201123396 ^ 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種半導體封裝結構，且特別是有關 於一種具有屏蔽功能之封裝結構。 【先前技術】 在電子元件之運作過程中，不論是來自產品外部的電 磁干擾（electro-magnetic interference ; EMI)，或來自產品内 部的電子元件向外輻射的電磁干擾，均會顯著地影響電子 * 元件的運作，甚至是大幅增加電子元件損壞的機會。 第1圖為習知技術中第一種封裝結構的剖面圖。封裝 結構10包含一基板11、一晶片12、一封膠13和數個銲球 14。基板11具有一第一面11a和一第二面lib。晶片12 位於基板11之第一面11a上，並透過數個凸塊15電性連 接基板11。封膠13覆蓋晶片12和基板11之第一面11a。 此些銲球14設置於基板11之第二面lib。 在封裝結構10中，由於其不具有屏蔽功能，故無法屏 φ 蔽晶片12不受外部之電磁波的干擾。 第2圖為習知技術中第二種封裝結構的剖面圖。封裝 結構20包含一第一基板21、一第一晶片22、一第一封膠 23、數個銲球24、一第二基板25、一第二晶片26、一第 二封膠27及數個凸塊28。第一基板21具有一第一面21a 及一第二面21b。第一晶片22位於第一面21a上，並透過 數個銲線29電性連接第一基板21。第一封膠23覆蓋第一 晶片22及部分的第一基板21。此些銲球24設置於第二面 - 21b。第二基板25具有一第三面25a及一第四面25b。第 . 二晶片26位於第三面25a，並透過數個銲線30電性連接 201123396 第二基板25。第二封膠27霜筌筮一曰w ’ 25。此些凸塊28電性連接：公26及第二基板 二基板25之第四面=第基板21之第一面213及第 在封裝結構20中，亦由於复# 屏蔽第-晶片.22、第具有屏敝功能，故無法 亦無法隔絕兩日日日>{彼此之間訊號的干擾。㈣卞擾 【發明内容】 本發明之第一實施方4组 構。封裝結構包含一第一乂柏、出一一種具有屏蔽之封裝結 件和-屏蔽層。第-基板^有$ =子70件、數個接地元 於第一美杯卜，允觉 ^有至〉、一接地端。電子元件位 第一美^上It Μ ^ 、接第—基板。此些接地元件位於 乐基板上，並排成至少一列於啻工—#Λ ,、 且此些接地元件電性連接接地端：一侧或周圍’ 上方，並遮蔽電子亓杜Λ 屏敝層位於電子元件之 、 ’且屏蔽層電性連接此些接地元件。 由此可知，屏蔽層和接地元件均透過第一 端而電性接地。透過屏蔽層和接地元件透7基=^地 以隔絕外部㈣斜擾及電^狀簡m部 列於it之ί地疋件之高度大於電子元件之高度，並可排 接觸===些===件為間隔排列或互相 ，上’屏“二=第表:二,位：些接地 包含一封膠，封膠覆蓋此些接地元件。°❻結構可 封裝結構可包含—容置空間，容置空間為封膠所圍 201123396 繞，且電子元件位於容置空間内。藉此，可增加封裝結構 ' 之散熱空間，並提高電子元件之散熱速度。 本發明之第二實施方式提出一種具有屏蔽之封裝結 構。封裝結構包含一第一基板、一第一電子元件、數個接 地元件、一第二基板、一第二電子元件和一屏蔽層。第一 基板具有至少一接地端。第一電子元件位於第一基板上， 並電性連接第一基板。此些接地元件位於第一基板上，並 排成至少一列於第一電子元件之一側或周圍，且接地元件 電性連接接地端。第二基板位於接地元件之上。第二電子 • 元件位於第二基板上，並電性連接第二基板。屏蔽層設置 於第二基板，並遮蔽第一電子元件，且電性連接接地元件。 由此可知，屏蔽層和接地元件均透過第一基板電性接 地。屏蔽層分隔第一電子元件和第二電子元件之訊號，可 避免兩電子元件之間的訊號互相干擾。 上述之接地元件之高度大於第一電子元件之高度，並 可排列於第一電子元件之周圍。屏蔽層設置於第二基板之 表面或内部，且透過數個接地線電性連接此些接地元件。 封裝結構可包含數個導電元件，此些導電元件位於第 * 一基板上，並排成至少一列於第一電子元件之一侧或周 圍。此些導電元件電性連接第一基板與第二基板，且與接 地端電性隔絕。封裝結構可包含一封膠，封膠覆蓋此些接 地元件與此些導電元件。 封裝結構可包含一容置空間，容置空間為封膠所圍 繞，第一電子元件位於容置空間内。藉此，可增加封裝結 構之散熱空間，並提高第一電子元件之散熱速度。 . 本發明之第三實施方式提出一種具有屏蔽之封裝結 構。封裝結構包含一基板、一第一電子元件、一第二電子 201123396 元件和數個接地元件。基板具有至少一接地端。第一電子 元件及第二電子元件各自位於基板上，並電性連接基板。 此些接地元件之高度大於或等於第一電子元件及第二電子 元件之高度，並排成至少一列於第一電子元件及第二電子 元件之間，且此些接地元件電性連接接地端。 由此可知，此些接地元件可透過基板電性接地。此些 接地元件分隔第一電子元件和第二電子元件，可避免兩電 子元件之訊號互相干擾。 上述之接地元件可排列於第一電子元件或第二電子元 • 件之周圍。封裝結構可包含一封膠，封膠覆蓋接地元件。 封裝結構可包含一第一容置空間和一第二容置空間， 第一容置空間和第二容置空間為封膠所圍繞。第一電子元 件位於第一容置空間内，第二電子元件位於第二容置空間 内。藉此，可增加封裝結構之散熱空間，並提高第一電子 元件和第二電子元件之散熱速度。 本發明之第四實施方式提出一種具有屏蔽之封裝結 構。封裝結構包含一第一基板、一第一電子元件、一第二 電子元件、數個接地元件、一第二基板、一第三電子元件 和至少一屏蔽層。第一基板具有至少一接地端。第一電子 元件及第二電子元件各自位於第一基板上，並電性連接第 一基板。此些接地元件排成至少一列於第一電子元件及第 二電子元件之間，並電性連接第一基板的接地端。第二基 板位於此些接地元件之上。第三電子元件位於第二基板 上，並電性連接第二基板。屏蔽層設置於第二基板，並遮 蔽第一電子元件及第二電子元件，且電性連接接地元件。 . 由此可知，接地元件和屏蔽層分隔第一電子元件、第 二電子元件和第三電子元件，作為此些電子元件之間的屏 201123396 蔽，以防止此些電子元件受到彼此的電磁訊號的干擾。 上述之接地元件之高度大於第一電子元件及第二電子 元件之高度。屏蔽層設置於第二基板之表面或内部，且透 過數個接地線或凸塊電性連接此些接地元件。 封裝結構可包含數個導電元件。此些導電元件位於第 一基板上，並排列於第一電子元件及第二電子元件之外 圍。此些導電元件電性連接第一基板與第二基板，且與接 地端電性隔絕。封裝結構可包含一封膠，封膠覆蓋此些接 地元件及此些導電元件。 • 封裝結構可包含一第一容置空間及一第二容置空間， 第一容置空間及第二容置空間為封膠所圍繞。第一電子元 件位於第一容置空間内，第二電子元件位於第二容置空間 内。藉此，可增加封裝結構之散熱空間，並提高第一電子 元件和第二電子元件之散熱速度。 本發明之第五實施方式提出一種具有屏蔽之封裝結 構。封裝結構包含一第一基板、數個第一電子元件、數個 第一接地元件、一第二基板、數個第二電子元件、數個第 二接地元件和至少一屏蔽層。第一基板具有至少一接地 * 端。此些第一電子元件位於第一基板上，並電性連接第一 基板。此些第一接地元件位於第一基板上，並排列於此些 第一電子元件之間，且此些第一接地元件電性連接接地 端。第二基板位於此些第一接地元件之上。此些第二電子 元件位於第二基板上，並電性連接第二基板。此些第二接 地元件位於第二基板上，並排列於此些第二電子元件之 間，且此些第二接地元件電性連接此些第一接地元件。屏 蔽層設置於第二基板，並遮蔽此些第一電子元件，且屏蔽 層電性連接此些第一接地元件。 201123396 藉由此些第一接地元件、此些第二接地元件與屏蔽 ' 層，分隔此些第一電子元件和第二電子元件，以防止此些 第一電子元件和第二電子元件受到彼此訊號的干擾。 上述之第一接地元件之高度大於第一電子元件之高 度。屏蔽層設置於第二基板之表面或内部，且透過數個接 地線或數個凸塊電性連接此些第一接地元件。 封裝結構可包含數個第一導電元件及數個第二導電元 件。此些第一導電元件排列於此些第一電子元件之外圍， 並電性連接第一基板及第二基板。此些第二導電元件排列 • 於此些第二電子元件之外圍，並電性連接第二基板。 封裝結構可包含一第一封膠及一第二封膠。第一封膠 覆蓋此些第一接地元件及此些第一導電元件，第二封膠覆 蓋此些第二接地元件及此些第二導電元件。 封裝結構可包含數個第一容置空間及數個第二容置空 間。此些第一容置空間為第一封膠所圍繞，此些第二容置 空間為第二封膠所圍繞。此些第一電子元件分別位於此些 第一容置空間内，此些第二電子元件分別位於此些第二容 置空間内。藉此，可增加封裝結構之散熱空間，並提高此 ® 些第一電子元件和此些第二電子元件之散熱速度。 【實施方式】 請同時參考第3A圖和第3B圖。第3A圖繪示本發明 具有屏蔽之封裝結構之第一實施例的俯瞰圖，第3B圖繪示 第3A圖之封裝結構中沿著連線AA’的剖面圖。 封裝結構100包含一第一基板110、一電子元件120、 數個接地元件150和一屏蔽層130。第一基板110具有至 少一接地端112及至少一接地端114。電子元件120位於第[ς] 8 201123396 * —基板11G上，並電性連接第—基板㈣。此些接地元件 150位於第一基板11〇上’並排成至少—列位於 120之一側。此些接地元件150電性連接接地端、112。兀^ 層130位於電子元件120之上方’並遮蔽電子元件蔽 且屏蔽層130電性連接此些接地元件150。 ’ 由此可知’屏蔽層130和接地元件15〇均透過 板110的接地端112而電性接地❶透過屏蔽層13^和 土 元件150 ’可屏蔽電子元件120 ’以隔絕來自電子元； 或外部的電磁訊號干擾。 ϋ • 上述之電子元件120係藉由接點122電性連接第一美 板110，接地端112透過接地線116電性連接接地端ιΐ4= 第一基板110可具有數個銲球180及數個銲球182，以 性連接外部電路(未繪示）。其中，銲球18〇電性連接接 端114，銲球182電性連接銲墊118 ^ 接地元件150可防止電磁波自電子元件12〇的側面 入。具體來說’此些接地元件150之高度hi大於電子元件 120之高度h2，並可排成一列或數列於電子元件之鬥 圍。舉例來說，如第3A圖所示，封裝結構1〇〇具有數歹^ 鲁 的接地元件15〇，此些接地元件150位於電子元件之 周圍。在每列的接地元件150中，各個接地元件15〇係間 隔排列，亦可互相接觸。換句話說，任兩相鄰的接地元件 150之間具有間隔或無間隔。藉由接地元件15〇屏蔽電子 元件120,使得電磁訊號無法自電子元件12〇的側面傳播。 如第3B圖所示。屏蔽層130位於此些接地元件15〇 之上，並可設置於任一載體上。具體來說，封裝結構1〇〇 可包含一第一基板140，第二基板140位於第一基板11〇 及此些接地元件150之上方。屏蔽層130可設置在第二基 201123396 板140之表面142或内部。 封裝結構100可包含一封膠160 ’封膠160覆蓋此些 接地元件150。封裝結構1 〇〇可包含一容置空間170，容置 空間170為封膠160所圍繞，且為封膠16〇、屏蔽層13〇 和第一基板110所包圍，電子元件120位於容置空間 中。藉由容置空間170之設置，可增加封裝結構10〇之散 熱空間，並提高電子元件120之散熱速度。 請同時參考第4A圖和第4B圖，第4A圖繪示本發明 具有屏蔽之封裝結構之第二實施例的俯瞰圖，第4B圖繪示 φ 第4A圖之封裝結構中沿著連線BB’的剖面圖。 封裝結構200包含一第一基板21〇、一第一電子元件 220、數個接地元件250、一第二基板240、一第二電子元 件270和一屏蔽層230。第一基板21〇具有至少一接地端 212及至少一接地端214。第一電子元件22〇位於第一基板 210上，並電性連接第一基板21〇。此些接地元件25〇位於 第一基板210上，並排成至少一列於第一電子元件22〇之 一侧。此些接地元件250為間隔排列或互相接觸，並電性 連接接地端212。第二基板240位於此些接地元件250之 # 上。第二電子元件270位於第二基板240上，並電性連接 第二基板240。屏蔽層23〇設置於第二基板24〇，並遮蔽第 一電子元件220’且屏蔽層230電性連接此些接地元件25〇。 由此可知’藉由電性接地的屏蔽層230分隔第一電子 元件220和第二電子元件270，可避免第一電子元件22〇 和第二電子元件270之訊號互相干擾。 上述之第一電子元件220係藉由接點222電性連接第 一基板210，第二電子元件270透過銲線272電性連接第 • 二基板240，接地端212透過接地線216電性連接接地端 ' 214。第一基板210可具有數個銲球290及數個銲球292 , 201123396 以電性連接外部電路（未繪示）。其中，銲球290電性連接 接地端214，銲球292電性連接銲墊219。 接地元件250之高度h3大於第一電子元件22〇之高度 h4，並可排列於第一電子元件220之周圍。屏蔽層230設 置於第二基板240之表面或内部，並透過數個接地線232 電性連接此些接地元件250。具體來說，屏蔽層230透過 接地線232連接接地端242,以電性連接此些接地元件250。 封裝結構200可包含數個導電元件252，此些導電元 件252位於第一基板210上，並電性連接第一基板210和 第二基板240。如此一來，第二基板240便可透過此些導 電元件252電性連接第一基板210。 此些導電元件252可排成一列或數列，並設置於第一 電子元件220的一側或周圍。此些導電元件252可連接第 一基板210上的銲墊218，以電性連接到第一基板210中 的線路或銲墊219，且此些導電元件252與接地端212、接 地端214電性隔絕。此些導電元件252可透過數個凸塊246 電性連接第二基板240上的銲墊244。 封裝結構200可包含一第一封膠260和一第二封膠 262,第一封膠260覆蓋此些接地元件250和此些導電元件 252,第二封膠262覆蓋第二電子元件270和第二基板240。 封裝結構200可包含一容置空間280 ’容置空間280 為第一封膠260所圍繞，且第一電子元件220位於容置空 間280内。藉由容置空間280之設置，可增加封裝結構200 之散熱空間，並提高第一電子元件220之散熱速度。 請同時參考第5A圖和第5B圖。第5A圖繪示本發明 具有屏蔽之封裝結構之第三實施例的俯瞰圖’第5B圖繪示 本發明第5A圖之封裝結構中沿著連線CC’的剖面圖。 201123396 • 封裝結構30〇包含一基板310、一第一電子元件320、 一第二電子元件322和數個接地元件33〇。基板31〇具有 , 至少一接地端312。第一電子元件320及第二電子元件322 各自位於基板310上，並電性連接基板31(^此些接地元 件330之高度h5大於或等於第一電子元件32〇及第二電子 兀件322之尚度h6，並排成至少一列於第一電子元件32〇 及第二電子兀件322之間。此些接地元件33〇為間隔排列 或互相接觸，並電性連接基板31〇的接地端312。 由此可知，藉由接地元件33〇分隔第一電子元件32〇 ❿和第二電子元件322，以防止第一電子元件320和第二電 子元件322受到彼此的訊號干擾。 上述之接地元件330電性連接接地端312，並透過接 地線316及接地端314電性連接銲球36〇。第一電子元件 320透過接點324電性連接基板31〇，第二電子元件322透 過接點326電性連接基板31〇。