuum evacuation method according to the seventh aspect of the invention includes the following feature: the vacuum of the air exhausting means assists the exhaust state of the chamber by the pump In the case of the other applications, the power supply and the power supply are also applied in the application, that is, the other vacuum of the vacuum pump in the state of the empty pump is enough to apply the vacuum in the application item, -11 - 201139851 When the vacuum pump is operated by maintaining the vacuum pressure of the processing chamber, the number of rotations of the other vacuum pump is a rotation in which the processing chamber can be set to a specific vacuum state within a specific recovery time. number. According to the invention of claim 8, the number of rotations in the standby state in which the processing chamber is in a vacuum state can be controlled by the other vacuum pump in the standby state. The vacuum pump is rotated with a minimum number of rotations, and power consumption can be suppressed. The substrate processing apparatus of the present invention according to the application item 9 of the present invention is characterized in that the substrate processing chamber is provided with a substrate to be loaded and subjected to specific processing, and will be as in Application No. 1 to Application No. 5 The plurality of vacuum pumps of the vacuum exhaust apparatus described in any one of the above are connected in parallel to the substrate processing chamber. According to the invention of the ninth aspect of the invention, there is provided a substrate processing of a vacuum exhaust apparatus capable of suppressing power consumption of a plurality of vacuum pumps without using an auxiliary pump by the operation of the switching means. Device. Further, in the substrate processing apparatus of the invention of claim 9, the substrate processing apparatus according to the ninth aspect of the invention is characterized in that the substrate processing apparatus is different from the substrate processing apparatus. a second substrate processing chamber in which the substrate is loaded and subjected to a specific treatment, and a second vacuum pump is connected to the second substrate processing chamber, and one of the vacuum pumps and the second vacuum chamber are inhaled. The side is connected in parallel, and a flow--12-201139851 way selection means is provided at a connection portion between the vacuum pump and the second vacuum pump. In the invention of claim 10, even when there is a problem in the second vacuum pump in which the second substrate processing chamber is in a vacuum state, the vacuum can be used by the flow path selecting means. One of the pumps is connected to the second substrate processing chamber, and one of the vacuum pumps is applied to the vacuum maintenance of the second substrate processing chamber. Further, in the substrate processing apparatus according to the first aspect of the invention, the substrate processing apparatus according to the first aspect of the present invention has the following features, that is, in the exhaust manifold, The exhaust side of the second vacuum pump is configured to discharge the fluid on the exhaust side of the second vacuum pump via the exhaust manifold by at least one of the vacuum pumps. In the invention according to the eleventh aspect of the invention, when the operation of maintaining the vacuum pressure state is performed during the standby operation of the second vacuum pump or the like, the exhaust side of the second vacuum pump can be performed by the vacuum pump. The exhaust of the volume portion can suppress the power consumption of the exhaust gas for performing the second vacuum pump. [Effects of the Invention] The vacuum exhausting apparatus and the vacuum exhausting method of the present invention can suppress the power consumption of a plurality of vacuum pumps without using an auxiliary pump. Further, the substrate processing apparatus of the present invention is a substrate processing apparatus including a vacuum evacuation device capable of suppressing power consumption of a plurality of vacuum pumps without using an auxiliary pump. -13-201139851 [Embodiment] The embodiment shown below is a substrate processing apparatus, and applies a treatment to a large-sized glass substrate, and a heating device, a plasma CVD device, a sputtering device, a dry etching device, and the like. An in-line vertical processing device in which a processing chamber (loading lock chamber: substrate processing chamber) is used to carry in and out the substrate from the processing chamber (load lock chamber: substrate processing chamber) at one