201134343 六、 [0001] [0002] Ο [0003] 〇 [0004] [0005] [0006] 發明說明： 【發明所屬之技術領域】 本發明涉及一種電子裝置外殼，尤其涉及一種表面具有 陶瓷塗層之電子裝置外殼及其製作方法。 [先前技術] 無線通信與資訊處理技術之迅速發展，行動電話、個人 數位助理（personal digital assistant，pDA)等 可攜式電子裝置競相湧現，令消費者可隨時隨地充分享 受高科技帶來之種種便利。該等可攜式電子裝置除了在 功能上更新、擴充之外，随著流行、使用者之愛好，亦 不斷於外觀上、造型上推陳出新。 習知之可攜式電子裝置外殼主要有兩類，其一金屬殼體 ，其色彩較為單一，即使於其表面形成烤漆層、電鍍層 等保護或裝飾性塗層，亦常因使用時不當之碰撞而產生 掉皮之現象，使外觀不再美觀亮眼；另一類為塑膠殼體 ，雖然色彩較多，然，由於材料硬度不夠，故在使用過 程中容易使殼鵲条表面產生刮痕’破壞原有之美觀。 【發明内容】 有鑒於此，有必要提供一種強度較好、耐到傷之電子事 置外殼。 另，還有必要提供一種上述電子裝置外殼之製作方法。 一種電子裝置外殼，包括一金屬基體，該電子裝置外殼 還包括一陶瓷塗層，該金屬基體之厚度為0. 4~〇. 6mm , 該陶瓷塗層藉由熱喷塗直接形成於該金屬基體之表面上 099109017 表單編號A0101 第3頁/共15頁 0992016096-0 201134343 ，該金屬基體與該陶瓷塗層接觸部分之表面為經過粗化 處理之粗糙面。 [0007] —種電子裝置外殼之製作方法，其包括如下步驟： [0008] 提供一金屬基體，其厚度為0. 4〜0. 6mm ; [0009] 對該金屬基體之預設表面進行粗化處理； [0010] 將該金屬基體放置於一内部通循環冷卻水之喷塗治具上 ，於其預設表面熱喷塗一陶瓷塗層； [0011] 對該陶瓷塗層進行打磨拋光，使其表面粗糙度為0.卜0. 3 /z m 〇 [0012] 上述外殼於其金屬基體之表面塗覆一陶瓷塗層，該陶瓷 塗層與金屬基體結合牢固。藉由該陶瓷塗層優異之耐磨 耗性、高硬度、高表面緻密性以克服傳統塑膠或金屬材 質之缺陷，使該外殼具有高耐磨損、耐刮擦、可持久保 持外觀亮麗之優點。上述電子裝置外殼之製作方法藉由 將該金屬基體放置於一内部可通循環冷卻之喷塗治具上 ，可防止熱喷塗時金屬基體受熱變形。 【實施方式】 [0013] 請參閱圖1，本發明第一實施例之電子裝置外殼10，其包 括一金屬基體12及一陶瓷塗層14。 [0014] 金屬基體12可由不銹鋼、鋁合金等製成，其厚度大約為 0.4〜0. 6mm，本實施例為0. 5mm。金屬基體12包括一第 一表面122及與該第一表面122相反之第二表面124。第 一表面122為一粗链面，其粗糙度Ra大約為1.3〜2.0 ;zm 099109017 表單編號A0101 第4頁/共15頁 0992016096-0 201134343 。陶瓷塗層14直接形成於談第一表面122上，其覆蓋整個 第一表面122。陶瓷塗層14由三氧化二鋁（A190Q)、四 L 〇 氧化三鐵（Fe3〇4)、氧化鈦（Ti〇2)等氧化物陶瓷材料之一 種製成，其厚度大約為0. 12〜0. 14mm，表面粗糙度為 0. 1~0. 3/zm。因上述陶瓷材料自身具有顏色，可以根據 顏色之需要選擇陶瓷材料，比如，用三氧化二鋁製得之 陶瓷塗層為白色，用四氧化三鐵製得之陶瓷塗層為黑色 ，而用氧化鈦製得之陶瓷塗層則為深藍色。 [0015] 上述電子裝置外殼10之製作方法為： [0016] 首先，提供一金屬基體12。 [0017] 對金屬基體12之第一表面122進行粗化處理，使第一表面 12 2之粗糙度（Ra )為1. 3〜2. 0 // m。本實施例採用喷砂 之方法對第一表面122進行粗化，噴砂所用材料可選自金 剛砂、鉻鐵合金砂、銅礦砂、石英砂及陶瓷砂之其中一 種，本實施例採用粒度為60目之白剛玉砂《金剛砂之一種 )° [0018] 採用熱喷塗方法於第一表面122喷塗一陶瓷塗層14，該步 驟最好在粗化處理完成後4小時内進行。該熱喷塗方法可 採用以氧-乙炔為燃氣、空氣為送料氣之火焰喷塗法。喷 塗材料可選自三氧化二鋁、四氧化三鐵、氧化鈦等氧化 物陶瓷材料之一種。因金屬基體12較薄，熱喷塗過程中 易受熱變形，為防止變形，因此喷塗過程中將金屬基材 12放置於一喷塗治具上，該喷塗治具内部可通循環冷卻 水，由此可對金屬基材進行冷卻，防止其過熱變形。該 099109017 表單編號A0101 第5頁/共15頁 0992016096-0 201134343 喷塗形成之陶瓷塗層14之初始粗糙度大約為2. 1~2. 3#πι ο [0019] 對喷塗後之金屬基體12進行打砂粗拋，以去除陶瓷塗層 14較粗糙之表層。經上述熱該步驟係將金屬基體12固定 於一治具上，使用一循環運行之金字塔型金剛石砂帶對 金屬基體12之陶瓷塗層14進行打磨，打磨之同時最好用 水喷淋砂帶進行冷卻，以避免打磨過程中產生過熱使金 屬基體12變形。所述金字塔型金剛石砂帶可採用3Μ公司 出品之粒度型號為Α45(即顆粒之平均尺寸為45/zm，對應 f| 歐洲標準之粒度型號為P400)之金字塔型金剛石砂帶。打 砂粗拋後，陶瓷塗層14之粗糙度大約為1. 0~1. 4 # m。 [0020] 之後進行打砂細磨，，以去除打砂粗拋時留下之砂帶痕跡 。該步驟與打砂粗拋步驟之操作類似，不同之處在於所 使用之砂帶為氧化鋁砂帶，比如可採用粒度型號為 800〜1 000之氧化鋁砂帶。打砂細磨後，掏瓷塗層14之粗 縫度大約為0. 5〜0. 8/zm。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device housing, and more particularly to a surface having a ceramic coating. Electronic device housing and method of manufacturing the same. [Prior Art] With the rapid development of wireless communication and information processing technology, portable electronic devices such as mobile phones and personal digital assistants (pDAs) are competing to emerge, enabling consumers to fully enjoy the high-tech products at any time and any place. convenient. In addition to functional updates and expansions, these portable electronic devices continue to evolve in appearance and style with the popularity and user hobbies. There are two main types of