基板31〇具有數個銲墊318 和數個銲球362,以電性連接外部電路（未繪示）。 為了保護第一電子元件320和第二電子元件322不受 鲁來自側面傳入的電磁波干擾’此些接地元件33〇可排列於 第一電子疋件320和第二電子元件322之周圍。此些接地 兀件330可排成一列或數列，各列的接地元件33〇位於第 一電子元件320和第二電子元件322之周圍。 封裝結構300可包含一封膠34〇，封膠34〇覆蓋此些 接地元件330。封裝結構300可包含一第一 和-第二容置空間352,第一容置空間3第5〇;=置空 ，=52為封膠340所圍繞。第—電子元件32〇位於第一容 .工間350内，第二電子元件322位於第二容置空間352 内。藉由第一容置空間35〇和第二容置空間352之設置， 201123396 可增加封裝結構300之散熱空間，並提高第一電子元件320 和第二電子元件322之散熱速度。 請同時參考第6A圖和第6B圖。第6A圖繪示本發明 具有屏蔽之封裝結構之第四實施例的俯瞰圖，第6B圖繪示 第6A圖之封裝結構中沿著連線DD，的剖面圖。 封裂結構400包含一第一基板410、一第一電子元件 420、一第二電子元件422、數個接地元件450、一第二基 板440、—第三電子元件470、一第四電子元件472和至少201123396 ^ VI. Description of the Invention: [Technical Field] The present invention relates to a semiconductor package structure, and more particularly to a package structure having a shielding function. [Prior Art] In the operation of electronic components, electromagnetic interference (electro-magnetic interference (EMI) from the outside of the product, or electromagnetic interference from external electronic components inside the product, can significantly affect the electrons* The operation of components, even the opportunity to significantly increase the damage of electronic components. Figure 1 is a cross-sectional view showing a first package structure in the prior art. The package structure 10 includes a substrate 11, a wafer 12, an adhesive 13 and a plurality of solder balls 14. The substrate 11 has a first surface 11a and a second surface lib. The wafer 12 is located on the first surface 11a of the substrate 11, and is electrically connected to the substrate 11 through a plurality of bumps 15. The sealant 13 covers the wafer 12 and the first face 11a of the substrate 11. The solder balls 14 are disposed on the second surface lib of the substrate 11. In the package structure 10, since it does not have a shielding function, the wafer 12 cannot be shielded from external electromagnetic waves. Figure 2 is a cross-sectional view showing a second package structure in the prior art. The package structure 20 includes a first substrate 21, a first wafer 22, a first seal 23, a plurality of solder balls 24, a second substrate 25, a second wafer 26, a second seal 27, and a plurality of Bump 28. The first substrate 21 has a first surface 21a and a second surface 21b. The first wafer 22 is located on the first surface 21a and electrically connected to the first substrate 21 through a plurality of bonding wires 29. The first adhesive 23 covers the first wafer 22 and a portion of the first substrate 21. These solder balls 24 are disposed on the second side - 21b. The second substrate 25 has a third surface 25a and a fourth surface 25b. The second wafer 26 is located on the third surface 25a and electrically connected to the second substrate 25 through the plurality of bonding wires 30. The second sealant 27 cream 筌筮 曰 w ’ 25. The bumps 28 are electrically connected: the fourth surface of the male substrate 26 and the second substrate two substrates 25 = the first surface 213 of the first substrate 21 and the first package structure 20, and also due to the complex # shielding first wafer. The screen has the function of screen, so it cannot and cannot isolate the interference of the two days and the day. (4) Noise disturbance [Summary of the Invention] The first embodiment of the present invention is a fourth embodiment. The package structure includes a first cypress, a shielded package and a shield. The first substrate ^ has $ = 70 pieces, a number of grounding elements in the first beauty cup, and it is allowed to have ~, a ground. The electronic component is located on the first US ^ on It Μ ^, connected to the first substrate. The grounding components are located on the music substrate and are arranged in at least one column to be completed—#Λ, and the grounding components are electrically connected to the grounding end: one side or around the top, and the shielding electron 亓 Λ Λ 敝 位于 layer is located The electronic component, and the shielding layer is electrically connected to the grounding components. It can be seen that both the shielding layer and the grounding element are electrically grounded through the first end. Through the shielding layer and the grounding element, the 7-base is grounded to isolate the external (4) oblique interference and the electrical component is listed in the height of the component. The height of the component is greater than the height of the electronic component, and the contact can be discharged === == Parts are arranged in intervals or on each other, on the 'screen' two = the first table: two, the position: some grounding contains a glue, the sealant covers these grounding elements. °❻ structure can be packaged structure can contain - accommodation space, The accommodating space is surrounded by the encapsulation 201123396, and the electronic components are located in the accommodating space. Thereby, the heat dissipation space of the package structure can be increased, and the heat dissipation speed of the electronic component can be improved. The second embodiment of the present invention provides a The package structure comprises a first substrate, a first electronic component, a plurality of grounding components, a second substrate, a second electronic component and a shielding layer. The first substrate has at least one grounding end. The electronic component is located on the first substrate and electrically connected to the first substrate. The grounding components are located on the first substrate and are arranged at least one side of or around the first electronic component, and the grounding component is electrically connected to the grounding end. First The substrate is located on the grounding member, and the second electronic component is located on the second substrate and electrically connected to the second substrate. The shielding layer is disposed on the second substrate and shields the first electronic component and is electrically connected to the grounding component. It can be seen that both the shielding layer and the grounding element are electrically grounded through the first substrate. The shielding layer separates the signals of the first electronic component and the second electronic component to avoid mutual interference of signals between the two electronic components. The height of the grounding component is greater than The height of the first electronic component can be arranged around the first electronic component. The shielding layer is disposed on the surface or inside of the second substrate, and is electrically connected to the grounding