end of the processing chamber is taken as an example. To illustrate. Further, at the load lock chamber, a plurality of vacuum pumps are connected in parallel, and the inside of the processing chamber including the load lock chamber is set to a specific vacuum state by the driving of the vacuum pump. The substrate processing apparatus to which the present invention is applied is not limited to the in-line type vertical processing apparatus shown in the embodiment, and may be applied to a central portion including a substrate transfer common chamber and supplied to the substrate. The periphery of the chamber is provided with a substrate processing apparatus having a plurality of substrate processing chambers, or a batch type substrate processing apparatus which is applied to batch processing by one processing chamber. An embodiment of the present invention will be described with reference to Figs. 1 to 1 . In Fig. 1, a schematic system of a substrate processing apparatus according to a first embodiment of the present invention is shown in Fig. 2, and a schematic system of a substrate processing apparatus according to a second embodiment of the present invention is shown. In FIG. 3, a schematic system of a substrate processing apparatus according to a third embodiment of the present invention is shown in FIG. 4, and a schematic system of a substrate processing apparatus according to a fourth embodiment of the present invention is shown. In Fig. 5, a schematic system of a substrate processing apparatus according to a first embodiment of the present invention is shown in Fig. 6, and a substrate processing apparatus according to a sixth embodiment of the present invention is used. The system of the substrate processing apparatus according to the seventh embodiment of the present invention is shown in FIG. 7, and the substrate processing apparatus according to the eighth embodiment of the present invention is shown in FIG. Slightly systematic display. Further, Fig. 9 shows a schematic system of a substrate processing apparatus according to a ninth embodiment of the present invention, and in Fig. 10, power consumption and recovery for representing the number of revolutions with respect to the vacuum pump. A graph showing the relationship between time' is shown in Figure 11 for a graph representing changes in power consumption. In the first embodiment to the ninth embodiment, the same components are denoted by the same reference numerals, and the description thereof will not be repeated. A first embodiment will be described with reference to Fig. 1 . The substrate processing apparatus 1 shown in the drawing is a vertical processing apparatus that processes a large glass substrate (substrate: for example, a flat panel display) that is held slightly vertically, and is a load lock chamber 2 and a heating chamber 3 The first processing chamber 4, the second processing chamber 5, the third processing chamber 6, and the fourth processing chamber 7 are sequentially connected to each other. Inside the substrate processing apparatus 1, a forward path and a return path for transporting the substrate are provided from the load lock chamber 2 to the fourth processing chamber 7. The substrate carried into the load lock chamber 2 is held in a vacuum state in the load lock chamber 2, and then heated in the heating chamber 3, and sequentially transported to the first processing chamber 4 to the fourth In the processing chamber 7, the path of the -15-201139851 is reversed, and the fourth processing chamber 7 to the first processing chamber 4 and the heating chamber 3 are returned to the load lock chamber 2, and are carried out again. At the load lock chamber 2, a vacuum exhaust unit 11 is connected, and the inside of the processing chamber including the plurality of load lock chambers 2 is set to a specific vacuum state by the vacuum exhaust unit 11. Each of the processing chambers is a processing chamber that is larger than the large substrate. In order to maintain the exhaust speed at a specific speed, the vacuum exhaust unit 11 is provided in parallel with a plurality of stages (in the figure). In the example, it is a vacuum pump 12 of 10 units. The vacuum exhaust device 11 will be described. At the load lock chamber 2, the other end of the vacuum pipe 13 is connected to the other end of the vacuum pipe 13 and is connected to the suction manifold 14. At the suction side of the vacuum manifold 1 of the 1st stage, the suction pipe 15' is separately connected to the suction pipe 15, and is connected to the suction manifold 14", that is, '10 vacuums The coin cylinder 12 is connected in parallel to the substrate processing apparatus 1 by the