portable electronic device casings. One of the metal casings has a single color. Even if a protective layer or a decorative coating such as a baking layer or a plating layer is formed on the surface thereof, it is often caused by improper collision. The phenomenon of peeling off makes the appearance no longer beautiful and bright; the other type is plastic shell, although the color is more, of course, due to the insufficient hardness of the material, it is easy to cause scratches on the surface of the shell strip during use. Original beauty. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an electronic housing having a good strength and resistance to injury. In addition, it is also necessary to provide a method of fabricating the above electronic device housing. An electronic device housing comprising a metal substrate, the electronic device housing further comprising a ceramic coating, the metal substrate having a thickness of 0. 4~〇. 6mm, the ceramic coating is directly formed on the metal substrate by thermal spraying On the surface of 099109017, the form number A0101, page 3 / page 15 0992016096-0 201134343, the surface of the metal substrate and the ceramic coating contact portion is a roughened surface. [0007] A method of fabricating an electronic device housing, comprising the following steps: [0008] providing a metal substrate having a thickness of 0. 4~0. 6mm; [0009] roughening the predetermined surface of the metal substrate [0010] placing the metal substrate on a spray fixture having internal circulating cooling water, thermally spraying a ceramic coating on the predetermined surface thereof; [0011] polishing and polishing the ceramic coating The surface roughness is 0. 3 /zm 〇 [0012] The outer casing is coated with a ceramic coating on the surface of the metal substrate, and the ceramic coating is firmly bonded to the metal substrate. By virtue of the excellent wear resistance, high hardness and high surface compactness of the ceramic coating to overcome the defects of the traditional plastic or metal material, the outer casing has high wear resistance, scratch resistance and long-lasting appearance. . The manufacturing method of the electronic device casing can prevent the metal substrate from being thermally deformed during thermal spraying by placing the metal substrate on a spray fixture which can be circulated and cooled. [Embodiment] Referring to Figure 1, an electronic device housing 10 according to a first embodiment of the present invention includes a metal substrate 12 and a ceramic coating 14. 5mm。 The embodiment of the present invention is 0. 5mm. The embodiment of the present invention is 0. 5mm. The metal substrate 12 includes a first surface 122 and a second surface 124 opposite the first surface 122. The first surface 122 is a thick chain surface having a roughness Ra of about 1.3 to 2.0; zm 099109017 Form No. A0101 Page 4 of 15 0992016096-0 201134343. The ceramic coating 14 is formed directly on the first surface 122 that covers the entire first surface 122. The thickness of the ceramic coating material is made up of a thickness of about 0. 