component through a plurality of grounding wires. The package structure can include several a conductive element, the conductive elements are disposed on the first substrate, and are arranged at least one side of or around the first electronic component. The conductive elements are electrically connected to the first substrate and the second substrate, and are electrically connected to the ground. Sexual isolation. The package structure may include a glue covering the grounding components and the conductive components. The package structure may include an accommodating space. The space is surrounded by the sealing material, and the first electronic component is located in the accommodating space. Thereby, the heat dissipation space of the package structure can be increased, and the heat dissipation speed of the first electronic component can be improved. The third embodiment of the present invention provides a shielding The package structure includes a substrate, a first electronic component, a second electronic 201123396 component, and a plurality of grounding components. The substrate has at least one grounding end. The first electronic component and the second electronic component are each located on the substrate, and Electrically connecting the substrate. The height of the grounding elements is greater than or equal to the height of the first electronic component and the second electronic component, and is arranged at least in a row between the first electronic component and the second electronic component, and the grounding components are electrically It is known that the grounding elements can be electrically grounded through the substrate. The grounding elements separate the first electronic component and the second electronic component to prevent the signals of the two electronic components from interfering with each other. The grounding elements described above may be arranged around the first electronic component or the second electronic component. The package structure can include a glue that covers the ground element. The package structure can include a first accommodating space and a second accommodating space, and the first accommodating space and the second accommodating space are surrounded by the sealant. The first electronic component is located in the first accommodating space, and the second electronic component is located in the second accommodating space. Thereby, the heat dissipation space of the package structure can be increased, and the heat dissipation speed of the first electronic component and the second electronic component can be improved. A fourth embodiment of the present invention proposes a package structure having a shield. The package structure includes a first substrate, a first electronic component, a second electronic component, a plurality of grounding components, a second substrate, a third electronic component, and at least one shielding layer. The first substrate has at least one ground terminal. The first electronic component and the second electronic component are each located on the first substrate and electrically connected to the first substrate. The grounding elements are arranged at least between the first electronic component and the second electronic component and electrically connected to the grounding end of the first substrate. The second substrate is located above the grounding elements. The third electronic component is located on the second substrate and electrically connected to the second substrate. The shielding layer is disposed on the second substrate and shields the first electronic component and the second electronic component, and is electrically connected to the grounding component. It can be seen that the grounding element and the shielding layer separate the first electronic component, the second electronic component and the third electronic component as a screen 201123396 between the electronic components to prevent the electronic components from being electromagnetically responsive to each other. interference. The height of the grounding element described above is greater than the height of the first electronic component and the second electronic component. The shielding layer is disposed on the surface or inside of the second substrate, and the grounding elements are electrically connected through a plurality of grounding wires or bumps. The package structure can include several conductive elements. The conductive elements are located on the first substrate and are arranged around the first electronic component and the second electronic component. The conductive elements are electrically connected to the first substrate and the second substrate and are electrically isolated from the ground. The package structure can include a glue that covers the ground elements and the conductive elements. The package structure can include a first accommodating space and a second accommodating space, and the first accommodating space and the second accommodating space are surrounded by the sealant. The first electronic component is located in the first accommodating space, and the second electronic component is located in the second accommodating space. Thereby, the heat dissipation space of the package structure can be increased, and the heat dissipation speed of the first electronic component and the second electronic component can be improved. A fifth embodiment of the present invention proposes a package structure having a shield. The package structure includes a first substrate, a plurality of first electronic components, a plurality of first ground components, a second substrate, a plurality of second electronic components, a plurality of second ground components, and at least one shielding layer. The first substrate has at least one ground terminal. The first electronic components are located on the first substrate and electrically connected to the first substrate. The first grounding components are disposed on the first substrate and are disposed between the first electronic components, and the first grounding components are electrically connected to the grounding end. The second substrate is located above the first grounding elements. The second electronic components are located on the second substrate and electrically connected to the second substrate. The second grounding components are disposed on the second substrate and are disposed between the second electronic components, and the second grounding components are electrically connected to the first grounding components. The shielding layer is disposed on the second substrate and shields the first electronic components, and the shielding layer is electrically connected to the first grounding components. 