respective intake pipes 15, one suction collecting pipe 14 and the vacuum piping 13 . The ten vacuum pumps 12 are, for example, a dry transfer type of a volume transfer type. At the volume portion (volume chamber) of the final stage, an exhaust system 17 having a muffler 16 is connected. By driving one set of vacuum pumps 12 at each vacuum m-stage 12, the flow system from the suction side is sequentially transferred to the volume chamber and transferred to the exhaust side. It is then exhausted from the volume chamber of the final section to the exhaust system 17 . By this, it is possible to obtain the desired hollow state. In the case of performing the operation (standby operation) of maintaining the existing vacuum-16-201139851 state in the above-described vacuum exhaust apparatus 11, the vacuum pump 12a is used (the fifth from the right in the figure) ) to exhaust the volume chamber of the final section of its empty pump 12, and maintain the vacuum of the final section of the other pump. Thereby, the power of the vacuum pump 12 during the standby operation is theoretically, since there is no flow, so that it is only mechanically lost, and the vacuum pump can be consumed without using a pump or the like. Power is greatly reduced. In addition, as the vacuum pump for maintaining other vacuum pumps, it is also possible to use other vacuum pumps 12 and true 12a. The configuration of the vacuum for maintaining the final stage of the other pump 12 by one vacuum pump 12a will be described. At the volume chamber (exhaust side) of the 12-stage vacuum pump (except the vacuum pump l2a), one end of the exhaust pipe is connected, and the other is provided with the exhaust pipe 18 Connected to the exhaust manifold 19. On the other hand, at the suction pipe 15 of the vacuum pump 12 (empty pump 12a), an opening and closing valve of 2 1 'vacuum pump 1 2a is provided, which is an exhaust gas regulating valve: cover exhaust gas adjustment An auxiliary pipe 22 is provided in the vacuum pump 2a side of the valve 21a and the exhaust gas collection f', and an auxiliary exhaust valve 23 (switching means) is provided in the auxiliary pipe 22. The opening/closing operation is performed with the exhaust gas regulating valve 2 1 a (opening and closing valve 2 1 ). The auxiliary exhaust valve 23 performs an opening and closing operation. That is, when the whole valve 2 1 a (opening and closing valve 2 1 ) is opened, the auxiliary exhaust is one of the other vacuums of the other body, and the vacuum is finally applied to the end of the empty pump. The end of the 18th connection contains the true opening and closing valve 1 a. The cull tube 19 is set to be connected. The exhaust gas adjustment 23 series -17-201139851 is turned off, and the substrate processing apparatus 1 is set to a specific vacuum state by the driving of all the vacuum pumps 12. Further, during the standby operation, the exhaust gas regulating valve 2 1 a (opening and closing valve 2 1 ) is closed, and the auxiliary exhaust valve 2 3 is opened, and the other vacuum chambers 1 2 are the final stage of the volume chamber. The fluid 'is exhausted by the vacuum pump 12a via the exhaust pipe 18, the exhaust manifold 1 9 and the auxiliary pipe 2 2, and is maintained in a vacuum state. Further, at the suction collecting pipe 14, a pressure detecting means (pressure sensor) 24 is provided, and based on the detection information of the pressure detecting means 24, the exhaust adjusting valve 2 1 a (opening and closing valve 2 1) The opening and closing operation and the closing operation of the auxiliary exhaust valve 23 are controlled, that is, the pressure is controlled according to the pressure (the degree of vacuum: the degree of vacuum of the substrate processing apparatus 1) of the intake manifold. action. Further, a pressure detecting means may be provided in an appropriate place of the substrate processing apparatus 1, and the degree of vacuum on the substrate processing apparatus 1 side may be directly detected, and the operation of the vacuum exhaust apparatus Π may be controlled. The operation of the substrate processing apparatus 1 including the above-described vacuum exhaust apparatus 11 will be described. The substrate "the flat panel display or the like carried into the load lock chamber 2 is held in the load lock chamber 2 and held in a vacuum state, and then heated in the heating chamber 3, and sequentially transported to the first process. In the chamber 4 and the fourth processing chamber 7, the passage path is reversed, and the fourth processing chamber 7 to the first processing chamber 4 and the heating chamber 3 are returned to the load lock chamber 2, and are