12~ 0〜3米。 0. 14mm, surface roughness of 0. 1~0. 3/zm. Since the ceramic material itself has a color, the ceramic material can be selected according to the color requirement. For example, the ceramic coating made of aluminum oxide is white, and the ceramic coating made of triiron tetroxide is black, and is oxidized. The ceramic coating made of titanium is dark blue. [0015] The manufacturing method of the electronic device casing 10 described above is: [0016] First, a metal substrate 12 is provided. The singularity of the first surface of the first surface 122 is 1. 3~2. 0 // m. In this embodiment, the first surface 122 is roughened by sandblasting. The material used for sandblasting may be selected from one of silicon carbide, ferrochrome alloy sand, copper ore, quartz sand and ceramic sand. The particle size is 60 mesh in this embodiment. White Corundum Sand "A Kind of Emery" ° [0018] A ceramic coating 14 is sprayed onto the first surface 122 by a thermal spraying method, preferably within 4 hours after the roughening process is completed. The thermal spraying method can employ a flame spraying method using oxy-acetylene as a gas and air as a feed gas. The spray material may be selected from one of oxidized ceramic materials such as aluminum oxide, triiron tetroxide, and titanium oxide. Since the metal substrate 12 is thin, it is susceptible to thermal deformation during thermal spraying, and in order to prevent deformation, the metal substrate 12 is placed on a spray fixture during the spraying process, and the spray fixture can pass through the circulating cooling water. Thereby, the metal substrate can be cooled to prevent overheating deformation. The 099109017 Form No. A0101 Page 5 of 15 0992016096-0 201134343 The initial roughness of the ceramic coating 14 formed by spraying is about 2. 1~2. 3#πι ο [0019] The metal substrate after spraying 12 Sanding coarse polishing is performed to remove the rough surface layer of the ceramic coating 14. Through the above heat step, the metal substrate 12 is fixed on a jig, and the ceramic coating 14 of the metal substrate 12 is polished by using a cycle-shaped pyramid type diamond abrasive belt, and the sanding belt is preferably sprayed with water. Cooling to avoid overheating during the grinding process deforms the metal substrate 12. The pyramid type diamond abrasive belt can be a pyramid type diamond belt produced by 3Μ Company with a particle size model of Α45 (ie, an average particle size of 45/zm, corresponding to the f| European standard size model P400). 5〜1. 4 # m。 The roughness of the ceramic coating 14 is about 1. 0~1. 4 # m. [0020] After that, fine sanding is performed to remove the traces of the sand belt left during the coarse sanding. This step is similar to the operation of the sanding and roughing step, except that the belt used is an alumina belt, for example, an alumina belt having a particle size of 800 to 1 000 can be used. 5〜0. 8/zm。 After the squeezing of the enamel coating is about 0. 5~0. 8/zm.