201123396, by using the first grounding component, the second grounding component and the shielding layer, separating the first electronic component and the second electronic component to prevent the first electronic component and the second electronic component from receiving signals from each other Interference. The height of the first grounding element described above is greater than the height of the first electronic component. The shielding layer is disposed on the surface or the inside of the second substrate, and electrically connected to the first grounding elements through a plurality of grounding wires or a plurality of bumps. The package structure can include a plurality of first conductive elements and a plurality of second conductive elements. The first conductive elements are arranged on the periphery of the first electronic components, and are electrically connected to the first substrate and the second substrate. The second conductive elements are arranged on the periphery of the second electronic components and electrically connected to the second substrate. The package structure may include a first sealant and a second sealant. The first adhesive covers the first grounding component and the first conductive component, and the second adhesive covers the second grounding component and the second conductive component. The package structure may include a plurality of first accommodating spaces and a plurality of second accommodating spaces. The first accommodating space is surrounded by the first sealing material, and the second accommodating spaces are surrounded by the second sealing material. The first electronic components are respectively located in the first accommodating spaces, and the second electronic components are respectively located in the second accommodating spaces. Thereby, the heat dissipation space of the package structure can be increased, and the heat dissipation speed of the first electronic components and the second electronic components can be improved. [Embodiment] Please refer to Figures 3A and 3B at the same time. Fig. 3A is a plan view showing a first embodiment of the package structure of the present invention, and Fig. 3B is a cross-sectional view taken along line AA' of the package structure of Fig. 3A. The package structure 100 includes a first substrate 110, an electronic component 120, a plurality of grounding components 150, and a shielding layer 130. The first substrate 110 has at least one ground terminal 112 and at least one ground terminal 114. The electronic component 120 is located on the first substrate 11G, and is electrically connected to the first substrate (four). The grounding members 150 are located on the first substrate 11' side and are arranged side by side at least one side of the column 120. The grounding elements 150 are electrically connected to the grounding end 112. The layer 130 is located above the electronic component 120 and shields the electronic component from being shielded. The shielding layer 130 is electrically connected to the grounding component 150. It can be seen that the shielding layer 130 and the grounding element 15 are both electrically grounded through the grounding end 112 of the board 110, and the shielding element 13 and the earth element 150' can shield the electronic component 120' from being insulated from the electronic component; or externally Electromagnetic signal interference.第一 The above-mentioned electronic component 120 is electrically connected to the first US plate 110 by the contact 122, and the grounding end 112 is electrically connected to the grounding end through the grounding wire 116. The first substrate 110 may have a plurality of solder balls 180 and several The solder ball 182 is connected to an external circuit (not shown). Wherein, the solder ball 18 is electrically connected to the terminal 114, and the solder ball 182 is electrically connected to the solder pad 118. The grounding member 150 prevents electromagnetic waves from entering from the side of the electronic component 12A. Specifically, the height hi of the grounding members 150 is greater than the height h2 of the electronic components 120, and may be arranged in a row or a plurality of columns of electronic components. For example, as shown in Fig. 3A, the package structure 1 has a plurality of ground elements 15A which are located around the electronic components. In each of the grounding elements 150 of the column, the respective grounding elements 15 are arranged in an interlaced manner and may also be in contact with each other. In other words, there are or no spacing between any two adjacent ground elements 150. The electronic component 120 is shielded by the grounding member 15 such that the electromagnetic signal cannot propagate from the side of the electronic component 12A. As shown in Figure 3B. The shielding layer 130 is located above the grounding elements 15A and can be disposed on any of the carriers. Specifically, the package structure 1A may include a first substrate 140, and the second substrate 140 is located above the first substrate 11A and the grounding elements 150. The shield layer 130 can be disposed on or within the surface 142 of the second substrate 201123396. The package structure 100 can include a glue 160' sealant 160 covering the ground elements 150. The package structure 1 can include an accommodating space 170. The accommodating space 170 is surrounded by the sealant 160, and is surrounded by the sealant 16 〇, the shield layer 13 〇 and the first substrate 110, and the electronic component 120 is located in the accommodating space. in. By the arrangement of the accommodating space 170, the heat dissipation space of the package structure 10〇 can be increased, and the heat dissipation speed of the electronic component 120 can be improved. Please refer to FIG. 4A and FIG. 4B at the same time, FIG. 4A is a bird's-eye view of the second embodiment of the shielded package structure of the present invention, and FIG. 4B is a view along line BB of the package structure of FIG. 4A. 