carried out. During this period, the treatment of -18-201139851 was applied in the vacuum processing chamber. In the substrate processing apparatus 1, the vacuum chamber 11 is used to set the processing chamber to a specific vacuum state. When the operation for obtaining the vacuum state required in the process is performed, the exhaust gas adjusting valve 2 1 a (opening and closing valve 2 1 ) is opened and the auxiliary exhaust valve 23 is closed by 1 The substrate processing apparatus 1 is driven to a specific vacuum state (vacuum state corresponding to the process) by driving the vacuum pump 12 of the platform. When the operation of maintaining the existing vacuum state (standby operation) is performed in the conveyance path of the substrate or the like, the exhaust gas adjustment valve 2 1 a (opening and closing valve 21) is closed and the auxiliary exhaust valve 23 is blocked. Turning on, except for one vacuum pump l2a, the fluid in the volume chamber of the final stage of the vacuum pump 12 is passed through the exhaust pipe 18, the exhaust manifold 19, and the auxiliary pipe 22 by vacuum Pu 12a is exhausted and maintained in a vacuum state. By this, during the standby operation, the other chambers of the vacuum pump 1 2 will not be opened to the atmosphere, and the other vacuum pumps will not be used for the final segment. The power required to depressurize the chamber from the atmosphere to a vacuum. Therefore, the power of the vacuum pump 12 is theoretically, since there is no fluid transfer, it is a mechanical loss only, and the power consumption of the vacuum pump 12 can be greatly reduced without using an auxiliary pump or the like. reduce. In the substrate processing apparatus 1 for processing a large-sized glass substrate such as a flat panel display, for example, 10 vacuum pumps 1 2 are arranged in parallel 'however, even in this case, in standby -19-201139851 During the operation, the evacuation of the volume of the final stage of the other vacuum pump 12 is carried out by one vacuum chamber 12a, and the power consumption of the other vacuum pumps 1 2 can be greatly increased. For suppression. In other words, it is possible to suppress the power consumption similarly to the case where the auxiliary pump is separately provided for each vacuum pump 12. Further, the power consumption of the plurality of vacuum pumps 12 is suppressed by a simple simple operation for controlling only the opening of the exhaust gas regulating valve 21a and the auxiliary exhaust valve 23. A second embodiment will be described with reference to Fig. 2 . The vacuum exhaust unit 3 1 of the second embodiment of the present invention is configured to include a vacuum holding valve 27 at the exhaust pipe 18 of the vacuum exhaust unit 11 shown in the drawing. The vacuum maintenance valve 27 is opened and closed in conjunction with the auxiliary exhaust valve 2 3 . That is, when the auxiliary exhaust valve 23 is opened, the vacuum maintenance valve is opened, and the exhaust system of the volume chamber of the final stage of the other vacuum pump is performed by one vacuum pump 12a, When the auxiliary exhaust valve 23 is closed, the vacuum maintenance valve 27 is closed, and the vacuum state of the final chamber is maintained during the operation of all the vacuums. Therefore, after the evacuation of the volume portion of the final stage of the vacuum pump 12 is performed by at least one vacuum pump 12a, the exhaust pipe 18 is closed by the vacuum holding valve 27, In this way, the flow path including the auxiliary pipe from the auxiliary exhaust gas 23 to the vacuum maintenance valve 27 is maintained in a vacuum state, and the final segment can be used to close the phase. 2 7 12 ～ ～ ～ ～ ～ ～ ～ ～ ～ 398 -20 -20 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 A third embodiment will be described with reference to Fig. 3 . The vacuum exhaust unit 3 2 of the third embodiment is provided with a decompression means 2 at the exhaust side of the vacuum exhaust unit 12a of one of the vacuum exhaust units 11 shown in Fig. 1 . Composition. That is, the volume chamber of the final stage of the vacuum pump 12a is decompressed by the decompression means 29, and the vacuum chamber 12a is used to decompress the final stage processing chamber from the atmosphere. The power required to reach the vacuum is not required. Therefore, the power of the one vacuum pump 12a is theoretically such that there is no fluid transfer, so that only the mechanical loss is obtained, and the power consumption of all the vacuum pumps 12 can be greatly suppressed. A fourth embodiment will be described with reference to Fig. 4 . The vacuum exhaust unit 33 of the fourth