UU
[0021] 接下來進行振動研磨，以去除細磨時留下之砂帶痕跡。 該步驟可採用一振動研磨機完成，使用磨料為圓錐體（ p 9. 5mmxh 1 0mm )形磨料，加工時間大約為2小時。振動 研磨後，陶瓷塗層14之粗糙度大約為0.1〜0.3/zm。 [0022] 進行滚筒研磨，以增加陶瓷塗層之亮度。使用磨料為核 桃殼粉末，加工時間大約為4小時。滾筒研磨後，陶瓷塗 層14之粗糖度大約為0. 1~0. 3#m。 [0023] 請參閱圖3，本發明第二實施例之電子裝置外殼20與電子 099109017 表單編號A0101 第6頁/共15頁 0992016096-0 201134343 Ο [0024] 裝置外殼1G類似’其包括_金屬基體22及—喊塗層 。請參閲圖2金屬基體22包括-第—表面222及與該第— 表面222相反之第二表面224，與第—實施例不同之處在 於’喊塗層24覆蓋於第-表面奶之局部區域，以於電 子裝置外殼2G表面上形成商標、文字或者裝飾圖案等。 第-表面222上形成有若干凹部郎及凸部226，該凹部 m之表面低於該凸部226之表面H塗層财蓋於該 凹部225區域’且陶竟塗層24與凸部咖齊平，共同構成 電子裝置外殼20之外表面。 [0025] [0026][0021] Next, vibration grinding is performed to remove the traces of the abrasive tape left during the fine grinding. This step can be accomplished using a vibratory mill using abraid (p 9. 5mm x h 1 0mm) abrasive with a processing time of approximately 2 hours. After the vibration grinding, the ceramic coating 14 has a roughness of about 0.1 to 0.3/zm. [0022] Barrel grinding is performed to increase the brightness of the ceramic coating. The abrasive is used as the core peach powder and the processing time is about 4 hours. 1〜0. 3#m。 After the barrel is ground, the thickness of the ceramic coating layer 14 is about 0. 1~0. 3#m. 3, an electronic device housing 20 and an electronic 099109017 according to a second embodiment of the present invention. Form No. A0101 Page 6 of 15 Page 9992016096-0 201134343 Ο [0024] The device housing 1G is similar to the 'metal substrate' 22 and - call the coating. Referring to FIG. 2, the metal substrate 22 includes a first surface 222 and a second surface 224 opposite to the first surface 222. The difference from the first embodiment is that the shouting coating 24 covers the portion of the first surface milk. The area is formed with a trademark, a letter or a decorative pattern on the surface of the electronic device casing 2G. The first surface 222 is formed with a plurality of concave portions 925 and a convex portion 226. The surface of the concave portion m is lower than the surface of the convex portion 226. The coating layer covers the region of the concave portion 225 and the ceramic coating layer 24 and the convex portion are flushed. Flat, together constitute the outer surface of the electronic device housing 20. [0026] [0026]
GG
[0027] 上述電子裝置外殼20之製作方法與電子裝置外殼1〇之製 作方法類似，包括以下步驟： 首先，提供—金屬基體22，其包括—第—表面m及與該 第—表面222相反之第二表面224。 表面222預设之局部區域進行飯刻處理，使被触刻 品域之表面低於未被蝕刻區域表面形成凹部225，未被蝕 d區域形成凸部22柄該蝕刻處理可以採用化學蝕刻或鐳 射餘刻等方法，本實施例採用化學蝕刻方法，具體為： 首先用油墨對金屬基體22進行遮蔽處理，使不需要蝕刻 之表面被遮蔽，而第一表面222需要蝕刻之區域曝露出來 ’然後將金屬基體22浸置於化學蝕刻液中進行蝕刻處理 ’使·第一表面222被蝕刻區域（即凹部225 )而低於未被 #刻區域（即凸部226 )。 對凹部225進行喷砂處理 。因上述化學蝕刻後凹部225之 表面報糙度仍然比較小，因此需進行該喷砂處理，以使 099109017 表單鵠衆A01(U 第7頁/共15頁 0992016096-0 201134343 凹部225獲得更大之表面粗糙度。噴砂處理後，凹部225 之粗糙度（Ra)為1.3~2.0/zm。 [0028] 採用類似於第一實施例中陶瓷塗層14之形成方法於第一 表面222喷塗一陶瓷塗層24。