'The section view. The package structure 200 includes a first substrate 21, a first electronic component 220, a plurality of grounding components 250, a second substrate 240, a second electronic component 270, and a shielding layer 230. The first substrate 21 has at least one grounding end 212 and at least one grounding end 214. The first electronic component 22 is located on the first substrate 210 and electrically connected to the first substrate 21A. The grounding elements 25 are located on the first substrate 210 and are arranged in at least one side of the first electronic component 22A. The grounding elements 250 are spaced or in contact with each other and electrically connected to the grounding end 212. The second substrate 240 is located on # of the grounding elements 250. The second electronic component 270 is located on the second substrate 240 and electrically connected to the second substrate 240. The shielding layer 23 is disposed on the second substrate 24 and shields the first electronic component 220' and the shielding layer 230 is electrically connected to the grounding components 25A. It can be seen that the first electronic component 220 and the second electronic component 270 are separated by the electrically grounded shielding layer 230, so that the signals of the first electronic component 22A and the second electronic component 270 can be prevented from interfering with each other. The first electronic component 220 is electrically connected to the first substrate 210 by the contact 222. The second electronic component 270 is electrically connected to the second substrate 240 through the bonding wire 272. The grounding terminal 212 is electrically connected to the ground through the grounding wire 216. End '214. The first substrate 210 can have a plurality of solder balls 290 and a plurality of solder balls 292, and 201123396 is electrically connected to an external circuit (not shown). The solder ball 290 is electrically connected to the ground end 214, and the solder ball 292 is electrically connected to the solder pad 219. The height h3 of the grounding element 250 is greater than the height h4 of the first electronic component 22, and may be arranged around the first electronic component 220. The shielding layer 230 is disposed on the surface or inside of the second substrate 240, and is electrically connected to the grounding members 250 through a plurality of grounding wires 232. Specifically, the shielding layer 230 is connected to the grounding end 242 through the grounding wire 232 to electrically connect the grounding components 250. The package structure 200 can include a plurality of conductive elements 252. The conductive elements 252 are located on the first substrate 210 and electrically connected to the first substrate 210 and the second substrate 240. In this way, the second substrate 240 can be electrically connected to the first substrate 210 through the conductive elements 252. The conductive elements 252 may be arranged in a column or series and disposed on one side or the periphery of the first electronic component 220. The conductive elements 252 can be connected to the pads 218 on the first substrate 210 to be electrically connected to the lines or pads 219 in the first substrate 210, and the conductive elements 252 and the ground end 212 and the ground end 214 are electrically connected. Isolated. The conductive elements 252 can be electrically connected to the pads 244 on the second substrate 240 through the plurality of bumps 246 . The package structure 200 can include a first encapsulant 260 and a second encapsulant 262. The first encapsulant 260 covers the grounding elements 250 and the conductive elements 252, and the second encapsulant 262 covers the second electronic components 270 and Two substrates 240. The package structure 200 can include an accommodating space 280 ′. The accommodating space 280 is surrounded by the first sealant 260, and the first electronic component 220 is located in the accommodating space 280. By the arrangement of the accommodating space 280, the heat dissipation space of the package structure 200 can be increased, and the heat dissipation speed of the first electronic component 220 can be improved. Please refer to both Figures 5A and 5B. Fig. 5A is a cross-sectional view of the package structure of the fifth embodiment of the present invention taken along line CC'. 201123396 • The package structure 30A includes a substrate 310, a first electronic component 320, a second electronic component 322, and a plurality of grounding components 33A. The substrate 31 has at least one grounding end 312. The first electronic component 320 and the second electronic component 322 are respectively disposed on the substrate 310 and electrically connected to the substrate 31. The height h5 of the grounding components 330 is greater than or equal to the first electronic component 32A and the second electronic component 322. The temperature h6 is arranged side by side between at least one of the first electronic component 32A and the second electronic component 322. The grounding components 33 are arranged at intervals or in contact with each other, and are electrically connected to the grounding end 312 of the substrate 31A. It can be seen that the first electronic component 32A and the second electronic component 322 are separated by the grounding element 33〇 to prevent the first electronic component 320 and the second electronic component 322 from being interfered with each other by the signal. The grounding end 312 is electrically connected to the grounding wire 316 and the grounding end 314. The first electronic component 320 is electrically connected to the substrate 31 through the contact 324, and the second electronic component 322 is electrically connected to the contact 326. The substrate 31 has a plurality of pads 318 and a plurality of solder balls 362 for electrically connecting external circuits (not shown). To protect the first electronic component 320 and the second electronic component 322 from the Lu From the side Electromagnetic interference 'The grounding elements 33' can be arranged around the first electronic component 320 and the second electronic component 322. The grounding elements 330 can be arranged in a column or series, and the grounding elements 33 of each column are located first. The periphery of the electronic component 320 and the second electronic component 322. The package structure 300 may include a glue 34, and the sealant 34 covers the grounding components 330. The package structure 300 may include a first and second accommodating spaces 352. The first accommodating space 3 is 5th 〇; = is blanked, and =52 is surrounded by the sealing 340. The first electronic component 32 is located in the first volume 350, and the second electronic component 322 is located in the second housing. In the space 352, by the arrangement of the first accommodating space 35 〇 and the second accommodating space 352 , the 201123396 can increase the heat dissipation space of the package structure 300 and improve the heat dissipation speed of the first electronic component 320 and the second electronic component 322 . Please refer to FIG. 6A and FIG. 6B at the same time. FIG. 6A is a bird's-eye view of a fourth embodiment of the package structure of the present invention, and FIG. 6B is a cross-sectional view DD of the package structure of FIG. The fracture structure 400 includes a first substrate 410, A first electronic element 420, a second electronic component 422, 450, a second substrate 440, a plurality of ground elements - a third electronic device 470, a fourth electronic component and at least 472