embodiment is configured to include the vacuum maintenance valve 27 shown in Fig. 2 and the pressure reducing means 2 9 shown in Fig. 3. Therefore, the vacuum state at the start of the exhaust operation of the volume chamber of the final stage obtained by the one vacuum pump 1 2 a is maintained, and the power consumption of all the vacuum pumps 1 2 can be maintained. Make a substantial reduction. A fifth embodiment will be described with reference to Fig. 5 . The vacuum exhausting device 34 of the fifth embodiment is connected to the suction pipe 15 of the vacuum pump 12b adjacent to the vacuum pump Ua of the vacuum exhausting device 11 shown in Fig. 1, and the connection assisting The branch pipe 22b' of the pipe 22 is provided with an opening and closing valve 28 at the exhaust pipe 18b. That is, -21 - 201139851 is, as the vacuum pump 12a is prepared, and the adjacent vacuum pump 1 2b is set as the row of the volume chamber for performing the final stage of the other vacuum pumping 12 The composition of the gas pump. When a problem occurs in the vacuum relay 12a, the auxiliary exhaust valve 23 is closed, and the auxiliary exhaust valve 23b of the branch pipe 22b is opened, and the opening and closing valve 28 is closed, and the phase is closed. The adjacent vacuum pump 1 2b is used to exhaust the volume chamber of the final section of the other vacuum pump 1 2 . Therefore, even if there is a problem in the vacuum relay 12a, the suppression of the power consumption of the vacuum ballast 12 can be performed. A sixth embodiment will be described with reference to Fig. 6 . The vacuum exhausting device 35 of the sixth embodiment is combined with the vacuum pump 12b shown in FIG. 2 as a backup and the adjacent vacuum pump 12b is used as a backup. Composition. Therefore, it is possible to minimize the load when the exhaust of the volume portion of the final stage is performed next, and to perform the exhaust operation of the volume chamber with good responsiveness, and at the same time, even at 1 2a of the vacuum Ningpu There is a problem, and it is possible to surely suppress the power consumption of the vacuum pump 12. The seventh embodiment will be described with reference to Fig. 7 . The vacuum exhaust unit 3 6 of the seventh embodiment is constructed by using the decompression means 29 shown in Fig. 3 and the vacuum chamber 12b which is adjacent to each other as shown in Fig. 5 as a backup. Further, in the combined configuration, the auxiliary decompression means 30 for exhausting the volume chamber of the final stage of the adjacent vacuum pump 12b is further provided. Therefore, even if there is a problem in the vacuum pump 12a, it is possible to surely suppress the power consumption of the vacuum pump 12 by -22-201139851, and it is also possible to carry out the vacuum pump 12a and the vacuum gang. The suppression of the power consumption of the vacuum pump 1 of all the pumps of the i2b. An eighth embodiment will be described with reference to Fig. 8 . The vacuum exhaust unit 37 of the eighth embodiment is a vacuum pump that uses the vacuum maintenance valve 27 shown in Fig. 2 and the pressure reducing means 29 shown in Fig. 7 as a backup. The combination of 12b and auxiliary decompression means 30 is combined. Therefore, it is possible to minimize the load when the exhaust of the volume portion of the final stage is performed next, and to perform the exhaust operation of the volume chamber with good responsiveness, and even at the vacuum pump 12a. When there is a problem, it is possible to surely suppress the power consumption of the vacuum pump 12, and further, it is possible to suppress the power consumption of all the vacuum pumps 12 including the vacuum pump 12a and the vacuum pump 12b. The ninth embodiment will be described with reference to Figs. 9 to 1 . The vacuum exhaust unit 38 of the ninth embodiment is configured such that the auxiliary pressure reducing means 30 of the vacuum exhaust unit 37 shown in Fig. 8 is omitted. In the heating chamber 3, the first processing chamber 4, the second processing chamber 5, the third processing chamber 6, and the fourth processing chamber 7, which are the second substrate processing chambers, one is connected via the vacuum piping 40. The second vacuum pump 41 is provided with the opening and closing valve 42 at the vacuum piping 40 on the intake side of the second vacuum pump 41, and the second vacuum pump 41 is opened by the opening and closing valve 42 and driven. The inside of the heating chamber 3, the first processing chamber 4, the second processing chamber 5, the -23-201139851, the third processing chamber 6, and the fourth processing chamber 7 are in a