陶瓷塗層24覆蓋於整個第一 表面222，即覆蓋凹部225及凸部226。 [0029] 之後，依照電子裝置外殼10之製作方法依次打砂粗拋步 驟、打砂細磨步驟、振動研磨。不同於第一實施例之處 在於，其中該打砂粗拋步驟除了去除陶瓷塗層24較粗糙 f'% 之表層外，同時使凸部226露出，使電子裝置外殼20表面 ^ 由金屬和陶瓷兩種不同之材料構成，由此於電子裝置外 殼20表面上形成商標、文字或者裝飾圖案等。 [0030] 為了增加陶瓷塗層24和露出之金屬基體22之光亮度，還 可以進一步進行滾筒研磨。使用磨料為核桃殼粉末，加 工時間大約為4小時。 [0031] 另外，為了突顯陶瓷塗層24之亮度，還可以進行喷砂處 理，經喷砂後使露出之金屬基體22呈啞光，如此以襯托 \ . 陶瓷塗層24之亮度。所使用之砂材可選用1 20目之陶瓷砂 〇 [0032] 上述實施例之電子裝置外殼於其金屬基體之表面直接塗 覆一陶瓷塗層，該陶瓷塗層與金屬基體結合牢固。藉由 陶瓷塗層優異之耐磨耗性，高硬度，高表面緻密性以克 服傳統塑膠或金屬材質之缺陷，使該外殼具有高耐磨損 、耐刮擦、可持久保持外觀亮麗之優點，同時還可於外 殼表面形成別致之裝飾花紋或圖案。在製作上述電子裝 099109017 表單編號A0101 第8頁/共15頁 0992016096-0 201134343 置外殼時，藉由將該金屬基體放置於一内部可通循環冷 卻之喷塗治具上，可防止熱喷塗時金屬基體受熱變形。 【圖式簡單說明】 [0033] 圖1係本發明第一實施例電子裝置外殼之剖視示意圖。 [0034] 圖2係本發明第二實施例電子裝置外殼之金屬基體之剖視 示意圖。 [0035] 圖3係本發明第二實施例電子裝置外殼之剖視示意圖。[0027] The manufacturing method of the electronic device casing 20 is similar to the manufacturing method of the electronic device casing 1 , and includes the following steps: First, a metal substrate 22 is provided, which includes a first surface m and an opposite surface of the first surface 222 Second surface 224. The surface area of the surface 222 is preset to be subjected to a rice etching process, so that the surface of the touched product region is lower than the surface of the unetched region to form the concave portion 225, and the non-etched region is formed with the convex portion 22. The etching process may be chemical etching or laser irradiation. In the present embodiment, a chemical etching method is used, specifically: first, the metal substrate 22 is masked with ink, so that the surface that does not need to be etched is shielded, and the area of the first surface 222 that needs to be etched is exposed. The metal substrate 22 is immersed in a chemical etching solution for etching treatment so that the first surface 222 is etched (i.e., the recess 225) and is lower than the unetched region (i.e., the convex portion 226). The recess 225 is sandblasted. Since the surface roughness of the concave portion 225 after the above chemical etching is still relatively small, the blasting treatment is required to make the 099109017 form AA01 (U page 7/15 pages 0992016096-0 201134343 recess 225 larger) Surface roughness. After the blasting treatment, the roughness (Ra) of the concave portion 225 is 1.3 to 2.0 / zm. [0028] A ceramic is sprayed on the first surface 222 in a manner similar to the method of forming the ceramic coating 14 in the first embodiment. The coating 24 covers the entire first surface 222, that is, covers the concave portion 225 and the convex portion 226. [0029] After that, according to the manufacturing method of the electronic device casing 10, the sand rough polishing step and the sand fine grinding step are sequentially