一屏蔽層430。第一基板410具有至少一接地端412及至 少一接地端414。第一電子元件420及第二電子元件422 各自位於第一基板410上，並電性連接第一基板410。此 些接地元件450位於第一基板410上，並排成至少一列於 第一電子元件420及第二電子元件422之間。此些接地元 件450為間隔排列或互相接觸，並電性連接接地端412。 第二基板440位於此些接地元件450之上。第三電子元件 47〇和第四電子元件472各自位於第二基板440上，並電 性連接第二基板440。屏蔽層430設置於第二基板440 ,並A shielding layer 430. The first substrate 410 has at least one ground terminal 412 and at least one ground terminal 414. The first electronic component 420 and the second electronic component 422 are respectively located on the first substrate 410 and electrically connected to the first substrate 410. The grounding elements 450 are disposed on the first substrate 410 and arranged in at least one column between the first electronic component 420 and the second electronic component 422. The grounding members 450 are spaced or in contact with each other and electrically connected to the grounding end 412. The second substrate 440 is located above the grounding elements 450. The third electronic component 47A and the fourth electronic component 472 are each located on the second substrate 440 and electrically connected to the second substrate 440. The shielding layer 430 is disposed on the second substrate 440, and
遮蔽第一電子元件420及第二電子元件422,且屏蔽層430 電性連接此些接地元件450。 由此可知’藉由接地元件450分隔第一電子元件420 和第二電子元件422 ’以防止第一電子元件42〇和第二電 子元件422受到彼此的電磁訊號的干擾。同時，將第一電 子元件420和第二電子元件422，透過屏蔽層430來與第 二電子元件470和第四電子元件472分隔，以避免第一電 子元件420、第二電子元件422、第三電子元件47〇和第四 電子元件472之間訊號的干擾。 上述之第一基板的接地端412透過至少一接地線 416電性連接接地端414。屏蔽層430透過數個接地線442 [S] 13 201123396 m連接此些接地元件45〇。此些接地元件450 之尚度h7大於第一電子元件420及第二電子 度h8。屏蔽層430可設置於第二基板44〇之表=或内部冋 並透過數個凸塊444電性連接此些接地元件45〇。The first electronic component 420 and the second electronic component 422 are shielded, and the shielding layer 430 is electrically connected to the grounding components 450. It can be seen that the first electronic component 420 and the second electronic component 422 are separated by the grounding member 450 to prevent the first electronic component 42A and the second electronic component 422 from being interfered by electromagnetic signals of each other. At the same time, the first electronic component 420 and the second electronic component 422 are separated from the second electronic component 470 and the fourth electronic component 472 through the shielding layer 430 to avoid the first electronic component 420, the second electronic component 422, and the third component. The interference of signals between the electronic component 47A and the fourth electronic component 472. The grounding end 412 of the first substrate is electrically connected to the grounding end 414 through at least one grounding wire 416. The shielding layer 430 is connected to the grounding members 45 through a plurality of grounding wires 442 [S] 13 201123396 m. The shank h7 of the grounding elements 450 is greater than the first electronic component 420 and the second electronic component h8. The shielding layer 430 can be disposed on the surface of the second substrate 44 or internal 冋 and electrically connected to the grounding elements 45 透过 through the plurality of bumps 444.
封裝結構400可包含數個導電元件松，以電性連接 第-基板410和第二基板44〇。具體來說，此些導電元件 452位於第-基板410 ±，並透過此些凸塊條電性連接 第二基板440，且此些導電元件452與接地端412、接地端 414電性隔絕。此些導電元件452可排列於第一電子元件 420和第二電子元件422的外圍。具體來說，此些導電元 件452可排成一列或數列，各列的導電元件452分別位於 第一電子元件420和第二電子元件422的周圍。 、 封裝結構400可包含一第一封膠460和一第二封膠 462’第一封膠460覆蓋此些接地元件450和導電元件452, 第二封膠462覆蓋第三電子元件470和第四電子元件472。 封裝結構400可包含一第一容置空間480及一第二容 置空間482。第一容置空間480和第二容置空間482為第 一封膠460所圍繞’第一電子元件420位於第一容置空間 480内，第二電子元件422位於第二容置空間482内。藉 由第一容置空間480及第二容置空間482之設置，可增加 封裝結構400之散熱空間，並提高第一電子元件42〇和第 二電子元件422之散熱速度。 請同時參考第7A圖和第7B圖。第7A圖繪示本發明 f有屏蔽之封裝結構之第五實施例的俯瞰圖，第7B圖繪示 第7A圖之封I結構中沿著連線EE，的剖面圖。 封裝結構5〇〇包含一第一基板51〇、數個第一電子元 件520、數個第〜接地元件550、-第二基板540、數個第 201123396 二電子元件570、數個第二接地元件552和至少一屏蔽層 530。第一基板510具有至少一接地端512。第一電子元件 520位於第一基板510上，並電性連接第一基板51〇。此些 第一接地元件550位於第一基板51〇上，並排列於此些第 一電子元件520之間。此些第一接地元件55〇為間隔排列 或互相接觸，並電性連接接地端512。第二基板54〇位於The package structure 400 may include a plurality of conductive elements loosely to electrically connect the first substrate 410 and the second substrate 44A. Specifically, the conductive elements 452 are located on the first substrate 410 and electrically connected to the second substrate 440 through the bumps, and the conductive elements 452 are electrically isolated from the ground 412 and the ground 414. The conductive elements 452 can be arranged on the periphery of the first electronic component 420 and the second electronic component 422. Specifically, the conductive elements 452 can be arranged in a column or series, and the conductive elements 452 of each column are located around the first electronic component 420 and the second electronic component 422, respectively. The package structure 400 can include a first sealant 460 and a second sealant 462 ′. The first sealant 460 covers the grounding elements 450 and the conductive elements 452 , and the second sealant 462 covers the third electronic components 470 and the fourth Electronic component 472. The package structure 400 can include a first accommodating space 480 and a second accommodating space 482. The first accommodating space 480 and the second accommodating space 482 are surrounded by the first adhesive 460. The first electronic component 420 is located in the first accommodating space 480, and the second electronic component 422 is located in the second accommodating space 482. By the arrangement of the first accommodating space 480 and the second accommodating space 482, the heat dissipation space of the package structure 400 can be increased, and the heat dissipation speed of the first electronic component 42 and the second electronic component 422 can be improved. Please refer to both Figure 7A and Figure 7B. Fig. 7A is a plan view showing a fifth embodiment of the shielded package structure of the present invention, and Fig. 7B is a cross-sectional view showing the structure I of Fig. 7A along the line EE. The package structure 5A includes a first substrate 51, a plurality of first electronic components 520, a plurality of first grounding components 550, a second substrate 540, a plurality of 201123396 two electronic components 570, and a plurality of second grounding components. 