vacuum state, and are set in the engineering process. The vacuum atmosphere needed. The vacuum piping 40 at the upstream side of the opening and closing valve 42 is connected to the suction collecting pipe 14 (one of the vacuum pumps 12) that maintains the load lock chamber 2 in a specific vacuum state at the joint portion. The flow path selecting means 43 for switching the flow path is provided. Further, it is connected to an intake pipe of one of the vacuum pumps 12 (vacuum pump 12s), and a flow path selecting means 43 is provided at the joint portion. The volume chamber (exhaust side) of the final stage of the second vacuum pump 41 is connected to the exhaust manifold 19 by the exhaust pipe 18 through the vacuum maintenance valve 27. When a problem occurs in the second vacuum pump 41, the flow path is switched to the vacuum pump 1 2s side by the flow path selecting means 43, and the heating chamber 3 can be moved by the vacuum pump 12s. The inside of the first processing chamber 4, the second processing chamber 5, the third processing chamber 6, and the fourth processing chamber 7 is in a vacuum state. Therefore, even in the event of a problem, the vacuum atmosphere required for the engineering process can be maintained, and the heating chamber 3, the first processing chamber 4, and the second processing chamber 5 can be continued. Processing in the third processing chamber 6 and the fourth processing chamber 7. The volume chamber (exhaust side) of the final stage of the second vacuum pump 41 is connected to the vacuum pump 12a by the exhaust manifold 19 and the auxiliary piping 22, and therefore The vacuum pump 12a performs the exhaust of the volume chamber of the final stage of the second vacuum pump 41. Therefore, in the standby operation, the power of the second vacuum pump 41 is theoretically, since there is no fluid transfer, it is only a mechanical loss, and the 24-201139851 can greatly reduce the power consumption. reduce. According to Fig. 10, the rotation control of the vacuum pump 12 will be described. When the engineering processing is performed by the substrate processing apparatus 1, the load lock chamber 2, the heating chamber 3, the first processing chamber 4, and the second processing chamber 5 are driven by the driving of the second vacuum pump 41. The third processing chamber 6 and the fourth processing chamber 7 are in a specific vacuum state. When the operation of maintaining the existing vacuum state (standby operation) is performed, the evacuation of the volume chamber of the final stage of the other vacuum pump 12 is performed by one vacuum pump 12a, and the other is maintained. Vacuum of the final section of the vacuum pump 12. In this case, the rotation of the other vacuum pump 12 is controlled to be lower than the number of rotations when the load lock chamber 2 is operated in a specific vacuum state. That is, the number of rotations during the operation of the vacuum pump 12 for maintaining the vacuum pressure of the load lock chamber 2 is set so that the load lock chamber 2 can be set to a specific vacuum within a specific recovery time. The minimum number of rotations of the state. As shown in Fig. 10, when the number of rotations of the vacuum pump 12 is high, the "recovery time required for maintaining the vacuum of the load lock chamber 2" is 0 seconds. Further, when the number of rotations of the vacuum pump 12 falls within a specific range (between T1 rpm and T3 rpm in the drawing), the recovery time to the state in which the vacuum of the load lock chamber 2 is maintained is maintained. There will be a big change. On the other hand, when the number of rotations of the vacuum pump 12 is low, the recovery time to return to the state in which the vacuum pressure of the load lock chamber 2 is maintained becomes longer (exceeding the dotted line in the figure). In order to return to the state in which the vacuum of the load lock chamber 2 is maintained, the recovery time required is -201539851, which is more desirable, but in the substrate processing apparatus 1, a large number of machines are Actuation, therefore, does not require the recovery time to be a leap second, as long as it is within a specific recovery time, it will not affect the substrate processing. Therefore, in the range of the rotation of the range where the recovery time is not changed much (between Tlrpm and T3rpm in the figure), the number of rotations of the vacuum pump 12 at the shortest recovery time (near T2rpm in the figure) Set the number of rotations of the vacuum pump 12 and operate it. Therefore, when the standby operation is performed, the vacuum pump 12 can be rotated with a minimum number of rotations, and