performed. The vibration grinding is different from the first embodiment in that the sanding rough polishing step removes the surface of the ceramic coating 24 from the rougher f'%, and exposes the convex portion 226 to the surface of the electronic device casing 20. It is composed of two different materials of metal and ceramic, thereby forming a trademark, a letter or a decorative pattern on the surface of the electronic device casing 20. [0030] In order to increase the brightness of the ceramic coating 24 and the exposed metal substrate 22, The barrel grinding is performed in one step. The abrasive is used as the walnut shell powder, and the processing time is about 4 hours. [0031] In addition, in order to highlight the brightness of the ceramic coating 24, sandblasting may be performed, and the exposed metal substrate 22 is blasted. It is matte, so as to set off the brightness of the ceramic coating 24. The sand used can be selected from the ceramic sandpaper of 20 mesh [0032] The electronic device casing of the above embodiment is directly coated on the surface of the metal substrate. Ceramic coating, which is firmly bonded to the metal substrate. The ceramic coating has excellent wear resistance, high hardness and high surface compactness to overcome the defects of traditional plastic or metal materials, so that the outer casing has high wear resistance. Damage, scratch resistance, long-lasting appearance, and a unique decorative pattern or pattern on the surface of the outer casing. In the production of the above-mentioned electronic equipment 099109017 Form No. A0101 Page 8 / Total 15 Page 0992016096-0 201134343 When the metal substrate is placed on a spray fixture that can be circulated and cooled, the metal substrate can be prevented from being thermally deformed during thermal spraying. 1 is a cross-sectional view of a casing of an electronic device according to a first embodiment of the present invention. [0034] FIG. 2 is a cross-sectional view showing a metal substrate of an electronic device casing according to a second embodiment of the present invention. A schematic cross-sectional view of an electronic device housing in accordance with a second embodiment of the present invention.
【主要元件符號說明】 [0036] 電子裝置外殼： 10 ' 20 [0037] 金屬基體： 12、 22 [0038] 第一表面： 122 ' 222 [0039] 第二表面： 124 ' 224 [0040] 陶瓷塗層： 14、 24 [0041] 凹部：225 [0042] 凸部：22 6 099109017 表單編號A0101 第9頁/共15頁 0992016096-0[Main component symbol description] [0036] Electronic device housing: 10' 20 [0037] Metal substrate: 12, 22 [0038] First surface: 122 '222 [0039] Second surface: 124 '224 [0040] Ceramic coating Layer: 14, 24 [0041] Recess: 225 [0042] Convex: 22 6 099109017 Form No. A0101 Page 9 / Total 15 Page 0992016096-0