552 and at least one shielding layer 530. The first substrate 510 has at least one ground terminal 512. The first electronic component 520 is located on the first substrate 510 and electrically connected to the first substrate 51. The first grounding members 550 are located on the first substrate 51A and are arranged between the first electronic components 520. The first grounding elements 55 are arranged at intervals or in contact with each other and electrically connected to the grounding end 512. The second substrate 54 is located at
此些第一接地元件550之上。此些第二電子元件57〇位於 第二基板540上，並電性連接第二基板54〇。此些第二接 地元件552 ax置於第一基板540，並排列於此些第二電子 兀件570之間。此些第二接地元件552為間隔排列或互相 接觸，並電性連接到此些第一接地元件55〇以電性接地。 屏蔽層530设置於第二基板540，並遮蔽此些第一電子元 件520，且屏蔽層530電性連接此些第一接地元件55〇。 透過電性接地的第一接地元件55〇，可屏蔽此些第一 電子元件520，以避免此些第一電子元件，受到彼此之 間的訊號干擾。藉由電性接地的第二接地元件552分隔此 些第二電子元件570,可屏蔽此些第二電子元件別，以避 第二電子科57G受此之間的訊號干擾。透過 的屏蔽層，則可避免此些第一電子元件52〔 及此二第一電子元件57〇受到彼此之間的訊號干擾。 ㈣第一基板510具有至少-接地端514和至少- 接地線516電性連接接地端512和接地端 。第一基板210可具有數個鲜球 以電性連接外部電路(未繪示）。 ^数:=592 接地端514 ’銲球592電性連接銲塾519 ^ ，性連接 件接地元件㈣之高度的大於此些第-電子元 “度hH) ’此些第二接地元件切之高度^則 m 15 201123396 可大於或等於此些第二電子元件570之高度hl2。 屏蔽層530可設置於第二基板540之表面或内部，並 •透過數個凸塊546或數個接地線532電性連接此些第一接 地元件550。此些第二接地元件552電性連接接地端542， 以電性連接此些第一接地元件550。 封裝結構500可包含數個第一導電元件554和數個第 二導電元件556。此些第一導電元件554電性連接第一某 板510和第二基板540，此些第二導電元件556電性連& 第二基板540。此些第一導電元件554和此些第二導電元 • 件556均電性隔絕於接地端512。此些第一導電元件554 可排成一列或數列’並排列於此些第一電子元件52〇的月 圍。此些第二導電元件556可排成一列或數列，並排列於 此些第二電子元件570的周圍。 、 封裝結構500可包含一第一封膠560，第—封膠56〇 覆蓋此些第一接地元件550和此些第一導電元件55^ ^封 裝結構500可包含數個第一容置空間580，此些第一容置 空間580為第一封膠560所圍繞，此些第一電;元件=2〇 分別位於此些第一容置空間580内。封裝結構5〇〇可包含 • 一第二封膠562’第二封膠562覆蓋此些第二接地元件552 和此些第二導電元件556。封裝結構500可包含數個第二 容置空間582 ’此些第二容置空間582為第二封膠562 ^ 圍繞’此些第二電子元件570分別位於此些第二容置六門 582内。藉由此些第一容置空間580及第二容置$間 之設置，可增加封裝結構500之散熱空間，並提^丄此第 一電子元件520和第二電子元件570之散熱速度^ 二 • 上述各實施例所述之屏蔽層可為金屬屏蔽層、網狀金 屬層、金屬線路層、地線層、保護電路層或其組人等。接 201123396 地元件可為接地柱、接地材料、導電材料、金屬材料、金 ’ 屬棒、金屬針、金屬線、導線、導腳、引腳、接腳、導線 架或其組合等。導電元件可為導電柱、導電材料、金屬材 料、金屬棒、金屬針、金屬線、導線、導腳、引腳、接腳、 導線架或其組合等。接地元件或導電元件之形狀可為1字 型、工字型、J字型、L字型、倒L型、Z字型、C字型、 階梯型、不規則型或任何的形狀。接地端可為接地面、接 地墊、金屬墊、銲墊、鋁墊、接點、接墊、引指、引腳或 導線架等。導電端可為導電墊、金屬墊、銲墊、鋁墊、接 φ 點、接墊、引指、引腳或導線架等。電子元件可為半導體 元件、裸晶片、封裝晶片、封裝體、記憶體、基頻晶片、 射頻晶片、兩頻晶片、數位訊號處理器、主動元件或被動 元件等。第一基板或第二基板可為封裝基板、陶瓷基板、 玻璃基板、積層板、疊層板、電路板、單層板、多層板、 載板或承載件等。封膠之材質可為環氧樹脂、矽膠、熱固 性塑膠、聚醯胺類、聚苯二曱基類或其組合等。 綜上所述，藉由電性接地的接地元件和屏蔽層，可屏 蔽各個電子元件，以避免電子元件受到來自内部或外部的 • 電磁訊號干擾。同時，藉由容置空間之設置，可增加封裝 結構之散熱空間，並提高各個電子元件之散熱速度。 雖然本發明已以各種實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 * 第1圖繪示習知技術中第一種封裝結構的剖面圖。 201123396 第2圖繪示習知技術中第二種封裝結構的剖面圖。 ' 第3A圖繪示本發明具有屏蔽之封裝結構之第一實施 例的俯蛾圖。 第3B圖繪示本發明第3A圖之封裝結構中沿著連線 AA’的剖面圖。 第4A圖繪示本發明具有屏蔽之封裝結構之第二實施 例的俯瞰圖。 第4B圖繪示本發明第4A圖之封裝結構中沿著連線 BB’的剖面圖。 • 第5A圖繪示本發明具有屏蔽之封裝結構之第三實施 例的俯瞰圖。 第5B圖繪示本發明第5A圖之封裝結構中沿著連線 CC’的剖面圖。 第6A圖繪示本發明具有屏蔽之封裝結構之第四實施 例的俯瞰圖。 第6B圖繪示本發明第6A圖之封裝結構中沿著連線 DD’的剖面圖。 φ 第7A圖繪示本發明具有屏蔽之封裝結構之第五實施 例的俯蛾圖。 第7B圖繪示本發明第7A圖之封裝結構中沿著連線 EE’的剖面圖。 【主要元件符號說明 lib :第二面 12 :晶片 13 :封膠 10 :封裝結構 11 :基板 1 la :第一面 201123396Above the first grounding elements 550. The second electronic component 57 is located on the second substrate 540 and electrically connected to the second substrate 54. The second grounding members 552 ax are disposed on the first substrate 540 and arranged between the second electronic components 570. The second grounding elements 552 are spaced apart or in contact with each other and electrically connected to the first grounding elements 55A to be electrically grounded. The shielding layer 530 is disposed on the second substrate 540 and shields the first electronic components 520, and the shielding layer 530 is electrically connected to the first grounding elements 55A. The first electronic component 520 can be shielded through the electrically grounded first grounding component 55〇 to prevent the first electronic components from being interfered by each other. The second electronic components 570 are separated by a second grounding component 552 electrically grounded to shield the second electronic components from the signal interference between the second electronic component 57G. Through the shielding layer, the first electronic components 52 and the two first electronic components 57 are prevented from being interfered with each other. (4) The first substrate 510 has at least a ground terminal 514 and at least a ground wire 516 electrically connected to the ground terminal 512 and the ground terminal. The first substrate 210 may have a plurality of fresh balls to electrically connect external circuits (not shown). ^数:=592 Ground terminal 514 'Battery ball 592 is electrically connected to the soldering pole 519 ^ , the height of the grounding element (4) of the sexual connector is greater than the number of the first - electron elements "degree hH" 'the height of the second grounding element The m 15 201123396 may be greater than or equal to the height hl2 of the second electronic components 570. The shielding layer 530 may be disposed on the surface or inside of the second substrate 540, and may be electrically transmitted through a plurality of bumps 546 or a plurality of grounding wires 532. The first grounding component 550 is electrically connected to the grounding terminal 542 to electrically connect the first grounding component 550. The package structure 500 can include a plurality of first conductive components 554 and a plurality of The second conductive element 556. The first conductive element 554 is electrically connected to the first plate 510 and the second substrate 540. The second conductive element 556 is electrically connected to the second substrate 540. The first conductive The element 554 and the second conductive elements 556 are electrically isolated from the ground terminal 512. The first conductive elements 554 can be arranged in a column or series and arranged in a circumference of the first electronic component 52A. The second conductive elements 556 can be arranged in a column or series and arranged The package structure 500 can include a first sealant 560, and the first sealant 56 covers the first ground component 550 and the first conductive component 55. The first accommodating space 580 can be included in