the power consumption can be suppressed. According to Fig. 11, a description will be given of a state of power consumption in the case where the rotation of the vacuum pump 12 is controlled with a specific recovery time. As shown by the Η line in the figure, if it is in the standby operation at time 11, the number of rotations of the vacuum pump 12 is reduced to the number of rotations at the shortest recovery time, and the power consumption is always reduced. To P 1. In the case where the number of rotations of the vacuum pump 12 is controlled to be the number of rotations during the operation of setting the load lock chamber 2 to a specific vacuum state, as shown by the dotted line in the figure, power consumption is performed. The system will only be lowered to P2 which is higher than P1. Further, when the vacuum pump 12 is returned from the standby operation to the number of rotations during the operation to be in a specific vacuum state, since the recovery is performed from the low rotation number, there is no rotation. When the number becomes too high -26-201139851', as shown by the dotted line at the time t2 in the figure, it is possible to suppress the power consumption temporarily becoming higher. Therefore, it is possible to greatly reduce the power consumption in the standby period (the period until the recovery) from the time 11 until the time 12, and it is possible to contribute to the effective consumption of energy. In addition, although the control of the number of rotations of the above-described vacuum pump 1 2 is described as an example of the vacuum exhaust device 38 of the ninth embodiment, it can be applied to the first embodiment. In the control of the number of revolutions of the vacuum pump 12 in the vacuum exhaust apparatus of the eighth embodiment. The vacuum exhausting apparatus described above can suppress the power consumption of the vacuum pump 12 of a plurality of stages without using the auxiliary pump. Further, the substrate processing apparatus described above is a substrate processing apparatus including a vacuum exhausting apparatus capable of suppressing the power consumption of the plurality of vacuum pumps 12 without using an auxiliary pump. [Industrial Applicability] The present invention can be utilized in the industrial field of a vacuum exhausting device and a vacuum exhausting method in which a processing chamber is evacuated to a vacuum state. Further, the present invention can be utilized in the industrial field of a substrate processing apparatus to which a vacuum exhaust apparatus is connected. [Brief Description of the Drawings] [Fig. 1] A schematic diagram of a substrate processing apparatus according to a first embodiment of the present invention, -27-201139851. Fig. 2 is a schematic system diagram of a substrate processing apparatus according to a second embodiment of the present invention. Fig. 3 is a schematic system diagram of a substrate processing apparatus according to a third embodiment of the present invention. Fig. 4 is a schematic system diagram of a substrate processing apparatus according to a fourth embodiment of the present invention. Fig. 5 is a schematic system diagram of a substrate processing apparatus according to a fifth embodiment of the present invention. Fig. 6 is a schematic system diagram of a substrate processing apparatus according to a sixth embodiment of the present invention. Fig. 7 is a schematic system diagram of a substrate processing apparatus according to a seventh embodiment of the present invention. Fig. 8 is a schematic diagram of a substrate processing apparatus according to an eighth embodiment of the present invention. Fig. 9 is a schematic diagram of a substrate processing apparatus according to a ninth embodiment of the present invention. Fig. 10 is a graph showing the state of the number of revolutions of the pump. [Figure π] Chart of power consumption. [Description of main component symbols] 1 : Substrate processing apparatus 2 : Load lock chamber 3 : Heating chamber -28 - 201139851 4 : First processing chamber 5 : Second processing chamber 6 : Third processing chamber 7 : Fourth processing chamber 11 31, 32, 33, 34, 35, 36, 37, 38: vacuum exhaust installation 12, 12a, 12b: vacuum pump 1 3, 4 0 : vacuum piping 1 4 : suction manifold 1 5 : suction pipe 16 : Silencer 1 7 : Exhaust system 1 8 , 1 8 b : Exhaust pipe 1 9 : Exhaust manifold 2 1 : Opening and closing valve 2 1 a : Exhaust valve 22 : Auxiliary pipe 23 : Auxiliary exhaust valve 24: Pressure detecting means 27: Vacuum maintenance valve 2 8, 4 2 : Opening and closing valve 2 9 : Decompression means 3 0 : Auxiliary decompression means 41 : 2nd vacuum pump -29-