the first accommodating space 580. The first accommodating space 580 is surrounded by the first sealing material 560. The package structure 5 can include a second sealant 562 562 covering the second ground elements 552 and the second conductive elements 556. The package structure 500 can include a plurality of second accommodating spaces 582 The second accommodating space 582 is located in the second accommodating six-door 582. The second accommodating space 580 and the second accommodating space 580 are respectively located in the second accommodating six-door 582. The arrangement of the two components can increase the heat dissipation space of the package structure 500, and improve the heat dissipation speed of the first electronic component 520 and the second electronic component 570. Metal shield layer, mesh metal layer, metal circuit layer, ground layer, protective circuit layer Its group, etc.. 201123396 ground components can be grounding posts, grounding materials, conductive materials, metal materials, gold 'bars, metal pins, wires, wires, leads, pins, pins, lead frames or combinations thereof The conductive element may be a conductive pillar, a conductive material, a metal material, a metal bar, a metal pin, a metal wire, a wire, a lead pin, a pin, a pin, a lead frame, or a combination thereof, etc. The shape of the grounding element or the conductive element may be It is a 1-character, I-shaped, J-shaped, L-shaped, inverted-L-shaped, Z-shaped, C-shaped, stepped, irregular, or any shape. The ground terminal can be a ground plane, a ground pad, a metal pad, a pad, an aluminum pad, a contact, a pad, a finger, a lead, or a lead frame. The conductive end can be a conductive pad, a metal pad, a pad, an aluminum pad, a φ point, a pad, a finger, a lead or a lead frame. The electronic components can be semiconductor components, bare wafers, packaged wafers, packages, memory, baseband chips, RF chips, dual-frequency chips, digital signal processors, active components, or passive components. The first substrate or the second substrate may be a package substrate, a ceramic substrate, a glass substrate, a laminate, a laminate, a circuit board, a single layer board, a multilayer board, a carrier board, or a carrier. The material of the sealant may be epoxy resin, silicone rubber, thermosetting plastic, polyamidoamine, polyphenylene difluoride or the like. In summary, each electronic component can be shielded by an electrically grounded grounding element and a shielding layer to prevent the electronic component from being disturbed by internal or external electromagnetic signals. At the same time, by arranging the accommodation space, the heat dissipation space of the package structure can be increased, and the heat dissipation speed of each electronic component can be improved. While the present invention has been described in terms of various embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS * FIG. 1 is a cross-sectional view showing a first package structure in the prior art. 201123396 Figure 2 is a cross-sectional view showing a second package structure in the prior art. Fig. 3A is a view showing the first embodiment of the shielded package structure of the present invention. Fig. 3B is a cross-sectional view along the line AA' in the package structure of Fig. 3A of the present invention. Fig. 4A is a plan view showing a second embodiment of the package structure of the present invention. Fig. 4B is a cross-sectional view along line BB' of the package structure of Fig. 4A of the present invention. • Fig. 5A is a plan view showing a third embodiment of the shielded package structure of the present invention. Fig. 5B is a cross-sectional view along the line CC' in the package structure of Fig. 5A of the present invention. Fig. 6A is a plan view showing a fourth embodiment of the shielded package structure of the present invention. Fig. 6B is a cross-sectional view along the line DD' in the package structure of Fig. 6A of the present invention. Fig. 7A is a perspective view showing a fifth embodiment of the shielded package structure of the present invention. Fig. 7B is a cross-sectional view along line EE' in the package structure of Fig. 7A of the present invention. [Main component symbol description lib: second side 12: wafer 13: encapsulation 10: package structure 11: substrate 1 la: first side 201123396
14 :鲜球 122 、222、324、326 :接點 15 :凸塊 130 • 230、430、530 :屏蔽層 20 :封裝結構 140、 240、440、540 :第二基板 21 :第一基板 142 :表面 21a :第一面 150、 250、330、450 :接地元件 21b :第二面 160 、340 :封膠 22 第一晶片 170 、280 :容置空間 23 第一封膠 180 、182、290、292、360、 24 焊球 362、590、592 :銲球 25 第二基板 220> 320、420、520 :第一電子元件 25a :第三面 246、 444、446、546、548 :凸塊 25b :第四面 252 、452 :導電元件 26 第二晶片 260 、460、560 :第一封膠 27 第二封膠 262 、462、562 :第二封膠 28 凸塊 270、 322、422、570:第二電子元件 29 銲線 272 =銲線 30 銲線 310 :基板 100 、200、300、400 、500:封裝结構 350、 480、580 :第一容置空間 110 '210 >410 > 510 :第一基板 352、 482、582:第二容置空間 112 、114、212、214、242 '312 ' 470 第三電子元件 314、412、414、512 、514、 472 第四電子元件 542、544 :接地端 550 第一接地元件 116 ' 216 > 232 、316、 416、 552 第二接地元件 442 ' 516 ' 532 :接地線 554 第一導電元件 118 、218、219、244、318 '518 ' 556 第二導電元件 519 :銲墊 AA，、 BB，、CC，、DD，、EE，：連線 120 :電子元件 hl-hl2 :高度 m 1914: fresh balls 122, 222, 324, 326: contacts 15: bumps 130 • 230, 430, 530: shield layer 20: package structure 140, 240, 440, 540: second substrate 21: first substrate 142: Surface 21a: first surface 150, 250, 330, 450: grounding member 21b: second surface 160, 340: encapsulant 22 first wafer 170, 280: accommodating space 23 first adhesive 180, 182, 290, 292 , 360, 24 solder balls 362, 590, 592: solder balls 25 second substrate 220 > 320, 420, 520: first electronic component 25a: third surface 246, 444, 446, 546, 548: bump 25b: Four sides 252, 452: conductive element 26 second wafer 260, 460, 560: first sealant 27 second sealant 262, 462, 562: second sealant 28 bumps 270, 322, 422, 570: second Electronic component 29 bonding wire 272 = bonding wire 30 bonding wire 310: substrate 100, 200, 300, 400, 500: package structure 350, 480, 580: first accommodating space 110 '210 > 410 > 510: first Substrate 352, 482, 582: second accommodating space 112, 114, 212, 214, 242 '312' 470 third electronic component 314, 412 414, 512, 514, 472 fourth electronic component 542, 544: ground 550 first ground component 116 ' 216 > 232, 316, 416, 552 second ground component 442 ' 516 ' 532 : ground line 554 first Conductive element 118, 218, 219, 244, 318 '518' 556 second conductive element 519: pad AA, BB, CC, DD, EE, connection 120: electronic component hl-hl2: height m 19